| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205264000 | Platinum group metal | 8 |
| 20090134036 | Electrolytic Processing Method and Electrolytic Processing Apparatus - An electrolytic processing method makes it possible to preferentially process a diffusion barrier layer while suppressing processing of an interconnect metal, thereby enabling omission of CMP or a lowering of processing pressure in CMP. The electrolytic processing method comprises: bringing a surface of a substrate (W) into contact with an electrolytic solution ( | 05-28-2009 |
| 20090173634 | EFFICIENT GALLIUM THIN FILM ELECTROPLATING METHODS AND CHEMISTRIES - The present invention relates to gallium (Ga) electroplating methods and chemistries to deposit uniform, defect free and smooth Ga films with high plating efficiency and repeatability. Such layers may be used in fabrication of electronic devices such as thin film solar cells. In one embodiment, the present invention provides a solution for application on a conductor that includes a Ga salt, a complexing agent, a solvent, and a Ga-film having submicron thickness is facilitated upon electrodeposition of the solution on the conductor. The solution may further include one or both of a Cu salt and an In salt. | 07-09-2009 |
| 20100051468 | ELECTROLYTE AND METHOD FOR DEPOSITING DECORATIVE AND TECHNICAL LAYERS OF BLACK RUTHENIUM - The production of oxidation-stable and mechanically strong metal layers having a black color presents a particular challenge in the area of electrochemical finishing, especially since there are only a few metals which are suitable for this purpose. A possibility which is not hazardous to health, in contrast to nickel, and is economical compared with rhodium is the electrochemical production of black ruthenium layers. The invention provides an electrolyte and a method using this electrolyte for producing black ruthenium layers on pieces of jewelry, decorative goods, consumer goods and technical articles. The electrolyte is distinguished in that one or more phosphonic acid derivatives are used as a blackening additive. These maintain brightness. The degree of blackness of the resulting black ruthenium layer can be adjusted by the choice of the type and amount of the phosphonic acid derivatives used, while maintaining the desired brightness. | 03-04-2010 |
| 20130334056 | COATING TECHNOLOGY - The present invention provides an aqueous platinum electroplating bath including: a) a source of platinum ions; and b) a source of polyphosphate anions, and wherein the bath has a pH in the range from about 2 to about 9 when it is in use or ready for use. The aqueous platinum electroplating bath may optionally include one or more levellers. The invention also provides the use of the platinum electroplating bath and platinum salts suitable for use in the bath. | 12-19-2013 |
| 20150047984 | COATING TECHNOLOGY - An aqueous platinum electroplating bath includes: a) a source of platinum ions; and b) a source of borate ions. The aqueous platinum electroplating bath may optionally include one or more levellers. A method of using the platinum electroplating bath for electroplating platinum or a platinum alloy onto a substrate is also described. | 02-19-2015 |
| 205265000 | Palladium | 3 |
| 20090120801 | Electrode Surface Coating and Method for Manufacturing the Same - An electrode surface coating and method for manufacturing the electrode surface coating comprising a conductive substrate; and one or more surface coatings comprising one or more of the following metals titanium, niobium, tantalum, ruthenium, rhodium, iridium, palladium, or gold, or an alloy of two or more metals, or a combination of two or more alloys or metal layers thereof having an increase in the surface area of 5 times to 500 times of the corresponding surface area resulting from the basic geometric shape. | 05-14-2009 |
| 20110168566 | PD and Pd-Ni Electrolyte Baths - The present invention relates to an electrolyte for the electrochemical deposition of palladium or palladium alloys on metallic or conductive substrates. The invention likewise relates to a corresponding electroplating process using this electrolyte and specific palladium salts which can be advantageously used in this process. | 07-14-2011 |
| 20150027899 | ANODE FOR ELECTROPLATING AND METHOD FOR ELECTROPLATING USING ANODE - Provided is an anode for electroplating which uses an aqueous solution as an electrolytic solution, and the anode which is low in potential when compared with a conventional anode, able to decrease an electrolytic voltage and an electric energy consumption rate and may also be used as an anode for electroplating various types of metals, and which is low in cost. Also provided is a method for electroplating which uses an aqueous solution as an electrolytic solution, in which the anode is low in potential and electrolytic voltage, thereby making it possible to decrease the electric energy consumption rate. The anode for electroplating of the present invention is an anode for electroplating which uses an aqueous solution as an electrolytic solution, in which a catalytic layer containing amorphous ruthenium oxide and amorphous tantalum oxide is formed on a conductive substrate. | 01-29-2015 |
