| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 338025000 | Ambient temperature | 15 |
| 20080224817 | INTERLACED RTD SENSOR FOR ZONE/AVERAGE TEMPERATURE SENSING - A device for heating a semiconductor wafer comprises a heating element arranged to conduct heat toward the wafer. The heating element can extend along a heating element path. An RTD sensor loop can extend along an RTD sensor path. The RTD sensor path can be positioned along the heating element path to measure a temperature that corresponds to the heating element. The RTD sensor loop can measure an average temperature along the heating element. Portions of the RTD sensor can be interlaced between portions of the heating element. The heating element path can be arranged with interstices between portions of the heating element path, and portions of the RTD sensor path can be positioned within the interstices to interlace the RTD sensor loop with the heating element. The RTD sensor loop can comprise a soft metal that is resistant to oxidation and extends along the RTD sensor path. | 09-18-2008 |
| 20090045908 | Polymer Ptc Element - There is provided a polymer PTC device which has a further improved performance. | 02-19-2009 |
| 20090115567 | 1200.degree.C Film Resistor - For production of a high-temperature sensor, in which a platinum resistance film is applied on a metal-oxide substrate, in particular sapphire or a ceramic plate, and a ceramic intermediate layer is laid on the resistance film, a self-supporting cover, in particular a ceramic or glass-ceramic cover, is bonded on the ceramic intermediate layer or a glass ceramic is mounted on the intermediate layer over its entire surface. Advantageously, the glass ceramic is electrically conductive or an ion conductor above 750° C. and is laid on up to the cathode of the resistance film up to beyond the intermediate layer. In particular, the cover is bonded with a metal-doped glass ceramic, which is laid on the cathode of the resistance film up to beyond the intermediate layer. Preferably, the electrically insulating intermediate layer is coated with a glass ceramic or a glass ceramic doped with metal, which coating has a resistance of at most one megaohm per square at 850° C. or above. | 05-07-2009 |
| 20090167481 | Electrical PTC Thermistor Component, and Method for the Production Thereof - An electrical PTC thermistor component includes a base that includes a peripheral surface, first and second faces on different sides of the component, and first and second conductive layers, each of which is on at least one of the first and second faces. The first conductive layer is not on the peripheral surface. The second conductive layer includes a cap that covers, and overlaps edges of, the at least one of the first and second faces. | 07-02-2009 |
| 20090174520 | Laminates, Thin-Film Sensors, Thin-Film Sensor Modules, and Methods for Producing the Thin-Film Sensors - A laminate includes an insulating substrate, and a temperature-sensitive resistor made of crystals of a metal based on a platinum group element and laminated on the insulating substrate; and has a percentage of (111) planes of crystals oriented at 10° or less from the normal direction (ND direction) in a layer of the temperature-sensitive resistor being 90% or more. By controlling the orientation of crystals forming the temperature-sensitive resistor, laminates suitable as a thin-film sensor, thin-film sensors including the laminate, thin-film sensor modules including the thin-film sensor, and methods for producing the thin-film sensors are provided. | 07-09-2009 |
| 20090174521 | Resistor Arrangement and Method for Producing a Resistor Arrangement - A resistor arrangement with resistor elements is specified that are arranged essentially regularly and that are spaced apart from each other and that are interconnected by a flexible substrate. According to a first preferred embodiment, intermediate spaces that are provided to carry a flow of flowing medium are arranged between the resistor elements. According to a second preferred embodiment, the resistor elements are arranged between two flexible substrates and are rigidly connected to these substrates. According to a third preferred embodiment, an electrically insulating adhesive layer that has openings through which the resistor elements are conductively connected to the substrate is arranged between the resistor elements and the substrate. According to a fourth preferred embodiment, the substrate is composed of, as a ground material, an elastic plastic that is filled with electrically conductive particles. In addition, a method for producing the resistor arrangement is specified. | 07-09-2009 |
| 20090219129 | Arrangement and method for temperature compensation for resistance - An arrangement and a method for temperature compensation for a resistance ( | 09-03-2009 |
| 20100073121 | MULTI-STRUCTURE THERMALLY TRIMMABLE RESISTORS - A method for arranging a plurality of thermally isolated microstructures over at least one cavity, each of the microstructures housing at least part of a thermally-trimmable resistor, the thermally-trimmable resistor having at least a functional resistor, the method comprising: providing pairs of facing microstructures; grouping together sets of pairs of facing microstructures, each of the sets having at least one pair of facing microstructures; and arranging microstructures within a given set to have each microstructure exposed to heat from a same number of facing, side, and diagonal neighbors of microstructures from a same resistor. | 03-25-2010 |
| 20100073122 | DUAL THIN FILM PRECISION RESISTANCE TRIMMING - A trimmable resistor for use in an integrated circuit is trimmed using a heater. The heater is selectively coupled to a voltage source. The application of voltage to the heater causes the heater temperature to increase and produce heat. The heat permeates through a thermal separator to the trimmable resistor. The resistance of the trimmable resistor is permanently increased or decreased when the temperature of the resistor is increased to a value within a particular range of temperatures. | 03-25-2010 |
| 20110057764 | RESISTOR WITH TEMPERATURE COEFFICIENT OF RESISTANCE (TCR) COMPENSATION - A current sense resistor and a method of manufacturing a current sensing resistor with temperature coefficient of resistance (TCR) compensation is disclosed. The resistor has a resistive strip disposed between two conductive strips. A pair of main terminals and a pair of voltage sense terminals are formed in the conductive strips. A pair of rough TCR calibration slots are located between the main terminals and the voltage sense terminals, each of the rough TCR calibration slots have a depth selected to obtain a negative starting TCR value observed at the voltage sense terminals. A fine TCR calibration slot is formed between the pair of voltage sense terminals. The fine TCR calibration slot has a depth selected to obtain a TCR value observed at the voltage sense terminals that approaches zero. The resistor can also have a resistance calibration slot located between the pair of main terminals. The resistance calibration slot has a depth selected to calibrate a resistance value of the resistor. | 03-10-2011 |
| 20120112873 | VIALESS INTEGRATION FOR DUAL THIN FILMS - THIN FILM RESISTOR AND HEATER - A process is described for integrating two closely spaced thin films without deposition of the films through deep vias. The films may be integrated on a wafer and patterned to form a microscale heat-trimmable resistor. A thin-film heating element may be formed proximal to a thin-film resistive element, and heat generated by the thin-film heater can be used to permanently trim a resistance value of the thin-film resistive element. Deposition of the thin films over steep or abrupt topography is minimized by using a process in which the thin films are deposited in a sequence that falls between depositions of thick metal contacts to the thin films. | 05-10-2012 |
| 20120119872 | Heater design for heat-trimmed thin film resistors - A heater design for post-process trimming of thin-film transistors is described. The heater incorporates low sheet-resistance material deposited in non-active connecting regions of the heater to reduce heat generation and power consumption in areas distant from active heating members of the heater. The heating members are proximal to a thin-film resistor. The resistance of the thin-film resistor can be trimmed permanently to a desired value by applying short current pulses to the heater. Optimization of a heater design is described. Trimming currents can be as low as 20 mA. | 05-17-2012 |
| 20130002395 | PTC Resistor - The present invention is related to a polymer fibre-based PTC resistor comprising a co-continuous polymer phase blend, said blend comprising a first and a second continuous polymer phase, wherein the first polymer phase comprises a dispersion of carbon nanotubes at a concentration above the percolation threshold, said first polymer phase presenting a softening temperature lower than the softening temperature of the second polymer phase. | 01-03-2013 |
| 20130088319 | CHIP THERMISTOR AND METHOD OF MANUFACTURING SAME - A chip thermistor has a thermistor portion including a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions including a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion so as to sandwich in the thermistor portion between the composite portions; and external electrodes connected to the pair of composite portions, respectively. In this manner, the pair of composite portions are used as bulk electrodes and, for this reason, the resistance of the chip thermistor can be adjusted mainly with consideration to the resistance in the thermistor portion without need for much consideration to the distance between the external electrodes and other factors. | 04-11-2013 |
| 20140247106 | High Temperature Resistive Temperature Detector for Exhaust Gas Temperature Measurement - The present disclosure relates to a high temperature resistance temperature detector for measuring exhaust gas temperature for example. The structure includes a resistive element disposed on an insulated carrier. The structure further includes a housing disposed over the carrier and resistive element for inhibiting oxidation of the element which would result in failure of the detector. | 09-04-2014 |
