| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 333004000 | With balanced circuits | 58 |
| 20080224790 | Balance filter and duplexer - A balance filter includes a first filter having first multimode surface acoustic wave (SAW) filters connected in parallel, a second filter that is connected to the first filter and includes a second multimode SAW filter, a first terminal connected to the first filter, and second terminals connected to the second filters. An input terminal of the balance filter is one of the first and second terminals, and an output terminal thereof is the other. Electric signals transmitted from the first to second filters or vice versa are in opposite phase. Electric signals are input or output via the second terminals in opposite phase. | 09-18-2008 |
| 20080315968 | HIGH-FREQUENCY COMPOSITE COMPONENT - A high-frequency composite component for selectively switching a GSM-system signal path and a DCS-system signal path for a signal transmitted to or received from an antenna terminal by a diplexer. Transmission-side input terminals and reception-side balanced output terminals to be switched by high-frequency switches are included in the GSM and the DCS systems. Matching elements include inductors and capacitors that are inserted between the reception-side balanced output terminals and the output side of surface acoustic wave filters. | 12-25-2008 |
| 20090021322 | ELASTIC WAVE FILTER DEVICE AND DUPLEXER - An elastic wave filter device includes first and second elastic wave filter units connected to an unbalanced terminal. The first and second elastic wave filter units include first to third IDTs and fourth to sixth IDTs, respectively. One end of the first IDT, one end of the second IDT, one end of the fourth IDT, and one end of the sixth IDT are commonly connected together and are connected to the unbalanced terminal. The second IDT and the fifth IDT are each divided into first to third sub-IDT portions in the elastic wave propagation direction, respectively. The second sub-IDT portions of the second and fifth IDTs are connected to first and second balanced terminals, respectively. | 01-22-2009 |
| 20090051457 | DMS-Filter with Connected Resonators - A surface acoustic wave filter arrangement is described herein. The surface acoustic wave filter arrangement includes a first gate configured to operate symmetrically or asymmetrically, and a second gate configured to operate symmetrically. The filter arrangement also includes a double-mode surface acoustic wave (DMS) filter structure including an input connected to the first gate, and an output. The output includes a terminal pair that includes two symmetrical terminals configured to operate symmetrically. Each of the two symmetrical terminals of the terminal pair is electrically connected at the output of the DMS filter structure to a cascaded resonator. | 02-26-2009 |
| 20090091401 | METHOD AND APPARATUS FOR FACILITATING SIGNAL TRANSMISSION USING DIFFERENTIAL TRANSMISSION LINES - The illustrative embodiments described herein provide an apparatus and method for facilitating signal transmission using differential transmission lines. The apparatus includes a first differential transmission line. The first differential transmission line includes a first plurality of conductors. The first plurality of conductors includes a set of conductors. The apparatus also includes a second differential transmission line. The second differential transmission line includes a second plurality of conductors. The second plurality of conductors includes a first conductor and a second conductor. A first noise produced by the first conductor on the set of conductors is balanced by a second noise produced by the second conductor on the set of conductors. The first differential transmission line and the second differential transmission line facilitate signal transmission. | 04-09-2009 |
| 20090273408 | FILTER DUPLEXER AND COMMUNICATION DEVICE - A filter has a filter section that is provided with a balanced input terminal including a terminal | 11-05-2009 |
| 20100066461 | DUPLEXER AND ELASTIC WAVE DEVICE - In a duplexer, a transmission elastic wave filter and a reception elastic wave filter are mounted on a laminated substrate, a coil connected between an antenna terminal and a ground potential is provided on the laminated substrate, the reception elastic wave filter has first and second ground pads connected to ground potentials of IDTs connected to first and second balanced terminals, the distance between the second ground pad and the coil is greater than the distance between the first ground pad and the coil, and an inductance component in a conductive path E connecting the second ground pad to the second ground terminal is less than an inductance component in a conductive path D connecting the first ground pad to the first ground terminal, so as to improve isolation characteristics between first and second balanced terminals of a reception filter chip. | 03-18-2010 |
| 20100117755 | BALUN CIRCUIT AND INTEGRATED CIRCUIT DEVICE - A balun circuit comprising first through third CPW lines becoming signal I/O ports, a first differential transmission line for linking the central conductor of the second CPW line and the ground conductor of the first CPW line and for linking the ground conductor of the second CPW line and the central conductor of the first CPW line, a second differential transmission line for linking the central conductors of the first and third CPW lines and for linking the ground conductors of the first and third CPW lines, and a joint for connecting at least two ground conductors of the first through third CPW lines. The differential transmission line has a first line formed in a dielectric layer on a substrate, a second line arranged in the underlying layer, and an underlying line at a fixed potential arranged between the substrate and the second line. | 05-13-2010 |
| 20100219901 | DUPLEXER - A duplexer according to the present invention includes: an acoustic wave element having a first terminal and a second terminal; a substrate mounting the acoustic wave element on the surface; a first columnar conductor electrically connected to the first terminal, and drawn to a back surface of the substrate, while being buried partially in the substrate; a second columnar conductor electrically connected to the second terminal, and drawn to the back surface of the substrate, while being buried partially in the substrate; a first ground pattern region arranged between the first columnar conductor drawn part and the second columnar conductor drawn part on the back surface of the substrate; a second ground pattern region electrically connected to the first ground pattern region on the back surface of the substrate and arranged in the part not including the part between the first columnar conductor drawn part and the second columnar conductor drawn part; and a third columnar conductor electrically connected to the first ground pattern region, while being buried partially in the substrate. | 09-02-2010 |
| 20100237961 | DIFFERENTIAL SIGNAL TRANSMISSION CABLE AND METHOD FOR COMPENSATING LENGTH OFFSET THEREOF - A compensation method compensates for a length offset between a first transmission line and a second transmission line of a differential signal transmission. The compensation method includes calculating a transmission speed of a first signal in the first transmission line, measuring lengths of the first and second transmission lines, calculating a transmission time of the first signal in the first transmission line, and calculating a relationship between permittivity values of the first and second transmission lines. The compensation method further changes the permittivity values of the first and second transmission lines according to the relationship. | 09-23-2010 |
| 20100259337 | High speed transmission lines with enhanced coupling - According to one exemplary embodiment, a circuit board for reducing dielectric loss, conductor loss, and insertion loss includes a pair of transmission lines. The pair of transmission lines has sufficient thickness to cause substantial broadside electromagnetic coupling between the pair of transmission lines, where the pair of transmission lines is sufficiently separated from a ground plane of the circuit board so as to cause negligible electromagnetic coupling to the ground plane relative to the substantial broadside electromagnetic coupling. The pair of transmission lines thereby reduce dielectric loss, conductor loss, and insertion loss for signals traversing through the transmission line pair. The pair of transmission lines can be separated from the ground plane by, for example, at least 50.0 mils. | 10-14-2010 |
| 20110095839 | PREVENTION STRUCTURE TO PREVENT SIGNAL LINES FROM TIME-SKEW - A prevention structure to prevent signal lines from time-skew is described. The prevention structure includes a plurality pairs of differential signal lines and a prevention line. The adjacent pairs of differential signal lines are separated from each other by a first gap. Each pair of the differential signal lines includes a positive signal line and a negative signal line each having a first line width. The prevention line has the second line width substantially equal to the first line width and is separated from the outmost differential signal line by a second distance substantially equal to the first distance. | 04-28-2011 |
| 20110109400 | Electronic Device - To provide a branching filter enabling sharing of the same mounting substrate between the normal arrangement and the mirror arrangement that is symmetric to the normal arrangement of an electrode group formed on a main surface of a piezoelectric substrate and a method for manufacturing the same. The branching filter | 05-12-2011 |
| 20110193650 | Duplexer, Communication Module Component, and Communication Device - [Problem] To provide a duplexer able to improve the isolation characteristic and the attenuation characteristic and a communication device using the same. | 08-11-2011 |
| 20110210803 | DIFFERENTIAL CIRCUIT AND LAYOUT METHOD FOR THE SAME - A differential circuit includes a chip with two terminals in two directions, a first differential signal trace, and a second differential signal trace. The first differential signal trace includes a first parallel section and a first unparallel section connecting the first parallel section to a terminal of the chip. The second differential signal trace includes a second parallel section parallel to the first parallel section, a second unparallel section connecting to the second parallel section, and an equalizing section connecting second unparallel section to the another terminal of the chip. The second parallel section is equal to the first parallel section. The total length of the second unparallel section and the equalizing section is equal to the length of the first unparallel section. | 09-01-2011 |
| 20110215880 | Method and System for Flip Chip Configurable RF Front End With an Off-Chip Balun - Methods and systems for a flip chip configurable RF front end with an off-chip balun may include bonding a balun package to a single integrated circuit (IC) comprising an integrated transmitter and a receiver. The balun package may comprise one or more layers and may be electrically coupled to the IC. The balun package may comprise various devices such as, for example, inductors, capacitors, resistors, and/or switches, which may be on an exterior surface and/or inner layers of the balun package. Accordingly, the balun package and/or the IC may be configured for receiving RF signals and/or transmitting RF signals. The balun package and/or the IC may also be configured for single-ended RF input, single-ended RF output, differential RF input, and/or differential RF output. An off-chip amplifier may be used to amplify signals on the single transmit line in the single-ended RF output mode of operation. | 09-08-2011 |
| 20110221542 | HIGH-FREQUENCY MODULE - A high-frequency module includes a balanced demultiplexer including a pair of balanced signal terminals and that has at least one of high differential isolation and high differential attenuation. A distance between an antenna terminal and a second balanced signal terminal provided on a mounting surface of a circuit board is greater than the antenna terminal and a first balanced signal terminal. On a back surface of the circuit board, a distance between a first back surface side electrode pad to which the antenna terminal is connected and a fourth back surface side electrode pad to which the second balanced signal terminal is connected is less than a distance between the first back surface side electrode pad to which the antenna terminal is connected and a third back surface side electrode pad to which the first balanced signal terminal is connected. | 09-15-2011 |
| 20110273240 | PRINTED CIRCUIT BOARD AND LAYOUT METHOD THEREOF - A printed circuit board layout method includes the following steps. A printed circuit board with a signal layer and a pair of differential transmission lines positioned on the signal layer is provided. A first distance is determined; when the distance between the pair of differential transmission lines is greater than the first distance, an eye width and an eye height of an eye diagram nearly remains the same. When a distance between the pair of differential transmission lines is less than the first distance, an eye width and an eye height of an eye diagram decreases. A second distance that is less than the first distance is set between the pair of differential transmission lines which makes the eye width and the eye height greater than a predetermined value, and which is determined by a Far End Crosstalk (FEXT) on the eye diagram when the pair differential transmission lines transmit signals. | 11-10-2011 |
| 20120007688 | PRINTED CIRCUIT BOARD - A printed circuit board includes an insulation layer and a signal layer attached to the insulation layer. The signal layer includes a pair of differential transmission lines. Width W of each of the differential transmission lines is changed according to change of space S between the differential transmission lines, based on the following formula: | 01-12-2012 |
| 20120025924 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Two transmission lines are formed adjacent to each other at spacing on an upper surface of a base insulating layer, and a ground conductor layer is formed on a lower surface of the base insulating layer. The ground conductor layer is arranged to be opposite to at least part of one transmission line and at least part of the other transmission line in a width direction of the two transmission lines. When a width of one transmission line, a width of the other transmission line, a spacing between the two transmission lines and a width of the ground conductor layer in an arbitrary cross section perpendicular to the two transmission lines are referred to as W | 02-02-2012 |
| 20130049878 | DIFFERENTIAL MODE TRANSMISSION LINES WITH WEAK COUPLING STRUCTURE - A differential mode transmission line with a weak coupling structure is presented. The differential mode transmission line with a weak coupling structure includes a first transmission line and a second transmission line. The first transmission line includes a first wiring portion, a second wiring portion, and a third wiring portion. The second transmission line also includes a first wiring portion, a second wiring portion, and a third wiring portion. The wiring portions of the present disclosure are connected through connection portions, and the connection portions are designed as a corner structure. Due to the characteristics of the corner structure of the present disclosure, a pitch between the second wiring portions is greater than that between the first wiring portions or the third wiring portions, thereby generating a weak coupling structure to suppress common mode noises. | 02-28-2013 |
| 20130141180 | HIGH-FREQUENCY MODULE - A high-frequency module has a structure including balanced terminals, with high design flexibility and good transmission characteristics. Wiring patterns to be connected to balanced terminals of SAW filters of SAW duplexers are located on a second layer to a sixth layer of a layered body. The characteristic impedances of first wiring patterns defining a pair of parallel or substantially parallel lines match, the characteristic impedances of second wiring patterns defining a pair of parallel or substantially parallel lines match, the characteristic impedances of third wiring patterns defining a pair of parallel or substantially parallel lines match, and the characteristic impedances of fourth wiring patterns defining a pair of parallel or substantially parallel lines match. | 06-06-2013 |
| 20130194053 | Integrated Combiner with Common Mode Correction - A circuit can include multiple data input ports and data output ports, pickoff tees coupled therebetween, and a resistive network coupled between the pickoff tees. A differential signal generator can be coupled with the resistive network and the pickoff tees. Resistances of the pickoff tees and resistive network can be selected such that impedances looking into the data input ports and data output ports are matched to a desired system impedance. | 08-01-2013 |
| 20130300514 | Transmission Line Shielding - A shield for differential transmission lines formed in a first metal layer may include one or more floating shields, each floating shield comprising an upper-side tile formed in a second metal layer of the integrated circuit adjacent to the first metal layer, a lower-side tile formed in a third metal layer of the integrated circuit adjacent to the first metal layer and non-adjacent to the second metal layer, and at least one via configured to electrically couple the upper-side tile at an end of the length of the upper-side tile to the lower-side tile and at an end of the length of the lower-side tile. | 11-14-2013 |
| 20140300430 | Ultra-Broadband Planar Millimeter-Wave Mixer with Multi-Octave IF Bandwidth - In some embodiments, a system may include a passive uniplanar single-balanced millimeter-wave mixer. In some embodiments, a three-port diode-tee IC forming a mixer core is coupled between an end of a slotline balun and a second coplanar balun. The operational bandwidth of a mixer structure is enhanced by optimizing the distance between the mixer diode-tee core and the back-short circuits. The frequency separation of LO and IF signals may be accomplished by means of stand-alone three-port filter-diplexer device. The system may allow wider than a frequency octave operational bandwidth for a frequency converter device all the way into millimeter wave frequencies at the same time as supporting the operational bandwidth for baseband IF signal over more than six frequency octaves. In some embodiments, the system may accomplish a 500 MHz to 34.5 GHz continuous IF bandwidth with RF signal sweeping from 33 GHz to 67 GHz and local oscillator at 67.5 GHz fixed frequency. | 10-09-2014 |
| 20140340167 | DIFFERNTIAL TRANSMISSION CIRCUIT - A low pass filter | 11-20-2014 |
| 20150373837 | TRANSMISSION OF SIGNALS ON MULTI-LAYER SUBSTRATES WITH MINIMUM INTERFERENCE - A signal transmission system including first and second transmission lines laid out side by side on a planar surface over a length L, each transmission line including a first conducting path and a second conducting path and each transmission line including a plurality of crossover structures at each of which the first and second conducting paths of that transmission line cross over each other to reverse the position of the two conducting paths relative to each other, wherein the plurality of crossover structures on the two transmission lines are arranged over the length L of the two transmission lines such that each of the first and second conducting paths of the first transmission line is a nearest neighbor of each of the first and second conducting paths of the second transmission line over distances that are substantially the same. | 12-24-2015 |
| 20160134445 | WIRING SUBSTRATE - A wiring substrate may include an insulating layer, a differential signal transmission line configured to include a first wire and a second wire disposed inside the insulating layer to be spaced apart from each other in a thickness direction of the substrate, the first wire and the second wire transmitting differential signals, and a first ground layer disposed between the first wire and the second wire. | 05-12-2016 |
| 333005000 | Plural balanced circuits | 30 |
| 20080224791 | Integrated Balanced-Unbalanced Duplexer - Circuitry, architectures, devices and systems for multi-band radio communications using a balanced-unbalanced duplexer. An integrated balanced-unbalanced duplexer for multi-band communications may include an unbalanced multi-band port; a first balanced single-band port; a second balanced single-band port; a first unbalanced coupling arm conductively coupled to the unbalanced multi-band port; a second unbalanced coupling arm conductively coupled to the unbalanced multi-band port; a first pair of balanced coupling arms conductively coupled to the first balanced single-band port and electromagnetically coupled to the first unbalanced coupling arm; and a second pair of balanced coupling arms conductively coupled to the second balanced single-band port and electromagnetically coupled to the second unbalanced coupling arm. The architectures and/or systems generally include components embodying one or more of the concepts disclosed herein. | 09-18-2008 |
| 20080231387 | HIGH-FREQUENCY MODULE - In a high-frequency module, mounting lands arranged to mount at least one filter device having at least one set of an unbalanced terminal and two balanced terminals are provided at one side of a substrate top surface, and mounting lands arranged to mount at least one element electrically connected to the filter device are arranged at the opposite side. At least two of a plurality of connection terminals provided on a substrate bottom surface are respectively connected to conductor patterns connected to via-hole conductors penetrating the substrate within a mounting area for mounting the filter device via connection lines and are arranged at a pitch which is less than the pitch of the via-hole conductors. | 09-25-2008 |
| 20090273409 | ACOUSTIC WAVE FILTER APPARATUS - An acoustic wave filter apparatus includes first and second acoustic wave filter sections on one piezoelectric substrate, first balance terminals of the first and second acoustic wave filter sections are commonly coupled to each other, and second balance terminals thereof are commonly coupled to each other. An acoustic wave filter apparatus where first balance input/output terminals of first and second acoustic wave filter sections are commonly connected to each other and then connected to a first balance terminal, second balance input/output terminals thereof are commonly connected to each other and then connected to a second balance terminal, the first and second balance output terminals of the first acoustic wave filter section are connected to first and third acoustic wave resonators, respectively, via first and third wiring lines, respectively, and then coupled to the first and second balance terminals, respectively, via the first and third acoustic wave resonators, respectively, the first and second balance output terminals of the second acoustic wave filter section are coupled to the first and second balance terminals, respectively, via second and fourth wiring line and second and fourth acoustic wave resonators, respectively, and the second wiring line and second wiring line cross each other on a piezoelectric substrate. | 11-05-2009 |
| 20100007429 | PRINTED CIRCUIT BOARD - A printed circuit board includes a plurality of differential pairs arranged thereon side-by-side. Each differential pair includes two transmission lines. Each transmission line includes a plurality of sections of equal length. Every two adjacent sections in each transmission line meet at an angle, and all angles are equal. The length of each section is determined by dividing the distance between two corresponding angles of the two transmission lines of each differential pair by the cosine of half of the angle. | 01-14-2010 |
| 20100052807 | ACOUSTIC WAVE FILTER DEVICE - An acoustic wave filter device includes a plurality of acoustic wave filters disposed on the same piezoelectric substrate, and achieves enlargement of out-of-passband attenuation without a large increase in its size. For at least the first acoustic wave filter, ends of second IDTs and of third IDTs connected to first and second balanced terminals, the ends being connected to a ground potential, are connected to a common connection line, the common connection line is connected to a ground terminal by a ground line, and a distance between a connection point, at which the ground line is connected to the common connection line, and the first balanced terminal, and a distance between the connection point and the second balanced terminal, is the same or substantially the same. | 03-04-2010 |
| 20100060372 | ACOUSTIC WAVE DUPLEXER - An acoustic wave duplexer has a satisfactory isolation characteristic between a reception acoustic wave filter chip and a transmission acoustic wave filter chip, and includes a reception surface acoustic wave filter chip and a transmission surface acoustic wave filter chip mounted on a substrate. The substrate includes first and second balanced terminals and a common terminal. At least one of the transmission surface acoustic wave filter chip and the reception surface acoustic wave filter chip is a balanced filter unit that includes, as an input terminal or an output terminal, a first balanced signal terminal and a second balanced signal terminal. The acoustic wave duplexer further includes a first interconnection arranged to connect the balanced filter unit and the first balanced terminal and a second interconnection arranged to connect the balanced filter unit and the second balanced terminal. The first and second interconnections intersect with each other while being insulated from each other. | 03-11-2010 |
| 20100123526 | Balanced-output triplexer - A balanced-output triplexer includes: a first filter provided between an input terminal and a pair of first balanced output terminals; a second filter provided between the input terminal and a pair of second balanced output terminals; and a third filter provided between the input terminal and a pair of third balanced output terminals. All of the first to third filters are provided within a layered substrate. All of the balanced output terminals are disposed to be adjacent to one of the sides of the top surface of the layered substrate and one of the sides of the bottom surface of the layered substrate. | 05-20-2010 |
| 20110227663 | 3-WAY BALUN FOR PLANAR-TYPE DOUBLE BALANCED MIXER - Provided is a 3-way balun for a double balanced mixer. This research provides a 3-way balun available for a planar-type double balanced mixer and a planar-type double balanced mixer employing the same. The 3-way balun includes a first output unit for receiving and outputting an input signal of a predetermined frequency; and second and third output units connected to the first output unit and outputting signals whose phase is different by 180 from a phase of a signal of the first output unit and amplitude is a half of an amplitude of the signal outputted from the first output unit. | 09-22-2011 |
| 20110279189 | PRINTED WIRING BOARD AND DEVICE INCLUDING PRINTED WIRING BOARD - A printed wiring board includes a first terminal array and a second terminal array comprising a plurality of terminals, a first differential signal line connecting a first terminal of the first terminal array to a predetermined number of terminals including a second terminal of the second terminal array, a second differential signal line connecting a third terminal of the first terminal array to a number of terminals including a fourth terminal of the second terminal array, which is bigger than the predetermined number of terminals wherein at least one of a line width and a line interval of one pair signal lines configuring the first differential signal line and the second differential signal line is determined so that differential impedance of the second differential signal line becomes higher compared with differential impedance of the first differential signal line. | 11-17-2011 |
| 20120001701 | SIGNAL PROCESSING CIRCUIT AND ANTENNA APPARATUS - To form a signal processing circuit and an antenna apparatus that do not need a circuit to adjust resonant frequency of a resonant circuit or resonant-frequency adjustment work and that are downsized, an antenna coil and a capacitor define an antenna resonant circuit. An impedance matching circuit including capacitors, a first coil, and a second coil is provided between the antenna resonant circuit and a wireless IC. The first coil and the second coil are magnetically coupled. | 01-05-2012 |
| 20120032749 | DIFFERENTIAL SIGNAL LINE STRUCTURE - A differential signal line structure is disposed on a substrate including a signal layer, a filter layer and a grounding layer. The signal layer, the filter layer and the grounding layer are arranged from up to down and in parallel manner. The differential signal line structure accordingly includes a differential signal line group, a first wire and a first grounding circuit; the differential signal line group is disposed in the signal layer; and the first wire is disposed in the filter layer and is arranged in a corresponding position right underneath the differential signal line group. The first grounding circuit is disposed in the grounding layer and is electrically connected to an end point of the first wire through a first via. | 02-09-2012 |
| 20120161893 | DIFFERENTIAL SIGNAL CROSSTALK REDUCTION - In some embodiments a second differential signal pair is located near a first differential signal pair. The second differential signal pair switches polarity near a middle point of a routing length of the second differential signal pair. Other embodiments are described and claimed. | 06-28-2012 |
| 20120262246 | ELASTIC WAVE FILTER AND COMMUNICATION DEVICE - An elastic wave filter includes at least a piezoelectric substrate and a longitudinally coupled resonator-type elastic wave filter unit provided on the piezoelectric substrate. The longitudinally coupled resonator-type elastic wave filter unit includes first to fifth IDTs and first and second reflectors arranged on either side of the first to fifth IDTs. The third IDT includes first and second divided comb-shaped electrodes. The second and fourth IDTs are connected to an unbalanced signal terminal, the first IDT and the first divided comb-shaped electrode of the third IDT are connected to a first balanced signal terminal, and the fifth IDT and the second divided comb-shaped electrode of the third IDT are connected to a second balanced signal terminal. The first and fifth IDTs each have a constant electrode finger pitch, and the electrode finger pitch of the first IDT is less than that of the fifth IDT. | 10-18-2012 |
| 20130082796 | COMPONENT - The present invention relates to a component (BE) which has a first duplexer operating with acoustic waves and a second duplexer operating with acoustic waves, wherein the first and second duplexers are arranged in a single SMD housing. In addition, the invention relates to a module (MO), which interconnects such a component (BE) and at least three 90° hybrids (HYB | 04-04-2013 |
| 20130162364 | PRINTED CIRCUIT BOARD - A printed circuit board includes an outer signal layer, a first ground layer, a first ground layer located below the outer signal layer, an inner signal layer located below the first ground layer, an second ground layer located below the inner signal layer, and a first differential signal transmission pair and a second differential signal transmission pair laid on the outer signal layer and the inner signal layer. A value h is equal to a distance between the inner signal layer and its closest ground layer. A distance between the first pair and the second pair is not more than h×3. | 06-27-2013 |
| 20130187725 | ACOUSTIC WAVE DEVICE - An acoustic wave device is provided with a low-frequency side filter having a low-frequency side passband, a high-frequency side filter having a high-frequency side passband, and first and second balanced terminals. The low-frequency side filter is connected to a first unbalanced terminal. The low-frequency side passband is a frequency band from a first minimum frequency to a first maximum frequency. The high-frequency side filter is connected to a second unbalanced terminal. The high-frequency side passband is a frequency band from a second minimum frequency to a second maximum frequency. The low-frequency side filter includes a first longitudinally-coupled acoustic wave resonator and a first one-terminal pair acoustic wave resonator connected in series to the first longitudinally-coupled acoustic wave resonator. An antiresonant frequency of the first one-terminal pair acoustic wave resonator is set to be higher than the first maximum frequency and lower than the second minimum frequency. | 07-25-2013 |
| 20130200958 | LAMINATE-TYPE ELECTRONIC DEVICE WITH FILTER AND BALUN - An electronic device comprising a laminate constituted by pluralities of insulation layers on which conductor patterns are formed; ground electrodes being formed on an upper-surface-side insulation layer and a bottom-surface-side insulation layer in the laminate; the laminate being partitioned to first and second regions by a first shield constituted by a line of via-holes electrically connecting the upper-surface-side ground electrode to the bottom-surface-side ground electrode; conductor patterns constituting a first filter for a first frequency band and conductor patterns constituting a first balun for the first frequency band being arranged in the first and second regions, respectively; pluralities of terminal electrodes being formed on bottom or side surfaces of the laminate; one of terminal electrodes of the first filter, which acts as an unbalanced port, being adjacent to a terminal electrode of the first balun, which acts as an unbalanced port, with no other terminal electrode than a ground electrode existing therebetween; and the first filter and the first balun being not electrically connected. | 08-08-2013 |
| 20130278348 | CROSSTALK CANCELLATION AND/OR REDUCTION - Some embodiments include a first differential signal pair and a second differential signal pair. The first and second differential signal pairs are arranged relative to each other in a manner to intentionally reduce or cancel crosstalk introduced by a pinout (for example, a section of a pinout, a socket, a connector, etc.) into at least one of the first differential signal pair and the second differential signal pair. Other embodiments are described and claimed. | 10-24-2013 |
| 20140091873 | DIFFERENTIAL SIGNAL CROSSTALK REDUCTION - In some embodiments a second differential signal pair is located near a first differential signal pair. The second differential signal pair switches polarity near a middle point of a routing length of the second differential signal pair. Other embodiments are described and claimed. | 04-03-2014 |
| 20140184350 | TWO LAYER DIFFERENTIAL PAIR LAYOUT, AND METHOD OF MAKING THEREOF, FOR REDUCED CROSSTALK - A device is provided for use with a signal, wherein the device includes a substrate, a first signal trace and a second signal trace. The first signal trace is disposed within the substrate at a first plane from the top surface by a distance d | 07-03-2014 |
| 20140197899 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD - A printed circuit board includes a plurality of wiring layers and a plurality of differential signal vias to establish connections between the plurality of wiring layers through via pairs and to be disposed so that paired-vias possessed by a specified differential signal via for transmitting a differential signal different from a signal of another differential signal via adjacent thereto are arranged on a locus of a point distanced equally from each of the paired-vias possessed by another differential signal via. | 07-17-2014 |
| 20140285280 | GROUNDING PATTERN STRUCTURE FOR HIGH-FREQUENCY CONNECTION PAD OF CIRCUIT BOARD - Disclosed is a grounding pattern structure for high-frequency connection pads of a circuit board. A substrate of the circuit board includes a component surface on which at least a pair of high-frequency connection pads. At least a pair of differential mode signal lines are formed on the substrate and connected to the high-frequency connection pads. The grounding surface of the substrate includes a grounding layer formed at a location corresponding to the differential mode signal lines. The grounding surface of the substrate includes a grounding pattern structure formed thereon to correspond to a location adjacent to the high-frequency connection pads. The grounding pattern structure is electrically connected to the grounding layer. The component surface of the substrate can be provided with a connector mounted thereto with signal terminals of the connector soldered to the high-frequency connection pads. | 09-25-2014 |
| 20150084712 | DUPLEXER AND MODULE INCLUDING THE SAME - A first filter channel with superior attenuation characteristics for transmission signals and is less susceptible to influence of transmission signals inputted to a transmission SAW filter device, is disposed closer to a transmission terminal, whereas a second filter channel with poor attenuation characteristics in a transmission band and is more susceptible to the influence of transmission signals inputted to the transmission SAW filter device, is disposed farther from a transmission terminal to improve isolation characteristics in a differential mode of a duplexer. | 03-26-2015 |
| 20150130551 | ELASTIC WAVE DEVICE AND DUPLEXING DEVICE - A balanced-unbalanced conversion-type elastic wave device includes an unbalanced signal terminal, first and second balanced signal terminals, and first to fifth interdigital transducers disposed along an elastic wave propagation direction. One end of each of the first, third, and fifth interdigital transducers is connected in common to the unbalanced signal terminal, one end of each of the second interdigital transducer and the fourth interdigital transducer is connected to the first and second balanced signal terminals respectively, a first inductance is connected between the first interdigital transducer and a ground potential, and a second inductance is connected between the fifth interdigital transducer and the ground potential. First and second inductance values of the first and second inductances, respectively, are different. | 05-14-2015 |
| 20150372661 | ACOUSTIC WAVE DEVICE - An acoustic wave device is provided with a low-frequency side filter having a low-frequency side passband, a high-frequency side filter having a high-frequency side passband, and first and second balanced terminals. The low-frequency side filter is connected to a first unbalanced terminal. The low-frequency side passband is a frequency band from a first minimum frequency to a first maximum frequency. The high-frequency side filter is connected to a second unbalanced terminal. The high-frequency side passband is a frequency band from a second minimum frequency to a second maximum frequency. The low-frequency side filter includes a first longitudinally-coupled acoustic wave resonator and a first one-terminal pair acoustic wave resonator connected in series to the first longitudinally-coupled acoustic wave resonator. An antiresonant frequency of the first one-terminal pair acoustic wave resonator is set to be higher than the first maximum frequency and lower than the second minimum frequency. | 12-24-2015 |
| 20160072471 | ELASTIC WAVE FILTER AND DUPLEXER USING SAME - An elastic wave filter has an unbalanced signal terminal, first and second balanced signal terminals, and first through fifth IDT electrodes arranged in ordinal order between a pair of grating reflectors. Wiring electrodes of the third and fifth IDT electrodes are disposed adjacent a ground electrode of the fourth IDT electrode, wiring electrodes of the second and third IDT electrodes are disposed adjacent one another, and ground electrodes of the first and second IDT electrodes are disposed adjacent one another. The unbalanced signal terminal is connected to the wiring electrodes of the first, third, and fifth IDT electrodes, and the first and second balanced signal terminals are connected to the wiring electrodes of the second and fourth IDT electrodes, respectively. A pitch gradation of pitch spacing between electrode fingers in each of the first, second, and third IDT electrodes on one side of a center line in the third IDT electrode is gradually reduced by a first spacing α, and a pitch gradation of pitch spacing between electrode fingers in each of the third, fourth, and fifth IDT electrodes on the other side of the center line is gradually reduced by a second spacing β (β≠α), as the distance from the center line increases. | 03-10-2016 |
| 20160111187 | DIFFERENTIAL SIGNAL CABLE AND MULTI-CORE DIFFERENTIAL SIGNAL TRANSMISSION CABLE - A differential signal cable includes a pair of signal line conductors for transmitting differential signals, an insulation collectively covering the pair of signal line conductors, a shielding tape wrapped around the insulation, and an insulating tape wound around the shielding tape. A gap is formed between an outer peripheral surface of the insulation and an inner surface of the shielding tape such that the insulation is movable relative to the shielding tape. | 04-21-2016 |
| 20160120026 | CIRCUIT BOARD, ELECTRONIC COMPONENT HOUSING PACKAGE, AND ELECTRONIC DEVICE - This circuit board includes a plate body made of a dielectric body and having a front surface and a back surface, a differential signal line formed on the front surface, the differential signal line being made of a pair of signal lines, and a ground conductor formed on the back surface. The signal lines include: terminals formed at a distance from the ground conductor, in an end portion at a prescribed distance from one end of the back surface; connection pads connected to the terminals and provided on the end portion of the front surface so as to be opposed to the terminals; transmission line units extending from the connections pads; and a widened portion provided in a position on the transmission line units corresponding to a space between the terminal and the ground conductor, the widened portion having a line width greater than that of the transmission line units. | 04-28-2016 |
| 20160174361 | SIGNAL ROUTING | 06-16-2016 |
| 20160181682 | DEVICES AND METHODS TO REDUCE DIFFERENTIAL SIGNAL PAIR CROSSTALK | 06-23-2016 |
