| Entries |
| Document | Title | Date |
|---|
| 20080316790 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR MANUFACTURING DEVICE - The present invention is a manufacturing method for a semiconductor device having steps of; aligning a program head | 12-25-2008 |
| 20090116275 | CONVENTIONALLY PRINTABLE NON-VOLATILE PASSIVE MEMORY ELEMENT AND METHOD OF MAKING THEREOF - A non-volatile passive memory element comprising on a single surface a first electrode system and a second electrode system together with an insulating system, unless the insulating system is the surface, wherein the first electrode system is insulated from the second electrode system, the first and the second electrode systems are pattern systems and at least one conductive or semi-conducting bridge is present between the first and second electrode systems, and wherein the non-volatile passive memory device is exclusive of metallic silicon and the systems and the conductive or semiconducting bridges are printable using conventional printing processes with the optional exception of the insulating system if the insulating system is the surface. A non-volatile passive memory device comprising a support and on at least one side of the support the above-mentioned non-volatile passive memory element. A process for providing the above-mentioned non-volatile passive memory device, comprising the realization on a single surface of the support of the steps of: providing a first electrode system pattern, optionally providing an insulating pattern, providing a second electrode system pattern, and providing at least one conductive or semiconducting bridge between the first electrode system pattern and the second electrode system pattern at predesignated points, wherein at least one of the steps is realized with a conventional printing process and two of said steps are optionally performed simultaneously. | 05-07-2009 |
| 20100214817 | SEMICONDUCTOR STORAGE DEVICE AND STORAGE SYSTEM - A pn junction type solar cell is formed in a predetermined region on a substrate made of glass. Light emitted from a light emitting unit reaches an n-type semiconductor layer after it passed through substrate. The solar cell generates electromotive force corresponding to a quantity of the emitted light. A control circuit, a mask ROM, a transmitting circuit and an antenna are formed on an upper side of the solar cell. A surface of a semiconductor storage device is entirely covered with an insulating film to block entry of outside air. The insulating film is typically formed of physicochemically stable glass or silicon dioxide. | 08-26-2010 |
| 20120008364 | ONE TIME PROGRAMMABLE MEMORY AND THE MANUFACTURING METHOD AND OPERATION METHOD THEREOF - A one time programmable memory having a memory cell formed on a substrate is provided. The memory cell has a transistor and an anti-fuse structure. The anti-fuse structure is consisted of a doping region, and a dielectric layer and a conductive layer is formed in the top edge corner region of an isolation structure. The upper surface of the isolation structure is lower than the surface of the substrate so as to expose the top edge corner region. The conductive layer is formed on the isolation structure and covers the top edge corner region. The dielectric layer is formed on the top edge corner region and between the doping region and the conductive layer. The memory cell stores the digital data depending on whether the dielectric layer breaks down or not. | 01-12-2012 |
| 20120039106 | Programmable Memory Cell with Shiftable Threshold Voltage Transistor - According to one exemplary embodiment, a one-time programmable memory cell includes an access transistor coupled to a shiftable threshold voltage transistor between a bitline and a ground, where the access transistor has a gate coupled to a wordline. The shiftable threshold voltage transistor has a drain and a gate shorted together. A programming operation causes a permanent shift in a threshold voltage of the shiftable threshold voltage transistor to occur in response to a programming voltage on the bitline and the wordline. In one embodiment, the access transistor is an NFET while the shiftable threshold voltage transistor is a PFET. In another embodiment, the access transistor is an NFET and the shiftable threshold voltage transistor is also an NFET. The programming voltage can cause an absolute value of the threshold voltage to permanently increase by at least 50.0 millivolts. | 02-16-2012 |
| 20120044741 | Semiconductor device having memory unit, method of writing to or reading from memory unit, and semiconductor device manufacturing method - A first semiconductor device is formed over a substrate and includes a first insulation film, a first electrode, and a first diffusion layer. A second semiconductor device is formed over a substrate and includes a second insulation film, a second electrode, and a second diffusion layer. The second electrode is coupled to the first electrode. A control transistor allows one of a source and a drain to be coupled to the first electrode and the second electrode, allows the other one of the source and the drain to be coupled to a bit line, and allows a gate electrode to be coupled to a word line. A first potential control line is coupled to the first diffusion layer and controls a potential of the first diffusion layer. A second potential control line is coupled to the second diffusion layer and controls a potential of the second diffusion layer. | 02-23-2012 |
| 20120147653 | CIRCUIT AND SYSTEM OF A HIGH DENSITY ANTI-FUSE - A high density anti-fuse cell can be built at the cross points of two perpendicular interconnect lines, such as active region lines, active and polysilicon lines, active and metal lines, or polysilicon and metal lines. The cell size can be very small. At least one of the anti-fuse cells have a thin oxide fabricated before, after, or between a diode in at least one contact holes at the cross points of the interconnect lines. The thin oxide of the anti-fuse cells at the cross points can be selected for rupture by applying supply voltages in the two perpendicular lines. In some embodiments, a diode can be created after thin oxide is ruptured so that explicitly fabricating a diode or opening a contact hole at the cross-point may not be necessary. | 06-14-2012 |
| 20120212991 | SEMICONDUCTOR DEVICE AND OPERATION METHOD THEREOF - An operation method of a semiconductor device, includes providing one or more memory elements each including a first semiconductor layer of a first conductivity type, second and third semiconductor layers of a second conductivity type, which are disposed to be separated from each other in the first semiconductor layer, a first electrode electrically connected to the second semiconductor layer, and a second electrode electrically connected to the third semiconductor layer, and performing operation of writing information on a memory element to be driven of the one or more memory elements. The operation of writing is performed by forming a filament in a region between the second and third semiconductor layers, which is a conductive path electrically linking these semiconductor layers, through application of a voltage equal to or higher than a predetermined threshold between the first electrode and the second electrode. | 08-23-2012 |
| 20120212992 | SEMICONDUCTOR DEVICE AND OPERATION METHOD THEREOF - An operation method of a semiconductor device, includes providing one or more memory elements each including a first semiconductor layer, second and third semiconductor layers, a dielectric film and a conductive film, a first electrode, a second electrode, and a third electrode, and performing operation of writing information on a memory element to be driven of the one or more memory elements. The operation of writing is performed by forming a filament in a region between the second and third semiconductor layers, which is a conductive path electrically linking these semiconductor layers, the filament being formed by causing a dielectric breakdown of at least a part of the dielectric film, through application of a voltage equal to or higher than a predetermined threshold between the second and third electrodes, thereby causing an electric current to flow between the conductive film and the third semiconductor layer. | 08-23-2012 |
| 20120314474 | NON-VOLATILE MEMORY CELL STRUCTURE AND METHOD FOR PROGRAMMING AND READING THE SAME - The present invention provides a non-volatile memory cell structure. A first isolation structure is disposed on a substrate and a semiconductor layer is disposed on the first isolation structure to form a silicon on insulator device. A first doping region is made of a portion of the semiconductor layer. A gate is disposed on the first doping region. A gate oxide layer is sandwiched between the first doping region and the gate. A second doping region is disposed within the semiconductor layer and outside the first doping region. A second doping region is in direct contact with the first doping region. A second isolation structure is disposed on the first isolation structure. Further, the second isolation structure surrounds the first doping region and the second doping region. The second isolation structure is also in direct contact with the first doping region and the second doping region. | 12-13-2012 |
| 20130148404 | ANTIFUSE-BASED MEMORY CELLS HAVING MULTIPLE MEMORY STATES AND METHODS OF FORMING THE SAME - In some aspects, a memory cell is provided that includes a steering element and a metal-insulator-metal (“MIM”) stack coupled in series with the steering element. The MIM stack includes a first dielectric material layer and a second dielectric material layer disposed on the first dielectric material layer, without a metal or other conductive layer disposed between the first dielectric material layer and the second dielectric material layer. Numerous other aspects are provided. | 06-13-2013 |
| 20130235644 | SYSTEM AND METHOD OF IN-SYSTEM REPAIRS OR CONFIGURATIONS FOR MEMORIES - In-system repairing or configuring faulty memories after being used in a system are disclosed. In one embodiment, a memory chip can include at least one OTP memory to store defective addresses that are to be repaired. Advantageously, the OTP memory can operate without requiring additional I/O pins or high voltage supplies for reading or programming. The memory chip can also include control logic to control reading or programming of the OTP memory as needed. | 09-12-2013 |
| 20140056050 | MEMORY CELL AND MEMORY - In various embodiments, a memory cell and a memory are provided. The memory cell comprises a Static Random Access Memory (SRAM) cell including a reset-set (RS) flip-flop and a Read Only Memory (ROM) cell being connected (or coupled) to the SRAM cell to set logic states of internal latch nodes of the RS flip-flop when the ROM cell is triggered. The size of the memory cells proposed in an embodiment of the invention is much smaller than the sum of the size of ROM cells and the size of SRAM cells with the capacity of the memory cells same as the sum of the capacity of the ROM cells and the capacity of the SRAM cells. | 02-27-2014 |
| 20140104921 | SEMICONDUCTOR MEMORY DEVICE HAVING OTP CELL ARRAY - Provided is a semiconductor memory device. The semiconductor includes a One Time Programmable (OTP) cell array, a converging circuit and a sense amplifier circuit. The OTP cell array includes a plurality of OTP cells connected to a plurality of bit lines, each bit line extending in a first direction. The converging includes a common node contacting a first bit line and a second bit line. The sense amplifier circuit includes a sense amplifier connected to the common node, the sense amplifier configured to amplify a signal of the common node. | 04-17-2014 |
| 20140119093 | Single-Ended Sense Amplifier for Solid-State Memories - Described embodiments provide a memory having at least one sense amplifier. The sense amplifier has a first capacitor, an inverting amplifier, a switch, an amplifier, and a second capacitor. The first capacitor is coupled between the input of the sense amplifier and a first node. The inverting amplifier has an input coupled to the first node and an output coupled to an internal node and the switch is coupled between the input and output of the inverting amplifier. The amplifier has an input coupled to the internal node and an output coupled to an output of the sense amplifier and the second capacitor is coupled between the internal node and a control node. When data is to be read from the memory, the second capacitor forces a small voltage reduction onto the intermediate node, helping the sense amplifier resolve the data value stored in the memory cell. | 05-01-2014 |
| 20150078061 | SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR DEVICE MOUNTING THE SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a non-volatile device array of once rewritable non-volatile devices arranged in a matrix. The device includes a plurality of non-volatile device sub-arrays formed by dividing the non-volatile device array; a power interconnect contact region provided between at least one of pairs of the plurality of non-volatile device sub-arrays, and connected to a power interconnect provided at an upper layer of the non-volatile device array; and an ESD protection circuit located in the power interconnect contact region between ground and a power source for the non-volatile devices. | 03-19-2015 |
