| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205666000 | Using mask | 8 |
| 20100032315 | Electrolytic processing apparatus and electrolytic processing method - An electrolytic processing apparatus, prior to carrying out plating directly on, e.g., a ruthenium film of a substrate using the ruthenium film as a seed layer, can securely remove a passive layer formed on a surface of the ruthenium film even when the substrate is a large-sized high-resistance substrate, such as a 300-mm wafer, thereby reducing the terminal effect during the subsequent plating, improving the quality of a plated film and enabling filling of a void-free plated film into a fine interconnect pattern. The electrolytic processing apparatus includes: an anode disposed opposite a seed layer of a noble metal or a high-melting metal, formed on a substrate; a porous body impregnated with an electrolytic solution, disposed in a space, filled with the electrolytic solution, between the substrate and the anode; and a control section for controlling an electric field on a surface of the seed layer so that a reduction reaction takes place in the seed layer, thereby electrolytically and electrochemically removing a passive layer formed in the surface of the seed layer. | 02-11-2010 |
| 20100181207 | Method For Fabricating Embedded Thin Film Resistors Of Printed Circuit Board - A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. In comparison with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the parasitic capacitive reactance effect caused by two contact ends of the conventional resistors is also avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly. | 07-22-2010 |
| 20100243472 | HIGH-THROUGHPUT LOCAL OXIDATION NANOLITHOGRAPHIC PROCESS - In a lithographic process suitable for use in the manufacture of electronic components, oxidative reactions are employed to reproducibly fabricate patterns having micro- or nano-scale dimensions. An electrically-conductive template is fabricated to have a nanometer-scale sharp edge and describe a pattern having a micron-scale length. The oxidative reaction is mediated by a water meniscus connecting the sharp edge of the template and an oxidizable substrate. One suitable substrate is graphene. The template can be controllably positioned using a light lever method. | 09-30-2010 |
| 20110017608 | ELECTROCHEMICAL ETCHING AND POLISHING OF CONDUCTIVE SUBSTRATES - A method for electrochemically etching a metal layer through an etch-resist layer pattern using a non-active electrolyte solution is described. The method is particularly useful in fabrication of advanced fuel delivery systems for land-based power generation turbines and aerospace turbine engines; of components for advanced thermal management in aerospace electronic devices and in cooling channels; of stents used in medicine; and of microchannels for sensors, chemical reactors, and dialysis and the like. In one embodiment of the invention the metal layer is copper and the non-active electrolyte solution is a mixture of sodium nitrate and sodium chloride and a pulse electric current is employed to accomplish the electrochemical etching. | 01-27-2011 |
| 20130153439 | METHOD FOR MASS TRANSFER OF MICRO-PATTERNS ONTO MEDICAL DEVICES - This invention is directed to a new method of mass-transfer/fabrication of micro-sized features/structures onto the inner diameter (ID) surface of a stent. This new approach is provided by technique of through mask electrical micro-machining. One embodiment discloses an application of electrical micro-machining to the ID of a stent using a customized electrode configured specifically for machining micro-sized features/structures. | 06-20-2013 |
| 20140246331 | METHOD FOR MASS TRANSFER OF MICRO-PATTERNS ONTO MEDICAL DEVICES - This invention is directed to a new method of mass-transfer/fabrication of micro-sized features/structures onto the inner diameter (ID) surface of a stent. This new approach is provided by technique of through mask electrical micro-machining One embodiment discloses an application of electrical micro-machining to the ID of a stent using a customized electrode configured specifically for machining micro-sized features/structures. | 09-04-2014 |
| 20140262821 | Methods of Etching Carbon Nanotube Sheet Material for Electrical Circuit and Thin Film Thermal Structure Applications - A method for etching Carbon Nanotube (CNT) sheet material for electrical circuit and thin film thermal structures. The method includes: forming an mask on a sheet of electrically conductive CNT material; and electrochemically removing unmasked portions of the CNT material. | 09-18-2014 |
| 20150329986 | PROCESS FOR ELECTROCHEMICALLY MAKING AT LEAST ONE POROUS AREA OF A MICRO AND/OR NANOELECTRONIC STRUCTURE - A process for making at least one porous area (ZP) of a microelectronic structure in at least one part of an conducting active layer ( | 11-19-2015 |
