| Entries |
| Document | Title | Date |
|---|
| 20080232067 | MECHANISMS FOR HEAT TRANSFER IN AN OPTICAL TRANSCEIVER MODULE AND CARD CAGE SYSTEM - Mechanisms and systems for dissipating heat from an optical transceiver module to a module card cage system. In one embodiment, a thermal conductive label having at least one raised portion is attached to a surface of the module. The raised portion is configured to contact at least a portion of the card cage to dissipate heat from the module to the card cage. In another embodiment, the card cage has a protruding depression formed on a part of its surface that is above a slot configured to receive an optical transceiver module. The protruding depression is configured to contact at least a portion of the module to dissipate heat from the module to the card cage. | 09-25-2008 |
| 20080259570 | TRANSMITTING DEVICE AND ELECTRONIC APPARATUS USING THE SAME - A transmitting device includes (a) an amplifier mounted on the top face or the internal layer of a substrate, (b) a semiconductor integrated circuit mounted on the bottom face of the substrate and connected to the amplifier, and (c) a spacer substrate disposed on the bottom face of the substrate. The spacer substrate is disposed at least under the amplifier. This structure allows the heat generated from the amplifier to be efficiently dissipated through the spacer substrate, thus inhibiting deterioration of the characteristics of the amplifier caused by the heat. | 10-23-2008 |
| 20080266805 | Carrier For Electrical Components With Soldered-On Cooling Body - The invention relates to an assembly of a carrier for electrical components that are arranged for producing more heat than can be dissipated via natural cooling at least under certain operating conditions and a cooling body mechanically and thermally connected thereto, whereby the carrier is provided with a metal part that is connected to the cooling body by means of a metallic connection. Mounting a metal part on the carrier makes it possible to form a metallic connection between the metal part and the metal cooling body. The invention also relates to a method for assembling an assembly of a carrier for heat-producing electrical components and a cooling body mechanically and thermally connected thereto, whereby the components are initially mounted on the carrier and a metal part of the carrier is then connected to the cooling body by means of a metallic connection. | 10-30-2008 |
| 20080291632 | Inverter casing - The invention relates to an inverter casing, said inverter casing ( | 11-27-2008 |
| 20080310116 | Heatsink having an internal plenum - A heatsink for conducting heat away from an electric module in thermal contact with the heatsink includes at least a first heatsink member joined to at least a second heatsink member by a weld joint to define a heatsink having an internal plenum. By replacing conventional adhesive and fastening means used for sealing heatsink members together with a welded joint, a more durable and reliable sealed plenum is obtained. In a preferred aspect, the weld joint is created using a friction stir welding technique. | 12-18-2008 |
| 20090002949 | HEAT TRANSFER FOR ELECTRONIC COMPONENT VIA AN ELECTROMAGNETIC INTERFERENCE (EMI) SHIELD HAVING SHIELD DEFORMATION - In one embodiment, an apparatus having an electromagnetic interference (EMI) shield for an electronic component. The EMI shield and the electronic component are adapted to be assembled onto a circuit board. The EMI shield provides EMI shielding for the electronic component. The EMI shield includes a thermally conductive material, such as a metal. The EMI shield is deformed, e.g., with a dimple or a tab, to form a contacting portion to contact the electronic component. After the assembly of the EMI shield and the electronic component onto the circuit board, the contacting portion of the EMI shield contacts the electronic component, thereby allowing conductive transfer of thermal energy between the electronic component and the EMI shield and enhanced heat dissipation for the electronic component. | 01-01-2009 |
| 20090052139 | Heat-Dissipation Apparatus For Communication Device With Card Slot - A heat dissipation apparatus for communication device with card slot is provided. The heat dissipation apparatus is applicable to a communication platform to dissipate the heat generated by the card communication module to the housing case. The heat dissipation apparatus includes a heat-conductive bridge, and at least a soft heat-conductive plate. The soft heat-conductive plate covers the surface of the card communication module to conduct the heat generated by the chips of the card communication module to the heat-conductive bridge, and then to the metal housing case for dissipation. | 02-26-2009 |
| 20090067130 | Arrangement for heat dissipation - The invention relates to an arrangement for heat dissipation. The arrangement comprises a printed circuit board and at least one electrical and/or electronic component, with a power supply unit supplying electrical power to the electrical and/or electronic component ( | 03-12-2009 |
| 20090067131 | ELECTRONIC DEVICE MOUNTING STRUCTURE - An electronic device mounting structure includes a thermally conductive base, a busbar located on the base, an electronic device mounted on the busbar, a thermally conductive wall standing on the base and having first and second portions located opposite each other across the electronic device, and a plate spring supported by the first and second portions of the wall. The plate spring presses the electronic device against the base so that thermal resistance between the electronic device and the base is reduced. The plate spring has a thermal conductivity so that heat in the electronic device is transferred to the wall through the plate spring. | 03-12-2009 |
| 20090086436 | CARRIER BODY FOR COMPONENTS OR CIRCUITS - A carrier body for electrical or electronic component elements or circuits, the carrier body being electrically nonconductive or virtually nonconductive. In order to simplify the carrier body while at the same time providing extremely improved heat dissipation, the invention process that the carrier body is provided integrally with heat-dissipating or heat-supplying cooling elements. | 04-02-2009 |
| 20090103267 | ELECTRONIC ASSEMBLY AND METHOD FOR MAKING THE ELECTRONIC ASSEMBLY - An electronic assembly comprises a generally planar substrate. An electronic component is mounted to the substrate and has a projecting portion projecting above a surface of the substrate. An enclosure has at least one side with indentations. One of the indentations is positioned to receive the projecting portion of the electronic component with a clearance gap. A thermally-conductive material is inserted between the projecting portion and the enclosure within the clearance gap. | 04-23-2009 |
| 20090109628 | Chip Cooling System with Convex Portion - Integrated circuit chip cooling methods and systems are disclosed. A method for cooling an integrated circuit chip may comprise: providing a cooling mechanism; positioning an interface medium between the cooling mechanism and the integrated circuit chip; and interfacing the cooling mechanism and the integrated circuit chip through the interface medium; wherein at least one of the cooling mechanism, the integrated circuit chip, or the interface medium includes a convex portion on an interface surface thereof. | 04-30-2009 |
| 20090154106 | DOUBLE BONDED HEAT DISSIPATION - Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation. | 06-18-2009 |
| 20090195987 | Positioning Device For Heatsink - A positioning device for connecting a heatsink to a chip set includes a rectangular frame having a through hole in a center thereof, two side plates extending from two opposite sides thereof and each side plate has one hook extending from an inside thereof. Two positioning rods extend from the other two opposite sides of the rectangular frame, and a plurality of flexible rods extend from insides of the rectangular frame. The heatsink extends through the through hole of the rectangular frame and the positioning rods insert through apertures in the heatsink. The hooks are hooked to two sides of the chip set and the flexible rods press on the heatsink. | 08-06-2009 |
| 20090201648 | CONTOUR SURFACE COOLING OF ELECTRONICS DEVICES - The present invention provides a cooling device including a heat generating device having a device surface with a device surface contour on at least a portion of the device surface and a base having a base surface with a base surface contour on at least a portion of the base surface. The device surface contour and the base surface contour are substantially similar such that at least a portion of the device surface and the base surface fit in close proximity to each other. | 08-13-2009 |
| 20090201649 | Electrical Device, Particularyl for Driving a Motively and/or Rgeneratively Operable Electric Machine - An electrical device, particularly for driving a motively and/or regeneratively operable electric machine, having at least one switching-element module, which may be for inverting and/or rectifying electric currents, the switching-element module being able to be cooled by a cooling device and resting at least indirectly thereon, a fixation element, at least one conductor, as well as the switching-element module and cooling device being disposed one above the other. | 08-13-2009 |
| 20090251865 | Heatsink of heat-producing device - There is provided a heatsink for radiating heat from a heat-producing device. The heatsink includes a heatsink body; a clip that has a pair of arms and is fitted to the heatsink body along a heat radiation surface of the heat-producing device such that the heat-radiation surface of the heat-producing device and the heatsink body closely contact with each other while being sandwiched between the pair of arms; and a guide plate integrally formed with the heatsink body. The guide plate is configured such that an interval between the guide plate and the heatsink body is smaller than an arm interval between the pair of arms of the clip on a front side in a fitting direction of the clip and is larger than the arm interval on a deep side in the fitting direction of the clip. | 10-08-2009 |
| 20090251866 | ELECTRICAL CONFIGURATION AS HEAT DISSIPATION DESIGN - An electrical configuration having at least one component which has at least one current bar, particularly a lead frame, and having an electronic circuit which has at least one heat dissipation surface and at least one electric terminal that is connected mechanically and electrically to the current bar. It is provided that the unit made up of the component and the electronic circuit is mounted on a support layer that effects the heat dissipation in such a way that, because of the fastening of the component onto the support layer, the heat dissipation surface is pushed against the support layer, based on the spring property of the current bar. | 10-08-2009 |
| 20090284928 | Enhancing the Cooling of Dual In-Line Memory Modules - An apparatus for enhancing the cooling of a dual in-line memory module (DIMM) includes a planar body having opposing surfaces, a top edge, a bottom edge, and opposing ends. An engagement flange is connected to the bottom edge of the body. A first clip leg is connected to the engagement flange. The first clip leg includes a tab arranged to engage one mounting latch recess of the DIMM. A second clip leg connected to the engagement flange. The second clip leg includes a tab arranged to engage the other mounting latch recess of the DIMM. | 11-19-2009 |
| 20090310311 | Electronic Device - An electronic device able to stably disperse heat generated by an electronic component is provided. By providing a heat dissipating metal plate | 12-17-2009 |
| 20100014252 | ELECTRIC UNIT HAVING CAPACITOR - A PCU has an inside sealed by a case made of aluminum and a bottom plate. Interior space of the PCU accommodates an IPM, a control substrate, and a capacitor. The IPM is provided to abut an upper surface of the bottom plate. The control substrate is a rectangular plate having mounted thereon a control circuit including electronic components such as a gate driver, a transformer and the like, and is provided above the IPM. The capacitor is accommodated in a housing in a substantially parallelepiped form. A reflector made of aluminum of high thermal reflectivity and high thermal conductivity is provided on the entire lower surface of the capacitor. | 01-21-2010 |
| 20100020498 | ELECTRONIC COMPONENT UNIT AND COUPLING MECHANISM - An electronic component unit includes: a substrate; an electronic component mounted on the surface of the substrate; a heat dissipating member received on the electronic component; a cylinder member having one end coupled to the substrate, the cylinder member having the other end defining an opening opposed to the heat dissipating member; and a piston member having one end coupled to the heat dissipating member, the piston member having the other end inserted in the cylinder member through the opening to establish a closed decompressed space inside the cylinder member. | 01-28-2010 |
| 20100033934 | FIXING HEAT DISSIPATING UNIT AND ELECTRONIC DEVICE HAVING FIXING HEAT DISSIPATING UNIT - A fixing heat dissipating unit that is disposed in an electronic device is connected to a substrate and a heat source. The fixing heat dissipating unit includes a fixing element and a heat conducting element. The fixing element is connected to the substrate to hold the substrate in the electronic device. The heat conducting element is respectively connected to the heat source and the fixing element. The heat source is a part of the electronic device and the fixing element is integrated with the heat conducting element as a single component. An electronic device having the fixing heat dissipating unit is also disclosed. | 02-11-2010 |
| 20100046169 | Heat Dissipation Device Having Sound Output Function - A heat dissipation device having sound output function includes a base body for placing an audio/video player thereon. The base body has an inclined surface under which a fan is disposed to dissipate out the heat generated from the audio/video player. The base body incorporates with a sound output assembly including a left channel, a right channel, a center channel, and a subwoofer channel. The base body has an audio input jack disposed at a rear side thereof for connection with an audio cable. When the audio cable is connected between the audio/video player and the audio input jack, the sound of the audio/video player can be played back through the sound output assembly to form a surround sound effect. | 02-25-2010 |
| 20100053901 | Hybrid Chassis Cooling System - In a system for housing electronics cards, methods and systems for cooling the electronics cards are presented. Each electronics card preferably contains heat-producing electronics and a heat sink, and is preferably placed within a card guide of the chassis and secured into position with a clamping device. At least one of the heat sink, the card guide, the clamping device, and a cold wall of the chassis are used to facilitate the conduction cooling of the heat-producing electronics. Furthermore, a clamping device may rigidly secure a card into position, thus reducing the impact of vibrations (including shock) on the card. Additionally, an air flow further cools the electronics cards, the card guides, and/or the cold wall. | 03-04-2010 |
| 20100073882 | THERMALLY CONDUCTIVE SHEET, PROCESS FOR PRODUCING THE SAME, AND RADIATOR UTILIZING THERMALLY CONDUCTIVE SHEET - A thermally conductive sheet having both of a high thermal conductivity and a high flexibility is obtained by providing a thermally conductive sheet including a composition containing:
| 03-25-2010 |
| 20100103622 | ELECTRONIC CONTROL DEVICE - The electronic control device includes: a printed circuit board; a heat-generating member having a plurality of legs which are mounted on the printed circuit board by connections between the legs and the printed circuit board; and a casing which radiates heat that is transferred from the heat-generating member, wherein: the legs are connected via press-fit connections with the printed circuit board. | 04-29-2010 |
| 20100142151 | DISPLAY DEVICE - A display device is disclosed. In one embodiment, the display device includes i) a display panel configured to display an image, ii) a chassis base configured to support the display panel, iii) an auxiliary chassis disposed between the display panel and the chassis base, wherein one end of the auxiliary chassis covers and contacts an edge of the chassis base. The display device further includes i) a driving board disposed at the back of the chassis base and configured to drive the display panel and ii) at least one signal transmission member comprising at least one circuit device and configured to electrically connect the display panel and the driving board, wherein one side of the at least one signal transmission member is supported by the auxiliary chassis, and wherein the one side faces the edge of the chassis base. | 06-10-2010 |
| 20100165575 | Electronics component packaging for power converter - Assembling a power converter for a multiple phase electric drive propulsion system in a machine includes arranging a plurality of rectangular capacitor units of a capacitor subassembly for conditioning electrical power in the power converter in a first packaging arrangement. In the first packaging arrangement, major capacitor axes of each one of the capacitor units are co-linear with one another and minor capacitor axes of each one of the capacitor units are oriented parallel but not co-linear with one another. Assembling the power converter further includes arranging a plurality of IGBT modules of a transistor subassembly for power switching in the power converter in a second packaging arrangement. In the second packaging arrangement major module axes of each one of the IGBT modules are oriented parallel but not co-linear with one another and minor module axes of each one of the IGBT modules are co-linear with one another. The capacitor subassembly and the transistor subassembly are supported in the first packaging arrangement and in the second packaging arrangement for service in a power converter housing. | 07-01-2010 |
| 20100202110 | ELECTRIC CONTROL UNIT - Electric control units are known having a printed circuit board substrate | 08-12-2010 |
| 20100220446 | HEAT DISSIPATING MATERIAL AND SEMICONDUCTOR DEVICE USING SAME - Disclosed is a heat dissipating material which is interposed between a heat-generating electronic component and a heat dissipating body. This heat dissipating material contains (A) 100 parts by weight of a silicone gel cured by an addition reaction having a penetration of not less than 100 (according to ASTM D 1403), and (B) 500-2000 parts by weight of a heat conductive filler. Also disclosed is a semiconductor device comprising a heat-generating electronic component and a heat dissipating body, wherein the heat dissipating material is interposed between the heat-generating electronic component and the heat dissipating body. | 09-02-2010 |
| 20100226095 | HEAT CONDUCTIVE SHEET AND POWER MODULE - Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties. | 09-09-2010 |
| 20100226096 | Clamping Part for Pressing Power Components Against a Cooling Surface - The present invention relates to a clamping member for pressing power components ( | 09-09-2010 |
| 20100246134 | THERMAL INSULATION STRUCTURE - A thermal insulation structure is disposed on an outer surface of a housing of an electronic device. The thermal insulation structure includes a plurality of tubular structures arranged in parallel, and each of the tubular structures extends along an extension direction. Each tubular structure has at least one tube wall enclosing to form a hollow space. Due to the tubular structures, the thermal isolation structure has anisotropic thermal conductivity. In the thermal isolation structure, heat transfer in every direction is different, and the hot spot area is relative enlarged to reduce the highest temperature on the surface of the thermal isolation structure. Thus, high temperature hot spot area caused by the heat generating element is prevented to be formed on the surface of the electronic device. | 09-30-2010 |
| 20100246135 | ELECTRONIC DEVICE - An electronic device of the present invention includes: a base made of a ceramic material; an electronic device element arranged in a central area of the upper surface of the base, in a way that the electronic device element is placed on a first heat transfer layer; a first heat dissipation layer formed in a central area of the lower surface of the base; a plurality of thermal vias arranged in the base, and which connects the first heat transfer layer and the first heat dissipation layer; and a second heat transfer layer buried in the base, the second heat transfer layer crossing the plurality of thermal vias, while extending from a position above a central area of the lower surface of the base to a position above a peripheral area of the lower surface of the base. | 09-30-2010 |
| 20100271782 | ELECTRO-OPTIC DEVICE AND ELECTRONIC DEVICE - An electro-optic device includes an electro-optic panel, a first holding member that holds the electro-optic panel, and a second holding member provided with a heat emitting portion on the side opposite to a surface to which the electro-optic panel is adhered. In the electro-optic device, a predetermined gap is provided between the first holding member and the second holding member. | 10-28-2010 |
| 20100271783 | ELECTRO-OPTIC DEVICE AND ELECTRONIC DEVICE - An electro-optic device includes an electro-optic panel and a holding member provided with a heat emitting portion on the side opposite to a surface to which the electro-optic panel is adhered by an adhesive. In the electro-optic device, a groove portion to be filled up with the adhesive is provided in a portion of the holding member to which the electro-optic panel is adhered. | 10-28-2010 |
| 20100290192 | SEMICONDUCTOR DEVICE AND DISPLAY APPARATUS - A COF includes, in at least one embodiment, a heat dissipating material on a back surface of an insulating film. The heat dissipating material has a slit for reducing a degree of thermal expansion. Thus, at least one embodiment of the invention provides the COF in which deformation and disconnection of wiring are prevented. | 11-18-2010 |
| 20100321891 | Avionics Chassis - An avionics chassis comprises a carbon fiber reinforced housing, a card rail for holding an electronic circuit board mounted to an interior surface of the housing, at least one heat-dissipating fin composed of carbon fiber and extending from the outer surface of the housing, a plurality of isotropic carbon fibers extending from an interior of the fin through the housing and in abutting contact with the card rail. The plurality of isotropic fibers form a direct conductive path from the card rail to the heat-dissipating fin. | 12-23-2010 |
| 20100321892 | Avionics Chassis - An avionics chassis comprises a housing having a substantially thermally non-conductive frame comprising a composite of carbon fibers laid up in an epoxy matrix. The housing also includes at least two walls, at least one of which is a thermally conductive wall comprising a composite of carbon fibers in a carbonized matrix, and a plurality of spaced, thermally-conductive, card rails provided on the at least two walls. The at least two walls are mounted to the frame in opposing relationship such that corresponding card rails on the walls define an effective slot therebetween in which a printed circuit board may be received and the card rails and the at least one thermally conductive wall form a thermally conductive path from the interior to the exterior. | 12-23-2010 |
| 20100321893 | Heat Dissipation Packaging for Electrical Components - The emphasis for transporting heat energy to ambient in an efficient manner is critical for many semiconductor components to maintain highest performance. A heat dissipation system with low thermal resistance for the packaging of high power electrical components, and the methods for assembling a low thermal resistance system, is proposed. Unique in this method is the emphasis on moving heat with a primary thermal conductor away from the source and creating large area interface zones to improve heat transfer. | 12-23-2010 |
| 20110013365 | ELECTRONIC CONTROL UNIT - An electronic control unit includes a circuit board, multiple circuit patterns, multiple semiconductor devices, multiple leads, and at least one thermal-conduction limiting portion. Each of the semiconductor devices is installed to the corresponding circuit pattern formed on the circuit board. Each of the leads electrically and mechanically connects each of the semiconductor devices to the corresponding circuit pattern. The thermal-conduction limiting portion, which can limit conduction of heat generated from the semiconductor devices, is placed between corresponding two of the circuit patterns. | 01-20-2011 |
| 20110032677 | DISTRIBUTED COMPUTING - On a typical motherboard the processor and memory are separated by a printed circuit data bus that traverses the motherboard. Throughput, or data transfer rate, on the data bus is much lower than the rate at which a modern processor can operate. The difference between the data bus throughput and the processor speed significantly limits the effective processing speed of the computer when the processor is required to process large amounts of data stored in the memory. The processor is forced to wait for data to be transferred to or from the memory, leaving the processor under-utilized. The delays are compounded in a distributed computing system including a number of computers operating in parallel. The present disclosure describes systems, method and apparatus that tend to alleviate delays so that memory access bottlenecks are not compounded within distributed computing systems. | 02-10-2011 |
| 20110075375 | TUNER MODULE CAPABLE OF PREVENTING A HEAT CONDUCTIVE SHEET FROM ARISING - A tuner module includes a circuit board, an electronic component, mounted on the circuit board, for demodulating a high frequency reception signal received from an antenna unit to produce a speech signal, a metal case accommodating the circuit board and the electronic component therein, and a heat conductive sheet, disposed between the electronic component and the metal case, made of an elastic body. The heat conductive sheet has dimensions which are substantially equal to or slightly lower than outer dimensions of the electronic component. The metal case has at least one slit-shaped hole which is formed along an outer shape of the electronic component. | 03-31-2011 |
| 20110075376 | Module substrate radiating heat from electronic component by intermediate heat transfer film and a method for manufacturing the same - A module substrate having a heat-generative electronic component mounted thereon includes first and second dielectric substrates and an intermediate heat transfer film. The heat-generative electronic component is flip-chip bonded on a wiring layer formed on the main surface of the first dielectric substrate through a solder bump. The second dielectric substrate is attached to the upper surface of the electronic component through an insulating layer. The intermediate heat transfer film for transferring heat generated by the electronic component to the second dielectric substrate is attached between the insulating layer and the second dielectric substrate so as to make the intermediate heat transfer film in close contact with the lower surface of the second dielectric substrate, thereby suppressing the temperature of the heat-generative electronic component in operation from increasing. | 03-31-2011 |
| 20110090648 | ELECTRONIC PACKAGE STRUCTURE - An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element. | 04-21-2011 |
| 20110096506 | MULTI-LAYER SOC MODULE STRUCTURE - A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure. | 04-28-2011 |
| 20110110045 | LIQUID CRYSTAL DISPLAY DEVICE - A liquid crystal display device includes a liquid crystal display panel and a backlight disposed at the back of the liquid crystal display panel. The backlight includes a frame, a light source, a reflective sheet, and a heat dissipating plate formed in a rectangular shape and housing the light source, the reflective sheet, and the heat dissipating plate. The heat dissipating plate is disposed between the reflective sheet and a bottom surface of the frame and includes a first portion and a second portion facing the first portion, and has a plurality of first openings at the first portion and at least one second opening at the second portion. The plurality of first openings are formed along the first portion, and each of the first openings has a first edge and a first fin formed at a part of the first edge. | 05-12-2011 |
| 20110141695 | ELECTRONIC DEVICE - According to one embodiment, an electronic device includes a circuit board, a heat generating element, a heat dissipater, and a pushing member. The circuit board is housed in a housing. The heat generating element is mounted on the circuit board. The heat dissipator is configured to dissipate heat generated by the heat generating element. The pushing member is configured to push part of the heat dissipator against the heat generating element. At least part of the pushing member is attached to a structure other than the circuit board. | 06-16-2011 |
| 20110141696 | THERMAL MATCHING IN SEMICONDUCTOR DEVICES USING HEAT DISTRIBUTION STRUCTURES - Embodiments described herein provide a chip, comprising a first device on a substrate and a second device on the substrate. The chip further comprises a heat distribution structure in thermal proximity to the first device and the second device, wherein the heat distribution structure is thermally isolated and reduces a thermal gradient between the first device and the second device. | 06-16-2011 |
| 20110141697 | DISPLAY APPARATUS (amended - Provided is a display apparatus including a display panel for displaying an image, a heat source arranged at a side surface of at least one side of the display panel, a heat absorbing section for absorbing heat generated by the heat source, a back surface plate arranged at a back surface side of the display panel and made of a metal, a portion of the back surface plate being in close contact with the heat absorbing section, a front surface plate arranged at a front surface side of the display panel and made of a metal, and a middle chassis arranged between the front surface plate and the heat absorbing section. | 06-16-2011 |
| 20110149519 | APPARATUS AND METHOD FOR EMBEDDING COMPONENTS IN SMALL-FORM-FACTOR, SYSTEM-ON-PACKAGES - According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including a first layer having a first conformable material; a second layer having a second conformable material; one or more electronic components embedded within the stack of layers; and a vertical filtering structure arranged periodically between the one or more electronic components, wherein the first conformable material, the second conformable material, or both are configured to allow high frequency signal routing. | 06-23-2011 |
| 20110157832 | ELECTRONIC DEVICE - According to one embodiment, the electronic device includes: a heating element that has: a first electronic part; and a plurality of connection terminals provided around the first electronic part; a first circuit board that has: a first surface; a second surface opposite to the first surface; an opening; and a plurality of pads provided around the opening at the first surface to be electrically connected with the connection terminals, respectively; a heat receiving member that has a heat receiving portion faced to the heating element and that is thermally connected to the heating element; a pressing member that presses the heat receiving member toward the first circuit board; and a support member that supports the first circuit board at a periphery of the opening from the second surface. | 06-30-2011 |
| 20110176277 | SILICON NITRIDE SINTERED BODY, METHOD OF PRODUCING THE SAME, AND SILICON NITRIDE CIRCUIT SUBSTRATE AND SEMICONDUCTOR MODULE USING THE SAME - Provided are a silicon nitride substrate made of a silicon nitride sintered body that is high in strength and thermal conductivity, a method of producing the silicon nitride substrate, and a silicon nitride circuit substrate and a semiconductor module that use the silicon nitride substrate. | 07-21-2011 |
| 20110199733 | ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS - An electro-optical device may include: an electro-optical panel, a holding member that includes a main body part arranged to surround the periphery of the electro-optical panel, and a holding part protruded from the main body part and holding the electro-optical panel, and a heat radiating member that is disposed opposing the electro-optical panel through an opening of the holding member from the opposite side of the light incident plane of the electro-optical panel. | 08-18-2011 |
| 20110261534 | FIXING MECHANISM AND ELECTRONIC DEVICE UTILIZING THE SAME - A fixing mechanism for fixing an object to a base plate is provided. The object defines a hole and includes a ring extending from an edge of the hole. The ring includes a threaded hole. The base plate includes a post on its top surface and respectively opposing to the hole. The fixing mechanism includes an elastic element, a first hollow bolt and a second bolt. The first hollow bolt passes through the hole and the elastic element, and includes an externally threaded portion engaging with the threaded hole of the ring. The second bolt is inserted into the first hollow bolt, and engages with the post of the base plate. | 10-27-2011 |
| 20110273846 | Substrate For Mounting Device and Package for Housing Device Employing the Same - There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion. | 11-10-2011 |
| 20110310564 | IMAGE PICKUP APPARATUS AND ELECTRONIC DEVICE - An image pickup apparatus that does not give a user, who grips an apparatus body with his/her hand when he/she uses the imaging apparatus or the electronic device, a sense of discomfort due to a heat, and that can efficiently diffuse heat generated from a heat source inside the apparatus body to suppress a local temperature rise inside the apparatus body. An image pickup apparatus comprises an outer cover that forms an exterior of a device body, the device body having a grip at one end thereof and having a heat source therein. A first thermal conductive path from a first circuit unit to a first heat storage member via a first heat conductive member and a second thermal conductive path from a second circuit unit to a second heat storage member via the second heat conductive member are separated from each other. | 12-22-2011 |
| 20120014066 | HEAT EXCHANGER, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE HEAT EXCHANGER, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE - Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger wherein a fin member provided with a plurality of fins forming flow channels for a refrigerant is arranged within a frame which forms the outer casing. The frame has a first frame member (a first wall portion) to which insulating plates (intervening members) interposed between the frame and heat-generating bodies (semiconductor elements) are welded. The insulating plates (intervening members) have a linear expansion coefficient different from that of the frame. The first frame member is provided with elastically deformable projections (elastically deformable portions) along an arrangement surface of the outer surface on which the insulating plates (intervening members) are arranged. | 01-19-2012 |
| 20120020026 | MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION - A microelectronic unit includes a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can include a microelectronic element having a bottom surface adjacent the inner surface, a top surface remote from the bottom surface, and a plurality of contacts at the top surface. The microelectronic element can include terminals electrically connected with the contacts of the microelectronic element. The microelectronic unit can include a dielectric region contacting at least the top surface of the microelectronic element. The dielectric region can have a planar surface located coplanar with or above the front surface of the carrier structure. The terminals can be exposed at the surface of the dielectric region for interconnection with an external element. | 01-26-2012 |
| 20120039043 | IMAGE PICKUP APPARATUS CAPABLE OF EFFICIENTLY DISSIPATING HEAT - An image pickup apparatus which is capable of suppressing by efficiently dissipating heat generated by an electronic device through transmission of the heat to a heat dissipating member without adding a new member to the image pickup apparatus. A CPU | 02-16-2012 |
| 20120044648 | FIXING MECHANISM FOR FIXING A THERMAL MODULE ON A BASE AND RELATED ELECTRONIC DEVICE - A fixing mechanism for fixing a thermal module on a base includes a U-shaped buckling component disposed on a side of the base for buckling a thermal fin and a heat conducting block of the thermal module, and a fixing component disposed on the other side of the base and connected to the U-shaped buckling component for clipping the base with the U-shaped buckling component. | 02-23-2012 |
| 20120057304 | TERMINAL BOX FOR SOLAR CELL MODULE - A terminal box is provided with a plurality of terminal plates ( | 03-08-2012 |
| 20120063093 | REDUCING THERMAL GRADIENTS TO IMPROVE THERMOPILE PERFORMANCE - With infrared (IR) sensors, repeatability and accuracy can become an issue when there are thermal gradients between the sensor and an underlying printed circuit board (PCB). Conventionally, a large thermal mass is included in the sensor packaging to reduce the effect from such thermal gradients, but this increase costs and size of the sensor. Here, however, a PCB is provided that includes an isothermal cage included therein that generally ensures that the temperature of the underlying PCB and sensor are about the same by including structural features (namely, the isothermal cage) that generally ensure that the thermal time constant for a path from a heat source to the thermopile (which is within the sensor) is approximately the same as thermal time constants for paths through the PCB. | 03-15-2012 |
| 20120063094 | THERMAL INTERFACE MATERIAL APPLICATION FOR INTEGRATED CIRCUIT COOLING - Techniques provide improved thermal interface material application in an assembly associated with an integrated circuit package. For example, an apparatus comprises an integrated circuit module, a printed circuit board, and a heat transfer device. The integrated circuit module is mounted on a first surface of the printed circuit board. The printed circuit board has at least one thermal interface material application via formed therein in alignment with the integrated circuit module. The heat transfer device is mounted on a second surface of the printed circuit board and is thermally coupled to the integrated circuit module. The second surface of the printed circuit board is opposite to the first surface of the printed circuit board. | 03-15-2012 |
| 20120113596 | ELECTRONIC APPARATUS, METHOD FOR MOUNTING A DEVICE, AND OPTICAL COMMUNICATION APPARATUS - An electronic apparatus includes a substrate, a device including a flange, the device being mounted at a first side of the substrate, a plate arranged at a position corresponding to the device at a second side of the substrate, the second side being opposite to the first side, and a securing member that secures the device to the substrate. | 05-10-2012 |
| 20120155031 | ELECTRONIC DEVICE - An exemplary electronic device includes a shell, a mother board and a metal sheet disposed at an inner side of the shell, an electronic apparatus fixed on the mother board, and a heat conducting plate thermally connecting the electronic apparatus with the metal sheet. The metal sheet is located between the shell and the mother board to shield electro magnetic interference from the electronic apparatus. The electronic apparatus generates heat when working. The electronic apparatus is located between the mother board and the metal sheet, and is spaced from the metal sheet. | 06-21-2012 |
| 20120162920 | Rotatable Latch For Compressing Thermal Interface Material Between A Heat Generating Electrical Component And A Cooling Electrical Component - Apparatuses are provided for compressing a thermal interface material between a heat generating electrical component and a cooling electrical component. Embodiments include a draw rod coupled at one end to the cooling electrical component, the draw rod passing through the heat generating electrical component; wherein the draw rod includes a pin on the end opposite the end coupled to the cooling electrical component; and a rotatable latch coupled to the heat generating electrical component, the rotatable latch including a hook at one end; wherein when the rotatable latch is in an engaged position, the hook of the rotatable latch engages the pin of the draw rod such that the thermal interface material adhered to the heat generating component is coupled to the cooling electrical component; wherein when the rotatable latch is in an unengaged position, the hook of the rotatable latch is not engaged with the pin of the draw rod. | 06-28-2012 |
| 20120236503 | POWER SEMICONDUCTOR MODULE AND ITS ATTACHMENT STRUCTURE - A power semiconductor module includes: a first metal substrate on which a power semiconductor device is mounted; a second metal substrate on which a power semiconductor device is not mounted; and an electrically insulating resin package which seals the first metal substrate and the second metal substrate. The back surface of the first metal substrate on the side opposite to the mounting surface of the power semiconductor device is made to expose outside the resin package to form a heat dissipation surface. | 09-20-2012 |
| 20120236504 | ELECTRONIC DEVICE FOR SWITCHING CURRENTS AND METHOD FOR PRODUCING THE SAME - The present invention relates to an electronic device for switching currents and a method for producing such a device that is reliable and durable. Such an electronic device comprises a power semiconductor that can be actuated for switching between at least two states; a substrate having thermomechanical properties compatible with the power semiconductor on which the power semiconductor is disposed on one side; a bus bar disposed on the other side of the substrate for conducting the current, wherein the substrate and the bus bar are coupled to each other such that a heat-conductive connection is provided so that heat can be dissipated from the power semiconductor to the bus bar. | 09-20-2012 |
| 20120243181 | ELECTRONIC ASSEMBLY - An electronic assembly has a plurality of functional units each including a board element populated with electronic modules, which board element has in each case a number of contact locations arranged in at least one row, and a contact board, which has for each board element at least one row of contact receptacles that are directly electrically connected to the contact locations of the associated board element. These rows point toward a side of the contact board in their longitudinal direction. A plurality of similar assemblies are produced compactly and cost-effectively by providing a communication unit separate from the contact board and serving for communication with modules of the board elements. The communication unit is connected to the contact board via a plurality of data lines which are contact-connected to the contact board on the side to which the rows point. | 09-27-2012 |
| 20120281361 | INTERNAL COVER THERMAL CONDUCTION - An apparatus and associated methodology associated with a thermally conductive frame having a perimeter surface defining a passage. A printed circuit board assembly (PCBA) is operably disposed within the passage and connected to the frame. The PCBA includes a solid state memory component. An internal cover is disposed in the passage on one side of the PCBA. The internal cover conducts heat to the frame that is operably generated by the solid state memory component. An external cover is attachable to the frame on an opposing side of the PCBA. The external cover cooperates with the frame and the internal cover to enclose the PCBA. | 11-08-2012 |
| 20120281362 | SILICON NITRIDE SUBSTRATE, CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE USING THE SAME - A silicon nitride substrate comprises a substrate comprising a silicon nitride sintered body, and a plurality of granular bodies containing silicon and integrated to a principal surface of the substrate, wherein a plurality of needle crystals or column crystals comprising mainly silicon nitride are extended from a portion of the granular bodies. A brazing material is applied to a principal surface of the substrate, and a circuit member and a heat radiation member are arranged on the applied brazing material, and bonded by heating. Because of a plurality of granular bodies integrated to the principal surface of the substrate, and a plurality of the needle crystals or the column crystals extended from a portion of the granular bodies, a high anchor effect is produced so that the circuit member and the heat radiation member are firmly bonded to the silicon nitride substrate. | 11-08-2012 |
| 20120293960 | DISPLAY DEVICE - A display device includes: a base plate being provided on a first side of a display panel; a front-face supporting member facing the base plate with the display panel therebetween, having a periphery on an external side with respect to the display panel, and being joined to the base plate at part or all of a peripheral portion of the front-face supporting member; and a back-face supporting member facing the front-face supporting member with the base plate therebetween, and being joined to both of the front-face supporting member and the base plate at a peripheral portion of the back-face supporting member. | 11-22-2012 |
| 20120300404 | RESIN-SEALED ELECTRONIC CONTROLLER AND METHOD OF FABRICATING THE SAME - A resin-sealed electronic controller obtained by bonding and fixing a circuit board to a thermally-conductive base plate, and integrating circuit components with a molding resin so as to reduce the size. A base plate includes a first exposed portion, a second exposed portion, and an adjacent flat portion adjacent to a central window hole. First circuit components which are low-heat-generating components with large height are located in the central window hole. Second circuit components which are high-heat-generating components with small height are provided on an area corresponding to the adjacent flat portion. A height dimension of the first circuit components at least partially overlaps a thickness dimension of the base plate, to reduce a total thickness dimension. The high-heat-generating components and the low-heat-generating components being provided separately from each other permits increased mounting density of low-heat-generating components, reducing an area of the circuit board. | 11-29-2012 |
| 20130003304 | CONICAL HEADED FASTENER FOR A PRINTED WIRING BOARD ASSEMBLY - One aspect includes an electronics assembly, including: (1) printed wiring board, (2) a mount and (3) a fastener for securing the printed wiring board to the mount, the fastener including a body configured to pass through a mounting hole on the printed wiring board and engage the mount, the fastener further including a conical head configured to receive a driver torque and further configured to engage a rim of the mounting hole and produce an increasing frictional torque to countervail and eventually balance the driver torque. | 01-03-2013 |
| 20130016474 | HEAT DISSIPATING ASSEMBLY OF PHOTOVOLTAIC JUNCTION BOXAANM GER; CHIH-CHANAACI Jhongli CityAACO TWAAGP GER; CHIH-CHAN Jhongli City TWAANM LIAO; YU-HSIANGAACI Jhongli CityAACO TWAAGP LIAO; YU-HSIANG Jhongli City TWAANM CHEN; SHANG-TINGAACI Jhongli CityAACO TWAAGP CHEN; SHANG-TING Jhongli City TWAANM HUNG; TSUNG-LIANGAACI Jhongli CityAACO TWAAGP HUNG; TSUNG-LIANG Jhongli City TW - A photovoltaic junction box includes a housing, a circuit board received in the housing, a plurality of metal brackets, and a plurality of bypass diodes. The plurality of metal brackets are secured to the circuit board. The plurality of bypass diodes are respectively secured to the plurality of metal brackets and electrically connected to the circuit board. | 01-17-2013 |
| 20130016475 | MODULAR FREQUENCY BASED FIBER TRANSPORT AND RADIO TRANSPORT REPEATER PLATFORM FOR DIVERSE RADIO FREQUENCY CONFIGURABLE DEPLOYMENTS - A modular design repeater platform that allows unique deployment configurations and rapid upgrading, and modifications to a deployed system in a wireless or fiber optic network system is disclosed. The platforms include fiber transport and radio transport systems. The system includes a base unit coupled to one or more RF modules. The components employ a flange—recess design and pedestal mounts to securely couple the components together. | 01-17-2013 |
| 20130016476 | APPARATUS FOR AND METHOD OF COOLING MOLDED ELECTRONIC CIRCUITS - An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally conductive mass that is thermally coupled to both the heat generating components and to the power supply leads. When the power supply leads are coupled to receive electricity from the external power supply circuit, heat generated by the device is thermally conducted into the external power supply circuit via the power supply leads. | 01-17-2013 |
| 20130094147 | STAND FOR DISPLAY DEVICE AND DISPLAY DEVICE INCLUDING THE SAME - A display device is disclosed. The disclosed display device has an excellent appearance through prevention of outward exposure of wirings. The display device is also configured to easily outwardly dissipate heat generated from various electronic elements included in the display device. | 04-18-2013 |
| 20130107461 | FIXING MECHANISM AND RELATED ELECTRONIC DEVICE | 05-02-2013 |
| 20130120938 | Modular Monitor Enclosed In A Housing With A Novel Rear Panel - A monitor has a rear panel formed by injection molding plastic around a metal cooling element. The monitor includes a display panel, control electronics, a module support, and a monitor housing. The housing includes a front frame, the cooling element and a rear panel frame. The cooling element has cooling ducts formed between cooling fins. The rear housing panel frame has fin extensions that extend the fins of the cooling element into the rear housing panel frame. The display panel attaches to one side of the module support, while the control electronics attach to the other side. The front frame and the rear panel frame screw together, and the display panel and control electronics are clamped between the front frame and the rear panel frame. The monitor can be attached to a vehicle by slipping a retaining member into a T-shaped duct formed between two fins on the cooling element. | 05-16-2013 |
| 20130141870 | INTERNAL FRAME OPTIMIZED FOR STIFFNESS AND HEAT TRANSFER - A thin portable electronic device with a display is described. The components of the electronic device can be arranged in stacked layers within an external housing where each of the stacked layers is located at a different height relative to the thickness of the device. One of the stacked layers can be internal metal frame. The internal metal frame can be configured to act as a heat spreader for heat generating components located in layers adjacent to the internal frame. Further, the internal metal frame can be configured to add to the overall structural stiffness of the device. In addition, the internal metal frame can be configured to provide attachment points for device components, such as the display, so that the device components can be coupled to the external housing via the internal metal frame. | 06-06-2013 |
| 20130155619 | ELECTRONIC CONTROL UNIT FOR THE MOTOR OF AN ELECTRIC FAN - An electronic control unit for a motor of an electric fan, has a support casing including a metal body adapted to act as a heat dissipator, a shell of an electrically insulating material coupled with the metal body, and a circuit board, mounted in contact with the dissipator body. The circuit board has a conductive connection member in the form of a flexible metal blade, electrically connected to the dissipator body, to provide an earth connection for the circuit board. The blade has a portion that projects beyond the edge of the board. The insulating shell has an internal formation which, upon coupling the shell with the dissipator body, interacts with the projecting portion of the blade, deforming it so as to bring it and thereafter maintain it in contact with the dissipator body in a resiliently loaded manner. | 06-20-2013 |
| 20130176682 | POWER ELECTRONIC SYSTEM WITH A COOLING DEVICE - A power electronic system with a cooling device, and a method for producing the system, comprising a plurality of submodules, each submodule having a first planar insulating material body, one first conductor track cohesively connected thereto, one power switch arranged on the conductor track, at least one internal connecting device composed of an alternate layer sequence of at least one electrically conductive film and at least one electrically insulating film, wherein at least one electrically conductive layer forms at least one second conductor track, and comprising external connection elements. In this case, the submodules are arranged cohesively or in a force-locking manner and in a manner spaced apart from one another with their first main surface on the cooling device. At least one second conductor track at least partially covers first conductor tracks of two submodules, electrically connects them to one another and covers an interspace between the submodules. | 07-11-2013 |
| 20130182390 | THERMALLY CONDUCTIVE FLEXIBLE MEMBER FOR HEAT TRANSFER - An example embodiment includes a thermal conduction system for dissipating thermal energy generated by operation of an optical subassembly that disposed within a shell of a communication module. The thermal conduction system can include a thermally conductive flexible member that contacts the optical subassembly and to contact the shell of the communication module. By contacting the optical subassembly and the shell, the thermal energy generated by operation of the optical subassembly can transfer from the optical subassembly to the shell. The thermally conductive flexible member defines thermally conductive flexible member holes that correspond to pins extending from the optical subassembly. The pins pass through the thermally conductive flexible member holes enabling the thermally conductive flexible member to contact the optical subassembly. | 07-18-2013 |
| 20130182391 | Rotatable Latch For Compressing Thermal Interface Material Between A Heat Generating Electrical Component And A Cooling Electrical Component - Apparatuses for compressing a thermal interface material between a heat generating electrical component and a cooling electrical component are provided. Embodiments include a draw rod coupled at one end to the cooling electrical component, the draw rod passing through the heat generating electrical component; wherein the draw rod includes a pin on the end opposite the end coupled to the cooling electrical component; and a rotatable latch coupled to the heat generating electrical component, the rotatable latch including a hook at one end; wherein when the rotatable latch is in an engaged position, the hook of the rotatable latch engages the pin of the draw rod such that the thermal interface material adhered to the heat generating component is coupled to the cooling electrical component. | 07-18-2013 |
| 20130194751 | CONTROLLING HEAT TRANSFER USING AIRFLOW-INDUCED FLUTTER OF CANTILEVERED ELASTIC PLATES - A capability for controlling heat transfer using airflow-induced fluttering of a cantilevered elastic plate is presented. A mounting structure is configured to be coupled to a surface of an element having a heat generating component coupled thereto. An elastic place is coupled to the mounting structure so as to arrange the elastic plate in a cantilevered position with respect to the surface of the element and at a position above the surface of the element when the mounting structure is coupled to the surface of the element. The elastic plate is configured to flutter, in response to air flow incident on the elastic plate, in a manner tending to disrupt the boundary layer region. The elastic plate may be arranged at a position that is selected based on a determined location of the boundary layer region. | 08-01-2013 |
| 20130223013 | DISPLAY DEVICE - A display device is disclosed. In one embodiment, the device includes a display panel, a printed circuit board (PCB) disposed opposite to a rear of the display panel, and supplying a driving signal to the display panel, and a substrate bracket attached to an edge of the rear of the display panel, and supporting the PCB. The substrate bracket includes a bracket main body portion facing the PCB, a bracket coupling ledge bent and extending from a top of the bracket main body portion and enclosing a top of the PCB, and a bracket hook portion protruding from a bottom of the bracket main body portion in a direction toward the PCB, and supporting a bottom of the PCB. | 08-29-2013 |
| 20130250520 | ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC APPARATUS USING THE SAME - An electronic component mounting package includes a first base including an upper surface and a first through-hole vertically formed; a second base having a second through-hole arranged to be overlapped with the first through-hole in a plan view; a sealing material filling the second through-hole; and a signal terminal that is fixed to the second base to pass through the sealing material and has an upper end portion that protrudes upwardly from the upper surface of the first base. The first base includes a plurality of first metal members and a second metal member, and the second metal member is vertically interposed between the plurality of first metal members. A thermal expansion coefficient of the first metal members is larger than a thermal expansion coefficient of the second base. A thermal conductivity of the second metal member is higher than a thermal conductivity of the first metal members. | 09-26-2013 |
| 20130265722 | ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONIC DEVICES - According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing. In an exemplary embodiment, a thermally-conductive structure which comprises graphite may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally-conductive structure which comprises graphite. | 10-10-2013 |
| 20130286592 | ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS - A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body. | 10-31-2013 |
| 20130286593 | ULTRASONIC PROBE - An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside. | 10-31-2013 |
| 20130301221 | THERMAL MANAGEMENT SYSTEM AND METHOD BETWEEN HEAT GENERATING CHIP AND HOUSING IN ELECTRONIC APPARATUS - The present invention relates to a thermal management system and method between a heat generating chip and a housing in an electronic apparatus. The system comprises: a housing; a heat generating chip arranged in the housing, wherein an air gap between the heat generating chip and adjacent portion of the housing is not less than 5 mm, and the dominant heat transfer mode is radiation; a heat insulation layer filled in the air gap between the heat generating chip and the housing, wherein the heat insulation layer is in contact with the heat generating chip, the heat insulation layer has an area no less than that of the heat generating chip, and the heat insulation layer has a thermal conductivity not smaller than that of air. | 11-14-2013 |
| 20130329368 | FASTENERS AND DUAL-THICKNESS THERMAL STAGES IN ELECTRONIC DEVICES - The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component in the electronic device. The system also includes a thermal stage disposed along a thermal interface between the heat-generating component and the heat pipe, wherein the thermal stage applies a spring force between the heat-generating component and the heat pipe. The thermal stage includes a first thickness to accommodate the heat pipe and a second thickness that is greater than the first thickness to increase a spring force between the heat-generating component and the heat pipe. Finally, the system includes a set of fasteners configured to fasten the thermal stage to a surface within the electronic device and form a thermal gap between the heat pipe and an enclosure of the electronic device. | 12-12-2013 |
| 20140009890 | ELECTRONIC COMPONENT BOX FOR VEHICLE - Provided is an electronic component box for a vehicle. The electronic component box for a vehicle, the electronic component box including a housing formed of a plastic material and manufactured through plastic injection molding, the housing having an opened top surface, a top cover formed of a plastic material and manufactured through the plastic injection molding, the top cover covering the opened top surface of the housing, a base cover seated on a bottom surface of the housing, an electronic component set seated on a top surface of the base cover, and a plated layer disposed on an inner circumferential surface of the housing and a back surface of the top cover to shield an electromagnetic wave. | 01-09-2014 |
| 20140022731 | METHOD FOR ASSEMBLING HEAT GENERATING ELEMENT AND HEAT DISSIPATING ELEMENT, PRESSURE SENSITIVE ELEMENT, AND POWER SUPPLYING UNIT - A method for assembling a heat generating element and a heat dissipating element includes: preparing a pressure sensitive element including a pressure sensitive layer and first and second release films connected to the pressure sensitive layer; separating the second release film from the pressure sensitive layer and then adhering a heat dissipating element to the pressure sensitive layer; forcing the first release film; separating the first release film from the pressure sensitive layer, and then adhering a heat generating element to the pressure sensitive layer; and fixedly attaching the heat generating element onto the pressure sensitive layer. A pressure sensitive element and a power supplying unit are also disclosed. | 01-23-2014 |
| 20140029201 | POWER PACKAGE MODULE AND MANUFACTURING METHOD THEREOF - There is provided a power package module, including: a lead frame; at least one first electronic component mounted on the lead frame; and an insulating member disposed on a first surface of the first electronic component and having a via electrode connected to the first electronic component. | 01-30-2014 |
| 20140029202 | MOTOR CONTROLLER - A motor controller, including: a control box ( | 01-30-2014 |
| 20140118947 | ENVIRONMENTAL SENSITIVE ELECTRONIC DEVICE PACKAGE - An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, at least one first side wall barrier structure, at least one thermal protrusion, and a first filler layer is provided. The second substrate is disposed above the first substrate. The environmental sensitive electronic device is disposed on the first substrate and located between the first substrate and the second substrate. The first side wall barrier structure is disposed on the second substrate and located between the first substrate and the second substrate, wherein the first side wall barrier structure is located on at least one side of the environmental sensitive electronic device. The thermal protrusion is located on the second substrate. The first filler layer is located between the first substrate and the second substrate and covers the environmental sensitive electronic device, the first side wall barrier structure, and the thermal protrusion. | 05-01-2014 |
| 20140126153 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, semiconductor memory device is capable of operating at a first mode and a second mode which is higher in speed than the first mode. The semiconductor memory device comprising: a semiconductor memory; a controller which controls the semiconductor memory; a connector which is provided with terminals for sending and receiving data to and from an external device; and a substrate on which the semiconductor memory, the controller, and the connector are mounted, the substrate comprising a plurality of wiring layers. The controller and the connector are mounted on an identical surface of the substrate. The substrate comprises a wiring which connects a mounting pad for the terminal for data transfer at the second mode of the connector and a mounting pad for a pin for data transfer at the second mode of the controller to each other on the wiring layer on a mounting surface for the connector and the controller. | 05-08-2014 |
| 20140160682 | ELECTRONIC COMPONENT AND FABRICATION PROCESS OF THIS ELECTRONIC COMPONENT - An electronic component comprising a substrate extending in a plane, having electrical connections to connect the component to a circuit, and having an upper face; an electronic chip arranged on the upper face or inside the substrate and connected to the connections via the substrate, a thick insulating layer forming a package and covering the upper face or at least part of the chip, and having an outer face parallel to the plane; a cavity inside the thick layer, the cavity having a bottom parallel to the plane and a side extending from the bottom to the outer face, the cavity having heat-absorbing material inside that is different from the material forming the thick layer. The heat-absorbing material has a specific heat capacity greater than 1 kJKg | 06-12-2014 |
| 20140185242 | POWER SEMICONDUCTOR MODULE - There is provided a power semiconductor module in which power semiconductor elements, integration of which may be difficult due to heating, are modularized. The power semiconductor module includes: a heat dissipation substrate electrically connected to a common connection terminal; and a plurality of electronic elements disposed on the heat dissipation substrate, wherein the electronic elements have varying spaces therebetween. | 07-03-2014 |
| 20140218869 | HEAT RADIATION STRUCTURE OF ELECTRIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A heat radiation structure for an electric device includes: at least one multi-layer substrate including a plurality of base parts made of insulation material and a conductor pattern, which are stacked in a multi-layer structure so that the conductor pattern is electrically coupled with an interlayer connection portion in the base parts; the electric device having at least one of a first electric element built in the at least one multi-layer substrate and a second electric element, which is not built in the multi-layer substrate; and a low heat resistance element opposed to the electric device. The low heat resistance element has a heat resistance lower than the insulation material. | 08-07-2014 |
| 20140240926 | WINDOW MEMBER AND DISPLAY APPARATUS HAVING THE SAME - A window member includes a base substrate that includes a display area transmitting a light and a non-display area disposed adjacent to the display area, a color pattern disposed on a surface of the base substrate in the non-display area, and a heat-discharge member that covers the color pattern and absorbs a heat to discharge the heat to an outside. | 08-28-2014 |
| 20140240927 | ELECTRONIC MODULE - The invention relates to an electronic module comprising at least one electronic or electric component ( | 08-28-2014 |
| 20140247561 | PRINTED WIRING BOARD - A printed wiring board includes a first resin insulation layer, a second resin insulation layer formed on the first insulation layer and having an opening portion, a mounting conductive layer formed on the first resin insulation layer in the opening portion of the second resin insulation layer such that the mounting conductive layer has a surface exposed by the opening portion, an electronic component positioned in the opening portion of the second resin insulation layer such that the electronic component is mounted on the surface of the mounting conductive layer, and a heat-dissipating via conductor formed in the first resin insulation layer such that the heat-dissipating via conductor is connected to the mounting conductive layer formed on the first resin insulation layer. | 09-04-2014 |
| 20140268573 | MANAGEMENT OF EXTERIOR TEMPERATURES ENCOUNTERED BY USER OF A PORTABLE ELECTRONIC DEVICE IN RESPONSE TO AN INFERRED USER CONTACT WITH THE PORTABLE ELECTRONIC DEVICE - Described embodiments include a portable electronic device. The device includes a shell housing components of the portable electronic device having a heat-generating component. The device includes a heat-rejection element located at an exterior surface of the shell. The heat-rejection element is configured to reject heat received from the heat-generating component into an environment in thermal contact with the heat-rejection element. The device includes a controllable thermal coupler configured to regulate heat transfer to the heat-rejection element. The device includes an activity monitor configured to infer a user touch to the shell in response to a detected activity of the portable electronic device. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the heat-rejection element in response to the inferred user touch. | 09-18-2014 |
| 20140285972 | HOUSING AND POWER MODULE HAVING THE SAME - There are provided a housing capable of evenly distributing stress generated at the time of assembly thereof and a power module having the same. The housing for a power module according to an embodiment of the invention includes: a body part having a space formed therein, the space receiving a module substrate having electronic devices mounted thereon; a plurality of fastening parts protruded from sides of the body part; and a fastening member having a leaf spring form and having both ends coupled to two of the fastening parts, respectively, wherein the fastening member includes: a coupling portion coupled to a fixing member; and elastic portions extending from both edges of the coupling portion to be coupled to the fastening parts and elastically deformed when the coupling portion is fastened to a heat radiating substrate to provide elastic force to the fastening parts. | 09-25-2014 |
| 20140362533 | ELECTRONIC CONTROL APPARATUS FOR VEHICLE - The present disclosure relates to an electronic control apparatus into which an printed circuit board is inserted in a sliding manner, and the electronic control apparatus of the present disclosure includes: an printed circuit board (PCB) and has one surface on which a heating element is mounted, and a corresponding surface on which a heat radiating material is applied; a connector cover which includes a connector electrically connected and coupled to the electronic circuit board, and a cover coupling portion for coupling a housing; and a housing body to which the PCB is tightly attached and assembled in a sliding manner, in which one or more projections are formed on both side surfaces in the housing body, one or more grooves are formed in both side surfaces of the electronic circuit board, the PCB is inserted and guided into the housing body in a sliding manner. | 12-11-2014 |
| 20140362534 | ELECTRONIC CONTROL APPARATUS FOR VEHICLE USING SLOPED STRUCTURE AND METHOD THEREOF - The present disclosure relates to an electronic control apparatus for a vehicle using a sloped structure, and a manufacturing method thereof, in which an appropriate space is maintained with a housing body in order to maintain thermal glue applied onto the PCB when assembling an electronic control apparatus in a sliding manner, and the PCB is assembled by making the PCB be in contact with an upper housing body along a sloped structure formed in a distal end housing at a point at which the slide type assembling is ended, so that the thermal glue may be uniformly applied onto the PCB and be maintained during a slide type manufacturing process. | 12-11-2014 |
| 20140362535 | TRANSMISSION CONTROL MODULE - A transmission control module includes a printed circuit board. The circuit board has conductor tracks routed on at least one layer of the circuit board and configured to electrically connect a carrier substrate to electrical components. The circuit board has an inner conductor track layer arranged between two insulating layers. A first outer insulating layer, at least on a first side of the circuit board, has a recess. Surfaces of conductor track sections of conductor tracks of the at least one inner conductor track layer are arranged at the bottom of the recess. The carrier substrate is inserted into the recess and makes electrical contact with the surfaces of the conductor track sections. The recess is filled with a moulding compound which covers at least the carrier substrate and the conductor track sections to protect the carrier substrate and the conductor track sections from transmission fluid. | 12-11-2014 |
| 20150009628 | DISPLAY APPARATUS - A display apparatus includes: a substrate; a display panel on the substrate; and a sealing substrate opposite to the display panel. The display apparatus includes further includes a heat dissipating layer which is between the display panel and the sealing substrate and dissipates heat generated from the display panel; and a sealing portion which is between the substrate and the sealing substrate and surrounds the display panel. | 01-08-2015 |
| 20150124408 | MANAGEMENT OF EXTERIOR TEMPERATURES ENCOUNTERED BY USER OF A PORTABLE ELECTRONIC DEVICE IN RESPONSE TO AN INFERRED USER CONTACT WITH THE PORTABLE ELECTRONIC DEVICE - Described embodiments include a portable electronic device. The device includes a shell housing components of the portable electronic device having a heat-generating component. The device includes a heat-rejection element located at an exterior surface of the shell. The heat-rejection element is configured to reject heat received from the heat-generating component into an environment in thermal contact with the heat-rejection element. The device includes a controllable thermal coupler configured to regulate heat transfer to the heat-rejection element. The device includes an activity monitor configured to infer a user touch to the shell in response to a detected activity of the portable electronic device. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the heat-rejection element in response to the inferred user touch. | 05-07-2015 |
| 20150131230 | MODULE IC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A module IC package structure for increasing heat-dissipating efficiency includes a substrate unit, an electronic unit, a package unit, a first heat-dissipating unit and a second heat-dissipating unit. The substrate unit includes a circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate for enclosing the electronic components. The first heat-dissipating unit includes a heat-dissipating base layer disposed on the top surface of the package gel body. The second heat-dissipating unit includes a plurality of heat-dissipating auxiliary layers disposed on the top surface of the heat-dissipating base layer. Whereby, the heat-dissipating efficiency of the module IC package structure can be increased by matching the heat-dissipating base layer and the heat-dissipating auxiliary layers. | 05-14-2015 |
| 20150131231 | ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF - There are provided an electronic component module allowing for a circuit wiring to be disposed outside of a molded part by a plating process, and a manufacturing method thereof, the electronic component module including a substrate; at least one electronic component mounted on the substrate; a molded part sealing the electronic component; a plurality of conductive connectors having one ends bonded to the substrate or one surface of the electronic component and formed in the molded part to penetrate through the molded part; and at least one plane pattern formed on an outer surface of the molded part and electrically connected to at least one of the conductive connectors. | 05-14-2015 |
| 20150131232 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE CONNECTION STRUCTURE - In a semiconductor device, heat radiation plates are respectively disposed on a front surface side and a rear surface side of semiconductor chips in an upper arm and a lower arm. A lead-out conductor part includes a parallel conductor that includes a positive electrode terminal, a negative electrode terminal, and an insulating film disposed between the positive electrode terminal and the negative electrode terminal, and the positive electrode terminal and the negative electrode terminal are disposed oppositely while sandwiching the insulation film. The semiconductor chips are covered by a resin mold part, surfaces of the heat radiation plates opposite to the semiconductor chips, a part of the positive electrode terminal, and a part of the negative electrode terminal are exposed from the resin mold part, and at least a part of the parallel conductor in the lead-out conductor part enters the resin mold part. | 05-14-2015 |
| 20150146377 | POWER CONVERSION DEVICE AND METHOD FOR ASSEMBLING THE SAME - A method for assembling a power conversion device is provided. The method includes mounting an electronic component on a heat-dissipating base, and electrically connecting a printed wiring board with the electronic component mounted on the heat-dissipating base. | 05-28-2015 |
| 20150146378 | HEAT-DISSIPATING BASE AND ELECTRONIC DEVICE - A heat-dissipating base is provided. The heat-dissipating base includes a main body and at least one first protrusion. The first protrusion is disposed on the main body. The first protrusion has at least one first protrusion top surface for thermally contacting at least one first component above the main body. | 05-28-2015 |
| 20150146379 | Circuit Board With Ceramic Inlays - A circuit board includes a plurality of conductive track levels disposed one above the other and insulation layers arranged between each of two adjacent conductive track levels. The circuit board includes a thermally conductive element, which includes ceramic, disposed between a first external insulation layer and a second external insulation layer. | 05-28-2015 |
| 20150305189 | THERMAL INTERFACE MATERIAL ASSEMBLIES AND RELATED METHODS - Example embodiments of the present disclosure generally relate to thermal interface material assemblies. In an example embodiment, a thermal interface material assembly generally includes a substrate and one or more pillars along a first and/or second side portion of the substrate. | 10-22-2015 |
| 20150319841 | WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, AND ELECTRONIC DEVICE - A wiring board includes a heat dissipation plate, a heat-conductive adhesive layer, an insulating layer, a thermal via, a heat dissipation metal terminal, and electrodes. The heat-conductive adhesive layer is disposed on the heat dissipation plate. The insulating layer is disposed on the heat-conductive adhesive layer. The insulating layer is formed with an opening portion. The thermal via is disposed in the opening portion of the insulating layer. The heat dissipation metal terminal is disposed on the thermal via and electrically connected to the heat dissipation plate. The electrodes are disposed on the insulating layer. The electrodes are to be connected to an electronic component. | 11-05-2015 |
| 20150319842 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A circuit substrate includes an insulating layer, circuit layers including a first layer on first surface side of the insulating layer and a second layer on second surface side of the insulating layer, conductor heat transfer layers including a first transfer layer on the first side of the insulating layer and a second transfer layer on the second side of the insulating layer, through hole electrical conductors filling first through holes penetrating through the insulating layer such that the electrical conductors connect the first and second layers, and a through hole thermal conductor filling a second through hole penetrating through the insulating layer such that the thermal conductor connects the first and second transfer layers. The second hole is positioned between two or more of the first holes and has a shape extending in direction that intersects direction connecting the two or more of the first holes. | 11-05-2015 |
| 20150342090 | Connector, Connector Assembly and Apparatus - A connector assembly is provided and includes a circuit board, an elastic connector, a cage, and a heat exchanger. The circuit board includes a heat exchanger opening passing there through. The elastic connector is positioned about the heat exchanger opening. The cage includes a bottom cage with a cage opening facing a first surface of the circuit board. The heat exchanger is positioned on the bottom cage, such that one side of the heat exchanger passes through the cage opening to protrude inside the cage and an opposite side of the heat exchanger passes through the heat exchanger opening to protrude from a second surface of the circuit board opposite to the first surface. | 11-26-2015 |
| 20150351217 | HEAT DISSIPATION STRUCTURE - A heat dissipation structure including: (A) a printed circuit board; (B) a heat-generating element; (C) an electromagnetic shielding case; (D) a rubbery, thermally conductive resin layer with a tensile elastic modulus of 50 MPa or lower and a thermal conductivity of 0.5 W/mK or higher; and (E) a thermally non-conductive layer with a thermal conductivity of lower than 0.5 W/mK, the heat-generating element (B) being placed on the printed circuit board (A), the heat-generating element (B) and the thermally conductive resin layer (D) being in contact with each other, the thermally non-conductive layer (E) being provided between the heat-generating element (B) and the electromagnetic shielding case (C). | 12-03-2015 |
| 20160037621 | ELECTRONIC ASSEMBLY WITH FRAME FOR THERMAL DISSIPATION - An electronic assembly comprises a first circuit board with a first substrate having an inner side and an outer side opposite the inner side. A plurality of primary components are mounted on the inner side of the first circuit board. A frame (e.g., or heat-sinking spacer) is secured to the first circuit board. A second circuit board comprises a second substrate having an inner side and an outer side opposite the first side. The second circuit board is secured to the frame and separated from the first circuit board in at least one spatial dimension. At least one secondary component is mounted on the second circuit board. A first housing section is adapted for mating with a second housing section. The first housing section and the second housing section collectively enclose the first circuit board and the second circuit board. | 02-04-2016 |
| 20160064131 | HEAT DISSIPATION DEVICE - A heat dissipation device is applied to an electronic device and comprises a heat conduction plate, at least an induction coil and a first heat dissipation plate. The heat conduction plate receives the heat provided by a heat source and includes a first contact element disposed on a first surface of the heat conduction plate. The induction coil is disposed at the heat conduction plate. The first heat dissipation plate is disposed at the first contact element of the heat conduction plate. The first heat dissipation plate and the heat conduction plate form a gap. The first heat dissipation plate includes at least a first magnetic element disposed opposite the induction coil. | 03-03-2016 |
| 20160064301 | SEMICONDUCTOR DEVICE - One semiconductor device includes a wiring board, a semiconductor chip, and an encapsulation body. The wiring board includes an insulating base, a conductive pattern that is formed on one surface of the insulating base, and a heat dissipation via that is connected to the conductive pattern. The heat dissipation via is provided so as to penetrate through the insulating base from one surface to the other surface, while being exposed from the lateral side of the insulating base. The semiconductor chip is mounted on the wiring board so as to overlap the conductive pattern. The encapsulation body is formed on the wiring board so as to cover the semiconductor chip. | 03-03-2016 |
| 20160095213 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor element and a ceramic circuit substrate on which the semiconductor element is mounted. The ceramic circuit substrate includes a ceramic substrate having one surface and the other surface facing each other, a metal circuit board joined to the one surface of the ceramic substrate and electrically connected to the semiconductor element, and a metal heat-dissipation plate joined to the other surface of the ceramic substrate. The metal circuit board is greater in thickness than the metal heat-dissipation plate. A surface of the metal heat-dissipation plate on a side opposite to the ceramic substrate is larger in area than a surface of the metal circuit board on a side opposite to the ceramic substrate. Thereby, a semiconductor device capable of suppressing warpage of the ceramic substrate can be achieved. | 03-31-2016 |
| 20160095249 | PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE HAVING THE SAME - Disclosed are a printed circuit board and an electronic component package having the printed circuit board, which includes: a base board; a heat-dissipating pad formed on the based board and having an electronic component installed thereon; and a bridging pad formed on the base board between the heat-dissipating pad and a shield can installed on the base board so as to allow heat generated by the electronic component to be transferred from the heat-dissipating pad to the shield can. | 03-31-2016 |
| 20160100508 | DISPLAY APPARATUS - A display apparatus includes a display panel, and a heat-radiating sheet located on a non-display surface of the display panel, wherein the heat-radiating sheet includes a first heat-radiating sheet in a central portion of the display panel, and a second heat-radiating sheet in edge portions of the display panel, and locations (heights) of the first heat-radiating sheet and the second heat-radiating sheet in a vertical direction are different from each other. | 04-07-2016 |
| 20160101807 | RECEPTACLE FOR A CONTROL CIRCUIT THAT CONTROLS AN ELECTRIC MOTOR FOR POWER ASSISTANCE IN A VEHICLE STEERING SYSTEM - Disclosed is a receptacle for a control circuit that controls an electric motor for power assistance in a vehicle steering system. The receptacle includes a housing for holding the control circuit, wherein the housing has an opening to allow insertion of the control circuit into the housing, and a baseplate for dust-tight closure of the opening of the housing in an end position, wherein the baseplate and the housing can be connected to one another in a dust-tight fashion in a delivery position which is different from the end position. | 04-14-2016 |
| 20160105949 | PRINTED CIRCUIT BOARD AND DISPLAY DEVICE - A printed circuit board and a display device are provided. The printed circuit board comprises a substrate, a package chip, and a metal heat dissipation layer. The package chip is disposed on a first surface of the substrate and comprises a chip body. The metal heat dissipation layer is disposed on a second surface of the substrate. A projection of the metal heat dissipation layer on the first surface of the substrate covers the chip body. The metal heat dissipation layer of the present invention is disposed on the reverse side of the printed circuit board to reduce the temperature of the package chip. | 04-14-2016 |
| 20160105992 | APPARATUS FOR COOLING AND MOUNTING A CIRCUIT BOARD - An apparatus is provided that includes a housing for an electronic device. The housing includes a plurality of side walls and a removable exterior housing panel. A circuit board is mechanically attached to a first side of the panel, which faces an interior of the housing when the panel is secured to the plurality of side walls. The panel is made from a heat-conductive material to conduct heat from the circuit board to the panel and exterior environment. | 04-14-2016 |
| 20160106010 | BOX-TYPE VEHICLE-MOUNTED CONTROL DEVICE - Provided is a box-type vehicle-mounted control device that effectively increases the amount of heat transfer from electronic components and a circuit board to a casing (base and cover) and that accordingly has achieved excellent heat dissipation property. | 04-14-2016 |
| 20160109670 | Optical Module Heat Dissipation Structure and Electronic Product - An optical module heat dissipation structure, disposed inside an enclosure, where the optical module heat dissipation structure includes an optical module, an elastic component, a fixed wall, and a heat dissipation wall, where the fixed wall and the heat dissipation wall are both connected to the enclosure, the optical module is disposed between the fixed wall and the heat dissipation wall, the elastic component elastically abuts between the fixed wall and the optical module, and elasticity of the elastic component makes the optical module tightly cling to the heat dissipation wall, to improve the heat dissipation efficiency of the optical module heat dissipation structure. An electronic product is further provided where the electronic product includes the optical module heat dissipation structure. | 04-21-2016 |
| 20160149512 | Power Module, Power Converter Device, and Electrically Powered Vehicle - A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module. | 05-26-2016 |
| 20160150674 | MANAGEMENT OF EXTERIOR TEMPERATURES ENCOUNTERED BY USER OF A PORTABLE ELECTRONIC DEVICE - Described embodiments include a portable electronic device. The device includes a shell housing components of the portable electronic device having a heat-generating component. The device includes a heat-rejection element located at an exterior surface of the shell. The heat-rejection element is configured to reject heat received from the heat-generating component into an environment in thermal contact with the heat-rejection element. The device includes a controllable thermal coupler configured to regulate heat transfer to the heat-rejection element. The device includes a proximity sensor configured to determine a location of a user touch to the shell relative to the location of the heat-rejection element. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the heat-rejection element in response to the determined location of the user touch relative to the location of the heat-rejection element. | 05-26-2016 |
| 20160183404 | Heat Transferring Electronics Chassis | 06-23-2016 |
| 20180027645 | SUBSTRATE UNIT | 01-25-2018 |
| 20180027671 | DISPLAY DEVICE | 01-25-2018 |
