HEAT DISSIPATION DEVICE

Abstract

A heat dissipation device includes a heat sink, a rack, and a fan fixed to an end of the rack. The rack includes two frames. Each frame includes a sidewall and two end walls extending from opposite ends of the sidewall. The two frames form a receiving space receiving the heat sink, with each end wall of one of the frames engaging with a corresponding one of the end walls of the other one of the frames. The two frames are configured to be attached to the heat sink from opposite sides of the heat sink, with the end walls abutting opposite ends of the heat sink. The fan is fixed to two engaging corresponding end walls at one of the opposite ends of the sink via the end board.

Description

BACKGROUND

[0001] 1. Technical Field

[0002] The present disclosure relates to a heat dissipation device.

[0003] 2. Description of Related Art

[0004] It is well known that a large amount of heat is often generated by an electronic component such as a central processing unit (CPU) of a computer. The heat must be quickly removed from the CPU to prevent unstable operation of or damage to the CPU. A heat sink is typically attached to the CPU to absorb the heat from the CPU. The heat absorbed by the heat sink is then dissipated to the air through a fan mounted to the heat sink. Typically, the fan is mounted to the heat sink through a plurality of fasteners extending through the fan and into the heat sink. It is cumbersome and inefficient to manipulate the fasteners when attaching or detaching the fan to or from the heat sink, and damage may occur to the fins of the heat sink.

BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.

[0006] FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat dissipation device.

[0007] FIG. 2 is a partially assembled, isometric view of the heat dissipation device of FIG. 1.

[0008] FIG. 3 is an assembled, isometric view of the heat dissipation device of FIG. 1.

DETAILED DESCRIPTION

[0009] The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to "an" or "one" embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

[0010] Referring to FIG. 1, an exemplary embodiment of a heat dissipation device is mounted to a motherboard 40 of a computer (not shown). The heat dissipation device includes a fan 10, a heat sink 20, and a rack 30 receiving the heat sink 20.

[0011] Two posts 42 extend from the motherboard 40, each axially defining a threaded hole (not shown) therein.

[0012] Referring to FIG. 2, the fan 10 includes a main body 12 and a dustproof portion 14 mounted to a side of the main body 12. The main body 12 includes two spaced end boards 120 each of which defines a through hole 122 in each of four corners. The dustproof portion 14 is mounted to one of the end boards 120.

[0013] The heat sink 20 includes a baseboard 22 and a plurality of fins 24 extending from the baseboard 22. Two through holes (not shown) are defined in opposite ends of the baseboard 22 corresponding to the posts 42 of the motherboard 40.

[0014] The rack 30 includes two frames 32 and a plurality of fixing members 34.

[0015] Each frame 32 includes a sidewall 320, a substantially U-shaped top surface 322 and a substantially U-shaped bottom surface 324 respectively extending from a top side of and a bottom side of the sidewall 320, and two substantially U-shaped end walls 326 extending from opposite ends of the sidewall 320. The top surface 322, bottom surface 324 and end walls 326 extend in the same direction.

[0016] The top surface 322 includes two spaced extending pieces 360. A protrusion 332 protrudes up from a distal end (opposite to the sidewall 320) of one of the extending pieces 360. A fixing portion 334 defining a through hole 336 therein extends from a distal end of the other extending piece 360. Each end wall 326 includes a connection piece 327 extending from the sidewall 320 and two fixing pieces 328 extending from opposite ends of the connection piece 327. Two fixing holes 330 in alignment with each other are respectively defined in the fixing pieces 328 of each end wall 326. A fixing portion 338 extends from a distal end of one of the fixing pieces 328 adjacent to the bottom surface 324 of a frame 32, and a pin 350 extends from an inner side of the fixing portion 338. A corresponding fixing piece 328 of the other end wall 326 adjacent to the bottom surface 324 of the frame 32 defines a through hole 352 in the distal end of the fixing piece 328 for receiving the pin 350 of the other frame 32.

[0017] Each fixing member 34 is made of elastic material, and includes a disc-shaped base 340, a shaft 344 extending from a side of the base 340, and a tapered blocking portion 342 formed on the circumference of the shaft 344 adjacent to the base 340.

[0018] In assembling the heat sink 20 to the motherboard 40, two fasteners 50 respectively extend through the through holes of the heat sink 20, and are received in the threaded holes of the corresponding posts 42 of the motherboard 40, to fix the heat sink 20 to the motherboard 40.

[0019] In assembling the rack 30 to the heat sink 20, four fixing members 34 respectively extend through the fixing holes 330 of a first end of the frames 32 from an inner side of the frames 32, with the blocking portions 342 of the fixing members 34 extending out through corresponding fixing holes 330. The frames 32 are then attached to the heat sink 20 from opposite sides of the heat sink 20, with the bottom surfaces 324 abutting the bottom of the baseboard 22 of the heat sink 20 and the end walls 326 abutting opposite ends of the heat sink 20. The pin 350 of one frame 32 engages in the corresponding through hole 352 of the other frame 32. The top surfaces 322 abut the top of the heat sink 20, with the protrusion 332 of one frame 32 received in the corresponding slot 336 of the other frame 32.

[0020] Referring to FIG. 3, in assembling the fan 10 to the rack 30, the fan 10 is attached to the rack 30, with the through holes 122 of the fan 10 opposite to the dustproof portion 14 aligning with the corresponding fixing members 34. The shafts 344 and the blocking portions 342 of the fixing members 34 extend out through corresponding through holes 122 of the fan 10, and end board 120 opposite to the dustproof portion 14 is received between the fixing pieces 328 of the first end of the rack 30 and the blocking portions 342 of the fixing members 34. Thereby, the fan 10 is fixed to two engaging corresponding end walls 326 on an end of the rack 30 through the plurality of fixing members 34.

[0021] It is believed that the present embodiments and their advantages will be understood from the foregoing description, and they will be apparent that various changes may be made thereto without departing from the spirit and scope of the description or sacrificing all of their material advantages, the examples hereinbefore described merely being exemplary embodiment.

Claims

1. A heat dissipation device, comprising: a heat sink; a rack comprising two frames, each frame comprising a sidewall and two end walls extending from opposite ends of the sidewall, the two frames forming a receiving space receiving the heat sink, with each end wall of one of the frames engaging with a corresponding one of the end walls of the other one of the frames; and a fan comprising an end board; wherein the two frames are configured to be attached to the heat sink from opposite sides of the heat sink, with the end walls abutting opposite ends of the heat sink, the fan is fixed to two engaging corresponding end walls at one of the opposite ends of the sink via the end board.

2. The heat dissipation device of claim 1, wherein each frame further comprises a top surface extending from a top side of the sidewall of each frame and abutting the top surface of the heat sink, the top surface comprises two extending pieces, a protrusion extends from one of the extending piece, a fixing portion extends from a distal end the other extending piece for engaging with the protrusion of the other frame.

3. The heat dissipation device of claim 2, wherein each end wall comprises a connection piece extending from the corresponding end of the sidewall of the corresponding frame, and two fixing pieces extending from opposite ends of the connection piece, a pin extends from a distal end of one of the fixing pieces, a through hole is defined in a distal end of the other fixing piece for receiving the pin of the other frame.

4. The heat dissipation device of claim 3, further comprising a plurality of fixing members for mounting the fan to the end walls on the end of the rack, wherein the end board comprise a plurality of through holes, each fixing member comprises a base, a shaft extending from the base and a blocking portion formed on the circumference of the post, two fixing holes in alignment with each other are defined in the fixing pieces of each end wall, the shafts and blocking portions of the fixing members extend out through corresponding fixing holes of an end of the rack and corresponding through holes of the fan.

5. The heat dissipation device of claim 4, wherein the fixing members are made of elastic material.

6. The heat dissipation device of claim 1, wherein a bottom surface extends from a bottom side of the sidewall of each frame and abuts against the bottom of the heat sink.

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