Class / Patent application number | Description | Number of patent applications / Date published |
257386000 | With means to reduce parasitic capacitance | 32 |
20080197423 | Device and method for reducing a voltage dependent capacitive coupling - A device comprises a first means for separating a conductive layer from a semiconductor substrate and a second means for reducing a voltage dependent capacitive coupling between the conductive layer and the semiconductor substrate. | 08-21-2008 |
20080224233 | Igfet Device Having a Rf Capability - An IGFET device includes: —a semiconductor body ( | 09-18-2008 |
20080251858 | FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME - A field effect transistor having a T- or Γ-shaped fine gate electrode of which a head portion is wider than a foot portion, and a method for manufacturing the field effect transistor, are provided. A void is formed between the head portion of the gate electrode and a semiconductor substrate using an insulating layer having a multi-layer structure with different etch rates. Since parasitic capacitance between the gate electrode and the semiconductor substrate is reduced by the void, the head portion of the gate electrode can be made large so that gate resistance can be reduced. In addition, since the height of the gate electrode can be adjusted by adjusting the thickness of the insulating layer, device performance as well as process uniformity and repeatability can be improved. | 10-16-2008 |
20090020830 | ASYMMETRIC FIELD EFFECT TRANSISTOR STRUCTURE AND METHOD - Disclosed are embodiments for a design structure of an asymmetric field effect transistor structure and a method of forming the structure in which both series resistance in the source region (R | 01-22-2009 |
20090278207 | Electromigration-Complaint High Performance FET Layout - An electrical contact structure distributes current along a length thereof. The electrical contact structure includes a plurality of n metal rectangles on n levels of metal. The rectangle on one metal level is at least as wide in width and vertically covers in width the rectangle on the metal level immediately below. The rectangle on one metal level is shorter in length than and substantially aligned at a first end with the rectangle on the metal level immediately below. Rectangle first ends are substantially aligned. Features of an exemplary FET transistor of this invention are a source and drain terminal electrical contact structure, a multi-level metal ring connecting gate rectangles on both ends, and a wider-than-minimum gate-to-gate spacing. The invention is useful, for example, in an electromigration-compliant, high performance transistor. | 11-12-2009 |
20090294872 | Ge/Xe IMPLANTS TO REDUCE JUNCTION CAPACITANCE AND LEAKAGE - A method of reducing junction capacitance and leakage and a structure having reduced junction capacitance and leakage wherein germanium or xenon is implanted in the source and drain regions to at least partially deactivate the dopants in the source and drain regions. | 12-03-2009 |
20090315120 | RAISED FACET- AND NON-FACET 3D SOURCE/DRAIN CONTACTS IN MOSFETS - An apparatus comprising a semiconductor substrate; a conductively doped source or drain (source/drain) region at the surface of the substrate; a raised semiconductor layer deposited over the source/drain region to form a raised source/drain region; a via formed in the raised source/drain region having substantially vertical sidewalls reaching partly or substantially to the source/drain region; and a metal contact filling the via. | 12-24-2009 |
20100025775 | Replacement spacers for mosfet fringe capacatance reduction and processes of making same - A process includes planarizing a microelectronic device that includes a gate stack and adjacent trench contacts. The process also includes removing a gate spacer at the gate stack and replacing the gate spacer with a dielectric that results in a lowered overlap capacitance between the gate stack and an adjacent embedded trench contact. | 02-04-2010 |
20110193175 | LOWER PARASITIC CAPACITANCE FINFET - An integrated circuit device includes a gate region extending above a semiconductor substrate and extending in a first longitudinal direction. A first fin has a first sidewall that extends in a second longitudinal direction above the semiconductor substrate such that the first fin intersects the gate region. A second fin has a second sidewall extending in the second direction above the semiconductor substrate such that the second fin intersects the gate region. A shallow trench isolation (STI) region is formed in the semiconductor substrate between the first and second sidewalls of the first and second fins. A conductive layer disposed over the first insulating layer and over top surfaces of the first and second fins. A first insulating layer is disposed between an upper surface of the STI region and a lower surface of the conductive layer to separate the STI region from the conductive layer. | 08-11-2011 |
20130277757 | Voids in STI Regions for Forming Bulk FinFETs - An integrated circuit structure includes a substrate; two insulation regions over the substrate, with one of the two insulation regions including a void therein; and a first semiconductor strip between and adjoining the two insulation regions. The first semiconductor strip includes a top portion forming a fin over top surfaces of the two insulation regions. | 10-24-2013 |
20130328132 | POWER SEMICONDUCTOR DEVICE AND METHOD THEREFOR - A power transistor includes a plurality of transistor cells. Each transistor cell has a first electrode coupled to a first electrode interconnection region overlying a first major surface, a control electrode coupled to a control electrode interconnection region overlying the first major surface, and a second electrode coupled to a second electrode interconnection region overlying a second major surface. Each transistor cell has an approximately constant doping concentration in the channel region. A dielectric platform is used as an edge termination of an epitaxial layer to maintain substantially planar equipotential lines therein. The power transistor finds particular utility in radio frequency applications operating at a frequency greater than 500 megahertz and dissipating more than 5 watts of power. The semiconductor die and package are designed so that the power transistor can efficiently operate under such severe conditions. | 12-12-2013 |
20140246731 | Voids in STI Regions for Forming Bulk FinFETs - An embodiment is an integrated circuit structure including two insulation regions over a substrate with one of the two insulation regions including a void, at least a bottom surface of the void being defined by the one of the two insulation regions. The integrated circuit structure further includes a first semiconductor strip between and adjoining the two insulation regions, where the first semiconductor strip includes a top portion forming a fin over top surfaces of the two insulation regions, a gate dielectric over a top surface and sidewalls of the fin, and a gate electrode over the gate dielectric. | 09-04-2014 |
20140332898 | FANOUT LINE STRUCTURE OFARRAY SUBSTRATE AND DISPLAY PANEL - A fanout line structure of an array substrate includes a plurality of fanout lines arranged on a fanout area of the array substrate, where resistance value of the fanout line is dependent on length of the fanout line. Each of the fanout lines comprises a first conducting film. Resistance values of a first part of fanout lines are less than resistance values of a second part of the fanout lines, and the first part of fanout lines are covered by an additional conducting film. In the fanout lines covered by the additional conducting film, as the resistance value of the fanout line, increases, area of the additional conducting film covering the fanout line correspondingly decreases. An additional capacitor is generated between the additional conducting film and the first conducting film. | 11-13-2014 |
20150294861 | PRODUCTION METHOD FOR ACTIVE ELEMENT SUBSTRATE, ACTIVE ELEMENT SUBSTRATE, AND DISPLAY DEVICE - The present invention provides a method of manufacturing an active element substrate aimed at reducing the production costs of an interlayer insulating film made from a spin-on glass material, for example. In the method of manufacturing an active element substrate, an interlayer insulating film is formed using a printing method that employs a plate. The plate includes: a main pattern that overlaps with signal lines that enclose openings; and fine line patterns that reduce, in the widthwise direction of the signal lines, the inclination of the edges of the printed pattern printed by the main pattern. | 10-15-2015 |
20160005729 | RADIO FREQUENCY TRANSISTOR STACK WITH IMPROVED LINEARITY - A RF transistor stack is described. The RF transistor stack comprises a first transistor having a T-gate layout configuration. The first transistor has a body region; a plurality of drain regions; and a plurality of source regions. A second transistor is provided which has a T-gate layout configuration. The second transistor has a body region; a plurality of drain regions; and a plurality of source regions. An interconnect operably couples the source regions of the first transistor with the source regions of the second transistor such that the distortion due to asymmetry in the division of RF voltage between the drain to source and the source to body terminals of first transistor is cancelled by reversing the asymmetry in the division of the RF voltage in the second transistor. | 01-07-2016 |
20160056279 | SEMICONDUCTOR DEVICE - A semiconductor device includes a fin-shaped silicon layer and a pillar-shaped silicon layer on the fin-shaped silicon layer, where a width of a bottom part of the pillar-shaped silicon layer is equal to a width of a top part of the fin-shaped silicon layer. A gate insulating film and a metal gate electrode are around the pillar-shaped silicon layer and a metal gate line extends in a direction perpendicular to the fin-shaped silicon layer and is connected to the metal gate electrode. A nitride film is on an entire top surface of the metal gate electrode and the metal gate line, except for the bottom of a contact. | 02-25-2016 |
20160064501 | UNDER-SPACER DOPING IN FIN-BASED SEMICONDUCTOR DEVICES - A fin field effect transistor (FinFET) device and a method of fabricating the FinFET are described. The device includes a fin formed on a substrate, the fin including a channel region of the device and a spacer and a cap formed over a dummy gate line separating a source and drain of the device. The device also includes an epitaxial layer formed over portions of the fin, the epitaxial layer being included between the fin and the spacer. | 03-03-2016 |
20160079354 | INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME - An IC device includes a substrate including a device region having a fin-type active region and a deep trench region; a gate line that extends in a direction intersecting the fin-type active region; and an inter-device isolation layer that fills the deep trench region. The gate line includes a first gate portion that extends on the device region to cover the fin-type active region and has a flat upper surface at a first level and a second gate portion that extends on the deep trench region to cover the inter-device isolation layer while being integrally connected to the first gate portion and has an upper surface at a second level that is closer to the substrate than the first level. | 03-17-2016 |
20160099260 | DISPLAY PANEL - A display panel includes a substrate, a plurality of first signal lines, a plurality of second signal lines, a plurality of pixel units, a plurality of transmitting lines, and a driving chip. The transmitting lines are disposed on the substrate and electrically connected to the second signal lines. The driving chip includes a plurality of first pins, a plurality of second pins, and a driving circuit. The first pins are electrically connected to the first signal lines, and the second pins are electrically connected to the transmitting lines. The first pins and the second pins are disposed alternately and evenly, such that the first signal lines and the transmitting lines do not intersect each other. The transmitting lines are disposed on the substrate evenly. | 04-07-2016 |
20160118462 | FinFET with an Asymmetric Source/Drain Structure and Method of Making Same - Embodiments of the present disclosure are a semiconductor device, a FinFET device, and a method of forming a FinFET device. An embodiment is a semiconductor device comprising a first semiconductor fin extending above a substrate, a first source region on the first semiconductor fin, and a first drain region on the first semiconductor fin. The first source region has a first width and the first drain region has a second width with the second width being different than the first width. | 04-28-2016 |
20160141379 | INTEGRATED CIRCUITS WITH MIDDLE OF LINE CAPACITANCE REDUCTION IN SELF-ALIGNED CONTACT PROCESS FLOW AND FABRICATION METHODS - Devices and methods for forming semiconductor devices with middle of line capacitance reduction in self-aligned contact process flow and fabrication are provided. One method includes, for instance: obtaining a wafer with at least one source, drain, and gate; forming a first contact region over the at least one source and a second contact region over the at least one drain; and forming at least one first and second small contact over the first and second contact regions. One intermediate semiconductor device includes, for instance: a wafer with a gate, source region, and drain region; at least one first contact region positioned over a portion of the source; at least one second contact region positioned over a portion of the drain; at least one first small contact positioned above the first contact region; and at least one second small contact positioned above the second contact region. | 05-19-2016 |
20160380065 | SEMICONDUCTOR STRUCTURES WITH FIELD EFFECT TRANSISTOR(S) HAVING LOW-RESISTANCE SOURCE/DRAIN CONTACT(S) - Disclosed are semiconductor structures comprising a field effect transistor (FET) having a low-resistance source/drain contact and, optionally, low gate-to-source/drain contact capacitance. The structures comprise a semiconductor body and, contained therein, first and second source/drain regions and a channel region. A first gate is adjacent to the semiconductor body at the channel region and a second, non-functioning, gate is adjacent to the semiconductor body such that the second source/drain region is between the first and second gates. First and second source/drain contacts are on the first and source/drain regions, respectively. The second source/drain contact is wider than the first and, thus, has a lower resistance. Additionally, spacing of the first and second source/drain contacts relative to the first gate can be such that the first gate-to-second source/drain contact capacitance is equal to or less than the first gate-to-first source/drain contact capacitance. Also disclosed are associated formation methods. | 12-29-2016 |
257387000 | Gate electrode overlaps at least one of source or drain by no more than depth of source or drain (e.g., self-aligned gate) | 8 |
20080272441 | Method and circuit for down-converting a signal - Methods, systems, and apparatuses for down-converting an electromagnetic (EM) signal by aliasing the EM signal are described herein. Briefly stated, such methods, systems, and apparatuses operate by receiving an EM signal and an aliasing signal having an aliasing rate. The EM signal is aliased according to the aliasing signal to down-convert the EM signal. The term aliasing, as used herein, refers to both down-converting an EM signal by under-sampling the EM signal at an aliasing rate, and down-converting an EM signal by transferring energy from the EM signal at the aliasing rate. In an embodiment, the EM signal is down-converted to an intermediate frequency signal. In another embodiment, the EM signal is down-converted to a demodulated baseband information signal. In another embodiment, the EM signal is a frequency modulated (FM) signal, which is down-converted to a non-FM signal, such as a phase modulated signal or an amplitude modulated signal. | 11-06-2008 |
20090001480 | HIGH-k/METAL GATE MOSFET WITH REDUCED PARASITIC CAPACITANCE - The present invention provides a high-k gate dielectric/metal gate MOSFET that has a reduced parasitic capacitance. The inventive structure includes at least one metal oxide semiconductor field effect transistor (MOSFET) | 01-01-2009 |
20090039443 | GATE STRUCTURE - A gate structure includes a substrate, a gate dielectric layer, a first conductive layer, a second conductive layer, a cap layer and a first insulating spacer. The gate dielectric layer is disposed on the substrate. The first conductive layer is disposed on the gate dielectric layer and has an opening. A part of the second conductive layer is disposed in the opening. The second conductive layer has an extrusion that protrudes above the opening of the first conductive layer. The extrusion has a cross-sectional width less than the width of the second conductive layer inside the opening. The cap layer is disposed on the extrusion. The first insulating spacer is disposed on a part of the first conductive layer and covers the sidewalls of the extrusion. The inclusion of the extrusion in the second conductive layer decreases the resistance of the gate structure and promotes the efficiency of the device. | 02-12-2009 |
20090184378 | STRUCTURE AND METHOD TO FABRICATE MOSFET WITH SHORT GATE - A method of producing a semiconducting device is provided that in one embodiment includes providing a semiconducting device including a gate structure atop a substrate, the gate structure including a dual gate conductor including an upper gate conductor and a lower gate conductor, wherein at least the lower gate conductor includes a silicon containing material; removing the upper gate conductor selective to the lower gate conductor; depositing a metal on at least the lower gate conductor; and producing a silicide from the metal and the lower gate conductor. In another embodiment, the inventive method includes a metal as the lower gate conductor. | 07-23-2009 |
20150372085 | LAYOUTS AND VERTICAL STRUCTURES OF MOSFET DEVICES - A metal-oxide-semiconductor field-effect transistor device includes a first active area, a first gate electrode configured to cross the first active area and extend in a Y direction, and define a first source area and a first drain area, first gate contacts disposed on the first gate electrode to align on a first virtual gate passing line extending in the Y direction, first source contacts disposed on the first source area to align on a first virtual source passing line extending in the Y direction, and first drain contacts disposed on the first drain area to align on a first virtual drain passing line extending in the Y direction, wherein at least one of the first drain contacts is disposed to align on any one of first virtual X-straight lines configured to pass between the first source contacts and extend parallel in an X direction perpendicular to the Y direction. | 12-24-2015 |
20160148999 | CAPACITANCE REDUCTION FOR ADVANCED TECHNOLOGY NODES - After forming source/drain contact trenches to expose source/drain regions, contact liner material layer portions are formed on sidewalls and bottom surfaces of the source/drain contact trenches. Contact material layer portions are then formed over the contact liner material layer portions to fill in the source/drain contact trenches. At least portions of the contact material layer portions and the contact liner material layer portions present on sidewalls of the source/drain contact trenches are removed to provide source/drain contacts with reduced contact capacitance. | 05-26-2016 |
20160197158 | LOW END PARASITIC CAPACITANCE FINFET | 07-07-2016 |
257388000 | Gate electrode consists of refractory or platinum group metal or silicide | 1 |
20080230848 | STRUCTURE HAVING DUAL SILICIDE REGION AND RELATED METHOD - A structure including a dual silicide region and a related method are disclosed. The structure may include a doped silicon, and a dual silicide region in the doped silicon, the dual silicide region including a first silicide region including a mid band gap metal, and a second silicide region including a near band gap metal, wherein the second silicide region is immediately adjacent to the doped silicon. The method may include forming a first silicide portion in a doped silicon by depositing a first metal over the doped silicon, annealing and removing unreacted first metal; ion implanting a second metal into the doped silicon; and annealing to form a second silicide portion from the second metal, wherein the first metal is different than the second metal. | 09-25-2008 |
257389000 | With thick insulator over source or drain region | 2 |
20110156165 | THIN FILM TRANSISTOR ARRAY SUBSTRATE AND METHOD FOR FABRICATING THE SAME - A thin film transistor array substrate including a substrate, a gate line intersecting a data line to define a pixel region on the substrate, a switching element disposed at an intersection of the gate line and the data line, a plurality of pixel electrodes and a plurality of first common electrodes alternately arranged on a protective film in the pixel region, a second common electrode overlapping the data line, a first storage electrode on the substrate, a second storage electrode overlapping the first storage electrode, and an organic insulation film on the switching element, the second storage electrode, the data line, a gate pad, and a data pad, wherein the second common electrode covers the data line, the protective film and the organic insulation film, and has inclined surfaces connected to the protective film within the pixel region. | 06-30-2011 |
20160163807 | REDUCED PARASITIC CAPACITANCE WITH SLOTTED CONTACT - A FET device fabricated by providing a first conductor on a substrate, the first conductor having a first top surface with a first height above the substrate. A second conductor is provided adjacent the first conductor, the second conductor having a second top surface with a second height above the substrate. A portion of the second conductor is removed to provide a slot, wherein the slot is defined by opposing interior sidewalls and a bottom portion, such that the bottom portion of the slot is below the first height of the first conductor. An insulating material is deposited in the slot, the insulating material having a third top surface with a third height above the substrate, the third height being below the second height of the second conductor to provide space within the slot for a third conductor. The space within the slot is then filled with the third conductor. | 06-09-2016 |