| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205674000 |
Electrolyte composition or defined electrolyte
| 40 |
| 205641000 |
With control responsive to sensed condition
| 20 |
| 205660000 |
Preliminary cleaning or shaping of workpiece
| 19 |
| 205662000 |
With mechanical abrasion or grinding
| 17 |
| 205645000 |
With measuring, testing, or sensing
| 16 |
| 205686000 |
Moving tool electrode
| 14 |
| 205646000 |
With programmed, cyclic, or time responsive control
| 12 |
| 205668000 |
Local application of electrolyte
| 11 |
| 205666000 |
Using mask
| 8 |
| 205665000 |
Aperture making
| 6 |
| 205652000 |
Gap maintenance or defined tool-workpiece gap
| 6 |
| 205658000 |
Simple alternating current | 5 |
| 20110303553 | ELECTROCHEMICAL SYSTEM AND METHOD FOR MACHINING STRONGLY PASSIVATING METALS - An electrochemical machining system for metals and alloys having a strongly passivating character including an electrolyte solution that is free of hydrofluoric acid, an electrode in contact with the electrolyte solution, a workpiece spaced apart from the electrode and in contact with the electrolyte solution and a power source including a first electrical lead electrically coupled to the electrode and a second electrical lead electrically coupled to the workpiece, the power source being configured to pass an electric current between the electrode and the workpiece, wherein the electric current includes anodic pulses and cathodic pulses, and wherein the cathodic pulses are interposed between at least some of the anodic pulses. | 12-15-2011 |
| 20130026047 | METHOD AND APPARATUS FOR ELECTROLYTIC SURFACE ROUGHENING TREATMENT AND METHOD AND APPARATUS FOR MANUFACTURING PLANOGRAPHIC PRINTING PLATE PRECURSOR - An aluminum support is manufactured at lower cost by efficiently performing a surface roughening treatment with dispersed pits formed on the aluminum support. In an electrolytic surface roughening treatment method for performing an electrolytic surface roughening treatment on a strip-shaped metal as being conveyed in an acidic electrolytic solution by applying an alternating waveform voltage, the method includes a step of applying a negative voltage to the metal plate at least once while the alternating waveform voltage is being applied so that the metal plate assumes a negative polarity. | 01-31-2013 |
| 20110174635 | ELECTROLYTIC TREATMENT METHOD AND ELECTROLYTIC TREATMENT DEVICE - An electrolytic treatment method and electrolytic treatment device are provided for electrolytic treatment of an aluminum web W by applying an alternating current to an upstream electrode and a downstream electrode disposed along a conveying direction a. At least one of a conveying velocity v of the aluminum web W, a frequency f of alternating current applied at the upstream electrode and the downstream electrode, and/or a web conveying direction separation distance d2 between the upstream electrode and the downstream electrode are set such that the alternating current and voltage waveform applied to the aluminum web W at the far end of the upstream electrode and the alternating current and voltage waveform applied to the aluminum web W at the near end of the downstream electrode do not reinforce each other. | 07-21-2011 |
| 20120138480 | Method for the Electrochemical Machining of a Workpiece - The invention relates to a method for electrochemical processing of at least one workpiece, comprising at least the following steps: a) setting a first flow density during a first phase in an electrolyte, b) retaining the first flow density during a second phase following the first phase, c) increasing the first flow density during a third phase following the second phase to a second flow density at least 30% greater than the first flow density, and d) reducing the second flow density during a fourth phase following the third phase within a maximum of 100 microseconds to a maximum of 1% of the second flow density. | 06-07-2012 |
| 20120222968 | SYSTEM AND METHOD FOR METAL DEBURRING - A system includes an electrolytic deburring tool, which includes a first electrode configured to be positioned at a first gap away from a first edge of a workpiece, a second electrode configured to be positioned at a second gap away from a second edge of the workpiece, a first electrolyte supply configured to flow a first electrolyte through the first gap between the first electrode and the first edge of the workpiece, a second electrolyte supply configured to flow a second electrolyte through the second gap between the second electrode and the second edge of the workpiece, and a power supply configured to flow an alternating current through the first gap and the second gap to cause electrolytic dissolution through the workpiece from both the first edge and the second edge. | 09-06-2012 |
| 205671000 |
Agitation or vibration of electrolyte | 5 |
| 20100078334 | ELECTRO-CHEMICAL PROCESSOR - An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer. | 04-01-2010 |
| 20110247943 | SYSTEM AND METHOD FOR ELECTROPOLISING DEVICES - A system and method is described for electropolising tubular metallic prostheses. In one aspect, the system provides a continuously changing set of points of contact between anode and prosthesis. In another aspect, the cathode is given a conical shape to correct for current concentrations that would otherwise exist and unevenly affect the amount of electropolishing over the length of the prosthesis. | 10-13-2011 |
| 20120292201 | Stripping Gold Components and the Method of Stripping Gold - The invention provides a stripping gold component which could remove gold from substrate, comprising: a stripping gold chemical compound; and a assistant conductive compound wherein said stripping gold chemical compound bonds with gold to form covalent bond to strip gold from said substrate, said assistant conductive chemical compound helps the electric conduction and decreases the voltage, said substrate would not be damaged after stripping gold from said substrate, and the stripping gold component is cyanide free. | 11-22-2012 |
| 20140076737 | ELECTROPOLISHING FIXTURE WITH PLUNGER MECHANISM - An electropolishing fixture with a plunger mechanism. The plunger mechanism can establish contact between a device and an anode mandrel during an electropolishing process while the device is immersed in an electrolytic bath. | 03-20-2014 |
| 20140360887 | ELECTROPOLISHING FIXTURE WITH PLUNGER MECHANISM - A method for electropolishing a medical device includes moving a plunger mechanism towards a side of the medical device to establish electrical contact between the medical device and an anode, the plunger mechanism moving transversely to a longitudinal axis of the medical device. Electropolishing the medical device following positioning the plunger mechanism and medical device and then removing the medical device and the anode from the electrolytic bath and unloading the medical device from the anode following electropolishing. | 12-11-2014 |
| 205655000 |
With irradiation or illumination | 4 |
| 20090084684 | Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method - There is provided a method for manufacturing a printed wiring board that allows molten scattered Cu and an overhang to be selectively removed while scarcely decreasing a thickness of wires, and an electrolytic etching solution suitably used in the method. In the method for manufacturing a printed wiring board in which a via that reaches from a surface copper layer to an inner-layer copper layer of a multilayer board in which copper layers and insulating layers are alternately layered is machined by means of a laser, a process of machining the via including steps of forming a laser absorbing layer on a surface of a copper layer disposed on the surface of the multilayer board, irradiating the laser, performing an electrolytic etching and removing the laser absorbing layer is carried out in this order. | 04-02-2009 |
| 20100012506 | COMBINED ELECTROCHEMICAL AND LASER MICROMACHING PROCESS FOR CREATING ULTRI-THIN SURFACES - Ultra-thin sections in an electrically conducting material are formed by electrochemically removing material to a thickness of approximately 5 to 150 micrometers and removing further material by laser micromachining to a material thickness of 1 to 30 micrometers. The electrochemical process quickly removes substantial material but is not as precise and accurate as laser machining to create the ultra-thin sections or translucent sections. Removing material by an electrochemical process may be controlled down to a thickness of approx. 10-12 micrometres so that enough margin of a material thickness is left at the bottom of this first cavity. The laser micromachining process removes remaining material down to a predetermined level, e.g. 1-5 micrometres, relatively rapidly, so that a relatively quick process for the manufacture of ultra-thin sections in an electrically conducting material is achieved. A metal structure manufactured by the novel and inventive process is disclosed. | 01-21-2010 |
| 20110094895 | Optical detection of planarization, breakthrough and end-point in membrane-mediated electropolishing of metal layers - Methods and apparatus for monitoring in situ the progress of planarization and/or removal of a thin metal layer from a substrate during membrane-mediated electropolishing processes are provided. | 04-28-2011 |
| 20110186443 | Electrochemical substrate slicing using electromagnetic wave excitation - An apparatus for cutting a workpiece using electrochemical etching and a method of using thereof are described. The apparatus includes an electrochemical bath configured to contain an electrochemical solution, a support apparatus configured to support and immerse a workpiece in the electrochemical bath, and a non-contact cutting device configured to extend into the electrochemical bath and slice the workpiece via electrochemical etching along a cutting plane. The apparatus further includes an electromagnetic (EM) radiation source configured to illuminate a cutting surface formed between opposing sidewalls within an evolving cutting groove formed in the workpiece during slicing along the cutting plane. | 08-04-2011 |
| 205672000 |
Defined electrolyte movement or pressure | 4 |
| 20090032408 | ELECTROLYTE RETAINING ON A ROTATING PLATEN BY DIRECTIONAL AIR FLOW - A method and apparatus for retaining electrolyte on a rotating platen using directional air flow is provided. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a processing pad and disposed on a stationary base so that the platen assembly may rotate relative to the base; and an air knife coupled to the base and extended over a portion of the surface, the air knife operable to deliver a stream of air toward the pad to divert at least a portion of a fluid disposed on the pad toward a center of the pad. | 02-05-2009 |
| 20110290663 | SYSTEM AND METHOD FOR METAL CUTTING - According to various embodiment, a system includes an electrolytic cutting tool. The electrolytic cutting tool includes a first cathode configured to be positioned at a first gap away from a first side of a workpiece, a second cathode configured to be positioned at a second gap away from a second side of the workpiece. The first and second cathodes are positioned opposite from one another. The electrolytic cutting tool also includes a first electrolyte passage configured to flow a first electrolyte through the first gap between the first cathode and the workpiece, a second electrolyte passage configured to flow a second electrolyte through the second gap between the second cathode and the workpiece, and a power supply configured to flow current through the first gap and the second gap to cause electrolytic dissolution through the workpiece from both the first side and the second side. | 12-01-2011 |
| 20130186773 | ELECTROCHEMICAL MACHINING METHOD AND APPARATUS - Electrochemical machining method and apparatus wherein in one aspect of the invention, the machining voltage is selected to maintain the highest current without initiating substantial hydrolysis of the electrolyte flushed between the work piece anode and tool cathode. In another aspect of the invention, the Low Machining Potential Voltage (LPMV) and High Machining Potential Voltage (HMPV) for a particular work piece material are identified and the work piece is machined using a voltage at or between the LMPV and HMPV. In yet another aspect of the invention, direct perturbation of the Beta Insulating Layer (BIL) is carried out in an optimally small (between about near zero to about 100 inter-electrode gap (IEG) with constant and simultaneous pulling in and pushing out of the electrolyte through the IEG. | 07-25-2013 |
| 20150299892 | POROUS SILICON ELECTRO-ETCHING SYSTEM AND METHOD - It is an object of this disclosure to provide high productivity, low cost-of-ownership manufacturing equipment for the high volume production of photovoltaic (PV) solar cell device architecture. It is a further object of this disclosure to reduce material processing steps and material cost compared to existing technologies by using gas-phase source silicon. The present disclosure teaches the fabrication of a sacrificial substrate base layer that is compatible with a gas-phase substrate growth process. Porous silicon is used as the sacrificial layer in the present disclosure. Further, the present disclosure provides equipment to produce a sacrificial porous silicon PV cell-substrate base layer. | 10-22-2015 |
| 205673000 |
Regenerating or rehabilitating, per se, of electrolyte | 2 |
| 20080210571 | Machine And Method For Electrochemically Polishing Indentations Within An Aluminum Wheel - A machine for electrochemically polishing indentations within the wall of an aluminum workpiece, such as a wheel, has a cathode attached to an upper platen. The workpiece is mounted upon a lower platen which acts as an anode. Electrolyte is passed between the cathode and the anode while simultaneously a current is applied which passes through the cathode and the anode. The current is selectively pulsed to maximize polishing but at the same time to permit the flushing away of residual material and to cool the cathode and the workpiece. | 09-04-2008 |
| 20100213077 | ELECTRODIALYSIS METHOD FOR TREATMENT OF SILICATE-CONTAINING POTASSIUM HYDROXIDE ETCHING WASTE SOLUTION - An electrodialysis method for the treatment of silicate-containing potassium hydroxide etching waste solution is provided. The method comprises: providing a reaction tank including a cathode, an anode, and two cation dialysis membranes, wherein the reaction tank is divided by the cation dialysis membranes into a cathode chamber, an anode chamber and a waste solution disposing chamber located therebetween; filling a sulfuric acid solution into the anode chamber; filling a potassium hydroxide solution into the cathode chamber; introducing a silicate-containing potassium hydroxide etching waste solution into the waste solution disposing chamber; and applying a voltage and a current density to each of the chambers to render potassium ions to transport from the waste solution chamber through the cation dialysis membrane to the cathode chamber. | 08-26-2010 |
| 205656000 |
Eroding workpiece of nonuniform internal electrical characteristics | 2 |
| 20090107851 | Electrolytic polishing method of substrate - An electrolytic polishing method of a substrate having a barrier film and an interconnect metal layer on a surface to be processed under the presence of an electrolytic solution, including a barrier film electrolytic polishing process which removes the barrier film by applying a voltage between a cathode and an anode, with the surface to be processed serving as the cathode, and causing relative motion between the surface to be processed and a polishing pad which faces and makes contact with the surface to be processed. | 04-30-2009 |
| 20150068918 | WAFER CONTACTING DEVICE, AND ARRANGEMENT AND METHOD FOR ELECTROCHEMICAL ETCHING OF A WAFER - A wafer contacting device may include: a receiving region configured to receive a wafer; and an elastically deformable carrier disposed in the receiving region and including an electrically conductive surface region. | 03-12-2015 |
| 205664000 |
Sharpening or point making | 1 |
| 20110198233 | PRODUCING METHOD FOR GRATER - A producing method for grater includes: coating etching resistant layers ( | 08-18-2011 |
| Entries |
| Document | Title | Date |
|---|
| 20080202940 | Electrodes With Increased Surface Area And Methods of Making - Disclosed herein, among other things, are high surface area electrodes and methods of making the same. In an embodiment, the invention includes a method of increasing the surface area of an electrode of an implantable medical device including immersing the electrode in an electrolyte solution and oxidatively removing material from the surface of the electrode. In an embodiment, the invention includes a method of increasing the surface area of an electrode of an implantable medical device including immersing the electrode in an electrolyte solution and applying an oscillating electrical potential. In an embodiment, the invention includes a method of manufacturing an implantable stimulation lead including welding an electrode to a conductor and increasing the surface area of the electrode by oxidatively removing a portion of the electrode surface. Other aspects and embodiments are provided herein. | 08-28-2008 |
| 20080245674 | SYSTEM AND METHOD FOR OBTAINING ANISOTROPIC ETCHING OF PATTERNED SUBSTRATES - Systems and methods for etching topographic features in non-crystalline or metallic substrates are provided. A protective material is placed and patterned on a surface of the substrate to define exposed and protected regions of the substrate for etching in a liquid etchant having etching rates that are thermally activated. A nonuniform temperature profile is imposed on the substrate so that the temperatures and hence the etching rates at surfaces in the exposed regions are higher than those in the protected regions. Arrangements for imposing the nonuniform temperature profile include heating designated portions of the substrate with light radiation. Alternatively, the non-uniform temperature profile is developed as etching progresses by passing current pulses through the substrate in a manner that causes geometrically non-uniform heating of the substrate. | 10-09-2008 |
| 20090008264 | SYSTEM AND METHOD FOR PROVIDING ELECTROCHEMICAL MACHINING OF A DEVICE - A system and method for electrochemically machining a work-piece contains a fixture capable of receiving a work-piece and securing the work-piece to the fixture. An electrolyte source is also provided. In addition, the system contains a rotary drive subassembly capable of receiving a portion of the work-piece therein, motion of the rotary drive assembly being determined by a received control signal, wherein frequency and amplitude of the control signal increases and decreases motion of the rotary drive subassembly, and wherein the control signal is a trapezoidal waveform. | 01-08-2009 |
| 20090038959 | Highly Pure Stainless Steel Process - This invention discloses a proper process control to produce a highly pure stainless steel cable products, including electro skim to improve smoothness of the rough surface of said product, electrolyte bath, electropolishing for leveling of roughness on the surface of said product and for increased resistance to corrosion, activation with weak acid, bath cleaning, and drying. | 02-12-2009 |
| 20090095637 | Electrochemical polishing method and polishing method - The present invention provides an electrochemical polishing method capable of increasing a polishing speed while preventing excessive polishing, such as dishing or erosion. In the electrochemical polishing method, when a voltage applied to a conductive film formed on the surface of a substrate is increased at a contact surface pressure of 0 between the surface of the substrate and a polishing pad, a voltage at a first change point C that allows a current density to start to decrease after an increase is referred to as a minimum voltage. In addition, when the voltage is increased at a contact surface pressure having a finite value, a voltage at a second change point B that allows the current density to be maintained constant after the decrease is referred to as a maximum voltage. In this case, the surface of the conductive film is polished while maintaining the voltage to be not lower than the minimum voltage and not higher than the maximum voltage. Further, the present invention provides an electrochemical polishing method capable of rapidly removing a conductive film in regions other than a contact plug or wiring line forming region while preventing excessive polishing, such as dishing or erosion. In the electrochemical polishing method, in a step of increasing a voltage, when the voltage is increased at a contact surface pressure of 0, a voltage at a first change point C that allows a current density to start to decrease after an increase is referred to as a threshold voltage, and the voltage is increased such that a voltage in a region in which a barrier film is exposed is higher than the threshold voltage. | 04-16-2009 |
| 20090200177 | PROCESS FOR FORMING AN IMPROVED METAL ALLOY STENT - A method and process for at least partially forming a medical device that is at least partially formed of a novel metal alloy which improves the physical properties of the medical device. | 08-13-2009 |
| 20090211921 | PROCEDURE FOR THE PRODUCTION AND APPLICATION OF A PROTECTIVE LAYER - The invention at hand relates to a method for processing and repairing a metal component with at least one finished or nearly finished partial component surface and at least one working surface to be further processed by means of an electrochemical treatment process and abutting the at least one finished or nearly finished partial component surface, with the process comprising the following steps: a) application of an electrically conductive layer on at least one area of the at least one finished or nearly finished partial component surface abutting the working surface to be processed, with the layer containing a metal or a metal alloy that has a similar or the same as, or a desiredly different electrochemical erosion behavior than the metal component; and b) electrochemical treatment of the working surface and of the layer, with the layer being completely or nearly completely eroded. The invention moreover relates to a component of a gas turbine or of a high or low pressure compressor. | 08-27-2009 |
| 20090255827 | AUTOMATED ELECTROPOLISHING PROCESS - An electropolishing system including an anode, a cathode, a rolling block and a motion controller. The anode is configured to removably retain a metal device to be electropolished, and may be formed as a bar made from a solid cylindrical piece of metal or other configurations, such as wires with hooks. The anode transfers the electricity to the metal device while grooming the surface of the metal device as it contacts the rolling block. The cathode may be configured as a mesh and completes the electrical circuit. The rolling block is formed from a relatively smooth, solid material and positioned so as to allow the metal device to roll against the surface of the block. The motion controller is configured to provide vertical and horizontal movement of the anode and metal device, using force transducers to control the compression of the metal device against the rolling block. | 10-15-2009 |
| 20090277801 | Photoresist-free metal deposition - Selectively accelerated or selectively inhibited metal deposition is performed to form metal structures of an electronic device. A desired pattern of an accelerator or of an inhibitor is applied to the substrate; for example, by stamping the substrate with a patterned stamp or spraying a solution using an inkjet printer. In other embodiments, a global layer of accelerator or inhibitor is applied to a substrate and selectively modified in a desired pattern. Thereafter, selective metal deposition is performed. | 11-12-2009 |
| 20100155260 | MICRO-BLASTING TREATMENT FOR LEAD FRAMES - Method of manufacturing a lead frame wherein a bare lead frame material is immersed in a salt solution. Gas bubbles are provided in the salt solution next to the bare lead frame material such that the bubbles contact a surface of the lead frame material and pop in proximity to the bare lead frame material causing chemical reactions on the surface of the lead frame, thereby forming a plurality of dimples of irregular sizes on the surface of the lead frame. | 06-24-2010 |
| 20100163426 | ELECTROCHEMICAL PLANARIZATION SYSTEM COMPRISING ENHANCED ELECTROLYTE FLOW - A polishing pad for an electrochemical planarization tool comprises a patterned surface that forms appropriate electrolyte flow channels for directing an electrolyte from the center to the periphery thereof. Consequently, a continuous electrolyte flow may be established, thereby significantly reducing the accumulation of contaminants in the polishing pad, thereby contributing to enhanced process uniformity so that frequent rinsing of the polishing pad and replacement of the electrolyte solution may be avoided. | 07-01-2010 |
| 20100288648 | METHOD AND APPARATUS FOR ETCHING THE SURFACES OF INTEGRALLY BLADED ROTORS - For electrolytically etching the surfaces of integrally bladed rotors (blisks) ( | 11-18-2010 |
| 20110048963 | METHOD OF MANUFACTURING ELECTROPOLISHING PAD - The present invention aim to provide a method of manufacturing an electropolishing pad, which is excellent in planarity, can reduce occurrence of scratches, and has a high polishing rate. The present invention relates to a method of manufacturing an electropolishing pad, including the steps of: laminating a tin sheet on and along a recessed structure surface of a resin layer to produce a laminated sheet having grooves in a tin sheet surface; and forming through holes penetrating the tin sheet and the resin layer in the laminated sheet. | 03-03-2011 |
| 20110114506 | Quadratic Electrolysis - An electrolysis device to separate water into its more economically valuable constituent hydrogen and oxygen gases. A neutral plate is interleaved between every magnetically charged electrode in an electrode stack to provide a means of spark suppression, a physical barrier between the hydrogen gas created at the cathode and oxygen gas created at the cathode, and to reduce deterioration of electrode surfaces caused by alternating polarity from an anode state to a cathode state. Scale of electrolysis cell electrodes are partially cleaned through a cycling of system polarity through a neutral electrode period. A means is provided to isolate and segregate dissociated hydrogen and oxygen gas. | 05-19-2011 |
| 20110114507 | ELECTROLYTICALLY ETCHING METHOD AND APPARATUS OF SURFACE OF NUCLEAR REACTOR CORE INTERNALS - Even a site having a complicated curved surface shape, such as a welded spot on a bottom of a nuclear reactor core, is simply and electrolytically etched without discharging an etching liquid in a large amount, whereby grain boundary on the surface of the nuclear reactor core internals can be confirmed visually. | 05-19-2011 |
| 20110120882 | POROUS SILICON ELECTRO-ETCHING SYSTEM AND METHOD - It is an object of this disclosure to provide high productivity, low cost-of-ownership manufacturing equipment for the high volume production of photovoltaic (PV) solar cell device architecture. It is a further object of this disclosure to reduce material processing steps and material cost compared to existing technologies by using gas-phase source silicon. The present disclosure teaches the fabrication of a sacrificial substrate base layer that is compatible with a gas-phase substrate growth process. Porous silicon is used as the sacrificial layer in the present disclosure. Further, the present disclosure provides equipment to produce a sacrificial porous silicon PV cell-substrate base layer. | 05-26-2011 |
| 20120043222 | COATING METHOD FOR FORMING PATTERN ON WORKPIECE - A coating method for forming a pattern on a workpiece includes: providing a workpiece constituting a surface; forming a coating layer over the surface using a physical vapor deposition method; providing a mask including a through hole having a shape conforming to a predetermined pattern; attaching the mask to the surface such that a portion of the coating layer is exposed through the through hole, the coating layer consisting of the exposed portion and an unwanted portion surrounding the exposed portion; forming a shielding layer on the exposed portion of the coating layer in the through hole; removing the mask; removing the unwanted portion of the coating layer; and removing the shielding layer to obtain the exposed portion having the predetermined pattern. | 02-23-2012 |
| 20120080321 | Display Device - A display device comprises a first insulating substrate ( | 04-05-2012 |
| 20140131221 | PERMANENT CATHODE AND A METHOD FOR TREATING THE SURFACE OF A PERMANENT CATHODE - The invention relates to a permanent cathode ( | 05-15-2014 |
| 20140238872 | SYSTEMS AND METHODS FOR SEPARATING COMPONENTS OF A MULTILAYER STACK OF ELECTRONIC COMPONENTS - Systems and methods for separating components of a multilayer stack of electronic components are disclosed herein. The multilayer stack may include an electronic assembly, a substrate, and a sacrificial anode portion that is located between the electronic assembly and the substrate and that operatively attaches the electronic assembly to the substrate. The methods may include locating the multilayer stack within an electrically conductive fluid to form an electrochemical cell and generating a potential difference between a cathode portion of the electronic assembly and the sacrificial anode portion. The methods further may include separating the electronic assembly from the substrate by electrochemically oxidizing the sacrificial anode portion to dissolve the sacrificial anode portion within the electrically conductive solution. | 08-28-2014 |
| 20150021198 | CONTINUOUS MACHINING SYSTEM AND MACHINING METHOD THEREOF - The present invention provides a continuous machining system and the machining method thereof. The machining system comprises a feeding module, an electrochemical machining module, and a separating module. The feeding module supplies a material strip continuously; the electrochemical machining module performs an electrochemical machining to the material strip. When the feeding module supplies the material strip to the electrochemical machining module continuously, the electrochemical machining module performs the electrochemical machining to the material strip continuously for forming continuously a plurality of components on the material strip. The separating module separates the plurality of components from the material strip. Thereby, the machining time is saved, and thus achieving the purposes of continuous machining and mass production. | 01-22-2015 |
| 20150034494 | ELECTRO-CHEMICALLY MACHINING WITH A MOTOR PART INCLUDING AN ELECTRODE - A method includes rotating a first motor part around a first structure substantially similar to a second motor part. The method also includes applying a first current to the first structure to electro-chemically machine the first motor part. | 02-05-2015 |
