| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361711000 | Cooling plate or bar | 30 |
| 20080218977 | Cycling Led Heat Spreader - A graphite heat spreader is provided for use with a flash LED light source for a camera of a handheld device such as a cell phone. Dramatically reduced operating temperatures are provided at substantially increased life of the electronic components. | 09-11-2008 |
| 20080218978 | IC fixing structure - The IC fixing component includes a locking case accommodating the IC in such a manner that a side of the IC out of a face-to-face contact with the heat dissipation plate is brought into a face-to-face contact with the locking case so as to be covered and a through hole and a rotation stop protrusion inserted into a rotation limiting hole. After the IC has been accommodated in the locking case, the screw member inserted through the through hole is screwed into a screw hole of the heat dissipation plate so that the side of the IC out of face-to-face contact with the locking case is pressed by the locking case thereby to be brought into a face-to-face contact with the heat dissipation plate. | 09-11-2008 |
| 20080278916 | Memory Module Assembly and Heat Sink thereof - A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat dissipating plate and a plurality of heat transfer mediums. Each of the heat transfer mediums includes a base attached to the heat dissipating plate, and at least one resilient sheet extending from an end of the base. The base and the resilient sheet define an included angle which is non-right angle so that the resilient sheet can snugly clip to the respective heat source. | 11-13-2008 |
| 20090009974 | DISPLAY DEVICE - A display device includes a display panel, a back light module, a heat dissipation plate and a heat pipe. The display panel has a display surface. The back light module is coupled to the display panel, and this back light module includes a control circuit board. The heat dissipation plate contacts the control circuit board. The heat pipe contacts the heat dissipation plate. The length direction of the heat pipe is not parallel with a horizontal direction, and it is also not perpendicular to the display surface. | 01-08-2009 |
| 20090040731 | SHIELDING AND HEAT DISSIPATION DEVICE - Discloses herein is a shielding and heat dissipation device comprising a conductive bracket ( | 02-12-2009 |
| 20090059537 | OPTIMIZATION OF ELECTRONIC PACKAGE GEOMETRY FOR THERMAL DISSIPATION - An electronic package device is disclosed including a microelectronic package and a heat sink positioned over the microelectronic package. A thermal interface element is positioned between the microelectronic package and the heat sink. The thermal interface element is elongated and has differing thicknesses along its length to enhance the dissipation of heat. | 03-05-2009 |
| 20090097208 | Electronic Component Module - The invention relates to an electronic component module, comprising at least one first multi-layer circuit board module ( | 04-16-2009 |
| 20090103268 | MODULE ASSEMBLY HAVING HEAT TRANSFER PLATE - A module assembly includes a component housing having a plurality of walls forming a cavity. At least one of the walls includes an opening therethrough open to the cavity. The heat transfer plate is mounted within the opening of the component housing and his exposed on an exterior of the component housing. The heat transfer plate forms at least a portion of a mounting surface of the component housing. | 04-23-2009 |
| 20090168361 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly includes a printed circuit board with a heat generating component attached thereon, a base, and a thermal plate. The heat generating component comprises a side surface. The base defines a receiving room and an opening configured for access into the receiving room. The printed circuit board is received in the receiving room via the opening. The thermal plate is mounted on the base to cover the opening. A conducting piece is formed on the thermal plate and extends into the receiving room. The conducting piece includes a contacting portion extending from the thermal plate and in contact with the side surface. The conducting piece is configured for conducting heat from the heat generating component to the thermal plate. A heat dissipating hole is defined on the thermal plate in alignment with the contacting portion configured for dissipating heat from the base. | 07-02-2009 |
| 20090219697 | THERMAL MANAGEMENT FOR ELECTROMAGNETIC COIL SYSTEMS - A system includes a housing and an electromagnetic coil within the housing. The electromagnetic coil is arranged in a coil stack. A thermal damper is positioned adjacent to the electromagnetic coil, and a thermal structural plate is positioned adjacent to the coil stack. The thermal damper manages temperature rise of the electromagnetic coil and the thermal structural plate provides cooling to the coil stack. In an embodiment, the system is used to launch projectiles. | 09-03-2009 |
| 20090237890 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes: a semiconductor element ( | 09-24-2009 |
| 20090296352 | THERMAL MANAGEMENT OF ELECTRONIC DEVICES - Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The device may also include at least one thermal plane substantially parallel to the first surface of the substrate, the at least one thermal plane being in thermal contact with at least one of the first thermal vias. The device may also include a heat sink attachment area, and second thermal vias extending from the heat sink attachment area to the interior of the substrate, the at least one thermal plane being in thermal contact with the second thermal vias. | 12-03-2009 |
| 20090296353 | PLASMA DISPLAY DEVICE - A display device includes a display panel for displaying an image, a chassis base for supporting the display panel and a heat dissipating plate at one side of the chassis base. The display device further includes a printed circuit board between the heat dissipating plate and the chassis base attached to the heat dissipating plate and electrically connected to the display panel, and a switch electrically connected to the printed circuit board to generate a signal for controlling the display panel, the switch being attached to the heat dissipating plate. | 12-03-2009 |
| 20090316365 | HEAT SINK SYSTEM HAVING THERMALLY CONDUCTIVE RODS - A heat sink system to conduct heat away from a printed circuit board assembly is provided. The heat sink system includes a chassis, a chassis cover, at least one thermally conductive block underlaying a high-heat section of the printed circuit board assembly, a plurality of thermally conductive through-rods, and at least one thermally conductive notch-rod associated with a respective thermally conductive block. The at least one thermally conductive block is in thermal contact with a portion of the chassis. The plurality of thermally conductive through-rods and at least one thermally conductive notch-rod each have a first end and a second end. The through-rods are positioned in holes formed in the printed circuit board. The notch-rods are positioned in a notch formed in the printed circuit board assembly. The first ends thermally contact the thermally conductive block and the second ends thermally contact the chassis cover. | 12-24-2009 |
| 20100027221 | SHEET STRUCTURE AND METHOD OF MANUFACTURING THE SAME - The sheet structure includes a plurality of linear structure bundles | 02-04-2010 |
| 20100053903 | INSULATION SUBSTRATE, POWER MODULE SUBSTRATE, MANUFACTURING METHOD THEREOF, AND POWER MODULE USING THE SAME - A process for providing a power module substrate. A brazing sheet is temporarily fixed on a surface of a ceramic substrate by surface tension of a volatile organic medium, and a conductive pattern member punched from a base material is temporarily fixed on a surface of the brazing sheet by surface tension. These are heated so as to volatilize the volatile organic medium, and a pressure is applied to the conductive pattern member in its thickness direction. The brazing sheet is then melted to join the conductive pattern member with the surface of the ceramics substrate. | 03-04-2010 |
| 20100128444 | HEAT-DISSIPATED FASTENER AND ELASTIC FRAME THEREOF - A heat-dissipated fastener including a heat-dissipated plate, an elastic frame and a heat sink module is provided. The elastic frame includes a sheet element, multiple connecting ribs and multiple attaching portions. Two elastic arms extend from two corresponding sides of the sheet element, respectively. The attaching portions are located below the sheet element and attached to the heat-dissipated plate. The connecting ribs are connected to the attaching portion and the sheet element, and an accommodating space is formed by the connecting ribs, the sheet element and the heat-dissipated plate to accommodate the heat sink module. When the heat-dissipated plate is attached to the heat source and the elastic arms are bent and fixed to the circuit board of the heat source, the connecting ribs exert force on the heat-dissipated plate vertically, respectively. | 05-27-2010 |
| 20100134980 | HEAT SINK ASSEMBLY - A heat sink assembly is characterized by comprising a base consisting of an aluminum casting and a copper base plate, a heat sink consisting of a plurality of aluminum heat fins, and at least a heat guide; wherein at least a groove is provided on each of the plurality of heat fins according to the quantity of said heat guide for passing the dissipation part of each said at least a heat guide, a cavity is opened on said aluminum casting for said copper base plate housing, and at least a trough is formed on the top surfaces of said copper base plate and said aluminum casting for placing the heat conduction part of each said at least a heat guide, and said copper base plate is placed against the heat source to transfer the heat through said base to said heat guide and then to said heat sink, so that the heat can be dissipated rapidly through said plurality of heat fins. In addition, the weight of the heat sink assembly is decreased, further more, the manufacturing costs reduced. | 06-03-2010 |
| 20110194255 | Electronic component unit and manufacturing method thereof - According to embodiments, there is provided an electronic component unit, including: a circuit board including: a heat generating element that generates a heat; and a bonding metal foil layer formed on a face thereof; a heat transfer board including: a board body having a thermal conductivity higher than that of the circuit board; an insulative layer formed on a first face of the board body; and a heat transfer metal foil layer formed to cover the insulative layer; and a heat sink, wherein the circuit board is assembled with the heat sink via the heat transfer board such that ( | 08-11-2011 |
| 20110242766 | POWER SUPPLY AND HEAT DISSIPATION MODULE THEREOF - A power supply includes a casing, a printed circuit board (PCB) and a heat dissipation module. The PCB is disposed in the casing and has a heat-generating element. The casing has a top cover. The heat dissipation module includes a heatsink and a heat dissipation plate. The heatsink is disposed at the PCB and contacts the heat-generating elements. The heatsink has a surface facing the top cover. The heat dissipation plate is disposed between the heatsink and the top cover and contacts the surface of the heatsink. | 10-06-2011 |
| 20130301222 | STACKED HEAT DISSIPATING MODULE OF AN ELECTRONIC DEVICE - A stacked heat dissipating module of an electronic device has a holding frame, and at least one first heat conducting medium layer, a heat dissipating medium layer, a first heat sink layer, at least one second heat conducting medium layer and at least one second heat sink layer stacked with each other. The at least one first heat conducting medium layer is mounted on at least one heating component of the electronic device to dissipate heat generated from the at least one heating component. Moreover, the holding frame, the heat conducting medium layers and the heat sink layers have corresponding housing holes for exposing an exposed component of the electronic device to bring the exposed component's function into full play. | 11-14-2013 |
| 20140355213 | ELECTRONIC DEVICES COMPRISING PRINTED CIRCUIT BOARDS - An electronic device may include at least one power component and a printed circuit board. The at least one power component may include a main body and a lead. The printed circuit board may include at least two conductive layers parallel to a plane. The printed circuit board may further include a mounting element and a conductor. The mounting element may include first conductive tubes. The conductor may include second conductive tubes. The first conductive tubes and the second conductive tubes may elongate through a thickness of the printed circuit board along a direction substantially perpendicular to the plane. The main body of the at least one power component may be fixed to the mounting element. The lead of the at least one power component may be fixed to the conductor. | 12-04-2014 |
| 20150319880 | REDUCED THERMAL TRANSFER TO PELTIER COOLED FETS - A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface opposing the first surface; a ground plane on the first surface of the substrate, and circuitry in a circuit-region on the second surface of the substrate. The ground plane includes a patterned-region that is patterned with an array of holes. The circuitry is configured for use with the at least one device to be cooled. When a first side of the cooling device contacts the ground plane, and when the at least one device to be cooled contacts the circuitry, a reduced cross-sectional area of the patterned-region prevents heat from a second side of the cooling device from degrading performance of the at least one device. | 11-05-2015 |
| 20150327403 | Power Module - Provided is a power module that decreases thermal resistance while holding insulating reliability. | 11-12-2015 |
| 20150351223 | METAL-BASED MOUNTING BOARD AND MEMBER PROVIDED WITH METAL-BASED MOUNTING BOARD - The metal-based mounting board includes: a metal-based circuit board including a metal substrate having a first surface and a second surface, an insulating film provided on the first surface and a metal film provided on the insulating film; and an electronic component provided on the metal film of the metal-based circuit board. Within the metal substrate, a region which overlaps with a collection of a plurality of lines each having an angle of 45° or less with respect to a normal line of the metal-based mounting board, the lines each passing through a surface of the electronic component facing the metal film, is defined as a first region. A region other than the first region is defined as a second region. At least one groove is provided within the first region so as to surround the electronic component in a planar view of the metal-based mounting board. | 12-03-2015 |
| 20150351224 | METAL-BASED MOUNTING BOARD AND MEMBER PROVIDED WITH METAL-BASED MOUNTING BOARD - A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate having a first surface and a second surface opposite to the first surface, an insulating film provided on the first surface of the metal substrate and a metal film provided on the insulating film; and an electronic component provided on the metal film of the metal-based circuit board, wherein in the case where within the metal substrate, a region which overlaps with a collection of a plurality of lines each having an angle of 45° or less with respect to a normal line of the metal-based mounting board, the lines each passing through a surface of the electronic component facing the metal film, is defined as a first region, and a region other than the first region is defined as a second region, a groove is provided within the second region, but is not provided within the first region. | 12-03-2015 |
| 20150366102 | ELECTRONIC CIRCUIT APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT APPARATUS - An electronic circuit apparatus includes a circuit substrate, a heat generating component positioned on the circuit substrate, a metal plate forming a portion of an inner layer of the circuit substrate and protruding from a side surface of the circuit substrate such that the metal plate has an exposed portion exposed to outside the circuit substrate, and an external component connected to the exposed portion of the metal plate and including one of an external heat dissipation component and an external cooling component. | 12-17-2015 |
| 20160037620 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - There is provided a printed circuit board including: a core layer having a cavity formed therein; a heat radiation body included in the cavity; an insulating layer provided on an upper surface and a lower surface of the core layer; and a heat dissipating via penetrating through the insulating layer to be in contact with the heat radiation body and dissipating heat externally, wherein the heat radiation body includes an insulating plate, a first metal block formed on an upper surface of the insulating plate, and a second metal block formed on a lower surface of the insulating plate. | 02-04-2016 |
| 20160050794 | Electronic Component Mounting Structure, Manufacturing Method and Electronic Component Product - An electronic component mounting structure, manufacturing method and an electronic component product are provided. The electronic component mounting structure comprises a printed circuit board, a metal flange, and a plurality of electronic components provided on the metal flange; a groove is provided on the printed circuit board, a metal layer is coated on a wall of the groove, the metal flange is restricted to the metal layer on the wall and is fixed in the groove, the one or more electronic components are connected to each other through a plurality of wires based on a circuit requirement, an input electrode and an output electrode are provided on the printed circuit board in a portion adjacent to the metal flange, and the input electrode and the output electrode are connected to the one or more electronic components mounted on the metal flange through wires respectively. | 02-18-2016 |
| 20160174357 | Vertical Radio Frequency Module | 06-16-2016 |
