| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205291000 |
Copper
| 52 |
| 205283000 |
Chromium
| 15 |
| 205264000 |
Platinum group metal
| 8 |
| 205305000 |
Zinc
| 7 |
| 205263000 |
Silver
| 6 |
| 205300000 |
Tin
| 6 |
| 205271000 |
Nickel | 5 |
| 20110114498 | Semi-Bright Nickel Plating Bath and Method of Using Same - A nickel plating bath for plating a semi-bright nickel deposit on a substrate comprising a) nickel sulfate ions; b) a soluble salt of chloroacetic acid, acetic acid, glycol acid or proprionic acid; and d) at least one diol selected from the group consisting of hexyne diol, butyne diol and combinations of the foregoing. The semi-bright nickel plating bath described herein produces sulfur-free semi-bright deposits over a very wide current density range. It does not contain coumarin but produces desirable leveling characteristics. The bath requires no aldehydes to achieve simultaneous thickness and electrolytic potential (STEP) and has extremely low stress and excellent ductility. | 05-19-2011 |
| 20110155582 | Semi-Bright Nickel Plating Bath and Method of Using Same - A nickel plating bath for plating a semi-bright nickel deposit on a substrate comprising a) nickel sulfateions; b) a soluble salt of chloroacefic acid, acetic acid, glycolic acid, proprionic acid, benzoic acid, salicylic acid or chlorobenzoic acid; and c) at least one diol selected from the group consisting of hexyne diol, butyne diol and combinations of the foregoing. The semi-bright nickel plating bath described herein produces sulfur-free semi-bright deposits over a very wide current density range. The plating bath described herein is at least substantially free of coumarin and produces desirable leveling characteristics. The bath also requires no aldehydes to achieve simultaneous thickness and electrolytic potential (STEP) and has extremely low stress and excellent ductility. | 06-30-2011 |
| 20110272289 | Boric acid replenishment in electroplating baths - Boric acid is replenished in an electroplating bath via a replenishment solution comprising boric acid dissolved in pure water, in which the solubility at room temperature is comparable to that in the plating bath at operating temperature. The replenishment solution may be used to replace all or part of the water lost by evaporation. An automated device may be used to replenish boric acid in the electroplating bath. | 11-10-2011 |
| 20130168259 | ELECTROLYTIC BATH FOR ELECTRODEPOSITION AND METHOD FOR PRODUCING SAME - An electrolytic bath for electrodeposition includes nickel salt, phosphoric acid, phosphonic acid, and boric acid in solution. A method for producing an electrolytic bath includes the steps of mixing a nickel salt, phosphoric acid, phosphonic acid, and boric acid, and adding nickel carbonate in order to increase the pH value. | 07-04-2013 |
| 20160024675 | FILM-FORMING METAL SOUTION AND METAL FILM-FORMING METHOD - A film-forming metal solution for supplying metal ions to a solid electrolyte membrane in film formation is provided. In the film formation, the solid electrolyte membrane is disposed between an anode and a substrate as a cathode, and the solid electrolyte membrane is brought into contact with the substrate and a voltage is placed between the anode and the substrate to precipitate a metal on a surface of the substrate from the metal ions contained in the solid electrolyte membrane, so that a metal film of the metal is formed on the surface of the substrate. The film-forming metal solution contains a solvent, and the metal dissolved in the solvent in an ionic state. A hydrogen ion concentration of the film-forming metal solution is within a range of 0 to 10 | 01-28-2016 |
| 205262000 |
Group VIIB transition metal (i.e., Mn, Tc, or Re) | 3 |
| 20080302668 | ELECTROLYTE AND PROCESS FOR DEPOSITING A MATT METAL LAYER - An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises
| 12-11-2008 |
| 20100044240 | LIQUID CRYSTAL TEMPLATED DEPOSITION METHOD - When depositing a metal or a compound of the metal from a liquid crystal phase comprising a metal compound, e.g. a metal salt, by electrochemical means, high concentrations of the salt may be employed by using an ionic surfactant in place of the commonly used non-ionic surfactant. | 02-25-2010 |
| 20150292098 | Ionic Liquid Electrolyte and Method to Electrodeposit Metals - An electrolyte and a method to electroplate a metal on a substrate using the electrolyte are described. The electrolyte includes an imidazolium compound, a metal salt, and water. The imidazolium compound has formula (I) | 10-15-2015 |
| 205266000 |
Gold | 3 |
| 20120132533 | GOLD PLATING SOLUTION - A gold plating bath and a plating method is disclosed where gold cyanide or salts thereof provide the source of gold, a cobalt compound, and a reaction product of compound containing at least a nitrogen-containing heterocyclic compound and an epihalohydrin. The gold plating bath has high deposition selectivity. | 05-31-2012 |
| 20080245670 | Electrochemical Detection of Arsenic - Electrochemical methods and materials for the detection of arsenic. In one aspect, arsenic is detected using a working electrode comprising particulate platinum. In another aspect, arsenic is detected using an electrode comprising indium tin oxide and particulate gold. Also provided are methods for the production of electrodes which involve the electrodeposition of gold onto indium tin oxide. | 10-09-2008 |
| 20090057160 | INTERLEAVED HELICAL COILS ON PERPENDICULAR HEADS - A method for manufacturing a write head with a helical coil having a very small and well controlled spacing between adjacent coil leads. The method includes forming a first set of coil leads, then conformally depositing a thin layer of electrically insulating material such as alumina over the first set of coil leads and over the substrate. An electrically conductive seed layer is then deposited over the thin layer of non-magnetic, electrically insulating material An electrically conductive material such as Cu is then deposited by electroplating in order to form a second set of electrically conductive leads interspersed within the first set of electrically conductive leads, each of the second set of leads being separated from the second set of leads by a portion of the thin layer of non-magnetic, electrically insulating material. | 03-05-2009 |
| 205269000 |
Cobalt | 2 |
| 20090242418 | COATING METHOD AND ELECTROLYZING APPARATUS USED THEREFOR - The present invention provides a coating method, in which a composite coating layer is formed on a surface of an alloy base member by utilizing a rotary electrode device. The coating method includes the steps of: preparing an electrolytic solution containing A ion wherein A is Co or Ni; preparing a MCrAlY powder wherein M denotes at least one element selected from the group consisting of Ni and Co, and the MCrAlY powder contains at least Ni when A is Co or the MCrAlY powder contains at least Co when A is Ni; preparing a dispersion liquid by dispersing the MCrAlY powder into the electrolytic solution; immerging the cylindrical rotary electrode and the alloy base member into the dispersion liquid; and electrolyzing the surface of the alloy base member while the cylindrical rotary electrode covered with the nonwoven fabric layer is rolled on the on the surface of the alloy base member thereby to form the composite coating layer onto the surface of the alloy base member. | 10-01-2009 |
| 20220136123 | COBALT CHEMISTRY FOR SMOOTH TOPOLOGY - An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH adjuster; and (4) an organic additive, which contains a suppressor. The electroplated cobalt deposit exhibits a level surface such that the thickness difference across substantially the entire surface of the substrate of less than about 200 nm. | 05-05-2022 |
| 205270000 |
Iron | 2 |
| 20130206603 | ELECTROLYTIC FREEZING OF ZINC SURFACES - The present invention relates to a method for the metallizing pretreatment of galvanized and/or alloy-galvanized steel surfaces or joined metallic components having at least some zinc surfaces, wherein a thin surface layer of iron is deposited on the zinc surfaces from an aqueous electrolyte containing water-soluble compounds that are a source of iron cations. The method is performed at least partially or continuously under application of an electrolytic voltage, the galvanized and/or alloy-galvanized steel surfaces being connected as cathode. The aqueous electrolyte additionally contains an accelerator selected from oxo acids of the elements phosphorus, nitrogen and/or sulfur, the elements phosphorus, nitrogen and/or sulfur being present in moderate oxidation states. | 08-15-2013 |
| 20150345041 | IRON STRIKE PLATING ON CHROMIUM-CONTAINING SURFACES - The present disclosure provides materials that include a stainless steel layer with a consistent or substantially consistent composition diffusion bonded to a carbon steel substrate. The material can have the corrosion resistance associated with the explosively welded stainless steel and the deep diffusion bonding observed typical of chromizing applications. In some embodiments, the disclosure provides materials having metal layers deposited onto a chromium surface and methods for depositing metal layers onto chromium surfaces. The present disclosure recognizes certain advantages to depositing metal layers onto chromium, such as more rapid diffusion of metals when heated to provide a stainless steel layer. | 12-03-2015 |
| 205281000 |
Cadmium | 1 |
| 20110108429 | Method of recycling Cd-112 isotope - Cd-112 isotope is recycled from a Cd-112 chemical separated solution or a remainder of an electroplating solution having a Cd-112 target. The present invention recycles Cd-112 isotope with a low cost, a high purity and a high recycle rate. The recycled Cd-112 isotope can be easily stored. And, the Cd-112 isotope can be used as an imaging agent in nuclear medicine. | 05-12-2011 |
| Entries |
| Document | Title | Date |
|---|
| 20080210567 | Electrodeposition Material, Process for Providing a Corrosion-Protective Layer of TiO2 on an Electrically Conductive Substrate and Metal Substrate Coated with a Layer of TiO2 - The present invention relates to electrodeposition material for the electrochemical deposition of a corrosion-protective layer of TiO | 09-04-2008 |
| 20080230395 | Metal surface treatment liquid for cation electrodeposition coating - A surface treatment with a zirconium ion that enables sufficient throwing power and superior anti-corrosion properties to be exhibited when thus surface treated metal base material is subjected to cation electrodeposition coating is provided. A metal surface treatment liquid thereof for cation electrodeposition coating includes zirconium ions, copper ions, and other metal ions, and having a pH of 1.5 to 6.5, in which: the other metal ions are at least one selected from the group consisting of tin ions, indium ions, aluminum ions, niobium ions, tantalum ions, yttrium ions and cerium ions; the concentration of zirconium ions is 10 to 10,000 ppm; the concentration ratio of the copper ions to the zirconium ions is 0.005 to 1 on a mass basis; and the concentration ratio of the other metal ions to the copper ions is 0.1 to 1,000 on a mass basis. | 09-25-2008 |
| 20080257746 | Method for Producing Metal Thin Body - A method for producing a metal thin body by electroplating, in which the relative integrated intensity of the (111) plane of the metal thin body can be increased to 65% or greater. By carrying out electroplating using an electrolytic solution (plating solution) containing 5% in volume or greater of acetonitrile and water, in particular, using an electrolytic solution (plating solution) containing 10% in volume or greater of acetonitrile and water, the relative integrated intensity of the (111) plane can be increased to 65% or greater. | 10-23-2008 |
| 20080314756 | Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal - Presented are methods and systems for fabricating three-dimensional integrated circuits having large diameter through-hole vias. One embodiment of the present invention provides a method of processing a wafer having holes for through-hole vias. The method comprises plating a gapfill metal on the wafer. The method also comprises chemically or electrochemically deplating a portion of the overburden metal. The method further comprises using chemical mechanical planarization to planarize the gapfill metal and to remove the remaining overburden metal. Another embodiment of the present invention is an integrated system comprising a process chamber for containing the wafer, a plating component integrated with the process chamber, and a deplating component integrated with the process chamber. The plating component is configured to electrochemically plate a gapfill metal onto the wafer to a least partially fill the holes. The deplating component is configured to chemically or to electrochemically remove a portion of the overburden metal formed by the plating component. | 12-25-2008 |
| 20090188808 | INDIUM ELECTROPLATING BATHS FOR THIN LAYER DEPOSITION - Indium (In) electroplating solutions which are used to deposit compositionally pure, uniform, substantially defect free and smooth In films with near 100% plating efficiency and repeatability. In one embodiment the plating solution includes an In source, citric acid and its conjugate pair salt and a solvent. At a pH value of below 4.0, sub-micron thick In layers with close to 100% purity at close to 100% plating efficiency are produced. Such In layers are used in fabrication of electronic devices such as thin film solar cells. | 07-30-2009 |
| 20100032310 | Method and apparatus for electroplating - An apparatus for electroplating a layer of metal on the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer (preferably within 5 mm of the wafer surface) which serves to modulate ionic current at the wafer surface, and a second cathode configured to divert a portion of current from the wafer surface. The ionically resistive ionically permeable element in a preferred embodiment is a disk made of a resistive material having a plurality of perforations formed therein, such that perforations do not form communicating channels within the body of the disk. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect. | 02-11-2010 |
| 20100116678 | GALLIUM ELECTROPLATING METHODS AND ELECTROLYTES EMPLOYING MIXED SOLVENTS - An electrochemical deposition method and electrolyte to plate uniform, defect free and smooth gallium films are provided. In a preferred embodiment, the electrolyte may include a solvent that comprises water and at least one monohydroxyl alcohol, a gallium salt, and an acid to control the solution pH and conductivity. The method electrodeposits a gallium film possessing sub-micron thickness on a conductive surface. Such gallium layers are used in fabrication of semiconductor and electronic devices such as thin film solar cells. | 05-13-2010 |
| 20110259755 | DEVICE AND METHOD FOR ELECTROCHEMICALLY COATING A WORKPIECE - The invention relates to an apparatus ( | 10-27-2011 |
| 20120006688 | ELECTROLYTE AND SURFACE-ACTIVE ADDITIVES FOR THE ELECTROCHEMICAL DEPOSITION OF SMOOTH, DENSE ALUMINUM LAYERS FROM IONIC LIQUIDS - The present invention relates to a process for the electrochemical deposition of aluminum, by means of which matt or shiny, dense aluminum layers can be obtained and which comprises the steps: (a) provision of an electrolysis apparatus having at least one anode and at least one cathode in an electrolysis space, (b) electrochemical deposition of aluminum on the at least one cathode of the electrolysis apparatus from an ionic liquid comprising anions and cations and also one or more metal salt(s) and one or more additive(s), wherein the current density at the at least one cathode is at least 50 A/m | 01-12-2012 |
| 20120043216 | Working electrode design for electrochemical processing of electronic components - An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness. | 02-23-2012 |
| 20120043217 | Rinsing and drying for electrochemical processing - An electroplating/etch apparatus including a fluid jet and a dryer present over the tank containing the electrolyte for the electroplating/etch process. The fluid jet and the dryer remove excess liquids, such as electrolyte, from the component being plated or etched, e.g., working electrode. The working electrode is present on a holder that traverses from a first position within the tank during a plating or etch operation to a second position that is outside the containing the plating electrolyte. The fluid jet rinses the working electrode when the holder is in the second position, and the forced air dryer blows any remaining fluid from the fluid jet and the electrolyte from the working electrode into the tank. | 02-23-2012 |
| 20130001093 | METHOD AND APPARATUS FOR ELECTROWINNING COPPER USING AN ATMOSPHERIC LEACH WITH FERROUS/FERRIC ANODE REACTION ELECTROWINNING - The present invention relates, generally, to a method and apparatus for recovering metal values from a metal-bearing materials, and more specifically, a process for recovering copper and other metals through leaching, electrowinning using the ferrous/ferric anode reaction, and the synergistic addition of ferrous iron to the leach step. | 01-03-2013 |
| 20130087464 | ROOM TEMPERATURE ELECTRODEPOSITION OF ACTINIDES FROM IONIC SOLUTIONS - Uranium metal can be electrochemical deposited from room temperature ionic liquid (RTIL), tri-methyl-n-butyl ammonium n-bis(trifluoromethansulfonylimide) [Me | 04-11-2013 |
| 20130168257 | METHOD OF CONTROLLING THE CORROSION RATE OF ALLOY PARTICLES, ALLOY PARTICLE WITH CONTROLLED CORROSION RATE, AND ARTICLES COMPRISING THE PARTICLE - A composite particle comprises a core, a shielding layer deposited on the core, and further comprising an interlayer region formed at an interface of the shielding layer and the core, the interlayer region having a reactivity less than that of the core, and the shielding layer having a reactivity less than that of the interlayer region, a metallic layer not identical to the shielding layer and deposited on the shielding layer, the metallic layer having a reactivity less than that of the core, and optionally, an adhesion metal layer deposited on the metallic layer. | 07-04-2013 |
| 20130168258 | ALUMINUM ELECTROPLATING SOLUTION - The purpose of the present invention is to provide an aluminum electroplating solution that allows aluminum electroplating to be conducted efficiently and in a short period of time, can increase the amount of electricity in the current of electroplating, and has high solubility in a nonaqueous solvent. This aluminum electroplating solution is characterized by comprising an aluminum metal salt, an ionic liquid obtained by an organic compound forming an ion pair with the aluminum metal salt, and an organic solvent having a dielectric constant of 8 or less. It is preferable for the volume percentage of the organic solvent in relation to the total volume of the ionic liquid and the organic solvent to be at least 30%, and for at least one of the following to be included as the organic solvent having a dielectric constant of 8 or less: hexane, toluene, diethyl ether, ethylacetate, cyclohexane, xylene, benzene, naphthalene, heptane, cyclopentyl methyl ether, and dioxane. | 07-04-2013 |
| 20130192996 | SURFACE IMPLANTATION FOR CORROSION PROTECTION OF ALUMINUM COMPONENTS - An aluminum alloy component has a surface region alloyed with an anodic metal to increase corrosion resistance in aqueous environments with high salinity or sulfur content. | 08-01-2013 |
| 20130256146 | CLEANING ELECTROPLATING SUBSTRATE HOLDERS USING REVERSE CURRENT DEPLATING - Provided are cleaning methods and systems to remove unintended metallic deposits from electroplating apparatuses using reverse current deplating techniques. Such cleaning involves positioning a cleaning (deplating) disk in an electroplating cup similar to a regular processed substrate. The front surface of the cleaning disk includes a corrosion resistant conductive material to form electrical connections to deposits on the cup's surfaces. The disk is sealed in the cup and submerged into a plating solution. A reverse current is then applied to the front conductive surface of the disk to initiate deplating of the deposits. Sealing compression in the cup may change during cleaning to cause different deformation of the lip seal and to form new electrical connections to the deposits. The proposed cleaning may be applied to remove deposits formed during electroplating of alloys, in particular, tin-silver alloys widely used for semiconductor and wafer level packaging. | 10-03-2013 |
| 20140311915 | ANODE FOR OXYGEN EVOLUTION - An electrode for electrochemical processes comprises a substrate of titanium or other valve metal, an intermediate protection layer based on valve metal oxides and a catalytic layer based on oxides of tin and of iridium doped with small amounts of oxides of elements selected between bismuth, antimony, tantalum and niobium. The electrode used in electrometallurgical processes, for example in the electrowinning of metals, as anode for anodic oxygen evolution presents a reduced overvoltage and a higher duration. | 10-23-2014 |
| 20150014178 | FILM FORMATION DEVICE AND FILM FORMATION METHOD FOR FORMING METAL FILM - Provided are a film formation device and a film formation method for forming a metal film, with which metal films with a desired thickness can be continuously formed on surfaces of a plurality of substrates. A film formation device | 01-15-2015 |
| 20150083604 | THIAZOLE COMPOUNDS AS ADDITIVES IN ELECTROLYTE SOLUTIONS IN ELECTROCHEMICAL CELLS AND BATTERIES - The present invention relates to an electrolyte solution comprising at least one solvent as component A, at least one electrolyte as component B and from 0.1 to 20% by weight, based on the total electrolyte solution, of at least one heteroaromatic compound of the general formula (I) as component C, the use of such a compound in electrolyte solutions, the use of such an electrolyte solution in an electrochemical cell or for metal plating, and also electrochemical cells comprising a corresponding electrolyte solution. | 03-26-2015 |
| 20150136610 | ELECTROCHEMICAL DEPOSITION METHOD - The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member. | 05-21-2015 |
| 20150144496 | METHODS AND SYSTEMS FOR MANUFACTURING COMPONENTS FROM ARTICLES FORMED BY ADDITIVE-MANUFACTURING PROCESSES - A method is provided for manufacturing a component. The method includes connecting a component comprising an internal passage and formed by an additive manufacturing process to a power supply, the component functioning as an anode, connecting a cathode to the power supply, the cathode being disposed in an electrolyte solution, the cathode being positioned externally to the internal passage of the component, contacting the internal passage of the component with the electrolyte solution, and using the power supply, applying a potential difference and current flow between the component and the cathode. | 05-28-2015 |
| 20160076162 | FILM FORMATION APPARATUS AND FILM FORMATION METHOD FOR FORMING METAL FILM - A film formation system for continuously forming metal films with desired thickness on the surfaces of substrates, and increase the film forming speed while suppressing abnormality of the metal films. A film formation system includes an anode; a solid electrolyte membrane between the anode and a substrate serving as a cathode such that a metal ion solution is disposed on the anode side thereof; and a power supply portion for applying a voltage across the anode and the substrate. A voltage is applied across the anode and the substrate o deposit metal out of the metal ions contained in the solid electrolyte membrane onto the substrate surface, thereby forming a metal film made of the metal ions. The anode has a base material, which is insoluble in the metal ion solution, and a metal plating film made of the same metal as the metal film, formed over the base material. | 03-17-2016 |
| 20160108533 | ALUMINUM TRIHALIDE-NEUTRAL LIGAND IONIC LIQUIDS AND THEIR USE IN ALUMINUM DEPOSITION - An ionic liquid composition comprising a complex of a trihalo aluminum (III) species with at least one organic uncharged ligand comprising a ring structure having at least three ring carbon atoms and at least one ring heteroatom selected from nitrogen and sulfur, wherein the complex is a liquid at a temperature of 100° C. or less. Methods of electroplating aluminum onto a metallic substrate using the above-described ionic liquid composition are also described. | 04-21-2016 |
| 20160153101 | Electrochemical Concentration of Lanthanide and Actinide Elements | 06-02-2016 |
| 20160186351 | REPLENISHER, SURFACE-TREATED METALLIC MATERIAL, AND PRODUCTION METHOD THEREOF - The purpose of the present invention is to provide a replenisher that avoids an increase in the HF concentration in a surface-treatment liquid for metal materials, is capable of supplying zirconium ions at high concentration by using the metal material surface-treatment liquid, and has excellent long-term storage stability, in order to continuously chemically convert and/or electrolytically treat a metal material. This replenisher contains prescribed amounts of: a zirconium compound not containing fluorine and including at least one type selected from a group comprising zirconium basic carbonate, zirconium carbonate, zirconium hydroxide, and ammonium zirconium carbonate; a fluorine-containing matter including at least one type selected from a group comprising hydrofluoric acid, a hydrofluoric acid salt, fluorozirconic acid, and a fluorozirconic acid salt; and an acid component including at least one type selected from a group comprising nitric acid, hydrochloric acid, sulfuric acid, and acetic acid. | 06-30-2016 |
| 20160186353 | METAL COATING FILM FORMATION DEVICE AND METHOD - Provided is a metal coating film formation device capable of forming a film using a simple device configuration and in a short time, and capable of performing the formation of a film of metal coating continuously for a long period. A film formation device | 06-30-2016 |
| 20160376723 | NUCLEAR FUEL STRUCTURE AND METHOD OF MAKING A NUCLEAR FUEL STRUCTURE USING A DETACHABLE CATHODE MATERIAL - A method of making a nuclear fuel structure may include reducing a metal oxide in a cathode assembly so as to deposit a metal of the metal oxide on the cathode plate of the cathode assembly, and processing the cathode plate with the metal deposited thereon to fabricate the nuclear fuel structure. The cathode plate may include an upper blade including an electrically conductive material, a lower blade portion connected to the upper blade, and a connection structure configured to secure the lower blade portion to the upper blade while providing electrical continuity. The connection structure may be configured to be disconnected from the lower blade portion to detach the lower blade portion from the upper blade. | 12-29-2016 |
