| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 333034000 | Tapered | 13 |
| 20090015345 | BROADBAND TRANSITION FROM A VIA INTERCONNECTION TO A PLANAR TRANSMISSION LINE IN A MULTILAYER SUBSTRATE - According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; The length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations. | 01-15-2009 |
| 20090027137 | TAPERED DIELECTRIC AND CONDUCTOR STRUCTURES AND APPLICATIONS THEREOF - Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore. | 01-29-2009 |
| 20090066441 | LOW-LOSS INTERFACE - In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material. | 03-12-2009 |
| 20090195327 | TRANSMITTING RADIO FREQUENCY SIGNAL IN SEMICONDUCTOR STRUCTURE - A semiconductor device for transmitting a radio frequency signal along a signal line includes a signal line that extends along a principal axis. On one side of the signal line is a first dielectric, and on the opposite side of the signal line is a second dielectric. First and second ground lines are proximate to the first and second dielectrics, respectively, and the ground lines are approximately parallel to the signal line. The device has a transverse cross-section that varies along the principal axis. | 08-06-2009 |
| 20090284324 | Integrated Circuit Transmission Lines, Methods for Designing Integrated Circuits Using the Same and Methods to Improve Return Loss - Integrated circuit transmission lines are designed to match elements at opposing ends of the transmission line over a frequency range of interest. By modifying characteristics of the transmission line over the length of the transmission line, from a first end coupled to a first external element to a second end coupled to a second external element, return loss is improved. In various embodiments one or more of the width of the conductors and the distance between adjacent edges of the conductors are modified across the length of the transmission line. In an alternative embodiment, the conductors of the transmission line are segmented with each segment having a length and a width across the segment. | 11-19-2009 |
| 20110025429 | Circuit Board Pad Having Impedance Matched to a Transmission Line and Method for Providing Same - The present invention provides a transmission line portion for a circuit board including a conductive strip and a pad portion including a conductive pad connected to the conductive strip, wherein an impedance discontinuity or mismatch between the transmission line portion and the pad portion is reduced or controlled. Impedance discontinuity or mismatch may be controlled by controlling the dimensions of the pad portion, for example the pad width or distance between pad and ground. A ground pad associated with the pad portion may be provided on a different layer than a ground plane of the transmission line portion. The ground pad and ground plane may be connected by vias. The ground pad may comprise a patterned conductive region, the pattern configured so as to desirably configure impedance of the pad portion. Also provided are a method, circuit board layout, and the like, related to the above. | 02-03-2011 |
| 20110140801 | SIGNAL CONVERTER AND HIGH-FREQUENCY CIRCUIT MODULE - A signal converter includes: a dielectric substrate; a first conductor layer disposed on one of opposite sides of the dielectric substrate, while including an input section receiving high-frequency signals inputted thereto; a second conductor layer disposed on the other of the opposite sides of the dielectric substrate; and plural first conducting sections penetrating the dielectric substrate for electrically connecting the first and second conductor layers, while forming a waveguide in the inside of the dielectric substrate with the first and second conductor layers. The first conductor layer is disposed on the dielectric substrate without occupying a separator section disposed on the dielectric substrate. The separator section includes first and second sections extend from the input section towards the waveguide. The first and second sections are separated away from each other for gradually increasing their interval in proportion to a distance away from the input section towards the waveguide. | 06-16-2011 |
| 20110273241 | COAXIAL TRANSMISSION LINE MICROSTRUCTURES AND METHODS OF FORMATION THEREOF - Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals. | 11-10-2011 |
| 20120182083 | CONNECTION METHOD AND SUBSTRATE - A connection method includes the step of connecting, using a line on a dielectric element, two points through which a signal flows, the two points having different heights and the widths of the line at the positions of the two points having been adjusted on the basis of the thickness of the dielectric element. | 07-19-2012 |
| 20140015623 | COAXIAL TRANSMISSION LINE MICROSTRUCTURES AND METHODS OF FORMATION THEREOF - Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals. | 01-16-2014 |
| 20140167876 | Meandered Slow Wave Taper Matching Network - Presently disclosed is a matching network provided from a slow wave, wrapped, tapered-transformer transmission line. | 06-19-2014 |
| 20140184351 | Low Power, High Speed Multi-Channel Chip-to-Chip Interface using Dielectric Waveguide - An exemplary embodiment of the present invention provides an improved dielectric waveguide named electrical fiber. The electrical fiber with a metal cladding may isolate the interference of the signals in other wireless channels and adjacent electrical fibers, which typically causes band-limitation problem, for a smaller radiation loss and better signal guiding to lower the total transceiver power consumption as the transmit distance increases. Also, the electrical fiber may have frequency independent attenuation characteristics to enable high data rate transfer with little or even without any additional receiver-side compensation due to vertical coupling of the electrical fiber and an interconnection device. | 07-03-2014 |
| 20150097634 | MILLIMETER-WAVE BROADBAND TRANSITION OF MICROSTRIP LINE ON THIN TO THICK SUBSTRATES - Embodiments are directed to a structure comprising: a first substrate section having a first thickness, a second substrate section having a second thickness different from the first thickness, a plurality of vias configured to couple a first ground plane associated with the first substrate section and a second ground plane associated with the second substrate section, and a microstrip comprising: a first section associated with the first substrate section and having a first width, a second section associated with the second substrate section and having a second width different from the first width, and a taper between the first width and the second width. | 04-09-2015 |
