| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 117089000 | Including change in a growth-influencing parameter (e.g., composition, temperature, concentration, flow rate) during growth (e.g., multilayer or junction or superlattice growing) | 20 |
| 20080302298 | Highly Uniform Group III Nitride Epitaxial Layers on 100 Millimeter Diameter Silicon Carbide Substrates - A semiconductor structure is disclosed that includes a silicon carbide wafer having a diameter of at least 100 mm with a Group III nitride heterostructure on the wafer that exhibits high uniformity in a number of characteristics. These include: a standard deviation in sheet resistivity across the wafer less than three percent; a standard deviation in electron mobility across the wafer of less than 1 percent; a standard deviation in carrier density across the wafer of no more than about 3.3 percent; and a standard deviation in conductivity across the wafer of about 2.5 percent. | 12-11-2008 |
| 20090114148 | METHOD OF PRODUCING EPITAXIAL LAYERS WITH LOW BASAL PLANE DISLOCATION CONCENTRATIONS - A method of: flowing a silicon source gas, a carbon source gas, and a carrier gas into a growth chamber under growth conditions to epitaxial grow silicon carbide on a wafer in the growth chamber; stopping or reducing the flow of the silicon source gas to interrupt the silicon carbide growth and maintaining the flow of the carrier gas while maintaining an elevated temperature in the growth chamber for a period of time; and resuming the flow of the silicon source gas to reinitiate silicon carbide growth. The wafer remains in the growth chamber throughout the method. | 05-07-2009 |
| 20100006023 | Method For Preparing Films And Devices Under High Nitrogen Chemical Potential - Nitride semiconductor films, such as for use in solid state light emitting devices and electronic devices, are fabricated in an environment of relatively high nitrogen potential such that nitrogen vacancies in the growing film are reduced. A reactor design, and method for its use, provide high nitrogen precursor partial pressure, precracking of the precursor using a catalytic metal surface, prepyrolyzing the precursor, using catalytically-cracked molecular nitrogen as a nitrogen precursor, and/or exposing the surface to an ambient which is extremely rich in active nitrogen species. Improved efficiency for light emitting devices, particularly in the blue and green wavelengths and improve transport properties in nitride electronic devices, i.e., improved performance from nitride-based devices such as InGaAlN laser diodes, transistors, and light emitting diodes is thereby provided. | 01-14-2010 |
| 20100116197 | OPTICAL QUALITY DIAMOND MATERIAL - A CVD single crystal diamond material suitable for use in, or as, an optical device or element. It is suitable for use in a wide range of optical applications such as, for example, optical windows, laser windows, optical reflectors, optical refractors and gratings, and etalons. The CVD diamond material is produced by a CVD method in the presence of a controlled low level of nitrogen to control the development of crystal defects and thus achieve a diamond material having key characteristics for optical applications. | 05-13-2010 |
| 20100126411 | METHODS FOR PRODUCING GaN NUTRIENT FOR AMMONOTHERMAL GROWTH - The present invention discloses methods to produce large quantities of polycrystalline GaN for use in the ammonothermal growth of group III-nitride material. High production rates of GaN can be produced in a hydride vapor phase growth system. One drawback to enhanced polycrystalline growth is the increased incorporation of impurities, such as oxygen. A new reactor design using non-oxide material that reduces impurity concentrations is disclosed. Purification of remaining source material after an ammonothermal growth is also disclosed. The methods described produce sufficient quantities of polycrystalline GaN source material for the ammonothermal growth of group III-nitride material. | 05-27-2010 |
| 20100251958 | EPITAXIAL GROWTH METHOD - The invention provides an epitaxial growth method which is a single wafer processing epitaxial growth method by which at least a single crystal substrate is placed in a reaction chamber with an upper wall having a downward convexity and an epitaxial layer is deposited on the single crystal substrate by introducing raw material gas and carrier gas into the reaction chamber through a gas feed port, in which, after any one of the radius of curvature of the upper wall of the reaction chamber and a difference between an upper end of the gas feed port and a lower end of the upper wall of the reaction chamber in the height direction or both are adjusted in accordance with the flow rate of the carrier gas which is introduced into the reaction chamber through the gas feed port, an epitaxial layer is deposited on the single crystal substrate. As a result, a single wafer processing epitaxial growth method is provided that can obtain the effects, such as an increase in the quality of an epitaxial wafer and an increase in productivity, which are produced by the degree of the flow rate of carrier gas, and deposit an epitaxial layer on a single crystal substrate without deforming the film thickness shape. | 10-07-2010 |
| 20110197808 | CRYSTAL GROWTH METHOD FOR NITRIDE SEMICONDUCTOR - Certain embodiments provide a crystal growth method for nitride semiconductors, including: growing a first semiconductor layer containing In | 08-18-2011 |
| 20120037067 | CUBIC SILICON CARBIDE FILM MANUFACTURING METHOD, AND CUBIC SILICON CARBIDE FILM-ATTACHED SUBSTRATE MANUFACTURING METHOD - A method for manufacturing a cubic silicon carbide film includes: a first step of introducing a carbon-containing gas onto a silicon substrate and rapidly heating the silicon substrate to an epitaxial growth temperature of cubic silicon carbide so as to carbonize a surface of the silicon substrate and form a cubic silicon carbide film; and a second step of introducing a carbon-containing gas and a silicon-containing gas onto the cubic silicon carbide film while maintaining the cubic silicon carbide film at the epitaxial growth temperature of cubic silicon carbide, so as to allow further epitaxial growth of the cubic silicon carbide film. | 02-16-2012 |
| 20120103249 | SIC SINGLE CRYSTAL SUBLIMATION GROWTH METHOD AND APPARATUS - A physical vapor transport growth system includes a growth chamber charged with SiC source material and a SiC seed crystal in spaced relation and an envelope that is at least partially gas-permeable disposed in the growth chamber. The envelope separates the growth chamber into a source compartment that includes the SiC source material and a crystallization compartment that includes the SiC seed crystal. The envelope is formed of a material that is reactive to vapor generated during sublimation growth of a SiC single crystal on the SiC seed crystal in the crystallization compartment to produce C-bearing vapor that acts as an additional source of C during the growth of the SiC single crystal on the SiC seed crystal. | 05-03-2012 |
| 20130014694 | METHOD OF GROWING SEMICONDUCTOR EPITAXIAL THIN FILM AND METHOD OF FABRICATING SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE SAMEAANM MAENG; Jong SunAACI GwangjuAACO KRAAGP MAENG; Jong Sun Gwangju KRAANM KIM; Bum JoonAACI SeoulAACO KRAAGP KIM; Bum Joon Seoul KRAANM RYU; Hyun SeokAACI SuwonAACO KRAAGP RYU; Hyun Seok Suwon KRAANM LEE; Jung HyunAACI AnsanAACO KRAAGP LEE; Jung Hyun Ansan KRAANM KIM; Ki SungAACI SuwonAACO KRAAGP KIM; Ki Sung Suwon KR - A method of growing a semiconductor epitaxial thin film and a method of fabricating a semiconductor light emitting device using the same are provided. The method of growing a semiconductor epitaxial thin film, includes: disposing a plurality of wafers loaded in a wafer holder in a reaction chamber; and jetting a reactive gas including a chlorine organic metal compound to the wafers through a gas supply unit provided to extend in a direction in which the wafers are loaded, to grow a semiconductor epitaxial thin film on a surface of each of the wafers. | 01-17-2013 |
| 20130233240 | METHODS AND APPARATUSES FOR EPITAXIAL FILMS WITH HIGH GERMANIUM CONTENT - The present application relates to methods for depositing a smooth, germanium rich epitaxial film by introducing silylgermane as a source gas into a reactor at low temperatures. The epitaxial film can be strained and serve as an active layer, or relaxed and serve as a buffer layer. In addition to the silylgermane gas, a diluent is provided to modulate the percentage of germanium in a deposited germanium-containing film by varying the ratio of the silylgermane gas and the diluent. The ratios can be controlled by way of dilution levels in silylgermane storage containers and/or separate flow, and are selected to result in germanium concentration greater than 55 atomic % in deposited epitaxial silicon germanium films. The diluent can include a reducing gas such as hydrogen gas or an inert gas such as nitrogen gas. Reaction chambers are configured to introduce silylgermane and the diluent to deposit the silicon germanium epitaxial films. | 09-12-2013 |
| 20130269600 | METHOD FOR GROWING MAGNESIUM-ZINC-OXIDE-BASED CRYSTAL - The method includes a step of growing an MgZnO-based single-crystal layer at a growth pressure of less than 10 kPa and a growth temperature equal to or greater than an upper limit temperature for ZnO single-crystal growth, wherein the MgZnO-based single-crystal layer is grown using a magnesium-based metal-organic compound having a Cp group, water vapor (H | 10-17-2013 |
| 20140174342 | METHODS FOR INCREASING GROWTH RATE OF THIN FILMS - The present invention generally related to adding Indium precursors to deposition processes for thin films. Indium precursors are added in order to increase the growth rate per cycle of the deposition process. A plurality of deposition processes are disclosed herein which comprising a plurality of deposition cycles and providing an In-precursor pulse before at least one reactant pulse in at least one deposition cycle. The In-precursor can be added for increasing the average growth rate per cycle by at least 50% and in many examples above 500% compared to the growth rate of a similar deposition process without providing an In-precursor. Examples disclosed herein include the deposition of thin films comprising pnictides or chalcogenides, made by atomic layer deposition. | 06-26-2014 |
| 20140209013 | CRYSTAL GROWTH METHOD FOR NITRIDE SEMICONDUCTOR HAVING A MULTIQUANTUM WELL STRUCTURE - A crystal growth method for nitride semiconductors, including the steps of growing a first semiconductor layer containing In | 07-31-2014 |
| 20150090180 | Epitaxial growth of compound semiconductors using lattice-tuned domain-matching epitaxy - A method of epitaxially growing a final film using a crystalline substrate wherein the final film cannot be grown directly on the substrate surface is disclosed. The method includes forming a transition layer on the upper surface of the substrate. The transition layer has a lattice spacing that varies between its lower and upper surfaces. The lattice spacing at the lower surface matches the lattice spacing of the substrate to within a first lattice mismatch of 7%. The lattice spacing at the upper surface matches the lattice spacing of the final film to within a second lattice mismatch of 7%. The method also includes forming the final film on the upper surface of the transition layer. | 04-02-2015 |
| 20150354090 | SIC EPITAXIAL WAFER PRODUCTION METHOD - A method for manufacturing a SiC epitaxial wafer includes: a first step of, by supplying a Si supply gas and a C supply gas, performing a first epitaxial growth on a SiC bulk substrate with a 4H—SiC(0001) having an off-angle of less than 5° as a main surface at a first temperature of 1480° C. or higher and 1530° C. or lower; a second step of stopping the supply of the Si supply gas and the C supply gas and increasing a temperature of the SiC bulk substrate from the first temperature to a second temperature; and a third step of, by supplying the Si supply gas and the C supply gas, performing a second epitaxial growth on the SiC bulk substrate having the temperature increased in the second step at the second temperature. | 12-10-2015 |
| 20160020086 | DOPING CONTROL METHODS AND RELATED SYSTEMS - A system for cleaning dopant contamination in a process chamber is disclosed. The system includes a susceptor and a chamber kit component, a first plurality of lamps configured to heat the susceptor, a second plurality of lamps configured to heat the chamber kit component, and a gas supply configured to provide a chlorine cleaning gas. The system is configured to deposit a layer on a substrate at a deposition temperature and perform an in-situ clean of the process chamber, including the chamber kit component, at the deposition temperature. A method for cleaning dopant contamination includes depositing a layer over a substrate at a deposition temperature, performing an in-situ clean of the process chamber and a process kit component at the deposition temperature, unloading the substrate, and performing a dedicated clean at a clean temperature. In some examples, the clean temperature is about equal to the deposition temperature. | 01-21-2016 |
| 117090000 | With pretreatment of substrate (e.g., coacting ablating) | 1 |
| 20140251203 | SELECTIVE EPITAXIAL GROWTH METHOD AND FILM FORMING APPARATUS - A selective epitaxial growth method includes preparing a target object including a single crystal substrate in which an epitaxial growth region is partitioned by a suppression film; and growing the epitaxial layer on the epitaxial growth region of the target object until a predetermined film thickness is obtained. The growing the epitaxial layer includes first source gas supply process of supplying a source gas onto the target object under a first pressure to grow a first epitaxial layer on the epitaxial growth region, first removing process of removing deposits on the suppression film, second source gas supply process of supplying the source gas onto the target object under a second pressure higher than the first pressure, and second removing process of removing the deposits on the suppression film. The second source gas supply process and the second removing process are repeated until the predetermined film thickness is obtained. | 09-11-2014 |
| 117092000 | Using an energy beam or field, a particle beam or field, or a plasma (e.g., ionization, PECVD, CBE, MOMBE, RF induction, laser) | 1 |
| 20140116327 | METHOD AND APPARATUS FOR FABRICATING FREE-STANDING GROUP III NITRIDE CRYSTALS - The method for fabricating a free-standing group III nitride plate ( | 05-01-2014 |
| 117093000 | With significant flow manipulation or condition, other than merely specifying the components or their sequence or both | 1 |
| 20140283736 | VAPOR PHASE GROWTH APPARATUS AND VAPOR PHASE GROWTH METHOD - A vapor phase growth apparatus of an embodiment includes a reaction chamber, a first gas supply channel that supplies a Si source gas to the reaction chamber, a second gas supply channel that supplies a C source gas to the reaction chamber, a third gas supply channel that supplies an n-type impurity source gas to the reaction chamber, a fourth gas supply channel that supplies a p-type impurity source gas to the reaction chamber, and a control unit that controls the amounts of the n-type impurity and p-type impurity source gases at a predetermined ratio, and introduces the n-type impurity and p-type impurity source gases into the reaction chamber. Where the p-type impurity is an element A and the n-type impurity is an element D, the element A and the element D form a combination of Al, Ga, or In and N, and/or a combination of B and P. | 09-25-2014 |
