| Entries |
| Document | Title | Date |
|---|
| 20080218285 | High-speed digital transmission signle line - A high-speed digital transmission signal line providing better dynamic resistance to be applied in an LVDS transmission system and functioning as an electronic line, an optical line, and a serial advanced technology attachment (SATA) includes a conductive layer in thickness of 0.018˜0.1 mm and in width of 0.2˜0.8 mm; a first and a second insulation layers each in thickness of 0.04˜0.3 mm being respectively disposed on both sides of the conductive layer; and a ground plate. | 09-11-2008 |
| 20080297271 | MULTI-PHASE LAYOUT STRUCTURE AND METHOD - The present invention provides a multi-phase layout structure and method. The layout structure comprises: a first layout layer; a second layout layer substantially parallel to the first layout layer; a plurality of traces, each transmitting a signal, and the plurality of signals having a phase difference between each other; wherein a horizontal coupling capacitance is provided between two neighboring traces configured on the same layer of the first layout layer and the second layout layer, a vertical coupling capacitance is provided between two neighboring traces configured on different layers of the first layout layer and the second layout layer, and the plurality of traces have substantially the same total coupling capacitance wherein the total coupling capacitance is defined by the horizontal coupling capacitance and the vertical coupling capacitance. | 12-04-2008 |
| 20090066437 | High speed electrical interconnect and method of manufacture - Fundamental interconnect systems for connecting high-speed electronics elements are provided. The interconnect systems consists of signal line, dielectric system with open trench or slot filled up with air or lower dielectric loss material, and the ground plane. The signal line could be for example, microstripline, strip line, coplanar line, single line or differential pairs. The interconnect system can be used for on-chip interconnects or can also be used for off-chip interconnects. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables. | 03-12-2009 |
| 20090189708 | COUPLING CANCELLATION SCHEME - Methods and apparatus are disclosed, such as those involving an interconnection layout for an integrated circuit (IC). One such layout includes a plurality of differential pairs of lines. Each differential pair has two lines including one or more parallel portions extending substantially parallel to each other. Each pair also includes a shield line. Each of the shield lines includes one or more parallel portions interposed between the parallel portions of one of the pairs of differential lines. One or more of the shield lines are electrically connected to a voltage reference, such as ground. This layout is believed to reduce or eliminate intra-pair coupling as well as inter-pair coupling. | 07-30-2009 |
| 20090237172 | TRANSMISSION LINE SYSTEMS AND APPARATUSES - Systems having three coupled transmission lines designed in such a way that any two of which taken together can be used as a differential transmission line with a roughly equal differential mode characteristic impedance while achieving high level of common mode characteristic impedance. The high level of common mode characteristic impedance is achieved by arrangement of the three transmission lines in distinct planes along a transmission axis. | 09-24-2009 |
| 20090251232 | COPLANAR WAVEGUIDE STRUCTURES AND DESIGN STRUCTURES FOR RADIOFREQUENCY AND MICROWAVE INTEGRATED CIRCUITS - Coplanar waveguide structures and design structures for radiofrequency and microwave integrated circuits. The coplanar waveguide structure includes a signal conductor and ground conductors generally coplanar with the signal conductor. The signal conductor is disposed between upper and lower arrays of substantially parallel shield conductors. Conductive bridges, which are electrically isolated from the signal conductor, are located laterally between the signal conductor and each of the ground conductors. Pairs of the conductive bridges connect one of the shield conductors in the first array with one of the shield conductors in the second array to define closed loops encircling the signal line. | 10-08-2009 |
| 20090267702 | PRINTED CIRCUIT BOARD FOR DECREASING WIRELESS WIDE AREA NETWORK NOISE - A printed circuit board (PCB) capable of decreasing wireless wide area network (WWAN) noise generated due to internal signal interference occurring in the PCB is disclosed. The PCB printed circuit board includes a first layer, a second layer, and at least one insulating layer formed between the first and second layers. The PCB board further includes a first signal line group disposed on the first layer while including a plurality of first signal lines each supplying a first signal, isolation patterns disposed on the first layer such that the isolation patterns are arranged between adjacent ones of the first signal lines, respectively, to prevent the adjacent first signal lines from interfering with each other, and a second signal line group disposed on the second layer while including a plurality of second signal lines each supplying a second signal different from the first signal. The second signal line group corresponds to the isolation patterns. | 10-29-2009 |
| 20090315633 | Design Structure, Structure and Method for Providing an On-Chip Variable Delay Transmission Line With Fixed Characteristic Impedance - A design structure, structure, and method for providing an on-chip variable delay transmission line with a fixed characteristic impedance. A method of manufacturing a transmission line structure includes forming a signal line of the transmission line structure, forming a first ground return structure that causes a first delay and a first characteristic impedance in the transmission line structure, and forming a second ground return structure that causes a second delay and a second characteristic impedance in the transmission line structure. The first delay is different from the second delay, and the first characteristic impedance is substantially the same as the second characteristic impedance. | 12-24-2009 |
| 20090315634 | EMULATION OF ANISOTROPIC MEDIA IN TRANSMISSION LINE - In one exemplary embodiment, a transmission line geometry or structure may readily be realized as periodic printed coupled/uncoupled microstrip lines on dielectric and/or suitable biased ferromagnetic substrates. An example of a transmission line geometry or structure may be adapted to emulate extraordinary propagation modes within bulk periodic assemblies of anisotropic dielectric and magnetic materials. For instance, wave propagation in anisotropic media may be emulated by using a pair of coupled transmission lines ( | 12-24-2009 |
| 20090315635 | TRANSMISSION CIRCUIT - A transmission circuit includes a plurality of transmission lines connected in a ring to propagate signals among a plurality of devices. The plurality of transmission lines have a predetermined same propagation delay, and a predetermined transmission line impedance, and the predetermined transmission line impedance is a half or less of an output impedance of each of the plurality of devices. When a signal outputted from a first optional one of the plurality of devices is propagated to the plurality of devices other than the first optional device, the signal outputted from the first optional device exceeds a predetermined threshold of a signal voltage at a same time. | 12-24-2009 |
| 20100001806 | SIGNAL TRANSMISSION LINES - A pair of signal transmission lines includes an aggressor line and a victim line parallel to the aggressor line. A plurality of time delay modules is linked in the aggressor line. A plurality of time delay modules is linked in the victim line. A total delay time of the time delay modules of the victim line is equal to a total delay time of the time delay modules of the aggressor line. | 01-07-2010 |
| 20100026408 | SIGNAL TRANSFER FOR ULTRA-HIGH CAPACITY CIRCUITS - The present invention provides high performance, low power signal transfer methods for linking large numbers of integrated chips into ultra-high capacity circuits; Example application of the present invention including ultra-high capacity memory systems, and router systems. | 02-04-2010 |
| 20100109790 | Multilayer Complementary-conducting-strip Transmission Line Structure - A multilayer complementary-conducting-strip transmission line (CCS TL) structure is disclosed herein. The multilayer CCS TL structure includes a substrate, and n signal transmission lines being parallel and interlacing with n-1 mesh ground plane(s), therein a plurality of inter-media-dielectric (IMD) layers are correspondingly stacked with among the n signal transmission lines and the n-1 mesh ground plane(s) to form a stack structure on the substrate, therein n≧2 and n is a natural number. Whereby, a multilayer CCS TL with independent of each layer and complete effect on signal shield is formed to provide more flexible for circuit design, reduce the circuit area and also diminish the transmission loss. | 05-06-2010 |
| 20100207700 | MICRO-STRIP TRANSMISSION LINE STRUCTURE OF A SERPENTINE TYPE - A micro-strip transmission line capable of reducing far-end crosstalk is provided. The micro-strip transmission line having a serpentine shape is capable of reducing the far-end crosstalk of the transmission line by increasing capacitive coupling between neighboring transmission lines by allowing parallel micro-strip transmission lines to have serpentine shapes. In the structure of the micro-strip transmission line having the serpentine shape, it is possible to reduce the far-end crosstalk of the transmission line by increasing capacitive coupling between neighboring transmission lines by allowing parallel micro-strip transmission lines to have serpentine shapes. | 08-19-2010 |
| 20100289595 | DEVICE FOR INDUCTIVE MULTI-INJECTION ON MULTIPLE CONDUCTORS - Which permits the application of methods for increasing the performance of a communications system on a medium made up of N conductors ( | 11-18-2010 |
| 20100327989 | MICRO-STRIP CROSSTALK COMPENSATION USING STUBS - A micro-strip transmission line may include a plurality of conductors, wherein each conductor has a compensating portion and a remaining portion. The compensating portion can compensate for far-end crosstalk in the remaining portion. In one example, the compensating portion has a longitudinal section and a plurality of alternating stubs extending from lateral surfaces of the longitudinal section. | 12-30-2010 |
| 20110025428 | COUPLING CANCELLATION SCHEME - Methods and apparatus are disclosed, such as those involving an interconnection layout for an integrated circuit (IC). One such layout includes a plurality of differential pairs of lines. Each differential pair has two lines including one or more parallel portions extending substantially parallel to each other. Each pair also includes a shield line. Each of the shield lines includes one or more parallel portions interposed between the parallel portions of one of the pairs of differential lines. One or more of the shield lines are electrically connected to a voltage reference, such as ground. This layout is believed to reduce or eliminate intra-pair coupling as well as inter-pair coupling. | 02-03-2011 |
| 20110037528 | Wave Guiding Structures for Crosstalk Reduction - Various apparatus and methods of addressing crosstalk in a circuit board are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first layer of a circuit board with a first signal trace and forming a second layer of the circuit board with a second signal trace. A first guard trace is formed on the first layer and offset laterally from the first signal trace but at least partially overlapping the second signal trace and a second guard trace is formed on the second layer and offset laterally from the second signal trace but at least partially overlapping the first signal trace. | 02-17-2011 |
| 20110095838 | MULTICHANNEL INTERFACING DEVICE HAVING A TERMINATION CIRCUIT - The invention relates to an interfacing device for transmission through interconnections used for sending a plurality of electrical signals. | 04-28-2011 |
| 20110109399 | DEVICE FOR INDUCTIVE MULTI-INJECTION ON MULTIPLE CONDUCTORS - The techniques described herein permit the application of methods for increasing the performance of a communications system on a medium made up of N conductors ( | 05-12-2011 |
| 20110128086 | CIRCUIT BOARD WITH DECREASED CROSSTALK - A circuit board includes a signal line plane and a reference plane. The signal line plane has at least a first transmission line and a second transmission line formed thereon. The reference plane has a conductive region and at least a non-conductive region. The first transmission line and the second transmission line overlap the conductive region in a thickness direction of the circuit board. The non-conductive region includes at least a first part and a second part connected to the first part, where the second part is positioned between the projection of the first transmission line on the reference plane and the projection of the second transmission line on the reference plane, and has no intersection with at least one of the projection of the first transmission line and the projection of the second transmission line. | 06-02-2011 |
| 20110156833 | NETZFILTER FUR EINEN UMRICHTER ZUM ANSCHLUSS DES UMRICHTERS AN EIN 3-PHASIGES VERSORGUNGSNETZ NETWORK FILTER FOR A CONVERTER FOR CONNECTION OF THE CONVERTER TO A 3-PHASE SUPPLY NETWORK - A network filter for connecting a converter to a 3-phase supply network includes in each phase a toroidal inductor which is connected in series with a commutation inductor at a respective first connection point, and a capacitor circuit having at least four capacitances, wherein first terminals of a first, a second and a third capacitance is connected in one-to-one correspondence to a respective one of the first connection points. Second terminals of the first, second and third capacitance are connected at a common second connection point, with a fourth capacitance being connected between ground and the common second connection point. The windings of the toroidal inductors can be formed of the connecting lines which connect the corresponding first terminals to the three phases of the supply network. | 06-30-2011 |
| 20110181370 | APPARATUS ENABLING PARALLEL TRANSMISSIONS OVER TRANSMISSION LINES HAVING DIFFERENT LENGTHS - A signal bus includes multiple interconnects for transporting electronic signals. The interconnects have different physical path lengths and different structures to equalize the different the physical path lengths, so that the electronic signals traverse the corresponding interconnects in same period of time. | 07-28-2011 |
| 20110199165 | CIRCUIT SUBSTRATE - A circuit substrate includes a first pair of ground lines, a second pair of ground lines, a plurality of first connection lines, a plurality of second connection lines and a plurality of conductive pillars. The first and second pairs of ground lines are located on first and second surfaces of the substrate, respecteively. The pillars are located in the substrate and vertically conducted between the first pair of ground lines and the second connection lines and between the second pair of ground lines and the first connection lines, and the first and second pairs of ground lines are conducted, so that a 3-D grounding circuit loop is formed. Moreover, a first pair of signal lines is disposed between the first connection lines for grounding and a second pair of signal lines is disposed between the second connection lines for grounding to get a better signal integrity. | 08-18-2011 |
| 20120019331 | PRINTED CIRCUIT BOARD - A printed circuit board includes signal transmitting units that transmit signals, signal receiving units that receive signals, and a plurality of signal lines that connect the signal transmitting units and the signal receiving units. A resistor having a value Rp [Ω] of resistance with a first tolerance is provided between two signal lines that are adjacent to each other. In addition, a capacitor element that is connected in series to the resistor and that has a value Cp [F] of capacitance with a second tolerance is also connected between the two signal lines. In relation to the rise time tr [s] of the signals output from the signal transmitting units, the value Rp of resistance of the resistor and the value Cp of capacitance of the capacitor element are set such that an expression (Cp×Rp)×0.9 tr/3≦(Cp×Rp)×1.1 is satisfied. | 01-26-2012 |
| 20120139655 | ELECTRICAL IMPEDANCE PRECISION CONTROL OF SIGNAL TRANSMISSION LINE FOR CIRCUIT BOARD - Disclosed is a structure for precision control of electrical impedance of signal transmission circuit board. A substrate forms thereon a plurality of first signal transmission lines, and a first covering insulation layer is formed on a first surface of the substrate to cover a surface of each first signal transmission lines and each spacing section formed between adjacent first signal transmission lines. Each first signal transmission lines can transmit a differential mode signal or a common mode signal. At least one first flattening insulation layer is formed between a surface of the first covering insulation layer and a first conductive shielding layer so that the first flattening insulation layer fills up the height difference between the surface of each first signal transmission line and the spacing section associated with each first signal transmission line to thereby ensure a consistent distance between the signal transmission lines and the conductive shielding layer for realizing precision control of electrical impedance of the signal transmission circuit board. | 06-07-2012 |
| 20120306587 | HIGH FREQUENCY INTERCONNECT STRUCTURES, ELECTRONIC ASSEMBLIES THAT UTILIZE HIGH FREQUENCY INTERCONNECT STRUCTURES, AND METHODS OF OPERATING THE SAME - High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same. The high frequency interconnect structures include a plurality of dielectric waveguides and are configured to communicatively connect a plurality of transmitters with a plurality of receivers and to convey a plurality of signals therebetween. The plurality of signals may include a plurality of electromagnetic waves and may have a frequency of at least 200 GHz. The high frequency interconnect structures further may be configured to decrease a potential for crosstalk between a first signal that is conveyed by a first dielectric waveguide of the plurality of dielectric waveguides and a second signal that is conveyed by a second dielectric waveguide of the plurality of dielectric waveguides, such as through control of a passband of the first dielectric waveguide relative to the second dielectric waveguide and/or the use of a crosstalk mitigation structure. | 12-06-2012 |
| 20120326798 | ON-CHIP TRANSMISSION LINE STRUCTURES WITH BALANCED PHASE DELAY - A transmission wiring structure, associated design structure and associated method for forming the same. A structure is disclosed having: a plurality of wiring levels formed on a semiconductor substrate; a pair of adjacent first and second signal lines located in the wiring levels, wherein the first signal line comprises a first portion formed on a first wiring level and a second portion formed on a second wiring level; a primary dielectric structure having a first dielectric constant located between the first portion and a ground shield; and a secondary dielectric structure having a second dielectric constant different than the first dielectric constant, the secondary dielectric structure located between the second portion and the ground shield, and the second dielectric layer extending co-planar with the second portion and having a length that is substantially the same as the second portion. | 12-27-2012 |
| 20130127559 | SUPPRESSION OF FAR-END CROSSTALK AND TIMING JITTER BY USING RECTANGULAR RESONATORS - Rectangular-shape resonators as guard traces formed in a region between the victim and aggressor lines are disclosed. No shorting-vias or resistors are required. The rectangular resonators are found to have functions of improving far-end crosstalk (FEXT) and timing jitter in both frequency domain and time domain if the parameters are appropriated selected. | 05-23-2013 |
| 20130194052 | COMPACT ROTMAN LENS USING METAMATERIALS - Apparatus for receiving and transmitting electromagnetic signals are disclosed herein. In some embodiments, an apparatus includes a positive refractive index (PRI) medium; a negative refractive index (NRI) medium having a first side and a second side disposed in the PRI medium; a plurality of first transmission lines, each first transmission line having a first end extending toward the first side of the NRI medium; and a plurality of second transmission lines, each second transmission line having a second end extending toward the second side of the NRI medium, wherein a plurality of electromagnetic signals travelling in a first direction, enters the PRI medium and travels along the plurality of first transmissions lines and exits into first side of the NRI medium, passes through the NRI medium and exits through the second side of the NRI medium into the PRI medium along a first one of the second transmission lines. | 08-01-2013 |
| 20130321089 | WAVEGUIDE DEVICE, COMMUNICATION MODULE AND ELECTRONIC DEVICE - An electronic device includes a central control unit and a waveguide device. The waveguide device includes a communication module having a communication function, and an attachment/detachment unit capable of attaching/detaching a high-frequency signal waveguide so that coupling between the module and the high-frequency signal is possible. The communication module includes a communication device, and a transfer structure configured to cause a high-frequency signal emitted from the communication device to be coupled to the high-frequency signal waveguide. | 12-05-2013 |
| 20140085018 | TRANSMISSION LINE SYSTEM - An exemplary transmission line system is provided. The system includes a first transmission line partially arranged on a first layer of a PCB including first structure units and partially arranged on a third layer of the PCB including second structure units, and a second transmission line arranged on a second layer of the PCB. Each first structure unit and each second structure respectively include a first connection line, a second connection line, and a first curved line; and a third connection line, a fourth connection line, and a second curved line. A second end of the first connection line and the second connection line of each of the first structure units are respectively connected to a second end of the third connection line and the fourth connection line of the adjacent second structure unit through vias. | 03-27-2014 |
| 20140266490 | ROUTING OF DUAL STRIP LINES TO REDUCE CROSSTALK - A signal line design is described herein. A circuit board may include a first signal line and a second signal line. The first signal line includes a pair of signal lines at a first depth of a section of a circuit board, wherein a centerline extends lengthwise between the pair of signal lines. The second signal line is disposed at a second depth of the circuit board. The second signal line includes a first segment that runs parallel to the first signal line at a first displacement from the center line. The second signal line includes a second segment that runs parallel to the first signal line on the other side of the center line at a second displacement distance from the center line. | 09-18-2014 |
| 20140285277 | Dielectric Waveguide Manufactured Using Printed Circuit Board Technology - A dielectric waveguide may be manufactured by forming a set of parallel channels in a planar sheet that has a lower dielectric constant value. The set of channels is then filled with a material having a higher dielectric constant value. The planar sheet is sliced into a plurality of strips that each contain one or more of the channels. | 09-25-2014 |
| 20140300428 | WAVEGUIDE STRUCTURE AND PRINTED-CIRCUIT BOARD - A waveguide structure or a printed-circuit board is formed using a plurality of unit structures which are repetitively aligned in a one-dimensional manner or in a two-dimensional manner. The unit structure includes first and second conductive planes which are disposed in parallel with each other, a transmission line having an open end which is formed in a layer different from the first and second conductive planes and positioned to face the second conductive plane, and a conductive via electrically connecting the transmission line to the first conductive plane. | 10-09-2014 |
| 20140300429 | WAVEGUIDE STRUCTURE AND PRINTED-CIRCUIT BOARD - A waveguide structure or a printed-circuit board is formed using a plurality of unit structures which are repetitively aligned in a one-dimensional manner or in a two-dimensional manner. The unit structure includes first and second conductive planes which are disposed in parallel with each other, a transmission line having an open end which is formed in a layer different from the first and second conductive planes and positioned to face the second conductive plane, and a conductive via electrically connecting the transmission line to the first conductive plane. | 10-09-2014 |
| 20140306776 | PLANAR RF CROSSOVER STRUCTURE WITH BROADBAND CHARACTERISTIC - An RF crossover structure includes a first and second independent transmission lines formed to cross with each other on a same surface of a dielectric substrate; first via-holes connected to the second transmission line so that the second transmission line is connected to a back surface from a front surface of the dielectric substrate and is connected again to the front surface of the dielectric substrate out of a crossing region at which the first and the second transmission lines are crossed. Further, the RF crossover structure includes CPW (Coplanar Waveguide) transmission lines used for a ground plane to improve a signal transmission property at the crossing region. | 10-16-2014 |
| 20140375394 | ATTENUATION REDUCTION CONTROL STRUCTURE FOR HIGH-FREQUENCY SIGNAL TRANSMISSION LINES OF FLEXIBLE CIRCUIT BOARD - An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines. | 12-25-2014 |
| 20150054592 | ON-CHIP VERTICAL THREE DIMENSIONAL MICROSTRIP LINE WITH CHARACTERISTIC IMPEDANCE TUNING TECHNIQUE AND DESIGN STRUCTURES - A vertical three dimensional (3D) microstrip line structure for improved tunable characteristic impedance, methods of manufacturing the same and design structures are provided. More specifically, a method is provided that includes forming a first microstrip line structure within a back end of the line (BEOL) stack. The method further includes forming a second microstrip line structure separated from the BEOL stack by a predetermined horizontal distance. | 02-26-2015 |
| 20150327357 | FLOATING CONNECTOR SHIELD - The disclosure generally relates to shielded transmission lines, electrical systems including the shielded transmission lines, cables using shielded transmission lines, and electrical connectors using shielded transmission lines. In particular, the present disclosure provides transmission lines that include floating shields capable of isolating interference between conductors that can result in reduced crosstalk. | 11-12-2015 |
| 20150333387 | BROADSIDE COUPLED DIFFERENTIAL DESIGN - A broadside coupled differential design is described herein. The design may include a differential pair. Each trace of the differential pair includes a wide portion and a narrow portion. The wide portion of the first trace of the differential pair is to be aligned with a narrow portion of the second trace of the differential pair. Additionally, the wide portion of the second trace of the differential pair is to be aligned with a narrow portion of the first trace of the differential pair, such that the wide and narrow portions of the traces of the differential pair are staggered. | 11-19-2015 |
| 20150340751 | PRINTED WIRING BOARD - To suppress occurrence of a difference in transmission time due to a difference in length between signal lines, there is provided a printed wiring board having: an insulating substrate ( | 11-26-2015 |
| 20160120018 | MULTI-LAYER PRINTED CIRCUIT BOARDS SUITABLE FOR LAYER REDUCTION DESIGN - A multi-layer printed circuit board comprises: at least two insulation layers, respectively having glass fiber cloth and cured resin covering thereon, the insulation layers being stacked on each other; an internal trace layer formed between two neighboring insulation layers; and an external trace layer formed on an outer surface of the outermost insulation layer; wherein the insulation layers have a dielectric constant of 3.4 or less, and the internal and external trace layers have a trace width between 40 and 75 micrometers, such that the multi-layer printed circuit board has a characteristic impedance between 45 and 55 Ω in single-ended signaling and between 90 and 110 Ω in differential signaling. | 04-28-2016 |
| 20160149558 | EFFECTIVE BIASING ACTIVE CIRCULATOR WITH RF CHOKE CONCEPT - A multi-port active circulator where each of plurality of FET transistors has (i) a gate connected to an associated port of the multi-port active circulator via a capacitor of an associated one of a plurality of first RF chokes, each of the first RF chokes being connected to a gate of an associated FET transistor of said plurality of transistors, the associated port of said associated FET transistor and to a power supply bias connection; (ii) a source connected to a common point; and (iii) a drain connected to the gate of the same FET transistor by a feedback circuit and connected to the gate of a neighboring FET transistor via a capacitor of one of a plurality of second RF chokes, each of which coupling gates and drains of neighboring FET transistors via capacitors thereof and being connected to another power supply bias connection. | 05-26-2016 |
| 20160150638 | INTERCONNECT ARRAY PATTERN WITH A 3:1 SIGNAL-TO-GROUND RATIO - An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of interconnects include: a first conductor pair with conductors arranged next to each other in a first direction, the first direction is oriented diagonally relative to the orthogonal grid pattern, a second conductor pair with conductors arranged next to each other in a second direction substantially perpendicular to the first direction, each conductor of the second conductor pair is spaced by the first distance from each signal conductor of the first conductor pair, and a third conductor pair with conductors arranged next to each other in a third direction substantially parallel to the first direction, each conductors of the third conductor pair is spaced by the first distance from one of the signal elements of the second conductor pair. | 05-26-2016 |
| 20160156085 | ACTIVE QUASI CIRCULATOR | 06-02-2016 |
| 20160190673 | IC-PACKAGE INTERCONNECT FOR MILLIMETER WAVE SYSTEMS - Consistent with an example embodiment, a System on Chip (SoC) device operates in millimeter wave frequencies. The SoC device comprises, a silicon device having at least one differential pair pad, the at least one differential pair pad having a shunt inductor coupled thereon. A parasitic capacitance on at least one differential pair pads is tuned out by resonance of the shunt inductor. A package has a redistribution layer (RDL), with an array of contact areas to which the silicon device is mounted and then encapsulated. A connection corresponds to the at least one differential pair pad and the connection is located about an outer row or column of the array of contact areas. | 06-30-2016 |
| 20160204494 | 3D MULTILAYER HIGH FREQUENCY SIGNAL LINE | 07-14-2016 |
| 20160380324 | TRANSMISSION LINE DESIGN AND METHOD OF FORMING THE SAME - A transmission line design includes a first transmission line configured to transfer at least one first signal. The transmission line design further includes a second transmission line configured to transfer at least one second signal, wherein the second transmission line is spaced from the first transmission line. The transmission line design further includes a high-k dielectric material between the first transmission line and the second transmission line. The transmission line design further includes a dielectric material surrounding the high-k dielectric material, the first transmission line and the second transmission line, wherein the dielectric material is different from the high-k dielectric material. | 12-29-2016 |
| 20180026325 | WAVEGUIDE STRUCTURES | 01-25-2018 |
