Entries |
Document | Title | Date |
20080203405 | Method for Preparing an Electric Circuit Comprising Multiple Leds - The invention relates to a method for preparing an electric circuit comprising a plurality of Light-Emitting Diodes (LEDs). First, a continuous layer of a first semiconductor material is provided. On this a first pattern of a material of a second semiconductor type is applied. Next, a substrate comprising a second pattern of at least one conducting layer ( | 08-28-2008 |
20080230791 | Optoelectronic device - An optoelectronic device such as a light-emitting diode chip is disclosed. It includes a substrate, a multi-layer epitaxial structure, a first metal electrode layer, a second metal electrode layer, a first bonding pad and a second bonding pad. The multi-layer epitaxial structure on the transparent substrate comprises a semiconductor layer of a first conductive type, an active layer, and a semiconductor layer of a second conductive type. The first bonding pad and the second bonding pad are on the same level. Furthermore, the first metal electrode layer can be patterned so the current is spread to the light-emitting diode chip uniformly. | 09-25-2008 |
20080277677 | LIGHT EMITTING DIODE ASSEMBLY AND LIGHT EMITTING DIODE DISPLAY DEVICE - An exemplary light emitting diode (LED) assembly includes a cover, a substrate, a LED unit, a first electrode terminal, and a second electrode terminal. The substrate includes a first surface and a second surface on an opposite side of the substrate thereto. The substrate and the cover cooperatively define a cavity. The LED unit is received in the cavity. The first and the second electrode terminals extend from the second surface. The first electrode terminal is electrically connected to one of a positive lead and a negative lead of the LED unit and the second electrode terminal is electrically connected to the other. The second electrode terminal includes a first electrode portion and a second electrode portion symmetrically arranged at opposite sides of the first electrode terminal. The first and the second electrode portions are at least partially symmetrical with respect to the first electrode terminal. | 11-13-2008 |
20090008656 | Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same - An LED chip package structure includes a ceramic substrate, a conductive unit, a hollow ceramic casing, many LED chips, and a package colloid. The ceramic substrate has a main body, many protrusions extended from the main body, many penetrating holes respectively penetrating through the protrusions, and many half through holes formed on a lateral side of the main body and respectively formed between each two protrusions. The conductive unit has many first conductive layers respectively formed on the protrusions, many second conductive layers respectively formed on inner surfaces of the half through holes and a bottom face of the main body, and many third conductive layers respectively filled in the penetrating holes. The hollow ceramic casing is fixed on the main body to form a receiving space. The LED chips is received in the receiving space. The package colloid is filled in the receiving space for covering the LED chips. | 01-08-2009 |
20090020770 | LED CHIP PACKAGE STRUCTURE WITH HIGH-EFFICIENCY LIGHT-EMITTING EFFECT AND METHOD OF PACKAGING THE SAME - An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips. | 01-22-2009 |
20090045418 | Light emitting diode (LED) with longitudinal package structure - The present invention provides erected LED package structure, which includes: a carrier substrate having a first surface, a second surface and a plurality of through holes passed through the first surface and the second surface of the carrier substrate, and the conductive material filled with each of the through holes; a LED having a semiconductor layer capable of the light emitting and an N electrode and a P electrode formed on the two sides of the semiconductor layer thereon; a first transparent carrier substrate having a metal layer thereon, in which the metal layer electrically connected to the N electrode of the LED and to the conductive material which is formed on the first surface of the carrier substrate; a second transparent carrier substrate having another metal layer thereon, in which another metal layer electrically connected to the P electrode of the LED and to another conductive material which is formed on the first surface of the carrier substrate; and a plurality of connecting elements electrically connected to the plurality of conductive material which is formed on the second surface of the carrier substrate. | 02-19-2009 |
20090206351 | SEMICONDUCTOR LIGHT EMITTING DEVICE - Embodiments provide a semiconductor light emitting device which comprises a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, a second conductive semiconductor layer on the active layer, and a plurality of third semiconductor structures spaced apart on the second conductive semiconductor layer. | 08-20-2009 |
20090230413 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface. | 09-17-2009 |
20090272991 | LIGHT EMITTING DIODE HAVING AlInGaP ACTIVE LAYER AND METHOD OF FABRICATING THE SAME - A light emitting diode having an AlInGaP active layer and a method of fabricating the same are disclosed. The light emitting diode includes a substrate. A plurality of light emitting cells are positioned to be spaced apart from one another, wherein each of the light emitting cells has a first conductive-type lower semiconductor layer, an AlInGaP active layer and a second conductive-type upper semiconductor layer. Meanwhile, a semi-insulating layer is interposed between the substrate and the light emitting cells. Further, wires connect the plurality of light emitting cells in series. Accordingly, it is possible to provide a light emitting diode, in which a plurality of light emitting cells are connected in series to one another through wires to be driven by an AC power source. | 11-05-2009 |
20100072496 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device (A | 03-25-2010 |
20100096647 | LIGHT OUTPUT DEVICE - A light output device comprises a substrate arrangement comprising first and second light transmissive substrates ( | 04-22-2010 |
20100096648 | AC LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME - The present invention relates to an AC light emitting diode. An object of the present invention is to provide an AC light emitting diode wherein various designs for enhancement of the intensity of light, prevention of flickering of light or the like become possible, while coming out of a unified method of always using only one metal wire with respect to one electrode when electrodes of adjacent light emitting cells are connected through metal wires. To this end, the present invention provides an AC light emitting diode comprising a substrate; bonding pads positioned on the substrate; a plurality of light emitting cells arranged in a matrix form on the substrate; and a wiring means electrically connecting the bonding pads and the plurality of light emitting cells, wherein the wiring means includes a plurality of metal wires connecting an electrode of one of the light emitting cells with electrodes of other electrodes adjacent to the one of the light emitting cells. | 04-22-2010 |
20100109028 | Vertical ACLED structure - This application related to an opto-electrical device, comprising a first ACLED having a first n-type semiconductor layer, a first light emitting layer, a first p-type semiconductor layer, a first p-type electrode and a first n-type electrode; a second ACLED having a second n-type semiconductor layer, a second light emitting layer, a second p-type semiconductor layer, a second p-type electrode and a second n-type electrode, wherein each of the first ACLED and the second ACLED are vertical stack structure and is connected in anti-parallel manner. | 05-06-2010 |
20100109029 | Semiconductor Light Emitting Device Packages Including Submounts - A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad. | 05-06-2010 |
20100117103 | Light-Emitting Module and Method of Manufacture for a Light-Emitting Module - A light-emitting module includes a supporting element, a number of optoelectronic semiconductor components mounted on the supporting element for the generation of electromagnetic radiation, and a metallic connecting layer by means of which the optoelectronic semiconductor components are supplied with operating voltage. An insulation layer is arranged in a region of the optoelectronic semiconductor components between the supporting element and the metallic connecting layer. The metallic connecting layer forms a light shade for the optoelectronic semiconductor components, so that the electromagnetic radiation is only emitted in a specified direction. | 05-13-2010 |
20100123146 | LIGHT-EMITTING DEVICE STRUCTURE AND SEMICONDUCTOR WAFER STRUCTURE WITH THE SAME - A light-emitting device structure comprises a substrate having a first region and a second region outside the first region, a first conductive type semiconductor layer positioned on the first region, a light-emitting structure positioned on the first conductive type semiconductor layer, a second conductive type semiconductor layer positioned on the light-emitting structure, and a wall structure positioned on the second region. | 05-20-2010 |
20100127284 | SEMICONDUCTOR LIGHT EMITTING DEVICE, ILLUMINATOIN MODULE, ILLUMINATION APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENT - A semiconductor light emitting device ( | 05-27-2010 |
20100155750 | Color correction for wafer level white LEDs - A method for fabricating a plurality of LED chips comprises providing a plurality of LEDs and forming a plurality of spacers each of which is on at least one of the LEDs. Coating the LEDs with a conversion material, each of the spacers reducing the amount of conversion material over its one of the LEDs. This reduction causes the plurality of LED chips to emit a wavelength of light in response to an electrical signal that is within a standard deviation of a target wavelength. LEDs, LED chips and LED chip wafers are fabricated using the method according to the present invention. One embodiment of an LED chip wafer according to the present invention comprises a plurality of LEDs on a wafer and a plurality of a spacers, each of which is on a respective one of the LEDs. A conversion material at least partially covers the LEDs and spacers, with at least some light from the LEDs passing through the conversion material and is converted. The spacers cause the LED chips to emit light having a wavelength within a standard deviation compared to the similar LED chips without the spacers where at least some of the LED chips emit light a wavelength of light outside the standard deviation. | 06-24-2010 |
20100155751 | LIGHT EMITTING DIODE ASSEMBLY AND LIGHT EMITTING DIODE DISPLAY DEVICE - An exemplary light emitting diode (LED) assembly includes a cover, a substrate, a LED unit, a first electrode terminal, and a second electrode terminal. The substrate includes a first surface and a second surface on an opposite side of the substrate thereto. The substrate and the cover cooperatively define a cavity. The LED unit is received in the cavity. The first and the second electrode terminals extend from the second surface. The first electrode terminal is electrically connected to one of a positive lead and a negative lead of the LED unit and the second electrode terminal is electrically connected to the other. The second electrode terminal includes a first electrode portion and a second electrode portion symmetrically arranged at opposite sides of the first electrode terminal. The first and the second electrode portions are at least partially symmetrical with respect to the first electrode terminal. | 06-24-2010 |
20100163893 | SEMICONDUCTOR LIGHT EMITTING DEVICE - Provided is a semiconductor light emitting device. | 07-01-2010 |
20100171131 | ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS - An electro-optical device includes a first light shielding film; a transistor element formed on the first light shielding film to overlap the first light shielding film; a second light shielding film formed on the transistor element to overlap the transistor element and electrically connected to an input terminal of the transistor element; a transparent conductive film extended toward an upper layer side of the second light shielding film in an opening region, through which light penetrates, of the display region; a dielectric film formed on the transparent conductive film in the opening region; and a transparent pixel electrode formed on the dielectric film in the opening region, constituting a storage capacitor together with the transparent conductive film and the dielectric film, and having a transparent pixel electrode which is electrically connected to the transistor element. | 07-08-2010 |
20100181582 | LIGHT EMITTING DEVICES WITH PHOSPHOR WAVELENGTH CONVERSION AND METHODS OF MANUFACTURE THEREOF - A light emitting device comprises: a package (low temperature co-fired ceramic) having a plurality of recesses (cups) in which each recess houses at least one LED chip and at least one phosphor material applied as coating to the light emitting light surface of the LED chips, wherein the phosphor material coating is conformal in form. In another arrangement a light emitting device comprises: a planar substrate (metal core printed circuit board); a plurality of light emitting diode chips mounted on, and electrically connected to, the substrate; a conformal coating of at least one phosphor material on each light emitting diode chip; and a lens formed over each light emitting diode chip. | 07-22-2010 |
20100200874 | PHOSPHOR, METHOD FOR PRODUCING THE SAME AND LIGHT-EMITTING DEVICE USING THE SAME - The invention is a phosphor which includes a phosphor material having a composition represented by a general formula: M(0) | 08-12-2010 |
20100200875 | ORGANIC ELECTROLUMINESCENT DEVICE AND ELECTRONIC APPARATUS - An organic electroluminescent device includes a substrate; a plurality of light-emitting elements disposed on the substrate and including first transparent electrodes, a second transparent electrode, and light-emitting layers held therebetween; reflective layers disposed opposite the light-emitting layers with the first electrodes therebetween; a first insulating film disposed between the substrate and the reflective layers and formed of an organic material; and a second insulating film disposed between the first electrodes and the reflective layers so as to cover the reflective layers and the first insulating film. The second insulating film has a first through-hole at a position not overlapping the first electrodes in plan view. The first through-hole extends through the second insulating film to reach the first insulating film. | 08-12-2010 |
20100200876 | MULTI-CHIP LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME - Multi-chip light emitting diodes and method for fabricating the same are provided. The multi-chip light emitting diode includes a lead frame including a carrier part. A plurality of chips is disposed on the carrier part, wherein the plurality of chips includes a first chip and a second chip. A first scattering layer is conformally covering the first chip to expose electrodes thereof, wherein the first scattering layer consists of a first scattering material. A second scattering layer is conformally covering the second chip to expose electrodes thereof, wherein the second scattering layer consists of a second scattering material. | 08-12-2010 |
20100219430 | Light emitting system, light emitting apparatus and forming method thereof - A light emitting system, a light emitting apparatus and the forming method thereof, the light emitting system comprising a plurality of light emitting units (100) and a frame for connecting the light emitting units. Each light emitting unit comprises a substrate (102), one or a plurality of chips (104) disposed on the substrate, an annular member (110) disposed on the substrate and surrounding the chips, the annular member used for adjusting the direction of the light emitted from the chips, and a protective layer (108) covering the chips, wherein the height of the protective layer is not more than that of the annular member. | 09-02-2010 |
20100237365 | LED-ARRAY SYSTEM - A LED-array system comprises at least one LED package | 09-23-2010 |
20100252843 | LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE, LIGHT-EMITTING ELEMENT PACKAGE, DISPLAY DEVICE, AND ILLUMINATION DEVICE - A light emitting element mounting substrate that enables a high quality light emitting element package to be readily manufactured with minimal variations in the chromaticity when manufacturing a white LED, a light emitting element package that employs the substrate, and a display device and illumination device that employs this package, are provided. In the light emitting element mounting substrate, at least a light emitting element mounting portion of a surface of a core metal is coated with a fluorescent enamel layer that consists of a fluorescent material-containing glass. In the light emitting element package, a light emitting element is mounted on the light emitting element mounting substrate, and the light emitting element is sealed with a transparent sealing resin. | 10-07-2010 |
20100258824 | ELECTRODE STRUCTURE AND LIGHT-EMITTING DEVICE USING THE SAME - An electrode structure includes at least two first electrodes and at least two second electrodes configured to be electrically connected in parallel to a power supply. Each of the first electrodes includes at least one first pad and at least one first extending wire with one end connected to the first pad, and the at least two first electrodes are spaced apart from each other. Each of the second electrodes includes at least one second pad and at least one second extending wire with one end connected to the second pad, and the at least two second electrodes are spaced apart from each other. | 10-14-2010 |
20100258825 | LIGHT EMITTING DEVICE - There is provided a light emitting device which makes it possible to reduce optical loss and improve brightness by increasing a ratio of fluorescent light that is not reabsorbed by a light emitting element while decreasing a ratio of scattered light that is reabsorbed by the light emitting element. Individual faces forming outer faces of the light emitting element | 10-14-2010 |
20100276708 | SEMICONDUCTOR LIGHT EMITTING DEVICE SUBSTRATE STRIPS AND PACKAGED SEMICONDUCTOR LIGHT EMITTING DEVICES - Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity configured to mount the semiconductor light emitting device therein. The semiconductor light emitting device is mounted on the substrate and electrically connected to a contact portion of the substrate. The substrate is liquid injection molded to form an optical element bonded to the substrate over the semiconductor light emitting device. Liquid injection molding may be preceded by applying a soft resin on the electrically connected semiconductor light emitting device in the cavity. Semiconductor light emitting device substrate strips are also provided. | 11-04-2010 |
20100289039 | COLLIMATING LIGHT EMITTING APPRATUS AND METHOD - Proposed is a light emitting apparatus ( | 11-18-2010 |
20100289040 | LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME - Disclosed herein is a light emitting diode. The light emitting diode includes a support substrate, semiconductor layers formed on the support substrate, and a metal pattern located between the support substrate and the lower semiconductor layer. The semiconductor layers include an upper semiconductor layer of a first conductive type, an active layer, and a lower semiconductor layer of a second conductive type. The semiconductor layers are grown on a sacrificial substrate and the support substrate is homogeneous with the sacrificial substrate. | 11-18-2010 |
20100295070 | LIGHT EMITTING DEVICE - A light emitting device comprises a plurality of LED chips (“lateral” or “vertical” conducting) operable to generate light of a first wavelength range and a package for housing the chips. The package comprises: a thermally conducting substrate (copper) on which the LED chips are mounted and a cover having a plurality of through-holes in which each hole corresponds to a respective one of the LED chips. The holes are configured such that when the cover is mounted to the substrate each hole in conjunction with the substrate defines a recess in which a respective chip is housed. Each recess is at least partially filled with a mixture of at least one phosphor material and a transparent material. In a device with “lateral” conducting LED chips a PCB is mounted on the substrate and includes a plurality of through-holes which are configured such that each chip is directly mounted to the substrate. For a device with “vertical” conducting LED chips the LED chips are mounted on a diamond like carbon film. | 11-25-2010 |
20100295071 | LIGHT EMITTING DEVICE - A light emitting device includes a carrier, a light emitting element electrically connected to the carrier, a transparent plate having at least one through hole formed therein and including a flat-portion and a lens-portion and a permeable membrane structure disposed on a surface of the transparent plate. The lens-portion covers the light emitting element and has a light incident surface, a light emitting surface, a first and a second side surfaces. A first partial beam of the light beam passes through the light incident surface and leaves from the light emitting surface. A second partial beam of the light beam passes through the light incident surface and is transmitted to the first or the second side surface. The first or the second side surface reflects at least a part of the second partial beam of the light beam to be passed through the light emitting surface. | 11-25-2010 |
20100301356 | LIGHT SOURCE HAVING LIGHT EMITTING CELLS ARRANGED TO PRODUCE A SPHERICAL EMISSION PATTERN - A light source includes a mount having first and second opposite surfaces, a first light emitting element having one or more solid state light emitting cells arranged to emit light from the first surface of the mount, and a second light emitting element having one or more solid state light emitting cells arranged to emit light from the second surface of the mount. The first and second light emitting elements are arranged such that the light emitted from the light source produces a substantially spherical emission pattern. | 12-02-2010 |
20100320488 | INTEGRATED SEMICONDUCTOR LIGHT-EMITTING DEVICE AND ITS MANUFACTURING METHOD - An integrated compound semiconductor light-emitting-device capable of emitting light as a large-area plane light source. The light-emitting-device includes plural light-emitting-units formed over a substrate, the light-emitting-units having a compound semiconductor thin-film crystal layer, first and second-conductivity-type-side electrodes, a main light-extraction direction is the side of the substrate, and the first and the second-conductivity-type-side electrodes are formed on the opposite side to the light-extraction direction. The light-emitting-units are electrically separated from each other by a light-emitting-unit separation-trench. An optical coupling layer is formed between the substrate and the first-conductivity-type semiconductor layer. The optical coupling layer is common to the plurality of light-emitting-units, and capable of optical coupling of the plurality of light-emitting-units and distributing a light to the entire light-emitting-device. | 12-23-2010 |
20110001149 | LIGHT EMITTING DIODE DISPLAY WITH TILTED PEAK EMISSION PATTERN - LED packages and LED displays utilizing the LED packages are disclosed where the peak emission of the LED display can be tilted or shifted to customize its peak emission to the mounting height or location of the LED display. One embodiment of an LED display comprises a plurality of LED package where the peak emission from at least some of the LED packages is tilted off the package centerline. The LED packages are mounted within the display in such a way as to generate an image having a peak emission that is tilted off the perpendicular emission direction of the display. | 01-06-2011 |
20110006318 | LED PACKAGE STRUCTURE WITH CONCAVE AREA FOR POSITIONING HEAT-CONDUCTING SUBSTANCE AND METHOD FOR MANUFACTURING THE SAME - An LED package structure with concave area for positioning heat-conducting substance includes a substrate unit, a heat-conducting adhesive unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a concave space formed on the substrate body, and a plurality of positive and negative pads exposed on the substrate body. The heat-conducting adhesive unit has a heat-conducting adhesive layer positioned in the concave space. The light-emitting unit has a plurality of LED chips disposed on the heat-conducting adhesive layer and received in the concave space. The conductive unit has a plurality of wires. Each LED chip is electrically connected between each positive pad and each negative pad. The package unit has a translucent package resin body disposed on the substrate body in order to cover the LED chips and the wires. | 01-13-2011 |
20110012143 | SOLID STATE LIGHTING COMPONENT - An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips. | 01-20-2011 |
20110012144 | LIGHT EMITTING DEVICE PACKAGE - Provided is a light emitting device package. The light emitting device package comprises a package body, a light emitting device, and a transient voltage suppress diode. The package body comprises a plurality of electrodes. The light emitting device is electrically connected to the plurality of electrodes. The transient voltage suppress diode is electrically connected to the plurality of electrodes. | 01-20-2011 |
20110018013 | THIN-FILM FLIP-CHIP SERIES CONNECTED LEDS - A light-emitting diode (LED) is fabricated by forming the LED segments with bond pads covering greater than 85% of a mounting surface of the LED segments and isolation trenches that electrically isolate the LED segments, mounting the LED segments on a submount with a bond pad that couples two or more bond pads from the LED segments, and applying a laser lift-off to remove the growth substrate from the LED layer. | 01-27-2011 |
20110018014 | LIGHT EMITTING DIODE COMPONENT - In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board. | 01-27-2011 |
20110042698 | EMITTER PACKAGE WITH ANGLED OR VERTICAL LED - The present invention is directed to LED packages and LED displays utilizing the LED packages, wherein the LED chips within the packages are arranged in unique orientations to provide the desired package or display FFP. One LED package according to the present invention comprises a reflective cup and an LED chip mounted in the reflective cup. The reflective cup has a first axis and a second axis orthogonal to the first axis, wherein the LED chip is rotated within the reflective cup so that the LED chip is out of alignment with said first axis. Some of the LED packages can comprise a rectangular LED chip having a chip longitudinal axis and an oval shaped reflective cup having a cup longitudinal axis. The LED chip is mounted within the reflective cup with the chip longitudinal axis angled from the cup longitudinal axis. LED displays according to the present invention comprise a plurality of LED packages, at least some of which have an LED chip mounted in a reflective cup at different angles to achieve the desired display FFP. | 02-24-2011 |
20110057212 | One-Way Transparent Display Systems - A display system includes a projection screen and a projector. The projection screen includes a retarder plate between a polarizer and a transparent screen. The projector projects an image through the polarizer and the retarder plate onto the transparent screen. The image is visible from a first side of the transparent screen but invisible from a second side of the transparent screen because any light passing twice through the retarder plate is blocked by the polarizer. | 03-10-2011 |
20110062463 | OPTICAL FUNCTIONAL ELEMENT, OPTICAL FUNCTIONAL ELEMENT ARRAY, EXPOSURE DEVICE, AND METHOD OF MANUFACTURING OPTICAL FUNCTIONAL ELEMENT - According to an aspect of the invention, an optical functional element includes a substrate, a semiconductor element portion, and a light emitting element portion. The semiconductor element portion includes a first part of a semiconductor multi layer structure formed on the substrate. The light emitting element portion includes a second part of the semiconductor multi layer structure and light emitting element structure formed on the second part of the semiconductor multi layer structure. | 03-17-2011 |
20110073886 | LED multi-side light source bracket - The present invention relates to a LED multi-side light source bracket, in particular to the bracket design that extends in the rectangular shape directly above the conducting pin for distribution and fixing of a plurality of chips before, after and above the rectangular block, wherein the chips are bridged to another conducting pin on the side through a plurality of conducting wires to be integrated with the resin or silicon lamp housing, the rectangular block support can be bent into the | 03-31-2011 |
20110079799 | ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE HAVING THE SAME - An anisotropic conductive film (ACF) is disclosed. The ACF includes a film, an adhesive layer positioned on the film, and one or more conductive balls within the adhesive layer. The conductive balls include a first core part having a first hardness, a second core part covering the first core part and having a second hardness that is greater than the first hardness, and a conductive part covering the second core part, respectively. | 04-07-2011 |
20110089441 | MULTICHIP TYPE LED PACKAGE STRUCTURE FOR GENERATING LIGHT-EMITTING EFFECT SIMILAR TO CIRCLE SHAPE - A multichip type LED package structure for generating light-emitting effect similar to circle shape includes a substrate unit, a light-emitting unit and a package unit. The substrate unit has a substrate body and a plurality of conductive circuits separated from each other by a predetermined distance and disposed on the substrate body. Each conductive circuit has a plurality of extending portions, and the extending portions of every two conductive circuits are adjacent to each other and are alternated with each other. The light-emitting unit has a plurality of LED chips selectively electrically disposed on the substrate unit. The package unit has a light-transmitting package resin body formed on the substrate unit to cover the LED chips. | 04-21-2011 |
20110089442 | OPTOELECTRONIC DEVICE - An optoelectronic device comprising: a substrate; a plurality of semiconductor units electrically connected with each other and disposed jointly on the substrate, wherein each semiconductor unit comprises a first semiconductor layer, a second semiconductor layer, and an active region interposed between thereof; a plurality of first electrodes disposed on each first semiconductor layer respectively; and a plurality of second electrodes disposed on each second semiconductor layer respectively, wherein at least one of the first electrodes comprises a first extension, and at least one of the second electrodes comprises a second extension, wherein at least one of the first extension and the second extension comprises a curve which is not parallel to the edge of the semiconductor units. | 04-21-2011 |
20110101389 | MULTICHIP TYPE LED PACKAGE STRUCTURE FOR GENERATING LIGHT-EMITTING EFFECT SIMILAR TO CIRCLE SHAPE BY SINGLE WIRE OR DUAL WIRE BONDING METHOD ALTERNATIVELY - A multichip type LED package structure for generating light-emitting effect similar to circle shape includes a substrate unit, a light-emitting unit and a package unit. The substrate unit has a substrate body and a plurality of conductive circuits separated from each other by a predetermined distance and disposed on the substrate body. Each conductive circuit has a plurality of extending portions, and the extending portions of every two conductive circuits are adjacent to each other and are alternated with each other. The light-emitting unit has a plurality of LED chips selectively electrically disposed on the substrate unit. The package unit has a light-transmitting package resin body formed on the substrate unit to cover the LED chips. | 05-05-2011 |
20110114976 | SECTIONALLY COVERED LIGHT EMITTING ASSEMBLY - A light emitting assembly ( | 05-19-2011 |
20110114977 | LIGHT ILLUMINATING DEVICE - To reliably keep an LED board and a heat conductive member in close contact to improve the heat-dissipation efficiency and to reliably position an LED and an optical element, such as a lens part, arranged in a housing are a slim LED board, the housing that has an accommodating concave part to house the LED board, a heat conductive member that is arranged between the LED board and the accommodating concave part, a pressing member that has the lens part and that presses a long side edge part of the LED board against a bottom surface of the accommodating concave part of the housing, a securing mechanism for securing the LED board, the heat conductive member and the pressing member to the housing, and a positioning mechanism for positioning the lens part relative to the LED. | 05-19-2011 |
20110121329 | AC LED Structure - An AC LED structure includes an insulating substrate, an LED set, a first metal layer and a second metal layer. The LED set has a first light-emitting diode and a second light-emitting diode, which are deposited on the insulating substrate and insulated from each other. The first metal layer and the second metal layer commonly have a first profile and serve to electrically connect the first light-emitting diode and the second light-emitting diode in an inverse parallel connection. In virtue of the first metal layer and the second metal layer of the first profile deposited on the first light-emitting diode and the second light-emitting diode, the LED set is allowed to be connected in series or in parallel with another LED set according to practical needs, so as to be able to endure high current density or high voltage operation. | 05-26-2011 |
20110133228 | LED STRUCTURE AND THE LED PACKAGE THEREOF - Disclosed is a light-emitting diode structure comprises a substrate, a plurality of light-emitting diodes on the substrate, and a conductive layer laid on the surface thereof. Each light-emitting diode comprises at least an electrical coupling side close to another electrical coupling side of an adjacent light-emitting diode. Each light-emitting diode comprises at least a first and a second electrode on the surface along the electrical coupling side, so that two close first or second electrodes can be soldered at the same time in wire soldering process, so as to make the light-emitting diodes connect in parallel. One end of the conductive layer is connected to the first electrode of a light-emitting diode and the other end is close to the second electrode of another light-emitting diode, so that the second electrode and the conductive layer can be soldered at the same time in wire soldering process, so as to make the light-emitting diodes connect in series. | 06-09-2011 |
20110140140 | INDIVIDUAL LIGHT SHIELDS - A light emitting assembly ( | 06-16-2011 |
20110156067 | LIGHT EMITTING MODULE AND ILLUMINATION DEVICE WITH THE SAME - A light emitting module includes a substrate, a conductive layer, a first light emitter, a second light emitter and a protection layer. The substrate has a first surface and a second surface on opposite sides of the substrate. The conductive layer is configured in the substrate. The first light emitter is disposed on the first surface and connected with the conductive layer. The second light emitter is disposed on the second surface and connected with the conductive layer. The protection layer covers the first light emitter and the second light emitter. | 06-30-2011 |
20110175119 | LIGHT EMITTING APPARATUS AND LIGHTING SYSTEM - Disclosed are a light emitting device package and a light emitting apparatus. The light emitting device package comprises a package body having a cavity, first and second frames passing through the package body and exposed in the cavity, a third frame disposed on a bottom surface of the cavity and electrically insulated from the first and second frames, a light emitting device on the third frame, and a wire electrically connecting the first and second frames with the light emitting device. A top surface of the third frame comprises a first plane having a first height, a second plane having a second height lower than the first height, and an inclined surface connecting the first plane with the second plane. The inclined surface is exposed in the cavity. | 07-21-2011 |
20110180827 | SOLID STATE LIGHTING DEVICE - A light emission package includes at least one solid state emitter, a leadframe, and a body structure encasing a portion of the leadframe. At least one aperture is defined in an electrical lead to define multiple electrical lead segments, with at least a portion of the aperture disposed outside an exterior side wall of the package. A recess may be defined in the exterior side wall to receive a bent portion of an electrical lead. A body structure cavity may be bounded by a floor, and side wall portions and end wall portions that are separated by transition wall portions including a curved or segmented upper edge, with different wall portions being disposed at different angles of inclination. | 07-28-2011 |
20110186880 | LED Housing - An LED housing having a housing cavity, a carrier element, LED chips, the LED housing being formed in such a way that it may connect a plurality of LED housings of identical construction and, by its shaping, is additionally mountable in various ways. | 08-04-2011 |
20110186881 | AC_LED SYSTEM IN SINGLE CHIP WITH THREE METAL CONTACTS - A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip. Alternatively, an AC LED system in single chip with four metal contacts is also disclosed. | 08-04-2011 |
20110193112 | LED MODULE - According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package. | 08-11-2011 |
20110193113 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME - Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer; a first electrode layer under the second conductive semiconductor layer; an electrode including a top surface making contact with a part of a bottom surface of the first conductive semiconductor layer; and an insulating member for covering an outer peripheral surface of the electrode, wherein a part of the insulating member extends into a region between the second conductive semiconductor layer and the first electrode layer from a bottom surface of the electrode. | 08-11-2011 |
20110193114 | Manufacturing Methods for Solid State Light Sheet or Strip with LEDs Connected in Series for General Illumination - A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. In another embodiment, a conductor layer is formed on the outer surface of the top substrate and makes contact with the LED electrodes and conductors on the bottom substrate via openings formed in the top substrate. | 08-11-2011 |
20110198631 | Solid State Light Sheet or Strip Having Cavities Formed in Bottom Substrate - A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. | 08-18-2011 |
20110198632 | Solid State Light Strips Containing LED Dies in Series - A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. | 08-18-2011 |
20110220924 | DISPLAY APPARATUS - A display apparatus including a self-luminous type light emitting device with which view angle characteristics of luminance are able to be improved is provided. An organic EL device (light emitting sections | 09-15-2011 |
20110220925 | LIGHT EMITTING DIODE WAFER-LEVEL PACKAGE WITH SELF-ALIGNING FEATURES - Several embodiments of light emitting diode packaging configurations including a substrate with a cavity are disclosed herein. A patterned wafer has a plurality of individual LED attachment sites, and an alignment wafer has a plurality of individual cavities. The patterned wafer and the alignment wafer are superimposed with the LED attachment sites corresponding generally to the cavities of the alignment wafer. At least one LED is placed in the cavities using the cavity to align the LED relative to the patterned wafer. The LED is electrically connected to contacts on the patterned wafer, and a phosphor layer is formed in the cavity to cover at least a part of the LED. | 09-15-2011 |
20110220926 | LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM INCLUDING THE SAME - Provided are a light emitting device package and a lighting system including the same. The light emitting device package includes: a body, a plurality of electrode layers, a light emitting device, and a molding member. The body includes a plurality of pits. The electrode layers include first protrusions disposed in the pits, and second protrusions protruding in a direction opposite to the first protrusions. The light emitting device is disposed on at least one of the plurality of electrode layers. The molding member is disposed on the light emitting device. | 09-15-2011 |
20110220927 | LIGHT EMITTING DEVICE PACKAGE - A light emitting device package is provided. The light emitting device package may include a main body having a cavity including side surfaces and a bottom, and a first reflective cup and a second reflective cup provided in the bottom of the cavity of the main body and separated from each other. A first light emitting device may be provided in the first reflective cup, and a second light emitting device may be provided in the second reflective cup. | 09-15-2011 |
20110227105 | Multi-Layer LED Array Engine - A multi-layer LED array engine is provided. The multi-layer LED array engine includes a base plate frame, a molded platform, two lead frames, a lighting element, a dome, a protection layer, and a phosphorous layer. The molded platform is disposed on and secured to the base plate frame. The two lead frames are combined with two lead frame grooves of the base plate frame. The lighting element is disposed on a lighting area of the base plate frame. The protection layer is provided on the lighting element, and the phosphorous layer is provided on the protection layer. The dome is secured to the molded platform for covering the molded platform and the lighting element. | 09-22-2011 |
20110227106 | LIGHT EMITTING DIODES AND METHODS FOR MANUFACTURING LIGHT EMITTING DIODES - Light emitting diodes and methods for manufacturing light emitting diodes are disclosed herein. In one embodiment, a method for manufacturing a light emitting diode (LED) comprises applying a first light conversion material to a first region on the LED and applying a second light conversion material to a second, different region on the LED. A portion of the LED is exposed after applying the first and second light conversion materials. | 09-22-2011 |
20110227107 | LIGHT-EMITTING ELEMENT, IMAGE DISPLAY DEVICE AND ILLUMINATING DEVICE - Disclosed is a light-emitting element | 09-22-2011 |
20110233578 | REFLECTOR LED LAMP - A reflector LED lamp comprises: a reflector | 09-29-2011 |
20110241039 | PRE-MOLDED SUPPORT MOUNT OF LEAD FRAME-TYPE FOR LED LIGHT MODULE - A pre-molded support mount of lead frame-type for an LED light module includes an insulative substrate and a lead frame embodied inside the insulative substrate and provided with a positive electrical contact and a negative electrical contact, which are exposed out of the insulative substrate. A plurality of LED chips can be mounted on the pre-molded support mount and electrically connected in series or in parallel through the lead frame. The pre-molded support mount has the advantage of being capable of simplifying manufacturing process and saving manufacturing costs in production of the LED light module. | 10-06-2011 |
20110241040 | NOVEL SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIAS - The substrate with through silicon plugs (or vias) described above removes the need for conductive bumps. The process flow is very simple and cost efficient. The structures described combines the separate TSV, redistribution layer, and conductive bump structures into a single structure. By combining the separate structures, a low resistance electrical connection with high heat dissipation capability is created. In addition, the substrate with through silicon plugs (or vias, or trenches) also allows multiple chips to be packaged together. A through silicon trench can surround the one or more chips to provide protection against copper diffusing to neighboring devices during manufacturing. In addition, multiple chips with similar or different functions can be integrated on the TSV substrate. Through silicon plugs with different patterns can be used under a semiconductor chip(s) to improve heat dissipation and to resolve manufacturing concerns. | 10-06-2011 |
20110254028 | Light Emitting Diode - The present disclosure provides a light emitting diode. The light emitting diode includes a substrate having a first surface and an opposite second surface. At least one light emitting diode chip is disposed on the first surface of the ceramic substrate. A plurality of thermal metal pads are disposed on the second surface of the substrate, wherein the thermal metal pads are electrically isolated from the at least one light emitting diode chip. | 10-20-2011 |
20110260182 | LIGHT EMITTING DEVICE ARRAY ASSEMBLIES AND RELATED METHODS - Light emitting device (LED) array assemblies and related methods are provided. An LED array assembly can include a primary substrate with an array of light emitting devices disposed on the primary substrate. The LED array assembly can also include a secondary substrate comprising at least one or more grooves. The primary substrate can be positioned on the secondary substrate with the grooves facing the primary substrate. | 10-27-2011 |
20110260183 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided are an electronic device including a bank structure and a method of manufacturing the same. The method of manufacturing the electronic device requires a fewer number of processes and comprises a direct patterning of insulating layers, such as fluorinated organic polymer layers, is possible using cost-efficient techniques such as inkjet printing. | 10-27-2011 |
20110266565 | DISPLAY PANEL - A display panel having a display area and a non-display area outside the display area is provided. The display panel includes a first substrate, a conductive light-shielding pattern, color filter patterns, first spacers, transparent pads, a second substrate, scan lines, data lines, pixel structures, third pads and fourth pads. The conductive light-shielding pattern defines a conductive matrix pattern, a plurality of first pads and second pads. Each first pad is electrically connected with one of the corresponding second pads through the conductive matrix pattern. The color filter patterns include a plurality of first filter patterns and second filter patterns. The second filter patterns are located within the non-display area and disposed on the second pads. The first spacers are disposed on the second filter patterns, and the transparent pads cover the first spacers and contact the second pads. | 11-03-2011 |
20110266566 | LED PACKAGE STRUCTURE WITH CONCAVE AREA FOR POSITIONING HEAT-CONDUCTING SUBSTANCE AND METHOD FOR MANUFACTURING THE SAME - An LED package structure with concave area for positioning heat-conducting substance includes a substrate unit, a heat-conducting adhesive unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a concave space formed on the substrate body, and a plurality of positive and negative pads exposed on the substrate body. The heat-conducting adhesive unit has a heat-conducting adhesive layer positioned in the concave space. The light-emitting unit has a plurality of LED chips disposed on the heat-conducting adhesive layer and received in the concave space. The conductive unit has a plurality of wires. Each LED chip is electrically connected between each positive pad and each negative pad. The package unit has a translucent package resin body disposed on the substrate body in order to cover the LED chips and the wires. | 11-03-2011 |
20110272718 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - In a semiconductor device, typically an active matrix display device, the structure of TFTs arranged in the respective circuits are made suitable in accordance with the function of the circuit, and along with improving the operating characteristics and the reliability of the semiconductor device, the manufacturing cost is reduced and the yield is increased by reducing the number of process steps. A semiconductor device has a semiconductor layer, an insulating film formed contacting the semiconductor layer, and a gate electrode having a tapered portion on the insulating film, in the semiconductor device, the semiconductor layer has a channel forming region, a first impurity region for forming a source region or a drain region and containing a single conductivity type impurity element, and a second impurity region for forming an LDD region contacting the channel forming region, a portion of the second impurity region is formed overlapping a gate electrode, and the concentration of the single conductivity type impurity element contained in the second impurity region becomes larger with distance from the channel forming region. | 11-10-2011 |
20110278607 | LIQUID CRYSTAL DISPLAY - A liquid crystal display includes first and second insulating substrates facing to each other, and a liquid crystal sandwiched between the first and second substrates. A plurality of gate lines are formed at the first substrate to transmit scanning signals, and data lines cross over the gate lines to transmit picture signals. Pads are connected to the gate and data lines. Pixels are demarcated by the gate lines and the data lines, and collectively form a display area. The gate lines demarcate the pixels into rows, and the data lines demarcate the pixels into columns. A black matrix defines each pixel, and a pixel electrode is formed at the pixel. A storage capacitor line is formed at the first substrate parallel to the gate line, and overlapped with the pixel electrodes at the first pixel row. Storage capacitors are formed between the pixel electrodes and the previous gate lines as well as between the pixel electrodes and the storage capacitor line. A gate-off voltage or a common electrode voltage is applied to the storage capacitor line. The opening ratio of each pixel at the first pixel row with the storage capacitor formed between the corresponding pixel electrode and the storage capacitor line differs from the opening ratio of the pixels at the other pixel rows. The difference in the opening ratio is made through forming a light interception pattern at each pixel of the first pixel row, or through differentiating opening areas of the black matrix. In order to prevent leakage of light, light interception patterns may be formed at the region between the display area and the pads. | 11-17-2011 |
20110284886 | LIGHT EMITTING MODULE - A light emitting module is revealed. The light emitting module includes a main substrate disposed with LED lights. The main substrate is connected correspondingly to a connector that is electrically connected with a light holder. A plurality light emitting sets is disposed circularly under the main substrate. Thereby the LED lights on the main substrate project light upward while the light emitting sets provide light under the main substrate and therearound. Thus the light emitting module provides shadow-free illumination. While being used together with a light shade, figures on the light shade are projected and enlarged so as to enhance visual aesthetics. | 11-24-2011 |
20110284887 | LIGHT EMITTING CHIP PACKAGE AND METHOD FOR FORMING THE SAME - According to an embodiment of the invention, a light emitting chip package is provided, which includes a carrier substrate having a first surface and an opposite second surface, a cavity extending from the first surface toward the second surface, at least a electrical conductive via and at least a thermal conductive via, located outside of the cavity and penetrating through the first surface and the second surface of the carrier substrate, a light emitting element having contact electrodes and disposed in the cavity, wherein the contact electrode are electrically connected to the electrical conductive via and are electrically insulated from the thermal conductive via. | 11-24-2011 |
20110284888 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - An outer lead connected to an inner lead penetrating a molded resin section, and another outer lead connected to another inner lead penetrating the molded resin section are provided on an outer wall surface of the molded resin section. The outer lead has a surface area greater than that of the another outer lead. | 11-24-2011 |
20110284889 | ORGANIC EL PANEL AND METHOD FOR MANUFACTURING THE SAME - An organic EL panel forming light-emitting elements on a substrate includes lower electrode lines stripe-formed on the substrate, upper electrode lines stripe-formed so as to cross the lower electrode lines, an organic EL element laminating an organic layer including a light-emitting layer between the lower electrode lines and the upper electrode lines in the crossing part of the lower electrode lines and the upper electrode lines, extracting terminals electrically connected to the respective upper electrode lines and formed outside the light-emitting element forming area, a common organic layer formed so as to cover at least the overall side edges of the lower electrode lines within the light-emitting element forming area, and a cathode separator stripe-formed on the common organic layer within the light-emitting element forming area so as to insulate-segment the upper electrode lines with the end part extending to the extracting terminals. | 11-24-2011 |
20110297979 | PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE - In embodiments of the invention, a passivation layer is disposed over a side of a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A material configured to adhere to an underfill is disposed over an etched surface of the semiconductor structure. | 12-08-2011 |
20110303929 | MULTI-DIMENSIONAL LED ARRAY SYSTEM AND ASSOCIATED METHODS AND STRUCTURES - A formed, multi-dimensional light-emitting diode (LED) array is disclosed. A substrate is bent into a trapezoidal shape having different sections facing in different directions. Each section has one or more mounted LEDs that emit light with an azimuthally non-circular, monotonic angular distribution. A converter material is placed in an optical path of the LEDs to alter characteristics of the light from the LEDs. | 12-15-2011 |
20110303930 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode (OLED) display is disclosed. The organic light emitting diode (OLED) display includes an organic light emitter that has a first electrode, an organic emission layer, and a second electrode. The OLED also has an encapsulation substrate covering the organic light emitter and an assistance electrode disposed between the encapsulation substrate and the second electrode. The assistance electrode can be disposed in a non-light-emitting region between the organic light emitter and the second electrode, and can have a lower resistance than a resistance of the second electrode. | 12-15-2011 |
20110316016 | LED CHIP PACKAGE STRUCTURE - An LED chip package structure includes a substrate; a first circuit pattern disposed on a surface of the substrate, wherein the first circuit pattern is divided into an electrical connection portion and a carrier portion; a second circuit pattern disposed on another surface of the substrate; a plurality of vias disposed in the substrate and connecting the first circuit pattern and the second circuit pattern, wherein the vias are filled with conductive material; and a plurality of LED chips disposed on the carrier portion of the substrate and electrically connected with the electrical connection portion. The vias filled with the conductive material are utilized to enhance heat dissipation of the substrate. | 12-29-2011 |
20110316017 | WAFER-TYPE LIGHT EMITTING DEVICE HAVING PRECISELY COATED WAVELENGTH-CONVERTING LAYER - The invention relates to a wafer-type light emitting device having a substrate, one or more light emitting semiconductors formed on the substrate, one or more frames provided over the one or more light emitting semiconductors, and one or more wavelength-converting layers applied on the one or more light emitting semiconductors and confined by the one or more frames, wherein the wafer-type light emitting device is diced into a plurality of separate light emitting units. | 12-29-2011 |
20120012868 | LIGHT EMITTING CHIP PACKAGE MODULE AND LIGHT EMITTING CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A light emitting chip package module includes a substrate, a light emitting chip package structure, and a magnetic device. The substrate has a surface. The light emitting chip package structure is disposed on the surface of the substrate. The light emitting chip package structure includes a carrier, a light emitting chip, and a sealant. The light emitting chip is disposed on and electrically connected to the carrier. The sealant is disposed on the carrier and covers the light emitting chip. The magnetic device is disposed next to the light emitting chip package structure to apply a magnetic field to the light emitting chip. | 01-19-2012 |
20120012869 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND DISPLAY DEVICE - A light emitting device includes a light emitting structure comprising a first semiconductor layer, an active layer and a second semiconductor layer, with an roughness formed in a surface of the first semiconductor layer; a phosphor layer arranged on the first semiconductor layer; and an adhesive activation layer arranged between the first semiconductor layer and the phosphor layer, wherein the adhesive activation layer fills a concave part of the roughness and a boundary surface between the adhesive activation layer and the phosphor layer is level. | 01-19-2012 |
20120012870 | Method of Manufacturing An Electric Optical Device in Which External Connection Terminals Are Formed - An electro-optical device includes an effective display region including a pixel, the pixel including a first electrode, a second electrode, and a light-emitting layer between the first electrode and the second electrode; and a wiring line connected to the second electrode at a position to the periphery of the effective display region, the wiring line including a first wiring layer and a second wiring layer that are electrically connected to each other and that overlap each other, the first wiring layer and the second wiring layer both extending in a direction in which an edge of the effective display region extends, the first wiring layer and the second wiring layer extending in the direction a distance that is longer than a distance in which the edge of the effective display region extends in the direction. | 01-19-2012 |
20120025229 | DISPLAY DEVICE AND ORGANIC LIGHT EMITTING DIODE DISPLAY - A display device fabricated with a substrate; a display unit disposed on the substrate and including an electrode; a conductive protruding portion disposed along an outer side of the display unit and electrically connected to the electrode; a sealing substrate fixed to the substrate by an adhering layer surrounding substrate at the display unit and the conductive protruding portion, the adhering layer including a resin and a plurality of carbon fibers impregnated with the resin, and the sealing substrate including a through hole; a metal layer disposed at one side of the sealing substrate, facing the substrate, and contacting the conductive protruding portion electrically connected with the electrode; and a conductive connection portion filling the through hole and contacting the metal layer. | 02-02-2012 |
20120056218 | LEAD FRAME PACKAGE WITH MULTIPLE BENDS - A lead frame package with multiple bends suitable for a light-emitting device, as well as a non-optical device is disclosed. A light-emitting device incorporating the lead frame package with multiple bends may comprise a light source die, a body and a plurality of leads. A non-optical device incorporating the lead frame package may comprise a die, a body and a plurality of leads. Each of the leads has at least first, second, and third bends defining each of the leads into at least first, second, third and fourth sections. At least the second section, the third section and the second bends of each lead are encapsulated by an encapsulating material forming the body. | 03-08-2012 |
20120068206 | Close-packed array of light emitting devices - A close-packed array of light emitting diodes includes a nonconductive substrate having a plurality of elongate channels extending therethrough from a first side to a second side, where each of the elongate channels in at least a portion of the substrate includes a conductive rod therein. The conductive rods have a density over the substrate of at least about 1,000 rods per square centimeter and include first conductive rods and second conductive rods. The close-packed array further includes a plurality of light emitting diodes on the first side of the substrate, where each light emitting diode is in physical contact with at least one first conductive rod and in electrical contact with at least one second conductive rod. | 03-22-2012 |
20120074441 | WAFER-LEVEL LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME - Exemplary embodiments of the present invention provide a wafer-level light emitting diode (LED) package and a method of fabricating the same. The LED package includes a semiconductor stack including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a plurality of contact holes arranged in the second conductive type semiconductor layer and the active layer, the contact holes exposing the first conductive type semiconductor layer; a first bump arranged on a first side of the semiconductor stack, the first bump being electrically connected to the first conductive type semiconductor layer via the plurality of contact holes; a second bump arranged on the first side of the semiconductor stack, the second bump being electrically connected to the second conductive type semiconductor layer; and a protective insulation layer covering a sidewall of the semiconductor stack. | 03-29-2012 |
20120080695 | LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME - Exemplary embodiments of the present invention disclose a light emitting diode (LED) and a method of fabricating the same. The LED includes a substrate, a semiconductor stack arranged on the substrate, the semiconductor stack including an upper semiconductor layer having a first conductivity type, an active layer, and a lower semiconductor layer having a second conductivity type, isolation trenches separating the semiconductor stack into a plurality of regions, connectors disposed between the substrate and the semiconductor stack, the connectors electrically connecting the plurality of regions to one another, and a distributed Bragg reflector (DBR) having a multi-layered structure, the DBR disposed between the semiconductor stack and the connectors. The connectors are electrically connected to the semiconductor stack through the DBR, and portions of the DBR are disposed between the isolation trenches and the connectors. | 04-05-2012 |
20120080696 | LIGHT EMITTING DIODE MODULE - An LED module includes a plurality of lighting sources each including a substrate, a first and second lead frames arranged on the substrate, an LED chip electrically connected to the first and the second lead frames, and an encapsulation covering the LED chip. The first lead frame of each of the lighting sources connects with the second lead frame of an adjacent lighting source electrically and mechanically. | 04-05-2012 |
20120080697 | LIGHT-EMITTING ELEMENT HAVING A PLURALITY OF CONTACT PARTS - A light-emitting element includes a supportive substrate; a reflective layer formed on the supportive substrate; a transparent layer formed on the reflective layer; a light-emitting stacked layer formed on the transparent layer; an etching-stop layer formed between the transparent layer and the reflective layer; and a plurality of contact parts formed between the light-emitting stacked layer and the transparent layer. | 04-05-2012 |
20120091484 | Display device and organic light emitting diode display - A display device includes: a display substrate; a display formed on the display substrate; an encapsulation substrate affixed to the display substrate by an adhering layer surrounding the display, the display substrate including a composite member including a resin matrix and a plurality of carbon fibers and an insulation member attached to an edge of the composite member and forming a through hole; a metal layer positioned on a side of the encapsulation substrate facing the substrate; and a conductive connector filling the through hole and contacting the metal layer. The composite member is stacked with at least two layers with different sizes, and the insulation member contacts sides of the at least two layers and has the same thickness as the composite member. | 04-19-2012 |
20120091485 | LIGHT EMITTING DEVICE - A light emitting diode device comprises a light source and a gas vent device. The gas vent device comprises a base having a collector, wherein a conversion element is located inside the collector. A portion of heat generated from the light source is transferred into thermal energy to gasify the conversion element and the other portion is dissipated via the gas vent device. Therefore, the light emitting device is able to provide illuminant and gasify the conversion element simultaneously. | 04-19-2012 |
20120097999 | CHIP PACKAGE - An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device disposed at the first surface; a protection layer located on the second surface of the substrate, wherein the protection layer has an opening; a light shielding layer located on the second surface of the substrate, wherein a portion of the light shielding layer extends into the opening of the protection layer; a conducting bump disposed on the second surface of the substrate and filled in the opening of the protection layer; and a conducting layer located between the substrate and the protection layer, wherein the conducting layer electrically connects the optoelectronic device to the conducting bump. | 04-26-2012 |
20120104430 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode (OLED) display is disclosed. In one embodiment, the OLED display includes i) a substrate having first and second surfaces opposing each other and ii) an organic light emitting diode (OLED) formed over the substrate, wherein the OLED is closer to the first surface than the second surface of the substrate. The display may also include i) a light scattering layer formed between the first surface of the substrate and the organic light emitting diode and ii) a light absorbing layer formed between the first surface of the substrate and the light scattering layer or on the second surface of the substrate. | 05-03-2012 |
20120138979 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE DISPLAY APPARATUS - Present embodiments provide a display apparatus including a substrate; a sealing substrate facing the substrate; a display unit between the substrate and the sealing substrate; a first sealing member between the substrate and the sealing substrate to be spaced apart from the display unit, so as to bond the substrate and the sealing substrate to each other; a second sealing member between the substrate and the sealing substrate to be spaced apart from the display unit and the first sealing member, so as to bond the substrate and the sealing substrate to each other; and a light pattern layer on a surface of the sealing substrate opposite to a surface facing the display unit, so as to adjust light intensity transmitted through the sealing substrate. The light pattern layer includes a first pattern corresponding to the first sealing member and a second pattern corresponding to the second sealing member. | 06-07-2012 |
20120146067 | LIGHT EMITTING DEVICE - A light emitting device includes a supporting substrate, a first conductivity type layer of a first conductivity type provided on the supporting substrate, an active layer provided on the first conductivity type layer, a second conductivity type layer of a second conductivity type provided on the active layer, a first electrode being in contact with a part of the surface of the first conductivity type layer, and a second electrode being in contact with a part of the surface of the second conductivity type layer. The first electrode is in contact with a surface of the first conductivity type layer, and the surface is different from a surface of the first conductivity type layer corresponding to a region located directly above or below the active layer. | 06-14-2012 |
20120153321 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An OLED display is disclosed. The display includes a substrate main body where a plurality of pixel areas are formed. Each pixel area includes an opaque area and a transparent area, and the opaque area includes a display area that emits light. The display area and the transparent area are separated by a conductive line disposed therebetween. | 06-21-2012 |
20120153322 | LIGHT EMITTING DIODE SOURCE WITH PROTECTIVE BARRIER - An apparatus having a substrate, an LED light source attached to the substrate, an electrical connector attached to the substrate and electrically connected to the LED light source, a potting material on the substrate and covering at least a portion of the electrical connector; and a barrier separating the potting material from the LED light source, the barrier having a height that exceeds the thickness of the potting material on the substrate. | 06-21-2012 |
20120168790 | DISPLAY DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF - A display device structure includes an active device, a passivation layer, a pixel electrode and a first conductive material. The passivation layer covers the active device and has a first through hole exposing a portion of the active device. The pixel electrode is disposed on the passivation layer, and the pixel electrode is a non-thin-film electrode constituted by a plurality of micro-conductive structures. The first conductive material is filled in the first through hole and electrically connected to the exposed active device. The pixel electrode is electrically connected to the first conductive material. | 07-05-2012 |
20120175651 | LIGHT EMITTNG MODULE, METHOD OF MANUFACTURING THE SAME AND DISPLAY APPARATUS HAVING THE SAME - A light emitting module includes a light emitting package and a lead frame. The light emitting package includes a light emitting chip emitting light, a first lead electrically connected to the light emitting chip, and a second lead spaced apart from the first lead and electrically connected to the light emitting chip. The light emitting package is mounted on the lead frame. The lead frame includes a third lead electrically connected to the first lead, a fourth lead electrically connected to the second lead and a molding part including the third lead and the fourth lead therein. | 07-12-2012 |
20120181555 | LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Light-emitting device packages which may be manufactured using post-molding and with improved heat emission performance and optical quality, and methods of manufacturing the light-emitting device packages. The light-emitting device package includes: a heat dissipation pad; a light-emitting device formed on the heat dissipation pad; a pair of lead frames disposed to be spaced apart from each other at both sides of the light-emitting device and the heat dissipation pad; a molding member surrounding the side of the light-emitting device except for an emission surface of the light-emitting device; and bonding wires for electrically connecting the lead frames to the light-emitting device. | 07-19-2012 |
20120181556 | ACTIVE MATRIX SUBSTRATE AND DISPLAY DEVICE - The present invention provides an active matrix substrate and a display device that have sufficient resistance to a surge current without formation of a short ring and that enable narrowing of a picture-frame region. The present invention is an active matrix substrate on which a plurality of pixels are formed in a matrix shape. The active matrix substrate includes, on one principal surface side of the substrate: a terminal; a semiconductor element; wiring that is formed in a picture-frame region of the substrate and that connects the terminal and the semiconductor element; and an annular conductive portion formed through an insulation layer on at least one of an upper layer side and a lower layer side of the wiring. The wiring comprises a meander structure including a meander-shaped portion. A portion of the conductive portion is disposed along the meander-shaped portion. | 07-19-2012 |
20120205689 | LIGHT EMITTING DEVICES AND METHODS - Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion. | 08-16-2012 |
20120248478 | PIXEL VIA AND METHODS OF FORMING THE SAME - This disclosure provides systems, methods and apparatuses for pixel vias. In one aspect, a method of forming an electromechanical device having a plurality of pixels includes depositing an electrically conductive black mask on a substrate at each of four corners of each pixel, depositing a dielectric layer over the black mask, depositing an optical stack including a stationary electrode over the dielectric layer, depositing a mechanical layer over the optical stack, and anchoring the mechanical layer over the optical stack at each corner of each pixel. The method further includes providing a conductive via in a first pixel of the plurality of pixels, the via in the dielectric layer electrically connecting the stationary electrode to the black mask, the via disposed at a corner of the first pixel, offset from where the mechanical layer is anchored over the optical stack in an optically non-active area of the first pixel. | 10-04-2012 |
20120261686 | LIGHT-EMITTING ELEMENT AND THE MANUFACTURING METHOD THEREOF - A light-emitting element includes: a carrier; an adhesive layer formed on the carrier; and a plurality of light-emitting units disposed separately on the conductive adhesive layer, wherein each of the light-emitting units includes a first semiconductor layer, a light-emitting layer surrounding the first semiconductor layer, a second semiconductor layer surrounding the light-emitting layer; and a conductive structure connecting the first semiconductor layers of the light-emitting units to each other. | 10-18-2012 |
20120267654 | LIGHT EMITTING DEVICE ARRAY - Disclosed is a light emitting device array. The light emitting device array comprises a light emitting device and a body comprises first and second lead frames electrically connected to the light emitting device and a substrate on which the light emitting device package is disposed, the substrate comprises a base layer and a metal layer disposed on the base layer and electrically connected to the light emitting device package, wherein the metal layer comprises first and second electrode patterns electrically connected to the first and second lead frames and a heat dissipation pattern insulated from at least one of the first or(and) second electrode patterns, absorbing heat generated from at least one of the base layer or(and) the light emitting device package and then dissipating the heat. | 10-25-2012 |
20120299034 | COLLIMATING LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A collimating light emitting device comprises a patterned optical layer able to redirect divergent light to light beam with uniform direction without utilizing external lenses thereby decreasing the size. The collimating light emitting device of the present invention may be utilized as a micro array projection device. The patterned optical layer may also be utilized in a single-die light-emitting device, thereby enhancing collimation. The manufacturing methods of the collimating light emitting device are also presented. | 11-29-2012 |
20120299035 | LIGHT-EMITTING DEVICE AND DISPLAY DEVICE - There has been a problem that difference in refractive index between an opposite substrate or a moisture barrier layer provided thereover, and air is maintained large, and light extraction efficiency is low. Further, there has been a problem that peeling or cracking due to the moisture barrier layer is easily generated, which leads to deteriorate the reliability and lifetime of a light-emitting element. A light-emitting element comprises a pixel electrode, an electroluminescent layer, a transparent electrode, a passivation film, a stress relieving layer, and a low refractive index layer, all of which are stacked sequentially. The stress relieving layer serves to prevent peeling of the passivation film. The low refractive index layer serves to reduce reflectivity of light generated in the electroluminescent layer in emitting to air. Therefore, a light-emitting element with high reliability and long lifetime and a display device using the light-emitting element can be provided. | 11-29-2012 |
20130001610 | DISPLAY APPARATUS - In a display apparatus in which light from a light-emitting element is extracted by an optical element, a difference in reflection characteristics between a display area including the optical element corresponding to the light-emitting element and a non-display area including no optical element impairs the appearance of the display apparatus. | 01-03-2013 |
20130026512 | LED MIRROR LIGHT ASSEMBLY - A LED mirror light assembly comprises a body having a through hole configured subject to a predetermined shape and located on a middle part thereof, a film-coated glass configured subject to shape of the through hole and supported on a first step, a LED holder holding a plurality of light-emitting diodes, and a reflector comprising a reflective surface located on a front side thereof and facing toward the light-emitting diodes and a light-shading coating coated on a rear side thereof The reflector being kept in a non-parallel manner relative to the film-coated glass and defining with the film-coated glass a predetermined contained angle so that the light spots of the light-emitting diodes are repeatedly reflected by the reflective back face of the film-coated glass and the reflective surface of the reflector, forming a curved tunnel of light spots. | 01-31-2013 |
20130037835 | Display Device with Reinforced Power Lines - A display device is provided with a reinforced power line. The display device includes a common power line. A light emission layer is interposed between a first and a second electrode. A passivation layer is formed over the second electrode and has a stepped shape. An auxiliary metal layer is coupled to a common power line. At least a portion of the auxiliary metal layer is formed over the passivation layer and has a shape that follows the stepped shape of the passivation layer. | 02-14-2013 |
20130049036 | LIGHT EMITTING DEVICE - A light emitting device includes a conductive substrate, a plurality of light emitting cells disposed on the conductive substrate, wherein each of the plurality of light emitting device cells includes a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, a protective layer disposed to cover a side of the first semiconductor layer and a side of the active layer, and a first electrode for connecting the second semiconductor layers of more than one of the light emitting cells to each other, wherein the protective layer includes protruding portions extending to an inside of each of the light emitting cells from the side of the first semiconductor layer and the side of the active layer. | 02-28-2013 |
20130049037 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME - An organic light emitting diode display includes a substrate; a first capacitor electrode provided over the substrate and including polysilicon; an insulating layer provided over the first capacitor electrode; and a second capacitor electrode provided over the insulating layer and including a first lower metal layer overlapping with the first capacitor electrode and a first upper metal layer. The first upper metal layer includes a doping opening configured to expose at least a portion of the first lower metal layer. | 02-28-2013 |
20130049038 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE - Disclosed is a light emitting device. The light emitting device includes a support substrate, a first light emitting structure provided on the support substrate and comprising a first conductive type first semiconductor layer, a first active layer, and a second conductive type second semiconductor layer, a first metal layer under the first light emitting structure, a second light emitting structure provided on the support substrate and comprising a first conductive type third semiconductor layer, a second active layer, and a second conductive type fourth semiconductor layer, a second metal layer under the second light emitting structure, and a contact part making contact with a lateral side of the first conductive type first semiconductor layer and electrically connected to the second metal layer. | 02-28-2013 |
20130056769 | LIGHT EMITTING DIODE MODULE AND DISPLAY DEVICE USING THE SAME LIGHT EMITTING DIODE MODULE - A light emitting diode (LED) module and a display device adopting the same LED module are provided. The LED module includes a circuit substrate, a LED chip, a connector and a conductive line. The LED chip has at least three pins, and the LED chip is fixed on the circuit substrate through the pins, wherein one of the pins is defined as a no connection (NC) pin. The connector includes a non-conductive housing, at least one fixing pin and a conductor. The fixing pin is connected to the non-conductive housing, and the non-conductive housing is fixed on the circuit substrate through the said at least one fixing pin. A part of the non-conductive housing is covered with the conductor. The conductive line is disposed on the circuit substrate and is electrically connected between the conductor and the NC pin. | 03-07-2013 |
20130119417 | LIGHT EMITTING DIODE (LED) PACKAGES AND RELATED METHODS - Light emitting diode (LED) packages and methods are disclosed herein. In one aspect, a light emitting package is disclosed. The light emitting package includes one or more areas of conductive material having a thickness of less than approximately 50 microns (μm). The package can further include at least one light emitting diode (LED) electrically connected to the conductive material and at least one thin gap disposed between areas of conductive material. | 05-16-2013 |
20130153943 | LED LIGHT SOURCE STRUCTURE WITH HIGH ILLUMINATING POWER AND IMPROVED HEAT DISSIPATING CHARACTERISTICS - The present invention relates to an LED light source structure, and more particularly, to an LED light source structure with high illuminating power and improved heat dissipating performance, in which metal having superior electric conductivity and thermal conductivity is processed into positive electrode units, and heat generated from an LED chip is directly dissipated through the electrode unit which is used as a positive electrode from among the positive electrode units, thereby improving heat dissipating characteristics, stabilizing a light source and preventing voltage drop, thus enabling output of high illuminating power. | 06-20-2013 |
20130161667 | PATTERNED REFLECTIVE LAYER ON DIELECTRIC LAYER FOR LED ARRAY - A light emitting diode array includes a first light emitting diode with a first electrode and a second light emitting diode with a second electrode. A first dielectric layer is positioned between the light emitting diodes. A first portion of the first dielectric layer at least partially covers the first light emitting diode and a second portion of the first dielectric layer at least partially covers the second light emitting diode. An interconnect is located at least partially on the first dielectric layer. The interconnect connects the first electrode to the second electrode. A reflective layer is formed over at least the first and second portions of the first dielectric layer. A permanent substrate is coupled to a side of the light emitting diodes having the reflective layer. | 06-27-2013 |
20130161668 | SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR PRODUCING SAME, AND DISPLAY DEVICE - A semiconductor light-emitting device ( | 06-27-2013 |
20130200407 | DEFOCUSED OPTIC FOR MULTI - CHIP LED - A defocused optic ( | 08-08-2013 |
20130200408 | SOLID-STATE LIGHT EMITTING DEVICE - An exemplary embodiment of the present disclosure provides a solid-state light emitting device. The solid-state light emitting device includes a stair-type bowl, a plurality of light emitting chips, and an encapsulation glue. The stair-type bowl includes a base and a ring stair structure. The ring stair structure includes a plurality of ring tread surfaces and a plurality of ring riser surfaces connected to the ring tread surfaces. The ring stair structure is connected to the base. The base has a bottom surface. The ring stair structure surrounds the bottom surface and protrudes from the bottom surface. The light emitting chips are respectively disposed above the ring tread surfaces and the bottom surfaces. The stair-type bowl is filled with the encapsulation glue. The encapsulation glue covers the light-emitting chips. | 08-08-2013 |
20130200409 | SEMICONDUCTOR UNIT, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS - There are provided a semiconductor unit that prevents connection failure caused by a wiring substrate to improve reliability, a method of manufacturing the semiconductor unit, and an electronic apparatus including the semiconductor unit. The semiconductor unit includes: a device substrate including a functional device and an electrode; a first wiring substrate electrically connected to the functional device through the electrode; and a second wiring substrate electrically connected to the functional device through the first wiring substrate. | 08-08-2013 |
20130200410 | LED LAMP ASSEMBLY - Provided is a light emitting diode (LED) lamp assembly having an increased light incidence angle by fixing unit LED lamps fixed on a substrate at various angles. The LED lamp assembly includes a substrate having a socket portion and an LED mounting portion, first unit LED modules installed on both surfaces of the substrate and irradiating light onto the both surfaces of the substrate in a frontward direction, and second unit LED modules irradiating light onto the both surface of the substrate in directions other than the frontward direction. In the LED lamp assembly, since first and second unit LED modules having light irradiation units formed at different positions are installed on both surfaces of a single substrate, light can be irradiated in a radial direction. | 08-08-2013 |
20130207139 | RADIATION-EMITTING COMPONENT AND METHOD FOR PRODUCING RADIATION-EMITTING COMPONENTS - A radiation-emitting component includes a semiconductor chip which has a first main surface, a second main surface on an opposite side from the first main surface and an active region that generates radiation; a carrier on which the semiconductor chip is fixed on the side of the second main surface; an output layer arranged on the first main surface of the semiconductor chip and forming a lateral output surface spaced apart from the semiconductor chip in a lateral direction, a recess tapering in a direction of the semiconductor chip being, formed in the output layer and deflecting radiation emerging from the first main surface during operation into the direction of the lateral output surface. | 08-15-2013 |
20130234177 | LED PACKAGE STRUCTURE - The present invention relates to a package structure for light-emitting diodes (LEDs). The package structure includes a substrate, a heat-dissipating structure disposed on the substrate, and a plurality of LED chips uniformly disposed on the heat-dissipating structure. The heat-dissipating structure has a central portion and at least one peripheral portion surrounding thereof. The central portion is capable of dissipating more heat than the peripheral portion. Thus, the temperature difference between the LED chips disposed on the central portion and the LED chips disposed on the peripheral portion can be reduced. | 09-12-2013 |
20130256717 | SEMICONDUCTOR BOARD, SEMICONDUCTOR DEVICE, AND PRODUCING METHOD OF SEMICONDUCTOR DEVICE - A semiconductor board includes a circuit board to which external electric power is supplied; a plurality of semiconductor elements which are supported on the circuit board; and a plurality of wires each of which is provided corresponding to each of a plurality of the semiconductor elements and each of which has one end electrically connected to the semiconductor element and the other end electrically connected to the circuit board. A plurality of the wires extend along a radial direction of a phantom circle having a center on the circuit board. | 10-03-2013 |
20130264594 | LED LIGHT SOURCE AND CORRESPONDING BACKLIGHT MODULE - The present invention relates to an LED light source and a corresponding backlight module. The LED light source includes a bar-shaped base and multiple LED assemblies. The LED assemblies each has an LED leadframe, a light-emitting chip, an anode bonding pad and a cathode bonding pad. The anode and cathode bonding pads are connected to the light-emitting chip and mounted on a bottom of the LED leadframe. By mounting the electrodes of the LED assembly on the bottom of the LED leadframe, the LED light source and the corresponding backlight module of the present invention prevents a technical problem that the electrodes of LED assemblies are easy to become short-circuited. | 10-10-2013 |
20130264595 | DISPLAY DEVICE AND FABRICATING METHOD THEREOF - Pixels of a display device include a first substrate, an organic insulation layer disposed on the first substrate and having an upper surface formed in an uneven structure, an inorganic insulation layer disposed on the organic insulation layer and formed in the uneven structure, a first electrode disposed on the inorganic insulation layer and formed in the uneven structure, and a device to provide a data voltage to the first electrode, in which the first electrode includes a reflective electrode to reflect incident light. | 10-10-2013 |
20130270588 | LEAD FRAME ASSEMBLY, LED PACKAGE AND LED LIGHT BAR - A lead frame assembly includes a surrounding frame and a plurality of lead frame sets arranged in a matrix. Each lead frame set includes spaced-apart first and second lead frames and a connecting structure interconnecting one of the lead frame sets to an adjacent lead frame set. Each lead frame set is further connected to the surrounding frame through the connecting structure thereof. A plurality of insulated bars are spacedly formed on a lead frame panel. Each insulated bar covers a corresponding row of the lead frame sets and exposes bottom surfaces of the first and second lead frames. Each insulated bar further covers portions of the surrounding frame that are adjacent to two opposite outermost ones of the lead frame sets. | 10-17-2013 |
20130277695 | LUMINOUS BODY WITH LED DIEs AND PRODUCTION THEREOF - A luminous body comprises a transparent plastic moulding with indentations, and LED DIEs disposed within the indentations. One side of each LED DIE lies approximately flush with an upper side of the moulding, and each LED DIE is connected to an electricity supply via electrical conductors disposed on the moulding. A method for producing such a luminous body is also disclosed. | 10-24-2013 |
20130307000 | RESIN-ATTACHED LEAD FRAME, METHOD FOR MANUFACTURING THE SAME, AND LEAD FRAME - A resin-attached lead frame includes a lead frame main body having a plurality of die pads (LED element resting portions) and a plurality of lead portions spaced from the die pads, the lead frame main body further including LED element resting regions each formed over an area including an upper surface of each of the die pads and an upper surface of each of the lead portions. A reflecting resin section surrounds each LED element resting region of the lead frame main body. A vapor-deposited aluminum layer or a sputtered aluminum layer is provided on respective upper surfaces of the LED element resting regions of the lead frame main body. | 11-21-2013 |
20130334548 | LIGHT EMITTING DEVICES AND METHODS - Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion. | 12-19-2013 |
20130334549 | LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE, AND PACKAGE ARRAY - In a light emitting device, a first lead has a first terminal part that is contiguous with a first connector. The first terminal part includes a first convex part that is exposed from a molded article at the inner peripheral face of a mounting recess, and a first concave part that is formed in the rear face of the first convex part. | 12-19-2013 |
20130341658 | LIGHT-EMITTING DEVICE HAVING DIELECTRIC REFLECTOR AND METHOD OF MANUFACTURING THE SAME - A light-emitting device includes a first conductive semiconductor layer formed on a substrate, a mask layer formed on the first conductive semiconductor layer and having a plurality of holes, a plurality of vertical light-emitting structures vertically grown on the first conductive semiconductor layer through the plurality of holes, a current diffusion layer surrounding the plurality of vertical light-emitting structures on the first conductive semiconductor layer, and a dielectric reflector filling a space between the plurality of vertical light-emitting structures on the current diffusion layer. | 12-26-2013 |
20130341659 | DISPLAY PANEL - A display panel including a substrate, a meshed shielding pattern, and a plurality of light-emitting devices is provided. The meshed shielding pattern is disposed on the substrate so as to define a plurality of pixel regions on the substrate. The light-emitting devices are disposed on the substrate. At least one light-emitting device of the light-emitting devices is disposed in each pixel region of the pixel regions, wherein an area of the pixel region is A1, an area of the light-emitting device is A2, and a ratio of A2 to A1 is below 50%. | 12-26-2013 |
20140001500 | LED LIGHT BAR | 01-02-2014 |
20140001501 | LIGHTING DEVICE | 01-02-2014 |
20140008674 | MOUNTING SUBSTRATE AND OPTICAL UNIT - A mounting substrate includes: a wiring substrate; and a plurality of optical elements mounted on a mounting surface of the wiring substrate, and each having a first electrode and a second electrode. The wiring substrate includes a support substrate, a plurality of first wires, and a plurality of second wires. The first wires and the second wires are provided within a layer between the support substrate and the mounting surface. The first wires are electrically connected with the first electrodes. The second wires are electrically connected with the second electrodes, and each have cross-sectional area larger than cross-sectional area of each of the first wires. | 01-09-2014 |
20140014986 | LIGHT-EMITTING-ELEMENT MOUNT SUBSTRATE AND LED DEVICE - A light-emitting-element mount substrate formed by relatively simple manufacturing steps, having a good heat release property, and having a high mechanical strength; and an LED device including the light-emitting-element mount substrate are provided. A substrate body of a light-emitting-element mount substrate is made of a low-resistance semiconductor (e.g., n-type silicon) substrate, and is divided into a first and second individual substrate bodies by an insulating layer. A first front-surface mounting electrode and a first external-connection electrode are formed on respective first and second major surfaces (e.g., front and back surfaces) of the first individual substrate body. A second front-surface mounting electrode and a second external-connection electrode are formed respective first and second major surfaces (e.g., front and back surfaces) of the second individual substrate body. The insulating layer has a shape different from a straight-line shape in plan view. | 01-16-2014 |
20140027800 | Method for producing a striplight and striplight - A method for producing a striplight is disclosed. Said method utilizing at least the following steps: (a) providing a strip-shaped carrier, which is populated on at least one side with a plurality of semiconductor light sources; (b) arranging at least one electrical line on the carrier; and (c) casting the at least one electrical line on the carrier. A striplight which has: a strip-shaped carrier, populated on at least one side with a plurality of semiconductor light sources; at least one electrical line, which is arranged on the carrier; and joint casting of the carrier and the at least one electrical line, is likewise disclosed. | 01-30-2014 |
20140027801 | SOLID STATE LIGHTING DEVICE - A light emission package includes at least one solid state emitter, a leadframe, and a body structure encasing a portion of the leadframe. At least one aperture is defined in an electrical lead to define multiple electrical lead segments, with at least a portion of the aperture disposed outside an exterior side wall of the package. A recess may be defined in the exterior side wall to receive a bent portion of an electrical lead. A body structure cavity may be bounded by a floor, and side wall portions and end wall portions that are separated by transition wall portions including a curved or segmented upper edge, with different wall portions being disposed at different angles of inclination. | 01-30-2014 |
20140034975 | DISPLAY APPARATUS - A display apparatus includes an active device array substrate, an opposite substrate disposed opposite to the active device array substrate, and a display medium disposed between the active device array substrate and the opposite substrate. The opposite substrate includes a first base and a light-shielding structure disposed on the first base and located between the first base and the active device array substrate. The light-shielding structure has a first dielectric layer, a second dielectric layer, a third dielectric layer, a metal layer, a fourth dielectric layer, a fifth dielectric layer, and a sixth dielectric layer stacked sequentially in a direction from the first base to the active device array substrate. The first, second, and third dielectric layers have different thicknesses. The fourth, fifth, and sixth dielectric layers have different thicknesses. | 02-06-2014 |
20140048829 | LIGHT BLOCKING MEMBER AND DISPLAY PANEL INCLUDING THE SAME - A light blocking member including a metal particle and a ceramic material and a display device including the same. | 02-20-2014 |
20140054626 | ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY APPARATUS - The present disclosure relates to an array substrate and the manufacturing method thereof, and a display apparatus. The manufacturing method of the array substrate comprises following step. A gate insulating layer and an active layer is formed on the substrate with said gate electrode and said common electrode formed thereon. A source drain layer is formed on the substrate with said gate insulating layer and said active layer formed thereon. A passivation layer is formed on the substrate with said source drain layer formed thereon, and a through hole is formed in the passivation layer; a pixel electrode is formed on the substrate with said passivation layer formed thereon with said through hole. The pixel electrode is connected to the drain electrode in the source drain layer through said through hole. The process for forming the pixel electrode comprises first etching, ashing and second etching. | 02-27-2014 |
20140054627 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device includes a circuit board with a layout layer and a die bonding area. At least one positive endpoint, negative endpoint and function endpoint are disposed on the layout layer. At least one semiconductor light-emitting chip is disposed within the die bonding area, and is electrically coupled to the positive endpoint, the negative endpoint and the function endpoint to facilitate various connection configurations. | 02-27-2014 |
20140054628 | SUBSTRATE, LIGHT-EMITTING DEVICE, AND LIGHTING APPARATUS - A substrate on which LEDs are to be mounted to form an element row and which includes a first line and a second line disposed such that the element row is interposed therebetween. The first line includes a first main line portion extending mainly in the row direction of the element row, and a first connecting portion including a portion for connecting to the LEDs. The second line includes a second main line portion extending mainly in the row direction of the element row, and a second connecting portion including a portion for connecting to the LEDs. The gap between the first main line portion and the second main line portion is larger at LED mounting positions than at positions other than the LED mounting positions. | 02-27-2014 |
20140054629 | LIGHT EMITTING DEVICE AND LIGHTING SYSTEM HAVING THE SAME - Disclosed are light emitting device and a lighting system including the same. The light emitting device includes a body including first and second sidewalls having a first length and corresponding to each other, third and fourth sidewalls close to the first and second sidewalls and having a second length shorter than the first length, and a concave portion having an open upper portion; a first lead frame disposed in the concave portion of the body and including a first cavity having a depth lower than a bottom of the concave portion; a second lead frame disposed in the concave portion of the body and including a second cavity having a depth lower than the bottom of the concave portion; a gap part between the first and second lead frames; a first light emitting chip in the first cavity; and a second light emitting chip in the second cavity. | 02-27-2014 |
20140054630 | TFT-LCD Array Substrate And Display Device - A TFT-LCD array substrate and a display device. The TFT-LCD array substrate comprises a pixel area the pixel area comprising a plurality of pixel units arranged in an array, and each of the pixel units comprising a first electrode and a second electrode generating a horizontal electric field with the first electrode. The second electrode comprises strip electrodes, and the strip electrodes constitute a radial pattern of a regular triangle, a regular polygon or a circle in each of the pixel units. | 02-27-2014 |
20140061691 | Array Substrate, Manufacturing Method And Display Device Thereof - The invention provides an array substrate, a manufacturing method and a display device thereof. The array substrate comprises a substrate, a gate line and a pixel electrode disposed on the substrate, a common electrode disposed above and overlaying the gate line, wherein a strip-shaped through hole is disposed on the common electrode and at least a portion of the strip-shaped through hole is positioned right above the gate line. | 03-06-2014 |
20140061692 | MULTILAYERED LED PRINTED CIRCUIT BOARD - A multilayered LED printed circuit board with electrically insulating layers includes at least one electrically insulating material and electrically conductive layers consisting of an electrically conductive material, wherein at least one of the electrically conductive layers is structured with a conductor track structure, wherein the at least one structured electrically conductive layer is arranged on an upper side of the LED printed circuit board, and wherein a plurality of LEDs is arranged on the at least one structured electrically conductive layer on the upper side. The LED printed circuit board further includes: a thermally conducting element, and thermal paths comprising an electrically conductive material, which are arranged, in each case in contact-making fashion, between the LEDs and the thermally conducting element. | 03-06-2014 |
20140084315 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with the electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Bottom surfaces of the first and second electrodes are exposed out of a bottom surface of the substrate to connect with welding pads of a printed circuit board. A bottom surface of the third electrode is received in the substrate. | 03-27-2014 |
20140097455 | SEMICONDUCTOR DEVICE AND DISPLAY APPARATUS - A semiconductor device according to an aspect of the present invention includes: a semiconductor layer including a channel region and a contact region; a pattern of a first conducting layer disposed at a position which overlaps with the channel region; a gate line formed in one of a second conducting layer or a third conducting layer, and connected to the pattern of the first conducting layer; and a source line formed in the other of the second conducting layer and the third conducting layer, and connected to the contact region. | 04-10-2014 |
20140103375 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface. | 04-17-2014 |
20140124803 | DISPLAY PANEL, CHIP ON FILM AND DISPLAY DEVICE INCLUDING THE SAME - A display panel includes a display area including a display element, and a non-display area adjacent to the display area, the non-display area including a plurality of conductive pads. The conductive pads are spaced apart at a predetermined distance so as to form a first pad row and a second pad row, the conductive pads collectively having a center portion and lateral portions. A distance between the first pad row and the second pad row is greater at at least one of the lateral end portions than at the center portion. | 05-08-2014 |
20140159080 | LED LAMP - A LED lamp is disclosed which has a plurality of light unit, each of the light unit has at least one flat metal lead for heat dissipation and the lower part of the metal lead is mounted on a heat sink for a further heat dissipation. | 06-12-2014 |
20140175471 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE - According to one embodiment, a semiconductor light emitting device includes a plurality of chips, a first insulating layer provided between the chips, one p-side external terminal, and one n-side external terminal. Each of the chips includes a semiconductor layer, a p-side electrode, and an n-side electrode. Each of the chips is separated from each other. The one p-side external terminal is provided corresponding to one chip on the second face side. The p-side external terminal is electrically connected to the p-side electrode. The one n-side external terminal is provided corresponding to one chip on the second face side. The n-side external terminal is electrically connected to the n-side electrode. | 06-26-2014 |
20140175472 | Semiconductor Light Emitting Unit Connected Body - The present disclosure provides a semiconductor light emitting unit connected body, comprising a first light emitting unit having a current supplying layer formed at the bottom; a second light emitting unit having a current supplying layer formed at the bottom and extended into the second light emitting unit; a connecting plate including a conductive portion where the first light emitting unit is placed and a conductive portion where the second light emitting unit is placed; and an electric pass for electrically connecting the first light emitting unit and the second light emitting unit. | 06-26-2014 |
20140197433 | LIGHT EMITTING DEVICE - A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency. | 07-17-2014 |
20140209945 | TRANSPARENT LED LAMP FOR BIDIRECTIONAL LIGHTING - A flexible light sheet includes a thin substrate that allows light to pass through it, a transparent first conductor layer overlying the substrate, an array of vertical light emitting diodes (VLEDs) printed as an ink over the first conductor layer, each of the VLEDs having a bottom electrode electrically contacting the first conductor layer, a dielectric material between the VLEDs overlying the first conductor layer, and a transparent second conductor layer overlying the VLEDs and dielectric layer, each of the VLEDs having a top electrode electrically contacting the transparent second conductor layer. Each individual VLED may emit light bidirectionally. The VLEDs are illuminated by a voltage differential between the first conductor layer and the second conductor layer such that bidirectional light passes through the first conductor layer and the second conductor layer. Phosphor layers may be deposited on both sides to create white light using blue VLEDs. | 07-31-2014 |
20140239322 | LIGHT EMITTING DEVICE ARRAY - Disclosed is a light emitting device array. The light emitting device array comprises a light emitting device and a body comprises first and second lead frames electrically connected to the light emitting device and a substrate on which the light emitting device package is disposed, the substrate comprises a base layer and a metal layer disposed on the base layer and electrically connected to the light emitting device package, wherein the metal layer comprises first and second electrode patterns electrically connected to the first and second lead frames and a heat dissipation pattern insulated from at least one of the first or(and) second electrode patterns, absorbing heat generated from at least one of the base layer or(and) the light emitting device package and then dissipating the heat. | 08-28-2014 |
20140239323 | Method and Apparatus for Accurate Die-to-Wafer Bonding - A plurality of conductive pads are disposed on a substrate. A plurality of semiconductor dies are each disposed on a respective one of the conductive pads. A mold device is positioned over the substrate. The mold device contains a plurality of recesses that are each configured to accommodate a respective one of the semiconductor dies underneath. | 08-28-2014 |
20140264407 | STRESS RELIEF FOR ARRAY-BASED ELECTRONIC DEVICES - In accordance with certain embodiments, an electric device includes a flexible substrate having first and second conductive traces on a first surface thereof and separated by a gap therebetween, an electronic component spanning the gap, and a stiffener configured to substantially prevent flexing of the substrate proximate the gap during flexing of the substrate. | 09-18-2014 |
20140291710 | LIGHT EMITTING DEVICE AND IMAGE DISPLAY UNIT - A light emitting device includes a package having a recess, a lead frame buried in the package so that one end of the lead frame is exposed at a bottom of the recess and another end protrudes to an exterior of the package, a light emitting element arranged on the lead frame exposed at the bottom of the recess, and an encapsulant filled in the recess. The package includes, at the side face where the lead frame protrudes, a first side face formed inwardly relative to a side face of the lead frame, and a second side face formed at a lower portion of the first side face and protruded so as to cover a top face of the lead frame. | 10-02-2014 |
20140299900 | INTERDIGITATED MULTIPLE PIXEL ARRAYS OF LIGHT-EMITTING DEVICES - The present invention discloses a plurality of interdigitated pixels arranged in an array, having a very low series-resistances with improved current spreading and improved heat-sinking Each pixel is a square with sides of dimension 1. The series resistance is minimized by increasing the perimeter of an active region for the pixels. The series resistance is also minimized by shrinking the space between a mesa and n-contact for each pixel. | 10-09-2014 |
20140319554 | CONDUCTIVE PARTICLE AND DISPLAY DEVICE INCLUDING THE SAME - A conductive particle comprising a polyhedral shape in which two neighboring sides among a plurality of sides form an intersection line, and two sides meeting on the intersection line form an angle. | 10-30-2014 |
20140319555 | DISPLAY PANEL AND DISPLAY APPARATUS HAVING THE SAME - A display panel includes a substrate, an active layer, a gate insulating layer, a gate electrode structure, an insulating interlayer, a switching element, and a planarization insulating layer. The active layer includes a source region and a drain region, and is disposed on the substrate. The gate insulating layer is disposed on the active layer. The gate electrode structure includes a plurality of gate electrode layer which are at least partially overlapped with each other. The gate electrode structure is disposed on the gate insulating layer. The insulating interlayer covers the gate electrode structure. The switching element includes a source electrode and a drain electrode, and the source electrode and the drain electrode are in contact with the source region and the drain region, respectively. The planarization insulating layer covers the switching element. | 10-30-2014 |
20140319556 | DISPLAY PANEL AND DISPLAY DEVICE - A display panel includes: a substrate on which a plurality of feed terminals corresponding to a plurality of pixels are provided; a plurality of pixel electrodes corresponding to the respective pixels; a common electrode common to the pixels; and a plurality of light-emitting layers corresponding to the respective pixels and provided between the pixel electrodes and the common electrode. In plan view, within each of the pixels, the light-emitting layer and the feed terminal do not overlap, feed terminals of each column of pixels are provided in a column, and the common electrode is electrically connected to conductive layers, the conductive layers each having a shape of a line that overlaps a corresponding one of the columns of feed terminals. Accordingly, the display panel achieves a high aperture ratio even with the conductive layers formed therein. | 10-30-2014 |
20140361322 | DISPLAY CONTRAST - There is herein described electronic components with improved display contrast and a method of manufacturing such electronic components. More particularly, there is described electronic components having improved display contrast by using a non-transparent or substantially non-transparent material ( | 12-11-2014 |
20150008460 | STRESS RELIEF FOR ARRAY-BASED ELECTRONIC DEVICES - In accordance with certain embodiments, an electric device includes a flexible substrate having first and second conductive traces on a first surface thereof and separated by a gap therebetween, an electronic component spanning the gap, and a stiffener configured to substantially prevent flexing of the substrate proximate the gap during flexing of the substrate. | 01-08-2015 |
20150021638 | LIGHT EMITTING DEVICE - Disclosed is a light emitting device comprising a plurality of light emitting cells, and a bridge electrode electrically connecting two adjacent light emitting cells, and the plurality of light emitting cells comprise a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first conductive semiconductor layer and the second conductive semiconductor layer, a first electrode on the first conductive semiconductor layer and a second electrode on the second conductive semiconductor layer, wherein the bridge electrode has a part thicker than the first electrode and the second electrode. | 01-22-2015 |
20150076535 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE - Disclosed are a light emitting device, a method of manufacturing the same, a light emitting device package, and a lighting system. The light emitting device includes a substrate; a plurality of conductive dielectric nano rods spaced apart from each other on the substrate; light emitting structures on the conductive dielectric nano rods, respectively; and a carbon nano electrode layer on the light emitting structures. | 03-19-2015 |
20150076536 | LIGHT-EMITTING ELEMENT HAVING A PLURALITY OF LIGHT-EMITTING STRUCTURES - A light-emitting element comprises a first semiconductor layer, a first light-emitting structure and a second light-emitting structure on the first semiconductor layer, a first electrode on the first semiconductor layer, a second electrode on the first light-emitting structure, and a first trench between the first light-emitting structure and the second light-emitting structure, exposing the first semiconductor layer, wherein the first trench is devoid of the first electrode and the second electrode formed therein. | 03-19-2015 |
20150091030 | DISPLAY DEVICES AND METHODS OF MANUFACTURING DISPLAY DEVICES - A display device includes a substrate including a display region and a peripheral region, display structures at the display region of the substrate, a plurality of blocking structures at the peripheral region of the substrate wherein the blocking structures have heights different from each other, an organic layer on the display structures and the blocking structures, and an inorganic layer on the organic layer. | 04-02-2015 |
20150108517 | LIGHT EMITTING MODULE AND LIGHTING APPARATUS HAVING THE SAME - A light emitting module according to an exemplary embodiment of the present invention includes a printed circuit board (PCB) and first through m-th lighting blocks (‘m’ is an integer greater than one). The PCB has wiring patterns electrically connecting optical semiconductor devices. The first through the m-th lighting blocks are disposed on the PCB and configured to generate light. Each of the first through the m-th lighting blocks includes first through n-th lighting groups (each block includes at least one group), each of which includes optical semiconductor devices disposed on the PCB, and an electric currents configured to flow through each lighting group is substantially the same. | 04-23-2015 |
20150129909 | FLEXIBLE CIRCUIT BOARD FOR LED LIGHTING FIXTURES - Techniques are disclosed for making a flexible laminated circuit board using a metal conductor onto which a SMD may be attached. Conductive metal strips may be laminated to form a flexible substrate and the metal strips may then be perforated for the placement of LED package leads. The LED packages may be attached to the conductive strips using solder or a conductive epoxy and the upper laminate layer may include perforations exposing portions of the metal strips for the attachment of the LED packages. Alternatively, strings of LED packages may be fabricated by attaching LED packages to conductive strips and these strings may be laminated between flexible sheets to form a laminated LED circuit. Plastic housings may aid in attaching the LED packages to the conductive strips. The plastic housings and/or the laminate sheets may be made of a reflective material. | 05-14-2015 |
20150129910 | System and Method for Connecting LED Devices - To connect multiple LED devices, each LED device is placed in a holder. A first wire is connected to a first wire connection point on the holder and a second wire is connected to a second wire connection point on the holder. The first wire is also connected to a first wire connection point on a circuit board The second wire is also connected to a second wire connection point on the circuit board. A connector may be used to connect the wires to the wire connection points on the circuit board. The circuit board includes traces to connect the LED devices to each other or to other components. | 05-14-2015 |
20150294960 | INTERDIGITATED MULTIPLE PIXEL ARRAYS OF LIGHT-EMITTING DEVICES - The present invention discloses a plurality of interdigitated pixels arranged in an array, having a very low series-resistance with improved current spreading and improved heat-sinking Each pixel is a square with sides of dimension l. The series resistance is minimized by increasing the perimeter of an active region for the pixels. The series resistance is also minimized by shrinking the space between a mesa and n-contact for each pixel. | 10-15-2015 |
20150303237 | LIGHT EMITTING MODULE AND LIGHTING APPARATUS HAVING THE SAME - A light emitting module includes a printed circuit board (PCB) and first through m-th lighting blocks of optical semiconductor devices (‘m’ is an integer greater than one). The PCB has wiring patterns electrically connecting optical semiconductor devices. The first through the m-th lighting blocks are disposed on the PCB and configured to generate light. Each of the first through the m-th lighting blocks includes first through n-th lighting groups (each block includes at least one group), each of which includes optical semiconductor devices disposed on the PCB. Electric currents configured to flow through each of the first through n-th lighting group is substantially the same. The PCB includes a pair of bodies spaced apart from each other and ‘m’ number of elbows connecting the pair of bodies, and each elbow respectively corresponds to the first through the m-th lighting blocks. | 10-22-2015 |
20150311396 | LIGHT EMITTING DEVICE PACKAGE - A light emitting device including a package body having a cavity; a first electrode and a second electrode in the package body; a plurality of light emitting chips on the first electrode; and a resin material in the cavity. Further, wherein the first electrode and the second electrode are separated by the package body, the package body includes a stepped portion exposed between the first electrode and the second electrode, the first electrode includes a bottom surface, a top surface and an inclined surface between the bottom surface and the top surface, and the top surface of the first electrode comprises an end portion in contact with the stepped portion. | 10-29-2015 |
20150311415 | LIGHT-EMITTING DEVICE HAVING EXCELLENT CURRENT SPREADING EFFECT AND METHOD FOR MANUFACTURING SAME - Disclosed are a light-emitting device having excellent light-emitting efficiency by a current spreading effect and a method for manufacturing the same. The light-emitting device, according to the present invention, comprises: a light-emitting structure which is formed on a substrate, includes a first semiconductor layer, an active layer, and a second semiconductor layer, and in which a plurality of trenches are formed up to the second semiconductor layer and the active layer; a first electrode formed to come in contact with the second semiconductor layer of the light-emitting structure; and a second electrode formed to come in contact with the first semiconductor layer along at least one edge of the substrate. | 10-29-2015 |
20150318457 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame. | 11-05-2015 |
20150338711 | DISPLAY DEVICE - The present invention relates to a display device, comprising: a substrate comprising a display region and a non-display region surrounding the display region; a first conductive layer disposed on the substrate; a semiconductor layer disposed on the substrate and partially covering the first conductive layer; and a second conductive layer disposed on a top surface of the semiconductor layer; and there is a spacing between a first side of the semiconductor layer and a second side of the second conductive layer from a top view, wherein the first side of the semiconductor layer is adjacent to the second side of the second conductive layer; wherein the spacing in the display region is a first distance, the spacing in the non-display region is a second distance, and the first distance is smaller than the second distance. | 11-26-2015 |
20150340575 | LIGHT EMITTING DEVICE - A light emitting device includes a substrate having a first main surface that serves as the light extraction surface, a second main surface that is opposite the first main surface, and a mounting surface that is adjacent to at least the second main surface, and that is provided an insulating base material, a pair of connection terminals disposed on the second main surface, and a heat dissipation terminal disposed on the second main surface and between the pair of connection terminals; a light emitting element that is mounted on the first main surface of the substrate and; a sealing member that seals the light emitting element and is formed substantially in the same plane as the substrate on the mounting surface. | 11-26-2015 |
20150349042 | FLEXIBLE CIRCUIT FILM AND DISPLAY APPARATUS HAVING THE SAME - A flexible circuit film includes a first flexible film, a second flexible film facing the first flexible film, a plurality of wirings arranged between the first flexible film and the second flexible film and extending in a first direction, then bending to extend in a second direction crossing the first direction, and then bending a second time to extend in an opposing direction to the first direction, and a guide film including a material more rigid than the first and second flexible films and arranged on an ends of the first flexible film. The guide film includes a tear-preventing portion overlapping with a bending portion of a shortest one of the wirings while covering portions of an inner edge near inner corners of a U-shaped flexible circuit film. | 12-03-2015 |
20150349228 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A step of forming a connecting member configured to electrically connect a first conductive line and a second conductive line includes a phase of perforating a laminate from a first semiconductor wafer to form a plurality of connection holes that reach the second conductive line and a phase of filling the plurality of penetrating connection holes with a conductive material to form conductive sections in contact with the second conductive line. | 12-03-2015 |
20150349232 | LIGHT EMITTING DIODE AND LIGHT EMITTING DEVICE INCLUDING THE SAME - Exemplary embodiments provide a light emitting diode and a method for manufacturing the same. The light emitting diode includes a light emitting structure, a plurality of holes formed through a second conductive type semiconductor layer and an active layer such that a first conductive type semiconductor layer is partially exposed therethrough, and a first electrode and a second electrode electrically connected to the first conductive type semiconductor layer and the second conductive type semiconductor layer, respectively, while being insulated from each other. The second electrode includes openings corresponding to the plurality of holes, a plurality of unit electrode layers separated from each other, and at least one connection layer electrically connecting at least two unit electrode layers to each other. The first electrode forms ohmic contact with the first conductive type semiconductor layer through the plurality of holes and partially covers the light emitting structure. | 12-03-2015 |
20160005939 | LIGHT EMITTING DIODE (LED) COMPONENTS INCLUDING CONTACT EXPANSION FRAME AND METHODS OF FABRICATING SAME - A Light Emitting Diode (LED) component includes an LED die and a contact expansion frame having an expanded anode contact and/or an expanded cathode contact. A patterned solder mask is provided on the contact expansion frame that exposes a portion of the outer face of the expanded anode contact and/or a portion of the outer face of the expanded cathode contact. A solder layer is provided on the portion of the outer face of the expanded anode contact and on the portion of the outer face of the expanded cathode contact. Multiple die components and related fabrication methods are also described. | 01-07-2016 |
20160013384 | LIGHT EMITTING UNIT AND LIGHT EMITTING MODULE | 01-14-2016 |
20160020371 | CHIP-ON-BOARD UV LED PACKAGE AND PRODUCTION METHOD THEREFOR - Disclosed is a chip-on-board UV LED package. The chip-on-board UV LED package comprises: a board in which electrode patterns are formed; a plurality of UV light sources which respectively comprise one or more UV LED chip and a correspondingly provided encapsulating material or lens, and are arrayed in a predetermined array on the board; and a reflecting means which is provided on the board so as to increase the focal length of the light emerging from the plurality of UV light sources. Here, the reflecting means comprises at least one reflector disposed so as to achieve separation between neighbouring UV light sources or between rows or columns of neighbouring UV light sources. | 01-21-2016 |
20160020374 | LIGHT EMITTING MODULE - A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode. | 01-21-2016 |
20160049443 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A display device includes: a substrate; a pixel defining layer defining a pixel region on the substrate; a first electrode on the pixel region; a light emitting layer on the first electrode; a second electrode on the light emitting layer; a thin film encapsulation layer on the second electrode; a metal pattern on the thin film encapsulation layer and overlapping the pixel defining layer; and a multi-layer thin film layer on the metal pattern and the thin film encapsulation layer. | 02-18-2016 |
20160056143 | LIGHT EMITTING DEVICE PACKAGE - A light emitting device package include: a lead frame having one surface with a recess portion provided therein and including a first mounting region positioned on the one surface and a second mounting region positioned in the recess portion; a light emitting device mounted on the first mounting region and electrically connected to the lead frame; and a Zener diode mounted on the second mounting region and connected to the lead frame by a wire. The wire is positioned within the recess portion and is disposed to have a height lower than the first mounting region. | 02-25-2016 |
20160079212 | STRESS RELIEF FOR ARRAY-BASED ELECTRONIC DEVICES - In accordance with certain embodiments, an electric device includes a flexible substrate having first and second conductive traces on a first surface thereof and separated by a gap therebetween, an electronic component spanning the gap, and a stiffener configured to substantially prevent flexing of the substrate proximate the gap during flexing of the substrate. | 03-17-2016 |
20160079483 | LIGHT-EMITTING UNIT AND SEMICONDUCTOR LIGHT-EMITTING DEVICE - A light-emitting unit is provided including a mounting substrate and a semiconductor light-emitting device. The mounting substrate includes a first pad, a second pad, and one or more third pads provided between the first pad and the second pad. The semiconductor light-emitting device includes a plurality of light-emitting elements having a first light-emitting element and a second light-emitting element separated in a first direction. Each light-emitting element includes a first external terminal and a second external terminal separated in the first direction. A first external terminal of the first light-emitting element is bonded to the first pad. A second external terminal of the first light-emitting element and a first external terminal of the second light-emitting element are each bonded to one of the one or more third pads. A second external terminal of the second light-emitting element is bonded to the second pad. | 03-17-2016 |
20160087181 | LIGHT-EMITTING DIODE DEVICE - A light-emitting diode device is disclosed, which comprises a substrate including a first surface; a plurality of light-emitting diode units formed on the first surface, each of the light-emitting diode units including a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; and a plurality of conductive connecting structures, spatially separated from each other, wherein one end of one of the plurality of conductive connecting structure is arranged on the second semiconductor layer, directly contacted with the second semiconductor layer, and electrically connected with each other through the second semiconductor layer; wherein another end of the one of the conductive connecting structures is arranged on another light-emitting diode unit, and directly contacted with one of the semiconductor layers of the another light-emitting diode unit. | 03-24-2016 |
20160099393 | USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND ASSEMBLY - LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances. | 04-07-2016 |
20160099394 | LIGHT SOURCE AND DISPLAY DEVICE INCLUDING THE SAME - A display device includes a light source which comprises a first line receiving power, a second line connected to a ground terminal, a plurality of light source units generating light, first to k-th conductive patterns connecting the light source units to the first and second lines in series, where k is a natural number greater than 1, and a discharge pattern disposed adjacent to the conductive patterns and the second line, and leading static electricity flowing into the conductive patterns to the second line. | 04-07-2016 |
20160104743 | OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME - The invention relates to an optoelectronic device ( | 04-14-2016 |
20160111604 | METHOD FOR EXPANDING SPACINGS IN LIGHT-EMITTING ELEMENT ARRAY AND LIGHT-EMITTING ELEMENT ARRAY UNIT - A method for expanding spacings in a light-emitting element array includes the following steps of: providing a light-emitting element array unit including a stretchable supporting film, and a plurality of light-emitting elements disposed on the stretchable supporting film and arranged into a two-dimensional array; stretching the stretchable supporting film along a first direction and a second direction. The first direction and the second direction respectively correspond to a row direction and a column direction of the two-dimensional array. | 04-21-2016 |
20160126225 | LIGHT-EMITTING DEVICE - A light-emitting device includes light-emitting units and an electrical connection layer. Each light-emitting unit includes a light-emitting stacking layer, a first electrode layer, an insulation layer, and a second electrode layer. The light-emitting stacking layer includes first and second-type doped semiconductor layers, an active layer, and a first inner opening passing through the second-type doped semiconductor layer and the active layer. The second electrode layer is close to and is electrically connected to the second-type doped semiconductor layer. The insulation layer is disposed on a sidewall of the first inner opening and forms a second inner opening. The first electrode layer is disposed in the second inner opening and electrically connected to the first-type doped semiconductor layer. The electrical connection layer is electrically connected to the first electrode layer of one of two adjacent light-emitting units and the second electrode layer of the other adjacent light-emitting unit. | 05-05-2016 |
20160148912 | SEMICONDUCTOR LIGHT-EMITTING DEVICE HAVING MATRIX-ARRANGED LIGHT-EMITTING ELEMENTS AND TRANSPARENT PLATES - A semiconductor light-emitting device includes a support body multiple, multiple light-emitting elements arranged in a matrix on the support body, a transparent resin layer provided on the light-emitting elements, multiple transparent plates provided on the transparent resin layer, each of the transparent plates being provided over one of the multiple light-emitting elements, and multiple optical shield layers each provided at one of a first side face of a first one of the transparent plates and a second the face of a second one of the transparent plates opposing the first the face of the first transparent plate. | 05-26-2016 |
20160155754 | Display Panel and Display Apparatus | 06-02-2016 |
20160190216 | DISPLAY DEVICE COMPRISING BENDING SENSOR - A display device including a bending sensor is provided. A display device including a bending sensor may include a flexible substrate including a display area and a bezel area surrounding the display area; and the bending sensor including a curved unit disposed in the bezel area and in which an electric change occurs when the flexible substrate is bent, and a detection unit detecting bending information by sensing the electric change. | 06-30-2016 |
20160202546 | DISPLAY DEVICE | 07-14-2016 |
20160204185 | LIGHT-EMITTING DEVICE COMPRISING FLEXIBLE SUBSTRATE AND LIGHT-EMITTING ELEMENT | 07-14-2016 |
20160254286 | FLEXIBLE DISPLAY PANEL | 09-01-2016 |
20160254315 | SEMICONDUCTOR DEVICE, LED HEAD, AND IMAGE FORMING APPARATUS | 09-01-2016 |
20160254316 | LED DISPLAY MASK AND LED DISPLAY | 09-01-2016 |
20160254430 | LIGHT EMITTING DEVICE, LEAD FRAME AND RESIN CAVITY MOLDING PACKAGE | 09-01-2016 |
20170236806 | LIGHT EMITTING APPARATUS, ILLUMINATION APPARATUS AND DISPLAY APPARATUS | 08-17-2017 |
20170236811 | METHOD OF SELECTIVELY TRANSFERRING LED DIE TO A BACKPLANE USING HEIGHT CONTROLLED BONDING STRUCTURES | 08-17-2017 |
20180026168 | LED LIGHT SOURCE WITH DIFFUSER | 01-25-2018 |
20190148680 | DISPLAY PANEL, MASK, METHOD FOR MANUFACTURING DISPLAY PANEL, AND DISPLAY DEVICE | 05-16-2019 |
20220140288 | DISPLAY APPARATUS - A display apparatus includes a display element including an emission area, a thin-film encapsulation layer disposed on the display element, a first insulating layer disposed on the thin-film encapsulation layer, the first insulating layer including an opening that corresponds to the emission area, and a refraction area defined by the opening and including an organic material, and a second insulating layer disposed on the first insulating layer, filling the refraction area, and having a refractive index greater than a refractive index of the first insulating layer, wherein the display element includes a first display element and a second display element, and the refraction area has a circular shape or an elliptical shape in a plan view and includes a first refraction area corresponding to the first display element and a second refraction area corresponding to the second display element. | 05-05-2022 |