| Entries |
| Document | Title | Date |
|---|
| 20080197363 | Light Emitting Device Having a Plurality of Light Emitting Cells and Method of Fabricating the Same - Disclosed is a light emitting device having a plurality of light emitting cells. The light emitting device comprises a thermally conductive substrate, such as a SiC substrate, having a thermal conductivity higher than that of a sapphire substrate. The plurality of light emitting cells are connected in series on the thermally conductive substrate. Meanwhile, a semi-insulating buffer layer is interposed between the thermally conductive substrate and the light emitting cells. For example, the semi-insulating buffer layer may be formed of AlN or semi-insulating GaN. Since the thermally conductive substrate having a thermal conductivity higher than that of a sapphire substrate is employed, heat-dissipating performance can be enhanced as compared with a conventional sapphire substrate, thereby increasing the maximum light output of a light emitting device that is driven under a high voltage AC power source. In addition, since the semi-insulating buffer layer is employed, it is possible to prevent an increase in a leakage current through the thermally conductive substrate and between the light emitting cells. | 08-21-2008 |
| 20080210953 | Luminaire with a Plurality of Light-Emitting Diodes in Decentralized Arrangement - A luminaire with a plurality of light-emitting diodes in a decentralized arrangement. To improve the light emission pattern issued by the luminaire, the emission region defined by the light guide emission ends is smaller than the arrangement region defined by the totality of the light-emitting diodes. | 09-04-2008 |
| 20080210954 | Alternating Current Light Emitting Device - The present invention relates to a light emitting device in which light emitting cells of a first light emitting cell block are connected in parallel to light emitting cells of a second light emitting cell block corresponding thereto. A light emitting device of the present invention comprises a substrate, and first and second light emitting cell blocks formed on the substrate and having a plurality of light emitting cells electrically connected in series to one another, respectively. Each of the light emitting cells has an N-electrode and a P-electrode. A P-electrode at one end of the first light emitting cell block is connected to an N-electrode at one end of the second light emitting cell block, and an N-electrode at the other end of the first light emitting cell block is connected to a P-electrode at the other end of the second light emitting cell block. The P-electrode of each of the light emitting cells of the first light emitting cell block and the P-electrode of each of the light emitting cells of the second light emitting cell block corresponding thereto, or the N-electrode of each of the light emitting cells of the first light emitting cell block and the N-electrode of each of the light emitting cells of the second light emitting cell block corresponding thereto are electrically connected to each other. In the light emitting device of the present invention, the light emitting cells of the first light emitting cell block and the light emitting cells of the second light emitting cell block corresponding thereto are respectively connected in parallel so that a current can cross the light emitting cells of the first and second light emitting cell blocks. Thus, even though a leakage current occurs in some of light emitting cells, the current is allowed to cross light emitting cells connected in another direction, thereby preventing overload on some of the light emitting cells due to the leakage current and ensuring uniform light emission and prolonged life span in the AC light emitting device. | 09-04-2008 |
| 20080210955 | Group III-V semiconductor device and method for producing the same - An object of the invention is to prevent short circuit at a side surface of a semiconductor device in the method for producing semiconductor devices including a laser lift-off step. The production method of the invention includes forming, on a sapphire substrate, a group III nitride semiconductor layer containing a plurality of semiconductor devices isolated from one another by a groove which reaches the substrate; forming a protective film for preventing short circuit on the top surface and side surfaces of the semiconductor layer and on the top surface of the sapphire substrate; forming a resin layer in the groove; bonding the semiconductor layer to a support substrate via a low-melting-point metal layer; and removing the sapphire substrate through the laser lift-off process. The resin layer functions as a support for the protective film, to thereby prevent cracking or chipping of the protective film. As a result, current leakage or short circuit, which would otherwise be caused by cracking or chipping of the protective film, can be prevented. | 09-04-2008 |
| 20080210956 | Light Emitting Diode Employing an Array of Nanorods and Method of Fabricating the Same - Disclosed are a light emitting diode employing an array of nanorods and a method of fabricating the same. The light emitting diode comprises an array of semiconductor nanorods positioned on a substrate. An upper electrode layer is deposited on the array of the nanorods such that an empty space remains between adjacent ones of the nanorods. Since the space between adjacent ones of the nanorods is not filled with an insulating material, the light extraction efficiency of a light emitting diode can be improved and a method of fabricating the light emitting diode can be simplified. | 09-04-2008 |
| 20080217628 | LIGHT EMITTING DEVICE - The present invention relates to a light emitting device having a light emitting diode package with a plurality of light emitting cells and an integrated electronic element formed on the same substrate. The light emitting device comprises a substrate, a light emitting cell block having a first array with a plurality of light emitting cells formed on one region of the substrate arranged therein, a second array formed on the same region as the first array, and electrodes for AC power connecting the first and second arrays in reverse parallel; and at least one integrated electronic element formed on another region of the same substrate as the light emitting cell block. | 09-11-2008 |
| 20080217629 | Ac Light Emitting Diode Having Improved Transparent Electrode Structure - Disclosed is an AC light emitting diode having an improved transparent electrode structure. The light emitting diode comprises a plurality of light emitting cells formed on a single substrate, each of the light emitting cells having a first conductive type semiconductor layer, a second conductive type semiconductor layer positioned on one region of the first conductive type semiconductor layer, and an active layer interposed between the first and second conductive type semiconductor layers. A transparent electrode structure is positioned on each of the light emitting cells. The transparent electrode structure includes at least two portions separated from each other, or a center portion and branches laterally extending from both sides of the center portion. Meanwhile, wires electrically connect adjacent two of the light emitting cells. Accordingly, a plurality of light emitting cells are electrically connected, whereby a light emitting diode can be provided which can be driven under AC power source. Also, an improved transparent electrode structure is employed, so that the current density can be prevented from being locally increased. | 09-11-2008 |
| 20080224152 | Flat panel display having a control frame pedestal and method of making same - A method for providing a flat panel display comprising the steps of: providing an anode assembly containing a plurality of pixels; applying a photoresist to a surface of the anode assembly; applying a mask that defines a control frame top surface; exposing the mask to UV radiation and causing the photoresist to cross link at the exposed areas of the photoresist such that the exposed photoresist is inert and does not outgas in a vacuum; removing the unexposed areas of the photoresist to define a pedestal; forming a planarizing layer over the exposed photoresist pedestal; applying a metal layer over the planarizing layer; applying a second photoresist over the metal layer; exposing portions of the second photoresist and removing excess of the metal layer and the planarizing layer to form the metal layer only on top of the exposed photoresist pedestal; and applying nanotube emitters on the metal layer. | 09-18-2008 |
| 20080224153 | ELECTRONIC DEVICE, METHOD OF PRODUCING THE SAME, LIGHT-EMITTING DIODE DISPLAY UNIT, AND METHOD OF PRODUCING THE SAME - An electronic device includes a base having a first wiring thereon; a flexible film having a second wiring thereon; a plurality of elements each including a first connecting portion and a second connecting portion; and an adhesive agent layer, wherein each of the elements is sandwiched between the base and the film in a state in which the first connecting portion is in contact with the first wiring, the second connecting portion is in contact with the second wiring, and a tensile force is applied to the film, and, in this state, the base and the film are bonded with the adhesive agent layer. | 09-18-2008 |
| 20080224154 | Semiconductor Light-Emitting Device With Metal Support Substrate - One embodiment of the present invention provides a semiconductor light-emitting device which includes a multi-layer structure. The multilayer structure comprises a first doped layer, an active layer, and a second doped layer. The semiconductor light-emitting device further includes a first Ohmic-contact layer configured to form a conductive path to the first doped layer, a second Ohmic-contact layer configured to form a conductive path to the second doped layer, and a support substrate comprising not less than 15% chromium (Cr) measured in weight percentage. | 09-18-2008 |
| 20080230788 | LIQUID CRYSTAL DISPLAY PANEL - A liquid crystal display (LCD) panel is provided. The LCD panel includes an active device array substrate, an opposite substrate, and a liquid crystal layer. The active device array substrate includes a plurality of pixel units, and each of the pixel units has a reflective area and a transmissive area. The opposite substrate is disposed above the active device array substrate and has a plurality of first alignment protrusions corresponding to the reflective area and a plurality of second alignment protrusions corresponding to the transmissive area. The first and the second alignment protrusions are positioned between the opposite substrate and the active device array substrate. Additionally, a height of the first alignment protrusions is greater than a height of the second alignment protrusions. The liquid crystal layer is disposed between the opposite substrate and the active device array substrate. The LCD panel has a high aperture ratio. | 09-25-2008 |
| 20080230789 | Light emitting device, method of manufacturing the same and monolithic light emitting diode array - A light emitting device including: at least one light emitting stack including first and second conductivity type semiconductor layers and an active layer disposed there between, the light emitting stack having first and second surfaces and side surfaces interposed between the first and second surfaces; first and second contacts formed on the first and second surface of the light emitting stack, respectively; a first insulating layer formed on the second surface and the side surfaces of the light emitting stack; a conductive layer connected to the second contact and extended along one of the side surfaces of the light emitting stack to have an extension portion adjacent to the first surface; and a substrate structure formed to surround the side surfaces and the second surface of the light emitting stack. | 09-25-2008 |
| 20080237612 | DEVICE HAVING SPACERS - An electroluminescent device comprising: a substrate; one or more light-emitting elements formed over the substrate, the one or more light-emitting elements including first and second spaced-apart electrodes wherein at least one of the first and second electrodes is transparent and a light-emitting layer comprising quantum dots formed between the first and second electrodes; a cover located over the one or more light-emitting elements and spaced apart from the one or more light-emitting elements to form a gap between the cover and the one or more light-emitting elements; and separately formed spacer elements located in the gap between the cover and the one or more light-emitting elements and wherein the spacer elements are in physical contact with the one or more light-emitting elements, the cover, or both the one or more light-emitting elements and the cover. | 10-02-2008 |
| 20080237613 | Ac Light Emitting Device Having Photonic Crystal Structure and Method of Fabricating the Same - Disclosed is an AC light emitting device having photonic crystal structures and a method of fabricating the same. The light emitting device includes a plurality of light emitting cells and metallic wirings electrically connecting the light emitting cells with one another. Further, each of the light emitting cells includes a first conductive type semiconductor layer, a second conductive type semiconductor layer disposed on one region of the first conductive type semiconductor layer, and an active layer interposed between the first and second conductive type semiconductor layers. In addition, a photonic crystal structure is formed in the second conductive type semiconductor layer. The photonic crystal structure prevents light emitted from the active layer from laterally propagating by means of a periodic array, such that light extraction efficiency of the light emitting device can be improved. Furthermore, the metallic wirings electrically connect a plurality of light emitting cells with one another such that an AC light emitting device can be provided. | 10-02-2008 |
| 20080251796 | Light Emitting Device and Method of Manufacturing the Same - The present invention relates to a light emitting device and a method of manufacturing the light emitting device. According to the present invention, the light emitting device comprises a substrate, an N-type semiconductor layer formed on the substrate, and a P-type semiconductor layer formed on the N-type semiconductor layer, wherein a side surface including the N-type or P-type semiconductor layer has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a light emitting device comprising a substrate formed with a plurality of light emitting cells each including an N-type semiconductor layer and a P-type semiconductor layer formed on the N-type semiconductor layer, and a submount substrate flip-chip bonded onto the substrate, wherein the N-type semiconductor layer of one light emitting cell and the P-type semi-conductor layer of another adjacent light emitting cell are connected to each other, and a side surface including at least the P-type semiconductor layer of the light emitting cell has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a method of manufacturing the light emitting device. Accordingly, there is an advantage in that the characteristics of a light emitting device such as luminous efficiency, external quantum efficiency and extraction efficiency are enhanced and the reliability is secured such that light with high luminous intensity and brightness can be emitted. | 10-16-2008 |
| 20080251797 | Array substrate and method for manufacturing the same - An array substrate is disclosed. The array substrate comprises a substrate, a gate metal layer, a gate insulation layer, a semiconductor layer, a patterned metal layer, a flat layer, and a pixel electrode. The patterned metal layer is disposed on the surface of the semiconductor layer comprising a source and a drain, and on the surface of the gate insulation layer comprising a storage capacitor line and a data line. The storage capacitor line has an extending portion parallel to a scan line. The pixel electrode overlaps parts of the scan line, parts of the data line, parts of the storage capacitor line, and parts of the extending portion. A method for manufacturing the array substrate is also provided. | 10-16-2008 |
| 20080251798 | Semiconductor device, LED head and image forming apparatus - A semiconductor device is supplied which is able to efficiently liberate heat produced by semiconductor element toward external, prevent temperature rise, improve operation characteristic and maintain stable operation. The semiconductor device comprises a substrate and a semiconductor thin film layer which is accumulated on the substrate and contains semiconductor element, the substrate is a metal substrate, between the metal substrate and the semiconductor thin film layer, a diamond-like carbon layer with high heat conductivity and good insulativity is furnished as a surface coating layer. | 10-16-2008 |
| 20080258156 | Light-emitting diode apparatus - In a light-emitting diode apparatus, light emitted from a principal plane of an emission layer has a plurality of unequal luminous intensities depending on the in-plane azimuth angle of the principal plane of the emission layer, and at least one of a light-emitting diode chip and a package has a structure of reducing difference in the intensity of light emitted from the package according to variation in the in-plane azimuth angle of a chip-arrangement surface. | 10-23-2008 |
| 20080258157 | Packaging Method Of LED Of High Heat-Conducting Efficiency And Structure Thereof - A packaging method of LED of high heat-conducting efficiency and a structure thereof firstly is to provide a copper substrate having a plurality of indentations. An insulating layer is formed on the surface of the substrate and the bottom of the indentations. Meanwhile, a set of metallic circuits is formed on the insulating layer of the substrate, and a layer of insulating lacquer is coated on the surface of the metallic circuits, where there is no electric connection and no enclosure. A tin layer is coated on the insulating layer of the indentation and the metallic circuits, where there is no insulating lacquer. Furthermore, a set of light-emitting chips are die bonded on the tin layer of the indentation. Next, the light-emitting chips and the metallic circuits are electrically connected by a set of gold wires. Moreover, a ringed object is arranged on the surface of the substrate, such that the light-emitting chip set, the gold wires and the metallic circuits are enclosed therein. Meanwhile, a fluorescent glue is attached to the light-emitting chip set, the gold wires and the metallic circuits. Eventually, an epoxy resin is filled into the interior of the ringed object to be dry for forming an epoxy resin layer. Thus, a packaging manufacture of LED is completed. | 10-23-2008 |
| 20080258158 | LIGHT EMISSION DEVICE - A light emission device includes a plurality of semiconductor light emitting elements and a supporting substrate on which the plurality of semiconductor light emitting elements are flip-chip mounted. Each of the plurality of semiconductor light emitting elements has a substantially rectangular shape which has a first side and a second side different from the first side. Light emitted from a first element end face on the first side is stronger than light emitted from a second element end face on the second side. Each first side of each of the plurality of semiconductor light emitting elements faces each other substantially in parallel. | 10-23-2008 |
| 20080265262 | Methods and systems for testing a functional status of a light unit - A method for testing a status of a light unit is provided, wherein the method includes electrically coupling the light unit to a controller and transmitting a negative voltage from the controller to the light unit. The method also includes detecting at least one of current and voltage passing through the light unit and determining a status of the light unit based on at least one of the detected current and detected voltage. | 10-30-2008 |
| 20080265263 | Polarized Semiconductor Light Emitting Device - A light emitting device includes a light emitting diode (LED), a concentrator element, such as a compound parabolic concentrator, and a wavelength converting material, such as a phosphor. The concentrator element receives light from the LED and emits the light from an exit surface, which is smaller than the entrance surface. The wavelength converting material is, e.g., disposed over the exit surface. The radiance of the light emitting diode is preserved or increased despite the isotropic re-emitted light by the wavelength converting material. In one embodiment, the polarized light from a polarized LED is provided to a polarized optical system, such as a microdisplay. In another embodiment, the orthogonally polarized light from two polarized LEDs is combined, e.g., via a polarizing beamsplitter, and is provided to non-polarized optical system, such as a microdisplay. If desired, a concentrator element may be disposed between the beamsplitter and the microdisplay. | 10-30-2008 |
| 20080272379 | DISPLAY APPARATUS, METHOD AND LIGHT SOURCE - In accordance with the invention, a display apparatus including a light source is provided, the light source having at least one superluminescent light emitting diode (SLED), the apparatus further having at least one light modulating device arranged in a beam path of a light beam emitted by the light source and operable to emit influenced light upon incidence of the light beam, the light modulating device being operatively connected to an electronic control, the display apparatus further having a projection optics arranged in a beam path of the influenced light. | 11-06-2008 |
| 20080272380 | Shield Member in LED Apparatus - An LED apparatus for illumination toward a preferential side in a downward and outward direction including a shield member in the form of a layer positioned over LED packages and secondary lens members. The shield member has a shield portion and a substantially planar non-shield portion thereabout. In preferred embodiments, the shield portion extends over a part of the lens portion of the secondary lens member. A cover preferably secures the shield member with respect to the secondary lens member, the primary lens and the LED package, the shield member preferably being sandwiched between the cover and the flange of the secondary lens member. | 11-06-2008 |
| 20080272381 | ORGANIC LIGHT EMITTING DISPLAY WITH SINGLE CRYSTALLINE SILICON TFT AND METHOD OF FABRICATING THE SAME - Provided is an organic light emitting display, in which a semiconductor circuit unit of 2T-1C structure including a switching transistor and a driving transistor formed of single crystalline silicon is formed on a plastic substrate. A method of fabricating the single crystalline silicon includes: growing a single crystalline silicon layer to a predetermined thickness on a crystal growth plate; depositing a buffer layer on the single crystalline silicon layer; forming a partition layer at a predetermined depth in the single crystalline silicon layer by, e.g., implanting hydrogen ions in the single crystalline silicon layer from an upper portion of an insulating layer; attaching a substrate to the buffer layer; and releasing the partition layer of the single crystalline silicon layer by heating the partition layer from the crystal growth plate to obtain a single crystalline silicon layer of a predetermined thickness on the substrate. | 11-06-2008 |
| 20080277674 | Semiconductor Light Emitting Device, Lighting Module, Lighting Apparatus, and Manufacturing Method of Semiconductor Light Emitting Device - An LED bare chip which is one type of a semiconductor light emitting device ( | 11-13-2008 |
| 20080277675 | LIGHT-EMITTING DIODE ASSEMBLY WITHOUT SOLDER - An electrical device in the form of a light emitting diode (LED) assembly. A plurality of LEDs are provided, wherein each has an anode and a cathode. A base holds this plurality of LEDs in a substantially fixed relationship. One or more anode conductors then each connect electrically to one or more of the LED anodes in a manner characterized by not including any solder material. Similarly, one or more cathode conductors each connect electrically to one or more of the LED cathodes in a manner characterized by not including any solder material. | 11-13-2008 |
| 20080283848 | Semiconductor device and method for manufacturing the same - A plurality of rectangle semiconductor substrates are attached to a single mother glass substrate. A pixel structure is determined so that even if a gap or a an overlapping portion is generated in a boundary between a plurality of semiconductor substrates, a single-crystal semiconductor layer does not overlap with the gap or the overlapping portion. Two TFTs are located in a first unit cell including the first light emitting element, four TFTs are located in a second unit cell including the second light emitting element, and no TFT is located in a third unit cell including the third light emitting element. A boundary line is between the third unit cell and a fourth unit cell. | 11-20-2008 |
| 20080290350 | LED lamp with exposed heat-conductive fins - In one embodiment, a LED lamp includes a heat sink including rows of exposed fins on one surface and a conductive member opposite the fins and including two electrically connected side positive electrodes, one or more negative electrode spaced from and between the positive electrodes, and one or more conductive positioning strips each between the negative electrode and either positive electrode; a light array mounted on the conductive member and including rows of LEDs divided into electrically parallel connected groups with the LEDs of each group being electrically series connected together, each LED including positive and negative pins secured to one conductive positioning strip and electrically connected to either positive electrode and the negative electrode respectively, a positive conductor electrically connected to either positive electrode; and a negative conductor electrically connected to the negative electrode. | 11-27-2008 |
| 20080290351 | SEMICONDUCTOR LIGHT EMITTING APPARATUS - A light emitting apparatus with a combination of a plurality of LED chips and a phosphor layer is provided and can be configured to significantly reduce variations in chromaticity and luminance. The plurality of semiconductor light emitting devices (LED chips) are disposed with a gap therebetween, and the phosphor layer is formed on the upper surface thereof to bridge over the gaps between the LED chips. The phosphor layer may be uniform in thickness, but can be less in thickness over the gaps between the LED chips than on the upper surface of the LED chips. The phosphor layer can be continuously formed on the upper surface of the array of the chips with no phosphor layer present in between the chips. This configuration allows for reducing variations in luminance and chromaticity which may result from the gaps or the phosphor layer present in between the gaps. | 11-27-2008 |
| 20080296590 | LED-Based Light Source Having Improved Thermal Dissipation - A light source having a plurality of dies mounted on leads that are partially enclosed in a plastic body is disclosed. Each die is powered by first and second contacts. One contact is connected to the lead on which the die is mounted. Light from the LED exits the die through the top surface. Each lead includes a layer of metal of substantially constant thickness. The layer includes a boundary, a die mounting region within the boundary and a heat transfer region within the boundary. The boundary increases in a dimension perpendicular to a line connecting the die mounting region and the heat transfer region. The leads are arranged such that the die mounting regions are proximate to a first point and oriented such that the lines radiate from the first point. The light source can be manufactured using conventional lead frame techniques. | 12-04-2008 |
| 20080296591 | Conductor Structure, Pixel Structure, and Methods of Forming the Same - A method for forming a conductor structure is provided. The method comprises: (1) providing a substrate; (2) forming a patterned dielectric layer with a first opening which exposes a portion of the substrate; forming a patterned organic material layer on the dielectric layer with a second opening which corresponds to the first opening and expose the exposed portion of the substrate; (3) forming a first barrier layer on the organic material layer and the exposed portion of the substrate; (4) forming a metal layer on the first barrier layer; and (5) removing the organic material layer, the first barrier layer thereon and the metal layer thereon. | 12-04-2008 |
| 20080303037 | METHODS OF MAKING THIN FILM TRANSISTORS COMPRISING ZINC-OXIDE-BASED SEMICONDUCTOR MATERIALS AND TRANSISTORS MADE THEREBY - A method of making a thin film transistor comprising a thin film semiconductor element comprised of a transparent zinc-oxide-based semiconductor material, wherein spaced apart first and second contacts in contact with said material are positioned on either side of a channel in the thin film semiconductor element such that the elongated sides of the channel are aligned with an underlying gate structure. The method can be accomplished while maintaining the substrate temperature at no more than 300° C. during fabrication. | 12-11-2008 |
| 20080303038 | Module Comprising Radiation-Emitting Semiconductor Bodies - A module comprising a regular arrangement of individual radiation-emitting semiconductor bodies ( | 12-11-2008 |
| 20080308818 | Light-emitting device - A light-emitting device includes an LED chip emitting a primary light, and a phosphor deposited on the LED chip for absorbing the primary light to excite a secondary light, wherein the wavelength of the primary light is shorter than 430 nm and the LED chip is driven by current density greater than 200 mA/cm | 12-18-2008 |
| 20080315217 | Semiconductor Light Source and Method of Producing Light of a Desired Color Point - This invention relates to a solid-state light source ( | 12-25-2008 |
| 20080315218 | Cubic illuminators - An exemplary illuminator includes a first electrode, a second electrode, and a light-emitting chip. The light-emitting chip includes light-emitting layers arranged three-dimensionally. The first and second electrodes are configured for providing different voltages to the light-emitting chip, and the light-emitting chip is capable of emitting light simultaneously along all dimensional axes. | 12-25-2008 |
| 20090001388 | Semiconductor Display Device and Method for Manufacturing The Same - To provide a semiconductor display device capable of being easily manufactured and a method for manufacturing the semiconductor display device. | 01-01-2009 |
| 20090008654 | Semiconductor Light Emitting Device, Illumination Module, Illumination Apparatus, Method For Manufacturing Semiconductor Light Emitting Device, and Method For Manufacturing Semiconductor Light Emitting Element - A semiconductor light emitting device ( | 01-08-2009 |
| 20090014732 | CHIP-TYPE LIGHT EMITTING DEVICE AND WIRING SUBSTRATE FOR THE SAME - For providing a chip-type light emitting device, having a plural number of light emitting elements therein, so as to enable to obtain a high optical output with preferable conversion efficiency thereof, and a wiring substrate for that, the chip-type light emitting device, mounting the plural number of the light emitting diodes | 01-15-2009 |
| 20090020767 | Active Matrix Substrate - An active matrix substrate is provided. Within the field of the probe contact area of the pad portion, a buffer layer is arranged on a pad in order to increase the thickness of the pad portion; or, to hollow out the pad and form an opening within the probe contract area. Thus, the probe will not touch the pad directly even if the probe is pressed inadequately to pierce the conductive layer. As a result, the substrate structure can prevent the metallic pad from chemically reacting with the mist or the air, and further to avoid an electrical erosion state. Therefore the signal of the probe can still be transmitted through the conductive layer. | 01-22-2009 |
| 20090020768 | BURIED CONTACT DEVICES FOR NITRIDE-BASED FILMS AND MANUFACTURE THEREOF - A semiconductor device comprising: a substrate; a first contact; a first layer of doped semiconductor material deposited on the substrate; a semiconductor junction region deposited on the first layer; a second layer of doped semiconductor material deposited on the junction region, the second layer having opposite semiconductor doping polarity to that of the first layer; and a second contact; wherein the second contact is in electrical communication with the second layer and the first contact is embedded within the semiconductor device between the substrate and the junction region and is in electrical communication with the first layer; and processes for manufacture of an embedded contact semiconductor device. | 01-22-2009 |
| 20090020769 | Semiconductor light emitting element - A semiconductor light emitting element having a rectangular shape in plan view comprising at least a first side and a second side adjacent to the first side, the semiconductor light emitting element including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, a plurality of first electrodes having a long shape along the first side and being arranged on the first conductivity-type semiconductor layer in a lattice form of x columns (x≧2) along the first side and y rows (y>x) along the second side, and a second electrode arranged on the second conductivity-type semiconductor layer. The first electrode and the second electrode are arranged on the same surface side. The first electrode is surrounded by the first conductivity-type semiconductor layer, the second conductivity-type semiconductor layer, and the second electrode is provided. | 01-22-2009 |
| 20090026467 | ELECTROOPTICAL DEVICE, ELECTRONIC APPARATUS, AND METHOD FOR PRODUCING ELECTROOPTICAL DEVICE - An electrooptical device having a plurality of light-emitting regions includes a substrate, a bank disposed in a region other than the light-emitting regions on the substrate so as to surround the light-emitting regions, and a functional layer disposed in openings surrounded by the bank. The bank includes an upper bank segment and a plurality of lower bank segments having a higher wettability than the upper bank segment. The number of the lower bank segments exposed is smaller in second regions of the openings than in first regions of the openings. | 01-29-2009 |
| 20090026468 | Semiconductor Light Emitting Element - In a semiconductor light emitting element, a p-type layer ( | 01-29-2009 |
| 20090032825 | Structure Of LED-Based Display Module And Method For Manufacturing The Same - The display module contains a circuit board, a heat-resistant and transparent protective layer, and a transparent and waterproofing enclosing member. The circuit board has a number of LED devices configured on the front surface and at least a terminal on the back surface. The LED devices are electrically and signally wired to the terminal so that electricity and video signals are fed to the LED devices via the terminal. The protective layer is coated on the outer surfaces of the LED devices and the circuit board so as to protect the wiring, the soldering contacts, and the electrical components of the circuit board from being damaged by the high temperature during the process of forming the enclosing member. The enclosing member wraps the circuit board and the LED devices entirely within and exposes only the terminal. | 02-05-2009 |
| 20090032826 | MULTI-CHIP LIGHT EMITTING DIODE PACKAGE - A multi-chip light emitting diode (LED) package having a plurality of LED chips, a substrate, and a plurality of conductive paste layers is provided. The substrate has at least two hollow areas with conductive patterns formed on a bottom surface thereon. The conductive paste layers are pasted on the bottom surfaces of the hollow areas respectively for fixing the LED chips and having the LED chips electrically connected to the conductive patterns. The LED chips in the different hollow areas are electrically connected in serial. | 02-05-2009 |
| 20090039359 | LIGHT EMITTING DIODE WITH IMPROVED CURRENT SPREADING PERFORMANCE - Disclosed is a light emitting diode (LED) for enhancing the current spreading performance. The LED includes a plurality of contact holes exposing an N-type semiconductor layer through a P-type semiconductor layer and an active layer, and a connection pattern electrically connecting exposed portions of the N-type semiconductor layer through the contact holes, thereby enhancing current spreading in the N-type semiconductor layer. In addition, disclosed is an LED including a plurality of light emitting cells spaced apart from one another on an N-type semiconductor layer and an N-contact layer between the light emitting cells. A plurality of light emitting cells are employed in the LED, so that current can be spread in the LED. | 02-12-2009 |
| 20090045416 | Optical Element Coupled to Low Profile Side Emitting LED - A low profile, side-emitting LED with one or more optical elements, such as a reflector or lens, optically coupled to each light emitting sidewall is described. In one embodiment, a reflector is used to redirect the light emitted from each sidewall to a forward direction, e.g., in a flash configuration. In another embodiment, a lens is used to collimate the side emitted light in the horizontal plane, e.g., for backlighting. Each entrance surface of the lens is positioned so that the bottom edge is at or below the bottom of the light emitting sidewall so that the base of the lens does not block light that is emitted by the LED. | 02-19-2009 |
| 20090050907 | Solid state lighting component - An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips. | 02-26-2009 |
| 20090050908 | Solid state lighting component - An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount. | 02-26-2009 |
| 20090050909 | LIGHT-EMITTING DIODE APPARATUS AND MANUFACTURING METHOD THEREOF - A light-emitting diode (LED) apparatus includes an epitaxial layer and an etching mask layer. The epitaxial layer has a first semiconductor layer, an active layer and a second semiconductor layer in sequence. The etching mask layer is disposed on the epitaxial layer and has a plurality of hollows. The second semiconductor layer includes a roughing structure. | 02-26-2009 |
| 20090057690 | Wafer level phosphor coating technique for warm light emitting diodes - Methods for wafer level fabricating of light emitting diode (LED) chips are disclosed with one embodiment of a method according to the present invention comprising providing a plurality of LEDs and then coating of the LEDs with a layer of first conversion material so that at least some light from the LEDs passes through the first conversion material. The light is converted to different wavelengths of light having a first conversion material emission spectrum. The LEDs are then coated with a layer of second conversion material arranged on the first layer of conversion. The second conversion material has a wavelength excitation spectrum, and at least some light from the LEDs passes through the second conversion material and is converted. The first conversion material emission spectrum does not substantially overlap with the second conversion material excitation spectrum. Methods according to the present invention can also be used in wafer level fabrication of LED chips and LED packages with pedestals for electrically contacting the LEDs through the conversion coatings. | 03-05-2009 |
| 20090065789 | LED chip package structure with high-efficiency light-emitting effect and method of packing the same - An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips. Each package colloid has a colloid cambered surface and a colloid light-emitting surface respectively formed on a top surface and a front surface thereof. | 03-12-2009 |
| 20090065790 | LED chips having fluorescent substrates with microholes and methods for fabricating - Methods for fabricating semiconductor devices such as LED chips at the wafer level, and LED chips and LED chip wafers fabricated using the methods. An LED chip wafer according to the present invention comprises a plurality of LEDs on a wafer and a plurality of pedestals, each of which is on one of the LEDs. A fluorescent substrate or preform (“preform”) is provided covering at least some of the LEDs, the preform comprising holes with the pedestals arranged within the holes. During operation of the covered ones of said LEDs at least some light from the LEDs passes through the preform and is converted. LED chips are provided that are singulated from this LED chip wafer. One embodiment of a method for fabricating LED chips from a wafer comprises depositing LED epitaxial layers on an LED growth wafer to form a plurality of LEDs on the growth wafer. Pedestals are formed on the LEDs and a fluorescent preform is formed with holes. The fluorescent preform is bonded over at least some of the plurality of LEDs so that at least some light from the covered ones of said LEDs passes through the preform and is converted. The pedestals are arranged in the holes so that an electrical signal is applied to the LEDs through the pedestals. | 03-12-2009 |
| 20090072249 | Nitride Semiconductor Light-Emitting Device - A nitride semiconductor light-emitting device including a first n-type nitride semiconductor layer, a light-emitting layer, a p-type nitride semiconductor layer, and a second n-type nitride semiconductor layer in this order, and further including an electrode formed of a transparent conductive film on the second n-type nitride semiconductor layer is provided. The nitride semiconductor light-emitting device has improved light extraction efficiency. The electrode formed of a transparent conductive film is preferably formed on a part of a surface of the second n-type nitride semiconductor layer. | 03-19-2009 |
| 20090072250 | CHIP TYPE SEMICONDUCTOR LIGHT EMITTING DEVICE - There is provided a reflective chip type semiconductor light emitting device, which has improved efficiency of taking out light and further improved luminance with the same input, and which emits high luminance light by emitting light uniformly from an area as large as possible and is suitable for lighting apparatuses. A pair of terminal electrodes ( | 03-19-2009 |
| 20090078944 | Light emitting device and method of manufacturing the same - This semiconductor light emitting device includes an optical cavity made of a group III nitride semiconductor having a major growth surface defined by a nonpolar plane and including a pair of cavity end faces parallel to c-planes, and a reflecting portion made of a group III nitride semiconductor having a major growth surface defined by a nonpolar plane and having a reflective facet opposed to one of the pair of cavity end faces and inclined with respect to a normal of the major growth surface. The optical cavity and the reflecting portion may be crystal-grown from the major surface of the substrate. The substrate is preferably a group III nitride semiconductor substrate having a major surface defined by a nonpolar plane. | 03-26-2009 |
| 20090085046 | METHODS AND SYSTEMS RELATING TO SOLID STATE LIGHT SOURCES FOR USE IN INDUSTRIAL PROCESSES - Methods and systems relating to solid state light sources for use in industrial processes. | 04-02-2009 |
| 20090095961 | Combination of LED and heat dissipation device - A combination of LED and heat dissipating device includes a heat dissipating device, an electrically insulative thermal conductivity layer covered on a part of the surface of the heat dissipating device, thermal and electric conducting layers disposed at the electrically insulative thermal conductivity layer and electrically isolated from one another, LED units each having an LED unit installed in one thermal and electric conducting layer and a lead wire that connects the LED chip of the respective LED unit to the LED chip of another LED unit, and a packaging device covering the LED units. | 04-16-2009 |
| 20090095962 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING DISPLAY APPARATUS, APPARATUS OF MANUFACTURING SEMICONDUCTOR DEVICE, AND DISPLAY APPARATUS - A method of manufacturing a semiconductor device includes the steps of: modifying a semiconductor film by applying a laser beam; and forming a semiconductor device on the modified semiconductor film. In the step of modifying the semiconductor film, the laser beam and the substrate are moved relative to each other in a first direction and a second direction which is opposite to the first direction, a change in an optical characteristic between an area irradiated with the laser beam and an area which is not irradiated with the laser beam in the substrate or an optical characteristic of the irradiated area is measured in each of the first and second directions, and irradiation power of the laser beam is modulated so that the difference between a measurement result in the first direction and a measurement result in the second direction lies in a predetermined range. | 04-16-2009 |
| 20090095963 | BARE DIE SEMICONDUCTOR DEVICE CONFIGURED FOR LAMINATION - A bare die semiconductor device, e.g., a bare die LED, includes a substrate having a bottom face and a bottom die electrode. There is also a top face having a top face edge, a top face area, a top face periphery and a top die electrode. A semiconductor material provides a p-n semiconductor junction between the top and bottom faces. The top die electrode inhibits an external top planar electrode from contact with the top face edges. Such bare die LEDs can be incorporated into a light sheet that has a transparent first substrate having a planar top electrode and a second substrate having a bottom substrate electrode. An adhesive secures the second substrate to the first substrate. Bare die LEDs are disposed in the adhesive with their top die electrodes contacting the top planar electrode and their bottom die electrodes contacting the bottom substrate electrode. | 04-16-2009 |
| 20090101921 | LED and thermal conductivity device combination assembly - AN LED and thermal conductivity device combination assembly includes a thermal conductivity device, two conducting members each having a metal conducting wire and an insulator surrounding the metal conducting wire and attached to the thermal conductivity device, LED chips each having a positive electrode and a negative electrode disposed at the top side and an insulation layer disposed at the bottom side and bonded to the surface of the thermal conductivity device, lead wires connected between the positive electrode and negative electrode of the LED chips and the metal conducting wires of the conducting members to connect the LED chips in series and in parallel, and a packaging device covering the LED chips. | 04-23-2009 |
| 20090108267 | COMPOSITE LIGHT-EMITTING-DIODE PACKAGING STRUCTURE - A composite light-emitting-diode (LED) packaging structure includes an upper LED package structure and a lower LED package structure packaged integrally together. The upper LED package structure includes an upper substrate having a hollow structure and an upper LED transparent chip in the hollow structure and enclosed from top to bottom by a light transmitting filling material. The lower LED package structure includes a lower substrate and a lower LED transparent chip on the lower substrate, packaged in the hollow structure and having a light transmitting protection layer. | 04-30-2009 |
| 20090108268 | COMPOSITE LIGHT-EMITTING-DIODE PACKAGING STRUCTURE - A composite light-emitting-diode (LED) packaging structure having oppositely arranged chips comprises a first substrate with a first surface and a second surface, a second substrate with a first surface and a second surface, a first LED chip on the first surface of the first substrate, and a second LED chip on the first surface of the second substrate. The second surface of the second substrate and the second surface of the first substrate are packaged integrally in contact. | 04-30-2009 |
| 20090108269 | ILLUMINATION DEVICE HAVING ONE OR MORE LUMIPHORS, AND METHODS OF FABRICATING SAME - A light emitter comprising a monolithic die comprising at least one solid state light emitting device and at least a first lumiphor covering part of a light emission region of the die. In some embodiments, at least a second lumiphor is provided on the die. The first lumiphor can be part of a first pattern of lumiphors, and/or the second lumiphor can be part of a second pattern of lumiphors. The first and second lumiphors can differ in luminescent material, size, shape and/or concentration of luminescent material. The lumiphors can overlap completely, partially, or not at all. Some embodiments comprise an electrical interconnection to electrically connect respective solid state light emitting devices. Also, a light emitter comprising unit cells each comprising a group of light emitting devices and at least one lumiphor. Methods of fabricating light emitters comprise selectively applying at least one lumiphor to a monolithic die. | 04-30-2009 |
| 20090108270 | MASTER, PIXEL ARRAY SUBSTRATE, ELECTRO-OPTICAL DEVICE AND METHODS OF MANUFACTURING THE SAME - A master having a substrate including displaying units and an ESD protection structure including an adjacent first region and a second region is provided. The displaying units have a predetermined-cutting region therebetween. Each displaying unit includes a peripheral circuit region and a display region having pixels. The ESD protection structure disposed on the predetermined-cutting region, located in the peripheral circuit region, and connecting the display region includes a first patterned conductive layer disposed on the first region and having an end away from the predetermined-cutting region, a first patterned dielectric layer disposed on the first patterned conductive layer and the substrate and having a first opening exposing a portion of the first patterned conductive layer, a patterned transparent conductive layer disposed corresponding to the predetermined-cutting region and connecting the first patterned conductive layer, and a second patterned dielectric layer covering the patterned transparent conductive layer and the substrate. | 04-30-2009 |
| 20090108271 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode package includes a mount, a plurality of LED chips, and a first and a second sealants made of different materials. The mount has an accommodation space and at least one partition member to divide the accommodation space into a plurality of separate cavities. The LED chips are placed in the cavities, and emitting beams of the LED chips exiting through the cavities include a first emission with a first wavelength band and a second emission with a second wavelength band, and the second wavelength band is different to the first one. The first and the second sealants are respectively used for sealing at least one of the LED chips placed in at least one of the cavities through which the first or the second emission exits. The first and the second sealants are separate from each other by the partition member. | 04-30-2009 |
| 20090108272 | LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs ( | 04-30-2009 |
| 20090108273 | LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs ( | 04-30-2009 |
| 20090108274 | LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs ( | 04-30-2009 |
| 20090108275 | LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs ( | 04-30-2009 |
| 20090114928 | LIGHTING STRUCTURE COMPRISING AT LEAST ONE LIGHT-EMITTING DIODE, METHOD FOR MAKING SAME AND USES THEREOF - A luminous structure based on light-emitting diodes, which includes: a first dielectric element with a substantially plane main face associated with a first electrode; a second dielectric element with a substantially plane main face associated with a second electrode that faces the first electrode and lies in a different plane; at least a first light-emitting diode including a semiconductor chip including, on first and second opposed faces, first and second electrical contacts, the first electrical contact being electrically connected to the first electrode, the second electrical contact being electrically connected to the second electrode, and at least the first element at least partly transmitting radiation within the ultraviolet or in the visible. | 05-07-2009 |
| 20090114929 | WHITE LIGHT EMITTING DEVICE - There is provided a white light emitting device that prevents a red phosphor from resorbing wavelength-converted light to improve white luminous efficiency. A white light emitting device according to an aspect of the invention includes a package body; at least two LED chips mounted to the package body and emitting excitation light; and a molding unit including phosphors, absorbing the excitation light and emitting wavelength-converted light, in regions of the molding unit divided according to the LED chips and molding the LED chips. According to the aspect of the invention, since the phosphor for converted red light can be prevented from resorbing light generated from other regions of the molding unit, the white light emitting device that can improve white luminous efficiency or control color rendering and color temperature by adjusting a mixing ratio of converted light for white light emission. | 05-07-2009 |
| 20090114930 | LIGHT-EMITTING DIODE AND LIGHT-EMITTING DIODE ARRAY LIGHT SOURCE - A light-emitting diode (LED) includes a substrate, a metallic buffer layer, a first type doped semiconductor layer, a light-emitting layer, a second type doped semiconductor layer, a first electrode, and a second electrode. The substrate has a plurality of bowl-shaped concaves or convexes on a surface thereof. The metallic buffer layer is disposed on the substrate and covers the bowl-shaped structure. The first type doped semiconductor layer is disposed on the metallic buffer layer. The light-emitting layer is disposed on a part of the first type doped semiconductor layer. The second type doped semiconductor layer is disposed on the light-emitting layer. The first electrode is disposed on the first type doped semiconductor layer not covered by the light-emitting layer. The second electrode is disposed on the second type doped semiconductor layer. | 05-07-2009 |
| 20090121237 | LED ARRAY FOR MICRODISPLAYS OR LIKE APPLICATIONS, AND METHOD OF FABRICATION - An array of LEDs are grown by epitaxy on row-connecting conductor strips extending in parallel spaced relationship to one another on the surface of a semiconductor substrate and are thereby electrically interconnected in rows. The row-connecting conductor strips are formed by ion implantation of a p-type dopant into parts of an n-type silicon substrate. Column-connecting conductor strips extend over the light-emitting surfaces of the LEDs for electrically interconnecting them in columns. The LEDs are lit up individually by voltage application between one of the row-connecting conductor strips and one of the column-connecting conductor strips. | 05-14-2009 |
| 20090134407 | A1 ALLOY FILM, ELECTRONIC DEVICE, AND ACTIVE MATRIX SUBSTRATE FOR USE IN ELECTROOPTIC DISPLAY DEVICE - In accordance with one aspect of the present invention, an Al alloy film contains a first additive element composed of Ni, and at least one type of second additive element selected from the group consisting of Group 2A alkaline earth metals and Groups 3B and 4B metalloids in Period 2 or 3 of the periodic table of the elements. Furthermore, the composition ratio of the first additive element is 0.5-5 at %, and the composition ratio of the second additive element is 0.1-3 at %. | 05-28-2009 |
| 20090134408 | LIGHT EMITTING DIODE PACKAGE, METHOD OF FABRICATING THE SAME AND BACKLIGHT ASSEMBLY INCLUDING THE SAME - A light emitting diode (“LED”) package includes: a mold including an accommodating groove formed therein and which includes a side surface and a bottom surface; an electrode pattern disposed on the bottom surface; a plurality of LED chips disposed on the electrode pattern; and protective resin disposed in the accommodating groove. A center LED chip of the plurality of LED chips is disposed at a center of the bottom surface, and a height of the center LED chip above the bottom surface is greater than heights of other LED chips of the plurality of LED chips above the bottom surface. | 05-28-2009 |
| 20090140268 | LED array module and method of packaging the same - An LED array module includes a drive IC structure, at least one LED array, an adhesive element, and a first conductive structure. The drive IC structure has a concave groove formed on a top side thereof. The at least one LED array is received in the at least one concave groove. The adhesive element is disposed between the at least one LED array and the drive IC structure. The first conductive structure is electrically connected between the drive IC structure and the at least one LED array. Moreover, the LED array module can be disposed on a PCB that has at least one input/output pad. A second conductive structure is electrically connected between the drive IC structure and the at least one input/output pad. | 06-04-2009 |
| 20090140269 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - In a display apparatus and a method of manufacturing the display apparatus, a gate line, a data line, and a plurality of layers are formed on an array substrate on which a pixel area, a pad area, and a peripheral area are defined. During the forming processes of the gate line, the data line, and the layers, the gate line and the data line are partially exposed in the peripheral area, or contact portions formed on the gate line and the data line in the peripheral area are exposed. Thus, the gate line and the data line may be tested using the contact portions as electrical terminals during the manufacturing process of the display apparatus. | 06-04-2009 |
| 20090140270 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF - An object is to provide a system-on-panel display device including a display portion and a peripheral circuit for controlling display on the display portion over one substrate, which can operate more accurately. The display device has a display portion provided with a pixel portion including a plurality of pixels and a peripheral circuit portion for controlling display on the display portion, which are provided over a substrate. Each of the display portion and the peripheral circuit portion includes a plurality of transistors. For semiconductor layers of the transistors, single crystal semiconductor materials are used. | 06-04-2009 |
| 20090140271 | LIGHT EMITTING UNIT - A light emitting unit has a chamber. The light emitting unit includes at least one substrate, a plurality of light emitting diode (LED) dies and a gel or a fluid. The LED dies are disposed on the substrate and in the chamber. At least two LED dies are electrically connected to each other in series or in parallel. The gel or the fluid is filled in the chamber. | 06-04-2009 |
| 20090146156 | Led chip package structure with high-efficiency light-emitting effect and method for making the same - An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, a package colloid unit, and a frame unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The package colloid unit has a longitudinal package colloid covering the LED chips, and the longitudinal package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof. The frame unit that is a frame layer covering the substrate unit and disposed around a lateral side of the longitudinal package colloid for exposing the light-emitting colloid surface of the longitudinal package colloid. | 06-11-2009 |
| 20090146157 | LIGHT-EMITTING DIODE PACKAGE - An LED package is provided. The LED package includes a leadframe having a pair of first electrodes and a pair of second electrodes, an LED chip disposed on the leadframe, and an encapsulant encapsulating a portion of the leadframe and the LED chip. The pair of first electrodes and the pair of second electrodes are electrically connected with the LED chip. The pair of first electrodes and the pair of second electrodes are located outside the encapsulant. The encapsulant has a top surface, a bottom surface, a first side surface and a second side surface opposite to the first side surface, wherein the pair of first electrodes extend from the first side surface to the bottom surface, and the pair of second electrodes extend from the second side surface to the bottom surface. | 06-11-2009 |
| 20090152568 | Method for packaging submount adhering light emitting diode and package structure thereof - A method for packaging submount adhering LED comprises providing a first substrate which has an upper surface, a lower surface forming a plurality of heat-dissipating cavities and a plurality of die-attaching regions defined on the upper surface. Each of the heat-dissipating cavities corresponds to the die-attaching region and has a bottom surface, wherein there is a carrier base located between the bottom surface and the die-attaching region. Next, a heat conductor is formed in the heat-dissipating cavity and a plurality of LEDs are disposed on the die-attaching regions of the first substrate. Then, a second substrate is provided which has a first surface facing to the upper surface of the first substrate, a second surface opposite to the first surface and a plurality of reflective slots communicating with the first and second surfaces. Each of the reflective slots corresponds to the LED and the die-attaching region and couples the first and second substrates thereby allowing each of the LEDs to be located in the reflective slot. | 06-18-2009 |
| 20090152569 | LED MODULE WITH REDUCED OPERATING TEMPERATURE - The present invention relates to a LED module with a reduced operating temperature. The LED module includes a substrate, a plurality of LED chips, a carrier and an encapsulant layer. These LED chips are disposed on the substrate and electrically connected to the substrate and are divided into a first LED chip set and a second LED chip set. The carrier is coupled to the substrate and has a driving circuit. The driving circuit is electrically connected to the plurality of LED chips for driving operations of the plurality of LED chips. The first LED chip set and the second LED chip set emit light in an alternate lighting manner or in a combined simultaneous/alternate lighting manner so as to reduce the operating temperature of the LED module. The encapsulant layer covers the plurality of LED chips, the substrate and the carrier having the driving circuit. | 06-18-2009 |
| 20090152570 | LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same - An LED chip package structure with high-efficiency light emission by rough surfaces includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covering the LED chips. Each package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof. | 06-18-2009 |
| 20090159902 | FLIP-CHIP TYPE SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING FLIP-CHIP TYPE SEMICONDUCTOR LIGHT-EMITTING DEVICE, PRINTED CIRCUIT BOARD FOR FLIP-CHIP TYPE SEMICONDUCTOR LIGHT-EMITTING DEVICE, MOUNTING STRUCTURE FOR FLIP-CHIP TYPE SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND LIGHT-EMITTING DIODE LAMP - A flip-chip type semiconductor light-emitting device having a positive electrode and a negative electrode similar in electrode area and capable of preventing the misalignment of the light-emitting device by utilizing the self alignment effect in manufacturing a light-emitting diode lamp and a printed circuit board for the flip-chip type semiconductor light-emitting device are provided. Furthermore, adopted are a flip-chip type semiconductor light-emitting device | 06-25-2009 |
| 20090159903 | LIGHT CHAIN - A light chain includes a plurality of light emitting diodes (LEDs) electrically connected to each other. Each LED includes an LED chip having a first pole and a second pole, and a packaging layer encapsulating the LED chip. A first electrode has an inner end connected to the first pole, and an outer end extending to the outside of the packaging layer. A second electrode has an inner end connected to the second pole, and an outer end extending to the outside of the packaging layer. A third electrode has a first outer end and a second outer end located at the outside. The outer end of the first electrode and the first outer end cooperatively form a first plug; the outer end of the second electrode and the second outer end cooperatively form a second plug configured to attach to a first plug of an adjacent LED. | 06-25-2009 |
| 20090159904 | LIGHT SOURCE DEVICE, LIGHT SOURCE MODULE, AND METHOD OF MAKING THE LIGHT SOURCE DEVICE - A light source device includes a lead frame, a first solid-state lighting chip, a first transparent encapsulation, a second solid-state lighting chip, and a second transparent encapsulation. The first solid-state lighting chip and the second solid-state lighting chip are respectively located at two opposite sides of the lead frame and electrically connected to the lead frame. The first transparent encapsulation and the second transparent encapsulation respectively encapsulate the first solid-state lighting chip and the second solid-state lighting chip. | 06-25-2009 |
| 20090159905 | Light Emitting Assembly - A light emitting assembly includes: a heat sink having a base wall and at least one mesa protruding from the base wall; and at least one light emitting package unit having at least one light emitting package bonded to the mesa so as to transfer heat generated from the light emitting package to the base wall through the mesa. A circuit board includes a substrate that is formed with at least one through-hole, and is provided with a conductive contact unit that is formed on the substrate. The heat sink is attached to the substrate such that the mesa protrudes from the base wall into and through the through-hole in the substrate so as to be bonded to the light emitting package. | 06-25-2009 |
| 20090159906 | Light-emitting device, method for manufacturing light-emitting device, and electronic apparatus - A light-emitting device includes an organic insulating layer lying above a face of a substrate, reflective layers arranged on a face of the organic insulating layer, an inorganic insulating layer extending over the reflective layers, pixel electrodes arranged on the inorganic insulating layer, and light-emitting sections arranged on the respective pixel electrodes. The inorganic insulating layer has openings and regions in which no pixel electrodes are arranged when viewed from above. The openings extend through the respective regions to the organic insulating layer. A method for manufacturing such a light-emitting device includes forming openings in regions of the inorganic insulating layer in advance of the formation of the light-emitting sections such that the openings extend through the regions to the organic insulating layer, the regions having no pixel electrodes thereon when viewed from above. | 06-25-2009 |
| 20090166646 | LIGHT-EMITTING ELEMENT HAVING PNPN-STRUCTURE AND LIGHT-EMITTING ELEMENT ARRAY - A light-emitting element including a light-emitting thyristor and a Schottky barrier diode is provided. A Schottky barrier diode is formed by contacting a metal terminal to a gate layer of a three-terminal light-emitting thyristor consisting of a PNPN-structure. A self-scanning light-emitting element array may be driven at 3.0V by using such a Schottky barrier diode as a coupling diode of a diode-coupled self-scanning light-emitting element array. | 07-02-2009 |
| 20090173954 | Semiconducting sheet - A substrate-free semiconducting sheet has an array of semiconducting elements dispersed in a matrix material. The matrix material is bonded to the edge surfaces of the semiconducting elements and the substrate-free semiconducting sheet is substantially the same thickness as the semiconducting elements. | 07-09-2009 |
| 20090184332 | Package structure module with high density electrical connections and method for packaging the same - A package structure module with high density electrical connections includes a drive IC structure, an LED array structure, and a plurality of conductive structures. The drive IC structure has a plurality of first open grooves formed on a lateral wall thereof. The LED array structure has a plurality of second open grooves formed on a lateral wall thereof to respectively face the first open grooves. Each conductive structure traverse the corresponding first open groove and the corresponding second open groove in order to electrically connect between the drive IC structure and the LED array structure. | 07-23-2009 |
| 20090184333 | LIGHT EMITTING DIODE DEVICE - An LED device includes a substrate, a plurality of LEDs, a first light pervious layer, a reflective plate, and a plurality of phosphor particles contained in the first light pervious layer. The LEDs are electrically mounted on the substrate and configured for emitting light of a first wavelength. The reflective plate is mounted on the substrate for directing the light of the first wavelength to transmit through the first light pervious layer. The phosphor particles are configured for converting the light of the first wavelength into light of a second wavelength. A distribution of the phosphor particles in the first light pervious layer gradually decreases from a center to a periphery thereof. | 07-23-2009 |
| 20090189165 | LIGHT-EMITTING DIODE LIGHT SOURCE - An LED light source comprises a lower substrate having an upper surface which is formed with a groove and covered with an insulating layer in an area outside the groove, wherein the insulating layer is partially covered with a metal layer; an upper substrate disposed on a top of the insulating layer and formed with an opening in an area corresponding to the groove; a plurality of sub-substrates disposed on an inner bottom portion of the groove, wherein each said sub-substrate has a surface covered with a circuit layer, adjacent said sub-substrates are electrically connected to each other at respective adjacent ends thereof by a first metal lead, and each said sub-substrate is provided thereon with a plurality of LED chips, in which each said LED chip is connected by a second metal lead to a corresponding electrical connection point; and a light-transmitting colloid filled in the groove and the opening. The plurality of LED chips are thus integrally packaged in the groove to form the LED light source, which can be easily manufactured while having a small volume and providing high brightness. | 07-30-2009 |
| 20090189166 | LIGHT EMITTING DEVICE HAVING A PLURALITY OF LIGHT EMITTING CELLS AND METHOD OF FABRICATING THE SAME - Disclosed is a light emitting device having a plurality of light emitting cells. The light emitting device comprises a thermally conductive substrate, such as a SiC substrate, having a thermal conductivity higher than that of a sapphire substrate. The plurality of light emitting cells are connected in series on the thermally conductive substrate. Meanwhile, a semi-insulating buffer layer is interposed between the thermally conductive substrate and the light emitting cells. For example, the semi-insulating buffer layer may be formed of AlN or semi-insulating GaN. Since the thermally conductive substrate having a thermal conductivity higher than that of a sapphire substrate is employed, heat-dissipating performance can be enhanced as compared with a conventional sapphire substrate, thereby increasing the maximum light output of a light emitting device that is driven under a high voltage AC power source. In addition, since the semi-insulating buffer layer is employed, it is possible to prevent an increase in a leakage current through the thermally conductive substrate and between the light emitting cells. | 07-30-2009 |
| 20090194774 | Light source module with wavelength converting structure and the method of forming the same - A light source package module with a wavelength converting structure is provided. The light source package module comprises a frame having a substrate and sidewalls formed on the substrate. A plurality of LED dice is disposed on the substrate, and there is a space between each of the LED dice. A wavelength converting structure is disposed on above the plurality of LED dice and the sidewalls. The light source package can provide a flat light source with a large emitting area can be made in simply as well. Additionally, the present invention further relates to the application of a backlight module. | 08-06-2009 |
| 20090200563 | Group III nitride semiconductor light-emitting device and production method therefor - Provided is a method for producing a Group III nitride semiconductor light-emitting device including a GaN substrate serving as a growth substrate, which method facilitates tapering of a bottom portion of the GaN substrate. In the production method, firstly, a Group III nitride semiconductor layer, an ITO electrode, a p-electrode, and an n-electrode are formed on the top surface of a GaN substrate through MOCVD. Thereafter, the GaN substrate is thinned through mechanical polishing of the bottom surface thereof, and then scratches formed by mechanical polishing are removed through chemical mechanical polishing, to thereby planarize the bottom surface. Subsequently, a mask is formed on the bottom surface of the GaN substrate, followed by wet etching with phosphoric acid. By virtue of anisotropy in etching of GaN with phosphoric acid, a tapered surface is exposed so as to be inclined by about 60° with respect to the GaN substrate. | 08-13-2009 |
| 20090200564 | Method and Structure for Fabricating Smooth Mirrors for Liquid Crystal on Silicon Devices - A method for fabricating a liquid crystal on silicon display device. The method includes providing a substrate, e.g., silicon wafer. The method includes forming a transistor layer overlying the substrate. Preferably, the transistor layer has a plurality of MOS devices therein. The method includes forming an interlayer dielectric layer (e.g., BPSG, FSG) overlying the transistor layer. The method includes planarizing the interlayer dielectric layer and forming a sacrificial layer (e.g., bottom antireflective coating, polymide, photoresist, polysilicon) overlying the planarized interlayer dielectric layer. The method includes forming a plurality of recessed regions within a portion of the interlayer dielectric layer through the sacrificial layer while other portions of the interlayer dielectric layer remain intact. Preferably, lithographic techniques are used for forming the recessed regions. The method includes forming an aluminum layer (or other reflective layer or multilayers) to fill the recessed regions and overlying remaining portions of the sacrificial layer and selectively removing the aluminum layer overlying portions of the sacrificial layer to form a plurality of electrode regions corresponding to each of the recessed regions. | 08-13-2009 |
| 20090206350 | LED chip package structure with different LED spacings and a method for making the same - An LED chip package structure with different LED spacing includes a substrate unit, a light-emitting unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit, and the LEDs are separated from each other by totally different spacing or partially different spacing. For example, the spacings between each two LED chips are from rarefaction to condensation, from condensation to rarefaction, from center rarefaction to outer condensation, from center condensation to outer rarefaction, alternate rarefaction and condensation, or alternate condensation and rarefaction. The package colloid unit covers the LED chips. | 08-20-2009 |
| 20090212303 | Light-emitting diode matrix and method for producing a light-emitting diode matrix - A light-emitting diode matrix comprises a substrate, first and second electrodes electrically insulated from each other formed in or on the substrate, and a first organic layer on the first electrode and a second organic layer on the second electrode. The first organic layer is separated from the second organic layer by separator means. Further, the light-emitting diode matrix comprises a cap electrode with an area disposed on the first organic layer and an area disposed on the second organic layer. The areas of the cap electrode are connected in an electrically conductive way via an area of the cap electrode disposed on the separator means. | 08-27-2009 |
| 20090212304 | Led chip package structure with multifunctional integrated chips and a method for making the same - An LED chip package structure with multifunctional integrated chips includes a substrate unit, a light-emitting unit, a chip unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The chip unit is electrically arranged on the substrate unit, and the chip unit is arranged between the light-emitting unit and a power source. The package colloid unit covers the LED chips. The package colloid unit is a strip fluorescent colloid corresponding to the LED chips. | 08-27-2009 |
| 20090212305 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device can vary color temperatures of its emission light and have a simple and small configuration. The semiconductor light emitting device can include a substrate, electrode wiring formed on the substrate, a plurality of semiconductor light emitting elements mounted on the electrode wiring, and a wavelength conversion layer surrounding the semiconductor light emitting elements. The semiconductor light emitting elements constitute a first semiconductor light emitting element group and a second semiconductor light emitting element group. The wavelength conversion layer has a thinner portion corresponding to the first group and a thicker portion corresponding to the second group and can be differentiated by a step provided on the substrate. | 08-27-2009 |
| 20090224265 | LED chip package structure with a high-efficiency heat-dissipating substrate and method for making the same - An LED chip package structure with a high-efficiency heat-dissipating substrate includes a substrate unit, an adhesive body, a plurality of LED chips, package bodies and frame layers. The substrate unit has a positive substrate, a negative substrate, and a plurality of bridge substrates separated from each other and disposed between the positive and the negative substrate. The adhesive body is filled between the positive, the negative and the bridge substrates in order to connect and fix the positive substrate, the negative substrate and the bridge substrates together. The LED chips are disposed on the substrate unit and electrically connected between the positive substrate and the negative substrate. The package bodies are respectively covering the LED chips. The frame layers are respectively disposed around the packages bodies in order to form a plurality of light-projecting surfaces on the package bodies, and the light-projecting surfaces correspond to the LED chips. | 09-10-2009 |
| 20090224267 | Process for fabricating a thin film semiconductor device, thin film semiconductor device, and liquid crystal display - A process of fabricating a thin film semiconductor device is proposed, which is suitable for mass production and enables to lower the production cost. A first substrate is subject to anodization to form a porous layer thereon. Then, a thin film semiconductor layer is formed on the porous layer. Using the thin film semiconductor layer, a semiconductor device is formed, and wiring is formed between the semiconductor devices. After that, the semiconductor devices on the first substrate is bonded to a second substrate. The semiconductor devices are separated from the first substrate. Further, the semiconductor devices are electrically insulated by removing a part of the thin film semiconductor layer from the separated surface of the second substrate. | 09-10-2009 |
| 20090224268 | LIGHT-EMITTING DIODE AND LIGHTING APPARATUS USING THE SAME - A light-emitting diode includes a substrate, a light-emitting diode element mounted on an upper surface of the substrate, and a sealing member that covers the light-emitting diode element. At least one pair of lower electrodes electrically connected to the light-emitting diode element and at least one pair of connecting electrodes connected to each other are disposed on the substrate. A connecting wiring pattern for connecting the pair of connecting electrodes is provided between the connecting electrodes. | 09-10-2009 |
| 20090230409 | UNDERFILL PROCESS FOR FLIP-CHIP LEDS - An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable. | 09-17-2009 |
| 20090230410 | LED PACKAGE AND METHOD OF MANUFACTURING THE SAME - The present invention relates to light emitting diode (LED) packages and methods of manufacturing the same, and more particularly, to an LED package and a method of manufacturing the same that can reduce a variation of color coordinates of mass-produced LED packages. | 09-17-2009 |
| 20090230411 | INTERDIGITATED MULTIPLE PIXEL ARRAYS OF LIGHT-EMITTING DEVICES - The present invention discloses a plurality of interdigitated pixels arranged in an array, having a very low series-resistances with improved current spreading and improved heat-sinking. Each pixel is a square with sides of dimension l. The series resistance is minimized by increasing the perimeter of an active region for the pixels. The series resistance is also minimized by shrinking the space between a mesa and n-contact for each pixel. | 09-17-2009 |
| 20090236615 | LIGHT EMITTING DIODE - A semiconductor device including a wafer-level LED includes a semiconductor structure coupled to first and second electrodes. The semiconductor includes a P-doped portion of a first layer to an N-doped portion of a second layer. The first layer includes a surface configured to emit light. The first electrode is electrically coupled to the P-doped portion of the first layer on a first side of the semiconductor structure. The first side is adjacent to the surface that is configured to emit the light. The second electrode is electrically coupled to the N-doped portion of the second layer on a second side of the semiconductor structure. The second side is also adjacent to the surface that configured to emit light. | 09-24-2009 |
| 20090236616 | LED ASSEMBLY WITH SEPARATED THERMAL AND ELECTRICAL STRUCTURES THEREOF - An LED assembly includes a substrate and a plurality of LEDs mounted on the substrate. Each LED comprises an LED die, a base supporting the LED die thereon and thermally contacting the substrate to take heat generated by the LED die to the substrate, a pair of leads electrically connecting the LED die to input a current to the LED die, and an encapsulant enveloping the LED die. The pair of leads hover above the substrate to separate an electrical route of the LED assembly from a heat conducting pathway thereof. Furthermore, each LED has a plurality of legs extending raidally from the base thereof to fit in the base of an adjacent LED, to thereby engagingly lock with the adjacent LED. | 09-24-2009 |
| 20090236617 | LED ASSEMBLY INCORPORATING A STRUCTURE FOR PREVENTING SOLDER CONTAMINATION WHEN SOLDERING ELECTRODE LEADS THEREOF TOGETHER - An LED assembly includes a substrate and a plurality of LEDs mounted on the substrate. Each LED includes a base and a first and a second electrode leads inserted in the base. The first lead forms a groove in an end thereof, and the second lead forms a tab from an end thereof. The tab of each LED is received in the groove of an adjacent LED to thereby cooperatively define an accommodating space in the groove and above the tab. The accommodating space is used for receiving excess solder when soldering the first and the second leads together. | 09-24-2009 |
| 20090236618 | LIGHT-EMITTING DIODE PACKAGE AND LEAD GROUP STRUCTURE FOR LIGHT-EMITTING DIODE PACKAGE - A light-emitting diode package | 09-24-2009 |
| 20090242903 | LUMINOUS BODY WITH LED DIES AND PRODUCTION THEREOF - A luminous body comprises a transparent plastic moulding with indentations, and LED DIEs disposed within the indentations. One side of each LED DIE lies approximately flush with an upper side of the moulding, and each LED DIE is connected to an electricity supply via electrical conductors disposed on the moulding. A method for producing such a luminous body is also disclosed. | 10-01-2009 |
| 20090242904 | Semiconductor Light Emitting Apparatus and Optical Print Head - A semiconductor light emitting apparatus is supplied capable of providing a high performance that can optimize simultaneously both an electrical characteristic and a light emitting characteristic. The semiconductor apparatus comprises an anode layer; a cathode layer that has a conductive type different from that of the anode layer; a gate layer that controls an electrical conduction between the anode layer and the cathode layer; an active layer that is set between the anode layer and the cathode layer and emits light through recombination of electron and positive hole; a first cladding layer that is set on one surface of the active layer and has an energy band gap larger than that of the active layer; and a second cladding layer that is set on other surface of the active layer, has an energy band gap larger than that of the active layer and has a conductive type different from that of the first cladding layer, wherein a thickness of the gate layer is or below a mean free path of carriers implanted into the gate layer. | 10-01-2009 |
| 20090242905 | SEMICONDUCTOR DEVICE, OPTICAL PRINT HEAD AND IMAGE FORMING APPARATUS - A semiconductor device and an optical print head, an image forming apparatus that has the semiconductor device are supplied capable of reduce occurrence probability of defect. The semiconductor device is formed by using semiconductor thin film bonded on the substrate, and includes a covering layer that covers at least one part region of the semiconductor thin film and covers at least one part of electroconductive member connecting with the semiconductor thin film. | 10-01-2009 |
| 20090242906 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTING UNIT - A semiconductor light emitting device includes: an outer surrounding body having a recessed portion formed in an upper surface of the outer surrounding body; a lead terminal led out from a side surface of the outer surrounding body; and a semiconductor light emitting element disposed in the recessed portion. The outer surrounding body has a cut portion formed at a corner defined by a cross point of extension lines of adjacent sides in a planar outline of the outer surrounding body viewed from the upper surface of the outer surrounding body. The lead terminal is led out from the cut portion. | 10-01-2009 |
| 20090242907 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - To achieve enlargement and high definition of a display portion, a single crystal semiconductor film is used as a transistor in a pixel, and the following steps are included: bonding a plurality of single crystal semiconductor substrates to a base substrate; separating part of the plurality of single crystal semiconductor substrates to form a plurality of regions each comprising a single crystal semiconductor film over the base substrate; forming a plurality of transistors each comprising the single crystal semiconductor film as a channel formation region; and forming a plurality of pixel electrodes over the region provided with the single crystal semiconductor film and a region not provided with the single crystal semiconductor film. Some of the transistors electrically connecting to the pixel electrodes formed over the region not provided with the single crystal semiconductor film are formed in the region provided with the single crystal semiconductor film. | 10-01-2009 |
| 20090242908 | PLANAR LIGHT SOURCE DEVICE - A planar light source device includes: a substrate having a thickness larger than 0.9 mm and including a metal layer; and a plurality of light-emitting diode chips disposed on the substrate in a matrix array. Each light-emitting diode chip has a chip size ranging from 0.0784 mm | 10-01-2009 |
| 20090242909 | LIGHT-EMITTING DEVICE, LINEAR LIGHT SOURCE, PLANAR LIGHT UNIT AND DISPLAY APPARATUS - A light-emitting device used in a linear array of a plurality of them includes a semiconductor light-emitting element, a substrate on which the semiconductor light-emitting element is mounted, and a light-transmitting sealing resin formed on the front surface of the substrate to seal the semiconductor light-emitting element. Of each of the peripheral edge surfaces of the substrate and the sealing resin, at least one side surface that faces in the direction of the array is inclined in the array direction. | 10-01-2009 |
| 20090242910 | LIGHT EMITTING DEVICE - A light emitting device includes: a first semiconductor region; a second semiconductor region and third semiconductor region which are provided in the first semiconductor region; a first semiconductor light emitting element of which first electrode is electrically connected to a main surface of the second semiconductor region; a second semiconductor light emitting element of which third electrode is electrically connected to a main surface of the third semiconductor region; and a conductor which electrically connects the second electrode of the first semiconductor light emitting element and the third semiconductor region, and which electrically connects the second electrode and the third electrode through the third semiconductor region. In the light emitting device, the semiconductor light emitting elements are connected in series, and are directly connected to a power source. | 10-01-2009 |
| 20090250709 | LED PACKAGE AND LIGHT SOURCE DEVICE USING SAME - An exemplary LED package includes a dielectric plate, a heat conductor, a first planar electrode and a second planar electrode, a LED chip, and metal wires. The dielectric plate comprises a receiving groove defined therein. The heat conductor is positioned in the dielectric plate opposite to the receiving groove, and the heat conductor comprises a holding portion exposed on bottom of the receiving groove. The first and second planar electrodes are respectively received in the dielectric plate extending to the receiving groove and are spaced from the heat conductor. The first and second electrodes are respectively electrically connected to the LED chip by the metal wires. The LED chip is mounted on the holding portion of the heat conductor. | 10-08-2009 |
| 20090256163 | LEDs using single crystalline phosphor and methods of fabricating same - Methods for fabricating LED chips from a wafer and devices fabricated using the methods with one method comprising depositing LED epitaxial layers on an LED growth wafer to form a plurality of LEDs on the growth wafer. A single crystalline phosphor is bonded over at least some the plurality of LEDs so that at least some light from the covered LEDs passes through the single crystalline phosphor and is converted. The LED chips can then be singulated from the wafer to provide LED chips each having a portion of said single crystalline phosphor to convert LED light. | 10-15-2009 |
| 20090256164 | Active Device Array Substrate and Method for Fabricating the Same - An active device array substrate and its fabricating method are provided. According to the subject invention, the elements of an array substrate such as the thin film transistors, gate lines, gate pads, data lines, data pads and storage electrodes, are provided by forming a patterned first metal layer, an insulating layer, a patterned semiconductor layer and a patterned metal multilayer. Furthermore, the subject invention uses the means of selectively etching certain layers. Using the aforesaid means, the array substrate of the subject invention has some layers with under-cut structures, and thus, the number of the time-consuming and complicated mask etching process involved in the production of an array substrate can be reduced. The subject invention provides a relatively simple and time-saving method for producing an array substrate. | 10-15-2009 |
| 20090261355 | Thin film transistor - To provide: a thin film transistor which can be operated with a low threshold and has a high transistor withstand voltage; a production method of the thin film transistor; and a semiconductor device, an active matrix substrate, and a display device, each including such a thin film transistor. The present invention is a thin film transistor including a semiconductor layer, a gate insulating film, a gate electrode on a substrate in this order, wherein a cross section of the semiconductor layer has a forward tapered shape; the gate insulating film covers a top surface and a side surface of the semiconductor layer; and the gate insulating film has a multilayer structure including a silicon oxide film on a semiconductor layer side and a film made of a material with a dielectric constant higher than a dielectric constant of silicon oxide on a gate electrode side; the gate insulating film satisfies 0.5≦B/A where a thickness of the gate insulating film on the top surface of the semiconductor layer is defined as A and a thickness of the gate insulating film on the side surface of the semiconductor layer is defined as B. | 10-22-2009 |
| 20090261356 | Sub-Mount, light emitting diode package and manufacturing method thereof - A sub-mount, a light emitting diode package, and a method of manufacturing thereof are disclosed. A sub-mount, on which multiple light emitting diodes are mounted, can include a multiple number of metal bodies on which the light emitting diodes are respectively mounted, and an oxide wall interposed between the metal bodies such that the adjacent metal bodies are supported by each other but electrically disconnected from each other. By utilizing certain embodiments of the invention, a high heat releasing effect may be obtained, and manufacturing costs may be reduced. | 10-22-2009 |
| 20090261357 | SOLID STATE LIGHT SHEET AND BARE DIE SEMICONDUCTOR CIRCUITS WITH SERIES CONNECTED BARE DIE CIRCUIT ELEMENTS - An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the bottom electrically conductive surface. An electrical insulator separates the bottom electrically conductive surface from the top electrically conductive surface. At least one bare die electronic element is provided having a top conductive side and a bottom conductive side. Each bare die electronic element is disposed so that the top conductive side is in electrical communication with the top electrically conductive surface and so that the bottom conductive side is in electrical communication with the bottom electrically conductive surface. | 10-22-2009 |
| 20090261358 | EMISSION TUNING METHODS AND DEVICES FABRICATED UTILIZING METHODS - A method for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs, typically on a wafer, and coating the LEDs with a conversion material so that at least some light from the LEDs passes through the conversion material and is converted. The light emission from the LED chips comprises light from the conversion material, typically in combination with LED light. The emission characteristics of at least some of the LED chips is measured and at least some of the conversion material over the LEDs is removed to alter the emission characteristics of the LED chips. The invention is particularly applicable to fabricating LED chips on a wafer where the LED chips have light emission characteristics that are within a range of target emission characteristics. This target range can fall within an emission region on a CIE curve to reduce the need for binning of the LEDs from the wafer. The emission characteristics of the LED chips in the wafer can be tuned to the desired range by micro-machining the conversion material over the LEDs. | 10-22-2009 |
| 20090261359 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | 10-22-2009 |
| 20090267085 | LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES - Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source. | 10-29-2009 |
| 20090267086 | Thermal Management For LED - A method and system for removing heat from an LED facilitates the fabrication of LEDs having enhanced brightness. A thermally conductive interposer can be attached to the top of the LED. Heat can flow through the top of the LED and into the interposer. The interposer can carry the heat away from the LED. Light can exit the LED though an at least partially transparent substrate of the LED. By removing heat from an LED, the use of more current through the LED is facilitated, thus resulting in a brighter LED. | 10-29-2009 |
| 20090267087 | LOW RESISTANCE WIRING STRUCTURE AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME - A low-resistance wiring structure and a liquid crystal display are disclosed. The liquid crystal display includes a first substrate; a thin film transistor (TFT) formed on the first substrate and formed of a gate wiring, a data wiring and a semiconductor layer; and a second substrate attached to the first substrate in a facing manner, wherein at least one of the gate wiring and the data wiring is formed as a first wiring made of copper, a second wiring made of a barrier metal preventing spreading of copper, and a metal oxide film pattern formed between the first and second wirings. A MO/Cu wiring structure is implemented by using pure molybdenum, so that the low-resistance wiring structure with high reliability can be formed at a low cost. | 10-29-2009 |
| 20090267088 | SYSTEMS, DEVICES AND METHODS OF BROADBAND LIGHT SOURCES WITH TUNABLE SPECTRUM - Broadband light source systems, devices, and methods with a tunable spectrum are described by multiplexing a plurality of light sources, such as LEDs, with thin-film filters or diffraction gratings. A plurality of light sources with different or same wavelengths are multiplexed together to construct a combined broadband light source. A diffraction grating diffracts light beams from the plurality of light sources to a slit-shaped aperture, depending on selected light sources, the relative positions of the light sources to the slit-shaped aperture, and the type of grating to produce a tunable spectrum. | 10-29-2009 |
| 20090267089 | LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs ( | 10-29-2009 |
| 20090272985 | White LED Lamp and Backlight Using the Same, and Liquid Crystal Display Device Using the Backlight - This invention provides a white LED lamp using an ultraviolet light emitting LED, which can simultaneously realize a high level of color rendering and a high level of brightness by virtue of an improved combination of a blue light emitting phosphor, a green light emitting phosphor, and a red light emitting phosphor. | 11-05-2009 |
| 20090272986 | LED module, and LED chain containing the same - The present invention discloses an LED module comprising: a waterproof enclosure; an LED accommodated in the waterproof enclosure; a wire for coupling the LED module with other LED modules and a driver; and a radiating unit set in the bottom of the waterproof enclosure and exposed to the external environment. The invention further provides an LED chain comprising the above said LED module and a driver coupled with the LED module. The LED chain according to the invention may have a high waterproof level, for example, IP65. The heat generated during the operation of the high power LED module may be transmitted to the external environment in time via a heat sink set on the LED module, thereby effective thermal management for the LED module and a long service life of the LED module may be obtained. Moreover, the finish surface of the driver may be made handsome by encapsulating the driver through the low pressure molding. | 11-05-2009 |
| 20090272987 | Structure Of LED Of High Heat-Conducting Efficiency - A structure of LED of high heat-conducting efficiency is to provide a copper substrate having a plurality of indentations. An insulating layer is formed on the surface of the substrate and the bottom of the indentations. Meanwhile, a set of metallic circuits is formed on the insulating layer of the substrate, and a layer of insulating lacquer is coated on the surface of the metallic circuits, where there is no electric connection and no enclosure. A tin layer is coated on the insulating layer of the indentation and the metallic circuits, where there is no insulating lacquer. Furthermore, a set of light-emitting chips are die bonded on the tin layer of the indentation. Next, the light-emitting chips and the metallic circuits are electrically connected by a set of gold wires. Moreover, a ringed object is arranged on the surface of the substrate, such that the light-emitting chip set, the gold wires and the metallic circuits are enclosed therein. Meanwhile, a fluorescent glue is attached to the light-emitting chip set, the gold wires and the metallic circuits. Eventually, an epoxy resin is filled into the interior of the ringed object to be dry for forming an epoxy resin layer. Thus, a packaging manufacture of LED is completed. | 11-05-2009 |
| 20090278139 | LIGHT-EMITTING DIODE PACKAGE ASSEMBLY - An electrical device containing multiple light emitting diode (LED) dies each having respective first and second connectors suitable to receive current through the LED die. A common base layer of a first electrically conductive material has cavities into which at least one LED die is mounted with its second connector electrically connected by a conductive bonding material to the first conductive material of the base layer. One or more over-layer sections of a second electrically conductive material each are electrically connected by a bond to at least one of the first connector of a LED die. And an insulator electrically separates the first conductive material of the base layer from the second conductive material of over-layer sections. | 11-12-2009 |
| 20090278140 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A manufacturing method of a semiconductor device comprises the steps of: providing a substrate; forming a plurality of grooves on the substrate by photolithograph etching or laser engraving, wherein the plurality of grooves divides a surface of the substrate into a plurality of mesas and the substrate is a patterned substrate; and growing a semiconductor device (e.g. photo-electronic device or LED) on the patterned substrate. The semiconductor device comprises at least one layer, wherein the layer directly disposed on the patterned substrate is the first layer. The first layer comprises a plurality of separated regions divided by the grooves. | 11-12-2009 |
| 20090283778 | Electroluminescent display useful for displaying a predetermined pattern - An electroluminescent display comprising semiconductor nanocrystals, wherein the semiconductor nanocrystals are selected to emit light at a predetermined wavelength and are disposed in a predetermined pattern. In certain embodiments, semiconductor nanocrystals that emit light at different predetermined wavelengths are disposed in the display to create a predetermined multi-color pattern. | 11-19-2009 |
| 20090283779 | LIGHT SOURCE WITH NEAR FIELD MIXING - A light emitting diode (LED) component comprising a submount with an array of LED chips and a lens over the array of LED chips. A diffuser is arranged so that at least some light from the LEDs passes through the diffuser to mix the LED light in the near field. The light passing through the diffuser appears as a mixture of LED chip light when directly viewed. A lighting device is also disclosed comprising an LED component comprising an array of LED chips and a near field diffuser to mix at least some of the light from the LED chips in the near field. A remote reflector is included to reflect at least some the light from the LED component so that is emits from the lighting device in the desired direction. | 11-19-2009 |
| 20090289267 | SOLID STATE LED BRIDGE RECTIFIER LIGHT ENGINE - A solid-state light engine comprised of light emitting diodes (LEDs) configured into a bridge rectifier with a current limiting module coupled to the LED bridge rectifier. The light engine may be packaged for high temperature operation. Optionally, the LEDs comprise wavelength-converting phosphors with a persistence that is a multiple of the peak to peak current period, to smooth and mask ripple frequency pulsation of emitted light. | 11-26-2009 |
| 20090294780 | LIGHT EMITTING DEVICE - A light emitting device comprises: a plurality of light emitting diodes and an insulating (low temperature co-fired ceramic) substrate with an array of recesses each for housing a respective one of the light emitting diodes. The substrate incorporates a pattern of electrical conductors that is configured for connecting the light emitting diodes in a selected electrical configuration and to provide at least two electrical connections on the floor of each recess. Light emitting diodes can be electrically connected to the electrical connections by at least one bond wire or by flip chip bonding. Each recess is filled with a transparent material to encapsulate each light emitting diode. The transparent material can incorporate at least one phosphor material such that the device emits light of a selected color and/or color temperature. | 12-03-2009 |
| 20090294781 | ARRAY SUBSTRATE FOR LIQUID CRYSTAL DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - A method of fabricating an array substrate for a liquid crystal display device includes: forming an initial photoresist (PR) pattern on a metallic material layer; etching the metallic material layer using the initial PR pattern as an etching mask to form the data line and a metallic material pattern, wherein the initial PR pattern is disposed on the data line; performing a first ashing process onto the initial PR pattern to partially remove the initial PR pattern so as to form a first ashed PR pattern, the first ashed PR pattern having a smaller width and a smaller thickness than the initial PR pattern such that end portions of the data line are exposed by the first ashed PR pattern; etching the intrinsic amorphous silicon layer and the impurity-doped amorphous silicon layer by a first dry-etching process; forming a source electrode and a drain electrode on the substrate. | 12-03-2009 |
| 20090302331 | OPTOELECTRONIC DISPLAY AND METHOD OF MANUFACTURING THE SAME - An optoelectronic display comprising a plurality of pixels, each pixel comprising a plurality of sub-pixels, wherein the optoelectronic display comprises a colour-forming layer which is patterned providing a plurality of discrete colour-forming regions in a two-dimensional array, and wherein an addressing array is provided for addressing the discrete colour-forming regions, at least some of the discrete colour-forming regions having portions which are separately addressable by the addressing array, each portion defining a sub-pixel of the optoelectronic display. | 12-10-2009 |
| 20090302332 | SEMICONDUCTOR CIRCUIT HAVING CAPACITOR AND THIN FILM TRANSISTOR, FLAT PANEL DISPLAY INCLUDING THE SEMICONDUCTOR CIRCUIT, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CIRCUIT - A flat panel display including a semiconductor circuit, and a method of manufacturing the semiconductor circuit are disclosed. In one embodiment, the semiconductor circuit includes i) a substrate, ii) a semiconductor layer and a first capacitor electrode formed on the substrate, the first capacitor electrode being doped to be conductive, iii) an insulating layer covering the semiconductor layer and the first capacitor electrode, iv) a gate electrode disposed on the insulating layer and corresponding to a portion of the semiconductor layer, and v) a second capacitor electrode disposed on the insulating layer and corresponding to the first capacitor electrode, wherein the gate electrode is thicker than the second capacitor electrode. | 12-10-2009 |
| 20090302333 | METHODS OF MANUFACTURING AN ORGANIC ELECTROLUMINESCENT DEVICE - A manufacturing method for an organic electroluminescent device that includes an effectively optical area including display pixels for display and a dummy area surrounding the effectively optical area, the dummy area including dummy pixels not for display is provided. The manufacturing method includes coating a first composite material on a first portion in the effectively optical area, the first portion corresponding to one of the display pixels, and coating a second composite material separately from the coating of the first composite material, the second composite material being coated on a second portion of the dummy area, the second portion corresponding to one of the dummy pixels, the first composite material including a first organic electroluminescent material that is dissolved or dispersed in a solvent and the second composite material including a second organic electroluminescent material that is dissolved or dispersed in a solvent. | 12-10-2009 |
| 20090309106 | LIGHT-EMITTING DEVICE MODULE WITH A SUBSTRATE AND METHODS OF FORMING IT - A light-emitting device module comprising a substrate, a light-emitting device chip and a heat-dissipating unit. The substrate has a cavity formed in the surface, has an insulator layer and metal layers, with layers of metal on the top and bottom surfaces. The light-emitting device chip is placed inside the cavity and is bonded onto the top metal layer of the substrate. The electrodes of the device chip are wired-bonded to electrodes formed on the top metal layer of the substrate. The cavity is filled with an encapsulating material to encapsulate the device chip. A heat-dissipating unit is bonded onto the bottom metal layer of the substrate. | 12-17-2009 |
| 20090309107 | Nitride Micro Light Emitting Diode With High Brightness and Method For Manufacturing the Same - The present invention relates to a nitride micro light emitting diode (LED) with high brightness and a method of manufacturing the same. The present invention provides a nitride micro LED with high brightness and a method of manufacturing the same, wherein a plurality of micro-sized luminous pillars | 12-17-2009 |
| 20090315043 | ORGANIC LIGHT-EMITTING TRANSISTOR AND DISPLAY DEVICE - An organic light-emitting transistor having a source electrode layer; a drain electrode layer facing the source electrode layer; an organic light-emitting layer formed between the source electrode layer and the drain electrode layer; a semiconductor layer formed between the organic light-emitting layer and the source electrode layer; and a gate electrode layer deposited to face through a gate insulation film to one face of the source electrode layer opposite to the other face facing the drain electrode layer. The organic light-emitting transistor further comprises: a charge-carrier suppression layer formed between the organic light-emitting layer and the source electrode layer to have an aperture; and a relay region formed between the charge-carrier suppression layer and the source electrode layer to relay charge-carriers from the source electrode layer to the aperture. | 12-24-2009 |
| 20090315044 | ELECTRO-OPTIC DISPLAYS, AND COMPONENTS FOR USE THEREIN - An electro-optic display comprises a substrate ( | 12-24-2009 |
| 20090321752 | ELECTRIC DEVICES AND METHODS OF MANUFATURING THE SAME - A process for manufacturing an electrical device, the process comprising the steps: providing a substrate; bringing a stamp into contact with the substrate whereby areas of the substrate contacted by the stamp have decreased wettability; and depositing a liquid comprising an electrically active material over areas of the substrate located between the areas of decreased wettability. | 12-31-2009 |
| 20090321753 | Light Emitting Device and Method of Manufacturing the Same - There is provided a light emitting device in which low power consumption can be realized even in the case of a large screen. The surface of a source signal line or a power supply line in a pixel portion is plated to reduce a resistance of a wiring. The source signal line in the pixel portion is manufactured by a step different from a source signal line in a driver circuit portion. The power supply line in the pixel portion is manufactured by a step different from a power supply line led on a substrate. A terminal is similarly plated to made the resistance reduction. It is desirable that a wiring before plating is made of the same material as a gate electrode and the surface of the wiring is plated to form the source signal line or the power supply line. | 12-31-2009 |
| 20090321754 | SIGNAL LIGHT USING PHOSPHOR COATED LEDS - A method for creating an improved signal light is disclosed. For example, the improved signal light includes a housing, one or more first type of light emitting diodes (LEDs) emitting a light energy having a first dominant wavelength deployed in the housing, one or more second type of LEDs emitting a light energy having a second dominant wavelength deployed in the housing, a filter and a mixer. The filter may filter the light energy of the one or more second type of LEDs such that only a third dominant wavelength passes from the one or more second type of LEDs. The mixer may mix the light energy having the first dominant wavelength and the filtered light energy having the third dominant wavelength to form a light energy having a desired fourth dominant wavelength. | 12-31-2009 |
| 20100001295 | Embedded package structure module with high-density electrical connections and method for making the same - An embedded package structure module with high-density electrical connections, including: a drive IC structure, an LED array structure and a plurality of conductive structures. The drive IC structure has at least one concave groove. The LED array structure is received in the at least one concave groove of the drive IC structure, and the LED array structure has a plurality of second open grooves formed on its lateral wall and close to the drive IC structure. The conductive structures respectively traverse the second open grooves in order to make the conductive structures electrically connect between the drive IC structure and the LED array structure. | 01-07-2010 |
| 20100001296 | LIGHT-EMITTING ELEMENT ARRAY WITH MICRO-LENSES AND OPTICAL WRITING HEAD - A light-emitting element array with the improvement of the light-emitting efficiency and the improvement of the uneven amount of light is provided. | 01-07-2010 |
| 20100001297 | LED ASSEMBLY WITH COLOR TEMPERATURE CORRECTION CAPABILITY - An illumination assembly is provided which is capable of correcting a color temperature. The assembly generally comprises a substrate and a light emitting device mounted on the substrate that further comprises a light emitting element and a resin containing a phosphor excitable by light emitted from the light emitting element. A reflectance factor of the substrate may be set corresponding to light emitted from the light emitting device, such that the light emitted by the light emitting device complies with a desired light emission for the illumination assembly. A translucent filling resin or translucent coating resin may further be applied on the light emitting device and the substrate, the translucent resin having a refractive index and correspondingly operable to suppress variations in color temperature. The assembly may comprise a plurality of light emitting devices having variable light color temperatures, wherein a plurality of substrate coatings may be provided having reflectance factors corresponding to the associated light color temperatures. One or more translucent resins may be applied on light emitting devices as desired to further suppress variations in color temperature. | 01-07-2010 |
| 20100001298 | LED-packaging arrangement and light bar employing the same - An LED-packaging arrangement, comprising: a first connection block with an enclosure groove at the bottom thereof; a second connection block with an enclosure groove at the bottom thereof; a light-emitting chip positioned at the top of the first connection block and via connection wires electrically coupled to the first and second connection blocks; a positioning/packaging body, and a transparent packaging body. Alternatively, a third connection block is provided with an enclosure groove at the bottom thereof. In this case, the electrical connection originally to the first connection block via the connection wire is changed to the third connection block. The first and second connection blocks are enclosed by the lower part of the positioning/packaging body in position such that the bottom surfaces of the first and second connection blocks are exposed. The upper part of the positioning/packaging body encloses the light-emitting chip so as to create a reflection cap. The transparent packaging body is employed to seal and fix the light-emitting chip and the connection wires in position for an optimal protection. In this way, the problem of the prior art is resolved that the heat generated by the light-emitting chip is not easily dissipated. Moreover, the heat-dissipating efficiency and the structural strength can be considerably enhanced. | 01-07-2010 |
| 20100006864 | IMPLANTED CONNECTORS IN LED SUBMOUNT FOR PEC ETCHING BIAS - A sapphire growth substrate wafer has epitaxially grown over it N-type layers, an active layer, and P-type layers to form GaN LEDs. Each LED is a flip-chip with its cathode contact and anode contact formed on the same side. The wafer is then diced to separate out the LEDs. A P-type silicon submount wafer has N-type doped interconnect regions for interconnecting all the cathode contacts together after the LEDs are mounted on the submount wafer. The sapphire substrate is then removed by a laser lift-off process. A bias voltage is then applied to the cathode contacts via the interconnect regions to bias the N-type layers for a photo-electrochemical etching process that roughens the exposed layer for increased light extraction. The submount wafer is then diced, cutting through the doped interconnect regions. | 01-14-2010 |
| 20100006865 | SEMICONDUCTOR MODULE FOR POWER GENERATION OR LIGHT EMISSION - In order to collect a plurality of semiconductor elements easily from a semiconductor module where a plurality of rod-like semiconductor elements for power generation or light emission are built in and to reuse or repair them, two split modules | 01-14-2010 |
| 20100006866 | LIGHT EMITTING DEVICE, DRIVING METHOD FOR THE SAME AND ELECTRONIC APPARATUS - It is a problem to provide a light-emitting device capable of obtaining a constant brightness without being affected by deterioration in an organic light-emitting layer or temperature change, and of making desired color display. The lowering in OLED brightness due to deterioration is reduced by causing the OLED to emit light while keeping constant the current flowing through the OLED instead of causing the OLED to emit light while keeping constant the OLED drive voltage. Namely, OLED brightness is controlled not by voltage but by current thereby preventing against the change in OLED brightness due to deterioration of OLED. Specifically, the drain current Id of a transistor for supplying a current to the OLED is controlled in a signal line drive circuit thereby keeping constant the drain current Id without relying upon the value of a load resistance. | 01-14-2010 |
| 20100006867 | LIGHT EMITTING DIODE HAVING LIGHT EMITTING CELL WITH DIFFERENT SIZE AND LIGHT EMITTING DEVICE THEREOF - There is provided a light emitting diode operating under AC power comprising a substrate; a buffer layer formed on the substrate; and a plurality of light emitting cells formed on the buffer layer to have different sizes and to be electrically isolated from one another, the plurality of light emitting cells being connected in series through metal wires. | 01-14-2010 |
| 20100006868 | AC LED device and method for fabricating the same - An AC LED device and method for fabricating the same are disclosed. An exemplary embodiment of the AC LED device includes at least two separate AC LED unit chips, wherein each of the AC LED unit chip includes a substrate having a first light emitting module and a second light emitting module. Each of the first and second light emitting modules includes a plurality of light emitting micro diodes connected between a first conductive electrode and a second conductive electrode, wherein the amount of light emitting micro diodes emitting light during a positive half cycle of an AC charge is equal to that during a negative half cycle of an AC charge. A plurality of conductive wires is respectively and electrically connected to the separate AC LED unit chips without passive devices. | 01-14-2010 |
| 20100006869 | SEMICONDUCTOR CHIP, WIRING SUBSTRATE OF A SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE HAVING THE SEMICONDUCTOR CHIP AND DISPLAY DEVICE HAVING THE SEMICONDUCTOR PACKAGE - A semiconductor chip can include a semiconductor substrate, an input portion and an output portion. A circuit element can be formed in the semiconductor substrate. The input portion can be formed on the semiconductor substrate. The input portion can include a first input pad to receive an input signal from the outside and a second input pad spaced apart from the first input pad, the second input pad being electrically connected to the first input pad through an external connection line such that the second input pad inputs the input signal to the circuit element. The output portion can be formed on the semiconductor substrate. The output pad can include an output pad to output an output signal from the circuit element. | 01-14-2010 |
| 20100006870 | LIGHT EMITTING DEVICE - The present invention relates to a light emitting device. According to the present invention, the light emitting device comprises a substrate, a plurality of light emitting cells disposed on the substrate, a first insulation layer disposed on each light emitting cell, an electrically conductive material disposed on the first insulation layer to couple two of the light emitting cells, and a second insulation layer disposed on the electrically conductive material. Each light emitting cell comprises a first semiconductor layer, a second semiconductor layer, and an inclined surface. The second insulation layer corresponds to a contour of each light emitting cell. | 01-14-2010 |
| 20100012954 | Vertical III-Nitride Light Emitting Diodes on Patterned Substrates with Embedded Bottom Electrodes - A light emitting diode (LED) device is presented. The LED device includes a substrate, a layered LED structure, and an embedded bottom electrode. The layered LED structure includes a buffer/nucleation layer disposed on the substrate, an active layer, and a top-side contact. A first-contact III-nitride layer is interposed between the buffer/nucleation layer and the active layer. A second-contact III-nitride layer is interposed between the active well layer and the top-side contact. A bottom electrode extends through the substrate, through the buffer/nucleation layer and terminates within the first-contact III-nitride layer. | 01-21-2010 |
| 20100012955 | Light-Emitting Diode Arrangement and Method for Producing the Same - A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side ( | 01-21-2010 |
| 20100019253 | AC LIGHT EMITTING DIODE - Disclosed herein is an AC light emitting diode. The light emitting diode comprises a plurality of light emitting cells two-dimensionally arranged on a single substrate. Wires electrically connect the light emitting cells to one another to thereby form a serial array of the light emitting cells. Further, the light emitting cells are spaced apart from one another by distances within a range of 10 to 30 D, and the serial array is operated while connected to an AC power source. Accordingly, the excellent operating characteristics and light output power can be secured in an AC light emitting diode with a limited size. | 01-28-2010 |
| 20100019254 | SEMICONDUCTOR LIGHT EMITTING DEVICE, LIGHTING MODULE, LIGHTING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR LIGHT EMITTING DEVICE - An LED bare chip which is one type of a semiconductor light emitting device ( | 01-28-2010 |
| 20100025698 | DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME - A display panel includes a substrate having a display area and a blank area. The blank area includes at least one of a non-metal line region and a metal-line region. The non-metal line region includes a plurality of insulating patterns and a first conductive pattern layer formed on the substrate. The insulating patterns are isolated from each other by the first conductive pattern layer. The metal-line region includes an insulating multilayer formed on the substrate and a conductive pattern layer formed on the insulating multilayer. Several isolated zones are formed by the conductive pattern layer on the surface of the insulating multilayer. | 02-04-2010 |
| 20100032690 | Light emitting device with an insulating layer - The present invention is related to a light emitting device with an insulating layer, which comprises a transparent substrate, a first light emitting unit, a second light emitting unit, an insulating layer and a conducting layer. The first light emitting unit and the second light emitting unit are set up on the transparent substrate, wherein the second light emitting unit has an appearance of a stair structure. The insulating layer is set between the first and the second light emitting units. The conducting layer is on the insulating layer in order to conduct the first and the second light emitting units. Because of the appearance of the stair structure of the second light emitting unit, improving the cladding efficiency of the insulating layer, further improving the insulating efficiency of the insulating layer and avoiding the insulating layer loosing and the leakage between the first and the second light emitting units. | 02-11-2010 |
| 20100032691 | LIGHT EMITTING DEVICE, LIGHT EMITTING SYSTEM HAVING THE SAME, AND FABRICATING METHOD OF THE LIGHT EMITTING DEVICE AND THE LIGHT EMITTING SYSTEM - A semiconductor device includes a first light emitting chip, the first light emitting chip having a first semiconductor layer, a second semiconductor layer, and a first active layer disposed therebetween, a second light emitting chip disposed on the first light emitting chip, the second light emitting chip having a third semiconductor layer, a fourth semiconductor layer, and a second active layer disposed therebetween, and a conductive layer disposed between the first semiconductor layer and the fourth semiconductor layer, the first semiconductor layer and the fourth semiconductor layer having different conductivity types. | 02-11-2010 |
| 20100032692 | LIGHT EMITTING DEVICE FOR AC OPERATION - An AC light emitting device, in which a plurality of light emitting cells formed on a substrate are flip-bonded to a submount to be driven under an AC power source is disclosed. The light emitting device comprises a first serial array of light emitting cells, and a second serial array of light emitting cells, wherein the second serial array is connected in reverse parallel to the first serial array. Meanwhile, bonding patterns are formed on a submount substrate, and the light emitting cells of the first and second serial arrays are flip-bonded to the bonding patterns. Further, node connecting patterns are formed on the submount substrate, and connect the bonding patterns such that nodes corresponding to each other provided in the first and second serial arrays are electrically connected to each other. Accordingly, it is possible to provide an AC light emitting device which can prevent overvoltage from being applied to light emitting cells in the array to which reverse voltage is applied by bonding patterns and node connecting patterns formed on a submount substrate, thereby protecting the light emitting cells. | 02-11-2010 |
| 20100032693 | LED REFLECTING PLATE AND LED DEVICE - A recess is formed in a land ( | 02-11-2010 |
| 20100032694 | LIGHT EMITTING DIODE WITH ITO LAYER AND METHOD FOR FABRICATING THE SAME - The present invention relates to a light emitting diode with enhanced luminance and light emitting performance due to increase in efficiency of current diffusion into an ITO layer, and a method of fabricating the light emitting diode. According to the present invention, there is manufactured at least one light emitting cell including an N-type semiconductor layer, an active layer and a P-type semiconductor layer on a substrate. The method of the present invention comprises the steps of (a) forming at least one light emitting cell with an ITO layer formed on a top surface of the P-type semiconductor layer; (b) forming a contact groove for wiring connection in the ITO layer through dry etching; and (c) filling the contact groove with a contact connection portion made of a conductive material for the wiring connection. | 02-11-2010 |
| 20100038655 | Reflective Layer for Light-Emitting Diodes - A system and method for manufacturing a light-generating device is described. A preferred embodiment comprises a plurality of LEDs formed on a substrate. Each LED preferably has spacers along the sidewalls of the LED, and a reflective surface is formed on the substrate between the LEDs. The reflective surface is preferably located lower than the active layer of the individual LEDs. | 02-18-2010 |
| 20100038656 | Nitride LEDs based on thick templates - Thick HVPE templates of nitrides enhance both the growth conditions and resulting device performance of LEDs, power devices, solar cells, and other electrical elements. The use of HVPE templates greater than 15 microns allows for increased incorporation of indium and/or aluminum in alloys with gallium nitride relative to a thinner MOCVD template for a given reactor growth temperature. The use of these thicker templates further allows the formation of epitaxial chips. The use of this approach forms more efficient nitride devices between 520 nm and 1.7 microns. These devices may be used for both emitting and absorbing applications such as LEDs and solar cells. | 02-18-2010 |
| 20100038657 | LIGHTING APPARATUS - A lighting apparatus is provided with a plurality of light-emitting devices, a substrate, a blind member, and a reflector. The reflector is formed with a plurality of reflective surfaces corresponding to the light-emitting devices, individually. The shielding angle at which light emitted from that one of the light-emitting devices which is located on the outermost periphery is intercepted by the reflective surface corresponding to the outermost light-emitting device is greater than shielding angles at which light emitted from the light-emitting devices located inside the outermost light-emitting device is intercepted by the reflective surfaces corresponding to the inside light-emitting devices. | 02-18-2010 |
| 20100044726 | Method for Packaging White-Light LED and LED Device Produced Thereby - This invention relates to light-emitting diodes or devices (LEDs), such as LED lighting assemblies and methods of manufacturing them. More particularly, this invention relates to white-light LED lighting assemblies, devices, and components, methods for packaging white-light LEDs, and LED devices produced thereby. A method for packaging a white-light LED is provided comprising providing a substrate with a resin injection hole and a vent hole, a packaging housing, at least one LED chip, a supporting frame and resin, installing the LED chip on the substrate, coating an inner wall of the packaging housing with fluorescent powder, connecting the packaging housing to the substrate by way of the supporting frame, so that a cavity is formed therebetween, injecting the resin into the cavity between the packaging housing and the substrate by way of the resin injection hole so that gas within the cavity is discharged by way of the vent hole, and curing the resin. LED assemblies made according to this method are also provided. | 02-25-2010 |
| 20100044727 | LED PACKAGE STRUCTURE - A LED package structure includes an insulating ceramic base, whereon a first surface and a second surface are formed. The LED package structure further includes a casing disposed on the first surface of the insulating ceramic base. A hole is formed on the casing. The LED package structure further includes a heat-dissipating structure connected to the second surface of the insulting ceramic base, at least one LED chip, and at least one conductive circuit disposed inside the casing. The conductive circuit includes a first conductive portion, and a second conductive portion connected to the first conductive portion via the hole and electrically connected to the LED chip. | 02-25-2010 |
| 20100051969 | Display device - A display device includes a transparent substrate, and a plurality of single-crystal thin-film semiconductor light-emitting elements disposed on one side of the transparent substrate. Each of the single-crystal thin-film semiconductor light-emitting elements is composed of single-crystal thin-film semiconductor layers separated from a base substrate, and includes a light-emitting layer and two non-light-emitting layers disposed on both sides of the light-emitting layer. | 03-04-2010 |
| 20100051970 | PLANARIZED LED WITH OPTICAL EXTRACTOR - A light emitting article is disclosed and includes a light emitting diode having an n-layer or p-layer with a first refractive index value. A planarizing layer having a refractive index value equal to or greater than the first refractive index value is disposed on the n-layer or p-layer, and a patterned electrode is disposed on the n-layer or p-layer. An extractor having a light input surface is optically coupled to the planarizing layer. | 03-04-2010 |
| 20100051971 | HIGH EFFICIENCY LIGHT EMITTING ARTICLES AND METHODS OF FORMING THE SAME - A light emitting article ( | 03-04-2010 |
| 20100051972 | Light-Emitting Diode Integration Scheme - A circuit structure includes a carrier substrate, which includes a first through-via and a second through-via. Each of the first through-via and the second through-via extends from a first surface of the carrier substrate to a second surface of the carrier substrate opposite the first surface. The circuit structure further includes a light-emitting diode (LED) chip bonded onto the first surface of the carrier substrate. The LED chip includes a first electrode and a second electrode connected to the first through-via and the second through-via, respectively. | 03-04-2010 |
| 20100051973 | LIGHT-EMITTING DEVICE, ELECTRONIC EQUIPMENT, AND PROCESS OF PRODUCING LIGHT-EMITTING DEVICE - A light-emitting device includes a light-reflecting layer, a first electrode disposed on or above the light-reflecting layer, a semi-transparent reflective second electrode, a light-emitting function layer disposed between the first electrode and the second electrode, and an electron-injection layer disposed between the light-emitting function layer and the second electrode. The second electrode is made of an Ag alloy having an Ag content of from 50% by atoms to 98% by atoms. | 03-04-2010 |
| 20100065860 | LIGHT EMITTING DIODE LIGHTING DEVICE - The present invention relates to a light emitting diode (LED) lighting device ( | 03-18-2010 |
| 20100065861 | LIGHT-EMITTING DEVICE - A light-emitting device | 03-18-2010 |
| 20100065862 | Light Emitting, Photovoltaic Or Other Electronic Apparatus and System - The present invention provides an electronic apparatus, such as a lighting device comprised of light emitting diodes (LEDs) or a power generating apparatus comprising photovoltaic diodes, which may be created through a printing process, using a semiconductor or other substrate particle ink or suspension and using a lens particle ink or suspension. An exemplary apparatus comprises a base; at least one first conductor; a plurality of substantially spherical or optically resonant diodes coupled to the at least one first conductor; at least one second conductor coupled to the plurality of diodes; and a plurality of substantially spherical lenses suspended in a polymer attached or deposited over the diodes. The lenses and the suspending polymer have different indices of refraction. In some embodiments, the lenses and diodes have a ratio of mean diameters or lengths between about 10:1 and 2:1. The diodes may be LEDs or photovoltaic diodes, and in some embodiments, have a junction formed at least partially as a hemispherical shell or cap. | 03-18-2010 |
| 20100065863 | Light Emitting, Photovoltaic Or Other Electronic Apparatus and System - The present invention provides an electronic apparatus, such as a lighting device comprised of light emitting diodes (LEDs) or a power generating apparatus comprising photovoltaic diodes, which may be created through a printing process, using a semiconductor or other substrate particle ink or suspension and using a lens particle ink or suspension. An exemplary apparatus comprises a base; at least one first conductor; a plurality of diodes coupled to the at least one first conductor; at least one second conductor coupled to the plurality of diodes; and a plurality of lenses suspended in a polymer deposited or attached over the diodes. The lenses and the suspending polymer have different indices of refraction. In some embodiments, the lenses and diodes are substantially spherical, and have a ratio of mean diameters or lengths between about 10:1 and 2:1. The diodes may be LEDs or photovoltaic diodes, and in some embodiments, have a junction formed at least partially as a hemispherical shell or cap. | 03-18-2010 |
| 20100072488 | LED WITH CONTROLLED ANGULAR NON-UNIFORMITY - A light source that uses a light emitting diode with a wavelength converting element is configured to produce a non-uniform angular color distribution, e.g., Δu′v′>0.015 within an angular distribution from 0° to 90°, that can be used with specific light based device that translate the angular color distribution into a uniform color distribution. The ratio of height and width for the wavelength converting element is selected to produce the desired non-uniform angular color distribution. The use of a controlled angular color non-uniformity in the light source and using it in applications that translate the non-uniformity into a uniform color distribution, e.g., with a uniformity of Δu′v′<0.01, increases the efficiency of the system compared to conventional systems in which a uniform angular light emitting diode is used. | 03-25-2010 |
| 20100072489 | SEMICONDUCTOR LIGHT EMITTING DEVICES GROWN ON COMPOSITE SUBSTRATES - A plurality of III-nitride semiconductor structures, each comprising a light emitting layer disposed between an n-type region and a p-type region, are grown on a composite substrate. The composite substrate includes a plurality of islands of III-nitride material connected to a host by a bonding layer. The plurality of III-nitride semiconductor structures are grown on the III-nitride islands. The composite substrate may be formed such that each island of III-nitride material is at least partially relaxed. As a result, the light emitting layer of each semiconductor structure has an a-lattice constant greater than 3.19 angstroms. | 03-25-2010 |
| 20100072490 | LOW COST FLEXIBLE DISPLAY SHEET - Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, onto a subsequent flexible surface using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, repaired, and/or released in a scalable manner during the assembly of IC chips by inducing phase change of the phase change material. The release member can be flexible or rigid. In some embodiments, the release member can be used with an intermediate transfer member. In some embodiments the IC element can be incorporated into a subsequent flexible surface including components for a TV, radiographic detector, sensor array, or any similar product having a requirement to emit, detect, or collect energy. In addition, the IC elements can be RF emitting, or visually emitting. | 03-25-2010 |
| 20100072491 | LED chip module - A LED chip module comprises a base board comprising a PCB circuit therein; and a LED chip mounting on the base board comprising a supporting frame comprising a case having a peripheral wall defining an inner room therein, and a plurality of pairs of pins provided at both sides of the case, wherein each pair of pins extending through the peripheral wall of both sides of the case respectively from the inner room of the case to the outside of the case connecting with the PCB circuit; and a LED circuit is disposed in the case, which comprises a plurality of LEDs and a plurality of pairs of conducting wires, wherein each pair of conducting wire have one end connecting to the both sides of a LED respectively, and has another end connecting to a pair of pins in the inner room of the case respectively. | 03-25-2010 |
| 20100072492 | Package Substrate and Light Emitting Device Using the Same - A package substrate of the present invention at least comprises a metal substrate and a plurality of light emitting dies. The metal substrate is provided thereon with at least one trench. The trench is recessed into the surface of the metal substrate through an insulating layer. The light emitting dies are secured in the trench and electrically connected to a predetermined wiring layer on the metal substrate by metal wires, thereby obtaining a light emitting die package substrate with good thermal conductivity, high heat dissipation, separate electrical and thermal paths and a simple and firm structure. | 03-25-2010 |
| 20100072493 | ACTIVE MATRIX SUBSTRATE - In an active matrix substrate ( | 03-25-2010 |
| 20100072494 | LIGHT EMITTING DIODE HAVING LIGHT EMITTING CELL WITH DIFFERENT SIZE AND LIGHT EMITTING DEVICE THEREOF - There is provided a light emitting diode operating under AC power comprising a substrate; a buffer layer formed on the substrate; and a plurality of light emitting cells formed on the buffer layer to have different sizes and to be electrically isolated from one another, the plurality of light emitting cells being connected in series through metal wires. | 03-25-2010 |
| 20100078656 | LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - Disclosed are a light emitting device and a method of fabricating the same. The light emitting device comprises a substrate. A plurality of light emitting cells are disposed on top of the substrate to be spaced apart from one another. Each of the light emitting cells comprises a first upper semiconductor layer, an active layer, and a second lower semiconductor layer. Reflective metal layers are positioned between the substrate and the light emitting cells. The reflective metal layers are prevented from being exposed to the outside. | 04-01-2010 |
| 20100078657 | SEMICONDUCTOR LIGHT EMITTING DEVICE, LIGHT EMITTING MODULE, LIGHTING APPARTUS, DISPLAY ELEMENT AND MANUFACTURING METHOD OF SEMICONDUCTOR LIGHT EMITTING DEVICE - An LED array chip ( | 04-01-2010 |
| 20100078658 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a light emitting device and a method of manufacturing the light emitting device. According to the present invention, the light emitting device comprises a substrate, an N-type semiconductor layer formed on the substrate, and a P-type semiconductor layer formed on the N-type semiconductor layer, wherein a side surface including the N-type or P-type semiconductor layer has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a light emitting device comprising a substrate formed with a plurality of light emitting cells each including an N-type semiconductor layer and a P-type semiconductor layer formed on the N-type semiconductor layer, and a submount substrate flip-chip bonded onto the substrate, wherein the N-type semiconductor layer of one light emitting cell and the P-type semiconductor layer of another adjacent light emitting cell are connected to each other, and a side surface including at least the P-type semiconductor layer of the light emitting cell has a slope of 20 to 80° from a horizontal plane. Further, the present invention is provides a method of manufacturing the light emitting device. Accordingly, there is an advantage in that the characteristics of a light emitting device such as luminous efficiency, external quantum efficiency and extraction efficiency are enhanced and the reliability is secured such that light with high luminous intensity and brightness can be emitted. | 04-01-2010 |
| 20100084665 | SOLID STATE LIGHT SHEET AND ENCAPSULATED BARE DIE SEMICONDUCTOR CIRCUITS - An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the bottom electrically conductive surface. An electrical insulator separates the bottom electrically conductive surface from the top electrically conductive surface. At least one bare die electronic element is provided having a top conductive side and a bottom conductive side. Each bare die electronic element is disposed so that the top conductive side is in electrical communication with the top electrically conductive surface and so that the bottom conductive side is in electrical communication with the bottom electrically conductive surface. | 04-08-2010 |
| 20100084666 | ILLUMINATING MEANS - An illuminating means, including a radiation source for emitting electromagnetic radiation in the optical range, a support base, and an electrode arrangement with a first and at least a second electrode. The radiation source is disposed on the support base and connected by connecting wires to the electrode arrangement so as to be electrically conductive, and the radiation source is provided in the form of a first and at least a second semiconductor component. The first electrode is connected to the first semiconductor component via a first contact point, and the second electrode is connected to the second semiconductor component via a second contact point, so as to be electrically conductive. The distance of the first contact point from a center point or a line of symmetry of the support base is different from the distance of the second contact point from the center point or line of symmetry. | 04-08-2010 |
| 20100084667 | Semiconductor Light Source Element for Beam Forming - A semiconductor light source element includes a substrate to which at least one semiconductor light source is mounted. An optical body is mounted to the substrate with its light receiving surface located adjacent the light emitting surface of the at least one semiconductor light source. The optical body has a shape and light output surface profile which are selected to produce a desired beam pattern with the light emitted by the at least one semiconductor light source. When two or more semiconductor light sources are employed in the semiconductor light source element, the light sources can be positioned at different locations about the light receiving surface to emit light from the front edge of the optical body in correspondingly diverse patterns. | 04-08-2010 |
| 20100090229 | SEMICONDUCTOR LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME - A light emitting apparatus can have a front luminous intensity distribution having a sharp difference at the interface between the light emitting area and the surrounding non-light emitting area (outer environment) so as to suppress or prevent light color unevenness. The semiconductor light emitting apparatus can include a substrate, a plurality of light emitting elements each having a top surface as a light emitting surface and disposed on the substrate with a predetermined gap between the adjacent light emitting elements, bridge portions each disposed at the gap between the adjacent light emitting elements so as to connect the light emitting elements, and a wavelength conversion layer disposed over the top surfaces of the plurality of the light emitting elements and the bridge portions entirely. The wavelength conversion layer can have a decreased thickness at least around its peripheral area and gradually tapering to its end portion. | 04-15-2010 |
| 20100096642 | PACKAGING STRUTURE FOR HIGH POWER LIGHT EMITTING DIODE(LED) CHIP - The present invention relates to a packaging structure for high-power light emitting diode (LED) chip, comprising a metal plate, insulators and a cover plate. The metal plate comprises a containing slot and isolating slots formed on the surface by working, and the insulators can be embedded in the isolating slot. After forming a hollow slot and notches on the surface of the cover plate by working, the cover plate is combined with the metal plate and insulators and at the same time, the hollow slot and the notches are corresponding to the containing slot and the isolating slots on the metal plate to form a hollowness state, followed by application of surface treatment to form soldering portions and an anti-soldering layer at the bottom of the metal plate. Then the metal plate is cut on both sides along free ends of the insulators so as to generate electrode contacts with positive and negative electrodes, and the surface mount technology (SMT) can be adopted for assembly of the packaging structure of high-power LED chip so as to simplify manufacturing processes, facilitate mass production and achieve separation of electricity from heat, etc. | 04-22-2010 |
| 20100096643 | SEMICONDUCTOR LIGHT SOURCE FOR ILLUMINATING A PHYSICAL SPACE INCLUDING A 3-DIMENSIONAL LEAD FRAME - The present invention is a semiconductor light source | 04-22-2010 |
| 20100096644 | Light Emitting Device Package and Light Emitting Apparatus - Disclosed are a light emitting device package and a light emitting apparatus. The light emitting device package comprises a package body comprising a light emitting surface inclined at an oblique angle with respect to a bottom surface, a plurality of lead electrodes in the package body, and at least one light emitting device electrically connected to the lead electrodes. | 04-22-2010 |
| 20100096645 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A manufacturing method of a display device and a display device which can reduce the number of times that an insulation substrate is put into a CVD device and is taken out from the CVD device are provided. The manufacturing method of a display device includes the steps of forming a conductive layer including first electrode films and second electrode films, a first insulation layer, semiconductor films, a second insulation layer and a protective layer on an insulation substrate; forming first resist films having a predetermined thickness which are arranged in first regions above the semiconductor films, opening portions which are arranged in second regions above the second electrode films and second resist films having a large thickness which are arranged in regions other than the first regions and the second regions on the protective layer; etching portions below the second regions, removing the first resist films by ashing; forming first holes which reach the semiconductor films below the first regions and second holes which reach the second electrode films below the second regions; removing the second resist films, and forming lines which are connected to the semiconductor films and lines which are connected to the second electrode films. | 04-22-2010 |
| 20100096646 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS HAVING THEREOF - Embodiments relate to a semiconductor light emitting device and a light emitting apparatus comprising the same. The semiconductor light emitting device according to embodiments comprises a plurality of light emitting cells comprising a plurality of compound semiconductor layers; a plurality of ohmic contact layers on the light emitting cells; a first insulating layer on the ohmic contact layer; a second electrode layer electrically connected to a first light emitting cell of the light emitting cells; and a plurality of interconnection layers connecting the light emitting cells in series. | 04-22-2010 |
| 20100102334 | LIGHTING DEVICE - The present invention relates to lighting device ( | 04-29-2010 |
| 20100102335 | ORGANIC EL DISPLAY AND METHOD OF MANUFACTURING THE SAME - The present invention provides an organic EL display and a method of manufacturing the same capable of assuring excellent electric connection between an auxiliary wiring and a second electrode without using large-scale equipment. The organic EL display includes: a plurality of pixels each having, in order from a substrate side, a first electrode, an organic layer including a light emission layer, and a second electrode; an auxiliary wiring disposed in a periphery region of each of the plurality of pixels and conducted to the second electrode; and another auxiliary wiring disposed apart from the auxiliary wiring at least in a part of outer periphery of a formation region of the auxiliary wiring in a substrate surface. | 04-29-2010 |
| 20100102336 | LIGHT EMITTING DIODE FOR AC OPERATION - The present invention discloses a light emitting diode (LED) including a plurality of light emitting cells arranged on a substrate. The LED includes half-wave light emitting units each including at least one light emitting cell, each half-wave light emitting unit including first and second terminals respectively arranged at both ends thereof; and full-wave light emitting units each including at least one light emitting cell, each full-wave light emitting units including third and fourth terminals respectively formed at both ends thereof. The third terminal of each full-wave light emitting unit is electrically connected to the second terminals of two half-wave light emitting units, and the fourth terminal of each full-wave light emitting unit is electrically connected to the first terminals of other two half-wave light emitting units. Also, a first half-wave light emitting unit is connected in series between the third terminal of a first full-wave light emitting unit and the fourth terminal of a second full-wave light emitting units, and a second half-wave light emitting units is connected in series between the fourth terminal of the first full-wave light emitting unit and the third terminal of the second full-wave light emitting unit. | 04-29-2010 |
| 20100102337 | LIGHT EMITTING DIODE FOR AC OPERATION - The present invention discloses a light emitting diode (LED) including a plurality of light emitting cells arranged on a substrate. The LED includes half-wave light emitting units each including at least one light emitting cell, each half-wave light emitting unit including first and second terminals respectively arranged at both ends thereof; and full-wave light emitting units each including at least one light emitting cell, each full-wave light emitting units including third and fourth terminals respectively formed at both ends thereof. The third terminal of each full-wave light emitting unit is electrically connected to the second terminals of two half-wave light emitting units, and the fourth terminal of each full-wave light emitting unit is electrically connected to the first terminals of other two half-wave light emitting units. Also, a first half-wave light emitting unit is connected in series between the third terminal of a first full-wave light emitting unit and the fourth terminal of a second full-wave light emitting units, and a second half-wave light emitting units is connected in series between the fourth terminal of the first full-wave light emitting unit and the third terminal of the second full-wave light emitting unit. | 04-29-2010 |
| 20100109025 | OVER THE MOLD PHOSPHOR LENS FOR AN LED - Rectangular LED dice are mounted on a submount wafer. A first mold has rectangular indentations in it generally corresponding to the positions of the LED dice on the submount wafer. The indentations are filled with silicone, which when cured forms a clear first lens over each LED. Since the wafer is precisely aligned with the mold, the top surfaces of the first lenses are all within a single reference plane irrespective of any x, y, and z misalignments of the LEDs on the wafer. A second mold has rectangular indentations filled with a phosphor-infused silicone so as to form a precisely defined phosphor layer over the clear first lens, whose inner and outer surfaces are completely independent of any misalignments of the LEDs. A third mold forms an outer silicone lens. The resulting PC-LEDs have high chromaticity uniformity from PC-LED to PC LED within a submount wafer and from wafer to wafer, and high color uniformity over a wide viewing angle. | 05-06-2010 |
| 20100109026 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided are a light emitting device and a method of manufacturing the same. The light emitting device includes each of first and second semiconductor stacked structures including first and second conductive type semiconductor layers and an active layer, first and second contacts on tops and bottoms of the first and second semiconductor stacked structures to be connected to the first and second conductive type semiconductor layers, a substrate structure including first and second sides, a first insulation layer on an area where no second contact is formed among a surface of the first and second semiconductor stacked layers, first and second conductive layers connected to the second contacts of the first and second semiconductor stacked structures, first and second wiring layers on the first side of the substrate structure, and first and second external connection terminals connected to the first and second contacts of the first semiconductor stacked structure. | 05-06-2010 |
| 20100109027 | LIGHT EMITTING DIODE PACKAGE - Provided is an LED package. It is easy to control luminance according to the luminance and an angle applicable. Since heat is efficiently emitted, the LED package is easily applicable to a high luminance LED. The manufacturing process is convenient and the cost is reduced. The LED package includes a substrate, an electrode, an LED, and a heatsink hole. The electrode is formed on the substrate. The LED is mounted in a side of the substrate and is electrically connected to the electrode. The heatsink hole is formed to pass through the substrate, for emitting out heat generated from the LED. | 05-06-2010 |
| 20100117099 | Multi-chip light emitting diode modules - A multi-chip lighting module is disclosed for maximizing luminous flux output and thermal management. In one embodiment, a multi-chip module device comprises a substantially thermally dissipative substrate with a dark insulating layer deposited on a surface of the substrate. A plurality of light emitting devices is also provided. An electrically conductive layer is applied to a surface of the substrate, with the conductive layer comprising a plurality of chip carrier parts each having a surface for carrying at least one of the light emitting devices. Each light emitting device has a first and a second electrical terminal. A reflective layer is also provided that at least partially covers the conductive layer. | 05-13-2010 |
| 20100117100 | LIGHT-EMITTING MODULE AND ILLUMINATION DEVICE - There is provided a light-emitting module which makes it difficult to sense glare and which suppresses the temperature rise of light-emitting diode chips and has a cost advantage. The light-emitting module is provided with a base body formed with a non-metallic member having a thermal conductivity of 1 W/mk or less. In the base body, a plurality of LED chips are spaced 10 to 30 mm apart from each other, and their junction temperature when they are normally lit is preferably set at 90° C. or less. A translucent sealing member covering an area between the adjacent light-emitting diode chips is provided. | 05-13-2010 |
| 20100117101 | AC LIGHT EMITTING DIODE - Disclosed herein is an AC light emitting diode. The light emitting diode comprises a plurality of light emitting cells two-dimensionally arranged on a single substrate. Wires electrically connect the light emitting cells to one another to thereby form a serial array of the light emitting cells. Further, the light emitting cells are spaced apart from one another by distances within a range of 10 to 30 μm, and the serial array is operated while connected to an AC power source. Accordingly, the excellent operating characteristics and light output power can be secured in an AC light emitting diode with a limited size. | 05-13-2010 |
| 20100123141 | EMISSIVE DEVICE WITH CHIPLETS - An emissive device includes a substrate having a substrate surface; a chiplet adhered to the substrate surface, the chiplet having one or more connection pads; a bottom electrode formed on the substrate surface, one or more organic or inorganic light-emitting layers formed over the bottom electrode, and a top electrode formed over the one or more organic or inorganic light-emitting layers; an electrical conductor including a transition layer formed over only a portion of the chiplet and only a portion of the substrate surface, the transition layer exposing at least one connection pad, the electrical conductor formed in electrical contact with the exposed connection pad and the bottom electrode; and an LED spaced from the chiplet and including a layer of light-emissive material formed over the bottom electrode and a top electrode formed over the light-emissive layer. | 05-20-2010 |
| 20100123142 | FLAT PANEL DISPLAY APPARATUS - Provided is a flat panel display apparatus including a sealant which has a small effective width and is able to effectively attach a substrate and an encapsulation substrate. The flat panel display apparatus includes the substrate, a display unit disposed on the substrate, the encapsulation substrate disposed facing the substrate so that the display unit is disposed on inner side of the encapsulation substrate, and the sealant attaching the substrate and the encapsulation substrate, wherein an end surface of the sealant facing the substrate contacts a silicon oxide layer disposed on the substrate. | 05-20-2010 |
| 20100123143 | THREE-DIMENSIONAL LED LIGHT-EMITTING PLATE - In the field of opto-electronic technology, a three-dimensional (3D) light-emitting diode (LED) light-emitting plate is described. The 3D LED light-emitting plate includes an aluminum substrate. The aluminum substrate is vertically disposed. Notches are formed on an upper side of the aluminum substrate in a thickness direction. LED chips are mounted in the notches. A flexible circuit layer is disposed on a surface of the aluminum substrate. Each LED chip is connected to a circuit of the flexible circuit layer by a gold wire. A fluorescent colloid light-emitting shell is disposed outside each LED chip correspondingly. A cavity is formed between the LED chip and the fluorescent colloid light-emitting shell. A lower portion of the fluorescent colloid light-emitting shell is fixed on the aluminum substrate. The 3D LED light-emitting plate effectively improves the luminous brightness and efficiency of an LED and enlarges an effective light-emitting angle, and alleviates the problem of non-uniform light pattern and light color, such that an LED white light lamp can achieve the luminous effect of a tungsten lamp. The fluorescent colloid light-emitting shell wraps the LED chip, which not only protects the LED chip from dust and produces white light, but is also suitable for use in a severe environment. Moreover, the production cost is reduced due to the simple structure. | 05-20-2010 |
| 20100123144 | CIRCUIT STRUCTURE OF PACKAGE CARRIER AND MULTI-CHIP PACKAGE - A circuit structure of a package carrier including a plurality of chip pads, a first electrode, a second electrode, a third electrode and a fourth electrode is provided. These chip pads are arranged in an M×N array. A first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad are disposed clockwise in the peripheral area of each chip pad in sequence. The orientations of each of the first, second, third, and fourth bonding pads of the (S−1) | 05-20-2010 |
| 20100127281 | BACKLIGHT UNIT EQUIPPED WITH LIGHT EMITTING DIODES - Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio. | 05-27-2010 |
| 20100133552 | LAMP TYPE LIGHT EMITTING DEVICE FOR SAFETY FUSE - A lamp type light emitting device for safety fuse, including a substrate, an electrode layer, a chip set, a wire set, two leads and an encapsulator. The electrode layer is arranged on the substrate and includes a first T-shaped electrode, a second T-shaped electrode, a first stripe electrode and a second stripe electrode. The chip set includes a first resistor chip and a first light emitting chip arranged on the first T-shaped electrode and a second resistor chip and a second light emitting chip arranged on the second T-shaped electrode. The wire set has fuse wires electrically connected the first resistor chip, the first light emitting chip, the first stripe electrode, the second resistor chip, second light emitting chip, and the second stripe electrode. The leads are electrically connected to the first and the second T-shaped electrodes. The encapsulator encapsulates the electrode layer, the chip set and the wire set. | 06-03-2010 |
| 20100133553 | THERMALLY CONDUCTIVE STRUCTURE OF LED AND MANUFACTURING METHOD THEREOF - A thermally conductive structure of a light emitting diode (LED) includes a vapor chamber, an insulating layer, an electrically conductive layer and a plurality of LEDs. In the invention, the insulating layer is plated over a surface of the vapor chamber; the electrically conductive layer disposed on the insulating layer is electrically separated from the vapor chamber and has a first electrode and a second electrode; and the LEDs arranged on the insulating layer respectively have a first leg connected to the first electrode and a second leg connected to the second electrode; thereby, the invention has an excellent performance of thermal conduction and heat dissipation, which is capable of prolonging the lifespan of LED. | 06-03-2010 |
| 20100133554 | SOLID STATE LIGHTING DEVICE - A light emission package includes at least one solid state emitter, a leadframe, and a body structure encasing a portion of the leadframe. At least one aperture is defined in an electrical lead to define multiple electrical lead segments, with at least a portion of the aperture disposed outside an exterior side wall of the package. A recess may be defined in the exterior side wall to receive a bent portion of an electrical lead. A body structure cavity may be bounded by a floor, and side wall portions and end wall portions that are separated by transition wall portions including a curved or segmented upper edge, with different wall portions being disposed at different angles of inclination. | 06-03-2010 |
| 20100133555 | SOLID METAL BLOCK SEMICONDUCTOR LIGHT EMITTING DEVICE MOUNTING SUBSTRATES - A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces. The first metal face includes an insulating layer and a conductive layer on the insulating layer. The conductive layer is patterned to provide first and second conductive traces that connect to a semiconductor light emitting device. The second metal face may include heat sink fins therein. A flexible film including an optical element, such as a lens, also may be provided, overlying the semiconductor light emitting device. | 06-03-2010 |
| 20100133556 | LED ARRAY PACKAGE COVERED WITH A HIGHLY THERMAL CONDUCTIVE PLATE - A light source includes a substrate, a light emitting diode on the substrate, and a phosphor layer over the light emitting diode. A plate is on the phosphor layer. An attachment member is coupled to the plate and is configured to conduct heat away from the plate. | 06-03-2010 |
| 20100133557 | METAL-BASED PHOTONIC DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF - A metal-based photonic device package module that is capable of greatly improving heat releasing efficiency and implementing a thin package is provided. The metal-based photonic device package module includes a metal substrate that is formed the shape of a plate, a metal oxide layer that is formed on the metal substrate to have a mounting cavity, a photonic device that is mounted in the mounting cavity of the metal oxide layer, and a reflecting plane that is formed at an inner surface of the mounting cavity of the metal oxide layer. | 06-03-2010 |
| 20100133558 | FLIP CHIP TYPE LED LIGHTING DEVICE MANUFACTURING METHOD - A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type UP lighting devices. | 06-03-2010 |
| 20100133559 | AREA LIGHT SOURCE APPARATUS AND LIQUID CRYSTAL DISPLAY APPARATUS ASSEMBLY - Disclosed herein is an area light source apparatus for illuminating a liquid crystal display apparatus of the transmission type, which has a display area formed from a plurality of pixels arrayed in a two-dimensional matrix, from the back, including: a plurality of light emitting element assemblies each provided as a light source and each including a light emitting element and a lens through which light emitted from the light emitting element passes; and a plurality of dummy lenses disposed in the proximity of each of the light emitting element assemblies and configured same as the lenses of the light emitting element assemblies. | 06-03-2010 |
| 20100140632 | Multi-Electrode Light Emitting Device - The invention relates to a broad-band light emitting diode having an active layer composed of a plurality of light emission regions of differing materials for emitting light at a plurality of wavelengths, wherein each of the emission regions of the active layer is electrically controlled by a separate electrode for providing a broad-band emission or optical gain with a multi-point control of its spectral profile. | 06-10-2010 |
| 20100140633 | Methods for Combining Light Emitting Devices in a Package and Packages Including Combined Light Emitting Devices - Methods of forming a light emitting device package assembly include defining a chromaticity region in a two dimensional chromaticity space, and subdividing the defined chromaticity region into at least three chromaticity subregions, providing a plurality of light emitting devices that emit light having a chromaticity that falls within at least one of the defined chromaticity subregions, selecting at least three of the plurality of light emitting devices, each of the three light emitting devices emits light from a different one of the chromaticity subregions, and mounting the selected light emitting devices on a light emitting device package body. | 06-10-2010 |
| 20100140634 | SOLID STATE EMITTER PACKAGE INCLUDING RED AND BLUE EMITTERS - A solid state emitter package includes a principally red solid state emitter having peak emissions within 590 nm to 680 nm, a principally blue solid state emitter having peak emissions within 400 nm to 480 nm, and at least one of a common leadframe, common substrate, and common reflector, with the package being devoid of any principally green solid state emitters having peak emissions between 510 nm and 575 nm. A solid state emitter package may include at least one electrically conductive path associated with the solid state emitter package that is not in electrical communication with any solid state emitter of the solid state emitter package, with such electrically conductive path being susceptible to inclusion of a jumper or a control element. | 06-10-2010 |
| 20100148190 | LIGHT EMITTING DIODE WITH ITO LAYER AND METHOD FOR FABRICATING THE SAME - The present invention relates to a light emitting diode with enhanced luminance and light emitting performance due to increase in efficiency of current diffusion into an ITO layer, and a method of fabricating the light emitting diode. According to the present invention, there is manufactured at least one light emitting cell including an N-type semiconductor layer, an active layer and a P-type semiconductor layer on a substrate. The method of the present invention comprises the steps of (a) forming at least one light emitting cell with an ITO layer formed on a top surface of the P-type semiconductor layer; (b) forming a contact groove for wiring connection in the ITO layer through dry etching; and (c) filling the contact groove with a contact connection portion made of a conductive material for the wiring connection. | 06-17-2010 |
| 20100148191 | High Luminous Flux Warm White Solid State Lighting Device - A high luminous flux warm white solid state lighting device with a high color rendering is disclosed. The device comprising two groups of semiconductor light emitting components to emit and excite four narrow-band spectrums of lights at high luminous efficacy, wherein the semiconductor light emitting components are directly mounted on a thermal effective dissipation member; a mixing cavity for blending the multi-spectrum of lights; a back-transferred light recycling member deposited on top of an LED driver and around the semiconductor light emitters; and a diffusive member to diffuse the mixture of output light from the solid state lighting device. The solid state lighting device produces a warm white light with luminous efficacy at least 80 lumens per watt and a color rendering index at least 85 for any lighting application. | 06-17-2010 |
| 20100148192 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display includes: a substrate member; a pixel electrode formed on the substrate member; a pixel defining film having an opening through which the pixel electrode is exposed, and formed on the substrate member; a light absorbing layer pattern for dividing the opening into a plurality of sub-emitting areas within the opening of the pixel defining film; an organic light emitting layer formed on the pixel electrode; and a common electrode formed on the organic light emitting layer. | 06-17-2010 |
| 20100148193 | SYSTEMS AND METHODS FOR PACKAGING LIGHT-EMITTING DIODE DEVICES - Embodiments disclosed herein provide packaged LED devices in which the majority of the emitted light comes out the top of each LED chip with very little side emissions. Because light only comes out from the top, phosphor deposition and color temperature control can be significantly simplified. A package LED may include a housing positioned on a supporting submount, sized and dimensioned to accommodate a single LED chip or an array of LED chips. The LED chip(s) may be attached to the submount utilizing the Gold-to-Gold Interconnect (GGI) process or solder-based approaches. In some embodiments, phosphor may be deposited on top of the LED chip(s) or sandwiched between glass plates on top of the LED chip(s). The phosphor layer may be inside or on top of the housing and be secured to the housing utilizing an adhesive. The housing may be adhered to the submount utilizing a thermal epoxy. | 06-17-2010 |
| 20100155745 | MULTICHIP LIGHT-EMITTING DIODE - A multichip light-emitting diode (LED) includes a reflective cup, a plurality of light-emitting chips and a package. The light-emitting chips are disposed in the reflective cup and emit light when driven. The package is disposed in the reflective cup and covers the light-emitting chips. The package further has a plurality of lenses corresponding to the light-emitting chips one by one. The lenses refract light emitted by the corresponding light-emitting chips, respectively. An extrinsic light efficiency of the multichip is increased through the design of the multichip LED. | 06-24-2010 |
| 20100155746 | HIGH VOLTAGE LOW CURRENT SURFACE-EMITTING LED - A monolithic LED chip is disclosed comprising a plurality of junctions or sub-LEDs (“sub-LEDs”) mounted on a submount. The sub-LEDs are serially interconnected such that the voltage necessary to drive the sub-LEDs is dependent on the number of serially interconnected sub-LEDs and the junction voltage of the sub-LEDs. Methods for fabricating a monolithic LED chip are also disclosed with one method comprising providing a single junction LED on a submount and separating the single junction LED into a plurality of sub-LEDs. The sub-LEDs are then serially interconnected such that the voltage necessary to drive the sub-LEDs is dependent on the number of the serially interconnected sub-LEDs and the junction voltage of the sub-LEDs. | 06-24-2010 |
| 20100155747 | ORGANIC LIGHT EMISSION DIODE DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - An organic light emission diode (OLED) display device and a method of fabricating the same, wherein the OLED display device includes a substrate including a pixel region and a non-pixel region, a buffer layer disposed on the substrate, a semiconductor layer disposed on the buffer layer, and including a channel region and source/drain regions, a gate electrode disposed to correspond to the channel region of the semiconductor layer, a gate insulating layer insulating the semiconductor layer from the gate electrode, source/drain electrodes electrically connected to the source/drain regions of the semiconductor layer, and an interlayer insulating layer insulating the gate electrode from the source/drain electrodes, wherein areas of the buffer layer, the gate insulating layer and the interlayer insulating layer that are on the non-pixel region, respectively, are removed, and the partially removed area is 8% to 40% of a panel area. | 06-24-2010 |
| 20100163890 | LED LIGHTING DEVICE - An LED lighting device comprising an integral body comprising a dielectric thermally conductive polymer has an electrically conductive material directly attached to, or at least in part is molded within the body and forms a circuit pattern. Two or more LED die each having at least a portion thereof being attached directly either to one of a portion of the first body for direct thermal conduction or a portion of the electrically conductive material for direct electrical and thermal conduction or both. The integral body is optionally molded to have integral cooling surfaces such as fins. The integral body also may take a shape conforming to a mounting structure of a lighting fixture and may also include thereon additional electrical components for assisting the LED die in producing light, in other words drive components. Terminals may be integrally molded or formed in the body upon which a portion of the conductive material resides for electrical connection to another device such as a power source. | 07-01-2010 |
| 20100163891 | LIGHT EMITTING DIODE - An LED includes a substrate, two LED dies mounted on the substrate, an encapsulant molded on the substrate and sealing the two LED dies, and two phosphors contained within the encapsulant and surrounding the two LED dies, respectively. The two phosphors are distributed on the two LED dies in same density and different thicknesses, whereby the mixed light from one LED die and one phosphor has a color temperature different from that mixed from another LED die and another phosphor. | 07-01-2010 |
| 20100171129 | ACTIVE MATRIX SUBSTRATE, ELECTROPHORETIC DISPLAY APPARATUS, AND ELECTRONIC DEVICE - An active matrix substrate includes a substrate; a plurality of data lines provided on the substrate; a plurality of scanning lines provided to cross the data lines on the substrate when seen in a plan view; a thin film transistor that is electrically connected to one of the plurality of data lines and one of the plurality of scanning lines and has an organic semiconductor layer; a pixel electrode electrically connected to the thin film transistor; and a capacitive element electrically connected in parallel with the thin film transistor between the data line and the pixel electrode. | 07-08-2010 |
| 20100171130 | Semiconductor device and fabrication method - A semiconductor device comprising a plurality of regions of semiconductor material forming a junction at an interface there-between, the junction including a depletion region having a width which varies spatially in at least one direction along the depletion region. Without limitation, the spatial variation in depletion region width is provided by ionised dopants having a concentration which varies spatially along said at least one direction. Alternatively, or in addition, the spatial variation in depletion region width is achieved by varying the thickness of the region(s) of semiconductor spatially along said at least one direction, for example by creating a plurality of cells within said region(s) devoid of said semiconductor material. A method of fabricating a semiconductor device comprising the step of varying the width of the depletion region spatially there-within in at least one direction along the depletion region. | 07-08-2010 |
| 20100176404 | METHOD FOR FABRICATING HIGH-POWER LIGHT-EMITTING DIODE ARRAYS - One embodiment of the present invention provides a method for fabricating a high-power light-emitting diode (LED). The method includes etching grooves on a growth substrate, thereby forming mesas on the growth substrate. The method further includes fabricating indium gallium aluminum nitride (InGaAlN)-based LED multilayer structures on the mesas on the growth substrate, wherein a respective mesa supports a separate LED structure. In addition, the method includes bonding the multilayer structures to a conductive substrate. The method also includes removing the growth substrate. Furthermore, the method includes depositing a passivation layer and an electrode layer above the InGaAlN multilayer structures, wherein the passivation layer covers the sidewalls and bottom of the grooves. Moreover, the method includes creating conductive paths which couple a predetermined number of adjacent individual LEDs, thereby allowing the LEDs to share a common power supply and be powered simultaneously to form a high-power LED array. | 07-15-2010 |
| 20100176405 | Light Emitting Diode Lighting Package with Improved Heat Sink - Improved lighting packages are described for light emitting diode (LED) lighting solutions having a wide variety of applications which seek to balance criteria such as heat dissipation, brightness, and color uniformity. The present approach includes a backing of thermally conductive material. The backing includes a cell structure. The cell structure comprises a plurality of hollow cells contiguously positioned in a side by side manner. The present approach also includes an array of LEDs. The array of LEDs is mounted to a printed circuit board (PCB). The PCB is attached to the cell structure to balance heat dissipation and color uniformity of the LEDs. | 07-15-2010 |
| 20100187546 | VERTICAL GEOMETRY LIGHT EMITTING DIODE PACKAGE AGGREGATE AND PRODUCTION METHOD OF LIGHT EMITTING DEVICE USING THE SAME - There are provided a vertical geometry light emitting diode package aggregate useful for the production of a light emitting device having a vertical geometry light emitting diode as the light source, the light emitting device satisfying requirements in terms of current capacity flowed for light emission, dissipation of heat generated due to flow of a large current, resistance to thermal stress, strength of device and light emission efficiency, and a method for producing a light emitting device having a vertical geometry light emitting diode as the light source by using the package aggregate. The vertical geometry light emitting diode package comprises a metal sheet having formed thereon a number of vertical geometry light emitting diode package units, each package unit comprising two or more substrate portions as a part of the metal sheet, which are separated by a slit, and a reflector having a penetrating opening and being adhered to the two or more substrate portions to cover parts of the slit such that the vertical geometry light emitting diode-mounting position is exposed in the inner side of the opening and at the same time, the end part of the slit is exposed in the outer side of the reflector. | 07-29-2010 |
| 20100187547 | Image display apparatus - An image display apparatus displaying an image by selectively emitting light from a plurality of semiconductor light emitting elements being regularly arranged, includes a substrate; a first conductive wiring layer being formed on the substrate and supplying a first electric potential; a second conductive wiring layer supplying a second electric potential; the plurality of semiconductor light emitting elements each including a first electrode layer being electrically connected to the first conductive wiring layer and a second electrode layer being electrically connected to the second conductive wiring layer; and a plurality of raised parts being disposed on the substrate, each of the raised parts having an upper surface which is higher than an upper surface of the first conductive wiring layer; wherein the plurality of semiconductor light emitting elements is fixed on the plurality of raised parts respectively. | 07-29-2010 |
| 20100187548 | LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME AND MONOLITHIC LIGHT EMITTING DIODE ARRAY - A light emitting device including: at least one light emitting stack including first and second conductivity type semiconductor layers and an active layer disposed there between, the light emitting stack having first and second surfaces and side surfaces interposed between the first and second surfaces; first and second contacts formed on the first and second surface of the light emitting stack, respectively; a first insulating layer formed on the second surface and the side surfaces of the light emitting stack; a conductive layer connected to the second contact and extended along one of the side surfaces of the light emitting stack to have an extension portion adjacent to the first surface; and a substrate structure formed to surround the side surfaces and the second surface of the light emitting stack. | 07-29-2010 |
| 20100193806 | Light Emitting Diode Unit, Display Apparatus Having the Same and Manufacturing Method of the Same - Disclosed are a light emitting diode unit, a display apparatus having the same, and a method of manufacturing the same. The light emitting diode unit includes at least one light emitting diode, a quantum dot layer, and a buffer layer. The light emitting diode emits first light. The quantum dot layer is provided on the light emitting diode and includes a plurality of quantum dots that absorb the first light to emit second light having a wavelength different from a wavelength of the first light. The buffer layer is interposed between the light emitting diode and the quantum dot layer and separates the light emitting diode from the quantum dot layer. The buffer layer includes a scattering agent which is dispersed in resin to diffuse the light emitted from the light emitting diode. | 08-05-2010 |
| 20100193807 | LIGHT EMITTING DEVICE - A light emitting device is provided. The light emitting device comprises a substrate, a first lead frame and a second lead frame on the substrate, a first light emitting diode, a heat conductor on the substrate, and a heat transfer pad. The first light emitting diode on the first lead frame is electrically connected to the first lead frame and the second lead frame. The heat conductor is electrically separated from the first lead frame. The heat transfer pad contacts the first lead frame and the heat conductor thermally to connect the first lead frame to the heat conductor. | 08-05-2010 |
| 20100193808 | LIGHT EMITTING DEVICE HAVING A PLURALITY OF LIGHT EMITTING CELLS AND PACKAGE MOUNTING THE SAME - Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other. | 08-05-2010 |
| 20100200869 | METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE - A method of manufacturing a display device including the steps of: forming drive elements on a substrate; forming a planarization film in a position corresponding to each of the drive elements; forming a bottom electrode corresponding to each of the plurality of organic light emitting elements; forming a pixel isolation insulating film in a region between the bottom electrodes; forming an organic layer including a light emission layer above the bottom electrode by evaporation using an evaporation mask; and forming a top electrode over the organic layer. In the step of forming the bottom electrode includes the steps of: forming a bottom electrode material film; forming a photoresist film on the bottom electrode material film; exposing the photoresist film using the evaporation mask and developing it; and selectively removing the bottom electrode material film by etching using the photoresist film as a mask. | 08-12-2010 |
| 20100200870 | LIGHT-EMITTING DIODE DIE PACKAGE AND METHOD FOR PRODUCING SAME - The present invention relates to a light-emitting diode die package having an LED die and an accommodating housing. The LED die has a first doped layer doped with a p- or n-type dopant and a second doped layer doped with a different dopant from that doped in the first doped layer. Each of the first and second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is formed. The insulation layer is formed with exposure holes for exposing the electrodes corresponding thereto. Each of the exposure holes is formed inside with an electrically conductive linker. The accommodating housing has an open end through which an accommodating space is accessible. The LED die is positioned within the accommodating space in such a manner that the electrically conductive linker protrudes outwardly from the accommodating space. | 08-12-2010 |
| 20100200871 | Self-Light-Emitting Device and Method of Manufacturing the Same - Failure light emission of an EL element due to failure film formation of an organic EL material in an electrode hole | 08-12-2010 |
| 20100207129 | LIGHT EMITTING DIODE LIGHT SOURCE FOR EMITTING POLARIZED LIGHT - An exemplary light emitting diode (LED) light source includes a frame and light emitting units. The frame includes a supporting surface having a curved surface and one or more receiving holes configured in the curved surface. Each of the light emitting units is received in a respective receiving hole. Each of the light emitting units includes an LED die for generating light of two polarization states, a reflective polarizer for preferentially reflects one polarization state back into the LED die and preferentially transmitting the other polarization state out of the light emitting unit, a polarization converting film for converting the reflected light of the first polarization state into light of the second polarization state, and a reflective film for reflecting light of the converted second polarization state to the reflective polarizer. | 08-19-2010 |
| 20100207130 | ACTIVE MATRIX SUBSTRATE, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING ACTIVE MATRIX SUBSTRATE - An active matrix substrate | 08-19-2010 |
| 20100219423 | Light Receiving or Light Emitting Semiconductor Module - Multiple semiconductor elements in a semiconductor module in which multiple spherical light receiving or emitting semiconductor elements are installed can easily be retrieved, reused, or repaired. In a semiconductor module | 09-02-2010 |
| 20100219424 | ORGANIC EL DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - An organic EL display panel is provided which includes: a substrate which includes a plurality of luminescent regions which are arranged side by side in a specific direction and run in parallel to one another; a bank formed over the substrate, the bank defining a plurality of coating regions in each of the luminescent regions, the coating regions being aligned in a row along the long axis of the luminescent region; and a pixel electrode provided in each of the coating regions, the pixel electrode having a long axis which is in parallel with the long axis of the luminescent region, wherein, in each of the luminescent regions, the coating region positioned at a lengthwise end of the luminescent region is larger in size than the coating region positioned at a lengthwise center of the luminescent region. | 09-02-2010 |
| 20100219425 | LIGHT EMITTING DEVICE HAVING A PLURALITY OF LIGHT EMITTING CELLS CONNECTED IN SERIES AND METHOD OF FABRICATING THE SAME - Disclosed are a light emitting device having a plurality of light emitting cells connected in series and a method of fabricating the same. The light emitting device includes a buffer layer formed on a substrate. A plurality of rod-shaped light emitting cells are located on the buffer layer to be spaced apart from one another. Each of the light emitting cells has an n-layer, an active layer and a p-layer. Meanwhile, wires connect the spaced light emitting cells in series or parallel. Accordingly, arrays of the light emitting cells connected in series are connected to be driven by currents flowing in opposite directions. Thus, there is provided a light emitting device that can be directly driven by an AC power source. | 09-02-2010 |
| 20100219426 | LIGHT EMITTING DEVICE HAVING VERTICALLY STACKED LIGHT EMITTING DIODES - Disclosed is a light emitting device having vertically stacked light emitting diodes. It comprises a lower semiconductor layer of a first conductive type positioned on a substrate, a semiconductor layer of a second conductive type on the lower semiconductor layer of a first conductive type, and an upper semiconductor layer of a first conductive type on the semiconductor layer of a second conductive type. Furthermore, a lower active layer is interposed between the lower semiconductor layer of a first conductive type and the semiconductor layer of a second conductive type, and an upper active layer is interposed between the semiconductor layer of a second conductive type and the upper semiconductor layer of a first conductive type. Accordingly, there is provided a light emitting device having a structure in which a lower light emitting diode comprising the lower active layer and an upper light emitting diode comprising the upper active layer are vertically stacked. Therefore, light output per unit area of the light emitting device is enhanced as compared with a conventional light emitting device, and thus, a chip area of the light emitting device needed to obtain the same light output as the conventional light emitting device can be reduced. | 09-02-2010 |
| 20100237359 | FLAT AND THIN LED-BASED LUMINARY PROVIDING COLLIMATED LIGHT - A light-emitting device ( | 09-23-2010 |
| 20100237360 | LIGHT EMITTING DIODE AND BACK LIGHT MODULE THEREOF - A light emitting diode (LED) includes an LED chip, a substrate structure, a fluorescence layer, and a lens. The substrate structure includes a cavity. The fluorescence layer covers on the LED chip and is configured in the cavity and covering the LED chip. The lens is installed on the substrate structure. The lens includes a curved lateral wall, a plane at the top, and a conical concave portion at the top center. | 09-23-2010 |
| 20100237361 | WHITE LIGHT-EMITTING LAMP FOR ILLUMINATION AND ILLUMINATING DEVICE USING THE SAME - A white light emitting lamp | 09-23-2010 |
| 20100237362 | DISPLAY DEVICE AND PRODUCTION METHOD THEREOF - The present invention provides a display device capable of suppressing deterioration of characteristics of a display element even when a resin is used as a material for a substrate. A display device of the present invention comprises: a resin substrate; and
| 09-23-2010 |
| 20100237363 | Apparatus for Dissipating Thermal Energy Generated by Current Flow in Semiconductor Circuits - A thermal energy dissipating arrangement includes a semiconductor device and a thermally conductive medium. The semiconductor device includes a semiconductor circuit defining a semiconductor junction and encapsulating material in physical contact with and surrounding the semiconductor circuit. The thermally conductive medium defines an opening sized to receive the semiconductor device such that the thermally conductive medium defining the opening is in physical, thermally conductive contact with an exterior surface of the encapsulating material about the semiconductor device with the thermally conductive medium defining the opening intersecting an angle of less than or equal to a predefined angle relative to a plane defined by the semiconductor junction about a periphery of the semiconductor circuit. The thermally conductive medium absorbs thermal energy generated within the semiconductor device as a result of current flow through the semiconductor junction and rejects the absorbed thermal energy to an ambient environment surrounding the thermally conductive medium. | 09-23-2010 |
| 20100237364 | Thermal Energy Dissipating and Light Emitting Diode Mounting Arrangement - A thermal energy dissipating and LED mounting arrangement includes a plurality of LEDs and a thermally conductive sheet. The thermally conductive sheet has a length, a width and a thickness, and defines a plurality of openings through the thickness. Each of the plurality of openings is sized to receive and securely hold therein a different one of the plurality of LEDs such that the thermally conductive sheet defining the opening is in physical, thermally conductive contact with an exterior surface of at least one side portion of encapsulating material surrounding a corresponding one of the plurality of LEDs. The thermally conductive sheet carries the plurality of LEDs, and also absorbs thermal energy generated within each of the plurality of LEDs as a result of current flow through the LED circuit and rejects the absorbed thermal energy to an ambient environment surrounding the thermally conductive sheet. | 09-23-2010 |
| 20100244055 | SEMICONDUCTOR-BASED SUB-MOUNTS FOR OPTOELECTRONIC DEVICES WITH CONDUCTIVE PATHS TO FACILITATE TESTING AND BINNING - The disclosure facilitates testing and binning of multiple LED chip or other optoelectronic chip packages fabricated on a single semiconductor wafer. The testing can take place prior to dicing. For example, in one aspect, metallization on the front-side of a semiconductor wafer electrically connects together cathode pads (or anode pads) of adjacent sub-mounts such that the cathode pads (or anode pads) in a given column of sub-mounts are electrically connected together. Likewise, metallization on the back-side of the wafer electrically connects together anode pads (or cathode pads) of adjacent sub-mounts such that the anode pads (or cathode pads) in a given row of sub-mounts are electrically connected together. Probe pads, which can be located one or both sides of the wafer, are electrically connected to respective ones of the rows or columns. | 09-30-2010 |
| 20100244056 | Addressable Or Static Light Emitting, Power Generating Or Other Electronic Apparatus - The present invention provides an addressable or static electronic apparatus, such as a light emitting display or a power generating apparatus. An exemplary apparatus comprises a substrate having a plurality of cavities; a plurality of first conductors coupled to the substrate and at least partially within the cavities, with the plurality of first conductors having a first and substantially parallel orientation; a plurality of light emitting diodes, photovoltaic diodes or other electronic components coupled to the plurality of first conductors and having a second orientation substantially normal to the first orientation; and a plurality of substantially optically transmissive second conductors coupled to the plurality of diodes and having a third orientation substantially normal to the second orientation and substantially perpendicular to the first orientation. In an exemplary method, the plurality of electronic components in a suspending medium are deposited within the plurality of cavities, and the plurality of electronic components are oriented using an applied field, followed by a bonding of the plurality of electronic components to the plurality of first conductors. | 09-30-2010 |
| 20100244057 | ORGANIC LIGHT EMITTING DISPLAY DEVICE - An organic light emitting display device, including: a first substrate on which a plurality of light emitting elements are formed; a second substrate that is disposed to be opposed to the first substrate; a primary dam member that is provided between the first substrate and the second substrate in order to surround the plurality of light emitting elements; a filler that is filled between the first substrate and the second substrate and in a first region defined by the primary dam member, an auxiliary dam member that is between the first substrate and the second substrate and in a second region outside the first region, and is made of porous material; and an inorganic sealant that is provided between the first substrate and the second substrate and in a third region outside the first region and the second region, and is jointed to the first substrate and the second substrate. | 09-30-2010 |
| 20100244058 | Light emitting diode package - A light emitting diode package includes a substrate, a plurality of light emitting diode chips, a fluorescence layer, and a plurality of reflecting layers. The light emitting diode chips, the fluorescence layer, and the reflecting layers are disposed on the substrate. The fluorescence layer covers the light emitting diode chips, and the reflecting layers are disposed right above the light emitting diode chips, respectively. | 09-30-2010 |
| 20100244059 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - An aspect of the present invention provides a semiconductor device, in which densely packaging and high performance of optical elements are realized by a simple manufacturing process. The semiconductor device includes: a first chip module, a second chip module and a bonding layer. The first chip module includes a plurality of optical chips that are bonded within a substantially same plane with a first resin layer. The second chip module includes a plurality of control semiconductor chips and a plurality of connecting chips. The connecting chips include conductive materials piercing through the connecting chips. The control semiconductor chips and the connecting chips are bonded within a substantially same plane with a second resin layer. And the optical chips and the control semiconductor chips are electrically connected through the connecting chips. | 09-30-2010 |
| 20100244060 | LIGHT EMITTING DEVICE HAVING A PLURALITY OF LIGHT EMITTING CELLS AND PACKAGE MOUNTING THE SAME - Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other. | 09-30-2010 |
| 20100252839 | DISPLAY AND METHOD OF MANUFACTURING THE SAME - A display includes: a light-emitting element formed by laminating a first electrode layer, an organic layer including a light-emitting layer and a second electrode layer in order on a base; and an auxiliary wiring layer being arranged so as to surround the organic layer and being electrically connected to the second electrode layer, in which the auxiliary wiring layer includes a two-layer configuration including a first conductive layer and a second conductive layer, the first conductive layer has lower contact resistance to the second electrode layer than that of the second conductive layer, the two-layer configuration in the auxiliary wiring layer is formed so that an end surface of the second conductive layer is recessed inward from an end surface of the first conductive layer, thereby a part of a top surface of the first conductive layer is in contact with the second electrode layer. | 10-07-2010 |
| 20100252840 | HIGH VOLTAGE LOW CURRENT SURFACE EMITTING LED - An LED chip comprising a plurality of sub-LEDs on a submount. Electrically conductive and electrically insulating features are included that serially interconnect the sub-LEDs such that an electrical signal applied to the serially interconnected sub-LEDs along the electrically conductive features spreads to the serially interconnected sub-LEDs. A via is included that is arranged to electrically couple one of the sub-LEDs to the submount. The sub-LED can be interconnected by more than one of the conductive features, with each one of the conductive features capable of spreading an electrical signal between the two of the sub-LEDs. | 10-07-2010 |
| 20100258820 | MANUFACTURING METHOD FOR CONTACT PADS OF A THIN FILM TRANSISTOR ARRAY PANEL, AND A THIN FILM TRANSISTOR ARRAY PANEL HAVING SUCH CONTACT PADS - A thin film transistor array panel includes a first insulation substrate, a plurality of data wires formed on the first insulation substrate and extending in a first direction, a data pad region formed on the first insulation substrate and having plural ones of the data wires extending therefrom, and an organic layer formed on the data wires, where the organic layer has a greater thickness where it is disposed over the data wires than the thickness it has between the data wires. The surface of the organic layer of the data pad region includes minute slit patterns that extend parallel to the first direction of the data wires, and the data wires have line boundaries of a zigzag shape. | 10-14-2010 |
| 20100258821 | CONCAVE-HEMISPHERE-PATTERNED ORGANIC TOP-LIGHT EMITTING DEVICE - A first device is provided. The first device includes an organic light emitting device, which further comprises a first electrode, a second electrode, and an organic emissive layer disposed between the first and second electrode. Preferably, the second electrode is more transparent than the first electrode. The organic emissive layer has a first portion shaped to form an indentation in the direction of the first electrode, and a second portion shaped to form a protrusion in the direction of the second electrode. The first device may include a plurality of organic light emitting devices. The indentation may have a shape that is formed from a partial sphere, a partial cylinder, a pyramid, or a pyramid with a mesa, among others. The protrusions may be formed between adjoining indentations or between an indentation and a surface parallel to the substrate. | 10-14-2010 |
| 20100258822 | SEMICONDUCTOR LIGHT-EMITTING DEVICE ASSEMBLY MANUFACTURING METHOD, SEMICONDUCTOR LIGHT-EMITTING DEVICE, ELECTRONIC DEVICE, AND IMAGE DISPLAY DEVICE - A method of manufacturing a semiconductor light-emitting device assembly includes providing light-emitting device portions on a light-emitting device production substrate so as to be separated from each other, each of the light-emitting device portions including a laminated structure, in which a first compound semiconductor layer, an active layer, and a second compound semiconductor layer are sequentially laminated, and a second electrode provided on the second compound semiconductor layer; forming an insulating layer on an entire surface so as to have an opening portion in which a top central portion of the second electrode is exposed; providing an extraction electrode to each light-emitting device portion so as to be patterned to extend from a top surface of the second electrode to the insulating layer; and forming an adhesive layer so as to cover an entire surface and attaching a support substrate using the adhesive layer. | 10-14-2010 |
| 20100264429 | LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE USING THE SAME - A light emitting device and an electronic device using the same are provided. The light emitting device includes a light emitting chip having a wavelength between 460 nm and 650 nm and phosphor powders, in which the phosphor powders can be stimulated by light emitted from the chip to emit light with a wavelength between 700 nm and 1200 nm. The phosphor powders are selected from the group consisting of Cu-doped CdS, Cu-doped SeS, Cu-doped CdTe and combinations thereof. | 10-21-2010 |
| 20100264430 | ORGANIC LIGHT EMITTING DEVICE - Provided is an organic light emitting device having a simple structure and enabling cost reduction. An organic light emitting device | 10-21-2010 |
| 20100270563 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, ACTIVE MATRIX DEVICE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS - A method of manufacturing a semiconductor device includes: forming, on one surface of a substrate, source electrodes and drain electrodes, a semiconductor layer provided between the source electrodes and the drain electrodes, and a gate insulator layer provided to cover a surface of the semiconductor layer; forming an insulator layer on a surface of the gate insulator layer, the insulator layer having through portions; and forming electrodes on the gate insulator layer around the bottom of the through portions and on the insulator layer in the vicinity of the through portions by a vapor film formation method simultaneously so as not to come into contact with each other, forming gate electrodes by using the electrodes formed on the gate insulator layer, and forming pixel electrodes electrically connected to the source electrodes or the drain electrodes by using the electrodes formed on the insulator layer. | 10-28-2010 |
| 20100270564 | LED PACKAGE AND BACKLIGHT UNIT USING THE SAME - The invention relates to an LED package having a large beam angle of light emitted from an LED, simplifying a shape of a lens and an assembly process, and to a backlight unit using the same. The LED package includes a housing with a seating recess formed therein and at least one LED seated in the seating recess. The LED package also includes a lens having a predetermined sag on an upper side thereof, covering an upper part of the LED. The LED package and the backlight unit using the same can emit light uniformly without bright spots formed in an output screen, uses a simpler shaped lens with an increased beam angle, and minimizes a color mixing region to achieve miniaturization. | 10-28-2010 |
| 20100270565 | SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - The invention provides a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts, and N semiconductor light-emitting die modules, wherein N is a positive integer lager than or equal to 1. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts. | 10-28-2010 |
| 20100276705 | SOLID STATE LIGHTING DEVICE WITH AN INTEGRATED FAN - A solid state lighting device includes a light source having one or more solid state light emitting cells. The solid state lighting device also includes a fan to cool the light emitting cells. | 11-04-2010 |
| 20100283064 | NANOSTRUCTURED LED ARRAY WITH COLLIMATING REFLECTORS - The present invention relates to nanostructured light emitting diodes, LEDs. The nanostructured LED device according to the invention comprises an array of a plurality of individual nanostructured LEDs. Each of the nanostructured LEDs has an active region wherein light is produced. The nanostructured device further comprise a plurality of reflectors, each associated to one individual nanostructured LED (or a group of nanostructured LEDs. The individual reflectors has a concave surface facing the active region of the respective individual nanostructured LED or active regions of group of nanostructured LEDs. | 11-11-2010 |
| 20100283065 | LED DEVICE WITH A LIGHT EXTRACTING ROUGH STRUCTURE AND MANUFACTURING METHODS THEREOF - The invention relates to a light emitting diode device having a light extracting rough structure. The device includes a leadframe, one or more light emitting diode chips provided on and electrically connected to the leadframe, and a lens configured to encapsulate the one or more light emitting diode chips, the lens having a surface including a micro-roughness structure. The micro-roughness structure of the lens has a roughness between 0.1 μm and 50 μm. The invention also relates to a method of manufacturing a light emitting diode device having a light extracting rough structure. | 11-11-2010 |
| 20100283066 | LIGHT EMITTING DEVICE AND DISPLAY DEVICE USING THE SAME - A light emitting device ( | 11-11-2010 |
| 20100283067 | SEMICONDUCTOR ELEMENT AND DISPLAY DEVICE USING THE SAME - Provided is a semiconductor element including: a semiconductor having an active layer; a gate insulating film which is in contact with the semiconductor; a gate electrode opposite to the active layer through the gate insulating film; a first nitride insulating film formed over the active layer; a photosensitive organic resin film formed on the first nitride insulating film; a second nitride insulating film formed on the photosensitive organic resin film; and a wiring provided on the second nitride insulating film, in which a first opening portion is provided in the photosensitive organic resin film, an inner wall surface of the first opening portion is covered with the second nitride insulating film, a second opening portion is provided in a laminate including the gate insulating film, the first nitride insulating film, and the second nitride insulating film inside the first opening portion, and the semiconductor is connected with the wiring through the first opening portion and the second opening portion. | 11-11-2010 |
| 20100289037 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE - The present invention provides a semiconductor device having a plurality of MOS transistors with controllable threshold values in the same face and easy to manufacture, a manufacturing method thereof and a display device. The invention is a semiconductor device having a plurality of MOS transistors in the same face each having a structure formed by stacking a semiconductor active layer, a gate insulator, and a gate electrode, wherein the semiconductor device includes: an insulating layer stacked on a side opposite to a gate electrode side of the semiconductor active layer; and a conductive electrode stacked on a side opposite to a semiconductor active layer side of the insulating layer and extending over at least two of the plurality of MOS transistors. | 11-18-2010 |
| 20100295066 | SEMICONDUCTOR SUBSTRATE AND METHODS FOR THE PRODUCTION THEREOF - The invention relates to semiconductor substrates and methods for producing such semiconductor substrates. In this connection, it is the object of the invention to provide semiconductor substrates which can be produced more cost-effectively and with which a high arrangement density as well as good electrical conductivity and closed surfaces can be achieved. In accordance with the invention, an electrically conductive connection is guided from its front side through the substrate up to the rear side. The electrically conductive connection is completely surrounded from the outside. The insulator is formed by an opening which is filled with material. The inner wall is provided with a dielectric coating and/or filled with an electrically insulating or conductive material. The electrically conductive connection is formed with a further opening which is filled with an electrically conductive material and is arranged in the interior of the insulator. The openings are formed with step-free inner walls aligned orthogonally to the front side or tapering continuously in the direction of the rear side. | 11-25-2010 |
| 20100301353 | LED LIGHTING DEVICE HAVING A CONVERSION REFLECTOR - An LED lighting device is provided which may include at least one light-emitting diode and at least one conversion reflector, wherein the conversion reflector is configured to emit at least a portion of light emitted from the light-emitting diode at a converted wavelength, and wherein the conversion reflector covers the at least one light-emitting diode. | 12-02-2010 |
| 20100301354 | LIGHT EMISSION DEVICE AND DISPLAY DEVICE USING THE SAME - A light emission device includes: a substrate body having a plurality of concave portions recessed into the substrate body and extending along a first direction; a plurality of first electrodes in the plurality of concave portions and extending along the first direction; a plurality of electron emission units on the first electrodes; a plurality of second electrodes on a front surface of the substrate body and extending along a second direction crossing the first electrodes; a plurality of magnetic induction metallic films disposed between the front surface of the substrate body and the second electrodes to contact the front surface and the second electrodes; and a magnetic sheet on a rear surface of the substrate body. | 12-02-2010 |
| 20100301355 | Optoelectronic Component and Production Method for an Optoelectronic Component - An optoelectronic component includes a carrier element. At least two elements are arranged in an adjacent fashion on a first side of the carrier element. Each element has at least one optically active region for generating the electromagnetic radiation. The optoelectronic component has an electrically insulating protective layer arranged at least in part on a surface of the at least two adjacent elements which lies opposite the first side. The protective layer, at least in a first region arranged between the at least two adjacent elements, at least predominantly prevents a transmission of the electromagnetic radiation generated by the optically active regions. | 12-02-2010 |
| 20100308346 | LIGHT-EMITTING DIODE AND MODULE THEREOF - A light-emitting diode module includes a transparent base, a support and a plurality of light-emitting chips. The base has a plurality of cavities separated from each other by a predetermined distance in order to respectively receive the light-emitting chips to form light-exiting areas. The base has a reflecting portion opposite to the cavities. The reflecting portion is at least one inclined plane for reflecting light that have projected outside walls of the cavities to the peripheral area of the light-emitting areas in order to increase the uniformity of the light source. In addition, the light-emitting chips are arranged to form a line or surface light source of any sizes by adjusting the numbers of the cavity and the light-emitting chips. | 12-09-2010 |
| 20100308347 | Light Emitting Device - A light emitting device includes a plurality of micro diodes, which are electrically connected to constitute a bridge rectifier circuit. Each branch of the bridge rectifier circuit includes a single micro diode or a plurality of micro diodes. The light emitting device is electrically connected to an AC power source, which alternately drives the light emitting device in two current loops. Therefore, the micro diodes in two current loops of the bridge rectifier circuit emit light by turns. | 12-09-2010 |
| 20100308348 | LIGHT-EMITTING DEVICE AND THE MANUFACTURING METHOD THEREOF - The disclosure provides a light-emitting device comprising a light-emitting epitaxy structure. The light-emitting epitaxy structure has a modulus of a critical reverse voltage not less than 50 volts while the light-emitting epitaxy structure is reverse-biased at a current density of −10 μA/mm | 12-09-2010 |
| 20100308349 | LIGHT-EMITTING DIODE, METHOD FOR MAKING LIGHT-EMITTING DIODE, INTEGRATED LIGHT-EMITTING DIODE AND METHOD FOR MAKING INTEGRATED LIGHT-EMITTING DIODE, METHOD FOR GROWING A NITRIDE-BASED III-V GROUP COMPOUND SEMICONDUCTOR, LIGHT SOURCE CELL UNIT, LIGHT-EMITTING DIODE BACKLIGHT, AND LIGHT-EMITTING DIODE DISPLAY AND ELECTRONIC DEVICE - A light-emitting diode with (a) a substrate having at least one recessed portion on one main surface; (b) a sixth nitride-based III-V group compound semiconductor layer grown on the substrate without forming a space in the recessed portion; and (c) a third nitride-based III-V group compound semiconductor layer of a first conduction type, an active layer and a fourth nitride-based III-V group compound semiconductor layer of a second conduction type formed over the sixth nitride-based III-V group compound semiconductor layer, wherein, a dislocation occurring, in the sixth nitride-based III-V group compound semiconductor layer, from an interface with a bottom surface of the recessed portion in a direction vertical to the one main surface arrives at an inclined face or its vicinity of a triangle having the bottom surface of the recessed portion as a base and bends in a direction parallel to the one main surface. | 12-09-2010 |
| 20100308350 | LED Chip-Based Lighting Products And Methods Of Building - Light-emitting diode (LED) chip-based lighting products and methods of manufacture include patterning conductors on an inside surface of a panel, mounting a plurality of unpackaged LED chips directly on the conductors, and integrating the panel with support structure to form the lighting product such that an outside surface of the panel forms an exterior surface of the lighting product. A light emitting diode (LED)-based lighting product includes a panel having an inner surface and an outer surface, the outer surface forming an external surface of the lighting product, conductors patterned on the inner surface, and a plurality of LEDs mounted directly to the conductors. | 12-09-2010 |
| 20100308351 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A display device having a base substrate provided with light-emitting devices and terminal electrodes connected thereto; a sealing substrate disposed to face the base substrate; a first resin material between the base substrate and the sealing substrate so as to surround a first region in which the light-emitting devices are provided; and a second resin material between the base substrate and the sealing substrate and is filled in the first region surrounded by the first resin material so as to seal the light-emitting devices. | 12-09-2010 |
| 20100314633 | FRONT END SCRIBING OF LIGHT EMITTING DIODE (LED) WAFERS AND RESULTING DEVICES - A wafer of light emitting diodes (LEDs) is laser scribed to produce a laser scribing cut. Then, the wafer is cleaned, for example by wet etching, to reduce scribe damage. Then, electrical contact layers for the LEDs are formed on the wafer that has been cleaned. Alternatively, the scribing cut may be produced by multiple etches before contact formation. Related LEDs are also described. | 12-16-2010 |
| 20100314634 | PIXEL STRUCTURE AND MANUFACTURING METHOD THEREOF AND DISPLAY PANEL - A pixel structure and a manufacturing method thereof and a display panel are provided. An electrode material layer, a shielding material layer, an inter-layer dielectric material layer, a semiconductor material layer and a photoresist-layer are sequentially formed on a substrate. The semiconductor material layer, the inter-layer dielectric material layer, the shielding material layer and the electrode material layer are patterned using the photoresist-layer as a mask to form a semiconductor pattern, an inter-layer dielectric pattern, a shielding pattern and a pixel electrode. A source/drain electrically connected to the pixel electrode and covering a portion of the semiconductor pattern is formed on the pixel electrode. A channel is another portion of the semiconductor uncovered by the source/drain. A dielectric layer covering the source/drain, the semiconductor pattern, the inter-layer dielectric pattern, the shielding pattern and the pixel electrode and a gate disposed on the dielectric layer above the channel are formed. | 12-16-2010 |
| 20100314635 | CHIP ARRANGEMENT, CONNECTION ARRANGEMENT, LED AND METHOD FOR PRODUCING A CHIP ARRANGEMENT - A chip arrangement for an optoelectronic component includes at least one semiconductor chip which emits electromagnetic radiation, and a connection arrangement which includes planes that are electrically insulated from one another, at least one plane having a cavity and at least one plane being a heat dissipating plane, wherein at least two electrically insulated conductors are arranged in at least the two planes, the semiconductor chip is arranged within the cavity and has at least two connection locations, and each of the connection locations is electrically conductively connected to a respective one of the conductors. | 12-16-2010 |
| 20100314636 | ORGANIC LIGHT EMITTING DEVICE, DISPLAY UNIT INCLUDING THE SAME, AND ILLUMINATING DEVICE INCLUDING THE SAME - An organic light emitting device includes a first electrode and second electrode on a substrate. Light emitting units are positioned between the first and second electrodes. A first light emitting unit includes a first light emitting layer, and a second light emitting unit includes a second light emitting layer. The first electrode reflects light from at least one of the light emitting units to generate an interference pattern with light emitted from the first light emitting layer. The interference pattern has a plurality of interference positions such that a first interference position is located within the first light emitting layer, and a second interference position is located within the second light emitting layer. | 12-16-2010 |
| 20100314637 | HEAT RELEASING SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY APPARATUS INCLUDING THE SAME - A heat releasing semiconductor package, a method for manufacturing the same, and a display apparatus including the same. The heat releasing semiconductor package includes a film, an electrode pattern formed over the film, a semiconductor device mounted over the electrode pattern, and a first heat releasing layer formed over the semiconductor device including the electrode pattern, the first heat releasing layer including a first adhesive and a first heat releasing material. | 12-16-2010 |
| 20100320479 | LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME - A light emitting apparatus and a production method of the apparatus are provided that can emit light with less color unevenness at high luminance. The apparatus includes a light emitting device, a transparent member receiving incident light emitted from the device, and a covering member. The transparent member is formed of an inorganic material light conversion member including an externally exposed emission surface, and a side surface contiguous to the emission surface. The covering member contains a reflective material, and covers at least the side surfaces of the transparent member. Substantially only the emission surface serves as the emission area of the apparatus. It is possible to provide emitted light having excellent directivity and luminance. Emitted light can be easily optically controlled. In the case where each light emitting apparatus is used as a unit light source, the apparatus has high secondary usability. | 12-23-2010 |
| 20100320480 | PHOSPHOR CONVERTING IR LEDS - The production of light of various wavelengths using IR phosphor down conversion techniques using existing LED emissions to pump sensitizer-rare earth ions that emit at other wavelengths. A sensitizer absorbs an LED chip pump emission and then transfers that energy with high quantum efficiency to dopant ions that then emits at their characteristic wavelength. | 12-23-2010 |
| 20100320481 | ORGANIC ELECTROLUMINESCENCE DEVICE, DISPLAY UNIT INCLUDING THE SAME, AND METHOD OF MANUFACTURING AN ORGANIC ELECTROLUMINESCENCE DEVICE - An organic electroluminescence device includes a first electrode, an organic layer formed on the first electrode and including a light-emitting layer, an intermediate layer formed on the organic layer; and a second electrode formed on the intermediate layer and having a thickness of 6 nm or less. | 12-23-2010 |
| 20100320482 | LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A light emitting device comprises a substrate having a plurality of light emitting elements mounted thereon; a side wall structure having a partition wall portion separating a plurality of light emitting areas that each include at least one of the light emitting elements; and encapsulating resin filled in the light emitting areas to bury the light emitting elements therein. The side wall structure is separated by a space from the substrate at, at least, the partition wall portion so as to be in noncontact with the substrate, and the encapsulating resin is formed so as to integrally, continuously fill the light emitting areas and the space without producing any interface therein. | 12-23-2010 |
| 20100320483 | LIGHT-EMITTING DIODE APPARATUS - An LED apparatus includes a base having thermal conductivity, an insulative substrate provided on one surface of the base and including electrodes provided on a surface of the substrate, at least one base-mounting area that is an exposed part of the base, exposed within a pass-through hole provided in the substrate, a plurality of LED elements mounted on the base in the base-mounting area and some of the LED elements in a unit electrically connected to the electrodes in series, a plurality of the units are electrically connected in parallel, and a frame disposed to surround the base-mounting area and configured to form a light-emitting area. | 12-23-2010 |
| 20100320484 | Light Emitting Device, Electronic Appliance, and Method for Manufacturing Light Emitting Device - To provide a light emitting device that has a structure in which a light emitting element is sandwiched by two substrates to prevent moisture from penetrating into the light emitting element, and a method for manufacturing thereof. In addition, a gap between the two substrates can be controlled precisely. In the light emitting device according to the present invention, an airtight space surrounded by a sealing material with a closed pattern is kept under reduced pressure by attaching the pair of substrates under reduced pressure. A columnar or wall-shaped structure is formed between light emitting regions inside of the sealing material, in a region overlapping with the sealing material, or in a region outside of the sealing material so that the gap between the pair of substrates can be maintained precisely. | 12-23-2010 |
| 20100320485 | MULTI-CHIP PACKAGED LED LIGHT SOURCE - A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer. | 12-23-2010 |
| 20100327294 | LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND CONTROLLING LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME - An LED package structure for increasing light-emitting efficiency and controlling light-projecting angle includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area disposed on a top surface of the substrate body. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the top surface of the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area. The package unit has a translucent package resin body disposed on the top surface of the substrate body in order to cover the LED chips. The position of the translucent package resin body is limited in the resin position limiting space. | 12-30-2010 |
| 20100327295 | LED PACKAGE STRUCTURE WITH EXTERNAL CUTTING CHAMFER AND METHOD FOR MANUFACTURING THE SAME - An LED package structure includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area, and the substrate body has a cutting chamfer formed on one side thereof. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the substrate body by coating. A distance between an outermost side of the annular reflecting resin body and an outermost side of the substrate body is between 0 and 1.5 mm, and the annular reflecting resin body surrounds the LED chips to form a resin position limiting space. The package unit has a translucent package resin body for covering the LED chips, and the position of the translucent package resin body is limited in the resin position limiting space. | 12-30-2010 |
| 20100327296 | DISPLAY APPARATUS - Provided is a display apparatus which can easily bond a drive panel and a sealing panel together. The drive panel includes organic electroluminescence devices on a substrate for drive and extracts light from the side of the organic electroluminescence devices. The sealing panel includes a color filter on a substrate for sealing. The drive panel and the sealing panel are disposed to face each other, and the whole facing surfaces of the drive panel and the sealing panel are bonded together with an adhesive layer. The adhesive layer is cured with at least heat, and is made of only one coating liquid or a combination of two or more coating liquids for curing. A temporary fixing portion is formed in an edge portion of the adhesive layer. The temporary fixing portion is made of, for example, an ultraviolet cure resin, and is formed so as to straddle between the sealing panel and the drive panel to align their relative positions. | 12-30-2010 |
| 20110001148 | Thin flat solid state light source module - Thin, flat solid state light source device and methods for manufacturing is described. LED chips and their circuit boards are mounted on a thermal conductive substrate. The LED chips are surrounded with a flat layer of reflecting material which may embed the circuit boards. The LED chips and the reflecting layer is then topped with a layer of diffusion material and a layer of cover material. | 01-06-2011 |
| 20110006312 | LIGHT-EMITTING DEVICE - This disclosure discloses a light-emitting device, comprising a substrate having a first major surface and a second major surface; a plurality of light-emitting stacks on the first major surface; and at least one electronic device on the second major surface, wherein the light-emitting stacks are electrically connected to each other in series via a first electrical connecting structure; the electronic device are electrically connected to the light-emitting stacks via a second electrical connecting structure. | 01-13-2011 |
| 20110006313 | LIGHT EMITTING APPARATUS - Provided is a light emitting apparatus in which light extraction efficiency can be improved without adversely affecting a functional layer of a light emitting device. The light emitting apparatus includes multiple light emitting devices formed on a substrate, each of the multiple light emitting devices at least including: a reflective layer; a first electrode; the functional layer including an emission layer with an emission region; and a second electrode. In which an optical waveguide including a periodic structure is formed between the emission regions and the optical waveguide includes a surface which is opposite to the substrate and is more repellent to a light emitting material liquid for forming the emission layer than the emission region. | 01-13-2011 |
| 20110006314 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A plurality of rectangle semiconductor substrates are attached to a single mother glass substrate. A pixel structure is determined so that even if a gap or a an overlapping portion is generated in a boundary between a plurality of semiconductor substrates, a single-crystal semiconductor layer does not overlap with the gap or the overlapping portion. Two TFTs are located in a first unit cell including the first light emitting element, four TFTs are located in a second unit cell including the second light emitting element, and no TFT is located in a third unit cell including the third light emitting element. A boundary line is between the third unit cell and a fourth unit cell. | 01-13-2011 |
| 20110006315 | AC LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME - The present invention relates to an AC light emitting diode. An object of the present invention is to provide an AC light emitting diode wherein various designs for enhancement of the intensity of light, prevention of flickering of light or the like become possible, while coming out of a unified method of always using only one metal wire with respect to one electrode when electrodes of adjacent light emitting cells are connected through metal wires. To this end, the present invention provides an AC light emitting diode comprising a substrate; bonding pads positioned on the substrate; a plurality of light emitting cells arranged in a matrix form on the substrate; and a wiring means electrically connecting the bonding pads and the plurality of light emitting cells, wherein the wiring means includes a plurality of metal wires connecting an electrode of one of the light emitting cells with electrodes of other electrodes adjacent to the one of the light emitting cells. | 01-13-2011 |
| 20110012135 | LIGHT-EMITTING DEVICE AND REPAIRING METHOD THEREOF - A light-emitting device including a plurality of light-emitting units is provided. Each of the light-emitting units includes a first common electrode layer, a plurality of light-emitting layers, and a second common electrode layer. The first common electrode layer includes a bridge conductive line and a plurality of first electrode patterns electrically insulated from each other, in which the first electrode patterns cover a portion of the bridge conductive line and are electrically connected to each other through the bridge conductive line. Each of the light-emitting layers is disposed on one of the first electrode patterns. The second common electrode layer is disposed on the light-emitting layers, in which the first common electrode layer of each of the light-emitting units is electrically connected to the second common electrode layer of an adjacent light-emitting unit. | 01-20-2011 |
| 20110012136 | DISPLAY APPARATUS - Provided is a display apparatus whose light extraction efficiency is not reduced even when a film thickness error of an image display device is caused. The display apparatus includes a plurality of image display devices. Each of the image display devices includes at least: a stack ( | 01-20-2011 |
| 20110012137 | STRUCTURE OF AC LIGHT-EMITTING DIODE DIES - A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage. | 01-20-2011 |
| 20110012138 | Light-Emitting Diode Die Packages and Methods for Producing Same - The present invention relates to a light-emitting diode die package. The LED die package includes a semiconductor base, at least two electrodes disposed on an electrode mounting surface of the semiconductor base, an insulation layer formed on the electrode-mounting surface and provided with two through holes for exposing the electrodes, a conductor-forming layer formed on the insulation layer and provided with two conductor-mounting holes in communication with the through holes, and conductor units formed within the through holes and the conductor-mounting holes in a manner electrically connected to the corresponding electrodes. The LED die package further includes a covering layer formed on a surface of the LED die opposite to the electrode-mounting surface and extending to an outer surface of the LED die. The covering layer is made of transparent material doped with phosphor powder. | 01-20-2011 |
| 20110012139 | ORGANIC ELECTROLUMINESCENT DEVICE - An organic electroluminescent device with a configuration in which a functional layer, a transparent first electrode, alight emitting layer, and a second electrode are disposed in layer in this order, wherein a surface of the functional layer has a plurality of depressions and projections having a height of 0.5 μm to 100 μm, the surface being located on a side opposite to a side where the first electrode is, and the refractive index n | 01-20-2011 |
| 20110012140 | LIGHT EMITTING DIODE ARRANGEMENT - The invention relates to a light emitting diode arrangement comprising a first light emitting diode ( | 01-20-2011 |
| 20110018006 | MICRO-SIZED SEMICONDUCTOR LIGHT-EMITTING DIODE HAVING EMITTING LAYER INCLUDING SILICON NANO-DOT, SEMICONDUCTOR LIGHT-EMITTING DIODE ARRAY INCLUDING THE MICRO-SIZED SEMICONDUCTOR LIGHT-EMITTING DIODE, AND METHOD OF FABRICATING THE MICRO-SIZED SEMICONDUCTOR LIGHT-EMITTING DIODE - A micro-sized semiconductor light-emitting diode includes an emission material layer formed on a silicon substrate, and including a silicon nano-dot; a hole injecting layer and an electron injecting layer that face each other, wherein the hole injecting layer and an electron injecting layer are formed between the emission material layer; a transparent conductive electrode layer formed on the electron injecting layer; and a first electrode and a second electrode that respectively inject a current in the hole injecting layer and the transparent conductive electrode layer from the outside. | 01-27-2011 |
| 20110018007 | ELECTRONIC DEVICE, DISPLAY APPARATUS, AND ELECTRONIC DEVICE MANUFACTURING METHOD - Provided is a solution for narrowing of a light emitting region, increasing of leak current at an edge of a functional layer, peeling of the functional layer, or the like caused by non-uniform thickness of the functional layer at the edges thereof. Provided is an electronic device comprising a substrate; a conductive functional layer formed on the substrate; and an edge covering layer that covers edges of the functional layer, wherein the functional layer includes a functional region that is not covered by the edge covering layer. This functional layer may include a non-functional region that is made non-functional by covering the functional layer with the edge covering layer. The edge covering layer may be adhered to the substrate by an adhesion force that is greater than an adhesion force between the substrate and the functional layer. | 01-27-2011 |
| 20110018008 | Organic light emitting diode display and method for manufacturing the same - An organic light emitting diode display comprises a display substrate including an organic light emitting element, an encapsulation substrate disposed to face the display substrate, a sealant disposed between edges of the display substrate and the encapsulation substrate for bonding and sealing the display substrate and the encapsulation substrate together, a filler filling in a space between the display substrate and the encapsulation substrate, first spacers formed on one surface of the display substrate contacting the filler, and second spacers formed on one surface of the encapsulation substrate contacting the filler. The display substrate and the encapsulation substrate are divided into a dropping area and a spreading area surrounding the dropping area and positioned relatively close to the sealant, and either or both of the first spacers and the second spacers have different shapes in the dropping area and in the spreading area. | 01-27-2011 |
| 20110018009 | Light-Emitting Device - A light-emitting device comprising a light-emitting layer ( | 01-27-2011 |
| 20110018010 | INFRARED LIGHT EMITTING DEVICE - Provided is an infrared light emitting device in which dark current and diffusion current caused by thermally excited holes are suppressed. Thermally excited carriers (holes) generated in a first n-type compound semiconductor layer ( | 01-27-2011 |
| 20110024772 | ELECTRICAL CONNECTION FOR SEMICONDUCTOR STRUCTURES, METHOD FOR THE PRODUCTION THEREOF, AND USE OF SUCH A CONNECTION IN A LUMINOUS ELEMENT - The invention relates to a method for electrically contacting an arrangement of a plurality of semiconductor structures comprising contact regions therefor and emitting electromagnetic radiation when a voltage is applied thereto. According to said method, a viscous, hardenable material is applied to the arrangement of a plurality of semiconductor structures and hardened to form a material web. The invention also relates to a luminous element comprising a plurality of semiconductor structures ( | 02-03-2011 |
| 20110031510 | ENCAPSULATED LENS STACK - A wafer scale package includes two or more substrates (wafers) that are stacked in an axial direction and a plurality of replicated optical elements. An optical device includes one or more optical elements. The wafer scale package and the device include one or more cavities that house the optical elements, while the end faces of the package or the device are planar and do not have replicated optical elements thereon. The number of double sided substrates is reduced, and design and manufacture of the optical device is improved. | 02-10-2011 |
| 20110031511 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME - An organic light emitting diode display and a method of manufacturing the same are disclosed. The organic light emitting diode display includes a substrate, a first electrode positioned on the substrate, an organic light emitting layer positioned on the first electrode, and a second electrode positioned on the organic light emitting layer. The organic light emitting layer includes an inorganic oxide layer between a light emitting layer and a common layer. | 02-10-2011 |
| 20110031512 | THIN FILM TRANSISTOR SUBSTRATE - A thin film transistor substrate, capable of being assembled, is attached to a filter substrate to provide a semi-finished liquid crystal display panel. The thin film transistor substrate includes a base substrate with thin film transistors formed thereon, wiring assemblies formed on the substrate and electrically connected to the corresponding thin film transistors selectively, metal sheets formed on the base substrate, a protection layer formed on the thin film transistors, the wiring assemblies, and the metal sheets, and a buffer module formed on the protection layer. The buffer module is positioned above a projection of a cutting line onto the base substrate, and the surplus materials of the filter substrate are removed along the cutting line. | 02-10-2011 |
| 20110031513 | WATERPROOF SMD LED MODULE AND METHOD OF MANUFACTURING THE SAME - A surface-mount device (SMD) light emitting diode (LED) module includes a leadframe, an LED chip, a waterproof protective film and a sealing material. The leadframe includes a plurality of leads and the LED chip is fixed on one of the leads. The waterproof protective film covers the LED chip and a portion of the leadframe, and exposes a portion of the leadframe for connecting to a circuit board. The sealing material is also formed on the leadframe to cover the LED chip. In addition, a method of manufacturing the SMD LED module is provided. | 02-10-2011 |
| 20110031514 | DISPLAY APPARATUS - There is provided a display apparatus that can improve the protective function and light utilization efficiency of organic EL devices and that has a simple structure. The display apparatus includes a plurality of organic EL devices formed on a substrate and a protective layer formed on the organic EL devices. The protective layer includes a first protective layer made of an inorganic material, a second protective layer made of a resin and having a microlens formed therein, and a third protective layer made of an inorganic material. | 02-10-2011 |
| 20110037079 | Structure and method for fabricating fluorescent powder gel light emitting module - The present invention relates to a structure and a method for fabricating a fluorescent powder gel light emitting module. A circuit is arranged on a surface of the circuit board, and a plurality of wire connection points is arranged thereon for providing the electrical connection to the electronic components and the light emitting diodes respectively with the circuit board. A plastic ring is formed on an outer portion of the light emitting diodes on the surface of the circuit board to form a specific region and coat the fluorescent powder gel onto the surface of the circuit board in the specific region between every visible light emitting face of the plurality of light emitting diodes and the adjacent region of every light emitting diode, and further to bake for forming a light emitting module to produce light overlapping region by the side light between every adjacent light emitting diode to further produce an extended light source plane to effectively gain a high light emitting efficiency, higher brightness and even irradiation of the radiated light. | 02-17-2011 |
| 20110037080 | METHODS FOR COMBINING LIGHT EMITTING DEVICES IN A PACKAGE AND PACKAGES INCLUDING COMBINED LIGHT EMITTING DEVICES - Methods of forming a light emitting device package assembly include defining a chromaticity region in a two dimensional chromaticity space within a 10-step MacAdam ellipse of a target chromaticity point, and subdividing the defined chromaticity region into at least three chromaticity subregions, providing a plurality of light emitting devices that emit light having a chromaticity that falls within the defined chromaticity region, selecting at least three of the plurality of light emitting devices, wherein each of the three light emitting devices emits light from a different one of the chromaticity subregions. The at least three light emitting devices are selected from chromaticity subregions that are complementary relative to the target chromaticity point to at least one other chromaticity subregion from which a light emitting device is selected. | 02-17-2011 |
| 20110042690 | LIGHT EMITTING DIODE PACKAGE - The present invention provides a light emitting diode package including: a package mold having a first cavity and a second cavity with a smaller size than that of the first cavity; first and second electrode pads provided on the bottom surfaces of the first cavity and the second cavity, respectively; an LED chip mounted on the first electrode pad; a wire for providing electrical connection between the LED chip and the second electrode pad; and a molding material filled within the first cavity and the second cavity. | 02-24-2011 |
| 20110042691 | ORGANIC ELECTROLUMINESCENT DISPLAY AND MANUFACTURING METHOD THEREFOR - This invention provides a means for suppressing streaks of light emission in an organic EL display having an organic light-emitting layer formed by coating by an ink jet method. A manufacturing process of the organic EL display of this invention includes: preparing a display substrate having two or more linear banks in parallel to each other, and two or more pixel regions arranged in a region between the linear banks; arranging an ink jet head such that the alignment direction of nozzles and the line direction of the linear banks are in parallel; and relatively moving the ink jet head in a direction perpendicular to the line direction of the linear banks and discharging the ink from the nozzles to apply the ink to every region defined by the linear banks. | 02-24-2011 |
| 20110042692 | ACTIVE MATRIX SUBSTRATE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC DEVICE - An active matrix substrate is provided which does not cause reductions in the brightness of electroluminescence elements, and which comprises appropriate peripheral circuitry occupying a small area. The active matrix substrate comprises peripheral circuits to supply current to EL elements provided for each pixel, and corresponding to EL elements, and further comprises a holding element (C) which holds a control voltage, a first active element (T | 02-24-2011 |
| 20110042693 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device ( | 02-24-2011 |
| 20110042694 | LIGHT-EMITTING ELEMENT AND DISPLAY PANEL - Light extraction efficiency is improved as a whole light emitting element. A light emitting element ( | 02-24-2011 |
| 20110042695 | LIGHT EMITTING DEVICE AND DISPLAY PANEL - Organic semiconductor layers include between a first electrode and a photoelectric converting layer a light extraction improving layer that contains at least silver or gold in part as a component, partially reflects light, and has transparency. The light extraction improving layer is in contact with or is inserted into a functional layer containing, for example, an organic semiconductor material, an oxide, a fluoride, or an inorganic compound having strong acceptor properties or strong donor properties with an ionization potential of 5.5 eV or higher, within the organic semiconductor layers. | 02-24-2011 |
| 20110049536 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING SAME - An exemplary light emitting diode package includes a housing, and a light emitting unit received in the housing. The light emitting unit includes a first carbon nanotube layer, a plurality of spaced light emitting chips, and a second carbon nanotube layer. The light emitting chips are formed on the first carbon nanotube layer. The second carbon nanotube layer covers the light emitting chips. | 03-03-2011 |
| 20110049537 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME - Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a plurality of light emitting cells including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a first electrode layer connected to the first conductive semiconductor layer of a first light emitting cell of the plural light emitting cells; a plurality of second electrode layers under the light emitting cells, a portion of the second electrode layers being connected to the first conductive semiconductor layer of an adjacent light emitting cells; a third electrode layer disposed under a last light emitting cell of the plural light emitting cells; a first electrode connected to the first electrode layer; a second electrode connected to the third electrode layer; an insulating layer around the first to third electrode layers; and a support member under the insulating layer. | 03-03-2011 |
| 20110049538 | FLIP CHIP LED DIE AND ARRAY THEREOF - A flip chip LED die is provided and includes a first type doped layer, a second type doped layer, a first electrode layer, a second electrode layer and an insulation layer. The second type doped layer is disposed under the first type doped layer. The first electrode layer is disposed under the first type doped layer without contacting the second type doped layer. The first electrode layer has an exposed area for directly coating an electrically conductive adhesive thereon. The second metal/electrode layer is disposed under the second type doped layer, and also has an exposed area for directly coating the electrically conductive adhesive thereon. The insulation layer is disposed between the first electrode layer and the second electrode layer for electrically insulating and supporting the first electrode layer and the second electrode layer. | 03-03-2011 |
| 20110057207 | WHITE-LIGHT EMITTING DEVICE - An white-light emitting device including a carrier, light emitting diode (LED) chips, and a wavelength converting material is provided. The LED chips are disposed on and electrically connected to the carrier. An equivalent wavelength of the first light emitted from the LED chips and divided into groups is λ. A variation of peak wavelengths of the LED chips in one group is smaller than 5 nm. λ meets an equation: | 03-10-2011 |
| 20110057208 | LIGHT EMITTING DISPLAY DEVICE - Provided is an organic light emitting display device sealed maintaining durability by preventing permeation of oxygen and moisture and improving impact resistance. The light emitting display device includes a first substrate; a second substrate disposed facing toward the first substrate; an emission unit disposed between the first substrate and the second substrate and comprising a plurality of light emitting devices; a first sealant disposed between the first substrate and the second substrate, and surrounding the emission unit and combining the first substrate and the second substrate; a first region formed between around a flat portion of the first sealant and a margin of the second substrate; a second region formed between around a corner of the first sealant and a margin of the second substrate; a second sealant disposed in the first region; and a third sealant disposed in the second region. | 03-10-2011 |
| 20110057209 | LIGHT EMITTING DEVICE - Provided are a light emitting device. The light emitting device comprises a package body, an insulating layer on a surface of the package body, first and second electrode layers on the insulating layer, a light emitting diode disposed on the package body and electrically connected to the first and second electrode layers, a resistor layer connected to the first electrode layer, a first element part in a first doping region within the package body, a second element part in a second doping region within the package body, and a third electrode layer connected to the first element part and the second element part. | 03-10-2011 |
| 20110057210 | ORGANIC ELECTROLUMINESCENCE DEVICE AND METHOD FOR PRODUCING THE SAME - To provide an organic electroluminescence device including: a plurality of organic electroluminescence display portions, each of which includes at least an anode, a light-emitting layer and a cathode; a plurality of lenses which are placed over the organic electroluminescence display portions, and each of which controls an optical path of light emitted from the light-emitting layer; and a plurality of filter layers, each of which is formed integrally with each lens and placed so as to cover the optical path in each lens, and transmits the light emitted from the light-emitting layer, wherein the filter layer formed integrally with one lens among the lenses absorbs at least light with a peak wavelength among light which has passed through at least one of lenses that are adjacent to the one lens. | 03-10-2011 |
| 20110062454 | LIGHT EMITTING DEVICE HAVING REMOTELY LOCATED LIGHT SCATTERING MATERIAL - A light emitting device with a remotely located light scattering material which improves color mixing property is provided. The light emitting device includes a substrate defining a cavity; one or more light emitting elements bonded to the substrate and positioned in the cavity; at least one first layer covering the one or more light emitting elements, at least part of the at least one first layer within the cavity, wherein the at least one first layer has a refractive index less than the refractive index of the one or more light emitting elements; and at least one second layer including light scattering material disposed on the at least one first layer, wherein the refractive index of the first layer is less than or equal to the refractive index of the second layer. | 03-17-2011 |
| 20110062455 | OPTOELECTRONIC COMPONENT - Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components. | 03-17-2011 |
| 20110062456 | LIGHT-EMITTING DEVICE - This disclosure discloses a light-emitting device. The light-emitting device comprises: a substrate; and a first light-emitting unit comprising a plurality of light-emitting diodes electrically connected to each other on the substrate. A first light-emitting diode in the first light-emitting unit comprises a first semiconductor layer with a first conductivity-type, a second semiconductor layer with a second conductivity-type, and a light-emitting stack formed between the first and second semiconductor layers. The first light-emitting diode in the first light-emitting unit further comprises a first connecting layer on the first semiconductor layer for electrically connecting to a second light-emitting diode in the first light-emitting unit; a second connecting layer, separated from the first connecting layer, formed on the first semiconductor layer; and a third connecting layer on the second semiconductor layer for electrically connecting to a third light-emitting diode in the first light-emitting unit. | 03-17-2011 |
| 20110062457 | SEMICONDUCTOR LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, IMAGE DISPLAY DEVICE, AND ELECTRONIC APPARATUS - A semiconductor light emitting device including an active layer, a compound semiconductor layer on the active layer, a contact layer on the compound semiconductor layer, and an electrode on the contact layer, where the contact layer is substantially the same size as the electrode. | 03-17-2011 |
| 20110062458 | LIGHT EMITTING PANEL AND MANUFACTURING METHOD OF LIGHT EMITTING PANEL - Disclosed is a light emitting panel including: a light blocking section formed above a substrate, the light blocking section including an opening; a first electrode formed above the opening of the light blocking section; a dividing wall including an opening so that at least a portion of the first electrode is exposed, the opening corresponding to a shape of the opening of the light blocking section; a second electrode formed above the first electrode; and a carrier transport layer composed of at least one layer formed between the first electrode and the second electrode. | 03-17-2011 |
| 20110062459 | AC LIGHT EMITTING DIODE HAVING FULL-WAVE LIGHT EMITTING CELL AND HALF-WAVE LIGHT EMITTING CELL - The present invention discloses an alternating current (AC) light emitting diode (LED) having half-wave light emitting cells and full-wave light emitting cells. The AC LED has a plurality of light emitting cells electrically connected between bonding pads on a single substrate. The AC LED includes a first row of half-wave light emitting cells each having an anode terminal and a cathode terminal, a second row of full-wave light emitting cells each having an anode terminal and a cathode terminal, and a third row of half-wave light emitting cells each having an anode terminal and a cathode terminal. In the AC LED, the second row is arranged between the first row and the third row, and the third row includes a pair of light emitting cells that share a cathode terminal with each other. The cathode terminal shared by the pair of light emitting cells in the third row is electrically connected to the anode terminal of a corresponding light emitting cell of the half-wave light emitting cells in the first row through a conductor that is electrically insulated from the full-wave light emitting cells in the second row. | 03-17-2011 |
| 20110062460 | ORGANIC EL LIGHT EMITTING ELEMENT, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE - An organic EL light emitting element is provided with a conductive transparent electrode | 03-17-2011 |
| 20110062461 | ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE - An organic EL display device of active matrix type wherein insulated-gate field effect transistors formed on a single-crystal semiconductor substrate are overlaid with an organic EL layer; characterized in that the single-crystal semiconductor substrate ( | 03-17-2011 |
| 20110073876 | LIGHT-EMITTING DEVICE AND DISPLAY - A light-emitting device allowed to obtain polarized light without increasing the number of components or the thickness thereof, and a display including the light-emitting device are provided. The light-emitting device includes: a light-emitting element including, on a substrate, a first electrode, a light-emitting layer and a second electrode in order from the substrate. The substrate has, on a surface facing the first electrode, a first concavo-convex structure including a plurality of strip-shaped protrusion sections with a width equal to or smaller than an upper wavelength limit of visible light, and the first electrode, the light-emitting layer and the second electrode each have, on a surface opposite to a surface facing the substrate, a second concavo-convex structure imitating the protrusion sections of the first concavo-convex structure. | 03-31-2011 |
| 20110073877 | HIGH-CURRENT/LOW COST READ-IN INTEGRATED CIRCUIT - A Read-In Integrated Circuit scene generator incorporates an array of unit cells, with each cell having a switching control circuit. An array of emitting elements is associated with the unit cells and each element is connected with a lead to the switching control circuit of the associated cell. A first electrically conducting overlayer is deposited substantially covering the array of unit cells and connected for current supply. Each emitting element is connected to the first conducting overlayer and the first conducting overlayer includes vias through which each connecting lead from the emitting element to the switching control circuit extends. A second electrically conducting overlayer is deposited substantially covering the array of unit cells and connected for current return. Each switching control circuit is connected to the second conducting overlayer. The second conducting overlayer also has vias through which each lead from the emitting element extends to the switching circuit. | 03-31-2011 |
| 20110073878 | LED ARRAY PACKAGE COVERED WITH A HIGHLY THERMAL CONDUCTIVE PLATE - A light source includes a substrate, a light emitting diode on the substrate, and a phosphor layer over the light emitting diode. A plate is on the phosphor layer. An attachment member is coupled to the plate and is configured to conduct heat away from the plate. | 03-31-2011 |
| 20110073879 | LIGHT-EMITTING DEVICE HAVING LIGHT-EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs ( | 03-31-2011 |
| 20110073880 | GLASS PLATE WITH GLASS FRIT STRUCTURE - A light emitting device includes: a first substrate; a second substrate; a light emitting unit interposed between the first substrate and the second substrate; and a sealing material bonding the first substrate to the second substrate and sealing the light emitting unit. The sealing material comprises V | 03-31-2011 |
| 20110073881 | LEDs USING SINGLE CRYSTALLLINE PHOSPHOR AND METHODS OF FABRICATING SAME - Methods for fabricating LED chips from a wafer and devices fabricated using the methods with one method comprising depositing LED epitaxial layers on an LED growth wafer to form a plurality of LEDs on the growth wafer. A single crystalline phosphor is bonded over at least some the plurality of LEDs so that at least some light from the covered LEDs passes through the single crystalline phosphor and is converted. The LED chips can then be singulated from the wafer to provide LED chips each having a portion of said single crystalline phosphor to convert LED light. | 03-31-2011 |
| 20110073882 | System for Wafer-Level Phosphor Deposition - System for wafer-level phosphor deposition. In an aspect, a semiconductor wafer is provided that includes a plurality of LED dies wherein at least one die includes an electrical contact, a photo-resist post covering the electrical contact, and a phosphor deposition layer covering the semiconductor wafer and surrounding the photo-resist post. In another aspect, a semiconductor wafer is provided that comprises a plurality of LED dies wherein at least one die comprises an electrical contact, a phosphor deposition layer covering the semiconductor wafer, and a cavity in the phosphor deposition layer exposing the at least one electrical contact. | 03-31-2011 |
| 20110073883 | LED LAMP - An LED lamp A | 03-31-2011 |
| 20110079797 | DISPLAY DEVICE - A display device includes an array of pixels including a plurality of organic EL elements each having a pair of electrodes and an organic compound layer including a light-emitting layer and disposed between the pair of electrodes and includes a protective layer disposed on the plurality of the organic EL elements. The protective layer has a first protective layer made of an inorganic material, a second protective layer made of a resin material and disposed on the first protective layer, and a third protective layer made of an inorganic material and disposed on the second protective layer. The second protective layer includes lenses for diverging at least part of light emitted from the light-emitting layer. The lenses have an elongated concave shape. | 04-07-2011 |
| 20110084287 | Organic light emitting diode display and method for manufacturing the same - An organic light emitting diode display includes a display substrate including organic light emitting diodes and a pixel defining layer having openings for defining respective light emitting regions of the organic light emitting diodes, an encapsulation substrate disposed to face the display substrate, a sealant disposed along the edge of the encapsulation substrate and bonding and sealing the display substrate and the encapsulation substrate together, and a filling material for filling the space between the display substrate and the encapsulation substrate. The pixel defining layer is divided into a plurality of deposit regions having a relatively small height and that are uniformly distributed, and a diffusion region surrounding the plurality of deposit regions and having a larger height than that of the plurality of deposit regions. | 04-14-2011 |
| 20110084288 | Organic light emitting diode display and method of manufacturing the same - An organic light emitting diode (OLED) display includes a substrate, a first electrode on the substrate, an emission layer on the first electrode, and a second electrode on the emission layer, the second electrode including a transflective conductive layer and a conductive oxide layer. | 04-14-2011 |
| 20110089440 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME - Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a first chip structure including a first reflective layer and a first light emitting structure having a plurality of compound semiconductor layers on the first reflective layer; a second chip structure bonded onto the first chip structure and including a second reflective layer and a second light emitting structure having a plurality of compound semiconductor layers on the second reflective layer; and an electrode on the second chip structure. | 04-21-2011 |
| 20110095310 | SEMICONDUCTOR LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME - Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module ( | 04-28-2011 |
| 20110095311 | Configuration of Multiple LED Module - A configuration of multiple LED modules having a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer. The first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area. | 04-28-2011 |
| 20110101383 | Semiconductor Component and Method for Producing a Semiconductor Component - A semiconductor component comprising at least one optically active first region ( | 05-05-2011 |
| 20110101384 | LIGHT-EMITTING DEVICE, METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE, AND ILLUMINATION DEVICE - According to one embodiment, a light-emitting device includes a substrate, a plurality of pads and a plurality of light-emitting elements. The pads has electric conductance, and are arranged on the substrate. A reflecting layer which is formed by electroplating is provided on a surface of each of the pads. The light-emitting elements are mounted on the pads. A depressed part is left on the substrate. The depressed part is formed on the substrate by removing a pattern on the substrate, by which the pads are electrically connected. | 05-05-2011 |
| 20110101385 | PACKAGED SEMICONDUCTOR LIGHT EMITTING DEVICES HAVING MULTIPLE OPTICAL ELEMENTS AND METHODS OF FORMING THE SAME - Methods of packaging a semiconductor light emitting device include providing a substrate having the semiconductor light emitting device on a front face thereof. A first optical element is formed from a first material on the front face proximate the semiconductor light emitting device but not covering the semiconductor light emitting device and a second optical element is formed from a second material, different from the first material, over the semiconductor light emitting device and the first optical element. Packaged semiconductor light emitting devices are also provided. | 05-05-2011 |
| 20110108859 | ORGANIC ELECTROLUMINESCENCE ELEMENT AND MANUFACTURING METHOD THEREOF - An organic luminescence includes pixel electrodes. Banks are each generally between adjacent ones of the pixel electrodes. The banks define apertures that each correspond to one of the pixel electrodes. An organic luminescent layer is within each of the apertures, and an upper electrode is above the banks and the organic luminescent layer. At least a portion of a periphery of each of the apertures includes curved portions and cusps. The curved portions are concave, and adjacent ones of the curved portions define each of the cusps. | 05-12-2011 |
| 20110108860 | OPTOELECTRONIC MODULE - An optoelectronic module includes a layer structure having a plurality of semiconductor layers including a substrate layer, a first layer arrangement and a second layer arrangement arrangement, wherein 1) the first layer arrangement has a light-emitting layer arranged on the substrate layer, 2) the second layer arrangement contains at least one circuit that controls an operating state of the light-emitting layer, and 3) the second layer arrangement is arranged on the substrate layer and/or surrounded by the substrate layer. | 05-12-2011 |
| 20110108861 | PROCESS FOR ANISOTROPIC ETCHING OF SEMICONDUCTORS - A method is provided for anisotropically etching semiconductor materials such as II-VI and III-V semiconductors. The method involves repeated cycles of plasma sputter etching of semiconductor material with a non-reactive gas through an etch mask, followed by passivation of the side walls by plasma polymerization using a polymer former. Using this procedure small pixels in down-converted light-emitting diode devices can be fabricated. | 05-12-2011 |
| 20110108862 | LIGHT-EMITTING-DIODE ARRAY AND METHOD FOR MANUFACTURING THE SAME - A light-emitting-diode (LED) array is disclosed which comprises a first LED device having a first electrode, a second LED device having a second electrode, wherein the first and the second LED device are formed on the same substrate and separated by a gap, at least one polymer material substantially filling the gap, and an interconnect, formed on top of the at least one polymer material, electrically connecting the first and the second electrode. | 05-12-2011 |
| 20110108863 | METHOD FOR MANUFACTURING AN ELECTRO-OPTICAL DEVICE - An object of the present invention is to provide an EL display device having high operation performance and reliability. | 05-12-2011 |
| 20110114969 | LIGHT EMITTING DIODE CHIP HAVING DISTRIBUTED BRAGG REFLECTOR, METHOD OF FABRICATING THE SAME, AND LIGHT EMITTING DIODE PACKAGE HAVING DISTRIBUTED BRAGG REFLECTOR - An exemplary embodiment of the present invention discloses a light emitting diode chip including a substrate, a light emitting structure arranged on the substrate, the light emitting structure including an active layer arranged between a first conductive-type semiconductor layer and a second conductive-type semiconductor layer, and a distributed Bragg reflector to reflect light emitted from the light emitting structure. The distributed Bragg reflector has a reflectivity of at least 90% for light of a first wavelength in a blue wavelength range, light of a second wavelength in a green wavelength range, and light of a third wavelength in a red wavelength range. | 05-19-2011 |
| 20110114970 | LIGHT EMITTING DIODE STRUCTURE, A LAMP DEVICE AND A METHOD OF FORMING A LIGHT EMITTING DIODE STRUCTURE - A light emitting diode structure, a lamp device and a method of forming a light emitting diode structure are provided. The structure has a substrate coated with a first reflective material; an electrode coated with a second reflective material, one or more layers of light emitting material, the layers disposed between the substrate and electrode; wherein in use, the first reflective material and second reflective material reflects light out of the structure via at least one light emitting surface and in a direction away from the electrode. | 05-19-2011 |
| 20110114971 | SUBSTRATE FOR SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE - A substrate for a semiconductor device is provided, including: a substrate; a transistor, formed on the substrate, that includes a semiconductor layer, and a gate electrode disposed so as to be opposed to the semiconductor layer with a gate insulating film interposed therebetween; and an underlying film disposed below the semiconductor layer, as an underlayer of the transistor, and formed in an island shape so as to at least partially overlap the semiconductor layer, in a plan view of the substrate. | 05-19-2011 |
| 20110114972 | OPTICAL SEMICONDUCTOR SEALING RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE USING SAME - An optical semiconductor sealing resin composition includes a rubber-particle-dispersed epoxy resin (A) containing an alicyclic epoxy resin and, dispersed therein, rubber particles, in which the rubber particles comprise a polymer including one or more (meth)acrylic esters as essential monomeric components and have a hydroxyl group and/or a carboxyl group in a surface layer thereof as a functional group capable of reacting with the alicyclic epoxy resin, the rubber particles have an average particle diameter of 10 nm to 500 nm and a maximum particle diameter of 50 nm to 1000 nm, and the difference in refractive index between the rubber particles and a cured article obtained from the optical semiconductor sealing resin composition is within ±0.02. The optical semiconductor sealing resin composition can give a cured article which exhibits excellent cracking resistance while maintaining satisfactory thermal stability and high transparency. | 05-19-2011 |
| 20110121323 | Packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity - A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two. | 05-26-2011 |
| 20110121325 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME - There are disclosed TFTs having improved reliability. An interlayer dielectric film forming the TFTs is made of a silicon nitride film. Other interlayer dielectric films are also made of silicon nitride. The stresses inside the silicon nitride films forming these interlayer dielectric films are set between −5×10 | 05-26-2011 |
| 20110121326 | Submount Having Reflective Cu-Ni-Ag Pads Formed Using Electroless Deposition - A submount for an LED has relatively large copper pads formed on its top surface using an electroless process so that no electrical bias circuitry is required for the submount. The copper pads are then coated with nickel using an electroless process. The nickel layer is then coated with silver using an electroless process, such as an immersion silver process. In one embodiment, the silver layer is less than one micron thick. The Ni layer prevents a reduction in reflectivity of the Ag after long periods of use while conducting the high current (300 mA to >1 amp) needed for high power LEDs. The silver layer surrounds at least 75% of the periphery of the LED die and extends at least 1 mm around the periphery of the die to reflect the LED light. | 05-26-2011 |
| 20110121327 | ORGANIC LIGHT-EMITTING DIODE THREE-DIMENSIONAL IMAGE DISPLAY DEVICE - Disclosed herein is an organic light-emitting diode three-dimensional image display device which comprises a first substrate, a cathode formed on the first substrate, an electron injection layer formed on the cathode, an electron transfer layer formed on the electron injection layer, an emission layer formed on the electron transfer layer, a hole transfer layer formed on the emission layer, a hole injection layer formed on the hole transfer layer, an anode formed on the hole injection layer, a wire grid polarizer formed on the anode and composed of a metal thin film pattern formed at a first angle and a method thin film pattern formed at a second angle perpendicular to the first angle, which are alternately arranged, and a second substrate arranged on the wire grid polarizer. | 05-26-2011 |
| 20110127548 | ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE - An organic light emitting diode (OLED) display device, including: a base substrate, on which OLEDs are formed; and an encapsulation substrate disposed on the base substrate, to cover the OLEDs; and a bonding member connecting the base substrate and the encapsulating substrate. The base substrate and/or the encapsulation substrate include bonding grooves, in which the bonding member is disposed. | 06-02-2011 |
| 20110127549 | LIGHT EMITTING DIODE CHIP HAVING DISTRIBUTED BRAGG REFLECTOR AND METHOD OF FABRICATING THE SAME - Exemplary embodiments of the present invention disclose a light emitting diode chip including a substrate having a first surface and a second surface, a light emitting structure arranged on the first surface of the substrate and including an active layer arranged between a first conductive-type semiconductor layer and a second conductive-type semiconductor layer, a distributed Bragg reflector arranged on the second surface of the substrate, the distributed Bragg reflector to reflect light emitted from the light emitting structure, and a metal layer arranged on the distributed Bragg reflector, wherein the distributed Bragg reflector has a reflectivity of at least 90% for light of a first wavelength in a blue wavelength range, light of a second wavelength in a green wavelength range, and light of a third wavelength in a red wavelength range. | 06-02-2011 |
| 20110133215 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an organic light emitting diode (OLED) display includes forming an upper electrode power source line outside of a pixel area over a substrate, forming a lower electrode in the pixel area, forming at least one layer of an organic material layer in the pixel area and areas outside of the pixel area, forming an upper electrode in the pixel area, selectively removing portions of the organic material layer that are exposed outside of the upper electrode, thereby exposing the upper electrode power source line, and coating a conductive material between the upper electrode and the upper electrode power source line in a normal pressure condition such that the conductive material overlaps the upper electrode and the upper electrode power source line, thereby forming a connection portion. | 06-09-2011 |
| 20110133216 | METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE AND STACKED STRUCTURE BODY - According to one embodiment, a method is disclosed for manufacturing a semiconductor light emitting device. The method can include forming a plurality of semiconductor stacked bodies on a first major surface of a support substrate with a gap between two neighboring semiconductor stacked bodies. The semiconductor stacked bodies includes a first semiconductor layer, a second semiconductor layer, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer. The method can bond the plurality of semiconductor stacked bodies to one other support substrate with a bonding member. In addition, the method can remove the support substrate from the plurality of semiconductor stacked bodies by irradiating the plurality of semiconductor stacked bodies with a laser light from a second major surface of the support substrate on a side opposite to the first major substrate. The bonding member is not irradiated with the laser light. | 06-09-2011 |
| 20110133217 | Led light emitting apparatus and vehicle headlamp using the same - Four LED chips are mounted on a sub-mount substrate so as to be parallel thereto. A wire | 06-09-2011 |
| 20110133218 | LIGHT EMITTING APPARATUS, METHOD OF MANUFACTURING THE SAME, AND LIGHTING SYSTEM - Disclosed are a light emitting apparatus, a method of manufacturing the same, and a lighting system. The light emitting apparatus includes a body, a light emitting device on the body, a conductive member electrically connected with the light emitting device on the body, a resin member surrounding the light emitting device, and an inorganic oxide layer having a refractive index less than a refractive index of the resin member on the resin member. | 06-09-2011 |
| 20110133219 | LIGHT EMITTING ELEMENT ARRAY - A method of fabricating a light emitting diode array, comprising: providing a temporary substrate; forming a first light emitting stack and a second light emitting stack on the temporary substrate; forming a first insulating layer covering partial of the first light emitting stack; forming a wire on the first insulating layer and electrically connecting to the first light emitting stack and the second light emitting stack; forming a second insulating layer fully covering the first light emitting stack, the wire and partial of the second light emitting stack; forming a metal connecting layer on the second insulating layer and electrically connecting to the second light emitting stack; forming a conductive substrate on the metal connecting layer; removing the temporary substrate; and forming a first electrode connecting to the first light emitting stack. | 06-09-2011 |
| 20110133220 | LIGHT EMITTING DIODE, METHOD FOR FABRICATING PHOSPHOR LAYER, AND LIGHTING APPARATUS - A light emitting diode includes: a light emitting diode chip including a substrate and a light emission structure disposed on the substrate; and a phosphor layer formed to cover at least one surface of a diode upper surface and a diode lower surface, when a surface formed by the light emitting diode chip, when viewed from above the light emission structure, is defined as the diode upper surface and a surface formed by the light emitting diode chip, when viewed from below the substrate is defined as the diode lower surface. The phosphor layer is formed in a manner such that the phosphor layer does not deviate from the diode upper surface or the diode lower surface and has a flat surface parallel to the diode upper surface or the diode lower surface and a curved surface connecting the flat surface to corners of the diode upper surface or the diode lower surface. | 06-09-2011 |
| 20110133221 | LED AND LED PACKAGE - A light emitting device (LED) and Package of the same are provided. The LED comprises a first conductivity type semiconductor layer, an active layer, a second conductivity type semiconductor layer, a first dielectric layer, and a first electrode layer. The first conductivity type semiconductor layer, the active layer, and the second conductivity type semiconductor layer are on a substrate. The first dielectric layer covers the edges of the second conductivity type semiconductor layer and the active layer. The first electrode layer covers the edge of the first conductivity type semiconductor layer. | 06-09-2011 |
| 20110133222 | LED LAMP WITH REMOTE PHOSPHOR COATING AND METHOD OF MAKING THE LAMP - A light emitting diode (LED) lamp includes a base with one or more LED chips, an internal cover over the LED chips, where the cover is a translucent ceramic whose thermal conductivity is greater than glass, where the cover has an interior surface separated from the LED chips by a gap, and where an exterior surface of the cover is coated with a phosphor. The ceramic cover preferably has a bulk thermal conductivity of at least 5 W/(m·K), such as polycrystalline alumina. The LED chips preferably are blue LEDs and the phosphor is selected so that the lamp emits white light. In the method of making the lamp, the phosphor may be applied to the exterior surface of the cover as a preformed sheet or in a coating. | 06-09-2011 |
| 20110133223 | SOLID STATE EMITTER PACKAGES - A solid state emitter package may include at least one electrically conductive path associated with the solid state emitter package that is not in electrical communication with any solid state emitter of the solid state emitter package, with such electrically conductive path being susceptible to inclusion of a jumper or a control element. A solid state emitter package includes a principally red solid state emitter having peak emissions within 590 nm to 680 nm, a principally blue solid state emitter having peak emissions within 400 nm to 480 nm, and at least one of a common leadframe, common substrate, and common reflector, with the package being devoid of any principally green solid state emitters having peak emissions between 510 nm and 575 nm. | 06-09-2011 |
| 20110133224 | THERMALLY OPTIMISED LED CHIP-ON-BOARD MODULE - A LED Chip-on-Board (COB) module comprises a plurality of LED die arranged on a substrate in one or more radially concentric rings about a centre point such that each LED die is azimuthally offset from neighbouring LED die. The module includes thermal conduction pads each having lateral dimensions at least as large as the combined lateral dimensions of the LED die attached to it and a total surface area at least five times larger than the total surface area of all the LED die attached to it. At the same time, the total light emission area of the module is no greater than four times larger than the combined total surface emission area of all the individual LED die disposed on the substrate. A variety of configurations are possible subject to these criteria, which permit good packing density for enhanced brightness whilst ensuring optimal heat transfer. A method of manufacturing the module is also provided. | 06-09-2011 |
| 20110140132 | Light-Emitting Device - Provided are a light-emitting device, a light-emitting device package, and a method for fabricating the light-emitting device. The light-emitting device includes a first light-emitting structure; an insulation layer having non-conductivity, in which a current does not flow, on the first light-emitting structure; a second light-emitting structure on the insulation layer; and a common electrode simultaneously and electrically connected to the first light-emitting structure and the second light-emitting structure. | 06-16-2011 |
| 20110140133 | LIGHT EMITTING DEVICE HAVING INCREASED LIGHT OUTPUT - The light intensity emitted from a package is increased by adjusting a portion of the package encapsulant so that light impacting the side walls of the adjusted encapsulant portion will encounter total internal reflection (TIR) with the reflected light directed toward the top surface of the package. The adjusted portion of the package is positioned so that air can be used as the second (exterior) medium with the critical TIR angle being such that light emitted from a light source (such as from an LED die) will be directed primarily so as to escape the package from the top surface as opposed to being scattered internal to the package. In one embodiment, a lower portion of the encapsulant is surrounded by a casing to inwardly direct light from the light source that impacts the side of the encapsulant with an angle less than the critical TIR angle. | 06-16-2011 |
| 20110140134 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - It is an object of the present invention to prevent an influence of voltage drop due to wiring resistance, trouble in writing of a signal into a pixel, and trouble in gray scales, and provide a display device with higher definition, represented by an EL display device and a liquid crystal display device. | 06-16-2011 |
| 20110140135 | LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES - Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source. | 06-16-2011 |
| 20110147768 | ORGANIC LIGHT EMITTING DEVICE CONNECTION METHODS - A light panel includes a light source having a generally planar, light emitting surface and a perimeter edge. A backsheet is disposed in substantially parallel relation with the light emitting surface, and an electrical feed-through region extends through the backsheet at a location spaced inwardly from the perimeter. A generally planar, flexible connector cable extends over the backsheet from the perimeter to the electrical feed-through region for establishing electrical connection with the light source. Openings in conductive pads provided in the flexible cable permit a conductive material to be inserted there through and mechanically and electrically interconnect the cable and the light panel. | 06-23-2011 |
| 20110147769 | Organic light emitting display and manufacturing method thereof - An organic light emitting display includes a gate electrode on a substrate, an active layer insulated from the gate electrode, source and drain electrodes that are insulated from the gate electrode and contact the active layer, an insulating layer between the active layer and the source and drain electrodes, a light blocking layer that is on the active layer and that blocks light of a predetermined wavelength from the active layer, and an organic light emitting device that is electrically connected to one of the source and drain electrodes. | 06-23-2011 |
| 20110156060 | Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof - A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module. | 06-30-2011 |
| 20110156061 | Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof - A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module. | 06-30-2011 |
| 20110156062 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display device and a method of manufacturing the same. The organic light-emitting display device includes a first film formed of an inorganic material, a second film that is formed of an organic material and formed on the first film, and includes a first surface and a second surface facing each other and lateral surfaces at boundaries of the first surface and the second surface, with the first surface contacting the first film, a third film that is formed of an inorganic material and covers the second surface and lateral surfaces of the second film, with a first sealing region contacting the first film being formed at a boundary between the second film and the third film, an organic light-emitting unit that is disposed on the third film to overlap with the second film, and a fourth film that covers the organic light-emitting unit, with a second sealing region contacting the third film being formed at a boundary of the fourth film. Accordingly, the organic light-emitting display device is protected from water penetration, thereby providing a long life span to the organic light-emitting display device. | 06-30-2011 |
| 20110156063 | ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAY DEVICE - An exemplary OLED display device includes a substrate, a colored photo-resist layer and a white OLED arranged in that order. The white OLED includes a reflecting electrode, a transmitting electrode, and an organic white light emitting layer arranged between the reflecting electrode and the transmitting electrode for emitting a white light. The colored photo-resist layer at least includes first through third photo-resist regions, the first through third photo-resist regions contain red pigment particles, green pigment particles and blue pigment particles respectively for extracting red, green and blue light components from the white light. Moreover, the colored photo-resist layer has an expected haze value e.g., greater than 30 by at least utilizing the scattering of the red, green and blue pigment particles and/or mixing of scattering particles that are different from the red, green and blue pigment particles into the first through third photo-resist regions. | 06-30-2011 |
| 20110156064 | LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - Disclosed are a light emitting device and a method of fabricating the same. The light emitting device includes a substrate; first and second light emitting cells, each including a first semiconductor layer, an active layer, and a second semiconductor layer; and a connector located between the first and second light emitting cells and the substrate, to electrically connect the first and second light emitting cells to each other. The connector extends from the second semiconductor layer of the first light emitting cell, across the substrate, and through central regions of the second semiconductor layer and active layer of the second light emitting cells, to contact the first semiconductor layer of the second light emitting cell. | 06-30-2011 |
| 20110156065 | SEMICONDUCTOR LIGHT EMITTING ELEMENT AND SEMICONDUCTOR LIGHT EMITTING DEVICE - Provided is a semiconductor light emitting element wherein generation of an open failure of the light emitting device can be eliminated by ensuring a current pathway when disconnection is generated in a transparent electrode layer. A semiconductor light emitting element ( | 06-30-2011 |
| 20110163329 | Organic light emitting display apparatus and method of manufacturing the same - An organic light emitting display apparatus and a method of fabricating the same are provided. The organic light emitting display apparatus includes a pixel unit on which an organic light emitting device is formed, a thin film transistor (TFT) electrically connected to the pixel unit and a data line and a scan line electrically connected to the TFT and disposed crossing each other on a substrate. The data line and the scan line are formed in one layer. A bridge that allows one of the data line and the scan line to bypass the other is on an intersection of the data line and the scan line. | 07-07-2011 |
| 20110163330 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode (OLED) display is disclosed. In one embodiment, the OLED display includes an organic light emitting element formed over a substrate and an encapsulation portion covering the organic light emitting element. Further, the encapsulation portion may include at least one organic layer and at least one inorganic layer, wherein ends of the inorganic layer and t he organic layer directly contact the substrate, and wherein the organic layer is thicker than the inorganic layer. | 07-07-2011 |
| 20110163331 | ORGANIC LIGHT-EMITTING DEVICE - The present invention relates to an organic light-emitting device capable of suppressing deterioration of organic EL elements at the corners of an emission region. | 07-07-2011 |
| 20110163332 | OLEDS AND OTHER ELECTRONIC DEVICES USING DESICCANTS - Electronic devices that use desiccants for protection from moisture. The electronic devices comprise a substrate ( | 07-07-2011 |
| 20110163333 | Display Device - A display device includes a plurality of pixels placed in a matrix form in which each pixel has a light emitting device. The light emitting device includes a light emissive layer; a reflective electrode disposed on a rear surface side of the light emissive layer; a transparent electrode disposed on a front surface side of the light emissive layer; a dividing wall, disposed between the reflective electrode and the light emissive layer at a periphery part of a region where the reflective electrode is formed; a protective layer on a front surface side of the transparent electrode; and a transparent substrate disposed above the protective layer. The protective layer and the transparent substrate are spaced from one another so as to delimit a space where a gas is sealed. | 07-07-2011 |
| 20110163334 | COLOUR MIXING METHOD FOR CONSISTENT COLOUR QUALITY - The present invention relates to a light emitting device ( | 07-07-2011 |
| 20110169017 | Electronic devices comprising electrodes that connect to conductive members within a substrate and processes for forming the electronic devices - An electronic device includes a substrate. The substrate includes a first pixel driving circuit, a first conductive member, and a second conductive member. The first and second conductive members are spaced apart from each other. The first conductive member is connected to the first pixel driving circuit. The second conductive member is part of a power transmission line. The electronic device further includes a well structure overlying the substrate and defining a pixel opening, a via, and a channel. The pixel opening is connected to the via through the channel. In addition, the electronic device includes a first electronic component. The electronic component includes a first electrode that contacts the first conductive member in the pixel opening, a second electrode that contacts the second conductive member in the via, and an organic layer lying between the first and second electrodes. | 07-14-2011 |
| 20110169018 | Liquid Crystal Display Device - An exemplary liquid crystal display device includes a data line, a pixel, a first gate line, a second gate line, an additional electrode and an additional gate line. The pixel includes a first sub-pixel and a second sub-pixel. The first gate line is electrically coupled to the first sub-pixel. The second gate line is electrically coupled to the second sub-pixel. The first sub-pixel is electrically coupled to the data line to receive a signal provided from the data line. The second sub-pixel is electrically coupled to the first sub-pixel through the additional electrode and to receive a signal provided from the data line through the first sub-pixel. The additional gate line is arranged crossing over the additional electrode and whereby a compensation capacitance is formed between the additional gate line and the additional electrode. | 07-14-2011 |
| 20110169019 | Display cell, display apparatus and method for making same - In an electrophoretic display device comprising a plurality of pixels, each pixel having a cell area containing a plurality of charged pigment particles dispersed between two opposite electrodes, a semiconducting passivation layer is provided on one or both of the two opposite electrodes. The semiconducting passivation layer can be made of MO | 07-14-2011 |
| 20110169020 | SIDE MOUNTABLE SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGES, PANELS AND METHODS OF FORMING THE SAME - Side-mountable semiconductor light emitting device packages include an electrically insulating substrate having a front face and a back face and a side face extending therebetween. The side face is configured for mounting on an underlying surface. An electrically conductive contact is provided proximate an edge of the substrate on the back face of the substrate and/or on a recessed region on the side face of the substrate. The contact is positioned to be positioned proximate an electrical connection region of the underlying surface when the semiconductor light emitting device package is side mounted on the underlying surface. A conductive trace extends along the front face of the substrate and is electrically connected to the contact. A semiconductor light emitting device is mounted on the front face of the substrate and electrically connected to the conductive trace. | 07-14-2011 |
| 20110169021 | PACKAGE OF LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - Provided is a package of a light emitting diode. The package according to an embodiment includes a base layer, a light emitting diode chip on the base layer, a lead frame electrically connected to the light emitting diode chip, a reflective coating layer directly on the lead frame, and a molding material covering the light emitting diode chip in a predetermined shape. | 07-14-2011 |
| 20110169022 | BOARD MODULE AND METHOD OF MANUFACTURING SAME - A liquid crystal display device ( | 07-14-2011 |
| 20110169023 | METHODS FOR MAKING QUASI-VERTICAL LIGHT EMITTING DIODES - A method of making quasi-vertical light emitting devices includes growing semiconductor layers on a growth substrate and etching the semiconductor layers to produce device isolation trenches forming separable semiconductor devices and holes. Blind holes are drilled in the substrate at the location of each of the holes in the semiconductor layers. The drilling of the blind holes defines blind hole walls and a blind hole end in each of the blind holes. N-semiconductor metal is deposited in each of the blind holes. An n-electrode contact is formed in each of the blind holes by plating each of the blind holes with an n-electrode metal connected to the n-semiconductor metal. The substrate is thinned to expose the n-electrode metal as an n-electrode. Bonding metal is deposited to the n-electrode for packaging. | 07-14-2011 |
| 20110175114 | FILM-COVERED LED DEVICE - A film-covered LED device includes a high thermal conductive substrate, a reflector, a plurality of LED chips, and a fluorescent film. A pair of electrical contacts is respectively disposed on two ends of the high thermal conductive substrate. A thru opening is formed on the reflector, which is disposed on the high thermal conductive substrate. The LED chips are disposed on the high thermal conductive substrate and connected electrically, within the thru opening. The fluorescent film is disposed on the reflector and casted over the LED chips. Thereby, the LEDs illumination is more evenly distributed, in maintaining illumination efficiency uniformity. The yield rate is also enhanced with savings in labor cost. | 07-21-2011 |
| 20110175115 | DEPOSITION MASK, METHOD FOR MANUFACTURING DISPLAY UNIT USING IT, AND DISPLAY UNIT - A deposition mask and a display unit and method of manufacturing same are provided. A red continuous organic layer, a green continuous organic layer, and a blue continuous organic layer are provided over two or more lines of a matrix configuration of organic light emitting devices in common. A film thickness distribution in the extensional direction of the red, green and blue continuous organic layer is dissolved, and an aperture ratio can be improved by just that much. | 07-21-2011 |
| 20110175116 | LIGHT-EMITTING DEVICE, PRODUCTION METHOD THEREFOR, AND DISPLAY CONTAINING THE SAME - The present invention provides a light-emitting device which includes, in the order mentioned, a light-emitting layer containing a light-emitting portion, an intermediate layer, and a fine concavo-convex pattern, wherein the intermediate layer is disposed over a second surface of the light-emitting layer which surface is opposite to a first surface of the light-emitting layer, wherein the fine concavo-convex pattern has a cross-sectional shape which has portions projected and recessed with respect to the light-emitting layer, and reflects light emitted from the light-emitting layer, and wherein at least part of the intermediate layer has a refractive index of 0.9n to 1.1n, where n denotes a refractive index of the light-emitting portion with respect to light which has a main light-emitting wavelength. | 07-21-2011 |
| 20110175117 | COATED LIGHT EMITTING DEVICE AND METHOD FOR COATING THEREOF - The present invention relates to the field of a light emitting device ( | 07-21-2011 |
| 20110180816 | SEMICONDUCTOR DEVICE, DISPLAY, ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A method is described for manufacturing a semiconductor device that comprises the steps of providing on a substrate a layer of a conducting material in a pattern comprising isolated elements having a first set of edges. The method further includes providing, on the substrate, a series of wall structures for forming one or more cavities there between. The wall structures have a second set of edges cooperating with the first set of edges. The second set of edges is positioned outside the first set of edges by a pre-defined distance. The method furthermore includes depositing a liquid material in the cavities. A display and an electronic apparatus incorporating the above described features is also disclosed. | 07-28-2011 |
| 20110180817 | LIGHT EMITTING DEVICE - A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency. | 07-28-2011 |
| 20110180818 | Solid State Light Sheet Using Thin LEDs For General Illumination - A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate having conductors is then laminated over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. The light sheets may be formed to emit light from opposite surfaces of the light sheet, enabling it to be used in a hanging fixture to illuminate the ceiling as well as the floor. The light sheet provides a practical substitute for a standard 2×4 foot fluorescent ceiling fixture. | 07-28-2011 |
| 20110180819 | LIGHT-EMITTING ARRANGEMENT - The invention relates to a light-emitting arrangement comprising a printed circuit board, PCB, having at least one electrically and thermally conductive portion, a light-emitting diode, LED, being thermally connected to the at least one electrically and thermally conductive portion by at least one contact of the LED, and a heat release member for dissipating heat generated by the LED, the heat release member being thermally connected to the at least one electrically and thermally conductive portion, wherein the heat generated by the LED is transferred along a heat transfer path extending from the LED via the at least one contact and the at least one electrically and thermally conductive portion to the heat release member. | 07-28-2011 |
| 20110180820 | LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - Disclosed are a light emitting device and a method of fabricating the same. The light emitting device includes a substrate; first and second light emitting cells, each including a first semiconductor layer, an active layer, and a second semiconductor layer; and a connector located between the first and second light emitting cells and the substrate, to electrically connect the first and second light emitting cells to each other. The connector extends from the second semiconductor layer of the first light emitting cell, across the substrate, and through central regions of the second semiconductor layer and active layer of the second light emitting cells, to contact the first semiconductor layer of the second light emitting cell. | 07-28-2011 |
| 20110180821 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A display device includes an array of light emitting cells. Each of the light emitting cells includes a first electrode, a second electrode, and an organic light emitting layer located between the first electrode and the second electrode. Banks are above the first electrode that partition the organic light emitting layer to define each of the light emitting cells. The light emitting cells include a peripheral light emitting cell that is located in a peripheral region of the array. The banks include first and second banks that each border the peripheral light emitting cell. The first bank is closer to a periphery of the array than the second bank. An inclination angle of an innermost sidewall of the first bank that is adjacent the peripheral light emitting cell is greater than an inclination angle of an outermost sidewall of the second bank that is adjacent the peripheral light emitting cell. | 07-28-2011 |
| 20110180822 | Optoelectronic Component - An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or—receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector. | 07-28-2011 |
| 20110180823 | LIGHT-EMITTING DEVICE, PRODUCTION METHOD THEREFOR, AND DISPLAY CONTAINING THE SAME - The present invention provides a light-emitting device which includes, in the order mentioned, a light-emitting layer containing a light-emitting portion, an interference layer, and a fine concavo-convex pattern, wherein the interference layer is disposed over a second surface of the light-emitting layer which surface is opposite to a first surface of the light-emitting layer, and reflects, toward the first surface, light emitted from the light-emitting layer, and wherein the fine concavo-convex pattern has a cross-sectional shape which has portions projected and recessed with respect to the light-emitting layer, and reflects light emitted from the light-emitting layer. | 07-28-2011 |
| 20110186864 | ELECTROLUMINESCENT LIGHT-EMITTING DEVICE COMPRISING AN ARRANGEMENT OF ORGANIC LAYERS, AND METHOD FOR ITS PRODUCTION - The invention relates to an electroluminescent light-emitting device comprising an arrangement of organic layers which are applied to a substrate, and also to a method for its production. The arrangement of organic layers comprises the following layers: at least one charge carrier transport layer consisting of organic material, and at least one light-emitting layer consisting of organic material. The arrangement of organic layers furthermore comprises at least one doped fullerene layer which has a doping that increases the electrical conductivity. | 08-04-2011 |
| 20110186865 | Wide angle oval light emitting diode package - The present invention is directed to LED packages and LED displays utilizing LED packages where the peak emission of the LED displays can exhibit improved emission characteristics. In some embodiments the improved characteristics include a wider horizontal emission angle for the LED packages according to the present invention, which results in improved emission characteristics for the LED display such as a wider far field pattern. This provides improved picture intensity and quality when viewing the display at different horizontal viewing angles. Different embodiments also provide for improved emission characteristics for LED packages emitting different colors of light when viewing at different vertical angles. In one embodiment the red and green LED packages can have emission patterns that are substantially the same at different vertical viewing angles within a range. This helps the colors of the display appear consistent at those angles. | 08-04-2011 |
| 20110186866 | OPTOELECTRONIC DEVICE ARRAY - An optoelectonice device array includes a plurality of packages, each enclosing an optoelectronic device, and positioned in at least one row. Each package overlaps at least one adjacent package, and may be hermetically sealed. | 08-04-2011 |
| 20110186867 | Arrangement Having at Least Two Light-Emitting Semiconductor Components and Method for the Production of Such an Arrangement - An arrangement having at least two light-emitting semiconductor components ( | 08-04-2011 |
| 20110186868 | LED PACKAGE - According to one embodiment, an LED package includes a first and a second lead frame, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and has one terminal connected to the first lead frame and another terminal connected to the second lead frame. The wire connects the one terminal to the first lead frame. The resin body covers the first and second lead frames, the LED chip, and the wire. The first lead frame includes a base portion and a plurality of extending portions. As viewed from above, a bonding position of the wire is located inside one of polygonal regions connecting between roots of the two or more of the extending portions. An appearance of the resin body is a part of an appearance of the LED package. | 08-04-2011 |
| 20110186869 | Organic Light Emitting Diode Display and Method of Manufacturing the Same - An organic light emitting diode (OLED) display comprises a first substrate and a second substrate configured to comprise a pixel area and a non-pixel area other than the pixel area, a sealing member configured to adhere the first substrate and the second substrate together, reinforcing materials filled into the non-pixel area of the first substrate and the second substrate, and an accommodation unit configured to accommodate some of the reinforcing materials within at least one of the first substrate and the second substrate corresponding to the non-pixel area. A method of manufacturing the OLED display comprises: preparing a mother substrate, including a plurality of display panels and cutting lines between two adjacent display panels; cutting the mother substrate into separated unit display panels; forming grooves on a side of each unit display panels; and filling reinforcing materials in a non-pixel area of the unit display panels, some of the reinforcing materials flowing into the grooves. | 08-04-2011 |
| 20110186870 | LED PACKAGE STRUCTURE - An LED package structure includes a base and two diodes. The base includes an insulating layer having an outer peripheral edge, and a conductive bottom layer disposed on a bottom face of the insulating layer and having an outer peripheral edge spaced from the outer peripheral edge of the insulating layer at a predetermined distance. The insulating layer is formed with two spaced-apart through holes, and cooperates with the conductive bottom layer to form first and second cavities. The diodes are disposed within the first and second cavities, respectively. A transparent encapsulant covers the base and the diodes. | 08-04-2011 |
| 20110186871 | ELECTROLUMINESCENT DISPLAY, ILLUMINATION OR INDICATING DEVICE, AND ITS FABRICATION PROCESS - The invention relates to an electroluminescent display, illumination or indicating device and to its fabrication process. This device ( | 08-04-2011 |
| 20110186872 | Light Emitting Device Package, Method Of Manufacturing The Same, And Lighting System - The light emitting device package includes a light emitting structure including a first conductive semiconductor layer, an active layer partially formed under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer, an insulating layer disposed on lateral surfaces of the active layer and the second conductive semiconductor layer, an electrode disposed under the first conductive semiconductor layer and electrically insulated from the active layer and the second conductive semiconductor layer by the insulating layer, and a metallic support layer disposed under the second conductive semiconductor layer, the insulating layer, and the electrode and including a first conductive region electrically connected to the electrode, a second conductive region electrically connected to the second conductive semiconductor layer, and an insulating region disposed between the first and second conductive regions and insulating the first conductive region from the second conductive region. | 08-04-2011 |
| 20110186873 | LIGHT EMITTING DEVICE PACKAGES, SYSTEMS AND METHODS - Packages, systems and methods for light emitting devices are disclosed. An LED package in one aspect can be of various sizes and configurations and can include one or more LEDs of a size smaller than those typically provided. The LED package or packages can for example be used for backlighting or other lighting fixtures. Optimized materials and techniques can be used for the LED packages to provide energy efficiency and long lifetime. | 08-04-2011 |
| 20110186874 | White Light Apparatus and Method - A method of manufacturing LED devices using substrate scale processing includes providing a substrate member having a surface region. A reflective layer is disposed on the surface region, the reflective surface having a reflectivity of at least 85%, An array of conductive regions is spatially disposed on the reflective surface. LED devices are affixed to each of the array regions. | 08-04-2011 |
| 20110193103 | SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING THE SEMICONDUCTOR DEVICE, SUBSTRATE FOR SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCING THE SUBSTRATE - A semiconductor device is provided with a porous structure layer formed by silicone resin between a substrate and a semiconductor element. Alternatively, a porous layer having a density of 0.7 g/cm | 08-11-2011 |
| 20110193104 | LIQUID MATERIAL DISPENSING APPARATUS AND METHOD OF DISPENSING LIGHT EMITTING MATERIALS FOR ORGANIC LIGHT EMITTING DIODE - A liquid dispensing apparatus is disclosed. In one embodiment, the apparatus includes i) a first moving unit configured to move in a first direction that is a movement direction of a patterning target object and ii) a second moving unit configured to move in a second direction crossing the first direction. The apparatus further includes a dispensing unit formed on the second moving unit; and a third moving unit formed between the first moving unit and the second moving unit and configured to rotate the second moving unit and the dispensing unit with respect to the first moving unit on a virtual plane that is substantially parallel to the first and second directions. | 08-11-2011 |
| 20110193105 | Solid State Light Sheet for General Illumination Having Substrates for Creating Series Connection of Dies - A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. | 08-11-2011 |
| 20110193106 | Solid State Light Sheet for General Illumination Having Metal Interconnector Through Layer for Connecting Dies in Series - A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. | 08-11-2011 |
| 20110193107 | LIGHT-EMITTER, METHOD OF MANUFACTURING THE SAME AND LIGHT EMITTING DEVICE - A light-emitter includes a first electrode and a layered body over the first electrode. The layered body includes a charge injection layer and a light-emitting layer. A bank defines a position of the light-emitting layer of the layered body, and a second electrode is over the layered body. The charge injection layer is formed by oxidation of an upper portion of a metal. The first electrode includes a metal layer that is a lower portion of the metal. An inner portion of the charge injection layer is depressed to define a recess. A portion of the bank is on an outer portion of the charge injection layer. | 08-11-2011 |
| 20110198619 | LIGHT EMITTING DIODE ASSEMBLY HAVING IMPROVED LIGHTING EFFICIENCY - A light emitting diode assembly is disclosed in the present invention. The light emitting diode assembly has a substrate and several light emitting diode units. It can also include several light emitting diode units fabricated on cavities formed in the substrate. Any light emitting diode unit is composed of a light emitting diode chip covered with a phosphor layer for providing light beams, and a reflecting unit installed or formed on the substrate, coated with a reflective film, surrounding the light emitting diode chip for reflecting the light beams emitted from the light emitting diode chip, and directing the light beams upward. The light emitting diode unit further includes a light condenser provided above the light emitting diode chip for guiding the light beams upward. The assembly can collect all light beams emitted laterally. Hence, lighting efficiency for the light emitting diode assembly can be improved. | 08-18-2011 |
| 20110198620 | BARRIER FILM COMPOSITE AND DISPLAY APPARATUS INCLUDING THE BARRIER FILM COMPOSITE - A barrier film composite includes a decoupling layer and a barrier layer. The barrier layer includes a first region and a second region that is thinner than the first region. | 08-18-2011 |
| 20110198621 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, METHOD OF MANUFACTURING LIGHT EMITTING DEVICE AND LIGHTING SYSTEM - A light emitting device according to the embodiment includes a conductive support member; a light emitting structure on the conductive support member including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer between the first and second semiconductor layers; and a protective device on the light emitting structure. | 08-18-2011 |
| 20110198622 | ORGANIC OPTO-ELECTRIC DEVICE AND A METHOD FOR MANUFACTURING AN ORGANIC OPTO-ELECTRIC DEVICE - An organic opto-electric device has a layer stack with a base electrode, an organic layer assembly, a cover electrode and a contact layer. The organic layer assembly is arranged between the base electrode and the cover electrode and the cover electrode is arranged between the organic layer assembly and the contact layer. The cover electrode and the base electrode are structured to form several laterally adjacent optically active areas and the base electrode, the organic layer assembly, the cover electrode and the contact layer are interconnected by vias such that at least two optically active areas are connected in series so that a current flow through the at least two optically active areas passes in a direction between the base electrode and a cover electrode. The current flow between the at least two optically active areas passes through the contact layer, wherein the contact layer contacts the base electrode above one of the vias laterally in the interior of the two optically active areas. | 08-18-2011 |
| 20110198623 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A display device includes an array of light emitting cells. Banks define each of the light emitting cells. The light emitting cells include a first light emitting cell that is located in a central region of the array and a second light emitting cell that is located in a peripheral region of the array. First and third banks border the first light emitting cell with the first bank being closer to a periphery of the array than the second bank. Second and fourth banks border the second light emitting cell with the third bank being closer to the periphery of the array than the fourth bank. An inclination angle of an innermost sidewall of the third bank that is adjacent the second light emitting cell is different than an inclination angle of an innermost sidewall of the first bank that is adjacent the first light emitting cell. | 08-18-2011 |
| 20110198624 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A display device includes an array of light emitting cells. Each light emitting cell includes first and second electrodes, and an organic light emitting layer located between the first and second electrodes. Banks are above the first electrode that partition the organic light emitting layer to define each of the light emitting cells. First and second light emitting cells are adjacent to one another and located in a peripheral region of the array. The first light emitting cell is closer to a center of the array than the second light emitting cell. A first bank borders the first light emitting cell and the second light emitting cell. An inclination angle of an innermost sidewall of the first bank that is adjacent the first light emitting cell is greater than an inclination angle of an outermost sidewall of the first bank that is adjacent the second light emitting cell. | 08-18-2011 |
| 20110198625 | NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE ARRAY - A nitride semiconductor light emitting device array, which includes a dielectric layer formed on a first conductivity lower nitride semiconductor layer, having a plurality of windows. Each of a plurality of hexagonal pyramid light emission structures is grown from a surface of the first conductivity lower nitride semiconductor layer exposed through each of the windows and onto a peripheral area of the window of the dielectric layer. Each of the hexagonal pyramid light emission structures includes a first conductivity upper nitride semiconductor layer, an active layer and a second conductivity nitride semiconductor layer formed in their order. The windows are disposed in such a triangular arrangement that side surfaces of the adjacent hexagonal pyramid light emission structures face each other. Also, a distance between bases of the adjacent hexagonal pyramid light emission structures is less than 0.3 times an interval between centers of the windows of the adjacent hexagonal pyramid light emission structures. | 08-18-2011 |
| 20110198626 | SUBSTRATE REMOVAL PROCESS FOR HIGH LIGHT EXTRACTION LEDS - A method for fabricating light emitting diode (LEDs) comprises providing a plurality of LEDs on a substrate wafer, each of which has an n-type and p-type layer of Group-III nitride material formed on a SiC substrate with the n-type layer sandwiched between the substrate and p-type layer. A conductive carrier is provided having a lateral surface to hold the LEDs. The LEDs are flip-chip mounted on the lateral surface of the conductive carrier. The SiC substrate is removed from the LEDs such that the n-type layer is the top-most layer. A respective contact is deposited on the n-type layer of each of the LEDs and the carrier is separated into portions such that each of the LEDs is separated from the others, with each of the LEDs mounted to a respective portion of said carrier. | 08-18-2011 |
| 20110198627 | Organic Optoelectronic Device And A Method For Encapsulating Said Device - The invention relates to an organic optoelectronic device, such as a display, lighting or signalling device, that is protected from the ambient air by a sealed encapsulation in the form of a thin film, and to a method for encapsulating such a device. An optoelectronic device ( | 08-18-2011 |
| 20110198628 | MULTI-CHIP LED PACKAGE - A multichip light-emitting-diode (LED) package includes a printed circuit board (PCB) having a tapered via hole and a circuit interconnection line on a surface of the PCB. An inclined surface of each via hole is used as a reflection plate reflecting light emitted by an LED chip located in the via hole. Each LED chip is directly bonded to a metal base for radiating heat. Additional heat radiation structures and reflection plates are not required, thus simplifying the structure of and manufacture of the multichip LED package, reducing manufacturing costs. | 08-18-2011 |
| 20110204386 | METAL BASED ELECTRONIC COMPONENT PACKAGE AND THE METHOD OF MANUFACTURING THE SAME - A package for an electronic component and method of forming a package for an electronic component are disclosed. The package may include a metal base and a termination chip coupled to the metal base. The termination chip may include a die contact pad electrically coupled to a mounting pad and an isolating feature configured to provide electrical isolation between the metal base and the die contact pad. The contact may be configured for electrical connection to the electronic component. The metal base may be folded to form a molding cavity. The metal base may include at least one plating layer. The package may include a light emitting diode (LED) coupled to the metal base. The LED may be coupled to the metal base via a eutectic bond. | 08-25-2011 |
| 20110204387 | SEMICONDUCTOR LIGHT EMITTING DEVICE HAVING MULTI-CELL ARRAY, LIGHT EMITTING MODULE, AND ILLUMINATION APPARATUS - A semiconductor light emitting device includes a substrate, a plurality of light emitting cells, a connection part, and a concavo-convex part. The light emitting cells are arrayed on the top surface of the substrate. Each of the light emitting cells has a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer that are sequentially stacked on the top surface of the substrate. The connection part is formed to connect the light emitting cells in series, parallel or series-parallel. The concavo-convex part is formed in at least one of the bottom surface of the substrate and the top surface of an isolation region between the light emitting cells. | 08-25-2011 |
| 20110204388 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME - An OLED display and a manufacturing method thereof are disclosed. The OLED display includes: a first substrate, an organic light emitting diode formed over the first substrate, the organic light emitting diode including a reflective surface configured to reflect light incident to the organic light emitting diode, a phase delay capping layer formed over the organic light emitting diode, configured to input linearly polarized light and output circularly polarized light, a second substrate disposed over the phase delay capping layer, and a polarizing plate formed over the second substrate, configured to pass through only linearly polarized light. | 08-25-2011 |
| 20110204389 | ILLUMINATING DEVICE - An illuminating device comprises one or more luminescent devices ( | 08-25-2011 |
| 20110204390 | Solid State Light Sheet Having Wide Support Substrate and Narrow Strips Enclosing LED Dies In Series - A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. | 08-25-2011 |
| 20110204391 | Solid State Light Sheet or Strip Having Cavities Formed in Top Substrate - A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. | 08-25-2011 |
| 20110204392 | LED ARRAY GRID, METHOD AND DEVICE FOR MANUFACTURING SAID GRID AND LED COMPONENT FOR USE IN THE SAME - Disclosed herein is a method for producing an LED array grid including the steps of (i) arranging N electrically conducting parallel wires, where N is an integer >1, thus creating an array of wires having a width D perpendicular to a direction of the wires, (ii) arranging LED components to the array of wires such that each LED component is electrically coupled to at least two adjacent wires, (iii) stretching the array of wires such that the width D increases, and arranging the stretched LED array grid onto a plate or between two plates | 08-25-2011 |
| 20110204393 | LED LAMP - An LED lamp (A | 08-25-2011 |
| 20110210344 | BARRIER FILM COMPOSITE, DISPLAY APPARATUS INCLUDING THE BARRIER FILM COMPOSITE, AND METHOD OF MANUFACTURING DISPLAY APPARATUS INCLUDING THE BARRIER FILM COMPOSITE - A barrier film composite includes a heat-shrinkable layer having a conformable surface conforming to a surface shape of an object in contact with the heat-shrinkable layer, and a flat surface disposed opposite to the conformable surface; and a barrier layer having a smaller thickness than the heat-shrinkable layer and disposed flat on the flat surface of the heat-shrinkable layer. | 09-01-2011 |
| 20110210345 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - Provided is a light emitting device. The light emitting device includes a light emitting structure layer comprising a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a first electrode connected to the first conductive type semiconductor layer, a current spreading layer on the second conductive type semiconductor layer, an insulation layer on the first electrode, and a second electrode comprising at least one bridge portion on the insulation layer and a first contact portion contacting at least one of the second conductive type semiconductor layer and the current spreading layer. | 09-01-2011 |
| 20110210346 | LED MODULE - An LED module includes at least two LED package units and at least one connecting unit. Each LED package unit includes at least one first engaging portion, at least one first conductive portion, and at least one LED chip connected electrically to the first engaging portion. The connecting unit includes at least two second engaging portions, and at least one second conductive portion having two opposite end sections extending respectively to the second engaging portions. When the second engaging portions of the connecting unit engaged with the first engaging portions of the LED package units, respectively, the end sections of the second conductive portion contact electrically and respectively the corresponding first conductive portions so as to connect electrically the LED chips of the LED package units. | 09-01-2011 |
| 20110210347 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device including: a thin film transistor substrate; and a driving circuit, wherein the thin film transistor substrate includes: a thin film transistor includes: a gate electrode; a gate insulating film that is formed on the insulating substrate and the gate electrode; a semiconductor layer that is formed on the gate insulating film; a channel protecting film; and a source electrode and a drain electrode that are formed to connect with the semiconductor layer; and a wiring converting unit that directly and electrically connects a first wiring layer and a second wiring layer through a first contact hole formed in the gate insulating film in the driving circuit, wherein the first wiring layer is formed at the same layer as the gate electrode on the insulating substrate; and wherein the second wiring layer is formed at the same layer as the source electrode and the drain electrode. | 09-01-2011 |
| 20110210348 | ORGANIC LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic EL device includes a first substrate and a plurality of organic EL elements above a first portion of the first substrate. A first inorganic layer covers the plurality of organic EL elements. An active layer is above a second portion of the first substrate that is different than the first portion. The active layer comprises a material that is at least one of hygroscopic and oxidizable. A second inorganic layer covers the active layer. A second substrate is opposite the first substrate, with the plurality of organic EL elements being between the first and second substrates. A seal extends between the first and second substrates to define a sealed space between the first and second substrates. The second inorganic layer includes through-holes that expose the active layer to the sealed space that is defined by the first substrate, the second substrate, and the seal. | 09-01-2011 |
| 20110210349 | LED MULTI-CHIP BONDING DIE AND LIGHT STRIP USING THE SAME - An LED multi-chip bonding die ( | 09-01-2011 |
| 20110210350 | LIGHT EMITTING ELEMENT WITH A PLURALITY OF CELLS BONDED, METHOD OF MANUFACTURING THE SAME, AND LIGHT EMITTING DEVICE USING THE SAME - The present invention relates to a light emitting element with arrayed cells, a method of manufacturing the same, and a light emitting device using the same. The present invention provides a light emitting element including a light emitting cell block with a plurality of light emitting cells connected in series or parallel on a single substrate, and a method of manufacturing the same, wherein each of the plurality of light emitting cells includes an N-type semiconductor layer and a P-type semiconductor layer, and the N-type semiconductor layer of one light emitting cell is electrically connected to the P-type semiconductor layer of another adjacent light emitting cell. Further, the present invention provides a light emitting device including a light emitting element with a plurality of light emitting cells connected in series. Accordingly, it is possible to simplify a manufacturing process of a light emitting device for illumination capable of being used with a household AC power source, to decrease a fraction defective occurring in manufacturing a light emitting device for illumination, and to mass-produce the light emitting device for illumination. Further, there is an advantage in that DC driving efficiency can be enhanced in an AC operation by installing a predetermined rectifying circuit outside the light emitting element. | 09-01-2011 |
| 20110215345 | SOLID STATE LAMP WITH THERMAL SPREADING ELEMENTS AND LIGHT DIRECTING OPTICS - Lamps and bulbs are disclosed generally comprising different combinations and arrangements of a light source, one or more wavelength conversion materials, regions or layers which are positioned separately or remotely with respect to the light source, and a separate diffusing layer. This arrangement allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of a co-planar arrangement of LEDs. The lamps according to the present invention can also comprise thermal management features that provide for efficient dissipation of heat from the LEDs, which in turn allows the LEDs to operate at lower temperatures. The lamps can also comprise optical elements to help change the emission pattern from the generally directional (e.g. Lambertian) pattern of the LEDs to a more omni-directional pattern. | 09-08-2011 |
| 20110215346 | LIGHT EMITTING DIODE - AC LED according to the present invention comprises a substrate, and at least one serial array having a plurality of light emitting cells connected in series on the substrate. Each of the light emitting cells comprises a lower semiconductor layer consisting of a first conductive compound semiconductor layer formed on top of the substrate, an upper semiconductor layer consisting of a second conductive compound semiconductor layer formed on top of the lower semiconductor layer, an active layer interposed between the lower and upper semiconductor layers, a lower electrode formed on the lower semiconductor layer exposed at a first corner of the substrate, an upper electrode layer formed on the upper semiconductor layer, and an upper electrode pad formed on the upper electrode layer exposed at a second corner of the substrate. The upper electrode pad and the lower electrode are respectively disposed at the corners diagonally opposite to each other, and the respective light emitting cells are arranged so that the upper electrode pad and the lower electrode of one of the light emitting cells are symmetric with respect to those of adjacent another of the light emitting cells. | 09-08-2011 |
| 20110220919 | FLUORESCENT SUBSTANCE, PROCESS FOR PRODUCTION OF FLUORESCENT SUBSTANCE, LIGHT-EMITTING DEVICE AND LIGHT-EMITTING MODULE - The embodiment provides a process for production of an oxynitride fluorescent substance. An compound containing In or Ga is adopted in the process as a material thereof. The red fluorescent substance produced by the process can be combined with a semiconductor light-emitting element, so as to be used in a light-emitting device or a light-emitting module. | 09-15-2011 |
| 20110220920 | METHODS OF FORMING WARM WHITE LIGHT EMITTING DEVICES HAVING HIGH COLOR RENDERING INDEX VALUES AND RELATED LIGHT EMITTING DEVICES - Methods of forming a light emitting device are provided in which a solid state lighting source is heated and a luminescent solution is applied to the heated solid state lighting source to form the light emitting device. The luminescent solution includes a first material that down-converts the radiation emitted by the solid state lighting source to radiation that has a peak wavelength in the green color range and that has a full width half maximum emission bandwidth that extends into the cyan color range, and at least one additional material that down-converts the radiation emitted by the solid state lighting source to radiation having a peak wavelength in another color range. | 09-15-2011 |
| 20110220921 | Organic light emitting display apparatus - An organic light emitting display apparatus includes a plurality of sub-pixels, each of the sub-pixels having a first electrode, a second electrode facing the first electrode, and an intermediate layer disposed between the first and second electrodes, the intermediate layer having a plurality of layers including an organic emission layer, at least one layer of the plurality of layers in the intermediate layer being commonly shared by two sub-pixels arranged in a first direction and by at least two sub-pixels arranged in a second direction perpendicular to the first direction. | 09-15-2011 |
| 20110220922 | Organic light emitting display device and method of manufacturing the same - An organic light emitting display device includes a substrate, a plurality of pixels on the substrate having a first region configured to emit light and a second region configured to transmit external light, a plurality of pixel circuit units, a plurality of first electrodes, a first organic layer on the plurality of first electrodes, a second organic layer on the first organic layer, the second organic layer including an emission layer, a third organic layer on the second organic layer, the third organic layer being positioned in the first region and outside a central portion of the second region, and a second electrode having a first portion only on the third organic layer. | 09-15-2011 |
| 20110220923 | Conductor Structure, Pixel Structure, and Methods of Forming the Same - A method for forming a conductor structure is provided. The method comprises: (1) providing a substrate; (2) forming a patterned dielectric layer with a first opening which exposes a portion of the substrate; forming a patterned organic material layer on the dielectric layer with a second opening which corresponds to the first opening and expose the exposed portion of the substrate; (3) forming a first barrier layer on the organic material layer and the exposed portion of the substrate; (4) forming a metal layer on the first barrier layer; and (5) removing the organic material layer, the first barrier layer thereon and the metal layer thereon. | 09-15-2011 |
| 20110227097 | ACTIVE MATRIX SUBSTRATE, PRODUCTION METHOD OF THE SAME, LIQUID CRYSTAL PANEL, LIQUID CRYSTAL DISPLAY DEVICE, LIQUID CRYSTAL DISPLAY UNIT, AND TELEVISION RECEIVER - An active matrix substrate includes: pixel regions ( | 09-22-2011 |
| 20110227098 | ORGANIC LIGHT EMITTING DISPLAY - An organic light emitting display is capable of reducing or minimizing the number of wiring lines to improve an aperture ratio. The organic light emitting display includes scan lines and data lines that cross each other at crossing regions, sub pixels located at the crossing regions that display an image in accordance with an amount of current that flows from a first power source to respective organic light emitting diodes in the sub pixels, and first power source lines that are parallel to the data lines, each of the first power source lines corresponding to at least two of the data lines. The first power source lines include a first group of the first power source lines that receive the first power source and a second group of the first power source lines that receive a second power source. | 09-22-2011 |
| 20110227099 | MASK FRAME ASSEMBLY FOR THIN FILM DEPOSITION, ORGANIC LIGHT-EMITTING DISPLAY DEVICE USING THE SAME, AND METHOD OF MANUFACTURING THE ORGANIC LIGHT-EMITTING DISPLAY DEVICE - A mask frame assembly for thin film deposition, a organic light-emitting display device using the same, and a method of manufacturing the organic light-emitting display device. The organic light-emitting display device includes a first electrode and a second electrode patterned on a substrate to face each other, and a plurality of organic layers formed between the first and second electrodes. The plurality of organic layers include at least a plurality of stripe-shaped organic layers and a plurality of discontinuous dot-shaped organic layers. | 09-22-2011 |
| 20110227100 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THEREOF - A light-emitting device comprises: a substrate; a plurality of organic electroluminescent elements provided on the substrate; and a partition defining pixel areas in each of which one of the organic EL elements is provided. The partition comprises an insulating film provided with openings each hollowly formed in an area corresponding to one of the pixel areas and a partition body provided on an opposite side of the insulating film with respect to the substrate. Each of the organic EL elements comprises a pair of electrodes and a light-emitting portion that is interposed between the electrodes and that is arranged in an area surrounded by the insulating film. The thickness of the insulating film is smaller than the thickness of the light-emitting portion. | 09-22-2011 |
| 20110227101 | METHOD FOR PROVIDING AND REMOVING DISCHARGING INTERCONNECT FOR CHIP-ON-GLASS OUTPUT LEADS AND STRUCTURES THEREOF - Microelectronic devices may be fabricated while being protected from damage by electrostatic discharge. In one embodiment, a shorting circuit is connected to elements of the microelectronic device, where the microelectronic device is part of a chip-on-glass system. In one aspect of this embodiment, a portion of the shorting circuit is in an area of a substrate where a microchip is bonded. In another embodiment, shorting links of the shorting circuit are comprised of a fusible material, where the fusible material may be disabled by an electrical current capable of fusing the shorting links. | 09-22-2011 |
| 20110233567 | PIXEL ARRAY - A pixel array is located on a substrate and includes a plurality of pixel sets. Each of the pixel sets includes a first scan line, a second scan line, a data line, a data signal transmission line, a first pixel unit, and a second pixel unit. The data line is not parallel to the first and the second scan lines. The data signal transmission line is disposed parallel to the first and the second scan lines and electrically connected to the data line. Distance between the first and the second scan lines is smaller than distance between the data signal transmission line and one of the first and the second scan lines. The first pixel unit is electrically connected to the first scan line and the data line. The second pixel unit is electrically connected to the second scan line and the data line. | 09-29-2011 |
| 20110233568 | LED STREET LAMP - Disclosed is a light emitting diode (LED) street lamp using an LED as a light source and capable of minimizing a luminance deviation within an illuminated area while increasing the luminance of the entire illuminated area. The LED street lamp includes a case provided at a front end of a lamp post; a board provided inside the case and having a plurality of LEDs spaced apart from each other; and heat dissipation units closely adhered to the board and dissipating heat generated when the LEDs emit light, wherein the plurality of LEDs have different luminance levels from each other, the luminance levels gradually increase from the center of the board to the edge of the board, and diffusing members diffusing the light generated from the plurality of LEDs are provided on board portions corresponding to areas between each of the plurality of LEDs. | 09-29-2011 |
| 20110233569 | ORGANIC LIGHT EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - An organic light emitting display apparatus and method of manufacturing the same to improve an image quality of the organic light emitting display apparatus. The organic light emitting display apparatus includes: a first electrode formed on a substrate; an intermediate layer disposed on the first electrode, the intermediate layer having an organic emission layer; and a second electrode formed on the intermediate layer, wherein the first electrode includes an etching unit facing the intermediate layer. | 09-29-2011 |
| 20110233570 | ORGANIC LIGHT EMITTING DIODE DISPLAY INCLUDING A MICROLENS ARRAY - An organic light emitting diode (OLED) display including a microlens array is disclosed. In one embodiment, the OLED includes a substrate and an organic light emitting diode including a first electrode formed on the substrate, an organic emission layer formed on the first electrode, and a second electrode formed on the organic emission layer. The OLED also includes an encapsulation layer covering the organic light emitting diode, wherein part of the encapsulation layer contacts the substrate, and a microlens array neighboring the encapsulation layer. In one embodiment, the distance between the organic emission layer and the microlens array is about 0.5 μm to about 300 μm. | 09-29-2011 |
| 20110233571 | LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM HAVING THE SAME - Provided is a light emitting device package. The light emitting device package includes a body having a cavity, a plurality of lead frames within the cavity, a light emitting device on at least one of the plurality of lead frames, and a moisture permeation prevention member between each of the lead frames and the body. Each of the lead frames includes a first frame disposed within the cavity, a second frame disposed on a lower surface of the body, and a third frame connecting the first frame to the second frame. The second frame of the lead frames is disposed within the body and at least one portion of the second frame is inclined with respect to the lower surface of the body. The moisture permeation prevention member is disposed on at least third frame of each of the lead frames. | 09-29-2011 |
| 20110233572 | ORGANIC EL DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME - Disclosed is an organic EL display panel which has: a substrate; two or more pixel electrodes arranged on the substrate; a bus electrode, which is positioned beside at least one pixel electrode and is disposed on the substrate; an organic layer which is formed on the pixel electrode by means of a coating method; two or more banks, which are disposed on the substrate and define the arrangement region of the organic layer; and a counter electrode, which is disposed on the organic layer and is connected to the bus electrode. The two or more banks include a bank disposed between the bus electrode and the pixel electrode, and a bank disposed between the pixel electrodes, and the lyophilicity of the surface of the bank disposed between the bus electrode and the pixel electrode is lower than that of the bank disposed between the pixel electrodes. | 09-29-2011 |
| 20110233573 | Method for Producing Temperature-Stable Large-Size Emitting LEDs and LEDs - The invention relates to a method for producing temperature-stable large-size emitting LEDs and LEDs produced by said method. The method is characterised in that a large-area emitting light emitter is provided in the form of semiconductor nanocrystals which furthermore is temperature-stable and has a narrow band emission. A colloidal solution of emitting nanocrystals and a matrix of either inorganic gels or at least one polymer are alternately applied to the substrate with the first electrode by spraying, as a result of the electrostatic interactions between substrate, nanoparticles and inorganic gels or polymers, the nanopartides or the polymers of the matrix are adsorbed and the impurities run down with the solvent. The layer of alternately sprayed nanocrystals and matrix are heated to give a gel cross-linking the metal oxide nanoparticles, wherein thee size of thee semiconductor nanocrystals which determine the emission wavelength are determined by the temperature and duration of the heating. The second electrode is then applied by means of a conventional PVD method. | 09-29-2011 |
| 20110233574 | LIGHT EMITTING DEVICE HAVING A PLURALILTY OF LIGHT EMITTING CELLS AND PACKAGE MOUNTING THE SAME - Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other. | 09-29-2011 |
| 20110241024 | LIGHT EMITTING DIODE HAVING A WAVELENGTH SHIFT LAYER AND METHOD OF MANUFACTURE - Embodiments of the present invention provide an LED having a Wavelength Shift Layer (WSL) and method of manufacture. Specifically, under embodiment of the present invention, a WSL layer is applied over an LED chip. The WSL itself typically comprises two layers: an adhesion layer applied over a set (at least one) of LED chips, and a conformal coating over the adhesion layer. The adhesion layer provides improved adhesive effect of the conformal coating to the LED chip(s). The conformal coating is comprised of a particular phosphor ratio that is determined based on a wavelength measurement of the underlying LED chip(s). Specifically, under the present invention, a wavelength of a light output by an LED chip(s) (e.g., blue or ultra-violet (UV)) is measured (e.g., at the wafer level). Typically, the phosphor ratio of is comprised of at least one of the following colors: yellow, green, or red. Regardless, this conformal coating is applied over a glue layer that itself is applied over the LED chip. | 10-06-2011 |
| 20110241025 | LIGHTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A lighting device including a metal substrate to prevent temperature rise of LED chip is offered. The lighting device includes the metal substrate, an anode or cathode electrode of the LED chip disposed on the metal substrate, brazing materials connecting the LED chip and the metal substrate, and a groove formed in the anode or cathode electrode. Forming the groove can prevent an occurrence of a crack in the brazing materials. | 10-06-2011 |
| 20110241026 | LIGHT-EMITTING DIODE CHIP AND PACKAGE STRUCTURE THEREOF - A light-emitting diode chip includes a first electrode and a metal composite layer. The metal composite layer is disposed on the first electrode and has a nickel layer. Since the metal composite layer is disposed on the first electrode, the yield of the wedge bonding can be increased, and the chip damage can be avoided. | 10-06-2011 |
| 20110241027 | Organic EL Element, Image Display Device and Method for Manufacturing the Same - One embodiment of the present invention is an organic EL element, including a substrate, a first electrode having a pixel region, the first electrode formed on the substrate, a multi-step partition wall, including a first partition wall formed on the substrate, the first partition wall sectioning the first substrate and having an inverse tapered shape, and a second partition wall formed on the first partition wall, the second partition wall having a bottom part which is narrower than a top part of the first partition wall, a light emitting medium layer, including a first light emitting medium layer formed on the pixel region, the first partition wall and the second partition wall, the first light emitting medium layer made of an inorganic material, and an organic light emitting layer on the first light emitting medium layer, and a second electrode formed on the light emitting medium layer, wherein the first light emitting medium layer is formed on the first electrode and the multi-layer partition wall. | 10-06-2011 |
| 20110241028 | LIGHT EMITTING DEVICE AND LIGHT UNIT HAVING THE SAME - Provided are a light emitting device and a light unit including the same. The light emitting device includes a body, a first cavity disposed at a center of the body, the first cavity having an opened upper side, a second cavity disposed around an upper portion of the body, the second cavity being spaced from the first cavity, first and second lead electrodes disposed within the first cavity, a light emitting chip disposed on at least one of the first and second lead electrodes, and a first molding member in the first cavity. The second cavity has an upper width grater than a lower width thereof and a side surface of the second cavity is formed of a vertical side surface with respect to a top surface of the body. | 10-06-2011 |
| 20110241029 | ORGANIC LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light emitting display device can prevent a voltage dropping in a cathode electrode. The organic light emitting display device includes a substrate, cathode wiring arranged on a surface of the substrate, an anode electrode arranged on the substrate and electrically insulated from the cathode wiring, an organic layer arrangement arranged on the anode electrode to form a plurality of unit pixels, a cathode electrode covering the organic layer arrangement and at least one electrical connection unit to electrically connect the cathode wiring to the cathode electrode. | 10-06-2011 |
| 20110241030 | LIGHT EMITTING DEVICE PACKAGE - A light emitting device package is provided which may prevent a Zener element mounted on an electrode from being positioned on an inclined plane of a cavity. The light emitting device package may include a light emitting device mounted on a first electrode, a Zener element mounted on a second electrode, and a body having cavity inclined planes that form a cavity on the first and second electrodes. The cavity inclined planes may include a first cavity inclined plane adjacent to the Zener element. The first cavity inclined plane may include an inclined plane forming a first inclination angle with respect to the second electrode and an interfacing plane forming a second inclination angle with respect to the second electrode, the second inclination angle being different from the first inclination angle. | 10-06-2011 |
| 20110241031 | OPTOELECTRONIC PROJECTION DEVICE - An optoelectronic projection device which generates a predefined image during operation, including a semiconductor body having an active layer that generates electromagnetic radiation and a radiation exit side and is an imaging element of the projection device, wherein, to electrically contact the semiconductor body, a first contact layer and a second contact layer are arranged at a rear side of the semiconductor body, the rear side lying opposite the radiation exit side, and are electrically insulated from one another by a separating layer. | 10-06-2011 |
| 20110241032 | LIGHT-EMITTING DEVICE - A light-emitting device is disclosed capable of reducing the variation of an emission spectrum depending on an angle of viewing a light extraction surface. More particularly, a light-emitting device is disclosed capable of preventing impurities from dispersing from a light-emitting element into a thin film transistor as well as reducing the variation of an emission spectrum depending on an angle of viewing a light extraction surface. The disclosed light-emitting device comprises a substrate; a first insulating layer provided over the substrate; a transistor provided over the first insulating layer; and a second insulating layer having a first opening portion so that the transistor is covered and the substrate is exposed; wherein a light-emitting element is provided inside the first opening portion. | 10-06-2011 |
| 20110241033 | LIGHT-EMITTING DEVICE - A light-emitting device includes a base and a light-emitting element that is disposed on the base. The light-emitting element is made up of a plurality of semiconductor layers including a light-emitting layer, and at the same time, is covered with a wavelength converting portion that includes a wavelength converting material. The light-emitting layer emits primary light, and the wavelength converting material absorbs part of the primary light and emits secondary light. The luminance of the primary light emitted from the edge portion of the light extraction surface of the light-emitting device is higher than the luminance of the primary light emitted from the inner region located inside the edge portion, and the ratio of the primary light and the secondary light that are emitted from a light extraction surface of the wavelength converting portion is substantially uniform across the light extraction surface of the wavelength converting portion. Thereby, a light color difference across the light extraction surface of the wavelength converting portion that covers the light-emitting element can be reduced further, and it is possible to irradiate an irradiation surface with light of uniform color. | 10-06-2011 |
| 20110241034 | SIGNAL LIGHT USING PHOSPHOR COATED LEDS - A method for creating an improved signal light is disclosed. For example, the improved signal light includes a housing, one or more first type of light emitting diodes (LEDs) emitting a light energy having a first dominant wavelength deployed in the housing, one or more second type of LEDs emitting a light energy having a second dominant wavelength deployed in the housing, a filter and a mixer. The filter may filter the light energy of the one or more second type of LEDs such that only a third dominant wavelength passes from the one or more second type of LEDs. The mixer may mix the light energy having the first dominant wavelength and the filtered light energy having the third dominant wavelength to form a light energy having a desired fourth dominant wavelength. | 10-06-2011 |
| 20110241035 | LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND CONTROLLING LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME - An LED package structure for increasing light-emitting efficiency and controlling light-projecting angle includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area disposed on a top surface of the substrate body. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the top surface of the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area. The package unit has a translucent package resin body disposed on the top surface of the substrate body in order to cover the LED chips. The position of the translucent package resin body is limited in the resin position limiting space. | 10-06-2011 |
| 20110248287 | HIGH REFLECTIVE SUBSTRATE OF LIGHT EMITTING DEVICES WITH IMPROVED LIGHT OUTPPUT - Apparatuses and methods for producing light emitting devices maximizing luminous flux output are disclosed. In one possible embodiment, a light emitting device comprises a substrate and a reflective layer at least partially covering the substrate. The reflective layer is non-yellowing, and may be substantially light transparent. One or more light emitting diode (LED) chips are disposed on the substrate. The light emitting device may emit white light. The reflective layer may comprise a silicone carrier with light reflective particles dispersed in the silicone carrier. A light diffusion lens may also be disposed on the substrate and surrounding the LED chips. Furthermore, one or more microspheres, light scattering particles, and/or phosphor particles may be dispersed in the lens. In one possible method for producing a light emitting device, a substrate is provided. One or more LED chips are coupled with the substrate, and a high reflective, non-yellowing coating is applied on at least a portion of the top surface of the substrate. The coating comprises a carrier with reflective particles dispersed throughout. | 10-13-2011 |
| 20110248288 | ELECTRO-LUMINESCENT DISPLAY PANEL - An electro-luminescent display panel including an active device array substrate, a pixel definition layer, electro-luminescent devices, an electrode layer and a protective layer is provided. The substrate includes pixel electrodes. The pixel definition layer on the substrate includes openings, each exposing the corresponding one of the pixel electrodes. The electro-luminescent devices are in the openings. Each electro-luminescent device layer is on the corresponding one of the pixel electrode. The electrode layer is on the pixel definition layer and the electro-luminescent devices. The protective layer including a buffer layer, a first and a second encapsulation films is on the electrode layer. The buffer layer covers the pixel definition layer and the electro-luminescent devices. The first encapsulation film partially covers the buffer layer. The first encapsulation film includes island patterns on the pixel electrodes. The second encapsulation film covers the buffer layer and the first encapsulation film. | 10-13-2011 |
| 20110248289 | LIGHT EMITTING DIODE PACKAGE, LIGHTING DEVICE AND LIGHT EMITTING DIODE PACKAGE SUBSTRATE - A light emitting diode (LED) package includes a LED package substrate, first LED chips and second LED chips. The LED package substrate includes a substrate, a first bonding pad, second bonding pads and a third bonding pad. The first, second and third bonding pads are disposed on the substrate. The second bonding pads are arranged in an array. The first and third bonding pads are located adjacent respectively to first and last column of the array. The first LED chips are die-bonded on the first bonding pad and wire-bonded respectively to the second bonding pads arranged in first column of the array. The second LED chips are die-bonded on the second bonding pads respectively. In each row except last column, each second LED chip is wire-bonded to the second bonding pad arranged in next column. The second LED chips located in last column are wire-bonded to the third bonding pad. | 10-13-2011 |
| 20110248290 | Methods and Apparatus for LED Lighting with Heat Spreading in Illumintion Gaps - Techniques for light emitting diode (LED) lighting with heat spreading in illumination gaps. Inexpensive structural aluminum may be suitably employed to form a passive heat spreading mount for plural LEDs whose illumination collectively combines to provide the light needed by a particular lighting fixture, such as a pendant chandelier, by way of example, by angling fins of the passive heat spreading mount to correspond to illumination gaps of the LEDs. | 10-13-2011 |
| 20110248291 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - An object of the invention is to provide a method for manufacturing semiconductor devices that are flexible in which elements fabricated using a comparatively low-temperature (less than 500° C.) process are separated from a substrate. After a molybdenum film is formed over a glass substrate, a molybdenum oxide film is formed over the molybdenum film, a nonmetal inorganic film and an organic compound film are stacked over the molybdenum oxide film, and elements fabricated by a comparatively low-temperature (less than 500° C.) process are formed using existing manufacturing equipment for large glass substrates, the elements are separated from the glass substrate. | 10-13-2011 |
| 20110254022 | LIGHT EMITTING DEVICE - There is presented a light emitting device, having plural light emitting elements disposed on a substrate, in which a protection element, such as a zener diode, can be disposed at an appropriate position. The light emitting device includes: a substrate; a light emitting section having plural light emitting elements disposed in a mounting area on the substrate; a positive electrode and negative electrode each having a pad section and wiring section to apply voltage to the light emitting section through the wiring sections; a protection element disposed at one of the positive electrode and negative electrode and electrically connected with the other one electrode; and a light reflecting resin formed on the substrate such as to cover at least the wiring sections and the protection element, wherein the wiring sections are formed along the periphery of the mounting area such that one end portions thereof are adjacent to each other. | 10-20-2011 |
| 20110254023 | LUMINAIRE AND LIGHT-EMITTING APPARATUS WITH LIGHT-EMITTING DEVICE - According to one embodiment, the light-emitting apparatus is provided with a substrate, a plurality of light-emitting devices, and a phosphor layer. The plurality of light-emitting devices are mounted on the substrate. The phosphor layer is formed of a translucent resin containing a phosphor and includes a phosphor portion that is formed in a convex shape and covers a predetermined number of the light-emitting device. Bases of the adjacent phosphor portions are formed by being linked with one another. | 10-20-2011 |
| 20110254024 | Circuit Structure of Package Carrier and Multi-Chip Package - A multi-chip package comprises a plurality of chip pads and a plurality of LED chips. The chip pads are arranged in an M×N array, M and N each a positive integer greater than 1. A peripheral area of each chip pad comprises a respective first bonding pad, a respective second bonding pad, and a respective third bonding pad arranged in sequence in a clockwise direction. A first orientation of the respective first to third bonding pads in a first row of the N rows differs from a second orientation of the respective first to third bonding pads in a second row of the N rows by 90 degrees. Each of the LED chips is disposed on a respective one of the chip pads and electrically connected to two of the respective first to third bonding pads on a same side of the respective LED chip. | 10-20-2011 |
| 20110254025 | Light-Emitting Diode Packaging Structure and Module and Assembling Method Thereof - A light-emitting diode packaging structure comprises a light-emitting diode and first and second metal plates on which the light-emitting diode is mounted. The light-emitting diodes includes first and second electrode leads, the second electrode lead having first and second contact surfaces on an outer edge of the second electrode lead. The first metal plate includes at least one clamping portion that clamps and fixes the first electrode lead on the first metal plate. The second metal plate includes at least first and second clamping portions. The first contact surface of the second electrode lead contacts the first clamping portion, and the second contact surface of the second electrode lead contacts the second clamping portion, such that the light-emitting diode is fixed on the second metal plate in at least two dimensions parallel to a primary surface of the second metal plate on which the light-emitting diodes is mounted. | 10-20-2011 |
| 20110254026 | SURFACE MOUNTED LED PACKAGE - An LED device and LED module are provided. The LED device is coupled to a lead frame with a first plane and a second plane opposite to the first plane, the lead frame having a LED chip disposed on the first plane. The LED device includes a reflection cup structure disposed on the lead frame, a lens structure and at least one fixing structure. The LED chip is disposed in the reflection cup structure and electrically connected to the first plane of the lead frame. The lens structure covers the first plane and the second plane of the lead frame. The fixing structure and the fixing structures are formed integrally and cover the lead frame cooperatively. | 10-20-2011 |
| 20110260178 | LIGHTING SYSTEM INCLUDING COLLIMATORS ALIGNED WITH LIGHT EMITTING SEGMENTS - A light source comprising a semiconductor light emitting device is connected to a mount. The light emitting device comprises a plurality of segments with neighboring segments spaced less than 200 microns apart. In some embodiments, multiple segments are grown on a single growth substrate. Each segment comprises a light emitting layer disposed between an n-type region and a p-type region. A spacer is positioned on a top surface of the mount. The light emitting device is positioned in an opening in the spacer. A plurality of collimators is attached to the spacer, wherein each collimator is aligned with a single segment. | 10-27-2011 |
| 20110260179 | FLEXIBLE LED PACKAGING STRUCTURE - A flexible LED packaging structure includes two or more metal foil substrates. One or more LED chips are assembled onto the primary metal foil substrate by silver glue or solder paste or eutectic. A secondary metal foil substrate is electrically connected with the LED chip by wires or eutectic. There is a spacing between the primary and secondary metal foil substrates. A packaging colloid, made of a flexible material, is fully covered onto the LED chip and partially covered onto the primary and secondary metal foil substrates, such that the lower surface of the primary and secondary metal foil substrates is exposed. With this principle, a plurality of LEDs is electrically connected in parallel or in series, and the metal foil substrate could be used to improve the heat-radiating effect, thus enabling flexible assembly onto multiple lightings. | 10-27-2011 |
| 20110260180 | IMAGE DISPLAY DEVICE AND THE METHOD FOR MANUFACTURING THE SAME - An image display device comprises: a first substrate having flexure property; a first resin layer which is attached to the first substrate and over which thin film transistors are located; a barrier layer which comprises an inorganic film covering a surface of the resin layer; and a first thin film layer and a second thin film layer which are located so as to sandwich the first resin layer with the barrier layer disposed therebetween. | 10-27-2011 |
| 20110266560 | WHITE-EMITTING LED CHIPS AND METHOD FOR MAKING SAME - Methods and devices for light emitting diode (LED) chips are provided. In one embodiment of a method, a pre-formed capping wafer is provided, with the capping wafer comprising a conversion material. A wire-bond free LED wafer is fabricated comprising a plurality of LEDs. The capping wafer is bonded to the LED wafer using an adhesive. The LED chips are later singulated upon completion of all final fabrication steps. The capping wafer provides a robust mechanical support for the LED chips during fabrication, which improves the strength of the chips during fabrication. Additionally, the capping wafer may comprise an integrated conversion material, which simplifies the fabrication process. In one possible embodiment for an LED chip wafer, a submount wafer is provided, along with a plurality of LEDs flip-chip mounted on the submount wafer. Additionally, a capping wafer is bonded to the LEDs using an adhesive, and the capping wafer comprises a conversion material. At least some of the light emitted from the LEDs passes through the capping wafer where at least some of the light is converted by the conversion material. | 11-03-2011 |
| 20110266561 | Optical Systems Fabricated by Printing-Based Assembly - The present invention provides optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity. Optical systems of the present invention include, however, devices and device arrays provided on conventional rigid or semi-rigid substrates, in addition to devices and device arrays provided on flexible, shapeable and/or stretchable substrates. | 11-03-2011 |
| 20110266562 | GLASS SUBSTRATE WITH AN ELECTRODE, ESPECIALLY A SUBSTRATE INTENDED FOR AN ORGANIC LIGHT-EMITTING DIODE DEVICE - A glass substrate includes a first side and a second opposite side, and provided, on its second side, with an electrode which is formed by at least one electrically conductive film, the substrate having, over all of its second side, and through a thickness e extending toward the interior of the substrate in the direction of the first side, a refractive index variation, of the glass, obtained by an ion-exchange treatment, the refractive index at the surface being greater than that of the glass located beyond the thickness e. | 11-03-2011 |
| 20110266563 | METHOD FOR FORMING A MULTI-LEVEL SURFACE ON A SUBSTRATE WITH AREAS OF DIFFERENT WETTABILITY AND A SEMICONDUCTOR DEVICE HAVING THE SAME - The invention relates to a method | 11-03-2011 |
| 20110266564 | SEMICONDUCTOR DISPLAY DEVICE - A semiconductor display device using a light-emitting element, which can suppress luminance unevenness among pixels due to the potential drop of a wiring, is provided. Power supply lines to which a power supply potential is supplied are electrically connected to each other in a display region where a plurality of pixels are arranged. Further, an interlayer insulating film is formed over a wiring (an auxiliary power supply line) for electrically connecting the power supply lines to each other in the display region and a gate electrode of a transistor included in a pixel; and the power supply lines are formed over the interlayer insulating film which is formed over the auxiliary power supply line and the gate electrode. Furthermore, a wiring (an auxiliary wiring) formed over the interlayer insulating film is electrically or directly connected to the auxiliary power supply line. | 11-03-2011 |
| 20110272714 | Organic light emitting diode display - An organic light emitting diode (OLED) display including a display substrate; a sealing member facing the display substrate; a sealant between the display substrate and the sealing member, the sealant cohering the display substrate and the sealing member; a plurality of conductive wires on the display substrate and overlapping the sealant; and a heat blocking film between the conductive wire and the sealant, the heat blocking film including a plurality of sub-heat blocking films. | 11-10-2011 |
| 20110272715 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE ORGANIC LIGHT EMITTING DISPLAY DEVICE - An organic light-emitting display device and a method of manufacturing the same are disclosed. The organic light-emitting display device includes: a substrate, a plurality of pixels on the substrate, a plurality of first electrodes, each disposed in each of the plurality of pixels, a pixel defining layer including a first pixel defining sub-layer disposed between each two adjacent first electrodes, and a second pixel defining sub-layer covering the first pixel defining sub-layer and surface edge portions of each two adjacent first electrodes, an intermediate layer disposed on each of the first electrodes and including an emission layer, and a second electrode configured to face the first electrodes. | 11-10-2011 |
| 20110272716 | LEAD FRAME FOR CHIP PACKAGE, CHIP PACKAGE, PACKAGE MODULE, AND ILLUMINATION APPARATUS INCLUDING CHIP PACKAGE MODULE - A lead frame for a chip package, a chip package, a package module, and an illumination apparatus including the chip package module. The chip package includes a first coupling portion and a second coupling portion that are coupled to each other on edges of a lead frame for mounting a chip thereon, and thus a package module is easily embodied by coupling the first coupling portion and the second coupling portion to each other. | 11-10-2011 |
| 20110272717 | Light Emitting Device And Method of Manufacturing The Same - A light emitting device having a structure in which oxygen and moisture are prevented from reaching light emitting elements, and a method of manufacturing the same, are provided. Further, the light emitting elements are sealed by using a small number of process steps, without enclosing a drying agent. The present invention has a top surface emission structure. A substrate on which the light emitting elements are formed is bonded to a transparent sealing substrate. The structure is one in which a transparent second sealing material covers the entire surface of a pixel region when bonding the two substrates, and a first sealing material (having a higher viscosity than the second sealing material), which contains a gap material (filler, fine particles, or the like) for protecting a gap between the two substrates, surrounds the pixel region. The two substrates are seated by the first sealing material and the second sealing material. Further, reaction between electrodes of the light emitting elements (cathodes or anodes) and the sealing materials can be prevented by covering the electrodes with a transparent protective layer, for example, CaF | 11-10-2011 |
| 20110278600 | LIGHT EMITTING DIODE MODULE AND METHOD OF MAKING THE SAME - A light emitting diode module includes a substrate, at least two spaced apart light emitting diodes formed on the substrate, an insulating layer, and an electrically conductive layer. Each of the light emitting diodes includes a light emitting unit, an n-electrode, and a p-electrode. The light emitting unit has first and second portions. The first portion has an n-type top face and a first stepped side. The second portion has a p-type top face and a second stepped side. The insulating layer is formed on the n-type top face and the first stepped side of the first portion of one of the light emitting diodes, and the second stepped side and the p-type top face of the second portion of the other one of the light emitting diodes. The electrically conductive layer is formed on the insulating layer. A method of making the light emitting diode module is also disclosed. | 11-17-2011 |
| 20110278601 | LIGHT EMITTING DIODE PACKAGE - An LED package includes a silicon base, an LED and a glass encapsulant. The silicon base has a first surface and a second surface opposite to the first surface. The LED chip is located on the first surface of the silicon base. The glass encapsulant covers the LED chip. The glass encapsulant and the silicon base define a receiving space therebetween to receive the LED chip. The glass encapsulant is fixedly engaged with the first surface of the silicon base, so the glass encapsulant and the silicon base enclose the LED chip. | 11-17-2011 |
| 20110278602 | LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A light emitting device includes a substrate having an element mounting area in a principal surface thereof. The light emitting device also includes at least one light emitting element mounted in the element mounting area of the substrate. The light emitting device also includes a heat transfer member provided on the substrate. The heat transfer member has a thermal conductivity different from thermal conductivity of the substrate so as to form uneven thermal resistance distribution in the element mounting area. Thermal resistance in a heat radiation path through the substrate for release of heat emitted from the light emitting element changes with the mounting position of the light emitting element. | 11-17-2011 |
| 20110278603 | ORGANIC EL DISPLAY AND METHOD FOR MANUFACTURING SAME - Disclosed is a method for manufacturing an organic EL display, which comprises: a step of preparing an organic EL panel that comprises a substrate and organic EL elements arranged as a matrix on the substrate, wherein each organic EL element has a pixel electrode arranged on the substrate, an organic layer arranged on the pixel electrode, a transparent counter electrode arranged on the organic layer, a protective layer arranged on the transparent counter electrode, and a color filter arranged on the protective layer, and a defect portion present in the organic layer in each organic EL element is detected; a step of destroying a region of the transparent counter electrode positioned above the defect portion by irradiating the region with laser light through the color filter; and a step wherein a region of the color filter positioned above the defect portion is removed. | 11-17-2011 |
| 20110284877 | POWER-TYPE LED - The invention discloses a power-type LED comprising a support frame, a group of LED chips mounted on the frame, and an exterior wrapping layer made of a fluorescent substance; Said support frame consists of a left support and an opposite right support placed at a distance from each other; The upper parts of the left and right supports are semi-cylinders, semi-cones, or semi-rings having multi-direction chip-fixing surfaces; A group of LED chips is respectively fixed onto the chip-fixing surfaces of the left support and the right support. All LED chips are serial-connected or parallel-connected with conducting wires. One of the supports is used as the positive pole and the other is used as the negative pole; The middle segment of the left and right supports is wrapped with an insulating layer which combines the left and right supports into an integrated support frame and insulates them from each other; The outer side of the upper part of the two-support frame is covered with a fluorescent layer which can enclose LED chips. The device can be made into a semiconductor light source and provides good heat-dissipating effect. | 11-24-2011 |
| 20110284878 | LIGHT EMITTING DIODE MODULE, AND LIGHT EMITTING DIODE LAMP - A light emitting diode (LED) lamp including a socket, an LED module disposed on the socket, and a lamp housing assembled to the socket is provided. LED module includes a supporting member and a plurality of LED packages, wherein each LED package includes a chip carrier, a reflective member, an LED chip, a lens, and a phosphor layer. Reflective member mounted on the chip carrier has a recess for exposing parts of the chip carrier. LED chip disposed in the recess. Lens encapsulating the LED chip has a light-emitting surface, a first reflection surface bonded with the reflective member and a second reflection surface, wherein the LED chip faces the light-emitting surface of the lens. | 11-24-2011 |
| 20110284879 | LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DIODE MODULE - A light emitting diode (LED) package comprising a carrier, an LED chip, a lens, and a phosphor layer is provided. The LED chip disposed on the carrier. The lens encapsulating the LED chip has a plurality of fins surrounding the LED chip and a conical indentation. The fins extending backward the LED chip radially. Each of the fins has at least one light-emitting surface and at least one reflection surface adjoining the light-emitting surface. A bottom surface of the conical indentation is served as an total reflection surface. The phosphor layer is disposed on the light-emitting surfaces of the lens. An LED package and an LED module are also provided. | 11-24-2011 |
| 20110284880 | LIGHT EMITTING DEVICE ARRAY, METHOD FOR FABRICATING LIGHT EMITTING DEVICE ARRAY AND LIGHT EMITTING DEVICE - A light emitting device array includes a first supporting member, at least two bonding layers disposed on the first supporting member, a second supporting member disposed on each of the at lest two bonding layers, a light emitting structure disposed on the second supporting member, the light emitting structure comprising a first conductivity type semiconductor layer, a second conductivity type semiconductor layer and an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, and a first electrode disposed on the light emitting structure. | 11-24-2011 |
| 20110284881 | DISPLAY APPARATUS - At least one of the pixels has a first region and a second region that are the same in color but different in viewing angle characteristic, and includes a switching circuit configured to independently turn on or off each of the organic EL elements provided in the respective first and second regions. | 11-24-2011 |
| 20110284882 | LIGHT EMITTING DEVICE PACKAGE - A light emitting device package is provided comprising a substrate, a first light emitting device, a body including a first lead frame on which the first light emitting device is disposed and a second lead frame separated from the first lead frame and an ESD device which contacts the first and second lead frames, and at least a part to which is exposed the outside of the body. | 11-24-2011 |
| 20110284883 | SEMICONDUCTOR LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, LUMINAIRE, DISPLAY UNIT, TRAFFIC SIGNAL LAMP UNIT, AND TRAFFIC INFORMATION DISPLAY UNIT - Provided is a light-emitting element in which two LED structures are dividedly formed on a rectangular substrate. The LED structures are each a semiconductor layer made by laminating an n-type semiconductor layer (a LED structure), an active layer (not shown), and a p-type semiconductor layer, and are respectively provided near both ends of a diagonal line of the upper surface of the substrate. On the upper surface of the substrate, two bonding electrodes each having a circular surface are also respectively formed near both ends of the other diagonal line, and two resistance elements each formed of the n-type semiconductor layer are respectively provided near two opposite sides of the substrate. | 11-24-2011 |
| 20110284884 | LIGHT EMITTING DIODE CHIP FOR HIGH VOLTAGE OPERATION AND LIGHT EMITTING DIODE PACKAGE INCLUDING THE SAME - A light emitting diode (LED) chip for high voltage operation and an LED package including the same arc disclosed. The LED chip includes a substrate, a first array formed on the substrate and including n light emitting cells connected in series, and a second array formed on the substrate and including m (m≦n) light emitting cells connected in series. During operation of the LED chip, the first array and the second array are operated by being connected in reverse parallel to each other. Further, when a driving voltage of the first array is delined as Vd1 and a driving voltage of the second array is defined as Vd2, a difference between Vd1 and Vd2×(n/m) is not more than 2V. | 11-24-2011 |
| 20110284885 | LIGHT EMITTIG DEVICE PACKAGE AND IMAGE DISPLAY APPARATUS INCLUDING THE SAME - Disclosed herein is a light emitting device package including first lead frame and second lead frame mounted on a package body, a light emitting device electrically connected to the first lead frame and second lead frame, to emit light of a first wavelength range, and an encapsulant surrounding the light emitting device, the encapsulant comprising phosphors to be excited by the light of the first wavelength range, thereby emitting light of a second wavelength range, and a resin having a refractive index of 1.1 to 1.3. | 11-24-2011 |
| 20110291113 | FILTER FOR A LIGHT EMITTING DEVICE - Embodiments of the invention include a semiconductor light emitting device capable of emitting first light having a first peak wavelength and a wavelength converting element capable of absorbing the first light and emitting second light having a second peak wavelength. In some embodiments, the structure further includes a metal nanoparticle array configured to pass a majority of light in a first wavelength range and reflect or absorb a majority of light in a second wavelength range. In some embodiments, the structure further includes a filter configured to pass a majority of light in a first wavelength range and reflect or absorb a majority of light in a second wavelength range, wherein the filter is configured such that a wavelength at which a minimum amount of light is passed by the filter shifts no more than 30 nm for light incident on the filter at angles between 0° and 60° relative to a normal to a major surface of the filter. | 12-01-2011 |
| 20110291114 | LED PACKAGE STRUCTURE - A light-emitting diode (LED) package structure includes a substrate, a first LED, a second LED, and a resin material. At least one enclosure made of a transparent material forms on a surface of the substrate, and encloses and forms at least one area on the substrate. The first LED and the second LED are disposed in the area and adjacent to each other, and the resin material is disposed in the area, and covers the first LED and the second LED. The LED package structure obtains desired illuminating lights by mixing lights respectively emitted by the first LED and the second LED. | 12-01-2011 |
| 20110291115 | ORGANIC LIGHT EMITTING DISPLAY - An organic light emitting display having first pixel power source lines receiving a pixel driving voltage from first power supply sources and second pixel power source lines arranged between the first pixel power source lines and receiving a pixel driving voltage from second power supply sources, the light emitting diode of each of a plurality of pixels included in an image display unit is divided into two, and the divided light emitting diodes are coupled to the different pixel power source lines so that brightness non-uniformity of the image display unit caused by the IR drops of the pixel power source lines is reduced or prevented. | 12-01-2011 |
| 20110291116 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME - An organic light emitting diode (OLED) display is disclosed. In one embodiment, the display includes i) a substrate, ii) a driving circuit formed on the substrate, iii) an organic light emitting diode formed on the substrate and electrically connected to the driving circuit, iv) an encapsulation thin film formed on the driving circuit and organic light emitting diode and v) a spacer formed on the substrate and surrounding the encapsulation thin film. | 12-01-2011 |
| 20110291117 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREFOR - A manufacturing method of an organic light emitting diode (OLED) display device includes forming a thin film transistor and an organic light emitting diode in a display area of a first substrate, forming a thin film encapsulation layer that has a layering structure of an organic film and an inorganic film on one substrate of the first substrate and a second substrate, forming a sealing member by coating a sealing material that includes an inorganic sealant and an organic compound on an edge of the second substrate, removing the organic compound of the sealing member by baking the sealing member, layering the second substrate on the first substrate so that the sealing member contacts the first substrate, dissolving the sealing member by using a laser beam, solidifying the sealing member, attaching the sealing member to the first substrate, and removing the second substrate from the sealing member. | 12-01-2011 |
| 20110291118 | Mother substrate for flat panel display apparatus and method of manufacturing the same - A mother substrate for forming flat panel display apparatuses and a method of manufacturing the same, the mother substrate including a substrate; a plurality of display units on the substrate, the display units being for forming a plurality of flat panel display apparatuses; a sealing substrate facing the display units; sealing members between the substrate and the sealing substrate, the sealing members surrounding each of the display units; a plurality of wiring units between the substrate and the sealing substrate, the wiring units overlapping the sealing members; a connecting unit including a conductive material, the connecting unit connecting adjacent wiring units in one direction and having a width that is greater than a width of each of the wiring units; and inlets connected to the plurality of wiring units and an external power source, the inlets being for applying a voltage to the plurality of wiring units. | 12-01-2011 |
| 20110291119 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display is disclosed. The organic light emitting diode display includes a base substrate including a display area and a non-display area around the display area, a plurality of pixels formed over the display area of the base substrate, the plurality of pixels including a common electrode, a common power line formed over the base substrate and electrically connected to a circuit of each of the plurality of pixels, an encapsulation substrate bonded to the base substrate by a sealing member surrounding the plurality of pixels, the encapsulation substrate including an inner surface facing the base substrate, a first conductive layer formed over the inner surface and electrically connecting the common power line to a first potential, and a second conductive layer formed over the inner surface and spaced apart from the first conductive layer, the second conductive layer electrically connecting the common electrode to a second potential. | 12-01-2011 |
| 20110291120 | Light Emitting Devices Using Connection Structures And Methods Of Manufacturing The Same - Example embodiments of the present invention relate to a light emitting device having a connection structure and a method of manufacturing the light emitting device. The method of manufacturing may include forming a light emitting region and electrode layers on a substrate in which a plurality of cell regions and a bridge for partially connecting the cell regions are disposed, thereby providing a light emitting device that controls stress with relative ease and integrates electrical connections between the cell regions. | 12-01-2011 |
| 20110291121 | LIGHT EMITTING ELEMENT PACKAGE - A light emitting element package includes a substrate, at least two light emitting element modules and an encapsulation member. The substrate includes a circuit layer. The circuit layer includes a plurality of solder pads. The at least two light emitting element modules are mounted on the substrate. Each of the at least two light emitting element modules includes a plurality of light emitting elements. Each light emitting element of the at least two light emitting element modules is electrically coupled to neighboring light emitting element in serial through the solder pads. The at least two light emitting element modules are reversely arranged. The encapsulation member is configured to encapsulate the at least two light emitting element modules on the substrate. | 12-01-2011 |
| 20110291122 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A display device with the substrate divided into three areas. A semiconductor layer is formed in the first second areas and includes a channel area and source/drain areas; a gate insulating layer formed on the semiconductor layer in an area corresponding to the channel area; and a gate electrode formed on the gate insulating layer. The source/drain electrodes contact the source/drain areas, respectively; a pixel electrode is formed in the same layer but in a third area; an interlayer insulating layer is formed on a whole surface of the substrate including the formed structures; and a gate line is formed on the interlayer insulating layer and is electrically connected to a gate electrode of the first area through a via contact hole of the interlayer insulating layer. | 12-01-2011 |
| 20110291123 | METHOD FOR PRODUCING A PLURALITY OF LED ILLUMINATION DEVICES AND A PLURALITY OF LED CHIPSETS FOR ILLUMINATION DEVICES, AND LED ILLUMINTATION DEVICE - A method for producing a plurality of LED illumination devices which each emit light having an average value of a first photometric parameter including producing a plurality of LED chips which emit light of the same color; measuring values of the first photometric parameter of the LED chips; combining the LED chips to form groups of at least two LED chips which have different values of the first photometric parameter such that differences in the average values of all the LED illumination devices are imperceptible to the human eye; and equipping a respective LED illumination device with a group of LED chips. | 12-01-2011 |
| 20110291124 | Improved Packaging for LED Combinations - In summary, the present invention relates to a device, a system, a method and a computer program enabling a thermally improved packaging of a plurality of light emitting diodes ( | 12-01-2011 |
| 20110291125 | LIGHTING MODULE - A lighting module may include a lighting band with a band-shaped flexible substrate, wherein at least one semiconductor light source is applied to a top side of the substrate, wherein the lighting module is faced with a protective layer such that at least one emission area of the at least one semiconductor light source is exposed thereby. | 12-01-2011 |
| 20110291126 | ACTIVE MATRIX SUBSTRATE AND DISPLAY DEVICE - An active matrix substrate ( | 12-01-2011 |
| 20110291127 | LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THE LIGHT EMITTING DEVICE - Disclosed is a light emitting device including, a light emitting structure that has a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, wherein the active layer is provided between the first conductive semiconductor layer and the second conductive semiconductor layer, and includes a plurality of well layers and at least one barrier layer, wherein the barrier layer includes a first nitride layer and a second nitride layer provided on the first nitride layer, and wherein the first nitride layer has a larger energy band gap than the second nitride layer while the energy band gap of the second nitride layer is larger than that of each well layer. | 12-01-2011 |
| 20110291128 | LIGHT-EMITTING ELEMENT, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT - A light emitter and method for manufacturing a light emitter. The light emitter includes a first electrode, a charge injection transport layer, a light-emitting layer, and a second electrode that are layered in this order. At least the light-emitting layer is defined by bank. The charge injection transport layer includes a recessed portion having an inner bottom surface in contact with a bottom surface of the light-emitting layer and an inner side surface continuous with the inner bottom surface and in contact at least partly with a side surface of the light-emitting layer. The inner side surface has a lower edge continuous with the inner bottom surface, and an upper edge is aligned with a portion of a bottom periphery of the bank, the portion being in contact with the light-emitting layer or in contact with a bottom surface of the bank. | 12-01-2011 |
| 20110297969 | SEMICONDUCTOR LIGHT EMITTING DEVICE - According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, a transparent layer, and a fluorescent material layer. The transparent layer is provided on the first major surface of the semiconductor layer. The transparent layer is transparent with respect to light emitted by the light emitting layer and has a trench provided outside the outer circumference of the light emitting layer. The fluorescent material layer is provided in the trench and on the transparent layer. The fluorescent material layer includes a first fluorescent material particle provided in the trench and a second fluorescent material particle provided on the transparent layer. A particle size of the first fluorescent material particle is smaller than a width of the trench. A particle size of the second fluorescent material particle is larger than the width of the trench and larger than the particle size of the first fluorescent material particle. | 12-08-2011 |
| 20110297970 | INTEGRALLY FORMED SINGLE PIECE LIGHT EMITTING DIODE LIGHT WIRE AND USES THEREOF - An integrally formed single piece light emitting diode (LED) light wire that provides a smooth, uniform lighting effect from all directions of the LED light wire. The integrally formed single piece LED light wire includes a support substrate, a conductive base formed on the support substrate, the conductive bus comprising a plurality of conductive bus elements, at least one conductive segment arranged between the plurality of conductive bus elements, the at least one conductive segment comprising at least one LED. The integrally formed single piece LED light wire may include built-in sensors/detectors and/or a plurality of LED modules with individually controlled LEDs via microprocessors. The integrally formed single piece LED light wire may also include an interlocking alignment system which permits the coupling of at least two LED light wires. Further, a plurality of the integrally formed single piece LED light wires may create a lighting panel. | 12-08-2011 |
| 20110297971 | LED LIGHTING DEVICE - An LED lighting device A | 12-08-2011 |
| 20110297972 | LIGHT EMITTING DEVICE HAVING PLURALITY OF LIGHT EMITTING CELLS AND METHOD OF FABRICATING THE SAME - A light emitting device having a plurality of light emitting cells is disclosed. The light emitting device comprises a substrate; a plurality of light emitting cells positioned on the substrate to be spaced apart from one another, each of the light emitting cells comprising a p-type lower semiconductor layer, an active layer and an n-type upper semiconductor layer; p-electrodes positioned to be spaced apart from one another between the substrate and the light emitting cells, the respective p-electrodes being electrically connected to the corresponding lower semiconductor layers, each of the p-electrodes having an extension extending toward adjacent one of the light emitting cells; n-electrodes disposed on upper surfaces of the respective light emitting cells, wherein a contact surface of each of the n-electrodes electrically contacting with each light emitting cell exists both sides of any straight line that bisects the light emitting cell across the center of the upper surface of the light emitting cell; a side insulating layer for covering sides of the light emitting cells; and wires for connecting the p-electrodes and the n-electrodes, the wires being spaced apart from the sides of the light emitting cells by the side insulating layer. | 12-08-2011 |
| 20110297973 | LED WITH AN ADSORPTION PLATE - The present invention relates to an LED with an adsorption plate attached thereto, and more particularly, to an LED which is covered with a light transmitter made of a light-transmitting material to prevent light scattering and to restrict the light radiation range to the size of the light transmitter. The light transmitter has a thin film light-transmitting portion and a thick film light-transmitting portion to improve visibility at a short distance and at a long distance, and from the front and the side. Further, a user may freely combine LEDs with adsorption plates attached thereto to express words or sentences for advertisements, and may also easily change the words or sentences. | 12-08-2011 |
| 20110297974 | LED ASSEMBLY WITH COLOR TEMPERATURE CORRECTION CAPABILITY - An illumination assembly is provided which is capable of correcting a color temperature. The assembly includes a substrate with a plurality of coatings applied on a respective plurality of surface portions of a base material. A light emitting device includes one or more light emitting elements of a first color temperature mounted on surface portions of the substrate having a first color coating, and one or more light emitting elements having a second color temperature mounted on surface portions of the substrate having a second color coating. Light emitting elements are individually sealed with a resin containing an excitable phosphor, with a reflectance factor of the first color coating and a reflectance factor of the second color coating set corresponding to light emitted from the light emitting elements having the first and second color temperatures, respectively, with respect to a desired color temperature for the light emitting device. | 12-08-2011 |
| 20110297975 | LIGHT-EMITTING UNIT ARRAY - A light-emitting unit array includes a plurality of light-emitting units arranged and integrated monolithically in an array, and each of the light-emitting units includes a first doped type layer, a second doped type layer, a light-emission layer, and a photonic crystal structure. The light emission layer is disposed between the first doped type layer and the second doped type layer, wherein the second doped type layer has a surface facing away from the light emission layer. The photonic crystal structure is disposed on the surface of the second doped type layer. | 12-08-2011 |
| 20110303926 | LIGHT EMITTING DIODE SYSTEMS INCLUDING OPTICAL DISPLAY SYSTEMS HAVING A MICRODISPLAY - Light emitting diode systems are disclosed. | 12-15-2011 |
| 20110303927 | LIGHT EMITTING MODULE AND ILLUMINATION APPARATUS - A light emitting module ( | 12-15-2011 |
| 20110303928 | LED LAMP - An LED lamp A includes a plurality of LED modules | 12-15-2011 |
| 20110309377 | Optoelectronic Module having a Carrier Substrate and a Plurality of Radiation-Emitting Semiconductor Components and Method for the Production Thereof - An optoelectronic module is specified, comprising a carrier substrate ( | 12-22-2011 |
| 20110309378 | METHOD FOR MANUFACTURING A MONOLITHIC LED MICRO-DISPLAY ON AN ACTIVE MATRIX PANEL USING FLIP-CHIP TECHNOLOGY AND DISPLAY APPARATUS HAVING THE MONOLITHIC LED MICRO-DISPLAY - A high-resolution, Active Matrix (AM) programmed monolithic Light Emitting Diode (LED) micro-array is fabricated using flip-chip technology. The fabrication process includes fabrications of an LED micro-array and an AM panel, and combining the resulting LED micro-array and AM panel using the flip-chip technology. The LED micro-array is grown and fabricated on a sapphire substrate and the AM panel can be fabricated using CMOS process. LED pixels in a same row share a common N-bus line that is connected to the ground of AM panel while p-electrodes of the LED pixels are electrically separated such that each p-electrode is independently connected to an output of drive circuits mounted on the AM panel. The LED micro-array is flip-chip bonded to the AM panel so that the AM panel controls the LED pixels individually and the LED pixels exhibit excellent emission uniformity. According to this constitution, incompatibility between the LED process and the CMOS process can be eliminated. | 12-22-2011 |
| 20110309379 | LIGHT-EMITTING DEVICE AND LUMINARE - According to one embodiment, a light-emitting device includes a substrate, a plurality of light-emitting elements and a sealing resin. The substrate is formed in a substantially rectangular shape. The plurality of light-emitting elements forms a plurality of rows by being arranged in a direction perpendicular to a longer dimension of the substrate. The rows are arranged in a longer direction of the substrate with a gap provided therebetween. The gap is set between the rows such that illumination intensity is evenly produced. The sealing resin coves each of the rows of the light-emitting elements. | 12-22-2011 |
| 20110309380 | MOTHER SUBSTRATE, ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a mother substrate and a method for manufacturing the same, the mother substrate comprising: a substrate, comprising at least one display region and pre-cutting regions in a periphery of the display region, wherein the display region comprises gate scanning lines and data scanning lines, the pre-cutting regions comprise a gate-line connecting line and a data-line connecting line electrically connected to each other, and the gate-line connecting line is electrically connected to all of the gate scanning lines in the display region, and the data-line connecting line is electrically connected to all of the data scanning lines in the display region substrate. | 12-22-2011 |
| 20110309381 | LIGHT-EMITTING DEVICE AND LIGHTING APPARATUS - According to one embodiment, a light-emitting device includes a series circuit, a substrate, and a sealing member. The series circuit includes a plurality of parallel circuits each including a plurality of light-emitting elements connected in parallel. The plurality of parallel circuits are connected in series. A plurality of groups are provided on the substrate. Each of the groups includes at least one of the light-emitting elements in the parallel circuit. The light-emitting elements are arranged in a divided manner according to each of the groups. The sealing member covers at least one of the light-emitting elements. | 12-22-2011 |
| 20110309382 | NANOWIRE LED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode (LED) structure includes a plurality of devices arranged side by side on a support layer. Each device includes a first conductivity type semiconductor nanowire core and an enclosing second conductivity type semiconductor shell for forming a pn or pin junction that in operation provides an active region for light generation. A first electrode layer extends over the plurality of devices and is in electrical contact with at least a top portion of the devices to connect to the shell. The first electrode layer is at least partly air-bridged between the devices. | 12-22-2011 |
| 20110309383 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a crystalline substrate having a plurality of side surfaces, a light emitting structure layer comprising a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer on the substrate, and a first electrode on the first conductive type semiconductor layer and a second electrode on the second conductive type semiconductor layer. An amorphous region is defined in a side surface of the substrate, and the amorphous regions of two sides adjacent to each other have different depths from a top surface of the substrate. | 12-22-2011 |
| 20110309384 | SEMICONDUCTOR LIGHT EMITTING DEVICE - The present invention relates to a semiconductor light emitting device including: a substrate for element mounting; a wiring provided on the substrate; an LED element provided on the substrate and electrically connected to the wiring; an encapsulating resin layer for encapsulating the LED element; and a wavelength conversion layer which contains a phosphor material and converts a wavelength of light emitted by the LED element, in which the wavelength conversion layer is provided on an upper side of the LED element, and a diffusive reflection resin layer is provided in a state that side faces of the LED element are surrounded therewith, and an area at the LED element face side of the wavelength conversion layer is at least twice larger by area ratio than an area of light emitting area on an upper surface of the LED element. | 12-22-2011 |
| 20110309385 | DISPLAY PANEL DEVICE AND METHOD OF MANUFACTURING THE SAME - A display panel device having a structure that is more reliable than that of a conventional display panel device includes: a bank and an opening surrounded by an inclined side wall of the bank; a pixel electrode that is a first electrode layer formed on the opening of the bank; a hole injection layer and an organic EL layer that are organic functional layers formed on the first electrode layer; and a common electrode that is a second electrode layer formed on the organic functional layers, wherein the first electrode layer has (i) an end portion that is in contact with the side wall of the bank so that the end portion runs on the side wall, and (ii) a depressed portion that opens upward in a peripheral portion close to the end portion. | 12-22-2011 |
| 20110309386 | LAMP HAVING OUTER SHELL TO RADIATE HEAT OF LIGHT SOURCE - A lamp includes an outer shell having heat conductivity, a base provided in the outer shell, and a cover provided in the outer shell. The outer shell has a light source support, and a heat radiating surface exposed to the outside of the outer shell. The light source support is formed integral with the heat radiating surface. A light source is supported on the light source support. The light source is heated during lighting, and thermally connected to the light source support. The light source is covered with the cover. | 12-22-2011 |
| 20110316006 | Surface-Textured Encapsulations for use with Light Emitting Diodes - Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode (LED) array apparatus includes a plurality of LEDs mounted to a substrate and an encapsulation covering the LEDs and having a surface texturing configured to extract light, wherein the surface texturing is includes at least one light extracting feature having a diameter larger than two or more of the LEDs. | 12-29-2011 |
| 20110316007 | DISPLAY DEVICE - A display device includes, on a substrate, light emitting elements each formed by sequentially stacking a first electrode layer, an organic layer including a light emission layer, and a second electrode layer and arranged in first and second directions which cross each other, a drive circuit including drive elements that drive light emitting elements, and a wiring extending in the first direction, and an insulating layer disposed in a gap region sandwiched by the light emitting elements neighboring in the second direction and having a recess or a projection. The wiring is disposed in an overlap region overlapping with the recess or the projection in the insulating layer in a thickness direction, in the gap region, and the second electrode layers in the light emitting elements neighboring in the second direction are separated from each other by the recess or the projection in the insulating layer. | 12-29-2011 |
| 20110316008 | FLAT PANEL DISPLAY - According to one embodiment, a flat panel display includes a first mounting portion including a first input pad and a first output pad, a second mounting portion including a second input pad and a second output pad, a first common terminal and a second common terminal, which have a common potential, and a guard ring wiring which is formed in a manner to extend from the first common terminal, to pass between the first input pad and the first output pad of the first mounting portion, to pass between the second input pad and the second output pad of the second mounting portion, and to reach the second common terminal, the guard ring wiring including a first resistor element of a first resistance value and a second resistor element of a second resistance value which is higher than the first resistance value. | 12-29-2011 |
| 20110316009 | LIGHT-EMITTING DEVICE - A light-emitting device includes a substrate, and a plurality of light-emitting arrays or light-emitting groups arranged on the substrate. The light-emitting arrays or light-emitting groups include a plurality of LED elements connected in parallel with a pair of adjacent electrodes. The number of the LED elements constituting each of the light-emitting arrays or the light-emitting groups differs in each of the light-emitting arrays or the light-emitting groups. Of the plurality of light-emitting arrays arranged in parallel with each other or the light-emitting groups arranged in a line, the number of the LED elements of the light-emitting arrays or the light-emitting groups positioned inside the substrate is more than the number of the LED elements of the light-emitting arrays or the light-emitting groups positioned outside the substrate. | 12-29-2011 |
| 20110316010 | LIQUID CRYSTAL DISPLAY DEVICE AND TELEVISION SET - Provided is a liquid crystal display device, including: a liquid crystal display panel; and a backlight unit, in which: the backlight unit includes: a plurality of light emitting diodes each having an anode and a cathode; a first substrate; and a second substrate, the plurality of light emitting diodes being mounted on the first substrate and the second substrate; the first substrate and the second substrate are disposed adjacent to each other; light emitting diodes which are adjacent across a boundary between the first substrate and the second substrate are disposed so that the respective anodes are opposed to each other and so as to have a pitch equal to or smaller than a pitch of other adjacent light emitting diodes. | 12-29-2011 |
| 20110316011 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE UNIT, AND METHOD FOR FABRICATING LIGHT EMITTING DEVICE - In a light emitting device, a light emitting device unit, and a method for fabricating a light emitting device according to an embodiment of the present invention, a light emitting device ( | 12-29-2011 |
| 20110316012 | ORGANIC LIGHT EMITTING DIODE SEGMENT - The invention relates to an organic light emitting diode segment ( | 12-29-2011 |
| 20110316013 | OLEDS CONNECTED IN SERIES - OLED device ( | 12-29-2011 |
| 20120001202 | Semiconductor Light Emitting Device and Method for Manufacturing the Same - A method for manufacturing a semiconductor light emitting device includes: (a) providing a temporary substrate; (b) forming a multi-layered LED epitaxial structure, having at least one light emitting unit, on the temporary substrate, wherein a first surface of the light emitting unit contacts the temporary substrate, and the light emitting unit includes a n-type layer, an active region, and a p-type layer; (c) forming a n-electrode on the n-type layer; (d) forming a p-electrode on the p-type layer; (e) bonding a permanent substrate on the light emitting unit, the n-electrode and the p-electrode; (f) removing the temporary substrate to expose the first surface of the light emitting unit; and (g) removing a portion of the light emitting unit from the first surface, to expose at least one of the n-electrode and the p-electrode. | 01-05-2012 |
| 20120001203 | LED CHIP PACKAGE STRUCTURE - A LED chip package structure includes a substrate unit, a light-emitting unit, and a package unit. The substrate unit includes a strip substrate body. The light-emitting unit includes a plurality of LED chips disposed on the strip substrate body and electrically connected to the strip substrate body. The package unit includes a strip package colloid body disposed on the strip substrate body to cover the LED chips, wherein the strip package colloid body has an exposed top surface and an exposed surrounding peripheral surface connected between the exposed top surface and the strip substrate body, and the strip package colloid body has at least one exposed lens portion projected upwardly from the exposed top surface thereof and corresponding to the LED chips. Hence, light beams generated by the LED chips pass through the strip package colloid body to form a strip light-emitting area on the strip package colloid body. | 01-05-2012 |
| 20120001204 | COLOR ADJUSTING ARRANGEMENT - Disclosed is a color adjusting arrangement comprising: i) a first wavelength converting material arranged to receive ambient light and capable of converting ambient light of a first wavelength range into light of a second wavelength range, and/or reflecting ambient light of said second wavelength range, said second wavelength range being part of the visible light spectrum; and ii) a complementary wavelength converting material arranged to receive ambient light and capable of converting part of said ambient light into light of a complementary wavelength range, which is complementary to said second wavelength range, and arranged to allow mixing of light of said second wavelength range and said complementary wavelength range; such that light of said second wavelength range that is emitted and/or reflected by said first wavelength converting material and light of said complementary wavelength range is mixed when leaving the color adjusting arrangement towards a viewing position, the light leaving the color adjusting arrangement thereby appearing less colored, i.e. having a color point substantially near the black body line. The invention thus allows an undesirable colored appearance of a semiconductor-phosphor based light source to be at least partly extinguished or neutralized. | 01-05-2012 |
| 20120007106 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode (OLED) display according to an exemplary embodiment includes an organic light emitting display panel that includes an organic light emitting member, a polarizing plate that is spaced-apart from the organic light emitting display panel and arranged at an upper portion thereof, and a window that is attached to an upper portion of the polarizing plate and protects the organic light emitting display panel. The polarizing plate may include a linear polarizing member and a retardation film that is disposed under the linear polarizing member. According to the exemplary embodiment, the external light visibility can be improved by absorbing light that is incident on the lower portion of the polarizing plate by the polarizing plate by attaching the polarizing plate to the lower portion of the window and separating the polarizing plate from the organic light emitting display panel. | 01-12-2012 |
| 20120007107 | Organic light emitting diode display and manufacturing method thereof - An organic light emitting diode (OLED) display includes: a first substrate; a display portion that is formed on the first substrate and includes a driving circuit portion and an organic light emitting diode; a thin film encapsulation layer that covers the display portion; an adhesive layer that covers an upper surface and a side of the thin film encapsulation layer; an absorption functional layer that is formed on the adhesive layer and absorbs at least one of oxygen and moisture; and a second substrate that is formed on the absorption functional layer. | 01-12-2012 |
| 20120007108 | LIGHT EMITTING DEVICE AND DISPLAY APPARATUS - A light emitting device includes: a light emitting chip arranged on a substrate; a resin lens which covers the light emitting chip and focuses irradiation light from the light emitting chip; a mask which covers a region of an upper layer surface of the substrate, other than the resin lens; and a low surface tension film formed on a region of the upper layer surface of the substrate, other than in the proximity of the light emitting chip. | 01-12-2012 |
| 20120007109 | LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - Disclosed are a light emitting device and a method of fabricating the same. The light emitting device comprises a substrate. A plurality of light emitting cells are disposed on top of the substrate to be spaced apart from one another. Each of the light emitting cells comprises a first upper semiconductor layer, an active layer, and a second lower semiconductor layer. Reflective metal layers are positioned between the substrate and the light emitting cells. The reflective metal layers are prevented from being exposed to the outside. | 01-12-2012 |
| 20120007110 | Light Emitting Device - To provide a light emitting device in which generation of cross talk between adjacent light emitting elements is suppressed, even when the light emitting device uses a light emitting element having high current efficiency. Also, to provide a light emitting device having high display quality even when the light emitting device uses a light emitting element having high current efficiency. The light emitting device has a pixel portion including a plurality of light emitting elements, wherein each of the plurality of light emitting elements includes a plurality of light emitting bodies provided between a first electrode and a second electrode and a conductive layer formed between the plurality of light emitting bodies, wherein the conductive layer is provided for each light emitting element, and wherein an edge portion of the conductive layer is covered with the plurality of light emitting bodies. | 01-12-2012 |
| 20120007111 | LIGHT EMITTING DEVICE MODULE AND LIGHTING SYSTEM INCLUDING THE SAME - Disclosed herein is a semiconductor light emitting device module comprising: a heat transfer member having a cavity; first conductive layer and second conductive layer contacting the heat transfer member via an insulating layer, the first conductive layer and the second conductive layer being electrically separated from each other in accordance with exposure of the insulating layer or exposure of the heat transfer member; and at least one semiconductor light emitting device electrically connected to the first conductive layer and the second conductive layer, the at least one semiconductor light emitting device is thermally contacted an exposed portion of the heat transfer member, wherein the insulating layer has an exposed portion disposed outside the cavity. | 01-12-2012 |
| 20120007112 | LIGHT EMITTING DEVICE - A light emitting device includes a substrate, a light emitting element, an additional light emitting element, a light reflecting resin member, an electrically conductive wire, an additional electrically conductive wire, and a sealing member. The substrate is provided with a conductor wiring. The light emitting element is mounted on the substrate. The electrically conductive wire electrically connects the conductor wiring and the light emitting element with at least a part of the electrically conductive wire being embedded in the light reflecting resin member. The additional electrically conductive wire electrically connects the light emitting element and the additional light emitting element, with the additional electrically conductive wire not being in contact with the light reflecting resin member. The sealing member is disposed in a region surrounded by the light reflecting resin member to cover the light emitting element. | 01-12-2012 |
| 20120012864 | LED ARRAY PACKAGE WITH A COLOR FILTER - A light source includes a substrate, a light emitting diode on the substrate within a cavity, a plate over the cavity, a phosphor layer on the plate, and a color filter on the plate between the phosphor layer and the cavity. | 01-19-2012 |
| 20120012865 | LED ARRAY PACKAGE WITH A HIGH THERMALLY CONDUCTIVE PLATE - A light source includes a substrate, a light emitting diode on the substrate, and a plate supporting member attached to the substrate and surrounding the light emitting diode to form a cavity. In addition, the light source includes a plate on the plate supporting member such that a distance between the plate and the substrate is approximately less than or equal to 1 mm. Furthermore, the light source includes a phosphor layer on the plate opposite the cavity. | 01-19-2012 |
| 20120012866 | BACKLIGHT MODULE AND LIGHT-EMITTING SOURCE PACKAGE STRUCTURE THEREOF - The present invention provides a backlight module and a light-emitting source package structure thereof. The light-emitting source package structure comprises: a heat-dissipation base, at least one chip and a heat-dissipation fixing element. The heat-dissipation base has a connection hole. The heat-dissipation fixing element further has a connection post and a heat-dissipation fin with an abutting surface, and the connection post of the heat-dissipation fixing element passes through a through hole of a fixed plate to fix in the connection hole, so that for closely aligning the abutting surface of the heat-dissipation fin and can abut against the fixed plate. Thus, and the heat-dissipation base and the heat-dissipation fixing element are stably fixed on the both sides of the fixed plate to ensure the tightly abutting relationship with the fixed plate and enhance the assembly reliability. Meanwhile, the heat-dissipation fin can additionally increase the heat-dissipation efficiency of the heat-dissipation fixing element. Thus, the temperature of the chip can be surely lowered to prevent from lowing the working efficiency of the chip. Hence, it is advantageous for the chip to stably work, and the lifetime thereof can be increased. | 01-19-2012 |
| 20120018745 | INTEGRATED LIGHTING APPARATUS AND METHOD OF MANUFACTURING THE SAME - An integrated lighting apparatus includes at least a lighting device, a control device comprising an integrated circuit, and a connector that is used to electrically connect the lighting device and the control device. With the combination, the integrated circuit drives the lighting device in accordance with its various designed functionality, thus expands applications of the integrated lighting apparatus. | 01-26-2012 |
| 20120018746 | ARRAY-TYPE LED DEVICE - An array-type LED device includes a substrate; and a plurality of light-emitting elements located on the substrate, wherein each of the plurality of light-emitting elements includes a first semiconductor layer having a first region and a second region; and a second semiconductor layer with an oblique angle located on the second region. The light-emitting element further includes a first electrical-contact region located on the first region, and a second electrical-contact region located on the second semiconductor layer, wherein the lateral resistance of the second semiconductor layer is larger than that of the first semiconductor layer. | 01-26-2012 |
| 20120018747 | LED LEAD FRAME AND METHOD OF MAKING THE SAME - An LED lead frame assembly comprises a wiring board having a plurality set of positive and negative poles arranged on a top surface thereof A plurality of LED chips are disposed on the wiring board, and electrically bonded to the bus line. A transparent cover is arranged upon the wiring board and covering the LED chip and the conductive lead. | 01-26-2012 |
| 20120018748 | LIGHT EMITTING DIODE DEVICE AND METHOD FOR FABRICATING THE SAME - A light emitting diode device includes: at least one light emitting diode chip, which includes a semiconductor unit, two electrodes that are disposed on an electrode-mounting surface of the semiconductor unit, a light-transmissive insulating layer that is disposed on the electrode-mounting surface and that has two via holes, a reflective metal layer disposed on a portion of the light-transmissive insulating layer, a protective insulating layer that is disposed on the reflective metal layer, a conductor-receiving insulating layer that has two conductor-receiving holes respectively in communication with the via holes, and two conductor units that are formed respectively in the conductor-receiving holes; and a light-transmissive envelope layer that covers a surface of the light emitting diode chip opposite to the electrode-mounting surface, that extends to cover outer lateral surfaces of the light emitting diode chip, and that is doped with a fluorescence powder. | 01-26-2012 |
| 20120025213 | THIN FILM SEMICONDUCTOR SUBSTRATE AND APPARATUS FOR MANUFACTURING THE SAME - A flat panel display is manufactured by mass production and easily stored and transported at low cost. Provided is a thin film semiconductor substrate which faces a plastic substrate | 02-02-2012 |
| 20120025214 | LED PACKAGING STRUCTURE AND PACKAGING METHOD - The present invention relates to an LED packaging structure and packaging method. Said packaging structure includes a substrate, an LED chip, one or more convex walls and a colloid lens shaped by the restriction of the convex walls. Said convex walls are arranged on the substrate, at least one LED chip is arranged on the substrate within an area surrounded by the convex walls, and the colloid lens enclosing the LED chip is arranged within the area surrounded by the convex walls. The colloid lens is formed with desired colloid shape by placing a liquid colloid within the area confined by the convex walls and utilizing surface tension of the liquid, and is cured. Compared to prior art, the LED packaging structure of the present invention is simple and reasonable, with simple production process and lower costs. | 02-02-2012 |
| 20120025215 | SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE - A semiconductor package includes a substrate, a number of electrodes formed in the substrate, a heat dissipating member fixed on the substrate, and at least one semiconductor chip mounted on the heat dissipating member and electrically connected to the electrodes. The heat dissipating member defines a receiving through hole and includes a conducting portion formed at the bottom of the receiving through hole. The at least one semiconductor chip is mounted on the conducting portion. The conducting portion efficiently conducts the heat generated by the semiconductor chip to the heat dissipating member and improves the heat dissipating efficiency of the semiconductor package. | 02-02-2012 |
| 20120025216 | PHOSPHOR SUSPENDED IN SILICONE, MOLDED/FORMED AND USED IN A REMOTE PHOSPHOR CONFIGURATION - A light emitting package comprising a support hosting at least one light emitting diode. A light transmissive dome comprised of a silicone including a phosphor material positioned to receive light emitted by the diode. A glass cap overlies said dome | 02-02-2012 |
| 20120025217 | LED LIGHTING MODULE - The invention relates to a light emitting diode (LED) module that is characterized by a thermally conductive substrate which is used as the base of the module; a plurality of cavities positioned on the module; each cavity is filled with a transparent or diffused encapsulant material and a plurality of LED semiconductors chips are mounted within each cavity. | 02-02-2012 |
| 20120025218 | SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD - A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located on at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, the chip mounted on the base board and a transparent plate disposed on the wavelength converting layer including a spacer and a phosphor having a high density. The wavelength converting layer can be formed in a thin uniform thickness between the transparent plate and a top surface of the chip using the spacer so as to extend toward the transparent plate. The semiconductor light-emitting device can be configured to improve light-emitting efficiency of the chip by using the thin wavelength converting layer including the phosphor having a high density, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from a small light-emitting surface. | 02-02-2012 |
| 20120025219 | ARRANGEMENT OF OPTOELECTRONIC COMPONENTS - An arrangement includes at least two optoelectronic individual elements. At least two of the individual elements overlap partially in a lateral direction. Indirect or direct electrical contacting between the at least two laterally overlapping individual elements is brought about by at least one conductor track on a carrier top of the one individual element and by at least one conductor track on a carrier bottom of the other individual element. | 02-02-2012 |
| 20120025220 | POLARIZED, LED-BASED ILLUMINATION SOURCE - An illumination source includes a number of light emitting diodes (LEDs) operating at a first wavelength. Light from the LEDs illuminates a phosphor material that generates light at a second wavelength. A reflective polarizer transmits light at the second wavelength in a first polarization state and reflects light at the second wavelength in a second polarization state orthogonal to the first polarization state. The light at the second wavelength reflected by the reflective polarizer is directed back towards the phosphor material without an increase in angular range. In some embodiments the LEDs, having a conformal layer of phosphor material, are attached directly to the first surface of a liquid cooled plate. A liquid coolant contacts a second surface of the plate. | 02-02-2012 |
| 20120025221 | Light Emitting Device - Provided is a light emitting device having a light emitting element such as a light emitting diode. The light emitting device includes a plurality of light sources each including a light emitting element, a first light reflective member which surrounds the plurality of light sources, and a second light reflective member disposed ahead of the first light reflective member in a light radiation direction of the plurality of light sources with reference to the plurality of light sources. The second light reflective member includes a light transmitting material. | 02-02-2012 |
| 20120025222 | Light-Emitting Diode Integration Scheme - A circuit structure includes a carrier substrate, which includes a first through-via and a second through-via. Each of the first through-via and the second through-via extends from a first surface of the carrier substrate to a second surface of the carrier substrate opposite the first surface. The circuit structure further includes a light-emitting diode (LED) chip bonded onto the first surface of the carrier substrate. The LED chip includes a first electrode and a second electrode connected to the first through-via and the second through-via, respectively. | 02-02-2012 |
| 20120032194 | LIGHTING MODULE WITH HIGH COLOR RENDING PROPERTY - A lighting module with high rending property includes a substrate, a plurality of first light emitting diode (LED) chips, a plurality of second LED chips and a wavelength conversion layer. The first LED chips are deposed on the substrate and electrically connected to the substrate. The second LED chips are deposed on the substrate and electrically connected to the substrate. The wavelength conversion layer seals the first LED chips and the second LED chips. The light emitted from the LED chips and the light emitted from the wavelength conversion layer caused by an excitation by the LED chips are mixing to form warm white light with high color rending property. The number ratio of the first LED chips to the second LED chips deposed on the substrate is 2:1. | 02-09-2012 |
| 20120032195 | DISPLAY PANEL - A display panel includes a substrate and a plurality of pixel units. Each pixel unit includes a first thin film transistor and a second thin film transistor. The first thin film transistor includes a first gate electrode electrically connected to a fist gate line, a first source electrode electrically connected to a data line, and a first drain electrode electrically connected to a first pixel electrode. The second thin film transistor includes a second gate electrode electrically connected to a second gate line, a second source electrode electrically connected to the data line, and a second drain electrode electrically connected to a second pixel electrode. The first drain electrode extends along a first direction to overlap the first gate electrode, and the second drain electrode extends along the first direction to overlap the second gate electrode. | 02-09-2012 |
| 20120032196 | LIGHT EMITTING DEVICE - According to one embodiment, a light emitting device includes a base substrate, first and second substrates, first and second semiconductor light emitting elements. The first and second substrates are provided on a major surface of the base substrate and include first and second reflection regions, respectively. The first and second semiconductor light emitting elements include first and second structural bodies including first and second light emitting layers, respectively. Each of the first and second semiconductor light emitting elements is inputted with a power not less than 1 Watt. An area of a face of the first semiconductor light emitting element is S | 02-09-2012 |
| 20120032197 | LIGHT EMITTING DEVICE AND IMAGE DISPLAY UNIT - A light emitting device includes a package having a recess, a lead frame buried in the package so that one end of the lead frame is exposed at a bottom of the recess and another end protrudes to an exterior of the package, a light emitting element arranged on the lead frame exposed at the bottom of the recess, and an encapsulant filled in the recess. The package includes, at the side face where the lead frame protrudes, a first side face formed inwardly relative to a side face of the lead frame, and a second side face formed at a lower portion of the first side face and protruded so as to cover a top face of the lead frame. | 02-09-2012 |
| 20120032198 | OPTOELECTRONIC SEMICONDUCTOR DEVICE - An optoelectronic semiconductor device including: a substrate; a semiconductor system having an active layer formed on the substrate; and an electrode structure formed on the semiconductor system, wherein the electrode structure includes: a first conductivity type bonding pad; a second conductivity type bonding pad; a first conductivity type extension electrode; and a second conductivity type extension electrode, wherein the first conductivity type extension electrode and the second conductivity type extension electrode form a three-dimensional crossover; wherein the first conductivity type extension electrode and the second conductivity type extension electrode are on the opposite sides of the active layer. | 02-09-2012 |
| 20120032199 | Element Substrate and Light-Emitting Device - A potential of a gate of a driving transistor is fixed, and the driving transistor is operated in a saturation region, so that a current is supplied thereto anytime. A current control transistor operating in a linear region is disposed serially with the driving transistor, and a video signal for transmitting a signal of emission or non-emission of the pixel is input to a gate of the current control transistor via a switching transistor. | 02-09-2012 |
| 20120032200 | METHOD FOR COATING LIGHT-EMITTING DEVICES, LIGHT COUPLER, AND METHOD FOR MANUFACTURING THE LIGHT COUPLER - A method of coating a light emitting device is provided. The method includes preparing a plurality of light emitting devices. The plurality of light emitting devices are coated with a first photocurable liquid. First light is selectively exposed to the first photocurable liquid to form a first coating layer on at least a partial region of a surface of each of the plurality of light emitting devices. The plurality of light emitting devices on which the first coating layer is formed are coated with a second photocurable liquid. Second light is selectively exposed to the second photocurable liquid to form a second coating layer on at least a partial region of the surface of each of the plurality of light emitting devices or a surface of the first coating layer. The first coating layer corresponds to the cured first photocurable liquid, while the second coating layer corresponds to the cured second photocurable liquid. | 02-09-2012 |
| 20120032201 | LIGHT-EMITTING DISPLAY APPARATUS - To provide a light-emitting display apparatus having a curved display face which can be manufactured with ease and high yield. The light-emitting display apparatus includes a curved and light-transmitting substrate | 02-09-2012 |
| 20120032202 | PLANAR LIGHT SOURCE DEVICE AND DISPLAY DEVICE PROVIDED WITH THE PLANAR LIGHT SOURCE DEVICE - A planar light source device is provided which satisfies the inequality α | 02-09-2012 |
| 20120032203 | LED UNIT - The LED unit | 02-09-2012 |
| 20120032204 | METHOD OF MANUFACTURING OLED-ON-SILICON - A method of manufacturing an Organic Light Emitting Diode (OLED). A substrate ( | 02-09-2012 |
| 20120032205 | MICRODISPLAY PACKAGING SYSTEM - Some embodiments provide a microdisplay integrated circuit (IC), a substantially transparent protective cover coupled to the microdisplay IC, and a base coupled to the microdisplay IC. Thermal expansion characteristics of the base may be substantially similar to thermal expansion characteristics of the protective cover. According to some embodiments, at least one set of imaging elements is fabricated on an upper surface of a semiconductor substrate, and a base is affixed to a lower surface of the semiconductor substrate to generate substantially negligible mechanical stress between the semiconductor substrate and the base. | 02-09-2012 |
| 20120037926 | SOLID STATE LIGHTS WITH COOLING STRUCTURES - A solid state lighting (SSL) with a solid state emitter (SSE) having thermally conductive projections extending into an air channel, and methods of making and using such SSLs. The thermally conductive projections can be fins, posts, or other structures configured to transfer heat into a fluid medium, such as air. The projections can be electrical contacts between the SSE and a power source. The air channel can be oriented generally vertically such that air in the channel warmed by the SSE flows upward through the channel. | 02-16-2012 |
| 20120037927 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light emitting diode package structure includes a substrate ( | 02-16-2012 |
| 20120037928 | ANTI-REFLECTION FILM AND FOLDABLE DISPLAY DEVICE EMPLOYING THE SAME - A anti-reflection film includes a light phase delay film which changes a phase of incident light, a polarizing film on the light phase delay film and transmitting light with a polarization component in a particular direction, and a protective film on the polarizing film and protecting the polarizing film. All of the polarizing film, the light phase delay film, and the protective film include flexible materials. | 02-16-2012 |
| 20120037929 | OPTOELECTRONIC COMPONENT - An optoelectronic component has an optoelectronic semiconductor chip, a contact frame, a contact carrier, a first electrical connection zone and a second electrical connection zone electrically insulated from the first electrical connection zone, which each have a part of the contact frame and a part of the contact carrier, wherein the contact frame has a recess which separates the first electrical connection zone at least in places from the second electrical connection zone and into which the optoelectronic semiconductor chip projects, and wherein the contact frame has a contact element which connects the contact frame electrically with the optoelectronic semiconductor chip. | 02-16-2012 |
| 20120037930 | METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT, OPTOELECTRONIC COMPONENT, AND COMPONENT ARRANGEMENT HAVING A PLURALITY OF OPTOELECTRONIC COMPONENTS - A method for producing optoelectronic components including A) providing a growth substrate with a semiconductor layer arranged thereon that produces a zone which is active during operation, B) applying separating structures on the semiconductor layer, C) applying a multiplicity of copper layers on the semiconductor layer in regions delimited by the separating structures, D) removing the separating structures, E) applying, a protective layer at least on lateral areas of copper layers, F) applying an auxiliary substrate on the copper layers, G) removing the growth substrate, H) singulating a composite assembly comprising the semiconductor layer, the copper layers and the auxiliary substrate to form components which are separated from one another. | 02-16-2012 |
| 20120037931 | SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING AN OPTICALLY TRANSMISSIVE ELEMENT AND METHODS FOR PACKAGING THE SAME - Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity. | 02-16-2012 |
| 20120037932 | Display Device and Driving Method of the Same - A problem in that a light emitting element slightly emits light is solved by an off current of a thin film transistor connected in series to the light emitting element, thereby a display device which can perform a clear display by increasing contrast, and a driving method thereof are provided. When the thin film transistor connected in series to the light emitting element is turned off, a charge held in the capacitance of the light emitting element itself is discharged. Even when an off current is generated at the thin film transistor connected in series to the light emitting element, this off current charges this capacitance until the capacitance of the light emitting element itself holds a predetermined voltage again. Accordingly, the off current of the thin film transistor does not contribute to light emission. In this manner, a slight light emission of the light emitting element can be reduced. | 02-16-2012 |
| 20120037933 | LIGHT EMITTING DEVICE AND LIGHTING SYSTEM HAVING THE SAME - The present invention provides a light emitting device comprising a first light emitting portion that emits white light at a color temperature of 6000K or more and a second light emitting portion that emits white light at a color temperature of 3000K or less, which include light emitting diode chips and phosphors and are independently driven. The present invention has an advantage in that a light emitting device can be diversely applied in a desired atmosphere and use by realizing white light with different light spectrums and color temperatures. Particularly, the present invention has the effect on health by adjusting the wavelength of light or the color temperature according to the circadian rhythm of humans. | 02-16-2012 |
| 20120043558 | ACTIVE DEVICE ARRAY SUBSTRATE AND METHOD FOR FABRICATING THE SAME - An active device array substrate and a fabricating method thereof are provided. A first patterned conductive layer including separated scan line patterns is formed on a substrate. Each scan line pattern includes a first and second scan lines adjacent to each other. Both the first and the second scan lines have first and second contacts. An open inspection on the scan line patterns is performed. Channel layers are formed on the substrate. A second patterned conductive layer including data lines interlaced with the first and second scan lines, sources and drains located above the channel layers, and connectors is formed on the substrate. The sources electrically connect the data lines correspondingly. At least one of the connectors electrically connects the first and second scan lines, so as to form a loop in each scan line pattern. Pixel electrodes electrically connected to the drains are formed. | 02-23-2012 |
| 20120043559 | LIGHT EMITTING DEVICE - There is provided a light emitting device which includes a light emitting element having a main emission peak in the wavelength region of greater than 420 nm and equal to or less than 500 nm, and a phosphor layer formed on the light emitting element. The light emitting element of this light emitting device has a junction temperature of from 100° C. to 200° C. at the time of continuous driving. Furthermore, the phosphor layer contains a phosphor represented by the following general formula (A), which absorbs the light emitted from the light emitting element and thereby emits light having a main emission peak in the wavelength region of equal to or greater than 650 nm and equal to or less than 665 nm: | 02-23-2012 |
| 20120043560 | LAMP MODULE - A lamp module is provided, including a circuit board, at least an LED, an insulator and a metal barrier. The LED is disposed on the circuit board and has two conductive leads on opposite sides thereof. The insulator is disposed on the circuit board, having an opening and two protruding sheets. The metal barrier is disposed on the insulator, wherein the LED and the protruding sheets are extended through the metal barrier. The conductive leads are insulated from the metal barrier by the protruding sheets of the insulating member. | 02-23-2012 |
| 20120043561 | Organic Light Emitting Diode Display - An organic light emitting diode display includes: a substrate; a first electrode positioned on the substrate; an organic layer positioned on the first electrode; a transflective layer positioned on the organic layer; an organic emission layer positioned on the transflective layer; and a second electrode positioned on the organic emission layer. | 02-23-2012 |
| 20120043562 | ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR - Provided is an organic eletroluminescence display device, which is capable of preventing transfer of an attached matter from the vapor deposition mask to the insulating layer, without increasing steps or manufacturing cost. The organic eletroluminescence display device includes: a first insulating layer formed on a substrate; multiple first electrodes disposed on the first insulating layer; an opening formed in the first insulating layer at a periphery of the first electrode; a second insulating layer disposed in a region overlapping with the opening; an organic compound layer covering the first electrodes; and a second electrode formed on the organic compound layer, in which: a material forming the first electrodes is absent in the opening; and the second insulating layer has a recess formed in a surface thereof, reflecting the opening of the first insulating layer, the recess being formed in a vertical direction of the substrate surface. | 02-23-2012 |
| 20120043563 | High Voltage Low Current Surface Emitting Light Emitting Diode - A light emitting diode chip includes a submount, a reflective layer on the submount, an insulating layer on the reflective layer opposite the submount, and a plurality of sub-LEDs on the insulating layer. Each of the sub-LEDs includes a first face adjacent to the submount and a transparent contact on the first face between the sub-LED and the insulating layer and electrical interconnects between adjacent ones of the sub-LEDs. | 02-23-2012 |
| 20120043564 | COMMON OPTICAL ELEMENT FOR AN ARRAY OF PHOSPHOR CONVERTED LIGHT EMITTING DEVICES - A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperature melting point than is used to thermally bond the optical element to the LED die. In one implementation, a single optical element is bonded to a plurality of LED dice that are mounted to the submount and the submount and the optical element have approximately the same coefficients of thermal expansion. Alternatively, a number of optical elements may be used. The optical element or LED die may be covered with a coating of wavelength converting material. In one implementation, the device is tested to determine the wavelengths produced and additional layers of the wavelength converting material are added until the desired wavelengths are produced. | 02-23-2012 |
| 20120056206 | SOLID STATE LIGHTING DIES WITH QUANTUM EMITTERS AND ASSOCIATED METHODS OF MANUFACTURING - Solid state lighting dies and associated methods of manufacturing are disclosed herein. In one embodiment, a solid state lighting die includes a substrate material, a first semiconductor material, a second semiconductor material, and an active region between the first and second semiconductor materials. The second semiconductor material has a surface facing away from the substrate material. The solid state lighting die also includes a plurality of openings extending from the surface of the second semiconductor material toward the substrate material. | 03-08-2012 |
| 20120056207 | PIXEL ARRAY - A pixel array includes pixel sets. Each pixel set includes a first and second scan lines arranged in parallel on a substrate, a data line not parallel to the first and second scan lines, a first active device electrically connecting the first scan line and the data line, a second active device electrically connecting the second scan line and the data line, a first pixel electrode electrically connecting the first active device, a second pixel electrode electrically connecting the second active device, and an auxiliary electrode pattern that includes a connecting portion and a first and second branch portions. A gap is between the first and second pixel electrodes. The connecting portion underneath the gap between the first and second pixel electrodes partially overlaps the first and second pixel electrodes. The first and second branch portions connect the connecting portion and partially overlap the first and second pixel electrodes, respectively. | 03-08-2012 |
| 20120056208 | SYSTEM FOR DISPLAYING IMAGES - A system for displaying images includes an organic light-emitting device (OLED) including an anode layer on a substrate, a cathode layer, and an organic light-emitting layer disposed between the anode and cathode layers. The cathode layer includes a metal layer in direct contact with the organic light-emitting layer, a transparent conductive layer, and an organic buffer layer with a carrier mobility in a range of 10 | 03-08-2012 |
| 20120056209 | LIGHT EMITTING DEVICE - A light emitting device according to one embodiment includes a board; plural first light emitting elements mounted on the board to emit light having a wavelength of 250 nm to 500 nm; plural second light emitting elements mounted on the board to emit light having a wavelength of 250 nm to 500 nm; a first fluorescent layer formed on each of the first light emitting elements, the first fluorescent layer including a first phosphor; and a second fluorescent layer formed on each of the second light emitting elements, the second fluorescent layer including a second phosphor. The second phosphor is higher than the first phosphor in luminous efficiency at 50° C., and is lower than the first phosphor in the luminous efficiency at 150° C. | 03-08-2012 |
| 20120056210 | LIGHT EMITTING APPARATUS AND MULTI-SURFACE PATTERN SUBSTRATE - A light emitting apparatus capable of increasing the number of substrates formed from one multi-surface pattern substrate and capable of reducing the manufacturing cost. The light emitting apparatus ( | 03-08-2012 |
| 20120056211 | POLARIZING FILM, OPTICAL FILM LAMINATE INCLUDING POLARIZING FILM, STRETCHED LAMINATE FOR USE IN PRODUCTION OF OPTICAL FILM LAMINATE INCLUDING POLARIZING FILM, PRODUCTION METHODS FOR THEM, AND ORGANIC EL DISPLAY DEVICE HAVING POLARIZING FILM - Provided is a continuous web of polarizing film for an organic EL display device which has a thickness of 10 μm or less and exhibits high optical characteristics. The polarizing film for an organic EL display device is made of a polyvinyl alcohol type resin having a molecularly oriented dichroic material, and formed through stretching to have a thickness of 10 μm or less and exhibit optical characteristics satisfying the following conditions: T≧42.5; and P≧99.5, wherein T is a single layer transmittance, and P is a polarization rate. The polarizing film for an organic EL display device may be prepared by subjecting a laminate comprising a non-crystallizable ester type thermoplastic resin substrate and the polyvinyl alcohol type resin layer formed on the substrate, to 2-stage stretching consisting of preliminary in-air stretching and in-boric-acid-solution stretching. | 03-08-2012 |
| 20120056212 | LIGHT-EMITTING DEVICE AND THE MANUFACTURING METHOD THEREOF - A light-emitting device includes: a carrier; a light-emitting structure formed on the carrier, wherein the light-emitting structure has a first surface facing the carrier, a second surface opposite to the first surface, and an active layer between the first surface and the second surface; a plurality of first trenches extended from the first surface and passing through the active layer so a plurality of light-emitting units is defined; and a plurality of second trenches extended from the second surface and passing through the active layer of each of the plurality of light-emitting units. | 03-08-2012 |
| 20120056213 | LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, DISPLAY DEVICE, AND ELECTRONIC APPARATUS - A light-emitting element includes: an anode; a cathode; a light-emitting layer which is provided between the anode and the cathode and emits light as the anode and the cathode are electrically connected to each other; and an organic layer which is provided between the anode and the light-emitting layer to come in contact with both layers. The organic layer has a first function of transporting holes and a second function of preventing electrons infiltrating from the light-emitting layer from staying in the organic layer. | 03-08-2012 |
| 20120056214 | LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A light emitting device of the invention includes a thin film transistor, an insulating layer covering the thin film transistor, an electrode which is electrically connected to the thin film transistor through a contact hole formed on the insulating layer, and a light emitting element formed by interposing a light emitting layer between a first electrode which is electrically connected to the electrode and a second electrode. The light emitting device further includes a layer formed of a different material from that of the insulating layer only between the electrode and the first electrode over the insulating layer and the insulating layer. | 03-08-2012 |
| 20120056215 | LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES - Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source. | 03-08-2012 |
| 20120061690 | LED MODULE AND PACKING METHOD OF THE SAME - A LED module and a packing method of the same include plural boards defined with a positive line and a negative line. The positive line connects to at least one positive joint, and the negative line connects to at least one negative joint. Some LEDs are respectively disposed on each board, and conducting ends of the LEDs are separately connected to the positive line and the negative line. A number of electronic elements are individually installed on each board, and conducting ends of the electronic elements are separately connected to the positive line and the negative line disposed on the board. A positive guiding line connects to the positive joint of each board, and a negative guiding line connects to the negative joint of each board. The LED module achieved in accordance with above-mentioned construction contributes to the flexibility. | 03-15-2012 |
| 20120061691 | LIGHT-EMITTING DEVICE - This disclosure discloses a light-emitting device. The light-emitting device comprises: a light-emitting array comprising a first light-emitting unit and a second light-emitting unit electrically connected in serial with the first light-emitting unit; at least two first bonding pads formed on the first light-emitting unit; and at least two second bonding pads formed on the second light-emitting unit. One of the two first bonding pads is in a floating level, and one of the two second bonding pads is in a floating level. | 03-15-2012 |
| 20120061692 | LIGHT EMITTING DIODE PACKAGE HAVING INTERCONNECTION STRUCTURES - A light emitting diode (LED) package includes a substrate, a first LED chip and a second LED chip. The substrate includes first to fourth electrodes, and an interconnection electrode. A mounting area is defined at center of a top surface of the substrate. The first to fourth electrodes are respectively in four corners of the substrate out of the mounting area. The first interconnection electrode is embedded in the substrate to electrically connect the first and the third electrodes. The first LED chip and the second LED chip are arranged in the mounting area. Each LED chip includes an anode pad and a cathode pad. The first to fourth electrodes are respectively connected to the four pads of the first and the second LED chips via a plurality of metal wires, and no metal wire connection is formed between the first and the second LED chips. | 03-15-2012 |
| 20120061693 | OPTOELECTRONIC COMPONENT WITH FLIP-CHIP MOUNTED OPTOELECTRONIC DEVICE - Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components. | 03-15-2012 |
| 20120061694 | LIGHT-EMITTING STRUCTURE - An embodiment of the present application discloses a light-emitting structure, comprising a first unit; a second unit; a trench formed between the first unit and the second unit, and having a less steep sidewall and a steeper sidewall steeper than the less steep sidewall; and an electrical connection arranged on the less steep sidewall. | 03-15-2012 |
| 20120061695 | LIGHT-EMITTING DIODE PACKAGE - A light emitting diode (LED) package is provided. The LED package includes: a package body including an LED; a bottom heat transfer metal layer formed on the bottom of the package body; and a metal plate bonded to the bottom heat transfer metal layer, wherein the bottom heat transfer metal layer is bonded to the metal plate through soldering or an adhesive such as Ag epoxy, and the metal plate includes only metal without a resin layer. | 03-15-2012 |
| 20120061696 | METHOD FOR MANUFACTURING DISPLAY AND DISPLAY - A method for manufacturing a display, the method including the steps of: disposing a substrate over which a plurality of lower electrodes and a plurality of auxiliary electrodes are formed and a donor film over which a light-emitting functional layer is formed so that the light-emitting functional layer contacts with the lower electrodes and does not contact with the auxiliary electrodes; irradiating the donor film with an energy beam to selectively transfer the light-emitting functional layer onto the lower electrodes; and forming an upper electrode that covers the light-emitting functional layer and the auxiliary electrodes. | 03-15-2012 |
| 20120061697 | ORGANIC LIGHT-EMITTING ELEMENT, ORGANIC LIGHT-EMITTING TRANSISTOR, AND LIGHT-EMITTING DISPLAY DEVICE - An organic light-emitting element comprises a large number of unit pixels each at least composed of a base, an auxiliary electrode, a first insulating layer to cover at least the auxiliary electrode, a charge injection layer on the first insulating electrode, laminated bodies each consisting of a first electrode and a second insulating layer and provided in a predetermined pattern, an organic light-emitting layer formed in regions where the laminated bodies are not provided, and a second electrode to cover at least the organic light-emitting layer. The unit pixel has first partitions provided to demarcate the organic light-emitting layer from other adjacent unit pixels and at least one or more second partitions to have a uniform coated thickness, and at least one of the first partition and the second partition is the laminated body. | 03-15-2012 |
| 20120061698 | Method for Treating Metal Surfaces - A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the electroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications and in manufacturing light emitting diodes (LEDs). | 03-15-2012 |
| 20120061699 | ELECTRIC LAMP - An electric lamp ( | 03-15-2012 |
| 20120068198 | HIGH DENSITY MULTI-CHIP LED DEVICES - High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption. | 03-22-2012 |
| 20120068199 | THIN FILM DEPOSITION APPARATUS, METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE THIN FILM DEPOSITION APPARATUS, AND ORGANIC LIGHT-EMITTING DISPLAY DEVICE MANUFACTURED BY USING THE METHOD - A thin film deposition apparatus that is suitable for manufacturing large-sized display devices on a mass scale and that can be used for high-definition patterning, a method of manufacturing an organic light-emitting display device by using the thin film deposition apparatus, and an organic light-emitting display device manufactured by using the method. The thin film deposition apparatus includes: a deposition source that discharges a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in the first direction; a first barrier plate assembly including a plurality of first barrier plates that are disposed between the deposition source nozzle unit and the patterning slit sheet in the first direction, and that partition a space between the deposition source nozzle unit and the patterning slit sheet into a plurality of sub-deposition spaces; and a second barrier plate disposed at one side of the patterning slit sheet, wherein an inner part of the second barrier plate is partitioned into a plurality of spaces by a plurality of barrier ribs. | 03-22-2012 |
| 20120068200 | Liquid Crystal Display Device and Method for Manufacturing the Same - A liquid crystal display device with a built-in touch screen, which uses a common electrode as a touch-sensing electrode including an intersection of a gate line and a data line to define a pixel region, a gate metal disposed in a central portion of the pixel, an insulating layer formed on the gate metal, a first contact hole disposed through the insulating layer to expose a predetermined portion of an upper surface of the gate metal, a contact metal on the insulating layer and inside the first contact hole, the contact metal electrically connected with the gate metal, a first passivation layer on the contact metal, a second contact hole disposed through the first passivation layer to expose a predetermined portion of an upper surface of the contact metal, a common electrode on the first passivation layer and inside the second contact hole, a conductive line electrically connected with the common electrode, and a second passivation layer on the first passivation layer and the conductive line, wherein the gate metal and the common electrode are electrically connected via the contact metal. | 03-22-2012 |
| 20120068201 | Thin Film Deposition Apparatus, Method of Manufacturing Organic Light-Emitting Display Device by Using the Apparatus, and Organic Light-Emitting Display Device Manufactured by Using the Method - A thin film deposition apparatus, a method of manufacturing an organic light-emitting display device by using the thin film deposition apparatus, and an organic light-emitting display device manufactured by using the method. A thin film deposition apparatus for forming a thin film on a substrate includes a first chamber in a vacuum state; first and second stages arranged in parallel in the first chamber wherein the substrate is fixable to at least one of the first and second stages; a mask contactable with the substrate; and a first deposition source and a second deposition source that are movable relative to the first and second stages and are configured to discharge a deposition material onto the substrate. | 03-22-2012 |
| 20120068202 | ACTIVE MATRIX SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND DISPLAY EQUIPMENT USING ACTIVE MATRIX SUBSTRATE MANUFACTURED BY THE SAME METHOD - The present invention provides an active matrix substrate and a method of manufacturing the same by decreasing the number of photolithographic processes to reduce the manufacturing cost. The invention also provides a display device using an active matrix substrate manufactured by said manufacturing method. In a process for preparing pixels on an active substrate, which constitutes a display device, a bank or an etching pattern is formed by performing half-tone exposure on a photo resist film or on a black color photo resist film where an active matrix and a display electrode are prepared by coating, and an insulator film is fabricated, and a transparent conductive film and a color filter are prepared by inkjet method. | 03-22-2012 |
| 20120074432 | LED PACKAGE MODULE AND MANUFACTURING METHOD THEREOF - A light emitting diode (LED) package module and the manufacturing method thereof are presented. A plurality of LEDs and a plurality of semiconductor elements are disposed on a silicon substrate, and then a plurality of lenses is formed above the positions of the plurality of the LEDs, and the plurality of the lenses is corresponding to the plurality of the LEDs. Then, a plurality of package units is defined on the silicon substrate, and each package unit has a semiconductor element and at least one LED. After that, the silicon substrate is cut to form a plurality of LED package modules, and each LED package module has at least one package unit. | 03-29-2012 |
| 20120074433 | ELECTRONIC APPARATUS - An electronic apparatus is provided that includes a number of first components on a first substrate and a number of second components on a second substrate. A lamination material that includes a conducting material is placed between the first components and the second components. Any one first component can couple to a varied subset of second components. | 03-29-2012 |
| 20120074434 | LIGHT EMITTING DEVICE PACKAGE AND LIGHTING APPARATUS USING THE SAME - Disclosed is a light emitting device package, which is free from thermal degradation by preventing reactions between moisture and light or between moisture and heat. The light emitting device package includes a light emitting device, a package body supporting the light emitting device, an electrode provided on the package body and electrically connected to the light emitting device, a filler covering the light emitting device, and a protective layer formed on a surface of the package body at which light and/or heat generated by the light emitting device arrives. | 03-29-2012 |
| 20120074435 | ORGANIC LIGHT EMITTING DISPLAY - An organic light emitting display is disclosed. In one embodiment, the display includes 1) a substrate, 2) a plurality of pixels formed on the substrate, wherein each of the pixels comprises at least one circuit region including i) a first light emission area, ii) a second light emission area iii) at least one transmission area transmitting external light, and iv) a pixel circuit unit and 3) a first pixel electrode formed in the first light emission area and electrically connected to the pixel circuit unit, wherein the first pixel electrode comprises a first transparent conductive layer and a reflective layer. The display may further include 1) a second pixel electrode formed in the second light emission area and electrically connected to the first pixel electrode, wherein the second pixel electrode comprises a second transparent conductive layer, 2) a first opposite electrode substantially directly below or above the first pixel electrode, 3) a second opposite electrode substantially directly below or above the second pixel electrode and 4) an organic emission layer formed between the first pixel electrode and the first opposite electrode and between the second pixel electrode and the second opposite electrode. | 03-29-2012 |
| 20120074436 | LED UNIT HAVING SELF-CONNECTING LEADS - An LED unit includes a plurality of LEDs connected to each other and a plate supporting the LEDs. Each LED includes a base, a chip mounted on the base, a pair of leads fixed to the base and electrically connected to the chip and an encapsulant sealing the chip. The base includes a main body and a pair of steps. The leads each have two opposite ends protruding from two opposite ends of the main body and located below/above a corresponding step. The protruding ends of the leads of each LED are connected to those of adjacent LEDs to electrically connect the LEDs in series or in parallel. | 03-29-2012 |
| 20120074437 | LED UNIT HAVING UNIFORM LIGHT EMISSION - An LED unit includes a plurality of LEDs connected to each other and a plate supporting the LEDs. Each LED includes a base, a chip mounted on the base, a pair of leads fixed to the base and electrically connected to the chip and an encapsulant sealing the chip. The base includes a main body and a pair of steps. The leads each have two opposite ends protruding from two opposite ends of the main body and located below/above a corresponding step. The protruding ends of the leads of adjacent LEDs are connected to each other. The encapsulants of adjacent LEDs are continuously connected together. Light emitted from the chips of the LEDs are evenly distributed in the encapsulants whereby the light from the LEDs forms a rectangular, uniform light source. | 03-29-2012 |
| 20120074438 | METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE, LIGHT EMITTING ELEMENT SUBSTRATE, AND QUALITY MANAGEMENT METHOD - A method for manufacturing a light emitting device includes forming a plurality of light emitting elements on a light emitting element substrate. an identification portion is formed on each of the light emitting elements to allow a pertinent light emitting element to be distinguishable from other light emitting elements. The light emitting elements are separated to form a plurality of light emitting devices. The identification portion may have an external appearance allowing each of the light emitting elements to be distinguishable from the other light emitting elements. | 03-29-2012 |
| 20120074439 | FLAT PANEL DISPLAY AND METHOD FOR MAKING THE SAME - A flat panel display includes a thin film transistor formed on a substrate; a planarization layer formed on the thin film transistor; a first electrode layer formed on the planarization layer and electrically connected with the thin film transistor through the via hole formed in the planarization layer; a pixel definition layer formed on the planarization layer and in which an opening for at least partially exposing the first electrode layer is formed; an adhesive reinforcement layer formed at least between the planarization layer and the pixel definition layer on the top of the planarization layer; an emitting layer formed on the first electrode layer; and a second electrode layer formed on the emitting layer and the pixel definition layer. The flat panel display has an improved adhesive property between a pixel definition layer and a planarization layer, which prevents a chipping phenomenon of the pixel definition layer. | 03-29-2012 |
| 20120074440 | ILLUMINATION DEVICE, DISPLAY DEVICE, AND TELEVISION RECEIVER - A backlight unit ( | 03-29-2012 |
| 20120080691 | LIGHT EMITTING DIODE AND MAKING METHOD THEREOF - An LED includes a substrate, a first P-type semiconductor layer formed on the substrate and a plurality of LED dies arranged on the first P-type semiconductor layer. The LED dies are electrically connected to each other in series. The present invention also relates to a method for making such an LED. | 04-05-2012 |
| 20120080692 | DISPLAY PANEL, DISPLAY DEVICE, ILLUMINATION PANEL AND ILLUMINATION DEVICE, AND METHODS OF MANUFACTURING DISPLAY PANEL AND ILLUMINATION PANEL - Disclosed herein is a display panel including a mounting substrate in which one or more light-emitting devices each including one or more light-emitting elements are mounted on a circuit substrate; and a transparent substrate disposed to face the light-emitting device side of the mounting substrate, wherein the transparent substrate has a transparent base material and a resin layer formed on the mounting substrate side of the transparent base material, and the resin layer is in contact with the light-emitting device and has, formed on an upper surface or a side surface of the light-emitting device, an inclined part which spreads from the light-emitting device side toward the transparent base material side. | 04-05-2012 |
| 20120080693 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME - The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted. | 04-05-2012 |
| 20120086022 | Light source with light scattering features, device including light source with light scattering features, and/or methods of making the same - Certain example embodiments of this invention relate to techniques for improving the performance of Lambertian and non-Lambertian light sources. In certain example embodiments, this is accomplished by (1) providing an organic-inorganic hybrid material on LEDs (which in certain example embodiments may be a high index of refraction material), (2) enhancing the light scattering ability of the LEDs (e.g., by fractal embossing, patterning, or the like, and/or by providing randomly dispersed elements thereon), and/or (3) improving performance through advanced cooling techniques. In certain example instances, performance enhancements may include, for example, better color production (e.g., in terms of a high CRI), better light production (e.g., in terms of lumens and non-Lambertian lighting), higher internal and/or external efficiency, etc. | 04-12-2012 |
| 20120086023 | Insulating glass (IG) or vacuum insulating glass (VIG) unit including light source, and/or methods of making the same - Certain example embodiments of this invention relate to techniques for improving the performance of Lambertian and non-Lambertian light sources. In certain example embodiments, this is accomplished by (1) providing an organic-inorganic hybrid material on LEDs (which in certain example embodiments may be a high index of refraction material), (2) enhancing the light scattering ability of the LEDs (e.g., by fractal embossing, patterning, or the like, and/or by providing randomly dispersed elements thereon), and/or (3) improving performance through advanced cooling techniques. In certain example instances, performance enhancements may include, for example, better color production (e.g., in terms of a high CRI), better light production (e.g., in terms of lumens and non-Lambertian lighting), higher internal and/or external efficiency, etc. | 04-12-2012 |
| 20120086024 | MULTIPLE CONFIGURATION LIGHT EMITTING DEVICES AND METHODS - Multiple configuration light emitting diode (LED) devices and methods are disclosed wherein LEDs within the device can be selectively configured for use in higher voltage, or variable voltage, applications. Variable arrangements of LEDs can be configured. Arrangements can include one or more LEDs connected in series, parallel, and/or a combination thereof. A surface over which one or more LEDs may be mounted can comprise one or more electrically and/or thermally isolated portions. | 04-12-2012 |
| 20120086025 | ORGANIC LIGHT-EMITTING DIODE MODULE - An organic light-emitting diode (OLED) module includes a substrate, a bus line, an organic light-emitting device layer, a plurality of conductive elements, and at least one conductive wire. The bus line is configured on the substrate. The organic light-emitting device layer is configured on the substrate and electrically connected to the bus line. The conductive elements are configured on the substrate and electrically connected to the bus line. The conductive wire is configured next to the conductive elements and electrically connected to the conductive elements. | 04-12-2012 |
| 20120091474 | NOVEL SEMICONDUCTOR AND OPTOELECTRONIC DEVICES - A light-emitting integrated wafer structure, comprising: three overlying layers, wherein each of the three overlying layers emits light at a different wavelength and wherein at least one of the three overlying layers is transferred to the light-emitting integrated wafer structure using one of atomic species implants assisted cleaving, laser lift-off, etch-back, or chemical-mechanical-polishing (CMP). | 04-19-2012 |
| 20120091475 | Method of treating the surface of a soda lime silica glass substrate, surface-treated glass substrate, and device incorporating the same - Certain example embodiments of this invention relate to methods of treating the surface of a soda lime silica glass substrate, e.g., a soda lime silica alkali ion glass substrate, and the resulting surface-treated glass articles. More particularly, certain example embodiments of this invention relate to methods of removing a top surface portion of a glass substrate using ion sources. During or after removal of this portion, the glass may then be coated with another layer, to be used as a capping layer. In certain example embodiments, the glass substrate coated with a capping layer may be used as a color filter and/or TFT substrate in an electronic device. In other example embodiments, the glass substrate with the capping layer thereon may be used in a variety of display devices. | 04-19-2012 |
| 20120091476 | LIGHT EMITTING DEVICE - A light emitting device includes a light emitting unit and a submount. The light emitting unit has a plurality of light emitting diodes (LEDs), and the submount has a plurality of conductive contacts on a side thereof. The LEDs are coupled to the conductive contacts in various electrical connection manners, such that the LEDs are connected in series or/and in parallel. | 04-19-2012 |
| 20120091477 | Organic Light Emitting Diode Display - An organic light emitting diode (OLED) display comprises: a substrate; a display unit formed on the substrate and including an organic light emitting element; an interception layer positioned at the outside of the display unit on the substrate; and a thin film encapsulation layer which is formed with a stacked film of an inorganic film and an organic film, which has an end portion contacting the interception layer, and which covers the entire display unit and at least a part of the interception layer. | 04-19-2012 |
| 20120091478 | LIGHT EMITTING DEVICE HAVING A PLURALILTY OF LIGHT EMITTING CELLS AND PACKAGE MOUNTING THE SAME - A light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other. | 04-19-2012 |
| 20120091479 | ELECTROOPTIC DEVICE AND ELECTRONIC APPARATUS - Pixel electrodes having reflectivity are arranged at a predetermined pitch in a matrix form on an effective display region on an opposed surface of an element substrate. A first conductive pattern which is formed by the same layer as the pixel electrodes is provided on an ineffective display region which is at an outer side with respect to the effective display region and at an inner side with respect to a sealing region when seen from the above. A second conductive pattern which is formed by the same layer as the pixel electrodes is provided on the sealing region. An area density of the second conductive pattern is smaller than an area density of the first conductive pattern when seen from the above. | 04-19-2012 |
| 20120091480 | LIGHT-EMITTING DEVICE - A light-emitting device includes a substrate, a plurality of light-emitting elements mounted on one surface of the substrate, a first glass film provided to one surface of the substrate and having a plurality of apertures that form a light-reflecting frame surrounding the perimeter of each the light-emitting elements, and a second glass film provided to the other surface of the substrate. A coefficient of thermal expansion of the second glass film is greater than that of the substrate when a coefficient of thermal expansion of the first glass film is greater than that of the substrate, and a coefficient of thermal expansion of the second glass film is less than that of the substrate when a coefficient of thermal expansion of the first glass film is less than that of the substrate. | 04-19-2012 |
| 20120091481 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A light-emitting device includes a light-emitting element and a support substrate. The light-emitting element has an insulating layer and first and second vertical conductors passing through the insulating layer. The support substrate has a substrate part and first and second through electrodes and is disposed on the insulating layer. The first through electrode passes through the substrate part with one end connected to an opposing end of the first vertical conductor, while the second through electrode passes through the substrate part with one end connected to an opposing end of the second vertical conductor. The opposing ends of the first and second vertical conductors are projected from a surface of the insulating layer and connected to the ends of the first and second through electrode inside the support substrate. | 04-19-2012 |
| 20120091482 | ORGANIC EL ELEMENT, METHOD FOR MANUFACTURING THE SAME, AND ORGANIC EL DISPLAY DEVICE | 04-19-2012 |
| 20120097985 | Light Emitting Diode (LED) Package And Method Of Fabrication - A light emitting diode (LED) package includes a substrate, a light emitting diode (LED) die mounted to the substrate, a frame on the substrate, a wire bonded to the light emitting diode (LED) die and to the substrate, and a transparent dome configured as a lens encapsulating the light emitting diode (LED) die. A method for fabricating a light emitting diode (LED) package includes the steps of: providing a substrate; forming a frame on the substrate; attaching a light emitting diode (LED) die to the substrate; wire bonding a wire to the light emitting diode (LED) die and to the substrate; and dispensing a transparent encapsulation material on the frame configured to form a transparent dome and lens for encapsulating the light emitting diode (LED) die. | 04-26-2012 |
| 20120097986 | WAFER LEVEL REFLECTOR FOR LED PACKAGING - An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter. | 04-26-2012 |
| 20120097987 | Organic light emitting diode display - An organic light emitting diode display includes a substrate, a display unit that includes a common power line and a common electrode, an encapsulation substrate that is attached to the substrate by an adhering layer enclosing the display unit and includes a resin matrix and a plurality of carbon fiber. The display includes a first conductive portion and a second conductive portion. The first conductive portion is on a first inner surface region, a first side surface region, and a first outer surface region of the encapsulation substrate. The first conductive portion is adapted to supply a first electrical signal to the common power line. The second conductive portion is on a second inner surface region, a second side surface region, and a second outer surface region of the encapsulation substrate. The second conductive portion is adapted to supply a second electrical signal to the common electrode. | 04-26-2012 |
| 20120097988 | LED Module - A LED module has a LED chip, LED packaging materials, a metal base circuit board, a power connection cable, a heat sink that also functions as a metal case; and an optional potting material. The LED chip is fixed to the metal base close to the surface of the board. The LED packaging materials forms a package. A power connection line has a continuous uninterrupted power supply line. A continuous power cord from the power connection line is mounted on the metal injection molded parts corresponding fixed location. Self-tapping screws are mounted to the metal base circuit board. The self-tapping screws are formed of metal. A plastic end connector cap is for the power cord. The power connection cable passes through the plastic end connector cap and joins together with the metal case to form a fixed electrical connection by connecting to the power connection cable. | 04-26-2012 |
| 20120097989 | Organic Light Emitting Diode Device - An organic light emitting diode device comprises a first electrode, a second electrode facing the first electrode, a first light emitting unit and a second light emitting unit positioned between the first electrode and the second electrode, a charge generation layer positioned between the first light emitting unit and the second light emitting unit, and a charge balance layer positioned adjacent to charge generation layer and including a lithium-containing compound. | 04-26-2012 |
| 20120097990 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode (OLED) display according to an exemplary embodiment includes a display substrate on which a plurality of organic light emitting diodes are formed; a conducting material layer contacting one of electrodes included in the organic light emitting diode; an encapsulation substrate facing the display substrate; and an anti-reflective light transmission layer that is formed on a surface of the encapsulation substrate and is connected to the conducting material layer. | 04-26-2012 |
| 20120097991 | Light-Emitting Element, Light-Emitting Device, and Lighting Device - Described is a solid-state light-emitting element, a light-emitting device using the solid-state light-emitting element, and a lighting device using the light-emitting device. The solid-state light-emitting element comprises a member with a low refractive index which has a hemispherical structure on a first surface and an uneven structure on a second surface, a bonding layer with a high refractive index which planarizes the uneven structure, and a light-emitting body whose light-emitting surface is in contact with a flat surface of the bonding layer. The uneven structure of the member with a low refractive index is provided inside at least an outside shape of the hemispherical structure formed on the first surface; and the light-emitting body is provided such that an outside shape of the light-emitting region of the light-emitting body is smaller than the outside shape of the hemispherical structure and overlaps with the hemispherical structure. | 04-26-2012 |
| 20120097992 | Method of Manufacturing Organic Light Emitting Display Apparatus, and Organic Light Emitting Display Apparatus Manufactured by Using the Method - A method of manufacturing an organic light emitting display device and an organic light emitting display device manufactured using the method, which are suitable for manufacturing large-sized display devices on a mass scale and can be used for high-definition patterning. The method includes consecutively forming organic layers on a substrate on which a plurality of panels are arranged parallel to each other; forming a second electrode on the organic layers, for each of the panels; forming a passivation layer on the second electrode on each of the panels to cover the second electrode; and removing a part of the organic layers that exists between the passivation layer on the second electrode of one of the panels and the passivation layer on the second electrode of an adjacent one of the panels. | 04-26-2012 |
| 20120097993 | RECTIFYING UNIT, A LIGHT EMITTING DIODE DEVICE, AND THE COMBINATION THEREOF - A light emitting diode device includes a substrate; a first conducting terminal and a second conducting terminal receiving the alternative current signal; a first and a third light-emitting diode groups disposed on the substrate including a plurality of light emitting diodes electrically connecting with the first conducting terminal and the second conducting terminal and emitting light during the positive half power cycle; a second and the third light-emitting diode groups disposed on the substrate including a plurality of light emitting diodes electrically connecting with the first conducting terminal and the second conducting terminal and emitting light during the negative half power cycle; wherein one light emitting diode in the first light-emitting diode group includes more than three conductive connecting points to electrically connect to the second light-emitting diode group and the third light-emitting diode group. | 04-26-2012 |
| 20120097994 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - To provide a light emitting device high in reliability with a pixel portion having high definition with a large screen. According to a light emitting device of the present invention, on an insulator ( | 04-26-2012 |
| 20120097995 | LIGHT-EMITTING DIODE ARRAY - A method of fabricating a light emitting diode array, comprising: providing a temporary substrate; forming a first light emitting stack and a second light emitting stack on the temporary substrate; forming a first insulating layer covering partial of the first light emitting stack; forming a wire on the first insulating layer and electrically connecting to the first light emitting stack and the second light emitting stack; forming a second insulating layer fully covering the first light emitting stack, the wire and partial of the second light emitting stack; forming a metal connecting layer on the second insulating layer and electrically connecting to the second light emitting stack; forming a conductive substrate on the metal connecting layer; removing the temporary substrate; and forming a first electrode connecting to the first light emitting stack. | 04-26-2012 |
| 20120097996 | LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES - Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source. | 04-26-2012 |
| 20120104418 | LIGHT-EMITTING MODULE AND ALTERNATING CURRENT LIGHT-EMITTING DEVICE - A light-emitting module is provided, including a heat sink and a plurality of insulating layers disposed over the heat sink. A plurality of light-reflective layers is disposed over one of the insulating layers, respectively, wherein the light-reflective layers comprise a plurality of light-reflective inclined surfaces. A plurality of conductive layers is disposed over one of the light-reflective layers, respectively. A light-emitting diode (LED) chip is disposed over the heat sink. A plurality of bonding wires is provided, connecting the LED chip with the conductive layers. A transparent housing is disposed over the LED chip. A phosphor layer is disposed over a surface of the transparent housing facing the heat sink, and does not physically contact the LED chip. | 05-03-2012 |
| 20120104419 | TRANSISTOR ARRAY SUBSTRATE - A transistor array substrate includes a substrate, plural pads, plural shorting bars, at least one pixel array, plural first wires, and plural second wires. The substrate has at least one panel region and a peripheral circuit region surrounding the panel region. The pads and the shorting bars are disposed in the peripheral circuit region. The pixel array, the first wires, and the second wires are disposed in the panel region. The panel region has a pair of first edges and a pair of second edges. The first edges are connected between the second edges. The shorting bars are connected to the pads. The first wires and the second wires are electrically connected to the pixel array. The first wires are connected to some shorting bars through one of the first edges. The second wires are connected to the other shorting bars through at least one second edge | 05-03-2012 |
| 20120104420 | DISPLAY DEVICE AND ORGANIC LIGHT EMITTING DIODE DISPLAY - A display device includes a substrate, a display unit formed on the substrate, a sealing substrate bonded to the substrate by a bonding layer surrounding the display unit, the sealing substrate comprising a complex member and an insulating member, wherein the complex member has a resin matrix and a plurality of carbon fibers and the insulator is connected to an edge of the complex member and comprises a penetration hole, a metal layer disposed at one side of the sealing substrate wherein the one side faces the substrate, and a conductive connection unit filling in the penetration hole and contacting the metal layer. The complex member and the insulator may be coupled by tongue and groovecoupling along a thickness direction of the sealing substrate where the protrusion-groove coupling structure is top-to-bottom symmetric and the insulator may have a thickness identical to that of the complex member. | 05-03-2012 |
| 20120104421 | LEADFRAME PACKAGE WITH RECESSED CAVITY FOR LED - An LED package includes a die pad having a bottom surface, an upper surface and a centrally located recessed cavity. The recessed cavity has a chip attach surface between the bottom surface and upper surface and sidewalls that extend from the recessed chip attach surface to the upper surface. The package additionally has leads arranged on opposing sides of the die pad. The leads have a bottom surface that is coextensive with the bottom surface of the die pad and an upper surface coextensive with the upper surface of the die pad. An LED chip is attached to the chip attach surface. The package further includes a package body having an encapsulant which fills space between the die pad and leads forming a bottom encapsulant surface that is coextensive with the bottom surfaces of the die pad and leads. | 05-03-2012 |
| 20120104422 | ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light emitting display and a method of manufacturing the same. The organic light-emitting display is a transparent display where one can see through the display to view an image on the other side of the display. Each pixel of the display has a first region that includes an organic light emitting diode and a thin film transistor, and a larger second region that is transparent. The second region is made of either transparent layers or ultra thin layers so that light is not blocked. A second electrode of the display may include magnesium and may be produced by a selective deposition process, so that use of a fine metal mask may be avoided. | 05-03-2012 |
| 20120104423 | ORGANIC LIGHT-EMITTING ELEMENT, ORGANIC LIGHT-EMITTING DEVICE, ORGANIC DISPLAY PANEL, ORGANIC DISPLAY DEVICE, AND METHOD OF MANUFACTURING AN ORGANIC LIGHT-EMITTING ELEMENT - An organic light-emitting element includes a reflective anode, a first functional layer, an organic light-emitting layer that emits blue light, a second functional layer, a transparent cathode, and a coating layer. An optical thickness of the first functional layer is greater than 0 nm but not greater than 316 nm. A difference in refractive index between the transparent cathode and either a layer adjacent to the transparent cathode within the second functional layer or a layer adjacent to the transparent cathode within the coating layer is from 0.1 to 0.7 inclusive. The transparent cathode has a physical thickness greater than 0 nm but not greater than 70 nm, a refractive index from 2.0 to 2.4 inclusive, and an optical thickness greater than 0 nm but not greater than 168 nm. | 05-03-2012 |
| 20120104424 | LIGHT EMITTING DEVICE HAVING PLURALITY OF NON-POLAR LIGHT EMITTING CELLS AND METHOD OF FABRICATING THE SAME - Disclosed are a light emitting device having a plurality of non-polar light emitting cells and a method of fabricating the same. This method comprises preparing a first substrate of sapphire or silicon carbide having an upper surface with an r-plane, an a-plane or an m-plane. The first substrate has stripe-shaped anti-growth patterns on the upper surface thereof, and recess regions having sidewalls of a c-plane between the anti-growth patterns. Nitride semiconductor layers are grown on the substrate having the recess regions, and the nitride semiconductor layers are patterned to form the light emitting cells separated from one another. Accordingly, there is provided a light emitting device having non-polar light emitting cells with excellent crystal quality. | 05-03-2012 |
| 20120104425 | Method of Driving A Light Emitting Device - The present invention is characterized in that a transistor with its L/W set to 10 or larger is employed, and that |V | 05-03-2012 |
| 20120112212 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME - An organic light emitting diode (OLED) display is disclosed. In one embodiment, the OLED display includes first and second substrates, an OLED interposed between the first and second substrates and an external sealant formed between the first and second substrates and configured to i) substantially seal the first and second substrates and ii) substantially surround the OLED. The OLED display may further include a dam formed between the external sealant and the OLED and configured to substantially surround the OLED, and a getter formed between the external sealant and the dam. | 05-10-2012 |
| 20120112213 | DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY APPARATUS HAVING THE SAME - A display substrate includes a substrate, a gate line formed on the substrate, a data line formed on the substrate and crossing the gate line, a first pixel electrode formed on the substrate on which the gate and the data line are formed, an insulation layer formed on the substrate and the first pixel electrode, and a second pixel electrode formed on the insulation layer. The second pixel electrode includes a first sub-electrode that overlaps the first pixel electrode and the data line, and a second sub-electrode that is electrically connected to the data line through a switching element. | 05-10-2012 |
| 20120112214 | ACTIVE DEVICE ARRAY SUBSTRATE - An active device array substrate is provided. First, a substrate having a display area and a sensing area is provided. Then, a first patterned conductor layer is disposed on the display area of the substrate. A gate insulator is disposed on the substrate. A patterned semiconductor layer, a second patterned conductor layer and a patterned photosensitive dielectric layer are disposed on the gate insulator, wherein the second patterned conductor layer includes a source electrode, a drain electrode and a lower electrode, the patterned photosensitive dielectric layer covering the second patterned conductor layer includes an interface protection layer disposed on the source electrode and the drain electrode and a photo-sensing layer disposed on the lower electrode. A passivation layer is then disposed on the substrate. After that, a third patterned conductor layer including a pixel electrode and an upper electrode is disposed on the passivation layer. | 05-10-2012 |
| 20120119228 | LED DEVICE WITH IMPROVED THERMAL PERFORMANCE - An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings. | 05-17-2012 |
| 20120119229 | THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF - A thin film transistor array panel includes: a substrate including a display area and a drive region in which a driving chip for transmitting a driving signal to the pixels is located; a gate line in the display area; a storage electrode line; a gate driving pad coupled to the driving chip; a gate insulating layer; a first semiconductor layer on the gate insulating layer and overlapped with a gate electrode protruding from the gate line; a second semiconductor layer formed on the gate insulating layer and overlapped with a sustain electrode protruding from the storage electrode line; a data line crossing the gate line in an insulated manner and a drain electrode separated from the data line; and a pixel electrode coupled to the drain electrode, and the drain electrode comprises a drain bar facing the source electrode, and a drain extender overlapped with the second semiconductor layer. | 05-17-2012 |
| 20120119230 | LED DEVICE HAVING A TILTED PEAK EMISSION AND AN LED DISPLAY INCLUDING SUCH DEVICES - An LED package and a lead frame include a reflector cup having a bottom surface with an LED asymmetrically positioned on the bottom surface and a wall surface inclined relative to the bottom surface and defining an opening at an upper end thereof. The bottom surface of the reflector cup has a first axial dimension along a first axis and a second axial dimension along a second axis, orthogonal to the first axis. A display having an asymmetrical FFP and asymmetrical screen curve includes an array of the LED modules including a plurality of LED packages. At least some of the LED packages include a dome-shaped lens asymmetrically positioned with respect to a geometric center of the bottom surface of the reflector cup. | 05-17-2012 |
| 20120119231 | LED PACKAGE STRUCTURE WITH A DEPOSITED-TYPE PHOSPHOR LAYER AND METHOD FOR MAKING THE SAME - An LED package structure with a deposited-type phosphor layer includes a substrate unit, a light-emitting unit and a package unit. The substrate unit includes at least one circuit substrate. The light-emitting unit includes a plurality of LED chips disposed on and electrically connected to the at least one circuit substrate. The package unit includes at least one package resin body formed by a mold structure. The at least one package resin body is formed on the at least one circuit substrate to cover the LED chips, and the at least one package resin body includes a continuous phosphor layer formed therein and deposited on outer surfaces of the LED chips by centrifugal force. Hence, the instant disclosure provides the continuous phosphor layer with the deposited phosphor powders for covering the outer surfaces of the LED chips, thus the light-emitting efficiency of the LED package structure can be increased actually. | 05-17-2012 |
| 20120119232 | ARRAY SUBSTRATE AND A MANUFACTURING METHOD THEREOF - An embodiment of the invention provides a method for manufacturing an array substrate, wherein the procedure for forming a data line, an active layer with a channel, a source electrode, a drain electrode and a pixel electrode comprises applying a photoresist on a data line metal thin film and performing exposure and development processes by using a multi-tone mask so as to form a photoresist pattern including a third thickness region, a second thickness region and a first thickness region whose thicknesses are successively increased, the third thickness region at least corresponding to the pixel electrode, the second thickness region corresponding to the data line, the active layer, the source electrode and the drain electrode, and the first thickness region corresponding to the other regions. | 05-17-2012 |
| 20120119233 | METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND OPTOELECTRONIC SEMICONDUCTOR COMPONENT - A method for producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier; shaping a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body covers all side areas of the at least one optoelectronic semiconductor chip, and wherein a surface facing away from the carrier at the top side and/or a surface facing the carrier at the underside of the at least one semiconductor chip remains substantially free of the shaped body or is exposed, and removing the carrier. | 05-17-2012 |
| 20120119234 | PHOSPHOR, METHOD OF MANUFACTURING THE SAME, AND LIGHT-EMITTING DEVICE - The present invention is a phosphor expressed by the general formula (A | 05-17-2012 |
| 20120119235 | DISPLAY PANEL APPARATUS AND METHOD OF FABRICATING DISPLAY PANEL APPARATUS - A display panel apparatus includes a planarizing film formed on a substrate, at least one pixel including a lower electrode; an organic EL layer; and an upper electrode which are formed above the planarizing film; an auxiliary electrode electrically connected to the upper electrode which is the opposite to the lower electrode; a display section including a plurality of the pixels; an electrode plate electrically connected to the auxiliary electrode and arranged to cover the planarizing film outside the display section, and the electrode plate has a hole exposing a part of a surface of the planarizing film. Furthermore, the display panel apparatus also includes a hole injection layer which is an inorganic material layer made of an inorganic material and covering the hole. | 05-17-2012 |
| 20120119236 | Light-Emitting Diodes on Concave Texture Substrate - A semiconductor device having light-emitting diodes (LEDs) formed on a concave textured substrate is provided. A substrate is patterned and etched to form recesses. A separation layer is formed along the bottom of the recesses. An LED structure is formed along the sidewalls and, optionally, along the surface of the substrate between adjacent recesses. In these embodiments, the surface area of the LED structure is increased as compared to a planar surface. In another embodiment, the LED structure is formed within the recesses such that the bottom contact layer is non-conformal to the topology of the recesses. In these embodiments, the recesses in a silicon substrate result in a cubic structure in the bottom contact layer, such as an n-GaN layer, which has a non-polar characteristic and exhibits higher external quantum efficiency. | 05-17-2012 |
| 20120119237 | PIXELATED LED - A pixelated light emitting diode (LED) and a method for pixelating an LED are described. The pixelated LED includes two or more monolithically integrated electroluminescent elements disposed adjacent each other on a substrate, wherein at least a portion of each electroluminescent element immediately adjacent the substrate includes an inverted truncated pyramidal shape. The method for pixelating an LED includes selectively removing material from the major surface of an LED to a depth below the emissive region, thereby forming an array of inverted truncated pyramid shapes. The efficiency of the pixelated LEDs can be improved by incorporating the truncated pyramidal shape. Additionally, the crosstalk between adjacent LED pixels can be reduced by incorporating the truncated pyramidal shape. | 05-17-2012 |
| 20120126254 | LED LAMP WITH IMPROVED DIE ARRANGEMENT - An LED lamp with improved die arrangement includes a main board equipped with a plurality of lines of light-emitting dies. The lines of the light-emitting dies are spaced by a distance equal to or greater than 0.38 mm. A number of the light-emitting dies in each of the lines may be added or reduced for fitting the main board. The light-emitting dies in one of the lines may be aligned with or offset from the light-emitting dies in the adjacent line. The LED lamp may have the light-emitting dies deployed in both of the aligned manner and the offset manner, so that the light-emitting dies fit a desired lighting pattern of the LED lamp and the LED lamp illuminates with enhanced uniformity and brightness. | 05-24-2012 |
| 20120126255 | LIGHT EMITTING DEVICES AND METHODS - Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a substrate, one or more light emitting diodes (LEDs) disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. In one aspect, a method for making a light emitting device is disclosed. The method can include providing a substrate with one or more LEDs comprising electrical connectors. The method can further include providing a retention material on at least a portion of the substrate wherein the retention material is disposed over at least a portion of the electrical connectors. | 05-24-2012 |
| 20120126256 | LED PACKAGE - According to one embodiment, an LED package includes a first and a second lead frame separated from each other, an LED chip, a wire and a resin body. The LED chip is provided above the first and second lead frames, and has a pair of terminals provided on an upper surface of the LED chip. One of the terminals is connected to the first lead frame and one other terminal is connected to the second lead frame. The wire is drawn out from the one terminal horizontally to connect the one terminal to the first lead frame. The resin body covers the LED chip and the wire, an upper surface, a part of a lower surface and a part of an end surface of each of the first and second lead frames to expose a remaining part of the lower surface and a remaining part of the lower surface. | 05-24-2012 |
| 20120126257 | LIGHT EMITTING DEVICES AND METHODS - Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed. | 05-24-2012 |
| 20120126258 | DISPLAY DEVICE, ORGANIC LIGHT EMITTING DIODE DISPLAY, AND MANUFACTURING METHOD OF SEALING SUBSTRATE - A display device includes a display unit, a sealing substrate, a first metal layer, a second metal layer, and a conductive wire member. The display unit is formed over a substrate. A sealing substrate is secured to the substrate by a bonding layer, and comprising a composite member and an insulating member. A first metal layer is formed over the inner surface of the sealing substrate facing the substrate, and a second metal layer is formed over the outer surface of the sealing substrate. A conductive wire member successively passes through at least two points of each of the first metal layer, the insulating member, and the second metal layer, and is secured to the sealing substrate to provide conduction of the first metal layer and the second metal layer. | 05-24-2012 |
| 20120126259 | LIGHT EMITTING DIODE - A light emitting diode, comprising: a transparent substrate; a wiring layer; and a semiconductor light emitting element structure part between the transparent substrate and the wiring layer, the semiconductor light emitting element structure part further comprising: a semiconductor light emitting layer; a transparent conductive layer provided on the wiring layer side of the semiconductor light emitting layer; a transparent insulating film; a metal reflection layer; and a first electrode part and a second electrode part provided on the wiring layer side of the transparent insulating film, to be electrically connected to the wiring layer, wherein the first electrode part is electrically connected to the first semiconductor layer via a first contact part which is provided to pass through the transparent insulating film, and the second electrode part is electrically connected to the second semiconductor layer by a second contact part provided to pass through the transparent insulating film, the transparent conductive layer, the first semiconductor layer, and the active layer. | 05-24-2012 |
| 20120126260 | HIGH EFFICACY SEMICONDUCTOR LIGHT EMITTING DEVICES EMPLOYING REMOTE PHOSPHOR CONFIGURATIONS - A semiconductor light emitting apparatus a semiconductor light emitting device configured to emit light inside a hollow shell including wavelength conversion material dispersed therein or thereon. A semiconductor light emitting apparatus according to some embodiments is capable of generating in excess of 230 lumens per watt. | 05-24-2012 |
| 20120126261 | LENS, LIGHT-EMITTING MODULE, LIGHT-EMITTING ELEMENT PACKAGE, ILLUMINATION DEVICE, DISPLAY DEVICE, AND TELEVISION RECEIVER | 05-24-2012 |
| 20120132931 | LED MODULE - According to one embodiment, an LED module includes a substrate, an interconnect layer, a light emitting diode (LED) package, and a reflection member. The interconnect layer is provided on the substrate. The LED package is mounted on the interconnect layer. The reflection member is provided on a region in the substrate where the LED package is not mounted and has a property of reflecting light emitted from the LED package. The LED package includes a first lead frame, a second lead frame, an LED chip, and a resin body. The first lead frame and the second lead frame are arranged apart from each other on the same plane. The LED chip is provided above the first lead frame and the second lead frame, with one terminal connected to the first lead frame and one other terminal connected to the second lead frame. The resin body covers the LED chip, covers an upper surface, a part of a lower surface, and a part of an end surface of each of the first lead frame and the second lead frame, and exposes a remaining part of the lower surface and a remaining part of the end surface. | 05-31-2012 |
| 20120132932 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display is disclosed. The organic light emitting diode display includes: a substrate, an organic light emitting diode positioned on the substrate, a metal layer positioned on the substrate with the organic light emitting diode interposed therebetween, and a resin layer positioned on the metal layer and configured to reinforce a strength of the metal layer. | 05-31-2012 |
| 20120132933 | LED MODULE AND ILLUMINATION APPARATUS - According to one embodiment, an LED module includes a substrate, an interconnect layer, an LED package, and a resin. The resin is provided on the substrate to cover the LED package. The resin has a refractive index higher than a refractive index of air. The resin is transmissive with respect to light emitted from the LED package. The LED package includes first and second leadframes, an LED chip, and a resin body. The first and second leadframes are disposed on a plane. An exterior form of the resin body is used as an exterior form of the LED package. | 05-31-2012 |
| 20120132934 | ORGANIC EL ELEMENT, DISPLAY APPARATUS, AND LIGHT-EMITTING APPARATUS - An organic EL element has an anode, a cathode, a hole injection layer and at least one functional layer disposed between the anode and the cathode. The at least one functional layer contains an organic material. Holes are injected into the functional layer from the hole injection layer, which contains a tungsten oxide. A Ultraviolet Photoelectron Spectroscopy (UPS) spectrum obtained from a UPS measurement has a protrusion near a Fermi surface and within a region corresponding to a binding energy range lower than a top of the valence band. The tungsten oxide contained in the hole injection layer satisfies a condition, determined from an X-ray Photoelectronic Spectroscopy measurement, that a ratio in a number density of atoms other than tungsten and oxygen atoms to the tungsten atoms does not exceed approximately 0.83. | 05-31-2012 |
| 20120132935 | METHOD OF MANUFACTURING AN ORGANIC LIGHT-EMITTING ELEMENT, ORGANIC LIGHT-EMITTING ELEMENT, DISPLAY PANEL, AND DISPLAY DEVICE - A method of manufacturing an organic light-emitting element. A first layer is formed above a substrate, and exhibits hole injection properties. A bank material layer is formed above the first layer using a bank material. Banks are formed by patterning the bank material layer, and forming a resin film on a surface of the first layer by attaching a portion of the bank material layer to the first layer, the banks defining apertures corresponding to light-emitters, the resin material being the same as the bank material. A functional layer is formed by applying ink to the apertures that contacts the resin film. The ink contains an organic material. The functional layer includes an organic light-emitting layer. A second layer is formed above the functional layer and exhibits electron injection properties. The hole injection properties of the first layer are then degraded by applying electrical power to an element structure. | 05-31-2012 |
| 20120138963 | PIXEL STRUCTURE - A pixel structure includes a substrate, a scan line, a first data line, a second data line, a first active device, a second active device, a first pixel electrode, and a second pixel electrode. The substrate has a first unit area and a second unit area. The first pixel electrode is disposed in the first unit area and includes a first main portion and first branch portions extending from the first main portion to an edge of the first unit area. The second pixel electrode is disposed in the second unit area and includes a second main portion and second branch portions extending from the second main portion to an edge of the second unit area, wherein at least a part of the first branch portions and at least a part of the second branch portions are asymmetrically arranged at two sides of the second data line. | 06-07-2012 |
| 20120138964 | BACKLIGHT FILM, METHOD AND APPARATUS FOR FORMING SAME - A backlight film includes a flexible substrate with a first electrode layer, a polymeric light emitting layer, a second electrode layer and a protection layer formed subsequently on the flexible substrate. The first electrode layer, the polymeric light emitting layer and the second electrode layer each has a predetermined pattern. The backlight film further includes an insulating layer arranged around the polymeric light emitting layer. A method and an apparatus for forming the backlight film are also provided. | 06-07-2012 |
| 20120138965 | DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A display substrate includes a base substrate, a data line, a gate line, a switching element, a self assembled monolayer (SAM) and a pixel electrode. The data line is formed on the base substrate. The gate line is formed across the data line. The switching element includes a source electrode electrically connected to the data line, a drain electrode spaced apart from the source electrode, a semiconductor pattern covering the source and drain electrodes, and a gate electrode electrically connected to the gate line and facing the semiconductor pattern. The SAM is disposed around the semiconductor pattern and a conductive pattern including the data line. The pixel electrode is electrically connected to the switching element. | 06-07-2012 |
| 20120138966 | Organic Light Emitting Diode Display - An organic light emitting diode (OLED) display includes a first electrode including a conductive black layer, a second electrode facing the first electrode, and an organic emission layer provided between the first electrode and the second electrode. | 06-07-2012 |
| 20120138967 | LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An LED package includes: 2n lead frames (n is a natural number); n LED chips provided above the 2n lead frames, one terminal of each of the n LED chips being connected to each of the n lead frames, another terminal of each of the n LED chips being connected to each of other n lead frames; a wire connected between the terminal and one of the lead frames; and a resin body covering the n LED chips, the wire, and a part of each of the 2n lead frames. The each of the 2n lead frames includes; a base having an upper surface and side surfaces, the upper surface and the side surfaces being covered with the resin body; and a plurality of extending portions extending from the base, one of the extending portions having tip surface which is exposed at one side surface of the resin body, another of the extending portions having tip surface which is exposed at another side surface of the resin body, the one side surface and the another side surface being perpendicular to each other, and. An outer shape of the resin body forms an outer shape of the LED package. | 06-07-2012 |
| 20120138968 | SEMICONDUCTOR PACKAGE AND DISPLAY PANEL ASSEMBLY HAVING THE SAME - Provided are a semiconductor package with a reduced lead pitch, and a display panel assembly having the semiconductor package. The semiconductor package includes a film having a hole formed therein, a plating pattern formed under the film and forming a wire; a semiconductor chip placed in the hole and electrically connected to the plating pattern; and a first passivation layer formed at a side opposite to the semiconductor chip about the plating pattern and protecting the plating pattern. | 06-07-2012 |
| 20120138969 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING DEVICE WITH THE SAME - The present invention relates to a light emitting device, a light emitting device package, and a lighting device with the same. The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a second electrode layer formed on an underside of the light emitting structure connected to the second conductive type semiconductor layer electrically, a first electrode layer in contact with the first conductive type semiconductor layer passed through the second conductive type semiconductor layer and the active layer, and an insulating layer formed between the second electrode layer and the first electrode layer, between the second conductive type semiconductor layer and the first electrode layer, and between the active layer and the first electrode layer. | 06-07-2012 |
| 20120138970 | FOLDABLE ORGANIC LIGHT EMITTING DIODE DISPLAY - A foldable display includes a first plate, a second plate, a first protecting window, a second protecting window, a soft material layer and an intermediate layer which controls brightness. The first plate includes a thin film transistor and an organic light emitting diode (“OLED”), and displays at least one portion of an image to be displayed. The second plate includes a thin film transistor and an OLED, and displays a second portion different from the first portion of the image. The first protecting window is on the first plate. The second protecting window is on the second plate. The soft material layer is between the first and second protecting windows. The intermediate layer is between the soft material layer and a side surface of the first protecting window, and between the soft material layer and the second protecting window. | 06-07-2012 |
| 20120138971 | Organic Electro-Optical Component - An organic electro-optical component, with an electrode, counter-electrode, and organic region made up of one or more organic materials, which is in electrical contact and in an active region overlapping with the electrode and the counter-electrode, wherein the electrode and/or the counter-electrode have part electrodes which extend from a part electrode connecting section which is arranged outside of the active region, a distal electrode section is electrically connected via a proximal electrode section to the part electrode connecting section, the distal electrode section is formed at least in sections within the active region, and the proximal electrode section is formed outside of the active region and by means of an electrical pathway, the pathway length of which is larger than the shortest distance between an end of the distal electrode section facing the part electrode connecting section and the part electrode connecting section. | 06-07-2012 |
| 20120138972 | ARRAY SUBSTRATE AND A METHOD FOR FABRICATING THE SAME AND AN ELECTRONIC PAPER DISPLAY - The present disclosure discloses a method for fabricating an array substrate comprising: depositing a source/drain metallic film on a first base substrate, and forming a source electrode, a drain electrode and a data line; sequentially depositing a semiconductor layer film, a gate insulating layer film and a gate metallic film on the first base substrate, and forming a semiconductor layer, a gate insulating layer, a gate electrode and a gate line; depositing a gate protection layer film on the first base substrate, and forming a gate protection layer and a through hole, wherein the through hole is formed on the gate protection layer corresponding to the drain electrode to expose a portion of the drain electrode; and depositing a pixel electrode film on the first base substrate, and forming a pixel electrode, wherein the pixel electrode is connected to the drain electrode via the through hole. | 06-07-2012 |
| 20120138973 | ORGANIC LIGHT-EMITTING PANEL AND MANUFACTURING METHOD THEREOF, AND ORGANIC DISPLAY DEVICE - A non-light-emitting cell | 06-07-2012 |
| 20120138974 | LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF - There is provided a light emitting device package including: a substrate having a circuit pattern formed on at least one surface thereof and including an opening; a wavelength conversion layer formed by filling at least a portion of the opening with a wavelength conversion material; and at least one light emitting device disposed on a surface of the wavelength conversion layer and electrically connected to the circuit pattern. | 06-07-2012 |
| 20120138975 | LIGHT- EMITTING ELEMENT AND DISPLAY DEVICE - A light-emitting element and a display device having a resonator structure which has a small luminance fluctuation, even if a film thickness is deviated from a designed value, thereby resulting in a variation in resonator optical path length. There are included: a first reflective member; a second reflective member; and a light-emitting layer provided therebetween, and there is provided a resonator structure that transmits part of light by the first reflective member or the second reflective member, the light being resonated between the first reflective member and the second reflective member. The resonator structure has at least two or more resonance spectral peaks at respective wavelengths in a visible light range with a wavelength of a maximum value relative luminosity being a border line and an emission output spectrum has at least two or more peaks at respective wavelengths based on the resonance spectral peaks. | 06-07-2012 |
| 20120138976 | ORGANIC ELECTROLUMINESCENT ELEMENT, ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE, AND ORGANIC ELECTROLUMINESCENT ILLUMINATING DEVICE - An organic electroluminescent element according to the present invention includes: an anode ( | 06-07-2012 |
| 20120146059 | Organic light emitting diode display - An organic light emitting diode (OLED) display includes: a substrate; an organic light emitting diode disposed on the substrate; a sealing member sealed with the substrate, interposing the organic light emitting diode therebetween; a pad portion disposed on the substrate, corresponding to an edge of the sealing member, and electrically connected with the organic light emitting diode; a conductive line portion formed on the sealing member and/or on the substrate, and applied with driving power supplied to the organic light emitting diode; and a conductive connection portion directly connecting the pad portion and the conductive line portion. | 06-14-2012 |
| 20120146060 | Organic Light Emitting Display Device and Manufacturing Method for the Same - An organic light emitting display device may comprises a thin film transistor including an active layer, a gate electrode including a gate lower electrode and a gate upper electrode, a source electrode, a drain electrode, and an organic light emitting device electrically connected to the thin film transistor. A pixel electrode formed of the same material and in the same layer as the gate lower electrode, an intermediate layer including a light emitting layer, and an opposed electrode are sequentially deposited. A first pad electrode is formed in the same layer as the gate lower electrode, a second pad electrode is formed on at least a part of the first pad electrode and in the same layer as the gate upper electrode, and a third pad electrode contacts at least a part of the second pad electrode and is formed in the same layer as the source electrode. | 06-14-2012 |
| 20120146061 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - A large size organic light emitting diode (OLED) display and manufacturing method thereof are disclosed. In one embodiment, the method includes i) forming a display unit including a plurality of pixels on a substrate, ii) forming a getter layer, a bonding layer and a conductive contact layer around the display unit and iii) manufacturing a sealing member including a flexible polymer film and a metal layer formed on at least one side of the polymer film. The method may further include laminating the sealing member on the substrate using a roll lamination process such that the metal layer contacts the conductive contact layer and curing the contact layer and the conductive contact layer. | 06-14-2012 |
| 20120146062 | LIGHT EMITTING DEVICE, DISPLAY APPARATUS, AND ELECTRONIC APPARATUS - In a display panel, a first electron injection layer is formed between an anode and a light-emitting functional layer, and a hole injection layer is formed between the anode and the first electron injection layer. In other words, the hole injection layer, the first electron injection layer, and the light-emitting functional layer are configured to be laminated on the anode in this order. An electron injection material used for the first electron injection layer is diffused into the hole injection layer, and the diffused electron injection material inhibits or promotes hole transportation of the hole injection layer, so that the amount of holes transported to a light-emitting functional layer is adjusted. As a result, the carrier balance is improved. | 06-14-2012 |
| 20120146063 | LIGHT EMITTING DIODE LAMP - An LED lamp comprises a front cover comprising an upper plate, a first sidewall perpendicular to the upper plate, a through hole in a central portion of the upper plate; a rear cover comprising a bottom plate, a second sidewall perpendicular from the bottom plate to engage the front and rear covers by sleeving over the first sidewall; a lamp body comprising a first and second substrates, a third sidewall interconnecting the first and second substrates, the third sidewall penetrating through the through hole and is between the upper and bottom plates; a first LED unit on the first substrate, facing the second substrate; a second LED unit on the second substrate, facing away the first substrate, wherein the LED lamp is configure to direct light from the first LED units via the third sidewall, and light from the second LED units along a direction away from the first substrate. | 06-14-2012 |
| 20120146064 | DEPOSITION MASK AND METHOD OF MANUFACTURING ORGANIC EL DISPLAY PANEL INCORPORATING DEPOSITION MASK - A deposition mask used in the manufacture of an organic EL display panel. A sheet of mask foil provided with a plurality of slit-shaped openings is fixed to a mask frame. Ends of successively arranged at least three openings are displaced from one another along the longitudinal direction of the openings. | 06-14-2012 |
| 20120146065 | LIGHTING EMITTING DEVICE, MANUFACTURING METHOD OF THE SAME, ELECTRONIC DEVICE HAVING THE SAME - One pixel is divided into a first region including a first light emitting element and a second region including a second light emitting element, wherein the first region emits light in one direction and the second region emits light in the direction opposite to that of the first region. Independently driving the first light emitting element and the second light emitting element allows images to be displayed independently on the surface. | 06-14-2012 |
| 20120153306 | HIGH POWER LEDS WITH NON-POLYMER MATERIAL LENSES AND METHODS OF MAKING THE SAME - LED chips and packages are disclosed having lenses made of materials that resist degradation at higher operation temperatures and humidity, and methods of fabricating the same. The lenses can be made of certain materials that can withstand high temperatures and high humidity, with the lenses mounted to the LED prior to certain critical metallization steps. This helps avoid damage to the metalized part that might occur as a result of the high mounting or bonding temperature for the lens. One embodiment of an LED chip comprises a flip-chip LED and a lens mounted to the topmost surface of the flip-chip LED. Lenses can be bonded to LEDs at the wafer level or at the chip level. The lens comprises a non-polymer material and the LED chip is characterized as having substantially no polymer materials in contact with the LED chip. | 06-21-2012 |
| 20120153307 | LED LIGHTING DEVICE WITH EXCELLENT HEAT DISSIPATION PROPERTY - The present invention relates to an improved LED lighting device with good heat dissipation, comprising: a housing; a copper circuit layer, disposed on the housing; a plurality of LED chips, disposed on the copper circuit layer; and a white reflective member, disposed on the plurality of LED chips and the copper circuit layer, wherein the white reflective member is used to increase the light-emitting efficiencies of the LED chips. In the present invention, the copper circuit layer is directly disposed on the housing without using an aluminum substrate or a print circuit board, so that the cost of the improved LED lighting device is reduced; moreover, that also prevents the LED chips from damage when welding the LED chips, and makes the improved LED lighting device performing better heat dissipation property. | 06-21-2012 |
| 20120153308 | ORGANIC LIGHT-EMITTING DISPLAY APPARATUS - An organic light-emitting display apparatus is disclosed. In one embodiment, the display apparatus includes i) a substrate and ii) an organic light-emitting device formed on the substrate, the organic light-emitting device including a stack structure including a first electrode, an organic light-emitting layer, and a second electrode. The apparatus may further include a sealing layer formed on the substrate so as to cover the organic light-emitting device, the sealing layer including an inorganic layer and a porous layer interposed between the sealing layer and the organic light-emitting device. One embodiment can reduce a stress due to a sealing inorganic layer so as to maintain characteristics for a long time in a severe environment and not affect an organic light-emitting device. | 06-21-2012 |
| 20120153309 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - A display apparatus includes a first insulating substrate including a display area in which a first opening is formed, as well as a non-display area. A second insulating substrate faces the first insulating substrate. The second insulating substrate includes a shutter part having a second opening corresponding to the first opening. The shutter part moves between two different positions to transmit or block light according to an overlap between the first opening and the second opening. | 06-21-2012 |
| 20120153310 | DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A display substrate includes an insulating substrate, a signal line, first and second pixel electrodes, a connection line and an insulating layer. The signal line is disposed on the insulating substrate. The first pixel electrode is electrically connected to the signal line through a switching element. The second pixel electrode overlaps the first pixel electrode. The connection line contacts an end portion of the signal line and extends to an end portion of the insulating substrate. The insulating layer is disposed between the first and second pixel electrodes and covers the connection line. The connection line is protected by the insulating layer, and the reliability of the display substrate is enhanced. | 06-21-2012 |
| 20120153311 | LOW-COST SOLID-STATE BASED LIGHT EMITTING DEVICES WITH PHOTOLUMINESCENT WAVELENGTH CONVERSION AND THEIR METHOD OF MANUFACTURE - A method of manufacturing a light emitting device comprises: mounting and electrically connecting a plurality of solid-state light emitters onto a substrate in a known configuration; screen printing a pattern of at least one photo luminescent material onto a surface of a light transmissive carrier such that there is a respective region of photo luminescent material corresponding to a respective one of the light emitters and mounting the carrier to the substrate such that each region of photo luminescent material overlays a respective one of the light emitters. Where the light transmissive carrier comprises a thermo formable material the method can further comprise heating and vacuum molding the carrier such as to form an array of hollow features configured such that a respective feature corresponds to a respective light emitter and is capable of housing a respective light emitter. | 06-21-2012 |
| 20120153312 | ARRAY SUBSTRATES AND METHODS FOR MANUFACTURING THE SAME - Disclosed is a method of forming array substrates having a peripheral wiring area and a display area. The method is processed by only three lithography processes with two multi-tone photomasks and one general photomask. In the peripheral wiring area, the top conductive line directly contacts the bottom conductive line without any other conductive layer. The conventional lift-off process is eliminated, thereby preventing a material (not dissolved by a stripper) from suspending in the stripper or remaining on the array substrate surface. | 06-21-2012 |
| 20120153313 | LIGHT EMITTING DEVICE AND ILLUMINATION APPARATUS USING SAME - A light emitting device includes a solid light-emitting element; a mounting substrate mounting the solid light-emitting element thereon; an encapsulating member encapsulating the solid light-emitting element; and a lead frame electrically connected to the solid light-emitting element through a wire. The lead frame is arranged on a rear surface of the mounting substrate, and the mounting substrate includes a front mounting surface on which the solid light-emitting element is mounted. The front mounting surface having a smooth surface region covered with the encapsulating member. The mounting substrate further includes a wire hole through which the wire extends from the front mounting surface of the mounting substrate to the rear surface thereof. | 06-21-2012 |
| 20120153314 | LIGHT SIGNAL - A light signal contains a semiconductor light source and a convex lens system for representing signal aspects, especially on rail-bound traffic routes. In order to eliminate the need for monochrome semiconductor light sources, the semiconductor light source is a white point light source. A signal aspect-specific color filter is provided in the aperture region of the point light source. | 06-21-2012 |
| 20120153315 | LIGHT EMITTING DEVICE - A light emitting device includes: a chip-mounting base formed with a plurality of conductive contacts; a reflector mounted on the chip-mounting base and defining a central hole; a first light emitting chip mounted on the chip-mounting base within the central hole and in electrical contact with respective ones of the conductive contacts for generating light with a first primary wavelength; a second light emitting chip stacked on and in electrical contact with the first light emitting chip for generating light with a second primary wavelength different from the first primary wavelength; and an encapsulant filling the central hole and capable of converting the first and second primary wavelengths into first and second secondary wavelengths, respectively. | 06-21-2012 |
| 20120153316 | LIGHT EMITTING DEVICE HAVING A TRANSPARENT THERMALLY CONDUCTIVE LAYER - A light emitting device and method of producing the same is disclosed. The light emitting device includes a transparent thermally conductive layer, a phosphor layer provided on the transparent thermally conductive layer, wherein the phosphor layer is not enclosed within any layers not containing phosphor, and at least one light emitting semiconductor arranged to emit light toward the transparent thermally conductive layer and the phosphor layer. | 06-21-2012 |
| 20120161161 | ARRAY ASSEMBLIES WITH HIGH VOLTAGE SOLID STATE LIGHTING DIES - Various embodiments of solid state lighting (“SSL”) assemblies with high voltage SSL dies and methods of manufacturing are described herein. In one embodiment, an array assembly of SSL dies includes a first terminal and a second terminal configured to receive an input voltage (Vo). The array assembly also includes a plurality of SSL dies coupled between the first terminal and the second terminal, at least some of which are high voltage SSL dies coupled in parallel. | 06-28-2012 |
| 20120161162 | Optoelectronic Semiconductor Component - An optoelectronic semiconductor device is specified, comprising a multiplicity of radiation-emitting semiconductor chips ( | 06-28-2012 |
| 20120161163 | LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device package uses a metal layer as a reflective region and includes a light-emitting device chip and an electrode pad that are disposed on an insulating layer. In addition, the electrode pad and an electrode pattern of a printed circuit board are connected to each other by an electrode pattern formed of conductive ink. A method of manufacturing a light-emitting device package includes forming an insulating layer on a metal layer, and bonding a light-emitting device chip and an electrode pad on the insulating layer. The electrode pad and a printed circuit board are connected to each other by conductive ink. | 06-28-2012 |
| 20120161164 | LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided are a light-emitting device package and a method of manufacturing the same. The light-emitting device package may include a plurality of light-emitting chips on one substrate (board). The plurality of light-emitting chips may produce colors around a target color. The target color may be produced by combinations of the colors of light emitted from the plurality of light-emitting chips. The colors around the target color may have the same hue as the target color and have color temperatures different from that of the target color. The plurality of light-emitting chips may have color temperatures within about ±250K of that of the target color. | 06-28-2012 |
| 20120161165 | LIGHTING DEVICE - For integration of light-emitting elements and for suppression of a voltage drop, plural stages of light-emitting element units each including a plurality of light-emitting elements which is connected in parallel are connected in series. Further, besides a lead wiring with a large thickness, a plurality of auxiliary wirings with different widths and different thicknesses is used, and the arrangement of the wirings, electrodes of the light-emitting elements, and the like is optimized. | 06-28-2012 |
| 20120161166 | LIGHTING DEVICE - For integration of light-emitting elements and for suppression of a voltage drop, plural stages of light-emitting element units provided over a substrate having an insulating surface and each including a plurality of light-emitting elements which is connected in parallel are connected in series. Further, besides a lead wiring with a large thickness, a plurality of auxiliary wirings with different widths and different thicknesses is used, and the arrangement of the wirings, electrodes of the light-emitting elements, and the like is optimized. Note that in the lighting device, light emitted from the light-emitting element passes through the substrate having an insulating surface and then is extracted. | 06-28-2012 |
| 20120161167 | Light-Emitting Unit, Light-Emitting Device, Lighting Device, and Method for Manufacturing Light-Emitting Unit - A light-emitting unit with small energy loss is provided. Further, a light-emitting unit with high reliability is provided. A light-emitting unit is provided in the following manner: a separation layer including a leg portion and a stage portion, which protrudes over an electrode is formed so that a projected area of the stage portion is larger than that of the leg portion; a layer containing a light-emitting organic compound, an upper electrode of the first light-emitting element, and an upper electrode of the second light-emitting element are formed; and the upper electrode of the first light-emitting element is electrically connected to a lower electrode of the second light-emitting element in a region overlapping with the stage portion of the separation layer. | 06-28-2012 |
| 20120161168 | LIGHT EMITTING DEVICE - A light emitting device includes: a chip-mounting base formed with a plurality of conductive contacts; a reflector mounted on the chip-mounting base and defining a central hole; a first light emitting chip mounted on the chip-mounting base within the central hole and in electrical contact with respective ones of the conductive contacts for generating light with a first primary wavelength; a second light emitting chip stacked on and in electrical contact with the first light emitting chip for generating light with a second primary wavelength different from the first primary wavelength; and an encapsulant filling the central hole and capable of converting the first and second primary wavelengths into first and second secondary wavelengths, respectively. | 06-28-2012 |
| 20120161169 | LIGHT-EMITTING DIODE DIE PACKAGE AND METHOD FOR PRODUCING SAME - The present invention relates to a light-emitting diode die package having an LED die and an accommodating housing. The LED die has a first doped layer doped with a p- or n-type dopant and a second doped layer doped with a different dopant from that doped in the first doped layer. Each of the first and second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is formed. The insulation layer is formed with exposure holes for exposing the electrodes corresponding thereto. Each of the exposure holes is formed inside with an electrically conductive linker. The accommodating housing has an open end through which an accommodating space is accessible. The LED die is positioned within the accommodating space in such a manner that the electrically conductive linker protrudes outwardly from the accommodating space. | 06-28-2012 |
| 20120168777 | LED PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - An LED package structure includes: a carrier; at least a first protruding portion and a plurality of electrical contacts formed on the carrier; a plurality of LED chips disposed on the first protruding portion and on the carrier in a region free from the first protruding portion, respectively; a plurality of bonding wires electrically connecting the | 07-05-2012 |
| 20120168778 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An OLED display includes a substrate, a first electrode on the substrate, an organic emission layer on the first electrode, a second electrode on the organic emission layer, an insulating layer substantially covering the second electrode and having an opening that exposes a center portion of the second electrode, and a power supply electrically coupled with the second electrode through the opening of the insulating layer and configured to supply power to the second electrode. | 07-05-2012 |
| 20120168779 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - An organic light emitting diode display includes: a substrate; a display device formed on the substrate, and including a common power line and a common electrode; a sealing substrate attached to the substrate by a junction layer surrounding the display device, the sealing substrate sealing the display device with the substrate; a first conductor formed over an outer side, a lateral side, and an inner side of the sealing substrate, the first conductor being for supplying a first electrical signal to the common power line; a second conductor formed on the inner side, the lateral side, and the outer side of the sealing substrate, the second conductor being for supplying a second electrical signal to the common electrode; and a plurality of arranging members formed into the sealing substrate, the first conductor, and the second conductor, the arranging members being for arranging positions of the sealing substrate, the first conductor, and the second conductor. | 07-05-2012 |
| 20120168780 | RESIN FOR TRANSPARENT ENCAPSULATION MATERIAL, AND ASSOCIATED ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE - A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si—H/Si-Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1. | 07-05-2012 |
| 20120168781 | LIGHT-EMITTING-ELEMENT ENCAPSULATING COMPOSITION, LIGHT-EMITTING DIODE AND LIQUID-CRYSTAL DISPLAY DEVICE - An encapsulating composition for a light emitting element, a light emitting diode (LED) and a liquid crystal display device (LCD) are provided. A silicone-cured product included as a main ingredient and a conductivity-providing agent having excellent compatibility and capable of providing superior conductivity can be used to significantly reduce the surface resistivity of the silicone-cured product. Therefore, the encapsulating composition for a light emitting element, the LED and the LCD can be useful in solving the problems regarding attachment of a foreign substance such as dust due to static electricity, and degradation of transparency since the composition has low surface resistivity when used as a semiconductor encapsulation material for an LED, and also in providing a cured product having excellent properties such as light resistance, heat resistance, durability and optical transparency. | 07-05-2012 |
| 20120168782 | LIGHT EMITTING DIODE, LIGHT EMITTING DIODE LAMP, AND ILLUMINATING APPARATUS - Disclosed is a light-emitting diode, which has an infrared emission wavelength of 700 nm or more, excellent monochromatism characteristics, and high output and high efficiency and excellent humidity resistance. The light-emitting diode is provided with: a light-emitting section ( | 07-05-2012 |
| 20120168783 | ORGANIC LIGHT EMITTING DISPLAY DEVICE - An organic light emitting display device includes a substrate, a plurality of pixels on the substrate having a first region configured to emit light and a second region configured to transmit external light, a plurality of pixel circuit units, a plurality of first electrodes, a first organic layer on the plurality of first electrodes, a second organic layer on the first organic layer, the second organic layer including an emission layer, a third organic layer on the second organic layer, the third organic layer being positioned in the first region and outside a central portion of the second region, and a second electrode having a first portion only on the third organic layer. | 07-05-2012 |
| 20120168784 | Two-Transistor Pixel Array - A two-transistor (2T) pixel comprises a chemically-sensitive transistor (ChemFET) and a selection device which is a non-chemically sensitive transistor. A plurality of the 2T pixels may form an array, having a number of rows and a number of columns. The ChemFET can be configured in a source follower or common source readout mode. Both the ChemFET and the non-chemically sensitive transistor can be NMOS or PMOS device. | 07-05-2012 |
| 20120175643 | Packaging Photon Building Blocks Having Only Top Side Connections in an Interconnect Structure - Standardized photon building blocks are used to make both discrete light emitters as well as array products. Each photon building block has one or more LED chips mounted on a substrate. No electrical conductors pass between the top and bottom surfaces of the substrate. The photon building blocks are supported by an interconnect structure that is attached to a heat sink. Landing pads on the top surface of the substrate of each photon building block are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors on the interconnect structure are electrically coupled to the LED dice in the photon building blocks through the contact pads and landing pads. The bottom surface of the interconnect structure is coplanar with the bottom surfaces of the substrates of the photon building blocks. | 07-12-2012 |
| 20120175644 | DISPLAYS WITH EMBEDDED MEMS SENSORS AND RELATED METHODS - Embodiments of displays with embedded MEMS sensors and related methods are described herein. Other embodiments and related methods are also disclosed herein. | 07-12-2012 |
| 20120175645 | ORGANIC EL DISPLAY DEVICE AND ELECTRONIC APPARATUS - An organic EL display device includes organic EL elements provided for respective pixels. Each organic EL element has first and second electrodes between which an organic layer is provided and has a region that contributes to light emission and a region that does not contribute to light emission. A capacitor is formed between the first and second electrodes in the region that does not contribute to light emission and is used as a capacitance element in a drive circuit for the organic EL element. | 07-12-2012 |
| 20120175646 | LIGHT EMITTING DIODE MODULE - An LED module includes a base, a circuit layer formed on the base and multiple LEDs each having an LED die connecting to the circuit layer. The circuit layer includes multiple connecting sections. Each connecting section includes a first connecting part and a second connecting part electrically insulating and spaced from each other. Each LED includes an electrode layer having a first section and a second section electrically insulated from the first section and respectively electrically connecting the first and second connecting parts of a corresponding connecting section. The LED die is electrically connected to the second section. A transparent electrically conductive layer is formed on the LED die and electrically connects the LED die to the first section of the electrode layer. An electrically insulating layer is located between the LED die and surrounding the LED die except where the transparent electrically conductive layer connects. | 07-12-2012 |
| 20120175647 | DISPLAY DEVICE AND ELECTRONIC APPARATUS - A display device including: a plurality of sub-pixels arranged in a matrix, each including an electro-optical element having a structure in which a display functional layer is sandwiched between an upper electrode and a lower electrode; and an auxiliary interconnect contact in a pixel area in which the plurality of sub-pixels are arranged in a matrix and electrically connecting the upper electrode to an auxiliary interconnect, wherein m (m is an integer equal to or larger than two) sub-pixels adjacent to each other along an arrangement direction of the sub-pixels are regarded as one group, and n (n is a natural number smaller than m) auxiliary interconnect contacts are formed for each group. | 07-12-2012 |
| 20120175648 | DISPLAY PANEL DEVICE, DISPLAY DEVICE, AND METHOD OF MANUFACTURING DISPLAY PANEL DEVICE - Provided is a display panel device including a pixel unit including a luminescent layer, and a lens that covers a luminescent region of the luminescent layer placed above the pixel unit and that transmits light emitted from the luminescent layer. The height between a luminescent face of the luminescent region and an apex of the lens is uniform along the straight line in the long axis direction of the luminescent region. Furthermore, at both end parts of the lens, a cross-section of the light emitting side corresponding to the long axis direction of the luminescent region has a shape of an elliptic arc having a predetermined curvature. | 07-12-2012 |
| 20120181553 | LIGHT-EMITTING DEVICE - A light-emitting device includes a support substrate, a plurality of organic electroluminescence (EL) elements provided on the support substrate, and a partition wall separating the plurality of organic EL elements from each other. The partition wall has a peripheral portion arranged so as to surround a region in which the plurality of organic EL elements are provided, and a plurality of divider portions arranged in a striped pattern in a region surrounded by the peripheral portion and each having one end and the other end in a longitudinal direction coupled to the peripheral portion. The organic EL elements are arranged between the divider portions adjacent to each other. A depression extending toward the support substrate is provided in the peripheral portion on an extended line in the longitudinal direction of the divider portions. | 07-19-2012 |
| 20120181554 | MULTICOLORED MASK PROCESS FOR MAKING DISPLAY CIRCUITRY - A process for forming a pixel circuit is disclosed comprising: (a) providing a transparent support; (b) forming a multicolor mask having at least four different color patterns; (c) forming integrated electronic components of the pixel circuit having at least four layers of patterned functional material comprising a first conductor, a dielectric, a semiconductor, and a second conductor each layer of patterned functional material corresponding to the four different color patterns of the multicolor mask. The functional material is patterned using a photopattern corresponding to each color pattern. | 07-19-2012 |
| 20120187424 | LIGHT EMITTING DIODE - Exemplary embodiments of the present invention relate to light emitting diodes including a plurality of light emitting cells on a substrate to be suitable for AC driving. The light emitting diode includes a substrate and a plurality of light emitting cell formed on the substrate. Each light emitting cell includes a first region at a boundary of the light emitting cell and a second region opposite to the first region. A first electrode pad is formed in the first region of the light emitting cell. A second electrode pad having a linear shape is disposed to face the first electrode pad while regionally defining a peripheral region together with the boundary of the second region. A wire connects the first electrode pad to the second electrode pad between two adjacent light emitting cells. | 07-26-2012 |
| 20120187425 | ORGANIC EL DISPLAY AND ELECTRONIC APPARATUS - Disclosed herein is an organic EL display device in which pixels each including an organic EL element formed by interposing an organic layer between an anode electrode and a cathode electrode are arranged in a matrix, the organic EL display device including: a common layer configured to be included in the organic EL element and be formed in the organic layer in common to the pixels; and a metal interconnect configured to surround periphery of the anode electrode and be electrically connected to the organic layer, wherein potential of the metal interconnect is set to a potential lower than potential of the anode electrode in a non-light-emission state of the organic EL element. | 07-26-2012 |
| 20120187426 | LIGHT SOURCE UNIT AND DEVICE USING SAME - Provided is a light source unit in which locating components are mounted on a substrate together with LEDs forming a light emitting portion, and with this, the light source unit can be more easily replaced, and the number of components can be reduced. | 07-26-2012 |
| 20120187427 | LAMINATING ENCAPSULANT FILM CONTAINING PHOSPHOR OVER LEDS - A process is described for wavelength conversion of LED light using phosphors. LED dies are tested for correlated color temperature (CCT), and binned according to their color emission. The LEDs in each_bin are mounted on a single submount to form an array of LEDs. Various thin sheets of a flexible encapsulant (e.g., silicone) infused with one or more phosphors are preformed, where each sheet has different color conversion properties. An appropriate sheet is placed over an array of LED mounted on a submount, and the LEDs are energized. The resulting light is measured for CCT. If the CCT is acceptable, the phosphor sheet is permanently laminated onto the LEDs and submount. By selecting a different phosphor sheet for each bin of LEDs, the resulting CCT is very uniform across all bins. | 07-26-2012 |
| 20120187428 | METHOD FOR THE PRODUCTION OF WHITE LEDS AND WHITE LED LIGHT SOURCE - For the production of a white LED having a predetermined color temperature, a blue LED ( | 07-26-2012 |
| 20120187429 | LED LIGHT SOURCE AND METHOD OF MANUFACTURING THE SAME - After the LEDs | 07-26-2012 |
| 20120187430 | Packaging Photon Building Blocks Having Only Top Side Connections in a Molded Interconnect Structure - Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer. | 07-26-2012 |
| 20120193647 | SOLID STATE LIGHTING COMPONENT PACKAGE WITH REFLECTIVE LAYER - A solid state lighting package is provided. The package comprising at least one LED element positioned on a top surface of a substrate or a submount capable of absorbing light emitted by the at least one LED element; and a reflective layer, the reflective layer covering at least a portion of the top surface of the substrate or the submount, whereby at least of portion of the light emitted by the LED element is reflected by the reflective layer. A method of manufacturing a solid state lighting package comprising the reflective layer, and a method of increasing the luminous flux thereof, is also provided. | 08-02-2012 |
| 20120193648 | CONFORMALLY COATED LIGHT EMITTING DEVICES AND METHODS FOR PROVIDING THE SAME - Methods are disclosed including applying a conformal coating to multiple light emitters. The conformal coating forms in gap areas between adjacent ones of the light emitters. The plurality of light emitters are separated into individual light emitters. The individual light emitters include the conformal coating that extends to a space corresponding to respective gap areas. Light emitting structures are disclosed including a semiconductor light emitting diode (LED) having an active region and a conformal coating including a first portion and a second portion, the first portion corresponding to at least one surface of the LED and the second portion extending from the first portion. | 08-02-2012 |
| 20120193649 | LIGHT EMITTING DIODE (LED) ARRAYS INCLUDING DIRECT DIE ATTACH AND RELATED ASSEMBLIES - An electronic device may include a packaging substrate having a packaging substrate face with a plurality of electrically conductive pads on the packaging substrate face. A first light emitting diode die may bridge first and second ones of the electrically conductive pads. More particularly, the first light emitting diode die may include first anode and cathode contacts respectively coupled to the first and second electrically conductive pads using metallic bonds. Moreover, widths of the metallic bonds between the first anode contact and the first pad and between the first cathode contact and the second pad may be at least 60 percent of a width of the first light emitting diode die. A second light emitting diode die may bridge third and fourth ones of the electrically conductive pads. The second light emitting diode die may include second anode and cathode contacts respectively coupled to the third and fourth electrically conductive pads using metallic bonds. Widths of the metallic bonds between the second anode contact and the second pad and between the second cathode contact and the third pad may be at least 60 percent of a width of the first light emitting diode die. | 08-02-2012 |
| 20120193650 | Method for Packaging an LED Emitting Light Omnidirectionally and an LED Package - The present invention discloses a method for packaging an LED emitting light omnidirectionally and an LED package. The present invention utilizes a transparent glue to bond LED chips and electrodes onto one or more transparent glass or organic films, and vertically fixes the transparent bracket having the LED chips, electrodes and welding wires in a transparent vessel. When the diode power is on, the front face of the LED chips on the vertical transparent bracket can emit light properly, while the rear face of the LED chips can emit brighter light via the transparent glass or organic film. The present invention makes it possible to demonstrate the brightest face of an LED, and thus improves LED light extraction. | 08-02-2012 |
| 20120193651 | LIGHT EMITTING DEVICES, SYSTEMS, AND METHODS - Light emitting devices, systems, and methods are disclosed. In one embodiment a light emitting device can include an emission area having one or more light emitting diodes (LEDs) mounted over an irregularly shaped mounting area. The light emitting device can further include a retention material disposed about the emission area. The retention material can also be irregularly shaped, and can be dispensed. Light emitting device can include more than one emission area per device. | 08-02-2012 |
| 20120193652 | LED ARRAY FORMED BY INTERCONNECTED AND SURROUNDED LED CHIPS - A light emitting diode array includes a first light emitting diode having a first electrode and a second light emitting diode having a second electrode. The first and second light emitting diodes are separated. A first polymer layer is positioned between the light emitting diodes. An interconnect located at least partially on the first polymer layer connects the first electrode to the second electrode. A permanent substrate is coupled to the light emitting diodes. The permanent substrate is coupled to the side of the light emitting diodes with the interconnect. A second polymer layer at least partially encapsulates the side of the light emitting diodes opposite the permanent substrate (the side opposite the interconnect). | 08-02-2012 |
| 20120193653 | LED ARRAY FORMED BY INTERCONNECTED AND SURROUNDED LED CHIPS - A light emitting diode array includes a first light emitting diode having a first electrode and a second light emitting diode having a second electrode. The first and second light emitting diodes are separated. A first polymer layer is positioned between the light emitting diodes. An interconnect located at least partially on the first polymer layer connects the first electrode to the second electrode. A permanent substrate is coupled to the light emitting diodes. The permanent substrate is coupled to the side of the light emitting diodes opposite the interconnect. A second polymer layer at least partially encapsulates the side of the light emitting diodes with the interconnect. | 08-02-2012 |
| 20120193654 | LIGHT EMITTING DEVICE - A light emitting device is disclosed. The light emitting device includes a support member, a light emitting structure disposed over the support member and includes first and second light emitting structures, the first and second light emitting structures including a first semiconductor layer, a second semiconductor layer, and an active layer, a passivation layer disposed on one side surface of the first light emitting structure, a first electrode disposed between the support member and the first semiconductor layer in the first light emitting structure, a second electrode disposed on a side surface of the passivation layer and on the second semiconductor layer in the first light emitting structure, a third electrode disposed between the support member and the first semiconductor layer in the second light emitting structure, an insulation layer disposed with a through hole, and a fourth electrode disposed in the through hole. | 08-02-2012 |
| 20120193655 | ALIGNMENT TOLERANT PATTERNING ON FLEXIBLE SUBSTRATES - A method is provided for fabricating a multilayer electronic device on a flexible substrate including at least a first and a second patterned layer, wherein the first patterned layer is defined with a linewidth that is smaller than the linewidth of the second patterned layer, and the second patterned layer is defined by a patterning technique which is capable of correcting for local distortions of the pattern of said first layer on top of the flexible substrate and wherein the first patterned layer is laid-out in such a way that the geometric overlap between a portion of the second layer and a portion of the first layer is insensitive against small variations of the position of the second patterned layer. | 08-02-2012 |
| 20120193656 | DISPLAY DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF - A display device structure includes an active device, a passivation layer, a pixel electrode and a first conductive material. The passivation layer covers the active device and has a first through hole exposing a portion of the active device. The pixel electrode is disposed on the passivation layer, and the pixel electrode is a non-thin-film electrode consituted by a plurality of micro-conductive structures or includes an organic conductive polymer material. The first conductive material is disposed around the first through hole and electrically connected to the exposed active device. The pixel electrode is electrically connected to the first conductive material. | 08-02-2012 |
| 20120199852 | LIGHT-EMITTING DIODE COMPONENT - An LED component includes, according to a first embodiment, a monolithic substrate, an array of LED chips disposed on a surface of the substrate, and an optical lens overlying the LED chips and having a lens base attached to the substrate, where the LED chips are positioned to provide a peak emission shifted from a perpendicular centerline of the lens base. The LED component includes, according to a second embodiment, a monolithic substrate, an array of LED chips disposed on a surface of the substrate, and an array of optical lenses, each optical lens overlying at least one of the LED chips and having a lens base attached to the substrate, where at least one of the LED chips is positioned to provide a peak emission shifted from a perpendicular centerline of the respective lens base. | 08-09-2012 |
| 20120199853 | Self-Light-Emitting Device and Method of Manufacturing the Same - Failure light emission of an EL element due to failure film formation of an organic EL material in an electrode hole | 08-09-2012 |
| 20120199854 | ACTIVE MATRIX SUBSTRATE AND ORGANIC EL DISPLAY DEVICE - The present invention provides an active matrix substrate driven by an analog gray scale method, and an organic EL display device, in which decrease in response speed of a current emissive element is suppressed. The active matrix substrate of the present invention is driven by an analog gray scale method and is provided with a pixel that has a current emissive element and a transistor that supplies current to the current emissive element. The pixel further has a compensation circuit for compensating variability of threshold voltage in the transistor; the current emissive element has a pixel electrode electrically connected to the transistor; a gate electrode of a transistor that makes up the compensation circuit forms a region covered with the pixel electrode; and a part or the entirety of the gate electrode that is positioned within the region is provided in a wiring layer that is lower than a wiring layer directly below the pixel electrode. | 08-09-2012 |
| 20120199855 | LIGHT EMITTING ELEMENT AND IMAGE DISPLAY APPARATUS USING THE LIGHT EMITTING ELEMENT - The present invention is intended to realize a light emitting element which is easy to fabricate, is efficient, and is able to emit light in a uniform polarization state enabling the achievement of high luminance. A light emitting element of the present invention is a light emitting element including an active layer for generating light, the light emitting element including: a first reflection layer that allows the light generated at the active layer to reflect at a reflection section in which reflection members are periodically provided, and to exit from an exiting section between the reflection members; a polarization beam splitter layer that transmits a polarized light oriented in a first direction and diffracts a polarized light oriented in a second direction orthogonal to the first direction among the light exited from the exiting section; a wave plate layer that allows the light transmitted through the polarization beam splitter layer and the light diffracted at the polarization beam splitter layer to enter, and to exit as a light of a same polarization state; and a second reflection layer that reflects the light reflected at the first reflection light. | 08-09-2012 |
| 20120205673 | Organic Light-Emitting Display Device - An organic light-emitting display device. The organic light-emitting display device includes a substrate, a semiconductor layer arranged on the substrate, an insulating film arranged on the semiconductor layer and a conductive layer arranged on the insulating film, wherein the semiconductor layer comprises a plurality of protrusion lines extending in a first direction, the protrusion lines being parallel to a peripheral edge of the conductive layer. | 08-16-2012 |
| 20120205674 | LIGHT EMITTING DEVICE HAVING SURFACE-MODIFIED SILICATE LUMINOPHORES - Exemplary embodiments of the present invention relate to a light emitting device including a light emitting diode and a surface-modified luminophore. The surface-modified luminophore includes a silicate luminophore and a fluorinated coating arranged on the silicate luminophore. | 08-16-2012 |
| 20120205675 | LIGHT-EMITTING DEVICE AND LIGHTING DEVICE - To provide a light-emitting device including the plurality of light-emitting elements having a structure in which a light-emitting area is large and defects in patterning of light-emitting elements are suppressed. To provide a lighting device including the light-emitting device. The light-emitting device includes a first wiring provided over a substrate having an insulating surface, an insulating film provided over the first wiring, a second wiring provided over the insulating film, and a light-emitting element unit including a plurality of light-emitting elements provided over the first wiring with the insulating film provided therebetween. The plurality of light-emitting elements each include a first electrode layer having a light-blocking property, a layer containing an organic compound in contact with the first electrode layer, and a second electrode layer having a light-transmitting property in contact with the layer containing an organic compound. The layers containing an organic compound are separated by a separation layer. | 08-16-2012 |
| 20120205676 | Light-Emitting Device and Display Device - A technique of manufacturing a display device with high productivity is provided. In addition, a high-definition display device with high color purity is provided. By adjusting the optical path length between an electrode having a reflective property and a light-emitting layer by the central wavelength of a wavelength range of light passing through a color filter layer, the high-definition display device with high color purity is provided without performing selective deposition of light-emitting layers. In a light-emitting element, a plurality of light-emitting layers emitting light of different colors are stacked. The closer the light-emitting layer is to the electrode having a reflective property, the longer the wavelength of light emitted from the light-emitting layer is. | 08-16-2012 |
| 20120205677 | LED MODULE - An LED module includes a substrate, one or more LED chips supported by a main surface of the substrate, and wirings. The substrate has one or more through holes penetrating from the main surface to a rear surface. The wirings are formed on the substrate and make electrical conduction with the LED chips. The wirings include pads which are formed on the main surface and make electrical conduction with the LED chips, rear surface electrodes which are formed on the rear surface, and through wirings which make electrical conduction between the pads and the rear surface electrodes and are formed on the inner sides of the through holes. | 08-16-2012 |
| 20120205678 | Light-Emitting Device and Manufacturing Method Thereof, Lighting Device, and Display Device - In a light-emitting device, an insulating separation layer whose upper portion protrudes more than a bottom portion in a direction parallel to a substrate is provided on and in contact with a common wiring provided over the substrate. An EL layer provided over the separation layer on the common wiring is physically divided by the separation layer. An upper electrode layer formed in the same position is also physically divided by the separation layer and is in contact with the common wiring in a region overlapped with the most protruding portion of the separation layer. Such a common wiring may be used as an auxiliary wiring. Further, such a light-emitting device may be applied to a lighting device and a display device. | 08-16-2012 |
| 20120205679 | Light-Emitting Module, Light-Emitting Panel, and Lighting Device - An object is to provide a light-emitting module in which a light-emitting element suffering a short-circuit failure does not cause wasteful electric power consumption. Another object is to provide a light-emitting panel in which a light-emitting element suffering a short-circuit failure does not allow the reliability of an adjacent light-emitting element to lower. Focusing on heat generated by a light-emitting element suffering a short-circuit failure, provided is a structure in which electric power is supplied to a light-emitting element through a positive temperature coefficient thermistor (PTC thermistor) thermally coupled with the light-emitting element. | 08-16-2012 |
| 20120205680 | SEMICONDUCTOR LIGHT EMITTING DEVICE, OPTICAL PICKUP UNIT AND INFORMATION RECORDING/REPRODUCTION APPARATUS - A semiconductor light emitting device downsized by devising arrangement of connection pads is provided. A second light emitting device is layered on a first light emitting device. The second light emitting device has a stripe-shaped semiconductor layer formed on a second substrate on the side facing to a first substrate, a stripe-shaped p-side electrode supplying a current to the semiconductor layer, stripe-shaped opposed electrodes that are respectively arranged oppositely to respective p-side electrodes of the first light emitting device and electrically connected to the p-side electrodes of the first light emitting device, connection pads respectively and electrically connected to the respective opposed electrodes, and a connection pad electrically connected to the p-side electrode. The connection pads are arranged in parallel with the opposed electrodes. | 08-16-2012 |
| 20120205681 | DISPLAY APPARATUS - Provided is a display apparatus and a method of manufacture. The display apparatus includes a first substrate with a plurality of organic electroluminescence devices, a second substrate with a color filter, the second substrate facing the first substrate, and an adhesive layer disposed between the first substrate and the second substrate so as to cover the plurality of organic electroluminescence devices, the adhesive layer being made of a material selected from the group consisting of a phenol resin, a melanin resin, an unsaturated polyester resin, an epoxy resin, a silicon resin and a polyurethane resin. | 08-16-2012 |
| 20120205682 | Semiconducting sheet - A substrate-free semiconducting sheet has an array of semiconducting elements dispersed in a matrix material. The matrix material is bonded to the edge surfaces of the semiconducting elements and the substrate-free semiconducting sheet is substantially the same thickness as the semiconducting elements. | 08-16-2012 |
| 20120205683 | Semiconducting sheet - A substrate-free semiconducting sheet has an array of semiconducting elements dispersed in a matrix material. The matrix material is bonded to the edge surfaces of the semiconducting elements and the substrate-free semiconducting sheet is substantially the same thickness as the semiconducting elements. | 08-16-2012 |
| 20120211772 | ARRAY SUBSTRATE, DISPLAY APPARATUS HAVING THE SAME AND METHOD OF MANUFACTURING THE SAME - An array substrate includes a substrate, a dummy pad and a driving signal output line. The substrate includes a display area displaying an image, and a peripheral area surrounding the display area. The dummy pad extends along a first direction in the peripheral area of the substrate, and includes a first protrusion portion protruding from an end portion of the dummy pad along the first direction. The driving signal output line extends along a second direction crossing with the first direction, is disposed adjacent to the dummy pad, and provides an external signal. Accordingly static electricity provided to the driving signal output line flows into the dummy pad having the first protrusion portion, so that static electricity may be prevented from flowing into the display area. | 08-23-2012 |
| 20120211773 | LIGHT-EMITTING DEVICES COMPRISING NON-LINEAR ELECTRICALLY PROTECTIVE MATERIAL - A circuit comprising an array of light emitting diodes (LEDs), and a layer of VSD material positioned to contact an input and an output of each LED in the array of LEDs, so as to protect each LED from both a forward surge and a reverse surge of voltage on the array of LEDs. The layer of VSD material is able to switch into a carrying current state in response to either of the forward or reverse surge exceeding a characteristic voltage level (V | 08-23-2012 |
| 20120211774 | SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD - A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located over at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The light-emitting device can include a base board, a frame located on the base board, the chip mounted on the base board, the wavelength converting layer located between an optical plate and the chip so as to extend from the optical plate toward the chip, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the optical plate. | 08-23-2012 |
| 20120211775 | Lighting Device - A lighting device having a novel structure for integration of a plurality of light-emitting elements, and a manufacturing method thereof are provided. In the lighting device, a plurality of light-emitting elements is electrically connected to each other through plugs (connecting members) and a connection wiring for integration. The connection wiring is provided on a counter substrate and the plugs are provided over an element substrate or for the counter substrate. Such a connection structure enables an appropriate electrical connection between the plurality of light-emitting elements in the lighting device. | 08-23-2012 |
| 20120211776 | ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE - An organic electroluminescence display device is provided. The organic electroluminescence display device includes plural organic electroluminescence elements. Each organic electroluminescence element includes: a lower electrode; an insulating layer having an opening, in which a lower electrode is exposed at the bottom of the opening; an auxiliary wiring; a stacked structure provided from a portion over the lower electrode exposed at the bottom of the opening to a portion of the insulating layer surrounding the opening, including a light emitting layer made of an organic light-emitting material; and an upper electrode. At least one layer of the stacked structure partially contacts the auxiliary wiring. The insulating layer and the auxiliary wiring are provided in common to the plurality of organic EL elements. The upper electrode covers the whole surface of the stacked structures and the auxiliary wiring. | 08-23-2012 |
| 20120211777 | FLAT PANEL DISPLAY AND METHOD OF FABRICATING THE SAME - A flat panel display and a method of fabricating the same are provided. The flat panel display includes a conductor, and a passivation layer pattern disposed on a side end of the conductor. As such, the passivation layer pattern can prevent or reduce corrosion and damage of the conductor. In one embodiment, the conductor includes a conductive layer formed of a material selected from the group consisting of aluminum and an aluminum alloy. The passivation layer pattern may be formed of an organic material or an inorganic material. | 08-23-2012 |
| 20120217514 | ARRAY SUBSTRATE, A DISPLAY PANEL HAVING THE ARRAY SUBSTRATE AND A METHOD OF MANUFACTURING THE ARRAY SUBSTRATE - A substrate includes a storage line, first and second gate lines and first and second pixel electrodes. The storage line extends along a first direction on the substrate. The first and second gate lines are substantially parallel with the storage line. The first pixel electrode is formed between the first gate line and the storage line. The second pixel electrode is formed between the second gate line and the storage line. | 08-30-2012 |
| 20120217515 | DISPLAY DEVICE - A display device includes a pixel area including pixels arranged in a matrix and having a horizontal resolution of 350 ppi or more and a color filter layer overlapping with the pixel area. The pixels each include a first transistor whose gate is electrically connected to a scan line and whose one of a source and a drain is electrically connected to a signal line; a second transistor whose gate is electrically connected to the other of the source and the drain of the first transistor and whose one of a source and a drain is electrically connected to a current-supplying line; and a light-emitting element electrically connected to the other of the source and the drain of the second transistor. The first and second transistors each have a channel formation region including a single crystal semiconductor. | 08-30-2012 |
| 20120217516 | Light-Emitting Device and Electronic Device Using Light-Emitting Device - Provided is a highly reliable light-emitting device in which a light-emitting element is prevented from being damaged when external physical force is applied. The light-emitting device includes a light-emitting element formed over a first substrate, including a first electrode layer, a light-emitting layer, and a second electrode layer; a structure body formed over the first substrate; a second substrate provided to face the first substrate; and a bonding layer provided between the first substrate and the second substrate. The light-emitting layer is separated by the structure body. By strengthening adhesion between the structure body and the bonding layer, or between the structure body and the second electrode, the highly reliable light-emitting device in which damage of the light-emitting element is prevented can be provided. | 08-30-2012 |
| 20120217517 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME - An organic light emitting device according to one or more embodiments includes a gate line, a data line intersecting the gate line, a switching thin film transistor connected to the gate line and the data line, a driving thin film transistor connected to the switching thin film transistor, and a light emitting diode (LED) connected to the driving thin film transistor. The switching thin film transistor includes a control electrode connected to the gate line, a crystalline semiconductor overlapping the control electrode, and an input electrode and an output electrode are spaced apart from each other on the crystalline semiconductor, wherein the control electrode and the gate line are respectively disposed under and on the crystalline semiconductor and include different materials. | 08-30-2012 |
| 20120217518 | ORGANIC LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD OF THE SAME, ORGANIC DISPLAY PANEL, AND ORGANIC DISPLAY DEVICE - The upper surface portion of a planarization layer is planarized. In an anode formed on the planarization layer, upper surface portions at edge regions by a bank are located above an upper surface portion at a central region. A hole injection transporting layer is layered along the upper surface portions of the anode, and in the hole injection transporting layer, upper surface portions at the edge regions near the bank are located above an upper surface portion at the central region. In an organic light-emitting layer, upper surface portions at the edge regions (regions D | 08-30-2012 |
| 20120217519 | METHOD AND STRUCTURE FOR ENCAPSULATING SOLID-STATE LIGHT EMITTING CHIP AND LIGHT SOURCES USING THE ENCAPSULATION STRUCTURE - A structure and a method for encapsulating a solid-state lighting chip ( | 08-30-2012 |
| 20120217520 | LED MOUNT BAR CAPABLE OF FREELY FORMING CURVED SURFACES THEREON - The present invention relates to a bar on which a plurality of LEDs are mounted. The bar has a first side surface having a plurality of grooves and a second side surface having a plurality of grooves, wherein the plurality of first grooves formed at the first side surface and the plurality of second grooves formed at the second side surface intersect each other such that the bar can be easily bent in a widthwise direction. | 08-30-2012 |
| 20120223342 | Light-Emitting Device and Lighting Device - A highly reliable light-emitting device or lighting device is provided. Further, a light-emitting device or lighting device with a high manufacturing yield is provided. Provided is a light-emitting device having a contact structure which includes a separation layer having a shape typified by a reverse tapered shape in which an outline of the bottom portion is inside an outline of an upper portion and which utilizes the difference between an amount of a light-emitting layer extending inside the outline and that of an upper electrode extending inside the outline. Further, when the outline of the separation layer which forms the contact portion has a depression and a projection, the length of the contact portion can be increased, and thus, contact resistance can be reduced. | 09-06-2012 |
| 20120223343 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode package includes a first lead frame comprising a first hole cup, a second lead frame comprising a second hole cup and disposed to face the first lead frame with a gap disposed between the first lead frame and the second lead frame, a first light emitting diode chip disposed on the first hole cup, and a second light emitting diode chip disposed on the second hole cup, the first lead frame comprising a first enlarged region formed between the gap and the first hole cup, and the second lead frame comprising a second enlarged region formed between the gap and the second hole cup. | 09-06-2012 |
| 20120223344 | ARRAY OF SCALABLE CERAMIC DIODE CARRIERS HAVING LEDS - Ceramic diode carriers ( | 09-06-2012 |
| 20120228645 | LED LAMP STRIP AND MANUFACTURING PROCESS THEREOF - A process of manufacturing an LED lamp strip includes the steps of forming a plurality of through holes on an adhesive tape, mounting the adhesive tape to a top side of a scrollable lead frame, bonding a plurality of LED chips to the top side of the scrollable lead frame according to the positions of the through holes, packaging the LED chips respectively, and finally cutting the scrollable lead frame. In light of this, the LED lamp strip can be produced under the circumstances of low production cost and less production time. | 09-13-2012 |
| 20120228646 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MAKING THE SAME - An LED package includes a substrate; a plurality of LED units formed on the substrate; and a phosphor tape arranged on the LED units. Light from the LED units travels to an external environment through the phosphor tape. The phosphor tape has phosphor particles evenly distributed therein. A method for forming the LED package is also provided. | 09-13-2012 |
| 20120228647 | ORGANIC ELECTROLUMINESCENT ELEMENT - The present invention provides an organic EL element configured to stably emit light while suppressing total reflection that occurs at an electrode. This organic EL element includes a pair of electrodes and one or more organic layers provided between the electrodes, and includes a light-emitting layer as the one or more organic layers. Surfaces of the pair of electrodes facing each other are flat. At least one organic layer of the one or more organic layers has a periodic structure that makes the traveling direction of light, traveling in the direction generally perpendicular to the thickness direction of the light-emitting layer, inclined to the thickness direction. The periodic structure has a periodic configuration that is arranged with a two-dimensional period in a plane that is perpendicular to the thickness direction of the light-emitting layer. | 09-13-2012 |
| 20120228648 | LIGHT-EMITTING DEVICE, LIGHT-EMITTING APPARATUS, DISPLAY DEVICE AND ELECTRONIC APPARATUS - A light-emitting device includes an anode, a cathode, a first phosphorescent layer and a fluorescent layer that are provided between the anode and the cathode and emit phosphorescent light and fluorescent light, respectively, upon energization of the anode and the cathode, and an intermediate layer provided between the first phosphorescent layer and the fluorescent layer, the intermediate layer including a hole transport layer and an electron transport layer that are in contact with each other, the electron transport layer being located on the anode side, the hole transport layer being located on the cathode side. | 09-13-2012 |
| 20120228649 | LED MODULE, METHOD FOR MANUFACTURING THE SAME, AND LED CHANNEL LETTER INCLUDING THE SAME - Disclosed herein is a method for manufacturing a light emitting diode (LED) module, the method including: disposing a circuit board at a molding space formed by an upper mold and a lower mold; adding a filling material to the molding space; hardening the filling material to form a molding cover covering at least a portion of an upper surface, a lower surface, and a side surface of the circuit board, the molding cover having an opening exposing the lower surface of the circuit board; removing the upper mold and the lower mold from the circuit board; and disposing an LED on the upper surface of the circuit board. | 09-13-2012 |
| 20120228650 | Light Emitting Diode Emitter Substrate with Highly Reflective Metal Bonding - The present disclosure provides one embodiment of a method for fabricating a light emitting diode (LED) package. The method includes forming a plurality of through silicon vias (TSVs) on a silicon substrate; depositing a dielectric layer over a first side and a second side of the silicon substrate and over sidewall surfaces of the TSVs; forming a metal layer patterned over the dielectric layer on the first side and the second side of the silicon substrate and further filling the TSVs; and forming a plurality of highly reflective bonding pads over the metal layer on the second side of the silicon substrate for LED bonding and wire bonding. | 09-13-2012 |
| 20120235167 | SOLID STATE OPTOELECTRONIC DEVICE WITH PREFORMED METAL SUPPORT SUBSTRATE - A wafer-level process for manufacturing solid state lighting (“SSL”) devices using large-diameter preformed metal substrates is disclosed. A light emitting structure is formed on a growth substrate, and a preformed metal substrate is bonded to the light emitting structure opposite the growth substrate. The preformed metal substrate can be bonded to the light emitting structure via a metal-metal bond, such as a copper-copper bond, or with an inter-metallic compound bond. | 09-20-2012 |
| 20120235168 | SEMICONDUCTOR LIGHT EMITTING DEVICE - According to one embodiment, a semiconductor light emitting device includes a stacked structure body, first and second electrodes. The stacked structure body includes first and second semiconductor layers and a light emitting layer provided between the second and first semiconductor layers, and has first and second major surfaces. The first electrode has a first contact part coming into contact with the first semiconductor layer. The second electrode has a part coming into contact with the second semiconductor layer. A surface of the first semiconductor layer on a side of the first major surface has a first part having a part overlapping a contact surface with the first semiconductor layer and a second part having a part overlapping the second semiconductor layer. The second part has irregularity. A pitch of the irregularity is longer than a peak wavelength of emission light. The first part has smaller irregularity than the second part. | 09-20-2012 |
| 20120235169 | SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD - A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer encapsulating at least one semiconductor light-emitting chip to emit various colored lights including white light. The semiconductor light-emitting device can include a base board with the chip mounted thereon, a frame located on the base board, a transparent plate located on the wavelength converting layer, a reflective material layer disposed between the frame and both side surfaces of the wavelength converting layer and the transparent plate, and a light-absorbing layer located on the reflective material layer. The semiconductor light-emitting device can be configured to improve light-emitting efficiency and a contrast between a light-emitting and non-light-emitting surfaces by using the transparent material and light-absorbing layer. A wavelength-converted light that is emitted can have a high light-emitting efficiency and a high contrast between a light-emitting and non-light-emitting surface from a small light-emitting surface. | 09-20-2012 |
| 20120235170 | Display Apparatus and Method of Fabricating the Same - A display apparatus comprises a first substrate, a second substrate separated from the first substrate and facing the first substrate, and a first sealing portion interposed between the first substrate and the second substrate, wherein the first substrate comprises a first region overlapped by the second substrate and a second region not overlapped by the second substrate, and the first sealing portion is situated on a boundary between the first region and the second region and comprises one or more injection holes. | 09-20-2012 |
| 20120235171 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display includes a substrate having a plurality of organic light emitting elements thereon and a thin film encapsulation layer on the substrate. The thin film encapsulation layer covers the organic light emitting elements, and the thin film encapsulation layer includes a first porous inorganic layer and a second inorganic layer on the first porous inorganic layer. | 09-20-2012 |
| 20120235172 | THREE DIMENSIONAL LIGHT EMITTING DIODE SYSTEMS, AND COMPOSITIONS AND METHODS RELATING THERETO - A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs. | 09-20-2012 |
| 20120235173 | THREE DIMENSIONAL LIGHT EMITTING DIODE SYSTEMS, AND COMPOSITIONS AND METHODS RELATING THERETO - A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs. | 09-20-2012 |
| 20120235174 | LIQUID CRYSTAL PANEL AND PIXEL STRUCTURE THEREOF - There is provided a pixel structure of a liquid crystal panel including a transparent substrate, and a gate line, a data line, a switching transistor, a first electrode, a second electrode and a shield layer formed on the transparent substrate. The gate line is substantially perpendicular to the data line. The switching transistor is located adjacent to a crossing point of the gate line and the data line, and is configured to input a display voltage of the data line to the second electrode according to the control of the gate line. The first electrode and the second electrode are arranged in such a way that the display voltage forms a transverse electric field between the first electrode and the second electrode. The shield layer overlaps at least a part of the gate and is electrically isolated from the first electrode and the second electrode. | 09-20-2012 |
| 20120235175 | ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display apparatus that improves image quality characteristics, the organic light-emitting display apparatus including: a substrate; a first electrode formed on the substrate; a pixel-defining layer (PDL) formed on the first electrode to expose a set or predetermined region of the first electrode; an intermediate layer formed in the exposed predetermined region of the first electrode and including an organic emission layer; and a second electrode having a light-scattering face facing the substrate or facing oppositely away from the substrate, the second electrode being disposed on the intermediate layer. | 09-20-2012 |
| 20120235176 | Optoelectronic Module Comprising at Least One First Semiconductor Body Having a Radiation Outlet Side and an Insulation Layer and Method for the Production Thereof - An optoelectronic module is provided which comprises a first semiconductor body ( | 09-20-2012 |
| 20120235177 | SEMICONDUCTOR LIGHT EMITTING DEVICE WAFER AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE - According to one embodiment, a semiconductor light emitting device wafer includes a plurality of semiconductor light emitting devices, the plurality of semiconductor light emitting devices being collectively formed, and includes a light emitting unit and a wavelength conversion unit. The light emitting unit has a first major surface and a second major surface on a side opposite to the first major surface. The wavelength conversion unit is provided on the first major surface side. The wavelength conversion unit contains a fluorescer. A thickness of the wavelength conversion unit changes based on a distribution in a surface of the wafer of at least one selected from a wavelength and an intensity of light emitted from the light emitting unit of the plurality of semiconductor light emitting devices. | 09-20-2012 |
| 20120235178 | DISPLAY DEVICE AND ELECTRONIC APPARATUS - Disclosed herein is a display device including a plurality of pixels configured to have a first electrode, a light emitting layer, and a second electrode in that order over a substrate, wherein: the plurality of pixels include a first pixel having a first light emitting layer common to the pixels and a second pixel having the first light emitting layer and a second light emitting layer provided on each second pixel basis; and a surface of the first electrode in the first pixel is closer to the substrate than a surface of the first electrode in the second pixel. | 09-20-2012 |
| 20120235179 | Measuring Method, Inspection Method, Inspection Device, Semiconductor Device, Method of Manufacturing a Semiconductor Device, and Method of Manufacturing an Element Substrate - An inspection method which simplifies an inspection step by eliminating the need to set probes on wiring or probe terminals, and an inspection device for performing the inspection step. A voltage is applied to each of inspected circuits or circuit elements to operate the same. Signal processing is performed on an output from each inspected circuit or circuit element during operation to form a signal (operation information signal) including information on the operating condition of the circuit or the circuit element. The operation information signal is amplified and the amplitude of an alternating current voltage separately input is modulated with the amplified operation information signal. The voltage of the modulated alternating current is read in a non-contact manner to determine whether the corresponding circuit or circuit element is non-defective or defective. | 09-20-2012 |
| 20120235180 | Packaged Semiconductor Light Emitting Devices Having Multiple Optical Elements and Methods of Forming the Same - Methods of packaging a semiconductor light emitting device include providing a substrate having the semiconductor light emitting device on a front face thereof. A first optical element is formed from a first material on the front face proximate the semiconductor light emitting device but not covering the semiconductor light emitting device and a second optical element is formed from a second material, different from the first material, over the semiconductor light emitting device and the first optical element. Packaged semiconductor light emitting devices are also provided. | 09-20-2012 |
| 20120235181 | LIGHT-EMITTING DEVICE AND LAMP - A light-emitting device including: a base which is translucent; a semiconductor light-emitting element provided on the base; a sealing member for sealing the semiconductor light-emitting element and including a first wavelength conversion material for converting a wavelength of light emitted by the semiconductor light-emitting element to a predetermined wavelength; and a groove provided on a side of the semiconductor light-emitting element, recessed from a top surface of the base on which the semiconductor light-emitting element is provided or a back surface of the base which is a surface opposite to the top surface, and for holding a second wavelength conversion material for converting the wavelength of the light emitted by the semiconductor light-emitting element to the predetermined wavelength. | 09-20-2012 |
| 20120235182 | Light-Emitting Diode Module and Corresponding Manufacturing Method - A new manufacturing method is described by the present invention for a new LED module | 09-20-2012 |
| 20120241771 | ORGANIC ELECTROLUMINESCENT DEVICE, DISPLAY DEVICE, AND ILLUMINATION DEVICE - According to one embodiment, an organic electroluminescent device comprises a translucent substrate, a light extraction layer including a convex structure disposed in a net form on one surface of the substrate and having a tilted surface forming an acute angle relative to the substrate, and a planarizing layer disposed on the convex structure, a first electrode disposed on the light extraction layer, a luminescent layer disposed on the first electrode and containing a host material and a luminescent dopant, and a second electrode disposed on the luminescent layer. A refractive index of the planarizing layer is approximately equal to a refractive index of the first electrode or is larger than the refractive index of the first electrode, and a refractive index of the convex structure is smaller than a refractive index of the planarizing layer. | 09-27-2012 |
| 20120241772 | ORGANIC LIGHT-EMITTING DISPLAY APPARATUS - An organic light-emitting display apparatus including: a first substrate; a second substrate disposed to face the first substrate; a first electrode disposed between the first substrate and the second substrate and a second electrode disposed to face the first electrode; and an organic light-emitting layer disposed between the first electrode and the second electrode, wherein at least one of the first electrode and the second electrode is a reflective electrode, and an optical property modification layer having at least one optical property modified from that of the reflective electrode is formed on a surface of the reflective layer. | 09-27-2012 |
| 20120241773 | LED BAR MODULE WITH GOOD HEAT DISSIPATION EFFICIENCY - An LED bar module includes a lengthwise base and a number of LED chips. The lengthwise base includes a metal layer, a metal circuit layer, and an insulated layer between the metal layer and the metal circuit layer. The insulated layer has a groove in a central thereof to expose a part of the metal layer. The LED chips are placed in the groove and directly contact the exposed part of the metal layer. The metal circuit layer has two connecting portions electrically connecting with the LED chips. The LED chips are arranged in a line which is located between and juxtaposed with the two connecting portions of the metal circuit layer. | 09-27-2012 |
| 20120241774 | DISPLAY MODULE AND MANUFACTURING METHOD THEREOF - A display module and a manufacturing method thereof are provided. The display module comprises a casing, an optical element and a display panel. The casing has an upper portion. The optical element is disposed in the casing. The display panel comprises a color filter substrate and a thin film transistor substrate. The color filter substrate is located within and toward the casing. The thin film transistor substrate is connected to the color filter substrate and connected to the upper portion of the casing. | 09-27-2012 |
| 20120241775 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE - An organic light-emitting display device includes a first substrate and a second substrate that face each other; an organic light-emitting device that is disposed between the first and second substrates and includes a pixel electrode separately formed in each pixel, a common electrode facing the pixel electrode, and an organic light-emitting layer disposed between the pixel electrode and the common electrode; and an electrode unit and at least one wiring unit that are disposed between the first substrate and the second substrate, the electrode unit including at least one thin-film transistor for transmitting a light-emitting signal to the pixel electrode and at least one capacitor, wherein an optical property modification layer obtained by modifying an optical property of at least one of the electrode unit and the wiring unit is formed on a surface of the at least one of the electrode unit and the wiring unit. | 09-27-2012 |
| 20120241776 | TFT-LCD ARRAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An embodiment of the invention provides a thin film transistor liquid crystal display (TFT-LCD) array substrate comprising: a gate line and a data line that intersect with each other to define a pixel region; and a pixel electrode and a thin film transistor formed in the pixel region. The thin film transistor comprises: a gate electrode connected with the gate line; a semiconductor island positioned above the gate electrode; and a source electrode and a drain electrode that are formed on the semiconductor island. A surface of the semiconductor island contacting with the source electrode and the drain electrode comprises ohmic contact regions subject to a surface treatment and a region of the semiconductor layer between the source electrode and the drain electrode is covered with a barrier layer. Another embodiment of the invention provides a method of manufacturing a thin film transistor liquid crystal display (TFT-LCD) array substrate. | 09-27-2012 |
| 20120241777 | OPTICAL ILLUMINATION DEVICE - The present invention relates to an optical lighting device comprising at least one light emitting diode configured for emitting said light with a trajectory, the device being capable of modifying said trajectory since it comprises an optical element comprising two faces each having a plurality of preferably rectangular lenses, each lens of one face being aligned with a lens of the other face. | 09-27-2012 |
| 20120241778 | LIGHT-EMITTING DEVICE AND METHOD FOR ASSEMBLING A LIGHT-EMITTING DEVICE - A light-emitting device, including a heatsink arranged at a tip of the light-emitting device, at least one light source, in particular a light-emitting diode, arranged on an underside of the heatsink, and a reflector arranged below the heatsink for reflecting at least some of the light emitted by the at least one light source. | 09-27-2012 |
| 20120248465 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - An organic light emitting diode display capable of reducing the shortening of image stacking lifetime caused by the residue of the barrier ribs produced during the forming of the barrier ribs is provided. The display includes: a substrate; a first pixel electrode formed on the substrate; barrier ribs formed on the substrate, and having an opening exposing the first pixel electrode; a second pixel electrode formed on the first pixel electrode; an organic light emitting member formed on the second pixel electrode; an organic light emitting member formed on the second pixel electrode; a common electrode formed on the organic light emitting member; and a thin film encapsulation member covering the common electrode. The width of the second pixel electrode is greater than the exposure width of the first pixel electrode exposed through the opening of the barrier ribs. | 10-04-2012 |
| 20120248466 | METAL ENCAPSULATING SHEET AND ORGANIC LIGHT-EMITTING DISPLAY APPARATUS INCLUDING THE SAME - A metal encapsulating sheet is configured to cover a display unit on a substrate and includes an insulating base film, and metal wirings on the base film for forming a current path between the display unit and a power supply, wherein connecting units of the metal wirings coupled to the power supply are outside a light-emitting region corresponding to the display unit. | 10-04-2012 |
| 20120248467 | ORGANIC LIGHT EMITTING DEVICE AND DISPLAY UNIT INCLUDING THE SAME - An organic light emitting device includes a first electrode and a second electrode, an organic layer including a light emitting layer between the first electrode and the second electrode, and an insulating film covering a rim of the first electrode from a surface thereof to a side surface thereof, and having an internal wall surface being in contact with the organic layer, and one or more corner sections in the internal wall surface with a ridge line thereof in parallel with the surface of the first electrode. | 10-04-2012 |
| 20120248468 | Metal Wiring Structure, Organic Light-Emitting Display Device Using the Same, and Method of Manufacturing the Organic Light-Emitting Display Device - An organic light-emitting display device comprises a substrate, an anode electrode formed on the substrate, an organic layer formed on the anode electrode, a cathode electrode formed on the organic layer, and an organic capping layer formed on the cathode electrode and containing a capping organic material and a rare-earth material which has higher oxidizing power than the material which forms the cathode electrode. | 10-04-2012 |
| 20120248469 | LIGHT EMITTING APPARATUS - A light emitting apparatus is disclosed. The light emitting apparatus includes a light-transmissive substrate having a top surface and a bottom surface, at least one semiconductor light emitting device disposed on the top surface of the light-transmissive substrate, a reflective part disposed over the semiconductor light emitting device to reflect light from the semiconductor light emitting device toward the light-transmissive substrate, and a first wavelength converter disposed between the light-transmissive substrate and the reflective part. | 10-04-2012 |
| 20120248470 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a method for manufacturing a highly reliable display device at a low cost with high yield. According to the present invention, a step due to an opening in a contact is covered with an insulating layer to reduce the step, and is processed into a gentle shape. A wiring or the like is formed to be in contact with the insulating layer and thus the coverage of the wiring or the like is enhanced. In addition, deterioration of a light-emitting element due to contaminants such as water can be prevented by sealing a layer including an organic material that has water permeability in a display device with a sealing material. Since the sealing material is formed in a portion of a driver circuit region in the display device, the frame margin of the display device can be narrowed. | 10-04-2012 |
| 20120248471 | PIXEL ARRAY SUBSTRATE AND DISPLAY DEVICE - A pixel array substrate includes: a first through fourth transistors (Ta through Td); a light-emitting element (OEL); a scanning line connected with a control terminal of the fourth transistor; a data line connected with one conducting terminal of the fourth transistor; a first control line (AZi) connected with one conducting terminal of the third transistor; a second control line (Ei) connected with a control terminal of the first transistor; and a first power source line (Ypj) connected with one conducting terminal of the first transistor. One conducting terminal of the second transistor is connected with the first power source line via the first transistor. A control terminal of the second transistor is connected with the data line via the fourth transistor and with a terminal of the light-emitting element via a capacitor (C). The terminal of the light-emitting element, the other conducting terminal of the second transistor, the other conducting terminal of the third transistor, and a control terminal of the third transistor are connected with one another. This configuration makes it possible to reduce the number of wiring of a pixel array substrate which includes an organic light-emitting diode. | 10-04-2012 |
| 20120248472 | METHOD FOR CREATING SERIALLY CONNECTED OLED DEVICES - By the invention it is proposed a method of preparing a serial connection of OLED-devices, comprising the steps of providing a carrier substrate; depositing a first electrode material layer on said carrier substrate; depositing a layer of an organic optoelectronic active material on said first electrode material layer; depositing a second electrode material layer on said organic optoelectronic active material layer; ablating at least the second electrode material layer and the organic optoelectronic active material layer at least in selected areas to build a trench forming separated OLED-devices on the carrier surface; electrically interconnecting neighboring OLED-devices by connecting the anode of a first OLED-device to the cathode of a neighboring second OLED-device, wherein in the steps of depositing the organic optoelectronic active material layer and the cathode layer, the carrier substrate surface is covered over its entire functional area with said layers, and wherein the electrical interconnection of the neighboring OLED-devices is performed by at least partially filling the trenches built in the ablating step with an electrical conductive material. Furthermore, an illuminant is provided comprising serial connected OLED-devices. | 10-04-2012 |
| 20120256198 | LED PACKAGE STRUCTURE FOR INCREASING THE LIGHT UNIFORMING EFFECT - A LED package structure for increasing the light uniforming effect includes a substrate unit, a light emitting unit, a first package unit, and a second package unit. The substrate unit includes at least one substrate body. The light emitting unit includes at least one light emitting element disposed on the at least one substrate body and electrically connected to the at least one substrate body. The first package unit includes a first package resin body formed on the at least one substrate body to cover the at least one light emitting element. The second package unit includes a second package resin body formed on the at least one substrate body to cover the first package resin body. The second package resin body is a light uniforming resin body having a light diffusing material mixed therein, and the second package resin body has an exposed light uniforming surface formed thereon. | 10-11-2012 |
| 20120256199 | DISPLAY DEVICE AND A METHOD OF MANUFACTURING THE SAME - A display device includes an array substrate, a driving film and an adhesive member. The array substrate includes a first base substrate, a plurality of first signal pads formed on the first base substrate and a first dummy pad formed adjacent to the first signal pads. The driving film includes a base film, a plurality of output terminals formed on the base film and a first alignment mark formed adjacent to the output terminals. The adhesive member adheres the first signal pads to the output terminals, and adheres the first dummy pad to the first alignment mark. | 10-11-2012 |
| 20120256200 | HIGH EFFICIENCY LEDS - A light emitting device and method of fabricating the same is disclosed that comprises at least one light emitter comprising an active region which emits light. The device further comprising a submount arranged such that the at least one light emitter is mounted to the submount such that the active region is angled in relation to the submount. | 10-11-2012 |
| 20120256201 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - An OLED display includes: a substrate; an organic light emitting element formed on the substrate and including a first electrode, an emission layer, and a second electrode; and an encapsulation layer formed on the substrate while covering the organic light emitting element. The encapsulation layer includes an organic layer and an inorganic layer, and a protrusion and depression structure is formed in an interface between the organic layer and the inorganic layer. | 10-11-2012 |
| 20120256202 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - An organic light emitting diode (OLED) display a includes: a substrate; an organic light emitting element on the substrate and including a first electrode, a light emission layer, and a second electrode; and an encapsulation layer on the substrate while covering the organic light emitting element. The encapsulation layer includes an organic layer and an inorganic layer. A mixed area, where organic materials forming the organic layer and inorganic materials forming the inorganic layer co-exist along a plane direction of the encapsulation layer, is formed at the boundary between the organic layer and the inorganic layer. | 10-11-2012 |
| 20120256203 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display includes a substrate, a display portion on the substrate, and a sealing substrate fixed on the substrate and sealingly engaging the display portion. The sealing substrate is fixed by an adhesive layer that surrounds the display portion. The sealing substrate includes a composite member, at least one conductive portion, and an insulation sheet. The composite member includes a resin base layer and a plurality of carbon fibers. The at least one conductive portion extends over inner and outer sides of the composite member and penetrates the composite member. The at least one conductive portion includes a double-layered structure having a metal foil layer and a plating layer. The insulation sheet is on the outer side of the composite member and the insulation sheet covers the at least one conductive portion | 10-11-2012 |
| 20120256204 | Light-Emitting Device and a Method of Manufacturing Light-Emitting Device - To provide a highly reliable light-emitting device and especially a light-emitting device which can be formed without use of a metal mask and includes a plurality of light-emitting elements. A structural body at least an end of which has an acute-angled shape is provided so that the end can pass downward through an electrically conductive film formed over the insulating layer and can be at least in contact with an insulating layer having elasticity, thereby physically separating the electrically conductive film, and the electrically conductive films are thus electrically insulated from each other. Such a structure may be provided between adjacent light-emitting elements so that the light-emitting elements can be electrically insulated from each other in the light-emitting device. | 10-11-2012 |
| 20120256205 | LED LIGHTING MODULE WITH UNIFORM LIGHT OUTPUT - The invention relates to a light emitting diode (LED) module that is characterized by a thermally conductive substrate which is used as the base of the module; and a plurality of cavities positioned on the module; and a plurality of LED semiconductors chips are mounted within each cavity. Within each cavity; secondary cavities are formed and a plurality of LED semiconductors chips are mounted within each of the secondary cavity. A multiple layer configuration of encapsulation is used to fill the cavities to help mix and diffuse the light from the LED chips and ensure that we achieve a uniform light output from the light emitting surface of the module. | 10-11-2012 |
| 20120256206 | LED MODULE WITH COOLING PASSAGE - An LED module with a cooling passage is disclosed. The LED module includes a light source unit having a plurality of LED's which provide light through an appropriate power supply, and one or more cooling units which form said cooling passage, which combine heat generated from the LEDs with ambient heat and discharges the combined heat in an opposite direction. | 10-11-2012 |
| 20120256207 | ILLUMINATION DEVICE AND DISPLAY APPARATUS - An illumination device includes: a substrate; a first transparent electrode covering approximately an entire surface of a display region of the substrate; a second transparent electrode which overlaps with the first transparent electrode when seen in plan view and covers approximately the entire surface of the display region; and a plurality of island shaped light emitting elements disposed between the first transparent electrode and the second transparent electrode. The first and second transparent electrodes are formed as single continuous films. | 10-11-2012 |
| 20120261680 | LED Array Having Embedded LED and Method Therefor - An LED array comprises a base layer, at least one LED disposed on the base layer, and a diffusion layer including a luminescent material. The diffusion layer covers the at least one LED and the base layer in such a way that light emitted from the at least one LED passes through the diffusion layer. | 10-18-2012 |
| 20120261681 | PRODUCING METHOD OF LIGHT EMITTING ELEMENT TRANSFER SHEET, PRODUCING METHOD OF LIGHT EMITTING DEVICE, LIGHT EMITTING ELEMENT TRANSFER SHEET, AND LIGHT EMITTING DEVICE - A method for producing a light emitting transfer sheet includes the steps of preparing a light emitting element sheet including a light semiconductor layer connected to an electrode portion on one side surface and a phosphor layer laminated on the other side surface; dividing the light emitting element sheet into plural pieces to form a plurality of light emitting elements; disposing a plurality of the light emitting elements on a substrate to be spaced apart from each other; forming a reflecting resin layer containing a light reflecting component on the substrate so as to cover the light emitting elements; and removing the reflecting resin layer partially so that one side surface of the electrode portion is exposed from the reflecting resin layer. | 10-18-2012 |
| 20120267643 | Organic light emitting display apparatus - Embodiments relate to an organic light-emitting display device, comprising a first substrate defined by a plurality of pixels each including a pixel area and a transmittance area adjacent to the pixel area, the pixel area emitting light in a first direction and the transmittance area transmitting external light, and the first substrate including a pair of optical pattern units for transmitting or blocking the external light for each transmittance area according to coded patterns corresponding to the plurality of pixels, a second substrate facing the first substrate and encapsulating the plurality of pixels on the first substrate, and a pair of sensor units corresponding to the pair of optical pattern units, the pair of sensor units being arranged in a second direction that is opposite to the first direction in which the light is emitted, the pair of sensor units receiving the external light passing through the pair of optical pattern units. | 10-25-2012 |
| 20120267644 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode (OLED) display includes a substrate and an organic light emitting element on the substrate and including a first electrode, a plurality of organic emission layers on the first electrode and including at least one P-type impurity doped organic emission layer, and a second electrode on the plurality of organic emission layers. | 10-25-2012 |
| 20120267645 | LIGHT EMITTING DIODE MODULE PACKAGE STRUCTURE - A light emitting diode (LED) module package structure is described. The LED module package structure includes a metal heat dissipating board, a plurality of light emitting diode chips fixed on the metal heat dissipating board, at least one chip-scale connector fixed on the metal heat dissipating board to electrically connect to the light emitting diode chip via a bonding wire. The chip-scale connector includes a sapphire substrate, a conductive metal layer and an insulation protruding member. The insulation protruding member divides the conductive metal layer into a plurality of conductive areas. In addition, the LED module package structure can further includes a chip-scale power connector fixed in the metal heat dissipating board to connect the chip-scale connector or the light emitting diode chip via the bonding wire. | 10-25-2012 |
| 20120267646 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME - An organic light emitting diode display includes a substrate; an organic light emitting element provided over the substrate; a thin film encapsulation layer configured to seal the organic light emitting element together with the substrate; a phase delay layer provided over the thin film encapsulation layer and contacting the thin film encapsulation layer; and a polarizing film attached to the phase delay layer and having an area smaller than that of the phase delay layer. | 10-25-2012 |
| 20120267647 | LIGHT EMITTING DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME - A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump. | 10-25-2012 |
| 20120267648 | LIGHT-EMITTING DIODE DIE PACKAGES AND ILLUMINATION APPARATUSES USING SAME - The present invention relates to an LED die package, which has a light-emitting diode die having a sapphire layer, a first doped layer doped with a p- or n-type dopant, and a second doped layer doped with a different dopant from that doped in the first doped layer. A surface of the sapphire layer opposite to the surface on which the first doped layer is disposed is formed with generally inverted-pyramidal-shaped recesses and overlaid with a phosphor powder layer. Each of the first and the second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is disposed and formed with exposure holes for exposing the electrodes. The exposure holes are each filled with an electrically conductive linker. | 10-25-2012 |
| 20120267649 | LIGHT-EMITTING DIODE DIE PACKAGES AND ILLUMINATION APPARATUSES USING SAME - The present invention relates to an LED die package, which has a light-emitting diode die having a sapphire layer, a first doped layer doped with a p- or n-type dopant, and a second doped layer doped with a different dopant from that doped in the first doped layer. A surface of the sapphire layer opposite to the surface on which the first doped layer is disposed is formed with generally inverted-pyramidal-shaped recesses and overlaid with a phosphor powder layer. Each of the first and the second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is disposed and formed with exposure holes for exposing the electrodes. The exposure holes are each filled with an electrically conductive linker. | 10-25-2012 |
| 20120273806 | LED PACKAGE STRUCTURE - An LED package structure with standby bonding pads for increasing wire-bonding yield includes a substrate unit, a light-emitting unit, a conductive wire unit and a package unit. The substrate unit has a substrate body and a plurality of positive pads and negative pads. The light-emitting unit has a plurality of LED bare chips. The positive electrode of each LED bare chip corresponds to at least two of the positive pads, and the negative electrode of each LED bare chip corresponds to at least two of the negative pads. Each wire is electrically connected between the positive electrode of the LED bare chip and one of the at least two positive pads or between the negative electrode of the LED bare chip and one of the at least two negative pads. The package unit has a light-permitting package resin body on the substrate body to cover the LED bare chips. | 11-01-2012 |
| 20120273807 | Method for the Producing of a Light-Emitting Semiconductor Chip, Method for the Production of a Conversion Die and Light-Emitting Semiconductor Chip - A light-emitting semiconductor chip is provided, the semiconductor chip comprising a semiconductor body having a pixel region with at least two electrically isolated sub-regions, each sub-region comprising an active layer, which generates electromagnetic radiation of a first wavelength range during operation, a separately manufactured ceramic conversion die over a radiation emission area of at least one sub-region, said conversion die being configured to convert radiation of the first wavelength range into electromagnetic radiation of a second wavelength range, wherein a width of the conversion die does not exceed 100 μm. Further, a method for the production of a light-emitting semiconductor chip and method for the production of a conversion die are provided. | 11-01-2012 |
| 20120273808 | LED ARRAY MODULE AND FABRICATION METHOD THEREOF - An LED array module is manufactured by: attaching an upper conductive layer to a lower conductive layer by an insulative adhesion layer; forming an insulating layer on the entire exposed surface of the upper conductive layer and the lower conductive layer; forming a plurality of LED mounting regions by machining the upper conductive layer so the upper surface of the lower conductive layer is exposed; mounting an LED in each of the LED mounting regions for supplying power to the LED by the lower and upper conductive layers; charging each of the LED mounting regions with an insulating and transparent resin; and forming respective separation grooves in the upper layer and lower conductive layers abreast in a width direction such that each of the upper and lower conductive layers is divided into a plurality of slices. | 11-01-2012 |
| 20120273809 | LIGHT EMITTING DIODE DEVICE - An LED package includes a substrate, a first LED module and a second LED module. The first LED module includes a plurality of first LEDs arranged at the substrate. The second LED module includes a plurality of second LEDs arranged at the substrate and surrounding the first LED module. A luminous intensity of the first LED module is less than a luminous intensity of the second LED module. | 11-01-2012 |
| 20120273810 | Booster Circuit, Semiconductor Device, and Electronic Apparatus - The invention provides a booster circuit including a first transistor, a second transistor, a first capacitor element, a second capacitor element, a diode, and an inverter, wherein one electrode of the first transistor is maintained at a predetermined potential, the output of the inverter is connected to the gate electrode of the first transistor and one electrode of the second transistor through the second capacitor element, the input of the inverter is connected to the other electrode of the first transistor through the first capacitor element and connected to the gate electrode of the second transistor, and the diode is connected between the other electrode of the first transistor and the other electrode of the second transistor so as to be forwardly biased. | 11-01-2012 |
| 20120273811 | HOUSING FOR AN OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING A HOUSING - A housing for an optoelectronic component including a main housing body formed by a first plastics material, and which has a recess, and a coating formed by a second plastics material, and which, at least in a region of the recess, connects at least in places to the main housing body and is in direct contact with the main housing body, wherein the first plastics material is different from the second plastics material, and the first plastics material and the second plastics material differ from one another with regard to at least one of the following material properties: temperature resistance with regard to discoloration, temperature resistance with regard to deformation, temperature resistance with regard to destruction, and resistance to electromagnetic radiation. | 11-01-2012 |
| 20120273812 | LIGHT SOURCE FOR ILLUMINATION - The present invention aims to provide a light source for illumination that achieves excellent luminous intensity distribution and can be easily assembled. A light source | 11-01-2012 |
| 20120273813 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR FABRICATING THE SAME - The present disclosure provides an LED package and a method for fabricating the same. The LED package includes a base, at least one LED chip mounted on the base, a transparent wall disposed on the base and extending around the LED chip, and a fluorescent material disposed inside of the transparent wall and covering upper and side surfaces of the LED chip. | 11-01-2012 |
| 20120273814 | Light Emitting Diode with a Current Concentrating Structure - A light emitting diode (LED) includes a transparent insulating layer; and at least one transparent conductive oxide layer substantially enclosing the transparent insulating layer, wherein the transparent insulating layer and the at least one transparent conductive oxide layer are configured to distribute a current through the LED toward a peripheral region of the LED. | 11-01-2012 |
| 20120280256 | REMOTE PHOSPHOR LIGHT EMITTING DEVICES, COMPONENTS AND FABRICATION - A substrate including phosphor is remotely illuminated by an LED. Optical radiation that emerges through the substrate is measured. Portions of the substrate, such as raised features on the substrate, are then selectively removed responsive to the measuring, so as to obtain a desired optical radiation. In removing portions of the substrate, holes may be drilled through the substrate to provide a separate path for light from the LED that does not pass through the phosphor. Alternatively, a separate LED may be provided outside the dome. | 11-08-2012 |
| 20120280257 | TFT ARRAY SUBSTRATE AND MANUFACTURING AND REPAIRING METHODS OF THE SAME - An embodiment of the disclosed provides a TFT-LCD array substrate is provided, comprising a base substrate; a first transparent conductive film, a gate layer, a gate insulating layer, a semiconductor layer, and a source/drain electrode layer sequentially formed on the base substrate from the bottom up, wherein for each pixel unit of the array substrate the first transparent conductive film comprises at least a first part and a second part that do not contact with each other, and the first part is located under an area of the data line, without contacting the gate line and the common electrode line. When a data line in the array substrate has an open failure, this part of the transparent conductive film can be welded together with the data line using laser welding so as to repaire the data line. | 11-08-2012 |
| 20120280258 | Nitride Light-Emitting Diode with a Current Spreading Layer - A nitride light-emitting diode is provided including a current spreading layer. The current spreading layer includes a first layer having a plurality of distributed insulating portions configured to have electrical current flow therebetween; and a second layer including interlaced at least one substantially undoped nitride semiconductor layer and at least one n-type nitride semiconductor layer configured to spread laterally the electrical current from the first layer | 11-08-2012 |
| 20120286297 | LED PACKAGE STRUCTURE AND MODULE THEREOF - The present invention discloses a LED package structure and a module thereof. The LED package structure comprises a metallic chip-carrying lead frame, a metallic anode lead frame, a metallic cathode lead frame and a forming resin. At least one LED chip is stuck to the metallic chip-carrying lead frame. The metallic anode lead frame and metallic cathode lead frame are arranged beside the metallic chip-carrying lead frame. The forming resin includes a top member, a first sidewall, and a second sidewall. The top member is arranged on the metallic chip-carrying lead frame and has an opening to reveal the LED chip. A reflective wall is formed along the opening. The first sidewall is arranged between the metallic chip-carrying lead frame and the metallic anode lead frame to join them. The second sidewall is arranged between the metallic chip-carrying lead frame and the metallic cathode lead frame to join them. | 11-15-2012 |
| 20120286298 | BUS LINE DESIGNS FOR LARGE-AREA OLED LIGHTING - Systems, and methods for the design and fabrication of OLEDs, including large-area OLEDs with metal bus lines, are provided. Various bus line design rules for large area OLED light panels may include mathematical models developed to optimize bus line design and/or layout on large area OLED light panels. For a given panel area dimension, target luminous emittance, OLED device structure and efficiency (as given by the JVL characteristics of an equivalent small area pixel), and electrical resistivity and thickness of the bus line material and electrode onto which the bus lines are disposed, a bus line pattern may be designed such that Fill Factor (FF), Luminance Uniformity (U) and Power Loss (PL) may be optimized. One general design objective may be to maximize FF, maximize U and minimize PL. Another approach may be, for example, to define minimum criteria for U and a maximum criteria for PL, and then to optimize the bus line layout to maximize FF. OLED panels including bus lines with different resistances (R | 11-15-2012 |
| 20120286299 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display device is disclosed. The display device includes a substrate; a first electrode on the substrate; an auxiliary electrode patterned on and insulated from the first electrode, and having a top surface that has surface roughness; an intermediate layer on the first electrode and the auxiliary electrode; and a second electrode on the intermediate layer and facing the first electrode. The auxiliary electrode and the second electrode are electrically connected to each other via the surface roughness of the top surface of the auxiliary electrode. | 11-15-2012 |
| 20120286300 | DISPLAY DEVICE, DISPLAY, AND ELECTRONIC UNIT - A display device includes: a third electrode provided on a side of the second electrode opposite to the light-emitting layer; and an efficiency improving layer improving an efficiency of light extraction from the light-emitting layer, and the efficiency improving layer being provided between the second and third electrodes. The first and third electrodes are each in a laminated structure including a first layer being transmissive, and a second layer being transmissive and having a refractive index higher than a refractive index of the first layer. | 11-15-2012 |
| 20120286301 | LED MODULE - An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion. | 11-15-2012 |
| 20120286302 | Flexible Lighting Devices - A first device and methods for manufacturing the first device are provided. The first device may comprise a flexible substrate and at least one organic light emitting device (OLED) disposed over the flexible substrate. The first device may have a flexural rigidity between 10 | 11-15-2012 |
| 20120286303 | DISPLAY APPARATUS - The present invention supplied a display apparatus using plastic substrate instead of glass substrate, which can solve such problems that the plastic substrate has a low heat conductivity and its heat release performance becomes bad so that it is difficult to obtain stable performance and reliability. In the display apparatus being formed by bonding semiconductor thin film element on a plastic substrate, a thin film metal layer is formed on surface of the semiconductor thin film element for promoting heat release. | 11-15-2012 |
| 20120292644 | LED PACKAGE AND METHOD OF MANUFACTURING THE SAME - The present invention provides a Light Emitting Diode (LED) package, comprising a Printed Circuit Board (PCB), an LED mounted on the PCB, a pillar placed higher than the LED around the LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED, and a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting the light emitted from the LED into white light by changing a wavelength of the light, wherein an electrical pad of the LED and an electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other. | 11-22-2012 |
| 20120292645 | ORGANIC ELECTROLUMINESCENCE DISPLAY AND MANUFACTURING METHOD THEREOF - An organic electroluminescence display including: a gate line disposed on a substrate; a data line crossing the gate line; a TFT connected to the gate and data lines; a capacitor connected to the TFT; and an OLED connected to the TFT. A gate electrode of the TFT and a lower electrode of the capacitor are patterned from a first layer. A gate insulating layer disposed on the gate electrode and an insulating island disposed on the gate line are patterned from a second layer. A semiconductor island disposed on the insulating island and an active layer disposed on the gate insulating layer are patterned from a third layer. An insulating layer is disposed on the TFTs, the capacitor, and between the semiconductor island and the data line. An upper electrode of the capacitor, source/drain electrodes of the TFT, and the data line are patterned from a fourth layer. | 11-22-2012 |
| 20120292646 | SEMICONDUCTOR LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, AND LIGHTING APPARATUS AND DISPLAY APPARATUS USING THE SAME - The present invention aims to provide a semiconductor light emitting device that may be firmly attached to a substrate with maintaining excellent light emitting efficiency, and a manufacturing method of the same, and a lighting apparatus and a display apparatus using the same. | 11-22-2012 |
| 20120299017 | BATWING LED WITH REMOTE PHOSPHOR CONFIGURATION - An LED emitter uses a molded lens with phosphor material embedded in a circumferential trench to generate a batwing beam pattern. After the lens is molded over a package substrate with connected LED dies thereon, the phosphor material is molded, injected, or dispensed into a circumferential trench. The molded lens is shaped such that a majority of the light emitted by the one or more LED dies is reflected by the top surface to the side surfaces through the phosphor material. | 11-29-2012 |
| 20120299018 | BAT-WING LENS DESIGN WITH MULTI-DIE - A batwing beam is produced from an optical emitter having a primary LED lens over a number of LED dies on a package substrate. The LED lens includes a batwing surface formed by rotating a parabolic arc about an end of the parabolic arc over a center of the optical emitter. A center of each of the LED dies is mounted to the package substrate about the focus of a parabola whose arc forms the batwing surface, for example, between about 0.5 to 1.5 of a focal distance from the vertex of the parabola. The batwing surface reflects light from the number of LED dies through total internal reflection (TIR) or through a reflectivity gel coating. | 11-29-2012 |
| 20120299019 | Systems and Methods Providing Semiconductor Light Emitters - A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board. | 11-29-2012 |
| 20120299020 | LED PACKAGE MODULE FOR LIGHTING - An LED package module for lighting includes a plurality of LED chips spacedly arranged on a hard substrate and a plurality of dome-shaped encapsulants arranged on the hard substrate in such a way that the encapsulants enclose the LED chips respectively. By means of the dome-shaped encapsulants, the light extracting rate of the LED chips is enhanced. On the surface of the hard substrate, no dam structure is needed; therefore, the amount of the encapsulant material used in the LED package module can be effectively saved. | 11-29-2012 |
| 20120299021 | DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - Drive units arranged on a transistor array substrate include faulty drive units. The pixel electrodes include first pixel electrodes and second pixel electrodes, the first pixel electrodes corresponding one-to-one to the faulty drive units, and the second pixel electrodes corresponding one-to-one to the non-faulty drive units, a portion of each second pixel electrode is embedded in the contact hole corresponding thereto, and is in contact with a power supply pad of the non-faulty drive unit corresponding thereto, so that the second pixel electrode is electrically connected to the non-faulty drive unit. Each first pixel electrode is electrically insulated from the faulty drive unit corresponding thereto, and is connected by a connector to any of the second pixel electrodes adjacent thereto. A surface of each connector facing the interlayer insulation film is entirely in contact with the interlayer insulation film. | 11-29-2012 |
| 20120299022 | LIGHT EMITTING DEVICES AND METHODS - Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a light emission area disposed over the submount. The light emission area can include one or more light emitting diodes (LEDs), a fillet at least partially disposed about the one or more the LEDs, and filling material. The filling material can be disposed over a portion of the one or more LEDs and a portion of the fillet. | 11-29-2012 |
| 20120299023 | ORGANIC LAYER DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE SAME - An organic layer deposition apparatus for forming an organic layer on a substrate includes: a deposition source configured to discharge a deposition material; a deposition source nozzle unit arranged at a side of the deposition source and including a plurality of deposition source nozzles; and a patterning slit sheet facing the deposition source nozzle unit and including a plurality of patterning slits and at least one spacer arranged between a pair of adjacent patterning slits of the plurality of patterning slits, the patterning slit sheet being smaller than the substrate in at least one of a first direction or a second direction perpendicular to the first direction, and the substrate is spaced apart from the organic layer deposition apparatus by a predetermined distance, and at least one of the substrate or the organic layer deposition apparatus is movable relative to the other. | 11-29-2012 |
| 20120299024 | PATTERNING SLIT SHEET ASSEMBLY, ORGANIC LAYER DEPOSITION APPARATUS, METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY APPARATUS, AND THE ORGANIC LIGHT-EMITTING DISPLAY APPARATUS - A patterning slit sheet assembly for performing a deposition process to form a thin film on a substrate in a desired fine pattern. The patterning slit sheet assembly includes a patterning slit sheet having a plurality of slits, a frame combined with the patterning slit sheet to support the patterning slit sheet, and a support unit including an upper member that is allowed to be moved or fixed to support the patterning slit sheet when a gravitational force is applied to the patterning slit sheet and a lower member disposed more apart from the patterning slit sheet than the upper member, wherein the upper member is fixed on the lower member. | 11-29-2012 |
| 20120299025 | MANUFACTURING METHOD OF LIGHT EMITTING DEVICE AND MANUFACTURING DEVICE THEREOF - The present invention provides a structure in which a pixel region | 11-29-2012 |
| 20120299026 | LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A light emitting device comprises a substrate having a plurality of light emitting elements mounted thereon; a side wall structure having a partition wall portion separating a plurality of light emitting areas that each include at least one of the light emitting elements; and encapsulating resin filled in the light emitting areas to bury the light emitting elements therein. The side wall structure is separated by a space from the substrate at, at least, the partition wall portion so as to be in noncontact with the substrate, and the encapsulating resin is formed so as to integrally, continuously fill the light emitting areas and the space without producing any interface therein. | 11-29-2012 |
| 20120299027 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - To achieve enlargement and high definition of a display portion, a single crystal semiconductor film is used as a transistor in a pixel, and the following steps are included: bonding a plurality of single crystal semiconductor substrates to a base substrate; separating part of the plurality of single crystal semiconductor substrates to form a plurality of regions each comprising a single crystal semiconductor film over the base substrate; forming a plurality of transistors each comprising the single crystal semiconductor film as a channel formation region; and forming a plurality of pixel electrodes over the region provided with the single crystal semiconductor film and a region not provided with the single crystal semiconductor film. Some of the transistors electrically connecting to the pixel electrodes formed over the region not provided with the single crystal semiconductor film are formed in the region provided with the single crystal semiconductor film. | 11-29-2012 |
| 20120299028 | MANUFACTURING METHOD FOR LIQUID CRYSTAL DISPLAY DEVICE - A LCD device having a large pixel holding capacitance includes opposedly facing first and second substrates, and liquid crystal between them. The first substrate includes a video signal line, a pixel electrode, a thin film transistor having a first electrode connected to the video signal line and a second electrode connected to the pixel electrode, a first silicon nitride film formed above the second electrode, an organic insulation film above the first silicon nitride film, a capacitance electrode above the organic insulation film, and a second silicon nitride film above the capacitance electrode and below the pixel electrode. A contact hole etched in both the first and second silicon nitride films connects the second electrode and the pixel electrode to each other. A holding capacitance is formed by the pixel electrode, the second silicon nitride film and the capacitance electrode. | 11-29-2012 |
| 20120299029 | DISPLAY DEVICE - It is an object to provide a highly reliable display device. It is a feature an IC is over a substrate and a material layer having the same height is thereover. An IC is provided on one side of the substrate, and a material layer having the same height as the IC is provided on at least another side. Further, an IC is provided on one side of the substrate, and material layers having the same height as the IC are provided on the other sides. Further, an IC is provided on one side of the substrate, and a material layer having the same height as the IC is provided at a corner of the substrate. | 11-29-2012 |
| 20120299030 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT, LIGHTING DEVICE AND LENS - An optoelectronic semiconductor component for a lighting device including a carrier, at least one optoelectronic semiconductor chip mounted on the carrier and which includes a radiation passage face remote from the carrier, by which a plane is defined, and a lens comprising 1) a radiation exit face, which, relative to a height above the plane, exhibits a minimum, in particular in a central region, and at least two local maxima, and at least two local maxima, and 2) at least two connecting embankments which each extend from one of the maxima to another of the maxima, and each connecting embankment comprises a saddle point higher than the minimum and lower than the maxima adjoining the connecting embankment. | 11-29-2012 |
| 20120305947 | THIN FILM TRANSISTOR SUBSTRATE AND METHOD FOR FABRICATING THE SAME - A thin film transistor substrate and a method for fabricating the same are discussed. According to an embodiment, the thin film transistor substrate includes a gate line arranged on a substrate in a first direction; a data line arranged in a second direction crossing the gate line to define adjacent first and second pixel regions, the data line being used in common by the first and second pixel regions; an entire common line arranged in the second direction substantially parallel with the data line; a thin film transistor including a gate electrode connected with the gate line, a source electrode connected with the data line, a drain electrode formed to face the source electrode, and an active layer formed to be overlapped with the gate electrode by interposing a gate insulating film between the active layer and the gate electrode; and a pixel electrode connected with the drain electrode. | 12-06-2012 |
| 20120305948 | LIGHT-EMITTING DIODE AND METHOD FOR MAKING THE SAME - A light-emitting diode includes: an epitaxial substrate including a base member, and a plurality of spaced apart first light-transmissive members; a light-emitting unit including a first-type semiconductor layer, a light-emitting layer, and a second-type semiconductor layer; and an electrode unit electrically connected to the light-emitting unit. The first-type semiconductor layer has a bottom film covering the first light-transmissive members, a plurality of spaced apart second light-transmissive members formed on a top face of the bottom film, and a top film formed on the bottom film to cover the second light-transmissive members. | 12-06-2012 |
| 20120305949 | Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies - An electronic device may include a packaging substrate having a packaging face and first and second pluralities of light emitting diodes electrically and mechanically coupled to the packaging face of the packaging substrate. The packaging substrate may include first and second electrically conductive pads on the packaging face. The light emitting diodes of the first plurality of light emitting diodes may be electrically coupled in parallel between the first electrically conductive pad and an interconnection structure on the packaging face. The light emitting diodes of the second plurality of light emitting diodes may be electrically coupled in parallel between the interconnection structure and the second electrically conductive pad. | 12-06-2012 |
| 20120305950 | DISPLAY APPARATUS - Disclosed is a method of making a display apparatus including a step of forming an underlying layer on a substrate, the underlying layer having a protrusion; and a step of depositing a material of a lens portion so as to form a film having a shape that follows a shape of the underlying layer. | 12-06-2012 |
| 20120305951 | LIGHT-EMITTING DEVICE HAVING LIGHT-EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs ( | 12-06-2012 |
| 20120313114 | Method of manufacturing thin film transistor, thin film transistor manufactured by using the method, method of manufacturing organic light-emitting display apparatus, and organic light-emitting display apparatus manufactured by using the method - A method of manufacturing a thin film transistor (TFT), a TFT manufactured by the method, a method of manufacturing an organic light-emitting display apparatus that includes the TFT, a display including the TFT. By including a buffer layer below and an insulating layer above a silicon layer for the TFT, the silicon layer can be crystallized without being exposed to air, so that contamination can be prevented. Also, due to the overlying insulating layer, the silicon layer can be patterned without directly contacting photoresist. The result is a TFT with uniform and improved electrical characteristics, and an improved display apparatus. | 12-13-2012 |
| 20120313115 | LIGHT EMITTER DEVICE PACKAGES, MODULES AND METHODS - Light emitter device packages, modules and methods are disclosed having a body and a cavity that can be formed from a single substrate of material. The material can be thermally conductive and/or metallic. A light emitter device package can have at least one isolating layer creating at least a first isolated portion of the body and/or first isolated portion of the cavity. The isolating layer can be formed from the same material as the single substrate which forms the package body and cavity, and can be a layer which is thermally and electrically isolated. A light emitter or light emitter device, such as an LED chip can be mounted upon a surface of the cavity and upon at least a portion of the isolating layer. | 12-13-2012 |
| 20120313116 | Liquid Crystal Display and Chip On Film Thereof - A chip on film (COF) is disclosed in the present disclosure, which comprises an adhesive base layer, a driving integrated circuit (IC), an adhesive layer and a copper layer. The driving IC is embedded on a surface of the adhesive base layer; the adhesive layer is located under the adhesive base layer; the copper layer is located under the adhesive layer. The adhesive base layer is formed with a heat and pressure spreading structure. A heat and pressure spreading structure is disposed on the adhesive base layer of the COF so that deformation or unevenness of the glass substrate in the bonded area can be avoided when the COF is thermally pressed to the glass substrate of the LCD. These guarantees the consistency between the bonded area and the unbounded area, the bonded area and the unbounded area of the glass substrate will have the same transmissivity and luminance. | 12-13-2012 |
| 20120313117 | LIGHT-EMITTING DIODE PACKAGE - Disclosed is a light-emitting diode package according to an embodiment, including; a body having a cavity formed therein, a lead frame placed in the cavity; and a light emitting diode electrically connected to the lead frame while having a slope angle relative to the bottom surface of the cavity, wherein a light emitting part and a non-light emitting part are present on the light emitting diode, and wherein a connection part is provided in a region of the cavity to be connected to at least a region of the non-light emitting part. | 12-13-2012 |
| 20120313118 | ACTIVE-MATRIX ORGANIC LIGHT-EMITTING DIODE DISPLAY DEVICE WITH SHORT PROTECTION - An active-matrix OLED display device, which reduces the adverse effects of short circuits across OLED devices in a densely packed array by having a thin-film resistive layer integrated in series with the OLED device. The OLED device includes a substrate, and first and second pixels situated proximate each other on the substrate. The first pixel comprises an OLED and means for preventing a failure of the first pixel due to a short from affecting the operation of the second pixel. The preventing means includes a resistor electrically connected in series with the OLED of the first pixel. The resistor is in the form of a thin-film resistive layer. The first pixel includes an anode, wherein the thin-film resistive layer is situated adjacent the anode. The anode and the thin-film resistive layer have substantially the same dimensions and are formed simultaneously. | 12-13-2012 |
| 20120313119 | THREE DIMENSIONAL LIGHT-EMITTING-DIODE (LED) STACK AND METHOD OF MANUFACTURING THE SAME - A three dimensional (3-D) light-emitting-diode (LED) stack and method of manufacturing the same, comprising: a substrate; at least a first LED, stacked on said substrate; and at least a second LED, stacked on said first LED, such that energy gap of said first LED is smaller than energy gap of said second LED. In said stack mentioned above, a material of larger energy gap capable of emitting light of shorter wavelength can be penetrated by lights emitted by another material of smaller energy gap capable emitting lights of longer wavelength, such that lights are mixed together and then emitted, and said materials are put into a three dimensional stack arrangement, to form a brand new light emitting device of mixed light, so as to emit lights as required. | 12-13-2012 |
| 20120313120 | Method For Depositing A Phosphor Layer On LEDs, And Apparatus Made Thereby - A method for depositing a phosphor layer on a light-emitting diode (“LED”) chip includes coating at least a light-emitting side of the LED chip with a phosphor-adhesive material, and applying phosphor particles to an exposed surface of the material such that the phosphor layer forms of phosphor particles that adhere to the exposed surface. A method for depositing phosphor layers on each of a plurality of LED chips includes mounting the LED chips to a common substrate, coating at least a light-emitting side of the LED chips with a phosphor-adhesive material, and applying phosphor particles to exposed surfaces of the material such that the phosphor layers form of phosphor particles that adhere to the material. A processed LED chip includes an unpackaged LED chip, a phosphor-adhesive material applied to a light-emitting side of the LED chip, and a phosphor layer formed of phosphor particles adhered to the material. | 12-13-2012 |
| 20120313121 | DISPLAY DEVICE AND METHOD THEREOF - A display device includes a pixel electrode disposed on a first substrate, and including a first portion, a second portion and a connection portion disposed between the first portion and the second portion, a capacitor line disposed on the first substrate and between the first substrate and the connection portion, a nonsymmetrical shaped capacitor electrode disposed on the first substrate and overlapping the pixel electrode and the capacitor line, and electrically connected to the pixel electrode through contact holes, and a common electrode disposed on a second substrate and including first and second opening patterns disposed overlapping the first portion and the second portion of the pixel electrode, respectively. | 12-13-2012 |
| 20120313122 | SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENTS, AND LIGHT-EMITTING DEVICE - A substrate for mounting light-emitting elements to mount a plurality of double wire type light-emitting elements so as to be connected in parallel, comprising a substrate main body made of a sintered product of an inorganic material powder and having a mounting surface for light-emitting elements; wiring conductors provided so as to be connected to electrodes of the light-emitting elements in one-to-one at a position out of a portion between the light-emitting elements, on the mounting surface; a reflection film formed on the mounting surface excluding the wiring conductors and a periphery thereof; and an overcoat glass film provided on the mounting surface so as to cover the entire reflection film including its edge and so as to exclude the wiring conductors and a periphery thereof, and a light-emitting device using it. | 12-13-2012 |
| 20120319140 | ORGANIC LIGHT EMITTING DISPLAY MODULE AND PRODUCING METHOD THEREOF - An organic light emitting diode (OLED) display module including a first carrier, a second carrier and an OLED display panel is provided. The second carrier disposed on the first carrier is integrally formed with the first carrier. The OLED display panel is disposed on the second carrier. A continuous joint surface is formed between the first and the second carriers. A producing method of the OLED display module is also provided. | 12-20-2012 |
| 20120319141 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME - An organic light emitting diode (OLED) display includes a substrate main body, a plurality of organic light emitting elements on the substrate main body, a column spacer on the substrate main body and between two or more of the plurality of organic light emitting elements, and an encapsulation thin film covering at least one of the organic light emitting elements and having regions divided by the column spacer. | 12-20-2012 |
| 20120319142 | GEL UNDERFILL LAYERS FOR LIGHT EMITTING DIODES AND METHODS OF FABRICATING SAME - A light emitting device is fabricated by providing a mounting substrate and an array of light emitting diode dies adjacent the mounting substrate to define gaps. A gel that is diluted in a solvent is applied on the substrate and on the array of light emitting dies. At least some of the solvent is evaporated so that the gel remains in the gaps, but does not completely cover the light emitting diode dies. For example, the gel substantially recedes from the substrate beyond the array of light emitting diode dies and also substantially recedes from an outer face of the light emitting diode dies. Related light emitting device structures are also described. | 12-20-2012 |
| 20120319143 | LIGHT EMITTING DEVICE AND ILLUMINATION APPARATUS INCLUDING SAME - A light emitting device includes a plurality of solid-state light emitting elements mounted on a substrate; and a wavelength converting unit covering the solid-state light emitting elements, the wavelength converting unit containing fluorescent materials. The solid-state light emitting elements include inner solid-state light emitting elements arranged in a central position of the substrate and outer solid-state light emitting elements arranged outwardly of the inner solid-state light emitting elements, and the wavelength converting unit is configured such that a probability that light propagating through the wavelength converting unit is brought into contact with the fluorescent materials in a portion of the wavelength converting unit covering the outer solid-state light emitting elements is lower than a probability that light propagating through the wavelength converting unit is brought into contact with the fluorescent materials in other portions. | 12-20-2012 |
| 20120319144 | DISPLAY PANEL AND DISPLAY DEVICE - Disclosed is a display panel | 12-20-2012 |
| 20120326171 | LIGHT EMITTING DIODE HAVING ELECTRODE PADS - The present invention relates to light-emitting diodes. A light-emitting diode according to an exemplary embodiment of the present invention includes a first group including a plurality of first light emitting cells connected in parallel to each other, and a second group including a plurality of second light emitting cells connected in parallel to each other. Each first light emitting cell and second light emitting cell has a semiconductor stack that includes a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer disposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer. At least two light emitting cells of the first light emitting cells share the first conductivity-type semiconductor layer, and at least two light emitting cells of the second light emitting cells share the first conductivity-type semiconductor layer. The first light emitting cells are connected in series to the second light emitting cells. | 12-27-2012 |
| 20120326172 | LIQUID CRYSTAL DISPLAY AND METHOD FOR MANUFACTURING THE SAME - Provided is a liquid crystal display including: a first substrate; a thin film transistor disposed on the first substrate; a passivation layer disposed on the thin film transistor and comprising a contact hole exposing an electrode of the thin film transistor; a pixel electrode disposed on the passivation layer and connected to the electrode of the thin film transistor through the contact hole; a lower buffer layer disposed on the pixel electrode; a lower alignment layer disposed on the lower buffer layer; a second substrate facing the first substrate; a common electrode disposed on the second substrate; an upper buffer layer disposed on the common electrode; and an upper alignment layer disposed on the upper buffer layer, in which the lower buffer layer comprises parylene, the upper buffer layer comprises parylene, or both the lower and the upper buffer layers comprise parylene. | 12-27-2012 |
| 20120326173 | LIGHT EMITTING DIODE ELEMENT, METHOD OF FABRICATION AND LIGHT EMITTING DEVICE - A light emitting diode comprises a multi-layer semiconductor, a first electrode and a second electrode. The multi-layer semiconductor has a light emitting active layer substantially perpendicular to the predetermined surface, a first semiconductor layer located on a surface of the light emitting active layer and a second semiconductor layer located on an opposite surface of the light emitting active layer. The first electrode is provided adjacent to and electrically connect to the first semiconductor layer. The second electrode is provided adjacent to and electrically connect to the second semiconductor layer. In addition, a method of fabricating LED element and a light emitting device having the LED elements are provided. | 12-27-2012 |
| 20120326174 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an organic light-emitting display device includes forming a gate electrode including a lower gate electrode on a gate insulating layer and an upper gate electrode on the lower gate electrode; forming a source region and a drain region at a semiconductor active layer using the gate electrode as a mask; forming an interlayer insulating layer on a substrate and etching the interlayer insulating layer, resulting in contact holes that expose portions of the source region and the drain region; forming a source/drain electrode raw material on the substrate and etching the source/drain electrode raw material to form a source electrode and a drain electrode; forming a gold overlapped lightly doped drain (GOLDD) structure having a LDD region at the semiconductor active layer by injecting impurity ions; depositing a protective layer on the substrate; and forming a display device on the substrate. | 12-27-2012 |
| 20120326175 | LED PACKAGE AND METHOD FOR MAKING THE SAME - An LED package includes a substrate with two opposite lateral bulging portions, an LED die, an electrode structure, and a reflective layer. The substrate includes a first substrate and a second substrate stacked together; the first substrate and the second substrate are transparent; and the substrate includes an emitting surface for emitting light of the LED package. The electrode structure is sandwiched between the first substrate and the second substrate. The LED die is mounted in the substrate and electrically connected to the electrode structure. The reflective layer is formed on an outer surface of the substrate except the emitting surface and the bulging portions. The disclosure also provides a method for manufacturing such an LED package. | 12-27-2012 |
| 20120326176 | DISPLAY DEVICE AND FABRICATION METHOD FOR DISPLAY DEVICE - A capacitor unit in a display device includes: a capacitor element having a first capacitor electrode connected to a power line and provided in a GM electrode layer and a second capacitor electrode connected to a line and provided in an SD electrode layer; a backup capacitor element having a first backup capacitor electrode provided in the GM electrode layer and a second backup capacitor electrode connected to the power line and provided in the SD electrode layer; a disconnect-able portion at which a connection between the second capacitor electrode and the line can be disconnected; and a connectable portion at which the first backup capacitor electrode and the line can be connected, and the disconnect-able portion and the connectable portion are arranged at a position in which the disconnect-able portion and the connectable portion overlap in a stacking direction. | 12-27-2012 |
| 20120326177 | DISPLAY DEVICE AND FABRICATION METHOD FOR DISPLAY DEVICE - A display device capable of suppressing decrease in capacitance and capable of reducing area even when a capacitor unit is repaired is provided. A capacitor unit in a display device includes: a capacitor element having a first capacitor electrode connected to a power line and provided in an SD electrode layer and a second capacitor electrode provided in a GM electrode layer; a backup capacitor electrode provided in the TM electrode layer; a disconnect-able portion at which a connection between the first capacitor electrode and the power line can be disconnected; and a connectable portion at which the backup capacitor electrode and the power line can be connected, and the disconnect-able portion and the connectable portion overlap in a stacking direction. | 12-27-2012 |
| 20120326178 | OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT - An optoelectronic component includes at least one inorganic optoelectronically active semiconductor component having an active region that emits or receives light during operation, and a sealing material applied by atomic layer deposition on at least one surface region, the sealing material covering the surface region in a hermetically impermeable manner. | 12-27-2012 |
| 20120326179 | DISPLAY DEVICE AND MANUFACTURING METHOD OF THE DISPLAY DEVICE - The MEMS shutter includes a shutter having an aperture part, a first spring connected to the shutter, a first anchor connected to the first spring, a second spring and a second anchor connected to the second spring, an insulation film on a surface of the shutter, the first spring, the second spring, the first anchor and the second anchor, the surfaces being in a perpendicular direction to a surface of a substrate, and the insulation film is not present on a surface of the plurality of terminals, and a surface of the shutter, the first spring, the second spring, the first anchor and the second anchor, the surfaces being in a parallel direction to a surface of the substrate and on the opposite side of the side facing the substrate. | 12-27-2012 |
| 20120326180 | LIGHT-EMITTING ELEMENT, DISPLAY AND DISPLAY DEVICE - A light-emitting element of the present invention includes (i) a light-emitting layer ( | 12-27-2012 |
| 20120326181 | LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE, ILLUMINATING DEVICE, AND BACKLIGHT - In a light emitting device, one hundred or more bar-like structured light emitting elements ( | 12-27-2012 |
| 20120326182 | IMAGE DISPLAY APPARATUS AND IMAGE DISPLAY APPARATUS MANUFACTURING METHOD - Provided is an image display apparatus in which color breakup of a reflection image formed from reflected ambient light may be reduced to suppress the influence of an ambient environment. The image display apparatus includes multiple pixels. Each of the pixels includes a light-emitting layer and a structure layer having a refractive index distribution in an in-plane direction parallel to a screen of the image display apparatus, for extracting light generated from the light-emitting layer. The structure layer includes multiple structures formed of a first medium and a layer formed of a second medium having a refractive index different from a refractive index of the first medium. The multiple structures are non-periodically arranged in the layer. Reflected ambient light is reflected by the multiple structures formed of the first medium to have an overlap range to reduce color breakup of a reflection image formed from the reflected ambient light. | 12-27-2012 |
| 20120326183 | LIGHT EMITTING DEVICE PACKAGE - A light emitting device package is provided. The light emitting device package may include a main body having a cavity including side surfaces and a bottom, and a first reflective cup and a second reflective cup provided in the bottom of the cavity of the main body and separated from each other. A first light emitting device may be provided in the first reflective cup, and a second light emitting device may be provided in the second reflective cup. | 12-27-2012 |
| 20130001596 | DEPOSITION OF ESD PROTECTION ON PRINTED CIRCUIT BOARDS - A method and apparatus for providing electro-static discharge (ESD) protection to light emitting diode (LED) systems on printed circuit boards (PCBs). Protection is provided by ESD diodes deposited on the PCBs configured as flexible substrates. Various deposition techniques are employed including chemical vapor deposition, pulsed laser deposition and atomic layer deposition. | 01-03-2013 |
| 20130001597 | Lighting Device Having a Color Tunable Wavelength Converter - There is herein described a lighting device including at least one LED and a wavelength converter. The wavelength converter includes a supporting plate, a plurality of first host sites and a plurality of second host site. The supporting plate is disposed over the LED. The plurality of the first host sites is disposed directly on a surface of the supporting plate. Each of the plurality of first host sites consists essentially of a first matrix and a plurality of first quantum dots dispersed in the first matrix. The first quantum dots have a first common emission peak wavelength. The plurality of the second host sites is disposed directly on the surface of the supporting plate. Each of the plurality of second host sites consists essentially of a second matrix and a plurality of second quantum dots dispersed in the second matrix. The second quantum dots have a second common emission peak wavelength. The second common emission peak wavelength is different from the first common emission peak wavelength. | 01-03-2013 |
| 20130001598 | METHOD AND DEVICE FOR A CATHODE STRUCTURE FOR FLEXIBLE ORGANIC LIGHT EMITTING DIODE (OLED) DEVICE - A method for making a flexible OLED lighting device includes forming a plurality of OLED elements on a flexible planar substrate, wherein at least one of the OLED elements includes a continuous respective anode layer formed over the substrate, one or more organic light emitting materials formed over the anode layer, a cathode layer formed over the light emitting materials, and an encapsulating protective cover formed over the cathode layer. At least one of the OLED elements defines a continuous light region on the substrate, wherein the substrate and combination of OLED elements define an active light area. The active light area is bendable from a flat planar configuration to a bend configuration having a design bending radius. The thickness of the cathode layer is formed between a minimum thickness value and a maximum thickness value as a function of the size of the active light area and the design bending radius. An OLED in accordance with these aspects is also provided. | 01-03-2013 |
| 20130001599 | LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT INCLUDING THE SAME - An LED package includes a body; a first lead frame having a first cavity in the body; a second lead frame having a second cavity in the body; a first bonding part protruding into a region between a first lateral side of the body and the first cavity from the first lead frame; a second bonding part protruding into a region between a second lateral side of the body, and the second cavity from the second lead frame; a first LED in the first cavity; a second LED in the second cavity; a third lead frame disposed between the first lateral side and the first cavity; a fourth lead frame disposed between the second lateral side and the second cavity; a first protective device on one of the third lead frame and the first bonding part; and a second protective device on one of the fourth lead frame and the second bonding part. | 01-03-2013 |
| 20130001600 | ORGANIC LIGHT-EMITTING DISPLAY APPARATUS - An organic light-emitting display apparatus includes an organic light-emitting device including a pixel electrode, an opposite electrode facing the pixel electrode, and an organic light-emitting layer interposed between the pixel electrode and the opposite electrode; a first polarization plate disposed on a surface of the organic light-emitting device, the organic light-emitting device being configured to emit light through the first polarization plate; a second polarization plate facing the first polarization plate; and an optical compensation member between the first polarization plate and the second polarization plate. | 01-03-2013 |
| 20130001601 | ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY DEVICE - An organic light emitting display device includes a substrate having a luminescent region and a non-luminescent region, an insulation layer on the substrate, a first electrode on the insulation layer, at least one light emitting structure on the first electrode, a second electrode on the light emitting structure, and at least one reflecting structure at one of the first electrode or the second electrode around the at least one light emitting structure. The reflecting structure may be configured to reflect light back toward the luminescent region. | 01-03-2013 |
| 20130001602 | ORGANIC LIGHT EMITTING DEVICE, ORGANIC LIGHT EMITTING DISPLAY APPARATUS, AND METHODS OF MANUFACTURING THE SAME - An organic light emitting display device includes a buffer layer on a substrate, the buffer layer including nano-particles, a pixel electrode on the buffer layer, an opposite electrode on the pixel electrode and facing the pixel electrode, and an organic emission layer between the pixel electrode and the opposite electrode. | 01-03-2013 |
| 20130001603 | METHODS OF FORMING INCLINED STRUCTURES ON INSULATION LAYERS, ORGANIC LIGHT EMITTING DISPLAY DEVICES AND METHODS OF MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY DEVICES - An organic light emitting display device comprises a first substrate, an insulation layer having an inclined structure, a first electrode, a pixel defining layer defining a luminescent region and a non-luminescent region, an organic light emitting structure, a second electrode and a second substrate. Lateral portions of the first electrode, the second electrode and/or the pixel defining layer may have an inclination angle for preventing a total reflection of light generated from the organic light emitting structure, so that the organic light emitting display device may ensure a light efficiency substantially larger than that of the conventional organic light emitting display device by about at least 30 percent. | 01-03-2013 |
| 20130001604 | LIGHT EMITTING DEVICE - There is a reflective layer covering almost the entire surface of the light emitting portion except the portions where the light emitting elements are arranged, it is possible to increase the reflectivity of the light emitting portion to realize a higher luminance. In addition, the heat generated from the light emitting elements can be dissipated through the reflective layer, so that it is possible to prevent overheat of the light emitting device, and it is thus possible to improve the reliability of the light emitting device. | 01-03-2013 |
| 20130001605 | LIGHT-EMITTING DEVICE - A light-emitting device includes a circuit substrate including at least a pair of electrodes, an LED element electrically mounted on the circuit substrate, a phosphor plate disposed on an upper surface of the LED element, a diffuser plate disposed on an upper surface of the phosphor plate, and a white resin disposed on an upper surface of the circuit substrate and covering a peripheral side surface of the LED element, a peripheral side surface of the phosphor plate, and a peripheral side surface of the diffuser plate. The present invention makes it possible to obtain a planar light-emitting surface even with a plurality of LEDs, and also, a problem of color-ring occurrence caused by a phosphor may be less represented. | 01-03-2013 |
| 20130001606 | SUB-MOUNT, LIGHT EMITTING DEVICE INCLUDING SUB-MOUNT AND METHODS OF MANUFACTURING SUCH SUB-MOUNT AND/OR LIGHT EMITTING DEVICE - A sub-mount adapted for AC and DC operation of devices mountable thereon, light emitting devices including such a sub-mount, and methods of manufacturing such a sub-mount are provided. The sub-mount includes a base substrate having first and second surfaces, a conductive pattern on the first surface, first and second pairs of first and second electrodes on the second surface and vias extending through the base substrate between the first and second surfaces. The conductive pattern includes a first set of mounting portions and two via portions along a first electrical path between the first pair of first and second electrodes, and a second set of mounting portions and two via portions along a second electrical path between the second pair of first and second electrodes, the via portions connecting respective portions of the conductive pattern to respective electrodes. | 01-03-2013 |
| 20130001607 | LIGHT-EMITTING DEVICE AND PRODUCTION METHOD THEREOF - Light-emitting device including a supporting substrate, a partition wall dividing a plurality of EL elements on the supporting substrate, and the EL elements provided in a concave portion that is a space between the partition walls. Each EL element is constituted by a first electrode, a first resistance layer formed by an applying method, a second resistance layer having an electric resistance higher than that of the first resistance layer, a light-emitting layer, and a second electrode in this order so that the first electrode is located near the supporting substrate. The first resistance layer includes a creeping-up portion creeping up to a direction that is away from the supporting substrate and along the surface of the corresponding partition wall; and the second resistance layer is provided by ranging continuously over one EL element to another EL element that are adjacent to each other with the partition wall interposed therebetween. | 01-03-2013 |
| 20130001608 | LIGHT EMITTING DEVICE - It is an object of the present invention to prevent an insulating film from peeling in a section where the insulating film is adjacent to a sealing region. Over a first substrate | 01-03-2013 |
| 20130009174 | VERTICAL STACKED LIGHT EMITTING STRUCTURE - A vertical stacked light emitting structure includes a substrate unit, a first light emitting unit, a light guiding unit, and a second light emitting unit. The substrate unit includes at least one substrate body. The first light emitting unit includes at least one first LED bare chip disposed on the substrate body and electrically connected to the substrate body. The light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Therefore, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially. | 01-10-2013 |
| 20130009175 | VERTICAL STACKED LIGHT EMITTING STRUCTURE - A vertical stacked light emitting structure includes a substrate unit, a stacked type light emitting module, and a flip-chip type light emitting module. The substrate unit includes a substrate body. The stacked type light emitting module includes a first light emitting unit and a light guiding unit. The first light emitting unit includes at least one first LED bare chip disposed on and electrically connected to the substrate body, and the light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The flip-chip type light emitting module includes a second light emitting unit. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Hence, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially. | 01-10-2013 |
| 20130009176 | DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A display substrate includes a base substrate, color filter layers, a bottom supporting layer and a light-blocking and maintaining element. The base substrate includes a gate line, a data line crossing the gate line, and a switching element on the base substrate. The color filter layers are adjacent to each other on the base substrate. The bottom supporting layer is between the color filter layers adjacent to each other and on the base substrate. The light-blocking and maintaining element is between the color filter layers adjacent to each other, and on the bottom supporting layer. The light-blocking and maintaining element includes a light blocking portion, and a maintaining portion which overlaps the bottom supporting layer and protrudes from the light blocking portion. | 01-10-2013 |
| 20130009177 | ORGANIC LAYER DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE SAME - An organic layer deposition apparatus, and a method of manufacturing an organic light-emitting display device using the organic layer deposition apparatus. The organic layer deposition apparatus includes: an electrostatic chuck that fixedly supports a substrate that is a deposition target; a deposition unit including a chamber maintained at a vacuum and an organic layer deposition assembly for depositing an organic layer on the substrate fixedly supported by the electrostatic chuck; and a first conveyer unit for moving the electrostatic chuck fixedly supporting the substrate into the deposition unit, wherein the first conveyer unit passes through inside the chamber, and the first conveyer unit includes a guide unit having a receiving member for supporting the electrostatic chuck to be movable in a direction. | 01-10-2013 |
| 20130009178 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode package includes an electrically insulated base, first and second electrodes, an LED chip, a voltage stabilizing module, and an encapsulative layer. The base has a first surface and an opposite second surface. The first and second electrodes are formed on the first surface of the base. The LED chip is electrically connected to the first and second electrodes. The voltage stabilizing module is formed on the first surface of the base, positioned between and electrically connected to the first and second electrodes. The voltage stabilizing module connects to the LED chip in reverse parallel and has a polarity arranged opposite to that of the LED chip. The voltage stabilizing module has an annular shape and encircles the first electrode. The encapsulative layer is formed on the base and covers the LED chip. | 01-10-2013 |
| 20130015471 | ETCHANT FOR METAL LAYER INCLUDING COPPER OR A COPPER ALLOY, METHOD OF MANUFACTURING A DISPLAY SUBSTRATE USING THE SAME AND DISPLAY SUBSTRATEAANM PARK; Hong-SickAACI Suwon-siAACO KRAAGP PARK; Hong-Sick Suwon-si KRAANM Lee; Wang-WooAACI Suwon-siAACO KRAAGP Lee; Wang-Woo Suwon-si KR - An etchant includes about 50% by weight to about 70% by weight of phosphoric acid, about 1% by weight to about 5% by weight of nitric acid, about 10% by weight to about 20% by weight of acetic acid, about 0.1% by weight to about 2% by weight of a corrosion inhibition agent including an azole-based compound and a remainder of water. | 01-17-2013 |
| 20130015472 | METHOD FOR PACKAGING LIGHT EMITTING DIODES AND LIGHT EMITTING MODULE HAVING LED PACKAGES FORMED BY THE METHODAANM LO; HSING-FENAACI HukouAACO TWAAGP LO; HSING-FEN Hukou TW - A method for making a light emitting module includes: a. providing a flexible substrate; b. forming a plurality of rigid portions in the flexible substrate; c. forming an electrically conductive layer on the rigid portions, the electrically conductive layer having several electrodes apart from each other; d. arranging a plurality of LED dies on the electrically conductive layer with each LED die striding over and electrically connected to two neighboring electrodes; e. forming an encapsulating layer to cover the LED dies; and f. cutting through the flexible substrate. At least one of above steps b, c, d, e is performed by a roll applying process. | 01-17-2013 |
| 20130015473 | LIGHT-EMITTING DEVICEAANM CHEN; CHAO-HSINGAACI Hsinchu CityAACO TWAAGP CHEN; CHAO-HSING Hsinchu City TWAANM CHUNG; CHIEN-KAIAACI Hsinchu CityAACO TWAAGP CHUNG; CHIEN-KAI Hsinchu City TWAANM LIU; HSIN-MAOAACI Hsinchu CityAACO TWAAGP LIU; HSIN-MAO Hsinchu City TWAANM YAO; CHIU-LINAACI Hsinchu CityAACO TWAAGP YAO; CHIU-LIN Hsinchu City TWAANM HUANG; CHIEN-FUAACI Hsinchu CityAACO TWAAGP HUANG; CHIEN-FU Hsinchu City TW - The application provides a light-emitting device, comprising a substrate; a plurality of first light-emitting diode units on the substrate, wherein every first light-emitting diode unit has a first electrode structure; and a plurality of second light-emitting diode units among the plurality of first light-emitting diode units, wherein every second light-emitting diode unit has a second electrode structure. The second electrode structure of the second light-emitting diode unit is flipped over and electrically connected with the adjacent first electrode structure of the first light-emitting diode unit. | 01-17-2013 |
| 20130015474 | WHITE LIGHT EMITTING DIODE (LED) LIGHTING DEVICEAANM Zhang; MingAACI ChengduAACO CNAAGP Zhang; Ming Chengdu CNAANM Zhao; KunAACI ChengduAACO CNAAGP Zhao; Kun Chengdu CNAANM Li; Dong-mingAACI ChengduAACO CNAAGP Li; Dong-ming Chengdu CN - An alternating current (AC) white LED lighting device and a method for manufacturing the same are provided. The AC white LED lighting device consists of blue, violet or ultraviolet LED chips, blue afterglow luminescence materials A and yellow luminescence materials B. Wherein the weight ratio of the blue afterglow luminescence materials A to the yellow luminescence materials B is 10-70 wt %:30-90 wt %. Because of using afterglow luminescence materials, the light will be sustained when an excitation light source disappears, which can eliminate the influence of LED chips light output variation due to the AC fluctuation on the lighting device. And the problem of the heating of the chips also can be overcome. At the same time, the influence of temperature quenching effect and direction change of the AC current on the AC white LED lighting device is eliminated. | 01-17-2013 |
| 20130015475 | ORGANIC EL PANEL AND METHOD OF MANUFACTURING THE SAMEAANM Miyazawa; KazutoshiAACI OsakaAACO JPAAGP Miyazawa; Kazutoshi Osaka JP - The present invention prevents a local luminance reduction at defects in pixel electrodes with a rapid and easy method. The present invention provides a method of manufacturing an organic EL panel that includes a TFT panel and organic EL devices disposed over a surface of the TFT panel in matrix arrangement, each of the organic EL devices including a pixel electrode disposed over the surface of the TFT panel, an organic luminescent layer disposed over the pixel electrode, and a counter electrode disposed over the organic functional layer. The method includes the steps of: providing a TFT panel; patterning pixel electrodes on a surface of the TFT panel; detecting in the pixel electrodes defects in which the surface of the TFT panel is exposed; roughening a portion of the surface of the TFT panel by applying a laser beam onto the portion, the portion including a surface exposed through the defect in the pixel electrode; forming an organic functional layer over the pixel electrodes and the surface of the TFT panel exposed through the defect in the pixel electrode; and forming a counter electrode over the organic functional layer. | 01-17-2013 |
| 20130020589 | WAFER LEVEL PHOTONIC DEVICE DIE STRUCTURE AND METHOD OF MAKING THE SAME - A vertical Light Emitting Diode (LED) device includes an epi structure with a first-type-doped portion, a second-type-doped portion, and a quantum well structure between the first-type-doped and second-type-doped portions and a carrier structure with a plurality of conductive contact pads in electrical contact with the epi structure and a plurality of bonding pads on a side of the carrier structure distal the epi structure, in which the conductive contact pads are in electrical communication with the bonding pads using at least one of vias and a Redistribution Layer (RDL). The vertical LED device further includes a first insulating film on a side of the carrier structure proximal the epi structure and a second insulating film on a side of the carrier structure distal the epi structure. | 01-24-2013 |
| 20130020590 | LIGHT EMITTING DEVICES AND COMPONENTS HAVING EXCELLENT CHEMICAL RESISTANCE AND RELATED METHODS - Light emitting devices and components having excellent chemical resistance and related methods are disclosed. In one embodiment, a component of a light emitting device can include a silver (Ag) portion, which can be silver on a substrate, and a protective layer disposed over the Ag portion. The protective layer can at least partially include an inorganic material for increasing the chemical resistance of the Ag portion. | 01-24-2013 |
| 20130020591 | DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A display substrate includes first, second, and third insulating layers in a display area thereof. The first and third insulating layers are in not only the display area but also a pad area adjacent to the display area and including a pad therein. Thus, defects of the display panel may be reduced. | 01-24-2013 |
| 20130020592 | LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE ARRAY, OPTICAL RECORDING HEAD, IMAGE FORMING APPARATUS, AND METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE - Provided is a light-emitting device including a semiconductor substrate of a first conductivity type, a semiconductor multilayer reflection mirror of the first conductivity type, formed on the semiconductor substrate, a first semiconductor layer of the first conductivity type, formed on the semiconductor multilayer reflection mirror, a second semiconductor layer of a second conductivity type, formed on the first semiconductor layer, a third semiconductor layer of the first conductivity type, formed on the second semiconductor layer, a fourth semiconductor layer of the second conductivity type, formed on the third semiconductor layer, a first electrode formed on a rear surface of the semiconductor substrate, and a second electrode formed on the fourth semiconductor layer, wherein the semiconductor multilayer reflection mirror includes a first selectively oxidized region and a first conductive region adjacent to the first oxidized region, and the first conductive region electrically connects the semiconductor substrate and the first semiconductor layer. | 01-24-2013 |
| 20130020593 | AC LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME - The present invention relates to a light emitting device, including a plurality of light guide portions, a reflection prevention substance disposed on an inclined surface of each light guide portion of the plurality of light guide portions, and a plurality light emitting regions. Each light emitting region includes a first-type semiconductor layer, a second-type semiconductor layer, and an active layer disposed between the first-type semiconductor layer and the second-type semiconductor layer. Each light guide portion of the plurality of light guide portions is surrounded by light emitting regions of the plurality of light emitting regions. | 01-24-2013 |
| 20130020594 | SEMICONDUCTOR TEMPLATE SUBSTRATE, LIGHT-EMITTING ELEMENT USING A SEMICONDUCTOR TEMPLATE SUBSTRATE, AND A PRODUCTION METHOD THEREFOR - A light-emitting device includes a semiconductor layer, a light-emitting stack structure formed on a first surface of the semiconductor layer, and a plurality of inverted pyramid structures formed on a second surface of the semiconductor layer opposite to the first surface. Each of the inverted pyramid structures has a sectional area increasing as each of the inverted pyramid structures is more extended in a vertical direction from the second surface. | 01-24-2013 |
| 20130026499 | WAFER-LEVEL PACKAGING FOR SOLID-STATE TRANSDUCERS AND ASSOCIATED SYSTEMS AND METHODS - Wafer-level packaging of solid-state transducers (“SSTs”) is disclosed herein. A method in accordance with a particular embodiment includes forming a transducer structure having a first surface and a second surface opposite the first surface, and forming a plurality of separators that extend from at least the first surface of the transducer structure to beyond the second surface. The separators can demarcate lateral dimensions of individual SSTs. The method can further include forming a support substrate on the first surface of the transducer structure, and forming a plurality of discrete optical elements on the second surface of the transducer structure. The separators can form barriers between the discrete optical elements. The method can still further include dicing the SSTs along the separators. Associated SST devices and systems are also disclosed herein. | 01-31-2013 |
| 20130026500 | LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM USING THE SAME - A light emitting device package of the embodiment includes a body including cavities; first and second lead electrodes disposed in the cavity of the body; a light emitting device disposed in the cavities, electrically connected to at least one of the first and second lead electrodes and emitting a first main peak wavelength in the range of 410˜460 nm; and a first resin layer having first phosphor on the light emitting device, wherein the first phosphor of the first resin layer emits light of a second main peak wavelength in the range of 461 nm˜480 nm by exciting some light having the first main peak wavelength, and the first and second main peak wavelengths have the wavelength different from each other and contain the light having the same color. | 01-31-2013 |
| 20130026501 | TOUCH DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - The present invention discloses a touch display device and a manufacturing method thereof, the display device comprising: an OLED display layer disposed on a lower substrate; an upper substrate; an air layer formed between the upper substrate and the lower substrate; and a touch module, disposed above the OLED display layer, wherein the touch module comprises: a first sensing circuit layer and a second sensing circuit layer, further wherein the first sensing circuit layer and the second sensing circuit layer are spaced and the distance between them is more than 2 um. The display device can reduce interference in detection circuit caused by coupling capacitance formed between the sensing circuit layers thereby improving accuracy of touch detection. | 01-31-2013 |
| 20130026502 | LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING SYSTEM - A light emitting device package according to the embodiment includes a body having a cavity; at least one light emitting device in the cavity; a resin member filled in the cavity while covering the light emitting device; and a fluorescence sheet coupled with a top surface of the body such that the fluorescence sheet is physically separable from the top surface of the body, and including a fluorescence material for converting light emitted from the light emitting device into another light. | 01-31-2013 |
| 20130026503 | LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - An organic light emitting diode (OLED) display includes a substrate, an OLED on the substrate, and an encapsulation layer on the substrate with the OLED therebetween. The encapsulation layer includes a plurality of metal layers. Two of the plurality of metal layers are directly attached to each other. | 01-31-2013 |
| 20130026504 | LIGHTING DEVICE UTILIZING LIGHT ACTIVE SHEET MATERIAL WITH INTEGRATED LIGHT EMITTING DIODE, DISPOSED IN SEAM AND/OR IN LOW PROFILE APPLICATION - A light source includes a substrate arranged into at least two facing surfaces which form a seam therebetween; and a lighting device with light emitting diode (LED) chips embedded therein in a linear arrangement. The LED chips generate light photons. The lighting device has a first edge and a second edge opposite to the first edge, the light photons within the lighting device that are emitted by the LED chips from a top surface of the LED chips being output from the lighting device at the second edge of the device. The lighting device is sandwiched in the seam between the two facing surfaces, the second edge of the lighting device being exposed when the seam is in an opened position. | 01-31-2013 |
| 20130026505 | LARGE AREA ORGANIC LIGHT EMITTING DIODE DISPLAY - The invention relates to a large area organic light emitting diode display having a uniformed luminescence throughout the display area. The invention suggests an organic light emitting diode display comprising a thin film transistor substrate including a thin film transistor, a driving current line to supply an electric signal to the thin film transistor, a driving line contact hole to expose some portions of the driving current line, and an organic light emitting diode connected to the thin film transistor; a cap including a cap substrate and an auxiliary electrode disposed on a surface of the cap substrate with an area that is at least ⅓ of an area of the cap substrate; a conductive sealing material to electrically connect the auxiliary electrode and the driving current line through the driving line contact hole; and an organic adhesive joining the thin film transistor substrate and the cap. | 01-31-2013 |
| 20130026506 | LIGHTING DEVICES WITH PRESCRIBED COLOUR EMISSION - Optical conversion layers based on semiconductor nanoparticles for use in lighting devices, and lighting devices including same. In various embodiments, spherical core/shell seeded nanoparticles (SNPs) or nanorod seeded nanoparticles (RSNPs) are used to form conversion layers with superior combinations of high optical density (OD), low re-absorbance and small FRET. In some embodiments, the SNPs or RSNPs form conversion layers without a host matrix. In some embodiments, the SNPs or RSNPs are embedded in a host matrix such as polymers or silicone. The conversion layers can be made extremely thin, while exhibiting the superior combinations of optical properties. Lighting devices including SNP or RSNP-based conversion layers exhibit energetically efficient superior prescribed colour emission | 01-31-2013 |
| 20130026507 | MULTICHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body. | 01-31-2013 |
| 20130026508 | LED MODULE WITH PASSIVE LED - An LED module ( | 01-31-2013 |
| 20130026509 | THREE-DIMENSIONAL LED SUBSTRATE AND LED LIGHTING DEVICE - The invention includes one or more LED elements, a silicon substrate on which the LED elements are mounted via micro bumps and internally formed wiring is connected to the micro bumps, a heat insulation organic substrate which is stuck to the opposite side of the LED elements-mounting side of the silicon substrate and has through-holes in which the wiring goes through, a chip-mounting substrate which is stuck to the opposite side of the silicon substrate side of the heat insulation organic substrate and internally formed wiring is connected to wiring in the through-holes of the heat insulation organic substrate, and an LED control circuit chip which is connected to the wiring of the chip-mounting substrate via micro bumps, and mounted via the micro bumps on the opposite side of the heat insulation organic substrate side of the chip-mounting substrate. | 01-31-2013 |
| 20130032825 | Resonant Optical Cavity Semiconductor Light Emitting Device - The present invention is a light emitting device apparatus and method of fabrication. The structure employs a waveguide in the lateral (x) direction formed via materials index, resonant wavelength and/or current-induced index changes. In the vertical (y) direction a resonant optical cavity is formed via distributed Bragg reflector and/or metal mirrors with sufficient reflectivity so as to create a substantial standing wave. The light is thereby constricted to propagate in the longitudinal (z) direction. A tapered output section may be employed to suppress lasing in the longitudinal direction or to losslessly transfer the light from the confined section to a resonant output coupler. Conversely, feedback may be employed to induce lasing in the longitudinal direction by suitable means, such as a periodic variation in the material index, resonant wavelength, gain or loss. The resonant output coupler may be formed by suitable means, such as mirror or cavity modulation. | 02-07-2013 |
| 20130032826 | Integrated Apparatus Including Driver Chips, a Power Supply and LED Chips on an Isolative Substrate - Disclosed is an integrated apparatus including an isolative substrate, a plurality of driver chips provided on a side of the isolative substrate, a power supply provided on the side of the isolative substrate and electrically connected to the driver chips, and LED chips provided on another side of the isolative substrate and electrically connected to the driver chips. Thus, the driver chips, the power supply and the LED chips are integrated on the isolative substrate. The production is easy. The integrated apparatus is not vulnerable to surges and lightning strikes. Electromagnetic interferences are reduced. Heat radiation of the integrated apparatus is excellent so that the LED chips are protected from thermal effect. | 02-07-2013 |
| 20130032827 | DISPLAY SUBSTRATE, METHOD OF MANUFACTURING A DISPLAY SUBSTRATE AND LIQUID CRYSTAL DISPLAY DEVICE HAVING A DISPLAY SUBSTRATE - A display substrate for a display device includes a substrate, a switching device, a gate line, a data line, a pixel electrode, a plurality of common electrodes. The switching device includes an active pattern, a gate insulation layer, a gate electrode, a source electrode and a drain electrode. The gate line is electrically connected to the source electrode, and the data line is electrically coupled to the gate electrode. The pixel electrode is electrically connected to the drain electrode, and the common electrodes are disposed on the pixel electrode. A coupling capacitance among the common electrodes and the data line can be prevented and/or reduced to prevent a signal delay of the data line. Further, an aperture ratio of the display substrate can be improved by changing a layout of the data line and the gate line. | 02-07-2013 |
| 20130032828 | LED LIGHT STRIP MODULE STRUCTURE - A LED light strip module structure includes a substrate and LED dies. The substrate has first and second surfaces. Accommodating cavities are formed on the first surface and extend toward the second surface. Each accommodating cavity has a bottom surface. Bonding metal layers are respectively attached to the bottom surfaces of the accommodating cavities. The LED die includes a crystal layer and a combination metal layer combined together. The LED dies are disposed in the accommodating cavities, respectively, so that the combination metal layer and the bonding metal layer form eutectic bonding. In addition, a diamond film layer may be disposed between the crystal layer and the combination metal layer, so that the LED die and the substrate can possess the stable and secure positioning effect and the thermoconductive speed and effect can be enhanced to lengthen the lifetime of the LED die through the diamond film layer. | 02-07-2013 |
| 20130032829 | DEPOSITION SOURCE ASSEMBLY, ORGANIC LAYER DEPOSITION APPARATUS, AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY APPARATUS BY USING THE ORGANIC LAYER DEPOSITION APPARATUS - An organic layer deposition apparatus, and a method of manufacturing an organic light-emitting display device by using the organic layer deposition apparatus. Here, the organic layer deposition apparatus includes a deposition source assembly. The deposition source assembly includes a first deposition source for discharging a deposition material, a second deposition material stacked on the first deposition source and discharging a different deposition material than the deposition material discharged from the first deposition source, a second deposition source nozzle unit disposed at a side of the second deposition source to face a deposition target and including a plurality of second deposition source nozzles, and a first deposition source nozzle unit disposed at the side of the second deposition source to face the deposition target and including a plurality of first deposition source nozzles formed to pass through the second deposition source. | 02-07-2013 |
| 20130032830 | ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - Discussed are an organic light emitting display device and a method of manufacturing the same in which organic and inorganic films are formed on a polarization plate, and the polarization plate is attached to an organic light emitting panel so that the organic and inorganic films seal the organic light emitting panel, thereby achieving improved polarization and a simple sealing structure. | 02-07-2013 |
| 20130032831 | ORGANIC LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING - Aspects of the present disclosure provide for manufacturing an organic light emitting diode (OLED) by forming two terminals of the OLED on two substrates of the display, and then depositing a plurality of layers of the OLED on one or both of the two terminals to form a first portion and a second portion of the OLED on each substrate. The two portions are joined together to form an assembled OLED. The deposition of the two portions can be stopped with each portion having approximately half of a common layer exposed. The two portions can then be aligned to be joined together and an annealing process can be employed to join together the two parts of the common layer and thereby form the OLED. | 02-07-2013 |
| 20130032832 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE - A display device includes an electrode layer formed at a predetermined position on a substrate, an insulating film having a through-hole formed on the top of the electrode layer, and a wiring film connected to the electrode layer via the through-hole formed in the insulating film. Based on a surface of the substrate, the through-hole includes a first taper portion having a first taper angle, a second taper portion formed higher than the first taper portion and having a second taper angle different from the first taper angle, and a third taper portion formed higher than the second taper portion and having a third taper angle different from the second taper angle. | 02-07-2013 |
| 20130032833 | LED MODULE AND LED LAMP HAVING THE LED MODULE - An LED module includes a first dielectric layer, and a first patterned conductive layer having first, second, and third die-bonding pads. Each die-bonding pad includes a pad body having a die-bonding area, and an extension extended from the pad body. The extension of the first die-bonding pad extends in proximity to the die-bonding area of the second die-bonding pad. The extension of the second die-bonding pad extends in proximity to the die-bonding area of the third die-bonding cad. A second dielectric layer disposed on the first patterned conductive layer includes three dielectric members corresponding respectively to the die-bonding pads of the first patterned conductive layer. Each dielectric member includes a chip-receiving hole exposing the die-bonding area of a respective die-bonding pad for attachment of an LED chip thereto, and a wire-passage hole spaced apart from the chip-receiving hole to expose partially the first patterned conductive layer for bonding a wire. | 02-07-2013 |
| 20130037827 | OLED LIGHT PANEL WITH CONTROLLED BRIGHTNESS VARIATION - Embodiments may provide a light source with a controlled brightness variation. A first device is provided that includes a substrate and a plurality of OLEDs disposed on the substrate. Each of the OLEDs includes a first electrode, a second electrode, and an organic electroluminescent (EL) material disposed between the first and the second electrodes. The plurality of OLEDs comprise a first group and a second group where a first current density is supplied to the first group of the plurality of OLEDs and a second current density that is different from the first current density is supplied to the second group of the plurality of OLEDs. Each of the plurality of OLEDs is commonly addressable and at least one of the OLEDs in the first group of OLEDs has substantially the same device structure as at least one of the OLEDs in the second group of OLEDs. | 02-14-2013 |
| 20130037828 | ORGANIC LIGHT-EMITTING DISPLAY AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display and a method of manufacturing the organic light-emitting display are disclosed. In one embodiment, the organic light-emitting display includes: i) a pixel electrode disposed on a substrate, ii) an opposite electrode disposed opposite to the pixel electrode, iii) an organic emission layer disposed between the pixel electrode and the opposite electrode; a light-scattering portion disposed between the substrate and the organic emission layer, including a plurality of scattering patterns for scattering light emitted from the organic emission layer in insulating layers having different refractive indexes. The display may further include a plurality of light absorption portions disposed between the light-scattering portion and the organic emission layer to correspond to the scattering patterns. | 02-14-2013 |
| 20130037829 | DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A display substrate includes a base substrate; a first metal pattern disposed on the base substrate and comprising a first signal line and a first electrode electrically connected to the first signal line; and a buffer pattern disposed at a corner between a sidewall surface of the first metal pattern and the base substrate. | 02-14-2013 |
| 20130037830 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode package includes a heat-dissipating substrate including a reflective groove having a lower bottom surface, an upper opening having a width greater than the lower bottom surface, and an inclined surface formed between the upper opening and the lower bottom surface and mounting grooves, each formed in the reflective groove and having a lower bottom surface, an upper opening having a width greater than the lower bottom surface, and an inclined surface formed between the upper opening and the lower bottom surface; an insulating layer selectively formed on the heat-dissipating substrate; wiring pattern layers formed on the insulating layer and extending to bottom surfaces of the mounting grooves to be selectively formed thereon; a light emitting diode chip mounted in each of the mounting grooves; and a molding layer formed around the light emitting diode chip. | 02-14-2013 |
| 20130037831 | Opto-Electronic Module and Method for Manufacturing The Same - A method for manufacturing a device that includes an opto-electronic module includes creating a wafer stack including multiple active optical components mounted on a substrate wafer, and an optics wafer including multiple passive optical components. The optics wafer can include a blocking portion, which is substantially non-transparent for at least a specific wavelength range, and a transparent portion, which is substantially non-transparent for the specific wavelength range. Each opto-electronic module includes a substrate member, an optics member, an active optical component mounted on the substrate member, and a passive optical component. The optics member is directly or indirectly fixed to the substrate member. The opto-electronic modules can have excellent manufacturability, small dimensions and high alignment accuracy. | 02-14-2013 |
| 20130037832 | FOLDABLE DISPLAY STRUCTURES - One embodiment provides a structure, comprising: a display; at least one structural component disposed over a portion of the display, wherein the at least on structural component comprises at least one amorphous alloy; and wherein a portion of the display is foldable. | 02-14-2013 |
| 20130037833 | Optical Device and Method for Manufacturing Same - The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate. | 02-14-2013 |
| 20130037834 | LIGHT EMITTING ELEMENT MODULE SUBSTRATE, LIGHT EMITTING ELEMENT MODULE, AND ILLUMINATING DEVICE - According to an aspect of the invention, there is provided a light emitting element module substrate including: a laminated plate; and a metal layer. The laminated plate includes a base metal plate and an insulating layer provided on the base metal plate. The metal layer is provided on the insulating layer. The metal layer includes a mounting section on which a light emitting element is to be mounted, and a bonding section to which a wiring electrically connected to the light emitting element is to be bonded. The metal layer includes a silver layer which is an uppermost layer of at least one of the mounting section and the bonding section and is formed by electrolytic plating. The mounting section and the bonding section are electrically isolated from a periphery of the laminated plate. | 02-14-2013 |
| 20130043493 | LIGHT-EMITTING DIODE STRUCTURE - A light-emitting diode (LED) structure includes a substrate, a plurality of LED chips, a first colloid, a second colloid, and a lens. The substrate is provided with at least one retaining section, and the LED chips are mounted on the substrate and covered by the first colloid. The second colloid is located to one side of the first colloid opposite to the substrate. The lens is provided with at least one catching section correspondingly engaged with the at least one retaining section, so that the lens is connected to the substrate to form a unitary body through engagement of the catching section with the retaining section and closes the LED chips, the first colloid and the second colloid in between the lens and the substrate. With these arrangements, the LED structure can have upgraded lighting efficiency and allows quick change of LED color temperature or LED beam angle. | 02-21-2013 |
| 20130043494 | LIGHT EMITTING DIODE PACKAGE - The present invention relates to a light emitting diode package which can reduce a wire length, and can improve heat and light resistance. The light emitting diode package includes a molded portion having a housing, a plurality of light emitting chips housed in the housing, a plurality of main lead portions having the plurality of light emitting chips mounted thereto respectively, at least one sub-lead portion formed spaced from the main lead portions and electrically connected to at least any one of the plurality of main lead portions and the plurality of light emitting chips with a wire for electrically connecting the plurality of light emitting chips each other. | 02-21-2013 |
| 20130043495 | ACTIVE MATRIX SUBSTRATE AND DISPLAY DEVICE - The present invention provides an active matrix substrate in which a peripheral can be narrowed or a gap between adjacent wirings increased to improve a yield. The present invention is an active matrix substrate in which a peripheral region is provided outside a display region. In the active matrix substrate, a first, a second, and a third transistor, a floating wiring, a switching wiring, a main wiring, and a branch wiring electrically connected with the main wiring are arranged in the peripheral region. The floating wiring and branch wiring each electrically connect the first and second transistors and comprise an intersecting portion intersecting with the switching wiring, with the third transistor being provided at the intersecting portion. A gate electrode of the third transistor includes the switching wiring, one of a source electrode and a drain electrode thereof includes the branch wiring, and the other of the source electrode and the drain electrode includes the floating wiring. | 02-21-2013 |
| 20130043496 | LIGHTING DEVICE - A lighting device with front carrier, rear carrier and plurality of light-emitting diode chips, which when in operation emits light and releases waste heat, wherein rear carrier is covered at least in selected locations by front carrier, light-emitting diode chips are arranged between rear carrier and front carrier to form array, light-emitting diodes are contacted electrically by rear and/or front carrier and immobilized mechanically by rear carrier and front carrier, front carrier is coupled thermally conductively to light-emitting diode chips and includes light outcoupling face remote from light-emitting diode chips, which light outcoupling face releases some of waste heat released by light-emitting diode chips into surrounding environment, each light-emitting diode chip is actuated with electrical nominal power of 100 mW or less when lighting device is in operation and has light yield of 100 lm/W or more. | 02-21-2013 |
| 20130043497 | Packaging Device for Matrix-Arrayed Semiconductor Light-Emitting Elements of High Power and High Directivity - A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two. | 02-21-2013 |
| 20130049023 | LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM - Disclosed are a light emitting device package and a lighting system. The light emitting device package includes a body including a cavity, at least one light emitting device in the cavity, a resin member filled in the cavity while covering the light emitting device, and a reflective layer on a lateral side of the cavity. The reflective layer is formed while opening the upper region of the cavity. The reflective layer is selectively formed only in a lower region of the lateral side of the cavity in the body, and the resin member, which is filled in the upper portion of the cavity, directly adheres to the body. The air-tightness between the resin member and the body is improved. | 02-28-2013 |
| 20130049024 | ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE - An OLED device adapted to enhance reliability and light-emitting efficiency is disclosed. The disclosed OLED device includes: a first electrode; an emission layer formed on the first electrode; a second electrode formed on the emission layer; and an electron injection layer disposed on the emission layer, configure to be in contact with the second electrode and in a single layer which is formed from a mixture of an inorganic compound and a metal material with a low work function. | 02-28-2013 |
| 20130049025 | LED PACKAGE DEVICE - An LED package device having a dam located on a substrate is provided, by which two regions are defined on the substrate. Two LED dies are respectively disposed on the two regions and separated by the dam; therefore, the LED package device has an enhanced intensity of the lateral-emitting light and a wide light emitting angle. The LED package devices can be used in backlight units to prevent mura and hot spot issues. | 02-28-2013 |
| 20130049026 | SEMICONDUCTOR ELEMENT AND DISPLAY DEVICE USING THE SAME - A semiconductor having an active layer; a gate insulating film in contact with the semiconductor; a gate electrode opposite to the active layer through the gate insulating film; a first nitride insulating film formed over the active layer; a photosensitive organic resin film formed on the first nitride insulating film; a second nitride insulating film formed on the photosensitive organic resin film; and a wiring provided on the second, nitride insulating film. A first opening portion is provided in the photosensitive organic resin film, an inner wall surface of the first opening portion is covered with the second nitride insulating film, a second opening portion is provided in a laminate including the gate insulating film, the first nitride insulating film, and the second nitride insulating film inside the first opening portion, and the semiconductor is connected with the wiring through the first opening portion and the second opening portion. | 02-28-2013 |
| 20130049029 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display device includes a gate electrode, a source electrode, and a drain electrode on a substrate, a gate interconnection line connected to the gate electrode, a source and drain interconnection line connected to the source and drain electrodes, a first test pad electrically connected to the source and drain interconnection line, and a second test pad electrically connected to the gate interconnection line. The second test pad is at a same level as the first test pad, and the gate electrode is on a different layer than the source and drain electrodes. | 02-28-2013 |
| 20130049030 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE - A light emitting device according to the embodiment includes a first light emitting structure including a first conductive type first semiconductor layer, a first active layer under the first conductive type first semiconductor layer, and a second conductive type second semiconductor layer under the first active layer; a first reflective electrode under the first light emitting structure; a second light emitting structure including a first conductive type third semiconductor layer, a second active layer under the first conductive type third semiconductor layer, and a second conductive type fourth semiconductor layer under the second active layer; a second reflective electrode under the second light emitting structure; a contact part that electrically connects the first conductive type first semiconductor layer of the first light emitting structure to the second reflective electrode; and a first insulating ion implantation layer between the contact part and the second conductive type second semiconductor layer. | 02-28-2013 |
| 20130049031 | LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE, AND LAMP - A light-emitting device which emits light omnidirectionally is provided. A light-emitting device according to the present invention includes: a package which is translucent; an LED provided in a recess in the package; and a sealing member for sealing the LED and packaging the recess; and the recess includes a bottom surface on which the LED is mounted and a side surface surrounding a bottom surface, and light emitted by the LED is transmitted inside the package through the bottom surface and the side surface of the recess and is emitted to outside of the package from the back surface and the side surface of the package. | 02-28-2013 |
| 20130049032 | ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE, METHOD OF MANUFACTURING ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE, AND ELECTRONIC SYSTEM - An organic electroluminescence display device includes: a light emission region including a plurality of pixels on a drive substrate, wherein each of the pixels includes, in order from a side close to the drive substrate, a first electrode, a functional layer, and a second electrode, the first electrode is provided for each of the pixels, and the functional layer includes at least an organic electroluminescence layer; a print pattern layer included in the functional layer and formed individually for each of the pixels; and a protrusion provided on the drive substrate and protruding further than any layer provided between the print pattern layer and the drive substrate. | 02-28-2013 |
| 20130049033 | LIGHT EMITTING DIODE PACKAGE ARRAY AND METHOD FOR FABRICATING LIGHT EMITTING DIODE PACKAGE - A light emitting diode (LED) package includes: an array substrate; a plurality of LEDs mounted on the array substrate and arranged in rows and columns; a plurality of wavelength conversion units disposed in a light path of light emitted from each of the plurality of LEDs to convert the wavelength thereof; a plurality of first inspection terminals formed on the array substrate and electrically connected to LEDs in the same rows, among the plurality of LEDs; and a plurality of second inspection terminals formed on the array substrate and electrically connected to LEDs in the same columns, among the plurality of LEDs. | 02-28-2013 |
| 20130049034 | LIGHT-EMITTING DEVICE - This disclosure discloses a light-emitting device. The light-emitting device comprises: a substrate; a first light-emitting stack comprising a first active layer; a bonding interface formed between the substrate and the first light-emitting stack; and a contact structure formed between the first light-emitting stack and the bonding interface and comprising a first contact layer and a second contact layer closer to the bonding interface than the first contact layer; wherein the first contact layer and the second contact layer comprises the same material and the first contact layer has an impurity concentration lower than that of the second contact layer. | 02-28-2013 |
| 20130056756 | LIGHT-TRANSMISSIVE MEMBER, OPTICAL DEVICE, AND MANUFACTURING METHODS THEREOF - A light-transmissive member has a first principal face, a second principal face, and side faces. The first principal face has a first portion including a center of the first principal face and a second portion between the first portion and the side face sides. The member includes a plurality of altered portions formed between the first principal face and the second principal face so that the plurality of altered portions do not appear on the first principal face, the second principal face, and the side faces. Orthogonal projections of the plurality of altered portions onto the first principal face are included in the second portion. | 03-07-2013 |
| 20130056757 | LED ARRAY CAPABLE OF REDUCING UNEVEN BRIGHTNESS DISTRIBUTION - A light emitting element in use for an LED array comprises an electrode layer, a semiconductor light emitting layer consisting of a p-type semiconductor layer, an active layer and an n-type semiconductor layer, a first wiring layer formed along and in parallel to one side of the semiconductor light emitting layer, and a plurality of second wiring layers extending from the first wiring layer to the semiconductor light emitting layer and electrically connected to the n-type semiconductor layer on a surface of the semiconductor light emitting layer, wherein a plane shape of the semiconductor light emitting layer comprises two short sides including a portion inclined from a line perpendicular to a upper and a lower sides, and a vertical line from a vertex where the upper side and the short side meet crosses the lower side of the adjacent light emitting element. | 03-07-2013 |
| 20130056758 | METHOD AND APPARATUS FOR THIN FILM MODULE WITH DOTTED INTERCONNECTS AND VIAS - A method to fabricate monolithically-integrated optoelectronic module apparatuses ( | 03-07-2013 |
| 20130056759 | Packaging Device for Matrix-Arrayed Semiconductor Light-Emitting Elements of High Power and High Directivity - A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two. | 03-07-2013 |
| 20130056760 | PIXEL ARRAY SUBSTRATE - A pixel array substrate includes a pixel region and a circuit region adjacent to the pixel region. A plurality of display pixel units are disposed in the pixel region and a plurality of dummy pixel units are disposed in the circuit region. Each of the dummy pixel units includes a data line, a scan line, a plurality of switching elements and a plurality of pixel electrodes. The switching elements are electrically connected to the scan line and data line. The pixel electrodes are electrically connected to the switching elements. Particularly, electrostatic currents in the pixel region can be dissipated by the dummy pixel units in the circuit region. The dummy pixel units preserve the continuity of electricity in the pixel array substrate and function as an inner short ring. Therefore, the area of the circuit region on the pixel array substrate is larger. | 03-07-2013 |
| 20130056761 | PIXEL ARRAY SUBSTRATE - A pixel array substrate includes a pixel region and a circuit region adjacent to the pixel region. A plurality of display pixel units are disposed in the pixel region and a plurality of dummy pixel units are disposed in the circuit region. Each of the dummy pixel units includes a data line, a scan line, a plurality of switching elements and a plurality of pixel electrodes. The switching elements are electrically connected to the scan line and data line. The pixel electrodes are electrically connected to the switching elements. Particularly, electrostatic currents in the pixel region can be dissipated by the dummy pixel units in the circuit region. The dummy pixel units preserve the continuity of electricity in the pixel array substrate and function as an inner short ring. Therefore, the area of the circuit region on the pixel array substrate is larger. | 03-07-2013 |
| 20130056762 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A display device having a base substrate provided with light-emitting devices and terminal electrodes connected thereto; a sealing substrate disposed to face the base substrate; a first resin material between the base substrate and the sealing substrate so as to surround a first region in which the light-emitting devices are provided; and a second resin material between the base substrate and the sealing substrate and is filled in the first region surrounded by the first resin material so as to seal the light-emitting devices. | 03-07-2013 |
| 20130056763 | SEMICONDUCTOR DEVICE - An object is to provide a semiconductor device that can realize a function of a thyristor without complication of the process. A semiconductor device including a memory circuit that stores a predetermined potential by reset operation and initialization operation is provided with a circuit that rewrite data in the memory circuit in accordance with supply of a trigger signal. The semiconductor device has a structure in which a current flowing through the semiconductor device is supplied to a load by rewriting data in the memory circuit, and thus can function as a thyristor. | 03-07-2013 |
| 20130056764 | Display Device and Manufacturing Method Thereof - A display device in which light leakage in a monitor element portion is prevented without increasing the number of steps and cost is provided. The display device includes a monitor element for suppressing influence on a light-emitting element due to temperature change and change over time and a TFT for driving the monitor element, in which the TFT for driving the monitor element is provided so as not to overlap the monitor element. Furthermore, the display device includes a first light shielding film and a second light shielding film, in which the first light shielding film is provided so as to overlap a first electrode of the monitor element and the second light shielding film is electrically connect to the first light shielding film through a contact hole formed in an interlayer insulating film. The contact hole is formed so as to surround the outer edge of the first electrode of the monitor element. | 03-07-2013 |
| 20130056765 | LIGHT EMITTING DIODE LIGHT SOURCE INCLUDING ALL NITRIDE LIGHT EMITTING DIODES - A light source including at least two phosphor converted (pc) light emitting diodes (LEDs), each of the pc LEDs including an associated blue-emitting LED as an excitation source for a phosphor containing element. | 03-07-2013 |
| 20130056766 | SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SAME - Disclosed is a semiconductor device | 03-07-2013 |
| 20130062630 | OVERLAY CIRCUIT STRUCTURE FOR INTERCONNECTING LIGHT EMITTING SEMICONDUCTORS - A system and method for packaging light emitting semiconductors (LESs) is disclosed. An LES device is provided that includes a heatsink and an array of LES chips mounted on the heatsink and electrically connected thereto, with each LES chip comprising connection pads and a light emitting area configured to emit light therefrom responsive to a received electrical power. The LES device also includes a flexible interconnect structure positioned on and electrically connected to each LES chip to provide for controlLES operation of the array of LES chips, with the flexible interconnect structure further including a flexible dielectric film configured to conform to a shape of the heatsink and a metal interconnect structure formed on the flexible dielectric film and that extends through vias formed in the flexible dielectric film so as to be electrically connected to the connection pads of the LES chips. | 03-14-2013 |
| 20130062631 | LIGHT EMITTING STRUCTURE, LIGHT EMITTING MODULE, AND LIGHT EMITTING DEVICE - A light emitting module includes a carrier unit, a substrate unit, and a light emitting unit. The carrier unit includes at least one carrier body, and the carrier body has a mounting portion. The substrate unit includes at least one bendable substrate. The bendable substrate includes a plurality of substrate portions and a plurality of bending portions, the substrate portions are disposed on the mounting portion of the carrier body, and each bending portion is disposed between every two corresponding substrate portions. The light emitting unit includes a plurality of light emitting groups respectively disposed on the substrate portions, and each light emitting group includes at least one light emitting element electrically connected to each corresponding substrate portion. Because the substrate portions can be disposed on different planes after bending the substrate portions, thus light sources respectively generated by the light emitting elements can be projected toward different directions. | 03-14-2013 |
| 20130062632 | LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM INCLUDING THE SAME - Disclosed are a light emitting device package and a lighting system in which the light emitting device package includes a first cavity in a first region of the body, a second cavity in a second region of the body, first and second lead frames spaced apart from each other in the first cavity, a third lead frame spaced apart from the second lead frame in the second cavity, a first light emitting device on the first and second lead frames in the first cavity, a second light emitting device on the second and third lead frames in the second cavity, and a molding member in the first and second cavities. | 03-14-2013 |
| 20130062633 | LED Array Having Embedded LED and Method Therefor - A light emitting array comprises a submount having a top surface and a bottom surface, and at least one LED at least partially embedded within the submount. The top surface of the submount is in contact with at least a side surface of the at least one LED. The submount may include one or more parallel layers. An optical layer may be covering the at least one LED in such a way that light emitted from the at least one LED passes through the optical layer. | 03-14-2013 |
| 20130062634 | SOLID STATE LIGHT SOURCE MODULE AND ARRAY THEREOF - A solid state light source array including a transparent substrate and N rows of solid state light emitting element series is provided. Each row of the solid state light emitting element series includes M solid state light emitting elements connected in series, wherein N, M are integrals and N≧1, M≧2. Each of the solid state emitting elements includes a first type electrode pad and a second type electrode pad. The first and the M | 03-14-2013 |
| 20130062635 | DISPLAY AND ELECTRONIC UNIT - A display includes: a first region including first pixels configured of a single color; a second region including second pixels configured of a plurality of colors different from the single color, the second pixels having an organic layer including a common light emitting layer; and a dividing wall separating the first region from the second region. | 03-14-2013 |
| 20130069083 | DIFFERENTIAL UNTRAVIOLET CURING USING EXTERNAL OPTICAL ELEMENTS - A lighting module has an array of solid state light emitters, a package in which the array of solid state light emitters resides, the package having a window and an external optical element arranged adjacent the window, the external optical element having a coating, the coating forming an optical pattern when illuminated by light from the array of solid state light emitters. | 03-21-2013 |
| 20130069084 | MULTIPLE DIE LED AND LENS OPTICAL SYSTEM - A light emitting device includes a number of light emitting diode dies (LEDs) mounted on a shared submount and covered with a single lens element that includes a corresponding number of lens elements. The LEDs are separated from each other by a distance that is sufficient for lens element to include separate lens elements for each LED. The separation of the LEDs and lens elements may be configured to produce a desired amount of light on a target at a predefined distance. In one embodiment, the lens elements are approximately flat type lens elements, such as Fresnel, TIR, diffractive lens, photonic crystal type lenses, prism, or reflective lens. | 03-21-2013 |
| 20130069085 | Organic Light-Emitting Display Device and Method of Fabricating The Same - Disclosed is an organic light-emitting display device capable of preventing the occurrence of cracks at corner regions of an adhesive layer. The organic light-emitting display device includes a first substrate including a plurality of pixels and a second substrate. A thin film transistor (TFT) located at each pixel of the first substrate. A pixel electrode is also located at each pixel. An organic light-emitting unit that emits light is coupled to each pixel electrode. A common electrode is electrically coupled to each organic light-emitting unit. An adhesive layer is coupled to the common electrode. The adhesive layer attaches the first and second substrates. The corner regions of the adhesive layer are rounded in order to control the creation of cracks in the adhesive layer and thereby prevent moisture from entering the active area of the device. | 03-21-2013 |
| 20130069086 | METHOD FOR PRODUCING A PLURALITY OF OPTOELECTRONIC SEMICONDUCTOR CHIPS - A method for producing a plurality of optoelectronic semiconductor chips includes providing a carrier wafer having a first surface and a second surface opposite the first surface. wherein a plurality of individual component layer sequences spaced apart from one another in a lateral direction are applied on the first surface, the component layer sequences being separated from one another by separation trenches; introducing at least one crystal imperfection in at least one region of the carrier wafer which at least partly overlaps a separation trench in a vertical direction; singulating the carrier wafer along the at least one crystal imperfection into individual semiconductor. | 03-21-2013 |
| 20130069087 | MULTI-LAYER WIRING SUBSTRATE, ACTIVE MATRIX SUBSTRATE, IMAGE DISPLAY APPARATUS USING THE SAME, AND MULTI-LAYER WIRING SUBSTRATE MANUFACTURING METHOD - A multiple-layer wiring substrate having a first conductive layer; an interlayer insulating layer; and a second conductive layer is disclosed, wherein the interlayer insulating layer includes a material whose surface energy is changed by receiving energy, and has a first region which does not include a contact hole and a second region which is formed such that its surface energy is higher than that of the first region, wherein a region within the contact hole of the first conductive layer has surface energy which is higher than surface energy of the second region of the interlayer insulating layer, and wherein the second conductive layer is formed by laminating, wherein the second conductive layer is in contact with the second region of the interlayer insulating layer along the second region, and is connected to the first conductive layer via the contact hole. | 03-21-2013 |
| 20130069088 | LIGHT EMITTING DIODE WITH CONFORMAL SURFACE ELECTRICAL CONTACTS WITH GLASS ENCAPSULATION - An optoelectronic device (e.g., LED) comprising one or more conformal surface electrical contacts conforming to surfaces of the device; and a high refractive index glass partially or totally encapsulating the device and the conformal surface electrical contacts, wherein traditional wire bonds and/or bond pads are not used and the glass is a primary encapsulant for the device. | 03-21-2013 |
| 20130069089 | High Efficacy Semiconductor Light Emitting Devices Employing Remote Phosphor Configurations - A semiconductor light emitting apparatus a semiconductor light emitting device configured to emit light inside a hollow shell including wavelength conversion material dispersed therein or thereon. A semiconductor light emitting apparatus according to some embodiments is capable of generating in excess of 250 lumens per watt, and in some cases up to 270 lumens per watt. | 03-21-2013 |
| 20130075766 | THIN FILM TRANSISTOR DEVICE AND PIXEL STRUCTURE AND DRIVING CIRCUIT OF A DISPLAY PANEL - A thin film transistor device, disposed on a substrate, includes a gate electrode, a semiconductor channel layer, a gate insulating layer disposed between the gate electrode and the semiconductor channel layer, a source electrode and a drain electrode disposed at two opposite sides of the semiconductor channel layer and partially overlapping the semiconductor channel layer, respectively, a capacitor electrode at least partially overlapping the gate electrode, and a capacitor dielectric layer disposed between the capacitor electrode and the gate electrode. The capacitor electrode, the gate electrode and the capacitor dielectric layer form a capacitor device. | 03-28-2013 |
| 20130075767 | LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME - The light emitting device | 03-28-2013 |
| 20130075768 | Organic Light Emitting Diode Display Device and Method of Fabricating the Same - In an organic light emitting diode (OLED) display device and a method for fabricating the same, OLED pixels are patterned through a photolithography process, so a large area patterning can be performed and a fine pitch can be obtained, and an organic compound layer can be protected by forming a buffer layer of a metal oxide on an upper portion of the organic compound layer or patterning the organic compound layer by using a cathode as a mask, improving device efficiency. In addition, among red, green, and blue pixels, two pixels are patterned through a lift-off process and the other remaining one is deposited to be formed without patterning, the process can be simplified and efficiency can be increased. | 03-28-2013 |
| 20130082287 | Thin Film Transistor and Manufacturing Method thereof, Array Substrate, and Liquid Crystal Display Device - The present invention discloses a thin film transistor (TFT), a manufacturing method thereof, an array substrate, and a liquid crystal display (LCD) device. The TFT comprises a gate electrode and a source electrode. The gate electrode comprises a first metal layer block and a second metal layer block positioned on the first metal layer block. The thermal expansion coefficient of the second metal layer block is less than that of the first metal layer block. The top surface of the first metal layer block is in contact with the bottom surface of the second metal layer block, and the width of the top surface of the first metal layer block accords with that of the bottom surface of the second metal layer block. The present invention can prevent hillocks from being produced, and can effectively avoid the phenomenon of electricity leakage. | 04-04-2013 |
| 20130087812 | LIGHT-EMITTING DEVICE WITH A SPACER AT BOTTOM SURFACE - A light-emitting device having at least one spacer located at a bottom surface is disclosed. In two other embodiments, an electronic display system and an electronic system having such light-emitting device are disclosed. The light-emitting device comprises a plurality of leads, a light source die, and a body. The body encapsulates a portion of the plurality of leads and the light source die. The body has a least one side surface and a bottom surface. The at least one spacer is located at the bottom surface. In use, the light-emitting device is attached to a top surface of a substrate. The spacer is configured to create an air vent between the bottom surface and the top surface of the substrate when the light-emitting device is attached to, and the spacer is in contact with the substrate. | 04-11-2013 |
| 20130087813 | GROOVED PLATE FOR IMPROVED SOLDER BONDING - A metal plate on a multi-die LED emitter substrate or a metal plate on a metal-core printed circuit board (MCPCB) that attaches to the emitter substrate (or both plates) can be fabricated with a number of generally radial grooves, at least some of which extend to the peripheral edge of the plate. These grooves can provide channels that allow air to escape during solder-bonding processes, reducing the size and/or total area of solder voids and thereby improving thermal transfer between the emitter and the MCPCB. | 04-11-2013 |
| 20130087814 | LIGHT EMITTING DEVICE AND LIGHTING APPARATUS INCLUDING THE SAME - A light emitting device is disclosed. The disclosed light emitting device includes a light emitting structure including a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer, a second electrode layer disposed beneath the light emitting structure and electrically connected to the second-conductivity-type semiconductor layer, a first electrode layer including a main electrode disposed beneath the second electrode layer, and at least one contact electrode branching from the main electrode and extending through the second electrode layer, the second-conductivity-type semiconductor layer and the active layer, to contact the first-conductivity-type semiconductor layer, and an insulating layer interposed between the first electrode layer and the second electrode layer and between the first electrode layer and the light emitting structure. The first-conductivity-type semiconductor layer includes a first region and a second region having a smaller height than the first region, and the first region overlaps with the contact electrode. | 04-11-2013 |
| 20130087815 | HYBRID DISPLAY DEVICE - The disclosure provides a hybrid display device, comprising: a substrate, wherein the substrate comprises a first surface and a second surface; a TFT array layer formed on the first surface of the substrate; a first display device formed on the TFT array layer; and a second display device formed on the second surface of the substrate, wherein there exists a corresponding relationship between a dielectric constant (k) of the substrate and a thickness (t) of the substrate to drive at least one of the first display device and the second display device, or to drive both of the first display device and the second display device by the TFT array layer, especially the TFT array layer actively drive the first display device, the second display device or combinations thereof. The dielectric constant of the substrate is about 1-100 and the thickness of the substrate is about 0.1-60 μm. | 04-11-2013 |
| 20130087816 | ILLUMINATION DEVICE - An illumination device includes a base, a light-emitting module, a first layer, and a second layer. The light-emitting module is disposed on the base for generating a progressive-type light-emitting intensity. The first layer encapsulates the light-emitting module. The second layer encloses the first layer. The second layer has a progressive-type thickness corresponding to the progressive-type light-emitting intensity, and both the progressive-type light-emitting intensity and the progressive-type thickness are decreased or increased gradually, thus the progressive-type light-emitting intensity can be transformed into the same light-emitting intensity through the progressive-type thickness of the second layer. | 04-11-2013 |
| 20130092960 | Multi-Die LED Package - A light-emitting device comprising (a) a submount having front and back sides and including a ceramic layer; (b) an array of light-emitting diodes (LEDs) on the front side; and (c) a lens overmolded on the submount and covering the LED array. In some embodiments, the submount comprises at least two electrically-conductive contact pads on the front side, and each LED in the array is secured with respect to one of the contact pads. | 04-18-2013 |
| 20130092961 | LIGHT EMITTING DEVICE MODULE - According to example embodiments, a light emitting device (LED) module includes a substrate, a LED on the substrate, a first reflector on the substrate, and a phosphor structure contacting the first reflector. The first reflector may surround the LED from a plan view. The first reflector may have a width at a middle portion of the reflector that is smaller than a width at a bottom portion of the reflector. The LED module may obtain a desired view angle depending on various applications by adjusting a height of the first reflector and/or a difference between the height of first reflector and a height of a phosphor structure. | 04-18-2013 |
| 20130092962 | LIGHT EMITTING DEVICE (LED), MANUFACTURING METHOD THEREOF, AND LED MODULE USING THE SAME - A light emitting device (LED), a manufacturing method thereof, and an LED module using the same. The LED may include a first semiconductor layer, an active layer, and a second semiconductor layer formed sequentially on a light-transmitting substrate, a first electrode formed in a region exposed by removing a part of the first semiconductor layer, a second electrode formed on the second semiconductor layer, a passivation layer formed on the first electrode and the second electrode to expose a region of the first electrode and a region of the second electrode, a first bump formed in a first region including the first electrode exposed through the passivation layer, and extended to another region of the second electrode on which the passivation layer is formed, and a second bump formed in a second region including the second electrode exposed through the passivation layer. | 04-18-2013 |
| 20130092963 | SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND ELECTRONIC DEVICE - A load, a transistor which controls a current value supplied to the load, a capacitor, a power supply line, and first to third switches are provided. After a threshold voltage of the transistor is held by the capacitor, a potential in accordance with a video signal is inputted and a voltage that is the sum of the threshold voltage and the potential is held. Accordingly, variation in current value caused by variation in threshold voltage of the transistor can be suppressed. Therefore, a desired current can be supplied to a load such as a light emitting element. In addition, a display device with a high duty ratio can be provided by changing a potential of the power supply line. | 04-18-2013 |
| 20130099257 | LED PACKAGE WITH EFFICIENT ILLUMINATION - An LED package with efficient illumination includes a base, a plurality of LED chips, an enclosure and an optically transparent plate. The LED chips are placed on the base and are electrically connecting to the base. The enclosure is located on the surface of the base. The LED chips are enclosed by the enclosure. A plurality of grooves is uniformly formed on the surface of the optically transparent plate. A volume of silicone mixed with phosphor powder is injected into each of the grooves. Thus, when packaging the plurality of LED chips, it will reduce the usage amount of the phosphor powder of the optically transparent plate. | 04-25-2013 |
| 20130099258 | Organic Light Emitting Diode Display - An organic light emitting diode (OLED) display according to an exemplary embodiment of the invention includes: a display substrate including a plurality of pixel areas; a tilt layer formed on the display substrate of each of the plurality of pixel areas, and having a tilt angle with respect to the display substrate; a first electrode formed on the tilt layer; an organic emission layer formed on the first electrode; a second electrode formed on the organic emission layer; an encapsulation substrate disposed on the second electrode and in parallel with the display substrate; and a prism sheet formed on the encapsulation substrate and having a plurality of prisms. | 04-25-2013 |
| 20130099259 | HIGH-VOLTAGE LIGHT-EMITTING DEVICE - The present invention relates to a high-voltage light-emitting device suitable for light-emitting diode chip array module. The device comprises a set of light emitting diode chips, about 18-25 chips, deposited on a substrate by using a non-matrix arrangement. Through the adjustments, the high-voltage light-emitting device of the present invention has optimized luminous efficiency. | 04-25-2013 |
| 20130099260 | RESIST STRIPPING COMPOSITION AND METHOD OF STRIPPING RESIST USING THE SAME - Disclosed herein is a resist stripping composition, which has an excellent ability of stripping a residual resist remaining after dry or wet etching at the tune of forming patterns in a process of manufacturing a flat panel display substrate. | 04-25-2013 |
| 20130099261 | LIGHT EMITTING MODULE - In a light emitting module, a semiconductor light emitting element is mounted on a mounting board. A plated layer is provided on the surface of the mounting board so as to be electrically connected to the semiconductor light emitting element mounted on the mounting board. The plated layer has a power feeding portion and an element connection portion. The power feeding portion extends, of the surfaces of the mounting board, from the upper surface on which the semiconductor light emitting element is to be mounted to a stepped surface located below the upper surface, so that power can be fed, on the stepped surface, to the semiconductor light emitting element. The element connection portions are provided on the upper surface such that a plurality of the semiconductor light emitting elements mounted on the upper surface are connected together in series. | 04-25-2013 |
| 20130099262 | LIQUID CRYSTAL DISPLAY - A liquid crystal display according to an exemplary embodiment of the present invention includes a substrate, a plurality of pixels arranged in a matrix on the substrate where each pixel includes a switching element, a plurality of gate lines that are connected to the switching elements and extend in a row direction, and a gate driver that is connected to the gate lines and is formed on the substrate as an integrated circuit. In the liquid crystal display, the gate driver includes a first region and a second region that is not aligned with the first region. | 04-25-2013 |
| 20130105825 | LIGHT EMITTING DIODE ARRAY | 05-02-2013 |
| 20130105826 | DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | 05-02-2013 |
| 20130105827 | LIGHT EMITTING DEVICE | 05-02-2013 |
| 20130105828 | LIGHT EMITTING DEVICE | 05-02-2013 |
| 20130105829 | LED CHIP-BASED LIGHTING PRODUCTS AND METHODS OF BUILDING | 05-02-2013 |
| 20130105830 | Light Emitting Device | 05-02-2013 |
| 20130105831 | ARRAY SUBSTRATE AND COLOR FILTER SUBSTRATE OF DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | 05-02-2013 |
| 20130105832 | LEADFRAME LED LIGHTING ASSEMBLY | 05-02-2013 |
| 20130113000 | DISPLAY SUBSTRATES AND METHODS OF FABRICATING THE SAME - Display substrates are disclosed. In one aspect, display substrates include a first signal line, a second signal line, a first detour signal line and a second detour signal line. The first signal line includes a first region and a pair of second regions disposed on opposite sides of the first region. The pair of second regions are spaced apart from the first region. The second signal line crosses the first signal line. The second signal line includes a third region and a pair of fourth regions disposed on opposite sides of the third region. The pair of fourth regions are spaced apart from the third region. The first detour signal line electrically connects the pair of second regions to each other. The second detour signal line electrically connects the pair of fourth regions to each other. Related methods are also disclosed. | 05-09-2013 |
| 20130113001 | LED PACKAGE MODULE - An LED package module includes a circuit board, a metal board, a plurality of chips, a plurality of wires and a molding component. The metal board directly covers the whole upper surface of the circuit board, wherein the metal board is provided with a plurality of chip-mounting pads and a plurality of openings arranged adjacent to the chip-mounting pads so as to expose the wiring area of the circuit board. The chips are respectively arranged on each of the chip-mounting pads. The wires electrically connect chips and the wiring area of the circuit board. The molding component respectively covers each chip, wires and the wiring area. | 05-09-2013 |
| 20130113002 | LOW COST MOUNTING OF LEDs IN TL-RETROFIT TUBES - This invention relates to a lighting device comprising a light transmissive light outlet unit ( | 05-09-2013 |
| 20130119410 | WHITE LIGHT EMITTING DIODE (LED) LIGHTING DEVICE DRIVEN BY PULSE CURRENT - A white LED lighting device driven by a pulse current is provided, which consists of blue, violet or ultraviolet LED chips, blue afterglow luminescence materials A and yellow luminescence materials B. Wherein the weight ratio of the blue afterglow luminescence materials A to the yellow luminescence materials B is 10-70 wt %:30-90 wt %. The white LED lighting device drives the LED chips with a pulse current having a frequency of not less than 50 Hz. Because of using the afterglow luminescence materials, the light can be sustained when an excitation light source disappears, thereby eliminating the influence of LED light output fluctuation caused by current variation on the illumination. At the same time, the pulse current can keep the LED chips being at an intermittent work state, so as to overcome the problem of chip heating. | 05-16-2013 |
| 20130119411 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light emitting diode package structure includes a substrate, LED bare chips and a lens. The substrate has an upper surface, a lower surface and a side surface between the upper surface and the lower surface. The upper surface is provided with a circuit pattern. The side surface is provided with a groove. The LED bare chips are fixed on the upper surface and electrically connected with the circuit pattern. The lens covers the LED bare chips, the upper surface and the circuit pattern by an injection molding process so as to be inserted into the groove. With this arrangement, the connecting strength between the substrate and the lens can be enhanced, thereby achieving waterproof and anti-electrostatic effects. Further, material cost of the present invention is reduced greatly. | 05-16-2013 |
| 20130119412 | PIXEL CIRCUIT, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS - An electro-optical device formed on a semiconductor substrate, includes: a first transistor controlling a current level according to a voltage between a gate and a source; a second transistor electrically connected between a data line and the gate of the first transistor; a third transistor electrically connected between the gate and a drain of the first transistor; and a light-emitting element emitting light at a luminance according to the current level, in which one of a source and a drain of the second transistor and one of a source and a drain of the third transistor are formed by a common diffusion layer. | 05-16-2013 |
| 20130119413 | LIGHT-EMITTING ELEMENT, DISPLAY DEVICE, AND METHOD FOR PRODUCING LIGHT-EMITTING ELEMENT - A light-emitter including: a transparent first electrode; a charge injection transport layer; a light-emitting layer; and a transparent second electrode, layered in this order. The light-emitting layer is defined by a bank. The charge injection transport layer has a recessed structure including: an inner bottom surface in contact with a bottom surface of the light-emitting layer; and an inner side surface continuous with the inner bottom surface. The inner side surface includes: a lower edge continuous with the inner bottom surface; and an upper edge continuous with the lower edge. The upper edge is aligned with a bottom periphery of the bank, or has contact with a bottom surface of the bank. The charge injection transport layer has contact with a side surface of the light-emitting layer. | 05-16-2013 |
| 20130119414 | LIGHT-EMITTING DEVICES WITH VERTICAL LIGHT-EXTRACTION MECHANISM - A light-emitting device comprises a lattice structure to minimize the horizontal waveguide effect by reducing light traveling distance in the light-absorption medium of the light-emitting devices, and to enhance light extraction from the light-emitting layer. The lattice structure includes sidewalls and/or rods embedded in the light-absorption medium and dividing the light-absorption medium into a plurality of area units. The area units are completely isolated or partially separated from each other by the sidewalls. Also provided is a method of fabricating a light-emitting device that comprises a lattice structure, which lattice structure includes sidewalls and/or rods embedded in the light-absorption medium and dividing the light-absorption medium into a plurality of area units. | 05-16-2013 |
| 20130126913 | THIN MULTI-LAYER LED ARRAY ENGINE - A thin multi-layer LED array engine is provided, which includes a substrate having a phosphor layer and a silica gel protection layer formed thereon. The phosphor layer is disposed on LED dices and makes direct contact with the substrate, and the silica gel protection layer is disposed on the phosphor layer. The LED dices are covered with the phosphor layer, and thereby the phosphor particles in the phosphor layer can be uniformly dispersed around the LED dices, so that the narrow color temperature distribution can be achieved. Furthermore, the phosphor layer makes direct contacts with the substrate, and thereby heat generated in the phosphor layer can be effectively dissipated through the substrate, and thereby the reliability of the optical components can be increased. | 05-23-2013 |
| 20130126914 | HIGH-VOLTAGE AC LIGHT-EMITTING DIODE STRUCTURE - A high-voltage alternating current (AC) light-emitting diode (LED) structure is provided. The high-voltage AC LED structure includes a circuit substrate and a plurality of high-voltage LED (HV LED) chips. Each one of the HV LED chips includes a first substrate, an adhering layer, first ohmic contact layers, epi-layers, a first insulating layer, at least two first electrically conducting plates, at least two second electrically conducting plates, and a second substrate. The HV LED chips manufactured by a wafer-level process are coupled to the low-cost circuit substrate to produce the downsized high-voltage AC LED structure. | 05-23-2013 |
| 20130126915 | FLEXIBLE ACTIVE DEVICE ARRAY SUBSTRATE AND ORGANIC ELECTROLUMINESCENT DEVICE HAVING THE SAME - A flexible active device array substrate including a flexible substrate, an active device array layer, a barrier layer, and a plurality of pixel electrodes is provided. The active device array layer is disposed on the flexible substrate. The barrier layer covers the active device array layer. The barrier layer includes a plurality of organic material layers and a plurality of inorganic material layers. The organic material layers and the inorganic material layers are alternately stacked on the active device array layer. The pixel electrodes are disposed on the barrier layer, and each of the pixel electrodes is electrically connected to the active device array layer. | 05-23-2013 |
| 20130126916 | PACKAGE FOR MOUNTING ELECTRONIC COMPONENTS, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING THE PACKAGE - A package includes: a leadframe made of conductive material and on which the plurality of electronic components are to be mounted, the leadframe including a first surface and a second surface opposite to the first surface and including a plurality of elongate portions arranged in parallel to each other with a gap interposed between the adjacent elongate portions; a heat sink including a first surface and a second surface opposite to the first surface, wherein the leadframe is disposed above the heat sink such that the second surface of the leadframe faces the first surface of the heat sink; and a resin portion, wherein the leadframe and the heat sink are embedded in the resin portion such that the first surface of the leadframe and the second surface of the heat sink are exposed from the resin portion, respectively. | 05-23-2013 |
| 20130126917 | LIGHT EMITTING DIODES AND SUBSTRATES - A thin layer substrate has a plurality of micron sized electrically conductive whisker components which are arranged in parallel and extending from one surface of the substrate to another surface to provide electrically conductive paths though the substrate. Such a substrate may be usable for micron sized LEDs. | 05-23-2013 |
| 20130134445 | COMPLEX PRIMARY OPTICS AND METHODS OF FABRICATION - A light emitter package with primary optic and method of fabricating the same is disclosed that comprises a light emitter disposed on a surface. The package further comprises at least one intermediate element on the surface and at least partially surrounding the light emitter. Furthermore, an encapsulant is over the light emitter forming a primary optic. The intermediate element at least partially defines the shape of the primary optic. | 05-30-2013 |
| 20130134446 | COST-EFFECTIVE LED LIGHTING INSTRUMENT WITH GOOD LIGHT OUTPUT UNIFORMITY - The present disclosure involves a lighting instrument. The lighting instrument includes a board or substrate, for example, a printed circuit board. The lighting instrument also includes a plurality of light-emitting devices disposed on the substrate. The light-emitting devices may be light-emitting diode (LED) dies. The LED dies belong to a plurality of different bins. The bins are categorized based on the light output performance of the LED dies. In some embodiments, the LED dies may be binned based on the wavelength or radiant flux of the light output. The LED dies are distributed on the substrate according to a predefined pattern based on their bins. In some embodiments, the LED dies are bin-mixed in an interleaving manner. | 05-30-2013 |
| 20130134447 | LOW-LIGHT-EMITTING-ANGLE HIGH-LUMINANCE UV LED NAIL LAMP STRUCTURE AND LED LIGHT SOURCE MODULE THEREOF - A low-light-emitting-angle high-luminance ultraviolet (UV) light-emitting diode (LED) nail lamp structure and an LED light source module thereof are provided. The UV LED nail lamp structure includes a housing and an LED light source module. The LED light source module is provided in the housing and has a plurality of UV LEDs, wherein the light-emitting angle of each UV LED ranges between 25° and 80°. The UV LED nail lamp structure features high luminance and enhanced lighting effect. | 05-30-2013 |
| 20130134448 | LIGHT MODULE AND LIGHT COMPONENT THEREOF - A light component includes a printed circuit board and a plurality of lighting emitting diodes (LEDs). The printed circuit board has a metal substrate. The LEDs are disposed on the printed circuit board, wherein two opposite edges of the metal substrate protrude out and are bent towards the LEDs to form two metal clamps. | 05-30-2013 |
| 20130134449 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF - A display panel includes a substrate, a plurality of bottom electrodes, an isolation layer, a plurality of light emitting layers, a top electrode, and at least one first auxiliary electrode. The bottom electrodes and the isolation layer are disposed on the substrate. The isolation layer has a plurality of pixel region openings and at least one buffer region. Each of the pixel region openings respectively exposes the corresponding bottom electrode. The buffer region is disposed between two adjacent pixel region openings. The light emitting layers are respectively disposed on the corresponding bottom electrodes. The top electrode covers the light emitting layers, the isolation layer, and the buffer region. The first auxiliary electrode is disposed in the buffer region. | 05-30-2013 |
| 20130134450 | ORGANIC LIGHT EMITTING DISPLAY APPARATUS - An organic light emitting display apparatus including sub pixels, each of the sub pixels including: first and second electrodes, the second electrode extending over the first electrode; and an intermediate layer disposed between the first and second electrodes, the intermediate layer including an emission layer, wherein a first portion of the first electrode, the second electrode, and the intermediate layer extends within a weak resonance region, the weak resonance region being configured to induce a first resonance of light generated by the emission layer between the first and second electrodes, and a second portion of the first electrode, the second electrode, and the intermediate layer extends within a strong resonance region, the strong resonance region being configured to induce a second resonance of light generated by the emission layer between the first and second electrodes, the second resonance being stronger than the first resonance. | 05-30-2013 |
| 20130134451 | Mask Assembly and Organic Light Emitting Diode Display Manufactured Using the Same - A mask assembly includes a frame forming an opening, and a plurality of unit masks which form a plurality of deposition openings, the longitudinal ends of the unit masks being fixed to the frame. At least two adjacent ones of the plurality of unit masks have deposition recesses formed on both sides facing each other. The width of the deposition recesses along a width direction of the unit masks is equal to or greater than the width of the deposition openings along the width direction of the unit masks. | 05-30-2013 |
| 20130134452 | DISPLAY DEVICE - Provided is a display device including: a substrate; and multiple pixels provided on the substrate, the pixels each having an organic EL element obtained by laminating a lower electrode provided on the substrate, an organic compound layer, and an upper electrode in the stated order, and the lower electrode including an electrode independently placed for each of the pixels, in which: the lower electrode is formed of a first lower electrode layer provided on the substrate and a second lower electrode layer provided on the first lower electrode layer; the organic compound layer and the upper electrode cover the first lower electrode layer and the second lower electrode layer; and charge injection property from the second lower electrode layer into the organic compound layer is larger than charge injection property from an end portion of the first lower electrode layer into the organic compound layer. | 05-30-2013 |
| 20130134453 | TRANSISTOR, METHOD OF MANUFACTURING TRANSISTOR, DISPLAY UNIT, AND ELECTRONIC APPARATUS - A transistor includes: a gate electrode; a semiconductor layer facing the gate electrode, with an insulating layer interposed in between; an etching stopper layer on the semiconductor layer; a pair of contact layers provided on the semiconductor layer, at least on both sides of the etching stopper layer; and source-drain electrodes electrically connected to the semiconductor layer through the pair of contact layers, and being in contact with the insulating layer. | 05-30-2013 |
| 20130134454 | WATER RESISTANT LED DEVICES AND AN LED DISPLAY INCLUDING SAME - The disclosure provides an LED package including a first plastic portion having a mounting surface and a lower surface. In some embodiments, the LED package includes a second portion surrounding the first plastic portion and exposing the mounting surface and the lower surface of the first plastic portion. In other embodiments, the first plastic portion includes at least one of a hole or a protrusion and the second portion includes corresponding structure filing the hole or surrounding the protrusion of the first plastic portion. The first plastic portion and the second portion have different optical properties. | 05-30-2013 |
| 20130134455 | SEMICONDUCTOR LIGHT EMISSION DEVICE, IMAGE FORMATION APPARATUS AND IMAGE DISPLAY APPARATUS - A semiconductor light emission device includes a substrate, and semiconductor light emission elements mounted on the substrate and each including an anode connection pad and a cathode connection pad. At least one of the anode connection pad and the cathode connection pad has a fine shaped portion. An image formation apparatus and an image display apparatus are described using the semiconductor light emission device. | 05-30-2013 |
| 20130140587 | POLARIZATION STRUCTURE, METHOD OF MANUFACTURING A POLARIZATION STRUCTURE AND ORGANIC LIGHT EMITTING DISPLAY DEVICE HAVING A POLARIZATION STRUCTURE - A polarization structure for a display device is disclosed. In one embodiment, the structure includes a retardation layer, a first polarizing layer, a first uniaxial optical compensation layer, a second polarizing layer and a second uniaxial optical compensation layer. The retardation layer may be configured to create a phase difference between two polarization components of an incident light. The first polarizing layer may be disposed on the retardation layer. The first uniaxial optical compensation layer may be disposed on the first polarizing layer. The second polarizing layer may be disposed on the first uniaxial optical compensation layer. The second uniaxial optical compensation layer may be disposed between the first polarizing layer and the first uniaxial optical compensation layer or between the first polarizing layer and the second polarizing layer. | 06-06-2013 |
| 20130140588 | LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME - Exemplary embodiments of the present invention disclose a light emitting diode (LED) and a method of fabricating the same. The LED includes a substrate, a semiconductor stack arranged on the substrate, the semiconductor stack including an upper semiconductor layer having a first conductivity type, an active layer, and a lower semiconductor layer having a second conductivity type, isolation trenches separating the semiconductor stack into a plurality of regions, connectors disposed between the substrate and the semiconductor stack, the connectors electrically connecting the plurality of regions to one another, and a distributed Bragg reflector (DBR) having a multi-layered structure, the DBR disposed between the semiconductor stack and the connectors. The connectors are electrically connected to the semiconductor stack through the DBR, and portions of the DBR are disposed between the isolation trenches and the connectors. | 06-06-2013 |
| 20130146900 | DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A display substrate includes a base substrate, a switching element, a protecting layer, an organic layer, a first pixel electrode and a second pixel electrode. The switching element is on the base substrate, and includes a gate electrode, a source electrode and a drain electrode. The protecting layer is on the switching element, and includes a first hole exposing the drain electrode. The organic layer is on the protecting layer, and includes a second hole which exposes a side surface of the protecting layer which defines the first hole and exposes a top surface of the protecting layer which is adjacent to the side surface of the protecting layer. The first pixel electrode is on the organic layer. The second pixel electrode overlaps the first pixel electrode, and is electrically connected to the drain electrode via the first and second holes. | 06-13-2013 |
| 20130146901 | COMPRESSION VOLUME COMPENSATION - A liquid-filled light emitting diode (LED) bulb including a base, a shell, one or more LEDs, a thermally conductive liquid, and a bladder. The shell is connected to the base and the thermally conductive liquid is held within the shell. The one or more LEDs are disposed within the shell and immersed in the thermally conductive liquid. The bladder is also immersed in the thermally conductive liquid and is configured to compensate for expansion of the thermally conductive liquid. | 06-13-2013 |
| 20130146902 | DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A display substrate includes a metal pattern, a first insulation layer pattern and a second insulation layer pattern. The metal pattern is on a base substrate. The first insulation pattern is on the metal pattern and includes one of a silicon nitride (SiN | 06-13-2013 |
| 20130146903 | DISPLAY UNIT AND METHOD OF MANUFACTURING THE SAME, ELECTRONIC APPARATUS, ILLUMINATION UNIT, AND LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A display unit includes: a plurality of light-emitting devices; and a separation section disposed between any adjacent two of the plurality of light-emitting devices and including a photoexcited material. A light-emitting device includes: an excitation light source; a wavelength conversion layer converting excitation light emitted from the excitation light source into light of a wavelength different from a wavelength of the excitation light; and a wavelength selection film disposed on a surface farther from the excitation light source of the wavelength conversion layer. | 06-13-2013 |
| 20130146904 | Optoelectronic Structures with High Lumens Per Wafer - An optoelectronic structure includes a wafer, a plurality of light emitting diode structures on a surface of the wafer, and a coating including a wavelength conversion material on the plurality of light emitting diode structures. The light emitting diode structures and the coating are configured to emit white light in response to electrical energy supplied to the light emitting diode structures. The light emitting diode structures from a single wafer are configured to generate an aggregate light output in excess of 800,000 lumens. | 06-13-2013 |
| 20130146905 | Light Emitting, Photovoltaic Or Other Electronic Apparatus and System - The present invention provides an electronic apparatus, such as a lighting device comprised of light emitting diodes (LEDs) or a power generating apparatus comprising photovoltaic diodes, which may be created through a printing process, using a semiconductor or other substrate particle ink or suspension and using a lens particle ink or suspension. An exemplary apparatus comprises a base; at least one first conductor; a plurality of substantially spherical or optically resonant diodes coupled to the at least one first conductor; at least one second conductor coupled to the plurality of diodes; and a plurality of substantially spherical lenses suspended in a polymer attached or deposited over the diodes. The lenses and the suspending polymer have different indices of refraction. In some embodiments, the lenses and diodes have a ratio of mean diameters or lengths between about 10:1 and 2:1. The diodes may be LEDs or photovoltaic diodes, and in some embodiments, have a junction formed at least partially as a hemispherical shell or cap. | 06-13-2013 |
| 20130153935 | Light Emitting Systems and Methods - Light-emitting systems and related methods of their fabrication are disclosed. | 06-20-2013 |
| 20130153936 | DEVICE MANUFACTURING METHOD AND ORGANIC EL DEVICE - A device manufacturing method including substrate preparation, pixel electrode formation, photosensitive film formation, first part exposure, second part exposure, and development. In first part exposure, after execution of photosensitive film formation, first photomask is arranged to face substrate and exposure is performed to cause first part of photosensitive film to be exposed to light via first photomask. In second part exposure, after or together with execution of first part exposure, second photomask is arranged to face substrate and exposure is performed to cause second part of photosensitive film, which is different from first part at least partially, to be exposed to light via second photomask. In second part exposure, second photomask is arranged such that end thereof overlaps with end of first photomask, and overlap between first and second photomasks positionally corresponds to electrical wire. | 06-20-2013 |
| 20130153937 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - In an organic light-emitting display device and a method of manufacturing the organic light-emitting display device, the method includes forming thin film transistors (TFTs) on a substrate; and forming organic light emitting diodes (OLEDs), each of the OLEDs including a first electrode having a portion exposed by a pixel defining layer (PDL) on the TFTs, an organic layer on the exposed portion of the first electrode and including an emission layer (EML) configured to emit light having a respective one of a plurality of colors, and a second electrode on the organic layer. The EML is formed in each of a sub-pixel region with one color and other sub-pixel regions with other colors that are formed by forming openings in the PDL. A solution supply unit for sub-pixel region that communicates with the sub-pixel region with one color is formed in the sub-pixel region with one color. | 06-20-2013 |
| 20130153938 | Light Emitting System - A light emitting assembly including a substrate having electrically conductive pathways that electrically connect a plurality of electrical component dies. The said electrical components include at least one light emitting diode engaged along the substrate to form an interface surface between the light emitting diode and the substrate. Therefore the combined and unified vector of thermal conduction from the light emitting diode dies are perpendicular to the interface surface when the combined and unified vector of thermal conduction crosses the interface surface from the light emitting diode die to the substrate. | 06-20-2013 |
| 20130153939 | ORGANIC LIGHT EMITTING DISPLAY DEVICE WITH ENHANCED EMITTING PROPERTY AND PREPARATION METHOD THEREOF - An organic light emitting display device in which an upper electrode and power supply lines are connected through through-holes such that charges can be smoothly supplied to the upper electrode of the organic light emitting display device, making it possible to improve light emitting efficiency. | 06-20-2013 |
| 20130153940 | ORGANIC ELECTRO-LUMINESCENCE DISPLAY DEVICE - An organic light emitting diode (OLED) display is disclosed. The display has high contrast and displays good black color by removing or decreasing influence of ambient light. The display includes an organic electro-luminescence emission layer and a plurality of pixels respectively including an active lighting layer disposed on the organic electro-luminescence emission layer. In the pixels, when the organic electro-luminescence emission layer emits light, light transmittance of the active lighting layer is decreased. | 06-20-2013 |
| 20130153941 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE UNIT, ACTIVE MATRIX SUBSTRATE, LIQUID CRYSTAL PANEL, AND LIQUID CRYSTAL DISPLAY - A semiconductor device ( | 06-20-2013 |
| 20130153942 | LIGHT EMITTING DEVICE, CIRCUIT BOARD, PACKAGING ARRAY FOR LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING PACKAGING ARRAY FOR LIGHT EMITTING DEVICE - A light emitting device includes a light emitting element and a package. The package is made up of a molded article and a lead that is embedded in the molded article. The lead includes a mounting part on which the light emitting element is mounted, a terminal part that is linked to the mounting part, and an exposed part. The package has a front face that is a light emitting face, a rear face opposite the front face, and a bottom face contiguous with the front face and the rear face. The light emitting element is mounted on the front face side of the mounting part. The exposed part is linked to the rear face side of the mounting part, and is exposed from the molded article at the bottom face and the rear face. The terminal part is exposed from the molded article at the bottom face. | 06-20-2013 |
| 20130161654 | REFLECTIVE LAYER ON DIELECTRIC LAYER FOR LED ARRAY - A light emitting diode array is described. The array includes a first light emitting diode with a first electrode and a second light emitting diode with a second electrode. The second light emitting diode is separated from the first light emitting diode. A first dielectric layer is positioned between the first light emitting diode and the second light emitting diode. An interconnect is located at least partially on the first dielectric layer that connects the first electrode to the second electrode. A second dielectric layer is formed over the first dielectric layer and the interconnect. A reflective layer is formed over the second dielectric layer. A permanent substrate is coupled to the reflective layer. | 06-27-2013 |
| 20130161655 | WHITE LED ASSEMBLY WITH LED STRING AND INTERMEDIATE NODE SUBSTRATE TERMINALS - A white LED assembly includes a string of series-connected blue LED dice mounted on a substrate. The substrate has a plurality of substrate terminals. A first of the substrate terminals is coupled to be a part of first end node of the string. A second of the substrate terminals is coupled to be a part of an intermediate node of the string. A third of the substrate terminals is coupled to be a part of a second end node of the string. Other substrate terminals may be provided and coupled to be parts of corresponding other intermediate nodes of the string. A single contiguous amount of phosphor covers all the LED dice, but does not cover any of the substrate terminals. In one example, the amount of phosphor contacts the substrate and has a circular periphery. All the LEDs are mounted to the substrate within the circular periphery. | 06-27-2013 |
| 20130161656 | ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display apparatus including: a substrate; a plurality of pixels that are formed on the substrate and each have a light emission area from which visible rays are emitted and a transmission area through which external light is transmitted; a pixel circuit portion disposed in each light emission area of the plurality of pixels; a first electrode that is disposed in each light emission area and is electrically connected to the pixel circuit portion; an intermediate layer that is formed on the first electrode and includes an organic emissive layer; a second electrode formed on the intermediate layer; and a capping layer that is disposed on the second electrode and includes a first capping layer corresponding to the light emission area and a second capping layer corresponding to the transmission area. Accordingly, electrical characteristics and image quality of the organic light-emitting display apparatus may be improved. | 06-27-2013 |
| 20130161657 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MAKING SAME - A light emitting diode package includes a triangular supporting member, a first substrate and a second substrate adhered on first and second inclined sidewalls the supporting member, respectively, a first LED chip and a second LED chip secured on the first substrate and the second substrate, respectively, and a package layer covering the first LED chip and a second LED chip. The first inclined sidewall and a bottom surface of the supporting member cooperatively form a first angle therebetween, and the second inclined sidewall and the bottom surface cooperatively form a second angle therebetween. The first angle and the second angle each range between 0 degree and 90 degrees. A method for making the light emitting diode package is also provided. | 06-27-2013 |
| 20130161658 | LIGHT EMITTER DEVICES AND COMPONENTS WITH IMPROVED CHEMICAL RESISTANCE AND RELATED METHODS - Light emitter devices, components and methods are disclosed. In one aspect, a light emitter component of a light emitter device is disclosed. The light emitter component can include a silver (Ag) portion at least partially disposed over a surface of the component. The component can further include a protective layer at least partially disposed over the Ag portion, the protective layer at least partially including an organic barrier material that increases or improves chemical resistance of the Ag portion. In some aspects, the protective layer includes a polyxylylene (e.g., poly(p-xylylene), a substituted poly(p-xylylene), a fluorocarbon containing poly(p-xylylene), and/or any other polymer prepared from a xylylene and/or comprising —CH | 06-27-2013 |
| 20130161659 | LIGHT-EMITTING DEVICE - A light-emitting device includes a substrate, and a plurality of light-emitting elements that are mounted on the substrate and each include an LED chip and a phosphor layer on a surface thereof. A maximum deviation in a value of a chromaticity coordinate x of light emitted from the plurality of light-emitting elements is not less than 0.0125. | 06-27-2013 |
| 20130161660 | LIGHT-EMITTING DEVICE - A light-emitting device includes a substrate, and a plurality of light-emitting elements that are mounted on the substrate and each emit light within a same color region. The plurality of light-emitting elements satisfy at least one of a first condition and a second condition. The first condition is that a maximum deviation in peak wavelength of light emitted from the plurality of light-emitting elements is not less than 1.25 nm. The second condition is that a maximum deviation in threshold voltage of the plurality of light-emitting elements is not less than 0.05 V. | 06-27-2013 |
| 20130161661 | CIRCUIT BOARD, DISPLAY MODULE, AND ELECTRONIC APPARATUS - A circuit board includes: a first substrate provided with a device section, the device section including one or a plurality of active devices; a plurality of first wiring layers each extending from the device section toward a periphery of the first substrate; and a plurality of second substrates each opposed to and bonded to the first wiring layer at the periphery of the first substrate and each having a second wiring layer, the second wiring layer being electrically connected to each of the first wiring layers. The first substrate has a cutout in one or more regions each facing one of the plurality of second substrates. | 06-27-2013 |
| 20130161662 | LIGHTING DEVICE - In a first aspect of the present invention, a lighting device including a metal plate, an electrical insulation layer that is smaller in size than an outline of the metal plate and arranged on an upper surface of the metal plate, a light-emitting element mounted on the electrical insulation layer, and a first connecting electrode and a second connecting electrode electrically connected to the light-emitting element and arranged on the electrical insulation layer. | 06-27-2013 |
| 20130161663 | ELECTRO-OPTIC DISPLAYS, AND COMPONENTS FOR USE THEREIN - An electro-optic display comprises a substrate ( | 06-27-2013 |
| 20130161664 | ELECTROLUMINESCENT ELEMENT, DISPLAY DEVICE AND LIGHTING DEVICE - An electroluminescent element ( | 06-27-2013 |
| 20130161665 | LIGHT-EMITTING DEVICE AND SURFACE LIGHT SOURCE DEVICE USING SAME - A light emitting device includes: a light-emitting element | 06-27-2013 |
| 20130168703 | DEPOSITION OF PHOSPHOR ON DIE TOP BY STENCIL PRINTING - A method for depositing a layer of phosphor-containing material on a plurality of LED dies includes disposing a template with a plurality of openings on an adhesive tape and disposing each of a plurality of LED dies in one of the plurality of openings of the template. The method also includes disposing a stencil over the template and the plurality of LED dies. The stencil has a plurality of openings configured to expose a top surface of each of the LED dies. Next, a phosphor-containing material is disposed on the exposed top surface of each the LED dies. The method further includes removing the stencil and the template. | 07-04-2013 |
| 20130168704 | Panel and method for fabricating the same - A panel is disclosed, in which, a patterned semiconductor layer is formed on an insulation layer. The patterned semiconductor layer includes a portion corresponding to an electrode and another portion corresponding to a wiring trace. The portion corresponding to the electrode may be formed as, for example, a channel, and the other portion corresponding to the wiring trace may protect the wiring trace during fabrication process or in the structure from scratching or corrosion. | 07-04-2013 |
| 20130168705 | SOLID-STATE LIGHT-EMITTING DEVICE AND SOLID-STATE LIGHT-EMITTING PACKAGE THEREOF - A solid-state light-emitting package includes a leadframe, a light-emitting chip, and a sealant. The leadframe includes a first electrode and a second electrode. The first electrode has at least one first contact end, and the second electrode has at least one second contact end. The light-emitting chip is electrically connected to the first electrode and the second electrode and is disposed between the first contact end and the second contact end. The sealant covers the leadframe and the light-emitting chip and has a first surface and a second surface. The first surface is the light output surface for the light-emitting chip. The first electrode and the second electrode are bent toward the first surface, where the first contact end and the second contact end are exposed by the first surface. | 07-04-2013 |
| 20130168706 | PRINTED LIGHT EMITTING DEVICES AND METHOD FOR FABRICATION THEROF - An array of light emitting devices and a method for large area fabrication of such is provided. The method includes providing a continuous flexible substrate and printing one or more layers of light emitting devices comprised of layers of transparent conductor, light emitting material, dielectric and electrode on the flexible substrate. The array of light emitting devices includes a flexible substrate and one or more layers of light emitting devices on the flexible substrate. The one or more layers of light emitting devices include layers of transparent conductor, light emitting material, dielectric and electrode. | 07-04-2013 |
| 20130168707 | ARRAY SUBSTRATE STRUCTURE OF DISPLAY PANEL AND METHOD OF MAKING THE SAME - An array substrate structure of a display panel includes a substrate, a plurality of first wirings, a first patterned insulating layer, a plurality of second wirings, a plurality of first protective patterns, and a plurality of second protective patterns. The substrate has a wiring region. The first wirings are disposed in the wiring region. The first patterned insulating layer is disposed on the first wirings. The second wirings are disposed on the first patterned insulating layer. The first protective patterns are disposed in the wiring region and disposed on the corresponding second wiring, respectively, where the first protective pattern includes a semiconductor material. The second protective patterns are disposed on the corresponding first protective pattern, respectively, where the second protective pattern includes an inorganic insulating material. | 07-04-2013 |
| 20130168708 | METHOD FOR DISPOSING FINE OBJECTS, APPARATUS FOR ARRANGING FINE OBJECTS, ILLUMINATING APPARATUS AND DISPLAY APPARATUS - This method for disposing fine objects, in a substrate preparing step, prepares a substrate having specified positions where fine objects ( | 07-04-2013 |
| 20130175550 | Donor Film, Method for Manufacturing Organic Light Emitting Diode Display Using the Same, and Organic Light Emitting Diode Display Manufactured by Using the Method - In a donor film, an organic light emitting diode display manufacturing method using the same, and an organic light emitting diode display manufactured by using the method, the donor film includes a donor substrate and a transfer layer formed on the donor substrate. The donor substrate includes a base film, a light-to-heat conversion (LTHC) layer disposed on the base film, and a curved interlayer film provided on the light-to-heat conversion layer and having a wrinkled side. The transfer layer includes an organic emission layer which is formed so as to be curved along a shape of the wrinkled side of the curved interlayer film. | 07-11-2013 |
| 20130175551 | Packaging Method and System for LEDs - A slim LED package configured to handle large current, having a narrow width, an LED chip mounting area positioned centro-symmetrically within the package, mounting holes positioned equidistantly from the mounting area, wherein multiple packages may be arranged with alternating anode and cathode ends in such a manner that a high-power density radiometric flux line may be created. Some embodiments include current density management areas positioned on one more sides of the LED chip mounting area. | 07-11-2013 |
| 20130175552 | ARRAY SUBSTRATE AND MANUFACTURING METHOD - Manufacturing an array substrate includes forming data and gate lines which cross and a gate electrode on a substrate. The data line is discontinuously disposed to be separated from the gate line, or the gate line is discontinuously disposed to be separated from the data line. Active and gate insulating layers including bridge and source electrode vias are formed on the substrate. The bridge vias correspond to adjacent discontinuous sections of the data line or the gate line. The source electrode via corresponds to the data line. Pixel, source, and drain electrodes and a bridge line are formed on the substrate. The pixel electrode and the drain electrode are integral. The source electrode is connected to the data line through the source electrode via. The bridge line connects adjacent discontinuous sections of the data line or adjacent discontinuous sections of the gate line through bridge vias. | 07-11-2013 |
| 20130175553 | LIGHT-EMITTING DIODE DEVICE - The present invention is directed to a light-emitting diode (LED) device, which includes at least one LED unit. Each LED unit includes at least one LED, which includes a first doped layer, a second doped layer and a conductive defect layer. The conductive defect layer is formed on the first or second doped layer. The conductive defect layer may be deposited between two LEDs, or between the first/second doped layer and an electrode. | 07-11-2013 |
| 20130175554 | LED PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING LED PACKAGE - There is provided a light emitting diode (LED) package substrate including: a substrate including a chip mounting region on which a plurality of LED chips is mountable; a conductive layer including a plurality of electrode patterns disposed on the chip mounting region; and a groove part, forming a dam, wherein the groove part surrounds the chip mounting region and is spaced apart from the chip mounting region by a predetermined interval. | 07-11-2013 |
| 20130175555 | LIGHT EMITTING DIODE PACKAGE HAVING INTERCONNECTION STRUCTURES - A light emitting diode (LED) package includes a substrate, a first LED chip and a second LED chip. The substrate includes first to fourth electrodes, and an interconnection electrode. A mounting area is defined at center of a top surface of the substrate. The first to fourth electrodes are respectively in four corners of the substrate out of the mounting area. The first interconnection electrode is embedded in the substrate to electrically connect the first and the third electrodes. The first LED chip and the second LED chip are arranged in the mounting area. Each LED chip includes an anode pad and a cathode pad. The first to fourth electrodes are respectively connected to the four pads of the first and the second LED chips via a plurality of metal wires, and no metal wire connection is formed between the first and the second LED chips. | 07-11-2013 |
| 20130175556 | LIGHT EMITTING APPARATUS - A lighting apparatus comprising a plurality of diodes and an electrical interface configured to receive an electrical signal and transmit the electrical signal to the plurality of diodes is provided. | 07-11-2013 |
| 20130175557 | LIGHT EMITTING APPARATUS - A lighting apparatus comprising a plurality of diodes and an electrical interface configured to receive an electrical signal and transmit the electrical signal to the plurality of diodes is provided. | 07-11-2013 |
| 20130175558 | LED LIGHTING DEVICES - Packaged chip-on-board (COB) LED arrays are provided where a color conversion medium is distributed within a glass containment plate, rather than silicone, to reduce the operating temperature of the color conversion medium and avoid damage while increasing light output. In accordance with one embodiment of the present disclosure, a lighting device is provided comprising a chip-on-board (COB) light emitting diode (LED) light source, a light source encapsulant, a distributed color conversion medium, and a glass containment plate. The COB LED light source comprises a thermal heat sink framework and at least one LED and defines a light source encapsulant cavity in which the light source encapsulant is distributed over the LED. The glass containment plate is positioned over the light source encapsulant cavity and contains the distributed color conversion medium. The light source encapsulant is distributed over the LED at a thickness that is sufficient to encapsulate the LED and define encapsulant thermal conduction paths T | 07-11-2013 |
| 20130181233 | SILICON PHOTONICS WAFER USING STANDARD SILICON-ON-INSULATOR PROCESSES THROUGH SUBSTRATE REMOVAL OR TRANSFER - Processing for a silicon photonics wafer is provided. A silicon photonics wafer that includes an active silicon photonics layer, a thin buried oxide layer, and a silicon substrate is received. The thin buried oxide layer is located between the active silicon photonics layer and the silicon substrate. An electrical CMOS wafer that includes an active electrical layer is also received. The active silicon photonics layer of the silicon photonics wafer is flip chip bonded to the active electrical layer of the electrical CMOS wafer. The silicon substrate is removed exposing a backside surface of the thin buried oxide layer. A low-optical refractive index backing wafer is added to the exposed backside surface of the thin buried oxide layer. The low-optical refractive index backing wafer is a glass substrate or silicon substrate wafer. The silicon substrate wafer includes a thick oxide layer that is attached to the thin buried oxide layer. | 07-18-2013 |
| 20130181234 | LIGHTING DEVICES WITH PRESCRIBED COLOUR EMISSION - Optical conversion layers based on semiconductor nanoparticles for use in lighting devices, and lighting devices including same. In various embodiments, spherical core/shell seeded nanoparticles (SNPs) or nanorod seeded nanoparticles (RSNPs) are used to form conversion layers with superior combinations of high optical density (OD), low re-absorbance and small FRET. In some embodiments, the SNPs or RSNPs form conversion layers without a host matrix. In some embodiments, the SNPs or RSNPs are embedded in a host matrix such as polymers or silicone. The conversion layers can be made extremely thin, while exhibiting the superior combinations of optical properties. Lighting devices including SNP or RSNP-based conversion layers exhibit energetically efficient superior prescribed colour emission | 07-18-2013 |
| 20130181235 | Organic Light-Emitting Display Device and Method of Manufacturing the Same - In an organic light-emitting display device and a method of manufacturing the same, the organic light-emitting display device includes: a substrate; an organic light-emitting unit that includes a plurality of organic light-emitting devices formed on the substrate; and an encapsulation unit that seals the organic light-emitting unit. The encapsulation unit includes: a barrier layer and a planarization layer that are stacked on the organic light-emitting unit; and a cover layer that is disposed between the barrier layer and the planarization layer to cover a crack occurring in each of the organic light-emitting devices. | 07-18-2013 |
| 20130181236 | LIGHT EMITTING DEVICE AND LIGHTING EQUIPMENT - A light emitting device has a base comprising at least one pair of leads having a silver-containing layer on their surfaces and being secured by a resin molded body, a light emitting element mounted on said leads, a protective film made of an inorganic material that covers the upper surface of said base, and a sealing resin disposed on the base surface via said protective film. The sealing resin has a first resin that covers said light emitting element, and a second resin having a higher hardness than said first resin that covers the boundaries between said resin molded body and said leads. | 07-18-2013 |
| 20130181237 | Light Emitting Systems and Methods - A light emitting system and related method are disclosed. | 07-18-2013 |
| 20130181238 | ELECTRONIC DEVICES WITH YIELDING SUBSTRATES - In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts. | 07-18-2013 |
| 20130181239 | SEMICONDUCTOR LIGHT EMITTING DEVICE - Disclosed is a semiconductor light emitting device. The semiconductor light emitting device comprises a first semiconductor layer, a second semiconductor layer, an active layer formed between the first semiconductor layer and the second semiconductor layer, a first reflective electrode on the first semiconductor layer to reflect incident light, and a second reflective electrode on the second semiconductor layer to reflect the incident light. | 07-18-2013 |
| 20130187175 | MULTI-LAYER ARRAY TYPE LED DEVICE - A multi-layer array type LED device is provided, which includes a substrate, an encapsulation body, two lead frames, a plurality of LED dices, and a set of optical lens. The outer circumferential edge and the upper and lower periphery of the substrate are completely encapsulated by the encapsulation body so that the multi-layer array type LED device can be tightly packaged. In the present invention, a fluorescent layer is disposed between an optical grease layer and a silica gel protection layer, and thereby the fluorescent layer is protected, and is capable of preventing moisture from permeating therein. On the other hand, in the present invention, the reflection coefficient of the optical grease layer is at least larger than a certain value so that the probability of the light emitted out of the optical chamber can be increased. | 07-25-2013 |
| 20130187176 | SILICONE RESIN - A silicone resin is provided. The silicone resin may be effectively used to encapsulate a semiconductor element, for example, a light-emitting element of a light-emitting diode. | 07-25-2013 |
| 20130187177 | DISPLAY PANEL MANUFACTURING METHOD AND DISPLAY PANEL - A method of manufacturing a display panel includes a sub-step of forming a photosensitive material layer for formation of a second layer on a first layer, a sub-step of disposing, over the photosensitive material layer, a photomask having a different degree of transparency in a first region and a second region thereof, the first region overlapping the photosensitive material layer, in plan view, at a location for formation of a second aperture, and the second region being a remainder of the photomask other than the first region, and a sub-step of exposing the photosensitive material layer via the photomask. In plan view, the area of the first region in the photomask is larger than the area of a first aperture in the first layer. | 07-25-2013 |
| 20130187178 | LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS - In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder. | 07-25-2013 |
| 20130193452 | LIGHT EMITTING DIODE SYSTEM AND METHODS RELATING THERETO - A light emitting diode system is disclosed having a bent layered structure conformed to a least a portion of a self-supporting three dimensional heat sink and maintains a breakdown voltage from 150 to 350 V/micron. The bent layered structure has an electrical circuit, a dielectric layer and at least one LED package, LED chip on board or mixtures thereof attached to the electrical circuit. The dielectric layer is a polyimide derived from at least 70 mole percent aromatic dianhydride based upon total dianhydride content of the polyimide and at least 70 mole percent aromatic diamine based upon total diamine content of the polyimide. | 08-01-2013 |
| 20130193453 | Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies - An electronic device may include a packaging substrate having a packaging face, and the packaging substrate may include positive and negative electrically conductive pads on the packaging face. A plurality of light emitting diodes may be electrically and mechanically coupled to the packaging face of the packaging substrate, with the plurality of light emitting diodes being electrically coupled between the positive and negative electrically conductive pads on the packaging face. A continuous optical coating may be provided on the plurality of light emitting diodes and on the packaging face of the packaging substrate so that the plurality of light emitting diodes are between the optical coating and the packaging substrate. | 08-01-2013 |
| 20130193454 | Electric Resistance Element Suitable for Light-Emitting Diode, Laser Diodes, or Photodetectors - An electric resistance element comprising: a base body, which is formed with a semiconductor material; a first contact element, which is electrically conductively connected to the base body; and a second contact element, which is electrically conductively connected to the base body. The base body has a first main surface into which a cutout is introduced. The first contact element is electrically conductively connected to the base body at least in places in the cutout. The base body has a second main surface, which is arranged in a manner lying opposite the first main surface. The second contact element is electrically conductively connected to the base body at least in places at the second main surface | 08-01-2013 |
| 20130193455 | LIGHT EMITTER PACKAGES AND DEVICES HAVING IMPROVED WIRE BONDING AND RELATED METHODS - Light emitter packages and devices having improved wire bonding and related methods are disclosed. In one embodiment a light emitter package can include at least one light emitting diode (LED) chip electrically connected to an electrical element via a wire bond. The wire bond can be provided at improved wire bonding parameters such as a temperature of approximately 150° C. or less, a bonding time of approximately 100 ms or less, a power of approximately 1700 mW or less, and a force of approximately 100 grams force (gf) or less, or combinations thereof. | 08-01-2013 |
| 20130193456 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display includes a substrate, a white pixel and a color pixel, each including an emission area, a non-emission area, a thin film transistor on the substrate, and an organic light emitting element on the substrate and electrically connected to the thin film transistor and configured to emit light at the emission area, a color filter layer between the organic light emitting element of the color pixel and the substrate at the emission area of the color pixel, and an overcoat layer having an overcoat opening corresponding to the emission area of the white pixel, and covering the color filter layer between the organic light emitting element of the color pixel and the color filter layer. | 08-01-2013 |
| 20130193457 | Light-Emitting Circuit, Luminaire, and Manufacturing Method for the Light-Emitting Circuit - According to one embodiment, a light-emitting circuit includes: a plurality of substrates in which wiring pattern layers are formed, the substrates including light-emitting elements connected to and mounted on the wiring pattern layers; and a linear conductor having electric conductivity, the linear conductor including linear joining sections at both ends electrically connected to the wiring pattern layers of the substrates and a convex section formed to be bent in a convex shape in an intermediate section between the joining sections, and the joining sections being respectively joined to the wiring pattern layers among the plurality of substrates adjacent to one another. | 08-01-2013 |
| 20130193458 | SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD - A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located on at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a casing having a cavity and a mounting surface, the chip mounted on the mounting surface, a transparent plate mounted on the wavelength converting layer within a top surface of the chip and a reflective layer located in the cavity so as to surround the transparent plate, the wavelength converting layer and the chip. The semiconductor light-emitting device can be configured to improve light-colored variability and light-emitting efficiency of the chip by using the reflective layer as a reflector, and therefore can emit a wavelength-converted light having a substantially uniform color tone and a high light-emitting efficiency from a smaller light-emitting surface than the top surface of the chip. | 08-01-2013 |
| 20130193459 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device includes a substrate; a light-emitting element formed on the substrate; a seal member sealing the light-emitting element, the seal member formed of a transparent dry film resist laminated on the substrate with the light-emitting element interposed therebetween. | 08-01-2013 |
| 20130193460 | LIGHT EMITTING DEVICE - A light emitting device includes a plurality of light emitting elements, a plurality of lead frames, and a package. The light emitting elements are mounted on the lead frames. The package is made of resin. The package has an opening. A part of the lead frames is embedded in an inner portion of the package and another part of the lead frames is exposed on a bottom surface of the opening. A resin bottom surface on which the resin is exposed is provided on the bottom surface of the opening of the package. The package includes a wall portion projecting from the bottom surface of the opening between the light emitting elements in the opening. The light emitting elements are connected by wire that straddles the wall portion. | 08-01-2013 |
| 20130193461 | ARRAY SUBSTRATE AND DISPLAY DEVICE HAVING THE SAME - An array substrate includes a lower substrate, a switching element and a pixel electrode. In the lower substrate, unit pixel areas are each divided into a plurality of domains. The switching element is disposed on the lower substrate and transmits a pixel signal. The pixel electrode is disposed on the unit pixel area and is electrically connected to the switching element. The pixel electrode includes a plurality of slit portions disposed thereon. A portion of the slit portions is longitudinally extended in a zigzag shape along different directions in correspondence with the domains. | 08-01-2013 |
| 20130193462 | LIGHT EMITTING DEVICE - A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency. | 08-01-2013 |
| 20130193463 | Methods Of Integrating LED Chips With Heat Sinks, And Led-Based Lighting Assemblies Made Thereby - An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink. A PCB forms an aperture corresponding to the pedestal, includes electrical conductors on an upper surface thereof, and is attached to the lower planar surface. The upper planar surface extends into the aperture, and one or more LED chips attach directly to the upper planar surface and connect to the conductors such that light emits upwardly. A method of integrating LEDs with a heat sink includes mounting a PCB to a planar surface of the heat sink, mounting one or more LED chips to a raised surface of the heat sink that is not covered by the PCB, and electrically connecting the LED chips to conductors on the PCB. | 08-01-2013 |
| 20130200398 | LIGHT EMITTING DIODE WITH WAVELENGTH CONVERSION LAYER - A light-emitting device comprises a base, a light-emitting unit comprising a semiconductor stack disposed on the base, and a wavelength conversion layer covering the light-emitting unit, wherein the wavelength conversion layer does not physically contact the base. | 08-08-2013 |
| 20130200399 | DISPLAY DEVICE - A display device includes a first insulation layer on a substrate, gate wires on the first insulation layer, the gate wires extending in a first direction, a second insulation layer on the gate wires, data wires on the second insulation layer, the data wires extending in a second direction crossing the first direction, pixels at intersection regions of gate wires and data wires, respectively, the pixels being connected to respective gate wires and data wires, and data leading diodes having an island form and connected to the data wires, the data leading diodes being configured to induce breakage of the first insulation layer when external static electricity passes through the data wires. | 08-08-2013 |
| 20130200400 | PCB HAVING INDIVIDUAL REFLECTIVE STRUCTURE AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE USING THE SAME - A printed circuit board (PCB) having an individual reflective structure and a method for manufacturing a light emitting diode (LED) package using the same, which can prevent reabsorption of light between LED chips by providing an individual reflective structure between the LED chips when the LED package is configured using two or more LED chips. The PCB includes a PCB; a wiring pattern-forming material layer formed on the PCB with an insulating layer interposed therebetween; dams formed on the wiring pattern-forming layer around chip mounting areas of the PCB; and a light reabsorption prevention dam formed on the wiring pattern-forming material layer between the chip mounting areas where LED chips are mounted. | 08-08-2013 |
| 20130200401 | CIRCUIT SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND ELECTROOPTICAL DEVICE - A circuit substrate includes, on an insulating substrate, a plurality of devices, a plurality of conductive layers connected in one-to-one correspondence with the devices, and an insulating layer provided between the devices and the conductive layers. The insulating layer includes a first insulating layer covering the devices, a second insulating layer formed on the first insulating layer, and a plurality of contact holes each passing through the first and second insulating layers in a thickness direction thereof. Side surfaces of the first and second insulating layers contact each other in at least part of the inside of each contact hole. Each conductive layer extends along an upper surface of the second insulating layer, at least a part of a side surface of the contact hole in which the side surfaces of the first and second insulating layers contact each other, and a bottom surface of the contact hole. | 08-08-2013 |
| 20130200402 | LIGHT-EMITTING MODULE - A light-emitting module includes a plate substrate, two circuit substrates, at least one LED chip, a plurality of wires and a molding component. The plate substrate includes a plurality of chip carriers protrudingly arranged from an upper surface and a lower surface of the plate substrate. The two circuit substrates directly stack on the upper and lower surface of the plate substrate, respectively, wherein a plurality of openings are arranged corresponding to the chip carriers penetrating therethrough and the upper surface of each chip carrier is at a higher or the same horizontal of the surface of the corresponding circuit substrate. The LED chip is arranged on each chip carrier. Each LED chip and the corresponding circuit substrates are electrically connected with a plurality of wires. Each of LED chips, each of chip carriers, wires and a portion of the circuit substrates are covered with the molding component. | 08-08-2013 |
| 20130200403 | PACKAGE STRUCTURE FOR SEMICONDUCTOR LIGHT EMITTING DEVICE - A package structure for a semiconductor light emitting device is provided. The package structure includes a semiconductor light emitting device, a lead frame, an electrostatic discharge protection device and an encapsulation. The lead frame supports the semiconductor light emitting device, and has a gap. The electrostatic discharge protection device is fastened in the gap and electrically connected to the lead frame. The encapsulation covers the lead frame, the semiconductor light emitting device and the electrostatic discharge protection device. | 08-08-2013 |
| 20130200404 | THIN FILM TRANSISTOR DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - A thin film transistor display panel includes: a gate electrode, a source electrode and a drain electrode which are included in a thin film transistor on a substrate; a data line connected to the source electrode; a pixel link member connecting the drain electrode to a pixel electrode; and a gate pad connected to the gate electrode through a gate line and including a first gate subpad, a second gate subpad and a gate pad link member, in which the pixel link member and the gate pad link member are substantially same in thickness. | 08-08-2013 |
| 20130200405 | Optoelectronic Semiconductor Component - An optoelectronic semiconductor component includes a substrate that has an upper side and an under side lying opposite the upper side. The substrate is formed with an electrically conductive mounting region, an electrically conductive connection region and an electrically isolating oxidation region. An optoelectronic part is arranged on the upper side of the substrate in the region of the mounting region. The oxidation region electrically isolates the mounting region from the connection region. The oxidation region extends, without interruption, from the upper side of the substrate to the underside of the substrate. The mounting region and the connection region are formed with aluminum and the oxidation region is formed with an oxide of the aluminum. The mounting region, the oxidation region and the connection region being are designed contiguously to form an entity. | 08-08-2013 |
| 20130200406 | CERAMIC-BASED LIGHT EMITTING DIODE (LED) DEVICES, COMPONENTS, AND METHODS - Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a ceramic body having a top surface, one or more light emitter devices mounted directly or indirectly on the top surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the ceramic body by one or more non-metallic layers. Components disclosed herein can result in improved light extraction and thermal management. | 08-08-2013 |
| 20130207128 | LIGHT-EMITTING DIODE LIGHT MODULE FREE OF JUMPER WIRES - An LED light module free of jumper wires has a substrate and multiple LED chips. The substrate has a positive side circuit, a negative side circuit, multiple first chip connection portions and multiple second connection portions. The first and second chip connection portions are respectively connected to the positive and negative side circuits, and are juxtaposedly and alternately arranged on the substrate so that a width between each first chip connection portion and a corresponding second chip connection portion is smaller than a width of each LED chip. Each LED chip can be directly mounted on corresponding first and second chip connection portions to electrically connect to the positive and negative side circuits. Accordingly, jumper wires for connecting the LED chips and the positive and negative side circuits can be removed to avoid broken jumper wires occurring when the LED light module is shipped or assembled. | 08-15-2013 |
| 20130207129 | Light-Emitting Diode Area Light Module and Method for Packaging the Same - An LED area light module has a substrate and a circuit layer and a solder mask layer formed on the substrate. The solder mask layer partially covers the circuit layer for the partially exposed circuit layer to form multiple electrical contacts. An embankment wall is formed on the solder mask layer with a solder mask material for the electrical contacts to be located within the embankment wall. Multiple LED chips are mounted on the solder mask layer within the embankment wall and electrically connected to the electrical contacts. Optically-transmissive adhesive is filled and concentrated within the embankment wall and covers the LED chips by a tension force thereof, and forms an optically-transmissive adhesive layer after congealed. Accordingly, the LED area light module eliminates the use of thick frame made of metal or rubber and steps of manufacturing and mounting the frame to simplify the packaging processes. | 08-15-2013 |
| 20130207130 | LIGHT EMITTER DEVICES HAVING IMPROVED LIGHT OUTPUT AND RELATED METHODS - Light emitter devices having improved light output and related methods are disclosed. In one embodiment, light emitter devices can include a light emission area including one or more light emitting chips. The emitter device can further include a filling material at least partially disposed over the one or more light emitting chips. The filling material can include a first discrete layer of phosphor containing material and a second discrete layer of optically clear material. The device can optionally include more than one discrete layer of optically clear material. Each of the discrete layers of material can be separately dispensed within the light emission area such that the filling material is dispensed to a level that is substantially flush with an upper surface of the emitter device. | 08-15-2013 |
| 20130207131 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display device including a substrate; a sealing sheet, which covers the substrate; a getter, which is interposed between at least a portion of the substrate and the sealing sheet; and an adhesive layer comprising an adhesive, which bonds the sealing sheet onto the substrate, wherein a getter-housing groove is in surfaces of the sealing sheet and the adhesive layer facing the substrate, and the getter is located in the getter-housing groove. | 08-15-2013 |
| 20130207132 | SOLID STATE WHITE LIGHT EMITTER AND DISPLAY USING SAME - A light emitting assembly comprising a solid state device coupleable with a power supply constructed and arranged to power the solid state device to emit from the solid state device a first, relatively shorter wavelength radiation, and a down-converting luminophoric medium arranged in receiving relationship to said first, relatively shorter wavelength radiation, and which in exposure to said first, relatively shorter wavelength radiation, is excited to responsively emit second, relatively longer wavelength radiation. In a specific embodiment, monochromatic blue or UV light output from a light-emitting diode is down-converted to white light by packaging the diode with fluorescent organic and/or inorganic fluorescers and phosphors in a polymeric matrix. | 08-15-2013 |
| 20130207133 | LIGHT-EMITTING DIODE - A light-emitting diode includes a carrier with a mounting face and includes a metallic basic body and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein an outer face of the metallic basic body includes the mounting face, the at least two light-emitting diode chips connect in parallel with one another, the at least two light-emitting diode chips are embedded in a reflective coating, the reflective coating covering the mounting face and side faces of the light-emitting diode chips, and the light-emitting diode chips protrude with their radiation exit surfaces out of the reflective coating, and the radiation exit surfaces face away from the carrier. | 08-15-2013 |
| 20130207134 | DISPLAY SUBSTRATE, DISPLAY PANEL HAVING THE DISPLAY SUBSTRATE, AND DISPLAY DEVICE HAVING THE DISPLAY PANEL - A display substrate includes a base substrate, a gate line portion, a data line portion, and a pixel portion. The base substrate includes a display area divided into first to fourth divided display areas, and first to fourth peripheral areas. The gate line portion includes a plurality of first gate lines, and a plurality of second gate lines. The data line portion includes a plurality of first data lines, and a plurality of second data lines. The pixel portion is disposed in the display area to be electrically connected to the first and second gate lines and the first and second data lines, respectively. | 08-15-2013 |
| 20130207135 | LIGHT EMITTING ELEMENT - A light emitting element is provided in this application, including a carrier; a conductive connecting structure disposed on the carrier and including a transparent conductive connecting layer; and an epitaxial stack structure disposed on the conductive connecting structure and including a plurality of electrically connected epitaxial light-emitting stacks, which substantially have the same width. | 08-15-2013 |
| 20130214294 | LIGHT EMITTING DEVICE WITH PLANAR CURRENT BLOCK STRUCTURE - A light-emitting device comprises a support base having a planar surface, a semiconductor stacked structure disposed on the planar surface, the semiconductor stacked structure comprising a first semiconductor layer, an active layer, a second semiconductor layer, a current block region formed in one of the first semiconductor layer and the second semiconductor layer and physically contacts the planar surface and an electrode disposed on the semiconductor stacked structure. | 08-22-2013 |
| 20130214295 | HEAT SPREADING SUBSTRATE - Heat spreading substrate. In an embodiment in accordance with the present invention, an apparatus includes a first conductive layer, a first insulating layer disposed in contact with the first conductive layer and a thermally conductive layer disposed in contact with the first insulating layer, opposite the first conductive layer. The faces of the first conductive layer, the first insulating layer and the thermally conductive layer are substantially co-planar; and a sum of widths of faces of the first conductive layer, the first insulating layer and the thermally conductive layer is greater than a height of the faces. The first conductive layer and the first insulating layer may include rolled materials. | 08-22-2013 |
| 20130214296 | HEAT SPREADING SUBSTRATE WITH EMBEDDED INTERCONNECTS - Heat spreading substrate with embedded interconnects. In an embodiment in accordance with the present invention, an apparatus includes a metal parallelepiped comprising a plurality of wires inside the metal parallelepiped. The plurality of wires have a different grain structure than the metal parallelepiped. The plurality of wires are electrically isolated from the metal parallelepiped. The plurality of wires may be electrically isolated from one another. | 08-22-2013 |
| 20130214297 | HIGH VOLTAGE LIGHT EMITTING DIODE CHIP AND ITS MANUFACTURING METHOD - A high voltage light emitting diode chip and its manufacturing method are provided. The high voltage light emitting diode chip can be manufactured by forming a plurality of light emitting diode units on a substrate and electrically connecting the light emitting diode units, wherein a trench with a width of about 0.5 μm to about 7 μm is present between every two adjacent light emitting diode units to isolate the light emitting diode units. The procedure for manufacturing the high voltage light emitting diode chip is simple and the high voltage light emitting diode chip that is produced can exhibit satisfying luminous efficiency. | 08-22-2013 |
| 20130214298 | LIGHT EMITTER DEVICE PACKAGES, COMPONENTS, AND METHODS FOR IMPROVED CHEMICAL RESISTANCE AND RELATED METHODS - Light emitter packages, components, and related methods for providing improved chemical resistance are provided herein. In one aspect, a component of a light emitter package is provided. The component can include a base material, a silver (Ag) containing material at least partially disposed over the base material, and a portion of phenyl containing silicone encapsulant at least partially disposed over the Ag portion. The component can be incorporated within a surface mount device (SMD) type light emitter package. | 08-22-2013 |
| 20130214299 | THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF - A thin film transistor array panel and a manufacturing method thereof according to an exemplary embodiment of the present invention form a contact hole in a second passivation layer formed of an organic insulator, protect a side of the contact hole by covering with a protection member formed of the same layer as the first field generating electrode and formed of a transparent conductive material, and etch the first passivation layer below the second passivation layer using the protection member as a mask. Therefore, it is possible to prevent the second passivation layer formed of an organic insulator from being overetched while etching the insulating layer below the second passivation layer so that the contact hole is prevented from being made excessively wide. | 08-22-2013 |
| 20130214300 | Solid State Light Sheet Having Wide Support Substrate and Narrow Strips Enclosing LED Dies in Series - A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. | 08-22-2013 |
| 20130214301 | DISPLAY APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS - A display device is provided including a plurality of light emitting devices formed on a substrate, a plurality of first members corresponding to the light emitting devices and formed directly on a portion of the respective light emitting device, and a plurality of second members formed in areas between adjacent first members. The first members and the second members are configured to reflect and guide at least a portion of light emitted from the light emitting sections through the first members. | 08-22-2013 |
| 20130214302 | LIGHT EMITTING ELEMENT AND FABRICATING METHOD THEREOF - A fabricating method of light emitting element. A substrate is provided. A plurality of first concaves and a plurality of second concaves are formed on the substrate, wherein a volume of each first concave is different from a volume of each second concave. A plurality of first light emitting diode chips and a plurality of second light emitting diode chips are provided, wherein a volume of each first light emitting diode chip is corresponding to the volume of each first concave, and a volume of each second light emitting diode chip is corresponding to the volume of each second concave. The first light emitting diode chips are moved onto the substrate such that the first light emitting diode chips go into the first concaves, and the second light emitting diode chips are moved onto the substrate such that the second light emitting diode chips go into the first concaves. | 08-22-2013 |
| 20130214303 | LIGHT EMITTING ELEMENT, LIGHT EMITTING ELEMENT ARRAY, OPTICAL WRITING HEAD, AND IMAGE FORMING APPARATUS - A light emitting element includes a semiconductor substrate, and an island structure formed on the semiconductor substrate. The island structure includes a light-emitting-unit thyristor and a current confinement structure. The light-emitting-unit thyristor includes stacked semiconductor layers having a pnpn structure. The current confinement structure includes a high-resistance region and a conductive region, and confines carriers in the conductive region. | 08-22-2013 |
| 20130221380 | OPTOELECTRONIC APPARATUSES WITH POST-MOLDED REFLECTOR CUPS AND METHODS FOR MANUFACTURING THE SAME - A method for manufacturing a plurality of optoelectronic apparatuses include attaching bottom surfaces of a plurality of packaged optoelectronic semiconductor devices (POSDs) to a carrier substrate (e.g., a tape) so that there is a space between each POSD and its one or more neighboring POSD(s). A light reflective molding compound is molded around a portion each of the POSDs attached to the carrier substrate so that a reflector cup is formed from the light reflective molding compound for each of the POSDs. The light reflective molding compound can also attach the POSDs to one another. Alternatively, an opaque molding compound can be molded around each POSD/reflector cup to attach the POSDs/reflector cups to one another and form a light barrier between each POSD and its neighboring POSD(s). The carrier substrate is thereafter removed so that electrical contacts on the bottom surfaces of the POSDs are exposed. | 08-29-2013 |
| 20130221381 | ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light emitting diode display device includes: a semiconductor layer on a substrate and including source and drain regions; a first insulating layer on the semiconductor layer; a gate electrode and a first storage electrode on the first insulating layer; a second insulating layer on the gate electrode and the first storage electrode; source and drain electrodes connected with the source and drain regions, respectively; a second storage electrode on the second insulating layer at a location corresponding to the first storage electrode; a third insulating layer on the source and drain electrodes and the second storage electrode; a first metal layer on the third insulating layer and connecting the drain electrode to an anode; and a second metal layer on the third insulating layer at a location corresponding to the second storage electrode. | 08-29-2013 |
| 20130221382 | MANUFACTURING LIGHT EMITTING DIODE (LED) PACKAGES - A method of manufacturing an LED package includes mounting a large panel frame/substrate (LPF/S) having a substantially square shape to a ring. The LPF/S includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern. Each of the die pads includes a planar chip attach surface. An LED chip is attached to the planar chip attach surface of each of the die pads. An encapsulant material is applied overlaying the LED chips and at least a part of the LPF/S. Each die pad and corresponding leads are separated from the LPF/S to form individual LED packages. The steps of attaching the LED chips and applying the encapsulant material are performed while the LPF/S is mounted to the ring. | 08-29-2013 |
| 20130221383 | TRANSPARENT LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEROF - A light emitting diode (LED) package and a method of fabricating an LED package are provided. The LED package can include a transparent substrate and an LED arranged on the transparent substrate. A reflective layer and/or a polarizing layer can also be included. The LED may be disposed on one surface of the transparent substrate with the reflective layer and/or polarizing layer formed on an opposing surface of the transparent substrate. The fabrication method may include forming an LED on one surface of a transparent substrate by mounting a flip-chip on the transparent substrate or vapor-depositing the LED directly on the transparent substrate. A multi-package stacked structure can also be provided wherein a plurality of LED packages are stacked together unidirectionally or bidirectionally, with or without a reflective layer and/or a polarizing layer. | 08-29-2013 |
| 20130221384 | SEMICONDUCTOR LIGHT EMITTING ELEMENT ARRAY - A semiconductor light emitting element array contains: a support substrate; a plurality of semiconductor light emitting elements disposed on said support substrate, a pair of adjacent semiconductor light emitting elements being separated by street, each of the semiconductor light emitting elements including; a first electrode formed on the support substrate, a semiconductor lamination formed on the first electrode and including a stack of a first semiconductor layer having a first conductivity type, an active layer formed on the first semiconductor layer, and a second semiconductor layer formed on the active layer, and having a second conductivity type different from the first conductivity type, and a second electrode selectively formed on the second semiconductor layer of the semiconductor lamination; and connection member having electrical insulating property and optically propagating property, disposed to cover at least part of the street between a pair of adjacent semiconductor laminations. | 08-29-2013 |
| 20130221385 | LIGHT EMITTING ELEMENT AND PRODUCTION METHOD FOR SAME, PRODUCTION METHOD FOR LIGHT-EMITTING DEVICE, ILLUMINATION DEVICE, BACKLIGHT, DISPLAY DEVICE, AND DIODE - A light-emitting element includes a first conductivity type semiconductor base, a plurality of first conductivity type protrusion-shaped semiconductors formed on the semiconductor base, and a second conductivity type semiconductor layer that covers the protrusion-shaped semiconductors. | 08-29-2013 |
| 20130228800 | White-Light Emitter Having a Molded Phosphor Sheet and Method of Making Same - A white-light emitter is disclosed, in which a silicone sheet is laminated between a pair of optically clear plastic sheets. The silicone sheet lacks the ability to retain its shape, while the three sheets, when sealed together, can retain a shape. The silicone sheet includes at least one phosphor, with a phosphor concentration between two percent and ten percent. The silicone sheet may be produced by molding. Compared to comparable silicone parts made by extrusion, the molded parts may show less part-to-part variation in color temperature, may be run in significantly smaller batches or as one-offs, and may allow the silicone and phosphor material to be mixed by hand or with a relatively simple mixing machine. In some cases, the sheets are sealed together at their perimeters and include a margin around the phosphor sheet. In some cases, the phosphor sheet includes a mixture of different phosphors. | 09-05-2013 |
| 20130228801 | Organic Light Emitting Diode Display and Method for Manufacturing the Same - An organic light emitting diode display includes a substrate, first electrodes patterned on the substrate, pixel defining layers on the substrate to separate the first electrodes corresponding to pixel units, light emitting layers on the first electrodes and separated corresponding to the pixel units, and a second electrode on the light emitting layers, wherein the pixel defining layers have pores. | 09-05-2013 |
| 20130228802 | LIGHT-EMITTING DIODE DEVICE - A two dimensional array light-emitting diode device is disclosed, which includes a transparent substrate including a first surface; a plurality of adjacent light-emitting diode units arranged on the first surface, wherein each of the light-emitting diode units including a plurality of sides and a circumference; and a plurality of conductive connecting structures arranged on the first surface, electrically connecting the plurality of light-emitting diode units mentioned above; wherein the sides of each of the light-emitting diode units have a plurality of vertical distances between the closest light-emitting diode units, and when the plurality of vertical distances larger than 50 μm, the sides are not near the closest light-emitting diode units; wherein the ratio of the total length of the sides not near the light-emitting diode units of each light-emitting diode unit and the circumference of the light-emitting diode unit is larger than 50%. | 09-05-2013 |
| 20130228803 | LIGHT-EMITTING DEVICE, LIGHTING DEVICE, LIGHT-EMITTING DEVICE ASSEMBLY, AND METHOD FOR PRODUCING LIGHT-EMITTING DEVICE - A light-emitting device includes a substrate including a mirror surface region on its upper surface, a semiconductor light-emitting element disposed in the mirror surface region, and an encapsulating layer joined onto the upper surface of the substrate. The encapsulating layer includes a lower layer that is in contact with the upper surface of the substrate, covers the surrounding of the semiconductor light-emitting element, and contains phosphor; and an upper layer that is positioned on the lower layer, and has a larger phosphor content per unit area than that of the lower layer. | 09-05-2013 |
| 20130228804 | METHOD AND SYSTEM FOR FORMING LED LIGHT EMITTERS - A method for forming a flexible sheet of LED light emitters includes forming a micro lens sheet having a plurality of micro lenses, forming a phosphor sheet including a wave-length converting material, forming a flexible circuit sheet, forming a ceramic substrate sheet including a plurality of LED light emitters, and forming a support substrate including a thermally conductive material. The method also includes attaching the above sheets to form a stack including, from top to bottom, the micro lens sheet, the phosphor sheet, the flexible circuit sheet, the ceramic substrate sheet, and the support substrate. | 09-05-2013 |
| 20130234167 | LIGHT-EMITTING ELEMENT, SELF-SCANNING LIGHT-EMITTING ELEMENT ARRAY, OPTICAL WRITING HEAD, AND IMAGE FORMING APPARATUS - Disclosed is a light-emitting element including a semiconductor substrate, an island structure formed on the semiconductor substrate and including at least a current confining layer and p-type and n-type semiconductor layers, a light-emitting thyristor formed in the island structure and having a pnpn structure, and a shift thyristor formed in the island structure and having a pnpn structure, wherein a groove portion having a depth such that the groove portion reaches at least the current confining layer is formed between a formation region of the shift thyristor of the island structure and a formation region of the light-emitting thyristor, and an oxidized region that is selectively oxidized from a side surface of the island structure and a side surface of the groove portion is formed in the current confining layer. | 09-12-2013 |
| 20130234168 | LIGHT-EMITTING ELEMENT, METHOD OF MANUFACTURING LIGHT-EMITTING ELEMENT, SELF-SCANNING LIGHT-EMITTING ELEMENT ARRAY, OPTICAL WRITING HEAD, AND IMAGE FORMING APPARATUS - Provided is a light-emitting element including a semiconductor substrate, an island structure formed on the semiconductor substrate and including at least a current confining layer and p-type and n-type semiconductor layers, a light-emitting thyristor formed in the island structure and having a pnpn structure, and a shift thyristor formed in the island structure and having a pnpn structure, wherein the island structure includes a first side surface having a first depth such that the first side surface does not reach the current confining layer in a formation region of the shift thyristor and a second side surface having a second depth such that the second side surface reaches at least the current confining layer in a formation region of the light-emitting thyristor, and an oxidized region selectively oxidized from the second side surface is formed in the current confining layer in the formation region of the light-emitting thyristor. | 09-12-2013 |
| 20130234169 | METHOD OF MANUFACTURING A THIN-FILM TRANSISTOR, METHOD OF MANUFACTURING A DISPLAY SUBSTRATE, AND DISPLAY SUBSTRATE - In a method of manufacturing a thin film transistor, a gate electrode is formed on a first surface of a base substrate, a oxide semiconductor layer, insulation layer and photo resist layer are formed an the fast surface of the base substrate having the gate electrode. The insulation layer and the oxide semiconductor layer are patterned using a first photo resist pattern to form an etch-stopper and an active pattern. A source and a drain electrode are formed on the base substrate having the active pattern and the etch-stopper, the source electrode and the drain electrode are overlapped with both ends of the etch-stopper and spaced apart from each other. Therefore, a manufacturing cost may be decreased by omitting a mask when forming the active pattern and the etch-stopper. | 09-12-2013 |
| 20130234170 | SEMICONDUCTOR LIGHT EMITTING DEVICE HAVING MULTI-CELL ARRAY - A semiconductor light emitting device (LED) includes a first light emitting cell having a first plurality of electrodes. A second light emitting cell includes a second plurality of electrodes. The first and second light emitting cells are disposed on the substrate and are physically separated from each other. A first interconnection unit electrically connects the first plurality of electrodes to the second plurality of the electrodes. | 09-12-2013 |
| 20130234171 | METHOD AND SYSTEM FOR FORMING INTEGRATED LIGHT GUIDES - A method and a system for forming one or more integrated light guides comprising one or more light sources and one or more light transmissive materials are disclosed. At least one of the one or more light transmissive materials is capable of transmitting light emitted by at least one of the one or more light sources. The method includes disposing the one or more light sources on one or more sides of a substrate to form an arrangement of the one or more light sources. Additionally, the method includes molding the one or more light transmissive materials onto one or more parts of one or more sides of the arrangement of the one or more light sources to form the one or more integrated light guides. | 09-12-2013 |
| 20130234172 | LIGHT-EMITTING DIODE DEVICE - A light-emitting diode device is disclosed, which comprises a substrate including a first surface; a plurality of light-emitting diode units formed on the first surface, each of the light-emitting diode units including a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; and a plurality of conductive connecting structures, spatially separated from each other, wherein one end of one of the plurality of conductive connecting structure is arranged on the second semiconductor layer, directly contacted with the second semiconductor layer, and electrically connected with each other through the second semiconductor layer; wherein another end of the one of the conductive connecting structures is arranged on another light-emitting diode unit, and directly contacted with one of the semiconductor layers of the another light-emitting diode unit. | 09-12-2013 |
| 20130234173 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a light emitting device. The light emitting device comprises a substrate, an N-type semiconductor layer formed on the substrate, and a P-type semiconductor layer formed on the N-type semiconductor layer, wherein a side surface including the N-type or P-type semiconductor layer has a slope of 20 to 80° from a horizontal plane. Further, a light emitting device comprises a substrate formed with a plurality of light emitting cells each including an N-type semiconductor layer and a P-type semiconductor layer formed on the N-type semiconductor layer, wherein the N-type semiconductor layer of one light emitting cell and the P-type semiconductor layer of another adjacent light emitting cell are connected to each other, and a side surface including at least the P-type semiconductor layer of the light emitting cell has a slope of 20 to 80° from a horizontal plane. | 09-12-2013 |
| 20130234174 | Semiconductor Light Source - A light source may comprise a thermally conductive frame comprising a base and a faceted portion extending from the base. The faceted portion may comprise a plurality of facets spaced circumferentially thereabout. Additionally, a hollow passageway may extend through the base and axially through the faceted portion. A plurality of LED chips may be arranged on the plurality of facets to provide an emission of light in an arc of 360 degrees. | 09-12-2013 |
| 20130240914 | ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - An organic light emitting diode (OLED) display includes a substrate where a plurality of pixels are formed, a first pixel defining layer on the substrate, the first pixel defining layer dividing the plurality of pixels, a connection wire on the first pixel defining layer, the connection wire electrically connecting two adjacent pixels, and a second pixel defining layer on the first pixel defining layer, the second pixel defining layer covering the connection wire. | 09-19-2013 |
| 20130240915 | LIGHT EMITTING DEVICE - A light emitting device | 09-19-2013 |
| 20130240916 | LIQUID CRYSTAL DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - Discussed are a liquid crystal display device and a method of fabricating the same in which a single common line is formed at the center of a substrate, which results in an enhanced aperture ratio and transmittance. The liquid crystal display device includes a single common line located at a center of a substrate; a first group of unit pixels located in a right portion of the substrate on the basis of the common line and a second group of unit pixels located in a left portion of the substrate on the basis of the common line, each unit pixel defined by a plurality of gate lines and data lines orthogonally intersecting each other; and a plurality of thin film transistors formed at a right side of the respective unit pixels of the first group and at a left side of the respective unit pixels of the second group. | 09-19-2013 |
| 20130240917 | SEMICONDUCTOR PACKAGE HAVING A CONDUCTIVE LAYER FOR ELECTROSTATIC DISCHARGE AND DISPLAY DEVICE INCLUDING THE SAME - A semiconductor package is provided. The semiconductor package may include a base film having a first surface and a second surface opposite the first surface, an interconnection pattern on the first surface of the base film, and a ground layer on the second surface of the base film. The semiconductor package may further include a semiconductor chip on the first surface of the base film within the first region and a via contact plug in the second region that penetrates the base film and is configured to electrically connect the interconnection pattern with the ground layer when electrostatic discharge occurs through the via contact plug. | 09-19-2013 |
| 20130240918 | ELECTROLYTICALLY COATED OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT - The invention relates to an optoelectronic seminconductor component, comprising a substrate-free optoelectronic semiconductor chip ( | 09-19-2013 |
| 20130240919 | SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF - The present invention relates to a semiconductor device capable of emitting light upon application of voltage and a method for manufacturing the same, and more particularly to a semiconductor device having a polygonal or circular columnar shape and a method for manufacturing the same. The semiconductor device of the present invention comprises a plurality of semiconductor structures and a connecting support layer that supports the plurality of the semiconductor structures, wherein each of the plurality of the semiconductor structures comprises a P-type first semiconductor layer, an N-type second semiconductor layer, and a light-emitting layer located between the first semiconductor layer and the second semiconductor layer, and forms a column having a polygonal or circular shape. | 09-19-2013 |
| 20130248888 | LED PACKAGE STRUCTURE - An LED package structure comprises a 3D substrate, LED chips, wires, and resin encapsulants. The 3D substrate has a stepped contour and includes a first chip accommodation region and at least one second chip accommodation region surrounding the first chip accommodation region. A first electric contact and a second electric contact are arranged in the first chip accommodation region. The LED chips are arranged in the border of the 3D substrate. The wires are used to connect the LED chips in series or in series firstly and in parallel next. One of the wires connects the first electric contact and one of the LED chips. Another one of the wires connects the second electric contact and another one of the LED chips. The resin encapsulants respectively encapsulate the LED chips. The LED package structure is characterized in using a 3D substrate to facilitate wiring and increase the beam angle. | 09-26-2013 |
| 20130248889 | LIGHT EMITTING DEVICE - An embodiment of the present invention provides a light emitting device including: a transparent substrate; a wiring layer disposed on the transparent substrate; a plurality of light emitting diode chips disposed on the transparent substrate and electrically connected to the wiring layer; and an opposite substrate disposed on the transparent substrate to sandwich the light emitting diode chips and the wiring layer, wherein no wiring layer is disposed on a surface of the opposite substrate facing the light emitting diode chips. | 09-26-2013 |
| 20130248890 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode (OLED) display is provided. The OLED display includes a substrate, an organic light emitting element on the substrate, and a thin film encapsulation layer on the substrate and covering the organic light emitting element. The thin film encapsulation layer includes at least one conductive layer having a voltage application pad. | 09-26-2013 |
| 20130248891 | ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light emitting display device and a method of manufacturing the same are proposed. The organic light emitting display device includes: a first film formed of an organic material, and having first and second surfaces facing each other and a third surface perpendicular to the first and second surfaces; a second film formed on the first film to cover the second and third surfaces of the first film; an organic light emitting unit disposed on the second film; a third film disposed on the second film to cover the organic light emitting unit; and a fourth film disposed on the third film, formed of an organic material, and having fourth and fifth surfaces facing each other, wherein the fifth surface faces the third film. | 09-26-2013 |
| 20130248892 | LIGHT-EMITTING DEVICE - A-light-emitting device which realizes a high aperture ratio and in which the quality of image is little affected by the variation in the characteristics of TFTs. The channel length of the driving TFTs is selected to be very larger than the channel width of the driving TFTs to improve current characteristics in the saturated region, and a high V | 09-26-2013 |
| 20130248893 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, a semiconductor light emitting device includes a plurality of chips, and a phosphor layer. Each of the plurality of chips includes a semiconductor layer, a p-side electrode, and an n-side electrode. The semiconductor layer has a first surface, a second surface opposite to the first surface, and a light emitting layer. The p-side electrode is provided in an emitting region on the second surface. The n-side electrode is provided in an non-emitting region on the second surface. The phosphor layer is provided on the first surface side of the chips. The phosphor layer includes a transparent body and a phosphor dispersed in the transparent body. A gap not including the phosphor is provided in the phosphor layer. The plurality of chips includes a plurality of chips for which the gap has different sizes. | 09-26-2013 |
| 20130248894 | LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, MANUFACTURING METHOD OF THE SAME, AND LIGHT-EMITTING ELEMENT PACKAGE - A light-emitting element mounting package including a first wiring forming a first light-emitting element mounting portion, which is provided on one surface of a substrate to mount a light-emitting element, and a first through wiring having one end and another end, the one end being electrically connected to the first light-emitting element mounting portion so as to be thermally transferable, and the other end protruding from another surface of the substrate. | 09-26-2013 |
| 20130248895 | LIGHT EMITTING DEVICE - A light emitting device includes a substrate elongated in a lengthwise direction; a plurality of LED chips disposed on the substrate in an intermediate region in widthwise direction, and aligned along the lengthwise direction at a distance of 80 μm or less; and interconnection wirings formed on regions outside the intermediate region in the widthwise direction; wherein each of the LED chips has a p-side electrode disposed on the substrate, a p-type semiconductor layer disposed on the p-side electrode, an active layer formed on the p-type semiconductor layer, and an n-type semiconductor layer formed on the active layer, and has a region in which the n-type semiconductor layer, the active layer, and the p-type semiconductor layer are patterned, and an n-side electrode formed selectively on a surface of the n-type semiconductor layer and connected to the p-side electrode of an adjacent LED chip through the interconnection wiring. | 09-26-2013 |
| 20130248896 | LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT INCLUDING THE SAME - Disclosed are a light emitting device package and a light unit including the same. The light emitting device package includes a body; a first lead frame having a first cavity in a first region of the body; a second lead frame having a second cavity in a second region of the body; a first bonding part adjacent to a first lateral side of the body and extended from the first cavity of the first lead frame; a second bonding part adjacent to a second lateral side of the body, which is opposite to the first lateral side of the body, and extended from the second cavity of the second lead frame; a first light emitting device in the first cavity; a second light emitting device in the second cavity; a third cavity adjacent to the first bonding part; a first protective device in the third cavity. | 09-26-2013 |
| 20130248897 | LIGHT EMITTING DIODE WAFER-LEVEL PACKAGE WITH SELF-ALIGNING FEATURES - Several embodiments of light emitting diode packaging configurations including a substrate with a cavity are disclosed herein. A patterned wafer has a plurality of individual LED attachment sites, and an alignment wafer has a plurality of individual cavities. The patterned wafer and the alignment wafer are superimposed with the LED attachment sites corresponding generally to the cavities of the alignment wafer. At least one LED is placed in the cavities using the cavity to align the LED relative to the patterned wafer. The LED is electrically connected to contacts on the patterned wafer, and a phosphor layer is formed in the cavity to cover at least a part of the LED. | 09-26-2013 |
| 20130248898 | Liquid Crystal Display Device - A liquid crystal display device includes a TFT substrate with gate lines and drain lines, and pixel electrodes each formed in a region surrounded by the gate lines and drain lines. Protrusions are formed below the gate lines, each of the protrusions having an upper surface and at least one inclined side surface. A gate insulating film is formed over the gate lines, a semiconductor layer formed on the gate insulating film, and drain electrodes formed and source electrodes formed over the semiconductor layer. Channel portions are defined by the space between the drain electrodes and the source electrodes, each of the channel portions being formed covering the upper surface and at least one of the at least one inclined side surface of one of the protrusions, the pixel and source electrode being in contact with each other on at least one inclined side surface of the protrusion. | 09-26-2013 |
| 20130256703 | AMOLED WITH N-TYPE TFT - A stratified organic light-emitting diode structure includes a thin-film transistor and an organic light-emitting diode (OLED). The OLED is fabricated on a planarization layer that has a top surface substantially parallel to the substrate, and the layers in the organic light-emitting diode (OLED) are substantially parallel to each other. The major part of each OLED layer has a uniform thickness so that the OLED produces a uniform brightness. The planarization layer covers the thin-film transistor entirely and the planarization layer on top of the thin-film transistor is also covered by an insulation layer. In order to electrically connect the top electrode of the OLED to the drain terminal of the thin-film transistor, an opening is made through both the top insulating layer and the planarization layer to expose part of the drain terminal. Spacers with uniform height are fabricated on the top insulating layer to protect the pixel structure. | 10-03-2013 |
| 20130256704 | LED, Backlight Module, and LCD Device - The invention provides a LED, a backlight module, and a LCD device. The LED includes an inner cavity. The bottom of the inner cavity is provided with a chip. Four side walls are arranged around the bottom of the inner cavity. Both ends of the chip are respectively connected with electrodes. Two opposite side walls of the bottom of the inner cavity are provided with at least one convex step surface, and the electrodes at the two ends of the chip are extended to the step surface from the bottom of the inner cavity; the other two side walls adjacent to the step surface are provided with at least one inclined surface which makes an obtuse angle with the bottom of the inner cavity. By selecting the inclination angle of different inclined surfaces, the invention can freely control the scattering range of the emitted light, has strong adaptability, and is suitable for being used as a backlight source of the LCD device. When light enters from the side, the large light emitting angle enables the light to be uniformly emitted into a light guide panel, thereby reducing the phenomenon of hot spots. | 10-03-2013 |
| 20130256705 | LIGHT EMITTING DIODE LIGHT BAR STRUCTURE - The present invention discloses a light emitting diode (LED) light bar structure, which is applied to a backlight module of edge lighting. The LED light bar structure comprises a circuit board, a first row light source and a second row light source. The first row light source comprises a plurality of first LEDs; the second row light source comprises a plurality of second LEDs; and the first LEDs of the first row light source alternately continue with the second LEDs of the second row light source along the longitude direction of the circuit board to keep the lights entering into the light guide plate continuously, so as to prevent the light guide plate from light shadow “Mura” phenomenon in the light guide plate near the LEDs, and it can suit the design trend of narrow frame of liquid crystal panel. | 10-03-2013 |
| 20130256706 | PIXEL ARRAY AND DISPLAY PANEL - A pixel array and a display panel are provided. The pixel array includes a plurality of pixel units. Each of the pixel units includes a first scan line, a second scan line, a data line, a first thin-film transistor, a second thin-film transistor, a first pixel electrode and a second pixel electrode. The first thin-film transistor is electrically connected to the first scan line and the data line. The first pixel electrode is electrically connected to the first thin-film transistor. The second thin-film transistor is electrically connected to the second scan line and the data line. The second pixel electrode is electrically connected to the second thin-film transistor. The orthogonal projection pattern of the first thin-film transistor on XY plane and the orthogonal projection pattern of the second thin-film transistor on XY plane are substantially the same. | 10-03-2013 |
| 20130256707 | ARRAY SUBSTRATE AND PIXEL UNIT OF DISPLAY PANEL - An array substrate and a pixel unit of a display panel include a plurality of subpixels arranged in a pixel array (N row*M column). Only one data line is disposed in a portion of two adjacent columns of subpixels in the pixel array, and two data lines are disposed in another portion of two adjacent columns of subpixels in the pixel array. | 10-03-2013 |
| 20130256708 | LIGHT EMITTING DIODES - An LED is provided. The LED includes at least two light emitting units located on a same plane. Each light emitting unit includes a first semiconductor layer, an active layer and a second semiconductor layer stacked in that order. Each light emitting unit further includes a first electrode and a second electrode electrically connected with the first semiconductor layer and the second semiconductor layer respectively. The active layer of each light emitting unit is spaced from the active layers of other light emitting units. A distance between adjacent active layer ranges from 1 micron to 1 millimeter. | 10-03-2013 |
| 20130256709 | METHOD OF MANUFACTURING SUBSTRATE FOR LED MODULE AND SUBSTRATE FOR LED MODULE MANUFACTURED BY THE SAME - Disclosed herein are a method of manufacturing a substrate for an LED module and a substrate for an LED module manufactured by the same, including: providing a base substrate having metal layers formed on both surfaces thereof; forming circuit patterns on the metal layers; applying a solder resist layer onto the circuit patterns; forming a through hole penetrating through the base substrate; separating the base substrate up and down; and bonding each of the separated base substrates to a parent substrate, thereby preventing light reflectivity of a parent substrate from being degraded due to a resist applying process and a surface treatment process. | 10-03-2013 |
| 20130256710 | MULTI-CHIP LIGHT EMITTER PACKAGES AND RELATED METHODS - Light emitter packages having multiple light emitter chips, such as light emitting diode (LED) chips, and related methods are provided. In one embodiment, a light emitter package can include a ceramic submount. An array of light emitter chips can be disposed over a portion of the submount, and each light emitter chip can include a horizontal chip structure having positive and negative electrical contacts disposed on a same side. The positive and negative electrical contacts can be adapted to electrically communicate to conductive portions of the submount. Light emitter packages can further include a lens overmolded on the submount and covering a portion of the array. | 10-03-2013 |
| 20130256711 | SUBSTRATE BASED LIGHT EMITTER DEVICES, COMPONENTS, AND RELATED METHODS - Substrate based light emitter devices, components, and related methods are disclosed. In some aspects, light emitter components can include a substrate and a plurality of light emitter devices provided over the substrate. Each device can include a surface mount device (SMD) adapted to mount over an external substrate or heat sink. In some aspects, each device of the plurality of devices can include at least one LED chip electrically connected to one or more traces and at least one pair of bottom contacts adapted to mount over a surface of external substrate. The component can further include a continuous layer of encapsulant disposed over each device of the plurality of devices. Multiple devices can be singulated from the component. | 10-03-2013 |
| 20130256712 | SEMICONDUCTOR LIGHT EMITTING DEVICE, LIGHT EMITTING MODULE AND ILLUMINATION APPARATUS - A semiconductor light emitting device includes a substrate, a semiconductor laminate disposed on the substrate and divided to a plurality of light emitting cells with an isolation region, and a wiring unit electrically connecting the plurality of light emitting cells. A region of lateral surfaces of each of the light emitting cells in which the wiring unit is disposed has a slope gentler than slopes of other regions of the lateral surfaces of each of the light emitting cells. | 10-03-2013 |
| 20130256713 | LED COMPONENT WITH LOW RTH WITH DISSOCIATED ELECTRICAL AND THERMAL PATHS - A component emitting light radiation comprising a vertical junction supported on a substrate, the face of the substrate opposite the face on which the junction is made is provided with at least one first conducting zone dedicated to electrical contact and a second conducting zone insulated from the substrate and from the first conducting zone, the second zone being dedicated to heat dissipation. | 10-03-2013 |
| 20130256714 | Light Emitting Device And Method of Manufacturing The Same - A light emitting device having a structure in which oxygen and moisture are prevented from reaching light emitting elements, and a method of manufacturing the same, are provided. Further, the light emitting elements are sealed by using a small number of process steps, without enclosing a drying agent. The present invention has a top surface emission structure. A substrate on which the light emitting elements are formed is bonded to a transparent sealing substrate. The structure is one in which a transparent second sealing material covers the entire surface of a pixel region when bonding the two substrates, and a first sealing material (having a higher viscosity than the second sealing material), which contains a gap material (filler, fine particles, or the like) for protecting a gap between the two substrates, surrounds the pixel region. The two substrates are sealed by the first sealing material and the second sealing material. Further, reaction between electrodes of the light emitting elements (cathodes or anodes) and the sealing materials can be prevented by covering the electrodes with a transparent protective layer, for example, CaF | 10-03-2013 |
| 20130256715 | Sulfur-Containing Phosphor Coated with ZnO Compound - Provided is a novel coated phosphor capable of effectively suppressing the adverse effects of hydrogen sulfide gas generated by the reaction between a sulfur-containing phosphor and moisture in the air. Provided is a sulfur-containing phosphor having a configuration in which ZnO compound containing Zn and O is present on the surface of a sulfur-containing phosphor having a host material which includes sulfur. | 10-03-2013 |
| 20130264587 | STACKED LED DEVICE USING OXIDE BONDING - A semiconductor light emitting device includes a substrate, a first epitaxial structure, a first substantially transparent conducting layer, a second epitaxial structure, a second substantially transparent conducting layer, and a substantially transparent insulating layer. The first epitaxial structure is over the substrate and includes a first doped layer, a first light emitting layer, and a second doped layer. The first substantially transparent conducting layer is coupled to the second doped layer. The second epitaxial structure includes a third doped layer, a second light emitting layer, and a fourth doped layer. The second substantially transparent conducting layer is coupled to the fourth doped layer. The substantially transparent insulating layer is between the first substantially transparent conducting layer and the second substantially transparent conducting layer. | 10-10-2013 |
| 20130264588 | COMPACT LED PACKAGE - A light emitting package includes a base and one or more LED units coupled to the base. The LED unit includes a plurality of vertically stacked epitaxial structures. Each epitaxial structure includes at least a first doped layer, at least a light emitting layer, and at least a second doped layer. At least one luminescent element is spaced a distance from the one or more LED units. | 10-10-2013 |
| 20130264589 | WAFER LEVEL PACKAGING OF LIGHT EMITTING DIODES (LEDS) - An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area. | 10-10-2013 |
| 20130264590 | LIGHT EMITTING LAMP - Disclosed is a light emitting lamp including a light source module including at least one light source and a light guide layer disposed on a substrate burying the at least one light source, and a housing accommodating the light source module, and the at least one light source includes a body having a cavity, a first lead frame including one end exposed to the cavity and the other end passing through the body and exposed to one surface of the body, a second lead frame including one end exposed to one portion of the surface of the body, the other end exposed to the another portion of the surface of the body, and an intermediate part exposed to the cavity, and at least one light emitting chip including a first semiconductor layer, an active layer and a second semiconductor layer, and disposed on the first lead frame. | 10-10-2013 |
| 20130264591 | LIGHT EMITTING DIODES (LEDS), DEVICES, AND METHODS FOR PROVIDING FAILURE MITIGATION IN LED ARRAYS - Light emitting diodes (LEDs), devices, and methods for providing failure mitigation in LED arrays are disclosed. In one aspect, an LED can include a body with an anode and a cathode in the form of electrically conductive bond pads. The anode and cathode can be configured to electrically communicate with more than two electrical components via electrical connectors. | 10-10-2013 |
| 20130264592 | WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A SINGLE CARRIER DIE - An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide multiple LED dies that are joined to a single carrier die. The multiple LED dies on the single carrier die are connected in series and/or in parallel by interconnection in the LED dies and/or in the single carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area. Related devices and fabrication methods are described. | 10-10-2013 |
| 20130264593 | DISPLAY DEVICE - In a display device connected with an IC driver, particularly the reliability of connection between an IC terminal located on the outermost side and the IC driver is improved. IC terminals and flexible wiring board terminals are formed on a terminal region of a TFT substrate. A plurality of the IC terminals are formed at a predetermined pitch. The reliability of an outermost IC terminal is degraded as compared with the reliability of the other IC terminals caused by the loading effect in etching a protection insulating film. In order to prevent this degradation, a dummy terminal is formed on the outer side of the outermost IC terminal, and the loading effect on the outermost IC terminal is made equal to the loading effect on the other IC terminals. Accordingly, degradation in the reliability of the outermost IC terminal is prevented. | 10-10-2013 |
| 20130270581 | MULTI-CHIP LIGHT EMITTER PACKAGES AND RELATED METHODS - Light emitter packages having multiple light emitter chips, such as light emitting diode (LED) chips, and related methods are provided. In one aspect, a light emitter package can include a submount, an array of light emitter chips disposed on a portion of the submount, and a lens provided over the submount and covering at least portions of the array. In some aspects, at least some of the light emitter chips can be adapted to emit light of a first dominant wavelength. In further aspects, at least some other light emitter chips are adapted to emit light of a second dominant wavelength that is different than the first dominant wavelength. In some aspects, the lens can be asymmetric. In some aspects, a collective center of the chips, or a center of an array of chips can be offset from a center of the asymmetric lens. | 10-17-2013 |
| 20130270582 | Display Device - Disclosed are a TFT array substrate for decreasing a bezel width and a display device including the same. The display device includes a first substrate including a display area (including a pixel formed in a pixel area defined by a gate line and a data line which intersect) and a non-display area that includes a built-in shift register connected to the gate line and a gate link part connected to the built-in shift register, a second substrate facing the first substrate, and a seal pattern formed in the non-display area of the first substrate in correspondence with an edge portion of the second substrate to facing-couple the first and second substrates. The seal pattern includes a first hardening area hardened by a first hardening process, and a second hardening area hardened by a second hardening process. | 10-17-2013 |
| 20130270583 | METHOD OF FORMING COPPER WIRING AND METHOD OF MANUFACTURING DISPLAY DEVICE - A method of forming a copper wiring includes forming a copper film on a substrate; forming a resist on the copper film in accordance with a predetermined pattern; forming an oxide film on the copper film on which the resist is formed; etching the copper film on which the oxide film is formed; and removing the resist after the etching of the copper film. | 10-17-2013 |
| 20130270584 | OPTOELECTRONIC PACKAGE AND METHOD FOR MAKING SAME - An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided. | 10-17-2013 |
| 20130277689 | NIGHT VISION IMAGING SYSTEM (NVIS) COMPATIBLE LIGHT EMITTING DIODE - The present disclosure is directed to an LED assembly that is compatible for use with a night vision imaging system or any other system that requires an LED with specific transmission or rejection wavelength bands. Such LEDs may emit selective wavelength bands anywhere between 400 nm and 700 nm of the electromagnetic spectrum while limiting selective wavelength bands anywhere between 700 and 1200 nanometers. In one embodiment, the LED is manufactured by coating one or more inorganic thin film optical coatings onto the LED and then protecting the LED and thin film optical coating with a resin encapsulant. In other embodiments, additional near infrared photochemical or color correcting dyes are incorporated directly into the encapsulant. | 10-24-2013 |
| 20130277690 | LOW PROFILE LIGHTING MODULE - A low profile lighting module. Devices according to this disclosure can produce a uniform light intensity output profile, limiting the perceived appearance of individual point sources, from direct lighting modules comprising several light emitting diodes. Individual lighting device components are disclosed that can contribute to this uniform profile, including: primary optics, secondary optics, and contoured housing elements. These components can interact with and control emitted light, thus adjusting its pattern. These components can alter the direction of emitted light, providing a more uniform light intensity over a wider range of viewing angle. | 10-24-2013 |
| 20130277691 | DISPLAY DEVICE - A display device in which various embodiments can prevent a vertically-striped blur is disclosed. In one aspect, the display device includes first gate lines, second gate lines, data lines, dummy data lines, and a plurality of pixels. The first and second gate lines are extended in a first direction. The data lines and the dummy data lines are extended in a second direction intersecting the first direction. The pixels are defined by the intersection of a first gate line of the first gate lines and a first data line of the data lines. | 10-24-2013 |
| 20130285075 | LIGHT-EMITTING DEVICE - A light-emitting device includes a support substrate; a light-emitting stacked layer; transparent-conductive bonding layer; and a semiconductor contact layer. The light-emitting stacked layer includes a first semiconductor layer; an active layer; and a second semiconductor layer, wherein a polarity of the first semiconductor layer is different from that of the semiconductor layer. A first pad is formed on an exposed portion of the first semiconductor layer and a second pad is formed on the semiconductor contact layer. A polarity of the semiconductor contact layer is different from that of the second semiconductor layer. | 10-31-2013 |
| 20130285076 | LIGHT EMITTING DIODE DEVICE - A light emitting diode (LED) device includes at least one stacking LED unit. The stacking LED unit includes a plurality of epitaxial structures interleaved with tunnel junctions. For a given predetermined input power, the plurality of epitaxial structures may reduce an operating current density of the stacking LED unit as compared to an LED unit with a single epitaxial structure and the same horizontal size. The reduced operating current density approaches a quantum efficiency peak. Additionally, for a given predetermined input power, the stacking LED unit may operate in a current density interval corresponding to a quantum efficiency within 20% decrement of the quantum efficiency peak. | 10-31-2013 |
| 20130285077 | LIGHT EMITTING MODULE - According to one embodiment, a light emitting module includes a mounting substrate, a plurality of light emitting chips, a transparent layer, and a phosphor layer. The transparent layer is provided between the plurality of light emitting chips on the mounting face and on the light emitting chip. The transparent layer has a first transparent body and a scattering agent dispersed at least in the first transparent body between the plurality of light emitting chips. The scattering agent has a different refraction index from a refraction index of the first transparent body. The phosphor layer is provided on the transparent layer. The light emitting chip includes a semiconductor layer, a p-side electrode, an n-side electrode, a p-side external terminal, and an n-side external terminal. | 10-31-2013 |
| 20130285078 | SEMICONDUCTOR DEVICE HAVING DISPLAY DEVICE - A semiconductor integrated circuit having a high withstand voltage TFT and a TFT which is capable of operating at high speed in a circuit of thin film transistors (TFT) and methods for fabricating such circuit will be provided. A gate insulating film of the TFT required to operate at high speed (e.g., TFT used for a logic circuit) is relatively thinned less than a gate insulating film of the TFT which is required to have high withstand voltage (e.g., TFT used for switching high voltage signals). | 10-31-2013 |
| 20130285079 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A display device includes a laminated wiring formed of a low-resistance conductive film, and a low-reflection film mainly containing Al and functioning as an antireflective film which are sequentially arranged on a transparent substrate, a wiring terminal part provided at an end part of the laminated wiring and has the same laminated structure as that of the laminated wiring, and an insulating film for covering the laminated wiring and the wiring terminal part, in which the insulating film side serves as a display surface side, the wiring terminal part has a first opening part penetrating the insulating film and the low-reflection film and reaching the low-resistance conductive film, and an outer peripheral portion of the first opening part has a laminated structure of the low-resistance conductive film, the low-reflection film, and the insulating film, in at least one part. | 10-31-2013 |
| 20130285080 | SEMICONDUCTOR LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, IMAGE DISPLAY DEVICE, AND ELECTRONIC APPARATUS - A semiconductor light emitting device including an active layer, a compound semiconductor layer on the active layer, a contact layer on the compound semiconductor layer, and an electrode on the contact layer, where the contact layer is substantially the same size as the electrode. | 10-31-2013 |
| 20130285081 | Optoelectronic Semiconductor Component - An optoelectronic semiconductor component, the includes at least two optoelectronic semiconductor chips , which are located on a common mounting surface. An optical element is arranged downstream of the semiconductor chips in a main emission direction and is spaced from the semiconductor chips. In a direction transverse to the main emission direction the optical element has a transmission gradient in a transitional region. The transitional region does not overlap the semiconductor chips, when viewed in plan view onto the mounting surface. | 10-31-2013 |
| 20130285082 | LED PACKAGE COMPRISING ENCAPSULATION - Light emitting elements ( | 10-31-2013 |
| 20130292708 | SUBMOUNT BASED LIGHT EMITTER COMPONENTS AND METHODS - Submount based light emitter components and methods are provided herein. In one aspect, a submount based light emitter component can include a primary submount, a secondary submount, and at least one light emitter chip. The at least one light emitter chip can be disposed over the primary submount and electrically connected to the secondary submount. | 11-07-2013 |
| 20130292709 | LED Lens Design with More Uniform Color-Over-Angle Emission - An LED device with improved angular color performance has a silicone lens shaped as a portion of a sphere. The lens is molded over an array of LED dies disposed on the upper surface of a substrate. Phosphor particles are disbursed throughout the material used to mold the lens. The distance between farthest apart edges of the LED dies is more than half of the length that the lens extends over the surface of the substrate. The distance from the top of the lens dome to the surface of the substrate is between 57% and 73% of the radius of the sphere. Shaping the lens as the top two thirds of a hemisphere reduces the non-uniformity in the emitted color such that neither of the CIE color coordinates x or y of the color changes more than 0.004 over all emission angles relative to the surface of the substrate. | 11-07-2013 |
| 20130292710 | LIGHT EMITTING DEVICE - A light emitting device includes: a support substrate; at least one light emitting laminate having a structure in which semiconductor layers are laminated and formed on the support substrate; a wall unit formed on the support substrate and surrounding the at least one light emitting laminate; and a wavelength conversion layer disposed above the at least one light emitting laminate. | 11-07-2013 |
| 20130292711 | DISPLAY DEVICE CAPABLE OF EMITTING LIGHT FROM OPPOSITE SIDES - A display device includes a transparent substrate, and a plurality of single-crystal thin-film semiconductor light-emitting elements disposed on one side of the transparent substrate. Each of the single-crystal thin-film semiconductor light-emitting elements is composed of single-crystal thin-film semiconductor layers separated from a base substrate, and includes a light-emitting layer and two non-light-emitting layers disposed on both sides of the light-emitting layer. | 11-07-2013 |
| 20130292712 | MULTI-DIMENSIONAL SOLID STATE LIGHTING DEVICE ARRAY SYSTEM AND ASSOCIATED METHODS AND STRUCTURES - A multi-dimensional solid state lighting (SSL) device array system and method are disclosed. An SSL device includes a support, a pillar having several sloped facets mounted to the support, and a flexible substrate pressed against the pillar. The substrate can carry a plurality of solid state emitters (SSEs) facing in various directions corresponding to the sloped facets of the pillar. The flexible substrate can be a flat substrate prepared using planar mounting techniques, such as wirebonding techniques, before bending the substrate against the pillar. | 11-07-2013 |
| 20130292713 | ARRAY SUBSTRATE OF DISPLAY PANEL - An array substrate of display panel includes a plurality of gate lines, common lines, data lines and repairing segments. The data line includes a first data line, and the common line includes a first common line. The first common line penetrates through first, second and third pixel areas, and the first data line has a broken line defect on a side of the first pixel area. The first common line has a first cutting part in the second pixel area and a second cutting part in the third pixel area, and the first common line between the first and second cutting parts forms a floating common repairing segment. In the second pixel area, the first data line is electrically connected to the common repairing segment through the repairing segment. In the third pixel area, the first data line is electrically connected to the common repairing line through the repairing segment. | 11-07-2013 |
| 20130292714 | LIGHT EMITTING DEVICE, LIGHT EMITTING SYSTEM HAVING THE SAME, AND FABRICATING METHOD OF THE LIGHT EMITTING DEVICE AND THE LIGHT EMITTING SYSTEM - A semiconductor device includes a first light emitting chip, the first light emitting chip having a first semiconductor layer, a second semiconductor layer, and a first active layer disposed therebetween, a second light emitting chip disposed on the first light emitting chip, the second light emitting chip having a third semiconductor layer, a fourth semiconductor layer, and a second active layer disposed therebetween, and a conductive layer disposed between the first semiconductor layer and the fourth semiconductor layer, the first semiconductor layer and the fourth semiconductor layer having different conductivity types. | 11-07-2013 |
| 20130292715 | METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT AND COMPONENT - A method of producing an optoelectronic component including providing an epitaxially grown layer sequence on a growth substrate, which comprises a suitable layer for light emission; applying a metal layer to the epitaxially grown layer sequence; applying a molding support to the metal layer, the molding support including a support material with a first coefficient of thermal expansion and a fiber mesh with a second coefficient of thermal expansion functionally bonded to the support material; and detaching the growth substrate. | 11-07-2013 |
| 20130292716 | LIGHT EMITTING DEVICE CHIP SCALE PACKAGE - The substrate that is used to support the growth of the LED structure is used to support the creation of a superstructure above the LED structure. The superstructure is preferably created as a series of layers, including conductive elements that forma conductive path from the LED structure to the top of the superstructure, as well as providing structural support to the light emitting device. The structure is subsequently inverted, such that the superstructure becomes the carrier substrate for the LED structure, and the original substrate is thinned or removed. The structure is created using materials that facilitate electrical conduction and insulation, as well as thermal conduction and dissipation. | 11-07-2013 |
| 20130299851 | LIGHTING DEVICE - A lighting device includes first and second light emission units. The first light emission unit emits light having a relatively low color temperature and a high feeling of contrast index. The second light emission unit emits light having a relatively high S/P ratio, which is the ratio of scotopic luminance to photopic luminance. The first light emission unit illuminates a region located at a vertical upper side of a region illuminated by the second light emission unit. | 11-14-2013 |
| 20130299852 | SUBSTRATE FOR OPTICAL SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME, OPTICAL SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a substrate for an optical semiconductor apparatus for mounting optical semiconductor devices, the substrate comprising first leads to be electrically connected to first electrodes of the optical semiconductor devices and second leads to be electrically connected to second electrodes of the optical semiconductor devices, wherein the first leads and the second leads are arranged each in parallel, a molded body of a thermosetting resin composition is molded by injection molding in a penetrating gap between the first leads and the second leads such that the substrate is formed in a plate shape, and an exposed front surface and an exposed back surface of the first leads, the second leads and the resin molded body each tie in a same plane. The substrate exhibits excellent heat dissipation properties and enables manufacture of a thin optical semiconductor apparatus with a low cost. | 11-14-2013 |
| 20130299853 | HIGH VOLTAGE LIGHT EMITTING DIODE AND FABRICATING METHOD THEREOF - A method for fabricating a high voltage light emitting diode (HV LED) includes: calculating a total area of the HV LED according to a predetermined light emission luminance; calculating the number of sub-LEDs according to a predetermined operating voltage; subtracting, from the total area, areas of isolation trenches between the sub-LEDs, electrode areas and areas of series-connected conductive leads between the sub-LEDs, and then dividing the difference obtained through the subtraction by the number of the sub-LEDs, so as to calculate an effective light emission area of each of the sub-LEDs; and according to the effective light emission area, adjusting the area of a sub-LED having an electrode and the area of a sub-LED having no electrode, so as to enable the area of the sub-LED having an electrode to be greater than the area of the sub-LED having no electrode. An HV LED manufactured by the above method. | 11-14-2013 |
| 20130299854 | LIGHT EMITTING DEVICE, METHOD OF FABRICATING THE SAME AND LIGHTING SYSTEM - A light emitting device according to an embodiment includes a body including first and second side walls which correspond to each other, third and fourth side walls which have lengths longer than lengths of the first and second side walls, and a concave portion; a first lead frame under the concave portion and the third side wall; a second lead frame under the concave portion and the fourth side wall; a light emitting chip on at least one of the first and second lead frames; a molding member on the concave portion; a first recess portion recessed from the first side wall toward the second side wall and connected to a bottom of the body; and a second recess portion recessed from the second side wall toward the first side wall and connected to the bottom of the body. | 11-14-2013 |
| 20130299855 | Wafer Level Reflector for LED Packaging - An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter. | 11-14-2013 |
| 20130299856 | LUMINOUS GLAZING UNIT - A luminous glazing unit including at least one substrate formed by a transparent glazing element; at least one light source; and at least one light extraction device for extracting the light, the extraction device being arranged to create a luminous region, the extraction device being formed by at least one fibrous layer. | 11-14-2013 |
| 20130306994 | DISPLAY PANEL - A display panel includes a fiber reinforced plastic substrate having a first lattice pattern with a first lattice period P, and a pixel layer disposed on the substrate having a second lattice pattern having a second lattice period H, in which if H>P, P and H satisfy | 11-21-2013 |
| 20130306995 | METHOD FOR MAKING GLASS SUBSTRATE FOR DISPLAY, GLASS SUBSTRATE AND DISPLAY PANEL - A method for manufacturing a glass substrate for a display includes a step of producing a glass substrate and a step of performing a surface treatment on one glass surface of major surfaces of the glass substrate to form surface unevenness. The surface treatment is performed such that protruded portions having a height of 1 nm or more from the surface roughness central plane of the surface unevenness are dispersedly provided on the glass surface after the surface treatment and the area ratio of the protruded portions with respect to the area of the glass surface is 0.5-10%. Using this glass substrate, semiconductor elements are formed on a major surface of the glass substrate opposite to the glass surface. Accordingly, a display panel is produced. | 11-21-2013 |
| 20130306996 | ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS - An electro-optical device includes a scanning line and a data line intersecting each other, a pixel circuit provided at a position corresponding to an intersection of the scanning line and the data line, and a power supply wiring line that supplies a given potential. The pixel circuit includes a light emitting element and a driving transistor configured to control a current flowing through the light emitting element. A gate electrode of the driving transistor is electrically connected via a first relay electrode to a given node. The first relay electrode is formed in the same layer as the power supply wiring line and the data line. The first relay electrode is surrounded on at least three sides by the power supply line. | 11-21-2013 |
| 20130306997 | SEMICONDUCTOR LIGHT EMITTING DEVICE HAVING MULTI-CELL ARRAY AND MANUFACTURING METHOD THEREOF, LIGHT EMITTING MODULE, AND ILLUMINATION APPARATUS - A semiconductor light emitting device includes a substrate and a plurality of light emitting cells disposed on the substrate. Each light emitting cell includes first and second conductive semiconductor layers having an active layer formed therebetween, and first and second electrodes formed on the first and second layers. A first insulation layer is formed on portions of the light emitting cell, while a second insulation layer entirely covers at least one light emitting cell. A method of manufacturing the semiconductor light emitting device, and a light emitting module and an illumination apparatus including the semiconductor light emitting device are also provided. | 11-21-2013 |
| 20130306998 | LED White Light Source with Remote Photoluminescent Reflecting Converter - The proposed illuminator relates to white-light lamps based on LEDs with remote photoluminescent converters. The illuminator comprises a heat removing base with a radiation output orifice, and the LEDs secured near the periphery of the orifice, with, arranged in series at a distance from the a concave photoluminescent converter layer and a concave light reflector, wherein the converter layer's and light reflector's concavities are oriented towards the LED's and the opening. White light mix of the LEDs' and converter layer's radiation exits via the orifice. The converter layer and reflector may have the form of a truncated ellipsoid of revolution, in particular a sphere, or a paraboloid, with a main axis perpendicular to the plane of the orifice, or a cylinder truncated by the plane of the orifice. The outside reflector' surface may have ribbed heat radiators associated with the heat removing base. | 11-21-2013 |
| 20130313580 | LIGHTING DEVICE - This invention discloses a lighting device for providing an illumination with enhanced color uniformity. The lighting device includes a light generating element adjacent a substrate and configured to produce light having wavelengths substantially within a first wavelength range; a transparent frame attached to the substrate, surrounding the transparent frame; a wavelength converting layer for converting a portion of the light produced by the light generating element into light having wavelengths within a second wavelength range, substantially covering the light emitting surface and at least part of the transparent frame; and a scattering frame configured to substantially scatter light that travels therein, covering a portion of the light emitting surface around periphery thereof to thereby receive a portion of the light leaving the wavelength converting layer around the periphery of the light emitting area. Light components in said portion of the light are substantially mixed in the scattering frame. | 11-28-2013 |
| 20130313581 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE - According to one embodiment, a semiconductor light emitting device includes: a semiconductor layer including a first and second surfaces, and a light emitting layer; a p-side electrode provided on the second surface; an n-side electrode provided on the second surface; a first insulating film covering the p-side and the n-side electrodes; a p-side wiring section electrically connected to the p-side electrode through the first insulating film; an n-side wiring section electrically connected to the n-side electrode through the first insulating film; and a phosphor layer provided on the first surface. The phosphor layer has an upper surface and an oblique surface, the oblique surface forming an obtuse angle with the upper surface and inclined with respect to the first surface. Thickness of the phosphor layer immediately below the oblique surface is smaller than thickness of the phosphor layer immediately below the upper surface. | 11-28-2013 |
| 20130313582 | UNITARY DISPLAY PANNEL AND METHOD OF MANUFACTURING THE SAME - A monolithically integrated display panel is formed to include a substrate, a first electrode disposed on the substrate, a partitioning member disposed above the first electrode where the partitioning member defines a substantially containerizing volume for a to-be-introduced and then later selectively removed sacrificial member, a light attribute controlling material disposed in the containerizing volume and replacing the selectively removed sacrificial member, where an upper width of the light attribute controlling material is substantially different in dimension than a lower width of the light attribute controlling material, and a second electrode disposed above the light attribute controlling material and insulated from the first electrode. | 11-28-2013 |
| 20130313583 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - The present application relates to a light-emitting device and method of manufacturing the same. The device includes a lower portion, and vertical light-emitting structures disposed on the lower portion. A conductive member partially surrounds the vertical light-emitting structures, and reflective members are disposed between the vertical light-emitting structures. The reflective members reflect light that is emitted in a lateral direction from the vertical light-emitting structures to minimize the number of times that light emitted in a lateral direction from the vertical light-emitting structure is transmitted through the light-absorbing member, thereby increasing a luminous efficiency. | 11-28-2013 |
| 20130320361 | MULTICHIP PACKAGE STRUCTURE FOR GENERATING A SYMMETRICAL AND UNIFORM LIGHT-BLENDING SOURCE - A multichip package structure for generating a symmetrical and uniform light-blending source includes a substrate unit, a light-emitting unit and a package unit. The substrate unit includes a substrate body and at least one bridging conductive layer disposed on the top surface of the substrate body. The light-emitting unit includes at least two first light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body and at least two second light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body. The package unit includes at least two first light-transmitting package bodies respectively covering the at least two first light-emitting elements and at least two second light-transmitting package bodies respectively covering the at least two second light-emitting elements. | 12-05-2013 |
| 20130320362 | HIGH VOLTAGE LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACUTING THE SAME - A high voltage LED package includes a substrate and LED chips formed on a top surface of the substrate. A periphery of each LED chip is roughened. The LED chips are electrically connected in series. | 12-05-2013 |
| 20130320363 | SAPPHIRE SUBSTRATE CONFIGURED TO FORM LIGHT EMITTING DIODE CHIP PROVIDING LIGHT IN MULTI-DIRECTIONS, LIGHT EMITTING DIODE CHIP, AND ILLUMINATION DEVICE - A sapphire substrate configured to form a light emitting diode (LED) chip providing light in multi-directions, a LED chip and an illumination device are provided in the present invention. The sapphire substrate includes a growth surface and a second main surface opposite to each other. A thickness of the sapphire substrate is thicker than or equal to 200 micrometers. The LED chip includes the sapphire substrate and at least one LED structure. The LED structure is disposed on the growth surface and forms a first main surface where light emitted from with a part of the growth surface without the LED structures. At least a part of light beams emitted from the LED structure pass through the sapphire substrate and emerge from the second main surface. The illumination device includes at least one LED chip and a supporting base. The LED chip is disposed on the supporting base. | 12-05-2013 |
| 20130320364 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A display device in which light leakage in a monitor element portion is prevented without increasing the number of steps and cost is provided. The display device includes a monitor element for suppressing influence on a light-emitting element due to temperature change and change over time and a TFT for driving the monitor element, in which the TFT for driving the monitor element is provided so as not to overlap the monitor element. Furthermore, the display device includes a first light shielding film and a second light shielding film, in which the first light shielding film is provided so as to overlap a first electrode of the monitor element and the second light shielding film is electrically connect to the first light shielding film through a contact hole formed in an interlayer insulating film. The contact hole is formed so as to surround the outer edge of the first electrode of the monitor element. | 12-05-2013 |
| 20130320365 | LIGHTING DEVICE - A lighting device includes a heat sink, through which air can flow transversely to its longitudinal extension and a plurality of semiconductor light sources, in particular light-emitting diodes, arranged on the heat sink, wherein at least two of the semiconductor light sources are aligned in different directions. | 12-05-2013 |
| 20130320366 | LIGHT SOURCE AND LIGHT-SOURCE BAND - LED light source having at least one light-emitting component. The light-emitting component is at least partly protected with a transparent protective material, which contains aliphatic thermoplastic polyurethane (TPU). A light-source band also includes at least one light-emitting component. | 12-05-2013 |
| 20130328068 | DEVICES, SYSTEMS, AND METHODS RELATED TO DISTRIBUTED RADIATION TRANSDUCERS - Radiation-transducer devices, e.g., lighting-emitting devices, including radiation transducers, e.g., light-emitting diodes, and associated devices, systems, and methods are disclosed herein. A radiation-transducer device configured in accordance with a particular embodiment includes a base structure including a first lead, a cap structure including a second lead, and a plurality of radiation transducers irregularly distributed between the base structure and the cap structure. The radiation transducers are non-uniformly oriented relative to the first and second leads and the device is configured to intermittently power the radiation transducers using an alternating current. A method for manufacturing radiation-transducer devices in accordance with a particular embodiment includes distributing a plurality of radiation transducers onto a base structure or a cap structure without individually handling the radiation transducers. The radiation transducers are introduced via a mixture including the radiation transducers and a non-solid carrier medium. | 12-12-2013 |
| 20130328069 | ACTIVE DEVICE, DRIVING CIRCUIT STRUCTURE, AND DISPLAY PANEL - An active device, a driving circuit structure, and a display panel are provided. The active device includes a gate, a gate insulation layer covering the gate, a semiconductor layer disposed above the gate, an etching stop layer disposed on the gate insulation layer and the semiconductor layer, a source, and a drain. The gate forms a meandering pattern on a substrate. The semiconductor layer has an area substantially defining a device region where the active device is. The etching stop layer has a first contact opening and a second contact opening. The first contact opening and the second contact opening separated from each other and both exposing the semiconductor layer. The source and the drain separated from each other are disposed on the etching stop layer and in contact with the semiconductor layer through the first contact opening and the second contact opening, respectively. | 12-12-2013 |
| 20130328070 | LIGHT EMITTING DEVICES AND SUBSTRATES WITH IMPROVED PLATING - Light emitting devices and substrates are provided with improved plating. In one embodiment, a light emitting device can include a submount and one or more light emitting diodes (LED) chips disposed over the submount. In one embodiment, the submount can include a copper (Cu) substrate, a first metallic layer of material that is highly reflective disposed over the Cu substrate for increased brightness of the device, and a second metallic layer disposed between the Cu substrate and the first metallic layer for forming a barrier therebetween. | 12-12-2013 |
| 20130328071 | MULTILAYER FILM SUBSTRATE, METHOD OF MANUFACTURING MULTILAYER FILM SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING DISPLAY UNIT, AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS - A method of manufacturing a multilayer film substrate, the method includes: forming an adhesion control layer on a first substrate, the adhesion control layer including an adhesion section and a separation section; forming a to-be-peeled layer being fixed to the first substrate in the adhesion section and being inhibited from being adhered to the first substrate in the separation section; laminating a function layer on the to-be-peeled layer; peeling the function layer off from the first substrate together with the to-be-peeled layer; and providing the function layer on a second substrate. | 12-12-2013 |
| 20130328072 | DISPLAY APPARATUS, MANUFACTURING METHOD OF DISPLAY APPARATUS, AND ELECTRONIC DEVICE - A display apparatus includes: a display region provided with a plurality of pixel portions; wires installed to the respective pixel portions within the display region from an outside of the display region and transmitting a signal to drive the respective pixel portions; connection pads provided on the outside of the display region and serving as input portions that provide the wires with a signal while electrically conducting with the wires; switch elements provided on the outside of the display region in a middle of the wires; and a light shielding covering portion shielding the switch elements from light and formed to cover the connection pads while electrically conducting with the connection pads. | 12-12-2013 |
| 20130334545 | Surface light source and display device - The present invention provide a surface light source, wherein, the surface light source comprises a LED light source, the diffusion plate and condenser plant. The diffusion plate has a phosphor, and the diffusion plate and the LED light source are disposed separately to form a heat dissipation space. The condenser device disposes between the LED light source and the diffuser plate for converging the light emitted from LED light source to the diffusion plate. | 12-19-2013 |
| 20130334546 | NOVEL ILLUMINATION DEVICES - Illumination device comprising at least one LED and at least one colour converter comprising at least one organic fluorescent colorant in a matrix consisting essentially of polystyrene or polycarbonate, wherein LED and colour converter are present in a remote phosphor arrangement. | 12-19-2013 |
| 20130341652 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An exemplary light-emitting diode (LED) package includes a first electrode, a second electrode spaced from the first electrode, an electrically insulating substrate sandwiched by and connecting with the first electrode and the second electrode, a first LED chip and a second LED chip mounted on top surfaces of the first and second electrodes respectively, and a reflector covering the top surfaces of the first and second electrodes. The first LED chip mounted on the top surface of the first electrode is above the second LED chip mounted on the top surface of the second surface. L-shaped retaining walls are formed on the top surfaces of the first and second electrodes. By the retaining walls, the LED package can also be used as a side-view LED package. | 12-26-2013 |
| 20130341653 | SOLID STATE LIGHTING COMPONENT - An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips. | 12-26-2013 |
| 20130341654 | LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT HAVING THE SAME - Disclosed is an LED package. The LED package includes a package body, a first frame and a second frame on the package body and a light emitting device chip on the first frame. The first frame is separated from the second frame, and the first frame includes a bottom frame on the package body and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame. | 12-26-2013 |
| 20130341655 | METHOD FOR PRODUCING AN ELECTRICAL TERMINAL SUPPORT - The invention relates to a method for producing an electrical terminal support for an optoelectronic semiconductor body, comprising the following steps: providing a carrier assembly ( | 12-26-2013 |
| 20130341656 | Miniature Surface Mount Device - A surface mount LED package includes a lead frame carrying a plurality of LEDs and a plastic casing at least partially encasing the lead frame. The lead frame includes an electrically conductive chip carrier and first, second, and third electrically conductive connection parts separate from the electrically conductive chip carrier. Each of the first, second and third electrically conductive connection parts has an upper surface, a lower surface, and a connection pad on the upper surface. The plurality of LEDs are disposed on an upper surface of the electrically conductive chip carrier. Each LED has a first electrical terminal electrically coupled to the electrically conductive chip carrier. Each LED has a second electrical terminal electrically coupled to the connection pad of a corresponding one of the first, second, and third electrically conductive connection parts. | 12-26-2013 |
| 20140001495 | LIGHT EMITTING DIODE LAMP | 01-02-2014 |
| 20140001496 | RELAMPABLE LED STRUCTURE | 01-02-2014 |
| 20140001497 | METHOD FOR PROVIDING A REFLECTIVE COATING TO A SUBSTRATE FOR A LIGHT EMITTING DEVICE | 01-02-2014 |
| 20140001498 | Substrate for mounting a plurality of light emitting elements | 01-02-2014 |
| 20140008669 | PARALLEL PLATE SLOT EMISSION ARRAY - Parallel plate slot emission array. In accordance with an embodiment of the present invention, an article of manufacture includes a side-emitting light emitting diode configured to emit light from more than two surfaces. The article of manufacture includes a first sheet electrically and thermally coupled to a first side of the light emitting diode, and a second sheet electrically and thermally coupled to a second side of the light emitting diode. The article of manufacture further includes a plurality of reflective surfaces configured to reflect light from all of the surfaces of the light emitting diode through holes in the first sheet. The light may be reflected via total internal reflection. | 01-09-2014 |
| 20140014978 | LED MODULE - In various embodiments, a light emitting diode module is provided. The light emitting diode module may include at least one light emitting diode; wherein the at least one light emitting diode is connected in parallel with at least one first capacitor; wherein the at least one light emitting diode is arranged in a first structural unit, and the at least one first capacitor is arranged in a second structural unit, wherein the first structural unit and the second structural unit are electrically coupled to one another via a first cable. | 01-16-2014 |
| 20140014979 | LIQUID CRYSTAL DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR - According to a manufacturing method for a liquid crystal display device according to this application, a first terminal hole ( | 01-16-2014 |
| 20140014980 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A reliable semiconductor light-emitting device can include a wavelength converting material in a cavity mounting at least one semiconductor light-emitting chip. The device can also include an encapsulating resin to cover the wavelength converting material so as to emit a wavelength-converted light using light emitted from the chip. The wavelength converting material should include a transparent resin having a large thermal expansion coefficient to maintain a high thermal resistance, and the encapsulating resin is subject to cracks due to a high transparent resin. The semiconductor device can be configured to form a space between the wavelength converting material and the encapsulating resin so that each of the encapsulating resin and the wavelength converting material cannot contact with each other even under a high temperature. Thus, the disclosed subject matter cannot stress in the encapsulating resin when the wavelength converting material expands, and therefore can provide the reliable semiconductor light-emitting device. | 01-16-2014 |
| 20140014981 | DISPLAY APPARATUS - A display apparatus including a display panel including a pixel electrode and a plurality of first signal lines transmitting a driving signal to the pixel electrode, a conductive member on the first signal lines, the conductive member having a resin, and a second signal line on the conductive member, the second signal line having an opening through which the resin travels to couple the second signal line with one of the first signal lines. | 01-16-2014 |
| 20140021492 | STRUCTURED LAMINATION TRANSFER FILMS AND METHODS - Lamination transfer films and methods for transferring a structured layer to a receptor substrate. The transfer films include a carrier substrate having a releasable surface, a sacrificial template layer applied to the releasable surface of the carrier substrate and having a non-planar structured surface, and a thermally stable backfill layer applied to the non-planar structured surface of the sacrificial template layer. The sacrificial template layer is capable of being removed from the backfill layer, such as via pyrolysis, while leaving the structured surface of the backfill layer substantially intact. | 01-23-2014 |
| 20140021493 | SOLID STATE LIGHTING COMPONENT PACKAGE WITH LAYER - A solid state lighting component comprising a layer having high reflectivity and/or scattering properties, the layer positioned about a solid state lighting component, and manufacturing methods of making same is disclosed. A method of increasing the luminous flux of the solid state lighting component, is also provided. | 01-23-2014 |
| 20140021494 | COLOR FILTER ON ARRAY SUBSTRATE AND A MANUFACTURING METHOD FOR THE SAME - A color filter on array (COA) substrate and a manufacturing method for the same are proposed. The COA substrate includes a transparent substrate, a thin film transistor (TFT), a color filter unit, and a pixel electrode. The color filter unit is disposed in a groove of the transparent substrate for transforming a beam of light sent to the color filter unit into the beam of light of a predetermined hue. The pixel electrode is disposed on the color filter unit and coupled to a drain of the TFT. The pixel electrode is used for controlling the rotational alignment of liquid crystals in a liquid crystal layer based upon the electrical level of an electrical signal transmitted to the drain when a scan impulse is received by a gate of the TFT. In addition, the color filter unit is formed in the groove, and the pixel electrode is formed on the color filter unit, implying that it is unnecessary to form a via on a passivation layer so that the drain could be connected to the pixel electrode through the via. Thus, etching the passivation layer for forming the via is omitted in the present invention. | 01-23-2014 |
| 20140021495 | LIGHT EMITTING DEVICE WITH PHOSPHOR WAVELENGTH CONVERSION - A light emitting device comprises: a thermally conductive substrate (MCPCB); at least one LED mounted in thermal communication with a surface of the substrate; a housing attached to the substrate and configured such the housing and substrate together define a volume that totally encloses the at least one LED, the housing comprising at least a part that is light transmissive (window); and at least one phosphor material provided on an inner surface of the housing within said volume said phosphor being operable to absorb at least a part of the excitation light emitted by the at least one light emitting diode and to emit light of a second wavelength range. The housing is attached to the substrate such that the volume is substantially water tight, preferably air/gas tight. | 01-23-2014 |
| 20140021496 | THIN FILM TRANSISTOR ARRAY AND EL DISPLAY EMPLOYING THEREOF - An EL display has a luminescence unit having a luminescence layer being disposed between the pair of electrodes, and a transistor array unit controlling the luminescence of the luminescence unit. An interlayer insulating film is disposed between the luminescence unit and the transistor array unit. An electrode of the luminescence unit is connected electrically to the transistor array unit via a contact hole provided in the interlayer insulation film. The transistor array unit has a wiring component made of copper or copper alloy. The wiring component has a lower layer pattern made of copper or copper alloy, and an upper layer pattern made of metal material different from that for the lower layer pattern. The upper layer pattern covers the upper surface and the side surface of the lower layer pattern. | 01-23-2014 |
| 20140021497 | SEMICONDUCTOR LIGHT SOURCE FOR ILLUMINATING A PHYSICAL SPACE INCLUDING A 3-DIMENSIONAL LEAD FRAME - A semiconductor light source for illuminating physical spaces may include a lead frame with multiple facets. Each facet may have one or more semiconductor light emitting devices, such as LEDs, located on it. The light source is disclosed in threaded, surface mounted, and bar light configurations. | 01-23-2014 |
| 20140021498 | Light Emitting Element, Light Emitting Device Using the Light Emitting Element, and Transparent Substrate Used in Light Emitting Elements - In order to improve the light extraction efficiency of a light-emitting element, the light-emitting element includes: a light-emitting layer provided between an electrode and a transparent substrate; a particle layer provided between the light-emitting layer and the transparent substrate; and an adhesive layer provided between the light-emitting layer and the particle layer, the particle layer includes particles having a refraction index that is higher than a refraction index of the transparent substrate, the adhesive layer has a refraction index that is higher than the refraction index of the transparent substrate, and the particle layer has an average thickness that is less than an average particle size of the particles. | 01-23-2014 |
| 20140027790 | AGGREGATION OF SEMICONDUCTOR DEVICES AND THE METHOD THEREOF - An aggregation of semiconductor devices, comprising: a first layer comprising a first surface and a second surface; a second layer comprising a first region and a second region; and a plurality of semiconductor devices disposed between the first layer and the second region wherein a shape of the second region comprises a curve and a mark. | 01-30-2014 |
| 20140027791 | DISPLAY APPARATUS - A display apparatus includes a first substrate having a display area and a non-display area surrounding the display area, an organic film on the first substrate, a first trench in the organic film in the non-display area, the first trench surrounding the display area and including a first sidewall on an inner side of the display apparatus, which includes a sidewall of the organic film, and a second sidewall on an outer side of the display apparatus, which includes a sidewall of the organic film, and a first blocking film containing an inorganic material and covering a surface of the organic film in the non-display area and the sidewall of the organic film included in the first sidewall of the first trench. | 01-30-2014 |
| 20140027792 | LIGHT EMITTING DEVICE AND ELECTRONIC APPARATUS - An organic EL device as a light emitting device includes: a first light emitting element that is disposed on a first surface of a substrate and that has a first pixel electrode; a second light emitting element that has a second pixel electrode; and an insulating layer that is provided with a first opening which exposes the first pixel electrode and a second opening which exposes the second pixel electrode. Further, in the organic EL device, the first opening is configured so that the insulating layer covers equal to or more than 50% of the circumferential edge portion of the first pixel electrode, and the second opening is configured so that the insulating layer covers less than 50% of the circumferential edge portion of the second pixel electrode. | 01-30-2014 |
| 20140027793 | ACTIVE MATRIX SUBSTRATE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC DEVICE - An active matrix substrate is provided which does not cause reductions in the brightness of electroluminescence elements, and which comprises appropriate peripheral circuitry occupying a small area. The active matrix substrate comprises peripheral circuits to supply current to EL elements provided for each pixel, and corresponding to EL elements, and further comprises a holding element which holds a control voltage, a first active element connected to the holding element and which supplies current to a light-emitting portion based on a control voltage, and a second active element connected to the holding element and which controls the charging and discharging of the holding element. In particular, the second active element is configured as a multiple-control-terminal type active element. As a result, there are no fluctuations in the programmed current. | 01-30-2014 |
| 20140027794 | LIGHT EMITTING DEVICE FOR LINEAR LIGHT SOURCE - A light emitting device includes: a substrate; a first metal film formed on the substrate; quadrilateral light emitting elements arranged in a line at an interval d | 01-30-2014 |
| 20140027795 | LED PACKAGE WITH ENCAPSULANT HAVING CURVED AND PLANAR SURFACES - LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with curved and planar surfaces. The packages can comprise a submount with a one or a plurality of LEDs, and in those with a plurality of LEDs each of the LEDs can emit the same or different wavelengths of light than the others. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant can be on the submount, over at least some of the LEDs, with each of the planar surfaces being vertical and aligned with one of the edges of the submount. The encapsulant can also have a upper curved surface with a relatively large radius of curvature, with the combination of curved and planar surfaces resulting in efficient emission of light with a relatively narrow emission profile. | 01-30-2014 |
| 20140027796 | Optical Device and Method for Manufacturing Same - The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate. | 01-30-2014 |
| 20140034973 | LIGHT-EMITTING DEVICE - A light-emitting device including: a base; light-emitting elements arranged on the base at intervals in an array along a predetermined direction of the base; and conductive-wiring parts formed on first and second sides of the array of the light-emitting elements on the base. The conductive-wiring parts are discretely formed along the predetermined direction of the base, each of the conductive-wiring parts relaying electricalconnection between the light-emitting elements, and the number of the conductive-wiring parts arranged per light-emitting element on each of the first and second sides of the array of the light-emitting elements is two or more. | 02-06-2014 |
| 20140034974 | LIGHT-EMITTING DEVICE - A light-emitting diode device is disclosed, which includes a substrate; a plurality of light-emitting diode units, each of the light-emitting diode units being an equilateral polygon with more than four sides, are disposed on the substrate; wherein each of the light-emitting diode units includes a first electrical connecting area disposed along a first side of the light-emitting diode unit, a second electrical connecting area disposed along a second side of the light-emitting diode unit, and a conductive connecting structure disposed on each of the electrical connecting areas; wherein each of the electrical connecting area electrically connects to one another light-emitting diode unit through the conductive connecting structure. | 02-06-2014 |
| 20140042464 | Array Substrate, Display Device And Manufacturing Method Of The Array Substrate - There are provided an array substrate, a display device and a manufacturing method of the array substrate. The array substrate includes: a base substrate; a set of gate lines located over the base substrate; a black matrix that permeates into the base substrate around each of the gate lines. In technical solutions of the invention, the black matrix is located on the array substrate but not located on the color filter substrate, permeates into the base substrate around each gate line, and has a relatively high accuracy of alignment with the array substrate. | 02-13-2014 |
| 20140042465 | ARRAY SUBSTRATE, METHOD FOR FABRICATING THE SAME AND DISPLAY DEVICE - Provided are an array substrate, a method for fabricating the same and a display device. The array substrate comprises: a transparent pixel electrode, a first data line and a first transparent common electrode, the array substrate further comprises: a second data line and an insulating layer having a via hole disposed in an non-aperture region of the array substrate, the second data line is connected to an extension of the transparent pixel electrode and connected to the second transparent common electrode through the via hole in the insulting layer. | 02-13-2014 |
| 20140042466 | Method for Producing at Least One Optoelectronic Semiconductor Component - A method can be used to provide at least one optoelectronic semiconductor component, A carrier includes a first surface and a second surface opposite the first surface. At least one optoelectronic semiconductor chip is arranged on the first surface of the carrier. The optoelectronic semiconductor chip is formed with at least one n-side region and at least one p-side region, and is applied with the n-side region or the p-side region to the first surface. An electrically insulating enclosure is arranged on exposed points of the outer faces of the semiconductor chip and of the first surface of the carrier. The electrically insulating enclosure is partially removed. After removal at least one major face, remote from the carrier, of the optoelectronic semiconductor chip is free of the electrically insulating enclosure at least in places. | 02-13-2014 |
| 20140042467 | SOLID STATE LIGHT SOURCES WITH COMMON LUMINESCENT AND HEAT DISSIPATING SURFACES - A solid state light source with LEDs in thermal contact to thermally conductive translucent elements where light emitted from the LEDs is directed to emerge from the heat dissipating surfaces of the elements. The thermally conductive translucent elements are arranged or combined with a reflector to form a light recycling cavity. The outside surfaces of the thermally conductive translucent elements forming the cavity become luminescent as the light emitted by the LEDs on the inside of the cavity is continually reflected and recycled until a very high percentage of the light emitted by the LEDs is eventually transmitted through and emitted uniformly and omnidirectionally. Simultaneously, the heat from the LEDs conducts through and to the luminescent outside surfaces of the elements of the cavity, which radiatively and convectively cool the light source thereby eliminating the need for bulky appended heat sinks. | 02-13-2014 |
| 20140042468 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light emitting device includes: a semiconductor chip having a growth surface that is a nonpolar or semipolar plane, and emitting polarized light; and a reflector having a reflective surface. At least part of light in a plane L | 02-13-2014 |
| 20140048824 | LIGHT-EMITTING DEVICE - A light-emitting device of an embodiment of the present application comprises optoelectronic units; a transparent structure having cavities configured to accommodate at least one of the optoelectronic units; and a conductive element connecting at least two of the optoelectronic units. | 02-20-2014 |
| 20140048825 | LIGHT-EMITTING DEVICE - This disclosure discloses a light-emitting display module display. The light-emitting display module comprises: a board; and a plurality of light-emitting diode modules arranged in an array configuration on the board; wherein one of the light-emitting diode modules comprises a plurality of encapsulated light-emitting units spaced apart from each other; and one of the encapsulated light-emitting units comprises a plurality of optoelectronic units, a first supporting, and a fence; and wherein the plurality of optoelectronic units are covered by the first supporting structure, and the fence surrounds the first supporting structure and the plurality of optoelectronic units. | 02-20-2014 |
| 20140048826 | ARRAY SUBSTRATE AND ITS MANUFACTURING METHOD - An array substrate comprises a substrate, a gate electrode, a source electrode and a drain electrode, the source electrode and the drain electrode being provided in different areas on the substrate and the vertical projections of the source electrode and the drain electrode on the substrate having an overlapping area; a semiconductor layer formed between the source electrode and the drain electrode, a vertical projection of the semiconductor layer on the substrate having overlapping areas with the vertical projections of the source electrode and the drain electrode on the substrate; a first insulating layer formed on the substrate while below the gate electrode and covering the source electrode or the drain electrode; a pixel electrode, a gate line, and a data line. A manufacturing method for the array substrate is also disclosed. | 02-20-2014 |
| 20140048827 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device includes: a semiconductor chip having a growth surface that is a nonpolar or semipolar plane, and emitting polarized light; and a reflector having a reflective surface. At least part of light in a plane L | 02-20-2014 |
| 20140054616 | Method and Apparatus for Fabricating Phosphor-Coated LED Dies - The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs. | 02-27-2014 |
| 20140054617 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE - Embodiments of the present invention provide an array substrate, comprising: a base substrate; a gate line and a data line formed on the base substrate, the gate line and the data line crossing with each other to define a pixel region; a thin film transistor and a pixel electrode, disposed in the pixel region; a strip-like common electrode, disposed above the pixel electrode and the data line, the common electrode comprising a first common electrode which covers above the data line and has a width greater than that of the data line; and a second common electrode, disposed above the pixel electrode; an insulating layer, disposed between the common electrode and the pixel electrode as well as between the common electrode and the data line, wherein a region of the first common electrode corresponding to the data line is hollowed out. | 02-27-2014 |
| 20140054618 | LIGHT-EMITTING DIODE DEVICES - An LED device includes an LED chip having a sapphire substrate, a first-type semiconductor layer on the substrate, a second-type semiconductor layer disposed on the first-type semiconductor layer, a first via hole passing through the sapphire substrate and the first-type semiconductor layer, a second via hole passing through the sapphire substrate, and an insulation layer coated on an inner wall of the first via hole; a transparent conductive layer made of electrically conductive material and formed on the second-type semiconductor layer; a cover layer formed on the transparent conductive layer; electrical conductors, each disposed within one of the via holes, wherein the electrical conductor in the first via hole is electrically connected to the second-type semiconductor layer and the electrical conductor in the second via hole is electrically connected to the first-type semiconductor layer; and two linkers for connection to external circuitry, formed on a surface of the sapphire. | 02-27-2014 |
| 20140054619 | Method and Apparatus for Packaging Phosphor-Coated LEDS - The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process. | 02-27-2014 |
| 20140054620 | ARRAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND DISPLAY DEVICE - Embodiments of the present invention provide an array substrate, a method for manufacturing the same and a display device. The method for manufacturing a thin film transistor array substrate comprises: forming a passivation layer and a resin layer on a substrate in sequence; removing a part of the resin layer through a patterning process, so as to form a resin-layer via hole passing through the resin layer; etching the passivation layer under the resin-layer via hole, so as to form a via hole passing through the resin layer and the passivation layer; treating the via hole with an etching process, so that a sidewall at the resin layer and a sidewall at the passivation layer for the via hole smoothly adjoin. | 02-27-2014 |
| 20140054621 | SEMICONDUCTOR LIGHT-EMITTING DEVICE INCLUDING TRANSPARENT PLATE WITH SLANTED SIDE SURFACE - In a semiconductor light-emitting device including a substrate, a semiconductor light-emitting element mounted on a top surface of the substrate, a transparent plate adapted to cover a top surface of the semiconductor light-emitting element, a wavelength-converting layer formed between a top surface of the semiconductor light-emitting element and a bottom surface of the transparent plate, and a reflective material layer surrounding all side surfaces of the semiconductor light-emitting element, the wavelength-converting layer and the transparent plate, at least one of the side surfaces of the transparent plate is slanted in an inward direction at the bottom surface of the transparent plate. | 02-27-2014 |
| 20140054622 | LIGHT EMITTING PACKAGE - The present invention discloses a light emitting package, including: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a width of a cross-sectional shape of the screen member is larger than a height of the cross sectional shape of the screen member, wherein the lens is disposed on the screen member, and wherein the lens is connected to an uppermost surface of the screen member. | 02-27-2014 |
| 20140054623 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device includes: a semiconductor chip having a nonpolar plane as a growth surface and configured to emit polarized light; and a reflector having a reflective surface. When a plane forming an angle of 45° relative to a direction of polarization of the polarized light is a plane L | 02-27-2014 |
| 20140061680 | HIGH VOLTAGE SOLID-STATE TRANSDUCERS AND SOLID-STATE TRANSDUCER ARRAYS HAVING ELECTRICAL CROSS-CONNECTIONS AND ASSOCIATED SYSTEMS AND METHODS - Solid-state transducer (“SST”) dies and SST arrays having electrical cross-connections are disclosed herein. An array of SST dies in accordance with a particular embodiment can include a first terminal, a second terminal and a plurality of SST dies coupled between the first and second terminals with at least a pair of the SST dies being coupled in parallel. The plurality of SST dies can individually include a plurality of junctions coupled in series with an interconnection between each individual junction. Additionally, the individual SST dies can have a cross-connection contact coupled to the interconnection. In one embodiment, the array can further include a cross-connection between the cross-connection contacts on the pair of the SST dies. | 03-06-2014 |
| 20140061681 | DISPLAY SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND ELECTRO-WETTING DISPLAY PANEL HAVING THE SAME - In a display substrate, a method for manufacturing the display substrate and an electro-wetting display apparatus including the display substrate, the display substrate includes a base substrate, a sidewall defining a unit pixel area, a pixel electrode, a hydrophobic insulating layer and a light blocking layer. The sidewall is on the base substrate and defines the unit pixel area. The pixel electrode is in the unit pixel area. The hydrophobic insulating layer is on the sidewall and the pixel electrode. The light blocking layer is on the hydrophobic insulating layer and overlaps the sidewall. | 03-06-2014 |
| 20140061682 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, a semiconductor device includes a conductive member, a semiconductor element, a sealing section. The semiconductor element is provided on an upper surface of the conductive member. The sealing section seals part of the conductive member and the semiconductor element. The upper end of the semiconductor element is located above the uppermost portion of the conductive member. The conductive member includes an inclined surface and a lower surface. The inclined surface is provided on an outside of the sealing section and makes an acute angle with the upper surface. The lower surface is provided outside the sealing section and makes an obtuse angle with the inclined surface. | 03-06-2014 |
| 20140061683 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFCTURING THE SAME - An LED package includes a substrate, an LED chip mounted on the substrate, and a lens formed on the substrate and encapsulating the LED chip therein. The lens includes a top surface and a bottom surface connecting a bottom end of the top surface. The bottom surface is directly formed on the substrate. A tangent of the top surface extends through a joint of the top surface and the bottom surface to define a contacting angle between the tangent and a plumb line, and the contacting angle is not larger than 60 degrees. | 03-06-2014 |
| 20140061684 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device. | 03-06-2014 |
| 20140061685 | LIGHT EMITTING DEVICE - A light emitting device includes a conductive support member, and first and second light emitting structures. A channel layer is provided around lower portions of the first and second light emitting structures. A first electrode is coupled to a first conductive first semiconductor layer of the first light emitting structure, and a second electrode is coupled to a second semiconductor layer of the first light emitting structure. A third electrode is coupled to a third semiconductor layer of the second light emitting structure, and a fourth electrode is coupled to a fourth semiconductor layer of the second light emitting structure. A first connection part is coupled to the first electrode and the conductive support member, and a second connection part is coupled to the second and third electrodes. A third connection part is coupled to the fourth electrode and has one end provided on the channel layer. | 03-06-2014 |
| 20140061686 | DISPLAY APPARATUS WITH GATE ELECTRODES FORMED IN A PROJECTING MANNER - A capacitance setting line is disposed at the top end of a pixel, a light emission setting line is disposed at the bottom end of the pixel, and a gate line is disposed at the center between both the lines. A selection transistor, a potential control transistor and a capacitor are disposed between the gate line and a capacitance setting line. A short-circuit transistor, a drive transistor and a drive control transistor are disposed between the gate line and the light emission setting line. With such an arrangement, the efficient arrangement of wiring contacts can be performed, and an aperture ratio can be increased. | 03-06-2014 |
| 20140061687 | LED ARRAY - A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate. | 03-06-2014 |
| 20140061688 | LED Structure - A light emitting diode (LED) structure comprises a first dopant region, a dielectric layer on top of the first dopant region, a bond pad layer on top of a first portion the dielectric layer, and an LED layer having a first LED region and a second LED region. The bond pad layer is electrically connected to the first dopant region. The first LED region is electrically connected to the bond pad layer. | 03-06-2014 |
| 20140070235 | WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS - Improved wire bonds and light emitting devices and related methods are disclosed. In one aspect, an improved wire bond can include a shaped wire bond, where at least a portion of the wire bond includes a negative kink and/or a concave shape with respect to an underlying substrate. | 03-13-2014 |
| 20140070236 | DEVICE AND METHOD FOR TOP EMITTING AMOLED - Embodiments of the present disclosure relate to devices and methods for reducing the resistance level of top electrodes in top emission AMOLED displays. By way of example, one embodiment includes disposing a metal frame between the top electrode and an insulating layer. The present disclosure also relates to methods for making such a display in reduced number of process steps, including certain techniques for combining certain steps into one process step. | 03-13-2014 |
| 20140070237 | DISPLAY APPARATUS - A display apparatus includes a display panel, a light guide plate, point light sources, a passivation layer and a first light adjusting layer. The light guide plate is disposed above the display panel and has an upper surface, an opposite lower surface, a light incident surface, a first and a second light guiding blocks. The display panel is disposed corresponding to the first light guiding block, and the second light guiding block extends outside the display panel. A portion of the upper surface located on the first light guiding block is an even surface. The first light guiding block is located between the passivation layer and the display panel. The first light adjusting layer is disposed on the second light guiding block and located on the upper surface or the lower surface. There is a first rough interface between the first light adjusting layer and the light guide plate. | 03-13-2014 |
| 20140070238 | LIGHT EMITTING DEVICE PACKAGE FOR CONTROLLING LIGHT EMISSION FROM A SIDE SURFACE AND METHOD OF MANUFACTURING THE SAME - A light emitting device package includes a base including at least one recess, at least one light emitting device disposed within the recess, and a reflective wall filling a space between the light emitting device and the recess so as to surround lateral surfaces of the light emitting device. The recess is formed to have a depth ranging from 80% to 120% of a height of the light emitting device. | 03-13-2014 |
| 20140070239 | Array Substrate And Method For Fabricating The Same - An array substrate and a method for fabricating the same are disclosed. The method for fabricating the array substrate comprises: forming a pattern of a gate electrode ( | 03-13-2014 |
| 20140070240 | ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE - Embodiments of the invention provide an array substrate, a manufacturing method thereof and a display device. The array substrate comprises: a base substrate; a gate line and a gate electrode formed on the base substrate; a gate insulating layer formed on the gate line and the gate electrode; a source electrode, a drain electrode and a pixel electrode formed on the gate insulating layer, wherein the pixel electrode is directly connected to the drain electrode; and an active layer formed on the gate insulating layer, the source electrode and the drain electrode. | 03-13-2014 |
| 20140070241 | SOLID STATE LIGHT SOURCE ARRAY - A solid state light source array including a transparent substrate and N rows of solid state light emitting element series is provided. Each row of the solid state light emitting element series includes M solid state light emitting elements connected in series, wherein N, M are integers and N≧1, M≧2. Each of the solid state emitting elements includes a first type electrode pad and a second type electrode pad. The first and the M | 03-13-2014 |
| 20140070242 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND LIQUID CRYSTAL DISPLAY - The disclosed technology relates to an array substrate and a method of manufacturing the same, and a liquid crystal display. The array substrate comprises a base substrate. The base substrate comprises a pixel region and a peripheral region; data lines and gate lines are formed to transversely and longitudinally cross each other on the base substrate to form a plurality of pixel units, and each of the pixel units comprises a switching element, a pixel electrode and a common electrode above the pixel electrode; the common electrode has slits in each pixel unit and is a plate-shaped electrode in the pixel region, when powered on, the common electrode forms a horizontal electric field together with the pixel electrode of the pixel unit; and a common electrode line fouled in the pixel region and connected with the common electrode. | 03-13-2014 |
| 20140077234 | SEMICONDUCTOR STRUCTURE WITH PATTERNED BURIED LAYER - An apparatus comprises a substrate, a first buried layer formed over the substrate, the first buried layer comprising one or more raised mesa structures, a second buried layer formed over the first buried layer, an active layer formed over the second buried layer, and a capping layer formed over the active layer. The apparatus may further comprise a third buried layer formed over the active layer, the third buried layer comprising one or more raised mesa structures, and a fourth buried layer formed over the third buried layer. The one or more raised mesa structures of the first buried layer may be offset from the one or more raised mesa structures of the third buried layer. | 03-20-2014 |
| 20140077235 | Substrate Free LED Package - A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies. | 03-20-2014 |
| 20140077236 | LIGHT EMITTING DEVICE - A light emitting device includes a flexible substrate including a flexible base member and a plurality of wiring portions disposed on one surface of the base member, at least one light emitting element arranged on a first surface of the flexible substrate and electrically connected to the respective wiring portions, a sealing resin sealing the light emitting element, and an adhesion layer arranged on a second surface of the flexible substrate. The adhesion layer has a portion corresponding at least to a region on the first surface where the at least one light emitting element is arranged. The portion has a thickness smaller than a thickness of regions other than the portion. | 03-20-2014 |
| 20140077237 | SEMICONDUCTOR LIGHT EMITTING APPARATUS - A light emitting apparatus with a combination of a plurality of LED chips and a phosphor layer is provided and can be configured to significantly reduce variations in chromaticity and luminance. The plurality of semiconductor light emitting devices (LED chips) are disposed with a gap therebetween, and the phosphor layer is formed on the upper surface thereof to bridge over the gaps between the LED chips. The phosphor layer may be uniform in thickness, but can be less in thickness over the gaps between the LED chips than on the upper surface of the LED chips. The phosphor layer can be continuously formed on the upper surface of the array of the chips with no phosphor layer present in between the chips. This configuration allows for reducing variations in luminance and chromaticity which may result from the gaps or the phosphor layer present in between the gaps. | 03-20-2014 |
| 20140077238 | LIGHT-EMITTING DEVICE AND THE MANUFACTURING METHOD THEREOF - A light-emitting device includes: a carrier; a light-emitting structure formed on the carrier, wherein the light-emitting structure has a first surface facing the carrier, a second surface opposite to the first surface, and an active layer between the first surface and the second surface; a plurality of first trenches extended from the first surface and passing through the active layer so a plurality of light-emitting units is defined; and a plurality of second trenches extended from the second surface and passing through the active layer of each of the plurality of light-emitting units. | 03-20-2014 |
| 20140084310 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME - According to an embodiment, a method for manufacturing a display device, includes steps of disposing a cathode of a first substrate unit to face an anode of a second substrate unit with an intermediate layer interposed, and bonding the cathode to the anode with the intermediate layer interposed. The first substrate unit includes a first substrate, a thin film transistor provided on the first substrate, and the cathode connected to the thin film transistor. The thin film transistor is an n-channel thin film transistor. The second substrate unit includes a second substrate and the anode provided on the second substrate. | 03-27-2014 |
| 20140084311 | LIGHT-EMITTING DEVICE - The present invention provides a light-emitting device which includes a plurality of LED chips mounted on a chip mount surface of a substrate provided with a wiring pattern. In the light-emitting device, the wiring pattern is provided so as to meet the following conditions (a), (b), and (c). (a) The wiring pattern divides the chip mount surface into at least three divided areas in a radial fashion from a center of the chip mount surface, and includes radial elements and circumferential elements so as to surround divided areas. (b) Of two radial elements and one circumferential element which surround each divided area as viewed from the individual divided area, one or two elements form part of a positive electrode pattern, and the remainder forms part of a negative electrode pattern. (c) There is only one radial element between adjoining ones of the divided areas. | 03-27-2014 |
| 20140084312 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package. | 03-27-2014 |
| 20140084313 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate. | 03-27-2014 |
| 20140084314 | INJECTION MOLDED MICROOPTICS - A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught. | 03-27-2014 |
| 20140091329 | LED Emitter with Improved White Color Appearance - The present disclosure involves a lighting instrument. The lighting instrument includes a board or substrate, for example, a printed circuit board substrate. The lighting instrument includes a plurality of light-emitting diode (LED) dies disposed on the substrate. The LED dies are spaced apart from one another. Each LED die is covered with a respective individual phosphor coating that is coated around the LED die conformally. Due at least in part to the individual phosphor coatings, the LED dies and the lighting instrument may assume a substantially white appearance in an off state. The lighting instrument also includes an encapsulation structure disposed over the substrate. The encapsulation structure may be a diffuser cap that encapsulates the light-emitting dies within. A diffuser gel fills the space between the encapsulation structure and the LED dies. | 04-03-2014 |
| 20140091330 | LED PACKAGE STRUCTURE WITH TRANSPARENT ELECTRODES - The present invention discloses a LED package structure with transparent electrodes. The electrode layers | 04-03-2014 |
| 20140091331 | DISPLAY DEVICE, THIN FILM TRANSISTOR, ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF - The embodiments of the invention provide a display device, a thin film transistor, an array substrate and a manufacturing method thereof. The manufacturing method comprises: step A, forming patterns of a source electrode, a drain electrode, a data line and a pixel electrode; step B, forming an active layer and agate insulating layer in order, and forming a via hole in the gate insulating layer for connecting the data line and an external circuit; and step C, forming patterns of a gate electrode, a gate line and a common electrode line, or forming a pattern of a gate electrode, a gate line and a common electrode. | 04-03-2014 |
| 20140091332 | LED LIGHTING DEVICES INCORPORATING WAVEGUIDES - A LED lighting device includes at least one waveguide element and multiple light-emitting sources such as LEDs or LED packages, which may be optically coupled though different light entry regions to the at least one waveguide. Multiple light solid state sources may be arranged in strips. A waveguide system includes first and second body structures each positioned to illuminate at least a portion of a target surface. One or more waveguides may be arranged to illuminate a LCD panel. | 04-03-2014 |
| 20140091333 | LIGHT EMITTING DEVICE EQUIPPED WITH PROTECTIVE MEMBER - A light emitting device includes a light emitting device body and a protective member. The light emitting device body has a flexible base member, at least one light emitting element arranged on the base member, and a sealing resin member sealing the light emitting element. The protective member is disposed adjacent to the sealing resin member on the base member. The protective member has a height greater than a height of the sealing resin member. | 04-03-2014 |
| 20140091334 | ENCAPSULATING SHEET-COVERED SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, SEMICONDUCTOR DEVICE, AND PRODUCING METHOD THEREOF - A method for producing an encapsulating sheet-covered semiconductor element includes a semiconductor element disposing step of disposing a plurality of semiconductor elements at spaced intervals to each other and an encapsulating sheet disposing step of disposing an encapsulating sheet so as to cover a plurality of the semiconductor elements and to form a space over the semiconductor elements adjacent to each other. | 04-03-2014 |
| 20140091335 | LIGHT EMITTING DEVICE - To provide a light emitting device that can maintain a desired light emission even when the tube is bent. | 04-03-2014 |
| 20140091336 | ELECTRONIC DEVICES WITH COMPONENT MOUNTING STRUCTURES - Electronic devices are provided that have components. A housing protrusion may be interposed between a display cover layer and display components. A button may have a button member. A support structure for a dome switch in the button may have a screw hole. A housing may have screw holes through which a screw passes. The screw may also pass through the screw hole of the support structure to hold the switch structure near the button member. A clip may have a spring. A metal plate may prevent the clip from becoming worn by the spring. A display may be mounted on a ledge in a device housing. The ledge may have gaps with supports and removed corners. | 04-03-2014 |
| 20140091337 | LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE ASSEMBLY, AND ELECTRODE-BEARING SUBSTRATE - A light-emitting device assembly includes a substrate, an optical semiconductor element mounted on the surface of the substrate, an encapsulating layer formed on the substrate surface to encapsulate the optical semiconductor element, and an electrode formed on the substrate surface to be electrically connected to the optical semiconductor element. On the substrate, only an encapsulating region and an electrode region are formed, the encapsulating region including the optical semiconductor element and being defined by the encapsulating layer, and the electrode region being defined by the electrode exposed from the encapsulating layer. | 04-03-2014 |
| 20140091338 | LIGHT EMITTING DIODE - Exemplary embodiments of the present invention relate to light emitting diodes including a plurality of light emitting cells on a substrate to be suitable for AC driving. The light emitting diode includes a substrate and a plurality of light emitting cell formed on the substrate. Each light emitting cell includes a first region at a boundary of the light emitting cell and a second region opposite to the first region. A first electrode pad is formed in the first region of the light emitting cell. A second electrode pad having a linear shape is disposed to face the first electrode pad while regionally defining a peripheral region together with the boundary of the second region. A wire connects the first electrode pad to the second electrode pad between two adjacent light emitting cells. | 04-03-2014 |
| 20140091339 | SEMICONDUCTOR DEVICE, DISPLAY, AND ELECTRONIC APPARATUS - A semiconductor device having a substrate is disclosed. The substrate includes a first set of inner edges and a second set of inner edges cooperating with the first set of inner edges. The second set of inner edges is positioned outside the first set of inner edges with respect to a cavity formed by the first inner edges and the second inner edges by a pre-defined distance. The substrate further includes a layer within the cavity, including a dried liquid material formed from a liquid deposited within the cavity. The layer within the cavity is formed between the respective first inner edges and the second inner edges. The semiconductor device may be implemented in a display of an electronic device. | 04-03-2014 |
| 20140097452 | LUMINESCENCE DEVICE - A luminescence device used in a backlight unit for lighting or displaying may include: a substrate including at least two electrode patterns and LED chips which are provided over the substrate and include a phosphor provided thereon. A dam is provided over the substrate, and an encapsulation layer is provided over the substrate. The dam is spaced from the LED Chips, and the substrate comprises a direct copper bonding (DCB) substrate including a first copper layer, a second copper layer and a substrate body. | 04-10-2014 |
| 20140097453 | LIGHT EMITTING DEVICES FOR LIGHT EMITTING DIODES (LEDS) - Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate, one or more LEDs disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. The LEDs can be connected in a pattern that is non-linear. | 04-10-2014 |
| 20140097454 | LIGHT EMITTING DEVICES FOR LIGHT EMITTING DIODES (LEDS) - Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a submount and a light emission area disposed over the submount. The light emission area can include one or more light emitting diodes (LEDs), a fillet at least partially disposed about the one or more the LEDs, and filling material. The filling material can be disposed over a portion of the one or more LEDs and a portion of the fillet. | 04-10-2014 |
| 20140103367 | METHOD OF FORMING LIGHT EMITTING DIODE DIES, LIGHT EMITTING DIODE WAFER AND LIGHT EMITTING DIODE DIE - A method of forming light emitting diode dies includes: forming an epitaxial layered structure that defines light emitting units on a front surface of a substrate wafer; forming a photoresist layer over a back surface of the substrate wafer; aligning the substrate wafer and patterning the photoresist layer so as to form openings in the photoresist layer, each of the openings having an area less than a projected area of the respective light emitting unit; forming a solder layer on the photoresist layer such that the solder layer fills the openings in the photoresist layer; removing the photoresist layer and a portion of the solder layer that covers the photoresist layer from the substrate wafer; and dicing the substrate wafer. | 04-17-2014 |
| 20140103368 | LIGHT-EMITTING DEVICE - Occurrence of a crosstalk phenomenon is suppressed in a light-emitting device including a tandem element. A light-emitting device includes a first lower electrode and a second lower electrode over an insulating layer; a partition which is formed over the insulating layer and positioned between the first lower electrode and the second lower electrode; a projecting object formed over the partition; a first light-emitting unit over each of the first lower electrode, the partition, the projecting object, and the second lower electrode; an intermediate layer over the first light-emitting unit; a second light-emitting unit over the intermediate layer; and an upper electrode over the second light-emitting unit. A recess is formed by a side surface of the projecting object and a side surface of the partition. | 04-17-2014 |
| 20140103369 | ILLUMINATION DEVICE - A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED structures. Each of the LED structures includes a first electrode and a second electrode. Light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface. An illumination device includes the semiconductor light emitting element and a supporting base. The semiconductor light emitting element is disposed on the supporting base, and an angle is formed between the semiconductor light emitting element and the supporting base. | 04-17-2014 |
| 20140103370 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device includes an LED chip, which includes an n-type semiconductor layer, active layer, and p-type semiconductor layer stacked on a substrate. The LED chip further includes an anode electrode connected to the p-type semiconductor, and a cathode connected to the n-type semiconductor. The anode and cathode electrodes face a case with the LED chip mounted thereon. The case includes a base member including front and rear surfaces, and wirings including a front surface layer having anode and cathode pads formed at the front surface, a rear surface layer having anode and cathode mounting electrodes formed at the rear surface, an anode through wiring connecting the anode pad and the anode mounting electrode and passing through a portion of the base member, and a cathode through wirings connecting the cathode pad and the cathode mounting electrode and passing through a portion of the base member. | 04-17-2014 |
| 20140103371 | LEAD FRAME FOR LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE PACKAGE, AND ILLUMINATION APPARATUS EMPLOYING THE LIGHT EMITTING DEVICE PACKAGE - Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions. The light emitting device package is formed by directly mounting the plurality of light emitting device chips on the lead frame and packaging the mounted light emitting device chips on the lead frame. The lead frame includes a plurality of connection portions for circuit connecting the plurality of light emitting device chips and a terminal portion in which a part of a circuit thereof is exposed. | 04-17-2014 |
| 20140103372 | METHOD AND APPARATUS FOR PACKAGING PHOSPHOR-COATED LEDS - The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process. | 04-17-2014 |
| 20140103373 | SOLID-STATE LIGHT EMITTING DEVICES WITH PHOTOLUMINESCENCE WAVELENGTH CONVERSION - A solid-state light emitting device comprises a light transmissive thermally conductive circuit board; an array of solid-state light emitters (LEDs) mounted on, and electrically connected to, at least one face of the circuit board; and a photoluminescence wavelength conversion component. The wavelength conversion component comprises a mixture of particles of at least one photoluminescence material (phosphor) and particles of a light reflective material. The emission product of the device comprises the combined light generated by the LEDs and the photoluminescence material. The wavelength conversion component can comprise a layer of the phosphor material and particles of a light reflective material applied directly to the array of LEDs in the form of an encapsulant. Alternatively the photoluminescence component is a separate component and remote to the array of LEDs such as tubular component that surrounds the LEDs. | 04-17-2014 |
| 20140110724 | PROCESS OF MAKING A STRUCTURE FOR ENCAPSULATING LED CHIPS AND THE LED CHIPS ENCAPSULATION STRUCTURE - A process of making a structure for encapsulating LED chips is provided with punching a reflective substrate into a reflective layer including through holes as reflective cups; punching an insulating substrate into an insulating layer including through holes, a flexible member having top and bottom formed with top and bottom layers of thermoset respectively, and top and bottom coatings formed on the top and bottom layers of thermoset respectively; punching a conductive substrate to form conductive members each having a solder pad and a lead leg; roughening bottom of the reflective layer; roughening top of the conductive substrate; filling an insulating material around the solder pads and the lead legs to form a lead frame; stacking and fastening the reflective layer, the insulating layer, and the lead frame fastened together; and electroplating the stack to form an airtight radiation emitting coating, thereby forming an LED chips encapsulation structure. | 04-24-2014 |
| 20140110725 | THIN GLASS SUBSTRATE AND FLAT PANEL DISPLAY INCLUDING THE SAME - A thin glass substrate and a flat panel display (FPD) including the same. The thin glass substrate includes a transparent base member and a transparent mesh pattern formed on one surface of the base member. The base member may be stably supported by the mesh pattern and tension is provided when the base member is deformed so that it is possible to prevent the base member from being broken. In addition, the mesh pattern disperses shock or stress applied to the base member, and it is possible to suppress electromagnetic wave interference from the outside. | 04-24-2014 |
| 20140110726 | LIGHT EMITTING APPARATUS AND METHOD FOR FABRICATING THE SAME - A light emitting apparatus includes a substrate having a first substrate portion, a second substrate portion arranged parallel to the first substrate portion, and a connection portion connecting the first substrate portion and the second substrate portion to each other. A plurality of first light emitting elements is formed on the first substrate portion; and a plurality of second light emitting elements is formed on the second substrate portion. | 04-24-2014 |
| 20140110727 | Two Terminal Packaging - A solution for packaging a two terminal device, such as a light emitting diode, is provided. In one embodiment, a method of packaging a two terminal device includes: patterning a metal sheet to include a plurality of openings; bonding at least one two terminal device to the metal sheet, wherein a first opening corresponds to a distance between a first contact and a second contact of the at least one two terminal device; and cutting the metal sheet around each of the least one two terminal device, wherein the metal sheet forms a first electrode to the first contact and a second electrode to the second contact. | 04-24-2014 |
| 20140110728 | SUBMOUNT WITH CAVITIES AND THROUGH VIAS FOR LED PACKAGING - A wafer having a plurality of light-emitting diode (LED) submounts and a method for fabricating an LED submount are provided. Each of the plurality of LED submounts of the wafer includes: a substrate ( | 04-24-2014 |
| 20140110729 | LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - Disclosed are a light emitting device and a method of fabricating the same. The light emitting device comprises a substrate. A plurality of light emitting cells are disposed on top of the substrate to be spaced apart from one another. Each of the light emitting cells comprises a first upper semiconductor layer, an active layer, and a second lower semiconductor layer. Reflective metal layers are positioned between the substrate and the light emitting cells. The reflective metal layers are prevented from being exposed to the outside. | 04-24-2014 |
| 20140110730 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME - Disclosed are a light emitting device. The light emitting device includes first and second light emitting cells on a conductive support member and having a hole. The first and second light emitting cells includes first and second semiconductor layers, and an active layer. First and second conducive layers are between the first light emitting cell and the conductive support member, and a third and fourth conductive layers are between the second light emitting cell and the conductive support member. First insulating layer is between the second and fourth conductive layers and the conductive support member. Second insulating layer is disposed in the hole. The second conductive layer is electrically connected to the first light emitting cells through the hole and the third conductive layer. | 04-24-2014 |
| 20140110731 | Semiconductor Device, and Display Device and Electronic Device Having the Same - An object is to provide a semiconductor device which can suppress characteristic deterioration in each transistor without destabilizing operation. In a non-selection period, a transistor is turned on at regular intervals, so that a power supply potential is supplied to an output terminal of a shift register circuit. A power supply potential is supplied to the output terminal of the shift register circuit through the transistor. Since the transistor is not always on in a non-selection period, a shift of the threshold voltage of the transistor is suppressed. In addition, a power supply potential is supplied to the output terminal of the shift register circuit through the transistor at regular intervals. Therefore, the shift register circuit can suppress noise which is generated in the output terminal. | 04-24-2014 |
| 20140110732 | SEMICONDUCTOR DEVICE - Semiconductor elements deteriorate or are destroyed due to electrostatic discharge damage. The present invention provides a semiconductor device in which a protecting means is formed in each pixel. The protecting means is provided with one or a plurality of elements selected from the group consisting of resistor elements, capacitor elements, and rectifying elements. Sudden changes in the electric potential of a source electrode or a drain electrode of a transistor due to electric charge that builds up in a pixel electrode is relieved by disposing the protecting means between the pixel electrode of the light-emitting element and the source electrode or the drain electrode of the transistor. Deterioration or destruction of the semiconductor element due to electrostatic discharge damage is thus prevented. | 04-24-2014 |
| 20140117384 | METHOD OF AND DEVICE FOR MANUFACTURING LED ASSEMBLY USING LIQUID MOLDING TECHNOLOGIES - A method of and a system for making LED comprising concurrently forming multiple dam structures on a whole silicon wafer using a liquid transfer mold, attaching dies to the silicon wafer inside each of the dam structure, performing flux reflow, cleaning flux, performing wire bonding, dispensing phosphor, curing the phosphor, concurrently forming dome structures by using a liquid transfer mold on all of the dam structures, mounting wafer, and using a saw for single or multiple LED(s) singulation. | 05-01-2014 |
| 20140117385 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A display device including a base substrate, a pixel disposed on the base substrate, and a color filter part disposed between the base substrate and the pixel. The color filter part includes a color filter corresponding to the pixel and a black matrix disposed at at least a side of the color filter. The pixel includes a cover layer defining a tunnel-shaped cavity on the base substrate, an image display part disposed in the tunnel-shaped cavity, and first and second pixel electrodes and a common electrode applying an electric field to the image display part. The tunnel-shaped cavity is formed by forming a sacrificial layer and wet-etching the sacrificial layer. | 05-01-2014 |
| 20140117386 | TILTED EMISSION LED ARRAY - The present disclosure is directed to LED components, and systems using such components, having a light emission profile that may be controlled independently of the lens shape by varying the position and/or orientation of LED chips with respect to one or both of an overlying lens and the surface of the component. For example, the optical centers of the LED emitting surface and the lens, which are normally aligned, may be offset from each other to generate a controlled and predictable emission profile. The LED chips may be positioned to provide a peak emission shifted from a perpendicular centerline of the lens base. The use of offset emitters allows for LED components with shifted or tilted emission patterns, without causing output at high angles of the components. This is beneficial as it allows a lighting system to have tilted emission from the LED component and primary optics. | 05-01-2014 |
| 20140117387 | PHOSPHOR LAYER CONTAINING TRANSPARENT PARTICLES OVER BLUE LED - LED dies are suspended in an ink and printed on a first support substrate to form a light emitting layer having a light emitting surface emitting primary light, such as blue light. A mixture of a transparent binder, phosphor powder, and transparent glass beads is formed as an ink and printed over the light emitting surface. The mixture forms a wavelength conversion layer when cured. The beads are preferably sized so that the tops of the beads protrude completely through the conversion layer. Some of the primary light passes through the beads with virtually no attenuation or backscattering, and some of the primary light is converted by the phosphor to secondary light. The combination of the secondary light and the primary light passing though the beads may form white light. The overall color is highly controllable by controlling the percentage weight of the beads. | 05-01-2014 |
| 20140124798 | LIGHT-EMITTING ELEMENT AND THE LIGHT-EMITTING ARRAY HAVING THE SAME - A light-emitting element includes: a light-emitting structure; a plurality of first contact portions separately on the light-emitting structure; and a plurality of reflective portions disposed separately among the plurality of first contact portions. | 05-08-2014 |
| 20140124799 | LIGHT EMITTING DIODES AND METHODS OF FABRICATING THE SAME - Provided is a light emitting diode, including a sub-mount structure including a first substrate and electrode portions provided on the first substrate, and a light emitting structure mounted on the sub-mount structure to include a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer. The electrode portions may include a first electrode portion and a second electrode portion connected to the first and second semiconductor layers, respectively, and each of the first and second electrode portions may include a first metal layer, a graphene layer, and a second metal layer sequentially provided on the first substrate. | 05-08-2014 |
| 20140124800 | ARRAY SUBSTRATE AND DISPLAY DEVICE - Embodiments of the present application provide an array substrate comprising: a base substrate, and a plurality of gate lines, a plurality of data lines and a plurality of pixel units defined by the gate lines and the data lines, which are formed on the base substrate, the pixel units comprising thin film transistors, pixel electrodes and common electrodes, projections of the data lines and the common electrodes on the base substrate not coinciding with each other. The embodiments of the present application also provide a display device comprising the above array substrate. | 05-08-2014 |
| 20140124801 | LIGHT EMITTING DEVICE PACKAGE HAVING LED DISPOSED IN LEAD FRAME CAVITIES - Disclosed are a light emitting device package and a lighting system. The light emitting device package includes a first cavity in a first region of the body; a second cavity in a second region of the body; first and second lead frames spaced apart from each other in the first cavity; a third lead frame spaced apart from the second lead frame in the second cavity; a first light emitting device on the first and second lead frames in the first cavity; a second light emitting device on the second and third lead frames in the second cavity; and a molding member in the first and second cavities. | 05-08-2014 |
| 20140131739 | METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT - A method of producing a component including providing a carrier having a top, an underside, and at least one connection area, applying an optoelectronic component to the top, wherein the optoelectronic component has a contact area facing away from the carrier, applying insulating material to the contact and connection areas, wherein the insulating material is free of foreign particles, applying an insulating layer to exposed places of the insulating material, optoelectronic component and carrier, wherein the insulating layer includes foreign particles in a predefinable concentration, removing the insulating layer in a region above the contact and/or connection areas, to produce openings, removing the insulating material in a region above the contact and connection areas, thereby producing at least two openings in the insulating material, and arranging conductive material on the insulating layer and at least in places in the openings, wherein conductive material conductively connects the contact and connection areas. | 05-15-2014 |
| 20140131740 | WHITE LIGHT EMITTING DEVICE - A light emitting device including: a blue light source; a phosphor; and a semiconductor nanocrystal, and emits white light having a R1-R8 average color rendering index (“CRI”) of greater than or equal to about 90, and a R9 red color rendering index (R9) of greater than or equal to about 90. | 05-15-2014 |
| 20140131741 | LED Spirit System and Manufacturing Method - The present invention relates to a new method, system and apparatus for light emitting diode (LED) packages. An object of the present invention is to provide an LED package having reduced components, a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipment for its manufacture, and is compatible with implementation within present illumination devices packaging. | 05-15-2014 |
| 20140131742 | LED Spirit Connector System and Manufacturing Method - The present invention relates to a new method, system and apparatus for light emitting diode (LED) packages. An object of the present invention is to provide an LED package having reduced components, a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipment for its manufacture, and is compatible with implementation within present illumination devices packaging. | 05-15-2014 |
| 20140131743 | Light-emitting Display Backplane, Display Device and Manufacturing Method of Pixel Define Layer - The present invention discloses a light-emitting display backplane, a display device and a manufacturing method of a pixel define layer. A light-emitting display backplane according to the present invention comprises: a substrate and a pixel define layer provided thereon, wherein said pixel define layer comprises: a first photosensitive resin layer, a first transparent define layer and a second transparent define layer sequentially provided on said substrate from bottom to top, each of the first photosensitive resin layer, the first define layer and the second define layer is provided with openings corresponding to respective pixels, and the openings in said second define layer are smaller than those in both said first define layer and said first photosensitive resin layer, so as to form luminescent material filling regions which are wider at bottom and narrower at top. | 05-15-2014 |
| 20140131744 | DRIVING DEVICE OF DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE DRIVING DEVICE - A driving device of a display apparatus, and a method of manufacturing the driving device. The driving device may have a specific structure, and be manufactured in such a manner, because a first electrode of a micro optical switch device may be formed simultaneously with the formation of at least a source region and a drain region, or a gate electrode of an active device and a capacitor electrode. | 05-15-2014 |
| 20140131745 | SEMICONDUCTOR LIGHT EMITTING DEVICE - An LED device includes first and second LED elements containing a lower layer of first conductivity type, an active layer, and an upper layer of second conductivity type, wherein the second LED element has third and fourth electrodes on the lower layer, recessed portion having a side surface exposing the upper, active and lower layers, and reaching the third electrode, fifth electrode disposed on the upper layer extending on the side surface of the recessed portion, and connected with the third electrode, and groove extending from the upper layer and reaching the active layer between the third and fourth electrodes to electrically separate the third electrode from the fourth electrode. | 05-15-2014 |
| 20140131746 | WHITE LIGHT EMITTING DIODE (LED) LIGHTING DEVICE DRIVEN BY PULSE CURRENT - A white LED lighting device driven by a pulse current is provided, which consists of blue, violet or ultraviolet LED chips, blue afterglow luminescence materials A and yellow luminescence materials B. Wherein the weight ratio of the blue afterglow luminescence materials A to the yellow luminescence materials B is 10-70 wt %: 30-90 wt %. The white LED lighting device drives the LED chips with a pulse current having a frequency of not less than 50 Hz. Because of using the afterglow luminescence materials, the light can be sustained when an excitation light source disappears, thereby eliminating the influence of LED light output fluctuation caused by current variation on the illumination. At the same time, the pulse current can keep the LED chips being at an intermittent work state, so as to overcome the problem of chip heating. | 05-15-2014 |
| 20140131747 | Packaging Photon Building Blocks Having Only Top Side Connections In A Molded Interconnect Structure - Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer. | 05-15-2014 |
| 20140138713 | PASSIVATION LAYER FOR FLEXIBLE DISPLAY - Embodiments of the present disclosure are directed towards passivation techniques and configurations for a flexible display. In one embodiment, a flexible display includes a flexible substrate, an array of display elements configured to emit or modulate light disposed on the flexible substrate, and a passivation layer including molecules of silicon (Si) bonded with oxygen (O) or nitrogen (N), the passivation layer being disposed on the array of display elements to protect the array of display elements from environmental hazards. | 05-22-2014 |
| 20140138714 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF - A manufacturing method of an array substrate includes the following steps. A substrate having pixel region and a peripheral region is provided. A plurality of pixel structures are formed in the pixel region, wherein at least one of the pixel structures is formed by the following steps. A gate electrode, a gate insulating layer, and a source electrode and a drain electrode are formed. A patterned semiconductor layer including a first semiconductor pattern and a second semiconductor pattern is formed. The second semiconductor pattern covers a portion of the drain electrode. A first passivation layer is formed. The first passivation layer has a first opening exposing a portion of the second semiconductor pattern. A transparent conductive pattern is formed on the first passivation layer, and the transparent conductive pattern is electrically connected to the second semiconductor pattern through the first opening. | 05-22-2014 |
| 20140138715 | LIGHT-EMITTING ASSEMBLIES COMPRISING AN ARRAY OF LIGHT-EMITTING DIODES HAVING AN OPTIMIZED LENS CONFIGURATION - Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another. | 05-22-2014 |
| 20140138716 | DISPLAY DEVICE - A display device includes a circuit substrate that is formed of a plurality of layers including a light control element; a counter substrate that faces a surface of the circuit substrate on which the light control element is disposed, with a gap therebetween; a seal that is disposed between the circuit substrate and the counter substrate to surround the light control element; and a filler with which a sealed space surrounded by at least the circuit substrate, the counter substrate, and a sealing surface of the seal is filled. The sealing surface includes internal angle corner surfaces formed by an inner surface of the seal, and a convex surface formed adjacent to the corner surfaces from at least one of the circuit substrate, the counter substrate, and the seal. | 05-22-2014 |
| 20140138717 | DISPLAY DEVICE, TRANSFLECTIVE THIN FILM TRANSISTOR ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF - The present invention provides a display device, a transflective thin film transistor array substrate and a manufacturing method thereof, the manufacturing method comprises: providing a substrate; forming a gate line, a data line which is broken when passing through a gate line area, a gate electrode, a reflective electrode and a common electrode line; forming a patterned gate insulating layer and an active layer located above the gate insulating layer; forming a pixel electrode, a source electrode, a drain electrode, a connection line of the data line and a channel; forming a passivation layer and a common electrode via hole; forming a common electrode. The present invention can avoid the problem of poor display effect under strong light. | 05-22-2014 |
| 20140138718 | Array Substrate and Fabrication Method Thereof, and Display Device - The present invention discloses an array substrate comprising a plurality of common electrode lines, a plurality of gate lines, and a plurality of data lines formed on a substrate, and a plurality of pixel units formed among the gate lines, the data lines and the common electrode lines, each pixel unit comprises: a pixel electrode, a first TFT, and a common electrode, the gate line and the data line drive the pixel electrode through the first TFT, the common electrode line is connected to the common electrode, the common electrode line and the data line do not overlap with each other, and an insulating layer is disposed between the common electrode line and the date line. The present invention further discloses a fabrication method of the array substrate and a display device comprising the array substrate. | 05-22-2014 |
| 20140138719 | Organic Optoelectronic Device And Method For The Encapsulation Thereof - The invention relates to an organic optoelectronic device which is protected from ambient air by a sealed encapsulation structure of the type including at least one thin layer. The device includes a substrate; at least one light-emitting unit deposited on the substrate, incorporating internal electrodes and external electrodes defining an active zone and, between the electrodes, a stack of organic; and a sealed encapsulation structure having one or more thin layers including at least one inorganic layer placed on top of the light-emitting unit and encasing same laterally. The device also includes a pre-encapsulation structure located between the external electrode and the encapsulation structure and which includes a buffer layer covering the external electrode and contains a heterocyclic organometallic complex having a glass transition temperature above 80° C., and a barrier layer covering the buffer layer and contains a silicon oxide SiOx, wherein x is 0| 05-22-2014 | |
| 20140138720 | SEMICONDUCTOR ELEMENT AND DISPLAY DEVICE USING THE SAME - A semiconductor having an active layer; a gate insulating film in contact with the semiconductor; a gate electrode opposite to the active layer through the gate insulating film; a first nitride insulating film formed over the active layer; a photosensitive organic resin film formed on the first nitride insulating film; a second nitride insulating film formed on the photosensitive organic resin film; and a wiring provided on the second, nitride insulating film. A first opening portion is provided in the photosensitive organic resin film, an inner wall surface of the first opening portion is covered with the second nitride insulating film, a second opening portion is provided in a laminate including the gate insulating film, the first nitride insulating film, and the second nitride insulating film inside the first opening portion, and the semiconductor is connected with the wiring through the first opening portion and the second opening portion. | 05-22-2014 |
| 20140145215 | AC LED device and method for fabricating the same - An AC LED device and method for fabricating the same are disclosed. An exemplary embodiment of the AC LED device includes at least two separate AC LED unit chips, wherein each of the AC LED unit chip includes a substrate having a first light emitting module and a second light emitting module. Each of the first and second light emitting modules includes a plurality of light emitting micro diodes connected between a first conductive electrode and a second conductive electrode, wherein the amount of light emitting micro diodes emitting light during a positive half cycle of an AC charge is equal to that during a negative half cycle of an AC charge. A plurality of conductive wires is respectively and electrically connected to the separate AC LED unit chips without passive devices. | 05-29-2014 |
| 20140145216 | LED WITH WIRE SUPPORT - An LED includes a base, a first chip and a second chip mounted on the base, a wire support formed on the base, and wires electrically connecting the first chip and the second chip with the base. The base includes a first lead, a second lead and an insulative band connecting the first lead and the second lead. A first wire connects an electrode of the first chip to the wire support, and a second wire connects an electrode of the second chip to the wire support. The first wire and the second wire are electrically connected to each other via a conductive layer formed on the wire support. The wire support in one embodiment is a Zener diode. | 05-29-2014 |
| 20140145217 | SUBSTRATE FOR DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - A substrate for a display device including a base substrate; a thin film transistor on the base substrate; a passivation layer of a photosensitive organic material on the thin film transistor, the passivation layer having a contact hole exposing the thin film transistor, the photosensitive organic material including an ultraviolet absorber; and a pixel electrode on the passivation layer, the pixel electrode connected to the thin film transistor through the contact hole. | 05-29-2014 |
| 20140145218 | LIGHT EMITTING DIODE HAVING A PLURALITY OF LIGHT EMITTING UNITS - Exemplary embodiments of the present invention provide a light emitting diode including light emitting units disposed on a substrate, and wires connecting the light emitting units to each other, wherein the light emitting units each include a parallelogram-shaped light emitting unit having two acute angles and two obtuse angles, or a triangular light emitting unit having three acute angles. | 05-29-2014 |
| 20140145219 | Light Output Device and Method of Manufacture - A light output device and manufacturing method in which an array of LEDs ( | 05-29-2014 |
| 20140145220 | LIGHT EMITTING DEVICE - To provide a light emitting device in which generation of cross talk between adjacent light emitting elements is suppressed, even when the light emitting device uses a light emitting element having high current efficiency. Also, to provide a light emitting device having high display quality even when the light emitting device uses a light emitting element having high current efficiency. The light emitting device has a pixel portion including a plurality of light emitting elements, wherein each of the plurality of light emitting elements includes a plurality of light emitting bodies provided between a first electrode and a second electrode and a conductive layer formed between the plurality of light emitting bodies, wherein the conductive layer is provided for each light emitting element, and wherein an edge portion of the conductive layer is covered with the plurality of light emitting bodies. | 05-29-2014 |
| 20140151721 | PHASE TRANSITION COOLING IN LED LIGHTING DEVICES - A lighting device is provided comprising a chip-on-board (COB) light emitting diode (LED) light source, a phase transfer fluid disposed in a hermetically sealed phase transfer fluid chamber, a phase transfer fluid wicking structure, a distributed color conversion medium, and a glass containment plate. The color conversion medium is distributed in two dimensions over an emission field of the lighting device within the glass containment plate. The COB LED light source comprises a thermal heat sink framework and at least one LED and defines the hermetically sealed phase transfer fluid chamber in which the phase transfer fluid is disposed. The glass containment plate is positioned over the hermetically sealed phase transfer fluid chamber and contains the distributed color conversion medium. The phase transfer fluid wicking structure is transparent to at least a portion of the operating wavelength bandwidth of the LED and is configured within the hermetically sealed phase transfer fluid chamber to encourage transport of phase transfer fluid, permit vaporization of transported phase transfer fluid, and receive condensed phase transfer fluid vapor. | 06-05-2014 |
| 20140151722 | LIGHT EMITTING DIODE (LED) LIGHT SOURCE DEVICE HAVING UNIFORM ILLUMINATION - An LED light source device includes a printed circuit board (PCB) and a plurality of LED light sources located on the PCB and electrically connected with the PCB. The plurality of LED light sources are arranged symmetrically relative to a center point of the PCB, and a distance between every adjacent two LED light sources decreases along a direction away from the center point of the PCB. An optical lens is located over the LED light sources for diverging light from a central one of the LED light sources. | 06-05-2014 |
| 20140151723 | PIXEL ARRAY - A pixel array includes multiple scan lines, multiple gate lines, multiple data lines and multiple pixel structures. The scan lines are disposed on a substrate. The gate lines intersect with the scan lines to demarcate multiple first unit regions and multiple second unit regions. Each gate line electrically connects to one of the scan lines. The data lines intersect with the scan lines and pass through the first unit regions. Each data line is located between two adjacent gate lines. The pixel structures are disposed on the first unit regions. Each pixel structure includes an active device and a pixel electrode. The active device is driven by one corresponding scan line and connects with one corresponding data line. An orthographic projection of each pixel electrode on the substrate is non-overlapped with or incompletely overlapped with an orthographic projection of the corresponding gate lines on the substrate. | 06-05-2014 |
| 20140151724 | Method for Producing an Optoelectronic Semiconductor Component and Such a Semiconductor Component - A method for producing a semiconductor component is disclosed. A carrier substrate includes a mounting region and an opening, which is formed in the mounting region of the carrier substrate. After mounting a semiconductor chip, an electrically insulating layer is applied to the carrier substrate in such a way that the electrically insulating layer completely fills the first opening in the carrier substrate. A second opening is formed in the electrically insulating layer. An electrically conductive layer is then applied to the electrically insulating layer in such a way that the second opening is filled with the electrically conductive layer in the form of a via. A semiconductor component produced in this way is also provided. | 06-05-2014 |
| 20140151725 | Method and Apparatus for Fabricating Phosphor-Coated LED Dies - The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs. | 06-05-2014 |
| 20140151726 | LIGHT EMITTING MODULE - There are provided a light emitting module including a luminescent material layer ( | 06-05-2014 |
| 20140159063 | VERTICAL SOLID-STATE TRANSDUCERS AND HIGH VOLTAGE SOLID-STATE TRANSDUCERS HAVING BURIED CONTACTS AND ASSOCIATED SYSTEMS AND METHODS - Solid-state transducers (“SSTs”) and vertical high voltage SSTs having buried contacts are disclosed herein. An SST die in accordance with a particular embodiment can include a transducer structure having a first semiconductor material at a first side of the transducer structure, and a second semiconductor material at a second side of the transducer structure. The SST can further include a plurality of first contacts at the first side and electrically coupled to the first semiconductor material, and a plurality of second contacts extending from the first side to the second semiconductor material and electrically coupled to the second semiconductor material. An interconnect can be formed between at least one first contact and one second contact. The interconnects can be covered with a plurality of package materials. | 06-12-2014 |
| 20140159064 | LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE - Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer. | 06-12-2014 |
| 20140159065 | STABILIZATION STRUCTURE INCLUDING SACRIFICIAL RELEASE LAYER AND STAGING CAVITY - A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is held within an array of staging cavities on a carrier substrate. Each micro device is laterally surrounded by sidewalls of a corresponding staging cavity. | 06-12-2014 |
| 20140159066 | STABILIZATION STRUCTURE INCLUDING SACRIFICIAL RELEASE LAYER AND STAGING BOLLARDS - A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is within an array of staging cavities on a carrier substrate. Each micro device is laterally retained between a plurality of staging bollards of a corresponding staging cavity. | 06-12-2014 |
| 20140159067 | ACTIVE MATRIX EMISSIVE MICRO LED DISPLAY - A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area. | 06-12-2014 |
| 20140159068 | DISPLAY DEVICE - A display device includes: a substrate; a signal line on the substrate; a signal input line on the substrate and connected to a driver; a first insulating layer between the signal line and the signal input line; a second insulating layer on the signal line, the signal input line and the first insulating layer; an organic layer on the second insulating layer; a first contact hole defined in the organic layer, the first insulating layer and the second insulating layer and exposing the signal line; a second contact hole defined in the organic layer and the second insulating layer and exposing the signal input line; and a connecting member on the organic layer, and connecting the signal line and the signal input line to each other through the first contact hole and the second contact hole, respectively. | 06-12-2014 |
| 20140159069 | LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A light emitting device includes a light source module and a secondary optical element. The optical element includes a light incident surface and a light radiating surface opposite to the light incident surface. The light source module includes at least one light emitting unit, and the light emitting unit includes a light emitting diode (LED) chip and an encapsulation layer. The encapsulation layer includes a light outputting surface. The light incident surface faces to the light outputting surface. A gap is defined between the light outputting surface and the light incident surface, and a transparent colloid is filled in the gap. The transparent colloid has a refractive index similar to that of the second optical element and the encapsulation layer. A method for manufacturing the light emitting device is also provided. | 06-12-2014 |
| 20140159070 | ARRAY SUBSTRATE AND DISPLAY DEVICE - An array substrate includes a first electrode located above a switching element through a first insulating film, a second electrode located above the first electrode through a second insulating film, and a connection portion that is located to pass through the first insulating film, first electrode, and second insulating film and electrically connects a drain electrode of the switching element and the second electrode. The connection portion is disposed in an avoidance region provided by carving out a gate line connected to the switching element. | 06-12-2014 |
| 20140159071 | LIGHT EMITTING DEVICE - A light emitting device includes a substrate, light emitting cells, each of the light emitting cells including a light emitting structure including lower and upper semiconductor layers, an upper electrode, and a lower electrode, a conductive interconnection layer electrically connecting a lower electrode of a first one of the light emitting cells and an upper electrode of a second one of the light emitting cells, and a current blocking layer disposed to extend from between the upper electrode and the upper semiconductor layer, wherein each light emitting cell further includes a conductive layer arranged to electrically connect the upper electrode of the second light emitting cell to the upper semiconductor layer of the second light emitting cell. | 06-12-2014 |
| 20140159072 | LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE ASSEMBLY, AND ELECTRODE-BEARING SUBSTRATE - A light-emitting device assembly includes a plurality of light-emitting devices, the plurality of light-emitting devices being provided continuously, the plurality of light-emitting devices each including a substrate, an optical semiconductor element mounted on the surface of the substrate, an encapsulating layer formed on the substrate surface to encapsulate the optical semiconductor element, and an electrode formed on the substrate surface so as to be electrically connected to the optical semiconductor element. The substrate has a fragile region formed to partition off the light-emitting devices that are disposed next to each other. | 06-12-2014 |
| 20140159073 | ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE - The present invention provides an array substrate and a method for manufacturing the same, and a display device. Wherein, after forming a pattern corresponding to a source/drain electrode layer, a transparent conducting layer is formed, and then a passivation layer is formed on the transparent conducting layer. Because the transparent conducting layer has a characteristic of anti-etching, it is hard to be damaged, so that the problem of damage of copper in the source/drain electrode layer is solved without increasing the process steps for forming the array substrate. | 06-12-2014 |
| 20140159074 | EL DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME - An EL display device of the present invention includes a plurality of pixel electrodes, wiring, a common electrode, a plurality of light-emitting layer portions, and a protective layer. The pixel electrodes are formed in one-to-one correspondence with a plurality of pixels. The wiring is formed in at least one of a plurality of intervals between the pixels. The common electrode is formed above each of the pixel electrodes and is in electrical connection with the wiring. The common electrode is made of alkali metal or alkaline earth metal. The light-emitting layer portions are each located between a corresponding one of the pixel electrodes and the common electrode. The protective layer is located on the common electrode, preventing oxidization thereof. The EL display device suppresses voltage drop in the common electrode, while also suppressing reduction in a property of electron injection to the light-emitting layer portions. | 06-12-2014 |
| 20140159075 | LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device package uses a metal layer as a reflective region and includes a light-emitting device chip and an electrode pad that are disposed on an insulating layer. In addition, the electrode pad and an electrode pattern of a printed circuit board are connected to each other by an electrode pattern formed of conductive ink. A method of manufacturing a light-emitting device package includes forming an insulating layer on a metal layer, and bonding a light-emitting device chip and an electrode pad on the insulating layer. The electrode pad and a printed circuit board are connected to each other by conductive ink. | 06-12-2014 |
| 20140159076 | LIGHT-EMITTING DEVICE - Improves light extraction efficiency. A light emitting device | 06-12-2014 |
| 20140167075 | PHOSPHOR CAP FOR LED DIE TOP AND LATERAL SURFACES - A method for depositing a layer of phosphor-containing material on a plurality of LED dies includes disposing a template with a plurality of openings on an adhesive tape and disposing each of a plurality of LED dies in one of the plurality of openings of the template. The method also includes forming a patterned dry film photoresist layer over the template and the plurality of LED dies. The photoresist layer has a plurality of openings configured to expose a top surface and side surfaces of each of the LED dies. Next, a phosphor-containing material is disposed on the exposed top surface of each the LED dies. The method further includes removing the photoresist layer and the template. | 06-19-2014 |
| 20140167076 | LED MODULE WITH SEPARATE HEAT-DISSIPATION AND ELECTRICAL CONDUCTION PATHS, AND RELATED HEAT DISSIPATION BOARD - A LED module with separate heat-dissipation and electrical conduction paths is disclosed, having a metal substrate; a plastic layer, comprising one or more hollow regions, and attached to the metal substrate; one or more conducting elements attached to the plastic layer; one or more LED chips positioned in the one or more hollow regions of the plastic layer and directly attached to the metal substrate; and a plurality of conducting wires for electrically connecting the one or more conducting elements and the one or more LED chips; wherein inner sides of the one or more hollow regions comprise one or more inclined surfaces each having an included angle with an upper surface of the metal substrate, and the included angle is between 90-180 degrees. | 06-19-2014 |
| 20140167077 | LIGHT SOURCE MODULE - A light source module includes a substrate, at least two light emitting diode (LED) chips and at least one dummy chip. The LED chips are disposed on the substrate. The dummy chip is disposed on the substrate and located between the LED chips. The LED chips, the dummy chip and the substrate are electrically connected to one another. The dummy chip is used to redirect a lateral light emitted from the LED chips. | 06-19-2014 |
| 20140167078 | LEAD FRAME AND LIGHT EMITTING DIODE PACKAGE HAVING THE SAME - An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way. | 06-19-2014 |
| 20140167079 | ARRAY SUBSTRATE, METHOD FOR FABRICATING THE SAME AND DISPLAY DEVICE - An array substrate, a method for fabricating the same and a display device are disclosed. The array substrate comprises a display region, at least two common electrode blocks are disposed at a periphery of the display region and conducted via a pixel electrode bridge line pattern. | 06-19-2014 |
| 20140175463 | FLEXIBLE DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A flexible display device is discussed. The flexible display device according to an embodiment includes an insulating and flexible substrate on which an adhesive layer is formed, a support layer adhered to the substrate via the adhesive layer, a cell array formed above the support layer, defining a plurality of pixel regions, and including a ground line connected to a ground voltage source of an external circuit, a light emitting array including a plurality of light emitting structures formed on the cell array, a sealing layer formed on the cell array, and a buffer layer, a shielding layer, and a bottom insulating layer formed between the support layer and the cell array. The light emitting array emits light toward the sealing layer, and the ground line is connected to the shielding layer through a contact hole to partially expose the shielding layer. | 06-26-2014 |
| 20140175464 | LIGHT EMITTING DIODE DEVICE - A light emitting diode (LED) device includes a light guiding member having a light incident surface, and an LED light bar mounted on the light incident surface. The LED light bar includes a printed circuit board, LEDs mounted on the printed circuit board, and encapsulating layers formed on the printed circuit board and respectively encapsulating the LEDs therein. Each encapsulating layer includes a light outputting surface away from the printed circuit board. The light incident surface faces the light outputting surface and air between the light incident surface and the light outputting surface is entirely exhausted. | 06-26-2014 |
| 20140175465 | LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME - Exemplary embodiments of the present invention provide a light emitting diode including a first light emitting cell and a second light emitting cell disposed on a substrate and spaced apart from each other, a first transparent electrode layer disposed on the first light emitting cell and electrically connected to the first light emitting cell, a current blocking layer disposed between a portion of the first light emitting cell and the first transparent electrode layer, an interconnection electrically connecting the first light emitting cell and the second light emitting cell, and an insulation layer disposed between the interconnection and a side surface of the first light emitting cell. The current blocking layer and the insulation layer are connected to each other. | 06-26-2014 |
| 20140175466 | LED MIXING CHAMBER WITH REFLECTIVE WALLS FORMED IN SLOTS - A relatively large substrate has a reflective surface, such as a diffusive white surface. LED dies, either as bare LED dies or packaged LED dies, are mounted to the substrate to form separate arrays of LEDs. Each array is intended for a separate mixing chamber. A layer of an encapsulant, such as silicone, is deposited over the substrate to encapsulate the LED dies. A laser etches through the encapsulant to form slots, and a reflective material, such as a white paint, is deposited in the slots to form reflective walls of each mixing chamber. If desired, a phosphor layer is deposited over the encapsulant and reflective walls. The substrate is then singulated to separate out the mixing chambers. Since no discrete parts are assembled, and multiple mixing chambers are formed simultaneously, the resulting mixing chambers are inexpensive and very reliable. | 06-26-2014 |
| 20140183565 | Light-Emitting Module Board and Manufacturing Method of the Light-Emitting Module Board - A light-emitting module board includes a metal board provided with an insulating layer, a light-emitting part and a white insulating film. The light-emitting part includes plural LED chips mounted on the metal board, and a white reflecting film of a ceramic coating formed in a light-emitting area on the metal board on which the plural LED chips are mounted. The white insulating film is an insulating film made of a same material as the white reflecting film and formed in a non-light-emitting area which is other than the light-emitting part and is provided on the metal board outside the light-emitting part. | 07-03-2014 |
| 20140183566 | MULTI-CHIP LED DIODE APPARATUS - In one aspect, there is an apparatus that comprises a plurality of light emitting chips that each have active areas that have elongated aspect ratios. This chips are mounted in a generally rectangular package. The chips are each arranged around a periphery of the package so that each narrow side of each chip abuts either a sidewall forming the periphery of the package or a long side another of the chips. Some of the chips receive a biasing voltage through one or more other of the chips. | 07-03-2014 |
| 20140183567 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A display device includes a data IC including a plurality of dummy output pads, and a plurality of signal output pads that are positioned at both sides of the plurality of dummy output pads; a plurality of dummy data pads and a plurality of signal input data pads in a non-display region of an array substrate of a display panel, the plurality of dummy data pads corresponding to the plurality of dummy output pads, and the plurality of signal input data pads corresponding to the plurality of the signal output pads; and a plurality of data link lines in the non-display region, and connected between the plurality of signal input data pads and the plurality of data lines in a display region of the display panel | 07-03-2014 |
| 20140183568 | LED PACKAGE WITH FLEXIBLE POLYIMIDE CIRCUIT AND METHOD OF MANUFACTURING LED PACKAGE - A light emitting diode (LED) package may include a base, at least one light emitting die on the base, and a flextape on the base. The flextape includes at least one metal trace connected to the light emitting die. In a method of manufacturing the LED package, the base may be formed so as to include a basin and at least one light emitting die may be placed within the basin. The flextape may be provided to include at least one metal trace that is electrically connected to the light emitting die. | 07-03-2014 |
| 20140183569 | LED CHIP UNIT AND MANUFACTURING METHOD THEREOF, AND LED MODULE - An LED chip unit and manufacturing method thereof, a LED module, an illuminating device and a display device. The LED chip unit includes a plurality of LED cores which are electrically isolated from each other. The LED chip unit is used for a cutting unit of an epitaxial wafer, so that scraping channels between the LED chip units are only reserved. The area which the space between the adjacent cores occupies is less than the scraping channel, so that utilization ratio of the epitaxial wafer is increased. The cores are integrated and the LED chip unit is packaged on the base plate as a basic unit, so that the cores are packaged on the base plate at a time thereby simplifying packaging. | 07-03-2014 |
| 20140183570 | Illumination Apparatuses - The present invention provides an illumination apparatus. The illumination apparatus comprises a body having a lower portion coupled to a standard metallic lamp adaptor and an upper portion; a light source module comprising an LED array of LED chips connected in series, a phosphor powder layer encapsulating the LED chips, and a pair of conductive wires electrically connected to the LED chips for transmitting electric power to the LED chips; and a transparent housing coupled to the upper portion of the body, so that the LED chips are enveloped within the transparent housing. | 07-03-2014 |
| 20140183571 | DISPLAY DEVICE - A display device includes a micro-lens film which has a high fill-factor and a high luminance ratio and prevents generation of moiré. The display device includes a display panel configured to display an image, a plurality of Light Emitting Diodes (LEDs) configured to generate light to supply light to the display panel, a light guide panel configured to guide light to the display panel, and a micro-lens film including a base film that concentrates and diffuses light emitted from the light guide panel, a lens unit at an upper surface of the base film, and a back-coating film at a lower surface of the base film. The lens unit includes unit block groups randomly arranged at the upper surface of the base film, each unit block group containing randomly arranged fixed-shape lenses having different sizes, and micro-beads randomly formed on surfaces of the fixed-shape lenses. | 07-03-2014 |
| 20140183572 | LIGHT EMITTING DEVICE - A light emitting device includes a substrate, a plurality of light emitting cells disposed on the substrate to be spaced apart from each other, and a connection wire electrically connecting adjacent ones of the light emitting cells. One of the adjacent light emitting cells includes a plurality of first segments, and the other of the adjacent light emitting cells includes a plurality of second segments respectively facing the first segments. A separation distance is provided between first and second segments facing each other, where each of which has an end contacting the connection wire is greater than a separation distance between first and second segments facing each other, and each of which has an end that does not contact the connection wire. | 07-03-2014 |
| 20140183573 | LIGHT EMITTING DEVICE - A light emitting device includes a substrate, a plurality of light emitting cells disposed on the substrate to be spaced apart from each other, and a connection wire electrically connecting adjacent ones of the light emitting cells. A first separation distance between first adjacent light emitting cells that are not connected by the connection wire among the light emitting cells is smaller than a second separation distance between second adjacent light emitting cells connected by the connection wire among the light emitting cells. | 07-03-2014 |
| 20140183574 | LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE USING THAT PACKAGE, AND ILLUMINATION DEVICE USING THE LIGHT EMITTING DEVICES - The light emitting device package of the present invention has a longitudinal direction (as viewed from above) and a transverse direction perpendicular to the longitudinal direction, and is provided with a first and second lead-frame lined-up in the longitudinal direction and molded resin holds the first and second lead-frames integrally. The package is characterized in that the first lead-frame has a main body and an extension that extends from the main body with a narrowed width towards the second lead-frame. Further, a recess is established in the bottom surface of the first lead-frame, and at least part of the exposed region of the bottom surface of the extension is separated from the exposed region of the bottom surface of the main body by the molded resin that fills the recess. | 07-03-2014 |
| 20140183575 | LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - The light-emitting device has a plurality of light-emitting elements that is mounted on one or more wiring patterns on a substrate. A new light-emitting element that replaces a defective element is mounted on the same wiring pattern on which the defective element is mounted. The defective element or a trace that remains after removal of the defective element is sealed by a same sealing member by which the new light-emitting element is sealed. | 07-03-2014 |
| 20140183576 | Display Device and Method of Fabricating the Display Device - In an EL element having an anode, an insulating film (bump) formed on the anode, and an EL film and a cathode formed on the insulating film, each of a bottom end portion and a top end portion of the insulating film is formed so as to have a curved surface. The taper angle of a central portion of the insulating film is set within the range from 35° to 70°, thereby preventing the gradient of the film forming surface on which the EL film and the cathode are to be formed from being abruptly changed. On the thus-formed film forming surface, the EL film and the cathode can be formed so as to be uniform in thickness, so that occurrence of discontinuity in each of EL film and the cathode is prevented. | 07-03-2014 |
| 20140191256 | THIN FILM TRANNSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF - Instead of forming contact holes the same way in both the non-image forming peripheral area (PA) and the image forming display area of a thin film transistor array panel, contact holes in the DA are formed to be substantially smaller than those in the PA for thereby improving an aperture ratio of the corresponding display device. In an exemplary embodiment, an inorganic gate insulating layer is not etched in the DA and only an inorganic first passivation layer among inorganic insulating layers positioned in the DA is etched to allow communication between the drain electrode and the corresponding field generating electrode. On the other hand, in the peripheral area, plural inorganic insulating layers such as the gate insulating laver, the first passivation laver, and the second passivation layer positioned on the gate wire and the data wire are simultaneously etched to form second contact holes and third contact holes exposing respective gate pads and data pads. | 07-10-2014 |
| 20140191257 | ELECTRONIC DEVICES WITH YIELDING SUBSTRATES - In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts. | 07-10-2014 |
| 20140191258 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, a semiconductor light emitting device includes not less than three chips. Each of the chips includes a semiconductor layer having a first face, a second face formed on a side opposite to the first face, and a light emitting layer, a p-side electrode, and an n-side electrode. The chips include a central chip centrally positioned in a plan view, and at least two peripheral chips arranged symmetrically to each other sandwiching the central chip in the plan view. A thickness of the fluorescent body layer on the first face is same among the peripheral chips, and the fluorescent body layer on the first face of the central chip and the fluorescent body layers on the first faces of the peripheral chips have thicknesses different from each other. | 07-10-2014 |
| 20140191259 | MOLDED CHIP FABRICATION METHOD AND APPARATUS - A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices. | 07-10-2014 |
| 20140197426 | LIGHT EMITTING DIODE CHIP STRUCTURE AND LIGHT EMITTING DIODE ELEMENT - A light emitting diode chip structure includes a substrate, a mesa type light emitting diode structure, and an electroluminescent layer. The mesa type light emitting diode structure includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The mesa type light emitting diode structure is formed on the substrate. The first semiconductor layer is formed on the substrate. The light emitting layer is formed on a portion of the first semiconductor layer, and a portion of the first semiconductor layer is uncovered. The second semiconductor layer is formed on the light emitting layer. The electroluminescent layer is formed on the second semiconductor layer. Furthermore, a light emitting diode element is also disclosed herein. | 07-17-2014 |
| 20140197427 | A DISPLAY APPARATUS SUBSTRATE HAVING A PLURALITY OF ORGANIC AND INORGANIC LAYERS STACKED - A display apparatus and a method of manufacturing the same includes a substrate including a plurality of organic layers and a plurality of inorganic layers, a display unit formed on the substrate and an encapsulation unit formed on the display, wherein the plurality of organic layers and the plurality of inorganic layers comprise at least a first organic layer, a first inorganic layer, a second organic layer, and a second inorganic layer which are sequentially stacked, and wherein an interfacial adhesion strength of the second organic layer is higher than an interfacial adhesion strength of the first organic layer. | 07-17-2014 |
| 20140197428 | DISPLAY PANEL AND DISPLAY DEVICE - A display panel includes an array substrate, an opposite substrate, and at least one closed sealing element. The array substrate has a first through hole, and the array substrate includes a plurality of pixel units, a plurality of scan lines, and a plurality of data lines. The scan lines are electrically connected to the pixel units. The data lines intersect with the scan lines, and the data lines are electrically connected to the corresponding pixel units. The opposite substrate is disposed opposite to the array substrate, and the opposite substrate has a second through hole. The closed sealing element is disposed between the array substrate and the opposite substrate, and the closed sealing element has a third through hole. The first through hole, the second through hole, and the third through hole form an opening. | 07-17-2014 |
| 20140197429 | METHOD OF ARRANGING A MULTIPLICITY OF LEDS IN PACKAGING UNITS, AND PACKAGING UNIT COMPRISING A MULTIPLICITY OF LEDS - A method of arranging a multiplicity of LEDs in packaging units includes defining a desired range for at least one photometric measurement variable for each of the packaging units; selecting an LED from the multiplicity of LEDs not yet arranged in one of the packaging units; measuring the at least one photometric measurement variable for the selected LED; equipping one of the packaging units containing fewer than N−1 LEDs with the selected LED; storing a measured value and a position of the selected LED in the packaging unit in a memory; repeating until the packaging units are equipped with N−1 LEDs; repeating and calculating the average value of the photometric measurement variable, equipping a packaging unit for which the calculated average value of the variable lies in a defined range with the selected LED; and storing the measured value and the position of the selected LED. | 07-17-2014 |
| 20140197430 | SUBSTRATE FREE LED PACKAGE - A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies. | 07-17-2014 |
| 20140197431 | LIGHT EMITTING DEVICE - Provided is a light emitting device having a high light emitting efficiency and a good brightness distribution, further having a good color mixing and a good light distribution. A light emitting device includes a base member, a plurality of light emitting elements disposed on the base member, and a sealing member sealing the light emitting elements. The base member has a plurality of regions divided by virtual lines extending in a radial manner from one point disposed on the base member to an outer periphery of the base member, and a light transmissive wall member between adjacent two regions of the plurality of regions. A sealing member containing a fluorescent material is disposed on each region of the plurality of regions. A color tone of light emitted from a first region which is one of the two adjacent regions of the plurality of regions differs from a color tone of light emitted from a second region which is the other of the two adjacent regions. | 07-17-2014 |
| 20140203301 | DISPLAY DEVICE - A display device includes a substrate and pixels arranged on the substrate in a matrix form. The substrate includes a display area in which the pixels are arranged and a non-display area disposed adjacent to a side of the display area. Each pixel includes a cover layer that extends in a row direction that includes a sidewall portion connected to the substrate and a cover portion spaced apart from the substrate and connected to the sidewall portion to define a tunnel-shaped cavity on the substrate. A width of the sidewall portion between adjacent pixels is less than a width of the sidewall portion disposed at an outermost position, and the cover layer seals one side of the tunnel-shaped cavity in the pixels arranged in a first row and a last row. | 07-24-2014 |
| 20140203302 | PIXEL STRUCTURE OF DISPLAY PANEL - A pixel structure of a display panel includes a gate line, a first data line, a second data line, a first active switching device, a second active switching device, a first pixel electrode and a second pixel electrode. The first pixel electrode is electrically connected to the first active switching device. The first pixel electrode includes a first main electrode disposed adjacent to one side of the first data line, and a second main electrode disposed adjacent to one side of the second data line. The second pixel electrode is electrically connected to the second active switching device. The second pixel electrode is disposed between the first main electrode and the second main electrode of the first pixel electrode. | 07-24-2014 |
| 20140203303 | Light-Emitting Diode Display Substrate, Method For Manufacturing Same, And Display Device - A light-emitting diode (LED) display substrate, a method for manufacturing the same, and a display device are provided and involve the display field. The method for manufacturing the LED display substrate comprises: forming a transparent conductive anode ( | 07-24-2014 |
| 20140203304 | LIGHT-EMITTING DEVICE PACKAGE STRIP AND METHOD FOR MANUFACTURING THE SAME - Provided is a light-emitting device package strip that includes a lead frame strip, a plurality of resin molding products that are injection-molded in the lead frame strip, and runner and gate members that are formed between adjacent resin molding products and on end sides of a line of adjacent resin molding products, each runner and gate member having a smaller thickness than a thickness of the resin molding products to facilitate cutting thereof. | 07-24-2014 |
| 20140203305 | LIGHT EMITTING DEVICE AND ITS METHOD OF MANUFACTURE - The light emitting device is provided with a substrate, semiconductor light emitting elements mounted on the substrate, a mold frame that surrounds the periphery of the light emitting elements on the substrate, and resin layers that fill the inside of the mold frame. The mold frame includes a first mold frame, and a second mold frame formed on top of the first mold frame. The resin layers include a first resin layer that embeds the light emitting elements in resin and is formed with a height approximately equal to the height of the top of the first mold frame, and a second resin layer on top of the first resin layer that is formed with a height approximately equal to the height of the top of the second mold frame. At least one of the resin layers (which are the first resin layer and the second resin layer) includes wavelength-shifting material to change the wavelength of light emitted from the semiconductor light emitting elements. | 07-24-2014 |
| 20140203306 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device can include a wavelength converting layer including a surrounding portion, which covers at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a substrate, a frame located on the substrate, the chip mounted on the substrate, a transparent material layer located on the wavelength converting layer so as to reduce from the wavelength converting layer toward a light-emitting surface thereof, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the transparent material layer. The semiconductor light-emitting device can be configured to improve light-emitting efficiency and a color variation by using the surrounding portion and an inclined side surface of transparent material layer, and therefore can emit various colored lights including white light having a high light-emitting efficiency from a small light-emitting surface. | 07-24-2014 |
| 20140203307 | DISPLAY PANEL AND SYSTEM FOR DISPLAYING IMAGES UTILIZING THE SAME - An embodiment of the invention provides a display panel, which includes a substrate having a pixel region and a peripheral region, a control element overlying the pixel region of the substrate, a conducting layer overlying the substrate in the peripheral region, a first insulating layer overlying the conducting layer in the peripheral region, wherein a ratio between an area of the first insulating layer and an area of the conducting layer in the peripheral region is between about 0.27 and 0.99, a lower electrode layer overlying the first insulating layer, and a second insulating layer overlying the lower electrode layer. | 07-24-2014 |
| 20140203308 | LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS - In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder. | 07-24-2014 |
| 20140203309 | ELECTROLUMINESCENCE DISPLAY DEVICE - Disclosed is an electroluminescence device having a substrate, a thin film transistor over the substrate, an insulating film over the thin film transistor, an electroluminescence element over the insulating film, a passivation film over the electroluminescence element, and a counter substrate over the passivation film. The electroluminescence element is configured to emit light through the counter substrate, and a space between the substrate and the counter substrate is filled with a filler. The electroluminescence device is featured by the tapered side surface of a gate electrode of the thin film transistor. | 07-24-2014 |
| 20140209930 | Multi-Vertical LED Packaging Structure - The present disclosure involves a light-emitting diode (LED) packaging structure. The LED packaging structure includes a submount having a substrate and a plurality of bond pads on the substrate. The LED packaging structure includes a plurality of p-type LEDs bonded to the substrate through a first subset of the bond pads. The LED packaging structure includes a plurality of n-type LEDs bonded to the substrate through a second subset of the bond pads. Some of the bond pads belong to both the first subset and the second subset of the bond pads. The p-type LEDs and the n-type LEDs are arranged as alternating pairs. The LED packaging structure includes a plurality of transparent and conductive components each disposed over and electrically interconnecting one of the pairs of the p-type and n-type LEDs. The LED packaging structure includes one or more lenses disposed over the n-type LEDs and the p-type LEDs. | 07-31-2014 |
| 20140209931 | LED BOARD STRUCTURE AND METHOD OF MANUFACTURING SAME - An LED board structure includes a light-pervious substrate having a plurality of light-pervious areas formed thereon, a plurality of patterned conductive traces arranged on the light-pervious substrate at locations other than the light-pervious areas, and a plurality of LEDs correspondingly arranged on the light-pervious areas and respectively having two electrode terminals electrically connected to the patterned conductive traces. With these arrangements, light emitted from the LEDs not only projects forward, but also backwardly passes through the light-pervious areas, so that both sides of the LED board structure are illuminated by the LEDs. A method of manufacturing an LED board structure is also disclosed. | 07-31-2014 |
| 20140209932 | PIXEL UNIT AND PIXEL ARRAY - A pixel array and a pixel unit thereof adapted in a display panel are provided. The pixel array includes a plurality of pixel units, and each pixel unit includes a first gate line, a second gate line, a data line, a first sub-pixel, a second sub-pixel and a third sub-pixel. The first sub-pixel is electrically connected to the second gate line and electrically connected to the data line through the third sub-pixel. The second sub-pixel is electrically connected to the second gate line and the data line. The third sub-pixel is electrically connected to the first gate line and the data line. | 07-31-2014 |
| 20140209933 | DISPLAY PANEL AND METHOD OF MANUFACTURING THE DISPLAY PANEL - A method of manufacturing a display panel includes forming a pixel-defining layer on a substrate, disposing a mask on the pixel-defining layer on a first region of the substrate, and forming a first emission layer, and disposing the mask on the pixel-defining layer on a second region of the substrate, and forming a second emission layer. | 07-31-2014 |
| 20140209934 | WHITE LIGHT EMITTING DIODES PACKAGE CONTAINING PLURAL BLUE LIGHT-EMITTING DIODES - A white light-emitting diode (LED) package containing plural blue LED chips is disclosed. The white LED package includes a transparent plate, plural blue LED chips bonded on a front surface of the transparent plate, a front fluorescent glue layer covering the plural blue LED chips, and a rear transparent glue layer covering a rear surface of the transparent plate and located at a position aligned with the front fluorescent glue layer. The edge of the rear transparent glue layer has an inclined lateral surface or a curved inclined lateral surface. Therefore, the light can be extracted from both front and rear surfaces, and the light extraction efficiency of the rear surface of the transparent plate is increased. The rear transparent glue layer can be replaced by a rear fluorescent glue layer to reduce the color temperature difference between the lights extracted from the front surface and the rear surface. | 07-31-2014 |
| 20140209935 | ARRAY SUBSTRATE AND DISPLAY DEVICE - An array substrate and a display device are disclosed. The array substrate comprises: a TFT, a pixel electrode layer driven by the TFT, a data line, a first passivation layer and a common electrode layer disposed on a substrate, the data line is for driving the TFT, the first passivation layer is disposed between the pixel electrode layer and the common electrode layer, the array substrate further comprises a second passivation layer disposed between the common electrode layer and the data line and located in a region corresponding to the data line. | 07-31-2014 |
| 20140209936 | VERTICALLY PRINTING LEDS IN SERIES - A first layer of first vertical light emitting diodes (VLEDs) is printed on a conductor surface. A first transparent conductor layer is deposited over the first VLEDs to electrically contact top electrodes of the first VLEDs. A second layer of second VLEDs is printed on the first transparent conductor layer. Since the VLEDs are printed as an ink, the second VLEDs are not vertically aligned with the first VLEDs, so light from the first VLEDs is not substantially blocked by the second VLEDs when the VLEDs are turned on. A second transparent conductor layer is deposited over the second VLEDs to electrically contact top electrodes of the second VLEDs. By this structure, the first VLEDs are connected in parallel, the second VLEDs are connected in parallel, and the first layer of first VLEDs and the second layer of second VLEDs are connected in series by the first transparent conductor layer. | 07-31-2014 |
| 20140209937 | PACKAGE-FREE AND CIRCUIT BOARD-FREE LED DEVICE AND METHOD FOR FABRICATING THE SAME - The present invention discloses a package-free and circuit board-free LED device and a method for fabricating the same. The LED device is exempted from the semiconductor package substrate and the printed circuit board and comprises at least one LED chip having two electrodes able to directly connect with external wires and at least one chip unit. A DC power or an AC power is directly electrically connected with the two electrodes through wires to drive the LED device to emit light. The present invention minimizes device components and fabrication steps, effectively reduces cost and promotes reliability and yield. | 07-31-2014 |
| 20140209938 | SEMICONDUCTOR LIGHT EMITTING ELEMENT - A semiconductor light emitting element includes: an insulating substrate having a plurality of convex portions on a surface thereof; a plurality of light emitting element components having semiconductor laminated bodies that are laminated on the insulating substrate and are separated from one another by a groove that exposes the convex portions; and a connector connecting between the light emitting element components. The light emitting element components include a first light emitting element component and a second light emitting element component. The first light emitting element component is separated from the second light emitting element component with the groove in between, and has a first protrusion that protrudes toward the second light emitting element component. The connector includes a first connector having a shape that straddles the groove and that follows the convex portions, and has a straight section. | 07-31-2014 |
| 20140209939 | CERAMIC LED PACKAGE - A package for multiple LED's and for attachment to a substrate includes a body, which includes a top body layer, a cavity disposed through the top body layer and having a floor for bonding to the multiple LED's, and a thermal conduction layer bonded to the top body layer and having a top surface forming the floor of the cavity and a bottom surface. The thermal conduction layer includes a thermally conducting ceramic material disposed between the floor and the bottom surface. The package also includes a plurality of LED bonding pads in direct contact with the floor and configured to bond to the multiple LED's and a plurality of electrical bonding pads in direct contact with the floor, proximate to the LED bonding pads, and in electrical communication with a plurality of electrical contacts disposed on a surface of the body. | 07-31-2014 |
| 20140209940 | LIGHT EMITTING DEVICE HAVING A PLURALITY OF LIGHT EMITTING CELLS - Exemplary embodiments of the present invention relate to a light-emitting device including a single substrate, at least two light-emitting units disposed on the single substrate, each of the at least two light-emitting units including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer disposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, a first electrode connected to the first conductivity-type semiconductor layer, and a second electrode connected to the second conductivity-type semiconductor layer, wherein two light-emitting units of the at least two light-emitting units share the first conductivity-type semiconductor layer. | 07-31-2014 |
| 20140209941 | LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - A light emitting device and a method of fabricating the same. The light emitting device includes a substrate. A plurality of light emitting cells are disposed on top of the substrate to be spaced apart from one another. Each of the light emitting cells includes a first upper semiconductor layer, an active layer, and a second lower semiconductor layer. Reflective metal layers are positioned between the substrate and the light emitting cells. The reflective metal layers are prevented from being exposed to the outside. | 07-31-2014 |
| 20140209942 | METHOD AND DEVICE OF A LED MATRIX - There is provided a method for manufacturing a light emitting diode, LED, matrix ( | 07-31-2014 |
| 20140217426 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, ELECTRONIC APPARATUS, AND DISPLAY APPARATUS - A semiconductor integrated circuit device includes a COF substrate; a semiconductor integrated circuit mounted on the COF substrate and having a first voltage circuit portion operating at a first voltage range and a second voltage circuit portion operating at a second voltage range higher than the first voltage range, the circuit portions being formed on a single chip; and a resin layer for sealing the COF substrate and the semiconductor integrated circuit. | 08-07-2014 |
| 20140217427 | SOLID-STATE LIGHT EMITTING DEVICES AND SIGNAGE WITH PHOTOLUMINESCENCE WAVELENGTH CONVERSION - A solid-state light emitting device comprises a solid-state light emitter (LED) operable to generate excitation light and a wavelength conversion component including a mixture of particles of a photoluminescence material and particles of a light reflective material. In operation the phosphor absorbs at least a portion of the excitation light and emits light of a different color. The emission product of the device comprises the combined light generated by the LED and the phosphor. The wavelength conversion component can be light transmissive and comprise a light transmissive substrate on which the mixture of phosphor and reflective materials is provided as a layer or homogeneously distributed throughout the volume of the substrate. Alternatively the wavelength conversion component can be light reflective with the mixture of phosphor and light reflective materials being provided as a layer on the light reflective surface. A wavelength conversion component, light emitting sign and light emitting signage surface are also disclosed. | 08-07-2014 |
| 20140231832 | THREE-TERMINAL LIGHT EMITTING DEVICE (LED) WITH BUILT-IN ELECTROSTATIC DISCHARGE (ESD) PROTECTION DEVICE - A three-terminal light emitting device (LED) chip, associated fabrication method, and LED array are provided. The method forms an n-doped semiconductor layer overlying a substrate, an active semiconductor layer overlying the n-doped semiconductor layer, and a p-doped semiconductor layer overlying the active semiconductor layer. A trench is formed through the p-doped and active semiconductor layers, exposing the n-doped semiconductor layer. In one aspect, the trench is formed at least part way, but not completely, through the n-doped semiconductor layer. Then, an LED P electrode is formed overlying a first region of the p-doped semiconductor layer, a diode P electrode is formed overlying a second region of the p-doped semiconductor layer that is separated from the first region of the p-doped semiconductor layer by the trench, and an N electrode is formed overlying a top surface of the exposed n-doped semiconductor layer in the trench, shared by the LED and diode. | 08-21-2014 |
| 20140231833 | LIGHT EMITTING DEVICE - A first light emitting structure includes a first semiconductor layer, an active layer, and a second semiconductor layer. A second light emitting structure includes a third semiconductor layer, an active layer, and a fourth semiconductor layer. A first electrode and a second electrode connect to the first semiconductor layer, and the second semiconductor layer, respectively. A third electrode and a fourth electrode connect to the third semiconductor layer, and the fourth semiconductor layer, respectively. A first contact portion includes a first region connected to the first electrode and a second region making contact with a top surface of the first semiconductor layer, and a second contact portion connects to the second and third electrodes. A third contact portion includes a first region connected to the third electrode and a second region making contact with a top surface of the third semiconductor layer. | 08-21-2014 |
| 20140231834 | TRANSPARENT LED LAYER BETWEEN PHOSPHOR LAYER AND LIGHT EXIT SURFACE OF LAMP - A flexible light sheet lamp includes a thin substrate and an array of printed microscopic vertical LEDs (VLEDs) sandwiched between a transparent first conductor layer and a transparent second conductor layer. The light sheet has a light exit surface. The VLEDs have one surface, facing the light exit surface of the light sheet, covered with a reflective metal. A phosphor layer is provided such that the semi-transparent VLED layer is between the phosphor layer and the light exit surface. A reflector layer is provided such that the phosphor layer is between the reflector layer and the VLED layer. The substrate may form the light exit surface or the light exit surface may be the opposite side of the light sheet. Some VLED light passing through the phosphor layer is reflected by the reflector layer and re-enters the phosphor layer. Therefore, less phosphor is needed to achieve the desired conversion ratio. | 08-21-2014 |
| 20140231835 | STACKED ASSEMBLY OF LIGHT EMITTING DEVICES - A stacked assembly of light emitting devices includes a first light emitting device, a second light emitting device and a sealing member. The first light emitting device includes a first substrate member extending in a longitudinal direction and defining a plurality of through-holes, and a plurality of first light emitting elements arranged on the first substrate member. The second light emitting device is arranged to overlap with the first light emitting device. The second light emitting device includes a second substrate member extending in the longitudinal direction, and a plurality of second light emitting elements arranged on the second substrate and exposed respectively through the through-holes. The sealing member seals the first light emitting elements and the second light emitting elements. | 08-21-2014 |
| 20140231836 | STRUCTURE AND METHOD FOR LED WITH PHOSPHOR COATING - The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension. | 08-21-2014 |
| 20140231837 | LED Module - An LED module has an electrically insulating main body, a base surface and a mounting surface located opposite the base surface. A number of electrical connection contacts are arranged at the mounting surface. The connection contacts do not adjoin the base surface. A heat sink is arranged in the main body. The heat sink extends from the mounting surface as far as the base surface. Furthermore, the LED module has a number of LED chips, each having an electrically insulating carrier substrate at a chip underside and two chip contacts at a chip top side. The LED chips are arranged with the electrically insulating carrier substrate on the heat sink. | 08-21-2014 |
| 20140239316 | LIGHT EMITTER PACKAGES AND METHODS - Light emitter packages and related methods having improved performance are disclosed. In one aspect, a light emitter package can include at least one light emitter chip disposed over a substrate or submount. In some aspects, the package can include a reflective polymeric material or polymeric reflector (sometimes referred to as a “solder mask” or “solder mask material”), a reflective material, and a conductive material disposed adjacent each other within a portion of the light emitter package. In some aspects, the reflective material can include a metallic material or metallic reflector applied to side walls of traces and/or within portions of a gap between traces prior to application of the reflective polymeric material within the gap. | 08-28-2014 |
| 20140239317 | DISPLAY DEVICE - A display device includes a substrate and a flexible circuit having one of its ends bonded to the substrate. The substrate comprises a pixel array. A driver integrated circuit (IC) is mounted on the flexible circuit. The flexible circuit is bonded to the substrate without protruding beyond an edge of the substrate. One end of the flexible circuit faces toward an inside of the substrate when the flexible circuit is flatly placed on or over the substrate, and the other end of the flexible circuit is bonded to the edge of the substrate. | 08-28-2014 |
| 20140239318 | LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - The light emitting device including: a flexible substrate having a negative lead electrode and a positive lead electrode formed on an upper surface thereof; a light emitting element having a negative electrode and a positive electrode formed on an upper surface thereof; an insulating film formed on a side surface of the light emitting element; a wiring formed in contact with the insulating film for connecting between the negative electrode and the negative lead electrode, or between the positive electrode and the positive lead electrode. | 08-28-2014 |
| 20140239319 | Light Emitting Device - A light emitting device including a light emitting structure comprising a plurality of light emitting regions comprising a first semiconductor layer, an active layer and a second semiconductor layer, a first electrode unit disposed on the first semiconductor layer in one of the light emitting regions, a second electrode unit disposed on the second semiconductor layer in another of the light emitting regions, and at least one connection electrode to sequentially connect the light emitting regions in series, wherein the light emitting regions connected in series are divided into 1 | 08-28-2014 |
| 20140239320 | LIGHT EMITTING APPARATUS AND PRODUCTION METHOD THEREOF - A light emitting apparatus comprises an electrically insulating base member; a pair of electrically conductive pattern portions formed on an upper surface of the base member; at least one light emitting device that is electrically connected to the pair of electrically conductive pattern portions; and a resin portion that surrounds at least a side surface of the at least one light emitting device and partially covers the pair of electrically conductive pattern portions. Each of the pair of electrically conductive pattern portions extends toward a periphery of the base member from resin-covered parts of the electrically conductive pattern portions. At least the resin-covered parts of each of the electrically conductive pattern portions has at least one elongated through hole extending in a direction in which the electrically conductive pattern portions extend from the resin-covered parts, wherein the resin portion contacts the base member via the through holes. | 08-28-2014 |
| 20140246685 | METHOD FOR MANUFACTURING DISPLAY ELEMENT, DISPLAY ELEMENT, AND DISPLAY DEVICE - According to one embodiment, a method for manufacturing a display element is disclosed. The method can include forming a peeling layer, forming a resin layer, forming a barrier layer, forming an interconnect layer, forming a display layer, and removing. The peeling layer is formed on a major surface of a base body. The major surface has first, second, and third regions. The peeling layer includes first, second, and third peeling portions. The resin layer is formed on the peeling layer. The resin layer includes first and second resin portions. The barrier layer is formed on the first, second, and third peeling portions. The interconnect layer is formed on the barrier layer. The display layer is formed on the interconnect layer. The first peeling portion is removed from the first resin portion and the second peeling portion is removed from the second resin portion. | 09-04-2014 |
| 20140246686 | OPTICAL SEMICONDUCTOR DEVICE INCLUDING ANTIPARALLEL SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND SCHOTTKY DIODE ELEMENT - An optical semiconductor device includes a semiconductor support substrate of a conductivity type having a first resistivity, a semiconductor layer of the conductivity type formed on the semiconductor support substrate and having a second resistivity higher than the first resistivity, a first power supply terminal having a first metal in Schottky barrier contact with the semiconductor layer along with the semiconductor support substrate, so that a Schottky diode element is constructed by the first power supply terminal and the semiconductor layer along with the semiconductor support substrate, a second power supply terminal having a second metal in ohmic contact with the semiconductor support substrate, and a semiconductor light-emitting element connected between the first and second power supply terminals, the semiconductor light-emitting element being antiparallel with the Schottky diode with respect to the first and second power supply terminals. | 09-04-2014 |
| 20140246687 | CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME - A chip on film package includes a flexible base film having a first surface and a second surface opposite to each other that includes at least one through hole therein, a plurality of wirings disposed on the first surface and the second surface of the base film, respectively, that include a first lead and a second lead connected to each other through the at least one through hole, and a display panel driving chip and a touch panel sensor chip, each mounted on any one of the first surface and the second surface of the base film, wherein at least one of the display panel driving panel and the touch panel sensor chip is electrically connected to the first and second leads. | 09-04-2014 |
| 20140246688 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT - An optoelectronic semiconductor component includes: at least one optoelectronic semiconductor chip, a leadframe having one a plurality of leadframe parts, at least two electrical connection means via which the semiconductor chip is electrically contact-connected to the leadframe, and a potting body, which is fitted to the leadframe and mechanically supports the latter, wherein the one or at least one of the leadframe parts is provided with a reflective coating at a top side, the semiconductor chip is fitted on the reflective coating at the top side, the leadframe includes at least two contact locations, onto which the connection means are directly fitted, and the contact locations are formed from a material that is different from the reflective coating. | 09-04-2014 |
| 20140252380 | Shadow Mask Assembly - A shadow mask assembly includes a securing assembly configured to hold a substrate that is configured to hold a plurality of dies. The securing assembly includes a number of guide pins and a shadow mask comprising holes for the guide pins, said holes allowing the guide pins freedom of motion in one direction. The securing assembly includes a number of embedded magnets configured to secure the shadow mask to the securing assembly. | 09-11-2014 |
| 20140252381 | ACTIVE DEVICE ARRAY SUBSTRATE - An active device array substrate for saving material cost includes a substrate, scan lines, data lines, a thin film transistor, a color filter layer, a transparent conductive layer, an insulating layer and a pixel electrode. The color filter layer covers and contacts the scan lines, data lines and the thin film transistor. The transparent conductive layer is disposed on the color filter layer and electrically isolated from the scan lines, the data lines and the thin film transistor by the color filter layer. The insulating layer covers the transparent conductive layer. The pixel electrode is disposed on the insulating layer and connected to the thin film transistor. | 09-11-2014 |
| 20140252382 | SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, a semiconductor light emitting element includes a light reflecting layer, first second, third and fourth semiconductor layers, first and second light emitting layers, and a first light transmitting layer. The second semiconductor layer is provided between the first semiconductor layer and the light reflecting layer. The first light emitting layer is provided between the first and second semiconductor layers. The first light transmitting layer is provided between the second semiconductor layer and the light reflecting layer. The third semiconductor layer is provided between the first light transmitting layer and the light reflecting layer. The fourth semiconductor layer is provided between the third semiconductor layer and the light reflecting layer. The second light emitting layer is provided between the third and fourth semiconductor layers. The light reflecting layer is electrically connected to one selected from the third and fourth semiconductor layers. | 09-11-2014 |
| 20140252383 | LIGHT-EMITTING DEVICE - Occurrence of a crosstalk phenomenon in a light-emitting device is inhibited. The light-emitting device includes an insulating layer; a first lower electrode over the insulating layer; a second lower electrode over the insulating layer; a structure over the insulating layer and between the first lower electrode and the second lower electrode; a first partition wall between the first lower electrode and the structure, over the insulating layer; a second partition wall between the second lower electrode and the structure, over the insulating layer; a first light-emitting unit over the first lower electrode, the first partition wall, the structure, the second partition wall, and the second lower electrode; an intermediate layer over the first light-emitting unit; a second light-emitting unit over the intermediate layer; and an upper electrode over the second light-emitting unit. | 09-11-2014 |
| 20140252384 | White LED Assembly With LED String And Intermediate Node Substrate Terminals - A white LED assembly includes a string of series-connected blue LED dice mounted on a substrate. The substrate has a plurality of substrate terminals. A first of the substrate terminals is coupled to be a part of first end node of the string. A second of the substrate terminals is coupled to be a part of an intermediate node of the string. A third of the substrate terminals is coupled to be a part of a second end node of the string. Other substrate terminals may be provided and coupled to be parts of corresponding other intermediate nodes of the string. A single contiguous amount of phosphor covers all the LED dice, but does not cover any of the substrate terminals. In one example, the amount of phosphor contacts the substrate and has a circular periphery. All the LEDs are mounted to the substrate within the circular periphery. | 09-11-2014 |
| 20140264393 | LIGHT ENGINE - A light engine with a heat sink having a curved recessed cavity that receives a flexed or cupped PCB bearing a plurality of LEDs. Once situated within the cavity and released, the PCB has a tendency to return to its flat state, but flanges or other suitable mechanisms at the ends of the cavity restrain the edges of the PCB and prevent the PCB from returning to its flat state. In this way, the PCB is securely retained within and biased against the cavity by its own forces. As the PCB heats, the PCB expands, further biasing the PCB against the cavity of the heat sink and increasing the thermal conductivity between the two components. | 09-18-2014 |
| 20140264394 | LIGHT EMITTING DIODE - A light emitting diode with a front surface adapted to emit light and a rear surface is provided with a reflective coating on the rear surface, the reflective coating being primarily silver and containing either 0.4% bismuth or a combination of 0.5% tin, 0.2% copper, and 0.2% samarium. | 09-18-2014 |
| 20140264395 | LIGHT EMITTING MODULE - Disclosed is a light emitting module. The light emitting module includes a substrate and a plurality of light emitting devices disposed on the substrate, at least one of the plurality of light emitting devices includes a plurality of light emitting cells which are individually driven, and the plurality of light emitting cells include a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer, and has a light emitting surface emitting light. | 09-18-2014 |
| 20140264396 | ULTRA-THIN PRINTED LED LAYER REMOVED FROM SUBSTRATE - Ultra-thin flexible LED lamp layers are formed over a release layer on a substrate. The LED lamp layers include a first conductor layer overlying the release layer, an array of vertical light emitting diodes (VLEDs) printed over the first conductor layer, where the VLEDs have a bottom electrode electrically contacting the first conductor layer, and a second conductor layer overlying the VLEDs and contacting a top electrode of the VLEDs. Other layers may be formed, such as protective layers, reflective layers, and phosphor layers. The LED lamp layers are then peeled off the substrate, wherein the release layer provides a weak adherence between the substrate and the LED lamp layers to allow the LED lamp layers to be separated from the substrate without damage. The resulting LED lamp layers are extremely flexible, enabling the LED lamp layers to be adhered to flexible target surfaces including clothing. | 09-18-2014 |
| 20140264397 | CERAMIC BASED LIGHT EMITTING DIODE (LED) DEVICES AND METHODS - Light emitter devices, such as light emitting diode (LED) devices and related methods are disclosed. A light emitter device includes a ceramic based substrate, at least one LED chip disposed on the substrate, and a filling material. The ceramic substrate can include one or more surface features. The filling material can be disposed over and/or within a portion of the one or more surface features. Surface features can include one or more pedestals, trenches, holes, indentions, depressions, waves, and/or convexly or concavely curved surfaces. Surface features can improve optics of the LED device, for example, improving brightness, reflection, and/or light extraction associated with the device. Related methods are disclosed. | 09-18-2014 |
| 20140264398 | Light Emitting Unit, Light Emitting Device, and Lighting Device - The light-emitting unit has at least a first light-emitting element, a second light-emitting element, and a separation layer. The separation layer has a leg portion and a stage portion which protrudes outside of a bottom surface of the leg portion over the leg portion. An upper electrode of the first light-emitting element is electrically connected to a lower electrode of the second light-emitting element in a region where the upper electrode and the lower electrode overlap with the stage portion of the separation layer. By providing the separation layer, the light-emitting unit can be formed without using a metal mask. The upper electrode can be a composite material including an organic compound and a metal oxide or a stacked layer of the composite material and a metal material or a light-transmitting conductive material. | 09-18-2014 |
| 20140264399 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURE - A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encapsulant is disposed within an aperture of the receptacle on the elastomeric encapsulant. | 09-18-2014 |
| 20140264400 | INTEGRATED MULTI-CHIP MODULE OPTICAL INTERCONNECT PLATFORM - Techniques, systems, and devices are disclosed to provide multilayer platforms for integrating semiconductor integrated circuit dies, optical waveguides and photonic devices to provide intra-die or inter-die optical connectivity. For example, an integrated semiconductor device having integrated circuits respectively formed on different semiconductor integrated circuit dies is provided to include a carrier substrate structured to form openings on a top side of the carrier substrate; semiconductor integrated circuit dies fixed to bottom surfaces of the openings of the carrier substrate, each semiconductor integrated circuit die including a semiconductor substrate and an integrated circuit formed on the semiconductor substrate to include one or more circuit components, and each semiconductor integrated circuit die being structured to have a top surface substantially coplanar with the top side of the carrier substrate; and planar layers formed on top of the top surfaces of the semiconductor integrated circuit dies and the top side of the carrier substrate to include optical waveguides and photonic devices to provide (1) intra-die optical connectivity for photonic devices associated with a semiconductor integrated circuit die, or (2) inter-die optical connectivity for photonic devices associated with different semiconductor integrated circuit dies. | 09-18-2014 |
| 20140284632 | DISPLAY DEVICE HAVING MEMS TRANSMISSIVE LIGHT VALVE AND METHOD FOR FORMING THE SAME - A display device having a MEMS transmissive light valve and a method for forming the same are provided. The method includes: providing a multilayer semiconductor substrate comprising a bottom semiconductor layer, a middle buried layer and a top semiconductor layer; forming a light guide opening in the top semiconductor layer; forming at least one MOS device in a remaining part of the top semiconductor layer; forming an interconnection layer and an interlayer dielectric layer on the at least one MOS; forming a MEMS transmissive light valve, which is electrically connected to the interconnection layer, on the light guide opening, where the MEMS transmissive light valve is surrounded by the interlayer dielectric layer; forming a transparent backplane on a top surface of the interlayer dielectric layer; and removing the bottom semiconductor layer. | 09-25-2014 |
| 20140284633 | STACKED LIGHT EMITTING DIODE ARRAY STRUCTURE - The present invention provides a stacked LED array structure, comprising a substrate and a plurality of LED dies stacked on the substrate in turn. Each LED die comprises a first semiconductor layer and a second semiconductor layer. The first semiconductor layer is provided thereon with a first electrode and stacked with the second semiconductor layer, while the second semiconductor layer is provided thereon with a second electrode and stacked with the first semiconductor layer of another LED die. The second electrode of each LED die is connected to the first electrode of another LED die in series via a metal layer to from an LED array. A plurality of LED dies may be stacked to be an LED array in a stacked manner, resulting in not only easy manufacturing, but also an effectively reduced volume for arranging the whole LED array. | 09-25-2014 |
| 20140284634 | LIGHT-EMISSION ELEMENT ASSEMBLY AND METHOD OF MANUFACTURING SAME, AS WELL AS DISPLAY - A light-emission element assembly includes: a light-emission element; a mold section in which the light-emission element is molded; a pad section protruding from an undersurface of the mold section, and electrically connected to the light-emission element; and a reinforcement section provided in the pad section, and projecting towards a side on which the mold section is provided. | 09-25-2014 |
| 20140284635 | INTEGRATED POWER SUPPLY ARCHITECTURE FOR LIGHT EMITTING DIODE-BASED DISPLAYS - An integrated circuit including a die of the integrated circuit, the die including an insulating layer, light emitting diodes, a semiconductor layer, and a control module. The insulating layer includes a first side and a second side. The second side is opposite to the first side. The light emitting diodes are arranged on the first side of the insulating layer. The semiconductor layer is arranged adjacent to the second side of the insulating layer. The light emitting diodes are connected to the semiconductor layer using connections from the first side of the insulating layer to the second side of the insulating layer. The control module is arranged on the semiconductor layer. The control module is configured to output pulse width modulated pulses to the light emitting diodes via the connections. | 09-25-2014 |
| 20140284636 | WHITE LIGHT SOURCE AND WHITE LIGHT SOURCE SYSTEM INCLUDING THE SAME - The present invention provides a white light source comprising: a light emitting diode (LED) having a light emission peak wavelength in a range of 350 or more and 420 nm or less; and a phosphor layer including four or more types of phosphors and resin, wherein the white light source satisfies a relational equation of: −0.2≦[(P(λ)×V(λ))/(P(λmax1)×V(λmax1))−(B(λ)×V(λ))/(B(λmax2)×V(λmax2))]≦+0.2, assuming that: a light emission spectrum of the white light source is P(λ); a light emission spectrum of black-body radiation having a same color temperature as that of the white light source is B(λ); a spectrum of a spectral luminous efficiency is V(λ); a wavelength at which P(λ)×V(λ) becomes largest is λmax1; and a wavelength at which B(λ)×V(λ) becomes largest is λmax2, and wherein an amount (difference) of chromaticity change on CIE chromaticity diagram from a time of initial lighting up of the white light source to a time after the white light source is continuously lighted up for 6000 hours is less than 0.010. According to the above white light source, there can be provided a white light source capable of reproducing the same light emission spectrum as that of natural light. | 09-25-2014 |
| 20140291704 | PLASMONIC IR DEVICES - An infra-red (IR) device comprising a dielectric membrane formed on a silicon substrate comprising an etched portion; and at least one patterned layer formed within or on the dielectric membrane for controlling IR emission or IR absorption of the IR device, wherein the at least one patterned layer comprises laterally spaced structures. | 10-02-2014 |
| 20140291705 | PHOSPHOR FILM, METHOD OF MANUFACTURING THE SAME, COATING METHOD OF PHOSPHOR LAYER, METHOD OF MANUFACTURING LED PACKAGE AND LED PACKAGE MANUFACTURED THEREBY - There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer. | 10-02-2014 |
| 20140291706 | LIGHT EMITTING DIODE DEVICE - A light emitting diode (LED) device includes: a substrate having a central portion; an LED chip unit formed on the central portion of the substrate; a circuit pattern having a positive electrode and a negative electrode that are formed on the substrate, each of the positive electrode and the negative electrode including an arc portion and at least one extending portion that extends from the arc portion toward the central portion; a wire unit connecting the LED chip unit to the extending portions; a glass layer disposed on the substrate, covering the arc portions and including an opening unit that is aligned with the central portion of the substrate; a dam structure formed on the glass layer and extending along the arc portions; and an encapsulated body disposed substantially within the dam structure to cover the extending portions, the wire unit and the LED chip unit. | 10-02-2014 |
| 20140291707 | SEMICONDUCTOR LIGHT DEVICE HAVING A GALVANIC NON-INSULATED DRIVER - A semiconductor light-emitting device is disclosed. The device includes a plurality of semiconductor light sources and a driver with no galvanic isolation for operating the semiconductor light sources wherein the semiconductor light sources may be divided into at least two carriers, the carriers are applied on an electrically conductive substrate, and the driver, and current-conducting regions also provided on a surface of the carriers, are electrically insulated from the substrate. | 10-02-2014 |
| 20140291708 | Alternating Current Vertical Light Emitting Element and Manufacturing Method Thereof - This invention discloses an AC-type vertical light emitting element and fabrication method thereof, which achieves polarity reversal of two LEDs via regional laser stripping and die bonding. The two LEDs are placed on a conductive substrate (e.g. Si substrate); therefore, the bonding pads of the two LEDs are on the back of the conductive substrate and the light emitting surfaces of the two LEDs, thus overcoming such problems of low light emitting efficiency and high thermal resistance of the traditional lateral structure. | 10-02-2014 |
| 20140299893 | Conductive Connector For Use With Circuit Board, and LED Module Having the Same - A conductive connector for use with circuit boards is characterized in that a conductive connection plug and a conductive connection socket are disposed on two circuit boards, respectively. The conductive connection plug has an inserting portion protruding from the edge of the first circuit board. The conductive connection socket has a clamping portion for clamping and securing the inserting portion of the conductive connection plug. The conductive connection plug is plugged into the conductive connection socket to enable the two circuit boards to be put together easily and quickly and reduce required space. An LED module is characterized in that the conductive connector connects circuit boards each having at least one LED component to enable the circuit boards to be put together easily and quickly, taken apart easily, and changed easily. | 10-09-2014 |
| 20140299894 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode (LED) package including a substrate unit, a light emitting unit and an encapsulant. The substrate unit includes a metal substrate and a circuit board. The metal substrate has a first carrier portion and a second carrier portion. The second carrier portion is projected from the first carrier portion. The first carrier portion has a first carrier face. The second carrier portion has a second carrier face located higher than the first carrier face. The circuit board is disposed on the first carrier face, and the second carrier portion passes through the circuit board. The light emitting unit includes at least one LED chip disposed on the second carrier face of the second carrier portion, and the LED chip electrically connected to the circuit board. The encapsulant encapsulates the LED chip. | 10-09-2014 |
| 20140299895 | LIGHT EMITTING DEVICE WITH PHOSPHOR WAVELENGTH CONVERSION - A light emitting device comprises a substantially planar light transmissive substrate having a light emitting surface and an opposite surface. The substrate is configured as a light guiding medium. The light emitting device also comprises at least one phosphor material disposed as a layer on the light emitting surface with a plurality of window areas and at least one source of excitation radiation of a first wavelength positioned adjacent to at least one peripheral edge of the substrate. The source is configured to couple excitation radiation into the substrate such that it is waveguided within the substrate by total internal reflection. Additionally, the light emitted by the device from the light emitting surface comprises first wavelength radiation and second, longer wavelength photoluminescent light emitted by the phosphor layer as a result of excitation by the source. | 10-09-2014 |
| 20140299896 | SURFACE-TEXTURED ENCAPSULATIONS FOR USE WITH LIGHT EMITTING DIODES - Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode (LED) array apparatus includes a plurality of LEDs mounted to a substrate and an encapsulation covering the LEDs and having a surface texturing configured to extract light, wherein the surface texturing is includes at least one light extracting feature having a diameter larger than two or more of the LEDs. | 10-09-2014 |
| 20140299897 | High Efficient and High Power LED Light Source,LED Lamp Which Uses Light Source and the Application of the Lamp - A light module includes a plurality of LEDs coupled on a circuit board, a condenser unit including a plurality of condensers integrally coupled with each other and supported on the circuit board, and a plurality of converging lenses supported within the light cavities of said condensers respectively. Each LED is located at a focal point of the condenser and is located at a focal point of the converging lens. A first portion of light from the LED is directly project toward the converging lens and is diverged by the converging lens to parallelly project out of the condenser. A second portion of light from the LED is reflected by a light reflecting wall of the condenser to parallelly project out of the condenser. Therefore, the first and second portions of light form collimated light beams out of a light opening of the condenser. | 10-09-2014 |
| 20140299898 | LIGHT EMITTING DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME - A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump. | 10-09-2014 |
| 20140306242 | OPTICAL SEMICONDUCTOR LIGHTING APPARATUS - An optical semiconductor lighting apparatus including: a substrate in which a single LED chip or a plurality of LED chips are disposed; a first mold portion disposed on the substrate to cover the plurality of LED chips; and a second mold portion extending from an edge of the first mold portion and disposed on the substrate. The respective LED chips can improve adhesive strength with respect to the substrate through the first and second mold portions. Peeling, surface cracking and damage caused by moisture permeation can be prevented by the first and second mold portions. A fluorescent material included in the second mold portion can improve a wavelength conversion rate. | 10-16-2014 |
| 20140306243 | LIGHT EMITTING DEVICE - A light emitting device includes a frame, a plurality of first light emitting units and a plurality of second light emitting units. The frame includes a base, a plurality of first pillars and a plurality of second pillars, wherein the first pillars and the second pillars are extended from a periphery of the base and arranged interlacedly, the first pillars are bent inwardly with respect to the base, and the second pillars are bent outwardly with respect to the base. Each of the first light emitting units is disposed on one of the first pillars. Each of the second light emitting units is disposed on one of the second pillars. | 10-16-2014 |
| 20140306244 | CONDUCTIVE PHOSPHOR LAYER ELECTRODE FOR VERTICAL LED - In a method for forming a phosphor-converted LED, an array of vertical LEDs is printed over a conductive surface of a substrate such that a bottom electrode of the LEDs ohmically contacts the conductive surface. A dielectric layer then formed over the conductive surface. An electrically conductive phosphor layer is deposited over the dielectric layer and the LEDs to ohmically contact the top surface of the LEDs and connect the LEDs in parallel. The conductive phosphor layer is formed by phosphor particles intermixed with a transparent conductor material. One or more metal contacts over the conductive phosphor layer conduct current through the conductive phosphor layer and the LEDs to illuminate the LEDs. A portion of light generated by the LED leaks through the conductive phosphor layer, and the combination of the LED light and phosphor light creates a composite light. | 10-16-2014 |
| 20140306245 | LIGHT EMITTING DEVICE - A light emitting device has: a first lead which is mounted a light emitting element, a second lead separated by an interval from the first lead, an insulating member configured to fix the first lead and the second lead, a wavelength conversion portion configured to cover the light emitting element, and a lens portion configured to cover the wavelength conversion portion, a thickness of the insulating member is equal to the thickness of the first lead and the second lead, a groove or a recessed portion is provided to retain the wavelength conversion portion in a specific region is formed in the first lead, and a lower surface of the first lead that forms an opposite side of a region formed on the wavelength conversion portion is not covered by the insulating member and is exposed to the outside. | 10-16-2014 |
| 20140306246 | LIGHT SOURCE MODULE - A light source module including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. A first distance is between a top surface of each of the first LED chips away from the upper surface of the substrate and the upper surface, a second distance is between a top surface of the second LED chip away from the upper surface of the substrate and the upper surface, and the second distance is greater than each of the first distances. | 10-16-2014 |
| 20140306247 | LIGHT EMITTING DEVICE, AND LIGHT EMITTING DEVICE PACKAGE - A light emitting device improves light extraction efficiency and may be individually driven in a light emitting device package and/or a light unit. The light emitting device may include first and second light emitting structures. The light emitting structure may include a first conductive first semiconductor layer, a first active layer under the first conductive first semiconductor layer, and a second conductive second semiconductor under the first active layer. The second light emitting structure may include a first conductive third semiconductor layer, a second active layer under the first conductive third semiconductor layer, and a second conductive fourth semiconductor layer under the second active layer. | 10-16-2014 |
| 20140306248 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a nitride light emitting diode (LED) package, and more specifically, to a nitride light emitting diode package which can improve light-emitting efficiency by increasing light emitting surface area, reduce operating voltage by simultaneously emitting light from six cells at once, and can increase operating current. | 10-16-2014 |
| 20140312363 | FLAT PANEL DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A flat panel display device and a manufacturing method thereof are provided. The flat panel display device includes: a display unit on a substrate; and a sealing structure on the substrate covering the display unit to seal the display unit, the sealing structure including at least one first layer including an inorganic material and at least one second layer including an organic material. The sealing structure includes at least one micro gap, and the micro gap includes an identification material including a fluorescent substance or a dye. | 10-23-2014 |
| 20140312364 | PACKAGE FOR LIGHT EMITTING DEVICE, AND LIGHT EMITTING DEVICE - A package for a light emitting device includes: a resin portion having a sidewall thereof; a first lead having a reflective layer containing silver, the first lead being embedded in the resin portion such that the reflective layer is exposed inside the sidewall; and a second lead having at least a part of a surface thereof exposed inside the sidewall, the second lead being embedded in the resin portion while being isolated from the first lead, wherein in the first lead, the reflective layer is provided spaced inward apart from a boundary between the first lead and the resin portion, and wherein a separating surface exposed between the boundary and the reflective layer is formed of a surface of metal containing silver in a smaller amount than that of the reflective layer. | 10-23-2014 |
| 20140312365 | ALTERNATING CURRENT LIGHT-EMITTING DEVICE - The alternating current light-emitting device includes: a light-emitting module having a substantially-transparent molded piece, three or more LEDs disposed so as to be linearly lined up on the substantially-transparent molded piece with a lead frame interposed therebetween and connected in series, and a resin member formed so as to cover each of the LEDs in a direction in which the LEDs are lined up; a main substrate including the light-emitting module disposed on a front surface thereof; and a rectifier element and a current-limiting element provided on the main substrate. | 10-23-2014 |
| 20140312366 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR FABRICATING THE SAME - An LED package allows a fluorescent material to be uniformly distributed around an LED chip on a base when a filling space inside a transparent wall surrounding the LED chip is filled with the fluorescent material. The LED package includes a base, at least one LED chip mounted on the base, a transparent wall formed on the base and having a filling space around the LED chip, and a fluorescent material, with which the filling space is filled to cover the LED chip. | 10-23-2014 |
| 20140319549 | LIGHT EMITTING DIODE PACKAGE HAVING A TRANSPARENT METAL LAYER FUNCTION AS AN ELECTRODE THEREOF - A light emitting diode package includes a substrate, a reflective cup formed on the substrate, at least one light emitting diode chip formed on the substrate and surrounded by the reflective cup, a first electrode and a second electrode electrically connected with a bottom electrode and a top electrode of the light emitting diode chip, respectively. The first electrode is an electrically conductive layer, and the second electrode is a transparent and electrically conductive layer. The first electrode directly touches and electrically connects the bottom electrode of the light emitting diode chip, and the second electrode directly touches and electrically connects the top electrode of the light emitting diode chip. The first and second electrodes each have a portion extending to a bottom of the substrate. | 10-30-2014 |
| 20140319550 | DISPLAY DEVICE - Display of a display device is made less likely to appear divided when a plurality of display panels are used as one screen. Provided is a display device including two display units and a foldable housing that includes a joint portion between the two display units and supports the two display units. Each display unit includes a display panel including a display region and a non-display region and a support having a first surface overlapped with the display region and a second surface that meets the first surface and is overlapped with the non-display region. The two display units are placed in the housing in an opened state such that the first surfaces of the supports face the same direction and the second surfaces of the supports face each other. | 10-30-2014 |
| 20140319551 | Light Emitting Device Including Resin-Molded Body With White Portion and Black Portion - A light emitting device includes a resin-molded body including: a light emitting window, a white portion, and a black portion, wherein, in a top plan view of the light emitting device, the white portion surrounds the light emitting window, and the black portion surrounds the white portion; an electrode protruding from an outer surface of the resin-molded body; and
| 10-30-2014 |
| 20140319552 | SEMICONDUCTOR LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME - Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module ( | 10-30-2014 |
| 20140332825 | CIRCUITRY CONFIGURABLE BASED ON DEVICE ORIENTATION - The present disclosure is directed to circuitry configurable based on device orientation. Example circuitry may comprise at least one device location and configurable conductors. The at least one device location may include at least two conductive pads onto which a device may be populated by a manufacturing process. The configurable conductors may be coupled to each of the at least two conductive pads. The configurable conductors may be configured by adding conductive material to at least one configurable conductor or subtracting at least part of at least one configurable conductor. For example, conductive material may be added to close a space between two segments of a configurable conductor to form a conduction path. Alternatively, at least part of at least one of a plurality of configurable conductors coupled to a conductive pad may be subtracted (e.g., cut) to stop conduction in the at least one configurable conductor. | 11-13-2014 |
| 20140332826 | THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY APPARATUS - A thin film transistor (TFT) substrate comprises a substrate, a plurality of pixel electrodes, a gate layer, an active layer, a first source layer and a second source layer, and a drain layer. The pixel electrodes are disposed on the substrate. The gate layer is disposed on the substrate. The active layer is disposed corresponding to the gate layer. The first source layer and the second source layer contact the active layer respectively. The drain layer contacts the active layer and is electrically coupled to one of the pixel electrodes. The gate layer, the active layer, the first source layer and the drain layer constitute a first transistor. The gate layer, the active layer, the second source layer and the drain layer constitute a second transistor. When the first and second transistors are disabled, the first and second source layers are electrically isolated from each other. | 11-13-2014 |
| 20140332827 | DISPLAY PANEL AND SEALING PROCESS THEREOF - A display panel and a sealing process are provided. The display panel has a display area and a non-display area; the sealing process includes following steps. A first substrate having a pixel array in the display area is provided. An absorption material layer is formed in the non-display area of the first substrate. A second substrate having a sealing material layer in the non-display area is provided. The second substrate and the first substrate are assembled, and a display medium is formed therebetween. The absorption material layer and the sealing material layer at least partially overlap. A laser processing process is performed on the sealing material layer, so that the first substrate is adhered to the second substrate by the sealing material layer. The absorption material layer is adopted for absorbing a portion of a laser beam passing through the sealing material layer in the laser processing process. | 11-13-2014 |
| 20140332828 | ENHANCED LIGHT OUTPUT FROM A LED CONTAINING LAMINATE - A laminate capable of emitting light comprises a reflective layer. The reflective layer increases the amount of light output from the laminate. A lighting apparatus containing the improved laminate is also provided. | 11-13-2014 |
| 20140339573 | LED light source with thermally conductive luminescent matrix - A wavelength conversion chip is formed by depositing a wavelength conversion material on a substrate to form a layer, removing the resulting wavelength conversion layer from the substrate and then segmenting the wavelength conversion layer into a plurality of wavelength conversion chips. The wavelength conversion material can be annealed by thermal annealing or radiation annealing to increase the wavelength conversion efficiency of the chips or to sinter the wavelength conversion material to form a ceramic material. Optical coatings, vias, light extraction elements, electrical connections or electrical bond pads can be fabricated on the wavelength conversion chips. | 11-20-2014 |
| 20140339574 | DISPLAY PANEL AND DISPLAY DEVICE - A display panel includes a first substrate on which an electrode line and a switching element are disposed, a second substrate positioned opposite the first substrate, a seal provided between the first substrate and the second substrate, a pad electrode that vertically overlaps the seal and is electrically connected to the electrode line, and a side electrode which is connected to one end of the pad electrode and includes a portion positioned on an exterior facing side of the seal. | 11-20-2014 |
| 20140339575 | CIRCUIT SUBSTRATE AND DISPLAY PANEL INCLUDING THE SAME - A circuit substrate includes a substrate, a first lead line, a second lead line, an insulating layer and a pad. The substrate has a pad region, a first non-pad region and a second non-pad region. The first lead line extends from the first non-pad region to the pad region. The second lead line extends from the second non-pad region to the pad region. The insulating layer is interposed between the first and second lead lines. The pads are on the pad region of the substrate and one of the pads is electrically connected to the first and second lead lines. A display panel including the circuit substrate is also provided. | 11-20-2014 |
| 20140339576 | FLIP-CHIP LIGHT-EMITTING DIODE UNIT - A flip-chip light-emitting diode (LED) unit includes a substrate, an electrode pad set disposed on the substrate, and three flip-chip LEDs disposed on the electrode pad set in a flip-chip manner and including one first LED and two second LEDs that are spaced apart from the first LED and that are electrically coupled to the first LED in a series configuration. | 11-20-2014 |
| 20140339577 | OPTOELECTRONIC SEMICONDUCTOR CHIP - An optoelectronic semiconductor chip includes a multiplicity of active regions, arranged at a distance from one another, and a reflective layer arranged at an underside of the multiplicity of active regions, wherein at least one of the active regions has a main extension direction, one of the active regions has a core region formed with a first semiconductor material, the active region has an active layer, covering the core region at least in directions transversely with respect to the main extension direction of the active region, the active region has a cover layer formed with a second semiconductor material and covers the active layer at least in directions transversely with respect to the main extension direction of the active region, and the reflective layer reflects electromagnetic radiation generated during operation in the active layer. | 11-20-2014 |
| 20140339578 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - The present invention provides a manufacturing technique of a semiconductor device and a display device using a peeling process, in which a transfer process can be conducted with a good state in which a shape and property of an element before peeling are kept. Further, the present invention provides a manufacturing technique of more highly reliable semiconductor devices and display devices with high yield without complicating the apparatus and the process for manufacturing. According to the present invention, an organic compound layer including a photocatalyst substance is formed over a first substrate having a light-transmitting property, an element layer is formed over the organic compound layer including a photocatalyst substance, the organic compound layer including a photocatalyst substance is irradiated with light which has passed through the first substrate, and the element layer is peeled from the first substrate. | 11-20-2014 |
| 20140339579 | LED Structure - A light emitting diode (LED) structure comprises a first dopant region, a dielectric layer on top of the first dopant region, a bond pad layer on top of a first portion the dielectric layer, and an LED layer having a first LED region and a second LED region. The bond pad layer is electrically connected to the first dopant region. The first LED region is electrically connected to the bond pad layer. | 11-20-2014 |
| 20140346533 | SOLID STATE LIGHTING COMPONENT PACKAGE WITH CONFORMAL REFLECTIVE COATING - A solid state lighting package is provided. The package comprising at least one LED element positioned on a top surface of a substrate and a conformal reflective layer of inorganic particles, whereby at least of portion of the light emitted by the LED element is reflected by the conformal reflective layer. A method of manufacturing a solid state lighting package comprising the distribution of inorganic particles, and a method of increasing the luminous flux thereof, is also provided. | 11-27-2014 |
| 20140346534 | PIXEL UNIT AND AN ARRAY SUBSTRATE - A pixel unit and an array substrate are provided. The pixel unit includes a scan line extended along a first extension direction; a data line extended along a second extension direction; a solder pad electrically connects to the scan line and the data line; an insulation layer covering the scan line and the data line, and having a through hole; and multiple strip electrodes disposed on the insulation layer and extending along a third extension direction, wherein, the multiple strip electrodes electrically connect to the solder pad by the through hole. The solder pad and the multiple strip electrodes are all made of a transparent conductive material. A shape of the solder pad is a polygon and is parallel to the third extension direction. The present invention can effectively suppress the “dark fringes” phenomenon around the solder pad. | 11-27-2014 |
| 20140346535 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A display device includes a display substrate, an encapsulation substrate facing the display substrate, a filling material between the display substrate and the encapsulation substrate, the filling material including a norbornene-based resin, and a sealing material joining the display substrate with the encapsulation substrate. | 11-27-2014 |
| 20140346536 | LIGHT-EMITTING DEVICE AND LIGHTING APPARATUS USING THE SAME - A light-emitting device including: a substrate; LEDs arranged on the substrate in a row; electrode pad pairs each including electrode pads at opposite sides of a corresponding LED in a row direction; Zener diodes (protective elements) in one-to-one correspondence to circuits (groups) U | 11-27-2014 |
| 20140353688 | LIGHT SOURCE DEVICE ADAPTED TO A DIRECT-TYPE BACKLIGHT MODULE AND DISPLAY DEVICE THEREWITH - A light source device includes a frame, at least one light emitting chip, a light transferring layer and a lens layer. The at least one light emitting chip is disposed within the frame for emitting light. The light transferring layer covers the at least one light emitting chip and combines with the frame. The lens layer is formed on the frame and contacts and combines with the light transferring layer, such that the light emitted from the at least one light emitting chip directly projects into the lens layer after passing through the light transferring layer. The lens layer has a light emitting surface on a side away from the light transferring layer for transferring the light emitted from the at least one light emitting chip into a light shape after passing through the light transferring layer and the lens layer. | 12-04-2014 |
| 20140353689 | THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF AND DISPLAY COMPRISING THE SAME - Provided is a TFT with an improved gate insulator, having an insulator substrate, a gate layer, a gate insulator layer, a active semiconductor layer, and a source and drain electrode layer, wherein the gate insulator layer includes a first silicon nitride film, a second silicon nitride film disposed on the first silicon nitride film and a third silicon nitride film disposed on the second silicon nitride, and compared to the second silicon nitride film, each of the first silicon nitride film and the third silicon nitride film is much thinner and has a lower content of N—H bond. Also provided is a display including said TFTs. According to the present disclosure, an improved gate insulator layer capable of withstanding higher voltage can be achieved due to the laminated structure and accordingly a TFT with excellent reliability can be formed. | 12-04-2014 |
| 20140353690 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE - An array substrate, a manufacturing method thereof, and a display device are provided. The array substrate comprise a base substrate ( | 12-04-2014 |
| 20140353691 | IN-CELL OLED TOUCH DISPLAY PANEL STRUCTURE WITH METAL LAYER FOR SENSING - An in-cell OLED touch display panel structure with metal layer for sensing includes an upper substrate, a lower substrate parallel to the upper substrate, an OLED layer configured between the upper and lower substrates, a black matrix layer, a sensing electrode layer, and a thin film transistor layer. The black matrix layer is disposed at one surface of the upper substrate facing the OLED layer, and is composed of a plurality of opaque lines. The sensing electrode layer is disposed at one side of the black matrix layer facing the OLED layer, and is composed of a plurality of sensing conductor lines. The thin film transistor layer is disposed at one side of the lower substrate facing the OLED layer. The plurality of sensing conductor lines are disposed at positions corresponding to those of the plurality of opaque lines of the black matrix. | 12-04-2014 |
| 20140353692 | LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME - A light emitting diode includes light emitting cells disposed on a substrate and interconnections connecting the light emitting cells to each other. Each of the light emitting cells includes a first semiconductor layer, a second semiconductor layer, an active layer disposed between the first semiconductor layer and the second semiconductor layer, and a transparent electrode layer disposed on the second semiconductor layer, wherein the first and second semiconductor layers have different conductivity types. The interconnections include a common cathode commonly connecting first and second light emitting cells of the light emitting cells, the first and second light emitting cells share the first semiconductor layer, the transparent electrode layer is continuously disposed between the first and second light emitting cells, and the common cathode is electrically connected to the first and second light emitting cells through the transparent electrode layer. | 12-04-2014 |
| 20140361316 | ELECTRO-OPTICAL APPARATUS, MANUFACTURING METHOD FOR ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC DEVICE - An electro-optical apparatus includes a first pixel and a second pixel. The first pixel and the second pixel include a reflective layer, an insulating layer, a functional layer, and an opposing electrode. The insulating layer includes a first insulating layer, a second insulating layer having a first opening, and a third insulating layer having a second opening. A first pixel electrode is provided on the first insulating layer in the first opening. A second pixel electrode is provided on the second insulating layer. | 12-11-2014 |
| 20140361317 | SOLID STATE LIGHTING COMPONENT PACKAGE WITH REFLECTIVE LAYER - A solid state lighting package is provided. The package comprising at least one LED element positioned on a top surface of a substrate or a submount capable of absorbing light emitted by the at least one LED element; and a reflective layer, the reflective layer covering at least a portion of the top surface of the substrate or the submount, whereby at least of portion of the light emitted by the LED element is reflected by the reflective layer. A method of manufacturing a solid state lighting package comprising the reflective layer, and a method of increasing the luminous flux thereof, is also provided. | 12-11-2014 |
| 20140361318 | LIGHT EMITTING DEVICE PROVIDED WITH LENS FOR CONTROLLING LIGHT DISTRIBUTION CHARACTERISTIC - The light emitting device comprises a substrate ( | 12-11-2014 |
| 20140361319 | INTERGRATED LIGHTING APPARATUS AND METHOD OF MANUFACTURING THE SAME - An integrated lighting apparatus comprises a first control device including a semiconductor substrate, an integrated circuit block formed above a first portion of the semiconductor substrate, and a plurality of power pads formed above the integrated circuit block; a first light emitting device formed above a second portion of the semiconductor substrate; and a through plug passing through the semiconductor substrate for electrically connecting the first control device and the first light emitting device. | 12-11-2014 |
| 20140361320 | Sealed Body, Method for Manufacturing Sealed Body, Light-Emitting Device, and Method for Manufacturing Light-Emitting Device - A highly productive method for sealing substrates with the use of glass frit is provided. A method for sealing substrates with the use of glass frit, which can be used for a substrate provided with a material having low heat resistance, is provided. A highly airtight sealed body which is manufactured by such a method is provided. A light-emitting device having high productivity and high reliability and a manufacturing method thereof are provided. A heat generation layer containing a conductive material which generates heat by induction heating is formed to overlap with a region where a paste including a frit material and a binder is applied. Alternatively, a conductive material which generates heat by induction heating is added to the paste itself. The paste is locally heated by induction heating to remove the binder included in the paste. | 12-11-2014 |
| 20140367704 | LED LIGHT ASSEMBLY - An LED assembly includes a rail device, an LED carrier with multiple LEDs securely mounted on the LED carrier and a wire extended out of the LED carrier from providing electricity to the LEDs and a plug device provided to two distal ends of the LED carrier and sandwiched in the rail device. The plug device has a passage defined in one distal end thereof to allow the wire to extend out of the plug device and a positioning seat is sandwiched in the rail device and provided to two sides of the plug device and has a receiving space to respectively and securely accommodate therein sides of the plug device. | 12-18-2014 |
| 20140367705 | REFLECTIVE BANK STRUCTURE AND METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE - Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer. | 12-18-2014 |
| 20140367706 | THIN FILM TRANSISTOR ARRAY PANEL AND METHOD OF MANUFACTURING THE SAME - A thin film transistor array panel includes a substrate; a gate line located over the substrate and including a gate pad portion; a data line located over the gate line and including a source electrode and a data pad portion; a drain electrode; a first passivation layer located over the data line and the drain electrode; an organic insulating layer located over the first passivation layer and having a contact hole; a first field generating electrode located over the organic insulating layer and having an opening; a second passivation layer located over the first field generating electrode; and a second field generating electrode located over the second passivation layer. The contact hole coincides with or is smaller than the opening, and the contact hole has a tapered structure. | 12-18-2014 |
| 20140367707 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF - A manufacturing method of a display panel including following steps is provided. An active device substrate including a first plate, active devices disposed on the first plate and pixel electrodes electrically connected to the active devices is provided. A display medium substrate including a second plate and a display medium disposed on the second plate is provided. The pixel electrodes are electrically connected to the display medium by a conductor. Moreover, a display panel manufactured by the manufacturing method is also provided. | 12-18-2014 |
| 20140367708 | LIGHT-EMITTING DIODE ARRANGEMENT - A light-emitting diode arrangement may include a first layer structure including at least one epitaxially formed light-emitting diode, and at least one second layer structure including at least one epitaxially formed light-emitting diode, wherein the at least one second layer structure is arranged on the first layer structure, and wherein contact faces of the at least one epitaxially formed light-emitting diode in the respective layer structure face contact faces of the at least one epitaxially formed light-emitting diode of the layer structure arranged directly therebelow or thereabove. | 12-18-2014 |
| 20140367709 | SEMICONDUCTOR LIGHT EMITTING DEVICE LAMP THAT EMITS LIGHT AT LARGE ANGLES - Embodiments of the invention include a plurality of semiconductor light emitting diodes attached to a mount. A plurality of lenses are disposed over the plurality of semiconductor light emitting diodes. A lens disposed over a semiconductor light emitting diode proximate an edge of the mount is rotationally asymmetrical and is shaped such that for a portion of the lens light emitted at an intensity that is half a maximum intensity is emitted at an angle of at least 70° relative to a normal to a top surface of the semiconductor light emitting diode. | 12-18-2014 |
| 20140367710 | LED MODULE - The purpose of the present invention is to reduce the size and thickness of an LED module in which a plurality of LED dies along with other electronic components are mounted on a circuit board, and at the same time to stabilize the operation of the module with respect to source voltage fluctuation. The LED module includes: a circuit board; a plurality of LED dies that are mounted on one surface of a circuit board as bare chips and constitute a series circuit; an FET die that is mounted on the one surface of a circuit board as bare chips and controls a current flowing through the plurality of LED dies; and a constant current circuit that is mounted on the one surface of a circuit board and is series-connected to the series circuit. The constant current circuit includes the FET die. | 12-18-2014 |
| 20140374779 | LIGHT-EMITTING DEVICE AND LIGHT-EMITTING ARRAY - A light-emitting device includes a light-emitting stack including a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer includes a first surface, a second surface opposite to the first surface, a first portion connecting to the first surface, and a second portion connecting to the first portion; an opening penetrating the first portion from the first surface and having a first width; a depression connecting to the opening and penetrating the second semiconductor layer, the active layer, and the second portion of the first semiconductor layer, wherein the depression includes a second width greater than the first width, and the depression includes a bottom to expose the second surface, and an electrode located in the depression and corresponding to the opening. | 12-25-2014 |
| 20140374780 | LIGHT EMITTING DEVICE FOR ILLUMINATING PLANTS - A spectrally adapted light emitting device for illuminating plants includes at least one semiconductor light-emitting diode (LED), at least one light conversion element for down-converting a portion of light emitted at the first wavelength to at least a second wavelength between 600 nm-680 nm, and at least one scattering device to diffuse light within the light emitting device. The at least one LED is configured to emit at least a first wavelength between 400 nm and 480 nm. The spectral light output from the spectrally adapted light emitting device is bi-modal with wavelengths in a range of 400 nm and 800 nm including a first local maximum between 400 nm and 480 nm and a second local maximum between 600 nm-680 nm with a local minimum between the first local maximum and the second local maximum. | 12-25-2014 |
| 20150008455 | MOLDED RESIN BODY FOR SURFACE-MOUNTED LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF, AND SURFACE-MOUNTED LIGHT-EMITTING DEVICE - A molded resin body for surface-mounted light-emitting device has cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 μm to 10 μm, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMS) under the conditions of a temperature range of −50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more. | 01-08-2015 |
| 20150008456 | METHOD FOR INSULATING NANOWIRES OR MIRCOWIRES - A method for producing a microelectronic device including a plurality of light emitting diodes each including a wire of nanometric or micrometric size, the method including: growing the nanowires from a growth substrate; forming at least one dielectric layer on a transfer substrate distinct from the growth substrate; and penetration by the nanowires in the dielectric layer. | 01-08-2015 |
| 20150008457 | FLIP-CHIP PHOSPHOR COATING METHOD AND DEVICES FABRICATED UTILIZING METHOD - Methods for fabricating light emitting diode (LED) chips one of which comprises flip-chip mounting a plurality of LEDs on a surface of a submount wafer and forming a coating over said LEDs. The coating comprising a conversion material at least partially covering the LEDs. The coating is planarized to the desired thickness with the coating being continuous and unobstructed on the top surface of the LEDs. The LEDs chips are then singulated from the submount wafer. An LED chip comprising a lateral geometry LED having first and second contacts, with the LED flip-chip mounted to a submount by a conductive bonding material. A phosphor loaded binder coats and at least partially covers the LED. The binder provides a substantially continuous and unobstructed coating over the LED. The phosphor within the coating absorbs and converts the wavelength of at least some of the LED light with the coating planarized to achieve the desired emission color point of the LED chip. | 01-08-2015 |
| 20150014709 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - A display apparatus includes a first insulating substrate including a front surface that provides an image and a rear surface opposite to the front surface, a low reflection layer provided on the rear surface, a gate wiring part provided on the low reflection layer, a data wiring part provided on the rear surface, the data wiring part that is insulated from the gate wiring part; and a pixel which is connected to the data wiring part and displays the image, where the low reflection layer includes a polymer resin having a black color. | 01-15-2015 |
| 20150014710 | LIGHT EMITTING DEVICE - With a light emitting device of a package formed by two types of molded resins, entry of water from between the molded resins may cause the light emitting device to be incapable of turning on. A light emitting device of the present invention includes: a package that has an opening at an upper surface thereof; a first molded resin that forms a part of the upper surface of the package; a second molded resin that forms an inner wall surface of the opening of the package; a lead frame that is buried in the package so as to be partially exposed at a bottom surface of the opening of the package, the lead frame having an end portion externally projected outside from a side surface of the package; and a light emitting element that is connected to an upper surface of the lead frame being exposed at the bottom surface of the opening. The second molded resin is higher than the first molded resin in light reflectance to light emitted from the light emitting element. The upper surface of the lead frame buried in the package is disposed so as to be spaced apart from the interface between the first molded resin and the second molded resin. | 01-15-2015 |
| 20150014711 | OPTOELECTRONIC COMPONENT WITH INERT GAS ATMOSPHERE - Various embodiments relate to an optoelectronic component, including a carrier element, on which at least one optoelectronic semiconductor chip is arranged, and a cover, which is mounted on the carrier element in a region extending circumferentially around the semiconductor chip and together with the carrier element forms a sealed cavity in which the at least one optoelectronic semiconductor chip is arranged in an inert gas. | 01-15-2015 |
| 20150014712 | SOURCE DRIVER INTEGRATED CIRCUIT AND DISPLAY DEVICE COMPRISING SOURCE DRIVER INTEGRATED CIRCUIT - A source driver integrated circuit comprises a common node; a plurality of pads for inputting power, a portion of which are connected to an external power source and the remainder of which are connected to the portion through the common node; and a common power line which is connected to the plurality of power input pads through the common node. As a result, the resolution of adjacent channels varies very little and block dimming between channels can be resolved. | 01-15-2015 |
| 20150014713 | LIGHT EMITTING DEVICE AND LIGHTING APPARATUS INCLUDING THE SAME - A light emitting device is disclosed. The disclosed light emitting device includes a light emitting structure including a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer, a second electrode layer disposed beneath the light emitting structure and electrically connected to the second-conductivity-type semiconductor layer, a first electrode layer including a main electrode disposed beneath the second electrode layer, and at least one contact electrode branching from the main electrode and extending through the second electrode layer, the second-conductivity-type semiconductor layer and the active layer, to contact the first-conductivity-type semiconductor layer, and an insulating layer interposed between the first electrode layer and the second electrode layer and between the first electrode layer and the light emitting structure. The first-conductivity-type semiconductor layer includes a first region and a second region having a smaller height than the first region, and the first region overlaps with the contact electrode. | 01-15-2015 |
| 20150014714 | LIGHT EMITTING SEMICONDUCTOR - A light emitting semiconductor element includes at least two electrically conductive units, at least a light emitting semiconductor die and a light transmitting layer. A groove is located between the two electrically conductive units. The light emitting semiconductor die is cross over the electrically conductive units. The light transmitting layer covers the light emitting semiconductor and partially fills within the groove for linking the electrically conductive units. | 01-15-2015 |
| 20150021628 | SOLID STATE LIGHTING DEVICES AND FABRICATION METHODS INCLUDING DEPOSITED LIGHT-AFFECTING ELEMENTS - Solid state light emitting devices include one or more light affecting elements (e.g., of one or more light-transmissive, light-absorptive, light-reflective, and/or lumiphoric materials) formed on, over, or around at least one solid state light emitter, with the light affecting elements including multiple fused elements embodying plurality of dots, rods, or layers such as may be formed by three-dimensional (3D) printing. At least one electrically conductive path in electrical communication with a solid state light emitter may be formed by selective material deposition such as 3D printing. Light affecting elements may be individually tailored to individual solid state light emitters, such as to yield different optical distributions for interactions between each specific emitter and its corresponding light affecting element. | 01-22-2015 |
| 20150021629 | Using An LED Die To Measure Temperature Inside Silicone That Encapsulates An LED Array - An LAM/ICM assembly comprises an integrated control module (ICM) and an LED array member (LAM). The ICM includes interconnect through which power from outside the assembly is received. In a first novel aspect, active circuitry is embedded in the ICM. In one example, the circuitry monitors LED operation, controls and supplies power to the LEDs, and communicates information into and out of the assembly. In a second novel aspect, a lighting system comprises an AC-to-DC converter and a LAM/ICM assembly. The AC-to-DC converter outputs a substantially constant current or voltage. The magnitude of the current or voltage is adjusted by a signal output from the LAM/ICM. In a third novel aspect, the ICM includes a switching DC-to-DC converter. An AC-to-DC power supply supplies a roughly regulated supply voltage. The switching converter within the LAM/ICM receives the roughly regulated voltage and supplies a regulated LED drive current to its LEDs. | 01-22-2015 |
| 20150021630 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - The present invention relates to a display device, and a manufacturing method thereof. The display device includes a first insulation substrate; gate lines and data lines positioned on the first insulating substrate. The gate lines and data lines are insulated from each other and crossed each other. A first passivation layer positioned on the gate lines and the data lines, and including a first contact opening. A color filter positioned on the first passivation layer, and including an opening. An organic insulation layer positioned on the color filter, and including a contact hole, in which the first contact opening is larger than the opening. The organic insulation layer covers the color filter and the contact opening. | 01-22-2015 |
| 20150021631 | FLEXIBLE DISPLAY APPARATUS AND METHOD OF MANUFACTURING SAME - A method of manufacturing a flexible display apparatus includes: preparing a support substrate; forming a first graphene oxide layer having a first electrical charge on the support substrate; forming a second graphene oxide layer having a second electrical charge on the first graphene oxide layer; forming a flexible substrate on the second graphene oxide layer; forming a display unit on the flexible substrate; and separating the support substrate and the flexible substrate from each other. | 01-22-2015 |
| 20150021632 | LED WITH MULTIPLE BONDING METHODS ON FLEXIBLE TRANSPARENT SUBSTRATE - Inventive aspects disclosed herein include a flexible device. The flexible device includes a flexible transparent substrate and an adhesive adhered to the flexible transparent substrate, covering a portion of the substrate. The device also includes two or more bare LED dies adhered to the adhesive, the two or more LED dies spaced as little as 0.22 inches (5.4 mm), or less, apart. The device additionally includes a pair of conductive traces on or in the substrate and positioned on opposing sides of the bare LED dies; a pair of conductive pads positioned on opposing surfaces of the bare LED die; and an interconnect that interconnects the pads and the traces. | 01-22-2015 |
| 20150021633 | LIGHT-EMITTING DIODE PACKAGE AND LIGHT-EMITTING DEVICE - An LED package is disclosed, which includes a heat dissipation plate, a composite structure, an LED chip, and an encapsulant. The heat dissipation plate has a chip bonding area, a circuit area, and a first dam disposed at the boundary between the chip bonding area and the circuit area, wherein the first dam is formed by punching or bending the heat dissipation plate. The composite structure is disposed on the circuit area. The LED chip which is disposed on the chip bonding area is electrically connected to the composite structure and covered by the encapsulant. Also a light-emitting device using the LED package is disclosed. | 01-22-2015 |
| 20150021634 | DISPLAY UNIT USING LED LIGHT SOURCES - A display unit includes a substrate, a plurality of LED light sources arranged in a matrix on the substrate, and a light blocking layer that blocks at least part of light emitted from the LED light sources. The light blocking layer includes an area that overlaps a region between two adjacent LED light sources among the plurality of LED light sources as viewed in a thickness direction Z of the substrate. | 01-22-2015 |
| 20150021635 | White Light Emitting LED Device - A white light emitting LED device comprises: base, blue light LED chips, light reflector and transparent substrate covered with a phosphor coating; two ends of the light reflector connect the base and the transparent substrate, respectively, the inner surface of the light reflector is covered with a light-reflecting coating; blue light LED chips are set on the surface of the base pointing to the transparent substrate, and the electrode leads of blue light LED chips pass through the base; blue light LED chip is a single chip, or a group of chips connected in series, or in parallel, or in a mixed manner; the transparent substrate has the shape of a plane, or a convex, or a semi-cylinder. The present invention gets the white light by utilizing the blue lights emitted by the blue light LED chips to irradiate the transparent substrate which is covered with a phosphor coating. | 01-22-2015 |
| 20150021636 | Optoelectronic Semiconductor Chip - An optoelectronic semiconductor chip includes a number active regions that are arranged at a distance from each other and a substrate that is arranged on an underside of the active regions. One of the active regions has a main extension direction. The active region has a core region that is formed using a first semiconductor material. The active region has an active layer that covers the core region at least in directions perpendicular to the main extension direction of the active region. The active region has a cover layer that is formed using a second semiconductor material and covers the active layer at least in directions perpendicular to the main extension direction of the active region. | 01-22-2015 |
| 20150028362 | ADHESIVE WAFER BONDING WITH CONTROLLED THICKNESS VARIATION - A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. The stabilization layer is bonded to a spacer side of a carrier substrate. The spacer side of the carrier substrate includes raised spacers extending from a spacer-side surface of the carrier substrate. | 01-29-2015 |
| 20150028363 | CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME - A chip-on-film package includes a base film including a bending area, an integrated circuit chip at an upper surface of the base film, a first line at the upper surface of the base film and overlapping the bending area, a second line at a lower surface of the base film and overlapping the bending area, a via pattern penetrating the base film to electrically couple the first line and the second line, and a common line coupled to the first line and to the integrated circuit chip, wherein at least a portion of the first line does not overlap at least a portion of the second line in a plan view. | 01-29-2015 |
| 20150028364 | PIXEL STRUCTURE, DISPLAY PANEL AND FABRICATION METHOD THEREOF - A pixel structure includes an active switching device, a patterned common electrode layer, an insulation layer, a patterned oxide electrode layer and a patterned passivation layer. The insulation layer covers the patterned common electrode layer. The patterned oxide electrode layer is disposed on the insulation layer and electrically connected to the active switching device. The patterned oxide electrode layer includes a semiconductor part and a conductive part. The semiconductor part and the patterned common electrode layer substantially overlap to each other in a vertical projection direction. The conductive part and the semiconductor part are connected to each other, the conductive part and the patterned common electrode layer do not overlap to each other in the vertical projective direction, and the conductive part is a pixel electrode. The patterned passivation layer covers the semiconductor part, and the patterned passivation layer has an opening exposing the conductive part. | 01-29-2015 |
| 20150028365 | HIGHLY REFRACTIVE, TRANSPARENT THERMAL CONDUCTORS FOR BETTER HEAT DISSIPATION AND LIGHT EXTRACTION IN WHITE LEDS - A lighting apparatus includes a light source and a light conversion layer disposed proximate the light source, the light conversion layer comprising a plurality of quantum dots (QDs) or phosphors, and a plurality of transparent thermally conductive particles, embedded in a matrix material to improve heat dissipation. | 01-29-2015 |
| 20150028366 | LIGHT EMITTING DIODE CHIP - An LED chip for use in an LED chip array forming a continuous array of LEDs. The LED chip comprises an array of LEDs on a substrate. LEDs in a row of the array are longitudinally offset from corresponding LEDs in another row. Adjacent LEDs in each row of the array are separated by a longitudinal pitch. At least part of an end face of the substrate is angled with respect to a transverse axis of the LED chip such that the LED chip is positionable adjacent another LED chip to maintain the longitudinal pitch between adjacent LEDs on different chips. | 01-29-2015 |
| 20150028367 | OPTOELECTRONIC MODULE AND A PROCESS FOR THE PRODUCTION OF AN OPTOELECTRONIC MODULE - An optoelectronic module ( | 01-29-2015 |
| 20150028368 | LIGHT EMITTING MODULE - Disclosed herein is a light emitting module. The light emitting module according to an exemplary embodiment includes a circuit board having a cavity and including a circuit pattern at a region which does not have the cavity, an insulation substrate disposed in the cavity while being formed, at an upper portion thereof, with at least one pad, and at least one light emitting device disposed on the pad, wherein a joining structure is disposed between a bottom surface of the cavity and a bottom surface of the insulation substrate. | 01-29-2015 |
| 20150028369 | LIGHT-EMITTING DIODE DEVICE - A light-emitting diode device having two electrode pads for connecting to an external power comprises a substrate; a plurality of light-emitting diode units on the substrate; and a plurality of conductive connecting structures electrically connecting the plurality of light-emitting diode units; wherein the two electrode pads are encircled by the plurality of light-emitting diode units. | 01-29-2015 |
| 20150034976 | LED CHIP-ON-BOARD TYPE FLEXIBLE PCB AND FLEXIBLE HEAT SPREADER SHEET PAD AND HEAT-SINK STRUCTURE USING THE SAME - A chip-on-board LED structure having multiple of LED dies, includes a flexible heat spreading pad for spreading heat and having a planar area; a top flexible foil on the flexible heat spreading pad; a dielectric layer on the first flexible foil; a flexible metal film on the dielectric layer; and an LED die array mounted on and covering a first area of the flexible metal film, wherein the planar area of the flexible heat spreading pad is at least four times larger than the first area of the flexible metal film. | 02-05-2015 |
| 20150034977 | Display Device - A display device includes a plurality of pixels in matrix, a substrate on which the plurality of pixels are formed, and a support member under the substrate. The substrate is arranged on a front surface of the support member and a plurality of recesses are formed on a rear surface of the support member. Each of the substrate and the support member is formed in substantially rectangular shape and has a first side, a second side, a third side facing to the first side, and a fourth side facing to the second side. Each of the plurality of recesses extends in a first direction extending substantially in parallel to the first side and the third side. | 02-05-2015 |
| 20150041832 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SUCH AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT - In at least one embodiment of the optoelectronic semiconductor component ( | 02-12-2015 |
| 20150041833 | SUBSTRATE FOR ELECTRO-OPTICAL APPARATUS, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC EQUIPMENT - An element substrate is provided with a substrate; a pixel electrode; a light shielding layer which is disposed between the substrate and the pixel electrode and has an opening in an area overlapping with the pixel electrode; a TFT that is disposed between the light shielding layer and the pixel electrode has a channel area which is disposed in an area overlapping with the light shielding layer; a light shielding layer that is disposed between the TFT and the pixel electrode and has an opening in an area overlapping with the pixel electrode; a micro lens that is disposed between the substrate and the light shielding layer and disposed in an area overlapping with the pixel electrode; and a micro lens that is disposed between the light shielding layer and the pixel electrode and disposed in an area overlapping with the pixel electrode. | 02-12-2015 |
| 20150041834 | LIGHT-EMITTING DIODES - A light-emitting diode includes a carrier including a metallic basic body having an outer face including a mounting face; and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein the at least two light-emitting diode chips are embedded in a reflective coating covering the mounting face and side faces of the at least two light-emitting diode chips, the at least two light-emitting diode chips have radiation exit surfaces facing away from the carrier, and the at least two light-emitting diode chips protrude with radiation exit surfaces out of the reflective coating, or the reflective coating terminates flush with the radiation exit surfaces of the at least two light-emitting diode chips. | 02-12-2015 |
| 20150041835 | LIGHT-EMITTING DEVICE AND LIGHTING DEVICE PROVIDED WITH THE SAME - A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of LED chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate. The soldering electrode land is formed of a first conductive material having a function to prevent diffusion to a solder, and the connector connecting electrode land is formed of a second conductive material having a function to prevent oxidation. | 02-12-2015 |
| 20150048388 | FLAT PANEL DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - A flat panel display apparatus including a substrate on which a display unit is formed, an encapsulation member that covers the display unit, a sealant that is formed between the substrate and encapsulation member while the sealant encapsulates the display unit by surrounding the display unit, and a metal layer that is formed on the substrate and located along with the sealant, the metal layer having irregular widths. | 02-19-2015 |
| 20150048389 | OPTOELECTRONIC MODULE COMPRISING AN OPTICAL WAVEGUIDE AND METHOD FOR PRODUCING SAME - An optoelectronic module ( | 02-19-2015 |
| 20150048390 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND FABRICATION METHOD FOR SAME - The purpose of the present invention is to provide a double-sided light emitting type semiconductor light emitting device that can be easily fabricated even if a semiconductor light emitting element is flip-chip mounted, and to provide a fabrication process for the same. The semiconductor light emitting device has a plurality of lead frames, a plurality of semiconductor light emitting elements connected to the plurality of lead frames, and a covering member that covers the plurality of semiconductor light emitting elements. The semiconductor light emitting device is characterized in that the edge of one lead frame among the plurality of lead frames is disposed in close proximity to the edge of another lead frame so as to form a gap, and the plurality of semiconductor light emitting elements are flip-chip mounted on the front surface and rear surface of the one lead frame and the other lead frame so as to straddle the gap. | 02-19-2015 |
| 20150048391 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device has a substrate, one or more semiconductor light-emitting elements provided on the substrate, and that emit light having a peak wavelength in a 380 nm to 480 nm wavelength region, and a molded member covering the semiconductor light-emitting element, and containing a phosphor that emits visible light by being excited by the emitted light from the semiconductor light-emitting element. The molded member is formed so that index A=H/(s/n) satisfies 0.3≦A≦6, where H is the height [mm] of the molded member from the substrate, s is the square root [mm] of the contact area between the substrate and the molded member, and n is the number of the semiconductor light-emitting elements covered with the molded member. | 02-19-2015 |
| 20150048392 | WAVELENGTH CONVERSION ELEMENT, LIGHT-EMITTING SEMICONDUCTOR DEVICE AND DISPLAY APPARATUS THEREWITH, AND METHOD FOR PRODUCING A WAVELENGTH CONVERSION ELEMENT - A wavelength conversion element including at least two ceramic conversion segments each including a ceramic wavelength conversion substance and connected together in a matrix by a non-transparent connecting material, wherein each conversion segment emits light by absorbing primary radiation and re-emitting secondary radiation different from the primary radiation, and the light comprises the secondary radiation and a proportion of the primary radiation is less than or equal to 5%. | 02-19-2015 |
| 20150048393 | HIGH DENSITY MULTI-CHIP LED DEVICES - High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption. | 02-19-2015 |
| 20150054003 | GEOMETRICAL LIGHT EXTRACTION STRUCTURES FOR PRINTED LEDS - A method of forming a light sheet includes depositing a reflective conductor layer over a substrate, printing a layer of microscopic inorganic LEDs on the conductor layer, depositing a first dielectric layer, having a first index of refraction, over the conductor layer and along sidewalls of the LEDs, and depositing a transparent conductor layer over the LEDs so that the LEDs are connected in parallel. The transparent conductor layer may be a wire mesh with openings. A liquid or paste polymer layer is then deposited over the transparent conductor layer and directly contacts the first dielectric layer. The indices of refraction of both layers are similar to reduce TIR. The top surface of the polymer layer is then molded to contain light extraction features to reduce waveguiding in the light sheet. In another embodiment, the substrate surface is the light exit surface that has the light extraction features | 02-26-2015 |
| 20150054004 | LIGHT EMITTING MODULE - According to one embodiment, a light emitting module includes a mounting substrate, a plurality of light emitting chips, a transparent layer, and a phosphor layer. The transparent layer is provided between the plurality of light emitting chips on the mounting face and on the light emitting chip. The transparent layer has a first transparent body and a scattering agent dispersed at least in the first transparent body between the plurality of light emitting chips. The scattering agent has a different refraction index from a refraction index of the first transparent body. The phosphor layer is provided on the transparent layer. The light emitting chip includes a semiconductor layer, a p-side electrode, an n-side electrode, a p-side external terminal, and an n-side external terminal. | 02-26-2015 |
| 20150060893 | DISPLAY DEVICE INCLUDING SEALANT AND MANUFACTURING METHOD THEREOF - A display device includes a lower substrate; an upper substrate facing the lower substrate; a display element layer in a display area of the lower substrate and including a thin film transistor; and a sealing body in a peripheral area surrounding the display area, having a closed curve shape, and between the lower substrate and the upper substrate, in which the sealing body includes a first portion and a second portion, the first portion and the second portion respectively extending along different directions from each other, and the first portion and the second portion respectively have different deposition structures from each other. | 03-05-2015 |
| 20150060894 | Light Emitting Device - According to an embodiment, a light emitting device including a substrate, a plurality of semiconductor light emitting elements and a wavelength conversion layer is provided. The semiconductor light emitting elements are provided on the substrate. The wavelength conversion layer covers the semiconductor light emitting elements and converts a wavelength of light emitted from the semiconductor light emitting elements. A first distance between an upper surface of the wavelength conversion layer in a first region between two adjacent semiconductor light emitting elements in the semiconductor light emitting elements and the substrate is shorter than a second distance between the upper surface of the wavelength conversion layer and the substrate in a second region on the two adjacent semiconductor light emitting elements. | 03-05-2015 |
| 20150060895 | Vertical Light Emitting Device and Manufacturing Method Thereof - A vertical high-voltage light emitting device and a manufacturing method thereof. Polarities of two adjacent light emitting diodes (LEDs) are reversed by means of area laser stripping and die bonding, and the two diodes whose polarities are reversed are disposed on an insulating substrate comprising a bonding metal layer ( | 03-05-2015 |
| 20150060896 | DISPLAY DEVICE - To suppress a loss of data in a semiconductor device. To provide a display device including a capacitor storing data, a display element performing display in accordance with the data, and switching elements connected to electrodes of the capacitor. In the display device, the voltage is held between the electrodes of the capacitor by turning the switching elements off; thus, the data can be stored even when supplying the power supply is stopped. | 03-05-2015 |
| 20150060897 | LIGHT EMITTING DEVICE PACKAGE - Embodiments relate to a light emitting device package including a first lead frame and a second lead frame spaced apart from each other, a light emitting device disposed on the first lead frame, a reflecting part disposed on the first lead frame and the second lead frame and a light transmitting part including a lower end part disposed on the reflecting part, the first lead frame and the second lead frame and an upper end part disposed on the lower end part. The upper end part has a side surface vertically aligned with a location of a sidewall between upper and lower ends of the reflecting part. | 03-05-2015 |
| 20150060898 | METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS - A method for bonding an LED assembly | 03-05-2015 |
| 20150069425 | LIGHT-EMITTING DEVICE MODULE AND METHOD OF MANUFACTURING SAME - A light-emitting device module includes a substrate and a light-emitting device disposed on the substrate. The light-emitting device may have a first pad and a second pad disposed thereon. A coating layer may cover the light-emitting device. The coating layer has a first via hole and a second via hole configured to respectively expose the first pad and the second pad therethrough. Wirings configured to be electrically connected to the first pad and the second pad through the first via hole and the second via hole are disposed on the coating layer. | 03-12-2015 |
| 20150069426 | DISPLAY PANEL - Provided is a display panel including a base substrate provided with a plurality of thin film transistors, the base substrate including a plurality of transmission regions and a light-blocking region adjacent to the transmission regions, the thin film transistors overlapping the light-blocking region, a plurality of pixel electrodes overlapping the transmission regions, respectively, the pixel electrodes being connected to a corresponding one of the thin film transistors, and an insulating layer interposed between the pixel electrodes and the base substrate to include at least one staircase portion, each of which overlaps the transmission regions, respectively. | 03-12-2015 |
| 20150069427 | OMNIDIRECTIONAL LIGHTING UNIT AND ILLUMINATION DEVICE AND METHOD FOR MANUFACTURING OMNIDIRECTIONAL LIGHTING UNIT - An omnidirectional lighting unit is disclosed, which includes a light-emitting chip, a spherical package member, a diffusion layer, and two conductive structures. The light-emitting chip has a positive electrode and a negative electrode. The spherical package member encapsulates the light-emitting chip, and the diffusion layer covers an outer surface of the spherical package member. The two conductive structures are electrically connected to the positive and negative electrodes, respectively, and each of the two conductive structures penetrates through the spherical package member and the diffusion layer outwardly, such that a portion of each conductive structure is exposed the exterior of the diffusion layer. | 03-12-2015 |
| 20150069428 | LIGHT EMITTING DIODE PACKAGE - Provided is a light emitting diode package including: a molded portion having a housing; a plurality of light emitting chips housed in the housing; a plurality of main lead portions on which the plurality of light emitting chips is mounted, respectively; at least one sub-lead portion formed spaced from the main lead portions and electrically connected to at least any one of the plurality of main lead portions and the plurality of light emitting chips with wires for electrically connecting the plurality of light emitting chips each other; first space maintaining portions formed such that the plurality of light emitting chips respectively on the plurality of main lead portions are opposite to one another with one of the first space maintaining portions disposed therebetween; and second space maintaining portions formed on both sides of each of the first space maintaining portions. | 03-12-2015 |
| 20150069429 | Method of Manufacturing Addressable and Static Electronic Displays - The present invention provides a method of manufacturing an electronic display. The exemplary method includes depositing a first conductive medium within a plurality of cavities of a substrate to form a plurality of first conductors. A plurality of electronic components in a suspending medium are then deposited within the plurality of cavities, and the plurality of electronic components are oriented using an applied field, followed by a bonding of the plurality of electronic components to the plurality of first conductors. A second, transmissive conductive medium is then deposited and bonded to the plurality of electronic components. | 03-12-2015 |
| 20150076528 | ADHESIVE WAFER BONDING WITH SACRIFICIAL SPACERS FOR CONTROLLED THICKNESS VARIATION - A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. Patterned sacrificial spacers are formed between the stabilization posts and between the micro devices. The patterned sacrificial spacers are disposed upon the patterned sacrificial spacers. | 03-19-2015 |
| 20150076529 | LIGHT-EMITTING DEVICE - A light-emitting device includes a resin layer and a plurality of luminous bodies disposed on the resin layer and spaced from each other. Each luminous body has a first side contacting the resin layer and a second side opposite the first side. A wiring element connects the luminous bodies to each other with the wiring element contacting the luminous bodies on the first side. At least some portion of the wiring element is in the resin layer. Separate phosphor layers are disposed on the second side of each luminous body such that each phosphor layer is spaced from each other phosphor layer. | 03-19-2015 |
| 20150076530 | LIGHT-EMITTING DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A light-emitting device package is disclosed. The light-emitting device package includes a metal substrate. An insulating layer is on the metal substrate, wherein the insulating layer has at least one opening to expose the metal substrate. At least one light-emitting device is disposed in the at least one opening of the insulating layer. A sidewall of the at least one opening of the insulating layer is covered by an optical spacer. The disclosure also provides a method for manufacturing the light-emitting device package. | 03-19-2015 |
| 20150076531 | CHIP-ON-FILM (COF) PACKAGE, COF PACKAGE ARRAY INCLUDING THE SAME, AND DISPLAY DEVICE INCLUDING THE SAME - A chip-on-film (COF) package includes a base film, an integrated circuit chip, and a plurality of signal interconnections. The base film includes a bonding region and a non-bonding region. The integrated circuit chip is at the non-bonding region. Each of the plurality of signal interconnections is coupled to the integrated circuit chip and extend to the bonding region along a first direction. The plurality of signal interconnections are spaced from each other along a second direction substantially crossing the first direction. The plurality of signal interconnections alternate on a first surface and a second surface opposite to the first surface of the base film along the second direction. | 03-19-2015 |
| 20150076532 | LIGHT EMITTING DIODE - AC LED according to the present invention comprises a substrate, and at least one serial array having a plurality of light emitting cells connected in series on the substrate. Each of the light emitting cells comprises a lower semiconductor layer consisting of a first conductive compound semiconductor layer formed on top of the substrate, an upper semiconductor layer consisting of a second conductive compound semiconductor layer formed on top of the lower semiconductor layer, an active layer interposed between the lower and upper semiconductor layers, a lower electrode formed on the lower semiconductor layer exposed at a first corner of the substrate, an upper electrode layer formed on the upper semiconductor layer, and an upper electrode pad formed on the upper electrode layer exposed at a second corner of the substrate. The upper electrode pad and the lower electrode are respectively disposed at the corners diagonally opposite to each other, and the respective light emitting cells are arranged so that the upper electrode pad and the lower electrode of one of the light emitting cells are symmetric with is respect to those of adjacent another of the light emitting cells. | 03-19-2015 |
| 20150076533 | INTERDIGITATED MULTIPLE PIXEL ARRAYS OF LIGHT-EMITTING DEVICES - The present invention discloses a plurality of interdigitated pixels arranged in an array, having a very low series-resistance with improved current spreading and improved heat-sinking. Each pixel is a square with sides of dimension l. The series resistance is minimized by increasing the perimeter of an active region for the pixels. The series resistance is also minimized by shrinking the space between a mesa and n-contact for each pixel. | 03-19-2015 |
| 20150084070 | PRE-ROTATED OVERMOULDED BIDIRECTIONAL SPREADING LENS FOR STRETCHED LEADFRAME ARCHITECTURE - A method for manufacturing a solid state light-emitting device (LED) lighting apparatus includes forming a leadframe assembly with a group of leadframes connected in series by folded interconnects, mounting LEDs on the leadframes, disposing optical elements about the LEDs, and stretching the leadframe assembly so the interconnects unfold to space apart the LEDs. Disposing the optical elements includes orienting the optical elements so the optical elements provide a predetermined light pattern after stretching the leadframe assembly. | 03-26-2015 |
| 20150084071 | LIGHT-EMITTING DEVICE - The light-emitting device of the disclosure includes at least one LED chip and a mounting substrate. The mounting substrate includes: a ceramic substrate; a reflection layer situated on a second surface on the opposite side of the ceramic substrate from a first surface; and a gas barrier layer covering the reflection layer. The LED chip is bonded to the first surface of the ceramic substrate. The ceramic substrate has light diffusion and transmissive properties and has a plan size larger than a plan size of the LED chip. The reflection layer has a plan size smaller than a plan size of the ceramic substrate and is formed so as to cover an area larger than a projected area of the LED chip on the second surface of the ceramic substrate. | 03-26-2015 |
| 20150084072 | LED PACKAGE STRUCTURES FOR PREVENTING LATERAL LIGHT LEAKAGE AND METHOD OF MANUFACTURING THE SAME - An LED package structure for preventing lateral light leakage includes a substrate unit, a light-emitting unit, a light-transmitting unit and a light-shielding unit. The substrate unit includes a circuit substrate. The light-emitting unit includes at least one LED chip disposed on the circuit substrate and electrically connected to the circuit substrate. The light-transmitting unit includes a light-transmitting gel body disposed on the circuit substrate for enclosing the LED chip. The light-transmitting gel body has a first light-transmitting portion disposed on the circuit substrate for enclosing the LED chip and at least one second light-transmitting portion projected upwardly from the first light-transmitting portion and corresponding to the LED chip, and the second light-transmitting portion has a light output surface. The light-shielding unit includes a light-shielding gel body disposed on the circuit substrate for exposing the light output surface of the second light-transmitting portion. | 03-26-2015 |
| 20150084073 | LIGHT EMITTING DEVICE - A light emitting device includes a light emitting element and a substrate including a flexible base, a plurality of wiring portions, a groove portion, and a reflective layer. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate. The wiring portions are arranged on the flexible base. The groove portion is formed between the wiring portions spaced apart from each other. The groove portion includes a first groove portion extending in a second direction intersecting the first direction. The reflective layer is arranged on the plurality of wiring portions. The light emitting element is disposed near the reflective layer and electrically connected to the plurality of wiring portions. The light emitting element is spaced apart from the first groove portion. | 03-26-2015 |
| 20150091025 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device includes a sheet-shaped die bonding material on a substrate including a wiring, and a plurality of light-emitting elements fixed onto the die bonding material. A method of manufacturing the light-emitting device includes applying the die bonding material in a paste form to the substrate such that the die bonding material is shared by the plurality of light-emitting elements, placing the plurality of light-emitting elements on the die bonding material in the paste form, and curing the die bonding material after placing the plurality of light-emitting elements so as to fix the plurality of light-emitting elements onto the bonding material. | 04-02-2015 |
| 20150091026 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light emitting diode package structure is provided. The light emitting diode package structure includes at least one light emitting diode unit, an encapsulating body and at least one isolation film. The encapsulating body includes a plurality of surfaces and at least one light-emitting surface, wherein one of the surfaces supports the light emitting diode unit, the other surfaces are exposed. The at least one isolation film is formed on the exposed surfaces. Wherein the isolation film blocks or reflects a portion of light emitted from the light emitting diode unit. | 04-02-2015 |
| 20150091027 | LIGHT EMITTING DEVICE - A light emitting device of the invention includes a substrate; a light emitting element mounted on the upper surface of the substrate; a wire that is electrically connected to the light emitting element; and a plate-shaped light-transmissive member that covers the light emitting element. The wire has a stack structure in which a first bonding ball, a bonding wire, and a second bonding ball are stacked in that order, the stack structure is disposed on the upper surface of the light emitting element, and the plate-shaped light-transmissive member is disposed above the stack structure. | 04-02-2015 |
| 20150097198 | Surface Light Source - In at least one embodiment, a surface light source includes one or a more optoelectronic semiconductor chips having a radiation main side for generating a primary radiation. A scattering body is disposed downstream of the radiation main side along a main emission direction of the semiconductor chips. The scatting body is designed for scattering the primary radiation. A main emission direction of the scattering body is oriented obliquely with respect to the main emission direction of the semiconductor chip. | 04-09-2015 |
| 20150097199 | LED ASSEMBLY - This disclosure discloses an LED assembly. The LED assembly comprises a transparent substrate; a first phosphor layer; a transparent mount, having a plurality of trenches substantially in parallel to each other, wherein the first phosphor layer is positioned between the transparent substrate and the transparent mount; an LED chip, mounted on an area of the transparent mount, wherein the area is located substantially between the trenches; and a second phosphor layer inside the trenches. | 04-09-2015 |
| 20150102365 | NANOSTRUCTURE SEMICONDUCTOR LIGHT EMITTING DEVICE - A nanostructure semiconductor light emitting device includes a base layer, an insulating layer and a plurality of light emitting nanostructures. The base layer is formed of a first conductivity type semiconductor. The insulating layer is disposed on the base layer and has a plurality of openings through which regions of the base layer are exposed. Each of the light emitting nanostructures is disposed on the exposed regions of the base layer and includes nanocore formed of a first conductivity type semiconductor, and an active layer and a second conductivity-type semiconductor layer sequentially disposed on side surfaces of the nanocore. Upper surfaces of the light emitting nanostructures are non-planar and contain portions free of the second conductivity-type semiconductor layer in order to prevent light emissions during device driving. | 04-16-2015 |
| 20150102366 | Light Emitting Device - A light emitting device includes a semiconductor light emitting element that is disposed on a surface of a board, a transparent phosphor plate that includes phosphors, a transparent bonding member that fixedly bonds an upper surface of the semiconductor light emitting element to a lower surface of the phosphor plate, and a reflective layer that surrounds the semiconductor light emitting element and the phosphor plate and contains light-reflective fine particles. The semiconductor light emitting element includes an exposed portion that is provided near an outer peripheral edge of the upper surface of the semiconductor light emitting element and is not covered by the phosphor plate but exposed. A portion of an outer peripheral end surface of the phosphor plate, which is located near the upper surface of the phosphor plate, is not covered by the bonding member. | 04-16-2015 |
| 20150102367 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a light emitting device. The light emitting device comprises a substrate, an N-type semiconductor layer formed on the substrate, and a P-type semiconductor layer formed on the N-type semiconductor layer, wherein a side surface including the N-type or P-type semiconductor layer has a slope of 20° to 80° from a horizontal plane. Further, a light emitting device comprises a substrate formed with a plurality of light emitting cells each including an N-type semiconductor layer and a P-type semiconductor layer formed on the N-type semiconductor layer, wherein the N-type semiconductor layer of one light emitting cell and the P-type semiconductor layer of another adjacent light emitting cell are connected to each other, and a side surface including at least the P-type semiconductor layer of the light emitting cell has a slope of 20° to 80° from a horizontal plane. | 04-16-2015 |
| 20150108509 | METHOD FOR PRODUCING INTERCONNECTED OPTOELECTRONIC COMPONENTS, AND INTERCONNECTED OPTOELECTRONIC COMPONENTS - The invention relates to a method for producing serially interconnected optoelectronic components as well as optoelectronic components interconnected according to the method. In a first step, an electrically non-conductive layer with optoelectronic material introduced therein and at least one first wire or thread ( | 04-23-2015 |
| 20150108510 | LED MODULE - The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate. | 04-23-2015 |
| 20150108511 | Optoelectronic Module and Method for Producing an Optoelectronic Module - An optoelectronic module has at least one semiconductor chip for emitting electromagnetic radiation. The semiconductor chip has a layer having a first conductivity, a layer having a second conductivity, a radiation surface and a contact surface which lies opposite the radiation surface. A contact is attached to the radiation surface. A frame made of a potting compound laterally encloses the semiconductor chip in at least some regions such that the radiation surface and the contact surface are substantially free of the potting compound. A first contact structure is arranged in at least some regions on the frame and in at least some regions on the contact surface. A second contact structure is arranged in at least some regions on the frame and in at least some regions on the contact of the radiation surface. | 04-23-2015 |
| 20150108512 | DISPLAY UNIT AND ELECTRONIC APPARATUS - A display unit includes a first substrate and a second substrate opposed to each other, a display element having a first electrode and a second electrode on the first substrate, an auxiliary electrode provided on a surface facing the first substrate of the second substrate, and including a plurality of films stacked in a direction from the second substrate to the first substrate, and a plurality of pillars configured to electrically connect the auxiliary electrode to the second electrode. | 04-23-2015 |
| 20150108513 | OVERLAY CIRCUIT STRUCTURE FOR INTERCONNECTING LIGHT EMITTING SEMICONDUCTORS - A system and method for packaging light emitting semiconductors (LESs) is disclosed. An LES device is provided that includes a heatsink and an array of LES chips mounted on the heatsink and electrically connected thereto, with each LES chip comprising connection pads and a light emitting area configured to emit light therefrom responsive to a received electrical power. The LES device also includes a flexible interconnect structure positioned on and electrically connected to each LES chip to provide for controlLES operation of the array of LES chips, with the flexible interconnect structure further including a flexible dielectric film configured to conform to a shape of the heatsink and a metal interconnect structure formed on the flexible dielectric film and that extends through vias formed in the flexible dielectric film so as to be electrically connected to the connection pads of the LES chips. | 04-23-2015 |
| 20150108514 | FLIP-CHIP LIGHT EMITTING DIODE AND FABRICATION METHOD - A flip-chip LED includes a substrate, having a surface with a p-region metal portion and an n-region metal portion separated from each other; a p-type epitaxial layer, an active layer and an n-type epitaxial layer successively laminated on the substrate; a reflection layer between the substrate and the p-type epitaxial layer; a current blocking layer between the reflection layer and the p-type epitaxial layer and positioned to prevent the current from concentrating on the edge of the LED; an insulating protection layer cladding the LED side wall and exposing part of the side wall of the n-type epitaxial layer; a P electrode connecting the metal reflection layer and the p-region metal portion of the substrate; and an N electrode connecting the side wall of the n-type epitaxial layer and n-region metal portion of the substrate. | 04-23-2015 |
| 20150108515 | DISPLAY DEVICE - Disclosed is a display device and an electronic apparatus incorporating the display device. The display device includes a transistor and a planarization film over the transistor. The planarization film has an opening where an edge portion is rounded. The display device further includes a first electrode over the planarization film and an organic resin film over the first electrode. The organic resin film also has an opening where an edge portion is rounded. The organic resin film is located in the opening of the planarization film. The first electrode and the transistor are electrically connected to each other through a conductive film. The first electrode is in contact with a top surface of the conductive film. Over the first electrode, a light-emitting member and a second electrode are provided. | 04-23-2015 |
| 20150115292 | DISPLAY APPARATUS AND MULTI-PANEL DISPLAY APPARATUS - A display apparatus includes a thin film transistor substrate, a gate driver, and a connection line. The thin film transistor substrate includes a display area and a non-display area surrounding the display area. The display area includes gate lines extending along a first direction and data lines extending along a second direction crossing the first direction. The data lines are insulated from the gate lines. The gate driver is at a first non-display area of the non-display area, located outside the display area along the second direction, and is configured to apply a gate signal to the gate lines. The connection line extends along the second direction and couples the gate driver and the gate lines. A resistance of the connection line coupled to a gate line is substantially equal to a resistance of the connection line coupled to another gate line. | 04-30-2015 |
| 20150115293 | LIGHT EMITTING DIODE DISPLAY PANEL - A light emitting diode (LED) display panel and fabrication method thereof are provided. The LED display panel includes a plurality of dielectric patterns and LED devices, and the dielectric patterns are formed on a substrate subsequent to formation of the LED devices. The dielectric pattern surrounds sidewalls of the corresponding LED device, and exposes an electrode of the LED device. The upper surface of the dielectric pattern and the electrode of the LED device are located at the same level approximately, and a connection electrode is disposed on the dielectric pattern, and electrically connected to the electrode of the LED device and a signal line. | 04-30-2015 |
| 20150115294 | LIGHT EMITTING DEVICE INCLUDING RESIN-MOLDED BODY WITH WHITE PORTION AND BLACK PORTION - A light emitting device includes a resin-molded body including: a light emitting window, a white portion, and a black portion, wherein, in a top plan view of the light emitting device, the white portion surrounds the light emitting window, and the black portion surrounds the white portion; an electrode protruding from an outer surface of the resin-molded body; and
| 04-30-2015 |
| 20150115295 | Flip-Chip Light Emitting Diode and Fabrication Method - A flip-chip light emitting diode (LED) includes: a substrate having a P-type pad electrode and an N-type pad electrode; a light-emitting epitaxial layer flip-chip mounted over the substrate, including, from top down, an n-type semiconductor layer, an active layer, and a p-type semiconductor layer. The n-type semiconductor layer is divided into a light-emitting region, an isolation region, and an electrode region. The light-emitting region and the electrode region are electrically isolated by the isolation region. The active layer and the p-type semiconductor layer are below the light-emitting region. The p-type semiconductor layer connects with the P-type pad electrode. The electrode region of the n-type semiconductor layer connects with the N-type pad electrode. A conductive connection portion on the n-type semiconductor layer connects the electrode region of the n-type semiconductor layer and the light-emitting region, realizing vertical current injection into the light-emitting epitaxial layer when an external power is connected. | 04-30-2015 |
| 20150123150 | DISPLAY DEVICE - When the plane shape of a bank edge, that is, the direction of a line segment connecting the centers of pixels adjacent to each other (the direction of the pixels) is orthogonal to the direction of a line segment formed by the bank edge, light leaks from the adjacent pixels. The shape of the luminous region of the pixel of a display device, that is, the edge shape of a bank opening is formed as follows. The direction of an approximately linear portion (a line segment) formed by a bank edge is not orthogonal to the direction of the most closely adjacent pixel (an acute angle or an obtuse angle is formed by the directions). | 05-07-2015 |
| 20150123151 | LIGHT EMITTING DEVICE - A light-emitting structure includes a transparent substrate; a first transparent conductive layer formed on the transparent substrate and having a first top surface and a second top surface substantially coplanar with the first top surface; a first light-emitting stack formed on the first top surface; and a first electrode directly formed on the second top surface. | 05-07-2015 |
| 20150129899 | LED LEAD FRAME FOR LAMINATED LED CIRCUITS - Techniques are disclosed for integrating the LED lead frame into the LED circuit fabrication process. The LED packages within the lead frame may be spaced according to the final spacing of the LED packages on the finished circuit board, such that multiple LED packages may be attached to a circuit board at a time by applying the lead frame to circuit board and then removing portions of the lead frame, leaving the LED packages attached to the board. The LED packages may be attached using solder or conductive epoxy, in some embodiments. Alternatively, part of the lead frame may include conductive wires forming one or more strings of LED packages. An entire string of LED packages may then be removed from the lead frame in a single motion and placement may be performed for a string of LED packages all at once rather than for individual LED packages. | 05-14-2015 |
| 20150129900 | LIGHT EMITTING DIODE STRUCTURE - A light emitting diode structure includes a patterned substrate, a light emitting diode die, and a first reflector. The light emitting diode die is disposed on the patterned substrate and emitting a light in wavelength λ. The first reflector is formed over the patterned substrate, covering the patterned substrate which is not covered by the light emitting diode die, to reflect the light emitted from the light emitting diode die. Also, plurality of light emitting diode die can be connected in series to form a high voltage light emitting diode structure. | 05-14-2015 |
| 20150129901 | Optoelectronic Semiconductor Chip and Method for Producing an Optoelectronic Semiconductor Chip - An optoelectronic semiconductor chip and a method for producing an optoelectronic semiconductor chip are disclosed. In an embodiment an optoelectronic semiconductor chip includes a support having a support top side, a semiconductor layer sequence having an active layer for generating electromagnetic radiation, wherein the active layer is located between an n-type n-layer and a p-type p-layer of the semiconductor layer sequence, wherein the semiconductor layer sequence, as seen in a plan view of the support top side, is patterned into emitter regions arranged next to one another and electrical conductor tracks located on a side of the semiconductor layer sequence facing away from the support, where the electrical conductor tracks include contact surfaces. The chip further includes an n-contact point and a p-contact point for electrically contacting the semiconductor chip, wherein the emitter regions are electrically connected in series via the at least two conductor tracks. | 05-14-2015 |
| 20150129902 | LIGHTING DEVICE - In a first aspect of the present inventive subject matter, a lighting device includes a light-emitting element that includes a first electrode and a second electrode on a lower surface of the light-emitting element; a phosphor layer directly covering a peripheral side surface of the light-emitting element; and a light-reflecting layer that is in contact with an upper surface of the light-emitting element and in contact with an upper surface of the phosphor layer directly covering the peripheral side surface of the light-emitting element. | 05-14-2015 |
| 20150129903 | DISPLAY DEVICE - A display device including a pixel array having a plurality of pixels arranged in a matrix form, each of the pixels including a sampling transistor configured to sample a data potential from a video signal line which is insulated from and intersects a control line in response to the change in potential of the control line, and a light-emitting element configured to emit light at the brightness commensurate with the magnitude of the post-sampling data potential. | 05-14-2015 |
| 20150129904 | LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES - A light emitting diode (LED) package includes a package body having a recessed portion, a first lead electrode and a second lead electrode spaced apart from each other, and a light emitting device arranged in the recessed portion and electrically connected to the first lead electrode and the second lead electrode. The LED package is configured to be driven by an alternating current (AC) and by a voltage higher than that for driving one light emitting diode. | 05-14-2015 |
| 20150129905 | Optical Device and Method for Manufacturing Same - The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate. | 05-14-2015 |
| 20150137149 | LED MODULE AND METHOD OF PREPARING THE LED MODULE, LIGHTING DEVICE - An LED module includes a submount having a face in a thickness direction thereof, an LED chip bonded to the face of the submount with a first bond, and a patterned wiring circuit electrically connected to the LED chip. The first bond transmits light emitted from the LED chip. The submount is a light-transmissive member having light diffusing properties, and a planar size larger than a planar size of the LED chip. The patterned wiring circuit is provided on the face of the submount so as not to overlap the LED chip. The submount is constituted by a plurality of light-transmissive layers which are stacked in the thickness direction and have different optical properties so that a light-transmissive layer of the plurality of light-transmissive layers which is farther from the LED chip is higher in reflectance in a wavelength range of the light emitted from the LED chip. | 05-21-2015 |
| 20150137150 | VERTICAL MULTI-JUNCTION LIGHT EMITTING DIODE - An embodiment of the invention comprises a first III-V semiconductor structure including a first light emitting layer disposed between a first n-type region and a first p-type region, and a second III-V semiconductor structure including a second light emitting layer disposed between a second n-type region and a second p-type region. A first contact is formed on a top surface of the first III-V semiconductor structure. A second contact is formed on a bottom surface of the second III-V semiconductor structure. A bonding structure is disposed between the first and second III-V semiconductor structures. | 05-21-2015 |
| 20150137151 | HIGH POWER LEDS - LED chips and packages are disclosed having lenses made of materials that resist degradation at higher operation temperatures and humidity, and methods of fabricating the same. The lenses can be made of certain materials that can withstand high temperatures and high humidity, with the lenses mounted to the LED prior to certain critical metallization steps. This helps avoid damage to the metalized part that might occur as a result of the high mounting or bonding temperature for the lens. One embodiment of an LED chip comprises a flip-chip LED and a lens mounted to the topmost surface of the flip-chip LED. Lenses can be bonded to LEDs at the wafer level or at the chip level. Some of the LED chips and packages can have lenses of different materials with planar and/or curved surfaces. | 05-21-2015 |
| 20150137152 | LIGHT EMITTING ELEMENT AND LIGHT EMITTING ELEMENT ARRAY - A light emitting element includes a semiconductor including an active layer, and a planar shape of the light emitting elements including a concave polygon. The planar shape of the concave polygon has interior angles including at least one acute angle. | 05-21-2015 |
| 20150137153 | METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE - Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer. | 05-21-2015 |
| 20150137154 | Display Device and Method for Manufacturing the Same - It is an object of the present invention to provide a display device preventing the external invasion of water and/or oxygen and preventing the deterioration of a luminous element due to these invading substances and to provide a production method including simple production steps for producing the display device. The invention provides a display device having a sealing material on the rim of an exposed interlayer insulator for preventing the invasion of water and/or oxygen from the interlayer insulator. Further, the invention provides a display device having a barrier body on an exposed interlayer insulator for preventing the invasion of water and/or oxygen from the interlayer insulator. Furthermore, the application of droplet discharge technique in production steps for producing the display device can eliminate a photolithography step such as exposing and developing. Thus, a method of producing a display device having an improved yield is provided. | 05-21-2015 |
| 20150144969 | LIGHT EMITTING DIODE PACKAGE, LIGHT SOURCE MODULE AND BACKLIGHT UNIT INCLUDING THE SAME - A light emitting diode package, a light source module and a backlight unit including the same are provided. A plurality of light emitting diode packages are arranged on a printed circuit board without interference therebetween, by forming lines therein. | 05-28-2015 |
| 20150144970 | Light Emitting Device - According to an exemplary embodiment, there is provided a light emitting device including a ceramic substrate, first to fourth connectors, a plurality of semiconductor light emitting elements, and a first metal layer. The ceramic substrate is provided with a first main surface including first to fourth sides and first to fourth corner portions, and the first main surface includes a mounting region, and first to fourth connector region provided respectively between the first to fourth corner portion and the mounting region. The plurality of semiconductor light emitting elements is provided on the mounting region. The first to fourth connectors are respectively provided on the first to fourth connector regions. A first metal layer is provided between the plurality of semiconductor light emitting elements and the ceramic substrate, and including first to fourth connector electrode portions electrically connected respectively to the first to fourth connectors. | 05-28-2015 |
| 20150144971 | CHIP SCALE LIGHT EMITTING DEVICE WITH METAL PILLARS IN A MOLDING COMPOUND FORMED AT WAFER LEVEL - Thick metal pillars are formed upon light emitting dies while the dies are still on their supporting wafer. A molding compound is applied to fill the space between the pillars on each die, and contact pads are formed atop the pillars. The metal pillars provide electrical contact between the contact pads and the electrical contacts of each light emitting die. The metal pillars maybe formed upon an upper metal layer of each die, and this upper metal layer maybe patterned to provide connections to individual elements within the die. | 05-28-2015 |
| 20150144972 | MATRIX LEADFRAME FOR LED PACKAGING - A leadframe ( | 05-28-2015 |
| 20150144973 | DISPLAY DEVICE - A display device having a first pixel electrode and a second pixel electrode whose areas are different from each other is provided. In the display device, the first pixel electrode and the second pixel electrode are electrically connected to a first transistor and a second transistor, respectively. Gates of the first transistor and the second transistor are electrically connected to each other. A potential is supplied to the first pixel electrode and the second pixel electrode through a wiring electrically connected to the first transistor and the second transistor. | 05-28-2015 |
| 20150295015 | DOUBLE-SIDED DISPLAY AND METHOD OF MANUFACTURING SAME - A double-sided display and a method of manufacturing the double-side display are provided. The double-sided display includes a substrate having a plurality of holes penetrating through the substrate, a TFT driving circuit, a front-side light-emitting structure, a back-side light-emitting structure, and a plurality of driving electrodes. The front-side and the back-side light-emitting structures are respectively disposed on two opposite sides of the substrate. The TFT driving circuit is disposed on one of the two opposite sides, and the driving electrodes are disposed on the other one of the two opposite sides. The TFT driving circuit is configured to drive one of the front-side and back-side light-emitting structures to display images, and is further configured to drive the other one of the front-side and back-side light-emitting structures to display images in cooperation with the driving electrodes connected to the TFT driving circuit via the holes. | 10-15-2015 |
| 20150295145 | LIGHT-EMITTING DEVICE AND METHOD OF PRODUCING THE SAME - A light-emitting device can prevent light from leaking through an unwanted area (or an unintended area) and can improve color unevenness and brightness unevenness. A method of producing such a light-emitting device, can include: disposing a plurality of light-emitting elements on a surface of a supporting substrate; forming a reflecting layer on the respective light-emitting elements along peripheries of the light-emitting elements facing an area between the light-emitting elements; forming a wavelength conversion layer so as to embed the plurality of light-emitting elements therein on the supporting substrate; and irradiating the wavelength conversion layer with laser beams to remove the wavelength conversion layer disposed at the area between the light-emitting elements. | 10-15-2015 |
| 20150303357 | LIGHT EMITTING DEVICE AND METHOD FOR PRODUCING SAME - There is provided a light emitting device highly resistant to the environment, and having good heat resistance, light resistance and gas barrier property, and a method for producing same. With the light emitting device, a substrate | 10-22-2015 |
| 20150311184 | LED MODULE - An LED module | 10-29-2015 |
| 20150311249 | CHIP-SCALE PACKAGED LED DEVICE - An LED device includes a substrate, a number (N) of flip-chip LED die(s), an electrical conductive structure and a lens structure. The substrate has upper and lower surfaces and is formed with multiple through holes. A ratio of LED die(s) surface area to an area of the upper surface of the substrate ranges from 22.7% to 76.2%. The electrical conductive structure includes a number (N) of upper bonding pad assembly (assemblies), a number (N+1) of lower bonding pads and a number (2N) of interconnectors. Each upper bonding pad assembly includes two upper bonding pads electrically connected to the LED die(s). The interconnectors are disposed in the through holes and interconnect the upper and lower bonding pads. The lens structure covers the LED die(s). | 10-29-2015 |
| 20150311267 | PIXEL STRUCTURE FOR ACTIVE MATRIX DISPLAY, AND METHOD FOR MANUFACTURING SAME - The present invention relates to a pixel structure for an active matrix display and to a method for manufacturing same, and the objective thereof is to simplify processes for manufacturing pixel electrodes and pixel defining layers and address a problem caused by a terminal which is formed at an edge part of the pixel electrode through the patterning of the pixel electrode. The pixel structure according to the present invention includes: a base substrate; a plurality of pixel circuit electrodes; an insulating layer; and a composite layer. The plurality of pixel circuit electrodes is arranged in a matrix form on the base substrate. The insulating layer is formed on the base substrate to cover the outer peripheries of the plurality of pixel circuit electrodes. The composite layer is integrally formed to cover the plurality of pixel circuit electrodes and the top of the insulating layer. In this case, the composite layer has: the conductive pixel electrodes that are formed to be respectively connected to the plurality of pixel circuit electrodes which are exposed from the insulating layer; and the non-conductive pixel defining layers on the outer peripheries of the pixel electrodes. | 10-29-2015 |
| 20150311269 | DISPLAY SUBSTRATE AND DISPLAY DEVICE APPLYING THE SAME - A display substrate and a display device applying the same are provided. The display substrate includes a base plate and a display structure. The display structure is disposed on the base plate and includes a plurality of display units arranged in an array. The display units have a core region and a peripheral region. The core region includes at least one first sub-pixel and at least one second sub-pixel. The peripheral region includes at least one third sub-pixel and is located outside the core region. | 10-29-2015 |
| 20150311387 | CHIP WITH ENHANCED LIGHT EXTRACTION - Described herein are devices and methods incorporating light extraction features for improving light extraction in light emitting diode (LED) chips, for example, thin-film semiconductor LED chips such as thin film GaN chips. These features can be located in the semiconductor diode region of an LED chip and are configured to improve device light extraction by redirecting light emitted by the chip's active region. In some embodiments, the light extraction features can comprise a material with a refractive index lower than the surrounding semiconductor material. In some embodiments, the light extraction features are shaped to improve light extraction and can be formed as protrusions, indentations and can comprise various features such as sloped sidewalls. Also disclosed herein are contact configurations for improving electrical conductivity in the disclosed devices. | 10-29-2015 |
| 20150311389 | Nitride Light Emitting Diode and Fabrication Method Thereof - A nitride light-emitting diode including: a substrate with sub-micro patterns over the surface, which is divided into a growth region and a non-growth region; a growth blocking layer, formed in the non-growth region of the substrate for blocking epitaxial growth in the non-growth region of the substrate; a light-emitting epitaxial layer, comprising an n-type layer, a light-emitting layer and a p-type layer, formed in the growth region of the substrate, which extends to the non-growth region through lateral epitaxy and covers the growth blocking layer; wherein, the refractive index of the growth blocking layer is less than that of the light-emitting epitaxial layer and the growth blocking layer forms undulating morphology along the sub-micro patterns of the substrate, thus increasing light extraction interface of LED, generating refractive index difference between the light-emitting epitaxial layer and the light extraction interface and improving light extraction efficiency. | 10-29-2015 |
| 20150311391 | LIGHTING DEVICE - A lighting device includes a plurality of light-emitting diodes including a first light-emitting diode with a non-rectangular shape in a top view, a submount to which each of the plurality of light-emitting diodes is coupled, and a plurality of conductive elements formed between the submount and the plurality of light-emitting diodes to electrically connecting at least a portion of the plurality of light-emitting diodes with each other in series. | 10-29-2015 |
| 20150311398 | LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME - An exemplary embodiment discloses a light emitting diode including a first light emitting cell and a second light emitting cell disposed on a substrate, the first light emitting cell and the second light emitting cell being spaced apart from each other. The light emitting diode also includes a first zinc oxide (ZnO) layer disposed on the first light emitting cell, the first ZnO layer being electrically connected to the first light emitting cell. The light emitting diode also includes a current blocking layer disposed between a portion of the first light emitting cell and the first ZnO layer, an interconnection electrically connecting the first light emitting cell and the second light emitting cell, and an insulation layer disposed between the interconnection and a side surface of the first light emitting cell. The current blocking layer and a first side of insulation layer are connected to each other. | 10-29-2015 |
| 20150311414 | LED CARRIER AND MANUFACTURING METHOD THEREOF - An LED carrier includes a substrate, a metallic layer, an insulating layer, and a reflecting layer. The metallic layer is disposed on the substrate and has a die bonding region and a ring-shaped wiring region separated from the die bonding region. A region arranged between the die bonding region and the ring-shaped wiring region is defined as an insulating region. The insulating layer at least partially covers the insulating region. The reflecting layer is arranged above the die bonding region and at least partially covers the top surface of the insulating layer. Moreover, the instant disclosure also provides a manufacturing method of an LED carrier. | 10-29-2015 |
| 20150325754 | HIGH-POWER WHITE LEDS - A light emitting apparatus includes a first radiation source without a dome, a substantially transparent and light transmissive optic device, a lens, a down conversion material, and a heat sink. The optic device is devoid of scattering particles and phosphor, and includes a planar top surface distal the first radiation source, a bottom surface proximal the first radiation sources, and a transparent sidewall extending between the top surface and the bottom surface. The down conversion material includes a flat layer including phosphor that is disposed on the planar top surface of the optic device between the lens and the radiation source. The heat sink, upon which the radiation source is mounted, has a recess formed therein in which an air space is defined between a boundary of the recess and the optic device. | 11-12-2015 |
| 20150325756 | LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE - A light emitting device includes a flip-chip mounted type light emitting element, a phosphor-containing member, and a first reflecting member. The flip-chip mounted type light emitting element has a pair of electrodes disposed on a bottom surface side. The phosphor-containing member is provided at least above the light emitting element and separated from the light emitting element. The first reflecting member is configured to cover the phosphor-containing member. An opening is in at least one of side faces of the light emitting device, the opening extracting light emitted from the light emitting element and light whose wavelength is converted by the phosphor-containing member. | 11-12-2015 |
| 20150325759 | OPTICAL ELEMENT WITH INTEGRATED INDICATOR - Solid state fixtures and packages are disclosed that include an optical element, such as an encapsulant, having an integrated indicator which indicates one or more characteristics of the package to a user, such as package orientation, polarity, chip-type, etc. The host optical element can be substantially symmetrical but for the indicator. Indicators can be additive, such as a bump, or subtractive, such as a hole. The indicator can be visible to the human eye, and/or can be machine detectable, such as by pick-and-place technology. Indicators can be formed by many processes including molding and laser ablation/imprinting, which is particularly suited for use with a hard host material. | 11-12-2015 |
| 20150325815 | DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME - A display device including: a substrate configured to include a first region and a second region formed at an outer periphery of the first region; an emission layer disposed on the first region and the second region of the substrate; a polarizer disposed on the emission layer; a touch panel disposed on the polarizer; a window disposed on the touch panel; and a light blocking layer covering side surfaces of the polarizer and the touch panel and a top surface of the emission layer disposed on the second region of the substrate. The polarizer and the touch panel cover the first region of the substrate and expose the second region of the substrate. | 11-12-2015 |
| 20150333044 | OPTICAL SEMICONDUCTOR LIGHTING APPARATUS - An optical semiconductor lighting apparatus including: a substrate in which a single LED chip or a plurality of LED chips are disposed; a first mold portion disposed on the substrate to cover the plurality of LED chips; and a second mold portion extending from an edge of the first mold portion and disposed on the substrate. The respective LED chips can improve adhesive strength with respect to the substrate through the first and second mold portions. Peeling, surface cracking and damage caused by moisture permeation can be prevented by the first and second mold portions. A fluorescent material included in the second mold portion can improve a wavelength conversion rate. | 11-19-2015 |
| 20150333045 | Packaging Photon Building Blocks Having Only Top Side Connections In A Molded Interconnect Structure - Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer. | 11-19-2015 |
| 20150333047 | METHOD FOR PRODUCING OPTOELECTRONIC SEMICONDUCTOR CHIPS, AND OPTOELECTRONIC SEMICONDUCTOR CHIP - What is specified is a method for producing a plurality of optoelectronic semiconductor chips ( | 11-19-2015 |
| 20150333216 | PROCESS FOR PRODUCING ADJACENT CHIPS COMPRISING LED WIRES AND DEVICE OBTAINED BY THE PROCESS - A process for producing at least two adjacent regions, each comprising an array of light-emitting wires connected together in a given region by a transparent conductive layer, comprises: producing, on a substrate, a plurality of individual zones for growing wires extending over an area greater than the cumulative area of the two chips; growing wires in the individual growth zones; removing wires from at least one zone forming an initial free area to define the arrays of wires, the initial free area comprising individual growth zones level with the removed wires; and depositing a transparent conductive layer on each array of wires to electrically connect the wires of a given array of wires, each conductive layer being separated from the conductive layer of the neighbouring region by a free area. A device obtained using the process of the invention is also provided. | 11-19-2015 |
| 20150333221 | FLEXIBLE DISPLAY AND METHOD OF FORMATION WITH SACRIFICIAL RELEASE LAYER - A flexible display panel and method of formation with a sacrificial release layer are described. The method of manufacturing a flexible display system includes forming a sacrificial layer on a carrier substrate. A flexible display substrate is formed on the sacrificial layer, with a plurality of release openings that extend through the flexible display substrate to the sacrificial layer. An array of LEDs and a plurality of microchips are transferred onto the flexible display substrate to form a flexible display panel. The sacrificial layer is selectively removed such that the flexible display panel attaches to the carrier substrate by a plurality of support posts. The flexible display panel is removed from the carrier substrate and is electrically coupled with display components to form a flexible display system. | 11-19-2015 |
| 20150333230 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE INCLUDING THE SAME - Disclosed is a light emitting device including a plurality of light emitting cells disposed on a substrate, at least one connection electrode for connecting the light emitting cells, and a first insulating layer disposed between adjacent light emitting cells, wherein each of the light emitting cells includes a light emitting structure including first and second conductive type semiconductor layers and an active layer, and a reflective layer disposed on the second conductive type semiconductor layer, wherein the connection electrode connects the first conductive type semiconductor layer of a first one of the adjacent light emitting cells to the reflective layer of a second one at the adjacent light emitting cells, and wherein a first width of the second conductive type semiconductor layer is the same as or greater than a second width of the reflective layer, and the first direction differs from a thickness direction of the light emitting structure. | 11-19-2015 |
| 20150333240 | PRINTED LED HEAT SINK DOUBLE LOCK - A light emitting assembly is disclosed. The assembly comprises a heat sink of an electrically conductive material configured to function as a first electrode. A plurality of LEDs in a semiconductor ink is disposed on the first electrode and operable to emit an excitation emission. The assembly further comprises a second electrode in communication with the plurality of LEDs and at least one photoluminescent layer proximate at least one of the electrodes. The photoluminescent layer is configured to convert the excitation emission to an output emission. | 11-19-2015 |
| 20150333290 | DISPLAY DEVICES AND METHODS OF MANUFACTURING DISPLAY DEVICES - A display device includes a display panel having a first substrate having a display region and a peripheral region surrounding the display region, a light emitting structure in the display region, a sealant in the peripheral region, the sealant including a first portion having a first width, and a second portion adjacent to the first portion and having a second width smaller than the first width, and a second substrate on the light emitting structure and the sealant, a body including an upper frame and a lower frame, the body receiving the display panel, and at least one function button at a first portion of the display device, at least a portion of the function button protruding out of the body, and the first portion of the sealant being disposed adjacent to the at least one the function button at the first portion of the display device. | 11-19-2015 |
| 20150338562 | POLARIZING FILTER AND DISPLAY DEVICE - The present invention discloses a polarizing filter and a display device. The polarizing filter comprises a polarization layer and a conductive layer provided on one side of the polarization layer. In the present invention, the conductive layer is provided on the polarization layer, thus, when the electrostatic charge are present on the color film substrate having the polarizing filter, the electrostatic charge may be shielded by the conductive layer, and will not adversely affect the liquid crystal molecule between the color film substrate and a array substrate celled to the color film substrate even if the charge are present on a surface of the color film substrate, such that the display quality of the display panel having the color film substrate and the array substrate is improved. In addition, there is no need to provide a conductive tape used to guide the electrostatic charge out of the color film substrate in the display panel, so as to prevent some undesirable phenomenon, such as local uneven force on the panel, light leak and glue residue and the like, caused by the arrangement of the conductive tape. | 11-26-2015 |
| 20150340345 | LIGHT EMITTING DIODE ASSEMBLY, BACKLIGHT MODULE, LIQUID CRYSTAL DISPLAY AND ILLUMINATION DEVICE - The present disclosure relates to the technical field of light emission of an LED and discloses a light emitting diode assembly, a backlight module, a liquid crystal display and an illumination device. The LED assembly comprises a lamp base and at least one pair of LED dies. The lamp base has a mounting groove. A pair of the LED dies are mounted at a bottom surface of the mounting groove, and two LED dies in the pair of LED dies are disposed symmetrically about an axis of the mounting groove. Among angles formed by intersection of planes where light exit surfaces of the two LED dies lie, an angle facing the bottom surface of the mounting groove is greater than 0 degree and less than 180 degrees. The light emitting diode assembly has a larger light exit angle and exhibits a simple structure. | 11-26-2015 |
| 20150340347 | LIGHT EMITTING DEVICE HAVING WAVELENGTH CONVERTING LAYER - Disclosed is a light emitting device having a wavelength converting layer. The light emitting device comprises a plurality of semiconductor stacked structures; connectors for electrically connecting the plurality of semiconductor stacked structures to one another; a single wavelength converting layer for covering the plurality of semiconductor stacked structures; an electrode electrically connected to at least one of the semiconductor stacked structures; and at least one additional electrode positioned on the electrode, passing through the wavelength converting layer to be exposed to the outside, and forming a current input terminal to the light emitting device or a current output terminal from the light emitting device. Since the single wavelength converting layer covers the plurality of semiconductor stacked structures, the plurality of semiconductor stacked structures can be integrally mounted on a chip mounting member such as a package or a module. | 11-26-2015 |
| 20150340412 | FLAT PANEL DISPLAY HAVING LOW REFLECTIVE BLACK MATRIX AND METHOD FOR MANUFACTURING THE SAME - A flat panel display having a low reflective black matrix and a method for manufacturing the same are provided. The flat panel display includes a substrate having an open area and a non-open area; a hazy layer disposed in the non-open area on the inner surface of the substrate; a black matrix stacked on the hazy layer; a driving element disposed in the non-opening area; and a display element disposed in the open area and driven by the driving element. | 11-26-2015 |
| 20150340557 | SHAPED LED FOR ENHANCED LIGHT EXTRACTION EFFICIENCY - The shape of a light emitting element | 11-26-2015 |
| 20150348949 | LED MODULE AND LED MODULE PACKAGING STRUCTURE - An LED module includes: a substrate including main, rear, and bottom surfaces; a first light emitting element disposed on the main surface; a conductive layer formed on the substrate and electrically coupled with the first light emitting element; a first conductive bonding layer interposed between the first light emitting element and the conductive layer; a main surface insulating film formed on the main surface and covering a portion of the conductive layer; and a first wire, wherein the main surface and the rear surface face opposite directions, the bottom surface connects long sides of the main and rear surfaces, the conductive layer includes a first wire bonding portion where the first wire is bonded, and the main surface insulating film includes a first insulating portion including a portion interposed between the first light emitting element and the first wire bonding portion when viewed in a thickness direction of the substrate. | 12-03-2015 |
| 20150348950 | LED PACKAGE - Disclosed herein is a light emitting diode (LED) package. The present invention is directed to a light emitting diode (LED) package capable of efficiently dissipating heat generated from LEDs. The present invention is also directed to a LED package in which a plurality of LEDs are disposed and heat generated from the plurality of LEDs is efficiently dissipated. | 12-03-2015 |
| 20150349038 | LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING LIGHT EMITTING DEVICE, AND ELECTRONIC EQUIPMENT - A light emitting device includes a transistor, a light reflection layer, a first insulation layer that includes a first layer thickness part, a second layer thickness part, and a third layer thickness part, a pixel electrode that is provided on the first insulation layer, a second insulation layer that covers a peripheral section of the pixel electrode, a light emission functional layer, a facing electrode, and a conductive layer that is provided on the first layer thickness part. The pixel electrode includes a first pixel electrode which is provided in the first layer thickness part, a second pixel electrode which is provided in the second layer thickness part, and a third pixel electrode which is provided in the third layer thickness part. The first pixel electrode, the second pixel electrode, and the third pixel electrode are connected to the transistor through the conductive layer. | 12-03-2015 |
| 20150349043 | EL DISPLAY PANEL, POWER SUPPLY LINE DRIVE APPARATUS, AND ELECTRONIC DEVICE - Disclosed herein is an electroluminescence display panel including a pixel circuit, a signal line, a scan line, a drive power supply line, a common power supply line, a power supply line drive circuit, a high-potential power supply line, and a low-potential power supply line. | 12-03-2015 |
| 20150349218 | SUBMOUNT BASED LIGHT EMITTER COMPONENTS AND METHODS - Submount based light emitter components and related methods are disclosed. In some aspects, light emitter components include a ceramic submount, at least a first pair of electrical traces disposed on a first side of the submount, at least a first pair of electrical contacts disposed on a second side of the submount, at least one light emitter chip disposed on the first side of the submount, and a non-ceramic reflector disposed about the at least one light emitter chip. The first pair of electrical contacts is configured to electrical communicate with the first pair of electrical traces. The at least one chip is configured to electrically communicate with the first pair of electrical traces. At least a portion of the reflector is configured to conceal a portion of each trace of the first pair of electrical traces. | 12-03-2015 |
| 20150357314 | DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS - Discontinuous bonds for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a first substrate and a second substrate, with at least one of the first substrate and the second substrate having a plurality of solid-state transducers. The second substrate can include a plurality of projections and a plurality of intermediate regions and can be bonded to the first substrate with a discontinuous bond. Individual solid-state transducers can be disposed at least partially within corresponding intermediate regions and the discontinuous bond can include bonding material bonding the individual solid-state transducers to blind ends of corresponding intermediate regions. Associated methods and systems of discontinuous bonds for semiconductor devices are disclosed herein. | 12-10-2015 |
| 20150357530 | METHOD FOR PRODUCING A PLURALITY OF OPTOELECTRONIC COMPONENTS AND OPTOELECTRONIC COMPONENT - The invention relates to a method for producing a plurality of optoelectronic components, comprising the following steps: providing an auxiliary support wafer ( | 12-10-2015 |
| 20150364452 | LED Light-Emitting Device - Provided is a LED light-emitting device including: a carrier, which is a transparent body, and on a carrying surface of which conductors are provided; a plurality of LED chips, which are electrically connected to the conductors by way of eutectic bonding, so as to realize electrical connection among the plurality of LED chips; an encapsulation structural member, which is a transparent body and encapsulates on the periphery of the carrier and the LED chips; and a pair of electrodes, wherein positive electrode/negative electrodes in the pair of electrodes are electrically connected to the LED chips located at the most upstream/most downstream of a current transmission in the plurality of LED chips by means of the conductors, and extend to the outside of the encapsulation structural member. | 12-17-2015 |
| 20150364650 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - The description discloses a lighting-emitting device and the method of manufacturing the same. A disclosed method of manufacturing a light-emitting device comprising providing a temporary substrate, forming a bonding pad on the temporary substrate, providing a first substrate, forming a light-emitting chip on the first substrate, connecting the light-emitting chip and the bonding pad layer. | 12-17-2015 |
| 20150364656 | LED PACKAGING STRUCTURE AND METHOD, DISPLAY DEVICE AND ILLUMINATING DEVICE - According to an LED packaging structure and packaging method thereof provided by the present disclosure, the LED may comprise a support having a cavity and at least one LED chip placed in the cavity. After the cavity is filled with a fluorescent adhesive, at least one concave lens structure may be formed at a light emitting side of the LED chip. | 12-17-2015 |
| 20150364663 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device includes a case including a recessed portion, a lead frame that is integrally molded with the case so as to be exposed on a bottom of the recessed portion and that includes separated first and second regions, a conductive paste film formed on the bottom of the recessed portion in a region between the first and second regions, a first flip-chip light-emitting element including first and second electrodes that are electrically connected to the first region and the conductive paste film, respectively, and a second flip-chip light-emitting element including third and fourth electrodes that are electrically connected to the second region and the conductive paste film, respectively. | 12-17-2015 |
| 20150364721 | DISPLAY DEVICE - A display device includes a first substrate, a light emitting element located on the first substrate, a second substrate having dampproofness and facing the first substrate, a first barrier layer located on the first substrate and having a higher level of dampproofness than the dampproofness of the second substrate, an organic layer located on the first barrier layer at a position facing the light emitting element, and a second barrier layer located on the organic layer and having a higher level of dampproofness than the dampproofness of the second substrate. | 12-17-2015 |
| 20150371974 | MICRO ASSEMBLED LED DISPLAYS AND LIGHTING ELEMENTS - The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible. | 12-24-2015 |
| 20150371975 | LED MODULE WITH HERMETIC SEAL OF WAVELENGTH CONVERSION MATERIAL - An LED module includes a substrate having a high thermal conductivity and at least one LED die mounted on the substrate. A wavelength conversion material, such as phosphor or quantum dots in a binder, has a very low thermal conductivity and is formed to have a relatively high volume and low concentration over the LED die so that the phosphor or quantum dots conduct little heat from the LED die. A transparent top plate, having a high thermal conductivity, is positioned over the wavelength conversion material, and a hermetic seal is formed between the top plate and the substrate surrounding the wavelength conversion material. The LED die is located in a cavity in either the substrate or the top plate. In this way, the temperature of the wavelength conversion material is kept well below the temperature of the LED die. The sealing is done in a wafer level process. | 12-24-2015 |
| 20150372052 | MICRO ASSEMBLED LED DISPLAYS AND LIGHTING ELEMENTS - The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible. | 12-24-2015 |
| 20150372054 | MONOLITHIC SEMICONDUCTOR CHIP ARRAY - A semiconductor chip ( | 12-24-2015 |
| 20150380461 | P-N JUNCTION OPTOELECTRONIC DEVICE FOR IONIZING DOPANTS BY FIELD EFFECT - An optoelectronic device comprising a mesa structure including:
| 12-31-2015 |
| 20150380473 | PORTABLE ELECTRONIC APPARATUS - A portable electronic apparatus comprises a substrate comprising a first surface and a second surface; a plurality of pixel electrodes arranged over the first surface of the substrate; a pixel-defining layer arranged over the first surface of the substrate such that at least a portion of each of the plurality of pixel electrodes is exposed; a plurality of protrusions formed over the pixel-defining layer; and an electronic component arranged over the second surface of the substrate and attached to the substrate, the electronic component having a polygonal shaped surface facing and substantially parallel to the second surface of the substrate. When viewed in a direction perpendicular to the second surface, imaginary straight lines that pass the plurality of protrusions are substantially parallel to at least one among sides of the polygonal shaped surface and do not pass the exposed portions of the plurality of pixel electrodes. | 12-31-2015 |
| 20150380610 | LIGHT EMITTING STRUCTURE AND MOUNT - In a method according to embodiments of the invention, a light emitting structure comprising a plurality of light emitting diodes (LEDs) is provided. Each LED includes a p-contact and n-contact. A first mount and a second mount are provided. Each mount includes anode pads and cathode pads. The anode pads are aligned with the p-contacts and the cathode pads are aligned with the n-contacts. The method further includes mounting the light emitting structure on one of the first and second mounts. An electrical connection on the first mount between the plurality of LEDs differs from an electrical connection on the second mount between the plurality of LEDs. The first mount is operated at a different voltage than the second mount. | 12-31-2015 |
| 20150380616 | BATWING LED WITH REMOTE PHOSPHOR CONFIGURATION - A lens is formed over one or more light-emitting devices disposed over a substrate. The lens includes a trench that circumferentially surrounds the one or more light-emitting devices. The trench is filled with a phosphor-containing material. | 12-31-2015 |
| 20150380617 | SEMICONDUCTOR LIGHT EMITTING DEVICE LAMP THAT EMITS LIGHT AT LARGE ANGLES - Embodiments of the invention include a plurality of semiconductor light emitting diodes attached to a mount. A plurality of lenses are disposed over the plurality of semiconductor light emitting diodes. A lens disposed over a semiconductor light emitting diode proximate an edge of the mount is rotationally asymmetrical and is shaped such that for a portion of the lens light emitted at an intensity that is half a maximum intensity is emitted at an angle of at least 70° relative to a normal to a top surface of the semiconductor light emitting diode. | 12-31-2015 |
| 20150380618 | FLIP CHIP PACKAGE STRUCTURE AND WAFER LEVEL PACKAGE STRUCTURE - A flip chip package structure includes a package base and a LED chip. The package base includes a first substrate, a first and a second electrodes disposed on the first substrate and a bonding layer disposed on the first substrate. The LED chip is flipped on the package base and includes an epitaxy layer, a third and a fourth electrodes disposed on the epitaxy layer and contacting the first and the second electrodes, a second insulating layer disposed between the third and the fourth electrodes, and a plurality of bonding pillars disposed on the second insulating layer and contacting the bonding layer. A minimum interval between the bonding layer, the first and the second electrodes and a minimum interval between the bonding pillars, the second and the third electrodes are larger than a width of each bonding pillar. | 12-31-2015 |
| 20150380622 | LIGHT EMITTING DEVICE - A light emitting device has: a plurality of light emitting elements, a base having a first main surface and a second main surface on the opposite side from the first main surface, the base having conductive patterns disposed on the first main surface on which the light emitting elements are mounted, conductive patterns disposed on the second main surface, and a groove provided on the second main surface of the base corresponding to a space between the light emitting elements, and a light reflecting member that integrally covers side surfaces of the plurality of light emitting elements. | 12-31-2015 |
| 20160005720 | Method for Producing an Optoelectronic Device and Optoelectronic Device - A method for producing an optoelectronic device is specified. A housing base body is formed with a self-healing polymer material. A recess is found in the housing base body. The recess is confined by a bottom surface and at least one side wall which are formed at least in places by the plastic material of the base body. An optoelectronic semiconductor chip has a first main surface, a second main surface facing away from the first main surface and at least one side surface connecting the first main surface and the second main surface with each other. The optoelectronic semiconductor chip is placed in the recess, so that the first main surface is brought in contact with the bottom surface and the at least one side surface is brought in contact with the at least one side wall. | 01-07-2016 |
| 20160005721 | MICRO ASSEMBLED LED DISPLAYS AND LIGHTING ELEMENTS - The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible. | 01-07-2016 |
| 20160005723 | LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT INCLUDING THE SAME - Disclosed are a light emitting device package. The light emitting device package includes a body having recess; a first lead frame including a first and second portions on a first region of the body; a second lead frame including a third and fourth portions on a second region of the body; a third lead frame between the first and second lead frame. The body has a length of the first direction greater than a width of the second direction, wherein the second portion of the first lead frame extends toward the second lead frame and has a small width, and wherein the fourth portion of the second lead frame extends toward the first lead frame. A first light emitting device is disposed on the first portion of the first lead frame and a second light emitting device is disposed on the third portion of the second lead frame. | 01-07-2016 |
| 20160013165 | LIGHT EMITTING DEVICE | 01-14-2016 |
| 20160013166 | LIGHT EMITTING MODULE | 01-14-2016 |
| 20160013167 | LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE | 01-14-2016 |
| 20160013254 | DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE | 01-14-2016 |
| 20160013376 | LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME | 01-14-2016 |
| 20160020365 | OPTOELECTRONIC COMPONENT - An optoelectronic component includes a carrier substrate, a single optoelectronic semiconductor chip arranged on the carrier substrate, an emission surface that emits light radiation which is part of a front side of the optoelectronic component, and a reflective layer adjacent to the emission surface at the front side of the optoelectronic component, wherein the emission surface is arranged such that the emission surface forms a part of an edge of the front side of the optoelectronic component. | 01-21-2016 |
| 20160020370 | THIN FILM WITH MULTILAYER DIELECTRIC COATINGS FOR LIGHT EMITTING DIODE (LED) LEAD FRAME AND CHIP-ON-BOARD (COB) SUBSTRATE REFLECTOR - A light emitting diode (LED) package according to various embodiments can include a metal substrate having a surface roughness. A thin film coated reflector is applied to the metal substrate. At least one light emitting diode (LED) chip is mounted above at least a portion of the metal substrate. | 01-21-2016 |
| 20160020373 | Light-Emitting Device - A light-emitting device includes a base having an insulating part and a metal block; a light-emitting diode (LED) chip over the base; a water soluble paste between the LED chip and the base metal block for chip fixing and heat conduction; packaging glue covering the LED chip; and the LED chip bottom, water soluble paste and the base metal block form an all-metal thermal conducting path to achieve low a thermal resistance. | 01-21-2016 |
| 20160020394 | BACKPLANE PRINTING PROCESS AND DEVICE - A printing operation using a backplane having at least one topographical feature located in a non-display area of the backplane. Continuous liquid printing produces layers contacting the at least one topographical feature, and these layers each exhibit uniform thickness. Non-display areas of the backplane are subsequently removed after completion of the printing operation to yield uniform layers within display areas of the backplane. | 01-21-2016 |
| 20160020428 | FLAT PANEL DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A flat panel display device provides a sealing structure for comprising and sealing a display unit disposed in a first region on a substrate. The display unit includes the first region and a second region, and a barrier is disposed in the first region on the substrate, on an outer side of the display unit, and adjacent to the second region. The sealing structure contacts the barrier, and includes at least one first layer of an inorganic material and at least one second layer of an organic material. A method of manufacturing the flat panel display device is also disclosed. | 01-21-2016 |
| 20160026047 | DISPLAY DEVICE - In the technical field of display, a display device for solving the technical problem of H-block caused by the resistance of the wire on array is provided. The display device comprises a substrate, a gate driver circuit, and at least two chip on films for transmitting the gate driving signal. The display device further comprises at least two wirings, each chip on film being connected to the gate driver circuit through one of the wirings. The wirings each comprise a wire on array, and all or some of the wirings each further comprise a resistor in series connection with the wire on array thereof. The present disclosure can be applied to display devices, such as liquid crystal television, liquid crystal display, cell phone, and tablet PC, and the like. | 01-28-2016 |
| 20160027859 | DISPLAY APPARATUS - A display apparatus includes a first substrate including a first display region and a first non-display region, a first display device in the first display region of the first substrate, a second substrate including a second display region and a second non-display region, the second display region overlapping the first non-display region of the first substrate, and a second display device in the second display region of the second substrate. | 01-28-2016 |
| 20160027980 | Optoelectronic Semiconductor Chip and Optoelectronic Module - An optoelectronics semiconductor chip has a substrate and a semiconductor body arranged on the substrate and has a semiconductor layer sequence. The semiconductor layer sequence includes an active region arranged between a first semiconductor layer and a second semiconductor layer and is provided to generate or to receive radiation. The first semiconductor layer is electrically conductively connected to a first contact and to a second contact. The first contact is formed on a front side of the substrate, facing the semiconductor body. The second contact is formed on a rear side of the substrate, facing away from the semiconductor body. The first contact and the second contact are electrically conductively connected to each other. | 01-28-2016 |
| 20160027983 | LEAD FRAME AND LIGHT EMITTING DIODE PACKAGE HAVING THE SAME - An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way. | 01-28-2016 |
| 20160035710 | LIGHT-EMITTING DEVICE AND LIGHTING DEVICE PROVIDED WITH THE SAME - A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of LED chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate. The soldering electrode land is formed of a first conductive material having a function to prevent diffusion to a solder, and the connector connecting electrode land is formed of a second conductive material having a function to prevent oxidation. | 02-04-2016 |
| 20160035797 | DISPLAY DEVICE - Display of a display device is made less likely to appear divided when a plurality of display panels are used as one screen. Provided is a display device including two display units and a foldable housing that includes a joint portion between the two display units and supports the two display units. Each display unit includes a display panel including a display region and a non-display region and a support having a first surface overlapped with the display region and a second surface that meets the first surface and is overlapped with the non-display region. The two display units are placed in the housing in an opened state such that the first surfaces of the supports face the same direction and the second surfaces of the supports face each other. | 02-04-2016 |
| 20160035942 | LIGHT-EMITTING APPARATUS HAVING LIGHT-PERVIOUS PLATE - The present invention provides a light-emitting apparatus having light-pervious plate. A circuit layer is disposed on a substrate. The circuit layer is adjacent to the LEDs, so that the LEDs can be connected electrically to the circuit layer. In addition, a frame is disposed on the circuit layer. A light-pervious plate is disposed on the frame and located in a light-emitting direction of the LEDs. Moreover, there is a gap between the light-pervious plate and the LEDs. | 02-04-2016 |
| 20160035949 | Color Tuning of Light-Emitting Devices - A variety of light-emitting devices for general illumination utilizing solid state light sources (e.g., light-emitting diodes) are disclosed. A light-emitting device can include a first light-emitting element (LEE) for emitting light having a first spectral composition, a second LEE for emitting light having a second spectral composition, and a scattering element surrounding at least in part the first and second LEEs to scatter light emitted from the first and second LEEs. The light-emitting device can also include electrical connections for connecting the first and second LEEs to a power source, where the electrical connections are arranged such that power to the first LEE is separately adjustable relative to power to the second LEE. | 02-04-2016 |
| 20160035978 | Display Module Manufacturing Method and Display Module - The present invention provides a manufacturing method of a display module, including a step of disposing a substrate on a transparent carrier plate, wherein the substrate has a bottom surface and a supporting surface opposite to the bottom surface; the bottom surface is attached to the transparent carrier plate and includes a first area and a second area. A step of performing a display elements manufacturing process on the supporting surface. A step of etching the first area by a first energy having a first energy density passing through the transparent carrier plate to separate the first area from the transparent carrier plate. A step of etching the second area by a second energy having a second energy density passing through the transparent carrier plate to separate the second area from the transparent carrier plate, wherein the second energy density is greater than the first energy density. A step of separating the substrate from the transparent carrier plate. | 02-04-2016 |
| 20160043062 | LIGHT SOURCE DEVICE - A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate. | 02-11-2016 |
| 20160043063 | LIGHT EMITTING DEVICE - The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance. | 02-11-2016 |
| 20160043283 | LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND LIGHT-EMITTING ELEMENT MODULE - There are provided a light-emitting element mounting substrate which exhibits high reflectivity, and a light-emitting module having high reliability and high luminance. A light-emitting element mounting substrate includes an alumina sintered body containing alumina crystal, zirconia crystal, and grain boundary phase, wherein an intensity ratio I | 02-11-2016 |
| 20160043284 | LIGHT EMITTING DEVICE AND LIGHT SOURCE MODULE - A light emitting device, has: a light emitting element; a substrate having a first main surface on which the light emitting element is mounted, and recesses on side surfaces adjacent to the first main surface, a cap covering the light emitting element, and having a light-transmissive member and a metal frame that supports the light-transmissive member and has side pieces extending toward the substrate from above the first main surface of the substrate, and tabs that is bended and extend from the side pieces and housed a part thereof in the recesses of the substrate. | 02-11-2016 |
| 20160043291 | LIGHT-EMITTING SEMICONDUCTOR COMPONENT - An optoelectronic component includes a carrier including a mounting surface, at least one light-emitting element arranged on the mounting surface and electrically conductively connected to the carrier, at least one reinforcing body integrated in the optoelectronic component, a housing consisting of a housing encapsulation compound or a housing molding compound, wherein the light emitting component is arranged in an emitter cavity of the housing, and a reinforcing body cavity in which the reinforcing body is arranged fully or partially encapsulated or encased with a reinforcing body encapsulation compound. | 02-11-2016 |
| 20160043337 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A display device includes a display panel, a top member, and a bottom member. The top member is disposed on the display panel, and has a first groove region where at least a portion of an upper surface of the display panel is exposed. The bottom member is disposed under the display panel, and has a second groove region where at least a portion of a lower surface of the display panel is exposed. The first and second groove regions are located at a bending region of the display device. | 02-11-2016 |
| 20160049387 | HIGH VOLTAGE SOLID-STATE TRANSDUCERS AND SOLID-STATE TRANSDUCER ARRAYS HAVING ELECTRICAL CROSS-CONNECTIONS AND ASSOCIATED SYSTEMS AND METHODS - Solid-state transducer (“SST”) dies and SST arrays having electrical cross-connections are disclosed herein. An array of SST dies in accordance with a particular embodiment can include a first terminal, a second terminal and a plurality of SST dies coupled between the first and second terminals with at least a pair of the SST dies being coupled in parallel. The plurality of SST dies can individually include a plurality of junctions coupled in series with an interconnection between each individual junction. Additionally, the individual SST dies can have a cross-connection contact coupled to the interconnection. In one embodiment, the array can further include a cross-connection between the cross-connection contacts on the pair of the SST dies. | 02-18-2016 |
| 20160049388 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device. | 02-18-2016 |
| 20160049557 | Light-Emitting Diode and Fabrication Method Thereof - A light emitting diode includes: a substrate of front and back main surfaces; a V-shaped groove, which has a reflecting surface, formed over front surface of the conductive substrate; a light-emitting epitaxial layer, the margin of which has its vertical projection between the bottom and the inner margin of the V-shaped groove, formed over the substrate, so that light emitted from the light-emitting epitaxial layer margin is incident to the mirror surface of the V-shaped groove and emits outwards. This structure can effectively improve extraction efficiency of device and control path of light at peripheral region of the light-emitting epitaxial layer. | 02-18-2016 |
| 20160049612 | DISPLAY DEVICE - A display device includes a first substrate, a pixel defining layer on the first substrate, the pixel defining layer defining a pixel region on the first substrate, a first electrode on the pixel region, a light emitting layer on the first electrode, a second electrode on the light emitting layer, a second substrate facing the first substrate, and a light scattering layer overlapping the pixel defining layer, the light scattering layer having a non-overlapping relationship with the light emitting layer. | 02-18-2016 |
| 20160056204 | ACTIVE MATRIX DISPLAY PANEL WITH GROUND TIE LINES - A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area. | 02-25-2016 |
| 20160056345 | LIGHT EMITTING ELEMENT PACKAGE - A light-emitting element package, according to one embodiment of the present invention, comprises: a circuit board including first and second regions having different heights; light-emitting elements respectively disposed in the first and second regions; and phosphor layers respectively disposed on the light-emitting elements, wherein the light-emitting elements are disposed within a 100-μm distance in the horizontal direction. | 02-25-2016 |
| 20160056353 | DEVICES AND METHODS INCLUDING AN LED AND REFLECTIVE DIE ATTACH MATERIAL - Devices and methods including an LED and reflective die attach material are described herein. The devices can include a reflective substrate (e.g., a substrate that includes a silver layer) to which one or more LED die are attached using the die attach material. The die attach material extends beyond the periphery of the LED die to cover an area of the substrate surface. | 02-25-2016 |
| 20160056354 | LED PACKAGES USING HIGHLY REFLECTIVE DIE ATTACH MATERIAL AND ENHANCED REFLECTIVE SUBSTRATES - Methods and apparatus are provided to improve long-term reliability of LED packages using reflective opaque die attach (DA) material. In one novel aspect, a protected area surrounding edges of the LED is determined. The DA is applied to the determined protected area by a dispense process, a stamping process, or a screen printing process, such that the effect of temperature degradation is reduced. A heat distribution model is used to determine the protected area, which is between edges of the LED and a predefined isothermal line where the temperature is 1/e that of the temperature at edges of the LED. In another embodiment, the protected area is further based on a spreading ratio of the substrate size to the LED size. In another novel aspect, with multiple LEDs in the LED package, the spreading ratio is further based on pitch distances to the immediate adjacent LEDs and the substrate boundary. | 02-25-2016 |
| 20160062018 | DISPLAY DEVICE - A display device comprises a display panel and an optical plate. The display panel comprises a surface comprising a display area and a non-display area, the display panel further comprising a bending portion that is bent and a non-bending portion that is not bent. The display panel comprises: a base substrate, an array of pixels formed over the base substrate, and electrically conductive lines disposed over the base substrate and electrically connecting the array of pixels to an exterior device, the electrically conductive lines comprising at least one extension formed in the bending portion and overlapping the non-display area when viewed in a thickness direction of the display panel. The optical plate is disposed over the display panel, and comprises: a first optical plate portion covering the display area, and a second optical plate portion covering the at least one extension of the electrically conductive lines. | 03-03-2016 |
| 20160064364 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - Disclosed is a display device including features that suppresses threshold voltage variation among the oxide thin-film transistors of an array substrate and a method for manufacturing the same. The display device includes a first COG block including sub-pixels configured to receive an output signal from a first drive integrated circuit positioned in a first COG area; a second COG block including sub-pixels configured to receive an output signal from a second drive integrated circuit positioned in a second COG area; and an equipotential line extended from the first COG area to the second COG area. | 03-03-2016 |
| 20160064615 | DISPLAY DEVICE - A display device includes a substrate, and a plurality of surface-mounted LEDs which are provided in a matrix pattern on a front surface side of the substrate. A plurality of eave members are provided between rows of the plurality of surface-mounted LEDs on the front surface side of the substrate. A plurality of connecting members are provided between columns of the plurality of surface-mounted LEDs on the front surface side of the substrate. A waterproof resin is provided in a space surrounded by the plurality of eave members and the plurality of connecting members so as to expose front surfaces of the plurality of surface-mounted LEDs and front surfaces of the plurality of connecting members. The plurality of connecting members are formed with a wide width on a front surface side and formed with a narrow width on a rear surface side. | 03-03-2016 |
| 20160064620 | LIGHT EMITTING DEVICE FOR ILLUMINATING PLANTS - A spectrally adapted light emitting device for illuminating plants includes at least one semiconductor light-emitting diode (LED), at least one light conversion element for down-converting a portion of light emitted at the first wavelength to at least a second wavelength between 600 nm-680 nm, and at least one scattering device to diffuse light within the light emitting device. The at least one LED is configured to emit at least a first wavelength between 400 nm and 480 nm. The spectral light output from the spectrally adapted light emitting device is bi-modal with wavelengths in a range of 400 nm and 800 nm including a first local maximum between 400 nm and 480 nm and a second local maximum between 600 nm-680 nm with a local minimum between the first local maximum and the second local maximum. | 03-03-2016 |
| 20160064624 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE - A light emitting device package may include: a package board; a semiconductor light emitting device disposed on the package board; and a color characteristics converting unit having a resin including a wavelength conversion material converting light emitted from the semiconductor light emitting device into light of a different wavelength and glass powder having a glass composition with a rare earth element added thereto and filtering light within a particular wavelength band, and disposed on a path on which light emitted from the semiconductor light emitting device travels. | 03-03-2016 |
| 20160064629 | LED PACKAGE AND MANUFACTURING METHOD THEREOF - A light emitting diode package includes a substrate, several light emitting diodes mounted on the substrate, and a package member enveloping the light emitting diodes. The light emitting diodes are electrically coupled to the substrate. The package member includes at least two layers, the first layer and the second layer. The first layer is spread on the substrate and completely covers the light emitting diodes and the wires. The second layer is formed on the first layer. Fluidity of colloid forming the second layer is worse than that of the first layer. A method is also provided to manufacture the present light emitting diode package. | 03-03-2016 |
| 20160064632 | LIGHT-EMITTING DEVICE - A light-emitting device comprises a substrate; a plurality of light-emitting diodes formed on the substrate, wherein each of the plurality of light-emitting diodes comprises a first conductivity type layer, an active layer on the first conductivity type layer, and a second conductivity type layer on the active layer; a reflective layer surrounding a sidewall of each of the plurality of light-emitting diodes; and a top electrode formed on the reflective layer and the plurality of light-emitting diodes. | 03-03-2016 |
| 20160071827 | MICRO DEVICE WITH STABILIZATION POST - A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface. | 03-10-2016 |
| 20160071830 | LIGHT EMITTING DEVICE - A light emitting device includes a substrate having a top surface, upper and lower metal layers, multiple LED chips, at least one Zener diode, multiple conductive wires and an encapsulant. The top surface includes a central region bounded by an imaginary boundary with a profile conforming to an outline of a circle stacked with a polygon. The central region has a die bonding area corresponding to the circle, and at least one polygonal extension area formed outside the die bonding area. The upper metal layer includes multiple conducting pads surrounding the central region. The LED chips are disposed on the die bonding area. The Zener diode is disposed on the polygonal extension area. The encapsulant is disposed on the substrate and covers the LED chips. | 03-10-2016 |
| 20160072024 | LIGHTING APPARATUS - A lighting apparatus includes a substrate, a plurality of light-emitting dies disposed on the substrate and spaced apart from one another, a continuous structure disposed over the substrate and covering the light-emitting dies within, and a filler. The light-emitting dies each are covered with an individual phosphor coating and the filler is between the continuous structure and the phosphor coating for each of the light-emitting dies. The lighting apparatus has a substantially white appearance when the plurality of light-emitting dies is turned off. | 03-10-2016 |
| 20160072027 | OPTICAL SYSTEMS FABRICATED BY PRINTING-BASED ASSEMBLY - Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity. | 03-10-2016 |
| 20160079320 | FLEXIBLE DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - Provided is a method of manufacturing a flexible display apparatus, the method including forming a sacrificial layer on a support substrate; forming a first material layer having a higher hydrogen concentration than the sacrificial layer on the sacrificial layer; forming a second material layer, preventing hydrogen diffusion from the first material layer to a flexible substrate, on the first material layer; forming the flexible substrate on the second material layer; forming a display layer on the flexible substrate; and irradiating a laser onto the support substrate to delaminate the sacrificial layer from the first material layer. | 03-17-2016 |
| 20160079321 | DISPLAY DEVICE - A display device includes an element substrate including a display area where a plurality of self-light-emitting elements are formed, and a driver IC disposed outside the display area in the element substrate. A first metal layer is disposed on the reverse side of the element substrate at a position opposite to the display area . A second metal layer is disposed with a space between the first metal layer and the second metal layer on the reverse side of the element substrate at a position opposite to the driver IC. | 03-17-2016 |
| 20160079324 | DISPLAY APPARATUS - A display apparatus includes a first substrate including an active area, a circuit area extending outwardly from the active area, and a cell seal area extending outwardly from the circuit area, a second substrate covering the first substrate, a sealing portion between the first substrate and the second substrate, the sealing portion covering at least a portion of the circuit area, a circuit line in the circuit area of the first substrate and electrically connected to a device in the active area of the first substrate, at least a portion of the sealing portion being on the circuit line, and a pixel definition layer between the sealing portion and the circuit line. | 03-17-2016 |
| 20160079485 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - According to one embodiment, a semiconductor light-emitting device includes a light-emitting element including a light-emitting layer; a first transparent body provided on the light-emitting element; a phosphor scattered in the first transparent body and emitting a light of a different wavelength from a radiated light of the light-emitting layer; and a second transparent body including a first transparent portion and a second transparent portion. The first transparent portion is surrounded by the first transparent body in an area on the light-emitting element. The second transparent portion is provided on the first transparent body and the first transparent portion. The second transparent portion includes an inclined portion provided on the first transparent portion. The inclined portion is inclined with respect to a first direction orthogonal to the light-emitting layer. | 03-17-2016 |
| 20160079486 | LIGHT EMITTING DEVICE - A light emitting device includes a light emitting element whose upper surface is a light extraction surface, and a light-transmissive member that has an upper surface and a lower surface, and covers the light extraction surface of the light emitting element. The light-transmissive member contains a phosphor. The upper surface and the lower surface of the light-transmissive member are both flat surfaces and parallel to each other. A side surface of the light-transmissive member has a protruding portion that protrudes to the side and has contact with the lower surface. | 03-17-2016 |
| 20160079490 | LIGHT EMITTING DEVICE COMPRISING WAVELENGTH CONVERTER - A light source ( | 03-17-2016 |
| 20160086928 | LIGHT-EMITTING DEVICE HAVING A PLURALITY OF CONCENTRIC LIGHT TRANSMITTING AREAS - The light-emitting device of the present invention includes LED chips provided on a ceramic substrate and a sealing material in which the LED chips are embedded. The sealing material contains a fluorescent substance and divided into a first fluorescent-substance-containing resin layer and a second fluorescent-substance-containing resin layer by a first resin ring and a second resin ring. | 03-24-2016 |
| 20160086929 | LIGHT EMITTING UNIT - A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop. | 03-24-2016 |
| 20160087003 | LIGHT EMITTING DEVICE - A light emitting device includes a substrate and a plurality of light emitting cells disposed on the substrate. Each light emitting cell includes a first semiconductor layer and a second semiconductor layer, an active layer between the first and the second semiconductors, a conductive material on the second semiconductor layer, an inclined surface, a first insulation layer overlaps each light emitting cell, an electrically conductive material overlaps the first insulation layer to couple two of the plurality of light emitting cells, and a second insulation layer overlaps the electrically conductive material. A light-transmitting material is used in both the first insulation layer and the second insulation layer. The inclined surface is continuous and has a slope of approximately 20° to approximately 80° from a horizontal plane based on the substrate. | 03-24-2016 |
| 20160087013 | DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME - A display device includes: a supporting member including a body, and a supporter rotatably coupled to a side surface of the body; a display substrate on the supporting member, the display substrate including a first region, and a second region at an outer periphery of the first region; an emission layer on the first region and the second region of the display substrate; a polarizer on the emission layer and on the first region of the display substrate; a touch panel on the polarizer; and a window on the touch panel. The supporter is configured to support the second region of the display substrate such that the second region of the substrate is in a bent-state in a non-display region of the device. | 03-24-2016 |
| 20160087161 | LIGHTING APPARATUS INCLUDING AN OPTOELECTRONIC COMPONENT - The invention relates to an illumination device ( | 03-24-2016 |
| 20160087173 | SELF-ALIGNED FLOATING MIRROR FOR CONTACT VIAS - Described herein are LED chips incorporating self-aligned floating mirror layers that can be configured with contact vias. These mirror layers can be utilized to reduce dim areas seen around the contact vias due to underlying material layers without the need for the mirror layer to be designed at some tolerance distance from the electrical via. This increases mirror area, eliminating lower light reflection in the proximity of the via and producing higher light output with greater light emission uniformity. In some embodiments, the mirror layer is formed with a contact via. This allows for a self-aligning process and results in the mirror layer extending substantially from the edge of the via. | 03-24-2016 |
| 20160087178 | LIGHT EMITTING DEVICE - Disclosed is a light emitting device. The light emitting device includes a body, first and second metal layers on a top surface of the body, a heat radiation plate disposed between the first and second metal layers and having a circular outline, a plurality of light emitting parts on the heat radiation plate, first and second bonding regions disposed on the first and second metal layers and electrically connected with the light emitting parts, and a molding member disposed on the heat radiation plate to cover the light emitting parts. Each of the light emitting parts includes a plurality of light emitting chips connected with each other, and a plurality of wires to electrically connect the light emitting chips with the first and second bonding regions, and the wires of each light emitting part are arranged a radial direction about a central of the heat radiation plate. | 03-24-2016 |
| 20160093666 | OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME - The invention relates to an optoelectronic device ( | 03-31-2016 |
| 20160099236 | LIGHT EMITTING LAMP - Disclosed is a light emitting lamp including a light source module including at least one light source and a light guide layer disposed on a substrate burying the at least one light source, and a housing accommodating the light source module, and the at least one light source includes a body having a cavity, a first lead frame including one end exposed to the cavity and the other end passing through the body and exposed to one surface of the body, a second lead frame including one end exposed to one portion of the surface of the body, the other end exposed to the another portion of the surface of the body, and an intermediate part exposed to the cavity, and at least one light emitting chip including a first semiconductor layer, an active layer and a second semiconductor layer, and disposed on the first lead frame. | 04-07-2016 |
| 20160099391 | LIGHT EMITTING DEVICE - A light emitting device includes: a mounting board; an adhesive member disposed on the mounting board and having a first surface adjacent to the mounting board and a second surface opposing the first surface; and a light emitting element disposed on the second surface of the adhesive member. The second surface of the adhesive member may have a first region on which the light emitting element is disposed and a second region on which a scattering pattern is provided to scatter light emitted by the light emitting element. | 04-07-2016 |
| 20160099435 | DISPLAY DEVICE - A display device comprises a first substrate including a first top portion, a first sidewall portion and a first bent portion, a second substrate including a second top portion, a second sidewall portion and a second bent portion, a display element and a packaging material. The first bent portion is disposed between the first top portion and the first sidewall portion. The second substrate is separated from the first substrate by a predetermined distance to form an accommodating space. The second top portion is disposed corresponding to the first top portion. The second bent portion is disposed between the second top portion and the second sidewall portion. The display element is disposed in the accommodating space. The packaging material is disposed in the accommodating space and corresponding to the first sidewall portion and the second sidewall portion. | 04-07-2016 |
| 20160104696 | TECHNIQUES FOR TILING ARRAYS OF PIXEL ELEMENTS AND FABRICATING HYBRIDIZED TILES - A first substrate having an array of emitters or detectors may be joined by bump bonding with a second substrate having read-in (RIIC) or read-out (ROIC) circuitry. After the two substrates are joined, the resulting assembly may be singulated to form sub-arrays such as tiles sub-arrays having pixel elements which may be arranged on a routing layer or carrier to form a larger array. Edge features of the tiles may provide for physical alignment, mechanical attachment and chip-to-chip communication. The pixel elements may be thermal emitter elements for IR image projectors, thermal detector elements for microbolometers, LED-based emitters, or quantum photon detectors such as those found in visible, infrared and ultraviolet FPAs (focal plane arrays), and the like. | 04-14-2016 |
| 20160104823 | ENGINEERED-PHOSPHOR LED PACKAGES AND RELATED METHODS - In accordance with certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence. | 04-14-2016 |
| 20160104863 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A display device is disclosed. In one aspect, the device includes first and second substrates each including a display area and a non-display area around the display area, a plurality of pixels formed in the display area of the first substrate and an internal circuit unit formed in the non-display area of the first substrate and electrically connected to the pixels. The device further includes a sealing member formed between the non-display areas of the first and second substrates to surround the display areas. The sealing member includes a first portion and a second portion, the second portion surrounded by the first portion and at least partially overlapping the internal circuit unit, and a groove is formed in the second substrate at a position corresponding to the second portion of the sealing member. | 04-14-2016 |
| 20160111400 | LIGHT EMITTING DEVICE - A flip chip light emitting diode includes a plurality of light emitting diodes and an encapsulation covering the plurality of light emitting diodes. Each of light emitting diode has a P electrode and an N electrode which are exposed out of the encapsulation. | 04-21-2016 |
| 20160111402 | LIGHT EMITTING DEVICE - There is presented a light emitting device, having plural light emitting elements disposed on a substrate, in which a protection element, such as a zener diode, can be disposed at an appropriate position. The light emitting device includes: a substrate; a light emitting section having plural light emitting elements disposed in a mounting area on the substrate; a positive electrode and negative electrode each having a pad section and wiring section to apply voltage to the light emitting section through the wiring sections; a protection element disposed at one of the positive electrode and negative electrode and electrically connected with the other one electrode; and a light reflecting resin formed on the substrate such as to cover at least the wiring sections and the protection element, wherein the wiring sections are formed along the periphery of the mounting area such that one end portions thereof are adjacent to each other. | 04-21-2016 |
| 20160111476 | PIXEL ARRANGEMENT OF COLOR DISPLAY PANEL - A pixel arrangement of color display panel includes a plurality of white sub-pixels extending along a first direction and forming a plurality of white sub-pixel columns and a plurality of first sub-pixels, second sub-pixels and third sub-pixels disposed between the white sub-pixel columns to respectively provide a first color light, a second color light and a third color light. The first, second, third and white sub-pixels respectively have a first length, a second length, a third length and a fourth length in the first direction. The first sub-pixels, the second sub-pixels and the third sub-pixels are arranged in a specific sequence. The first length is equal to the second length, the second length is equal to the third length, and the fourth length is greater than the first length. | 04-21-2016 |
| 20160111607 | PHOSPHOR SHEET, LIGHT-EMITTING DEVICE HAVING THE PHOSPHOR SHEET AND METHOD OF MANUFACTURING THE SAME - A light-emitting device includes a substrate including a first electrode and a second electrode, a light-emitting diode (LED) chip electrically connected to the first and the second electrodes, and a phosphor sheet disposed on an upper surface of the LED chip, a first transparent part disposed under the phosphor sheet, and a second transparent part disposed between the phosphor sheet and the LED chip. The first transparent part contacts the second transparent part. | 04-21-2016 |
| 20160118547 | LIGHT-EMITTING DEVICE AND METHOD OF PRODUCING THE SAME - A light-emitting device of the present invention includes a plurality of first mounting bonding layers that are formed of a metal on a mounting substrate and disposed separately from each other in an island shape, and a plurality of light-emitting elements that are provided on the first mounting bonding layers, respectively. Each of the light-emitting elements includes a columnar support that is mounted on the first mounting bonding layer, and a light-emitting unit that is located on the top face of the support. Each of the supports has a protrusion at a portion closer to the top face on a side face of the support. | 04-28-2016 |
| 20160118548 | LIGHT EMITTING DEVICE - A light emitting device has a plurality of light emitting elements that are arranged with gaps between the devices on a mounting board in a first direction, a wavelength-conversion member that covers the plurality of light emitting elements, a light reflective resin. Each light emitting element has an n-type semiconductor layer, an active layer provided in a part of the n-type semiconductor layer, and a p-type semiconductor layer provided on the active layer. In a second direction which is perpendicular to the first direction, an n-side electrodes are provided at least in regions at both ends of the n-type semiconductor layer, and a p-side electrode is provided on the surface of the p-type semiconductor layer, and wherein in the second direction, the wavelength-conversion member is positioned to approximately align both sides with both active layer side faces, or to dispose its sides outward of the active layer side faces. | 04-28-2016 |
| 20160118556 | LIGHT-EMITTING DEVICE WITH LIGHT SCATTERING LAYER - In one embodiment, a light-emitting device having a reflector, a light source die, a light scattering member, a first encapsulant, and a second encapsulant is disclosed. The light scattering member may be configured to scatter light emitted from the light source die, before the light being transmitted into the second encapsulant where a lens surface is configured to collimate the light towards a first direction. The light scattering member may be light-scattering particles distributed uniformly within the first encapsulant, a roughened surface of the first encapsulant, and a deposited light scattering layer on the first encapsulant, air bubbles, or a substantially flat layer. The light scattering member may be provided outside a reflector cup. | 04-28-2016 |
| 20160118561 | CIRCUIT STRUCTURE OF A FLIP-CHIP LIGHT EMITTING DIODE - The invention relates to a circuit structure of a flip-chip light emitting diode. It is provided for assembling of the flip-chip light emitting diode. Each flip-chip light emitting diode has at least two electrodes. The circuit structure defines a light emitting surface on a surface of a substrate, and the light emitting surface is provided with a plurality of reflective and conductive surfaces. The reflective and conductive surface is used for assembling of the electrodes of the flip-chip light emitting diode. At least one flip-chip light emitting diode is connected in series, parallel or series-parallel on the light emitting surface, wherein the total area of the reflective and conductive surface accounts for 80% to 99% of the area of the light emitting surface. Accordingly, the circuit structure of the flip-chip light emitting diode can efficiently improve the luminous efficiency of flip-chip light emitting diode device by adding a proportion of the area of the reflective conduction surfaces on the substrate of the flip-chip light emitting diode. | 04-28-2016 |
| 20160126223 | LIGHT-EMITTING DIODE LIGHTING DEVICE - A light-emitting diode (LED) lighting device includes a substrate, a first bottom electrode, a bottom transparent isolation layer, a first vertical LED, a second vertical LED, a first top transparent electrode, and a second top transparent electrode. The substrate has a first recess therein. The first bottom electrode is disposed in the first recess and is reflective. The first vertical LED and the second vertical LED are disposed in the first recess and on the first bottom electrode. The first bottom transparent isolation layer is disposed in the first recess. The first top transparent electrode is electrically connected to the first vertical LED. The second top transparent electrode is electrically connected to the second vertical LED. The first top transparent electrode, the second top transparent electrode, and the first bottom electrode cooperate to electrically connect the first vertical LED and the second vertical LED in series. | 05-05-2016 |
| 20160126287 | DISPLAY PANEL FOR COMPENSATING NEGATIVE POWER SUPPLY VOLTAGE, DISPLAY MODULE AND MOBILE DEVICE INCLUDING THE SAME - A display panel including: a cathode electrode formed in a cathode region of the display panel, the cathode electrode entirely covering an active region of the display panel a plurality of pixel units in columns and rows in the active region of the display panel; a ring-shaped edge negative voltage line formed in a ring-shaped edge portion of the cathode electrode configured to supply a negative power supply voltage to the cathode electrode; and a plurality of compensation negative voltage lines connected to the ring-shaped edge negative voltage line, the compensation negative voltage lines extending along a column direction of the display panel and arranged along a row direction of the display panel. | 05-05-2016 |
| 20160126430 | LIGHT-EMITTING DEVICE WITH HARDENED ENCAPSULANT ISLANDS - In one embodiment, a light-emitting device having a light source die, a substantially transparent encapsulant surrounding the light source die, and a second substantially transparent encapsulant at least partially covering the first substantially transparent encapsulant is disclosed. The second substantially transparent encapsulant may expose a portion of the first substantially transparent encapsulant. The second substantially transparent encapsulant may be less tacky, and may be hardened as compared to the first substantially transparent encapsulant. The second substantially transparent encapsulant may comprise a plurality of encapsulant islands that are distanced away from one another. In another embodiment, the light-emitting device may comprise a third substantially transparent encapsulant covering a portion of the first substantially transparent encapsulant that is exposed by the second substantially transparent encapsulant. | 05-05-2016 |
| 20160133611 | LIGHT EMITTING DEVICE - A light emitting device includes a substrate, a first light emitting element, a second light emitting element, a first conductive pattern, and a second conductive pattern. The first conductive pattern is provided on the substrate and includes a first element mounting portion and a first wire connecting portion. The second conductive pattern is provided on the substrate to form a first wiring gap between the first conductive pattern and the second conductive pattern. A first recess is provided between the first element mounting portion and the first wire connecting portion and is in communication with the first wiring gap. At least a part of an outer shape of the first element mounting portion is defined by the first wiring gap and the first recess on a third side of the first element mounting portion adjacent to the second conductive pattern. | 05-12-2016 |
| 20160133794 | OPTOELECTRONIC SEMICONDUCTOR CHIP - An optoelectronic semiconductor chip includes a multiplicity of active regions arranged at a distance from one another, and a continuous current spreading layer, wherein at least one of the active regions has a main extension direction, one of the active regions has a core region formed with a first semiconductor material, the active region has an active layer covering the core region at least in directions transversely with respect to the main extension direction of the active region, the active region has a cover layer formed with a second semiconductor material and covers the active layer at least in directions transversely with respect to the main extension direction of the active region, and the current spreading layer covers all cover layers of the active region. | 05-12-2016 |
| 20160133800 | LIGHT EMITTING APPARATUS AND PRODUCTION METHOD THEREOF - A light emitting apparatus includes an electrically insulating base member; a first electrically conductive pattern portion and a second electrically conductive pattern portion formed on an upper surface of the base member; a plurality of intermediate electrically conductive pattern portions arranged between the first and second electrically conductive pattern portions; at least one light emitting device mounted on at least one of the intermediate electrically conductive pattern portions; a protection element mounted on the first and second electrically conductive pattern portions; and a resin portion disposed around the at least one light emitting device such that (i) the first and second electrically conductive pattern portions are partially covered by the resin portion and partially exposed from the resin portion, and (ii) the protection element is covered by the resin portion. | 05-12-2016 |
| 20160133864 | DISPLAY DEVICE MANUFACTURE - A method of manufacturing a display device is provided which uses a sacrificial layer interposed between a carrier and a display device substrate. | 05-12-2016 |
| 20160133871 | FLEXIBLE DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - A flexible display apparatus includes a flexible substrate, a display layer disposed on one surface of the flexible substrate and including a plurality of pixels, graphene disposed on a surface opposing the one surface of the flexible substrate, and an encapsulation layer covering the display layer. | 05-12-2016 |
| 20160141286 | Carrier For An Optoelectronic Semiconductor Chip And Optoelectronic Component - A carrier ( | 05-19-2016 |
| 20160141332 | EMISSIVE DEVICE INCLUDING FIRST AND SECOND ADJACENT PIXELS SHARING THE SAME SEMICONDUCTOR LIGHT-EMITTING STACK - The emissive device includes first and second adjacent pixels ( | 05-19-2016 |
| 20160141452 | LIGHTING EMITTING DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE - The present invention discloses a light emitting device, a manufacturing method thereof and a display device. The light emitting device comprises a substrate. An anode layer, a functional layer and a cathode layer are provided above the substrate, and the functional layer is provided between the anode layer and the cathode layer. A transmission enhanced layer is further provided on the substrate. The transmission enhanced layer comprises a plurality of photonic crystal microstructures, so that light is refracted while transmitting through the transmission enhanced layer, so as to form light in different directions and thus to reduce an incident angle of light incident to the substrate. Therefore, the total reflection generated when light transmits through an interface between the substrate and the air is reduced, thereby improving luminous efficiency and reducing power loss. | 05-19-2016 |
| 20160141469 | OPTOELECTRONIC DEVICE WITH LIGHT-EMITTING DIODES - An optoelectronic device including an array of light-emitting diodes and photoluminescent blocks opposite at least part of the light-emitting diodes, each light-emitting diode having a lateral dimension smaller than 30 μm, each photoluminescent block including semiconductor crystals having an average size smaller than 1 μm, dispersed in a binding matrix. | 05-19-2016 |
| 20160148860 | LEADFRAME BASED LIGHT EMITTER COMPONENTS AND RELATED METHODS - Leadframe based light emitter components and methods are provided. In some aspects, a leadframe based light emitter component includes a leadframe element, an electrical device connected to a portion of the leadframe element, and a molded cup encasing portions of the leadframe element and the electrical device connected thereto. A method of providing a leadframe based light emitter component includes providing a leadframe element, connecting an electrical device to a portion of the leadframe element, and molding a body over portions of the leadframe element and the electrical device. | 05-26-2016 |
| 20160148911 | ULTRA-SMALL LED ELECTRODE ASSEMBLY AND METHOD FOR MANUFACTURING SAME - Provided are a nano-scale LED assembly and a method for manufacturing the same. First, a nano-scale LED device that is independently manufactured may be aligned and connected to two electrodes different from each other to solve a limitation in which a nano-scale LED device having a nano unit is coupled to two electrodes different from each other in a stand-up state. Also, since the LED device and the electrodes are disposed on the same plane, light extraction efficiency of the LED device may be improved. Furthermore, the number of nano-scale LED devices may be adjusted. Second, since the nano-scale LED device does not stand up to be three-dimensionally coupled to upper and lower electrodes, but lies to be coupled to two electrodes different from each other on the same plane, the light extraction efficiency may be very improved. Also, since a separate layer is formed on a surface of the LED device to prevent the LED device and the electrode from being electrically short-circuited, defects of the LED electrode assembly may be minimized. Also, in preparation for the occurrence of the very rare defects of the LED device, the plurality of LED devices may be connected to the electrode to maintain the original function of the nano-scale LED electrode assembly. | 05-26-2016 |
| 20160149093 | LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same. | 05-26-2016 |
| 20160149100 | LIGHT EMITTING DIODE CONSTRUCTIONS AND METHODS FOR MAKING THE SAME - Light emitting diode (LED) constructions comprise an LED having a pair of electrical contacts along a bottom surface. A lens is disposed over the LED and covers a portion of the LED bottom surface. A pair of electrical terminals is connected with respective LED contacts, are sized larger than the contacts, and connect with the lens material along the LED bottom surface. A wavelength converting material may be interposed between the LED and the lens. LED constructions may comprise a number of LEDs, where the light emitted by each LED differs from one another by about 2.5 nm or less. LED constructions are made by attaching 2 or more LEDs to a common wafer by adhesive layer, forming a lens on a wafer level over each LED to provide a rigid structure, removing the common wafer, forming the electrical contacts on a wafer level, and then separating the LEDs. | 05-26-2016 |
| 20160149104 | LIGHT EMITTING DIODE (LED) COMPONENTS INCLUDING LED DIES THAT ARE DIRECTLY ATTACHED TO LEAD FRAMES, AND METHODS OF FABRICATING SAME - A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described. | 05-26-2016 |
| 20160155784 | METHOD FOR FABRICATING DISPLAY DEVICE AND DISPLAY DEVICE | 06-02-2016 |
| 20160155899 | LIGHT EMITTING DIODE DEVICE HAVING CONNECTED LIGHT EMITTING DIODE ELEMENTS AND METHOD OF FABRICATING THE SAME | 06-02-2016 |
| 20160155910 | SURFACE-TEXTURED ENCAPSULATIONS FOR USE WITH LIGHT EMITTING DIODES | 06-02-2016 |
| 20160155913 | LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME | 06-02-2016 |
| 20160155967 | FLEXIBLE DISPLAY DEVICE | 06-02-2016 |
| 20160163921 | LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME - A light emitting diode including a first light emitting cell and a second light emitting cell disposed on a substrate and spaced apart from each other to expose a surface of the substrate, a first transparent layer disposed on and electrically connected to the first light emitting cell, first connection section disposed on a portion of the first light emitting cell, a second connection section disposed on a portion of the second light emitting cell, a first interconnection and a second interconnection electrically connecting the first light emitting cell and the second light emitting cell, and an insulation layer disposed between the first and second interconnections and a side surface of the first light emitting cell. | 06-09-2016 |
| 20160172341 | LIGHT EMITTING DEVICE | 06-16-2016 |
| 20160172551 | LED Lens Design with More Uniform Color-Over-Angle Emission | 06-16-2016 |
| 20160172554 | PC LED WITH OPTICAL ELEMENT AND WITHOUT SSUBSTRATE CARRIER | 06-16-2016 |
| 20160178812 | OPTICAL FILM AND DISPLAY ASSEMBLY APPLYING THE SAME | 06-23-2016 |
| 20160178952 | DISPLAY DEVICE | 06-23-2016 |
| 20160181332 | LIGHT EMITTING DISPLAY DEVICE | 06-23-2016 |
| 20160181484 | OXYNITRIDE-BASED PHOSPHOR AND WHITE LIGHT EMITTING DEVICE INCLUDING THE SAME | 06-23-2016 |
| 20160181488 | SEMICONDUCTOR LIGHT EMITTING DEVICE | 06-23-2016 |
| 20160187733 | DISPLAY PANEL AND DISPLAY DEVICE - A display panel having a plurality of pixel units arranged in an array includes an array substrate and a color filter substrate which are arranged opposite to each other. The array substrate includes a first electrode, and multiple second electrodes arranged corresponding to the respective pixel units, the first electrode and second electrodes are insulated from each other by an insulation layer; and the color filter substrate includes multiple black matrixes and multiple color resists arranged corresponding to the respective pixel units. The array substrate further includes multiple third electrodes arranged in boundary areas between two adjacent pixel units and opposite to the black matrixes. The third electrodes and the first electrode are disposed in different layers and have a same potential. | 06-30-2016 |
| 20160190074 | FUSE PACKAGE AND LIGHT EMITTING DEVICE MODULE USING THE SAME - A fuse package may include a first lead frame, a second lead frame spaced apart from the first lead frame, a package body configured to cover at least a portion of the first lead frame and at least a portion of the second lead frame, a wire fuse mounted on the first lead frame and the second lead frame, and configured to electrically connect the two lead frames, and an encapsulator configured to cover the wire fuse. | 06-30-2016 |
| 20160190401 | SHAPED PHOSPHOR TO REDUCE REPEATED REFLECTIONS - Pre-formed wavelength conversion elements are attached to light emitting elements and are shaped to reduce repeated occurrences of total internal reflection. The sides of the shaped elements may be sloped or otherwise shaped so as to introduce a change in the angle of incidence of reflected light upon the light extraction surface of the wavelength conversion element. The pre-formed wavelength conversion elements may be configured to extend over an array of light emitting elements, with features between the light emitting elements that are shaped to reduce repeated occurrences of total internal reflection. | 06-30-2016 |
| 20160190405 | LIGHT EMITTING DEVICE - A light emitting device includes a base, at least one light emitting element, and a light transmissive sealing member. The base has a conductor wiring. The at least one light emitting element is mounted on the base. The at least one light emitting element is electrically connected to the conductor wiring. The light transmissive sealing member includes a light diffusion material. The light transmissive sealing member covers the at least one light emitting element. The light transmissive sealing member has a projection shape. The projection shape has a substantially circular bottom surface facing the base and a height in a light axis direction of the at least one light emitting element. The height is greater than a diameter of the substantially circular bottom surface. | 06-30-2016 |
| 20160190408 | Light emitting device - A light emitting device includes: a substrate having a base body and a plurality of wiring parts provided on at least one side of the base body; a first covering part that covers part of the wiring parts; a plurality of light emitting elements that are disposed on the wiring parts exposed from the first covering part; a second covering part that is disposed on the first covering part surrounding the light emitting elements and is formed from a material whose reflectivity is higher than that of the first covering part, and a resin component that seals the substrate and the light emitting elements, and is disposed in contact with the first covering part and the second covering part. | 06-30-2016 |
| 20160190411 | CHIP-ON-BOARD TYPE LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR MANUFACTURING SAME - There are provided a chip-on-board type light emitting device package capable of improving structural reliability and heat-dissipating efficiency and reducing a manufacturing cost, and a method for manufacturing the same. The chip-on-board type light emitting device package includes: a dual frame including a base frame on which a plurality of light emitting devices are mounted and an electrode frame positioned above the base frame so as to be spaced apart from the base frame and including two electrodes separated from each other; and a molding part coupled to the dual frame so that the base frame and the electrode frame are spaced apart from each other and having an opening through which light generated in the plurality of light emitting devices is to be emitted, wherein the base frame has a through-hole through which the electrode frame is exposed. | 06-30-2016 |
| 20160190489 | FLEXIBLE DISPLAY DEVICE - A flexible display device, including a display panel for displaying an image; and a flexible substrate having a side on which the display panel is supported, the flexible substrate including a plastic film having at least one of a carbon material and a graphite material. | 06-30-2016 |
| 20160195761 | CURVED DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | 07-07-2016 |
| 20160197044 | METHOD AND APPARATUS THAT PROCESSES AN OPTOELECTRONIC COMPONENT | 07-07-2016 |
| 20160197061 | Packaging a Substrate with an LED into an Interconnect Structure Only Through Top Side Landing Pads on the Substrate | 07-07-2016 |
| 20160197239 | Flip-Chip Light Emitting Diode Chip | 07-07-2016 |
| 20160197250 | LIGHT EMITTING DEVICE | 07-07-2016 |
| 20160202392 | DISPLAY SUBSTRATE AND FABRICATION METHOD THEREOF, AND DISPLAY APPARATUS AND FABRICATION METHOD THEREOF | 07-14-2016 |
| 20160202517 | DISPLAY DEVICE AND ELECTRONIC APPARATUS | 07-14-2016 |
| 20160204375 | FLAT PANEL DISPLAY DEVICE | 07-14-2016 |
| 20160254244 | Systems and Methods Utilizing Anisotropic Conductive Adhesives | 09-01-2016 |
| 20160254253 | Method for Producing a Semiconductor Component and a Semiconductor Component | 09-01-2016 |
| 20160254254 | SEMICONDUCTOR LIGHT EMITTING DEVICE | 09-01-2016 |
| 20160254314 | LIGHT EMITTING DIODE | 09-01-2016 |
| 20160254424 | OPTOELECTRONIC LIGHTING DEVICE | 09-01-2016 |
| 20160254427 | Optoelectronic Component and Method for Securing Same | 09-01-2016 |
| 20160254429 | LIGHT EMITTING DEVICE | 09-01-2016 |
| 20160254482 | DISPLAY PANEL, PACKAGING METHOD THEREOF AND DISPLAY DEVICE | 09-01-2016 |
| 20160380037 | DISPLAY DEVICE - A display device includes a first pixel and a second pixel arranged in a first or a second direction, each of them has a pixel electrode, a contact hole under the pixel electrode, a bank on the pixel electrode, and an opening provided in the bank and on the pixel electrode. A first imaginary line connecting the center of the contact hole of a first pixel and the center of the contact hole of a second pixel is substantially parallel to the first direction or the second direction, a second imaginary line connecting the center of the opening of the first pixel and the center of the opening of the second pixel is substantially parallel to the first direction or the second direction, and each of straight-line sides of the openings of the plurality of pixels has an angle with respect to both of the first and the second direction. | 12-29-2016 |
| 20160380166 | Method for Producing an LED Module and LED Module - Various embodiments may relate to a method for producing an LED module, including providing a housing implemented as a hollow body, having an opening on a light exit side of the LED module, wherein the housing has a base side, arranged opposite to the light exit side, arranging a circuit board having one LED on the base side of the housing, pouring in one first base layer made of a curable material in a non-cured state through the opening into the housing, and pouring in a scattering layer made of a curable material in a non-cured state through the opening into the housing. The scattering layer is poured in onto the first base layer. The first base layer is not cured during the pouring in of the scattering layer, and after the pouring in of the scattering layer, the one first base layer and the scattering layer are cured. | 12-29-2016 |
| 20160380229 | DISPLAY DEVICE - A display device includes a substrate including a peripheral region folded back to face a rear surface of the substrate, and a counter region facing the peripheral region; and a filling member held between the peripheral region and the counter region. The substrate is folded such that the display device includes a first overlapping portion where a part of the peripheral region is bonded with the counter region with an adhesive material being provided therebetween; a second overlapping portion where a part of the peripheral region is in direct contact with the filling member; and a third overlapping portion where a part of the peripheral region is bonded with the filling member with an adhesive material being provided therebetween. | 12-29-2016 |
| 20170236760 | LIGHT-EMITTING DIODE LIGHTING DEVICE AND METHOD FOR REPAIRING THE SAME | 08-17-2017 |
| 20170236979 | LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING PACKAGE COMPRISING SAME | 08-17-2017 |
| 20170237032 | ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS | 08-17-2017 |
| 20170237033 | ELECTRO-OPTICAL APPARATUS AND ELECTRONIC DEVICE | 08-17-2017 |
| 20170237039 | ELECTROOPTICAL DEVICE, ELECTROOPTICAL DEVICE MANUFACTURING METHOD, AND ELECTRONIC APPARATUS | 08-17-2017 |
| 20180023779 | TERRESTRIAL VEHICLE LIGHT-EMITTING MODULE | 01-25-2018 |
| 20180026153 | LIGHT-EMITTING DEVICE | 01-25-2018 |
| 20180026229 | DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE | 01-25-2018 |
| 20190147778 | TRANSFER PRINTING SUBSTRATE AND METHOD FOR PRODUCING THE SAME | 05-16-2019 |
| 20190148188 | MICRO PICK AND BOND ASSEMBLY | 05-16-2019 |
| 20190148320 | Electronic element and electronic device comprising the same | 05-16-2019 |
| 20190148601 | LIGHT EMITTING DEVICE AND DISPLAY COMPRISING SAME | 05-16-2019 |
| 20190148610 | METHOD OF MANUFACTURING LIGHT EMITTING ELEMENT MOUNTING BASE MEMBER, AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE | 05-16-2019 |
| 20220139886 | LIGHT-EMITTING PACKAGE AND METHOD OF MANUFACTURING THE SAME - A light-emitting package includes an encapsulating member, a plurality of light-emitting components disposed in the encapsulating member, a plurality of first electrode pads, a plurality of second electrode pads, and a plurality of conductive connection structures. The encapsulating member has a first surface and a second surface opposite to each other. Each light-emitting component has a light-emitting surface exposed on the first surface. Both the first electrode pads and the second electrode pads are exposed on the second surface. A first bonding surface of each first electrode pad and a second bonding surface of each second electrode pad are both flush with the second surface. The light-emitting components disposed on the first electrode pads are electrically connected to the first electrode pads. The conductive connection structures passing through the encapsulating member are electrically connected to the light-emitting components and the second electrode pads. | 05-05-2022 |
| 20220139962 | DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - A display device includes a substrate including a first surface and a second surface, pixels and first lines disposed on the first surface of the substrate, a first protective layer disposed on the second surface of the substrate and overlapping the pixels and the first lines, via holes penetrating the substrate and the first protective layer and exposing an area of each of the first lines, second lines disposed on a surface of the first protective layer and electrically connected to the first lines through the via holes, respectively, and pads disposed on the surface of the first protective layer and electrically connected to the second lines, respectively. The first protective layer includes openings corresponding to the via holes and also includes a photoresist material. | 05-05-2022 |
| 20220140025 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A display device including a partition wall disposed on a substrate between a first electrode and a second electrode. The partition wall has an opening. A light emitting layer is disposed in the opening. An auxiliary layer having lyophobicity is disposed between the partition wall and the second electrode. | 05-05-2022 |
| 20220140182 | OPTOELECTRONIC DEVICE HAVING A DIODE MATRIX - An optoelectronic device including an array of axial diodes, each diode forming a resonant cavity having a standing electromagnetic wave forming therein, each light-emitting diode including an active area located substantially at the level of an extremum of the electromagnetic wave, the array forming a photonic crystal configured to maximize the intensity of the electromagnetic radiation supplied by the diode array. | 05-05-2022 |
