| Entries |
| Document | Title | Date |
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| 20080303608 | Flexible Microwave Transmission Line - A power amplifier (power amplifier) having multiple solid state sub-amplifiers connected in parallel between the power amplifier input and the power amplifier output are described. The signal input to the power amplifier is provided to an RF splitter connected between the power amplifier input connector and the input of each of the sub-amplifiers. The RF splitter splits the input power from the signal input and provides the power to the sub-amplifier inputs through input electrical paths. The input electrical paths from the power amplifier input to the sub-amplifiers are substantially physically identical. Each of the sub-amplifiers drive an input of an RF combiner connected between the outputs of the sub-amplifiers and the output of the power amplifier. The RF combiner combines the output power from each of the sub-amplifiers through output electrical paths, and provides the combined power to the power amplifier output. The output electrical paths from the sub-amplifiers to the power amplifier output are substantially physically identical. | 12-11-2008 |
| 20080309427 | Transit Structure of Standard Waveguide and Dielectric Waveguide - A transit structure of a standard waveguide and a dielectric waveguide is related to connecting the dielectric dielectric waveguide to the standard waveguide. The transit structure includes: a cavity to match the dielectric waveguide and the standard waveguide, wherein the dielectric waveguide and the standard waveguide are orthogonal to each other to connect. The transit structure drastically reduces a design time by simply implementing a transit structure by using only a dielectric waveguide, a cavity and a standard waveguide on a dielectric substrate and remarkably reduces a size thereof in comparison with a conventional transit structure since all designs are finished in the size of a metal waveguide. | 12-18-2008 |
| 20090146757 | Coaxial automatic impedance adaptor - The invention concerns a coaxial automatic impedance adaptor characterized in that it comprises two slugs and has only a lateral translational movement along an axis Ox. The double slug tuner principle is based on the movement of two line segments of different characteristics of 50 O inside a closed cylinder on either side of standard connectors. | 06-11-2009 |
| 20090153261 | METHOD AND SYSTEM FOR MATCHING NETWORKS EMBEDDED IN AN INTEGRATED CIRCUIT PACKAGE - Methods and systems for matching networks embedded in an integrated circuit package are disclosed and may include controlling impedance within an integrated circuit via one or more impedance matching networks. The impedance matching networks may be embedded within a multi-layer package bonded to the integrated circuit. The impedance of one or more devices within the integrated circuit may be configured utilizing the impedance matching networks. The multi-layer package may include one or more impedance matching networks. The impedance matching networks may provide impedance matching between devices internal to the integrated circuit and external devices. The impedance matching networks may be embedded within the multi-layer package, and may include transmission lines, inductors, capacitors, transformers and/or surface mount devices. The impedance matching networks may be deposited on top of and/or on bottom of the multi-layer package. The integrated circuit may be flip-chip bonded to the multi-layer package. | 06-18-2009 |
| 20090179712 | Electric apparatus - An electric apparatus capable of stably transmitting signals in a high frequency band (high speed signals) by preventing distortion of a signal waveform through impedance control is disclosed. The electric apparatus includes a case having a signal line which transmits signals between electronic parts, a dielectric deposited on the case and the signal line, and a ground portion disposed on the dielectric. | 07-16-2009 |
| 20090212881 | COAXIAL-TO-MICROSTRIP TRANSITIONS AND MANUFACTURING METHODS - Coaxial-to-microstrip transitions may include a microstrip line and coaxial-line assembly. The microstrip line includes a first dielectric having an aperture, a conductive strip disposed on one primary face of the first dielectric, and a ground plane disposed on the opposite primary face of the first dielectric. The coaxial-line assembly includes an outer conductor and an inner conductor. In some examples, the ground plane extends between the outer conductor and the inner conductor on a first side of the coaxial-line assembly proximate the conductive strip and an aperture cross section extends beyond the outer conductor on a second side of the coaxial-line assembly distal the conductive strip. In some examples, the ground plane has a non-circular aperture. In some examples, the outer conductor encloses an area that is less than an area of the aperture. In some examples, the enclosed area has a width that is less than a corresponding width of the first aperture. | 08-27-2009 |
| 20090278622 | Coaxial Impedance Matching Adapter and Method of Manufacture - An impedance adapter with body and cap portions coupled together encloses a cavity with a printed circuit board (PCB). The PCB is provided with a trace on a first side and a ground plane on a second side. The trace is coupled to a first contact at a first end of the PCB and a second contact at a second end of the PCB. The trace has a sinuous path between the first contact and the second contact, the path longer than a longitudinal axis length of the PCB. The first and second contacts are supported coaxial within the inner conductor bore of the respective cap portion and body portion by first and second end insulators. The ground plane coupled to the body portion and the cap portion. A method of manufacture for the adapter includes steps of pre-assembling the PCB, contacts and insulators before insertion into the cavity. | 11-12-2009 |
| 20090295497 | IMPEDANCE TRANSFORMING HYBRID COUPLER - An RF hybrid coupler is described having a coupling section and impedance matching transformer sections. The coupler, constructed of Stripline patterns, accepts an RF input signal at a first impedance value and outputs a plurality of RF signals at a second impedance value. The output RF signals are at equal amplitudes to one another and at lower amplitude than the input RF signal. | 12-03-2009 |
| 20090295498 | APPARATUS AND METHOD OF VIA-STUB RESONANCE EXTINCTION - An apparatus includes a multi-layer printed circuit board having a first through-hole via for a signal connection and a second through hole via for power/ground connections. The printed circuit includes a transmission line connected to at least one through-hole via. A resistor is connected between the first and second through-hole vias to eliminate a resonance notch and achieve a flat frequency response for insertion loss. | 12-03-2009 |
| 20100007431 | SIGNAL TRANSMISSION STRUCTURE - A signal transmission structure includes two power planes, a signal line and a first pillar. The power planes spaced by an interval space provide a first voltage and a second voltage respectively. The signal line, disposed on first surfaces of the power planes, is disposed across the interval space. The first pillar is disposed within the interval space and is aside the signal line, in which the first pillar is apart from the power planes and the signal line. | 01-14-2010 |
| 20100019859 | Multilayer Microstripline Transmission Line Transition - A microstripline transmission line arrangement carries a signal having a fundamental frequency. The arrangement includes a first microstripline transmission line, a second microstripline transmission line, and a coaxial electrically conductive conduit interconnecting the first transmission line and the second transmission line. The conduit includes a signal conductor and an electrically grounded shield substantially surrounding the signal conductor. The conductor and the shield are positioned relative to each other to thereby comprise a means for lowpass filtering the signal. A cutoff frequency of the lowpass filtering is less than a third harmonic of the fundamental frequency. | 01-28-2010 |
| 20100033262 | RADIO FREQUENCY INTERCONNECT CIRCUITS AND TECHNIQUES - A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly. | 02-11-2010 |
| 20100052811 | FLAT, ASYMMETRIC, AND E-FIELD CONFINED WIRELESS POWER TRANSFER APPARATUS AND METHOD THEREOF - In accordance with various aspects of the disclosure, a method and apparatus is disclosed that includes feature of a transmitter and receiver having a substantially two-dimensional resonator structure including a flat coil; and an impedance-matching structure operably connected to the resonator structure, the transmitter configured to transmit power wirelessly. | 03-04-2010 |
| 20100085130 | MANUFACTURABLE TUNABLE MATCHING NETWORK FOR WIRE AND RIBBON BOND COMPENSATION - In a millimeter wave circuit having first and second adjacent circuit boards, each circuit board having a microstrip and a ground plane, a low loss electrical connection between the microstrips on adjacent planes. Each microstrip ends in a connection pad and a first wire bond is attached to the connection pads on the adjacent circuit boards. A second wire bond also extends between the connection pads in parallel with the first wire bond and, optionally, one or more capacitors are provided on either the first, second or both circuit boards to match the impedance between the circuit boards. These capacitors may be selectively trimmed. | 04-08-2010 |
| 20100097158 | Radio Frequency Coaxial Transition - A coaxial transition includes a first conductor aligned along a first axis. The transition also includes a ground shield surrounding the first conductor such that a first gap exists between the first conductor and the ground shield. An electric field radiates between the first conductor and the ground shield through the first gap. The transition further includes a second conductor aligned along a second axis and coupled to the first conductor. The second conductor forms a second gap between the second conductor and a portion of the ground shield. A first portion of the electric field radiates between the second conductor and the ground shield through the second gap. The transition also includes a top ground plane aligned substantially parallel to the second conductor. A third gap exists between the top ground plane and the second conductor. The second gap and the third gap are substantially parallel with the second conductor therebetween. | 04-22-2010 |
| 20100176896 | High frequency electrical connector - A coaxial to transmission line connector has a connector and an attachment area with a windowed electrical attachment point that when soldered in place on a ground reference of an electrical device, creates an electrical and mechanical connection between an outer conductor of the coaxial to transmission line connector. The attachment area has at least one mechanical alignment point and a corresponding reference pivot point located substantially co-planar at the termination of the coaxial dielectric region at an edge of a PCB and a port of the coaxial to transmission line connector. The at least one mechanical alignment point and the corresponding reference pivot plane serve to automatically align the coaxial to transmission line connector to the electrical device. Opposite the attachment area is a dielectric area following termination of the outer conductor in the transition area of the microstrip transmission line. | 07-15-2010 |
| 20100231320 | SEMICONDUCTOR DEVICE, TRANSMISSION SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING TRANSMISSION SYSTEM - Disclosed herein is a semiconductor device including: a semiconductor circuit element configured to process an electrical signal having a predetermined frequency; and a transmission line configured to be connected to the semiconductor circuit element via a wire and transmit the electrical signal. An impedance matching pattern having a symmetric shape with respect to a direction of the transmission line is provided in the transmission line. | 09-16-2010 |
| 20100244978 | METHODS AND APPARATUS FOR MATCHING AN ANTENNA - A method and an arrangement for matching the antenna of a radio device in transmitting condition. The antenna impedance in the output of the power amplifier of a transmitter is adjusted by means of a π-shaped reactive matching circuit, the component values of which can be selected from a relatively wide array of the alternatives. The component values are selected by means of the multiple-way switches, which only are located in the transverse branches of the matching circuit. The switches are set ( | 09-30-2010 |
| 20100253444 | VARIABLE IMPEDANCE ADAPTER FOR TUNING SYSTEM PERFORMANCE - A variable impedance adapter that has a value of characteristic impedance that is responsive to changes in the configuration of the adapter. In one embodiment, the variable impedance adapter includes an elongated section and a telescoping section that surround a center conductor that transmits an electrical signal across the adapter. A pair of tuning elements is disposed on a portion of the center conductor, one or more of the elements being shaped and configured to move along the center conductor amongst a plurality of positions in response to relative movement between the elongated section and the telescoping section. The first position and the second position correspond to different values of characteristic impedance of the variable impedance adapter. | 10-07-2010 |
| 20100259338 | High frequency and wide band impedance matching via - A high frequency and wide band impedance matching via is provided, applicable to multi-layer printed circuit boards, for example. The multi-layer circuit board may include several signal transmission traces, several ground layers, signal transmission vias and ground vias. The signal transmission traces and the ground layers may be sited on different circuit layers, and each signal transmission trace may be opposite to one of the ground layers. The signal transmission vias may be connected between the signal transmission traces. The ground vias may be connected between the ground layers. The ground vias may be opposite to the signal transmission vias, and the ground vias corresponding to the signal transmission vias may be sited to stabilize the characteristic impedance of the transmission traces. | 10-14-2010 |
| 20100271149 | HIGH-FREQUECY MODULE FOR WIRELESS COMMUNICATIONS - A high-frequency module includes an antenna, an impedance matching circuit, and a transmission wire. The transmission wire is connected between the antenna and the impedance matching circuit. The transmission wire includes a dielectric layer, a signal layer, and two ground layers. The signal layer and the ground layers are located on the dielectric layer. The ground layers are located at opposite sides of the signal layer respectively. A space is formed between a signal and each ground layer. | 10-28-2010 |
| 20110037533 | METHOD, STRUCTURE, AND DESIGN STRUCTURE FOR AN IMPEDANCE-OPTIMIZED MICROSTRIP TRANSMISSION LINE FOR MULTI-BAND AND ULTRA-WIDE BAND APPLICATIONS - A method, structure, and design structure for an impedance-optimized microstrip transmission line for multi-band and ultra-wide band applications. A method includes: forming a plurality of openings in a ground plane associated with a signal line; forming a plurality of capacitance plates in the plurality of openings; and connecting the plurality of capacitance plates to the signal line with a plurality of posts extending between the signal line and the plurality of capacitance plates. | 02-17-2011 |
| 20110084778 | ELECTRICAL CIRCUIT SIGNAL CONNECTION SYSTEM - A termination block for connecting a first signal device and a second signal device. The termination block includes a housing, first and second connectors, and an electrical circuit having passive elements that connect the first and second connectors and provide impedance matching. | 04-14-2011 |
| 20110102097 | SYSTEM FOR TRANSMITTING AN ELECTRIC PULSE AND DEVICE FOR CAPACITIVE DISCONNECTION FOR SUCH A SYSTEM - The invention relates, in particular, to a system for transmitting at least one electric pulse for an apparatus for determining a distribution of charges contained in the thickness of an item ( | 05-05-2011 |
| 20110102098 | STRUCTURE FOR REDUCING SCATTERING OF ELECTROMAGNETIC WAVES - A structure made of in certain frequency bands invisible material includes a transmission line network. The structure has a matching layer at the boundary of the material, supporting structures inside the transmission line network and that the transmission line network has been matched with the surrounding space. | 05-05-2011 |
| 20110128089 | SIGNAL TRANSMISSION DEVICE - A signal transmission device | 06-02-2011 |
| 20110128090 | STRIPLINE - A strip conductor is provided on a dielectric board, and a ground conductor facing the strip conductor in a thickness direction of the dielectric board is provided on a surface of the dielectric board. The ground conductor is provided with a plurality of holes penetrating therethrough along the thickness direction of the dielectric board. This structure accomplishes a microstrip line that can obtain consistent passing frequency characteristics. | 06-02-2011 |
| 20110140800 | Radio frequency signal transmission method with coaxial connection having a dielectric material for impedance matching - A radio frequency signal transmission method for transmitting a radio frequency signal through an inner conductor serving as a signal line, the radio frequency signal transmission method including: causing the radio frequency signal to be input to and propagate through the inner conductor, an impedance between the inner conductor and an outer conductor serving as a grounding line being adjusted to a predetermined impedance; and causing a component of the radio frequency signal to propagate through a capacitor provided in a middle of the inner conductor, an impedance at a portion of the capacitor installed being adjusted to match the predetermined impedance by a dielectric material provided around the capacitor. | 06-16-2011 |
| 20110248789 | COMPENSATING FOR AN ELECTROSTATIC DISCHARGE CAPACITANCE LOAD - In some embodiments a differential communication channel compensates for electrostatic discharge capacitance of an electrostatic discharge component by increasing an impedance of the differential communication channel near the electrostatic discharge component. Other embodiments are described and claimed. | 10-13-2011 |
| 20110267153 | WAVEGUIDE-MICROSTRIP LINE CONVERTER - Provided is a waveguide-microstrip line converter, including: a waveguide; a dielectric substrate that is connected to cover one end of the waveguide; a strip conductor that is disposed on a front surface of the dielectric substrate; a conductor plate that is disposed the front surface of the dielectric substrate, and connected to the strip conductor; a ground conductor that is disposed on a rear surface of the dielectric substrate; and a plurality of connection conductors that connect a periphery of the conductor plate and the ground conductor, in which: the ground conductor has an opening formed therein in a connection region; the strip conductor and the ground conductor forma microstrip line; and the plurality of connection conductors are arranged so that a distance between two lines of the plurality of connection conductors that are aligned in a longitudinal direction of the microstrip line, and disposed on both opposing sides of the conductor plate in a vicinity of a connection portion is narrower than a distance therebetween in a vicinity of the opening. | 11-03-2011 |
| 20110285473 | IMPEDANCE-MATCHING TRANSFORMERS FOR RF DRIVEN CO2 GAS DISCHARGE LASERS | 11-24-2011 |
| 20110285474 | APPARATUS, SYSTEM, AND METHOD FOR A COMPACT SYMMETRICAL TRANSITION STRUCTURE FOR RADIO FREQUENCY APPLICATIONS - Described herein are an apparatus, system, and method having a compact symmetrical transition structure for RF applications. The apparatus comprises: first and second ground planes each of which having respective truncated edges, the first and second ground planes being parallel to one another and separated by a multi-layer substrate; a strip line positioned between the first and second ground planes; and a symmetrical transition structure, coupled to the strip line and the first and second ground planes near their respective truncated edges, and further coupled to a broadside coupled line (BCL). | 11-24-2011 |
| 20110316644 | CIRCUIT BOARD WITH JUMPER STRUCTURE - A circuit board with jumper structure is disclosed. The circuit board includes a substrate, a ground layer, a first signal transmission line, and a second signal transmission line. The ground layer is formed on a second plane of the substrate. The first signal transmission line is formed on a first plane of the substrate, and coupled to a first signal end and a second signal end. A first signal transmitted on the first signal transmission line in a combination method of a microstrip line to co-planar waveguide transition and a co-planar waveguide to microstrip line transition. The second signal transmission line is formed on the second plane of the substrate, and coupled to a third signal end and a fourth signal end. A second signal is transmitted on the second signal transmission line in the co-planar waveguide transmission. | 12-29-2011 |
| 20120032752 | VERTICAL QUASI-CPWG TRANSMISSION LINES - In one example embodiment, a coplanar waveguide signal transition element transitions high-speed signals between vertically stacked coplanar waveguide transmission lines. The signal transition element comprises one or more dielectric layers and a plurality of electrically conductive vias extending through at least a portion of the one or more dielectric layers. The vias include one or more signal vias and one or more ground vias that are configured to transition signals between the vertically stacked coplanar waveguide transmission lines. The signal transition element also comprises a ground plane disposed within the one or more dielectric layers and electrically coupled to the one or more ground vias. The ground plane has one or more openings through which the one or more signal vias respectively pass. | 02-09-2012 |
| 20120038432 | Wideband impedance matching of power amplifiers in a planar waveguide - A flexible matching circuit topology defined by rules maximizes transfer efficiency for an amplified input signal over a wide band of operation. The circuit includes an impedance matching circuit suitable for transforming an electromagnetic signal transmission path of a first impedance into an electromagnetic signal transmission path having a second impedance. A first transmission line element is connected to at least one intermediate transmission line element. At least one pair of perpendicularly juxtaposed transmission line stub elements are connected across said intermediate transmission line element. At least one last transmission line element is connected to the intermediate transmission line element. An optional number of single-sided stub elements may be connected perpendicularly to the first transmission line element, the intermediate transmission line elements or the last transmission line element. | 02-16-2012 |
| 20120044026 | MULTIBAND MATCHING CIRCUIT - A multiband matching circuit of the present invention includes an inductive element having one end connected to an input terminal, a first switch having one end connected to the other end of the inductive element and the other end grounded, a capacitive element having one end connected to the input terminal, a second switch having one end connected to the other end of the capacitive element and the other end grounded, a first-band matching circuit that is connected between the other end of the inductive element and a first output terminal and performs impedance matching in a first frequency band, and a second-band matching circuit that is connected between the other end of the capacitive element and a second output terminal and performs impedance matching in a second frequency band higher than the first frequency band. | 02-23-2012 |
| 20120068783 | Tuning Circuit For Pivotal Antenna - A tuning circuit for a pivotal antenna comprises a feeder transmission cable, a microwave medium, an impedance-matching tuning circuit, a grounding plane, a pivotal shaft, a radiation conductor, and a carrier member. The feeder transmission cable has a central wire and an outer conductor. The microwave medium has a first plane and a second plane. The impedance-matching tuning circuit is arranged on the first plane and connected with the central wire. The grounding plane is arranged on the second plane and connected with the outer conductor. The pivotal shaft has a first end connected with the impedance-matching tuning circuit and a second end connected with the radiation conductor. The carrier member accommodates the microwave medium thereinside. The tuning circuit for a pivotal antenna of the present invention can provide superior impedance and bandwidth for a radiation conductor of an antenna. | 03-22-2012 |
| 20120098615 | BROADBAND NON-COPLANAR FEEDTHROUGH - A high-speed feedthrough (HSFT) is disclosed for transmitting a signal having a highest frequency of at least 10 GHz between first and second locations separated by a vertical distance of at least approximately half of the shortest transmitted wavelength, and separated by a horizontal distance. A substrate structure includes multiple stacked layers. An RF transmission line is connected through the structure between the first and second locations for transmitting the signal. The RF transmission line comprises a series of sequentially connected horizontal conductors having lengths less than half of the effective wavelength and vertical conductors having heights less than one quarter of the effective wavelength, thereby spanning the horizontal and vertical distance between the two locations in a stairs-like shape through the structure's layers. Each conductor's geometry may deviate from standard 50 ohm buried strip lines and is optimized for complete 3-dimensional structure. | 04-26-2012 |
| 20120105169 | ELECTRONIC CIRCUIT - An electronic circuit includes a first transmission line connected to a DC power source, a second transmission line having one end connected to the first transmission line at a connecting node, a narrow portion formed in the second transmission line and provided at a position that is away from a specific position by equal to or greater than ⅛ wavelength of a signal, the specific position being away from the connecting node at a distance equal to ¼ wavelength, and a capacitor having one end connected to the other end of the second transmission line and the other end connected to a reference potential. | 05-03-2012 |
| 20120133454 | MICROSTRIP LINE STRUCTURES - The invention is related to a microstrip line structure, which comprises: a first microstrip line and a second microstrip line, paralleled with the first mircostrip line for transferring a transmission signal, and a plurality of grooves periodically arranged on both sides of the second microstrip line by using subwavelength, and each period length in the plurality of grooves is smaller than the wavelength of the transmission signal. | 05-31-2012 |
| 20120182082 | Method and Device for Routing Over a Void for High Speed Signal Routing in Electronic Systems - Embodiments of the present invention are directed to providing an increased trace width when traversing a void in another layer in a printed circuit board or package design. By increasing the trace width or alternatively increasing the capacitance, the degradation due to the void can be reduced. This approach works for microstrip, stripline as well as other transmission lines that use a reference plane. The void can be the result of an antipad associated with a via, or any other disruption in an otherwise uniform reference plane. | 07-19-2012 |
| 20120200369 | DC BLOCKING DEVICE BY USING IMPEDANCE MATCHING - A DC blocking device using impedance matching is disclosed. The disclosed DC blocking device comprises: a first strip line configured to receive a signal and including a first line section and a first joining section joined to a part where a signal is received; and a second strip line separated from the first strip line at a designated distance and including a second line section and a second joining section for joining an output signal, where coupling occurs from the first strip line to the second strip line, the first strip line and the second strip line each have at least one bending section, and the first line section and the second line section have smaller line widths than the first joining section and the second joining section. The disclosed DC blocking device has the advantage of minimizing spatial constraints when it is installed in a mobile communication apparatus, and of achieving proper coupling even if the length of the part of the DC blocking device where coupling occurs is reduced. | 08-09-2012 |
| 20120206215 | BROADSIDE-COUPLED TRANSFORMERS WITH IMPROVED BANDWIDTH - A monolithic microwave integrated circuit (MMIC) compatible broadside-coupled transformer including (i) a first transmission line, (ii) a second transmission line, and (iii) a third transmission line. The first and the second transmission lines generally form the broadside-coupled transformer. The third transmission line is generally connected in series with the broadside-coupled transmission line forming a ground return path of the broadside-coupled transformer. | 08-16-2012 |
| 20120218051 | ELECTRICAL CIRCUIT SIGNAL CONNECTION SYSTEM - A termination block for connecting a first signal device and a second signal device. The termination block includes a housing, first and second connectors, and an electrical circuit having passive elements that connect the first and second connectors and provide impedance matching. | 08-30-2012 |
| 20120229228 | MOBILE WIRELESS COMMUNICATIONS DEVICE WITH ADJUSTABLE IMPEDANCE MATCHING NETWORK AND ASSOCIATED METHODS - A mobile device includes an adjustable impedance matching network coupled between a power amplifier and an antenna and has an adjustable impedance element. An impedance sensor is coupled between the power amplifier and adjustable impedance matching network. A processor is configured to a) calculate a corrected antenna load impedance based upon a sensed impedance at inputs of the impedance matching network and a current value of the adjustable impedance element, and b) determine a new value for the adjustable impedance element based upon the corrected antenna load impedance. The processor is also configured to c) set the adjustable impedance element to the new value, and d) sense a new impedance at the inputs and determine if the sensed new impedance is within a threshold value of the power amplifier impedance, and repeat steps a), b), and c) if the sensed new impedance is not within the threshold value. | 09-13-2012 |
| 20130082797 | MICROSTRIP TO AIRSTRIP TRANSITION WITH LOW PASSIVE INTER-MODULATION - A microstrip to airstrip transition is provided. The microstrip to airstrip transition includes a ground plane, a printed circuit board, a microstrip, a solder mask, and an airstrip. The ground plane has first and second sides. The printed circuit board has first and second sides and is disposed on the first side of the ground plane. The microstrip is disposed on a portion of the first side of the printed circuit board, and the solder mask is disposed over at least a portion of the microstrip. The airstrip is disposed over the at least portion of the solder mask, and the solder mask prevents direct contact between the microstrip and the airstrip. | 04-04-2013 |
| 20130088304 | ANTENNA FEED STRUCTURE - A feed structure for a wearable antenna incorporates a microstrip transmission line designed for mounting on opposite sides of a fabric. The transmission line has a perforated ground plane which reduces capacitance and offers an appropriate impedance, even when the fabric is thin, and allows the use of a relatively robust line conductor having a width of 3 mm or 5 mm or more. The ground plane can be extended to provide the ground plane of a balun and the material of that ground plane can in turn be extended to provide the wearable antenna. | 04-11-2013 |
| 20130093532 | FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board including: a base substrate; a pad formed on one surface side of the base substrate; and a ground plane layer formed on the other surface side of the base substrate, the ground plane layer including a ground-removed portion, the ground-removed portion being formed at a position facing the pad via the base substrate so as to be of similar shape to the pad and have an outer shape extended 100±50 μm outwardly from an outer shape of the pad. | 04-18-2013 |
| 20130106527 | VARIABLE CAPACITANCE MEMS VARACTOR ARRAY METHOD & APPARATUS | 05-02-2013 |
| 20130106528 | ASYMMETRICAL MULTILAYER SUBSTRATE, RF MODULE, AND METHOD FOR MANUFACTURING ASYMMETRICAL MULTILAYER SUBSTRATE | 05-02-2013 |
| 20130154760 | BONDING WIRE IMPEDANCE MATCHING CIRCUIT - An impedance matching circuit is provided. The present impedance matching circuit is able to match impedance using a transformer which is arranged inside a dielectric substrate and arranged to overlap with a bonding pad area and an end of a transmission line, thereby enabling transmitting signals at a desired frequency with a minimum insertion loss without using a very thin transmission line which is several to dozens of μm wide or specially designed antennas in order to compensate for inductance. Thus, the present impedance matching circuit may be applied to various millimeter bands. | 06-20-2013 |
| 20130207739 | Adjustable Impedance Matching Network - An adjustable impedance matching network includes a first terminal, a second terminal, a reference potential terminal, a transmission line transformer with a first inductor path and a second inductor path. A semiconductor switching element is configured to bridge a sub-section of the first inductor path or the second inductor path to thereby adjust an inductance of the first inductor path or the second inductor path. According to an alternative embodiment, the impedance matching network includes a selector switch to selectively connect one of a plurality of inductor nodes with at least one of the first terminal and the second terminal. Further embodiments relate to an integrated circuit for adjustable impedance matching with a transmission line transformer formed by first and second inductor paths that are implemented as conductive paths at or in a substrate of the integrated circuit. | 08-15-2013 |
| 20130207740 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS INCLUDING THE SAME - A high-frequency signal transmission line includes a body; a signal line including a first line portion provided to a first layer of the body, a second line portion provided to a second layer of the body alternately being connected; and a first ground conductor provided to the first layer or a third layer positioned on an opposite side of the second layer relative to the first layer, and also overlaid with a plurality of second line portions in planar view from a normal direction of a principal surface of the body, and also not overlaid with a plurality of the first line portions. A property impedance of the first line portion and a property impedance of the second line portion are different from each other. | 08-15-2013 |
| 20130285762 | VARIABLE CAPACITOR MODULE - Disclosed herein is a variable capacitor module, including a variable capacitor circuit part including a first capacitor unit, a second capacitor unit connected in parallel with the first capacitor unit, and first and second switch units connected between the first and second capacitor units, and selecting at least one capacitor unit according to operations of the first and second switch units, wherein the variable capacitor circuit part is present in plural, and the plural variable capacitor parts are connected in parallel with each other, and thus, an asymmetric phenomenon where the RF terminal has directivity by gate resistance of the switch can be removed. | 10-31-2013 |
| 20130300515 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS - An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack. | 11-14-2013 |
| 20130300516 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS - An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack. | 11-14-2013 |
| 20130342280 | COAXIAL-TO-STRIPLINE AND STRIPLINE-TO-STRIPLINE TRANSITIONS INCLUDING A SHORTED CENTER VIA - A stripline includes a first ground plane; a second ground plane; a first signal trace located between the first ground plane and the second ground plane; and a center via that extends through the stripline and is in electrical contact with the first ground plane and the first signal trace. | 12-26-2013 |
| 20140028413 | SIGNAL TRANSMISSION MEDIUM AND HIGH FREQUENCY SIGNAL TRANSMISSION MEDIUM - A signal transmission medium for transmitting EHF band signals from a first point to a second point, including: a first end at which a signal exchange with the first point takes place; a second end at which a signal exchange with the second point takes place; and a transmission line portion which is flexible and connects the first end and the second end. The transmission line portion includes: strip conductors which are formed substantially down a center of a flexible printed circuit board to establish electrical connection between a signal line at the first end and a signal line at the second end; and a pair of grounding sheets which are arranged in parallel to each other at a substantially constant gap from the flexible printed circuit board in 180-degree opposite directions. The cavities are formed between the pair of grounding sheets and the strip conductors. | 01-30-2014 |
| 20140043109 | EFFICIENT LOOP ANTENNA SYSTEM AND METHOD - An antenna including a conductive loop having a first top surface portion, the conductive loop having a first edge portion interrupted by a gap defining a feed point, a conductive strip having a second top surface, the conductive loop lying in a plane defined by the second top surface, the conductive strip having a second edge portion extending between first and second opposing distal ends, the second edge portion being spaced from the first edge portion, and the second edge portion extending along the first edge portion at a substantially constant distance from the first edge portion, and wherein the conductive strip is electrically isolated from the conductive loop and is structurally configured and positioned relative to the conductive loop to adjust an input impedance of the conductive loop. | 02-13-2014 |
| 20140077893 | SUBSTRATE INTEGRATED WAVEGUIDE COUPLER - Disclosed is a substrate integrated waveguide coupler. The substrate integrated waveguide coupler according to the present invention includes: a substrate; an upper conducting plate applied to an upper portion of the substrate; a lower conducting plate applied to a lower portion of the substrate; two peripheral via holes disposed parallel to each other on both sides of the substrate, respectively, and being of a pipeline type electrically connecting the upper conducting plate and the lower conducting plate to each other; and an inner via hole disposed between the two peripheral via holes, and having a center thereof separated by a preset distance and forming a short slot functioning to couple input signals. | 03-20-2014 |
| 20140125426 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS - An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack. | 05-08-2014 |
| 20140167874 | PRINTED CIRCUIT BOARD CAPABLE OF REDUCING RETURN LOSS OF DIFFERENTIAL SIGNAL AND ELECTRONIC DEVICE USING THE SAME - A printed circuit board (PCB) includes a receiver component, a transmission line including a positive signal transmission line and a negative signal transmission line, a transmitter component, and a capacitance unit. The transmitter component transmits a different signal to the receiver component via the transmission line. The capacitance unit is spaced from the receiver component a predetermined distance S, therein, the predetermined distance S is calculated by a formula S=Vx (n*UI−(C | 06-19-2014 |
| 20140167875 | TRANSMISSION DEVICE - A transmission device that establishes efficient match with an impedance mismatch section of a differential transmission system. The transmission device includes: a differential driver; a differential receiver; a differential line that connects between the differential driver and the differential receiver, the differential line including in-phase signal wiring and inverted-phase signal wiring; a delay increasing structure interposed in the differential line at an upstream of the impedance mismatch section; and a delay increasing structure interposed at a downstream of the impedance mismatch section. The delay increasing structure is interposed only in one of the in-phase signal wiring and the inverted-phase signal wiring, and the delay increasing structure is interposed only in another of the in-phase signal wiring and the inverted-phase signal wiring. | 06-19-2014 |
| 20140176254 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE - A high-frequency signal transmission line includes a dielectric body including a plurality of dielectric sheets. A signal line is provided in the dielectric body. A connector is mounted on a first main surface of the dielectric body and electrically connected to the signal line. A ground conductor is provided on a second main surface side of the dielectric body, compared with the signal line, and faces the signal line across the dielectric sheet. In the ground conductor, conductor-missing portions are provided in which no conductors are provided in at least portions of regions overlapping with the signal line in planar in connection portions. Adjustment conductors are provided in the second main surface of the dielectric body, and overlap with at least portions of the conductor-missing portions in the planar view. | 06-26-2014 |
| 20140191820 | COAXIAL-IMPEDANCE SYNTHESIZER - The invention relates to a coaxial-impedance synthesizer, comprising: a longitudinal central ( | 07-10-2014 |
| 20140203886 | Communications Connectors Including Transmission Lines Having Impedance Discontinuities that Improve Return Loss And/or Insertion Loss Performance and Related Methods - Communications plugs are provided that include a housing that receives the conductors of the communication cable. A printed circuit board is mounted at least partially within the housing. A plurality of plug contacts are on the printed circuit board, and the printed circuit board includes a plurality of conductive paths that electrically connect respective ones of the conductors to respective ones of the plug contacts. First and second of the conductive paths are arranged as a first differential pair of conductive paths that comprise a portion of a first differential transmission line through the communications plug, where the first differential transmission line includes a first transition region where the impedance of the first differential transmission line changes by at least 20% and a second transition region impedance of the first differential transmission line changes by at least 20%. | 07-24-2014 |
| 20140266496 | MICROWAVE CONNECTOR WITH FILTERING PROPERTIES - A microwave connector is provided. The microwave connector includes an outer conductor, an inner conductor disposed within the outer conductor and dielectric materials interposed between the outer conductor and the inner conductor, the dielectric materials including a non-dissipative dielectric material and a dissipative dielectric material. | 09-18-2014 |
| 20140312986 | TUNABLE INTERCONNECT STRUCTURES, AND INTEGRATED CIRCUIT CONTAINING THE SAME - Tunable interconnect structures, integrated circuits containing the tunable interconnect structures and methods of manufacturing the same are disclosed. The interconnect transmission line structure includes a signal conductor and a plurality of conductors in proximity to the signal conductor. The structure further includes one or more switchable conductors in proximity to at least the signal conductor. The one or more switchable conductors has a programmable wiring switch with a terminal connected to the one or more switchable conductors and another terminal connected to ground. | 10-23-2014 |
| 20140368291 | INSULATION CIRCUIT AND COMMUNICATION EQUIPMENT - Disclosed is an insulation circuit comprising: a first pattern formed on a first layer of a substrate, that receives high-frequency signals; a second pattern formed on this first layer next to the first pattern and that outputs the high-frequency signals received by the first pattern; a third pattern formed on a second layer different from the first layer of the substrate and connected with a signal ground, in such a way that the first and second patterns respectively overlap in plan view; and a fourth pattern formed on the second layer next to the third pattern and connected with a frame ground, in such a way that the first and second patterns respectively overlap in plan view. | 12-18-2014 |
| 20150035615 | VERTICAL MICROCOAXIAL INTERCONNECTS - In one embodiment, a vertical microcoaxial interconnect includes a dielectric substrate having a top side and a bottom side, an inner conductor extending through the substrate from its top side to its bottom side, an outer conductor that extends through the substrate from its top side to its bottom side, the outer conductor surrounding the inner conductor, a signal line extending to the inner conductor without contacting the outer conductor, and a ground line extending to the outer conductor without contacting the inner conductor or the signal line. | 02-05-2015 |
| 20150084714 | SIGNAL TRANSMISSION LINE - A signal transmission line is disclosed. The signal transmission line includes a dielectric substrate, a signal line formed on a first surface of the dielectric substrate, a first conductive layer formed on a second surface of the dielectric substrate, and a first stub formed on the first surface of the dielectric substrate, the first stub being electrically connected with the signal line. The first stub includes a plurality of straight areas each extending from a different position of the signal line, a conductor part extending in parallel with the signal line, the conductor part being electrically connected with straight areas, a projection part connected with the conductor part, the projection part extending from the conductor part, and an opening provided between the conductor part and the signal line. | 03-26-2015 |
| 20150097633 | 60 GHZ INTEGRATED CIRCUIT TO PRINTED CIRCUIT BOARD TRANSITIONS - Embodiments are directed to a transition structure for interfacing an integrated circuit chip and a substrate, comprising: a co-planar waveguide (CPW) structure formed based on ground-signal-ground (GSG) pads on the integrated circuit chip, a grounded co-planar waveguide (CPWG) structure coupled to the GSG pads, and a microstrip coupled to the CPWG structure. | 04-09-2015 |
| 20150381140 | METHOD AND APPARATUS FOR A MULTI-HARMONIC MATCHING NETWORK - A matching network and method for matching a source impedance to a load impedance is provided. A bias feed microstrip structure is coupled to a direct current (DC) voltage source and has a bias feed microstrip electrical length less than one fifth of a fundamental wavelength of a fundamental frequency component of an input signal. A harmonic impedance transformation network can be configured to compensate for parasitic reactances of a precursor element. A tuned impedance element presents a short circuit impedance at the second harmonic impedance transformation network terminal for harmonic frequency components and presents a higher impedance for the fundamental frequency component. A fundamental impedance transformation network is configured to match a fundamental impedance transformation network input impedance for the fundamental frequency component to a load impedance of a load. Multiple instances of the harmonic impedance transformation network and the tuned impedance element can be provided. | 12-31-2015 |
| 20160006102 | PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD FOR CAMERA MODULE - A printed circuit board and a printed circuit board includes a signal transmitting part; a ground part that includes an impedance adjusting part and a dummy part; and an insulating layer disposed between the signal transmitting part and the ground part. | 01-07-2016 |
| 20160099699 | Adjustable Impedance Matching Network - An impedance matching network includes a first terminal, a second terminal, and a reference potential terminal. The impedance matching network further includes a first shunt branch between the first terminal and the reference potential terminal, the first shunt branch including a capacitive element. The impedance matching network also includes a second shunt branch between the second terminal and the reference potential terminal, the second shunt branch including an inductive element. Furthermore, the impedance matching network includes a transmission line transformer with a first inductor path and a second inductor path, wherein the first inductor path connects the first terminal and the second terminal. An alternative impedance matching network includes a transformer and an adaptive matching network. The transformer is configured to transform an impedance connected to a first port so that a corresponding transformed impedance lies within a confined impedance region in a complex impedance plane. | 04-07-2016 |
| 20160173055 | IMPEDANCE MATCHING IN A TRANSMISSION LINE | 06-16-2016 |
| 20160182004 | Integrated Tunable Impedance Network | 06-23-2016 |
