Entries |
Document | Title | Date |
20080198554 | Cooling Assembly - A cooling assembly and method of cooling a heat-generating electronic component on a circuit board. A heat collector collects heat from the electronic component. A heat pipe transfers the heat to a location remote from the electronic component. A heat sink is mounted to the circuit board at the distant location. The heat sink has at least one groove formed on an underside thereof. The heat sink is mounted so that is overlies the heat pipe and the heat pipe is introduced into the groove, thereby securing the heat pipe between the heat sink and the circuit board. | 08-21-2008 |
20080212283 | Electrical Component - According to one variant, an electrical component is specified, with a substrate ( | 09-04-2008 |
20080212284 | Electronic construction unit and electrical circuit carrier - An electronic device having an electrical circuit carrier and a body is specified, in which at least one riveted connection is formed between the electrical circuit carrier and the body. In the case of such a device, the electrical circuit carrier can be mechanically incorporated in a stable manner and with little technical complexity. An electrical circuit carrier having at least one rivet is also specified. | 09-04-2008 |
20080218974 | Method and Structure for Connecting, Stacking, and Cooling Chips on a Flexible Carrier - A heat sink apparatus having a plurality of chips attached to a first surface of a flexible carrier and a plurality of heat sink fins. One or more additional chips may be attached to a second surface of the flexible carrier. The flexible carrier has at least one complementary fold, the complementary fold having a counterclockwise fold and a clockwise fold as seen from the side. A first chip back surface of a first chip and a second chip back surface of a second chip are in thermal contact with a particular heat sink fin, that is, sharing the same heat sink fin. Thermal contact between the chips and heat sink fins is effected by force, by thermally conducting adhesive, by thermal grease, or by a combination of force and/or thermally conducting adhesive and/or thermal grease. | 09-11-2008 |
20080218975 | MOUNTING STRUCTURE WITH HEAT SINK FOR ELECTRONIC COMPONENT AND FEMALE SECURING MEMBER FOR SAME - A mounting structure is provided which is capable of easily attaching a heat sink irrespective of a thickness of an LSI (Large-Scale Integration circuit) mounted on a printed circuit board. Each female screw metal fitting of each female screw portion is attached on an upper surface of a cylindrical gel in a stacked manner and a lower surface of the cylindrical gel is attached to the printed circuit board. An end portion of each male screw is made to pass through each through-hole of the heat sink so as to be screwed into each of the female screw portions. With a progress of screwing therein, each of the female screw portions is elevated and the cylindrical gel is pulled and elongated. Since a restoring force occurs when the cylindrical gel is elongated, the heat sink is pulled by each of the female screw portions toward the LSI. Thus, variations in height can be accommodated. | 09-11-2008 |
20080225491 | System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices - System and method for preventing resin-based adhesive from contacting a substrate to minimize resin bleed-out and contamination. A preferred embodiment comprises a semiconductor device having a die mounted on a substrate, first and second gold surfaces formed on the substrate, a trench formed between the first and second gold surfaces, resin-based adhesive applied to the first gold surface, and a heat sink bonded to the resin-based adhesive. | 09-18-2008 |
20080247139 | ELECTRICAL CIRCUIT ASSEMBLY FOR HIGH-POWER ELECTRONICS - An electrical circuit assembly includes an electrical circuit substrate having a first side; a heat sink including a metal base plate having a first side and a second side, and a plurality of fins extending from the second side; and a thermally conductive and electrically insulating adhesive directly interconnecting at least a portion of the first side of the electrical circuit substrate with the first side of the base plate. | 10-09-2008 |
20080253090 | Ic Component Comprising a Cooling Arrangement - An IC component has a cooling arrangement that is embodied as an electronic housing provided with a cooling body. The IC component is directly disposed on the cooling body in the electronic housing. The invention advantageously provides a cooling arrangement for IC components that enables the IC component to be efficiently and directly cooled and assembled in a simple manner, without requiring additional components. It is especially suitable for applications in electronic housings in the automotive field. | 10-16-2008 |
20080253091 | Electronic Device - An electronic device includes an FPC, a circuit chip arranged on the flexible flat cable, a heat sink arranged on the circuit chip to release a heat of the circuit chip, and an elastic member arranged on a lower surface of the FPC. The upper surface of the FPC is large enough to cover a contact surface of the circuit chip. The elastic member does not overlap with an apex portion of the circuit chip, but overlaps with the circuit chip at an inner side of the apex portion. Therefore the elastic member does not press the FPC against the apex portion of the circuit chip. Accordingly, the FPC at a position corresponding to an apex of the circuit chip is suppressed from being distorted, and there is no fear of breaking of wire and exfoliation of the circuit chip. | 10-16-2008 |
20080266806 | ELECTRONIC ASSEMBLY THAT INCLUDES A HEAT SINK WHICH COOLS MULTIPLE ELECTRONIC COMPONENTS - The electronic assembly includes a substrate that has a first side and a second side. The electronic assembly further includes first and second electronic components that are mounted on the first side of the substrate. The first electronic component extends a different height above the first side of the substrate as the second electronic component. The electronic assembly further includes a heat sink that includes a base and fins which extend from the base. The base of the heat sink includes a formation which engages the second electronic component in order to maintain the base of the heat sink in substantially parallel relation to the substrate. In some embodiments, the formation in the base of the heat sink is a detent, while in other embodiments the formation in the base of the heat sink is a projection. | 10-30-2008 |
20080266807 | ELECTRONIC ASSEMBLY WITH EMI SHIELDING HEAT SINK - An example electronic assembly includes a substrate that has a first surface and a second surface. The first surface of the substrate includes a grounding ring. The electronic assembly further includes one or more electronic components that are mounted on the first surface of the substrate such that the grounding ring at least partially surrounds the electronic components(s). A heat sink engages the electronic component(s) and the grounding ring in order provide cooling and EMI shielding to the electronic components(s). In some embodiments, the grounding ring surrounds the entire electronic components(s) and the heat sink engages the entire grounding ring, although in other embodiments, the grounding ring may partially surround the electronic components(s) and/or the heat sink may engage just a portion of the grounding ring. | 10-30-2008 |
20080266808 | Cooling Assembly - A method and apparatus for cooling an electronic application having at least one heat-generating electronic component mounted on a circuit board. A heat transferring heat sink is attached to the circuit board in thermal contact with one heat generating electronic component by first being statically fixed to the circuit board in a stationary position at a specified height above the circuit board, and then by resiliently biasing the component against the heat sink. | 10-30-2008 |
20080278914 | Connector with a heat sink - A connector with a heat sink to prevented a card from being damaged due to friction when the card is inserted or removed includes a frame provided with two guide arms and two elastic members, each guide arm containing two chutes, each chute containing an upper and a lower limit zones; a pressurizing-down mechanism connected to the frame, a leading post received in the chute being lo disposed on each side arm, and a heat sink being provided on top; card insertion driving the pressurizing-down mechanism to move with its leading post in the chute for the heat sink to contact the card to conduct the heat generated from the card; and the elastic member moving the pressurizing-down mechanism into the upper limit zone to remove the card. | 11-13-2008 |
20080285236 | Heat transfer system for a receptacle assembly - A receptacle assembly includes a housing that is configured to hold an electrical module. An energy transfer element, which is held by the housing, is positioned to directly engage the electrical module. The transfer element absorbs thermal energy produced by the electrical module. The receptacle assembly also includes a heat sink that is remotely located from the transfer element. A thermally conductive member extends between the heat sink and the transfer element to convey thermal energy therebetween. | 11-20-2008 |
20080291635 | HEAT DISSIPATIVE STRUCTURE, OPTICAL PICKUP APPARATUS, AND OPTICAL RECORDING/REPRODUCING APPARATUS - A heat dissipative structure that offers high heat dissipation effect with a simple configuration, an optical pickup apparatus having the same, and an optical recording/reproducing apparatus are provided. A heat-dissipating component is provided for a heat-producing component. Heat generated in the heat-producing component can be transferred to the heat-dissipating component and released therefrom. The heat-dissipating component has a heat-dissipating plate, whereby a large surface area and high heat dissipation effect is obtained. The heat-dissipating portion having the heat-dissipating plate is disposed in a region including a side opposite from a heat-receiving portion which receives heat from the heat-producing component, whereby heat is released at a location as far away from the heat-receiving portion as possible. The heat dissipative structure which offers high heat dissipation effect can be implemented with a simple configuration, and the heat-producing component can be cooled effectively. | 11-27-2008 |
20080291636 | Semiconductor device - The semiconductor device includes a circuit board. The circuit board has an insulating substrate, a metal circuit fixed on a first side of the insulating substrate, and a metal plate fixed on a second side of the insulating substrate. The semiconductor device further has a semiconductor element mounted on the metal circuit, a stress reducing member fixed on the metal plate, and a heat sink fixed on the stress reducing member. The stress reducing member is plate-shaped and has round-shaped corners. | 11-27-2008 |
20080310117 | METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUCTOR DEVICES - A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink. | 12-18-2008 |
20090002950 | Multi-layer electrically isolated thermal conduction structure for a circuit board assembly - A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers. | 01-01-2009 |
20090016026 | Switching device with two controlled phases - In a switching device with two controlled phases, in which each phase is associated with a respective printed circuit board assembly with at least one component to be cooled on a heat sink, the heat sink has a T-shaped cross section transversely with respect to its extent direction. In at least one embodiment, the printed circuit board assemblies are arranged on both sides of the center limb of the heat sink, with the components of the two printed circuit board assemblies facing one another and resting on in each case one side of the center limb. | 01-15-2009 |
20090021916 | SEMICONDUCTOR ASSEMBLY HAVING A HOUSING - A semiconductor assembly, power semiconductor module, a housing and methods for assembling the power semiconductor housing is disclosed. One embodiment provides an electrically insulating substrate has an inner housing having a cover and a peripheral rim, and at least one pressure element arranged adjacent a side-face of the peripheral rim. The pressure element is resiliently coupled to the inner housing. | 01-22-2009 |
20090027857 | Heat spreader constructions, intergrated circuitry, methods of forming heat spreader constructions, and methods of forming integrated circuitry - The invention includes a heat spreader having a base which has a perimeter surface surrounding a heat-receiving region. A frame portion interfaces the perimeter surface and has an opening traversing a thickness of the frame. The invention includes a method of forming a heat spreader construction by forming a base portion having a perimeter region surrounding a heat-receiving surface. An independent frame portion is joined to the base portion. The invention includes integrated circuitry having a heat spreader construction in thermal communication with a heat-generating device. The heat spreader has a base having a heat-receiving surface and a perimeter surface which interfaces a frame portion. The invention includes methodology for forming integrated circuitry which includes providing an integrated circuitry board having a heat generating device mounted thereon, and providing a multi-part heat spreader in thermal communication with the heat-generating device. | 01-29-2009 |
20090027858 | HEAT DISSIPATING DEVICE ASSEMBLY - A heat dissipating device assembly for dissipating heat generated by an electronic component ( | 01-29-2009 |
20090027859 | Surface mounted heat sink and electromagnetic shield - A single-piece, high performance, inexpensively fabricated heat sink and electromagnetic interference (EMI) shield makes thermal contact with a heat generating device. Capillary forces exerted on the heat sink by cooling flowed solder draw the heat sink toward the PCB. The heat sink attaches directly to a printed circuit board (PCB), thus not stressing ball grid array (BGA) solder joints between the heat generating device and the PCB in applications with BGAs. The heat sink does not require any special tools for installation or removal nor any additional PCB space. The heat sink is designed to allow automated surface mounting techniques, such as pick and place. The single-piece construction eliminates the need for a separate clip, thereby increasing heat transfer area. | 01-29-2009 |
20090034204 | APPARATUS FOR TRANSFERRING HEAT FROM A HEAT SPREADER - An apparatus for transferring heat from a heat spreader is provided. The apparatus includes a heat dissipating member and a heat spreading member adjacent the heat dissipating member, the heat spreading member configured to spread heat laterally across the heat dissipating member, the heat spreading member defining a heat conduction plane. The apparatus also includes a base adjacent to the heat spreading member, wherein the heat spreading member is between the base and the heat dissipating member, and at least one thermal via within the heat conduction plane, the thermal via thermally coupled to the heat spreading member, the at least one thermal via thermally coupled to the heat dissipating member and the base through surface-to-surface contact. | 02-05-2009 |
20090034205 | HEAT SINK ASSEMBLY WITH A LOCKING DEVICE - A heat sink assembly includes a heat sink having a first shoulder and a second shoulder, and a locking device having a retention module, a first clip and a second clip. The first clip has two extension portions engaging with the retention module and a pressing portion between the two extension portions. The second clip comprises a pressing portion located on the second shoulder, an axle connecting with the pressing portion and pivotably engaging with the retention module and a locking portion connecting with the pressing portion. The second clip can rotate around the axle thereof when the heat sink assembly is in an unlocked position; the locking portion engages with the retention module and the pressing portion presses the second shoulder of the heat sink toward the retention module when the heat sink assembly is in a locked position. | 02-05-2009 |
20090040728 | Fixing Structure and Heat Dissipation Device - A fixing structure includes a back plate, a fixing plate, a first elastic element, a second elastic element and a fastener. The back plate has a positioning pillar thereon. The fixing plate presses a heat dissipation element to allow the heat dissipation element to contact a chip above the back plate. Both the first elastic element and the second elastic element are connected to the fixing plate. The fastener fastens the first elastic element and the second elastic element to the positioning pillar or just fastens the first elastic element to the positioning pillar to allow the second elastic element to be suspended. Furthermore, a heat dissipation device employing the fastening structure is also disclosed. | 02-12-2009 |
20090046431 | High Capacity Thin Module System - Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module. | 02-19-2009 |
20090052140 | HEAT DISSIPATION DEVICE ASSEMBLY WITH RETAINER DEVICE - A heat dissipation device assembly includes a heat dissipation device mounted on a printed circuit board and a retainer device mounted below the printed circuit board. The retainer device includes a back plate and a crank pivotably mounted to the back plate. The crank includes a pressing portion and a handle for receiving a rotation force. Posts are extended from the heat dissipation device through the printed circuit board to engage with the back plate, thereby to pre-assemble the heat dissipation device on the printed circuit board. The handle is pushed to rotate between a released position and a locked position. In the locked position, the pressing portion extends through the back plate to push the printed circuit board toward the heat dissipation device, whereby an electronic component on the printed circuit board has an intimate contact with the heat dissipation device. | 02-26-2009 |
20090059532 | ELECTRONIC SYSTEM WITH A HEAT SINK ASSEMBLY - An electronic system comprises an enclosure, a printed circuit board in the enclosure, and a heat sink assembly comprising a holding member. The enclosure comprises a first panel and a second panel perpendicularly connecting with the first panel. The printed circuit board is mounted on the first panel of the enclosure. The heat sink assembly has a first end mounted on the printed circuit board for contacting a heat-generating electronic device on the printed circuit board, and a second end opposite to the first end. The holding member connects the second panel of the enclosure with the second end of the heat sink assembly. | 03-05-2009 |
20090059533 | HEAT DISSIPATION ASSEMBLY - A heat dissipation assembly for dissipating heat generated by an electronic component includes a heat sink contacting the electronic component, a pair of retaining members fixed on two lateral sides of a top portion of the heat sink, a pair of arms pivotably secured to the retaining members, and an operating member pivotably attached to the retaining members. The operating member has two cams for interacting with the retaining member and the heat sink. When the operating member is rotated from a vertical orientation to a horizontal orientation, the arms are driven by the operating member to rotate towards the heat sink to engage with barbs of a retention module. Furthermore, the arms are also activated to move upwardly so they can tightly engage with the barbs, thereby securing the heat sink to the electronic component. | 03-05-2009 |
20090059534 | ELECTRONIC EQUIPMENT - In order to ensure waterproofing between a resin enclosure case and a heat sink, a canopy structure is provided in a portion, in which water is likely to penetrate, so as to prevent the water from entering the portion, thereby directing the water flow to the outside of the enclosure. This makes it easy to install and remove an electronic unit, so that an electronic component integrally formed with the heat sink can be easily replaced. | 03-05-2009 |
20090067133 | HEAT SINK HAVING PROTECTIVE DEVICE FOR THERMAL INTERFACE MATERIAL SPREAD THEREON - A protective device ( | 03-12-2009 |
20090067134 | ELECTRONIC DEVICE - According to one embodiment, a heat sink includes an extended end screwed to a printed circuit board. The extended end includes a screw hole and an engagement projection. A notch is formed by cutting the side of the printed circuit board to a position at which the notch does not interfere with signal lines. The notch is engaged with an engagement projection extending from the extended end, thereby preventing the heat sink from rotating when the heat sink is screwed to the printed circuit board. | 03-12-2009 |
20090073659 | Heat sink structure for a power supply - A structure comprises a high thermally conductive case with a receiver space for a power module, a thermally conductive part being provided on the case to contact a heating component of the power module in the power supply to induct the heat by the heating component to the case and contact the exterior air through the outside surface of case to dissipate the heat; and a housing the inner surface of which directly contact and cover the outside of high thermally conductive case, a grid-formed structure being formed at most of the region of housing to prevent the heat from scalding the person who touches or takes the power supply. With the large heat dissipation area, the heat is transferred through the external air to increase the efficiency of heat dissipation, and further all power parts may operate in a lower temperature to increase the work efficiency of power supply. | 03-19-2009 |
20090086437 | ELECTRONIC CONTROL DEVICE USING LC MODULE STRUCTURE - In an electronic control device that includes two or more kinds of lead-insertion-type parts, including at least a coil and a capacitor, the parts are installed on a support that has a wiring, a terminal structure and mechanically fixing portions; the leads of the above parts are respectively inserted in and electrically connected to holes formed in the wiring portion of the support; the parts and the support are fixed to each other with an adhesion material for fixation; the upper surfaces of the parts are attached to a metallic chasis with a thermally conductive material of a low elasticity modulus interposed in between; the mechanically fixing portions of the support are fixed to the metallic chasis; and the terminal structure of the support is electrically connected to a circuit board that mounts at least a controlling element. | 04-02-2009 |
20090109630 | HEAT SINK ASSEMBLY HAVING A FIXING BASE THEREOF - A heat sink assembly includes a fixing base and a heat sink mounted on the fixing base. The fixing base has a bottom face attached to an electronic component mounted on a printed circuit board. The fixing base includes a pair of hooks extending from a rear side thereof and engaging with a support beam fixed to the printed circuit board. A pair of sleeves extend from a front side of the fixing base and two fasteners are received in the sleeves and threadedly engage with the printed circuit board. The rear and front sides of the fixing base are firmly secured to the printed circuit board, whereby the heat sink mounted on the fixing base can dissipate heat from the electronic component via the fixing base. | 04-30-2009 |
20090116194 | Circuit Module and Manufacturing Method Thereof - A circuit module includes: a thermally conductive board forming a part of a housing; a circuit board disposed above the thermally conductive board; a semiconductor chip connected to a plurality of electrode pads on a upper surface of the circuit board through solder; a heat sink connected to a upper surface of the semiconductor chip; a thermally conductive member thermally connecting the thermally conductive board to the semiconductor chip; and a plurality of fasteners passing through the thickness of the circuit board in an area surrounding the semiconductor chip to attach the heat sink to the thermally conductive board. | 05-07-2009 |
20090116195 | HEAT SINK FOR DISSIPATING HEAT AND APPARATUS HAVING THE SAME - A heat sink includes first and second base plates to contact with first and second surfaces of a heat source, respectively. The first base plate includes a support unit protruding from a first surface and a first dissipating unit to dissipate heat from the heat source. The second base plate includes a penetrating hole spaced apart from an edge portion to hold the support unit and a second dissipating unit to dissipate the heat from the heat source. A coupling member is positioned on an upper surface of the support member and applies a force to the first and second base plates to thereby combine the first and second base plates to the heat source. The base plates are combined to the memory module without any loss of the surface area of the dissipating fin, to thereby improve the dissipation efficiency of the heat sink. | 05-07-2009 |
20090129024 | INVERTED THROUGH CIRCUIT BOARD MOUNTING WITH HEAT SINK - The apparatus contains a printed circuit board in which a heat sink is mounted adjacent to one side of the printed circuit board in contact with a heat generating device mounted to the circuit board and positioned at least in part within an aperture in the circuit board. | 05-21-2009 |
20090129025 | Illumination device comprising a substrate plate and a heat sink - The invention relates to an illumination device ( | 05-21-2009 |
20090135564 | DIGITAL MICROMIRROR DEVICE MODULE - A digital micromirror device (DMD) module includes a circuit board, a DMD element, a soft elastic pad, a heat dissipation pad and a heat sink. The circuit board includes a first surface, a second surface and a through hole, wherein the first surface is opposite to the second surface. The DMD element is electrically connected to the circuit board. The soft elastic pad is disposed on the first surface of the circuit board and surrounds the through hole. The heat dissipation pad passes through the through hole and contacts the DMD element. The soft elastic pad is sandwiched between the circuit board and the heat sink, the heat dissipation pad is sandwiched between the heat sink and the DMD element, and the heat sink contacts the soft elastic pad and the heat dissipation pad, so as to apply a force to the soft elastic pad and the heat dissipation pad. | 05-28-2009 |
20090141453 | HEAT DISSIPATION DEVICE HAVING A CLIP ASSEMBLY - A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink and a clip attaching the heat sink onto the printed circuit board. The heat sink has a rectangular base and a plurality of fins extending upwardly from the base. The fins define a receiving channel therein, which is slantwise to two opposite sides of the heat sink. The clip includes a main body placed in the receiving channel and two latching legs extending obliquely and oppositely from two opposite ends of the main body. The two latching legs are located in front of and in rear of the two opposite sides of the heat sink, respectively, and are parallel thereto. | 06-04-2009 |
20090154108 | CLIP AND HEAT DISSIPATION ASSEMBLY USING THE SAME | 06-18-2009 |
20090154109 | HEAT SINK ASSEMBLY - A heat sink assembly includes a heat sink and a clip for securing the heat sink to a circuit board with a pair of securing members mounted thereon. The clip is a bent resilient wire including a positioning portion disposed on the heat sink and a pair of arms extending from opposite ends of the positioning portion. Each arm includes an operation portion suspended above the heat sink and a hook connecting with the operation portion. The securing members are located at opposite lateral sides of the electronic component respectively. The two hooks are configured for engaging with the securing members, correspondingly. | 06-18-2009 |
20090161318 | THERMAL MANAGEMENT SYSTEMS AND METHODS - Thermal management systems and methods for electronics. A printed circuit board assembly may include a soldered-in heat sink in communication with inner layers of a printed circuit board for cooling. The heat sink may include a plurality of leads received by plated through-holes in the printed circuit board. The heat sink may include features to augment surface area, as well as features to increase turbulence in a supplied cooling medium for enhanced convection. The heat sink may also include a heat pipe to facilitate cooling. The number, placement and configuration of the heat sinks may be optimized for a particular application to make efficient use of available surface area on the printed circuit board. | 06-25-2009 |
20090161319 | Electronic Circuit Arrangement and Method for Producing an Electronic Circuit Arrangement - An electronic circuit arrangement includes a heat sink and a first circuit carrier which is thermally coupled to the heat sink, lies flat on the latter and is intended to wire electronic components of the circuit arrangement. Provided for at least one electronic component is a special arrangement which is associated with a considerably increased heat dissipation capability for the relevant component and, in addition, also affords further advantages in connection with changes in the population and/or line routing which might occur in practice. The important factor for this is that the component is arranged under a second circuit carrier which is held in a recess in the first circuit carrier. The recess passes through to the top side of the heat sink. | 06-25-2009 |
20090168354 | Thermally and electrically conductive interconnect structures - An interconnect structure for operable placement between a first body and a second body, wherein the interconnect structure includes a first surface for operable juxtaposition with the first body, a second surface for operable juxtaposition with the second body, and a thickness dimension defined between the first and second surfaces. The interconnect structure includes a first thermally conductive material and a second electrically conductive material, wherein the second electrically conductive material is formed in one or more distinct structures, with the structures forming at least one substantially continuous pathway of the second material through the thickness dimension. The interconnect structure exhibits a compressive modulus along a thickness axis of less than about 100 psi. | 07-02-2009 |
20090168355 | HEAT SINK ASSEMBLY FOR MULTIPLE ELECTRONIC COMPONENTS - A heat sink assembly for removing heat from two heat generating-components mounted on a printed circuit board, includes a first heat sink, a second heat sink, a plurality of poles each having a head at a top end and a double-layer spring. The first heat sink includes a base and a plurality of fins arranged on the base. The second heat sink has a first shoulder extending from a lateral side thereof. The first shoulder is disposed on the base. The double-layer spring includes an outer spring and an inner spring having a top end connected to a top end of the outer spring. One of the poles wearing the double-layer spring extends through the first shoulder and the base. The outer spring is compressed between the head of the pole and the first shoulder. The inner spring is compressed between the head of the pole and the base. | 07-02-2009 |
20090168356 | MEMORY MODULE ASSEMBLY WITH HEAT DISSIPATION DEVICE - A memory module assembly ( | 07-02-2009 |
20090168357 | PLASMA DISPLAY APPARATUS - A plasma display apparatus includes a plasma display panel, a chassis having the plasma display panel fixedly mounted on one face thereof, and having reinforcing members disposed as bulges on another face thereof to extend alongside each other, a heat sink fixedly mounted on the reinforcing members extending alongside each other to bridge between the reinforcing members, and a circuit board fixedly mounted on the heat sink to drive the plasma display panel. | 07-02-2009 |
20090168358 | Power drive unit - A power drive unit is configured to comprise a heat sink, a power module pressed by a press member to the heat sink to be fastened thereto and a spring member that has a substantially circular shape and is installed between the power module and the press member. With this, the power module can be fastened to the heat sink without incurring layout limitation, degradation of heat release performance and the like. Also, since the power drive unit further includes a projection that protrudes from the press member to be engaged with an engagement hole bored at the center of the spring member, engagement of the projection of the press member with the engagement hole of the spring member functions to prevent displacement of the press member relative to the spring member, thereby making loads acting on the power modules uniform. | 07-02-2009 |
20090175005 | Support, in Particular for an Electronic Power Component, a Power Module Including the Support, an Assembly Including the Module, and an Electrical Member Controlled by the Module - The support is for fitting on a heat dissipation mass. The support comprises an electrically insulating plate and a heat conductor plate for conducting heat to the heat dissipation mass. In particular, the heat conductor plate is in contact with the electrically insulating plate. The heat conductor plate includes a layer forming a junction with the heat dissipation mass, referred to as its bottom layer, and a layer for stiffening the heat conductor plate, referred to as its intermediate layer. More particularly, the stiffener layer is made of a material of hardness greater than that of the material of the bottom layer. | 07-09-2009 |
20090195988 | ELECTRONIC APPARATUS - According to one embodiment, a heat sink includes first and second fin units. Fins of the first fin unit are provided with a through-hole part in which a heat pipe is inserted. Fins of the second fin unit are provided with a cutout part cut out to avoid the peat pipe. The fins of the second fin unit are inserted in spaces between the fins of the first fin unit. The fins of the second fin unit reach to a region in which the fins of the second fin unit overlap the heat pipe in the first fin unit. | 08-06-2009 |
20090195989 | HEAT SINK COMPONENT AND A METHOD OF PRODUCING A HEAT SINK COMPONENT - A heat sink component for a semiconductor package includes a thermal interface member including a thermally conductive material, and a heat sink member having a surface thereof that includes at least one projecting portion having a pointed shape or edge shape, a tip of which digs into the thermally conductive material. | 08-06-2009 |
20090213552 | Component arragement with an optimized assembly capability - The invention relates to a component arrangement comprising: an electronics module ( | 08-27-2009 |
20090213553 | Power Module - A power semiconductor module comprises a housing. The housing comprises a casing and at least one coating of high resistance to surface tracking. A plurality of electrical conductors is provided on the housing. The coating is provided on a creepage distance that is provided between the electrical conductors. | 08-27-2009 |
20090213554 | POWER AMPLIFICATION DEVICE AND TRANSMITTER USING IT - A power amplification device includes a first power amplification unit having the positions of connectors thereof reversed, a second power amplification unit not having the positions of connectors thereof reversed, and a heat sink having a first flank thereof abutted on the heat radiation surface of the first power amplification unit, and having a second flank abutted on the heat radiation surface of the second power amplification unit. A transmitter using the power amplification device includes a plurality of power amplification devices, a distributor directly coupled to the input connectors of the power amplification devices, and a synthesizer directly coupled to the output connectors of the power amplification devices. | 08-27-2009 |
20090219696 | POWER CONVERSION DEVICE AND FABRICATING METHOD FOR THE SAME - A power conversion device in which the inductance of a main circuit is reduced, a surge voltage is suppressed, elements are properly cooled, which is miniaturized and reduced in weight as a whole, and is excellent in handling performance in a manufacturing process and a maintenance work. A positive side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a first laminated bus bar connected to the respective modules. A negative side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a second laminated bus bar connected to the respective modules, and both the laminated bus bars and the capacitors are connected to one another by a third laminated bus bar. Both the cooling plates are parallel to each other so that the mount surfaces thereof are set in the same direction. | 09-03-2009 |
20090237887 | ELECTRONIC DEVICE - An electronic device includes a circuit board on which a device generating heat in an operation state is mounted, a chassis to accommodate the circuit board, and a temperature-responsive arrangement. The chassis includes a holding part. The temperature-responsive arrangement extends and contracts in accordance with temperature so as to dispose the device apart from the holding part at a first temperature less than a threshold temperature, and to dispose the device in contact with the holding part at a second temperature exceeding the threshold temperature. | 09-24-2009 |
20090237888 | ELECTRICAL ASSEMBLY AND FASTENING ASSEMBLY THEREOF - An electric assembly includes a heat sink defining a through hole and a notch communicating with the through hole; a circuit board defining a fixing hole; and a fastening assembly. The fastening assembly includes a fastener comprising a stem, a head connected one end of the stem, and a clamp connected to an opposite end of the stem; a limiting member comprising a main body slideably disposed on the stem and a limiting portion extending from the main body, the main body received into the through hole, and the limiting portion engageably inserted into the notch; and an elastic member disposed around the stem and between the head and the main body. Wherein the limiting portion is capable of sliding out of the notch and against the heat sink to compress the elastic member. | 09-24-2009 |
20090237889 | Power Converter Having Multiple Layer Heat Sinks - A power converter including a printed circuit board (PCB) having a plurality of heat conductive layers configured to sink heat generated by the power converter electronics. Each of these heat conductive layers are comprised of thermally conductive material configured as planar sheets, each of these heat conductive layers being coupled to at least one wire to sink heat therefrom, such as via a wire of an input cable and/or output cable. Advantageously, a more compact power converter is realized having improved power output while operating within safety guidelines. | 09-24-2009 |
20090244848 | Power Device Substrates and Power Device Packages Including the Same - Provided are power device substrates that comprise thermally conductive plastic materials, and power device packages including the same. An exemplary power device package includes a power device substrate that comprises a thermally conductive plastic material, and has a first principal plane that provides an electrically insulating surface and a second principal plane of which at least a portion is exposed outside a molding member. The exemplary power device package further includes one or more power devices disposed on the first principal plane of the power device substrate, and a plurality of conductive members that are electrically connected to the power device(s) in order to electrically connect the power device(s) to an external circuit. | 10-01-2009 |
20090257195 | Electronic apparatus - An electronic apparatus in which a circuit substrate is installed in a casing, including: first and second groove portions that are formed on a first surface and a second surface of a heat sink, respectively, the heat sink discharging heat from a heat element on the circuit substrate to the outside of the casing; and a through-hole portion that is formed at an intersection point of the first groove portion formed on the first surface of the heat sink and the second groove portion formed on the second surface of the heat sink. | 10-15-2009 |
20090262504 | HEAT SINK CLIP AND ASSEMBLY - A clip includes a body, a moveable fastener and an actuating member. The body includes a pressing part, a flat portion and a latching leg. The movable fastener includes a connecting portion, a pivot axis connected at a top end of the connecting portion and an engaging portion. The connecting portion extends through the flat portion. The actuating member defines a guiding groove therein. The guiding groove angles outward to form a height difference along a longitudinal axis of the actuating member between a topmost end and a bottommost end thereof. The actuating member is above the flat portion and connected to the pivot axis of the moveable fastener. The actuating member is levelly moveable relative to the movable fastener so that the pivot axis can slide along the guiding groove to render the moveable fastener vertically moveable between a locked position and a released position. | 10-22-2009 |
20090262505 | Heat radiator - A heat radiator is in the form of a rectangular body having two opposite longer sides and two opposite shorter sides, and includes a contact section located at an end surface of the heat radiator for contacting with a heat source and having at least one extension wall outward extended therefrom to divide the heat radiator into a first heat-dissipating zone, which consists of a plurality of curved radiation fins outward extended from the contact section toward the two longer sides, and a second heat-dissipating zone, which consists of a plurality of straight or curved radiation fins outward extended from the contact section and the extension wall toward the two shorted sides. These radially outward extended radiation fins not only provide increased heat radiating areas, but also guide airflow produced by a cooling fan to smoothly flow therethrough to carry heat away from the heat radiator in different directions. | 10-22-2009 |
20090268407 | HEAT SINK CLIP - A heat sink clip ( | 10-29-2009 |
20090279263 | SECURING DEVICE FOR ASSEMBLING HEAT DISSIPATION MODULE ONTO ELECTRONIC COMPONENT - A securing device ( | 11-12-2009 |
20090279264 | ELECTRONIC DEVICE AND HEAT DISSIPATION UNIT THEREOF - A heat dissipation unit is provided. The heat dissipation unit includes a heat sink, a first fixing station, a first heat pipe, a second fixing station and a second heat pipe. The first fixing station is located on a first plane. The first heat pipe is connected to the first fixing station and the heat sink. The second fixing station is located on a second plane, wherein a gap is formed between the first plane and the second plane. The second heat pipe is connected to the second fixing station and the heat sink, wherein the first fixing station partially overlaps the second fixing station. | 11-12-2009 |
20090290309 | HEAT DISSIPATION DEVICE - A securing device includes a securing member defining a securing hole, and a fastener. The fastener includes a spring, and a bolt having a main portion, a bottom fixing portion, and a top head portion. The securing hole includes an inner portion and an outer portion extending horizontally from the inner portion to an outside. A width of the outer portion is smaller than the fixing portion and larger than the main portion. The main portion enters into the inner portion through the outer portion. The fixing portion abuts against a bottom of the securing member. The spring is compressed between a top of the securing member and the head portion. A concave is depressed from the securing member and surrounds the inner portion. A lower portion of the spring is fittingly received in the concave. | 11-26-2009 |
20090296350 | HEAT-DISSIPATING MECHANISM IMPLEMENTED IN CAGE FOR OPTICAL TRANSCEIVER - A mechanism for the heat sink to adhere to the transceiver inserted in the cage is disclosed. The heat sink provides a guide in the side thereof, while, the cage provides a slit in the side. A pair of elastic tabs is diagonally formed in the slit. The transceiver slides the heat sink rearward as the insertion thereof into the cage, then, the guide of the heat sink slips down the rear tab in the slit, which presses the heat sink downward to adhere to the transceiver. The heat conducting path from the transceiver to the heat sink is formed. | 12-03-2009 |
20090296351 | MECHANISM TO MAKE A HEAT SINK IN CONTACT WITH A PLUGGABLE TRANSCEIVER, A PLUGGABLE OPTICAL TRANSCEIVER AND A CAGE ASSEMBLY PROVIDING THE SAME - An inventive heat-dissipating mechanism between the pluggable optical transceiver and the heat sink with the thermo-conducting sheet is disclosed. One of the optical transceiver and the heat sink is adhered with the thermo-conducting sheet. The heat sink is assembled with the cage so as to be movable in vertical as causing the downward force. The optical transceiver provides a projection in the surface to be come in contact with the heat sink, while, the heat sink provides a rail with a pocket. When the transceiver is inserted into the cage, the projection first runs on the rail to lift the heat sink upward; subsequently, is fallen within the packet to adhere the thermo-conducting sheet to the transceiver. | 12-03-2009 |
20090310312 | APPARATUS FOR MOUNTING A MODULE AND ENABLING HEAT CONDUCTION FROM THE MODULE TO THE MOUNTING SURFACE - An electronics enclosure is provided. The electronics enclosure includes a heat dissipating body comprising: a heat conducting surface, a first flange adjacent to the heat conducting surface, and a first part of a latch mechanism adjacent to the heat conducting surface. The first part of the latch mechanism is adjacent an edge of the heat conducting surface opposite to the first flange, such that a portion of the heat conducting surface is between the first flange and the first part of the latch mechanism. The electronics enclosure also includes a plurality of electronic modules configured to mount to the heat dissipating body. Each of the plurality of electronic modules comprises: a plurality of electronic components, a heat conducting side configured to contact the heat conducting surface of the heat dissipating body, a second flange adjacent the heat conducting side, the second flange configured to couple with the first flange, and a second part of the latch mechanism adjacent the heat conducting side, the second part of the latch mechanism configured to couple with the first part of the latch mechanism. The second flange and the second part of the latch mechanism are on opposite edges of the heat conducting side. | 12-17-2009 |
20090316363 | AIR VOLUME CONTROL MODULE FOR VEHICULAR AIR CONDITIONING APPARATUS - An air volume control module for use with a vehicular air conditioning apparatus includes a circuit board including a control circuit for controlling the rotational speed of the blower of the vehicular air conditioning apparatus, a heat sink connected to the circuit board and including a fin for radiating heat generated by the circuit board, and a base housing surrounding the circuit board, the heat sink being inserted in the base housing with the fin projecting from the base housing. The base housing is mounted on the heat sink only by a locking finger. Either one of the base housing and the fin of the heat sink has a protective projection having a heightwise dimension greater than that of the locking finger. | 12-24-2009 |
20090316364 | HIGH FREQUENCY DEVICE - A high frequency device includes an antenna connector adapted to be connected with an antenna, a board, a conductor layer provided on an upper surface of the board, a filter mounted on the upper surface of the board and connected with the antenna connector, and a high frequency circuit mounted on a lower surface of the board and connected with the filter. The filter includes a case having a hollow shape having an opening which opens downward, and a resonator accommodated in the case. The case has a lower end around the opening. The lower end of the case is joined to the conductor layer. The high frequency device has a small size. | 12-24-2009 |
20090323287 | Integrated Circuit Cooling Apparatus for Focused Beam Processes - A fixture and method are provided for cooling an IC in the performance of focused beam processes. The method provides a holding/cooling fixture with thermal electric (TE) jaws having an IC interface surface and a heatsink interface. An IC die is secured between the IC interface surfaces of the jaws. Electrical energy is supplied to the TE jaws, creating a negative temperature differential between the IC interface and heatsink interfaces. As a result, the IC die is cooled. A focused beam is applied to a local region of the IC die. Some examples of the focused beam include a focused ion beam (FIB), scanning electron microscope (SEM), E-beam, or a laser scanning microscope (LSM). The focused beam heats the local region of the IC, while the bulk of the IC remains cooled. Typically, each TE jaw includes a plurality of TE elements thermally connected in series. | 12-31-2009 |
20100002396 | HEAT SINK ASSEMBLY HAVING A CLIP - A heat sink assembly includes a heat sink and a clip assembly. The clip assembly includes a clip and a pair of movable fasteners pivotally connected to the clip. The clip includes a main body, two pressing portions extending from two opposite ends of the main body and two locking arms extending oppositely from the two pressing portions, respectively. The movable fasteners each include a main body, a pair of receiving portions curved upwardly from the main body and receiving a corresponding locking arm therein and a hook extending downwardly from the main body and engaging with a clasp on a printed circuit board. A distance from each of the hooks of the movable fasteners to a corresponding clasp can be adjustable via rotation of the movable fasteners around the locking arms of the clip. | 01-07-2010 |
20100008045 | HEAT SINK - A heat sink used to dissipate a heat source includes a heat-dissipating portion and a heat-conducting portion secured into the heat-dissipating portion. The heat-dissipating portion includes a base and fins extending from the base. The base defines a threaded hole in a bottom thereof. The heat-conducting portion includes a substrate for contacting with the heat source and a threaded portion extending from the substrate. The threaded portion of the heat-conducting portion is positioned in the base of the heat-dissipating portion and secured in the base of the heat-dissipating portion by the threaded portion engaging in the threaded hole of the base of the heat-dissipating portion. | 01-14-2010 |
20100008046 | THERMAL DISSIPATION HEAT SLUG SANDWICH - In one embodiment a thermal dissipation heat slug sandwich includes a circuit board, a circuit package having an integrated heat slug mounted to an obverse side of the circuit board, and a lower heat sink plate on a reverse side of the circuit board thermally coupled to the heat slug and a housing enclosing the circuit board An upper heat sink plate may be mounted to the obverse side of the circuit board to cover the circuit package. The upper heat sink plate thermally coupled to the lower heat sink plate through the circuit board. An insulating cover may also be provided to redirect radiant heat from the circuit package to the housing. | 01-14-2010 |
20100014253 | Electronic Component Module and Method for Production Thereof - An electronic component module comprising at least one ceramic circuit carrier ( | 01-21-2010 |
20100020499 | ELECTRONIC CHIP MODULE - Provided is an electron chip module having a heat sink that can increase heat dissipation efficiency. A bottom surface of a module circuit board and an upper surface of a heat sink are in direct contact with each other by using a metal wire, such that heat generated during the operation of a heat-generating device chip mounted onto the module circuit board can be effectively dissipated to the outside. | 01-28-2010 |
20100020500 | HEAT DISSIPATION DEVICE - A clip includes a main body, a pair of locking members integrally formed at opposite ends of the main body, and a securing member secured onto one of the locking members. The one locking member includes an upper portion, a lower portion wider than the upper portion, and a step between the upper and lower portions. The securing member includes a handling portion and an engaging portion extending downwardly from the handling portion. A pair of flanges are formed on the engaging portion facing the main body and abutting the step. A clearance is defined between the flanges and the engaging portion receiving the upper portion. One of the engaging portion and the one locking member forms an engaging hole, and the other one forms a hook engaging into the engaging hole. | 01-28-2010 |
20100039774 | Power Semiconductor Module And Method For Its Production - A power semiconductor module that includes a substrate having at least one power semiconductor element; a heat sink for dissipation of heat from the at least one power semiconductor element and a housing having a cutout which is arranged on a lower face of the housing facing the heat sink and holds the substrate; and to a method for production of such power semiconductor modules. The power semiconductor module has at least one holding element, which engages in a recess, which is associated with the at least one holding element, on the lower face of the housing and is designed such that it limits any movement of the substrate in the direction of the lower face of the housing. | 02-18-2010 |
20100039775 | THERMAL MANAGEMENT OF ELECTRONIC DEVICES - Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The device may also include at least one thermal plane substantially parallel to the first surface of the substrate, the at least one thermal plane being in thermal contact with at least one of the first thermal vias. The device may also include a heat sink attachment area, and second thermal vias extending from the heat sink attachment area to the interior of the substrate, the at least one thermal plane being in thermal contact with the second thermal vias. | 02-18-2010 |
20100046171 | FASTENING MEMBER - A fastening member for fastening a peripheral device in an electronic device casing and performing heat exchange with the peripheral device is presented. The fastening member includes a supporting plate and a pair of side plates. This pair of side plates is respectively disposed on two sides of the supporting plate to support the peripheral device. The side plates can be fastened to the electronic device casing. The supporting plate has a plurality of heat-conductive connecting pieces in contact with the casing for transferring heat generated by the peripheral device to the electronic device casing, so as to perform heat exchange. | 02-25-2010 |
20100053902 | ELECTRONIC DEVICE WITH CIRCUIT BOARD SUPPORT - An electronic device includes a circuit board comprising a first surface and a second surface, a heat sink positioned on the first surface, and a support positioned on the second surface to support the circuit board. The circuit board includes a pair of first locating holes extending through the first surface and the second surface. The heat sink includes a pair of second locating holes corresponding to the first locating holes. The support includes a pair of locating posts projecting from a pair of diagonal corners thereof and extending through the corresponding first and second locating holes to limit unwanted movement of the heat sink and a shim projecting from a center thereof to prevent the circuit board from flexing. Dimensions of the shim are contoured to provide compensation for bending of the support under an applied load. | 03-04-2010 |
20100073883 | FILM FORMING METHOD, THERMAL CONDUCTION MEMBER, POWER MODULE, VEHICLE INVERTER, AND VEHICLE - There is provided a film forming method capable of enhancing adhesion efficiency of a metal powder by use of a low-pressure compressed gas even in the case of spraying the metal powder remaining in a solid-phase state to a substrate, to form a film, the method being a film forming method of spraying a metal powder p in a solid-phase state to a surface | 03-25-2010 |
20100079957 | UNDERFILL PROCESS AND MATERIALS FOR SINGULATED HEAT SPREADER STIFFENER FOR THIN CORE PANEL PROCESSING - A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel, and mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates by mounting perimeter ribs of the IHS panel to a corresponding pattern of sealant on the substrate panel and by mounting each of the plurality of dies to a corresponding one of the plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel. Other embodiments are also disclosed and claimed. | 04-01-2010 |
20100091460 | ELECTRONIC MODULE WITH HEAT SINK - An electronic module includes a printed circuit board with a heat producing electrical component assembled in an insulating housing. The component is adjacent a thermally conducting heat sink with a thermally conductive material disposed therebetween. Integral with the heat sink is a thermally conductive runner, partially encased in the housing wall, connecting the heat sink to a thermally conductive port. The port is coupled to a base structure when the housing is attached to the base, forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base. | 04-15-2010 |
20100091461 | MOUNTING STRUCTURE FOR POWER MODULE, AND MOTOR CONTROLLER INCLUDING THE SAME - A mounting structure for a power module, in which a power module and a heat sink can be easily separated without additional labor and time and without requiring an extra disassembly space in a product and in which parts are not damaged during the disassembly. In the heat sink ( | 04-15-2010 |
20100091462 | ELECTRONIC DEVICE-MOUNTED APPARATUS AND NOISE SUPPRESSION METHOD FOR SAME - A noise electric current flowing through a heat sink is efficiently discharged to the ground of a printed circuit board to reduce levels of clock signal harmonic noises generated from the heat sink. An electronic device-installed apparatus is provided with a printed circuit board ( | 04-15-2010 |
20100097767 | Machine for passively removing heat generated by an electronic circuit board - A machine for passively removing heat generated by an electronic circuit board is disclosed. In a typical embodiment an electronic circuit board of any type or size is comprised of electronic components producing heat during operation. High thermal conductivity moldable pads applied to both sides of the electronic circuit board form a conductive pathway to transport heat away from electronic circuits and components. A two piece rigid heat sink having thin rigid conductive fins on its top base is coupled together forming a cavity into which the computer board/conductive pad assembly fits, thereby forming a second conductive pathway for heat transport away from board features. The thin rigid conductive fins collectively form yet a third conductive pathway for heat transport from the solid base of the two piece rigid heat sink. Exposure of the thin rigid conductive fins to cooler surrounding air provides convective transfer of heat from the fins to ambient air. | 04-22-2010 |
20100103623 | LOW-TEMPERATURE-COFIRED-CERAMIC PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided are a low-temperature-cofired-ceramic (LTCC) package and a method of manufacturing the same. The LTCC package includes: an LTCC substrate including a plurality of LTCC layers and a recess in which a device is mounted; a thermal conductive element adhered onto a first LTCC layer exposed by the recess using a first thermal conductive adhesive member; the device adhered onto the thermal conductive element using a second thermal conductive adhesive member; and a connection member for electrically connecting the device with the LTCC substrate. In the LTCC package and the method, portions of the LTCC layers disposed under a high-heating device except a lowermost LTCC layer contacting a heat sink, which correspond to a thermal transmission path, are removed and replaced by a higher thermal conductive material to minimize heat dissipation resistance and heat resistance caused by thermal conduction. Thus, heat resistance and thermal stress between the bottom of the high-heating device and the heat sink can be minimized. | 04-29-2010 |
20100110638 | SEMICONDUCTOR DEVICE - A semiconductor module mounted on a vehicle is disclosed. The semiconductor module includes a semiconductor element, a forced-cooling type cooler, and a heat mass. Heat generated in the semiconductor element is conducted to the cooler. The heat mass is joined onto the semiconductor element, so as to be thermally coupled to the semiconductor element. The heat mass is formed such that the thermal resistance of a part of the heat mass that corresponds to a high temperature part of the semiconductor element in a heat generating state is lower than the thermal resistance of a part of the heat mass that corresponds to a lower temperature part of the semiconductor element. | 05-06-2010 |
20100128439 | THERMAL MANAGEMENT SYSTEM WITH GRAPHENE-BASED THERMAL INTERFACE MATERIAL - A thermal management system includes graphene paper disposed between a heat source and a heat sink to transfer heat therebetween. The graphene paper is oriented such that the individual layers are substantially perpendicular to the plane of the heat source and the plane of the heat sink to maximize heat transfer. The heat source and the heat sink can be any physical structure that emits and absorbs thermal energy, respectively. The graphene paper may be bonded to the heat source and the heat sink using a bonding agent, such as a thermally conductive material, and the like. The graphene paper may be formed in several different configurations, such as a spring structure, and the like. | 05-27-2010 |
20100128440 | HEAT SINK ASSEMBLY HAVING A CLIP - A heat sink assembly includes a heat sink and a clip. The heat sink includes a base and two first and two second fins mounted on a top surface of the base. The first and second fins are spaced from each other. The first fins are located between the second fins. Each second fin includes a body and a ridge formed at an inner surface of the body. The clip includes a pressing member, two engaging members angling upwardly from opposite ends of the pressing member, and two locking members extending from ends of the engaging members respectively. The pressing member of the clip is sandwiched between the first fins and abuts the top surface of the base. The engaging members of the clip span the first fins and resist the ridges and the second fins respectively. | 05-27-2010 |
20100128441 | ARC DISCHARGE DEVICE - [Object] To incorporate more semiconductor elements in a small-sized lightweight power semiconductor module provided in an arc discharge device. | 05-27-2010 |
20100134979 | POWER SEMICONDUCTOR APPARATUS - A power semiconductor apparatus has: plural power semiconductor units, sealed by a transfer mold resin so that insertion holes of conductive tubular sockets in which plural external terminals can be insertion-connected are exposed in one surface thereof and a metal heat dissipation surface is exposed in another surface thereof; and a conductive connecting member having the plural external terminals. The surfaces of the power semiconductor units that have the insertion holes of tubular sockets are arrayed in the same direction in the plural power semiconductor units. Electrical wiring connection between the plural power semiconductor units is effected by inserting the external terminals of the conductive connecting member into the respective insertion holes of the tubular sockets of the plural power semiconductor units. | 06-03-2010 |
20100157539 | HEATSINK MOUNTING SYSTEM - A heatsink system ( | 06-24-2010 |
20100165576 | POWER SYSTEM MODULE AND METHOD OF FABRICATING THE SAME - Provided are a power system module allowing a user's requirements to be easily met, and having economic practicality and high integration, and a manufacturing method thereof. The power system module includes a plastic case, a molding type power module package, a control circuit board, and at least one external terminal. The plastic case defines a bottom and a side wall. The molding type power module package is fixed to the bottom of the plastic case and includes at least a power device therein. The control circuit board is fixed to the side wall of the plastic case, includes at least a control device mounted thereon which is electrically connected to the power module package. The external terminal protrudes to outside the plastic case and is electrically connected to the control circuit board. | 07-01-2010 |
20100172102 | SOLDERLESS HEATSINK ANCHOR - A heatsink may be releasably secured to a substructure of an electronic system, such as a circuit board, in engagement with a heat-generating component, such as a processor. One embodiment provides an anchor that includes an anchor body, a hook coupled to the anchor body, a pair of flexible retention prongs extending from the anchor body in a common direction and spaced for insertion into openings on a circuit board, an optional pair of stabilization prongs extending from the anchor body adjacent to the flexible retention prongs, each having a width greater than the adjacent flexible retention prong, a barb disposed at the end of each prong and configured for retaining the anchor body on the circuit board upon insertion of the prongs into the openings on the circuit board, a spring integrated with the anchor body and having a free end spaced from the barbs a distance of less than the thickness of the circuit board, and a stop integrated with the anchor body for limiting the amount of insertion of the prongs beyond an initial contact of the free end of the spring with the circuit board. A heatsink clip releasably secures the heatsink to the hook of the anchor. | 07-08-2010 |
20100208430 | HEAT DISSIPATION ARRANGEMENT FOR COMMUNICATION CHASSIS - A heat dissipation arrangement for communication chassis includes a chassis body defining an inner receiving space and being divided into at least one heat receiving portion and at least one heat dissipation portion; a first heat pipe set arranged in the receiving space to connect the heat receiving portion to the heat dissipation portion, so that heat absorbed by the heat receiving portion can be quickly transferred via the first heat pipe set to the heat dissipation portion; and at least one thermal module including a plurality of radiating fins and at least one second heat pipe, which is connected to the heat dissipation portion and extended through the radiating fins, allowing part of the heat transferred to the heat dissipation portion to be transferred to the radiating fins. The thermal module provides additional heat dissipating area, so that the communication chassis can provide excellent heat dissipation effect. | 08-19-2010 |
20100208431 | Patterned Composite Structures and Methods of Making the Same - The present disclosure relates to a patterned surface composite structure. The structure includes a first material having a specific coefficient-of-thermal-expansion and a second material having a different coefficient-of-thermal-expansion. The first material can be patterned with specific features and the second material may be located between those features, thereby forming areas having a coefficient-of-thermal-expansion between that of the first and second materials. A thermally emissive device, such as a laser diode, may be attached to a surface of the patterned composite structure. | 08-19-2010 |
20100232113 | HEAT DISSIPATION DEVICE WITH FASTENER - An electronic device comprises a printed circuit board, an electronic component mounted on the printed circuit board, a heat dissipation device dissipating heat generated by the electronic component and a plurality of wires on the printed circuit board. The heat dissipation device comprises a heat sink and a pair of fasteners securing the heat sink to the printed circuit board. Each fastener comprises a frame body having a gap defined at a top portion thereof. The wires in a form of a wire harness extend through the gap of the frame body and into the frame body. | 09-16-2010 |
20100238632 | Load driving device - A load driving device includes: an output power device for driving a load; a driving IC for controlling the output power device, wherein the driving IC is electrically coupled with the output power device through a wire or a connection member; and a first electrode substrate. The output power device and the driving IC are mounted on the first electrode substrate. In this case, the output power device is controlled with high speed, and a mounting area of the output power device and the driving IC is reduced. | 09-23-2010 |
20100259899 | PASSIVE COOLING SYSTEM AND METHOD FOR ELECTRONICS DEVICES - An apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat pipe and at least one heat sink thermally coupled to a bridge plate. When a cradle is thermally coupled to the at least one heat pipe, the at least one heat sink draws heat from the cradle. | 10-14-2010 |
20100271784 | HEAT SINK ASSEMBLY HAVING A CLIP - A heat sink assembly includes a heat sink adapted for thermally contacting an electronic component of a printed circuit board, and a clip pressing the heat sink and engaging with the printed circuit board. The clip includes a pressing portion pressing the heat sink, two arms extending slantwise and upwardly from opposite ends of the pressing portion, two connecting portions extending outwardly from the two arms, two securing portions engaging with the printed circuit board, and two operating portions. When the two operating portion are operated, the connecting portions are rotated and the securing portions rotate with the connecting portions to engage with the printed circuit board. | 10-28-2010 |
20100284151 | Sealed Power Supply and Platform for Military Radio - An AC/DC power supply and platform for a military radio has been developed. The apparatus includes a base that supports at least one SINCGARS RT-1523 radio. The base is connected to an AC power supply and at least one DC power supply. The AC supply and DC power supply are configured to switch automatically to the DC power supply should the AC power supply fail. The housing of the platform is sealed from the exterior environment with gaskets. | 11-11-2010 |
20100290193 | Stacked-chip packaging structure and fabrication method thereof - A stacked-chip packaging structure includes chip sets, a heat sink, a substrate, a circuit board, and solder balls. The chip sets are stacked together, each of which has a heat-dissipation structure and a chip. The heat-dissipation structure has a chip recess, through holes arranged in the chip recess, and an extending portion extending from the chip recess. The chip disposed in the chip recess has bumps. Each bump on the chip is correspondingly disposed in one of the through holes of the heat-dissipation structure. The extending portion of the heat-dissipation structure of each chip set contacts that of the neighboring chip set. The heat sink and the substrate are disposed at two opposite sides of the chip sets, respectively. The circuit board is below the substrate. The solder balls are between the circuit board and the substrate. | 11-18-2010 |
20100302737 | POWER ELECTRONICS POWER MODULE WITH IMBEDDED GATE CIRCUITRY - A power electronics power module is provided. The power electronics power module includes an electrically conductive substrate, a electronic die having first and second opposing surfaces and at least one transistor formed thereon, the electronic die being mounted to the electrically conductive substrate and the at least one transistor being configured such that when the at least one transistor is activated, current flows from the first surface of the electronic die into the electrically conductive substrate, and a control member at least partially imbedded in the electrically conductive substrate, the control member having a control conductor formed thereon and electrically connected to the at least one transistor such that when a control signal is provided to the control conductor, the at least one transistor is activated. | 12-02-2010 |
20100309632 | MOTHERBOARD WITH MOUNTING HOLES - A motherboard includes a printed circuit board, and a heat generating component mounted on the printed circuit board. A plurality of mounting holes is defined in the printed circuit board for mounting a heat sink apparatus on the heat generating component. At least a ground via is defined in the printed circuit board and adjacent to each of the mounting holes. The heat sink apparatus is capable of electrically contacting the ground via, and the ground via is capable of reducing electromagnetic interference of the motherboard and grounding static electricity on the heat sink apparatus. | 12-09-2010 |
20100309633 | ELECTRONIC CIRCUIT COMPOSED OF SUB-CIRCUITS AND METHOD FOR PRODUCING THE SAME - To improve manufacture of an electronic circuit, the electronic circuit is composed of modules of sub-circuits arranged on a common substrate, such as a cooling body, and that are electrically interconnected by a planar electrical contact element. | 12-09-2010 |
20100309634 | Thermal Interface with Non-Tacky Surface - A package includes a thermal interface member which includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum cross-sectional thickness of less than about 10 microns. | 12-09-2010 |
20100315784 | FASTENING CLAMP - The invention relates to a fixing element ( | 12-16-2010 |
20100315785 | ELECTRONIC EQUIPMENT - An electronic equipment includes: an attachment plate; attachments disposed on the attachment plate and each provided with a female screw; a printed circuit board placed on the attachments; electronic parts mounted on the surface of the printed circuit board opposite to the attachments, and whose surfaces opposite to the surface of the printed circuit board serves as heat release surfaces; and a heat sink having a thermal-conduction surface and screw insertion holes. The thermal-conduction surface is abutted in common against the heat release surfaces with a heat release grease between them, male screws inserted into the screw insertion holes are penetrated through the printed circuit board, and meshed with the female screws threaded in the attachments, the heat sink is attached together with the printed circuit board to the attachments, and at least one of the attachments can be displaced in the thickness direction of the printed circuit board. | 12-16-2010 |
20100315786 | SEMICONDUCTOR DEVICE - A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor. | 12-16-2010 |
20100315787 | System and Method for Dissipating Heat from Semiconductor Devices - A system includes a circuit board, a multi-die package, and a heat dissipator. The circuit board has substantially planar opposing first and second sides. The multi-die package includes a substrate and a first set of one or more semiconductor devices on a first substrate side and a second set of one or more semiconductor devices on a second substrate side. The multi-die package is located at the first circuit board side. The heat dissipator is located at the second circuit board side, and thermally coupled to the second set of semiconductor devices. One or more portions of the circuit board are removed between the first circuit board side and the second circuit board side so as to define one or more holes through the circuit board and to facilitate thermal coupling between the second set of semiconductor devices and the heat dissipator through the one or more holes. | 12-16-2010 |
20100321894 | HEATSINK MOUNTING SYSTEM - A heatsink mounting system ( | 12-23-2010 |
20100328897 | HEAT SINK ASSEMBLY WITH TEMPERATURE DISPLAY - A heat sink assembly dissipates heat of a chip on a circuit board. A temperature collecting module of the heat sink assembly senses temperature of the chip and generates corresponding analog signals. A display module of the heat sink assembly receives the analog signals and converts the analog signals into digital signals, and then displays the digital signals with temperature unit symbol. | 12-30-2010 |
20110002104 | BRACKET FOR MOUNTING HEAT SINK - A bracket is used to mount a heat sink to a printed circuit board (PCB). The heat sink can dissipate heat for an electronic component mounted on the PCB. Cantilevers can be detached from the bracket, and replaced by other cantilevers with different sizes to mount a plurality of heat sinks having different sizes. | 01-06-2011 |
20110026226 | VEHICULAR ELECTRONICS ASSEMBLY - An electronics assembly for use in a vehicle is provided. The assembly comprises a heat sink, a dam coupled to the heat sink, the dam and the heat sink combining to form a reservoir, an electronic component positioned within the reservoir, and a thermally conductive layer conformally molded to the electronic component and disposed between the electronic component and the heat sink. | 02-03-2011 |
20110032678 | NANO-TUBE THERMAL INTERFACE STRUCTURE - A structure, comprising: a semiconductor structure having an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electrically and thermally nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer; and a plurality of electrically and thermally conductive heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink. | 02-10-2011 |
20110044003 | Heatsink structure - An improved heatsink structure is disclosed. The present invention provides a type of heatsinks formed by stacking a plurality of particulates, in order to achieve a larger heat-dissipation surface area and higher heat-dissipation efficiency. | 02-24-2011 |
20110044004 | HEAT TRANSFER APPARATUS HAVING A THERMAL INTERFACE MATERIAL - A heat-transfer apparatus includes a heat-producing body, a heat sink adjacent to the heat-producing body, and a thermal interface material that includes a plurality of heat-transfer particles bridging the heat-producing body and the heat sink. | 02-24-2011 |
20110051373 | CAGE HAVING A HEAT SINK DEVICE SECURED THERETO IN A FLOATING ARRANGEMENT THAT ENSURES THAT CONTINUOUS CONTACT IS MAINTAINED BETWEEN THE HEAT SINK DEVICE AND A PARALLEL OPTICAL COMMUNICATIONS DEVICE SECURED TO THE CAGE - A floating heat sink device is provided that attaches to a cage in a floating configuration that enables the heat sink device to move, or “float”, as the parallel optical communications device secured to the cage moves relative to the cage. Because the heat sink device floats with movement of the parallel optical communications device, at least one surface of the parallel optical communications device maintains continuous contact with at least one surface of the heat sink device at all times. Ensuring that these surfaces are maintained in continuous contact at all times ensures that heat produced by the parallel optical communications device will be transferred into and absorbed by the floating heat sink device. | 03-03-2011 |
20110051374 | IMAGE CAPTURING DEVICE - An image capturing device a circuit base, an image sensor, a cooling member, and an elastic member. The image sensor is disposed on the circuit base. The circuit board defines a first opening covered by the image sensor. The elastic member is interposed between the circuit board and the cooling member. The elastic member comprises a bulged elastic flange running through the first opening and compressively abutting against the image sensor and the circuit board and an elastic arm bent towards the cooling member and elastically abutting against the cooling member. | 03-03-2011 |
20110063802 | ELECTRONIC SYSTEM WITH HEAT DISSIPATION DEVICE - A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component. | 03-17-2011 |
20110075377 | Heat Sink Interface Having Three-Dimensional Tolerance Compensation - A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components. | 03-31-2011 |
20110090649 | TILT-TYPE HEAT-DISSIPATING MODULE FOR INCREASING HEAT-DISSIPATING EFFICIENCY AND DECREASING LENGTH OF SOLDER PIN - A tilt-type heat-dissipating module for increasing heat-dissipating efficiency and decreasing length of solder pin is disposed on a circuit substrate. The tilt-type heat-dissipating module includes a substrate unit, a heat-dissipating unit and an electronic unit. The substrate unit has a heat-dissipating body disposed on the circuit substrate, and one part of a top surface of the heat-dissipating body is a first inclined plane. The heat-dissipating unit has a plurality of heat-dissipating fins connected to the heat-dissipating body. The electronic unit has a plurality of electronic elements disposed on the first inclined plane of the heat-dissipating body. Each electronic element has a plurality of pins bent downwards from a bottom thereof in order to electrically connect to the circuit substrate, and heat generated by the electronic elements is transmitted to external environment by matching the heat-dissipating body and the heat-dissipating fins. | 04-21-2011 |
20110103020 | Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices - One aspect of the invention includes a copper substrate; a catalyst on top of the copper substrate surface; and a thermal interface material that comprises a layer containing carbon nanotubes that contacts the catalyst. The carbon nanotubes are oriented substantially perpendicular to the surface of the copper substrate. A Raman spectrum of the layer containing carbon nanotubes has a D peak at ˜1350 cm | 05-05-2011 |
20110110046 | REINFORCEMENT FRAME, COMPONENT UNIT, AND DISPLAY - Disclosed is a reinforcement frame ( | 05-12-2011 |
20110116237 | RF PACKAGE - An RF package includes a substrate mountable on a base plate, a non-conductive cover overlying the substrate, and quasi-serpentine stepped source leads attached to an upper surface of the substrate and extending from at least one of a pair of opposite sides of the upper surface of the substrate to tapered lower surfaces of the cover. The cover includes a recess to receive the substrate. The recess includes stress distribution surface areas to engage and press outer edge portions of opposite sides of the substrate against a base plate or heat sink. The tapered lower surfaces of the cover engage with and press against the stepped source leads when securing the RF package to the base plate or heat sink using one or more fasteners or bolts. The cover includes structural features to improve preferential deformation when a mounting force is applied. | 05-19-2011 |
20110116238 | HEAT DISSIPATION MODULE FOR ELECTRONIC APPARATUS - A heat dissipation module for an electronic apparatus including a heat-generating structure is provided. The heat dissipation module includes a heat dissipation structure and a heat-conducting structure. The heat-conducting structure includes a heat-conducting portion and an extending portion. The heat-conducting portion is adhered between the heat-generating structure and the heat dissipation structure. The heat generated by the heat-generating structure is transmitted to the heat dissipation structure through the heat-conducting portion. The extending portion is connected to the heat-conducting portion and exposed to the heat-generating structure and the heat dissipation structure. When the extending portion is forced to move along a direction away from the heat-generating structure and the heat dissipation structure, the heat-conducting portion is deformed to release the adhesion between the heat-conducting portion and the heat-generating structure and the adhesion between the heat-conducting portion and the heat dissipation structure. | 05-19-2011 |
20110128707 | POWER SEMICONDUCTOR MODULE FOR WIDE TEMPERATURE APPLICATIONS - A power semiconductor module includes an insulating substrate with a conductive circuit layer attached to one side and a baseplate attached to the other side. A power semiconductor device is attached to the conductive circuit layer. The conductive circuit layer and the baseplate are formed of a material with a coefficient of thermal expansion less than about 8.0×10 | 06-02-2011 |
20110134607 | SOLID STATE SWITCH ARRANGEMENT - A solid state switching arrangement includes at least one bus bar configured to carry electrical current and at least one switch that is gallium nitride based. The switch is secured relative to the bus bar and the bus bar is configured to communicate heat away from the switch. An example method of arranging a switch includes mounting a gallium nitride based switch relative to a bus bar and communication heat away from the gallium nitride based switch using the bus bar. | 06-09-2011 |
20110134608 | SEMICONDUCTOR DEVICE - A semiconductor apparatus | 06-09-2011 |
20110149520 | HEAT SINK ASSEMBLY - An exemplary heat sink assembly includes a heat sink and a clip resiliently clamping the heat sink on a printed circuit board. The heat sink includes a base and a plurality of first fins and two central second fins extending upwardly from the base. The clip includes a locating portion fixed between the second fins of the heat sink, a pair of elastic portions extending outwardly from opposite ends of the locating portion and oriented towards substantially opposite directions, and two hooks extending outwardly from ends of the operating members, respectively. An acute included angle is formed between each elastic portion and the locating portion of the clip in an original relaxed position, and the acute included angles become approximately right angles when the clip is preassembled in the heat sink with the elastic portions abutting the second fins. | 06-23-2011 |
20110157833 | RETENTION MODULE FOR TOOLLESS HEAT SINK INSTALLATION - An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes within the bracket to attach to the board. A heat sink is removably installed within the bracket in a toolless manner, such that the heat sink comes into contact with the integrated circuit. The heat sink and the bracket join together to become a single entity that is permitted to float along an axis perpendicular to a surface of the circuit board. The coil springs are tuned to define a predetermined force at which the heat sink is pushed against the integrated circuit. The module can include a latch having tabs bent at different angles relative to one another to balance forces applied by the tabs against the heat sink while the latter is being installed within the bracket. | 06-30-2011 |
20110170265 | HEAT DISSIPATING DEVICE AND HEAT DISSIPATING SYSTEM - A heat dissipating device includes a supporting component installed on a circuit board. A plurality of openings is formed on the supporting component. The heat dissipating device further includes a plurality of heat dissipating components disposed on a side of the supporting component and installed inside the plurality of openings respectively for dissipating heat generated by a plurality of heat sources disposed on the other side of the supporting component. The heat dissipating device further includes a plurality of elastic components for pressing the plurality of heat dissipating components so that the plurality of heat dissipating components contacts the plurality of heat sources closely. | 07-14-2011 |
20110182034 | COMPOSITE COVER WITH INTEGRAL HEAT SINK - A composite cover for a portion of a motor vehicle transmission has an integral, internal heat sink to which an electronic controller is attached. The cover, which may be fabricated of any temperature appropriate plastic or composite, closes off and protects that portion of a motor vehicle transmission having electrical and electronic components such as valves, solenoids, motors and sensors. Spaced from the inside surface of the cover where it is subjected on both sides to flow of transmission fluid is a plate or heat sink. An electronic controller is disposed on the outside of the cover and attached by heat transferring mechanical fasteners such as studs or bolts to the plate inside the cover. Preferably, the housing of the controller also includes a heat sink. | 07-28-2011 |
20110188207 | MOBILE TERMINAL - A mobile terminal is provided. The mobile terminal comprises at least one element, a connector selectively connected to another device to provide a data exchange path between the at least one element and the other device, and a thermal conduction frame having one side coming into contact with the at least one element and the other side coming into contact with the connector to transfer heat generated from the at least one element to the connector. The connector is connected to the element included in the mobile terminal and the other device through the thermal conduction frame to effectively transfer heat generated from the element to the other device through the connector. | 08-04-2011 |
20110242765 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - The subject invention relates to a semiconductor package and method of manufacturing the same. The semiconductor package of the subject invention comprises a substrate with a through hole penetrating therethrough; a semiconductor chip positioned on the substrate covering the through hole; and a thermal conductive device filling the through hole and contacting the semiconductor chip. According to the subject invention, the thermal resistance in the structure of the semiconductor package is substantially reduced and thus desirable performance of heat spreading or dissipation is achieved. In addition, the production cost and size of the semiconductor package are also reduced. | 10-06-2011 |
20110255247 | HEAT SINK ASSEMBLY AND ELECTRONIC DEVICE EMPLOYING THE SAME - A heat sink assembly with shielding frame is mounted on a circuit board and includes a heat sink, a shielding frame and a heat transmitting film. The circuit board comprises at least one electronic component and a plurality of latching slots surrounding the electronic component. The heat sink includes a base and a plurality of heat fins extending upwardly from the base. A plurality of slots are defined between the plurality of heat fins. The shielding frame includes a hollow frame, a plurality of latch portions and a plurality of limitation portions. The plurality of latch portions are disposed on one end of the hollow frame and evenly spaced apart from each other. The plurality of limitation portions extend from the other end of the hollow frame. The shielding frame cooperates with the heat sink to shield the electronic component from electromagnetic interference (EMI). | 10-20-2011 |
20110267779 | LED LIGHTING SYSTEM WITH A THERMAL CONNECTOR - There is described an LED lighting system comprising: at least one light emitting diode (LED); a heat sink thermally connected to the at least one LED for dissipating heat generated by the at least one LED; an electrical connector for electrically connecting the LED lighting system to a power source; and a thermal insulating connector having a first end connected to the heat sink and a second end connected to the electrical connector, the thermal connector comprising a chamber adapted to receive an electronic circuit therein, the electronic circuit being operatively connected to the at least one LED and the electrical connector. | 11-03-2011 |
20110267780 | THERMAL DISSIPATOR UTILIZNG LAMINAR THERMAL TRANSFER MEMBER - A thermal dissipator includes an elongated laminar thermal transfer member having opposite sides, opposite ends and a longitudinal axis extending between those ends. The member has a thermal conductivity along its axis and in a first plane extending between its sides that is substantially greater than the thermal conductivity of the member in a second plane transverse to the first plane. A transverse heat sink structure contacts at least one side of the thermal transfer member along the length thereof, and extends from the thermal transfer member in a direction parallel to the first plane. A compression device compresses the thermal transfer member and the heat sink structure together to establish intimate thermal contact therebetween. Solid state lighting apparatus incorporating the dissipator is also disclosed. | 11-03-2011 |
20120002371 | ELECTRONIC DEVICE WITH HEAT DISSIPATION APPARATUS - An electronic device includes an enclosure, a circuit board disposed within the enclosure, a heat sink, and a thermally conductive member. A heat-generating electronic component is fixed to the circuit board. The heat sink is in contact with the heat-generating electronic component. Two ends of the thermally conductive member are respectively fixed to the enclosure and the heat sink. | 01-05-2012 |
20120014067 | HEAT SINK FOR POWER CIRCUITS - The present invention relates generally to a heat sink comprising a plurality of fins, each fin having two or more prongs extending from a root section of the fin. In certain embodiments, the heat sink may be assembled by aligning the plurality of fins within slots between protrusions extending from a base of the heat sink. However, in other embodiments, the plurality of fins may have connector ends having female sides and opposite male sides, wherein the plurality of fins may be attached to each other via the interlocking female and male sides, thereby forming at least part of the base of the heat sink, and fortified with reinforcing members. | 01-19-2012 |
20120039044 | ELECTRONIC DEVICE AND HEAT DISSIPATION APPARATUS OF THE SAME - A heat dissipation apparatus is arranged in a housing of an electronic device. The electronic device includes a motherboard mounted in the housing. The heat dissipation apparatus includes a heat dissipation block mounted to an electronic element of the motherboard, a heat sink, a number of pipes connecting the heat sink to the heat dissipation block, and a plate plugged in a socket of the motherboard. The heat sink is mounted to the plate. | 02-16-2012 |
20120044649 | HEAT DISSIPATION DEVICE - A heat dissipation device is used for heat dissipating for an electronic element. The heat dissipation device includes a heat sink and a buffer arranged between the heat sink and the electronic element. The buffer is made of elastic and thermally conductive material. | 02-23-2012 |
20120092832 | ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED THERMAL CHARACTERISTICS - A microelectronic assembly includes a dielectric element having oppositely-facing first and second surfaces and one or more apertures extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element having a rear surface and a front surface facing the first surface of the dielectric element, the first microelectronic element having a first edge and a plurality of contacts exposed at the front surface thereof; a second microelectronic element including having a rear surface and a front surface facing the rear surface of the first microelectronic element, a projecting portion of the front surface of the second microelectronic element extending beyond the first edge of the first microelectronic element, the projecting portion being spaced from the first surface of the dielectric element, the second microelectronic element having a plurality of contacts exposed at the projecting portion of the front surface; leads extending from contacts of the microelectronic elements through the at least one aperture to at least some of the conductive elements; and a heat spreader thermally coupled to at least one of the first microelectronic element or the second microelectronic element. | 04-19-2012 |
20120113597 | HEAT SINK FOR AN ELECTRONIC OR ELECTRICAL COMPONENT - The invention relates to a heat sink ( | 05-10-2012 |
20120127666 | Heat-Radiating Substrate and Method Of Manufacturing The Same - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability. | 05-24-2012 |
20120127667 | HEAT SINK PACKAGE AND METHOD OF MANUFACTURING - A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern. | 05-24-2012 |
20120140417 | HOUSING FOR AN ON-BOARD ELECTRONIC CARD - A housing ( | 06-07-2012 |
20120182692 | DOUBLE-SIDED SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD FOR THE SAME - A double-sided substrate includes a ceramic substrate, a first metal layer formed on one surface of the ceramic substrate and having a plurality of subsidiary metal layers which are laminated on the surface of the ceramic substrate and whose purities differ from each other and a second metal layer formed on the other surface of the ceramic substrate, wherein the closer to the ceramic substrate any subsidiary metal layer is located, the lower purity the subsidiary metal layer has. Additionally, a semiconductor includes the above double-sided substrate, a power element and a heat sink. | 07-19-2012 |
20120206881 | SYSTEMS AND METHODS FOR THERMAL MANAGEMENT FOR TELECOMMUNICATIONS ENCLOSURES USING HEAT PIPES - Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe. | 08-16-2012 |
20120236505 | ELECTRONIC SUBSTRATE DEVICE - An electronic substrate device capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipator without intermediation of an electronic substrate. An electronic substrate device according to the present invention, in which a base member includes a central protruding portion which is accommodated in a penetrating portion while facing a die pad through an intermediary first gap, and first separated protruding portions provided around the central protruding portion have a height dimension smaller than that of the central protruding portion, the first separated protruding portions having a top surface which abuts a rear surface portion of the electronic substrate to form a second gap, and in which a first heat transfer bond which is a heat conductive adhesive is applied to the first gap and the second gap communicating with the first gap. | 09-20-2012 |
20120262883 | HEAT RADIATOR AND MANUFACTURING METHOD THEREOF - A back metal layer ( | 10-18-2012 |
20120268894 | SOCKET AND HEAT SINK UNIT FOR USE WITH REMOVABLE LED LIGHT MODULE - A socket and heat sink unit for use with a removable LED light module includes separate socket and heat sink portions that are coupleable to each other. The socket can releasably couple to a removable LED light module. The heat sink can couple to the socket and extends about a central axis. The heat sink includes a plurality of fin members that extend outward from a central core portion. At least two adjacent fin members define a channel therebetween at the junction of the fin members to the central core portion. The channel can receive a fastener therein to couple the socket to the heat sink. An extrusion process can be used to manufacture the heat sink portion, and to form one or more fastener holes in the heat sink portion sized to receive one or more fasteners to fasten the heat sink portion to the socket portion. | 10-25-2012 |
20120281363 | HEAT SPREADER FOR ELECTRICAL COMPONENTS - A heat spreader for a resistive element is provided, the heat spreader having a body portion that is arranged over a top surface of the resistive element and electrically insulated from the resistive element. The heat spreader also includes one or more leg portion that extends from the body portion and are associated with the heat sink in a thermally conductive relationship. | 11-08-2012 |
20120300405 | ELECTRONIC CONTROL DEVICE - The invention relates to an electronic control device ( | 11-29-2012 |
20120307454 | LED backlit sign - An illuminated sign includes a plurality of straight fin heat sinks framed together; a plurality of LED plates framed together, each LED plate comprising a plurality of LEDs arranged in rows on a front surface, and a plate heat sink on a rear surface, the plate heat sinks being in contact with the straight fin heat sinks; and an LCD panel mounted in front of the LED plates by framing. | 12-06-2012 |
20120314371 | GROUP III NITRIDE BASED FLIP-CHIP INTEGRATED CIRCUIT AND METHOD FOR FABRICATING - A circuit substrate has one or more active components and a plurality of passive circuit elements on a first surface. An active semiconductor device has a substrate with layers of material and a plurality of terminals. The active semiconductor device is flip-chip mounted on the circuit substrate and at least one of the terminals of the device is electrically connected to an active component on the circuit substrate. The active components on the substrate and the flip-chip mounted active semiconductor device, in combination with passive circuit elements, form preamplifiers and an output amplifier respectively. In a power switching configuration, the circuit substrate has logic control circuits on a first surface. A semiconductor transistor flip-chip mounted on the circuit substrate is electrically connected to the control circuits on the first surface to thereby control the on and off switching of the flip-chip mounted device. | 12-13-2012 |
20130003305 | HALF-BRIDGE ELECTRONIC DEVICE WITH COMMON HEAT SINK ON MOUNTING SURFACE - A device includes a first switch and a second switch, each switch being integrated on a chip having a back surface and an opposite front surface. Each chip includes a first conduction terminal and a control terminal on the front surface, while a second conduction terminal of the switch is located on the back surface. The first switch and the second switch are connected in a half-bridge configuration with the first switch's second conduction terminal electrically connected to the second switch's first conduction terminal. The chips are installed in a common package comprising an insulating body with an embedded heat sink. The chips of the switches are mounted on the heat sink such that the second conduction terminal of the first switch and the first conduction terminal of the second switch are in contact with the heat sink, with the heat sink providing the electrical connection between the two switches. | 01-03-2013 |
20130003306 | ELECTRONIC CONTROL UNIT AND METHOD OF MANUFACTURING THE SAME - An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means. | 01-03-2013 |
20130003307 | SOLAR CELL MODULE JUNCTION BOX - A solar cell module junction box includes a plurality of terminals ( | 01-03-2013 |
20130021753 | STRUCTURE FOR FIXING ELECTRIC PART FOR MOTOR-DRIVEN COMPRESSOR - An electric part fixing structure for a motor-driven compressor includes an electric part having a plurality of leads and a guide member for positioning the leads. The guide member is made of a plastic and has a guide hole through which the lead is passed. | 01-24-2013 |
20130027887 | SWITCHING POWER SUPPLY DEVICE - A switching power supply device includes a case, a board that has circuit parts containing a switching element mounted thereon and is accommodated in the case, and a heat sink that is provided in the case so as to partition the inside of the case into a part mount chamber having the board accommodated therein and an air flow path through which air flows. The switching element of the circuit parts is mounted on the board while brought into contact with a surface of the heat sink that faces the part mount chamber, and cooled through the heat sink by the air flowing in the air flow path. | 01-31-2013 |
20130050946 | FASTENING MECHANISM FOR FIXING RADIATOR - A fastening mechanism for fixing a radiator having a plurality of heat sinks to a circuit board includes two fixing rods fixed on the circuit board, a connecting member positioned between the heat sinks; and two fastening arms respectively connecting the connecting member to the fixing rods. An electronic device using the fastening mechanism is also provided. | 02-28-2013 |
20130077250 | DC-DC Converter Vertically Integrated with Load Inductor Structured as Heat Sink - A power supply converter ( | 03-28-2013 |
20130077251 | HEAT SINK MOUNTING DEVICE - A heat sink mounting device includes a touching plate and a mounting member. The touching plate defines a locking hole. The mounting member includes a locking post. The locking post includes a body and two protrusions protruding from the body. An inner surface of the locking hole defines two cutouts. The touching plate includes two blocking blocks extending from an edge of the locking hole on a bottom surface of the touching plate. The two protrusions extend out of the two cutouts and abut the bottom surface of the touching plate. One of the two protrusions is located between the two blocking blocks, to prevent the body from rotating freely in the locking hole. | 03-28-2013 |
20130083486 | SPRINGY CLIP TYPE APPARATUS FOR FASTENING POWER SEMICONDUCTOR - The present disclosure relates to an apparatus for fastening a power semiconductor using an integral springy (elastic) clip, capable of fixing a power semiconductor, such as a diode and a MOSFET, using elasticity of a U-shaped clip by integrally molding the clip onto a housing of a plastic module. The apparatus includes an elastic (springy) clip integrally molded onto a lower surface of the housing and downwardly curved into a U-like shape in a bridge module in which a bridge of the power semiconductor protrudes through a through hole of the housing to be connected to a printed circuit board, whereby the power semiconductor is fixed by a force that the housing presses the power semiconductor. | 04-04-2013 |
20130094149 | STRUCTURE FOR MOUNTING HEAT SINK, AND HEAT SINK MOUNTED USING THE STRUCTURE - A new mounting structure is provided in which, when a heat sink is mounted (fixed) on a circuit board using a spring member, an anchor for fixing the spring member is formed in a very small size in plan view. In the present invention, at least one anchor for mounting a heat sink body on a circuit board is set in a projected state on the heat sink body side and both ends of a spring member are each directly or indirectly attached to an anchor, whereby the heat sink body is mounted on the circuit board. In the anchor, a main body section projecting on the circuit board is formed in a substantially circular shape or a polygonal shape. When the spring member is attached to the anchor, the spring member is attached to an attaching section in an externally fit state. | 04-18-2013 |
20130107462 | HIDDEN PIN TYPE HIGH-POWER LED SUPPORT AND HIDDEN PIN TYPE HIGH-POWER LED PACKAGING STRUCTURE AND TECHNOLOGY USING SAME | 05-02-2013 |
20130135824 | Power Semiconductor Device - The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base | 05-30-2013 |
20130141871 | POWER MODULE FOR ELECTRIC POWER STEERING AND ELECTRIC POWER STEERING DRIVE CONTROL APPARATUS USING THE SAME - An object is to release heat efficiently to heat-resistance abilities of individual components by enhancing a heat-radiation performance of power circuit components forming a power module ( | 06-06-2013 |
20130155620 | Package - An electronic component package includes a support and heat conductor. The heat conductor has a protuberance and the support has a socket arranged to be able to receive the protuberance so that the movement of heat conductor relative to the support during the assembly process is reduced. | 06-20-2013 |
20130163206 | SEMICONDUCTOR DEVICE - A semiconductor device includes a structure in which a semiconductor element (chip) is mounted in a cavity formed in a wiring board with an adhesive interposed between the chip and a bottom surface of the cavity, and electrode terminals of the chip are connected via wires to wiring portions formed on the board around the cavity. The chip is mounted in close contact with a side wall of the cavity, the side wall being near a region where a wiring for higher frequency compared with other wirings within the wiring portion is formed. A recessed portion is provided in a region of the bottom surface of the cavity, and a thermal via extending from the bottom surface of the recessed to the outside of the board is provided, the region being near a portion where the chip is in close contact. | 06-27-2013 |
20130170144 | ELECTRONIC DEVICE WITH HEAT SINK MECHANSIM - An electronic device includes an electronic component and a heat sink mechanism. The electronic component includes at least one heat sink portion defining a plurality of heat sink holes. The heat sink mechanism includes at least one first conducting portion secured to an end of the heat sink holes, for dissipating heat produced by the electronic component away from the electronic device. | 07-04-2013 |
20130170145 | THERMAL CONNECTOR - A thermal connector for use with a printed circuit board assembly is disclosed. The thermal connector includes a top segment configured for thermal engagement with a heat source disposed on a top surface of a printed circuit board and for insertion through an opening of the printed circuit board to thermally engage the heat source. A middle segment of the thermal connector extends from the top segment and includes a flanged portion configured to engage a bottom surface of the printed circuit board when the top segment is inserted through the opening of the printed circuit board. A bottom segment of the thermal connector extends from the middle segment and is configured for thermal engagement to a heat dissipating element. | 07-04-2013 |
20130265723 | POWER SUPPLY MODULE - A power supply module includes a circuit board and a heatsink plate. The circuit board includes a first principal surface, a second principal surface, and side surfaces. Electronic components are mounted on the first principal surface. The heatsink plate includes a plate-shaped body portion that faces the first principal surface, and a plurality of fixing portions that extend at an angle from the body portion to face the side surfaces. The fixing portions are configured to come into contact with the second principal surface to secure the body portion to the circuit board. | 10-10-2013 |
20130279118 | THERMALLY CONDUCTIVE ADHESIVE - A thermally conductive adhesive having: a thermosetting adhesive containing a curable component and a curing agent for the curable component, and a metal filler dispersed in the thermosetting adhesive uses a silver powder and a solder powder as the metal filler. The solder powder to be used has a melting temperature lower than the thermal curing temperature of the thermally conductive adhesive and produces a high-melting-point solder alloy having a melting point higher than the melting temperature of the solder powder when the solder powder is reacted with the silver powder under thermal curing conditions of the thermally conductive adhesive. A curing agent having flux activity to the metal filler is used as the curing agent. | 10-24-2013 |
20130322019 | HEAT-SINK DEVICE INTENDED FOR AT LEAST ONE ELECTRONIC COMPONENT AND CORRESPONDING METHOD - The present invention relates to a heat-sink device intended for at least one electronic component ( | 12-05-2013 |
20130335921 | SUBSTRATE FOR POWER MODULE, SUBSTRATE WITH HEAT SINK FOR POWER MODULE, POWER MODULE, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE, AND METHOD FOR PRODUCING SUBSTRATE WITH HEAT SINK FOR POWER MODULE - Provided is a power module substrate including a ceramic substrate, and a metal plate which contains aluminum or an aluminum alloy, and which is stacked and bonded on a surface of the ceramic substrate, wherein one or more additional elements selected from Ag, Zn, Ge, Mg, Ca, Ga, and Li are solid-solubilized in the metal plate, and the Ag concentration in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.05% by mass and less than or equal to 10% by mass, or the total concentration of Zn, Ge, Mg, Ca, Ga, and Li in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.01% by mass and less than or equal to 5% by mass. | 12-19-2013 |
20130335922 | ELECTRONIC DEVICE WITH HEAT DISSIPATION APPARATUS - A heat dissipation apparatus for an electronic component installed in an enclosure of an electronic device includes a bracket and a heat sink. The bracket includes a supporting plate, an elastic positioning plate extending slantingly up from a side of the supporting plate away from the electronic component, and an installation plate extending from the positioning plate to be attached to the enclosure. The heat sink is fixed to the supporting plate to abut against the electronic component. | 12-19-2013 |
20140022732 | Heat dissipater having heat conductive rib with interval forming as flow guide hole and applied in electric luminous body - The present invention relates that a part of the outer bottom is combined with an intermediate heat conductor ( | 01-23-2014 |
20140098497 | TRANSCEIVER ASSEMBLY - A transceiver assembly includes a transceiver module having ribs and a thermal interface member on an outer surface and a receptacle assembly receiving the transceiver module. The receptacle assembly includes a heat sink and a clip coupling the heat sink to a guide frame. The heat sink has a heat sink surface facing the thermal interface member and a step extending from the heat sink surface with a module engagement surface. The ribs ride along the step during insertion into and removal from the receptacle of the transceiver module. When the ribs are longitudinally aligned with and engage the step, the module engagement surface is in an elevated position. When the ribs are longitudinally offset from the step, the module engagement surface is in a recessed position and in direct thermal engagement with the thermal interface member. | 04-10-2014 |
20140111943 | METAL INJECTION MOLDED HEAT DISSIPATION DEVICE - A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein the base plate comprises a plurality of metal pellets to dissipate heat from the integrated heat spreader. | 04-24-2014 |
20140118948 | ELECTRONIC DEVICE - An electronic device includes a housing, a heat source located inside a casing, and a heat dissipation device disposed inside a casing. The heat dissipation device is in thermal contact with the heat source. The heat dissipation device includes a casing having a heat dissipation material. The heat dissipation material includes 15 to 30 volume percent of multiple copper materials, 50 to 85 volume percent of a phase change material, and 15 to 20 volume percent of air. The casing has a surface being in thermal contact with the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area and a geometric midpoint of the surface are overlapped. The heat dissipation device absorbs heat generated by the heat source located in the central area through thermal conduction. | 05-01-2014 |
20140118949 | CIRCUIT BOARD SYSTEM COMPRISING A SPRING FASTENED ELEMENT - A circuit board system according to the invention includes a circuit board ( | 05-01-2014 |
20140140009 | FIXING BRACKET AND ELECTRONIC DEVICE USING THE SAME - A fixing bracket includes a bracket body, at least one connecting rod assembly, and at least one elastic buckling arm. One side of the bracket body has a first pivoting point and a second pivoting point. The at least one connecting rod assembly includes a first rod, a second rod, a third rod. The first rod has a third pivoting point and a fourth pivoting point. The second rod has a first limiting part, a fifth pivoting point, and a sixth pivoting point. The third rod has a second limiting part, a seventh pivoting point, and a eighth pivoting point. The at least one elastic buckling arm is located on the first rod. The connecting rod assembly drives the elastic buckling arm to move between a release position and a fastening position. When located at the fastening position, the first limiting part is against the second limiting part. | 05-22-2014 |
20140160683 | LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD - A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons. | 06-12-2014 |
20140168899 | PACKAGE SUBSTRATE AND ELECTRONIC ASSEMBLY - A package substrate including a circuit board and a heat-dissipating element is provided. The circuit board has a through opening adapted for accommodating an electronic element. The heat-dissipating element is disposed at the circuit board and covers one side of the through opening. The heat-dissipating element includes a heat-dissipating plate, an adhesive layer and an antioxidation layer. The heat-dissipating plate has a first surface facing the through opening and a second surface opposite to the first surface. The adhesive layer is disposed on the first surface and the heat-dissipating plate adheres to the circuit board through the adhesive layer. The antioxidation layer is disposed on the second surface. An electronic assembly including the package substrate is also provided. | 06-19-2014 |
20140168900 | SCALABLE AND MODULAR APPROACH FOR POWER ELECTRONIC BUILDING BLOCK DESIGN IN AUTOMOTIVE APPLICATIONS - A power electronic building block includes a housing; a power module mounted within the housing; a controller mounted within the housing and coupled to the power module; a capacitor assembly coupled to the power module and mounted within the housing; an AC bus bar mounted within the housing; and a DC bus bar coupling the capacitor assembly to the power module and mounted within the housing. | 06-19-2014 |
20140185243 | HEAT SINK-INTEGRATED DOUBLE-SIDED COOLED POWER MODULE - A power module for an inverter that is used in an eco-friendly vehicle, such as a hybrid vehicle, an electrical vehicle, or a fuel cell vehicle, i.e., a heat sink-integrated double-sided cooled power module in which cooling efficiency is maximized by adopting a double-sided direct cooling method that uses a heat sink manufactured by an extrusion method. In particular, the heat sink is disposed in upper and lower portions of the power module, and direct bonding materials (DBMs) are deposited between the upper and lower heat sinks where a chip is interposed between the DBMs. Faces between the heat sinks, the chip, and the DBMs are bonded to one another by a solder, and an entire circumference of the chip and the DBMs is finished by a mold portion. | 07-03-2014 |
20140185244 | THERMALLY CONDUCTIVE FILM AND CIRCUIT BOARD MODULE - There is provided a circuit board module including a heat radiation member, a thermally conductive film that is disposed on the heat radiation member and includes a thermally conductive filler, a circuit board formed on the thermally conductive film, and a heat generation device disposed on the circuit board, wherein the thermally conductive filler is distributed in an area of the thermally conductive film corresponding to the heat generation device and another area that is extended from the area corresponding to the heat generation device by a predetermined distance on a plane. | 07-03-2014 |
20140204536 | Semiconductor Module Arrangement and Method for Producing a Semiconductor Module Arrangement - A semiconductor module arrangement is provided having a first subassembly, a second subassembly and a third subassembly. The third subassembly has a quantity of adjustment pins which are fixedly connected to one another. The first subassembly has a number N1 of first adjustment openings, and the second subassembly has a number N2 of second adjustment openings. Each of the adjustment pins engages into a different one of the first adjustment openings and/or into one of the second adjustment openings. A corresponding method of producing the semiconductor module arrangement is also provided. | 07-24-2014 |
20140240928 | THERMAL GREASE HAVING LOW THERMAL RESISTANCE - A thermally conductive grease includes a carrier oil, at least one dispersant, and thermally conductive particles. The thermally conductive particles have a D50 (Vol. Average) particle size of no greater than about 11 microns and the thermally conductive particles in the thermally conductive grease contain less than 3% by volume of particles having a particle size of 0.7 microns or less, based on the total volume of thermally conductive particles in the thermally conductive grease. | 08-28-2014 |
20140247562 | DC-DC CONVERTER VERTICALLY INTEGRATED WITH LOAD INDUCTOR STRUCTURED AS HEAT SINK - An apparatus includes a heat-generating component and a thermally inert component positioned in close proximity to the heat-generating component. A housing for the thermally inert component is in touch with the heat-generating component and is structured to transform the thermally inert component into a heat sink for the heat-generating component | 09-04-2014 |
20140254100 | Cooling Apparatus for Fanless Desktop Enclosure of an Elastomericly Suspended Circuit Board - A desktop enclosure provides cooling for a circuit board without the noise and power consumption of fans. An elastomeric suspension applies a force to a circuit board. The circuit board transmits the force to a heat source which is thermally coupled to a heat conduction rod through a non curing, ultra-high conductive performance thermal interface grease. The heat conduction rod is fastened to a heatsink lid of the enclosure which dissipates the heat by convection and radiation. | 09-11-2014 |
20140285973 | HOUSING AND POWER MODULE HAVING THE SAME - There are provided housing, capable of preventing a fastening part from being damaged by stress generated at the time of assembly thereof, and a power module having the same. The housing for the power module includes a body part having a space formed therein, the space accommodating a module substrate on which electronic elements are mounted, a plurality fastening parts formed to be protruded from side surfaces of the body part, and an elastic member coupled to the fastening parts in a plate spring manner and elastically supporting lower portions of the fastening parts. | 09-25-2014 |
20140285974 | SUBSTRATE SPACING MEMBER AND INVERTER DEVICE - A substrate spacing member includes a spacer portion which is disposed between the two substrates in contact with both edge portions thereof to keep a distance between the two substrates constant, spacer member holding portions which hold the spacer members, a frame body portion that connects the spacer member holding portions to each other, a branch portion which extends toward a predetermined position between the two substrates from the frame body portion or the spacer member holding portions, and electrode holding portions which are provided at the branch portions, and hold electrodes at the predetermined positions. | 09-25-2014 |
20140293544 | ENERGY CONSUMING DEVICE AND ASSEMBLY - An energy consumption device includes a housing that supports a first and second terminal. An energy consuming module, which may include a light emitting diode array, is supported by the housing and is thermally coupled to a thermal bridge that extends below a lower surface of the housing. A cover can be positioned so as to secure the energy consuming module between the cover and the housing. A plurality of magnets can be configured to secure the energy consumption device to a rail that supports powered contacts so that the first and second terminals engage the powered contacts and the thermal bridge is pressed against the rail. | 10-02-2014 |
20140293545 | ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL MANAGEMENT FEATURES - An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis. | 10-02-2014 |
20140301042 | MANUFACTURING OF A HEAT SINK BY WAVE SOLDERING - An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink. | 10-09-2014 |
20140307390 | INTEGRATED CIRCUIT PACKAGE FOR HEAT DISSIPATION - An apparatus for enclosing an electronic component to a base comprising, an enclosure attached to a base and surrounding an electronic component. The enclosure divided into a first portion and a second portion along a first plane substantially parallel to the base. The second portion of the enclosure is attached to the base. The first portion of the enclosure is attached to the second portion of the enclosure. The enclosure including one or more extruding elements on an exterior surface of the enclosure. The one or more extruding elements on the exterior surface of the enclosure increases an exterior surface area of the enclosure facilitating dissipation of heat from the electronic component. | 10-16-2014 |
20140313674 | ELECTRONIC DEVICE WITH HEAT SINK - An electronic device includes a circuit board, a first heat sink, a second heat sink, and two fixing members. The first heat sink includes a board and a number of fins extending from a top of the board. The second heat sink includes a connecting piece, two blocks mounted to opposite ends of the connecting piece, and a number of fins extending from a top of the connecting piece. The blocks are rested on the circuit board. Opposite ends of each fixing member are fixed to the board and one of the blocks. The first heat sink is mounted on the circuit board and maintains the second heat sink on the circuit board. | 10-23-2014 |
20140313675 | ELECTRONIC CONTROL APPARATUS FOR VEHICLE USING OVERMOLDING AND MANUFACTURING METHOD THEREOF - The present disclosures provides an electronic control apparatus for a vehicle using overmolding in which a heat radiating plate is attached to an opposite side of a part requiring heat radiation in a printed circuit board (PCB) and a part other than the part, to which the heat radiating plate is attached, is overmolded so as to directly discharge heat to the air through the heat radiating plate such that a heat radiation effect is excellent, the heat radiating plate is attached in advance and then a housing is formed of mold resin such that a manufacturing process is simplified, and a printed circuit board (PCB) is surrounded by mold resin such that a waterproof function is excellent, and a manufacturing method thereof. | 10-23-2014 |
20140321061 | SLIDING THERMAL CONTACT FOR PLUGGABLE OPTIC MODULES - Present thermal solutions to conduct heat from pluggable optical modules into heat sinks use a metal heat sink attached with a spring clip. The interface between the pluggable module and the heat sink is simple metal-on-metal contact, which is inherently a poor thermal interface and limits heat dissipation from the optical module. Heat dissipation from pluggable optical modules is enhanced by the application of thermally conductive fibers, such as an advanced carbon nanotube velvet. The solution improves heat dissipation while preserving the removable nature of the optical modules. | 10-30-2014 |
20140334104 | ELECTRONIC CONTROL APPARATUS FOR VEHICLE - The present disclosure relates to an electronic control apparatus for a vehicle, and the electronic control apparatus includes: an electronic control board which has a top side on which a heating element is mounted; a heat sink which radiate heat generated from the heating element to the outside; at least one screw which couples the electronic control board and the heat sink; and a heat radiating pad which transfer heat of the heating element to the heat sink, in which a stepped portion having a predetermined depth is formed on the contact surface of the heat sink so that the heat radiating pad is inserted thereto, and the depth of the stepped portion is formed to be smaller than a thickness of the heat radiating pad so that the heat radiating pad is pressed and inserted between the electronic control board and the heat sink. | 11-13-2014 |
20140376188 | ELECTRONIC DEVICE - In an electronic device, a one-side heat radiation element and a two-side heat radiation element are disposed on a surface of a substrate adjacent to a heat sink. The one-side heat radiation element has a rear-side covered conductive portion and a rear-surface molded portion on the rear-side covered conductive portion adjacent to the heat sink, and radiates heat to the substrate. A surface of a rear-side exposed conductive portion of the two-side heat radiation element adjacent to the heat sink is exposed and the two-side heat radiation element radiates heat to the substrate and the heat sink. The rear-surface molded portion controls a limit position of the one-side heat radiation element toward the heat sink due to deformation of the substrate. A heat radiation gel is filled in between the rear-side exposed conductive portion and the heat sink to radiate heat from the two-side heat radiation element toward the heat sink. | 12-25-2014 |
20150009629 | ELECTRONIC CONTROL APPARATUS FOR VEHICLE USING RADIATION BOARD AND MANUFACTURING METHOD THEREOF - Disclosed are an electronic control apparatus for a vehicle and provides an electronic control apparatus for a vehicle using a radiation board in which a radiation plate having a slide fixing structure (for example, “U” shaped) is attached onto a portion opposite to a portion which requires the radiation in a printed circuit board(PCB) and if additional radiation performance is required, a slidable radiation board which is detachable is attached/detached to directly emit heat to the atmosphere through the radiation plate and the radiation board to the atmosphere, thereby improving a radiation effect and to implement a standard platform of the radiation structure and implement an optimal radiation structure through a slidable radiation board and a manufacturing method thereof. | 01-08-2015 |
20150029669 | CONTROL DEVICE AND METHOD FOR PRODUCING A CONTROL DEVICE FOR A MOTOR VEHICLE - A control device includes a first circuit carrier with electrical components that are electrically conductively connected to one another and a second circuit carrier with electrical components that are electrically conductively connected to one another. The first circuit carrier and the second circuit carrier are electrically conductively connected to one another. The second circuit carrier is fixedly connected in thermally conductive fashion to a fluid-tight thermally conductive carrier element. The second circuit carrier and the carrier element are arranged in a cutout of the first circuit carrier. The carrier element has better thermal conductivity than the first circuit carrier and can be thermally conductively connected to a heat sink. The carrier element is integrated in fluid-tight fashion in an internal region of the first circuit carrier. | 01-29-2015 |
20150055302 | POWER MODULE SUBSTRATE WITH HEATSINK, POWER MODULE SUBSTRATE WITH COOLER AND POWER MODULE - A power module substrate with a heatsink includes: a power module substrate provided with a ceramic substrate, a circuit layer and a metal layer; and a heatsink bonded to the metal layer via a solder layer and composed of copper or a copper alloy. The metal layer is formed by bonding an aluminum plate in which the content of Al is 99.0 to 99.85% by mass to the ceramic substrate, and the solder layer is formed of a solid-solubilized-hardening type solder material including Sn as a major component and a solid-solubilized element being solid-solubilized into a matrix of Sn. | 02-26-2015 |
20150077943 | SEMICONDUCTOR DEVICE COMPONENT AND SEMICONDUCTOR DEVICE - A semiconductor device component includes a first portion having a first hole usable as a nut insertion hole, and a second portion having a second hole adjacent to the first hole with a wall interposed therebetween. The first hole includes a first surface facing the wall, a second surface adjacent to the first surface, a third surface adjacent to the second surface, a fourth surface adjacent to the third surface and facing the first surface, a fifth surface adjacent to the fourth surface and facing the second surface, and a sixth surface adjacent to the fifth surface and the first surface and facing the third surface. A distance between the first and fourth surfaces is greater than a distance between the second and fifth surfaces, and greater than a distance between the third and sixth surfaces. | 03-19-2015 |
20150116944 | ELECTRICAL ASSEMBLY WITH A SOLDER SPHERE ATTACHED HEAT SPREADER - An electrical assembly that includes a circuit board, an electrical device, a heat spreader, and a solder sphere. The electrical device is a surface mount type package attached to the circuit board. The heat spreader overlies and extends beyond the outline of the device, and is in thermal contact the top side of the surface mount type package. A contact surface of the heat spreader is spaced apart from a mounting surface of the circuit board by a distance based on a height of the top side above the mounting surface. The solder sphere has a pre-reflow diameter sufficient to couple the contact surface to the mounting surface after the solder sphere is reflowed. | 04-30-2015 |
20150116945 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - A semiconductor device includes: a block module which internally includes a power semiconductor element and a first heatsink, and from which a main circuit terminal and a control terminal are drawn; a control substrate connected to the control terminal; a package in which the block module and the control substrate are housed; and a second heatsink to which the package is fixed by a connection screw. The connection screw is inserted into the second heatsink so as to be inclined at an inclination angle θ relative to a normal to a surface of the second heatsink. | 04-30-2015 |
20150146380 | ELECTRONIC DEVICE AND METHOD FOR ASSEMBLING THE SAME - An electronic device includes a bottom case, an accommodation unit, an electromagnetic induction module, a heat-dissipating component, an elastic clip, a printed wiring board, and an electronic component. The accommodation unit is disposed on the bottom case. At least one portion of the electromagnetic induction module is disposed in the accommodation unit. The heat-dissipating component is disposed on the bottom case and is separated from the accommodation unit. The elastic clip is partially mounted on the heat-dissipating component. The printed wiring board has a first surface and a second surface, and the first surface faces the accommodation unit. The electronic component includes a main body and pin feet. The pin feet are electrically connected to the printed wiring board, and the main body is clamped between the heat-dissipating component and the elastic clip. | 05-28-2015 |
20150296654 | HEAT SINK RETAINER UNIT AND THERMAL MODULE DEVICE - A heat sink retainer unit includes a buckle body, a retainer member, an elastic member and a handle. The elastic member is disposed in the buckle body and fitted on the retainer member. The retainer member is passed through the buckle body from a lower side thereof. A top end of the retainer member is positioned above the buckle body. The handle is positioned above the buckle body and pivotally connected with the top end of the retainer member. By means of operating the handle, the retainer member can be moved up and down, whereby the elastic member can apply elastic force to the buckle body. | 10-15-2015 |
20150305169 | Electronic Control Device - The invention provides an electronic control device having a high-grade heat sink that: does not require tight control at the time of manufacturing; does not restrict the range of electronic components that can be used; is structurally simple; can be produced at a higher production rate; and is cost-effective. In this device, when a circuit board | 10-22-2015 |
20150305190 | Electronic System - An electronic system includes a carrier including at least one waveguide feeding, a semiconductor chip including a first surface and a second surface, and an integrated RF circuit, and a cooling element including a backshort. The semiconductor chip is mounted to the carrier such that the first surface faces the carrier. The integrated RF circuit is connected to the at least one waveguide feeding. The cooling element is mounted to the carrier such that the backshort is adjacent one end of the at least one waveguide feeding, and the cooling element at least partially covers the semiconductor chip such that the second surface of the semiconductor chip faces the cooling element. | 10-22-2015 |
20150305192 | DIELECTRIC THERMAL PAD USING DUAL-SIDED THERMALLY CONDUCTIVE ADHESIVE ON CERAMIC - A device includes: an electronic component that generates heat; a heatsink configured to absorb at least part of the heat through thermal transfer; and a thermally conductive dielectric pad that attaches the electronic component and the heatsink to each other and facilitates the thermal transfer. The thermally conductive dielectric pad includes: a ceramic tile; a first layer of adhesive that attaches a first side of the ceramic tile to the electronic component; and a second layer of adhesive that attaches a second side of the ceramic tile to the heatsink. | 10-22-2015 |
20150305201 | Carrier and Package Having the Carrier - A carrier is disclosed, including: a main body having a first surface and a second surface opposing the first surface; a conductive part formed on the first surface of the main body; and a plurality of heat conductors that are not in contact with the conductive part and penetrate the main body to connect the first surface with the second surface. Therefore, heat generated by electronic elements can be effectively dissipated outside to improve the functionality and lifetime of electronic elements. | 10-22-2015 |
20150313038 | OPTIMIZED FRAME SYSTEM FOR A DISPLAY DEVICE - An image display device comprising an image display panel, heat dispersion material positioned proximate to the image display panel, a frame system including a framework positioned proximate to the heat dispersion material opposite the image display panel, and a plurality of electronic components engaging the framework, where the image display device exhibits a support factor of less than about 150 mm-W/m° K. The framework can be adhesively bonded to the heat dispersion material. The framework can include a height and a width wherein the heat dispersion material substantially spans the height and the width. Additionally, a first cross support can span the framework and a plurality of second electronic components can engage the first cross support. Additionally a second cross support can span the framework wherein at least one of the second electronic components engages the second cross support. | 10-29-2015 |
20150315451 | CARBON NANOTUBE SHEET, ELECTRONIC DEVICE, METHOD OF MANUFACTURING CARBON NANOTUBE SHEET, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - A carbon nanotube sheet includes a plurality of carbon nanotubes including a first constriction portion in one end side, and a resin portion filled between the plurality of carbon nanotubes. Each of the plurality of carbon nanotubes is bent at the first constriction portion to a lateral direction in the resin portion. | 11-05-2015 |
20150319840 | ELECTRONIC DEVICE - In an electronic device, a heat generating element is connected directly to an electrically-conductive joining material that is the start point of the heat dissipation path on the one surface of the substrate, and the other surface of the substrate is provided by an other surface side insulating layer. An electrically-conductive other surface side electrode connected to an external heat dissipation member is disposed on the surface of the other surface side insulating layer right under the heat generating element. On the other surface side of the substrate, an other surface side inner layer wire that is the end point of the heat dissipation path extends to the other surface side insulating layer and is insulated electrically from the other surface side electrode through the other surface side insulating layer. | 11-05-2015 |
20150319886 | Thermal Management System and Method - A thermal management system/method allowing efficient electrical/thermal attachment of heat sourcing PCBs to heat sinking PCBs using reflow/wave/hand soldering is disclosed. The disclosed system/method may incorporate a combination of support pins, spacer pads, and/or contact paste that mechanically attaches a heat sourcing PCB (and its associated components) to a heat sinking PCB such that thermal conductivity between the two PCBs can be optimized while simultaneously allowing controlled electrical conductivity between the two PCBs. Controlled electrical isolation between the two PCBs is provided for using spacer pads that may also be thermally conductive. Contact paste incorporated in some embodiments permits enhanced conductivity paths between the heat sourcing PCB, a thermally conductive plate mounted over the heat sourcing PCB, and the heat sinking PCB. The use of self-centering support pins incorporating out-gassing vents in some embodiments allows reflow/wave/hand soldering as desired. | 11-05-2015 |
20150334869 | FREQUENCY UP CONVERTER HAVING COMPACT SIZE AND ENHANCED HEAT EMISSION CHARACTERISTICS - A frequency up converter having a compact size and enhanced heat emission characteristics by improving an arrangement structure of circuit boards is provided. The frequency up converter can enhance the heat emission characteristics and also reduce an entire volume and weight by classifying the devices according to their heat emission characteristics, separately arranging boards in a multi-step structure, and installing a heat sink. | 11-19-2015 |
20150334877 | WIRING BOARD AND ELECTRONIC DEVICE - To improve the operation characteristics of an electronic component housed in a recess of an insulating substrate. A wiring board comprises an insulating substrate; and a heat-transfer member disposed inside the insulating substrate. The insulating substrate comprises an upper surface and a recess formed in the upper surface, the upper surface including a first mounting region for a first electronic component, and a second mounting region for a second electronic component which is provided in the recess. The heat-transfer member is disposed inside the insulating substrate so as to overlap the first mounting region and the second mounting region as seen in a plan view, and, part of the heat-transfer member is exposed in the recess. | 11-19-2015 |
20150342026 | ELECTRIC ASSEMBLY TO BE MOUNTED ON A TOP-HAT RAIL - The invention relates to an electric assembly to be mounted on a top-hat rail, comprising: an electric current supply component ( | 11-26-2015 |
20150359107 | ELECTRONIC MODULE WITH A PLASTIC-COATED ELECTRONIC CIRCUIT AND METHOD FOR THE PRODUCTION THEREOF - An electronic module for use as a control device in a motor vehicle, includes a plastic-coated electronic circuit with at least one organic HDI circuit carrier. The electronic circuit is disposed on a heat sink and electrically-conductive conductor structures are provided for electrically connecting the electronic circuit to electrical devices or components outside the electronic module. The circuit carrier is thermally and conductively connected to the heat sink, and the electronic circuit and the heat sink are coated in plastic in such a manner that only the rear side of the heat sink lying opposite the circuit carrier is at least partially free of plastic, and at least contact ends of the conductor structures, which make the electrical connection to the electrical devices or components outside the electronic module are free of plastic. A method for the production of the electronic module is also provided. | 12-10-2015 |
20150373870 | INVERTER HOUSING - Disclosed is an inverter housing which is installed in a vehicle, and more particularly, an inverter housing which is capable of having a high heat dissipation effect and realizing a compact size. To this end, the inverter housing according to the present invention includes a body having a plate shape; a plurality of capacitor insertion portions formed to be recessed in a first direction of the body, so that capacitors are inserted thereinto, and integrally arranged to be spaced from each other; a plurality of switching device installation portions configured as spaces in which switching devices are installed, and arranged between the capacitor insertion portions in a second direction of the body opposite to the first direction; and a plurality of heat dissipation fins installed in the first direction of the body to face the switching devices with the body interposed therebetween. | 12-24-2015 |
20150382444 | THERMALLY ENHANCED WIRING BOARD HAVING METAL SLUG AND MOISTURE INHIBITING CAP INCORPORATED THEREIN AND METHOD OF MAKING THE SAME - A method of making a wiring board having a metal slug incorporated in a resin core is characterized by the provision of a moisture inhibiting cap covering interfaces between metal and plastic. In a preferred embodiment, the metal slug is bonded to the resin core by an adhesive substantially coplanar with the metal slug and the metal layers on two opposite sides of the resin core at smoothed lapped top and bottom surfaces so that a metal bridge can be deposited on the adhesive at the smoothed lapped bottom surface to completely cover interfaces between the metal slug and the surrounding plastic material. In the method, conductive traces are also deposited on the resin core at the smoothed lapped top surface so as to provide electrical contacts for chip connection. | 12-31-2015 |
20160021780 | Carrier, Semiconductor Module and Fabrication Method Thereof - A semiconductor module includes a carrier having a first carrier surface and a second carrier surface opposite the first carrier surface, a first semiconductor chip mounted over the first carrier surface and a heatsink coupled to the second carrier surface with a first heatsink surface facing the carrier. The second carrier surface or the first heatsink surface has at least one cavity in the form of one or more of dimples and trenches. | 01-21-2016 |
20160024358 | Conductive Silicone Materials And Uses - A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu—Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 12 weight percent, all based on weight of the curable silicone composition; wherein the curable silicone composition has a concentration of the Cu—Ag core-shell particles and hydrocarbon vehicle such that the curable silicone composition remains curable to a conductive silicone material having a concentration of the Cu—Ag core-shell particles of from 88.0 to 92 weight percent and having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method, and a thermal conductivity of greater than or equal to 2.9 Watts per meter*Kelvin (W/(m*K)) measured according to Thermal Properties Test Method. | 01-28-2016 |
20160044826 | ELECTRONICS PROTECTION HOUSING FOR ACCOMMODATING ELECTRONICS - An electronics protection housing which reliably protects electronics ( | 02-11-2016 |
20160050793 | LEADFRAME PACKAGE WITH INTEGRATED PARTIAL WAVEGUIDE INTERFACE - A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers. | 02-18-2016 |
20160079150 | TECHNIQUES AND CONFIGURATIONS ASSOCIATED WITH A PACKAGE LOAD ASSEMBLY - Embodiments of the present disclosure are directed toward techniques and configurations associated with a package load assembly. In one embodiment, a package load assembly may include a frame configured to form a perimeter around a die area of a package substrate having a first surface configured to be coupled with a surface of the package substrate and a second surface disposed opposite to the first surface. The frame may include deformable members disposed on the second surface, which may be configured to be coupled with a base of a heat sink to distribute force applied between the heat sink and the package substrate, via the frame, and may deform under application of the force, which may allow the base of the heat sink to contact a surface of an integrated heat spreader within the die area of the package substrate. | 03-17-2016 |
20160088720 | TRANSISTOR THERMAL AND EMI MANAGEMENT SOLUTION FOR FAST EDGE RATE ENVIRONMENT - An electronic device mounting technique in which insulative and thermal barrier materials used in combination with printed circuit board design produce higher electrical breakdown voltage while minimizing thermal resistance and electromagnetic interference. | 03-24-2016 |
20160095201 | CIRCUIT BOARD COMPRISING HEAT TRANSFER STRUCTURE - A circuit board comprises a first heat transfer structure including graphite or graphene, wherein at least a portion of the first heat transfer structure is disposed inside an insulating member and a primer layer is disposed on a surface of the first heat transfer structure. The first heat transfer structure may comprise a plurality of monomers, the monomers including a primer layer disposed on at least one surface of at least one layer of graphite or graphene. | 03-31-2016 |
20160113144 | PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME - A package assembly can include: (i) a plurality of electrical components stacked on at least two layers; (ii) a lead frame connected to the electrical components by solder interconnection; (iii) an encapsulating compound overlapping a portion of the lead frame and the electrical components to expose portions of leads of the lead frame from the encapsulating compound; and (iv) a heat sink having a first portion arranged between at least two of the plurality of electrical components on adjacent of the at least two layers, where the heat sink is configured to provide a common heat dissipation path for the electrical components. | 04-21-2016 |
20160128208 | ELECTRICAL CONTROL DEVICE - An electrical control device ( | 05-05-2016 |
20160150655 | ELECTRONIC APPARATUS - An electronic apparatus includes a board, an electronic component, a mold resin a rod-like connection terminal and a case. The board includes: a first surface; a second surface, which is opposite to the first surface; a wire pattern; and a through-hole having a metal member connected to the wire pattern. The electronic component mounted on the first surface of the board. The mold resin seals the electronic component on the first surface of the board. The rod-like connection terminal inserted into the through-hole from a distal end of the through-hole and electrically connected to the metal member. The case having a surface on which the connection terminal stands and accommodating the board on which the electronic component is mounted. The board is arranged such that the first surface on which the electronic component and the mold resin are arranged faces the surface of the case on which the connection terminal stands. | 05-26-2016 |
20160150679 | ELECTRONIC DEVICE - An electronic device includes a housing, a heat generating element and a heat prevention module. The housing includes a case portion. The heat generating element is disposed inside the housing. The heat prevention module obstructs between the case portion and the heat generating element. The heat prevention module includes a first thermally conductive plate, a second thermally conductive plate and a third thermally conductive plate. The second thermally conductive plate obstructs between the first thermally conductive plate and the case portion. The third thermally conductive plate connects an edge of the first thermally conductive plate and an edge of the second thermally conductive plate. | 05-26-2016 |
20160157381 | ELECTRIC POWER CONVERTER | 06-02-2016 |
20160157384 | POWER MODULE | 06-02-2016 |
20160165715 | DEVICE INCLUDING A PRINTED CIRCUIT BOARD AND A METAL WORKPIECE - A device including a first semiconductor package that includes a semiconductor chip, an encapsulation material at least partly covering the semiconductor chip, and a contact element electrically coupled to the semiconductor chip and protruding out of the encapsulation material. In addition, the device includes a printed circuit board (PCB), wherein the first semiconductor package is mounted on the PCB and the contact element of the first semiconductor package is electrically coupled to the PCB. The device further includes a first metal workpiece mounted on the printed circuit board and electrically coupled to the contact element of the first semiconductor package. | 06-09-2016 |
20160165759 | MULTILEVEL CONVERTER - A multilevel converter contains at least two submodules which are connected in a row. Each of the submodules contains at least two switches and a capacitor and two current-carrying outer module terminals. Accordingly, at least one of the submodules has at least one outer cooling member which acts as a current-carrying outer module terminal. | 06-09-2016 |
20160183414 | ULTRATHIN HEAT REMOVER FOR PORTABLE ELECTRONIC DEVICE | 06-23-2016 |
20160192493 | Circuit board assembly, control device for a cooler fan module and method - The present invention relates to a circuit board assembly, comprising a circuit board which has a first and a second solder region, which is galvanically separated from the first, and which furthermore has a separator arranged between the solder regions and rising out from the solder regions, having a power semiconductor component which has a housing having an output connection side, from which at least one control connection and a plurality of output connections protrude, which are arranged substantially adjacent to each other on the output connection side, wherein the control connection is electrically and mechanically connected to the first solder region and the output connections are electrically and mechanically connected to the second solder region and the control connection is separated from the output connections via the raised separator. The present invention furthermore relates to a control device for a cooler fan module of a motor vehicle and a method for assembling a power semiconductor component on a circuit board. | 06-30-2016 |
20160192533 | Packaging Structure and Optical Module Using the Same - A packaging structure and an optical module using the same are disclosed, wherein said packaging structure includes: a printed circuit board, having a first surface and a second surface opposite to each other; a heat dissipation hole running through the first and second surfaces of the printed circuit board; a heat dissipation block fixed within the heat dissipation hole; a power device provided on the first surface of the printed circuit board, wherein the power device is in a thermal conductive connection with the heat dissipation block. No adhesive or other dielectric of low heat conductivity coefficient is necessary during the manufacturing process of the heat dissipation block. The heat dissipation hole can open wider, as the fixation of copper paste and the heat dissipation hole are not a concern. Therefore, the heat dissipation ability of the packaging structure is optimized and the stable operation of the device is ensured. | 06-30-2016 |
20160192541 | ELECTRONIC DEVICE CABINET AND A DISSIPATION BOARD - An electronic device cabinet comprising a housing and a printed-circuit board positioned in an internal area of the housing and defining a dissipation chamber. The dissipation chamber is formed between a first surface of the printed-circuit board and a first dissipating surface of a dissipation board. The dissipation board is fitted into the housing. The printed-circuit board comprises at least one electronic component positioned in the dissipation chamber. The dissipation chamber further includes a filler in direct contact with a perimeter of the electronic component, with parts of the first surface of the printed-circuit board, with the tracks of the printed-circuit board, and with parts of the first dissipating surface of the dissipation board. The cabinet is configured so that a second dissipating surface of the dissipation board, opposite the first dissipating surface, is in direct contact with the external environment surrounding the cabinet. | 06-30-2016 |
20160255714 | POWER CONVERTER | 09-01-2016 |
20170238410 | Heat-Dissipation and Shielding Structure and Communications Product | 08-17-2017 |
20190150272 | ELECTRONIC MODULE | 05-16-2019 |
20220141990 | HEAT SINK FOR OPTICAL MODULE - In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material. | 05-05-2022 |