| Entries |
| Document | Title | Date |
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| 20080238583 | DISCRETE COMPONENT ELECTROMAGNETIC COUPLER - In some embodiments a discrete component electromagnetic coupler includes an input and an output, wherein a signal to be observed passes through the coupler via the input and the output, a coupler to transfer energy through electromagnetic effects to a second output, and a termination point to ground through a resistance. Other embodiments are described and claimed. | 10-02-2008 |
| 20080303611 | Apparatus for Transferring Broadband, High-Frequency Signals - An apparatus for the transfer of broadband, high-frequency signals of a center wavelength (λ | 12-11-2008 |
| 20090021329 | CHIP-LEVEL THROUGH HOLE STRUCTURE OF ELECTRONIC PACKAGE - A through-hole structure for a wafer level packaging includes a wafer, a RF passage penetrating through the wafer, and a through-hole structure disposed around the RF passage. The through-hole structure has three types of structure. The through hole structure includes a plurality of holes filled with metal material thereinside. On the other hand, the through hole structure can be a plurality of holes coated with a metal layer on the internal surface thereof. Alternatively, the through hole structure has both of the two above hole structure. Depending on the structure, the through hole structure performs an electric reference for preventing the RF signal from decay or interference. | 01-22-2009 |
| 20090021330 | HANDHELD TERMINAL - A first unit and a second unit are connected rotatably by a hinge. A first coil and a second coil for performing communication between the first unit and the second unit by facing each other are arranged at the first unit and the second unit, respectively. A movable body is provided at the second unit. The movable body projects from the second unit due to elastic force arid is adapted to displace toward a failing direction against the elastic force by contacting with the first unit during a process of opening of the first unit with respect to the second unit. The second coil is located at the movable body, and the first coil is located at a portion of the first unit that is contacted by the movable body during the process of opening the first unit with respect to the second unit. | 01-22-2009 |
| 20090079522 | COMPONENT-LESS TERMINATION FOR ELECTROMAGNETIC COUPLERS USED IN HIGH SPEED/FREQUENCY DIFFERENTIAL SIGNALING - Component-less termination for electromagnetic couplers used in high speed/frequency differential signaling is described. In one embodiment, the apparatus includes a first signal line and a second signal line forming a differential pair, a first electromagnetic coupler to provide sampled electromagnetic signals from the first signal line, and a second electromagnetic coupler to provide sampled electromagnetic signals from the second signal line, wherein the first electromagnetic coupler is far end short circuited and wherein the second electromagnetic coupler is far end open circuited. Other embodiments are also described and claimed. | 03-26-2009 |
| 20090085697 | METHOD AND APPARATUS FOR ANALOG VALIDATION OF HIGH SPEED BUSES USING ELECTROMAGNETIC COUPLERS - In at least one embodiment an apparatus is provided that includes an electromagnetic coupler to provide sampled electromagnetic signals and an electronics component to receive the sampled electromagnetic signals from the electromagnetic coupler, to amplify and recover a derivative-like output signal, and to provide recovered sampled electromagnetic signals to an oscilloscope with a unity transfer function. Other embodiments may be described and claimed. | 04-02-2009 |
| 20090096555 | MOTHERBOARD - A motherboard includes a signal control chip, a signal switch chip connected to the signal control chip via a plurality of first transmission lines, and a complex connector configured for connecting to a first type of transmission device or a second type of transmission device. The signal control chip is connected to the complex connector via the first transmission lines and a plurality of second transmission lines. The signal switch chip is electrically connected to the complex connector via a plurality of third transmission lines. Each second transmission line is connected in series with a first resistor. Each third transmission line is connected in series with a second resistor. When the first type of transmission device is mounted on the complex connector, the signal switch chip and the second resistors are removed. When the second type of transmission device is mounted on the complex connector, the first resistors are removed. | 04-16-2009 |
| 20090096556 | HIGH-FREQUENCY ELECTRIC FIELD COUPLER, COMMUNICATION SYSTEM, AND COMMUNICATION APPARATUS - A high-frequency electric field coupler is provided for use in a contactless communication system propagating high frequency signals in a wide band utilizing electric field coupling. The coupler includes a coupling electrode and a resonance unit operating to increase the amplitude of an electrical charge accumulated at the coupling electrode at a predetermined resonance frequency. The coupling electrode is a linear conductor in the form of a coil. | 04-16-2009 |
| 20090108964 | Ethernet Coupling - Improved coupler for Ethernet over twisted pair. An improved coupler has a first common mode choke for connecting an Ethernet PHY to the primary winding of a transformer. The secondary winding of the transformer connects through a second common mode choke for connection to a twisted pair line. In one embodiment, the first common mode choke, transformer, and second common mode choke are placed in the same package. In a second environment, a plurality of choke-transformer-choke units are placed in the same package. In a third embodiment, the plurality of choke-transformer-choke units may be integrated into a connector. Pairs of the second common mode chokes may share cores. | 04-30-2009 |
| 20090167465 | APPARATUS AND SYSTEMS FOR ELECTRICALLY ISOLATING AND TRANSMITTING RF SIGNALS BETWEEN TWO DEVICES - Various embodiments of apparatus and systems are provided for electrically isolating two devices while transferring power and RF signals therebetween. An electrical isolation apparatus includes an isolation transformer that operates to transfer electrical power between first and second devices. The electrical isolation apparatus also includes a decoupling device that transfers radio frequency (RF) signals between the first and second devices. The isolation transformer and the opto-isolator cooperatively operate to electrically isolate the first device from the second device. | 07-02-2009 |
| 20090189717 | CIRCULAR POLARIZED COUPLING DEVICE - A coupling device for transmitting a wireless signal is provided. The coupling device includes a substrate, a ground layer and a feed conductor. The substrate includes a first surface and a second surface opposite to the first surface. The ground layer is disposed on the second surface having a circular opening, and the circular opening has an opening edge and an opening center. The feed conductor extends on the first surface, including a conductive portion and a feed portion connected thereto. The feed portion corresponds to the circular opening, wherein the opening center is on a base line, a radial line is formed between the opening center and the opening edge, a radial distance is formed on the radial line between the opening edge and the feed portion, and a length of the radial distance varies with an angle between the radial line and the base line. | 07-30-2009 |
| 20090195335 | SEMICONDUCTOR CONFIGURATION HAVING AN INTEGRATED COUPLER AND METHOD FOR MANUFACTURING SUCH A SEMICONDUCTOR CONFIGURATION - A semiconductor configuration having an integrated coupler is provided. The semiconductor configuration includes a coupler which is integrated in the substrate and which includes a first port and a second port. The coupler defines, in a plan view onto the substrate, an inner region of the substrate surrounded at least in sections by the coupler, and an outer region of the substrate arranged outside to the coupler. The coupler is at least a magnetic coupler, a capacitive coupler, or a combination of both. At least a circuit element is integrated in the inner region of the substrate and includes a port which is electrically connected to the second port of the coupler. | 08-06-2009 |
| 20090212887 | METHOD AND SYSTEM FOR PROCESSING SIGNALS VIA DIRECTIONAL COUPLERS EMBEDDED IN AN INTEGRATED CIRCUIT PACKAGE - Methods and systems for processing signals via directional couplers embedded in an integrated circuit package are disclosed and may include generating via a directional coupler, one or more output RF signals that may be proportional to a received RF signal. The directional coupler may be integrated in a multi-layer package. The generated RF signal may be processed by an integrated circuit electrically coupled to the multi-layer package. The directional coupler may include quarter wavelength transmission lines, which may include microstrip or coplanar structures. The directional coupler may be electrically coupled to one or more variable capacitances in the integrated circuit. The variable capacitance may include CMOS devices in the integrated circuit. The directional coupler may include discrete devices, which may be surface mount devices coupled to the multi-layer package or may be devices integrated in the integrated circuit. The integrated circuit may be flip-chip bonded to the multi-layer package. | 08-27-2009 |
| 20090243765 | Bidirectional, DC-isolated transmission channel - Arrangement and method for electrically isolated transmission of direct-current and alternating-current signals. The signals can be transmitted in both directions via the same and only DC-isolated channel. The arrangement comprises a first transmit-and-receive system ( | 10-01-2009 |
| 20090251236 | TRANSMISSION PATH FOR USE IN RF FIELDS - A transmission path ( | 10-08-2009 |
| 20090273418 | COMMUNICATION SYSTEM AND ANTENNA APPARATUS - An antenna apparatus for use in a transmitter or a receiver in a communication system. The antenna apparatus includes: a dielectric substrate having a conductor layer on one of surfaces; and a slot antenna including an antenna electrode formed on the one surface and disposed substantially at the center, a grounded conductive surface surrounding the antenna electrode, and a slot transmission line made by a gap between the antenna electrode and the grounded conductive surface. | 11-05-2009 |
| 20090278632 | ELECTRONIC APPARATUS - An image reading apparatus that operates in accordance with a driving signal at a predetermined frequency includes a document illumination board with a wiring pattern made of a conductor, wherein an inductor is provided at an interval smaller than a predetermined interval onto a wiring pattern having a length equal to or larger than a predetermined length at which resonance is generated due to the driving signal having the predetermined frequency. | 11-12-2009 |
| 20090295512 | Circuit Module with Non-Contacting Microwave Interlayer Interconnect - A circuit module may include a first substrate having a first side and a second side, a second substrate having a third side and a fourth side, the third side facing the second side, and a resilient bond layer coupling the second side to the third side. The first substrate may have a first coefficient of thermal expansion and the second substrate may have a second coefficient of thermal expansion substantially different from the first coefficient of thermal expansion. A broadside coupler may couple a microwave signal from the first substrate to the second substrate. The broadside coupler may include a first conductive element formed on the second side and a second conductive element formed on the third side proximate the first conductive element. | 12-03-2009 |
| 20090315650 | METHOD AND SYSTEM FOR AN INTEGRATED CIRCUIT WITH FERROMAGNETIC LAYERS - Methods and systems for an integrated circuit package with ferrimagnetic and/or ferromagnetic layers are disclosed and may include processing a received signal via a single chip comprising one or more integrated layers of ferrimagnetic and/or ferromagnetic material. The received signal may be amplified via the single chip and the one or more integrated layers of ferrimagnetic material and/or ferromagnetic material. Circuits within the single chip may be impedance matched via the one or more integrated layers of ferrimagnetic material and/or ferromagnetic material. The received signal may comprise a microwave signal. The ferromagnetic and/or ferrimagnetic material may be deposited on and/or within the single chip. The ferromagnetic and/or ferrimagnetic material may be deposited on the single chip via an ink printing, spin-on, electron beam deposition, and/or an evaporation technique. | 12-24-2009 |
| 20090315651 | WIRELESS TRANSMISSION PACKAGE DEVICE - A wireless transmission package device comprises a first signal pin, a second signal pin; and a third signal pin. The second signal pin and the third signal form a signal input-output transmission channel when the first signal pin is not connected to an external load, whereas the second signal pin and the first signal pin form the signal input-output transmission channel when the first signal pin is connected to an external load. | 12-24-2009 |
| 20100026422 | Electric circuit - In an electric circuit ( | 02-04-2010 |
| 20100045407 | ELECTROMAGNETICALLY COUPLED INTERCONNECT SYSTEM ARCHITECTURE - An electromagnetic interconnect method and apparatus effects contactless, proximity connections between elements in an electronics system. Data to be communicated between elements in an electronic system are modulated into a carrier signal and transmitted contactlessly by electromagnetic coupling. The electromagnetic coupling may be directly between elements in the system or through an intermediary transmission medium. | 02-25-2010 |
| 20100052826 | ISOLATOR WITH COMPLEMENTARY CONFIGURABLE MEMORY - An isolator that includes first and second substantially identical circuitry galvanically isolated from each other and each having at least one communications channel thereon for communicating signals across an isolation boundary therebetween and each of said first and second circuitry having configurable functionality associated with the operation thereof. A coupling device is provided for coupling signal across the isolation boundary between the at least one communication channels of the first and second circuitry. First and second configuration memories are provided, each associated with a respective one of the first and second circuitry. First and second configuration control devices are provided, each associated with a respective one of the first and second circuitry and each configuring the functionality of the associated one of the first and second circuitry. The first and second configurable memories have stored therein complementary configuration information to control each of the functionalities of the first and second circuitry to operate in a complementary manner for communication of signals across the isolation boundary. | 03-04-2010 |
| 20100079223 | MINIATURIZED DUAL-BALANCED MIXER CIRCUIT BASED ON A TRIFILAR LAYOUT ARCHITECTURE - A miniaturized dual-balanced mixer circuit based on a trifilar layout architecture is proposed, which is designed for use to provide a frequency mixing function for millimeter wave (MMW) signals, and which features a downsized circuit layout architecture that allows IC implementation to be more miniaturized than the conventional star-type dual-balanced mixer (DBM). The proposed miniaturized dual-balanced mixer circuit is distinguished from the conventional star-type DBM particularly in the use of a trifilar layout architecture for the layout of two balun circuit units. This feature allows the required layout area to be only about 20% of that of the conventional star-type DBM. | 04-01-2010 |
| 20100102904 | FLUXONIC DEVICES - A fluxonic device including a closed loop transmission line; an additional transmission line and a junction at which the closed loop transmission line and the additional transmission line meet. An apparatus including a fluxon container for containing one or more fluxons; a fluxon interface along which a fluxon can propagate; a junction where the fluxon container and fluxon interface meet; and a controller for controlling a fluxon at the junction. An electromagnetic radiation generator comprising: a fluxon transmission line having a length, a depth and a width and including a perturbation in the length-wise direction; a mechanism for applying a driving electric current in a depth-wise direction; and a magnetic field generator for generating a magnetic field in a width-wise direction. | 04-29-2010 |
| 20100127803 | Signal transmitting device - A magnetic coupling-type isolator includes a primary coil configured to generate a first magnetic field in accordance with an input signal, a bias coil configured to generate a second magnetic field in accordance with a bias signal, a first magneto-resistive element having a magnetic resistance increased by the first magnetic field and decreased by the second magnetic field, a second magneto-resistive element having a magnetic resistance decreased by the first magnetic field and increased by the second magnetic field, and a comparator configured to output an output signal in accordance with a difference between the magnetic resistance of the first magneto-resistive element and the magnetic resistance of the second magneto-resistive element. | 05-27-2010 |
| 20100244998 | Apparatuses And Methods For Coupling A Signal To And/Or From A Cable - Apparatuses and methods for coupling a signal to and from a twisted pair cable by non-contact coupling with twisted pairs in the twisted pair cable, such that the signal propagates along the cable between at least two of the twisted pairs. In particular, a coupling unit for coupling a voltage signal to and/or from such a cable, the coupling unit having a first electrode and a second electrode. The electrodes may be electrically isolated from a voltage signal generator and/or a voltage signal processor. | 09-30-2010 |
| 20100327997 | HIGH-FREQUENCY COUPLER AND COMMUNICATION DEVICE - A high-frequency coupler includes ground; a coupling electrode being supported so that the coupling electrode is placed opposite the ground and separately placed at a height from the ground, the height being negligible relative to the wavelength of the high-frequency signal; a resonator increasing electric current entering the coupling electrode through a transmission path; and a stretchable/retractable connection section connecting a predetermined position on the coupling electrode and the resonator; wherein an infinitesimal dipole is formed, the infinitesimal dipole including a line segment which connects the center of electric charge accumulated in the coupling electrode and the center of mirror-electric charge accumulated in the ground, and the high-frequency signal is transmitted to another high-frequency coupler at a communication partner side, which is placed opposite the high-frequency coupler so that the angle between the direction of the infinitesimal dipole and the direction from the high-frequency coupler toward the other high-frequency coupler is nearly zero. | 12-30-2010 |
| 20110001587 | DIE-TO-DIE ELECTRICAL ISOLATION IN A SEMICONDUCTOR PACKAGE - Some of the embodiments of the present disclosure provide a semiconductor package comprising a first die; a second die; and an inductor arrangement configured to inductively couple the first die and the second die while maintaining electrical isolation between active circuit components of the first die and active circuit components of the second die. Other embodiments are also described and claimed. | 01-06-2011 |
| 20110006864 | HIGH FREQUENCY COUPLER AND COMMUNICATION DEVICE - A high frequency coupler includes a ground, a first coupling electrode connected via a first resonator unit to an input and output terminal of a communication circuit, and one or more second coupling electrodes connected via a second resonator unit designed utilizing a ground to a ground terminal of the communication circuit. | 01-13-2011 |
| 20110090030 | SIGNAL TRASMISSION THROUGH LC RESONANT CIRCUITS - An embodiment of an electronic system includes a first electronic circuit and a second electronic circuit. The electronic system further includes a resonant LC circuit having a resonance frequency for coupling the first electronic circuit and the second electronic circuit; each electronic circuit includes functional means for providing a signal at the resonance frequency to be transmitted to the other electronic circuit through the LC circuit and/or for receiving the signal from the other electronic circuit. The LC circuit also include capacitor means having at least one first capacitor plate included in the first electronic circuit and at least one second capacitor plate included in the second electronic circuit. The LC circuit further includes first inductor means included in the first electronic circuit and/or second inductor means included in the second electronic circuit. The at least one capacitor plate of each electronic circuit is coupled with the corresponding functional means through the possible corresponding inductor means. | 04-21-2011 |
| 20110133865 | Technique for conveying a wireless-standard signal through a barrier - The RF signal generated by a ZigBee radio on the outside of a building structure is conveyed to the interior of the building by guiding it along an electric cable bundle that passes through the building's wall to supply domestic electric power to the interior of the structure. The RF signal is launched by a unique coupler comprising a pair of insulated foil conductors. | 06-09-2011 |
| 20110133866 | COUPLER AND WIRELESS COMMUNICATION DEVICE USING COUPLER - A coupler is provided on a printed board including a feeder circuit and a grounded circuit. The coupler includes a first line, a short-circuited line and an open-ended line. The first line has two ends. One of the ends is a feed point of the coupler connected to the feeder circuit, and another one of the ends is a node of the coupler. The short-circuited line is extended from the node to an end short-circuited to the grounded circuit. The open-ended line is extended from the node. | 06-09-2011 |
| 20110140811 | Millimeter-Wave Chip Packaging and Interface - A system enabling interface between a millimeter-wave bare-die and a Printed Circuit Board (PCB). A cavity of depth X is formed in at least one lamina of a PCB. Three electrically conductive pads are printed on one of the laminas of the PCB, the pads optionally reach the edge of the cavity. A bare-die Integrated Circuit having a thickness of optionally X, or a heightened bare-die Integrated Circuit having a thickness of optionally X, output a millimeter-wave signal from three electrically conductive contacts arranged in a ground-signal-ground configuration on an upper side edge of the bare-die Integrated Circuit. The bare-die Integrated Circuit is placed inside the cavity, optionally such that the electrically conductive pads and the upper side edge containing the electrically conductive contacts are arranged side-by-side at substantially the same height. Three bonding wires or strips electrically connect each electrically conductive contact to one of the electrically conductive pads. | 06-16-2011 |
| 20110148549 | Signal Transmission Arrangement - A signal transmission arrangement includes input terminals for receiving an input signal and output terminals for providing an output signal. A first transformer has a primary winding and a secondary winding, the primary winding being coupled to the input terminals. A second transformer has a primary winding and a secondary winding, the primary winding being coupled to the secondary winding of the first transformer, and the secondary winding being coupled to the output terminals. | 06-23-2011 |
| 20110156843 | PRINTED CIRCUIT BOARD AND TRANSMITTING/RECEIVING MODULE INCLUDING THE SAME - A printed circuit board and a transmitting/receiving module including the same are disclosed. The printed circuit board in accordance with an embodiment of the present invention can include a substrate, a first transmission line, which is formed on one surface of the substrate and transmits an inputted data signal, and a second transmission line, which is capacitively connected to the first transmission line. Here, the first transmission line and the second transmission line transmit an ascending edge and a descending edge of the inputted data signal. | 06-30-2011 |
| 20110181374 | Apparatuses And Methods For Coupling A Signal To And/Or From A Cable - Apparatuses and methods for coupling a signal to and from a twisted pair cable by non-contact coupling with twisted pairs in the twisted pair cable, such that the signal propagates along the cable between at least two of the twisted pairs. In particular, a coupling unit for coupling a voltage signal to and/or from such a cable, the coupling unit having a first electrode and a second electrode. The electrodes may be electrically isolated from a voltage signal generator and/or a voltage signal processor. | 07-28-2011 |
| 20110193659 | Scalable Millimeter Wave Power Source - An apparatus comprises a structure, an array of oscillator units, a plurality of waveguides in the structure, and a synchronizing cavity located within the structure. The array of oscillator units has a plurality of rows and a plurality of columns associated with the structure. Oscillator units in a row within the array of oscillator units are directly coupled to each other. The plurality of waveguides is configured to couple the array of oscillator units to the synchronizing cavity. The synchronizing cavity is configured to cause the array of oscillator units to operate at substantially a common frequency. | 08-11-2011 |
| 20110241804 | HIGH-FREQUENCY COUPLER AND COMMUNICATION DEVICE - A high-frequency coupler and a communication device are compact, capable of efficiently communicating a large volume of data over a short distance and can be used in combination with a non-contact IC card. The high-frequency coupler includes magnetic-field-generating patterns and a surrounding pattern disposed around a periphery thereof, and is used to communicate a large volume of data over a short distance in a communication system that uses broadband frequencies. Out of the magnetic fields radiated in directions perpendicular or substantially perpendicular to the plane of the patterns from the magnetic-field-generating patterns, portions extending laterally in the plane of the patterns are blocked by the surrounding pattern, the magnetic fields are lengthened in a direction perpendicular or substantially perpendicular to the plane of the patterns and the communication distance is increased. | 10-06-2011 |
| 20110248801 | GROUND LOOP ISOLATOR FOR A COAXIAL CABLE - A ground loop isolator for a coaxial cable, for example that blocks DC current but which allows a desired band of RF through the ground loop isolator, and which is small enough to fit in the areas where coupling of the desired electronic equipment is to occur. Embodiments may include an outer area allowing for easier manual coupling of the coaxial cable connector nut to electronic devices. | 10-13-2011 |
| 20110254643 | COMMUNICATION DEVICE AND COMMUNICATION SYSTEM - There is provided a communication system including a transmitter and a receiver, each including a communication circuit unit that processes a high-frequency signal for transmitting data, a band-pass filter, and a high frequency coupler, a distributed constant line connecting the high frequency coupler and the band-pass filter of the transmitter, and a distributed constant line connecting the high frequency coupler and the band-pass filter of the receiver, wherein an electrical length of the distributed constant line of the transmitter is different from an electrical length of the distributed constant line of the receiver. | 10-20-2011 |
| 20110273247 | HIGH-FREQUENCY ELECTRIC FIELD COUPLER, COMMUNICATION SYSTEM, AND COMMUNICATION APPARATUS - A high-frequency electric field coupler is provided for use in a contactless communication system propagating high frequency signals in a wide band utilizing electric field coupling. The coupler includes a coupling electrode and a resonance unit operating to increase the amplitude of an electrical charge accumulated at the coupling electrode at a predetermined resonance frequency. The coupling electrode is a linear conductor in the form of a coil. | 11-10-2011 |
| 20120001705 | High-Frequency Coupler - A high-frequency coupler used in communication of high frequency signals, which aims to provide a high-frequency coupler satisfying both constant communication quality and thinning. The high-frequency coupler includes a circuit board and a toroidal coil. The circuit board includes a first receiving passageway and a second receiving passageway. The toroidal coil extends through the first receiving passageway and the second receiving passageway between a first surface and a second surface of the circuit board. The toroidal coil orbits on both sides of the first surface and the second surface in a circular shape. The toroidal coil reverses an orbiting direction at a position substantially near a half of a length of the toroidal coil. | 01-05-2012 |
| 20120007700 | ELECTROMAGNETIC COUPLER AND INFORMATION COMMUNICATION DEVICE INCLUDING SAME - There is provided an electromagnetic coupler, which includes: a first conductor pattern and at least one second conductor pattern separated from the first conductor pattern, the first conductor pattern and the at least one second conductor pattern being formed in a first conductor layer; a feed pattern connected to a feeding system and a ground pattern separated from the feed pattern, the feed pattern and the ground pattern being composed of a conductor and formed in a second conductor layer; and a plurality of linear conductors electrically connecting the first conductor pattern with the feed pattern and connecting the second conductor pattern with the ground pattern, the plurality of linear conductors being formed between the first conductor layer and the second conductor layer. Furthermore, the first conductor layer and the second conductor layer are parallel to each other. | 01-12-2012 |
| 20120007701 | COMMUNICATION CONTROL METHOD AND COMMUNICATION SYSTEM - A communication control method according to the present invention is a communication control method for a communication system using a common AC coupling element for transmitting and receiving signals between first and second circuits, the method including: setting a first transmission circuit Tx | 01-12-2012 |
| 20120013422 | SIGNAL TRANSMISSION COMMUNICATION UNIT AND COUPLER - This disclosure provides a signal transmission communication unit and a coupler that can occupy a small area and have a reduced thickness. The signal transmission communication unit includes a base component including a signal transmission line and a ground electrode, a coupling planar conductor parallel to the base component and having a planar shape, an inductor circuit connected between the coupling planar conductor and the signal transmission line, and an LC-series circuits between part of the coupling planar conductor and the ground electrode and including a capacitor and an inductor connected in series. The inductor circuit is provided between the coupling planar conductor and the base component, and the LC-series connected circuit is provided between the coupling planar conductor and the base component. | 01-19-2012 |
| 20120032761 | ELECTROMAGNETIC COUPLER AND INFORMATION COMMUNICATION DEVICE INCLUDING SAME - There is provided an electromagnetic coupler, which includes: a conductor pattern formed in a first conductor layer; a feed pattern connected to a feeding system and a ground pattern separated from the feed pattern, the feed pattern and the ground pattern being formed in a second conductor layer parallel to the first conductor layer; and a first linear conductor and a plurality of second linear conductors formed perpendicularly to the first and the second conductor layers, the first linear conductor connecting the conductor pattern and the feed pattern, the plurality of second linear conductors connecting the conductor pattern and the ground pattern. In addition, the conductor pattern is symmetrical in shape with respect to the connection point between the conductor pattern and the first linear conductor; and the plurality of second linear conductors are symmetrical in position with respect to the first linear conductor in a planar view. | 02-09-2012 |
| 20120038437 | LOW-LOSS TUNABLE RADIO FREQUENCY FILTER - A tunable RF filter comprises a signal transmission path having an input and output, a plurality of resonant elements disposed along the signal transmission path between the input and output, and a set of non-resonant elements coupling the resonant elements together to form a stop band having a plurality of transmission zeroes corresponding to respective frequencies of the resonant elements, and at least one sub-band between the transmission zeroes. The set of non-resonant elements comprises a first plurality of non-resonant elements respectively coupled in parallel with the resonant elements, and a second plurality of non-resonant elements respectively coupled in series with the resonant elements. The first plurality of non-resonant elements comprises at least one variable non-resonant element for selectively introducing at least one reflection zero within the stop band to create a pass band in one of the one sub-band(s) without varying any of the second plurality of non-resonant elements. | 02-16-2012 |
| 20120086526 | WIRELESS IC DEVICE AND COUPLING METHOD FOR POWER FEEDING CIRCUIT AND RADIATION PLATE - A wireless IC device includes a wireless IC chip, a power feeding circuit substrate including a power feeding circuit including inductance elements, and radiation plates including plate-shaped coupling units. The inductance elements have spiral shapes and are wound in directions opposite to each other. The plate-shaped coupling units in the radiation plates are disposed in a vicinity of the inductance elements so as to be perpendicular or substantially perpendicular to the winding axes of the inductance elements, and eddy currents occur in the plate-shaped coupling units so as to couple the power feeding circuit and the radiation plates with each other. The plate-shaped coupling units may also have spiral shapes. | 04-12-2012 |
| 20120176208 | Electromagnetic coupler and information communication device with same mounted thereon - An electromagnetic coupler includes a first plane, a plurality of conductive patterns formed on the first plane and spaced apart from each other, a second plane parallel to the first plane, a ground pattern formed on the second plane and connected to ground, a first linear conductor formed to have a length shorter than ¼ a wavelength equivalent to a frequency used, the first linear conductor being connected at one end to one conductive pattern of the plural conductive patterns, and fed between an other end of the first linear conductor and the ground pattern, and a plurality of second linear conductors formed to have a length shorter than ¼ the wavelength equivalent to the frequency used, one or more of the second linear conductors being formed for each of the plural conductive patterns, to connect each of the plural conductive patterns and the ground pattern. | 07-12-2012 |
| 20120176209 | INTERFACE CIRCUIT - Presented is an interface circuit for connecting a RF antenna to a RF device. The interface circuit comprises: a first terminal adapted to connect to the RF antenna; a second terminal adapted to connect to the RF device; an inductive load connected to the second terminal; a first switch adapted to connect the inductive load to the first terminal; and a resistive load connected to the second terminal via a second switch | 07-12-2012 |
| 20120212306 | ISOLATION DEVICES THAT PASS COUPLER OUTPUT SIGNALS - Various embodiments are directed to isolation devices, systems, methods and various means, for isolating ignition causing signals and/or explosions from hazardous or explosive environments. | 08-23-2012 |
| 20120218061 | Transmission Lines Applied to Contact Free Slip Rings - A non-contacting rotary interface has a first core with a first pair of balanced transmission lines coupled to the first core and a second core moveable in relation to the first core with a second pair of balanced transmission lines coupled to the second core and configured to receive signals from the first pair of balanced transmission lines. The first pair of balanced transmission lines has a first transmit wire coupled to a termination point at a first end of the first transmit wire, a first transceiver coupled to the first transmit wire at a second end of the first transmit wire, a second transmit wire coupled to the termination point at a first end of the second transmit wire, and a second transceiver coupled to the second transmit wire at a second end of the second transmit wire. The balanced transmission lines may be electrical traces on a circuit board. | 08-30-2012 |
| 20120235773 | SIGNAL TRANSMISSION DEVICE, FILTER, AND INTER-SUBSTRATE COMMUNICATION DEVICE - A signal transmission device includes: a first substrate and a second substrate; a first resonance section including a first resonator and a second resonator electromagnetically coupled to each other; a second resonance section disposed side-by-side relative to the first resonance section, and electromagnetically coupled to the first resonance section to perform a signal transmission between the first and second resonance sections; and a first shielding electrode disposed between the first resonator and the second substrate and partially covering the first resonator to allow at least an open end of the first resonator to be covered therewith, and a second shielding electrode disposed between the second resonator and the first substrate and partially covering the second resonator to allow at least an open end of the second resonator to be covered therewith. | 09-20-2012 |
| 20120262254 | Antenna Coupler - In an antenna coupler, a multilayer printed-circuit board has conductor levels which are electrically isolated from one another in the depth direction. A first radio-frequency line coupled to the antenna is arranged in a first conductor level, while a second radio-frequency line coupled on the appliance side is arranged in a second conductor level of the board. The board has an electrically insulating core layer, with the first and second conductor levels extending on the same of the two faces of the core layer and with the second radio-frequency line at a greater distance from the core layer than the first radio-frequency line. Furthermore, the second radio-frequency line is arranged on an outer surface of the board. The antenna coupler comprises an electrically conductive shielding structure designed to shield the first radio-frequency line and appliance-side metal parts, which are not part of the antenna coupler, against interaction with radio-frequency signals. | 10-18-2012 |
| 20120274425 | WIDEBAND ACTIVE QUASI-CIRCULATOR - Aspects describe a wideband active quasi-circulator that has the advantages of small size, lightweight, and compatibility with monolithic microwave integrated circuit (MMIC) technology. An active quasi-circulator is provided that comprises both a power amplifier and a low noise amplifier. The active quasi-circulator can operate over a wide frequency range with isolation or substantial isolation between a power amplifier and a low noise amplifier that is tunable with isolation or substantial isolation at any frequency within the wide frequency range. The provided quasi-circulator is suitable for use in mobile units in multi-band radio frequency communication systems, as well as in other configurations. | 11-01-2012 |
| 20120274426 | COUPLER AND ELECTRONIC APPARATUS - According to one embodiment, a coupler transmits and receives an electromagnetic wave by electromagnetic coupling between the coupler and another coupler. The coupler includes a line-shaped coupling element having a first open end and a second open end, a ground plane, a feeding element connecting the coupling element and a feed point, and a short circuiting element connecting the coupling element and the ground plane. The feeding element comprises a first end connected to an intermediate portion of the coupling element between the first open end and the second open end, and a second end connected to the feed point. The short circuiting element comprises a third end connected to the intermediate portion of the coupling element, and a fourth end connected to the ground plane. | 11-01-2012 |
| 20130002376 | MISALIGNMENT TOLERANT CONTACTLESS RF COUPLING DEVICE - Some embodiments relate to a contactless RF coupling device that includes a first substrate and a second substrate. The RF coupling device may provide a broadband, low loss electrical connection without mechanical contact as would a conventional mechanical connector. The first substrate includes a first ground plane on one side and a first transmission line on an opposing side. The first transmission line includes an enlarged first coupling member at an end of the first transmission line. The second substrate includes a second ground plane on one side and a second transmission line on an opposing side. The second transmission line includes an enlarged second coupling member at an end of the second transmission line. The first ground plane may not extend under the first coupling member and the second ground plane may include an opening that is aligned with the second coupling member. | 01-03-2013 |
| 20130063230 | BROAD-BAND COUPLING TRANSDUCERS FOR WAVEGUIDES - A method of producing a waveguide and a coupling transducer for connecting the waveguide to a load is disclosed. The method comprises: forming a series of similar circuits each circuit comprising two capacitors and at least one inductor section, the circuits being coupled to together to form the waveguide; and removing one of the capacitors and at least part of the at least one inductor section from one of the circuits to form the coupling transducer. | 03-14-2013 |
| 20130076460 | Technique for Conveying a Wireless-Standard Signal Through a Barrier - The RF signal generated by a ZigBee radio on the outside of a building structure is conveyed to the interior of the building by guiding it along an electric cable bundle that passes through the building's wall to supply domestic electric power to the interior of the structure. The RF signal is launched by a unique coupler comprising a pair of insulated foil conductors. | 03-28-2013 |
| 20130106538 | INDUCTOR COMPRISING ARRAYED CAPACITORS | 05-02-2013 |
| 20130141191 | ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD - An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency. | 06-06-2013 |
| 20130169385 | CONTACTLESS DATA COMMUNICATIONS COUPLING - A coupler for coupling a first and a second section of a transmission line embedded in a first and a second component respectively, includes a first half-coupler including a first electrically conductive housing, a first electrically conductive structure, and a first structure of dielectric material, and a second half-coupler including a second electrically conductive housing, a second electrically conductive structure, and a second structure of dielectric material. When the first and second components are connected end-to-end, the first and second housings come into contact to form together an electromagnetic cavity, inside which the first and second conductive structures are separated from each other by the first and second dielectric structures, so as to allow the first and second conductive structures to be in electromagnetic communication with each other. | 07-04-2013 |
| 20130181791 | WAVEGUIDE STRUCTURE FOR A CONTACTLESS CONNECTOR - A contactless connector includes a first communication chip configured to at least one of transmit and receive wireless RF signals, a second communication chip configured to at least one of transmit and receive wireless RF signals, and a waveguide structure between the first and second communication chips. The waveguide structure conveys RF signals between the first and second communication chips. | 07-18-2013 |
| 20130187731 | MODULAR INTERFACE SYSTEMS AND METHODS - Interface systems and methods are provided. An interface system can include a first isolator ( | 07-25-2013 |
| 20130314180 | CONNECTING MULTIPLE ELECTRONIC DEVICES - A data processing system is proposed which comprises two electronic devices, each of them having an electro-magnetic coupler embedded on the exterior casing, at least one of the electronic device having one or more sliding surfaces for directing relative movement between the two devices, such that they automatically come into correct alignment during the sliding. | 11-28-2013 |
| 20130314181 | COUPLER - An electromagnetic coupler comprising: a transmitter configured to operate at a first central frequency, a first termination configured to connect to the transmitter and having a second resonant frequency, a receiver configured to operate at the first frequency, a second termination configured to connect to the receiver and having a third resonant frequency, wherein when the first and second terminations are bought into close proximity when engaged, the equivalent resonant frequency is substantially the first frequency, and wherein the second and/or third frequencies being substantially spectrally spaced from the first frequency. | 11-28-2013 |
| 20130314182 | SIGNAL TRANSMISSION DEVICE AND ELECTRONIC DEVICE - Provided is a signal transmission device including a high-frequency signal waveguide that transmits a high-frequency signal emitted from an electronic device. When the electronic device is arranged close to the high-frequency signal waveguide, the high-frequency signal is transmitted via the high-frequency signal waveguide. | 11-28-2013 |
| 20130328646 | ELECTROMAGNETIC COUPLING STRUCTURE, MULTILAYERED TRANSMISSION LINE PLATE, METHOD FOR PRODUCING ELECTROMAGNETIC COUPLING STRUCTURE, AND METHOD FOR PRODUCING MULTILAYERED TRANSMISSION LINE PLATE - This electromagnetic coupling structure includes a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers, one pair of outer dielectric layers facing each other with the laminated body interposed therebetween, and one pair of outer conductive layers facing each other with the one pair of outer dielectric layers interposed therebetween. The one pair of outer conductive layers include wiring portions and conductive patch portions disposed at front ends of the wiring portions, and the conductive patch portions have portions longer than the wiring portions in a direction perpendicular to an extending direction of the wiring portions. In the laminated body, a hole passing through the inner dielectric layer and the inner conductive layers is arranged, and the one pair of outer conductive layers are electromagnetically coupled through a metal film formed inside the hole. | 12-12-2013 |
| 20140002212 | ELECTROMAGNETIC RESONANCE COUPLER | 01-02-2014 |
| 20140049345 | RESONANCE COUPLER - A resonance coupler includes transmission-side resonant wiring provided on a transmission substrate and connected to a transmission ground between a connection point of first transmission wiring to the transmission-side resonant wiring and a connection point of second transmission wiring to the transmission-side resonant wiring, and reception-side resonant wiring provided on a reception substrate and connected to a reception ground between a connection point of first reception wiring to the reception-side resonant wiring and a connection point of second reception wiring to reception-side resonant wiring. When viewed in a direction perpendicular to a main surface of the transmission substrate, the transmission substrate and the reception substrate are provided facing each other so that the transmission-side resonant wiring and the reception-side resonant wiring are symmetric about a point and have matching contours. | 02-20-2014 |
| 20140055217 | DIE-TO-DIE ELECTRICAL ISOLATION IN A SEMICONDUCTOR PACKAGE - Some of the embodiments of the present disclosure provide a semiconductor package comprising a first die; a second die; and an inductor arrangement configured to inductively couple the first die and the second die while maintaining electrical isolation between active circuit components of the first die and active circuit components of the second die. Other embodiments are also described and claimed. | 02-27-2014 |
| 20140070907 | GALVANIC ISOLATION INTERFACE FOR HIGH-SPEED DATA LINK FOR SPACECRAFT ELECTRONICS, AND METHOD OF USING SAME - Under one aspect of the present invention, a structure for providing galvanically isolated communication between first and second spacecraft electronic components includes a semi-insulating substrate; an input port disposed on the substrate and configured to receive a signal from the first spacecraft electronic component; a coupling structure disposed on the substrate, coupled to the input port so as to receive the signal, and configured to provide an isolated replica of the received signal as an output; a signal conditioner disposed on the substrate, coupled to the coupling structure so as to receive the isolated replica of the received signal, and configured to condition the isolated replica; and an output port disposed on the substrate, coupled to the signal conditioner so as to receive the conditioned isolated replica, and configured to provide the conditioned isolated replica to the second spacecraft electronic component. | 03-13-2014 |
| 20140152405 | COUPLER STRUCTURE OF MOBILE TERMINAL AND MOBILE TERMINAL INCLUDING THE SAME - A coupler structure of a mobile terminal having a repeater applied thereto is provided. The coupler structure includes a first substrate having a reception coupler, a second substrate having a transmission coupler, and a repeater disposed between the first substrate and the second substrate. | 06-05-2014 |
| 20140240063 | TRANSFORMER AND ELECTRICAL CIRCUIT - A transformer is provided. The transformer includes at least one first primary turn; at least one second primary turn; and a first secondary turn and a second secondary turn. The first secondary turn and the second secondary turn are arranged laterally between the at least one first primary turn and the at least one second primary turn. The first secondary turn and the second secondary turn are arranged one above the other. | 08-28-2014 |
| 20140306783 | COUPLER AND ELECTRONIC APPARATUS - According to one embodiment, a coupler for transmitting and receiving electromagnetic wave by electromagnetic coupling between the coupler and another, includes a line-shaped coupling element including a first open end and a second open end, a ground plane, a feeding element connecting the coupling element and a feed point, and a short circuiting element connecting the feeding element and the ground plane. The feeding element includes a first end connected to an intermediate portion between the first open end and the second open end of the coupling element, and a second end connected to the feed point. The short circuiting element includes a third end arranged between the first end of the feeding element and the second end of the feeding element, and a fourth end connected to the ground plane. | 10-16-2014 |
| 20140312995 | COUPLER AND ELECTRONIC APPARATUS - According to one embodiment, a coupler for wireless transfer includes a coupling element including a first open end and a second open end. The coupler further includes a feeding element electrically connecting a feed point and an intermediate portion of the coupling element between the first open end and the second open end. The coupler further includes a short circuiting element electrically connecting the intermediate portion and a ground plane. An electrical distance from the feed point to each of the first open end and the second open end is ¼ of a wavelength corresponding to a central frequency used for the wireless transfer. | 10-23-2014 |
| 20140340179 | COMMUNICATION SHEET, SMART SHELF - The communication sheet according to the present invention includes a dielectric layer including a dielectric substrate, a first conductor layer that is a conductor layer including a mesh sheet-like mesh conductor disposed on one surface of the dielectric substrate, wherein an opening region from where the mesh conductor is removed is formed, and a second conductor layer that is a conductor layer including a sheet-like sheet conductor disposed on another surface of the dielectric substrate opposite to the first conductor layer, wherein the sheet conductor in a region opposite to the opening region from where the mesh conductor is removed is not removed. | 11-20-2014 |
| 20140375398 | SIGNAL TRASMISSION THROUGH LC RESONANT CIRCUITS - An embodiment of an electronic system includes a first electronic circuit and a second electronic circuit. The electronic system further includes a resonant LC circuit having a resonance frequency for coupling the first electronic circuit and the second electronic circuit; each electronic circuit includes functional means for providing a signal at the resonance frequency to be transmitted to the other electronic circuit through the LC circuit andor for receiving the signal from the other electronic circuit. The LC circuit also include capacitor means having at least one first capacitor plate included in the first electronic circuit and at least one second capacitor plate included in the second electronic circuit. The LC circuit further includes first inductor means included in the first electronic circuit andor second inductor means included in the second electronic circuit. The at least one capacitor plate of each electronic circuit is coupled with the corresponding functional means through the possible corresponding inductor means. | 12-25-2014 |
| 20150008992 | COMMUNICATION USING MULTIPLE CONDUCTOR CABLE - A method of communication over a composite cable having a plurality of conductors, the method including placing an inductive coupler around the composite cable, coupling the composite cable to a signal input or output using the inductive coupler around the composite cable to communicate a signal to or from the composite cable, wherein the signal is communicated across the composite cable from a first location to a second location, wherein the inductive coupler is at one of the first location and the second location. | 01-08-2015 |
| 20150008993 | WAVEGUIDE COUPLER - A waveguide coupler comprising: a first coupling portion arranged to couple with a first waveguide and a second coupling portion arranged to couple with a second waveguide so as to connect the first waveguide and the second waveguide together; wherein arranged between the first and second coupling portions is a wave modulation portion arranged to modulate wave signals transferred between the first waveguide and the second waveguide. | 01-08-2015 |
| 20150008994 | INTERFACE APPARATUS - An object of the present invention is to provide an interface apparatus which can suppress leakage of electromagnetic waves and supply electromagnetic waves efficiently without limiting applications or mounting positions. An interface apparatus ( | 01-08-2015 |
| 20150048907 | CONTACTLESS COMMUNICATION UNIT CONNECTOR ASSEMBLIES - Contactless extremely high frequency connector assemblies, passive cable connector assemblies, and active cable connector assemblies are disclosed herein. In one embodiment, a contactless connector assembly can include several (EHF) contactless communication units operable to selectively transmit and receive EHF signals, and several signal directing structures coupled to the EHF CCUs. The signal directing structures can direct the EHF signals along a plurality of EHF signal pathways. | 02-19-2015 |
| 20150054602 | Line bridging element for two microstrip lines and method - A line bridging element for two microstrip lines, each of which are configured to conduct electromagnetic waves having a wavelength in the millimeter wavelength range, including a dielectric resonator, including a first coupling point, which is configured to couple the line-conducted electromagnetic wave, which is carried in the first microstrip line, into the dielectric resonator, including a second coupling point, which is configured to decouple the electromagnetic wave coupled into the dielectric resonator into the first microstrip line. The invention also provides a method for manufacturing a line bridging element. | 02-26-2015 |
| 20150061795 | RADIO FREQUENCY DEVICE WITH FEED STRUCTURE - A radio frequency (RF) device includes an RF transmission line structure having opposing boundary walls with a non-rectilinear form factor, and a feed structure configured to introduce RF energy into an area between the opposing boundary walls to illuminate the RF transmission line structure with the RF energy across the non-rectilinear form factor. The feed structure includes a plurality of traveling-waveguide-fed leaky line-segment structures, each configured to launch the RF energy into the area with a propagation direction having an oblique angle relative to an axis of the line-segment structure. | 03-05-2015 |
| 20150123749 | BROADBAND CONNECTION STRUCTURE AND METHOD - A broadband connection structure is disclosed. The broadband connection structure includes a carrier and a chip. The carrier includes a first resonator. The chip includes a second resonator and configured on the carrier using a flip-chip method. The first resonator is connected to the second resonator via a magnetic field and an electric field existing therebetween to transmit a broadband signal between the carrier and the chip. A broadband connection method is also disclosed. | 05-07-2015 |
| 20160006485 | Contactless Coupler - A contactless coupler is disclosed. The contactless coupler has an inductive coupling element adapted to transmit and/or receive power by inductive magnetic coupling and a capacitive coupling element adapted to transmit and/or receive a data signal by capacitive coupling. The capacitive coupling element comprises one or more capacitive electrodes disposed at an end of the coupler. | 01-07-2016 |
| 20160020501 | METHOD FOR BUILDING A CONNECTION BETWEEN A COAXIAL RF CABLE AND HYBRID PACKAGE USING 3D PRINTING AND A CONNECTION RECEPTACLE - A method of forming a connection receptacle over a substrate includes printing a first dielectric layer over the substrate between first and second transmission lines, the first dielectric layer having a tapered cross-section along a plane extending from the first transmission line to the second transmission line; disposing a conductive layer over the printed first dielectric layer; and electrically connecting the conductive layer to a conductor of the first transmission line and a conductor of the second transmission line. | 01-21-2016 |
| 20160065168 | RESONANCE COUPLER AND TRANSMISSION DEVICE - A resonance coupler according to one aspect of the present disclosure includes first resonance wiring and second resonance wiring. The first resonance wiring includes first open loop wiring, first input/output wiring extending outwardly from a first connection portion of the first open loop wiring, and first stub wiring extending inwardly from a second connection portion of the first open loop wiring. The second resonance wiring includes second open loop wiring, and second input/output wiring extending outwardly from a third connection portion of the second open loop wiring. The first stub wiring includes a first connection end connected to the second connection portion and a first open end on an opposite side. A wiring length from the first connection portion to the first open end is one-quarter of a wavelength of an nth-order harmonic of a radio-frequency signal, where n is an integer not less than 2. | 03-03-2016 |
| 20160072167 | ELECTROMAGNETIC RESONANT COUPLER AND HIGH-FREQUENCY TRANSMISSION DEVICE - A high-frequency transmission device includes first and second resonators as ring-shaped wires each having an opening part at a part thereof, first and second input/output terminals each electrically connected to both resonators, a first ground shield formed on a plane different from planes on which both resonators are arranged, a second ground shield formed on a plane different from the planes on which both resonators and the first ground shield are arranged, and first and second ground wires each formed to surround peripheries of both resonators. The ground shields and the ground wires are respectively connected to each other. A dielectric wire is present between both ground wires, and the ground wires are not electrically connected to each other. | 03-10-2016 |
| 20160079648 | ADJUSTABLE COUPLING DEVICE AND RADIO FREQUENCY COMMUNICATION DEVICE - The present disclosure relates to the field of communication technologies, and more particularly, to an adjustable coupling device and a radio frequency communication device. The adjustable coupling device includes a coaxial transmission line for transmitting signals across the two terminals thereof and a coupling body for sampling the signals via coupling. The adjustable coupling device further includes a coupling cavity formed on the outer surface of the coaxial transmission line; a printed circuit board on which the coupling body is disposed, the printed circuit board capping the coupling cavity to seal the coupling body within the coupling cavity; a tuner, disposed through the printed circuit board, where the lower end of the tuner extends into the coupling cavity, and the tuner can be moved up and down to change the depth thereof extended into the coupling body so as to change the electromagnetic field distribution within the coupling cavity. In this way, the present disclosure has a simple structure and thus eliminates the influence on the coupling device derived from the structure and the machining accuracy and assembly techniques of printed circuit board, with simple tuning means and high reliability. | 03-17-2016 |
| 20160182005 | HYBRID PASSIVE DEVICE AND HYBRID MANUFACTURING METHOD | 06-23-2016 |
| 20160380609 | ALTERNATING CURRENT (AC) COUPLER FOR WIDEBAND AC SIGNALS AND RELATED METHODS - An AC coupler for transmitting high-frequency components of a wideband signal includes a signal conductor and a shielding structure arranged as a transmission line. The signal conductor includes a conductive element and a capacitor configured to block direct current (DC) components of the wideband signal while transmitting high-frequency alternating current (AC) components of the wideband signal. The shielding structure is configured for conducting at least the AC components of the wideband signal while confining electric fields and currents in the shielding structure substantially to a region proximate to the signal conductor. The shielding structure has a width substantially greater than a width of the signal conductor. The difference between the shielding structure width and the signal conductor width may be substantially greater than an offset distance between the signal conductor and the shielding structure. | 12-29-2016 |
| 20080238582 | Flexible Capacitive Coupler Assembly And Method Of Manufacture - A flexible capacitive coupler assembly includes a flexible dielectric substrate assembly having a front surface and a rear surface, the front surface having thereon a macroscopic metal capacitive pad. A package supports the flexible dielectric substrate. An electrical connection is made to package wiring or leads on the flexible dielectric substrate to establish electrical contact with a computer subsystem. | 10-02-2008 |
| 20080315978 | METHOD AND APPARATUS FOR NON-CONDUCTIVELY INTERCONNECTING INTEGRATED CIRCUITS - A method and apparatus for constructing, repairing and operating modular electronic systems utilizes peripheral half-capacitors (i.e., conductive plates on the outside of the modules) to communicate non-conductively between abutting modules. Such systems provide lower cost, improved testability/reparability and greater density than conventional modular packaging techniques, such as printed circuit boards and multi-chip modules. The non-conductive interconnection technique of the invention can be applied to all levels in the packaging hierarchy, from bare semiconductor dies to complete functional sub-units. Numerous exemplary systems and applications are described | 12-25-2008 |
| 20090015353 | INTEGRATED CIRCUIT WITH ELECTROMAGNETIC INTRACHIP COMMUNICATION AND METHODS FOR USE THEREWITH - An integrated circuit includes a substrate and a first integrated circuit die having a first circuit coupled to the substrate via a first bonding wire, the first circuit having a first intra-chip interface. A second integrated circuit die has a second circuit coupled to the substrate via a second bonding wire, the second circuit having a second intra-chip interface, the second bonding wire electrically isolated from the first bonding wire. The first circuit communicates with the second circuit via the first intra-chip interface and the second intra-chip interface, and wherein the first intra-chip interface and the second intra-chip interface communicate via a first electromagnetic coupling between the first bonding wire and the second bonding wire. | 01-15-2009 |
| 20090039986 | PACKAGE-BASED FILTERING AND MATCHING SOLUTIONS - A microelectronic package having a radio frequency (RF) amplifier circuit and, incorporating harmonic rejection filters and matching circuits integrally formed in the package is disclosed. A harmonic rejection filter may comprise a metal-insulator-metal (MIM) capacitor serially coupled between bond pads disposed on a RF amplifier circuit die, a first wire bond coupling a first bond pad to a package output, where the first bond pad is coupled to the output of the RF amplifier, and a second wire bond coupling a second bond pad to a package ground. The harmonic rejection filter may be appropriately configured to filter one or more harmonics at different frequencies. | 02-12-2009 |
| 20090085696 | METHOD AND APPARATUS FOR RF SIGNAL TRANSMISSION IN A SLIDER PHONE - A method and apparatus for internal RF signal transmission between the fixed base portion and the sliding portion of a mobile communication terminal using capacitive coupling are disclosed. The method and apparatus provide internal RF signal transmission when the sliding portion is open (SO) and when the sliding portion is closed (SC). The method for internal RF signal transmission in a mobile communication terminal includes a first capacitor plate for forming a first capacitor when the two parts are at a first position relative to each other and for forming a second capacitor when the two parts are at a second position relative to each other. | 04-02-2009 |
| 20090102581 | INTERCONNECT FOR SURFING CIRCUITS - An interconnect for surfing circuits is presented. The interconnect includes at least one control signal line, at least one data signal line, and at least one variable capacitor coupled to the at least one control signal line and the at least one data signal line, wherein the capacitance of the variable capacitor is configured to be controlled by a control signal on the control signal line so that a velocity of a data signal transmitted on the at least one data signal line is determined by the value of the capacitance of the variable capacitor. | 04-23-2009 |
| 20090201108 | Switched Length Match Transmission Path Instrument - A testing apparatus includes one or more trace banks. Each trace bank includes (1) an input switch operable to couple an input port to one of multiple output ports, (2) an output switch operable to couple one of multiple input ports to one output port, and (3) transmission lines of different lengths coupled between the output ports of the input switch and the input ports of the output switch. The trace banks can be cascaded using cables to connect their output and input ports. The input and output switches in the trace banks are controlled to provide a transmission path of the desired length. | 08-13-2009 |
| 20090243764 | Gate-driver IC with HV-isolation, especially hybrid electric vehicle motor drive concept - An automotive drive system for a high voltage electric motor comprises a microcontroller and ECU powered by a low voltage (12 volt) bus net which controls the drives of a high voltage inverter powered by a 100 volt or higher source, which, in turn, drives the motor. To provide good electrical insulation between the low voltage and high voltage systems, the low voltage control signals are produced by a low voltage signal input chip which has a bottom electrode which produces a control potential responsive to the ECU output and a high voltage driver IC which drives the power devices of the high voltage inverter. The high voltage driver IC has a top electrode which drives the high voltage IC function. The bottom electrode of the LV input chip is coupled to the top electrode of the high voltage driver IC through an insulation layer, defining a capacitive coupler which defines an isolation barrier between the low voltage net and the high voltage system insulation. The two ICs may be bare chips, individually packaged chips or co-packed chips. Plural control IC chips and driver IC chips can communicate with one another for diverse control functions, including “smart” functions. | 10-01-2009 |
| 20090284332 | IVUS SYSTEM WITH ROTARY CAPACITIVE COUPLING - An imaging system comprises a catheter having a lumen, a rotatable imaging probe within the catheter lumen including a distal transducer and first and second conductors coupled to the transducer, and a coupler that couples the rotatable first and second conductors to non-rotatable third and fourth conductors, respectively. The coupler includes a rotary capacitive coupler. | 11-19-2009 |
| 20100019870 | MICROWAVE DEVICE, HIGH-FREQUENCY DEVICE, AND HIGH-FREQUENCY EQUIPMENT - Since the loss of the conventional microwave device is large, when this device is applied to the microwave component, there are problems; for example, a low-noise amplifier, the noise figure is degraded, and when applied to a high-output amplifier, output and efficiency may be decreased. In particular, in the high-output amplifier of over 100W class, heat generation at a capacitor which forms the microwave device increases, which causes a problem that the reliability of the microwave device may be decreased. A structure is formed to include a capacitor loaded between two high impedance lines the length of which has ¼ wavelength in the desired frequency band and the characteristic impedance is higher than 50Ω. | 01-28-2010 |
| 20100090787 | FEED DEVICE - There is provided a less fragile feeding apparatus for an antenna that can be fitted to clothing. The feeding apparatus uses a coaxial cable for feeding. A center conductor of the coaxial cable is connected to a first radiating element in terms of alternating current at least through capacitive coupling, and an outer conductor of the coaxial cable is connected to a second radiating element in terms of alternating current at least through capacitive coupling. | 04-15-2010 |
| 20100109818 | Wireless Electrical Device Using Open-Circuit Elements Having No Electrical Connections - A wireless electrical device includes an electrically unconnected electrical conductor and at least one electrically unconnected electrode spaced apart from the electrical conductor. The electrical conductor is shaped for storage of an electric field and a magnetic field. In the presence of a time-varying magnetic field, the electrical conductor so-shaped resonates to generate harmonic electric and magnetic field responses. Each electrode is at a location lying within the magnetic field response so-generated and is constructed such that a linear movement of electric charges is generated in each electrode due to the magnetic field response so-generated. | 05-06-2010 |
| 20100141360 | MULTILAYER COMPACT ANTENNA - An antenna is provided. The antenna includes a dielectric material including a plurality of layers defined a first set of electrodes of a first polarity and a second set of electrodes of a second polarity, wherein the first set of electrodes and second set of electrodes alternate in position to form the plurality of layers; a first interconnect coupled to the first set of electrodes, the first interconnect coupled to a ground; a second interconnect coupled to the second set of electrodes, the second interconnect coupled to a voltage source, wherein a voltage is applied to the second interconnect to generate an electric field. | 06-10-2010 |
| 20100182106 | DIRECT CURRENT VOLTAGE ISOLATOR - An isolation amplifier with at least one ground line and at least one signal conducting line, separated by an insulator with a capacitor arranged in the signal conducting line in a region in which the surface of the signal conducting line facing the insulator is greater than the surface of the ground line facing the insulator. | 07-22-2010 |
| 20100315182 | ISOLATING INTERFACE WITH A DIFFERENTIATING CIRCUIT COMPRISING A CAPACITIVE BARRIER AND METHOD FOR TRANSMITTING A SIGNAL BY MEANS OF SUCH ISOLATING INTERFACE - A known method for parallel two-way symmetrical signal transmission by means of an isolating interface with a differentiating circuit comprising a capacitive barrier is improved. When restarting communication in the selected direction after a longer break, a pilot signal is conducted via the transmitting plates for the communication in the reverse direction and capacitive compensators to one of the receiving plates for communication in the selected direction. Threshold levels for comparisons of the signals of the first and second time derivative are decreased, the capacitance of capacitive compensators is then set to reduce output the output signal and finally communication is reestablished. Transmitting plates for communication in the reverse direction are now connected to the receiving plates for communication in the selected direction through the capacitive compensators with the capacitance adjusted as described above. This provides satisfactory signal transmission even when a thick layer of an electrically well conductive liquid appears between the plates of the isolating interface. | 12-16-2010 |
| 20110006863 | Applications of Universal Frequency Translation - Frequency translation and applications of same are described herein. Such applications include, but are not limited to, frequency down-conversion, frequency up-conversion, enhanced signal reception, unified down-conversion and filtering, and combinations and applications of same. | 01-13-2011 |
| 20110043305 | COUPLER AND COMMUNICATION SYSTEM - A coupler includes a first conductive pattern provided on a substrate having insulating property, a second conductive pattern provided on the substrate and placed in opposition to the first conductive pattern, a third conductive pattern provided on the substrate, a fourth conductive pattern provided on the substrate and placed in opposition to the third conductive pattern, a ground potential portion placed around positions on the substrate where the first conductive pattern, the second conductive pattern, the third conductive pattern, and the fourth conductive pattern are placed, a first resistor connecting between the first conductive pattern and the second conductive pattern placed in opposition to each other, and a second resistor connecting between the third conductive pattern and the fourth conductive pattern placed in opposition to each other. | 02-24-2011 |
| 20110109408 | Electromagnetic coupler and communication apparatus using the same - An electromagnetic coupler has a first conductor pattern and a second conductor pattern separated from the first conductor pattern that are formed in a first plane, a feeding pattern made of a conductor and being connected to a feeing system and a ground made of a conductor and being separated from the feeding pattern that are formed in a second plane, and linear conductors electrically connecting between the first conductor pattern and the feeding pattern, and between the second conductor pattern and the ground, respectively. | 05-12-2011 |
| 20120007699 | APPARATUS FOR REDUCING POWER CONSUMPTION BY USING CAPACITIVE COUPLING TO PERFORM MAJORITY DETECTION - One embodiment of the present invention provides a system that reduces power consumption by using capacitive coupling to perform a majority detection operation. The system starts by driving a plurality of signals onto a plurality of driven wires. The signals are then fed from each driven wire through a corresponding coupling capacitor to a single majority detection wire. Next, the system feeds signal on the majority detection wire and a bias voltage to a differential receiver. The output of the differential receiver switches if the signal on the majority-detection wire switches relative to the bias voltage. The system then uses the output of the differential receiver to optimize the signals from the plurality of driven wires for transmission across a long signal route. Optimizing the transmission of signals reduces the power consumed by the computer system. | 01-12-2012 |
| 20120098628 | Tuneable Frequency Selective Surface - An electronically tuneable surface. The surface comprises: a conductive sheet comprising at least one opening; and a biasing circuit. The biasing circuit comprises first and second conductors, separated from the conductive sheet by a dielectric, and arranged at mutually opposing sides of the opening such that each conductor is capacitively coupled to the conductive sheet at the respective side of the opening. The conductors define a gap between them corresponding to the opening. The biasing circuit also comprises an electrical control element bridging the gap, connected to the first and second conductors. When the element is in a first state, the surface exhibits a first frequency transmission characteristic with respect to incident electromagnetic radiation, and when the element is in a second state, the surface exhibits a second, different characteristic. | 04-26-2012 |
| 20120169438 | HDMI RECEIVER - An embodiment of a transmitter includes an amplifier having first and second differential output nodes, a first supply node, a first pull-up impedance having a first node coupled to the first differential output node and having a second node coupled to the supply node, and a second pull-up impedance having a first node coupled to the second differential output node and having a second node coupled to the supply node. An embodiment of a receiver includes an amplifier having first and second differential input nodes, a first supply node, a first pull-up impedance having a first node coupled to the first differential input node and having a second node coupled to the supply node, and a second pull-up impedance having a first node coupled to the second differential input node and having a second node coupled to the supply node. In an embodiment, the transmitter and receiver are capacitively coupled to one another. | 07-05-2012 |
| 20120169439 | BATTERY AND WIRELESS COMMUNICATION APPARATUS - Used is a battery a battery ( | 07-05-2012 |
| 20120194301 | CAPACITIVE COUPLER PACKAGING STRUCTURE - Embodiments of the present invention provide a capacitive coupler packaging structure including a substrate with at least one capacitor and a receiver formed thereon, wherein the at least one capacitor at least includes a first electrode layer, a second electrode layer and a capacitor dielectric layer therebetween, and the first electrode layer is electrically connected to the receiver via a solder ball. The capacitive coupler packaging structure also includes a transmitter electrically connecting to the capacitor. | 08-02-2012 |
| 20130057367 | CAPACITIVE RF COUPLER FOR UTILITY SMART METER RADIO FREQUENCY COMMUNICATIONS - Method and apparatus for locating a low insertion loss apparatus for capacitive coupling of radio frequency (RF) signals from within the confines of a dielectric housing of a utility meter, through the dielectric cover, avoiding the need for drilling a hole in the utility meter body or meter dielectric cover, to route the coaxial RF cable from the embedded wireless modem to an external remote antenna or in-line power amplifier. Specifically the invention relates to an improved capacitive coupling method, which provides for an un-tethered or tethered integral radio frequency (RF) coupler where said RF coupler is located within and on the outer surface of a replacement dielectric cover or alternately retro-fitted on the inner surface and outer surface of an existing utility meter dielectric cover. A method and apparatus for a, standalone, alternative embodiment of the capacitive RF Coupler apparatus is also described and illustrated herein. | 03-07-2013 |
| 20130249655 | VARIABLE CAPACITOR CIRCUIT - Disclosed herein is a variable capacitor circuit. The variable capacitor circuit which is composed of a plurality of capacitors and a switch transistor connected to each capacitor, and adjusts a capacitance value (C) in accordance with ON/OFF of the switch transistor, includes a unit cell in which at least one switching unit and at least one capacitor are alternately connected in series to each other, and a plurality of capacitor units to which at least one of the unit cells is connected in parallel, and thereby may adjust a difference in quality factors in accordance with a signal direction. | 09-26-2013 |
| 20130249656 | PACKAGE WITH PRINTED FILTERS - Aspects of the disclosure provide a circuit package. The circuit package includes a first signal terminal electrically coupled with a serializer/deserializer (SERDES), a second signal terminal electrically coupled with an external electronic component, and a trace disposed on an insulating layer. The trace is configured to transfer an electrical signal between the first signal terminal and the second signal terminal. The trace is patterned to provide a specific filtering characteristic to filter the electrical signal. | 09-26-2013 |
| 20140292451 | CAPACITIVE BLIND-MATE MODULE INTERCONNECTION - A blind-mate capacitive coupling interconnection between a main module enclosure one or more sub-module enclosures has coupling surfaces each with a ground portion and an aperture, an inner element provided in the aperture, spaced away from the ground portion. The coupling surfaces may be provided, for example, as traces on a printed circuit board. To accommodate a degree of mis-alignment, one of the inner elements may be provided larger than the other. Capacitive coupling between the coupling surfaces occurs when the coupling surfaces are mated together, retained in position, for example, by a mechanical fixture. | 10-02-2014 |
| 20140361856 | HIGH QUALITY FACTOR INTERCONNECT FOR RF CIRCUITS - Embodiments of radio frequency (RF) devices are disclosed having interconnection paths with capacitive structures having improved quality (Q) factors. In one embodiment, an RF device includes an inductor having an inductor terminal and a semiconductor die. The semiconductor die includes one or more active semiconductor devices that include a device contact. The device contact provided by the one or more active semiconductor devices is positioned so as to be vertically aligned directly below the inductor terminal. The inductor terminal and the device contact are electrically connected with an interconnection path that includes a capacitive structure. To prevent or reduce current crowding, the interconnection path is vertically aligned so as to extend directly between the inductor terminal and the device contact. In this manner, the interconnection path electrically connects the inductor terminal and the device contact without degrading the Q factor of the RF device. | 12-11-2014 |
| 20150070111 | SYSTEM FOR TRANSMITTING INFORMATION BETWEEN CIRCUITS - A system for transferring information from a first circuit to a second circuit includes first and second isolation elements coupled between the first circuit and the second circuit. A first transient filter is located on the second circuit and coupled to the first isolation element. A second transient filter is located on the second circuit and coupled to the second isolation element. A first ground is located on the first circuit, and a second ground is located on the second circuit. The first ground electrically floats relative to the second ground. | 03-12-2015 |
| 20160164492 | APPARATUS AND METHODS FOR HIGH VOLTAGE VARIABLE CAPACITOR ARRAYS WITH FEED-FORWARD CAPACITORS - Apparatus and methods for high voltage variable capacitors are provided herein. In certain configurations, an integrated circuit (IC) includes a variable capacitor array and a bias voltage generation circuit that biases the variable capacitor array to control the array's capacitance. The variable capacitor array includes a plurality of variable capacitor cells electrically connected in parallel between a radio frequency (RF) input and an RF output of the IC. Additionally, each of the variable capacitor cells can include a cascade of two or more pairs of anti-series metal oxide semiconductor (MOS) capacitors between the RF input and the RF output. The pairs of anti-series MOS capacitors include a first MOS capacitor and a second MOS capacitor electrically connected in anti-series. The bias voltage generation circuit generates bias voltages for biasing the MOS capacitors of the variable capacitor cells. | 06-09-2016 |
| 20160181012 | COUPLING DEVICE AND COUPLING ASSEMBLY FOR THE CONTACT-FREE TRANSMISSION OF DATA SIGNALS AND METHOD FOR THE TRANSMISSION OF DATA SIGNALS | 06-23-2016 |
