| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205263000 | Silver | 6 |
| 20090120800 | Organic Silver Complexes, Their Preparation Methods and Their Methods for Forming Thin Layers - The present invention relates to a silver complex obtained by reacting at least one silver compound represented by the formula 2 below with at least one ammonium carbamate compound or ammonium carbonate compound represented by the formula 3, 4 or 5 below: | 05-14-2009 |
| 20090159453 | METHOD FOR SILVER PLATING - The aim of the present invention is to provide a method for silver plating that does not comprise the step of forming the nickel-underlayer and that can form a silver-plated layer having sufficient adherence directly on the difficult-to-plate substrates with the use of a halide-free plating bath under a good working environment. The present invention provides a silver plating method onto a substrate on which an oxide layer inhibiting adherence of a plated layer is prone to form, comprising at least the following steps of; (A) degreasing the substrate, (B) removing the oxide layer with a strongly acidic solution from the substrate, and (C) silver plating onto the substrate, without a step of nickel or nickel alloy strike plating in advance, utilizing a phosphines-containing acidic silver plating bath which essentially does not contain halide ion or cyanide ion. | 06-25-2009 |
| 20090283416 | METHOD FOR TREATING THE SURFACE OF AN ELECTRICALLY CONDUCTING SUBSTRATE SURFACE - Disclosed is a method of treating the surface of an electrically conducting substrate surface wherein a tool comprising an ion-conducting solid material is brought into contact at least in some areas with the substrate surface, the tool is able to conduct the metal ions of the substrate and an electric potential is applied so that an electric potential gradient is applied between the substrate surface and the tool in such a manner that metal ions are drawn from the substrate surface or deposited onto the substrate surface by means of the tool. | 11-19-2009 |
| 20120067735 | CYANIDE-FREE SILVER ELECTROPLATING SOLUTIONS - A cyanide-free silver electroplating solution may be used to electroplate mirror bright silver layers at high current density ranges and at high temperatures such as in reel-to-reel electroplating. The cyanide-free silver electroplating solution is environmentally friendly. | 03-22-2012 |
| 20130199936 | Methods and Electrolytes for Electrodeposition of Smooth Films - Electrodeposition involving an electrolyte having a surface-smoothing additive can result in self-healing, instead of self-amplification, of initial protuberant tips that give rise to roughness and/or dendrite formation on the substrate and/or film surface. For electrodeposition of a first conductive material (C1) on a substrate from one or more reactants in an electrolyte solution, the electrolyte solution is characterized by a surface-smoothing additive containing cations of a second conductive material (C2), wherein cations of C2 have an effective electrochemical reduction potential in the solution lower than that of the reactants. | 08-08-2013 |
| 20160122890 | CYANIDE-FREE ELECTROLYTE COMPOSITION AND METHOD FOR THE DEPOSITION OF SILVER OR SILVER ALLOY LAYERS ON SUBSTRATES - The invention relates to a cyanide-free electrolyte composition for depositing a silver or silver alloy layer on a substrate as well as a method for depositing such layers with the help of said cyanide-free electrolyte composition. The electrolyte composition according to the invention comprises at least one silver ion source, a sulfonic acid and/or a sulfonic acid derivative, a wetting agent and a hydantoin. The silver or silver alloy layers deposited from such an electrolyte composition by means of the method according to the invention are dull and ductile. | 05-05-2016 |
