| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 216019000 | Filling or coating of groove or through hole in a conductor with an insulator | 7 |
| 20080257859 | Molecular characterization with carbon nanotube control - In a method for fabricating a molecule characterization device, there is formed an aperture in a support structure, and electrical contact pads are formed on a selected surface of the support structure for connection to molecular analysis circuitry. Then at the aperture is provided at least one carbon nanotube. An electrically insulating layer is deposited on walls of the aperture to reduce an extent of the aperture and form a smaller aperture, while depositing substantially no insulating layer on a region of the nanotube that is at the aperture. | 10-23-2008 |
| 20090008361 | OXIDANT AND PASSIVANT COMPOSITION AND METHOD FOR USE IN TREATING A MICROELECTRONIC STRUCTURE - A composition that may be used for cleaning a metal containing conductor layer, such as a copper containing conductor layer, within a microelectronic structure includes an aqueous acid, along with an oxidant material and a passivant material contained within the aqueous acid. The composition does not include an abrasive material. The composition is particularly useful for cleaning a residue from a copper containing conductor layer and an adjoining dielectric layer that provides an aperture for accessing the copper containing conductor layer within a microelectronic structure. | 01-08-2009 |
| 20100308010 | COMPOSITE MICROMECHANICAL COMPONENT AND METHOD OF FABRICATING THE SAME - The invention relates to a method ( | 12-09-2010 |
| 20130306593 | ELECTROSTATIC CHUCK AND MANUFACTURING METHOD THEREOF - An electrostatic chuck of a stack structure includes a metal layer interposed between insulating layers and a groove formed at a peripheral portion of the electrostatic chuck to have a thickness gradually increasing toward an outside, the groove being covered with a thermally sprayed insulating film. The thermally sprayed film covers at least a portion of the metal layer exposed at an inside of the groove such that the thermally sprayed film does not protrude from the groove. | 11-21-2013 |
| 20140138346 | PROCESS INTEGRATION OF A SINGLE CHIP THREE AXIS MAGNETIC FIELD SENSOR - A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane. | 05-22-2014 |
| 20140175048 | ELECTRICAL LAPPING GUIDE FOR MANUFACTURE OF A SCISSOR STYLE MAGNETIC SENSOR - A method of manufacturing a magnetic sensor having a hard bias structure located at a back edge of the sensor. The method forms an electrical lapping guide that is compatible for use with such a sensor having a back edge hard bias structure and which can accurately determine a termination point for a lapping operation that forms an air bearing surface of the slider and determines the sensor stripe height. | 06-26-2014 |
| 20150053639 | METHOD OF MANUFACTURING TOUCH DEVICES - A method of manufacturing touch devices comprises the steps of cutting a large-sized substrate into a plurality of even units and then performing the subsequent machining processes, providing the required materials of each structure layer, layer by layer, via sputtering or coating, and then simultaneously forming each structure layer via processes such as photolithography, developing, and etching. Therefore, the manufacturing cost is significantly reduced and the structure strength is substantially enhanced. | 02-26-2015 |
