Class / Patent application number | Description | Number of patent applications / Date published |
338020000 |
Current and/or voltage (e.g., ballast resistor)
| 206 |
338047000 |
Force-actuated
| 17 |
338025000 |
Ambient temperature
| 15 |
338032000 |
Magnetic field or compass (e.g., Hall effect type)
| 6 |
338036000 |
Fluid- or gas pressure-actuated | 3 |
20080204185 | PRESSURE SENSOR - A diaphragm is formed at a predetermined location of a sensor chip made of semiconductor material, and a sensor gauge for differential pressure or pressure sensing-use is provided on the sensor chip that includes at least the diaphragm. The sensor gauge has a plurality of sensor gauges synergistically forming a bridge circuit, and are connected to one another with semiconductor resistors, the semiconductor resistors and the sensor gauges are covered with an insulating film, and the number of contact holes, passing through a portion of the insulating film, for electrode line-out use for forming contacts electrically connected to the semiconductor resistors does not exceed the number of sensor gauges. | 08-28-2008 |
20090051479 | FLUID PRESSURE SENSOR PACKAGE - A fluid pressure sensor package can be easily assembled to have different types of probe tubes depending upon different application environments. The sensor package includes a sealed casing accommodating a sensor chip for sensing a pressure of a fluid introduced into the casing. A probe tube extends from the casing for introducing the fluid into contact with the sensor chip. The casing has a top opening, and has a side wall formed on its interior surface with a stepped shoulder for bearing a flange at the lower end of the probe tube. The flange is sealingly bonded to the sidewall of the casing by a sealer. Since the probe tube is prepared as a separate member from the casing, the casing can be a common base for various probe tubes having fluid channels of different lengths or diameters. | 02-26-2009 |
20100073123 | MINIATURE PRESSURE TRANSDUCER - A miniature pressure transducer is disclosed which is able to operate at high temperatures. The pressure transducer is provided on a substrate comprising an elongate silicon base portion with one or more contact areas formed at one end and a diaphragm formed at the opposite distal end. A plurality of piezoresistive elements are provided on the diaphragm, preferably in a Wheatstone Bridge arrangement, and connected to the contact areas using interconnects. The diaphragm extends across substantially the entire effective width of the elongate base portion providing a compact width whilst still maintaining a sensitive pressure sensing capability. | 03-25-2010 |
338015000 |
Photoconductive (e.g., light sensitive) | 3 |
20130002394 | BOLOMETER AND METHOD OF MANUFACTURING THE SAME - A polymer film | 01-03-2013 |
20130342306 | COMPACT OPTICAL TRANSCONDUCTANCE VARISTOR - A compact radiation-modulated transconductance varistor device having both a radiation source and a photoconductive wide bandgap semiconductor material (PWBSM) integrally formed on a substrate so that a single interface is formed between the radiation source and PWBSM for transmitting PWBSM activation radiation directly from the radiation source to the PWBSM. | 12-26-2013 |
20140218161 | PHOTORESISTOR - A photoresistor includes a first electrode layer, a photosensitive material layer, and a second electrode layer. The first electrode layer, photosensitive material layer and second electrode layer are stacked with each other. The first electrode layer is located on a first surface of the photosensitive material layer. The second electrode layer is located on a second surface of the photosensitive material layer. The first surface and second surface of the photosensitive material layer are opposite to each other. The first electrode layer includes a carbon nanotube film structure. | 08-07-2014 |
338034000 |
Gas, vapor, or moisture absorbing or collecting | 2 |
20090066472 | GAS SENSOR, AIR-FUEL RATIO CONTROLLER, AND TRANSPORTATION APPARATUS - A resistance-type gas sensor includes a gas detection section including an oxide semiconductor layer. The oxide semiconductor layer includes cerium ions and zirconium ions. An amount of substance of zirconium ions relative to a sum of amounts of substance of cerium ions and zirconium ions contained in the oxide semiconductor layer is no less than about 45% and no more than about 60%, and the oxide semiconductor layer has a crystal phase containing about 80 vol % or more of cubic crystals. | 03-12-2009 |
20090201120 | Aligned particle based sensor elements - The present invention relates to a sensor array for detecting an analyte in a fluid, comprising first and second sensors formed by chemically sensitive resistors, wherein the first sensor comprises a region of aligned conductive material; or where each of the sensors comprises alternating regions of nonconductive regions and aligned conductive regions with each resistor providing an electrical path through both the nonconductive region and the aligned conductive region, while each sensor manifests a different electrical resistance during contact with sample fluids having different analyte concentrations via the monitoring arrangement of having the sensors electrically connected to an electrical measuring apparatus. The aligned conductive particle material is aligned by exposure to either of an electric, magnetic, optical, photo-electric, electromagnetic or mechanical field, which serves to improve signal to noise ratio of vapor sensors allowing Lower Detection Limits for vapors being sensed. Such Lower Detection Limits allow for identification of lower concentrations of hazardous material and is advantageous in medical applications, such as detection of disease states in a patient. | 08-13-2009 |
338033000 |
Float actuator | 2 |
20080231411 | RESISTANCE PLATE AND LIQUID LEVEL DETECTION APPARATUS PROVIDED WITH SAID RESISTANCE PLATE - In a resistance plate, a first slide portion includes a plurality of first conductive segments arranged at intervals generally in a direction of sliding movement of a sliding arm, the adjacent first conductive segments being connected together via a resistor. A first conducting path | 09-25-2008 |
20150357098 | FUEL SENDER DEVICE FOR VEHICLE - A fuel sender device for a vehicle may include a resistance substrate having a conductor part, a contact plate having a contact point contacting the conductor part, and a float unit moving up and down according to a variation of an oil surface and angularly rotating the contact plate, wherein the fuel sender device includes a variable contact point that allows the contact plate to variably contact the conductor part while moving up and down and rotating according to the variation of the oil surface. | 12-10-2015 |
338014000 |
Plural conditions | 1 |
20160064124 | ELECTRONIC COMPONENT - An electronic component in which a metal layer is unlikely to be peeled from a substrate includes an insulating ceramic substrate, a ceramic layer diffusion-bonded to the substrate, a metal layer including a first principal surface and a second principal surface opposed to the first principal surface, with the first principal surface diffusion-bonded to the ceramic layer, and a characteristic layer diffusion-bonded to the second principal surface of the metal layer and prepared from a ceramic material, wherein the characteristic layer varies in resistance value with respect to ambient temperature or applied voltage. | 03-03-2016 |
Entries |
Document | Title | Date |
20100245029 | CARBON-BASED FILMS, AND METHODS OF FORMING THE SAME, HAVING DIELECTRIC FILLER MATERIAL AND EXHIBITING REDUCED THERMAL RESISTANCE - Methods in accordance with aspects of this invention form microelectronic structures in accordance with other aspects this invention, such as non-volatile memories, that include (1) a bottom electrode, (2) a resistivity-switchable layer disposed above and in contact with the bottom electrode, and (3) a top electrode disposed above and in contact with the resistivity-switchable layer; wherein the resistivity-switchable layer includes a carbon-based material and a dielectric filler material. Numerous additional aspects are provided. | 09-30-2010 |
20100301988 | Breakdown Layer via Lateral Diffusion - An electronic device including a breakdown layer having variable thickness. The device includes a variable resistance material positioned between two electrodes. A breakdown layer is interposed between the variable resistance material and one of the electrodes. The breakdown layer has a non-uniform thickness, which serves to bias the breakdown event toward the thinner portions of the breakdown layer. As a result, the placement, size, and number of ruptures in the breakdown layer are more consistent over a series or array of devices. The variable resistance material may be a phase-change material. The variable-thickness breakdown layer may be formed through a diffusion process by introducing a gas containing a resistivity-enhancing species to the environment of segmented variable resistance devices during fabrication. The resistivity-enhancing element penetrates the outer perimeter of the variable resistance material and diffuses toward the interior of the device. The resistivity-enhancing species increases the resistance of the interface between the variable resistance material and the electrode by interacting with the variable resistance material and/or electrode to form a resistive interfacial material. Based on the diffusional nature of the process, the concentration of the resistivity-enhancing species decreases toward the center of the device and as a result, the breakdown layer is thinner toward the center of the device. | 12-02-2010 |
20110128114 | TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME - A touch panel includes a first transparent electrode substrate, a second transparent electrode substrate, a first bonding layer, a first transparent substrate, and a second bonding layer. The first transparent electrode substrate includes a first wiring pattern, a first surface, a second surface, and a first path. The second transparent electrode substrate includes a second wiring pattern, a third surface, a fourth surface, and a second path. The second path causes the third surface and the fourth surface to communicate with each other. The first bonding layer includes a first peripheral area, an opening area, and a third path. The first bonding layer bonds the first transparent electrode substrate and the second transparent electrode substrate to each other. The first transparent substrate is opposed to the second surface. The second bonding layer includes a first opening portion. | 06-02-2011 |
20120235781 | Porous Film Sensor - A method of forming a film is described. The method begins by forming a mixture including a polymer and a plurality of unordered nanomaterial. The film is dried and a plurality of pores is formed within the film. A sensitive film transducer capable of detecting changes in pressure and applied force can be made using this method. | 09-20-2012 |
20140049356 | ON-CHIP IMPEDANCE NETWORK WITH DIGITAL COARSE AND ANALOG FINE TUNING - System and method for providing precision a self calibrating resistance circuit is described that provides for matching a reference resistor using dynamically configurable resistance networks. The resistor network is coupled to the connection, wherein the resistor network provides a configurable resistance across the connection. In addition, the resistor network comprises a digital resistor network and an analog resistor network. Also, the circuit includes control circuitry for configuring the configurable resistance based on a reference resistance of the reference resistor. The configurable resistance is configured by coarsely tuning the resistor network through the digital resistor network and fine tuning the resistor network through the analog resistor network. | 02-20-2014 |
20140184380 | MULTI-STATE MEMORY RESISTOR DEVICE AND METHODS FOR MAKING THEREOF - In one aspect, the invention provides a method for making a multi-state memory resistor device. The method comprises providing a convertible component and inducing multiple state-dependent resistances on the convertible component to provide a multi-state memory resistor device. The convertible component is characterized by at least one of packing density, applied pressure, temperature, contact area or combinations thereof. The resistance from the multiple state-dependent resistances of the multi-state memory resistor device is a function of maximum current applied across the convertible component. In another aspect, the invention provides a multi-state memory resistor device comprising a convertible component, wherein the convertible component converts into a multi state memory resistor device having multiple state-dependent resistances when induced with a maximum current across the convertible component. | 07-03-2014 |