Entries |
Document | Title | Date |
20080198657 | NON-VOLATILE SEMICONDUCTOR MEMORY HAVING MULTIPLE EXTERNAL POWER SUPPLIES - A memory device includes core memory such as flash memory for storing data. The memory device includes a first power input to receive a first voltage used to power the flash memory. Additionally, the memory device includes a second power input to receive a second voltage. The memory device includes power management circuitry configured to receive the second voltage and derive one or more internal voltages. The power management circuitry supplies or conveys the internal voltages to the flash memory. The different internal voltages generated by the power management circuitry (e.g., voltage converter circuit) and supplied to the core memory enable operations such as read/program/erase with respect to cells in the core memory. | 08-21-2008 |
20080198658 | MEMORY CARD, SEMICONDUCTOR DEVICE, AND METHOD OF CONTROLLING MEMORY CARD - A semiconductor device includes a transfer section which receives, from an external source, a second program for modifying a function of a first program stored in a read-only memory (ROM) and information required in activation of the second program, and which writes the program and the information to a nonvolatile semiconductor memory, and a load section which activates the second program on the basis of the information written to the nonvolatile semiconductor memory to modify the function of the first program. | 08-21-2008 |
20080198659 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes: a memory cell array having a plurality of memory cells arranged therein; and a sense amplifier circuit configured to read data of the memory cell array, wherein a comparison operation is performed between read out data from the memory cell array and externally supplied expectance data in the sense amplifier circuit. | 08-21-2008 |
20080205149 | METHOD OF PROGRAMMING NON-VOLATILE MEMORY DEVICE - A method of programming a non-volatile memory device enables a pump in response to a first program confirm command. The pump generates a voltage. An initial page of a memory block is programmed. Subsequent intermediate pages of the memory block are programmed in response to a second program confirm command while the pump remains enabled. A final page of the memory block is programmed in response to a third program confirm command. The pump is then disabled after the final page is programmed. | 08-28-2008 |
20080205150 | HYBRID NON-VOLATILE MEMORY - A non-volatile memory (NVM) circuit includes at least two types of NVM sub-circuits that share common support circuitry. Different types of NVM sub-circuits include ordinary NVM circuits that provide a logic output upon being addressed, programmable fuses that provide an output upon transitioning to a power-on state, NVM circuits that provide an ON/OFF state output, and the like. Some of the outputs are used to calibrate circuits within a device following power-on. Other outputs are used to store information to be employed by various circuits. | 08-28-2008 |
20080205151 | Non-Volatile Memory Device and Method of Driving the Same - A non-volatile memory device capable of stably setting its operating environment and a method of driving the non-volatile memory device are provided. The method includes providing power to the non-volatile memory device having a memory cell array that stores initial setting data for setting the operating environment of the non-volatile memory device. An initial read operation is performed on the memory cell array. The operating environment of the non-volatile memory device is set using the initial setting data that is read through the initial read operation. The initial setting data stored in the memory cell array includes main data having information about the operating environment to be set and an indicator corresponding to the main data for indicating a start and an end of the main data. | 08-28-2008 |
20080205152 | FLASH MEMORY DEVICE FOR OVER-SAMPLING READ AND INTERFACING METHOD THEREOF - A memory system having a flash memory device that performs an over-sampling read operation to read data from a memory cell in the flash device by using an over-sampling read voltage that falls within a threshold voltage distribution range. A memory controller supplies a read mode signal to the flash memory device to perform the over-sampling read operation. | 08-28-2008 |
20080205153 | METHOD AND APPARATUS FOR CONTROLLING TWO OR MORE NON-VOLATILE MEMORY DEVICES - A method and apparatus for controlling two or more non-volatile memory devices includes activating a read enable signal or a write enable signal, which is input to the first and second non-volatile memory devices, using a controller. A first chip enable signal is alternately activated for selecting the first non-volatile memory device and a second chip enable signal is activated for selecting the second non-volatile memory device using the controller. This is done while the read enable signal or the write enable signal is input to the first and second non-volatile memory devices being activated. Accordingly, even when the minimum cycle of the controller is longer than that of a memory device read/write time is reduced, thereby improving read/write performance. | 08-28-2008 |
20080205154 | Semiconductor Memory Device - A semiconductor memory device comprises memory cells, a bitline connected to the memory cells, a read circuit including a precharge circuit, and a first transistor connected between the bitline and the read circuit, wherein a first voltage is applied to a gate of the first transistor when the precharge circuit precharges the bitline, and a second voltage which is different from the first voltage is applied to the gate of the first transistor when the read circuit senses a change in a voltage of the bitline. | 08-28-2008 |
20080219056 | SYSTEM THAT COMPENSATES FOR COUPLING DURING PROGRAMMING - Shifts in the apparent charge stored on a floating gate (or other charge storing element) of a non-volatile memory cell can occur because of the coupling of an electric field based on the charge stored in adjacent floating gates (or other adjacent charge storing elements). To compensate for this coupling, the read or programming process for a given memory cell can take into account the programmed state of an adjacent memory cell. To determine whether compensation is needed, a process can be performed that includes sensing information about the programmed state of an adjacent memory cell (e.g., on an adjacent bit line or other location). | 09-11-2008 |
20080239823 | NONVOLATILE SEMICONDUCTOR MEMORY AND METHOD FOR CONTROLLING THE SAME - A nonvolatile semiconductor memory includes a memory cell array, a flag information storage that stores a write flag indicating success/failure of writing in association with each address of a plurality of data segments contained in the data block, an internal address storage that selects the address where the writing has failed, a write circuit that performs data writing, a comparator that performs verify operation to verify success/failure of the data writing, and a sequence controller that updates a write flag according to the result of the verify operation. | 10-02-2008 |
20080247235 | FLASH MEMORY DEVICE AND METHOD FOR DRIVING THE SAME - Provided are a flash memory device and a method of driving the same for reading set information and stably storing the read set information in a latch. The method of driving the flash memory device includes applying power to the flash memory device, which includes a memory cell array for storing set information used to set an operating environment of the flash memory device. An initial read operation of the memory cell array is performed to read the set information. The set information read in the initial read operation is stored in a latch. It is determined whether the set information is normally stored in the latch based on set data input to the latch and set data output from the latch. | 10-09-2008 |
20080253189 | MEMORY UNIT - A memory unit is provided herein. The present invention utilizes two non-volatile devices having a split gate structure to save a logic state of the memory unit. Thus, even when a power supply for the memory unit is shut down, the non-volatile devices can still save the logic state. The memory unit not only has the advantage of high speed operation of a static random access memory, but also functions as a non-volatile memory for saving data. | 10-16-2008 |
20080253190 | Non-volatile memory device and method of operating the same - The present invention is directed to a non-volatile memory device and a method of operating the same. The non-volatile memory device includes a first transistor connected to an nth bitline and a second transistor connected to an (n+1)th bitline. The first transistor and the second transistor are serially coupled between the nth bitline and the (n+1)th bitline. The non-volatile memory device may include a 2-transistor 1-bit unit cell where a drain region and a source region of a memory cell have the same or similar structure. Since a cell array of a non-volatile memory device according to the invention may include a 2-transistor 2-bit unit cell, storage capacity of the non-volatile memory device may be doubled. | 10-16-2008 |
20080253191 | FLASH MEMORY DEVICE AND SET-UP DATA INITIALIZATION METHOD - A flash memory device includes a memory cell array having a set-up data region configured to store set-up data, wherein the set-up data includes first data and second data. The second data is stored in an empty cell area of the set-up data region. The flash memory also includes a page buffer and decoder configured to read the set-up data from the set-up data region, and a status detector receiving the set-up data from the page buffer and decoder and configured to discriminate the first data from the second data and generate a Pass/Fail status signal. | 10-16-2008 |
20080253192 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A semiconductor integrated circuit device includes a memory cell array having a plurality of blocks, a storage unit, a block replacement information register group, and a bad block flag register group. The storage unit includes a block replacement information registration area with which it is possible to register block replacement information, and a bad block information registration area with which it is possible to register bad block information. The block replacement information register group is set in accordance with the block replacement information read out of the storage unit during a boot sequence, and the bad block flag register group is set in accordance with both of the block replacement information and the bad block information read out of the storage unit during the boot sequence. | 10-16-2008 |
20080259690 | FLASH MEMORY DEVICE - A NAND flash memory device includes a high voltage switch and a bulk voltage supplying circuit. The high voltage switch is configured to transfer a word line voltage to selected word lines of selected memory cells. The bulk voltage supplying circuit is configured to provide a negative voltage to a bulk region of the high voltage switch in response to an operation mode. | 10-23-2008 |
20080266966 | OPERATION METHOD OF NON-VOLATILE MEMORY AND METHOD OF IMPROVING COUPLING INTERFERENCE FROM NITRIDE-BASED MEMORY - An operation method of a non-volatile memory is provided. The operation method is that a reading operation is performed to a selected nitride-based memory cell, a first positive voltage is applied to a word line adjacent to one side of the selected memory cell and a second positive voltage is applied to another word line adjacent to the other side of the selected memory cell. The operation method of this present invention not only can reduce a coupling interference issue but also can obtain a wider operation window. | 10-30-2008 |
20080266967 | NONVOLATILE SEMICONDUCTOR MEMORY - A semiconductor memory device comprising: a memory cell array having memory cell units each formed by connecting a plurality of memory cells; a first and a second select gate transistors, the first select gate transistor being connected between one end of the memory cell array and a common source line, the second select gate transistor being connected between the other end of the memory cell array and bit lines; word lines acting also as control gates of the memory cells; a first select gate voltage-generating circuit for generating a first select gate voltage; a second select gate-setting circuit for setting an instructed value of a second select gate voltage; a second select gate voltage-generating circuit for generating the second select gate voltage based on the set, instructed value; a first transfer circuit for transferring the first select gate voltage generated by the first select gate voltage-generating circuit to a second select gate; a discharging circuit for discharging the first select gate voltage transferred to the second select gate; and a discharging characteristics selection circuit for selecting discharging characteristics of the discharging circuit. | 10-30-2008 |
20080266968 | CHARGE PUMP CIRCUIT, SEMICONDUCTOR MEMORY DEVICE, AND METHOD FOR DRIVING THE SAME - A semiconductor memory device includes: a memory cell array including a plurality of memory cells arranged in rows and columns for holding information, each of the memory cells having a control gate; a plurality of word lines extending in a row direction, each of the word lines being connected to the control gates of the memory cells of a corresponding row of the memory cell array; a plurality of bit lines extending in a column direction and connected to sources or drains of the memory cells; a row decoder for selecting any of the plurality of word lines; a column decoder for selecting any of the plurality of bit lines; a charge pump circuit for generating a voltage higher than a supply voltage; and a first switch located in a connection path between the row decoder and the charge pump circuit. | 10-30-2008 |
20080266969 | METHOD OF OPERATING NON-VOLATILE MEMORY - A method of operating a non-volatile memory having a substrate, a gate, a charge-trapping layer, a source region and a drain region is provided. The charge-trapping layer close to the source region is an auxiliary charge region and the charge-trapping layer close to the drain region is a data storage region. Before prosecuting the operation, electrons have been injected into the auxiliary charge region. When prosecuting the programming operation, a first voltage is applied to the gate, a second voltage is applied to the source region, a third voltage is applied to the drain region and a fourth voltage is applied to the substrate. The first voltage is greater than the fourth voltage, the third voltage is greater than the second voltage, and the second voltage is greater than the fourth voltage to initiate a channel initiated secondary hot electron injection to inject electrons into the data storage region. | 10-30-2008 |
20080273391 | Regulator Bypass Start-Up in an Integrated Circuit Device - An internal voltage regulator in an integrated circuit device is always active upon initial start-up and/or power-on-reset operations. The internal voltage regulator protects the low voltage core logic circuits of the integrated circuit device from excessively high voltages that may be present in a particular application. In addition, nonvolatile memory may be part of and operational with the low voltage core logic circuits for storing device operating parameters. Therefore, the internal voltage regulator also protects the low voltage nonvolatile memory from excessive high voltages. Once the integrated circuit device has stabilized and all logic circuits therein are fully function, a bit(s) in the nonvolatile memory may be read to determine if the internal voltage regulator should remain active, e.g., how power operation with a high voltage source, or be placed into a bypass mode for low power operation when the integrated circuit device is powered by a low voltage. | 11-06-2008 |
20080279009 | Nonvolatile Semiconductor Memory Device and Writing Method of the Same - A nonvolatile semiconductor memory device and a writing method thereof are provided. The nonvolatile semiconductor memory device includes a cell array, a controller configured to receive input data from an outside source, an address latch unit configured to store a Y-address of the input data and X-addresses respectively corresponding to at least two wordlines, over which the input data is written, based on an address of the input data output from the controller, and a page buffer configured to receive the input data from the controller and temporarily store the input data. The controller writes the data stored in the page buffer over the two wordlines in the cell array based on the at least two X-addresses and the Y-address. | 11-13-2008 |
20080279010 | FLASH MEMORY DEVICE AND PROGRAM METHOD THEREOF - A method for programming a flash memory device comprising programming memory cells via repetition of program loops, a first of the program loops including a program execution interval and a verify read interval, a second of the program loops including the program execution interval, the verify read interval, and a judging interval. Also disclosed is a flash memory device comprising a memory cell array having memory cells arranged in rows and columns, a read/program circuit configured to perform program and read operations to the memory cell array, and a control logic circuit configured to control the read/program circuit so as to perform a judging operation according to a program loop number. | 11-13-2008 |
20080279011 | DATA PROCESSING APPARATUS - The present invention is directed to largely reduce peak current at the time of operation of a boosting circuit provided for an EEPROM. In the erase/write operation, first, a low-frequency clock signal as a selection clock signal is input by a low-frequency clock control signal to a charge pump. After lapse of a certain period (about ⅓ of fall time), a high-frequency clock signal having a frequency higher than that of the low-frequency clock signal is output by a high-frequency clock control signal and is input as the selection clock signal to the charge pump to boost a voltage to a predetermined voltage level. In such a manner, while suppressing the peak of consumption current, the fall time of the boosted voltage can be shortened. | 11-13-2008 |
20080285351 | MEASURING THRESHOLD VOLTAGE DISTRIBUTION IN MEMORY USING AN AGGREGATE CHARACTERISTIC - A threshold voltage distribution of a set of storage elements in a memory device is measured by sweeping a control gate voltage while measuring a characteristic of the set of storage elements as a whole. The characteristic indicates how many of the storage elements meet a given condition, such as being in a conductive state. For example, the characteristic may be a combined current, voltage or capacitance of the set which is measured at a common source of the set. The control gate voltage can be generated internally within a memory die. Similarly, the threshold voltage distribution can be determined internally within the memory die. Optionally, storage elements which become conductive can be locked out, such as by changing a bit line voltage, so they no longer contribute to the characteristic. New read reference voltages are determined based on the threshold voltage distribution to reduce errors in future read operations. | 11-20-2008 |
20080285352 | Method of writing/reading data into/from memory cell and page buffer using different codes for writing and reading operations - Provided are a method of writing/reading data into/from a memory cell and a page buffer using different codes for the writing and reading operations. The method of writing/reading data into/from a memory cell that has a plurality of threshold voltage distributions includes a data writing operation and a data reading operation. In the data writing operation, data having a plurality of bits is written into the memory cell by using a plurality of writing codes corresponding to threshold voltage distributions. In the data reading operation, the data having a plurality of bits is read from the memory cell by using reading codes corresponding to the threshold voltage distributions from among the threshold voltage distributions. In the method of writing/reading data into/from a memory cell, a part of the writing codes is different from a corresponding part of the reading codes. | 11-20-2008 |
20080285353 | Flash memory device, method of manufacturing the same, and method of operating the same - Provided are a memory device, a method of manufacturing the same, and a method of operating the same. The memory device may include a channel region having an upper end where both sides of the upper end are curved, the curved portions of both sides allowing charges to be injected thereinto in a program or erase voltage such that the curved portions into which the charges are injected are separate from a portion which determines a threshold voltage, and a gate structure on the channel region. | 11-20-2008 |
20080291732 | Three cycle SONOS programming - A method to eliminate over-erase in a nonvolatile trapped-charge memory array during write operations includes a three-cycle process of bulk programming the memory array, bulk erasing the memory array and selectively inhibiting one or more memory cells in the memory array while applying a programming voltage to the memory array. | 11-27-2008 |
20080291733 | LOADING DATA WITH ERROR DETECTION IN A POWER ON SEQUENCE OF FLASH MEMORY DEVICE - A semiconductor device is provided to have two groups of nonvolatile memory cells, two groups of data registers and a compare circuit. Each of the two groups of the nonvolatile memory cells stores a set of predetermined data and a set of complementary data respectively. The two groups of data registers are respectively connected to the two groups of the nonvolatile memory cells. The compare circuit is connected to the two groups of the data registers, for performing a comparison to generate a compare result. | 11-27-2008 |
20080291734 | NONVOLATILE MEMORY DEVICES AND METHODS OF CONTROLLING THE WORDLINE VOLTAGE OF THE SAME - A nonvolatile memory device includes an array of memory cells arranged in rows and columns, the array of memory cells having wordlines associated therewith. A wordline voltage controller determines the levels of wordline voltages to be supplied to the respective wordlines and a wordline voltage generator generates the wordline voltages at the determined levels. Related methods are also provided. | 11-27-2008 |
20080298128 | METHOD OF STORING E-FUSE DATA IN FLASH MEMORY DEVICE - Provided is a method of storing configuration data regarding an operating environment of a flash memory device, which includes a memory cell array having an electrical fuse (E-Fuse) block for storing the configuration data. The method includes storing the configuration data in multiple strings of the E-Fuse block, each string including multiple memory cells configured to store one bit. | 12-04-2008 |
20080298129 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE ADAPTED TO STORE A MULTI-VALUED DATA IN A SINGLE MEMORY CELL - A non-volatile semiconductor memory device includes an electrically data rewritable non-volatile semiconductor memory cell and a write circuit for writing data in the memory cell, the write circuit writing a data in the memory cells by supplying a write voltage Vpgm and a write control voltage VBL to the memory cell, continuing the writing of the data in the memory cell by changing the value of the write control voltage VBL in response to an advent of a first write state of the memory cell and inhibiting any operation of writing a data to the memory cell by further changing the value of the write control voltage VBL to Vdd in response to an advent of a second write state of the memory cell. | 12-04-2008 |
20080298130 | MEMORY DEVICE DISTRIBUTED CONTROLLER SYSTEM - A memory device distributed controller circuit distributes memory control functions amongst a plurality of memory controllers. A master controller receives an interpreted command and activates the appropriate slave controllers depending on the command. The slave controllers can include a data cache controller that is coupled to and controls the data cache and an analog controller that is coupled to and controls the analog voltage generation circuit. The respective controllers have appropriate software/firmware instructions that determine the response the respective controllers take in response to the received command. | 12-04-2008 |
20080304323 | Method and apparatus for programming data of memory cells considering floating poly coupling - A method and an apparatus for programming data of memory cells considering coupling are provided. The method includes: calculating a change of a threshold voltage based on source data of the memory cells; converting source data which will be programmed based on the calculated change of the threshold voltage; and programming the converted source data. | 12-11-2008 |
20080304324 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE WHICH REALIZES "1" WRITE OPERATION BY BOOSTING CHANNEL POTENTIAL - A nonvolatile semiconductor memory device includes a memory cell array having a plurality of cell units each including a preset number of memory cells and select gate transistors on drain and source sides. The nonvolatile semiconductor memory device includes a voltage control circuit to prevent occurrence of an erroneous write operation due to excessively high boost voltage of a channel when “1” is written into the memory cell. | 12-11-2008 |
20080310234 | NONVOLATILE MEMORY DEVICE AND METHODS OF PROGRAMMING AND READING THE SAME - A read method of a non-volatile memory device includes reading an initial threshold voltage value of an index cell from threshold voltage information cells that store information indicating the initial threshold voltage, determining a current threshold voltage value from the index cell, and comparing the initial threshold voltage value and the current threshold voltage value to calculate a shifted threshold voltage level of the index cell. A read voltage is changed by the shifted threshold voltage level to read user data using the changed read voltage. | 12-18-2008 |
20080316830 | COMPENSATION METHOD TO ACHIEVE UNIFORM PROGRAMMING SPEED OF FLASH MEMORY DEVICES - Systems and methodologies are provided herein for increasing operation speed uniformity in a flash memory device. Due to the characteristics of a typical flash memory array, memory cells in a memory array may experience distributed substrate resistance that increases as the distance of the memory cell from an edge of the memory array increases. This difference in distributed substrate resistance can vary voltages supplied to different memory cells in the memory array depending on their location, which can in turn cause non-uniformity in the speed of high voltage operations on the memory array such as programming. The systems and methodologies provided herein reduce this non-uniformity in operation speed by providing compensated voltage levels to memory cells in a memory array based at least in part on the location of each respective memory cell. For example, a compensated operation voltage can be provided that is higher near the center of the memory array and lower near an edge of the memory array, thereby lessening the effect of distributed substrate resistance and providing increased operation speed uniformity throughout the memory array. | 12-25-2008 |
20080316831 | Nonvolatile semiconductor device, system including the same, and associated methods - A nonvolatile memory device is provided. The nonvolatile memory device includes a semiconductor substrate and memory cell units arranged in a matrix on the semiconductor substrate. Each of the memory cell units includes a tunnel insulation layer on the semiconductor substrate. A first memory gate and a second memory gate are disposed on the tunnel insulation layer. An isolation gate is disposed between the first and second memory gates. A word line covers the first memory gate, the second memory gate and the isolation gate. A method of forming the nonvolatile memory device is also provided. | 12-25-2008 |
20090003071 | SEMICONDUCTOR STORAGE DEVICE AND READ VOLTAGE CORRECTION METHOD - A semiconductor memory device comprises a semiconductor memory, a corrected voltage storage circuit which stores a corrected voltage produced by correcting a read voltage of the semiconductor memory, and a memory controller which reads the corrected voltage from the corrected voltage storage circuit and performs a read operation of the semiconductor memory using the corrected voltage. | 01-01-2009 |
20090003072 | NON-VOLATILE MEMORY DEVICE - A non-volatile memory device is provided. In an aspect, the non-volatile memory device includes two or more common source lines that are included in one memory cell block in order to distribute the current that could have been concentrated on one common source line. As a result, the bouncing phenomenon generated by the nose of the source line can be reduced. That is, at the time of a verifying operation performed during a program operation, the current concentrated on a common source line can be distributed and, therefore, the occurrence of under-programmed cells can be prevented. | 01-01-2009 |
20090003073 | Rd Algorithm Improvement for Nrom Technology - Selecting a read voltage level for a NVM cell by using an initial value for the read voltage and performing a read operation, comparing an actual number of bits found to an expected number of bits and, if there is a discrepancy between the actual number and the expected number, adjusting the read voltage level, based on variable data such as statistics available, level occupation, neighbor level, previous chunks data, and other data used during read, program or erase. For example, based on a number of missing bits, or upon a result of a previous read operation, or a result obtained at another program level, or upon how many times the memory cell has been cycled, or upon how many memory cells are at each program level, or on a number of bits at another program level in a selected chunk of memory. | 01-01-2009 |
20090003074 | Scalable Electrically Eraseable And Programmable Memory (EEPROM) Cell Array - A non-volatile memory (NVM) system includes a plurality of NVM cells fabricated in a dual-well structure. Each NVM cell includes an access transistor and an NVM transistor, wherein the access transistor has a drain region that is continuous with a source region of the NVM transistor. The drain regions of each NVM transistor in a column of the array are commonly connected to a corresponding bit line. The control gates of each NVM transistor in a row of the array are commonly connected to a corresponding word line. The source regions of each of the access transistors in the array are commonly coupled. The NVM cells are programmed and erased without having to apply the high programming voltage V | 01-01-2009 |
20090010066 | FLASH MEMORY DEVICE AND METHOD IN WHICH TRIM INFORMATION IS STORED IN MEMORY CELL ARRAY - A flash memory device which includes a memory cell array which stores data and trim information, and control logic which controls programming, erasing, and reading modes of the memory cell array. The control logic is operative to receive the trim information from the memory cell array in a power-up mode, and to optimize operational time periods of the programming, erasing, and reading modes in accordance with the trim information. | 01-08-2009 |
20090016113 | NON-DIFFUSION JUNCTION SPLIT-GATE NONVOLATILE MEMORY CELLS AND ARRAYS, METHODS OF PROGRAMMING, ERASING, AND READING THEREOF, AND METHODS OF MANUFACTURE - Nonvolatile flash memory systems and methods are disclosed having a semiconductor substrate of a first conductivity type, including non-diffused channel regions through which electron flow is induced by application of voltage to associated gate elements. A plurality of floating gates are spaced apart from one another and each insulated from the channel region. A plurality of control gates are spaced apart from one another and insulated from the channel region, with each control gate being located between a first floating gate and a second floating gate and capacitively coupled thereto to form a subcell. A plurality of spaced-apart assist gates are insulated from the channel region, with each assist gate being located between and insulated from adjacent subcells. The channel is formed of three regions, two beneath adjacent control gate elements as well as a third region between the first two and beneath an associated assist gate. | 01-15-2009 |
20090016114 | CIRCUIT AND METHOD OF GENERATING HIGH VOLTAGE FOR PROGRAMMING OPERATION OF FLASH MEMORY DEVICE - Provided is a high voltage generator for a flash memory device including a voltage pumping unit configured to generate a high voltage in response to a pumping clock signal, a transistor having a gate coupled to the high voltage and a source coupled to a program voltage, a voltage distributor coupled to the drain of the transistor, the voltage distributor configured to generate a distributor voltage, and a pumping clock controller configured to compare the distributor voltage to a reference voltage and to generate the pumping clock signal when the high voltage is less than a voltage substantially equal to the program voltage plus the threshold voltage of the transistor. | 01-15-2009 |
20090016115 | TESTING NON-VOLATILE MEMORY DEVICES FOR CHARGE LEAKAGE - A method of and apparatus for testing a floating gate non-volatile memory semiconductor device comprising an array of cells including floating gates for storing data in the form of electrical charge. The method includes applying a test pattern of said electrical charge to the floating gates, exposing the device to energy to accelerate leakage of the electrical charges out of the cells, and subsequently comparing the remaining electrical charges in the cells to the test pattern. The energy is applied in the form of electromagnetic radiation of a wavelength such as to excite the charges in the floating gates to an energy level sufficient for accelerating charge loss from the floating gates of defective cells relative to charge loss from non-defective cells. The wavelength is preferably in the range of 440 to 560 nm. | 01-15-2009 |
20090021984 | METHODS AND STRUCTURES FOR HIGHLY EFFICIENT HOT CARRIER INJECTION PROGRAMMING FOR NON-VOLATILE MEMORIES - A metal oxide semiconductor field effect transistor (MOSFET) in a non-volatile memory cell has a source, a drain and a channel region between the source and the drain, all formed in a substrate of opposite conductivity type to the conductivity type of the source and drain. The MOSFET is programmed by connecting the drain electrode to the supply source of the main voltage, V | 01-22-2009 |
20090021985 | INTERNAL VOLTAGE GENERATOR AND CONTROL METHOD THEREOF, AND SEMICONDUCTOR MEMORY DEVICE AND SYSTEM INCLUDING THE SAME - An internal voltage of a semiconductor memory device is controlled, where the internal voltage is set according to a reference voltage. The reference voltage is controlled according to first control data to increase the internal voltage to be higher than a target voltage in a power-up operation, and second control data is read. The reference voltage is then controlled according to the second control data to decrease the internal voltage to the target voltage. | 01-22-2009 |
20090021986 | OPERATING METHOD OF NON-VOLATILE MEMORY DEVICE - An operating method for a non-volatile memory device is applicable on a non-volatile memory device in which a substrate is disposed. The substrate includes a trench, a first conductive type first well region disposed in the substrate, and a second conductive type second well region disposed above the first conductive type first well region. The operating method includes applying a first voltage to a control gate, a second voltage to a drain region, and a third voltage to a source region. Besides, a channel F-N tunneling effect is employed to program a memory cell. | 01-22-2009 |
20090027969 | METHOD OF USING HOT-CARRIER-INJECTION DEGRADATION AS A PROGRAMMABLE FUSE/SWITCH - Method and apparatus for providing nonvolatile storage with a programmable transistor. The method includes receiving a data value to be stored in the programmable transistor and programming the programmable transistor to store the received data value. Programming includes applying a selected voltage to the programmable transistor. The selected voltage is selected to inject carriers into a gate oxide layer of the programmable transistor. The carriers are maintained in the gate oxide layer of the programmable transistor in the absence of the selected voltage, thereby programming the programmable transistor with the received data value. | 01-29-2009 |
20090027970 | Programming based on controller performance requirements - Methods and solid state drives are disclosed, for example a solid state drive that is adapted to receive and transmit analog data signals representative of bit patterns of three or more levels (such as to facilitate increases in data transfer rates relative to devices communicating data signals indicative of individual bits). Programming of the solid state drive, comprising an array of non-volatile memory cells, might include adjusting the level of each memory cell being programmed in response to a desired performance level of a controller circuit. | 01-29-2009 |
20090034337 | METHOD, APPARATUS, AND SYSTEM FOR IMPROVED READ OPERATION IN MEMORY - Various embodiments include methods, apparatus, and systems for reading an adjacent cell of a memory array in an electronic device to determine a threshold voltage value of the adjacent cell, the adjacent cell being adjacent a target cell, and reading the target cell of the memory array using a wordline voltage value based on the threshold voltage value of the adjacent cell. Additional apparatus, systems, and methods are disclosed. | 02-05-2009 |
20090052253 | Memory device and method reducing fluctuation of read voltage generated during read while write operation - Provided is a device and method for reducing a fluctuation of a read voltage generated during a read while write (RWW) operation. A semiconductor memory device may include a write voltage generator configured to generate a write voltage to perform the write operation to at least one of a plurality of banks where the write voltage generator generates the write voltage to have a voltage level of a read voltage before the write operation changes to a read operation. The semiconductor device may also include a read voltage generator configured to generate a read voltage to perform the read operation to at least one of the other plurality of banks and/or a plurality of switches configured to switch a voltage applied to at least one of the banks to one of the write voltage and the read voltage in response to a plurality of control signals. | 02-26-2009 |
20090052254 | Non-Volatile Semiconductor Memory - A non-volatile semiconductor device has a memory cell array having electrically erasable programmable non-volatile memory cells, reprogramming and retrieval circuits that temporarily store data to be programmed in the memory cell array and sense data retrieved from the memory cell array. Each reprogramming and retrieval circuit has first and second latches that are selectively connected to the memory cell array and transfer data. A controller controls the reprogramming and retrieval circuits on a data-reprogramming operation to and a data-retrieval operation from the memory cell array. Each reprogramming and retrieval circuit has a multilevel logical operation mode and a caching operation mode. In the multilevel logical operation mode, re-programming and retrieval of upper and lower bits of two-bit four-level data is performed using the first and the second latches to store the two-bit four-level data in one of the memory cells in a predetermined threshold level range. In the caching operation mode, data transfer between one of the memory cells selected in accordance with a first address and the first latch is performed while data transfer is performed between the second latch and input/output terminals in accordance with a second address with respect to one-bit two-level data to be stored in one of the memory cells. | 02-26-2009 |
20090059670 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - There is provided a nonvolatile semiconductor memory device which can read and verify a cell with a negative threshold voltage by biasing voltages of a source line and well line to a positive voltage. The nonvolatile semiconductor memory device includes a voltage control circuit which applies a select gate voltage obtained by adding the biased positive voltage to a voltage set at read time of a cell with a positive threshold voltage to a select gate at a read time and verify time for the cell with the negative threshold voltage. | 03-05-2009 |
20090067248 | PROGRAM METHOD OF FLASH MEMORY DEVICE - In a program method of a flash memory device where memory cells within a string are turned on to electrically connect channel regions, all of the channel regions within a second string are precharged uniformly by applying a ground voltage to a first bit line connected to a first string including to-be-programmed cells and a program-inhibited voltage to a second bit line connected to the second string including program-inhibited cells. If a program operation is executed, channel boosting occurs in the channel regions within the second string including the program-inhibited cells. Accordingly, a channel boosting potential can be increased and a program disturbance phenomenon, in which the threshold voltage of program-inhibited cells is changed, can be prevented. | 03-12-2009 |
20090067249 | MEMORY WITH MULTI-PAGE READ - A memory device is described that provides increased output data to help evaluate data errors from bit line coupling and floating gate coupling during a read operation. Multiple rows, or pages, of data are read to allow an internal or external decoder to evaluate memory cell data. | 03-12-2009 |
20090067250 | MEMORY DEVICES WITH PAGE BUFFER HAVING DUAL REGISTERS AND METHOD OF USING THE SAME - A nonvolatile memory device and programming method and apparatus therefore are described that include operatively coupled first and second sense amplifiers having first and second data registers or latches, a storage circuit for storing a data of the second amplifier, a pass/fail check circuit for checking the content of the second data register whether a cell of the memory device has been sufficiently programmed and a restore circuit for resetting the second data register for reprogramming the device until sufficiently programmed. | 03-12-2009 |
20090080259 | Post-Facto Correction For Cross Coupling In A Flash Memory - A method of storing and reading data, using a memory that includes a plurality of cells (e.g. flash cells), such that data are stored in the cells by setting respective values of a physical parameter of the cells (e.g. threshold voltage) to be indicative of the data, and such that data are read from the cells by measuring those values. One of the cells and its neighbors are read. The data stored in the cell are estimated, based on the measurements and on respective extents to which the neighbors disturb the reading. Preferably, the method also includes determining those respective extents to which the neighbors disturb the reading, for example based on the measurements themselves. | 03-26-2009 |
20090080260 | Programmable CSONOS logic element - A complementary SONOS-type (CSONOS) logic device is programmed and erased with a common voltage. The CSONOS device retains data integrity over extended read endurance cycles. | 03-26-2009 |
20090080261 | NONVOLATILE SEMICONDUCTOR MEMORY - A nonvolatile semiconductor memory, has a first wire; a second wire adjacent to the first wire; a third wire disposed next to the second wire such that the second wire is disposed between the first wire and the third wire; a power supply circuit for setting each of the wires at a predetermined potential; and a determining circuit for determining presence or absence of a short circuit between the wires. | 03-26-2009 |
20090080262 | METHOD OF PROGRAMMING A NAND FLASH MEMORY DEVICE - A method of programming a NAND flash memory device includes providing a flash memory device, wherein word lines are disposed between a drain selecting line and a source selecting line, wherein a first word line is provided adjacent to the source selecting line and a last word line is provided adjacent to the drain selecting line; and selecting a word line to program memory cells coupled to the selected word line to perform an even LSB program operation and an odd LSB program operation for the selected first word line. Each of the word lines is selected until all of the word lines have been selected, so that the even LSB program operation and the odd LSB program operation can be performed for all of the word lines. The even LSB program operation is performed to store a lower rank data bit in memory cells coupled to an even bit line assigned a selected word line. The odd LSB program operation is performed to store a lower rank data bit in memory cells coupled to an odd bit line assigned to the selected word line. | 03-26-2009 |
20090086543 | Highly Compact Non-Volatile Memory And Method Thereof - A non-volatile memory device capable of reading and writing a large number of memory cells with multiple read/write circuits in parallel has an architecture that reduces redundancy in the multiple read/write circuits to a minimum. The multiple read/write circuits are organized into a bank of similar stacks of components. In one aspect, each stack of components has individual components factorizing out their common subcomponents that do not require parallel usage and sharing them as a common component serially. Other aspects, include serial bus communication between the different components, compact I/O enabled data latches associated with the multiple read/write circuits, and an architecture that allows reading and programming of a contiguous row of memory cells or a segment thereof. The various aspects combined to achieve high performance, high accuracy and high compactness. | 04-02-2009 |
20090091982 | EXTERNAL CLOCK TRACKING PIPELINED LATCH SCHEME - A flash memory including a first latch having at least one external input to receive at least one command, at least one memory address, and a plurality of data bits, a command decoder coupled to the first latch output; a command latch including a first command latch input, a second command latch input, and a command latch output, the first command latch input to couple to the command decoder output, and the second command latch input to couple to a write command output of an internal clock control generator; and a command register including a first command register input and a second command register input, the first command register input to couple to the command latch output, and the second command register input to couple to an internal latch command output of the internal clock control generator. Additional apparatus, systems, and methods are disclosed. | 04-09-2009 |
20090097320 | Memory Cells, Electronic Systems, Methods Of Forming Memory Cells, And Methods of Programming Memory Cells - Some embodiments include memory cells having vertically-stacked charge-trapping zones spaced from one another by dielectric material. The dielectric material may comprise high-k material. One or more of the charge-trapping zones may comprise metallic material. Such metallic material may be present as a plurality of discrete isolated islands, such as nanodots. Some embodiments include methods of forming memory cells in which two charge-trapping zones are formed over tunnel dielectric, with the zones being vertically displaced relative to one another, and with the zone closest to the tunnel dielectric having deeper traps than the other zone. Some embodiments include electronic systems comprising memory cells. Some embodiments include methods of programming memory cells having vertically-stacked charge-trapping zones. | 04-16-2009 |
20090097321 | Non-volatile memory device, method of operating the same, and method of fabricating the same - A non-volatile memory device may include at least one semiconductor layer, a plurality of control gate electrodes, a plurality of charge storage layers, at least one first auxiliary electrode, and/or at least one second auxiliary electrode. The plurality of control gate electrodes may be recessed into the semiconductor layer. The plurality of charge storage layers may be between the plurality of control gate electrodes and the semiconductor layer. The first and second auxiliary electrodes may be arranged to face each other. The plurality of control gate electrodes may be between the first and second auxiliary electrodes and capacitively coupled with the semiconductor layer. | 04-16-2009 |
20090097322 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device including: a memory cell array including a plurality of word lines, a plurality of bit lines, and memory cells arranged in portions where the plurality of word lines and the plurality of bit lines intersect with each other; a plurality of data bus lines connected to the plurality of bit lines; a plurality of sense amplifiers individually connected to the plurality of data bus lines and configured for detecting memory data stored in corresponding memory cells based on values of currents that are generated in the individual data bus lines in accordance with the memory data. | 04-16-2009 |
20090103366 | Non-volatile memory device - A non-volatile memory device may include at least one string, at least one bit line corresponding to the at least one string, and/or a sensing transistor. The at least one string may include a plurality of memory cell transistors connected in series. The sensing transistor may include a gate configured to sense a voltage of the corresponding bit line. A threshold voltage of the sensing transistor may be higher than a voltage obtained by subtracting a given voltage from a voltage applied to read the corresponding bit line connected to a memory cell transistor to be read of the plurality of memory cell transistors. | 04-23-2009 |
20090103367 | ONE-TRANSISTOR CELL SEMICONDUCTOR ON INSULATOR RANDOM ACCESS MEMORY - Silicon-oxide-nitride-oxide-silicon SONOS-type devices (or BE-SONOS) fabricated in Silicon-On-Insulator (SOI) technology for nonvolatile implementations. An ultra-thin tunnel oxide can be implemented providing for very fast program/erase operations, supported by refresh operations as used in classical DRAM technology. The memory arrays are arranged in divided bit line architectures. A gate injection, DRAM cell is described with no tunnel oxide. | 04-23-2009 |
20090109758 | NONVOLATILE MEMORY ARRAY PARTITIONING ARCHITECTURE AND METHOD TO UTILIZE SINGLE LEVEL CELLS AND MULTI LEVEL CELLS WITHIN SAID ARCHITECTURE - A system comprising a program component that programs one or more non-volatile memory (“NVM”) cells of an array of pairs of NVM cells using FN tunneling, an erase component that erases the one or more NVM cells of the array of pairs of NVM cells using FN tunneling, and a read component that reads the one or more NVM cells of the array of pairs of NVM cells. | 04-30-2009 |
20090116291 | METHOD OF MAKING INTEGRATED CIRCUIT EMBEDDED WITH NON-VOLATILE ONE-TIME - PROGRAMMABLE AND MULTIPLE-TIME PROGRAMMABLE MEMORY - A programmable non-volatile device is made which uses a floating gate that functions as a FET gate that overlaps a portion of a source/drain region. This allows a programming voltage for the device to be imparted to the floating gate through capacitive coupling, thus changing the state of the device. The invention can be used in environments such as data encryption, reference trimming, manufacturing ID, security ID, and many other applications. | 05-07-2009 |
20090122614 | SINGLE POLY EEPROM ALLOWING CONTINUOUS ADJUSTMENT OF ITS THRESHOLD VOLTAGE - A single-poly EEPROM memory device comprises a control gate isolated within a well of a first conductivity type in a semiconductor body of a second conductivity type, first and second tunneling regions isolated from one another within respective wells of the first conductivity type in the semiconductor body, a read transistor isolated within a well of the first conductivity type, and a floating gate overlying a portion of the control gate, the read transistor, and the first and second tunneling regions. The memory device is configured to be electrically programmed by changing a charge on the floating gate that changes the device threshold voltage. In one embodiment, the memory device is configured to be electrically programmed by applying a first potential between the first and second tunneling regions, and a second potential to the control gate, the second potential having a value less than the first potential. | 05-14-2009 |
20090122615 | NON-VOLATILE MEMORY DEVICE AND METHOD OF OPERATING THE SAME - Program voltages of a non-volatile memory device are controlled variably according to a program/erase operation count. The non-volatile memory device includes a program voltage supply unit for applying a program voltage to a memory cell, a program/erase count storage unit for storing a total program/erase operation count of the non-volatile memory device, a program start voltage storage unit for storing levels of program start voltages to be differently supplied according to the program/erase operation count, and a program voltage controller for controlling the program start voltage according to the program/erase operation count. | 05-14-2009 |
20090129166 | METHOD, CIRCUIT AND SYSTEM FOR SENSING A CELL IN A NON-VOLATILE MEMORY ARRAY - Disclosed is a method, circuit and system for evaluating the status of a data storage area in a non-volatile memory cell within a non-volatile memory cell array. According to some embodiments of the present invention, leakage current in at least one other cell in proximity with the cell being evaluated is suppressed. Leakage current suppression may be achieved by applying a suppression voltage to the word of the cell(s) whose leakage current(s) are to be suppressed. | 05-21-2009 |
20090129167 | SEMICONDUCTOR MAGNETIC MEMORY INTEGRATING A MAGNETIC TUNNELING JUNCTION ABOVE A FLOATING-GATE MEMORY CELL - A semiconductor magnetic memory device has a magnetic tunneling junction formed over a memory cell. The memory cell has a control gate surrounded by a floating gate. The floating gate is coupled to the magnetic tunneling junction through a pinning layer that maintains the magnetic orientation of the lower magnetic layer of the junction. A current through a selected word line, coupled to the control gate, generates a first magnetic field. A current through a cell select line generates a second magnetic field that is orthogonal to the first magnetic field. This changes the magnetic orientation of the upper magnetic layer of the junction to lower its resistance, thus allowing a write/erase voltage on a program/erase line to program/erase the floating gate. | 05-21-2009 |
20090135652 | Method for Extracting the Distribution of Charge Stored in a Semiconductor Device - The invention relates to a method for determining a set of programming conditions for a given type of charge-trapping non-volatile memory device, comprising the steps of: (a) selecting different sets of programming parameters to be applied to the corresponding number of non-volatile memory devices of said type, (b) programming said number of non-volatile memory devices by means of the sets of programming parameters, (c) determining an actual spatial charge distribution of the charge trapping layer of each of the programmed devices, (d) determining the influence of at least one of the programming parameters on the spatial charge distribution, (e) determining an optimised value for at least one of the programming parameters, (f) entering each optimised value in said sets of programming parameters and repeating steps b) to e) at least once. | 05-28-2009 |
20090135653 | METHOD FOR PERFORMING OPERATIONS ON A MEMORY CELL - A method for performing operations on a memory cell is disclosed. The memory cell includes a substrate, a first doping region and a second doping region. The first doping region and the second doping region are formed on the substrate with a channel region therebetween. A dielectric layer is formed above the channel region and a conductive gate is formed over the dielectric layer. The method includes applying a first constant voltage for a first period to the conductive gate followed by applying a second constant voltage for a second period to the conductive gate repeatedly. The value of the first constant voltage is different from the value of the second constant voltage. A third constant voltage and a fourth voltage are applied to the first doping region and the second doping region respectively. | 05-28-2009 |
20090135654 | MEMORY READ METHODS, APPARATUS, AND SYSTEMS - Some embodiments include first memory cells and a first line used to access the first memory cells, second memory cells and at least one second line used to access the second memory cells. The first and second memory cells have a number of threshold voltage values corresponding to a number of states. The states represent values of information stored in the memory cells. During a read operation to read the first memory cells, a first voltage may be applied to the first line and a second voltage may be applied to the second line. At least one of the first and second voltages may include a value based on a change of at least one of the threshold voltage values changing from a first value to a second value. The first and second values may correspond to a unique state selected from all of the states. Other embodiments including additional apparatus, systems, and methods are disclosed. | 05-28-2009 |
20090135655 | Embedded Flash Memory Devices on SOI Substrates and Methods of Manufacture Thereof - Flash memory device structures and methods of manufacture thereof are disclosed. The flash memory devices are manufactured on silicon-on-insulator (SOI) substrates. Shallow trench isolation (STI) regions and the buried oxide layer of the SOI substrate are used to isolate adjacent devices from one another. The methods of manufacture require fewer lithography masks and may be implemented in stand-alone flash memory devices, embedded flash memory devices, and system on a chip (SoC) flash memory devices. | 05-28-2009 |
20090147585 | FLEXIBLE WORD LINE BOOSTING ACROSS VCC SUPPLY - Systems and methods for producing a boosted voltage which can be used as a boosted word line voltage for read mode operations of memory cells are disclosed. The system contains a VCC comparator, a look up table, and a boosting circuit including a set of boosting capacitors. The look up table has a list of trim codes that indicates desired boosting ratios. The boosting ratio can vary depending on a level of a supply voltage to provide a sufficient word line voltage, thereby preventing and/or mitigating delay in reading operations. The number of the capacitors in the boosting circuit can be predetermined to be turned on or off according to the trim code. Accordingly, the voltage boost circuit provides a sufficient boosted word line voltage to a core cell gate with flexibility despite fluctuation of the supply voltage level. | 06-11-2009 |
20090154248 | NONVOLATILE MEMORY DEVICE STORING DATA BASED ON CHANGE IN TRANSISTOR CHARACTERISTICS - A nonvolatile memory device includes a pair of PMOS transistors, and a control circuit configured to operate in a store mode to apply to a first one of the PMOS transistors potentials that cause an NBTI degradation purposefully and to apply to a second one of the PMOS transistors potentials that cause no NBTI degradation while causing no current to flow between a source node and a drain node of the first one of the PMOS transistors, and to operate in a recall mode to set gate nodes of the PMOS transistors to a common potential to detect a difference in the NBTI degradation between said PMOS transistors. | 06-18-2009 |
20090161438 | METHODS OF FORMING AND PROGRAMMING FLOATING-GATE MEMORY CELLS HAVING CARBON NANOTUBES - Floating-gate memory cells having carbon nanotubes interposed between the substrate and the tunnel dielectric layer facilitate ballistic injection of charge into the floating gate. The carbon nanotubes may extend across the entire channel region or a portion of the channel region. For some embodiments, the carbon nanotubes may be concentrated near the source/drain regions. For some embodiments, the tunnel dielectric layer may adjoin the substrate in at least a portion of the channel region. | 06-25-2009 |
20090168535 | NON-VOLATILE MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A non-volatile memory device includes a memory cell array and a controller. The memory cell array includes memory cells for data storage and a plurality of flag cells. The flag cells indicate program states of the memory cells for each of a plurality of word lines. The controller determines the program states of the memory cells by employing the flag cells and controls a pass voltage provided to a corresponding word line according to the determined program states. | 07-02-2009 |
20090168536 | METHOD OF PROGRAMMING NON-VOLATILE MEMORY DEVICE - A method of programming a non-volatile memory device includes applying a power supply voltage to a drain select line, applying a high level voltage to a drain-side pass word line or a source-side pass word line, and applying a pass voltage to unselected word lines and a program voltage to a selected word line. The high level voltage is applied to the drain-side pass word line or the source-side pass word line before applying the pass voltage to the unselected word lines and the program voltage to the selected word line. | 07-02-2009 |
20090168537 | METHOD OF PROGRAMMING A NON-VOLATILE MEMORY DEVICE - A method of programming a non-volatile memory device includes applying a first pass voltage to word lines in a direction of a source select line based on a first word line selected for a program operation, wherein the word lines do not include a second word line adjacent to the first word line in a direction of the source select line; and applying a first voltage, a program voltage and a second pass voltage when the first pass voltage reaches a given level. The first voltage is applied to the second word line, the program voltage is provided to the first word line, and the second pass voltage is applied to word lines in a direction of a drain select line on the basis of the first word line. | 07-02-2009 |
20090168538 | Method of Programming Non-Volatile Memory Device - A programming method of a non-volatile memory device may include providing a memory device in which a first word line is preprogrammed in an erase operation of a memory block, pre-programming a second word line according to a program command, and programming the first word line. | 07-02-2009 |
20090168539 | Semiconductor integrated circuit and unstable bit detection method for the same - A semiconductor integrated circuit including a nonvolatile memory cell is provided with a detection/word line voltage control circuit for sequentially supplying two or more mutually different unstable bit detecting voltages to a control gate of the nonvolatile memory cell to cause the nonvolatile memory cell to output a plurality of pieces of readout data, and an OK/NG determination circuit for comparing the plurality of pieces of readout data to determine whether the nonvolatile memory cell is stable or not. | 07-02-2009 |
20090175084 | Buffering systems for accessing multiple layers of memory in integrated circuits - Embodiments of the invention relate generally to data storage and computer memory, and more particularly, to systems, integrated circuits and methods for accessing memory in multiple layers of memory implementing, for example, third dimension memory technology. In a specific embodiment, an integrated circuit is configured to implement write buffers to access multiple layers of memory. For example, the integrated circuit can include memory cells disposed in multiple layers of memory. In one embodiment, the memory cells can be third dimension memory cells. The integrated circuit can also include read buffers that can be sized differently than the write buffers. In at least one embodiment, write buffers can be sized as a function of a write cycle. Each layer of memory can include a plurality of two-terminal memory elements that retain stored data in the absence of power and store data as a plurality of conductivity profiles. | 07-09-2009 |
20090175085 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF WRITING AND READING THE SAME - MOS transistors each having different ON withstanding voltages that are drain withstanding voltages when gates thereof are turned on are formed on the same substrate. One of the MOS transistors having the lower ON withstand voltage is used as a memory element. Using the fact that the drain withstanding voltage is low when a gate thereof is turned on, a short-circuit occurs in a PN junction between a drain and the substrate of the one of the MOS transistors having the lower ON withstand voltage to write data. | 07-09-2009 |
20090180326 | Non-Volatile Memory and Semiconductor Device - There is provided a non-volatile memory which enables high accuracy threshold control in a writing operation. In the present invention, a drain voltage and a drain current of a memory transistor are controlled to carry out a writing operation of a hot electron injection system, which is wherein a charge injection speed does not depend on a threshold voltage. FIGS. | 07-16-2009 |
20090180327 | NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE - In a memory cell array which is constituted with flash memory, a pair of a positive memory cell and a negative memory cell, to which data with mutually opposite values are written, is plurally provided. Bit lines and I/O lines connected to the memory cells of a data reading object are charged, and then a potential WL of a word line connected to the data reading object memory cells is raised. Hence, currents flow in the data reading object memory cells in accordance with the data that were written, and consequently one of a potential BL and a potential BLN of the I/O lines begins to fall. When one of the potentials BL and BLN falls below the circuit threshold of a sense amplifier, reading data is established, and the established reading data is outputted as a sense amplifier output signal SAOUT. | 07-16-2009 |
20090180328 | Method for Accessing in Reading, Writing and Programming to a NAND Non-Volatile Memory Electronic Device Monolithically Integrated on Semiconductor - A method for accessing, in reading, programming, and erasing a semiconductor-integrated non-volatile memory device of the Flash EEPROM type with a NAND architecture having at least one memory matrix organized in rows or word lines and columns or bit lines, and wherein, for the memory, a plurality of additional address pins are provided. The method provides both an access protocol of the asynchronous type and a protocol of the extended type allowing to address, directly and in parallel, a memory extended portion by loading an address register associated with the additional pins in two successive clock pulses. A third multi-sequential access mode and a parallel additional bus referring to the additional address pins are also provided to allow a double addressing mode, sequential and in parallel. | 07-16-2009 |
20090185425 | Integrated Circuit Having a Memory Cell Arrangement and Method for Reading a Memory Cell State Using a Plurality of Partial Readings - Embodiments of the invention relate generally to an integrated circuit having a memory cell arrangement and a method for reading a memory cell state using a plurality of partial readings. In an embodiment of the invention, an integrated circuit having a memory cell arrangement is provided. The memory cell arrangement may include at least one memory cell, the memory cell being capable of storing a plurality of memory cell states being distinguishable by a predefined number of memory cell threshold values, and a controller configured to read a memory cell state of the at least one memory cell using a number of reference levels that is higher than the predefined number of memory cell threshold values, wherein the reading includes a first partial reading using a first set of a plurality of reference levels and a second partial reading using a second set of a plurality of reference levels, wherein the second set of a plurality of reference levels includes at least one reference level which is different from the reference levels of the first set of a plurality of reference levels. | 07-23-2009 |
20090185426 | Semiconductor memory device and method of forming the same - The present invention discloses a semiconductor memory device comprising a source, a drain, a floating gate, a control gate, a recess channel and a gated p-n diode. The said p-n diode connects said floating gate and said drain. The said floating gate is for charge storage purpose, it can be electrically charged or discharged by current flowing through the gated p-n diode. An array of memory cells formed by the disclosed semiconductor memory device is proposed. Furthermore, an operating method and a method for producing the disclosed semiconductor memory device and array are described. | 07-23-2009 |
20090185427 | SEMICONDUCTOR MEMORY DEVICE AND DRIVING METHOD FOR THE SAME - The semiconductor memory device includes: a first well of a first conductivity type, a second well of the first conductivity type and a third well of a second conductivity type formed in a substrate: a diffusion bit line extending in a row direction and a word line extending in a column direction both formed in the second well; a plurality of semiconductor memory elements arranged in a matrix, each connected with the diffusion bit line and the word line; a selection transistor formed in the first well for applying a voltage to the diffusion bit line; and a forward diode formed of a diffusion layer of the first conductivity type formed in the third well and the third well. The diffusion bit line, the forward diode and the source of the selection transistor are electrically connected with one another. | 07-23-2009 |
20090201739 | METHOD FOR DRIVING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - In a case of writing to a trap type non-volatile memory cell that includes: a laminated insulating film, containing a charge accumulation layer, that is formed on a semiconductor substrate where source, drain and well regions are formed; and a first gate electrode formed on the laminated insulating film, charge injections that are carried on a single memory node multiple times under two or more different writing conditions, the writing condition is a combination of a well voltage applied to the well, a drain voltage applied to the drain and a gate voltage is applied to the first gate. Thereby, it is possible to form a trapezoid-shaped electron distribution in the charge accumulation layer, and thus prevent the charge retention characteristic from deteriorating. | 08-13-2009 |
20090201740 | INTEGRATED CIRCUIT, METHOD TO PROGRAM A MEMORY CELL ARRAY OF AN INTEGRATED CIRCUIT, AND MEMORY MODULE - An integrated circuit having a memory cell arrangement with a plurality of memory cells and a memory cell arrangement controller is provided. The memory cell arrangement controller is configured such that during programming of at least one memory cell of the plurality of memory cells, at least one memory cell, which is arranged adjacent to the memory cell to be programmed, is driven to shield the memory cell to be programmed. | 08-13-2009 |
20090207662 | Multi-Transistor Non-Volatile Memory Element - The present disclosure provides a multi-transistor element including a substrate, a first floating gate disposed on the substrate, a second floating gate disposed on the substrate and coupled to the first floating gate, and a first active region disposed in the substrate and coupled to the first and second floating gates. | 08-20-2009 |
20090207663 | Flash Memory Devices Including Ready/Busy Control Circuits and Methods of Testing the Same - A flash memory device includes a chip disable fuse circuit that has a fuse and that outputs a chip disable signal when the fuse is cut out, and a ready/busy control circuit that forcibly activates a ready/busy signal representing an internal operational state in response to the chip disable signal and externally outputs the ready/busy signal through a ready/busy output pin. | 08-20-2009 |
20090213659 | FLASH MEMORY DEVICE AND FLASH MEMORY SYSTEM INCLUDING THE SAME - A flash memory device including: a memory cell array; a signal generator inputting a first data fetch signal and outputting a second data fetch signal; and an output buffer circuit configured to output data from the memory cell array in sync with rising and falling edges of the second data fetch signal, wherein second data fetch signal is output along with data output from the output buffer circuit. | 08-27-2009 |
20090213660 | Three-Terminal Single Poly NMOS Non-Volatile Memory Cell - A three terminal non-volatile memory (NVM) cell for a CMOS IC is formed by a standard CMOS process flow. The NVM cell includes two transistors that share a common floating gate. The floating gate includes a first portion disposed over the channel region of the first (NMOS) transistor, a second portion disposed over the channel region of the second (NMOS or PMOS) transistor, and a third portion extending into an enlarged drain diffusion area away from the channel regions, whereby the gate-to-drain capacitance is higher than the gate-to-source capacitances. A pocket implant or CMOS standard LV N-LDD is formed under the second transistor to enhance CHE programming. Both HV LDD and LV LDD implants are introduced together enabling LDD implant merging under the floating gate extension. The floating gate is formed using substantially T-shaped, C-shaped, U-shaped, Y-shaped or O-shaped polysilicon structures. Various array addressing schemes are disclosed. | 08-27-2009 |
20090231920 | PROGRAMMING METHOD AND MEMORY DEVICE USING THE SAME - A programming method applied to a memory is provided. The memory includes a number of memory cells. The method includes the following steps. A target cell of the memory cells is programmed in response to a first programming command. The target cell is programmed in response to a second programming command. | 09-17-2009 |
20090231921 | MANUFACTURING METHOD OF NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND NONVOLATILE SEMICONDUCTOR STORAGE DEVICE - In a nonvolatile semiconductor storage device having a split-gate memory cell including a control gate electrode and a sidewall memory gate electrode and a single-gate memory cell including a single memory gate electrode on the same silicon substrate, the control gate electrode is formed in a first region via a control gate insulating film, the sidewall memory gate electrode is formed in the first region via a charge trapping film, and at the same time, a single memory gate electrode is formed in a second region via the charge trapping film. At this time, the sidewall memory gate electrode and the single memory gate electrode are formed in the same process, and the control gate electrode and the sidewall memory gate electrode are formed so as to be adjacently disposed to each other in a state of being electrically isolated from each other. | 09-17-2009 |
20090231922 | Nonvolatile Memory Device and Read Method Thereof - Disclosed is a read method of a non-volatile memory device which includes performing a first read operation in which a first read voltage is applied to a selected word line. If a read fail arises at the first read operation, a second read operation is performed in which a second read voltage lower than the first read voltage is applied to the selected word line. If no read fail arises at the second read operation, the read fail generated at the first read operation is cured by performing a program operation. | 09-17-2009 |
20090238004 | Method of operating sonos memory device - A silicon-oxide-nitride-oxide-silicon (SONOS) memory device includes a memory type transistor including a gate with a SONOS structure on a semiconductor substrate. The gate is formed by sequentially stacking a tunneling oxide layer, a memory node structure including a trap site having nano-sized trap elements in which charges passing through the tunneling oxide layer are trapped, and a gate electrode. The nano-sized trap elements may be a crystal layer composed of nanocrystals that are separated from one another to trap the charges. The memory node structure may include additional memory node layers which are isolated from the nano-sized trap elements. | 09-24-2009 |
20090238005 | MULTI-PLANE TYPE FLASH MEMORY AND METHODS OF CONTROLLING PROGRAM AND READ OPERATIONS THEREOF - A multi-plane type flash memory device comprises a plurality of planes each including a plurality of memory cell blocks, page buffers each latching an input data bit to be output to its corresponding plane or latching an output data bit to be received from the corresponding plane, cache buffers each storing an input or output data bits in response to one of cache input control signals and each transferring the stored data bit to the page buffer or an external device in response to one of cache output control signals, and a control logic circuit generating the cache input and output control signals in response to command and chip enable signals containing plural bits. The program and read operations for the plural planes are conducted simultaneously in response to the chip enable signal containing the plural bits, which increases an operation speed and data throughput processed therein. | 09-24-2009 |
20090251969 | ANALOG READ AND WRITE PATHS IN A SOLID STATE MEMORY DEVICE - A memory array in a memory device is coupled to an analog I/O data interface that enables analog voltage levels to be written to the memory array. The I/O interface is comprised of a plurality of analog data paths that each includes a capacitor for storing charge corresponding to a target voltage to which a selected memory cell, coupled to its respective data path, is to be programmed. A plurality of comparators can be included in the I/O interface, with each such comparator coupled to a respective bit line. Such a comparator can compare a threshold voltage of a selected memory cell to its target voltage and inhibits further programming when the threshold voltage equals or exceeds the target voltage. | 10-08-2009 |
20090251970 | SEMICONDUCTOR DEVICE AND CONTROL METHOD THEREOF - A semiconductor device in accordance with one embodiment of the invention can include a first data storage region including a non-volatile main data storage region. Additionally, the semiconductor device can include a second data storage region including a non-volatile reference region wherein an erasing operation and a writing operation are performed on both the first data storage region and the second data storage region. Moreover, the semiconductor device can also include a control unit coupled to the first and second data storage regions which determines a stress condition corresponding to the first data storage region based on a stress information related to the second data storage region. | 10-08-2009 |
20090262581 | NON VOLATILE MEMORY - An electrically programmable and erasable non-volatile semiconductor memory such as a flash memory is designed into a configuration in which, when a cutoff of the power supply occurs in the course of a write or erase operation carried out on a memory cell employed in the non-volatile semiconductor memory, the operation currently being executed is discontinued and a write-back operation is carried out to change a threshold voltage of the memory cell in the reversed direction. In addition, the configuration also allows the number of charge-pump stages in an internal power-supply configuration to be changed in accordance with the level of a power-supply voltage so as to make the write-back operation correctly executable. As a result, no memory cells are put in deplete state even in the event of a power-supply cutoff in the course of a write or erase operation. | 10-22-2009 |
20090268525 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device capable of preventing the disturb phenomenon that could become a serious problem as the nonvolatile memory having a virtual grounding bit line is miniaturized comprises a program row voltage application circuit for applying a predetermined program row voltage to the selected word line in programming in the selected memory cell, a program column voltage application circuit for applying a ground voltage to one of a pair of selected bit lines and applying a predetermined program column voltage to the other of the selected bit lines in programming; and a counter voltage application circuit for applying a counter voltage of an intermediate voltage between the ground voltage and program column voltage, to an adjacent unselected bit line not connected to the selected memory cell in the first and second bit lines and adjacent to the selected bit line to which the program column voltage is applied. | 10-29-2009 |
20090268526 | SEMICONDUCTOR MEMORY DEVICE WITH A STACKED GATE INCLUDING A CHARGE STORAGE LAYER AND A CONTROL GATE AND METHOD OF CONTROLLING THE SAME - A semiconductor memory device includes a transfer circuit and a control circuit. The transfer circuit which includes a p-type MOS transistor with a source to which is applied a first voltage and an n-type MOS transistor to whose gate the drain of the p-type MOS transistor is connected and the first voltage is transferred, to whose source a second voltage is applied, and whose drain is connected to a load. The control circuit which turns the p-type MOS transistor on and off and which turns the p-type MOS transistor on to make the p-type MOS transistor transfer the second voltage to the load and, during the transfer, turns the p-type MOS transistor off to make the gate of the n-type MOS transistor float at the first voltage. | 10-29-2009 |
20090279361 | Addressable Memory Array - This document discloses non-volatile memory cells and methods of manufacturing the same. The memory arrays are byte, word, and/or page addressable without using a byte select transistor. The byte select transistor is eliminated by using the well, memory transistor control gates, and select transistor gates to selectively program a byte, word, or page. | 11-12-2009 |
20090279362 | PARTIAL SCRAMBLING TO REDUCE CORRELATION - Decorrelation is provided between data stored in respective pairs of adjacent memory cells in a plurality of bit lines of a flash memory. Each of the pairs of adjacent memory cells is located along a respective one of the bitlines and common to two adjacent wordlines. The decorrelation is achieved by storing scrambled data in at least one memory cell of each of the pairs of adjacent memory cells and storing unscrambled data in at least one memory cell of at least one of the pairs of adjacent memory cells. | 11-12-2009 |
20090290421 | FLASH MEMORY DEVICE AND METHOD OF PROGRAMMING THE SAME - A flash memory device and a method of programming the same are disclosed. The flash memory device includes an array of memory cells intersected by a plurality of bit lines and a plurality of word lines. A page buffer circuit includes a plurality of latches coupled to an even virtual bit line and an odd virtual bitline. The page buffer circuit is configured to load data into the array of memory cells responsive to a select circuit, which is structured to electrically couple at least some of the bit lines to the plurality of latches of the page buffer circuit. | 11-26-2009 |
20090296478 | METHOD OF PROGRAMMING NONVOLATILE MEMORY DEVICE - In one aspect of the method of programming a nonvolatile memory device, memory cells selected for a program are determined to belong to a first memory cell group or a second memory cell group based on address information and a program command. According to this determination, to-be-programmed data are input based on information about the number of set data bits, and programming and verification are performed. | 12-03-2009 |
20090296479 | SEMICONDUCTOR MEMORY DEVICE - There are provided a first nonvolatile memory array including a plurality of nonvolatile memory elements which require an erase operation before a write operation, and a second nonvolatile memory array including a plurality of overwritable nonvolatile memory elements. A request to rewrite data is received by a control circuit. The control circuit writes data to be rewritten to the second nonvolatile memory array when the capacity of the data to be rewritten is not more than that of the second nonvolatile memory array. | 12-03-2009 |
20090296480 | CIRCUIT FOR GENERATING A VOLTAGE AND A NON-VOLATILE MEMORY DEVICE HAVING THE SAME - A circuit for providing a voltage, which includes a first voltage generating circuit to output a first voltage generated by dividing an input voltage on the basis of resistance rate varied in accordance with a first control signal, a second voltage generating circuit to output a third voltage by using a second voltage, where the third voltage is shifted in accordance with a temperature, a third voltage generating circuit to change the third voltage by using a voltage shift rate set in accordance with a level of an operation voltage to be outputted at the temperature, thereby outputting a fourth voltage, and a comparison amplifying circuit configured to output the operation voltage in accordance with the first voltage, the fourth voltage and resistance rate. | 12-03-2009 |
20090296481 | EEPROMS USING CARBON NANOTUBES FOR CELL STORAGE - An electrically erasable programmable read only memory (EEPROM) cell includes cell selection circuitry and a storage cell for storing the informational state of the cell. The storage cell is an electro-mechanical data retention cell in which the physical positional state of a storage cell element represents the informational state of the cell. The storage cell element is a carbon nanotube switching element. The storage is writable with supply voltages used by said cell selection circuitry. The storage is writable and readable via said selection circuitry with write times and read times being within an order of magnitude. The write times and read times are substantially the same. The storage has no charge storage or no charge trapping. | 12-03-2009 |
20090296482 | Non-volatile memory device and method of operation therefor - In one embodiment, the non-volatile memory device includes a plurality of normal memory cells, and at least one flag memory cell associated with one of the plurality of normal memory cells. A normal page buffer is configured to store data read from one of the plurality of normal memory cells. The normal page buffer includes a main latch storing the read data. A control circuit is configured to selectively change data stored in the main latch during a read operation based on a state of the flag memory cell. | 12-03-2009 |
20090296483 | NONVOLATILE MEMORY DEVICE WITH EXPANDED TRIMMING OPERATIONS - A nonvolatile memory device includes a trimming cell array storing trimming data for a plurality of operating modes, a trimming cell sense amplifier sensing the trimming data and a trimming cell latch storing the sensed trimming data. A plurality of trimming circuits performs trimming operations in response to a trimming control signals derived from trimming data. A single temporary trimming control logic unit receives externally provided control data and controls operation of a single summation circuit. The summation circuit controls the operation of the trimming circuits by respectively and selectively varying the trimming control signal provided to each one of the plurality of trimming circuits in response to the externally provided control data. | 12-03-2009 |
20090296484 | Apparatus for Generating A Voltage and Non-Volatile Memory Device Having the Same - An apparatus for generating a voltage includes a first voltage outputting circuit configured to receive an input voltage and adjust and output a first voltage in accordance with a temperature, a buffer circuit configured to receive the first voltage and output the received first voltage as a second voltage at an output node of the buffer circuit, and a second voltage outputting circuit configured to receive the second voltage at an input terminal and output a third voltage by dividing a driving voltage in accordance with a resistance ratio, wherein the second voltage outputting circuit includes a sub-voltage outputting circuit and a controlling circuit configured to adjust a voltage level of the third voltage through a feedback of the third voltage to the input terminal. | 12-03-2009 |
20090296485 | DIFFERENTIAL FLASH MEMORY PROGRAMMING TECHNIQUE - The invention relates flash memory programming techniques. An object of the invention is to provide a flash memory programming technique avoiding problems of the known state of the art and in particular, saving a significant amount of time during the development and/or production phases of any equipment containing flash memory devices and also saving time during an updating or upgrading procedure of such an equipment already being in use. Accordingly, the invention proposes for programming a flash memory device to program only differences in information between data already stored in the flash memory device and new data to be stored. | 12-03-2009 |
20090303797 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a semiconductor substrate, a gate insulating film formed on the substrate, a first gate electrode formed on the gate insulating film, source and drain regions formed in the substrate so as to sandwich the first gate electrode, an intergate insulating film formed on the first gate electrode and including an opening, a second gate electrode formed on the intergate insulating film and electrically connected to the first gate electrode through the opening, and a boost electrode formed on the intergate insulating film and electrically isolated from the first gate electrode and the second gate electrode. | 12-10-2009 |
20090310417 | SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit includes a non-volatile memory built into the semiconductor integrated circuit, the non-volatile memory electrically writing and erasing data and including a memory cell, the memory cell including: a selecting transistor controlled by a word line; an impurity diffused region formed inside a semiconductor substrate, the impurity diffused region being coupled to one of a source and a drain of the selecting transistor; a first electrode formed above the semiconductor substrate with an insulating film therebetween, the first electrode receiving a control signal and part of the first electrode having an opening; a second electrode formed avobe the first electrode so as to oppose the first electrode with an insulating film therebetween, the second electrode having a protrusion which opposes the impurity diffused region with a tunnel film therebetween and projects toward the semiconductor substrate through the opening of the first electrode, and storing information based on an applied voltage; and a sensing transistor operating based on charges accumulated in the second electrode, so as to sense the information stored in the memory cell. | 12-17-2009 |
20090316485 | MEMORY CARD USING MULTI-LEVEL SIGNALING AND MEMORY SYSTEM HAVING THE SAME - A memory card including a memory controller, a memory system and a method to control a memory are provided. The memory card includes a flash memory, a memory interface outputting a writing data signal to be written into the flash memory, and a multi-level converter transforming the writing data signal into a writing voltage signal to be provided to the flash memory. The writing voltage signal has one of different voltage levels in accordance with plural bits of the writing data signal. | 12-24-2009 |
20090316486 | PROGRAM AND READ TRIM SETTING - A method and apparatus for setting trim parameters in a memory device provides multiple trim settings that are assigned to portions of the memory device according to observed or tested programming speed and reliability. | 12-24-2009 |
20090323422 | GAIN CONTROL FOR READ OPERATIONS IN FLASH MEMORY - A technique for performing read operations with reduced errors in a memory device such as flash memory. An automatic gain control approach is used in which cells which have experienced data retention loss are read by a fine M-level quantizer which uses M-1 read threshold voltage levels. In one approach, M-quantized threshold voltage values are multiplied by a gain to obtain gain-adjusted threshold voltage values, which are quantized by an L-level quantizer, where L12-31-2009 | |
20090323423 | METHODS, CIRCUITS AND SYSTEMS FOR READING NON-VOLATILE MEMORY CELLS - The present invention includes methods, circuits and systems for reading non-volatile memory (“NVM”) cells, including multi-level NVM cells. According to some embodiments of the present invention, there may be provided a NVM cell threshold voltage detection circuit adapted to detect an approximate threshold voltage associated with a charge storage region of a NVM cell, where the NVM cell may be a single or a multi-charge storage region cell. A decoder circuit may be adapted to decode and/or indicate the logical state of a NVM cell charge storage region by mapping or converting a detected approximate threshold voltage of the charge storage region into a logical state value. | 12-31-2009 |
20090323424 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR DRIVING SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a plurality of memory cell transistors arranged in a matrix; a plurality of word lines commonly coupling the control gates of the plural memory cell transistors present in a identical first direction; a plurality of source lines commonly coupling the sources of the plural memory cell transistors present in the identical first direction; a plurality of bit lines commonly coupling the drains of the plural memory cell transistors present in a identical second direction intersecting the first direction; a first transistor having a drain coupled to the source line; a second transistor having a drain coupled to a source of the first transistor, a gate coupled to the word line and a source grounded; and a control line commonly coupling the gates of the plural first transistors. | 12-31-2009 |
20090323425 | SYSTEMS AND METHODS FOR IMPROVED FLOATING-GATE TRANSISTOR PROGRAMMING - The present invention describes systems and methods for improving the programming of floating-gate transistors. An exemplary embodiment of the present invention provides a floating-gate transistor programming system including an array of floating-gate transistors and a measuring circuit comprising a logarithmic transimpedance amplifier and an analog-to-digital converter. Furthermore, the floating-gate transistor programming system includes an injecting circuit comprising a digital-to-analog converter, wherein the pulsing circuit can inject charge into each of the floating-gate transistors and the measuring circuit can measure a present charge value in one of the plurality of floating-gate transistors. | 12-31-2009 |
20090323426 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a sense amplifier which senses identical multilevel data, which is stored in a memory cell, a plurality of number of times at a time of read, and a n-channel MOS transistor which has a current path one end of which is connected to the sense amplifier and the other end of which is connected to a bit line. The device further include a control unit which applies a first voltage to a gate electrode of the n-channel MOS transistor, thereby setting the n-channel MOS transistor in an ON state, and applies a second voltage which is higher than the first voltage, to the gate electrode during a period after first sense and before second sense. | 12-31-2009 |
20090323427 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device is provided which can achieve high performance, such as an improvement in reliability, an improvement in yield, and the like, without increasing the chip area. The semiconductor memory device is a non-volatile semiconductor memory device operable to program and erase data, and hold the data in the absence of a supplied voltage, comprising a memory cell including a first charge localized portion and a second charge localized portion each operable to store static charge corresponding to the data. The second charge localized portion stores static charge corresponding to static charge which should be stored in the first charge localized portion, thereby serving as a backup to the first charge localized portion. | 12-31-2009 |
20090323428 | METHOD FOR IMPROVING MEMORY DEVICE CYCLING ENDURANCE BY PROVIDING ADDITIONAL PULSES - A method for programming and erasing a PHINES memory device is comprising providing one or more additional pulses that are associated with a program or erase pulse, wherein the additional pulses are of similar polarity, but of lesser magnitude than the program or erase pulses. For an erase pulse on a PHINES memory device, two additional pulses can be utilized. For a program pulse on the source-side of a PHINES memory device, one additional pulse can be utilized that comprises a negative bias measured from a gate of the memory device to a source of the memory device. For a program pulse on the drain-side of a PHINES memory device, one additional pulse can be utilized that comprises a negative bias measured from a gate of the memory device to a drain of the memory device. | 12-31-2009 |
20100002517 | SEMICONDUCTOR DEVICE AND METHOD FOR CONTROLLING - A semiconductor device is disclosed. The semiconductor device includes a plurality of memory cells that are provided in a matrix and that have a charge storage layer made of an insulating film that is provided on a semiconductor substrate and a plurality of word lines that are provided on the charge storage layer. A plurality of memory cells that are arranged in a single line among the plurality of memory cells arranged in the matrix are coupled to the same word line. The semiconductor device further includes an application section that when reading data from a selected memory cell selected from the plurality of memory cells, applies a voltage to a selected word line to be coupled to the selected memory cell among the plurality of word lines. The application section applies a voltage that has a polarity that is opposite to the voltage applied to the selected word line to non-selected word lines arranged on both adjacent sides of the selected word line. | 01-07-2010 |
20100002518 | Flash memory device and programming method thereof - The flash memory device includes a memory cell array having a plurality of memory cells, a high voltage generator configured to generate a plurality of pass voltages, with a first pass voltage of the plurality of pass voltages supplied to the memory cell array during a programming operation; and a main controller including a voltage controller configured to shift the first pass voltage at a plurality of time intervals during the programming operation. | 01-07-2010 |
20100002519 | Flash memory device and programming method thereof - A flash memory device including a controller to determine higher, M, and lower, N, word-line address bits based on an input word-line address, to determine a selected area of a memory array based on the higher and lower word-line address bits, and an unselected area of the memory array based on the selected area; and a high voltage generator to provide a first pass voltage to a word line of the selected area, and to provide a second pass voltage to a word line of the unselected area. The pass voltages are discriminately applied to the programmed and non-programmed memory cells, enlarging the pass voltage window. The memory array is divided into pluralities of zones to which local voltages are each applied in different levels. | 01-07-2010 |
20100002520 | METHOD FOR PROGRAMMING A FLASH MEMORY DEVICE - A method for programming a flash memory device includes applying a program bias to a memory cell of a plurality of memory cells within a memory cell string. Each memory cell string comprises a source select line, a plurality of memory cells and a drain select line. A first pass bias is applied to at least one of the memory cells in a source select line direction relative to the memory cell to which the program bias has been applied. A second pass bias is applied to the memory cells in a drain select line direction relative the memory cell(s) to which the first pass bias has been applied. | 01-07-2010 |
20100008143 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND CONTROL METHOD THEREOF - A nonvolatile semiconductor memory device includes a multi-layer insulating film having at least charge storage layers and formed on bottom surfaces and both side surfaces of a plurality of trench portions respectively formed in portions between the plurality of active areas formed in a first direction, a plurality of gate electrodes filled in internal portions of the plurality of trench portions with the multi-layer insulating film, a plurality of first metal interconnections formed in a second direction and each functioning as a bit line or source line, and a plurality of first conductivity-type diffusion layer regions arranged in a staggered form in corresponding portions of the plurality of active areas which intersect with the plurality of first metal interconnections. The device further includes a plurality of connection contacts form to respectively connect the plurality of first conductivity-type diffusion layer regions to the plurality of first metal interconnections. | 01-14-2010 |
20100008144 | SYSTEM AND MEMORY FOR SEQUENTIAL MULTI-PLANE PAGE MEMORY OPERATIONS - A system and method for performing memory operations in a multi-plane flash memory. Commands and addresses are sequentially provided to the memory for memory operations in memory planes. The memory operations are sequentially initiated and the memory operation for at least one of the memory planes is initiated during the memory operation for another memory plane. In one embodiment, each of a plurality of programming circuits is associated with a respective memory plane and is operable to program data to the respective memory plane in response to programming signals and when it is enabled. Control logic coupled to the plurality of programming circuits generates programming signals in response to the memory receiving program commands and further generates programming enable signals to individually enable each of the programming circuits to respond to the programming signals and stagger programming of data to each of the memory planes. | 01-14-2010 |
20100014354 | USE OF RECOVERY TRANSISTORS DURING WRITE OPERATIONS TO PREVENT DISTURBANCE OF UNSELECTED CELLS - A memory array and method for performing a write operation in a memory array that eliminates parasitic coupling between selected and unselected bitlines and protects memory cells on unselected bitlines. A memory array ( | 01-21-2010 |
20100014355 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - In a nonvolatile memory cell, a selection transistor is connected to a memory cell transistor in series. The selection transistor is formed into a double layer gate structure, and has a voltage of each gate driven individually and separately. Using capacitive coupling between these stacked gate electrode layers of the selection transistor, a gate potential of the selection transistor is set to the predetermined voltage level. An absolute value of the voltage level generated by a voltage generator to the gates of the selection transistor can be made small, so that current consumption can be reduced and an layout area of the voltage generator can be reduced. Thus, a nonvolatile semiconductor memory device with a low current consumption and a small chip layout area is provided. | 01-21-2010 |
20100020615 | CLOCK SYNCHRONIZED NON-VOLATILE MEMORY DEVICE - A nonvolatile memory apparatus including a control circuit, plural terminals having clock, command and other terminals, data and command registers, and plural nonvolatile memory cells. The clock terminal receives a clock signal and the command terminal receives commands including read and program commands. The data register receives from and outputs data to outside. The control circuit reads operation steps from memory used to control the apparatus. The control circuit, responsive to the read command, controls reading data from the memory cells, storing read data to the data register, and outputting read data via the other terminal, not the command terminal, based on the clock signal. The control circuit, responsive to the program command, controls receiving data via the other terminal, not the command terminal, based on the clock signal, storing received data to the data register and writing received data to the memory cells. | 01-28-2010 |
20100020616 | Soft Errors Handling in EEPROM Devices - Soft errors occur during normal use of a solid-state memory such as EEPROM or Flash EEPROM. A soft error results from the programmed threshold voltage of a memory cell being drifted from its originally intended level. The error is initially not readily detected during normal read until the cumulative drift becomes so severe that it develops into a hard error. Data could be lost if enough of these hard errors swamps available error correction codes in the memory. A memory device and techniques therefor are capable of detecting these drifts and substantially maintaining the threshold voltage of each memory cell to its intended level throughout the use of the memory device, thereby resisting the development of soft errors into hard errors. | 01-28-2010 |
20100027342 | Memory device and memory data determination method - A memory device and a memory data determination method are provided. The memory device may estimate a threshold voltage shift of a first memory cell based on data before the first memory cell is programmed and a target program threshold voltage of the first memory cell. The memory device may generate a metric of a threshold voltage shift of a second memory cell based on the estimated threshold voltage shift of the first memory cell. Also, the memory device may determine data stored in the second memory cell based on the metric. | 02-04-2010 |
20100027343 | Non-Volatile Memory Monitor - The invention provides circuits, systems, and methods for monitoring a non-volatile memory (NVM) cell, or an array of NVM cells. The monitor is capable of switching from a normal operating state to an evaluation state, monitoring for one or more particular characteristics, and returning to the normal operating state. Alternative embodiments of the invention are disclosed using various triggers and producing outputs capable of reporting or feeding back to influence the operation of the monitoring systems and methods, the NVM circuitry, or an external system. The invention includes an energy conservation feature, in that no power is consumed in the normal operating state, and low power in the evaluation state. | 02-04-2010 |
20100027344 | SEMICONDUCTOR MEMORY DEVICE - A drain voltage generator circuit includes a first switching element coupled between a first power supply voltage and an output end of the drain voltage generator circuit, a second switching element coupled in parallel to the first switching element and having a smaller current capability than that of the first switching element, and a control circuit for turning ON the second switching element and then the first switching element, and generates a voltage to supply to a drain of a memory cell. A source of the memory cell is set to be floated or grounded by a transistor. | 02-04-2010 |
20100027345 | ERASABLE NON-VOLATILE MEMORY DEVICE USING HOLE TRAPPING IN HIGH-K DIELECTRICS - A non-volatile memory is described having memory cells with a gate dielectric. The gate dielectric is a multilayer charge trapping dielectric between a control gate and a channel region of a transistor to trap positively charged holes. The multilayer charge trapping dielectric comprises at least one layer of high-K. | 02-04-2010 |
20100027346 | Asymmetric Single Poly NMOS Non-Volatile Memory Cell - An asymmetric non-volatile memory (NVM) cell for a CMOS IC formed by a standard CMOS process flow used to form both low voltage and high voltage transistors on a substrate. The NVM cell includes an NMOS floating gate transistor and an optional select transistor. The floating gate transistor includes an elongated floating gate having a first portion disposed over the channel region C | 02-04-2010 |
20100027347 | Three-Terminal Single Poly NMOS Non-Volatile Memory Cell - A three terminal non-volatile memory (NVM) cell for a CMOS IC is formed by a standard CMOS process flow. The NVM cell includes two transistors that share a common floating gate. The floating gate includes a first portion disposed over the channel region of the first (NMOS) transistor, a second portion disposed over the channel region of the second (NMOS or PMOS) transistor, and a third portion extending into an enlarged drain diffusion area away from the channel regions, whereby the gate-to-drain capacitance is higher than the gate-to-source capacitances. A pocket implant or CMOS standard LV N-LDD is formed under the second transistor to enhance CHE programming. Both HV LDD and LV LDD implants are introduced together enabling LDD implant merging under the floating gate extension. The floating gate is formed using substantially T-shaped, C-shaped, U-shaped, Y-shaped or O-shaped polysilicon structures. Various array addressing schemes are disclosed. | 02-04-2010 |
20100034022 | COMPENSATING FOR COUPLING DURING READ OPERATIONS IN NON-VOLATILE STORAGE - Capacitive coupling from storage elements on adjacent bit lines is compensated by adjusting voltages applied to the adjacent bit lines. An initial rough read is performed to ascertain the data states of the bit line-adjacent storage elements, and during a subsequent fine read, bit line voltages are set based on the ascertained states and the current control gate read voltage which is applied to a selected word line. When the current control gate read voltage corresponds to a lower data state than the ascertained state of an adjacent storage element, a compensating bit line voltage is used. Compensation of coupling from a storage element on an adjacent word line can also be provided by applying different read pass voltages to the adjacent word line, and obtaining read data using a particular read pass voltage which is identified based on a data state of the word line-adjacent storage element. | 02-11-2010 |
20100034023 | NONVOLATILE SEMICONDUCTOR MEMORY ELEMENT, NONVOLATILE SEMICONDUCTOR MEMORY, AND METHOD FOR OPERATING NONVOLATILE SEMICONDUCTOR MEMORY ELEMENT - According to an aspect of the present invention, there is provided a nonvolatile semiconductor memory element including: a semiconductor substrate including: a source region; a drain region; and a channel region; a lower insulating film that is formed on the channel region; a charge storage film that is formed on the lower insulating film and that stores data; an upper insulating film that is formed on the charge storage film; and a control gate that is formed on the upper insulating film, wherein the upper insulating film includes: a first insulting film; and a second insulating film that is laminated with the first insulating film, and wherein the first insulating film is formed to have a trap level density larger than that of the second insulating film. | 02-11-2010 |
20100034024 | Control Method For Nonvolatile Memory and Semiconductor Device - In a nonvolatile memory, the threshold is restored to a state before changing, without increasing number of writing undesirably. In a system including a nonvolatile memory, a random number generator, and a controller accessible to the nonvolatile memory, every time access to the nonvolatile memory is performed, the controller determines a refresh-targeted area, based on a random number generated by the random number generator. The controller is made to perform refresh control to re-write to the refresh-targeted area. By such refresh control, the threshold is restored to a state before changing, without increasing the number of writing undesirably. | 02-11-2010 |
20100034025 | NON-VOLATILE SEMICONDUCTOR STORAGE SYSTEM - There is provided a non-volatile memory having electrically rewritable non-volatile memory cells arranged therein. A controller controls operation at the non-volatile memory. The non-volatile memory comprises a status output section configured to output status information indicating a status of read operation, write operation or erase operation in the non-volatile memory cell. The controller comprises a control signal generating section configured to output a control signal for a certain operation in the non-volatile memory, and a control signal switching section configured to instruct the control signal generating section to switch the control signal based on the status information. | 02-11-2010 |
20100046296 | METHOD FOR READING AND PROGRAMMING A MEMORY - A method for programming a memory is provided. The memory includes a number of cells and has a preset PV level for a target cell. The method includes programming a first-side of the target cell to have a Vt level not lower than the preset PV level; reading a Vt level of a second-side of the target cell and accordingly obtaining a corrected PV level corresponding to the first-side; and programming the first-side of the target cell to have a Vt level not lower than the corresponding corrected PV level. | 02-25-2010 |
20100046297 | NON-VOLATILE MEMORY AND METHOD FOR RAMP-DOWN PROGRAMMING - A ramp-down programming voltage is used to program a group of nonvolatile memory cells in parallel, step by step from a highest step to a lowest step. Overall programming time is improved when a conventional setup for program inhibit together with a verify after each program step are avoided. A program voltage estimate is provided for each cell indicating the programming voltage expected to program the cell to its target. Initially, all but those cells having estimates at or above the current program voltage step will be program-inhibited. Thereafter, with each descending program voltage step, additional cells will be un-inhibited. Once un-inhibited, a cell need not be re-inhibited even if programmed to its target. This is because subsequent program steps are at lower voltages and ineffective in programming the cell beyond its target. The un-inhibit operation in one implementation amounts to simply pulling the associated bit lines to ground. | 02-25-2010 |
20100046298 | Non-volatile semiconductor memory circuit - Provided is a non-volatile semiconductor memory circuit capable of improving data retention characteristics and decreasing an area thereof by connecting a constant current circuit ( | 02-25-2010 |
20100046299 | PROGRAMMING RATE IDENTIFICATION AND CONTROL IN A SOLID STATE MEMORY - Memory devices adapted to receive and transmit analog data signals representative of bit patterns of two or more bits facilitate increases in data transfer rates relative to devices communicating data signals indicative of individual bits. Programming of such memory devices includes determining a rate of programming (i.e., rate of movement of the respective threshold voltage) of the memory cells and biasing the corresponding bit line with a programming rate control voltage that is greater than the bit line enable voltage and less than the inhibit voltage. This voltage can be adjusted to change the speed of programming. A capacitor coupled to the bit line stores the programming rate control voltage in order to maintain the proper bit line bias for the duration of the programming operation or until it is desired to change the programming rate. | 02-25-2010 |
20100054040 | METHOD OF PROGRAMMING AND SENSING MEMORY CELLS USING TRANSVERSE CHANNELS AND DEVICES EMPLOYING SAME - A first channel in the substrate underlying a trap gate is biased to cause trapping of holes or electrons in the trap gate and thereby program the memory device to a programmed state. A second channel in the substrate underlying the trap gate and transverse to the first channel is biased to sense the programmed state. For example, biasing a first channel in the substrate underlying the trap gate to cause trapping of holes or electrons in the trap gate and thereby program the memory device to a programmed state may include applying voltages to a first source/drain region and first gate on a first side of the trap gate and to a second source/drain region and a second gate on a second side of the trap gate, and biasing a second channel in the substrate underlying the trap gate and transverse to the first channel to sense the programmed state may include applying voltages to a third source/drain region on a third side of the trap gate and to a fourth source/drain region on a fourth side of the trap gate. | 03-04-2010 |
20100061152 | METHOD AND SYSTEM TO ACCESS MEMORY - This document discusses among other things, a system comprising a host controller, an Input/Output buffer, and a memory device. The memory device is coupled to the host controller and is configured to receive a read command from the host controller. The non-volatile includes an interface control logic, which is in communication with a non-volatile memory. The interface control logic includes a latency programming circuit coupled to the non-volatile memory and the Input/Output buffer. The latency programming circuit stores at least one value corresponding to dummy byte delays to be provided at the non-volatile memory prior to transferring data from the non-volatile memory during a read operation. | 03-11-2010 |
20100067301 | COLUMNAR NON-VOLATILE MEMORY DEVICES WITH AUXILIARY TRANSISTORS AND METHODS OF OPERATING THE SAME - A non-volatile memory device includes at least one semiconductor column having a first sidewall and a second sidewall. The device also includes at least one gate electrode is disposed on the first sidewall and at least one control gate electrode disposed on the second sidewall. The device further includes at least one charge storage layer is disposed between the second sidewall and the at least one control gate electrode. The at least one gate electrode and the at least one control gate electrode may be disposed on opposite sides of the at least one semiconductor column such that they commonly control a channel region in the semiconductor column. | 03-18-2010 |
20100067302 | NAND-TYPE FLASH MEMORY AND NAND-TYPE FLASH MEMORY CONTROLLING METHOD - A method of controlling a NAND-type flash memory provided with a latch circuit in which data is temporarily stored has measuring a first consumption current of the latch circuit in a first state in which the latch circuit is caused to retain first logic; measuring a second consumption current of the latch circuit in a second state in which the latch circuit is caused to retain second logic obtained by inverting the first logic; and comparing the first consumption current and the second consumption current to cause the latch circuit to retain logic corresponding to the state corresponding to a smaller one of the first consumption current and the second consumption current. | 03-18-2010 |
20100067303 | FLASH MEMORY DEVICE CAPABLE OF REDUCED PROGRAMMING TIME - A flash memory device comprising a high voltage generator circuit that is adapted to supply a program voltage having a target voltage to a selected word line is provided. The flash memory device is adapted to terminate the program interval in accordance with when the program voltage has been restored to the target voltage after dropping below the target voltage. A method for operating the flash memory device is also provided. | 03-18-2010 |
20100067304 | WRITE ONCE READ ONLY MEMORY EMPLOYING CHARGE TRAPPING IN INSULATORS - Structures and methods for write once read only memory employing charge trapping in insulators are provided. The write once read only memory cell includes a metal oxide semiconductor field effect transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, and a gate separated from the channel region by a gate insulator. A plug couples the first source/drain region to an array plate. A bitline is coupled to the second source/drain region. The MOSFET can be programmed by operation in a reverse direction trapping charge in the gate insulator adjacent to the first source/drain region such that the programmed MOSFET operates at reduced drain source current when read in a forward direction. | 03-18-2010 |
20100074022 | MEMORY AND METHOD FOR PROGRAMMING THE SAME - A method for programming a memory is provided. The memory includes multiple rows of memory cells each including two half cells. The method includes the following steps. Whether the two half cells of a to-be-programmed memory cell of the n | 03-25-2010 |
20100074023 | SEMICONDUCTOR DEVICE HAVING NON-VOLATILE MEMORY AND METHOD OF FABRICATING THE SAME - A memory cell of a non-volatile memory device, comprises: a select transistor gate of a select transistor on a substrate, the select transistor gate comprising: a gate dielectric pattern; and a select gate on the gate dielectric pattern; first and second memory cell transistor gates of first and second memory cell transistors on the substrate at opposite sides of the select transistor, each of the first and second memory cell transistor gates comprising: a tunnel insulating layer pattern; a charge storage layer pattern on the tunnel insulating layer pattern; a blocking insulating layer pattern on the charge storage layer pattern; and a control gate on the blocking insulating layer pattern; first and second floating junction regions in the substrate between the select transistor gate and the first and second memory cell transistor gates respectively; and first and second drain regions in the substrate at sides of the first and second memory cell transistor gates respectively opposite the first and second floating junction regions respectively. Methods of formation thereof are also provided | 03-25-2010 |
20100080062 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR DRIVING SAME - A nonvolatile semiconductor memory device includes: a semiconductor substrate including a first channel, and a source region and a drain region provided on both sides of the first channel; a first insulating film provided on the first channel; a charge retention layer provided on the first insulating film; a second insulating film provided on the charge retention layer; and a semiconductor layer including a second channel provided on the second insulating film, and a source region and a drain region provided on both sides of the second channel. | 04-01-2010 |
20100080063 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes a memory cell group, transfer transistor, and switching circuit. The memory cell group has a plurality of memory cells each including a floating gate and control gate, and the current paths of the plurality of memory cells are connected in series. The transfer transistor transfers a write voltage to at least one memory cell in the memory cell group. The switching circuit applies a voltage to the gate of the transfer transistor. In a write operation, when a first voltage higher than a power supply voltage and lower than the write voltage is applied to the control gate of an unselected memory cell, the switching circuit applies an intermediate voltage higher than the first voltage and equal to or lower than the write voltage to the gate of the transfer transistor. | 04-01-2010 |
20100091572 | 2T NOR-TYPE NON-VOLATILE MEMORYT CELL ARRAY AND METHOD OF PROCESSING DATA OF 2T NOR-TYPE NON-VOLATILE MEMORY - Provided are a 2-transistor (2T) NOR cell array which includes at least a cell, and a cell comprising a selection transistor and a storage transistor including a charge storage floating gate or a charge storage dielectric, and a method of processing data of a 2T NOR flash memory cell which is used to store data in a 2T NOR cell array, read the stored data, and erase the stored data. The 2T NOR cell array includes a selection transistor and a storage transistor. The selection transistor includes a terminal connected to a bit line and a gate terminal applied with a selection signal. The storage transistor includes a terminal connected to the other terminal of the selection transistor, the other terminal connected to a common source line, and a gate applied with a control voltage. A back bias voltage is applied to bulk regions of the selection transistor and the storage transistor when a programming operation is performed, and a floating gate or a charge storage dielectric is provided between the gate and the bulk region of the storage transistor. | 04-15-2010 |
20100097863 | Method of programming non-volatile memory device and non-volatile memory device using the same - A program method of a nonvolatile memory device according to example embodiments includes a operation (a) of detecting a level of a program voltage; and a operation (b) of providing a unselected word line voltage and a bit line precharge voltage having a variable level respectively according to the detected level of the program voltage. | 04-22-2010 |
20100097864 | SEMICONDUCTOR MEMORY SYSTEM INCLUDING A PLURALITY OF SEMICONDUCTOR MEMORY DEVICES - A communication line is connected to first and second chips, and held at a first signal level. A monitor circuit changes a signal level of the communication line from the first signal to a second signal level while one of the first and second chips uses a current larger than a reference current. When the signal level of the communication line is the second signal level, the other of the first and second chips is controlled to a wait state that does not transfer to an operating state of using a current larger than the reference current. | 04-22-2010 |
20100103740 | Nonvolatile Memory Device, Methods of Programming the Nonvolatile Memory Device and Memory System Including the Same - A nonvolatile memory device is provided. A counter counts an amount of data to be program-inhibited among data to be written to memory cells to provide a first count value. The counter also counts an amount of program-inhibited data among data written to the memory cells to provide a second count value. Control logic controls a program operation by comparing the first count value with the second count value. | 04-29-2010 |
20100110793 | Flash Memory Device and Memory System Including the Same - Provided is a flash memory device. The flash memory device includes a memory cell array, and a voltage generator. The memory cell array is connected to a plurality of word lines. The voltage generator generates a program voltage which is supplied to a selected word line of the word lines and a pass voltage which is supplied to a non-selected word line of the word lines, in a program operation. The voltage generator varies a level of the pass voltage with a temperature. | 05-06-2010 |
20100110794 | NON-VOLATILE SEMICONDUCTOR MEMORY HAVING MULTIPLE EXTERNAL POWER SUPPLIES - A memory device includes core memory such as flash memory for storing data. The memory device includes a first power input to receive a first voltage used to power the flash memory. Additionally, the memory device includes a second power input to receive a second voltage. The memory device includes power management circuitry configured to receive the second voltage and derive one or more internal voltages. The power management circuitry supplies or conveys the internal voltages to the flash memory. The different internal voltages generated by the power management circuitry (e.g., voltage converter circuit) and supplied to the core memory enable operations such as read/program/erase with respect to cells in the core memory. | 05-06-2010 |
20100118609 | Nonvolatile semiconductor memory, and method for reading data - A nonvolatile semiconductor memory includes a memory cell, a first gate control circuit that is coupled to the memory cell, and a second gate control circuit that is coupled to the memory cell. The memory cell includes a first gate electrode that is formed above a channel region in a semiconductor substrate, a second gate electrode that is formed beside the first gate electrode, and that is capacitively coupled with the first gate electrode through a first insulating layer, and a charge trapping layer that is formed between the channel region and the second gate electrode, and that includes a second insulating layer for trapping a charge. Data stored in a memory cell transistor including the second gate electrode changes depending on an amount of the charge trapped in the charge trapping layer. The first gate control circuit applies a potential to the first gate electrode, when reading the data stored in the memory cell transistor. The second gate control circuit brings the second gate electrode into a floating state, when the potential is applied to the first gate electrode. | 05-13-2010 |
20100118610 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A stacked body with a plurality of dielectric films and electrode films alternately stacked therein is provided. The electrode film is divided into a plurality of control gate electrodes extending in one direction. The stacked body is provided with a U-pillar penetrating through the select gate electrodes and the control gate electrodes, having one end connected to a source line, and having the other end connected to a bit line. Moreover, a different potential is applied to uppermost one of the control gate electrodes than that applied to the other control gate electrodes. | 05-13-2010 |
20100124119 | Nonvolatile Memory Device and Read Methods Thereof - An object of the present inventive concept is providing a nonvolatile memory device having improved reliability by compensating a threshold voltage of a flash memory cell. | 05-20-2010 |
20100135081 | NONVOLATILE MEMORY DEVICE - A nonvolatile semiconductor memory device includes a memory cell array and a control circuit configured to control reading and programming operations for reading data from and inputting data to the memory cell array, respectively. The control circuit includes first and second units. The first unit is configured to count a number of bits having logic 0 or a number of bits having logic 1, to set a logic where the counted number is greater than n/2 as an initial state to regenerate programming data, and to perform a programming operation based on the regenerated data, when simultaneously programming the programming data of n bits input for a designated address. The second unit is configured to program a recognition bit for recognizing which of the logic 0 and the logic 1 the initial state of the memory cell of the designated address is in, when the programming operation is performed. | 06-03-2010 |
20100142281 | Non-Volatile Memory Device and Program Method Thereof - Disclosed is a program method of a non-volatile memory device which comprises classifying plural memory cells into aggressor cells and victim cells based on program data to be written in the plural memory cells; and programming the aggressor cells by a program manner different from the victim cells. | 06-10-2010 |
20100142282 | METHOD OF PROGRAMMING FLASH MEMORY DEVICE - A method of programming data in a flash memory device is disclosed. The memory device includes a memory cell array which in turn includes at least one block, and the block in turn includes a plurality of pages. A program command to program a plurality of pages in the block is received. The plurality of pages is programmed in a predefined order. An address corresponding to a page that was programmed last amongst the plurality of pages is stored. | 06-10-2010 |
20100142283 | PROGRAM METHOD WITH OPTIMIZED VOLTAGE LEVEL FOR FLASH MEMORY - A non-volatile memory device and programming process is described that increases the programming voltage of successive programming cycles in relation to the percentage of the data bits that failed programming verification during the previous programming cycle and were not correctly programmed into the memory array. This allows for a faster on average program operation and a more accurate match of the subsequent increase in the programming voltage to the non-volatile memory device, the specific region or row being programmed and any changes due to device wear. In one embodiment of the present invention the manufacturing process/design and/or specific memory device is characterized by generating a failed bit percentage to programming voltage increase profile to set the desired programming voltage delta/increase. In another embodiment of the present invention, methods and apparatus are related for the programming of data into non-volatile memory devices and, in particular, NAND and NOR architecture Flash memory. | 06-10-2010 |
20100149876 | Reverse Reading In Non-Volatile Memory With Compensation For Coupling - Shifts in the apparent charge stored by a charge storage region such as a floating gate in a non-volatile memory cell can occur because of electrical field coupling based on charge stored in adjacent (or other) charge storage regions. Although not exclusively, the effects are most pronounced in situations where adjacent memory cells are programmed after a selected memory cell. To account for the shift in apparent charge, one or more compensations are applied when reading storage elements of a selected word line based on the charge stored by storage elements of other word lines. Efficient compensation techniques are provided by reverse reading blocks (or portions thereof) of memory cells. By reading in the opposite direction of programming, the information needed to apply (or select the results of) an appropriate compensation when reading a selected cell is determined during the actual read operation for the adjacent word line rather than dedicating a read operation to determine the information. | 06-17-2010 |
20100157679 | MONITOR STRUCTURE FOR MONITORING A CHANGE OF A MEMORY CONTENT - A monitor structure for monitoring a change of a memory content in a memory field of a non-volatile memory comprising a reference transistor in the memory field and a monitor transistor. The monitor transistor and the reference transistor comprise a common floating gate. Moreover, the memory field is arranged in a first well, and the monitor transistor in a second well. The first well and the second well are of different doping types. | 06-24-2010 |
20100157680 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a semiconductor region, a tunnel insulating film formed on the semiconductor region, a charge-storage insulating film formed on the tunnel insulating film, a block insulating film formed on the charge-storage insulating film, and a control gate electrode formed on the block insulating film, wherein the tunnel insulating film comprises a first region which is formed on a surface of the semiconductor region and contains silicon and oxygen, a second region which contains silicon and nitrogen, a third region which is formed on a back surface of the charge-storage insulating film and contains silicon and oxygen, and an insulating region which is formed at least between the first region and the second region or between the second region and the third region, and contains silicon and nitrogen and oxygen and the second region is formed between the first region and the third region. | 06-24-2010 |
20100157681 | Read, Verify Word Line Reference Voltage to Track Source Level - A non-volatile memory device has individual pages of memory cells to be sensed in parallel. The memory device includes a source level tracking circuit coupled to receive a predetermined word line voltage from a word line voltage supply and the voltage level at the aggregate source node of one or more pages and coupled to provide to word lines of the memory an output voltage during the sensing operation, where the source level tracking circuit includes an op amp whereby the output voltage is the word line voltage offset by an amount to track the voltage level at the aggregate node and compensate for source bias errors due to a finite resistance in the ground loop. | 06-24-2010 |
20100157682 | METHOD OF ENHANCING CHARGE STORAGE IN AN E2PROM CELL - A method is provided for enhancing charge storage in an E | 06-24-2010 |
20100157683 | APPARATUS AND METHOD FOR REDUCED PEAK POWER CONSUMPTION DURING COMMON OPERATION OF MULTI-NAND FLASH MEMORY DEVICES - System and method for executing a global memory command in a multi-chip non-volatile memory device having a plurality of non-volatile memories. The global memory command is received at each non-volatile memory concurrently. The memory command is initiated at different times relative to receiving the global memory command for at least two of the plurality of non-volatile memory to mitigate peak power consumption. | 06-24-2010 |
20100157684 | FLASH MEMORY PROGRAM INHIBIT SCHEME - A method for minimizing program disturb in Flash memories. To reduce program disturb in a NAND Flash memory cell string where no programming from the erased state is desired, a local boosted channel inhibit scheme is used. In the local boosted channel inhibit scheme, the selected memory cell in a NAND string where no programming is desired, is decoupled from the other cells in the NAND string. This allows the channel of the decoupled cell to be locally boosted to a voltage level sufficient for inhibiting F-N tunneling when the corresponding wordline is raised to a programming voltage. Due to the high boosting efficiency, the pass voltage applied to the gates of the remaining memory cells in the NAND string can be reduced relative to prior art schemes, thereby minimizing program disturb while allowing for random page programming. | 06-24-2010 |
20100165734 | SYSTEM AND METHOD FOR DATA RECOVERY IN A DISABLED INTEGRATED CIRCUIT - Systems and methods for providing memory access circuitry in application specific integrated circuits, and in certain configurations for recovering data from non-volatile memory registers in a partially disabled application specific integrated circuit as provided. In one configuration, a virtual partial dual-port non-volatile memory is provided having a secondary partial read only port. In another configuration, a physical partial dual-port non-volatile memory is provided having a secondary partial read only port. | 07-01-2010 |
20100165735 | NONVOLATILE SEMICONDUCTOR MEMORY - A nonvolatile semiconductor memory of an aspect of the present invention comprises a voltage step-down circuit including a first and a second circuit to achieve a voltage drop and configured to decrease the first voltage to a second voltage less than the first voltage, a transfer transistor to transfer the second voltage to a word line, and a control circuit to generate the second voltage as a first write voltage in a first mode wherein the first write voltage less than or equal to a prescribed magnitude is applied to the word line, and to generate the second voltage as a second write voltage in a second mode wherein the second write voltage greater than the prescribed magnitude is applied to the word line, wherein the difference between the first voltage and the second voltage is greater than or equal to the threshold voltage of the transfer transistor. | 07-01-2010 |
20100165736 | FLASH MEMORY DEVICE AND MANUFACTURING METHOD OF THE SAME - A flash memory device and a method for manufacturing the same are provided. The flash memory device can include first and second memory gates on a substrate, an oxide layer on sides of and on the substrate outside of the first and second memory gates, a source poly contact between the first and second memory gates, first and second select gates outside the first and second memory gates, a drain region outside the first and second select gates, and a metal contact on the drain region and the source poly contact. | 07-01-2010 |
20100165737 | ELECTROMECHANICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME - In a memory device and a method of forming the same, in one embodiment, the memory device comprises a first word line structure on a substrate, the first word line structure extending in a first direction. A bit line is provided over the first word line structure and spaced apart from the first word line by a first gap, the bit line extending in a second direction transverse to the first direction. A second word line structure is provided over the bit line and spaced apart from the bit line by a second gap, the second word line structure extending in the first direction. The bit line is suspended between the first word line structure and the second word line structure such that the bit line deflects to be electrically coupled with a top portion of the first word line structure through the first gap in a first bent position and deflects to be electrically coupled with a bottom portion of the second word line structure through the second gap in a second bent position, and is isolated from the first word line structure and the second word line structure in a rest position. | 07-01-2010 |
20100172183 | Method and Apparatus to Suppress Fringing Field Interference of Charge Trapping NAND Memory - With advanced lithographic nodes featuring a half-pitch of 30 nm or less, charge trapping NAND memory has neighboring cells sufficiently close together that fringing fields from a neighboring pass gate interferes with the threshold voltage. The interference results from fringing fields that occupy the gaps that separate the neighboring charge storage structures. The fringing electric fields are suppressed, by the insulating structures having a relative dielectric constant with respect to vacuum that is less than a relative dielectric constant of silicon oxide, from entering the neighboring charge storage structures. In some embodiments, the insulating structures suppress the fringing electric fields from entering a channel region. This suppresses the short channel effects despite the small dimensions of the devices. | 07-08-2010 |
20100172184 | Asymmetric Single Poly NMOS Non-Volatile Memory Cell - An asymmetric non-volatile memory (NVM) cell for a CMOS IC formed by a standard CMOS process flow used to form both low voltage and high voltage transistors on a substrate. The NVM cell includes an NMOS floating gate transistor and an optional select transistor. The floating gate transistor includes an elongated floating gate having a first portion disposed over the channel region C | 07-08-2010 |
20100177567 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE WHICH CAN ELECTRICALLY REWRITE DATA AND SYSTEM THEREFOR - A nonvolatile semiconductor memory device includes a memory cell, latch circuits, and an arithmetic operation circuit. The memory cell stores data by a difference in threshold voltage. A read operation is performed twice or more on the memory cell under the same read conditions, and the latch circuits store a plurality of read data. The arithmetic operation circuit takes majority decision of the plurality of data stored in the latch circuits and decides data determined by the majority decision as data stored in the memory cell. | 07-15-2010 |
20100177568 | READ MODE FOR FLASH MEMORY - A method for reading a nonvolatile memory array including an array of memory cells, each memory cell including a substrate, a control gate, a charge storage element, a source region and a drain region, includes receiving, at an address register, a read command including an address for a memory cell in the array of memory cells and an indication regarding whether the read command is a full page read command or a partial page read command. A starting address for a page including the received address is identified, wherein the page includes multiple rows of memory cells in the array of memory cells. The address register is reset to the starting address for the page. It is determined whether all memory cells in the page are non-programmed. Data indicative of a non-programmed state of the page is output if it is determined that all memory cells in the page are non-programmed. | 07-15-2010 |
20100182837 | MAGNETIC FLOATING GATE MEMORY - An apparatus includes at least one memory device including a floating gate element and a magnetic field generator that operably applies a magnetic field to the memory device. The magnetic field directs electrons in the memory device into the floating gate element. | 07-22-2010 |
20100182838 | FLASH MEMORY DEVICE WITH DATA OUTPUT CONTROL - An apparatus, system, and computer-implemented method for controlling data transfer between a plurality of serial data link interfaces and a plurality of memory banks in a semiconductor memory is disclosed. In one example, a flash memory device with multiple links and memory banks, where the links are independent of the banks, is disclosed. The flash memory devices may be cascaded in a daisy-chain configuration using echo signal lines to serially communicate between memory devices. In addition, a virtual multiple link configuration is described wherein a single link is used to emulate multiple links. | 07-22-2010 |
20100188901 | Three-Terminal Single Poly NMOS Non-Volatile Memory Cell - A three terminal non-volatile memory (NVM) cell for a CMOS IC is formed by a standard CMOS process flow. The NVM cell includes two transistors that share a common floating gate. The floating gate includes a first portion disposed over the channel region of the first (NMOS) transistor, a second portion disposed over the channel region of the second (NMOS or PMOS) transistor, and a third portion extending into an enlarged drain diffusion area away from the channel regions, whereby the gate-to-drain capacitance is higher than the gate-to-source capacitances. A pocket implant or CMOS standard LV N-LDD is formed under the second transistor to enhance CHE programming. Both HV LDD and LV LDD implants are introduced together enabling LDD implant merging under the floating gate extension. The floating gate is formed using substantially T-shaped, C-shaped, U-shaped, Y-shaped or O-shaped polysilicon structures. Various array addressing schemes are disclosed. | 07-29-2010 |
20100195399 | MEMORY SEGMENT ACCESSING IN A MEMORY DEVICE - Methods for programming memory devices, a memory device, and memory systems are provided. According to at least one such method, bit lines a memory segment are read at substantially the same time by coupling a selected memory segment, and at some of the data lines of any intervening segments, to respective data caches. The bit lines of the unselected memory segments that are not used to couple the selected segment to the data caches can be coupled to their respective source lines. Other methods, devices, and systems are also provided. | 08-05-2010 |
20100202208 | SEMICONDUCTOR DEVICE INCLUDING CONTACT PLUG HAVING AN ELLIPTICAL SECTIONAL SHAPE - A semiconductor device includes a first MOS transistor, second MOS transistors, first contact plugs, and a second contact plug. The first MOS transistor with a first conductivity is formed on a semiconductor substrate. The second MOS transistors with a second conductivity are formed on the semiconductor substrate. The first contact plugs has a circular planar shape. The second contact plug has an elliptical planar shape and is formed on a source or a drain in one of the second MOS transistors. The first contact plugs are formed on sources or drains in the remaining second MOS transistors and the first MOS transistor. | 08-12-2010 |
20100202209 | FLASH MEMORY DEVICE AND PROGRAM METHOD THEREOF - A flash memory device includes a memory cell array on which data is stored, and page buffers that are connected to the memory cells through the bit lines and apply one of the first voltage, second voltage or third voltage between the first and second voltage, to the respective bit line when performing the program. | 08-12-2010 |
20100202210 | REDUCING EFFECTS OF PROGRAM DISTURB IN A MEMORY DEVICE - A selected word line that is coupled to cells for programming is biased with an initial programming voltage. The unselected word lines that are adjacent to the selected word line are biased at an initial V | 08-12-2010 |
20100208522 | MEMORY DEVICE AND READING METHOD THEREOF - A memory device ( | 08-19-2010 |
20100214841 | MEMORY APPARATUS AND METHOD THEREOF FOR OPERATING MEMORY - A memory apparatus and a method thereof for operating a memory are provided herein. The apparatus has the memory and a controller. The memory has a plurality of memory cells, and each the memory cells has a first side and the second side. Each of the first side and the second side is programmable to store one bit of data. The controller programs the first sides and the second sides of the memory cells to different levels. Several threshold voltage distributions of the programmed memory cells could be overlapped with each other. The controller distinguishes the bits of the memory cells by comparing the threshold voltages of the memory cells with the different levels and by comparing the threshold voltages with those of neighbor sides. | 08-26-2010 |
20100214842 | NONVOLATILE SEMICONDUCTOR MEMORY INCLUDING CHARGE ACCUMULATION LAYER AND CONTROL GATE - A nonvolatile semiconductor memory includes a transistor, a first MOS, a second MOS, a first voltage circuit, and a second voltage circuit. The transistor includes a accumulation layer, a control gate, and a first impurity diffused layer. The first MOS includes a first electrode and a second layer. The second MOS includes a second electrode and a third layer, after the channels being formed, the first MOS and the second MOS being cut off. The first voltage circuit applies a first voltage to an active region to generate a forward bias. The second voltage circuit applies a second voltage, and a third voltage to the control gate of the transistor, after the first voltage circuit charges the first to third impurity diffused layer to the first voltage, the second voltage circuit applying the second voltage and the third voltage to the control gate of the transistor. | 08-26-2010 |
20100214843 | NONVOLATILE MEMORY DEVICE AND MEMORY SYSTEM HAVING THE SAME - A non-volatile memory device including a cell array having memory cells arranged at intersections of word lines and bit lines; an address decoder configured to select one of the word lines in response to an address; a write circuit configured to write program data in memory cells connected with the selected word line; and a control circuit configured to control the address decoder and the write circuit such that a plurality of band program (write) operations are sequentially executed during a write operation, wherein the control circuit is further configured to select each band write operation the optimal write condition of the next band write operation. A plurality of available write conditions are stored as trim information in a plurality of registers. The control circuit selects the register storing information for performing programming under the optimal write condition. | 08-26-2010 |
20100214844 | Memory system and programming method thereof - Provided are a non-volatile memory system and a programming method thereof. The programming method of the non-volatile memory system includes adjusting a program-verify-voltage of a selected memory cell referring to program data to be written in an interfering cell configured to provide interference for the selected memory cell and programming the selected memory cell depending on the adjusted program-verify-voltage. | 08-26-2010 |
20100214845 | NAND MEMORY CELL ARRAY, NAND FLASH MEMORY HAVING NAND MEMORY CELL ARRAY, DATA PROCESSING METHOD FOR NAND FLASH MEMORY - A NAND memory cell array which can be programmed in a hot carrier injection scheme, a NAND flash memory having the NAND memory cell array, and a data processing method for the NAND flash memory are provided. The NAND memory cell array includes one select transistor and at least two storage transistors. The NAND memory cell array can be programmed by controlling a bulk bias voltage and a voltage applied to a gate in the hot carrier injection scheme. | 08-26-2010 |
20100214846 | Flash Memory Devices, Methods for Programming the Same, and Memory Systems Including the Same - A programming method of a nonvolatile memory device is provided including: applying a local voltage to a first unselected word line; applying a local voltage to a second unselected word line, after the local voltage is applied to the first unselected word line; and applying a pass voltage to the first unselected word line, after the local voltage is applied to the second unselected word line. Related devices and systems are also provided herein. | 08-26-2010 |
20100214847 | SEMICONDUCTOR STORAGE DEVICE AND READ VOLTAGE CORRECTION METHOD - A semiconductor memory device comprises a semiconductor memory, a corrected voltage storage circuit which stores a corrected voltage produced by correcting a read voltage of the semiconductor memory, and a memory controller which reads the corrected voltage from the corrected voltage storage circuit and performs a read operation of the semiconductor memory using the corrected voltage. | 08-26-2010 |
20100232224 | NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE - A memory cell array has plural memory strings arranged therein, each of which including a plurality of electrically-rewritable memory transistors and selection transistors. Each memory string includes a body semiconductor layer including four or more columnar portions, and a joining portion formed to join the lower ends thereof. An electric charge storage layer is formed to surround a side surface of the columnar portions. A first conductive layer is formed to surround a side surface of the columnar portions as well as the electric charge storage layer. A plurality of second conductive layers are formed on side surfaces of the joining portion via an insulation film, and function as control electrodes of a plurality of back-gate transistors formed at a respective one of the joining portions. | 09-16-2010 |
20100232225 | SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device has a sense amplifier. The sense amplifier includes a first lower interconnection; a second interlayer insulation film formed on the first interlayer insulation film and top of the first interconnection; a contact interconnection formed in a direction perpendicular to a substrate plane of the semiconductor substrate so as to pass through the second interlayer insulation film, and connected to the first lower interconnection; a first upper interconnection formed on the second interlayer insulation film and connected to the contact interconnection disposed under the first upper interconnection; a dummy contact interconnection formed in a direction perpendicular to the substrate plane of the semiconductor substrate in the second interlayer insulation film, and adjacent to the contact interconnection; and a second upper interconnection formed on the second interlayer insulation film so as to extend in the first direction, and connected to the dummy contact interconnection disposed under the second upper interconnection. | 09-16-2010 |
20100238734 | SEMICONDUCTOR NON-VOLATILE MEMORY, CHARGE ACCUMULATING METHOD FOR SEMICONDUCTOR NON-VOLATILE MEMORY, CHARGE ACCUMULATING PROGRAM STORAGE MEDIUM - There is provided a semiconductor non-volatile memory including: plural memory sections, a voltage application section, and a control section that controls the voltage application section wherein the control section controlling voltage application such that, based on a value of current detected by a current detection section, in a region where the current flowing in a channel region is greater than a predetermined target value at which a amount of charge accumulated has become a specific value in at least one of a first charge accumulating section or a second charge accumulating section, when a value of current flowing in the channel region approaches a target value, a rate of increase in the charge accumulating amount per time is decreased at least once. | 09-23-2010 |
20100238735 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - In a nonvolatile semiconductor memory device storing data by accumulating charges in a floating gate, memory units, each of which includes a first MOS transistor as a read device, a bit cell composed of a first capacitor as a capacitance coupling device and a second capacitor as an erase device, and a decode device including a second MOS transistor and a third MOS transistor, are arranged in array. This attains nonvolatile memory capable of bit by bit selective erase arranged in array to thus reduce the core area remarkably. | 09-23-2010 |
20100246268 | METHOD OF PROGRAMMING NONVOLATILE MEMORY DEVICE - In a method of programming a nonvolatile memory device, when a program is performed, a program voltage is applied to a first word line selected for the program. A first pass voltage is applied to three second word lines neighboring the first word line toward a source select line. First and second voltages are applied to third and fourth word lines neighboring the first word line toward the source select line. A second pass voltage is applied to the remaining word lines other than the first to fourth word lines. | 09-30-2010 |
20100246269 | NONVOLATILE MEMORY AND METHODS FOR MANUFACTURING THE SAME WITH MOLECULE-ENGINEERED TUNNELING BARRIERS - Embodiments of tunneling barriers and methods for same can embed modules exhibiting a monodispersion characteristic into a dielectric layer (e.g., between first and second layers forming a dielectric layer). In one embodiment, by embedding C | 09-30-2010 |
20100254193 | WIRITING METHOD OF A NONVOLATILE MEMORY DEVICE - A method of performing a writing operation of a nonvolatile memory device is provided. The method includes performing a first band program using trim information from a first band register of multiple band registers, which include at least a default band register; and performing a second band program using trim information from a second band register or trim information from the default band register after performing the first band program. The second band register is selected while the first band program is being performed. | 10-07-2010 |
20100259991 | Nonvolatile memory cell and method for producing the same - A nonvolatile memory cell comprising a semiconductor substrate, a gate electrode formed on a surface of the semiconductor substrate with a gate insulation film interposed between them, a pair of impurity diffusion layers formed in a surface layer of the semiconductor substrate on both sides of the gate electrode, a channel region positioned in the surface layer of the semiconductor substrate between the pair of impurity diffusion layers, a charge storage layer formed on a surface of at least one impurity diffusion layer and along a side wall of the gate electrode, and a charge storage layer electrode laminated on the charge storage layer. | 10-14-2010 |
20100259992 | METHODS AND APPARATUS FOR PROGRAMMING A MEMORY CELL USING ONE OR MORE BLOCKING MEMORY CELLS - Methods and apparatus for programming a memory cell using one or more blocking memory cells facilitate mitigation of capacitive voltage coupling. The methods include applying a program voltage to a selected memory cell of a string of memory cells, and applying a cutoff voltage to a set of one or more memory cells of the string between the selected memory cell and a select gate. The methods further include applying a pass voltage to one or more other memory cells of the string between the selected memory cell and the select gate. Other methods further include applying other pass voltages, other cutoff voltages and/or intermediate voltages to still other memory cells of the string. | 10-14-2010 |
20100271880 | TECHNIQUES FOR CONTROLLING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for controlling a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for controlling a direct injection semiconductor memory device. The method may comprise applying a first voltage potential to a first region via a bit line and applying a second voltage potential to a second region of the memory device via a source line. The method may also comprise applying a control voltage potential to a body region of the memory device via a word line that is spaced apart and capacitively coupled to the body region, wherein the body region is electrically floating and disposed between the first region and the second region. The method may further comprise applying a third voltage potential to a third region of the memory device via a carrier injection line in order to bias at least one of the first region, the second region, the third region, and the body region to perform one or more operations. | 10-28-2010 |
20100271881 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A semiconductor integrated circuit device includes a memory cell array including a plurality of planes each including a plurality of memory cells, a power supply voltage generating circuit including a voltage generating circuit configured to generate a power supply voltage common to the plurality of planes, a select number detection circuit configured to detect a number of selected planes of the plurality of planes, and a resistance variable circuit configured to vary a wiring resistance between the plurality of planes and the voltage generating circuit in accordance with the number of selected planes, which is reported from the select number detection circuit, and a control circuit configured to control the power supply voltage generating circuit. | 10-28-2010 |
20100271882 | NONVOLATILE SEMICONDUCTOR MEMORY APPARATUS COMPRISING CHARGE ACCUMULATION LAYER AND CONTROL GATE - A nonvolatile semiconductor memory apparatus includes memory cell strings, first and second bit lines, a first buffer, a second buffer, and a controlling unit. The memory cell strings each include memory cells. The first and second bit lines connected to the memory cell strings. The first buffer connects to the first bit line and holds first data. The second buffer connects to the second bit line and holds second data. The controlling unit includes first and second latches and controls timing to output the first and second data according to an internal terminal, a second signal, and a third signal, and transfers a control signal synchronized with the timing of the first and second data to the external terminal. The controlling unit allows the first latch to hold the first and second data, and transfers the first data, and thereafter transfers the second data. | 10-28-2010 |
20100284225 | NONVOLATILE MEMORY DEVICE - A nonvolatile memory device includes a memory cell array configured to include cell strings coupled between respective bit lines and a source line, a unilateral element coupled to the source line, and a negative voltage generation unit coupled to the unilateral element and configured to generate a negative voltage. | 11-11-2010 |
20100290288 | NONVOLATILE MEMORY DEVICE AND METHOD OF TESTING THE SAME - A nonvolatile memory device includes a storage unit configured to store pattern data selected based on a test command set, and a control unit configured to consecutively perform a program operation on a number of pages in response to the pattern data to obtain programmed pages, consecutively perform a read operation on the programmed pages, and provide information about a bit line coupled to a fail memory cell and about a number of fail bit lines checked as a result of the read operation. | 11-18-2010 |
20100296340 | NANOTUBE MEMORY CELL WITH FLOATING GATE BASED ON PASSIVATED NANOPARTICLES AND MANUFACTURING PROCESS THEREOF - A method for manufacturing a nanotube non-volatile memory cell is proposed. The method includes the steps of: forming a source electrode and a drain electrode, forming a nanotube implementing a conduction channel between the source electrode and the drain electrode, forming an insulated floating gate for storing electric charges by passivating conductive nanoparticles with passivation molecules and arranging a disposition of passivated conductive nanoparticles on the nanotube, the conductive nanoparticles being adapted to store the electric charges and being insulated by the passivation molecules from the nanotube, and forming a control gate coupled with the channel. | 11-25-2010 |
20100296341 | SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING SAME - The disclosure of this application enhances the data writing speed of an electrically erasable and writable semiconductor memory. In a semiconductor storage device of this application, at a time of writing data, when a positive voltage lower than a voltage at control gate | 11-25-2010 |
20100296342 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - When bit lines or sense amplifiers are checked whether they are defective during a test performed to check whether the bit lines are defectively open, an electrical current supplied from one sense amplifier is detected by another sense amplifier. Thus, if plural bit lines are defectively open, they can be detected simultaneously. Consequently, the test time can be shortened greatly. | 11-25-2010 |
20100296343 | Non-Volatile Memory and Semiconductor Device - There is provided a non-volatile memory which enables high accuracy threshold control in a writing operation. In the present invention, a drain voltage and a drain current of a memory transistor are controlled to carry out a writing operation of a hot electron injection system, which is wherein a charge injection speed does not depend on a threshold voltage. FIGS. | 11-25-2010 |
20100302854 | Area-Efficient Electrically Erasable Programmable Memory Cell - Electrically erasable programmable “read-only” memory (EEPROM) cells in an integrated circuit, and formed by a single polysilicon level. The EEPROM cell consists of a coupling capacitor and a combined read transistor and tunneling capacitor. The capacitance of the coupling capacitor is much larger than that of the tunneling capacitor. In one embodiment, field oxide isolation structures isolate the devices from one another; a lightly-doped region at the source of the read transistor improves breakdown voltage performance. In another embodiment, trench isolation structures and a buried oxide layer surround the well regions at which the coupling capacitor and combined read transistor and tunneling capacitor are formed. | 12-02-2010 |
20100302855 | MEMORY DEVICE AND METHODS FOR FABRICATING AND OPERATING THE SAME - The memory device is described, which includes a substrate, a conductive layer, a plurality of charge storage layers and a plurality of doped regions. The substrate has a plurality of trenches formed therein. The conductive layer is disposed on the substrate and fills the trenches. The charge storage layers are disposed between the substrate and the conductive layer in the trenches respectively, wherein the charge storage layers are separated from each other. The doped regions are configured in the substrate under bottoms of the trenches, respectively. | 12-02-2010 |
20100302856 | NONVOLATILE MEMORY DEVICE AND METHOD OF PROGRAMMING AND READING THE SAME - A nonvolatile memory device includes a control circuit configured to generate a control signal by counting a number of first data among input data, a buffer unit configured to temporarily store the input data, invert the input data in response to the control signal, and store the inverted data or the input data as the program data, and a memory cell block configured to receive and store the program data. | 12-02-2010 |
20100302857 | METHOD OF PROGRAMMING AN ARRAY OF NMOS EEPROM CELLS THAT MINIMIZES BIT DISTURBANCES AND VOLTAGE WITHSTAND REQUIREMENTS FOR THE MEMORY ARRAY AND SUPPORTING CIRCUITS - A method for programming and erasing an array of NMOS electrically erasable programmable read only memory (EEPROM) cells that minimizes bit disturbances and high voltage requirements for the memory array cells and supporting circuits. In addition, the array of N-channel memory cells may be separated into independently programmable memory segments by creating multiple, electrically isolated P-wells upon which the memory segments are fabricated. The multiple, electrically isolated P-wells may be created, for example, by p-n junction isolation or dielectric isolation. | 12-02-2010 |
20100315876 | MEMORY DEVICES AND OPERATIONS THEREOF USING PROGRAM STATE DETERMINATION BASED ON DATA VALUE DISTRIBUTION - In a memory device, a proportion of at least one cell state in a unit of the memory is determined. A program state of the unit of the memory is determined based on the determined proportion of the at least one cell state. Determining a proportion of at least one cell state in a unit of the memory may be preceded by processing data to be stored in the unit of the memory according to a data value distribution function to produce transformed data having data values conforming to a predetermined distribution and storing the transformed data in the unit of the memory. The distribution function may be configured, for example, to provide a uniform distribution of data values in the unit of the memory. | 12-16-2010 |
20100322007 | FLASH MEMORY DEVICE AND METHOD OF READING DATA - A flash memory device and method of reading data are disclosed. The method includes; performing a test read operation directed to test data stored in a memory cell array of the flash memory device by iteratively applying a sequence of test read retry operations, wherein each successive test read retry operation uses a respectively higher test read voltage level than a preceding test read retry operation, until one test read retry operation in the sequence of test read retry operations successfully reads the test data using a minimum test read retry voltage associated with the one test read retry operation, setting an initial read voltage for the flash memory device equal to the minimum test read retry voltage, and thereafter performing a normal read operation directed to user data stored in the memory cell array by iteratively applying a sequence of read retry operations, wherein an initial read | 12-23-2010 |
20100322008 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array including regular memory cells and permanent memory cells and a control circuit. The regular memory cells are capable of switching between a first data storage state and a second data storage state. The permanent memory cells are fixed in a third data storage state that is read as the same logic level data as the first storage state. Data is stored in at least one of the regular memory cells and at least one of the permanent memory cells. The control circuit rewrites at least one of the regular memory cells from the second data storage state to the first data storage state at the time of data holding. The control circuit performs a reading operation after rewriting the regular memory cells from the first data storage state to the second data storage state. | 12-23-2010 |
20100322009 | SEMICONDUCTOR MEMORY DEVICE INCLUDING CHARGE ACCUMULATION LAYER - According to one embodiment, a semiconductor memory device includes a semiconductor substrate, memory cells without a source region and a drain region, and a first insulating film. The memory cells are arranged adjacent to one another on the semiconductor substrate and include a first gate electrode including a charge accumulation layer. A current path functioning as a source region or a drain region of a selected memory cell is formed in the semiconductor substrate when a voltage is applied to the first gate electrode of one of unselected memory cells. The first insulating film is formed on the semiconductor substrate to fill a region between the first gate electrodes of the memory cells adjacent to each other. | 12-23-2010 |
20100322010 | NON-VOLATILE MEMORY PROGRAMMABLE THROUGH AREAL CAPACITIVE COUPLING - A programmable non-volatile device is made which uses a floating gate that functions as a FET gate that overlaps a portion of a source/drain region. This allows a programming voltage for the device to be imparted to the floating gate through capacitive coupling, thus changing the state of the device. The invention can be used in environments such as data encryption, reference trimming, manufacturing ID, security ID, and many other applications. | 12-23-2010 |
20100329013 | SEMICONDUCTOR MEMORY DEVICE INCLUDING NONVOLATILE MEMORY CELL AND DATA WRITING METHOD THEREOF - A semiconductor memory device includes memory cells, bit lines, and first and second control circuits. The first control circuit supplies a write voltage and a write control voltage to a selected memory cell to write the data in the selected memory cell, the first control circuit changes a supply state of the write control voltage to further write the data when the selected memory cell reaches a first write state by the write, the first control circuit further changes the supply state of the write control voltage to prohibit the write when the selected memory cell reaches a second write state by the write. The second control circuit controls a rising of the write control voltage when the first control circuit starts the writing to make the selected memory cell the second write state. | 12-30-2010 |
20100329014 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF READING THE SAME - A semiconductor memory device includes a memory cell array including an even page cell group and an odd page cell group, and a page buffer configured to read data stored in memory cells of the even page cell group and the odd page cell group and store the read data. The page buffer comprises a first latch configured to store first even page data of the even page cell group when a first read operation is performed, a second latch configured to store odd page data of the odd page cell group when a second read operation is performed, and a third latch configured to store second even page data of the even page cell group when a third read operation is performed. | 12-30-2010 |
20100329015 | METHOD OF OPERATING NONVOLATILE MEMORY DEVICE - A method of operating a nonvolatile memory device includes reading data stored in a main cell and a flag cell using a first read voltage, the nonvolatile memory device comprising the main cell for storing data including a least significant bit (LSB) and a most significant bit (MSB), and the flag cell for determining a program state of the main cell, determining a program state of the main cell based on the data read from the flag cell, reading data stored in the main cell and the flag cell using a second read voltage if a MSB page program has been performed on the main cell, and reading data stored in the main cell using a third or a fourth read voltage based on the data read from the flag cell using the second read voltage, if a threshold voltage of the main cell shifts. | 12-30-2010 |
20100329016 | SEMICONDUCTOR DEVICE - The performance of a semiconductor device including a nonvolatile memory is enhanced. Each of nonvolatile memory cells arranged over a silicon substrate includes: a first n-well; a second n-well formed in a place different from the place thereof; a selection transistor formed in the first n-well; and an electric charge storage portion having a floating gate electrode and a storage portion p-well. The floating gate electrode is so placed that it overlaps with part of the first n-well and the second n-well. The storage portion p-well is placed in the first n-well so that it partly overlaps with the floating gate electrode. In this nonvolatile memory cell, memory information is erased by applying positive voltage to the second n-well to discharge electrons in the floating gate electrode to the second n-well. | 12-30-2010 |
20100329017 | SEMICONDUCTOR DEVICE FOR SHORT-CIRCUITING OUTPUT TERMINALS OF TWO OR MORE VOLTAGE GENERATOR CIRCUITS AT READ TIME AND CONTROL METHOD FOR THE SAME - According to one embodiment, a semiconductor device includes a first voltage generator, a second voltage generator, a first MOS transistor, and a controller. The first voltage generator outputs a first voltage to a first node. The second voltage generator outputs a second voltage to a second node. The first MOS transistor is capable of short-circuiting the first node and second node. The controller performs a control operation to short-circuit the first node and second node by turning on the first MOS transistor. The controller controls a period in which the first MOS transistor is kept in an on state based on time. | 12-30-2010 |
20100329018 | METHOD OF OPERATING NONVOLATILE MEMORY DEVICE CAPABLE OF READING TWO PLANES - A nonvolatile memory device is operated by receiving a dual plane read command for simultaneously reading first and second planes, each comprising memory cells, receiving an MSB read address for reading data stored in the memory cells, checking whether an MSB program operation has been performed on each of the first and second planes, and performing the read operation on the first and second planes according to a result of the check and outputting the read data. | 12-30-2010 |
20100329019 | SEMICONDUCTOR STORAGE DEVICE AND ELECTRONIC DEVICE USING THE SAME - When data is read from a memory cell of a top array block to a bit line, a switching device is closed so that the data is stored in the form of electrical charges at a bit line of a bottom array block. The switching device at a top array side is opened to drive a sense amplifier, and thus, the data read from the memory cell and retained at the bit line of the bottom array block is output to the outside. While the data is output in the above-described manner, a potential of the bit line of the top array block can be precharged to start a next read operation. | 12-30-2010 |
20110002172 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes: a memory unit; and a control unit. The memory unit includes a multilayer structure including electrode films and inter-electrode insulating films alternately stacked in a first direction; a semiconductor pillar piercing the multilayer structure in the first direction; a memory layer provided between the semiconductor pillar and the electrode films; a inner insulating film provided between the memory layer and the semiconductor pillar; a outer insulating film provided between the memory layer and the electrode films; and a wiring electrically connected to the first semiconductor pillar. In erasing operation, the control unit sets the first wiring at a first potential and sets the electrode film at a second potential lower than the first potential, and then sets the first wiring at a third potential and sets the electrode film at a fourth potential higher than the third potential. | 01-06-2011 |
20110002173 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes a memory cell array in which a plurality of nonvolatile memory cells are arrayed, and a program voltage generator that switches current supply amount based on the number of memory cells that are programmed at the same time, among the plurality of memory cells. The nonvolatile semiconductor memory device further includes a selection circuit that selects, among the plurality of memory cells, one or more memory cells that are programmed, to flow a current outputted by the program voltage generator. | 01-06-2011 |
20110007570 | METHOD OF READING AN NVM CELL THAT UTILIZES A GATED DIODE - A method of reading an NVM cell structure formed on a deep well of N-type semiconductor material, wherein the NVM cell structure includes a PMOS transistor formed in an N-type well, the PMOS transistor including spaced-apart p-type source and drain region defining an n-type cannel region therebetween, an NMOS transistor formed in a P-type well that is adjacent to the N-type well, the NMOS transistor including spaced-apart n-type source and drain regions defining a p-type channel region therebetween, a conductive floating gate that includes a first section that extends over the n-type channel region of the PMOS transistor and is separated therefrom by intervening dielectric material and a second section that extends over the p-type channel region and is separated therefrom by intervening dielectric material, and a conductive control gate formed over at least a portion of the second section of the floating gate and is separated therefrom by intervening dielectric material, the method comprising: biasing the deep N-type well at a preselected read voltage; holding the source region of the PMOS transistor at the read voltage; holding the drain of the PMOS transistor at ground; and holding the control gate at ground for a preselected read time. | 01-13-2011 |
20110013457 | NONVOLATILE MEMORY DEVICES AND PROGRAMMING METHODS THEREOF IN WHICH A PROGRAM INHIBIT VOLTAGE IS CHANGED DURING PROGRAMMING - Provided are nonvolatile memory devices and programming methods thereof. A non-volatile memory device is programmed by performing a plurality of programming loops on memory cells in a memory cell array and changing a program inhibit voltage applied to bit lines of the memory cells that have completed programming while performing the plurality of programming loops. | 01-20-2011 |
20110013458 | MEMORY DEVICES SUPPORTING SIMULTANEOUS PROGRAMMING OF MULTIPLE CELLS AND PROGRAMMING METHODS THEREOF - Some embodiments of the present invention provide methods of programming memory devices that include an array of vertical channels passing through a stacked plurality of word plates, wherein respective columns of vertical channels are configured to be coupled to respective bit lines. In some method embodiments, potentials of the vertical channels are boosted, followed by selectively applying respective data to vertical channels via the bit lines to thereby selectively change the potentials of the vertical channels according to the data. A program voltage is subsequently applied to a selected word plate to thereby program a plurality of cells. | 01-20-2011 |
20110019479 | TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a first region coupled to a source line, a second region coupled to a bit line. The direct injection semiconductor memory device may also include a body region spaced apart from and capacitively coupled to a word line, wherein the body region is electrically floating and disposed between the first region and the second region. The direct injection semiconductor memory device may further include a third region coupled to a carrier injection line configured to inject charges into the body region through the second region. | 01-27-2011 |
20110019480 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device, includes: a stacked structural unit including electrode films alternately stacked with inter-electrode insulating films; a first and second semiconductor pillars piercing the stacked structural unit; a connection portion semiconductor layer to electrically connect the first and second semiconductor pillars; a connection portion conductive layer opposing the connection portion semiconductor layer; a memory layer, an inner insulating film, and an outer insulating film provided between the first and second semiconductor layers and the electrode films and between the connection portion semiconductor layer and the connection portion conductive layer. At least a portion of a face of the connection portion conductive layer opposing the outer insulating film is a curved surface having a recessed configuration on a side of the outer insulating film. | 01-27-2011 |
20110019481 | TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for biasing a direct injection semiconductor memory device including the steps of applying a first non-negative voltage potential to a first region via a bit line and applying a second non-negative voltage potential to a second region via a source line. The method may also include applying a third voltage potential to a word line, wherein the word line may be spaced apart from and capacitively to a body region that may be electrically floating and disposed between the first region and the second region. The method may further include applying a fourth positive voltage potential to a third region via a carrier injection line, wherein the third region may be disposed below at least one of the first region, the body region, and the second region. | 01-27-2011 |
20110019482 | TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. At least one of the plurality of memory cells may include a first region coupled to a respective bit line of the array and a second region coupled to a respective source line of the array. At least one of the plurality of memory cells may also include a body region spaced apart from and capacitively coupled to a respective word line of the array, wherein the body region may be electrically floating and disposed between the first region and the second region. At least one of the plurality of memory cells may further include a third region coupled to a respective carrier injection line of the array and wherein the respective carrier injection line may be one of a plurality of carrier injection lines in the array that are coupled to each other. | 01-27-2011 |
20110026328 | SYSTEM AND METHOD OF MAINTAINING DATA INTEGRITY IN A FLASH STORAGE DEVICE - A flash storage device includes a power hold circuit including a double layer capacitor. A power source supplies power to the flash storage device and charges the double layer capacitor. The double layer capacitor supplies power for maintaining integrity of data during a data transfer occurring in the flash storage device when the power supplied by the power source is disrupted. Additionally, the flash storage device can inhibit subsequent data transfers until the power supplied by the power source is restored. | 02-03-2011 |
20110026329 | SEMICONDUCTOR DEVICE USING CHARGE PUMP CIRCUIT - A semiconductor device including a plurality of capacitance units connected in parallel between a first voltage and a second voltage. Each of the plurality of capacitance units includes: a capacitance element connected with the first voltage; and a capacitance disconnecting circuit connected between the second voltage and the capacitance element. The capacitance disconnecting circuit includes a non-volatile memory cell with a threshold voltage changed based on a change of a leakage current which flows from the capacitance element, and blocks off the leakage current based on a rise of the threshold voltage of the non-volatile memory cell when the leakage current exceeds a predetermined value. | 02-03-2011 |
20110026330 | PROGRAM METHOD OF FLASH MEMORY DEVICE - In a program method of a flash memory device where memory cells within a string are turned on to electrically connect channel regions, all of the channel regions within a second string are precharged uniformly by applying a ground voltage to a first bit line connected to a first string including to-be-programmed cells and a program-inhibited voltage to a second bit line connected to the second string including program-inhibited cells. If a program operation is executed, channel boosting occurs in the channel regions within the second string including the program-inhibited cells. Accordingly, a channel boosting potential can be increased and a program disturbance phenomenon, in which the threshold voltage of program-inhibited cells is changed, can be prevented. | 02-03-2011 |
20110032765 | Memory Formed By Using Defects - A non-volatile memory is provided. The non-volatile memory comprises at least a silicon-on-insulator transistor including a substrate; an insulating layer disposed on the substrate; an active region disposed on the insulating layer; and an energy barrier device disposed in the active region and outputting a relatively small current when the non-volatile memory is read. | 02-10-2011 |
20110032766 | N-CHANNEL SONOS NON-VOLATILE MEMORY FOR EMBEDDED IN LOGIC - A system and method of an electrically programmable and erasable non-volatile memory cell fabricated using a single-poly, logic process with the addition of ONO deposition and etching is disclosed. In one embodiment, a non-volatile memory system includes at least one non-volatile memory cell consists of a SONOS transistor fabricated on a P substrate, with a deep N-well located in the P substrate, with a P-well located in the deep N-well. The memory cell further includes an access NMOS transistor, coupled to the SONOS transistor and located in the same P-well that includes an oxide only gate-dielectric. The cell can be fabricated in a modified logic process with other transistors and with their physical characteristics preserved. | 02-10-2011 |
20110038212 | CONTROLLER AND NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - A controller includes a generation unit configured to aggregate comparison results between second threshold voltage levels held in the memory cells and predetermined third threshold voltage levels, and generate a histogram of the second threshold voltage levels, an estimation unit configured to estimate statistical parameter of a distribution of the second threshold voltage levels with respect to a first threshold voltage level according to writing data, based on the histogram, and a determination unit configured to determine a fifth threshold voltage level defining a boundary of a fourth threshold voltage level indicating a read result of the memory cells from the third threshold voltage levels based on the statistical parameter in such a manner that mutual information amount between the first threshold voltage level and the fourth threshold voltage level becomes maximum. | 02-17-2011 |
20110038213 | MULTI-DOT FLASH MEMORY - A multi-dot flash memory set potentials of bit lines being disposed at a left side of a selected floating gate to V | 02-17-2011 |
20110038214 | GATE-SEPARATED TYPE FLASH MEMORY WITH SHARED WORD LINE - A gate-separated type flash memory with a shared word line includes: a semiconductor substrate, on which a source electrode area and a drain electrode area are separately arranged; a word line, which is arranged between the source electrode area and the drain electrode area; a first storage bit unit, which is arranged between the word line and the source electrode area, and a second storage bit unit, which is arranged between the word line and the drain electrode area. The two storage bit units and word line are separated by a tunneling oxide layer. The two storage bit units respectively have a first control gate, a first floating gate and a second control gate, a second floating gate, and the two control gates are separately respectively arranged on two floating gates. | 02-17-2011 |
20110044112 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first memory cell which includes a first memory transistor and a first selector transistor. The semiconductor device further includes a second memory cell which includes a second memory transistor and a second selector transistor. The semiconductor device further includes a first word line electrically coupled to a gate electrode of the first memory transistor and to a gate electrode of the second selector transistor, and a second word line electrically coupled to a gate electrode of the second memory transistor and to a gate electrode of the first selector transistor. The semiconductor device further includes a first source line electrically coupled to a source region of the first memory transistor and to a source region of the second memory transistor. | 02-24-2011 |
20110051519 | Novel NAND-based hybrid NVM design that integrates NAND and NOR in 1-die with serial interface - A nonvolatile memory device includes multiple independent nonvolatile memory arrays that concurrently for parallel reading and writing the nonvolatile memory arrays. A serial interface communicates commands, address, device status, and data between a master device and nonvolatile memory arrays for concurrently reading and writing of the nonvolatile memory arrays and sub-arrays. Data is transferred on the serial interface at the rising edge and the falling edge of the synchronizing clock. The serial interface transmits a command code and an address code from a master device and transfers a data code between the master device and the nonvolatile memory device, wherein the data code has a length that is determined by the command code and a location determined by the address code. An enable signal defines a beginning and termination of a reading or writing operation. Reading one nonvolatile memory array may be interrupted for another operation and then resumed. | 03-03-2011 |
20110063918 | IDENTIFYING AT-RISK DATA IN NON-VOLATILE STORAGE - The non-volatile storage system predicts which blocks (or other units of storage) will become bad based on performance data. User data in those blocks predicted to become bad can be re-programmed to other blocks, and the blocks predicted to become bad can be removed from further use. | 03-17-2011 |
20110069552 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF DATA READ THEREIN - A nonvolatile semiconductor memory device comprises: a memory cell array having a plurality of memory strings each having a plurality of memory cells connected in series; and a control circuit configured to execute a read operation for reading data from the memory cells included in a selected memory string from among the plurality of memory strings. During the read operation, the control circuit is configured to apply a first voltage to a gate of at least one of the memory cells in a non-selected memory string not subject to the read operation, and apply a second voltage lower than the first voltage to a gate of another of the memory cells in the non-selected memory string not subject to the read operation. | 03-24-2011 |
20110069553 | SEMICONDUCTOR STORAGE DEVICE COMPRISING DOT-TYPE CHARGE ACCUMULATION PORTION AND CONTROL GATE, AND METHOD OF MANUFACTURING THE SAME - A semiconductor memory device includes a first insulation film, Charge accumulation portions, a second insulation film, and a control gate. The first insulation film is located on an active area (AA). The charge accumulation portions comprise minute crystals arranged on the first insulation film. A density of the charge accumulation portions at an end portion in an AA width direction of the first insulation film is higher than a density of the charge accumulation portions at a central potion in the AA width direction. The second insulation film is located on the first insulation film so as to coat the charge accumulation portions. The control gate is located on the second insulation film. | 03-24-2011 |
20110075486 | CHARGE TRAPPING MEMORY CELL HAVING BANDGAP ENGINEERED TUNNELING STRUCTURE WITH OXYNITRIDE ISOLATION LAYER - A band gap engineered, charge trapping memory cell includes a charge storage structure including a trapping layer. a blocking layer, and a dielectric tunneling structure including a thin tunneling layer, a thin bandgap offset layer and a thin isolation layer comprising silicon oxynitride. The memory cell is manufactured using low thermal budget processes. | 03-31-2011 |
20110075487 | BOOSTER CIRCUIT AND SEMICONDUCTOR MEMORY - A booster circuit includes a first capacitor and a second capacitor serially coupled between a first node and a second node through a third node; a third capacitor and a fourth capacitor serially coupled between a fourth node and a fifth node through a sixth node; a first switch coupling the third node with a power supply line when the fourth node is set to a first level; a second switch coupling the sixth node with the power supply line when the first node is set to the first level; a third switch transferring a plurality of electric charges of the sixth node to the second node; a fourth switch transferring a plurality of electric charges of the third node to the fifth node; a fifth switch coupling the second node with a voltage line; and a sixth switch coupling the fifth node with the voltage line. | 03-31-2011 |
20110075488 | Non-Volatile Semiconductor Memory - A non-volatile semiconductor device has a memory cell array having electrically erasable programmable non-volatile memory cells, reprogramming and retrieval circuits that temporarily store data to be programmed in the memory cell array and sense data retrieved from the memory cell array. Each reprogramming and retrieval circuit has first and second latches that are selectively connected to the memory cell array and transfer data. A controller controls the reprogramming and retrieval circuits on a data-reprogramming operation to and a data-retrieval operation from the memory cell array. Each reprogramming and retrieval circuit has a multilevel logical operation mode and a caching operation mode. In the multilevel logical operation mode, re-programming and retrieval of upper and lower bits of two-bit four-level data is performed using the first and the second latches to store the two-bit four-level data in one of the memory cells in a predetermined threshold level range. In the caching operation mode, data transfer between one of the memory cells selected in accordance with a first address and the first latch is performed while data transfer is performed between the second latch and input/output terminals in accordance with a second address with respect to one-bit two-level data to be stored in one of the memory cells. | 03-31-2011 |
20110080787 | NON-VOLATILE MEMORY APPARATUS AND METHODS - Some embodiments include apparatus and methods having memory cells coupled in series and a module to cause an application of voltages with at least three different values to gates of the memory cells during an operation to retrieve information stored in at least one of the memory cells. Additional apparatus and methods are described. | 04-07-2011 |
20110080788 | DRIVING METHOD OF SEMICONDUCTOR DEVICE - It is an object to reduce defects caused by reading wrong data by judging whether a storage state held in a non-volatile memory element is correct or not in the case where accumulation or discharge of electrons in/from a charge accumulation layer. | 04-07-2011 |
20110085381 | CHARGE CARRIER DEVICE - A device comprises an impurity ion disposed in an insulating region, a semiconductor region adjacent to the insulating region, an electrometer arranged to detect charge carriers in the semiconductor region and at least one control gate configured to apply an electric field to the insulating region and semiconductor region. The at least one control gate is operable to cause at least one charge carrier in the semiconducting material region to bind to the impurity ion without the at least one charge carrier leaving the semiconductor material region. The electrometer is operable to detect whether the at least one charge carrier is bound to the impurity ion. | 04-14-2011 |
20110085382 | Universal dual charge-retaining transistor flash NOR cell, a dual charge-retaining transistor flash NOR cell array, and method for operating same - A NOR flash memory cell is formed of dual serially connected charge retaining transistors. A drain/source of a first of the dual charge retaining transistors connected to a local bit line and a source/drain of a second of the dual charge retaining transistors connected to a local source line. The drain/sources of the commonly connected dual serially connected charge retaining transistors are connected solely together. The drain/sources and source drains are formed in a diffusion well. In some embodiments, the diffusion well is formed in a deep diffusion well. The dual serially connected charge retaining transistors are N-channel or P-channel charge retaining transistors with the charge retaining layers being either floating gate or SONOS charge trapping layers. Selected charge retaining transistors are programmed by a combination of a band-to-band tunneling and a Fowler-Nordheim tunneling and erased by a Fowler Nordheim tunneling. | 04-14-2011 |
20110090739 | INDEPENDENT WELL BIAS MANAGEMENT IN A MEMORY DEVICE - Methods for programming a memory device, memory devices configured to perform the disclosed programming methods, and memory systems having a memory device configured to perform the disclosed programming methods, for example, are provided. According to at least one such method, multiple independent semiconductor well regions each having strings of memory cells are independently biased during a programming operation performed on a memory device. Reduced charge leakage may be realized during a programming operation in response to independent well biasing methods. | 04-21-2011 |
20110090740 | NONVOLATILE MEMORY DEVICE AND RELATED METHOD OF OPERATION - A flash memory device comprises alternately arranged odd and even memory cells. The odd and even memory cells are connected to corresponding odd and even bitlines, which are connected to corresponding odd and even page buffers. In a read operation of the flash memory device, data is sensed at two different times via the odd and even bitlines. In certain embodiments, data is read from the odd page buffers while data is being sensed via the even bit lines, or vice versa. | 04-21-2011 |
20110090741 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE ADAPTED TO STORE A MULTI-VALUED DATA IN A SINGLE MEMORY CELL - A non-volatile semiconductor memory device includes an electrically data rewritable non-volatile semiconductor memory cell and a write circuit for writing data in the memory cell, the write circuit writing a data in the memory cells by supplying a write voltage Vpgm and a write control voltage VBL to the memory cell, continuing the writing of the data in the memory cell by changing the value of the write control voltage VBL in response to an advent of a first write state of the memory cell and inhibiting any operation of writing a data to the memory cell by further changing the value of the write control voltage VBL to Vdd in response to an advent of a second write state of the memory cell. | 04-21-2011 |
20110090742 | SEMICONDUCTOR INTEGRATED CIRCUIT ADAPTED TO OUTPUT PASS/FAIL RESULTS OF INTERNAL OPERATIONS - In a semiconductor integrated circuit, an internal circuit is capable of executing a first operation and a second operation concurrently, and an output circuit outputs to the outside of the semiconductor integrated circuit information indicating whether or not the first operation is being executed and information indicating whether or not the second operation is executable. | 04-21-2011 |
20110096606 | SEMICONDUCTOR INTEGRATED CIRCUIT ADAPTED TO OUTPUT PASS/FAIL RESULTS OF INTERNAL OPERATIONS - In a semiconductor integrated circuit, an internal circuit is capable of executing a first operation and a second operation concurrently, and an output circuit outputs to the outside of the semiconductor integrated circuit information indicating whether or not the first operation is being executed and information indicating whether or not the second operation is executable. | 04-28-2011 |
20110096607 | PROGRAMMING A MEMORY DEVICE TO INCREASE DATA RELIABILITY - Methods for programming a memory array, memory devices, and memory systems are disclosed. In one such method, the target reliability of the data to be programmed is determined. The relative reliability of different groups of memory cells of the memory array is determined. The data is programmed into the group of memory cells of the array having a relative reliability corresponding to the target reliability. | 04-28-2011 |
20110103148 | Normally off gallium nitride field effect transistors (FET) - A heterostructure field effect transistor (HFET) gallium nitride (GaN) semiconductor power device comprises a hetero-junction structure comprises a first semiconductor layer interfacing a second semiconductor layer of two different band gaps thus generating an interface layer as a two-dimensional electron gas (2DEG) layer. The power device further comprises a source electrode and a drain electrode disposed on two opposite sides of a gate electrode disposed on top of the hetero-junction structure for controlling a current flow between the source and drain electrodes in the 2DEG layer. The power device further includes a floating gate located between the gate electrode and hetero-junction structure, wherein the gate electrode is insulated from the floating gate with an insulation layer and wherein the floating gate is disposed above and padded with a thin insulation layer from the hetero-junction structure and wherein the floating gate is charged for continuously applying a voltage to the 2DEG layer to pinch off the current flowing in the 2DEG layer between the source and drain electrodes whereby the HFET semiconductor power device is a normally off device. | 05-05-2011 |
20110103149 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR DRIVING SAME - According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array and a control circuit. The memory cell array includes a stacked body, a through-hole, a semiconductor pillar, and a charge storage film. The stacked body includes a plurality of insulating films alternately stacked with a plurality of electrode films. The through-hole is made in the stacked body to align in a stacking direction. The semiconductor pillar is buried in the through-hole. The charge storage film is provided between the electrode films and the semiconductor pillar. Memory cells are formed at each intersection between the electrode films and the semiconductor pillar. The control circuit writs a first value to at least some of the memory cells, performs an erasing operation of the first value from the memory cell written with the first value, reads data stored in the memory cell having undergone the erasing operation, and sets the memory cell to be unusable in a case that the first value is read from the memory cell. | 05-05-2011 |
20110110160 | AREA-EFFICIENT ELECTRICALLY ERASABLE PROGRAMMABLE MEMORY CELL - Electrically erasable programmable “read-only” memory (EEPROM) cells in an integrated circuit, and formed by a single polysilicon level. The EEPROM cell consists of a coupling capacitor and a combined read transistor and tunneling capacitor. The capacitance of the coupling capacitor is much larger than that of the tunneling capacitor. In one embodiment, field oxide isolation structures isolate the devices from one another; a lightly-doped region at the source of the read transistor improves breakdown voltage performance. In another embodiment, trench isolation structures and a buried oxide layer surround the well regions at which the coupling capacitor and combined read transistor and tunneling capacitor are formed. | 05-12-2011 |
20110110161 | Method of Programming a Flash Memory Device - A non-volatile memory device includes an array of flash memory cells therein and a voltage generator. The voltage generator is configured to generate a program voltage (Vpgm), a pass voltage (Vpass), a blocking voltage (Vblock) and a decoupling voltage (Vdcp) during a flash memory programming operation. The blocking voltage is generated at a level that inhibits inadvertent programming of an unselected memory cell(s). This voltage level of the blocking voltage is set so that Vdcp05-12-2011 | |
20110116318 | MEMORY ARRAY OF FLOATING GATE-BASED NON-VOLATILE MEMORY CELLS - A memory array comprises a plurality of memory cells organized in a matrix of rows and columns. Each of the memory cells includes a high voltage access transistor, a floating gate memory transistor electrically connected to the access transistor, and a coupling capacitor electrically connected to the memory transistor. A first set of word lines are each electrically connected to the capacitor in each of the memory cells in a respective row. A second set of word lines are each electrically connected to the access transistor in each of the memory cells in a respective row. A first set of bit lines are each electrically connected to the access transistor in each of the memory cells in a respective column. A second set of bit lines are each electrically connected to the memory transistor in each of the memory cells in a respective column. Various combinations of voltages can be applied to the word lines and bit lines in operations to program, erase, read, or inhibit a logic state stored by the memory transistor in one or more of the memory cells. | 05-19-2011 |
20110116319 | MEMORY ARRAY OF FLOATING GATE-BASED NON-VOLATILE MEMORY CELLS - A memory array comprises a plurality of memory cells organized in a matrix of rows and columns. Each of the memory cells includes a high voltage access transistor, a floating gate memory transistor electrically connected to the access transistor, and a coupling capacitor electrically connected to the memory transistor. A first set of word lines are each electrically connected to the capacitor in each of the memory cells in a respective row. A second set of word lines are each electrically connected to the access transistor in each of the memory cells in a respective row. A first set of bit lines are each electrically connected to the access transistor in each of the memory cells in a respective column. A second set of bit lines are each electrically connected to the memory transistor in each of the memory cells in a respective column. Various combinations of voltages can be applied to the word lines and bit lines in operations to program, erase, read, or inhibit a logic state stored by the memory transistor in one or more of the memory cells. | 05-19-2011 |
20110122698 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device according to an embodiment of the present invention includes a substrate, a gate insulator formed on the substrate and serving as an F-N (Fowler-Nordheim) tunneling film, a first floating gate formed on the gate insulator, a first intergate insulator formed on the first floating gate and serving as an F-N tunneling film, a second floating gate formed on the first intergate insulator, a second intergate insulator formed on the second floating gate and serving as a charge blocking film, and a control gate formed on the second intergate insulator. | 05-26-2011 |
20110122699 | CONTROLLING A MEMORY DEVICE RESPONSIVE TO DEGRADATION - Embodiments of the present invention disclosed herein include devices, systems and methods, such as those directed to non-volatile memory devices and systems capable of determining a degradation parameter associated with one or more memory cells. Disclosed devices and systems according to embodiments of the present invention include those that utilize the degradation parameter to adjust control signals coupled to the memory cells. | 05-26-2011 |
20110122700 | RELAXED METAL PITCH MEMORY ARCHITECTURES - A relaxed metal pitch architecture may include a bit line and a first active area string and a second active area string. The bit line may be directly coupled to the first active area string and to the second active area string. The relaxed metal pitch architecture may be applied to a non-volatile memory structure. | 05-26-2011 |
20110122701 | SEMICONDUCTOR MEMORY HAVING ELECTRICALLY ERASABLE AND PROGRAMMABLE SEMICONDUCTOR MEMORY CELLS - An electrically alterable non-volatile multi-level memory device and a method of operating such a device, which includes setting a status of at least one of the memory cells to one state selected from a plurality of states including at least first to fourth level states, in response to information to be stored in the one memory cell, and reading the status of the memory cell to determine whether the read out status corresponds to one of the first to fourth level states by utilizing a first reference level set between the second and third level states, a second reference level set between the first and second level states and a third reference level set between the third and fourth level states. | 05-26-2011 |
20110134698 | FLASH MEMORY CELL ON SeOI HAVING A SECOND CONTROL GATE BURIED UNDER THE INSULATING LAYER - The invention relates to a flash memory cell having a FET transistor with a floating gate on a semiconductor-on-insulator (SOI) substrate composed of a thin film of semiconductor material separated from a base substrate by an insulating buried oxide (BOX) layer, The transistor has in the thin film, a channel, with two control gates, a front control gate located above the floating gate and separated from it by an inter-gate dielectric, and a back control gate located within the base substrate directly under the insulating (BOX) layer and separated from the channel by only the insulating (BOX) layer. The two control gates are designed to be used in combination to perform a cell programming operation. The invention also relates to a memory array made up of a plurality of memory cells according to the first aspect of the invention, which can be in an array of rows and columns, and a method of fabricating such memory cells and memory arrays. | 06-09-2011 |
20110134699 | APPARATUS FOR REDUCING THE IMPACT OF PROGRAM DISTURB - The unintentional programming of an unselected (or inhibited) non-volatile storage element during a program operation that intends to program another non-volatile storage element is referred to as “program disturb.” A system is proposed for programming and/or reading non-volatile storage that reduces the effect of program disturb. In one embodiment, different verify levels are used for a particular word line (or other grouping of storage elements) during a programming process. In another embodiment, different compare levels are used for a particular word (or other grouping of storage elements) during a read process. | 06-09-2011 |
20110134700 | Nonvolatile Semiconductor Memory - A select gate transistor has a select gate electrode composed of a first-level conductive layer and a second-level conductive layer. The first-level conductive layer has contact areas. The second-level conductive layer has its portions removed that are located above the contact areas. Two adjacent select gate electrodes that are adjacent to each other in the column direction are arranged such that the contact areas of one select gate electrode are not opposed to the contact areas of the other select gate electrode. One select gate electrode has its first- and second-level conductive layers removed in their portions that are opposed to the contact areas of the other select gate electrode. | 06-09-2011 |
20110141815 | Methods and Apparatus for Read-Side Intercell Interference Mitigation in Flash Memories - Methods and apparatus are provided for read-side intercell interference mitigation in flash memories, A flash memory device is read by obtaining a read value for at least one target cell; obtaining a value representing a voltage stored in at least one aggressor cell that was programmed after the target cell; determining intercell interference for the target cell from the at least one aggressor cell; and obtaining a new read value that compensates for the intercell interference by removing the determined intercell interference from the read value for the at least one target cell. The new read value can optionally be provided to a decoder. In an iterative implementation, one or more intercell interference mitigation parameters can be adjusted if a decoding error occurs. | 06-16-2011 |
20110141816 | Tracking Cells For A Memory System - Tracking cells are used in a memory system to improve the read process. The tracking cells can provide an indication of the quality of the data and can be used as part of a data recovery operation if there is an error. The tracking cells provide a means to adjust the read parameters to optimum levels in order to reflect the current conditions of the memory system. Read operations are performed on the tracking cells, where threshold voltages of physical states of the tracking cells are further apart than threshold voltages of physical states of non-tracking cells. Based on the read operations, an extent to which the tracking cells are errored is determined. | 06-16-2011 |
20110149656 | MULTI-CELL VERTICAL MEMORY NODES - Embodiments of the invention pertain to vertical memory structures. Embodiments of the invention describe memory nodes comprising two memory cells on opposing sides of a vertical channel separating a source region and a drain region. Embodiments of the invention may utilize floating gate NAND memory cells, polysilicon diodes, MiM diodes, or MiiM diodes. Embodiments of the invention may be used to form flash memory, RRAM, Memristor RAM, Oxide Ram or OTPROM. | 06-23-2011 |
20110149657 | Methods and Apparatus for Write-Side Intercell Interference Mitigation in Flash Memories - Methods and apparatus are provided for write-side intercell interference mitigation in flash memories. A flash memory device is written by obtaining program data to be written to at least one target cell in the flash memory; obtaining one or more bits of program data for at least one aggressor cell to be programmed later than the target cell: and precompensating for intercell interference for the target cell by generating precompensated program values. The aggressor cells comprise one or more cells adjacent to the target cell, such as adjacent cells in a same wordline as the target cell and/or cells in an upper or lower adjacent wordline to the target cell. The precompensated program values for the target cell are optionally provided to the flash memory. | 06-23-2011 |
20110149658 | METHOD, APPARATUS, AND SYSTEM FOR IMPROVED READ OPERATION IN MEMORY - Various embodiments include methods, apparatus, and systems for reading an adjacent cell of a memory array in an electronic device to determine a threshold voltage value of the adjacent cell, the adjacent cell being adjacent a target cell, and reading the target cell of the memory array using a wordline voltage value based on the threshold voltage value of the adjacent cell. Additional apparatus, systems, and methods are described. | 06-23-2011 |
20110157991 | EEPROM DEVICE - A stable and reliable EEPROM device includes an EEPROM cell having first, second and third control voltage terminals for performing operations for programming, reading and erasing data, respectively, a first transistor configured to supply a programming operation voltage to the first control voltage terminal during the programming operation, a second transistor configured to supply a ground voltage to the first control voltage terminal, the data of which will not be programmed during the programming operation, and a third transistor connected to the second control voltage terminal and turned on by an address selected for reading the data of the EEPROM cell during the reading operation. | 06-30-2011 |
20110157992 | APPARATUS, SYSTEM, AND METHOD FOR BIASING DATA IN A SOLID-STATE STORAGE DEVICE - An apparatus, system, and method are disclosed for improving performance in a non-volatile solid-state storage device. Non-volatile solid-state storage media includes a plurality of storage cells. The plurality of storage cells is configured such that storage cells in an empty state store initial binary values that satisfy a bias. An input module receives source data for storage in the plurality of storage cells of the non-volatile solid-state storage media. Bits of the source data have a source bias that is different from the bias of the plurality of storage cells. A bit biasing module biases the bits of the source data toward the bias of the plurality of storage cells. A write module writes the biased source data to the plurality of storage cells of the non-volatile solid-state storage media. | 06-30-2011 |
20110157993 | SEMICONDUCTOR MEMORY DEVICE AND READ METHOD THEREOF - A read method using a semiconductor memory device includes reading data of a cell adjacent to a cell to be read and storing the data in a first latch of a first page buffer, sending the data, stored in the first latch, to a second latch of a second page buffer adjacent to the first page buffer, setting a read voltage of the cell to be read according to a value of the data stored in the first and second latches, and reading data of the cell to be read using the set read voltage. | 06-30-2011 |
20110157994 | NAND-TYPE FLASH MEMORY AND NAND-TYPE FLASH MEMORY CONTROLLING METHOD - A method of controlling a NAND-type flash memory provided with a latch circuit in which data is temporarily stored has measuring a first consumption current of the latch circuit in a first state in which the latch circuit is caused to retain first logic; measuring a second consumption current of the latch circuit in a second state in which the latch circuit is caused to retain second logic obtained by inverting the first logic; and comparing the first consumption current and the second consumption current to cause the latch circuit to retain logic corresponding to the state corresponding to a smaller one of the first consumption current and the second consumption current. | 06-30-2011 |
20110164452 | MEMORY DEVICE | 07-07-2011 |
20110164453 | SYSTEM AND MEMORY FOR SEQUENTIAL MULTI-PLANE PAGE MEMORY OPERATIONS - A system and method for performing memory operations in a multi-plane flash memory. Commands and addresses are sequentially provided to the memory for memory operations in memory planes. The memory operations are sequentially initiated and the memory operation for at least one of the memory planes is initiated during the memory operation for another memory plane. In one embodiment, each of a plurality of programming circuits is associated with a respective memory plane and is operable to program data to the respective memory plane in response to programming signals and when it is enabled. Control logic coupled to the plurality of programming circuits generates programming signals in response to the memory receiving program commands and further generates programming enable signals to individually enable each of the programming circuits to respond to the programming signals and stagger programming of data to each of the memory planes. | 07-07-2011 |
20110170353 | ACCESS LINE DEPENDENT BIASING SCHEMES - The present disclosure includes methods, devices, and systems for access line biasing. One embodiment includes selecting, using a controller external to the memory device, a particular access line dependent biasing scheme and corresponding bias conditions for use in performing an access operation on an array of memory cells of the memory device, and performing the access operation using the selected particular access line dependent biasing scheme and corresponding bias conditions. In one or more embodiments, the selected particular access line dependent biasing scheme and corresponding bias conditions is selected by the controller external to the memory device based, at least partially, on a target access line of the array. | 07-14-2011 |
20110170354 | Method and System to Access Memory - This document discusses among other things, a system comprising a host controller, an Input/Output buffer, and a memory device. The memory device is coupled to the host controller and is configured to receive a read command from the host controller. The non-volatile includes an interface control logic, which is in communication with a non-volatile memory. The interface control logic includes a latency programming circuit coupled to the non-volatile memory and the Input/Output buffer. The latency programming circuit stores at least one value corresponding to dummy byte delays to be provided at the non-volatile memory prior to transferring data from the non-volatile memory during a read operation. | 07-14-2011 |
20110170355 | SEMICONDUCTOR MEMORY DEVICE HAVING A PLURALITY OF CHIPS AND CAPABILITY OF OUTPUTTING A BUSY SIGNAL - One package contains a plurality of memory chips. Each memory chip has an I/O terminal which generates a busy signal. The busy signal enables a busy state when a power supply voltage value reaches a specified and guaranteed range after a power-on sequence. The busy signal maintains the busy state until completion of initialization operations for the plurality of memory chips. The busy signal releases the busy state after completion of all initialization operations for the plurality of memory chips. | 07-14-2011 |
20110170356 | Methods of Programming Data in a Non-Volatile Memory Device and Methods of Operating a Nand Flash Memory Device Using the Same - Methods of programming data in a non-volatile memory cell are provided. A memory cell according to some embodiments may include a gate structure that includes a tunnel oxide layer pattern, a floating gate, a dielectric layer and a control gate sequentially stacked on a substrate, impurity regions that are formed in the substrate at both sides of the gate structure, and a conductive layer pattern that is arranged spaced apart from and facing the floating gate. Embodiments of such methods may include applying a programming voltage to the control gate, grounding the impurity regions and applying a fringe voltage to the conductive layer pattern to generate a fringe field in the floating gate. | 07-14-2011 |
20110170357 | NONVOLATILE MEMORY WITH A UNIFIED CELL STRUCTURE - A novel FLASH-based EEPROM cell, decoder, and layout scheme are disclosed to eliminate the area-consuming divided triple-well in cell array and allows byte-erase and byte-program for high P/E cycles. Furthermore, the process-compatible FLASH cell for EEPROM part can be integrated with FLASH and ROM parts so that a superior combo, monolithic, nonvolatile memory is achieved. Unlike all previous arts, the novel combo nonvolatile memory of the present invention of ROM, EEPROM and FLASH or combination of any two is made of one unified, fully compatible, highly-scalable BN+ cell and unified process. In addition, its cell operation schemes have zero array overhead and zero disturbance during P/E operations. The novel combo nonvolatile memory is designed to meet the need in those markets requiring flexible write size in units of bytes, pages and blocks at a lower cost. | 07-14-2011 |
20110176368 | MULTIPLE TIME PROGRAMMABLE (MTP) PMOS FLOATING GATE-BASED NON-VOLATILE MEMORY DEVICE FOR A GENERAL PURPOSE CMOS TECHNOLOGY WITH THICK GATE OXIDE - A multiple time programmable (MTP) memory cell, in accordance with an embodiment, includes a floating gate PMOS transistor, a high voltage NMOS transistor, and an n-well capacitor. The floating gate PMOS transistor includes a source that forms a first terminal of the memory cell, a drain and a gate. The high voltage NMOS transistor includes a source connected to ground, an extended drain connected to the drain of the PMOS transistor, and a gate forming a second terminal of the memory cell. The n-well capacitor includes a first terminal connected to the gate of the PMOS transistor, and a second terminal forming a third terminal of the memory cell. The floating gate PMOS transistor can store a logic state. Combinations of voltages can be applied to the first, second and third terminals of the memory cell to program, inhibit program, read and erase the logic state. | 07-21-2011 |
20110188314 | BIT LINE STABILITY DETECTION - A power supply and monitoring apparatus such as in a nonvolatile memory system. A power supply circuit provides power to a large number of sense modules, each of which is associated with a bit line and a string of non-volatile storage elements. During a sensing operation, such as a read or verify operation, a discharge period is set in which a sense node of each sense module discharges into the associated bit line and string of non-volatile storage elements, when the string of non-volatile storage elements, is conductive. This discharge sinks current from the power supply, causing a perturbation. By sampling the power supply, a steady state condition can be detected from a rate of change. The steady state condition signals that the discharge period can be concluded and data can be latched from the sense node. The discharge period automatically adapts to different memory devices and environmental conditions | 08-04-2011 |
20110188315 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE HAVING NON-SELECTED WORD LINES ADJACENT TO SELECTED WORD LINES BEING CHARGED AT DIFFERENT TIMING FOR PROGRAM DISTURB CONTROL - A non-volatile semiconductor memory device includes a memory cell array of data-rewritable non-volatile memory cells or memory cell units containing the memory cells, and a plurality of word lines each commonly connected to the memory cells on the same row in the memory cell array. In write pulse applying during data writing, a high voltage for writing is applied to a selected word line, and an intermediate voltage for writing is applied to at least two of non-selected word lines. The beginning of charging a first word line located between the selected word line and a source line to a first intermediate voltage for writing is followed by the beginning of charging a second word line located between the selected word line and a bit line contact to a second intermediate voltage for writing. | 08-04-2011 |
20110199830 | FLOTOX-BASED, BIT-ALTERABLE, COMBO FLASH AND EEPROM MEMORY - A non-volatile memory array having FLOTOX-based memory cells connected by a plurality of word lines and a plurality of bit lines is disclosed. In the memory array, the FLOTOX-based memory cells in a common word line do not share a common source line. Instead, the FLOTOX-based memory cells associated with a bit line are provided with a source line laid out in parallel with the bit line to avoid punch-through leakage. The FLOTOX-based memory cells may be 2T FLOTOX-based EEPROM cells or 1T FLOTOX-based flash cells. The byte-alterable and page-alterable functions of a 2T EEPROM array and the block-alterable function of a 1T flash array are preserved. In addition, a novel bit-alterable function is added to both 2T FLOTOX-based EEPROM array and 1T FLOTOX-based flash array to reduce the unnecessary high voltage over-stress in a write operation to improve program/erasure endurance cycles. | 08-18-2011 |
20110199831 | COARSE AND FINE PROGRAMMING IN A SOLID STATE MEMORY - Memory devices adapted to receive and transmit analog data signals representative of bit patterns of two or more bits facilitate increases in data transfer rates relative to devices communicating data signals indicative of individual bits. Programming of such memory devices includes initially programming a cell with a coarse programming pulse to move its threshold voltage in a large step close to the programmed state. The neighboring cells are then programmed using coarse programming. The algorithm then returns to the initially programmed cells that are then programmed with one or more fine pulses that slowly move the threshold voltage in smaller steps to the final programmed state threshold voltage. | 08-18-2011 |
20110199832 | MAGNETIC FLOATING GATE MEMORY - An apparatus includes at least one memory device including a floating gate element and a magnetic field generator that operably applies a magnetic field to the memory device. The magnetic field directs electrons in the memory device into the floating gate element. | 08-18-2011 |
20110205801 | SEMICONDUCTOR MEMORY DEVICE - In writing operation, charge pumps of a memory apply any of first to n-th voltages which are different from each other. An application-voltage selector selects voltages to be applied to WLs among the first to n-th voltages. A word-line number register stores the number of WLs to which each of the first to n-th voltages is to be applied for the first to n-th voltages. A storage stores a correspondence table that stores a relationship between the number of WLs for each of the first to n-th voltages and the number of charge pumps allocated to the first to n-th voltages. A generation-voltage selector allocates charge pumps to generate the first to n-th voltages based on the correspondence table according to the number of WLs for each of the first to n-th voltages. Each charge pump generates any of the first to n-th voltages allocated by the generation-voltage selector. | 08-25-2011 |
20110205802 | NONVOLATILE MEMORY DEVICE AND METHOD OF READING THE SAME - Provided are a nonvolatile memory device and a method of reading the same. The nonvolatile memory device includes: a memory cell; a transistor disposed between a common source line and the memory cell; and a control logic for controlling a bias voltage of the transistor to reduce the amount of current flowing into the common source line during a read operation. The method includes: applying a read voltage to the memory cell; and controlling a bias voltage of the transistor to reduce the amount of current flowing into the common source line. | 08-25-2011 |
20110211394 | FIELD EFFECT TRANSISTORS FOR A FLASH MEMORY COMPRISING A SELF-ALIGNED CHARGE STORAGE REGION - Storage transistors for flash memory areas in semiconductor devices may be provided on the basis of a self-aligned charge storage region. To this end, a floating spacer element may be provided in some illustrative embodiments, while, in other cases, the charge storage region may be efficiently embedded in the electrode material in a self-aligned manner during a replacement gate approach. Consequently, enhanced bit density may be achieved, since additional sophisticated lithography processes for patterning the charge storage region may no longer be required. | 09-01-2011 |
20110211395 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device, in which interference between adjoining cells can be reduced and an expansion of a chip area can be suppressed, comprising: a memory cell array in which plural memory cells connected to plural word lines and plural bit lines are disposed in a matrix form; sense amplifiers each of which is to be connected to each of the bit lines; a control circuit which controls voltages of the word lines and the bit lines, and programs data into the memory cells or reads data from the memory cells; wherein the plural bit lines include at least a first, a second, a third and a fourth bit lines adjoining to each other, and the sense amplifiers include at least a first and a second sense amplifiers, a first and a fourth selection transistors which are provided between the first and the fourth bit lines and the first sense amplifier, and connect the first and the fourth bit lines to the first sense amplifier; and a second and a third selection transistors which are provided between the second and the third bit lines and the second sense amplifier, and connect the second and the third bit lines to the second sense amplifier. | 09-01-2011 |
20110216596 | Reliability Protection for Non-Volatile Memories - A non-volatile memory cell having enhanced protection against mobile ions. The electric field within the memory cell is controlled in a manner that minimizes migration of mobile ions toward the floating gate. Each conductive layer in the memory cell is biased to reduce the flow of mobile ions toward the floating gate. The memory cell is preferably manufactured using a conventional logic process. | 09-08-2011 |
20110216597 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A memory string comprises a semiconductor layer, a charge storage layer, and a plurality of first conductive layers. The semiconductor layer includes a columnar portion that extends in a perpendicular direction to a substrate. The charge storage layer is formed around a side surface of the columnar portion. The plurality of first conductive layers are formed around the side surface of the columnar portion and the charge storage layer. A control circuit comprises a plurality of second conductive layers, an insulating layer, and a plurality of plug layers. The plurality of second conductive layers are formed in the same layers as the plurality of first conductive layers. The insulating layer is formed penetrating the plurality of second conductive layers in the perpendicular direction. The plurality of plug layers are formed penetrating the insulating layer in the perpendicular direction. The insulating layer has a rectangular shaped cross-section with a constricted portion in a horizontal direction to the substrate. The constricted portion is positioned on a long side of the cross-section. | 09-08-2011 |
20110216598 | MEMORY SYSTEM AND OPERATING METHOD THEREOF - Provided are a memory system and an operating method thereof. The operating method reads an observation memory cell at least one time with different read voltages to configure a first read data symbol, reads a plurality of interference memory cells adjacent to the observation memory cell at least one time with different read voltages to configure second read data symbols, and determines a logical value of the observation memory cell based on the first read data symbol and the second read data symbols. | 09-08-2011 |
20110216599 | SEMICONDUCTOR MEMORY DEVICE AND CONTROL METHOD THEREOF - According to one embodiment, a semiconductor memory device includes a memory cell array, a column decoder, and a control circuit configured to control the memory cell array and the column decoder. The control circuit is configured to load program data from outside, to execute a first data program in a first even-numbered bit line, to execute a second data program in a first odd-numbered bit line, to execute a verify read of the programmed bit lines, to determine whether a value of the verify read is programmed up to a predetermined threshold value, and to change, in a case where the value of the verify read fails to be programmed to the predetermined threshold value, an order of the first and second data programs, to execute the second data program in the first odd-numbered bit line, and then to execute the first data program in the first even-numbered bit line. | 09-08-2011 |
20110222347 | NAND NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND WRITE METHOD FOR NAND NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a NAND nonvolatile semiconductor memory device comprises memory cell transistors and a write circuit. The memory cell transistors are arranged in a matrix in a column direction and in a row direction. Each of the memory cell transistors comprises a charge accumulation layer and a control gate electrode configured to control the charge accumulation state of the charge accumulation layer. The write circuit carries out write on the memory cell transistors. The memory cell transistors arranged in the same line include first memory cell transistors and second memory cell transistors that are smaller than the first memory cell transistors in the column direction. The write circuit carries out write on a predetermined first memory cell transistor and then on another first memory cell transistor. After the write on the another first memory cell transistor, the write circuit carries out write on the second memory cell transistor. | 09-15-2011 |
20110222348 | Nonvolatile Memory Devices Having Memory Cell Arrays with Unequal-Sized Memory Cells and Methods of Operating Same - Nonvolatile memory devices include a two-dimensional array of nonvolatile memory cells having a plurality of memory cells of unequal size therein. These memory cells may include those that have unequal channel widths associated with respective word lines and those having unequal channel lengths associated with respective bit lines that are connected to corresponding strings of nonvolatile memory cells (e.g., NAND-type strings). Control circuitry is also provided that is electrically coupled to the two-dimensional array of nonvolatile memory cells. This control circuitry may operate to concurrently program first and second nonvolatile memory cells having unequal sizes from an erased state (e.g., logic 1) to an equivalent programmed state (e.g., logic 0). This is done by establishing unequal first and second word line-to-channel region voltages in the first and second nonvolatile memory cells, respectively, during an operation to program a row of memory cells in the two-dimensional array of nonvolatile memory cells, which includes the first and second nonvolatile memory cells of unequal size. | 09-15-2011 |
20110222349 | TRANSFER CIRCUIT, NONVOLATILE SEMICONDUCTOR DEVICE USING THE SAME, AND TRANSFER METHOD OF THE SAME - According to one embodiment, a transfer circuit includes a first inverter, a second inverter, a first line, a second line, a first holder, and a second holder. The first inverter inverts data at a first node and transfers the inverted data to a second node. The second inverter inverts the data at the second node and transfers the inverted data to the first node. The first line connected to the first node. The second line connected to the second node. The first holder may output data to the first node. The second holder may output data to the second node. When the first holder outputs the data to the first line, the first and second inverters are turned off. When the second holder outputs the data to the first line through the second node, the first inverter is turned off. | 09-15-2011 |
20110222350 | MULTI-LEVEL CELL ACCESS BUFFER WITH DUAL FUNCTION - An access buffer, such as page buffer, for writing to non-volatile memory, such as Flash, using a two-stage MLC (multi-level cell) operation is provided. The access buffer has a first latch for temporarily storing the data to be written. A second latch is provided for reading data from the memory as part of the two-stage write operation. The second latch has an inverter that participates in the latching function when reading from the memory. The same inverter is used to produce a complement of an input signal being written to the first latch with the result that a double ended input is used to write to the first latch. | 09-15-2011 |
20110222351 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprises memory cells which includes a selection transistor and a memory transistor; selection gate lines coupled to a gate of the selection transistor; control gate lines coupled to the control gate of the memory transistor; source lines coupled to a source of the memory transistor; bit lines coupled to the selection transistor; a selection gate line driver circuit; a control gate line driver circuit; and a source line driver circuit, wherein the selection gate line driver circuit comprises a first transistor including a first gate insulation film and drives the selection gate line with a first driving voltage, and the control gate line driver circuit and the source line driver circuit comprises a second transistor including second gate insulation films and drives the control gate line and the source line with a boost voltage higher than the first driving voltage. | 09-15-2011 |
20110222352 | METHOD FOR PROGRAMMING A NON-VOLATILE MEMORY DEVICE TO REDUCE FLOATING-GATE-TO-FLOATING-GATE COUPLING EFFECT - A method for programming a non-volatile memory array comprising a plurality of memory cells. Each cell is adapted to store a lower and an upper page of data. The method: programs the lower page of predetermined memory cells with first predetermined data and the upper page with second predetermined data. One of the lower page or the upper page of the predetermined memory cells is reprogrammed with the first or second predetermined data, respectively. | 09-15-2011 |
20110235425 | METHOD OF DIRECTLY READING OUTPUT VOLTAGE TO DETERMINE DATA STORED IN A NON-VOLATILE MEMORY CELL - An NVM cell design enables direct reading of cell output voltage to determine data stored in the cell, while providing low current consumption and a simple program sequence that utilizes reverse Fowler-Nordheim tunneling. | 09-29-2011 |
20110235426 | FLASH MEMORY SYSTEM HAVING A PLURALITY OF SERIALLY CONNECTED DEVICES - A semiconductor memory device and system are disclosed. The memory device includes a memory, a plurality of inputs, and a device identification register for storing register bits that distinguish the memory device from other possible memory devices. Circuitry for comparing identification bits in the information signal with the register bits provides positive or negative indication as to whether the identification bits match the register bits. If the indication is positive, then the memory device is configured to respond as having been selected by a controller. If the indication is negative, then the memory device is configured to respond as having not been selected by the controller. A plurality of outputs release a set of output signals towards a next device. | 09-29-2011 |
20110242893 | NON-VOLATILE MEMORY UNIT CELL WITH IMPROVED SENSING MARGIN AND RELIABILITY - A non-volatile memory unit cell includes a first transistor pair and first and second control gates. The first transistor pair includes first and second transistors that are connected in series and of the same type. The first and second transistors have a first floating polysilicon gate and a second floating polysilicon gate, respectively. The first control gate is coupled to the first floating polysilicon gate through a tunneling junction and the second control gate is coupled to the second floating polysilicon gate through another tunneling junction. | 10-06-2011 |
20110242894 | METHOD AND SYSTEM TO ISOLATE MEMORY MODULES IN A SOLID STATE DRIVE - A method and system to facilitate the usage of memory modules that have one or more defective memory dies. In one embodiment of the invention, a memory module is packaged with a number of dies and the memory module is tested and sorted according to the number of dies that pass testing. Each signal of each die in the memory module has an unique bond-out or connection point in the package of the memory module. By separating the signals of each die in the memory module, any defective die can be easily isolated and this allows a significant cost reduction in products that use a large number of dies. | 10-06-2011 |
20110242895 | MEMORY DEVICE, MANUFACTURING METHOD FOR MEMORY DEVICE AND METHOD FOR DATA WRITING - A memory device to which an electron beam is irradiated to store data therein is provided. The memory device includes a plurality of floating electrodes that store data through irradiation of the electron beam thereto, a charge amount detecting section that detects data stored in each of the floating electrodes based on a charge amount accumulated in each of the floating electrode. | 10-06-2011 |
20110242896 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A semiconductor device includes a booster circuit and a detector. The booster circuit is configured to boost an input voltage and output an output voltage, and the detector is configured to output the output voltage, which is output from the booster circuit, and control the booster circuit to generate a plurality of different voltages in accordance with an operating mode. | 10-06-2011 |
20110242897 | PROGRAM AND READ TRIM SETTING - A method and apparatus for setting trim parameters in a memory device provides multiple trim settings that are assigned to portions of the memory device according to observed or tested programming speed and reliability. | 10-06-2011 |
20110249502 | SEMICONDUCTOR DEVICE - The semiconductor device includes the read circuit which reads data written to a memory cell. The read circuit includes a first transistor, a second transistor, a first switch, and a second switch. A first terminal of the first transistor is electrically connected to a gate of the first transistor, and a second terminal of the first transistor is electrically connected to an output from the read circuit via the first switch. A first terminal of the second transistor is electrically connected to a gate of the second transistor, and a second terminal of the second transistor is electrically connected to the output from the read circuit via the second switch. A channel formation region of the first transistor can be formed using an oxide semiconductor, and a channel formation region of the second transistor can be formed using silicon. | 10-13-2011 |
20110255340 | Nonvolatile semiconductor memory and method for testing the same - A nonvolatile semiconductor memory, includes a nonvolatile memory array, a voltage generator circuit that generates a drive voltage which changes depending on a supply voltage and a code, a control circuit that applies the generated drive voltage to the nonvolatile memory array, and a code output circuit that outputs any one of a plurality of codes to the voltage generator circuit, wherein the plurality of codes includes a first code and a second code, wherein the second code is different from the first code, wherein, in a first state, the code output circuit outputs the first code to the voltage generator circuit, and the voltage generator circuit generates the drive voltage according to the first code, and wherein, in a second state, the code output circuit outputs the second code to the voltage generator circuit, and the voltage generator circuit generates the drive voltage according to the second code. | 10-20-2011 |
20110261622 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MEMORY SYSTEM HAVING THE SAME - A nonvolatile semiconductor memory device includes a first string including a first number of memory cells connected in series each storing therein information in a nonvolatile manner; and a second string including a second number of memory cells connected in series each storing therein information in a nonvolatile manner, wherein the second number is smaller than the first number. | 10-27-2011 |
20110267889 | A HIGH SECOND BIT OPERATION WINDOW METHOD FOR VIRTUAL GROUND ARRAY WITH TWO-BIT MEMORY CELLS - A non-volatile VG memory array employing memory semiconductor cells capable of storing two bits of information having a non-conducting charge trapping dielectric, such as silicon nitride, layered in associating with at least one electrical insulating layer, such as an oxide, is disclosed. Bit lines of the memory array are capable of transmitting positive voltage to reach the source/drain regions of the memory cells of the array. A method that includes the hole injection erasure of the memory cells of the array that lowers the voltage threshold of the memory cells to a value lower than the initial voltage threshold of the cells is disclosed. The hole injection induced lower voltage threshold reduces the second bit effect such that the window of operation between the programmed and un-programmed voltage thresholds of the bits is widened. The programming and read steps reduce leakage current of the memory cells in the array. | 11-03-2011 |
20110273934 | Interleaving Charge Pumps for Programmable Memories - Systems and methods, including computer software for performing operations enable interleaving of charging operations in a charging pump. A first charge pump is charged to a predetermined level, and a first operation is performed using a charge stored in the first charge pump after it reaches the predetermined level. A second charge pump is charged during a time that overlaps with performing the first operation. A second operation is performed using a charge stored in the second charge pump as a result of charging the second charge pump. | 11-10-2011 |
20110280077 | MULTI-SEMICONDUCTOR MATERIAL VERTICAL MEMORY STRINGS, STRINGS OF MEMORY CELLS HAVING INDIVIDUALLY BIASABLE CHANNEL REGIONS, MEMORY ARRAYS INCORPORATING SUCH STRINGS, AND METHODS OF ACCESSING AND FORMING THE SAME - Multi-semiconductor vertical memory strings, strings of memory cells having individually biasable channel regions, arrays incorporating such strings and methods for forming and accessing such strings are provided. For example non-volatile memory devices are disclosed that utilize NAND strings of serially-connected non-volatile memory cells. One such string can include two or more serially connected non-volatile memory cells each having a channel region. Each memory cell of the two or more serially connected non-volatile memory cells shares a common control gate and each memory cell of the two or more serially connected non-volatile memory cells is configured to receive an individual bias to its channel region. | 11-17-2011 |
20110280078 | CHARGE PUMP OPERATION IN A NON-VOLATILE MEMORY DEVICE - A charge pump in a memory device is activated to produce a programming voltage prior to data loading during a programming operation. During an initial programming cycle, first and second load voltages are charged from the charge pump. The first load is removed from the charge pump during a verify operation. The first load voltage is subsequently recharged by charge sharing from the second load voltage so that the charge pump is not initially necessary for recharging the first load voltage. | 11-17-2011 |
20110280079 | NAND FLASH MEMORY PROGRAMMING - A method of charging a floating gate in a nonvolatile memory cell comprises bringing a substrate channel within the memory cell to a first voltage, bringing a control gate to a programming voltage, and floating the substrate channel voltage while the control gate is at the programming voltage. Memory devices include state machines or controllers operable to perform the described method, and operation of such a state machine, memory device, and information handling system are described. | 11-17-2011 |
20110280080 | MEMORY WITH MULTI-PAGE READ - A memory device is described that provides increased output data to help evaluate data errors from bit line coupling and floating gate coupling during a read operation. Multiple rows, or pages, of data are read to allow an internal or external decoder to evaluate memory cell data. | 11-17-2011 |
20110280081 | NON-VOLATILE SEMICONDUCTOR MEMORY - When a plurality of non-volatile memory cells in a memory cell array are simultaneously written, bit lines of the plurality of non-volatile memory cells are connected to M data lines, where M is an integer of two or more, based on a column address signal. N switches, where N is an integer of one or more, and a switch control circuit for controlling the N switches, are provided for each data line. The M switch control circuits control the M×N switches to change the levels or apply periods of drain voltages applied to the bit lines of the plurality of memory cells on a memory cell-by-memory cell basis. | 11-17-2011 |
20110286276 | PARTIAL LOCAL SELF BOOSTING FOR NAND - A memory system is programmed with minimal program disturb and reduced junction and channel leakage during self-boosting. Pre-charging bias signals are applied to word lines adjacent to a selected word line before a program signal is applied to the selected word line and a pass signal is applied to the remaining word lines. The pre-charging bias signals apply a pre-charge to the memory cells. The pre-charging bias signals are chosen to improve the isolation of the memory cells on word lines adjacent to the selected word line, improve self boost efficiency and reduce current leakage to prevent or reduce program disturb and/or programming errors especially in the inhibited memory cells on the selected word line. | 11-24-2011 |
20110286277 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR DRIVING SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a plurality of memory cell transistors arranged in a matrix; a plurality of word lines commonly coupling the control gates of the plural memory cell transistors present in a identical first direction; a plurality of source lines commonly coupling the sources of the plural memory cell transistors present in the identical first direction; a plurality of bit lines commonly coupling the drains of the plural memory cell transistors present in a identical second direction intersecting the first direction; a first transistor having a drain coupled to the source line; a second transistor having a drain coupled to a source of the first transistor, a gate coupled to the word line and a source grounded; and a control line commonly coupling the gates of the plural first transistors. | 11-24-2011 |
20110286278 | METHOD OF STORING E-FUSE DATA IN FLASH MEMORY DEVICE - Provided is a method of storing configuration data regarding an operating environment of a flash memory device, which includes a memory cell array having an electrical fuse (E-Fuse) block for storing the configuration data. The method includes storing the configuration data in multiple strings of the E-Fuse block, each string including multiple memory cells configured to store one bit. | 11-24-2011 |
20110292733 | ELECTRICALLY PROGRAMMABLE FLOATING COMMON GATE CMOS DEVICE AND APPLICATIONS THEREOF - A programmable CMOS device includes a PFET and an NFET that have a common floating gate. Depending on the configuration, the programmable CMOS device can be programmed, erased, and re-programmed repeatedly. The programming, erasure, and/or reprogramming can be effected by injection of electrons and/or holes into the floating gate. The programmable CMOS device can be employed as a fuse or an antifuse, to program a floating gate of another device, and/or to function as a latch. The programmable CMOS device can be formed employing standard logic compatible processes, i.e., without employing any additional processing steps. | 12-01-2011 |
20110299337 | METHODS AND APPARATUS FOR AN ISFET - An ISFET includes a control gate coupled to a floating gate in a CMOS device. The control gate, for example, a poly-to-well capacitor, is configured to receive a bias voltage and effect movement of a trapped charge between the control gate and the floating gate. The threshold voltage of the ISFET can therefore by trimmed to a predetermined value, thereby storing the trim information (the amount of trapped charge in the floating gate) within the ISFET itself. | 12-08-2011 |
20110299338 | Memory system and method of accessing a semiconductor memory device - A memory system is provided with a processor, a main memory, and a flash memory. Performance of the memory system is improved through achievement of speed-up and high data reliability. The memory system includes a nonvolatile memory device and a controller configured to drive a control program to control the nonvolatile memory device. The control program executes a second access operation for the nonvolatile memory device even before a first access operation to the nonvolatile memory device is completed. | 12-08-2011 |
20110299339 | NONVOLATILE SEMICONDUCTOR MEMORY, METHOD FOR READING OUT THEREOF, AND MEMORY CARD - A nonvolatile semiconductor memory includes: a memory cell unit including a plurality of memory cells having an electric charge accumulation layer and a control electrode, said memory cells being electrically connected in series; a plurality of word lines, each of which is electrically connected to said control electrode of said plurality of memory cells; a source line electrically connected to said memory cells at one end of said memory cell unit; a bit line electrically connected to said memory cells at the other end of said memory cell unit; and a control signal generation circuit, which during a data readout operation staggers a timing for selecting the word line connected to said memory cells of said memory cell unit from a timing for selecting a non-selected word line connected to a non-selected memory. | 12-08-2011 |
20110305090 | MEMORY CONTROLLER SELF-CALIBRATION FOR REMOVING SYSTEMIC INFLUENCE - Self-calibration for a memory controller is performed by writing a voltage to a selected cell. Adjacent cells around the selected cell are programmed. After each of the adjacent programming operations, the voltage on the selected cell is read to determine any change in voltage caused by systemic offsets such as, for example, floating gate-to-floating gate coupling. These changes are averaged and stored in a table as an offset for use in adjusting a programming voltage or a read voltage in a particular area of memory represented by the offset. Self calibration method for temperature is determined by writing cells at different temperatures and reading at different temperatures to generate temperature offset tables for the write path and read path. These offset tables are used to adjust for systematic temperature related offsets during programming and during read. | 12-15-2011 |
20110317489 | Nonvolatile Memory Devices, Read Methods Thereof And Memory Systems Including The Nonvolatile Memory Devices - Reading methods of nonvolatile memory devices including a substrate and a plurality of memory cells which are stacked in a direction intersecting the substrate. The reading methods apply a bit line voltage to a plurality of bit lines and apply a first string selection line voltage to at least one selected string selection line. The reading methods apply a second string selection line voltage to at least one unselected string selection line and apply a read voltage to a plurality of word lines. The reading methods apply a first ground selection line voltage to at least one selected ground selection line and apply a second ground selection line voltage to at least one unselected ground selection line. | 12-29-2011 |
20110317490 | NONVOLATILE SEMICONDUCTOR MEMORY - A nonvolatile semiconductor memory can reduce variations in an amount of current during data writing operation. This allows for the writing of data to memory cells with high precision. The nonvolatile semiconductor memory includes a plurality of memory cells, word lines connected to the memory cells, and bit lines connected to each of the memory cells. At least two of the bit lines are selected, and a current is simultaneously supplied from a power supply line to those memory cells which are connected to the selected bit lines in order to write data thereto. The nonvolatile semiconductor memory also includes charge amount measurement units for measuring respective amounts of charge stored in the memory cells. The nonvolatile semiconductor memory also includes current path switching circuits connected to the respective bit lines. Those current path switching circuits which are connected to the selected bit lines supply a current from the power supply line to the memory cells or a predetermined terminal depending on a measured value of the amount of charge measured by the charge amount measurement section. | 12-29-2011 |
20120002479 | CIRCUIT FOR THE OPTIMIZATION OF THE PROGRAMMING OF A FLASH MEMORY - A non volatile memory device is provided. The memory device includes a plurality of memory cells and programming means. The programming circuitry is configured to select a group of memory cells, receive a first data word and program memory cells of the selected group based on the data word. the program means includes a program circuit configured to receive at least one second data word, and, for each second data word, select a corresponding portion of memory cells of the group and send a program current in parallel to discriminated memory cells of the portion based on the corresponding second data word during a corresponding program phase. The memory device further includes an optimization circuit configured to generate said at least one second data word from the first data word. Each of said at least one second data word is such to cause during each program phase that the number of discriminated memory cells is maximized compatibly with a maximum predetermined limit of the total program current provided by the program circuit. | 01-05-2012 |
20120002480 | NONVOLATILE MEMORY APPARATUS - A nonvolatile memory device includes: a data transmission line configured to transmit internal configuration data; a data path control unit configured to control a data transmission path direction of the data transmission line according to control of a test signal; and a configuration data latch unit configured to latch a signal transmitted through the data transmission line or drive a latched signal to the data transmission line, according to control of the test signal. | 01-05-2012 |
20120002481 | METHOD OF PROGRAMMING A NON-VOLATILE MEMORY DEVICE - A method of programming a non-volatile memory device includes applying a first pass voltage to word lines in a direction of a source select line based on a first word line selected for a program operation, wherein the word lines do not include a second word line adjacent to the first word line in a direction of the source select line; and applying a first voltage, a program voltage and a second pass voltage when the first pass voltage reaches a given level. The first voltage is applied to the second word line, the program voltage is provided to the first word line, and the second pass voltage is applied to word lines in a direction of a drain select line on the basis of the first word line. | 01-05-2012 |
20120008400 | NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME - A non-volatile semiconductor storage device includes: a memory string; a select transistor; and a carrier selection element. The select transistor has one end connected to one end of the memory string. The carrier selection element has one end connected to the other end of the select transistor, and selects a majority carrier flowing through respective bodies of the memory transistors and the select transistor. The carrier selection element includes: a third semiconductor layer; a metal layer; a second gate insulation layer; and a third conductive layer. The metal layer extends in the vertical direction. The metal layer extends in the vertical direction from the top of the third semiconductor layer. The second gate insulation layer surrounds the third semiconductor layer and the metal layer. The third conductive layer surrounds the third semiconductor layer and the metal layer via the second gate insulation layer and extends in a parallel direction. | 01-12-2012 |
20120008401 | SYSTEMS AND METHODS FOR STORING, RETRIEVING, AND ADJUSTING READ THRESHOLDS IN FLASH MEMORY STORAGE SYSTEM - A method, system and computer-readable medium are provided for reading information from a memory unit. A request may be received to read information from a set of memory cells in the memory unit. At least one read threshold in an initial set of read thresholds may be perturbed to generate a perturbed set of read thresholds. The set of memory cells may be read using the perturbed set of read thresholds to provide a read result. The performance of said reading may be evaluated using the perturbed set of read thresholds. The at least one read threshold may be iteratively perturbed for each sequential read operation that the read performance is evaluated to be sub-optimal. | 01-12-2012 |
20120008402 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A method of operating a semiconductor memory device includes performing an LSB program operation for selected memory cells while raising a program voltage, when the threshold voltages of some of the selected memory cells reach a target level, storing data, corresponding to a relevant program voltage, in a first flag cell, performing the LSB program operation for some of the selected memory cells, having threshold voltages not reached the target level, until the threshold voltages of all the selected memory cells reach the target level, and after the LSB program operation is completed, performing an MSB program operation for the selected memory cells by using a program voltage, set based on the data stored in the first flag cell, as a start program voltage. | 01-12-2012 |
20120008403 | SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit includes a boost circuit configured to boost a power supply voltage so as to generate first and second voltages, the second voltage being lower than the first voltage, a load circuit supplied with the first voltage, and a capacitor. The capacitor has first and second diffusion regions, a first insulating film formed on a channel region, a first electrode formed on the first insulating film, a second insulating film formed on the first electrode, and a second electrode formed on the second insulating film. The second voltage is applied to the first electrode. The first voltage is applied to the second electrode. The power supply voltage is applied to at least one of the first and second diffusion regions. | 01-12-2012 |
20120008404 | SYSTEM AND METHOD FOR REDUCING PIN-COUNT OF MEMORY DEVICES, AND MEMORY DEVICE TESTERS FOR SAME - Methods, memory devices and systems are disclosed. In one embodiment, a non-volatile memory device receives command signals through the same input/output terminals that receive address signals and write data signals and transmit read data signals. The input/output terminals are connected to a multiplexer, which is responsive to a received mode control signal to couple the input/output terminals to either a command bus or an input/output bus. A latch in the memory device latches the command signals when the mode control signal causes the input/output terminals to be coupled to the input/output bus. As a result, the command signals continue to be applied to the command bus. When the mode control signal causes the input/output terminals to be coupled to the input/output bus, write data signals are clocked into the memory device and read data signals are clocked out of the memory device responsive to a received clock signal. | 01-12-2012 |
20120014182 | APPARATUS FOR GENERATING A VOLTAGE AND NON-VOLATILE MEMORY DEVICE HAVING THE SAME - An apparatus for generating a voltage includes a first voltage outputting circuit configured to receive an input voltage and adjust and output a first voltage in accordance with a temperature, a buffer circuit configured to receive the first voltage and output the received first voltage as a second voltage at an output node of the buffer circuit, and a second voltage outputting circuit configured to receive the second voltage at an input terminal and output a third voltage by dividing a driving voltage in accordance with a resistance ratio, wherein the second voltage outputting circuit includes a sub-voltage outputting circuit and a controlling circuit configured to adjust a voltage level of the third voltage through a feedback of the third voltage to the input terminal. | 01-19-2012 |
20120020162 | Low power, single poly EEPROM cell with voltage divider - An Electrically Erasable Programmable Read Only Memory (EEPROM) memory array (FIGS. | 01-26-2012 |
20120020163 | Array architecture for reduced voltage, low power, single poly EEPROM - An Electrically Erasable Programmable Read Only Memory (EEPROM) memory array (FIG. | 01-26-2012 |
20120020164 | TEST METHOD FOR SCREENING MANUFACTURING DEFECTS IN A MEMORY ARRAY - A method of screening manufacturing defects at a memory array may include programming a background pattern of physically inverse data along conductive lines extending in a first direction. The programming may include providing a program conductive line with a high value. The method may further include programming a memory cell at an intersection of the program conductive line and a conductive line extending in a second direction to a selected high value, and determining whether a cell initially at a low value and associated with a conductive line extending in the first direction and adjacent to the program conductive line is disturbed. | 01-26-2012 |
20120020165 | SEMICONDUCTOR STORAGE DEVICE AND CONTROL METHOD THEREOF - In one embodiment, there is provided a semiconductor storage device including: a memory cell array; a high voltage generator; and a controller that controls the high voltage generator. When a word line to is selected from word lines, the controller controls the high voltage generator to: apply a first read pass voltage to one or two first adjacent word lines adjacent to the selected word line; apply a second read pass voltage to a second adjacent word line adjacent to the first adjacent word lines, wherein the second read pass voltage is higher than the first read pass voltage; and apply a third read pass voltage to remaining word lines other than the selected word line, the first adjacent word line and the second adjacent word line, wherein the third read pass voltage is higher than the first read pass voltage and lower than the second read pass voltage. | 01-26-2012 |
20120026796 | STORAGE DEVICE AND METHOD FOR OPERATING THE SAME - A storage device includes a control unit, a first voltage supply unit for supplying a first working voltage to the control unit, N memory units, a second voltage supply unit for supplying a second working voltage to each memory unit, a logic gate, a first voltage detecting unit and a second voltage detecting unit. Once the first voltage detecting unit detects that the first working voltage of the control unit is abnormal, the logic gate outputs a first write protect signal to notify the control unit and control the memory units to enter a write protect mode. Once the second voltage detecting unit detects that the second working voltage of one or more memory units is abnormal, the logic gate outputs a second write protect signal to notify the control unit and control the one or more memory units to enter the write protect mode. | 02-02-2012 |
20120026797 | NonVolatile Memory Devices, Methods Of Programming The Same, And Memory Systems Including The Same - A nonvolatile memory device including a bit line connected to a cell string, a page buffer connected to the bit line, the page buffer is configured to output a target bit line forcing voltage level to the bit line during a programming operation, and a bit line forcing voltage clamp circuit connected between the bit line and the page buffer, and the bit line forcing voltage clamp circuit is configured to adjust the target bit line forcing voltage level to the bit line. | 02-02-2012 |
20120033498 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF READING THE SAME - A semiconductor memory device comprises planes each configured to comprise flag cells storing data about program methods of memory cells of the plane, page buffer units configured to sense the data of the flag cells, a flag cell data detection circuit configured to make a determination of program methods of the planes on the basis of a result, obtained by comparing the sensed data of the flag cells of the planes, and the sensed data of the flag cells, and a microcontroller configured to control the page buffer units, wherein the page buffer units read least significant bit (LSB) data of the planes or both the least significant bit (LSB) data and most significant bit (MSB) data on the basis of the determination of the flag cell data detection circuit. | 02-09-2012 |
20120033499 | FLASH MEMORY DEVICE AND READING METHOD THEREOF - A flash memory device and reading method of the flash memory device. The reading method includes determining a read voltage set of memory cells corresponding to a first word line from at least one of flag cell data of the first word line and flag cell data of a second word line adjacent to the first word line, and reading the memory cells corresponding to the first word line according to the determined read voltage set. | 02-09-2012 |
20120039129 | COST SAVING ELECTRICALLY-ERASABLE-PROGRAMMABLE READ-ONLY MEMORY (EEPROM) ARRAY - A cost saving electrically-erasable-programmable read-only memory (EEPROM) array, having: a plurality of parallel bit lines, a plurality of parallel word lines, and a plurality of parallel common source lines. The bit lines are classified into a plurality of bit line groups, containing a first group bit lines; the word line includes a first and a second word lines; and the common source line includes a first common source line. And, a plurality of sub-memory arrays are provided. Each sub-memory array includes a first and a second memory cells disposed opposite to each other and located on two different sides of the first common source line; the first memory cell is connected to the first group bit lines, the first common source line, and the first word line, and the second memory cell is connected to the first group bit line, the first common source line, and the second word line. | 02-16-2012 |
20120039130 | Nonvolatile Memory Devices, Channel Boosting Methods Thereof, Programming Methods Thereof, And Memory Systems Including The Same - Non-volatile memory device channel boosting methods in which at least two strings are connected to one bit line, the channel boosting methods including applying an initial channel voltage to channels of strings in a selected memory block, floating inhibit strings each having an un-programmed cell among the strings, and boosting channels of the floated inhibit strings. | 02-16-2012 |
20120044766 | SEMICONDUCTOR MEMORY DEVICE WITH A STACKED GATE INCLUDING A CHARGE STORAGE LAYER AND A CONTROL GATE AND METHOD OF CONTROLLING THE SAME - A semiconductor memory device includes a transfer circuit and a control circuit. The transfer circuit which includes a p-type MOS transistor with a source to which is applied a first voltage and an n-type MOS transistor to whose gate the drain of the p-type MOS transistor is connected and the first voltage is transferred, to whose source a second voltage is applied, and whose drain is connected to a load. The control circuit which turns the p-type MOS transistor on and off and which turns the p-type MOS transistor on to make the p-type MOS transistor transfer the second voltage to the load and, during the transfer, turns the p-type MOS transistor off to make the gate of the n-type MOS transistor float at the first voltage. | 02-23-2012 |
20120044767 | NON-VOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME - A non-volatile memory device includes a plurality of unit cells. Each unit cell includes lower and upper electrodes over a substrate, a conductive organic material layer between the lower and the upper electrodes, and a nanocrystal layer located within the conductive organic material layer, wherein the nanocrystal layer includes a plurality of nanocrystals surrounded by an amorphous barrier. A read operation is performed when an input voltage is in a first voltage range. A first write operation is performed when the input voltage is in a second voltage range higher than the first voltage range. A second write operation is performed when the input voltage is in a third voltage range higher than the second voltage range. An erase operation is performed when the input voltage is higher than the third voltage range. | 02-23-2012 |
20120063230 | Trench MONOS memory cell and array - The MONOS vertical memory cell of the present invention allow miniaturization of the memory cell area. The two embodiments of split gate and single gate provide for efficient program and erase modes as well as preventing read disturb in the read mode. | 03-15-2012 |
20120063231 | Apparatus, System, and Method for Non-Volatile Storage Element Programming - Methods, storage controllers, and systems for non-volatile storage element programming are described. One method includes programming user data in pages associated with a set of wordlines of an erase block of a non-volatile, solid-state storage element. The method further includes selecting at least one of the wordlines of the set programmed with the user data and restricting further programming of user data in the pages associated with the selected wordline. In some embodiments, the selected wordline occurs subsequent to the pages associated with the other wordlines of the set in a page programming order for the erase block. | 03-15-2012 |
20120069668 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor storage device includes a transistor, a first node, a first capacitor, a first switch, and a second switch. One end of the transistor is connected to a first voltage source supplying a first voltage. The first node is charged to the first voltage by the transistor. One of electrodes of the first capacitor is connected to the first node, and the other of the electrodes of the first capacitor is supplied with a first clock signal having a second voltage. One end of the first switch is connected to the first node. The first switch outputs a potential of the first node at a first time at which the first switch is turned on. One end of the second switch is connected to the first node. The second switch outputs the potential of the first node at a second time. | 03-22-2012 |
20120069669 | NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF CONTROLLING AND MANUFACTURING THE SAME - A nonvolatile semiconductor storage device is disclosed. The device includes a cell group having a first memory cell and a second memory cell located first directionally adjacent to the first memory cell, and a programming circuit. The first memory cell is used for data retention and the second memory cell is used for adjustment of a threshold voltage of the first memory cell. The programming circuit is configured to program the first memory cell by applying voltage to the second memory cell to control the threshold voltage of the first memory cell to be higher than a first threshold voltage. | 03-22-2012 |
20120069670 | Semiconductor Integrated Circuit Device for Driving Liquid Crystal Display - The present invention realizes a semiconductor integrated circuit device for driving liquid crystal (liquid crystal control driver IC) capable of easily setting drive conditions and the like according to specifications of a liquid crystal display to be used. An electrically-programmable nonvolatile memory circuit (EPROM) or an electrically erasable and programmable nonvolatile memory circuit (EEPROM) is provided in a semiconductor integrated circuit device for driving a liquid crystal display, and setting information is stored in the memory circuit. The memory circuit is constructed by a normal device which can be formed in the same process as a semiconductor manufacturing process of forming devices of other circuits. | 03-22-2012 |
20120069671 | MEMORY AND OPERATION METHOD THEREFOR - An operation method for a memory device having a plurality of memory cells includes: reading the plurality of memory cells by a first word line voltage to get a first number of a first logic state; reading the plurality of memory cells by a second word line voltage to get a second number of the first logic state, the second word line voltage different from the first word line voltage; and using the second word line voltage as a target word line voltage if the first number of the first logic state is equal to the second number of the first logic state. | 03-22-2012 |
20120081966 | COMBINED EEPROM/FLASH NON-VOLATILE MEMORY CIRCUIT - A non-volatile memory circuit includes memory rows and supporting circuits coupled to the memory rows, where at least one of the memory rows include at least one Electrically Erasable Programmable Read-Only Memory (EEPROM) memory element and at least one Flash memory element. The EEPROM and Flash elements are configured to share some of the supporting circuits and can be accessed in parallel. | 04-05-2012 |
20120081967 | METHOD AND SYSTEM FOR PROGRAMMING NON-VOLATILE MEMORY CELLS BASED ON PROGRAMMING OF PROXIMATE MEMORY CELLS - A multi-level non-volatile memory device programs cells in each row in a manner that takes into account the coupling from the programming of cells that are proximate the row to be programmed. In one example of the invention, after the row has been programmed, the proximate cells are verified by read, comparison, and, if necessary, reprogramming operations to compensate for charge added to proximate memory cells resulting from programming the row. In another example of the invention, a row of memory cells is programmed with charge levels that take into account the charge that will be added to the memory cells when proximate memory cells are subsequently programmed. | 04-05-2012 |
20120081968 | N WELL IMPLANTS TO SEPARATE BLOCKS IN A FLASH MEMORY DEVICE - A semiconductor memory device that has an isolated area formed from one conductivity and formed in part by a buried layer of a second conductivity that is implanted in a substrate. The walls of the isolated area are formed by implants that are formed from the second conductivity and extend down to the buried layer. The isolated region has implanted source lines and is further subdivided by overlay strips of the second conductivity that extend substantially down to the buried layer. Each isolation region can contain one or more blocks of memory cells. | 04-05-2012 |
20120087191 | Symmetric, Differential Nonvolatile Memory Cell - Some embodiments relate to a differential memory cell. The memory cell includes a first transistor having a source, a drain, a gate, and a body. A first capacitor has a first plate and a second plate, wherein the first plate is coupled to the gate of the first transistor and extends over the body region. The memory cell also includes a second transistor having a source, a drain, a gate, and a body, wherein the source and body of the second transistor is coupled to the second plate of the first capacitor. A second capacitor has a third plate and a fourth plate, wherein the third plate is coupled to the gate of the second transistor and the fourth plate is coupled to the source and the body of the first transistor. | 04-12-2012 |
20120106254 | MEMORY SYSTEM - According to one embodiment, a memory system includes a NAND flash memory, a first unit, and an second unit. Memory cells capable of holding data and management data as a first control signal. Memory cells are arranged in a matrix in the NAND flash memory. The first unit holds a second and a third signal. The second signal is made variable in accordance with an output frequency. The third signal is made variable. The second unit outputs the data to an outside in accordance with the first to third signals. The second unit includes a buffer unit including first to third transistors. The output frequency includes a first frequency and a second frequency. If the first to third transistors output the data to the outside in synchronization with the second frequency, the first to third transistors may be turned on regardless of a value of the first control signal. | 05-03-2012 |
20120106255 | VOLTAGE GENERATION CIRCUIT WHICH IS CAPABLE OF REDUCING CIRCUIT AREA - According to one embodiment, a voltage generation circuit includes a first boost circuit, a first output circuit, a rectifying circuit, a second output circuit, and a detection circuit. The first boost circuit outputs a first voltage in first and second operation modes. The first output circuit is connected to the first boost circuit, and outputs the first voltage as a second voltage in the first operation mode. The rectifying circuit is connected to the first boost circuit, and outputs a third voltage which is lower than the first voltage in the first operation mode. The second output circuit short-circuits the rectifying circuit in the second operation mode, and outputs the first voltage as a fourth voltage. The detection circuit detects the second and fourth voltages which are supplied from the first and second output circuits. | 05-03-2012 |
20120106256 | ELECTRONIC CIRCUIT WITH A FLOATING GATE TRANSISTOR AND A METHOD FOR DEACTIVATING A FLOATING GATE TRANSISTOR TEMPORARILY - An electronic circuit includes a floating gate transistor with a floating gate capacitor. The floating gate transistor can be programmed to be in an ON or an OFF state by charging the floating gate capacitor. The circuit further includes a deactivation capacitor adapted to store a charge sufficient for deactivating the floating gate transistor temporarily. The deactivation capacitor is connectable in series to the floating gate capacitor. A method for deactivating a floating gate transistor temporarily is provided, wherein the floating gate transistor includes a floating gate capacitor. A deactivation capacitor is charged with a charge sufficient for changing the state of the floating gate transistor temporarily. The deactivation capacitor is connected in series to the floating gate capacitor for deactivating the floating gate transistor. | 05-03-2012 |
20120113722 | Selecting programming voltages in response to at least a data latch in communication with a sense amplifier - Memory devices and methods of programming memory cells including selecting a voltage to apply to a control gate of the memory cell during programming of a data value of a sense amplifier to the memory cell in response to at least a data value contained in a data latch that is in communication with the sense amplifier. | 05-10-2012 |
20120120728 | NON-VOLATILE MEMORY DEVICE - A non-volatile memory device is provided, including a substrate formed of a single crystalline semiconductor, pillar-shaped semiconductor patterns extending perpendicular to the substrate, a plurality of gate electrodes and a plurality of interlayer dielectric layers alternately stacked perpendicular to the substrate, and a charge spread blocking layer formed between the plurality of gate electrodes and the plurality of interlayer dielectric layers. | 05-17-2012 |
20120127798 | METHOD AND APPARATUS FOR SHARING INTERNAL POWER SUPPLIES IN INTEGRATED CIRCUIT DEVICES - A method, system and apparatus for sharing internal power supplies in integrated circuit devices is described. A multiple device integrated circuit | 05-24-2012 |
20120127799 | WRITE-PRECOMPENSATION AND VARIABLE WRITE BACKOFF - A technique for writing data is disclosed. The technique includes estimating an amount of additional voltage on a victim cell of a solid-state storage device caused by writing to one or more other cells in the solid-state storage device, determining a modified write value for the victim cell based at least in part on a desired value for the victim cell and the estimated amount of additional voltage, and writing the modified write value to the victim cell. | 05-24-2012 |
20120134213 | METHOD COMPENSATION OPERATING VOLTAGE, FLASH MEMORY DEVICE, AND DATA STORAGE DEVICE - Disclosed is a method generating a compensated operating voltage, such as a read voltage, in a non-volatile memory device, and a related non-volatile memory device. The operating voltage is compensated in response to one or more memory cell conditions such as temperature variation, programmed data state or physical location of a selected memory cell, page information for selected memory cell, or the location of a selected word line. | 05-31-2012 |
20120140560 | METHOD AND MEMORY CONTROLLER FOR READING DATA STORED IN FLASH MEMORY BY REFERRING TO BINARY DIGIT DISTRIBUTION CHARACTERISTICS OF BIT SEQUENCES READ FROM FLASH MEMORY - An exemplary method for reading data stored in a flash memory includes: controlling the flash memory to perform a plurality of read operations upon each of a plurality of memory cells included in the flash memory; obtaining a plurality of bit sequences read from the memory cells, respectively, wherein the read operations read bits of a predetermined bit order from each of the memory cells as one of the bit sequences by utilizing different control gate voltage settings; and determining readout information of the memory cells according to binary digit distribution characteristics of the bit sequences. | 06-07-2012 |
20120140561 | MEMORY DEVICE CAPABLE OF IMPROVING WRITE PROCESSING SPEED AND MEMORY CONTROL METHOD - According to one embodiment, a memory device includes a memory unit, a first storage unit, a second storage unit, a third storage unit, a data move unit, and a controller. The first storage unit stores a logical address and an intermediate address. The second storage unit stores the intermediate address and the physical address corresponding to the intermediate address. The third storage unit stores a flag corresponding to the logical address and the intermediate address. The flag represents whether read of latest data by a read operation has succeeded. When the flag stored in the third storage unit represents a success of the read of the latest data, the controller determines whether write has been done for the same logical address of the memory unit during the data move processing, and if the write has been done, invalidates the data move processing. | 06-07-2012 |
20120140562 | NONVOLATILE MEMORY DEVICE AND METHOD OF MAKING THE SAME - A nonvolatile memory device includes a substrate, a structure including a stack of alternately disposed layers of conductive and insulation materials disposed on the substrate, a plurality of pillars extending through the structure in a direction perpendicular to the substrate and into contact with the substrate, and information storage films interposed between the layers of conductive material and the pillars. In one embodiment, upper portions of the pillars located at the same level as an upper layer of the conductive material have structures that are different from lower portions of the pillars. In another embodiment, or in addition, upper string selection transistors constituted by portions of the pillars at the level of an upper layer of the conductive material are programmed differently from lower string selection transistors. | 06-07-2012 |
20120140563 | PUMP CIRCUIT AND SEMICONDUCTOR MEMORY DEVICE INCLUDING THE SAME - A pump circuit includes a plurality of clock control circuits configured to transfer a clock to respective output terminals in response to respective pump-off signals or block the clock from being transferred to the respective output terminals, a plurality of charge pumps configured to generate respective high voltages by performing respective pumping operations in response to respective clock signals of the output terminals, and a plurality of switching circuits configured to transfer the respective high voltages to a final output terminal in response to respective control signals. | 06-07-2012 |
20120140564 | NON-VOLATILE ONE-TIME-PROGRAMMABLE AND MULTIPLE-TIME PROGRAMMABLE MEMORY CONFIGURATION CIRCUIT - A programmable non-volatile configuration circuit uses a pair of non-volatile memory devices arranged in a pull-up and pull-down arrangement. The non-volatile memory devices have floating gates that overlaps a variable portion of a source/drain region. This allows a programming voltage for the device to be imparted to the floating gate through variable capacitive coupling, thus changing the state of the device. The invention can be used in environments to store configuration data for programmable logic devices, field programmable arrays, and many other applications. | 06-07-2012 |
20120140565 | Scalable Electrically Eraseable And Programmable Memory - A non-volatile memory including one or more EEPROM cell pairs. Each EEPROM cell pair includes three transistors and stores two data bits, effectively providing a 1.5 transistor EEPROM cell. An EEPROM cell pair includes a first non-volatile memory transistor connected to a first bit line, a second non-volatile memory transistor connected to a second bit line, and a source access transistor coupled to common source line. The source access transistor includes: a first diffusion region continuous with a source region of the first non-volatile memory transistor and a second diffusion region continuous with a source region of the second non-volatile memory transistor. | 06-07-2012 |
20120147677 | BIASING SYSTEM AND METHOD - Embodiments are provided that include a memory system that includes a memory system, having an access device coupled between a global line and a local line and a voltage source coupled to the global line and configured to output a bias voltage on the global line when the memory system is in a non-operation state. The access device is selected when the memory system is in the non-operation state, and the access device is deselected when the memory system is in an other state. Further embodiments provide, for example, a method that includes coupling a global access line to a local access line, biasing the local access line to a voltage other than a negative supply voltage while a memory device is in a first state and uncoupling the global access line from the local access line while the memory device is in an other state. | 06-14-2012 |
20120155181 | Method and Apparatus for Reducing Read Disturb in Memory - Various aspects of a NAND memory include have multiple versions of a high threshold voltage distribution—a version with a reduced maximum, and another version. The version with a reduced maximum has a reduced word line pass voltage. | 06-21-2012 |
20120163084 | Early detection of degradation in NAND flash memory - Techniques for early detection of degradation in NAND Flash memories by measuring the dispersion of the threshold voltages (VT's), of a set (e.g. page) of NAND Flash memory cells during read operations are described. In an embodiment of the invention the time-to-completion (TTC) values for the read operation for the memory cells are used as a proxy for dispersion of the threshold voltages (VT's). A Dispersion Analyzer determines the dispersion of the set of TTC values. In one embodiment the delta between the maximum and minimum TTC values is used as the dispersion measurement. If the measured TTC dispersion differs by more than a selected amount from a reference dispersion value, a warning signal is provided to indicate that the page of memory has degraded. The warning signal can be used to take appropriate action such as moving the data to a new page. | 06-28-2012 |
20120163085 | Non-Volatile Memory And Methods With Soft-Bit Reads While Reading Hard Bits With Compensation For Coupling - A non-volatile memory has its cells' thresholds programmed within any one of a first set of voltage bands partitioned by a first set of reference thresholds across a threshold window. Hard bits are obtained when read relative to the first set of reference thresholds. The cells are read at a higher resolution relative to a second set of reference thresholds so as to provide additional soft bits for error correction. The soft bits are generated by a combination of a first modulation of voltage on a current word line WLn and a second modulation of voltage on an adjacent word line WLn+1, as in a reading scheme known as “Direct-Lookahead (DLA)”. | 06-28-2012 |
20120163086 | CONCURRENT OPERATION OF PLURAL FLASH MEMORIES - A device comprises an address storage device. A first circuit includes a first flash memory, configured to sequentially receive first and second addresses and store the first address in the address storage device. The first circuit has a first set of control inputs for causing the first circuit to perform a first operation from the group consisting of read, program and erase on a cell of the first flash memory corresponding to a selected one of the first and second addresses. A second circuit includes a second flash memory, configured to receive the second address. The second circuit has a second set of control inputs for causing the second circuit to read data from a cell of the second flash memory corresponding to the second address while the first operation is being performed. | 06-28-2012 |
20120163087 | Decoder for Nand Memory - An integrated circuit device has multiple blocks of NAND memory cells, and a high voltage switch. The high voltage switch is coupled to a decoder output and the blocks of NAND memory cells. The high voltage switch has an output voltage range with positive and negative voltages. | 06-28-2012 |
20120163088 | SEMICONDUCTOR MEMORY DEVICE AND CONTROL METHOD THEREFOR - According to one embodiment, a semiconductor memory device includes a memory cell array including memory cells, each of which is arranged at a position of between a word line and a bit line, a row decoder, and a bit line control circuit. And when data is to be read out from the memory cell, a charge control circuit controls the gate voltages of a first transistor, a second transistor, a third transistor, and a fourth transistor, respectively, so that the bit line is charged in accordance with a first characteristic obtained by increasing a current driving capacity of the first transistor during a desired period after start of charge of the bit line, and the bit line is then charged in accordance with a second characteristic obtained by returning the current driving capacity of the first transistor to the lower current driving capacity after elapse of the desired period. | 06-28-2012 |
20120163089 | METHOD FOR WRITING DATA IN SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE DEVICE - A method for writing data in a semiconductor storage device and a semiconductor storage device are provided, that can reduce variations in readout current from a sub storage region which serves as a reference cell for the memory cells of the semiconductor storage device, thereby preventing an improper determination from being made when determining the readout current from a memory cell. In the method, data is written on a memory cell in two data write steps by applying voltages to the first and second impurity regions of the memory cell, the voltages being different in magnitude from each other. | 06-28-2012 |
20120163090 | INFORMATION RECORDING/REPRODUCING DEVICE - According to one embodiment, an information recording/reproducing device includes a recording layer, and a recording circuit configured to record information by generating a phase change in the recording layer while applying a voltage to the recording layer. The recording layer comprises a compound including at least one type of cationic element, and at least one type of anionic element, at least the one type of cationic element is a transition element including a d orbital incompletely filled with electrons, and the average shortest distance between adjacent cationic elements is 0.32 nm or less, and the recording layer is provided with a material selected from (i) A | 06-28-2012 |
20120163091 | SEMICONDUCTOR MEMORY DEVICE WHICH STORES PLURAL DATA IN A CELL - A memory cell array is configured to have a plurality of memory cells arranged in a matrix, each of the memory cells being connected to a word line and a bit line and being capable of storing n values (n is a natural number equal to or larger than 3). A control circuit controls the potentials of the word line and bit line according to input data and writes data into a memory cell. The control circuit writes data into the memory cell to a k-valued threshold voltage (k<=n) in a write operation, precharges the bit line once, and then changes the potential of the word line an i number of times to verify whether the memory cell has reached an i-valued (i<=k) threshold voltage. | 06-28-2012 |
20120170371 | PROGRAMMING METHOD OF NON-VOLATILE MEMORY DEVICE - A programming method of a non-volatile memory device that includes a string of memory cells with a plurality of floating gates and a plurality of control gates disposed alternately, wherein each of the memory cells includes one floating gate and two control gates disposed adjacent to the floating gate and two neighboring memory cells share one control gate. The programming method includes applying a first program voltage to a first control gate of a selected memory cell and a second program voltage that is higher than the first program voltage to a second control gate of the selected memory cell, and applying a first pass voltage to a third control gate disposed adjacent to the first control gate and a second pass voltage that is lower than the first pass voltage to a fourth control gate disposed adjacent to the second control gate. | 07-05-2012 |
20120170372 | MEMORY DEVICE BIASING METHOD AND APPARATUS - Memory devices and methods are disclosed, such as those facilitating data line shielding by way of capacitive coupling with data lines coupled to a memory string source line. For example, alternating data lines are sensed while adjacent data lines are coupled to a common source line of the data lines being sensed. Data line shielding methods and apparatus disclosed can reduce effects of source line bounce occurring during a sense operation of a memory device. | 07-05-2012 |
20120176842 | Memory System - The present invention provides a memory system which contributes to improvement in efficiency of a data process accompanying a memory access. A memory system has a rewritable nonvolatile memory, a buffer memory, and a controller. The controller controls, in response to an access request from an external apparatus, first data transfer between the controller and the external apparatus, second data transfer between the controller and the nonvolatile memory, and third data transfer between the controller and the buffer memory, controls transfer from the controller to the buffer memory in the third data transfer and transfer from the buffer memory to the controller in a time sharing manner, and enables the first data transfer or the second data transfer to be performed in parallel with the transfer carried out in the time sharing manner. | 07-12-2012 |
20120182807 | Three-Dimensional Stacked and-Type Flash Memory Structure and Methods of Manufacturing and Operating the Same Hydride - A 3D stacked AND-type flash memory structure comprises several horizontal planes of memory cells arranged in a three-dimensional array, and each horizontal plane comprising several word lines and several of charge trapping multilayers arranged alternately, and the adjacent word lines spaced apart from each other with each charge trapping multilayer interposed between; a plurality of sets of bit lines and source lines arranged alternately and disposed vertically to the horizontal planes; and a plurality of sets of channels and sets of insulation pillars arranged alternatively, and disposed perpendicularly to the horizontal planes, wherein one set of channels is sandwiched between the adjacent sets of bit lines and source lines. | 07-19-2012 |
20120182808 | Memory Device, Manufacturing Method and Operating Method of the Same - A memory device, a manufacturing method and an operating method of the same are provided. The memory device includes a substrate, stacked structures, a channel element, a dielectric element, a source element, and a bit line. The stacked structures are disposed on the substrate. Each of the stacked structures includes a string selection line, a word line, a ground selection line and an insulating line. The string selection line, the word line and the ground selection line are separated from each other by the insulating line. The channel element is disposed between the stacked structures. The dielectric element is disposed between the channel element and the stacked structure. The source element is disposed between the upper surface of the substrate and the lower surface of the channel element. The bit line is disposed on the upper surface of the channel element. | 07-19-2012 |
20120182809 | Data State-Dependent Channel Boosting To Reduce Channel-To-Floating Gate Coupling In Memory - In a programming operation, selected storage elements on a selected word line are programmed while unselected storage elements on the selected word line are inhibited from programming by channel boosting. To provide a sufficient but not excessive level of boosting, the amount of boosting can be set based on a data state of the unselected storage element. A greater amount of boosting can be provided for a lower data state which represents a lower threshold voltage and hence is more vulnerable to program disturb. A common boosting scheme can be used for groups of multiple data states. The amount of boosting can be set by adjusting the timing and magnitude of voltages used for a channel pre-charge operation and for pass voltages which are applied to word lines. In one approach, stepped pass voltages on unselected word lines can be used to adjust boosting for channels with selected data states. | 07-19-2012 |
20120188823 | SEMICONDUCTOR DEVICE - A semiconductor device includes a charge pump circuit that generates a first voltage during a first period and a second voltage during a second period following the first period by a boosting operation, a load current application circuit that includes a first memory cell, and that applies the first voltage to the first memory cell, a memory circuit that includes a second memory cell, and that applies the second voltage to the second memory cell; and a voltage detection circuit that monitors a value of the first voltage to determine whether or not the first voltage is increased to the predetermined voltage, wherein the charge pump circuit stops the boosting operation if the first voltage is less than the predetermined voltage at an end of the first period. | 07-26-2012 |
20120195126 | CELL OPERATION MONITORING - Memory devices adapted to process and generate analog data signals representative of data values of two or more bits of information facilitate increases in data transfer rates relative to devices processing and generating only binary data signals indicative of individual bits. Programming of such memory devices includes programming to a target threshold voltage range representative of the desired bit pattern. Reading such memory devices includes generating an analog data signal indicative of a threshold voltage of a target memory cell. Atypical cell, block, string, column, row, etc. . . . operation is monitored and locations and type of atypical operation stored. Adjustment of operation is performed based upon the atypical cell operation. | 08-02-2012 |
20120201081 | SEMICONDUCTOR STORAGE DEVICE - The invention provides a semiconductor storage device which can restrain the uneven high voltage applied to the storage unit and can provide the high voltage with high precision. The semiconductor storage device includes a storage unit array, a Y decoder circuit, a X decoder circuit, a sense amplifier circuit, a Y gate circuit, a high voltage generating circuit, a high voltage regulator circuit, and a voltage adjusting circuit. The voltage modifying data for adjusting the potential of the anode of the zener diode so as to adjust the high voltage applied to the storage unit array is written into the storage unit array. The voltage modifying data is used to adjust voltage by the voltage adjusting circuit. | 08-09-2012 |
20120206969 | Memory Array - A memory array used in the field of semiconductor technology includes a plurality of memory cells, bit lines, word lines perpendicular to the bit lines, and first/second control lines. The memory array uses split-gate memory cells, wherein two memory bit cells of a memory cell share one word line, thereby the read, program and erase of the memory cell can be realized by applying different voltages to the word line, two control gates and source/drain regions; the word line sharing structure enables a split-gate flash memory to effectively reduce the chip area and avoid over-erase problems while maintaining electrical isolation performance of the chip unchanged and not increasing the complexity of the process. | 08-16-2012 |
20120206970 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, an interface includes first to third input circuits, delay and selection circuits. The first input circuit outputs an active first internal signal in response to an active first control signal received by a memory device. The second input circuit outputs an active second internal signal in response to an active second control signal received by the device while the device is receiving the active first control signal. The delay circuit outputs a selection signal in first or second states after the elapse of a first period from inactivation or activation of the first control signal. The selection circuit outputs the first and second internal signals as an enable signal while receiving the selection signal of the first and second states. The third input circuit outputs an input signal received from the outside from the interface to inside the device while receiving the active enable signal. | 08-16-2012 |
20120206971 | PROGRAMMABLE MEMORY DEVICE AND MEMORY ACCESS METHOD - A programmable memory device includes a plurality of one-time programmable (OTP) memory units, a search unit, a writing unit, and a reading unit. Each OTP memory unit is assigned an address. The search unit searches for the first writable OTP memory unit from the plurality of OTP memory units in a writing operation, or searches for the last programmed OTP memory unit from the plurality of OTP memory units in a reading operation. The writing unit writes data to be written and the bit length of the data to the first writable OTP memory unit. The reading unit sequentially reads data from the last programmed OTP memory unit. | 08-16-2012 |
20120213007 | CONTROLLING A NON-VOLATILE MEMORY - Controlling a non-volatile memory. The non-volatile memory includes a plurality of memory cells in an integrated circuit substrate. The non-volatile memory also includes a high-voltage node in power-transmissive communication with the plurality of memory cells. Further, the non-volatile memory includes an intermediate-voltage node in power-transmissive communication with the plurality of memory cells. Moreover, the non-volatile memory includes a counter-doped-gate device, coupled within the integrated circuit substrate, in power-transmissive communication between the high-voltage node and the intermediate-voltage node. | 08-23-2012 |
20120218823 | VOLTAGE GENERATION AND ADJUSTMENT IN A MEMORY DEVICE - Voltage generation devices and methods are useful in determining a data state of a selected memory cell in a memory device. Voltages applied to an access line coupled to a selected memory cell can be determined at least partially in response to a sensed operating characteristic of the memory device, such as operating temperature, and to a particular data state to be determined in the selected memory cell. | 08-30-2012 |
20120218824 | INDEPENDENT WELL BIAS MANAGEMENT IN A MEMORY DEVICE - Methods for programming a memory device, memory devices configured to perform the disclosed programming methods, and memory systems having a memory device configured to perform the disclosed programming methods, for example, are provided. According to at least one such method, multiple independent semiconductor well regions each having strings of memory cells are independently biased during a programming operation performed on a memory device. Reduced charge leakage may be realized during a programming operation in response to independent well biasing methods. | 08-30-2012 |
20120218825 | WORDLINE VOLTAGE TRANSFER APPARATUS, SYSTEMS, AND METHODS - The apparatus and systems described herein may comprise a plurality of memory cells coupled to a local wordline, and a wordline drive circuit that includes a regulator coupled to a plurality of pass transistors and a string driver. The regulator may comprise a regulator transistor having a threshold voltage that is substantially the same as the threshold voltage of the string driver during memory cell program operations. In some embodiments, the regulator may comprise a cascode-connected pair of transistors. Methods of manufacturing and operating the apparatus and systems are also described. | 08-30-2012 |
20120224428 | CHARGE PUMP OPERATION IN A NON-VOLATILE MEMORY DEVICE - A charge pump in a memory device is activated to produce a programming voltage prior to data loading during a programming operation. During an initial programming cycle, first and second load voltages are charged from the charge pump. The first load is removed from the charge pump during a verify operation. The first load voltage is subsequently recharged by charge sharing from the second load voltage so that the charge pump is not initially necessary for recharging the first load voltage. | 09-06-2012 |
20120230108 | MEMORY DEVICE WITH MULTIPLE PLANES - Disclosed herein is a device that comprises at least one selection/non-selection voltage receiving line, at least one word line operatively coupled to the selection/non-selection voltage receiving line, and a plurality of memory cells coupled to the word line; a selection voltage source line; and a selection voltage supply circuit comprising a first switch circuit and a first driver circuit driving the first switch circuit to be turned ON or OFF, the first switch circuit including a first node coupled to the selection voltage source line, a second node coupled to the selection/non-selection voltage receiving line of the first memory plane and a third node coupled to the selection/non-selection voltage receiving line of the second memory plane, and the first driver circuit being provided in common to the first and second memory planes. | 09-13-2012 |
20120230109 | Method of Setting Trim Codes for a Flash Memory and Related Device - A flash memory device with auto-trimming functionality includes a memory cell array comprising first memory cells and a fuse sector, a read circuit for reading a memory state of the first memory cells, an offset circuit for outputting offset current values, and an auto-trimming circuit. The auto-trimming circuit has a register for storing a current characteristic, a current control module for modifying input current applied to a first memory cell under test at a first address according to the memory state, and updating the current characteristic to the modified input current, an address counter for starting application of the modified input current to a second memory cell at a second address for test when reading the first memory cell passes, and a programming circuit for programming the fuse sector according to the current characteristic and the offset current values. | 09-13-2012 |
20120230110 | METHOD AND APPARATUS FOR ADDRESSING MEMORY ARRAYS - The present description relates to non-volatile memory arrays and the operation thereof In at least one embodiment, the non-volatile memory array may include a plurality of memory modules coupled in a daisy chain with enable in/out signals, and a single chip enable signal coupled in parallel to each memory module. With such a configuration, all memory units within each of the memory modules of each memory array may be addressed with the single chip enable | 09-13-2012 |
20120230111 | LEVEL SHIFTING CIRCUIT - A level shifting circuit having an input and an output where the level shifting circuit is configured to receive a logical high level having a first voltage level at the input and to output a logical high level having a second voltage level at the output where the second voltage level is higher than the first voltage level. Level shifting circuit embodiments having two or more parallel coupled depletion mode transistors coupled to a high voltage source and further coupled to the output by an enhancement mode transistor, and an additional transistor coupled between a first signal and the output of the level shifting circuit where the first signal has the same logic level of the input are disclosed. | 09-13-2012 |
20120230112 | NONVOLATILE MEMORY DEVICE, DRIVING METHOD THEREOF, AND MEMORY SYSTEM HAVING THE SAME - A nonvolatile memory device (NVM), memory system and apparatus include control logic configured to perform a method of applying negative voltage on a selected wordline of the NVM. During a first time a first high voltage level is applied to the channel of a transistor of a address decoder and a ground voltage is applied to the well of the transistor. And, during a second time a second high voltage level is applied to the channel of the transistor, and within the second time interval a first negative voltage is applied to the well of the transistor. The first high voltage level is higher than the second high voltage level, and a voltage applied on the selected wordline is negative within the second time interval. | 09-13-2012 |
20120236648 | ELECTRICALLY ADDRESSED NON-VOLATILE MEMORY MAINTENTANCE - An electrically addressed non-volatile memory is maintained by measuring a voltage threshold for each selected memory cell in the electrically addressed non-volatile memory. The voltage threshold is a voltage around which a controllable voltage signal applied to a control gate of a selected memory cell produces a change in value read from the selected memory cell. A measured voltage threshold distribution of the measured voltage thresholds is generated for the selected memory cells. The voltage threshold distribution is analyzed to identify memory cells having greater probabilities of read errors, for example. In response to the analysis, an operating parameter that affects the memory cells identified as having greater probabilities of read errors is selectively changed. | 09-20-2012 |
20120236649 | HOT CARRIER PROGRAMMING OF NAND FLASH MEMORY - A NAND memory device includes strings of NAND memory cells, where each memory cell includes a charge trapping structure formed over a lightly-doped substrate region. A selected one of the NAND memory cells can be programmed by application of a relatively low program voltage in combination with a previously-applied set-up voltage, which is applied to the substrate for initiating inversion. The inversion in the substrate causes electrons to become hot in the channel regions, including the channel of the selected memory cell. As a result, the relatively lower program voltage can be used at the control gate of the selected memory cell for sufficiently energizing hot electrons to tunnel into the charge trapping structure of the selected memory cell. | 09-20-2012 |
20120236650 | NAND ARCHTECTURE INCLUDING RESITIVE MEMORY CELLS - A non-volatile memory device includes a first select transistor, a second select transistor, and a first string of first memory cells provided between the first and second select transistors. Each first memory cell has a first resistive memory cell and a first transistor. The first resistive memory cell is in series with a gate of the first transistor. The non-volatile memory device further includes a first bit line coupled to a drain of the first select transistor and a plurality of word lines. Each word line is coupled to one of the first memory cells. | 09-20-2012 |
20120236651 | SYSTEM AND METHOD FOR DETERMINING DATA DEPENDENT NOISE CALCULATION FOR A FLASH CHANNEL - Disclosed is an system and method for determining a probability that a memory cell was programmed to a certain input level. An output level is received from a memory cell and a probability is determined that the output level corresponds to each of a plurality of programming levels. Each probability is determined as a function of the output level, a mean value of a distribution corresponding to the programming level, and a variance from the mean value with the variance being determined by a relative position of the output level with respect to the mean value. A probability value is generated as a function of the plurality of determined probabilities and then provided for use at a demodulator. | 09-20-2012 |
20120236652 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, a nonvolatile semiconductor memory device includes a first memory string including a first memory cell and a second memory cell aligned along a first axis, a source contact provided at a source-side end of the first memory string, a second memory string that extends along the first axis and includes a third memory cell that aligns with the first memory cell along a second axis perpendicular to the first axis, and a shield conductive layer. The shield conductive layer extends along the first axis between the first memory string and the second memory string and is electrically connected to the source contact. | 09-20-2012 |
20120243318 | NON-VOLATILE MEMORY PROGRAMMING - Some embodiments include a memory device and a method of programming memory cells of the memory device. One such method can include applying a signal to a line associated with a memory cell, the signal being generated based on digital information. The method can also include, while the signal is applied to the line, determining whether a state of the memory cell is near a target state when the digital information has a first value, and determining whether the state of the memory cell has reached the target state when the digital information has a second value. Other embodiments including additional memory devices and methods are described. | 09-27-2012 |
20120243319 | NONVOLATILE SEMICONDCUTOR MEMORY DEVICE, IC CARD AND PORTABLE APPARATUS - According to one embodiment, a nonvolatile semiconductor memory device includes a first nonvolatile memory, and a voltage generation circuit configured to apply a voltage to the first nonvolatile memory, the voltage generation circuit includes a charge pump and an oscillator configured to generate a clock to be used to operate the charge pump. The voltage generation circuit changes a frequency of the clock. | 09-27-2012 |
20120243320 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes a plurality of memory cells, a logic gate chain, and a counter. The memory cells are capable of retaining data and are associated with the columns. The logic gate chain includes a plurality of logic gates associated with the columns. Each of the logical gates outputs a logical level to a next-stage logical gate in the series connection. The logic level indicates presence or absence of verify-failure in the associated column. The counter counts the number of output times of the logic level indicating the presence of the verify-failure in a final-stage logic gate of the series connection. A content indicated by the logic level output from each of the logic gates is inverted at a boundary of the logic gate associated with the column having the verify-failure in the logic gate chain. | 09-27-2012 |
20120243321 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, there is provided a semiconductor memory device including a memory cell array, a storage unit, a selection unit, a startup processing unit, and an operation control unit. The memory cell array includes memory cells. The storage unit stores a plurality of operating parameters. The selection unit accesses the storage unit and selects a first operating parameter for operating the memory cells from among the plurality of operating parameters stored in the storage unit, based on a first instruction input. The startup processing unit performs a power startup and reads out the first operating parameter from the storage unit and sets the first operating parameter so as to be ready for use, based on a second instruction input. The operation control unit uses the first operating parameter set by the startup processing unit in order to operate the memory cells. | 09-27-2012 |
20120243322 | SEMICONDUCTOR INTEGRATED CIRCUIT ADAPTED TO OUTPUT PASS/FAIL RESULTS OF INTERNAL OPERATIONS - In a semiconductor integrated circuit, an internal circuit is capable of executing a first operation and a second operation concurrently, and an output circuit outputs to the outside of the semiconductor integrated circuit information indicating whether or not the first operation is being executed and information indicating whether or not the second operation is executable. | 09-27-2012 |
20120250416 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes: a memory cell array including plural memory cells; a first word line connected to a control gate of a first memory cell; a second word line connected to a control gate of a second memory cell and neighboring the first word line on one side; a third word line connected to a control gate of a third memory cell and neighboring the first word line on the opposite side to the one side; and a control circuit configured to read data from the first word line under a condition in which the memory cell connected to the second word line holds data while the memory cell connected to the third word line does not hold data, and to set a first voltage applied to the third word line to be lower than a second voltage applied to the second word line. | 10-04-2012 |
20120250417 | HOT ELECTRON INJECTION NANOCRYSTALS MOS TRANSISTOR - The disclosure relates to a hot electron injection MOS transistor, comprising source and drain regions formed in a semiconductor substrate, a control gate, and a floating gate comprising electrically conductive nanoparticles. The control gate comprises a first portion arranged at a first distance from the substrate, a second portion arranged at a second distance less than the first distance from the substrate, and an intermediary portion linking the first and the second portions. | 10-04-2012 |
20120257453 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to one embodiment of the present invention includes: a memory cell array and a control circuit. The control circuit executes a first reading operation and a second reading operation. The first reading operation is an operation of reading a threshold voltage set in the selected memory cell by setting a voltage between a control gate electrode and source of the selected memory cell to a first value. The second reading operation is an operation of reading a threshold voltage set in the selected memory cell by setting a voltage between the control gate electrode and source of the selected memory cell to a second value lower than the first value. When executing the second reading operation, the control circuit keeps a voltage of the control gate electrode of the selected memory cell to 0 or a positive value. | 10-11-2012 |
20120257454 | FLASH STORAGE DEVICE WITH DATA INTEGRITY PROTECTION - A flash storage device includes a power hold circuit including a double layer capacitor. A power source supplies power to the flash storage device and charges the double layer capacitor. The double layer capacitor supplies power for maintaining integrity of data during a data transfer occurring in the flash storage device when the power supplied by the power source is disrupted. Additionally, the flash storage device can inhibit subsequent data transfers until the power supplied by the power source is restored. | 10-11-2012 |
20120262991 | METHODS AND DEVICES FOR DETERMINING SENSING VOLTAGES - The present disclosure includes methods and devices for determining sensing voltages. One such method includes comparing data associated with a number of template distributions to data associated with a first threshold voltage distribution and a second threshold voltage distribution associated with a number of memory cells programmed to particular adjacent program states, determining an intersection of the first and second threshold voltage distributions based on a template distribution of the number template distributions which most closely compares to the first and second threshold voltage distributions, and using the determined intersection to determine a sensing voltage used to sense the number of memory cells programmed to the particular adjacent program states. | 10-18-2012 |
20120262992 | SEMICONDUCTOR DEVICE INCLUDING MULTI-CHIP - In order to implement a memory having a large storage capacity and a reduced data retention current, a non-volatile memory, an SRAM, a DRAM, and a control circuit are modularized into one package. The control circuit conducts assignment of addresses to the SRAM and DRAM, and stores data that must be retained over a long period of time in the SRAM. In the DRAM, a plurality of banks are divided into two sets, and mapped to the same address space, and sets are refreshed alternately. A plurality of chips of them are stacked and disposed, and wired by using the BGA and chip-to-chip bonding. | 10-18-2012 |
20120268997 | NONVOLATILE SEMICONDUCTOR DEVICE - A nonvolatile memory device includes a plurality of global word lines, a voltage pump configured to generate a plurality of voltages, a control unit configured to divide the plurality of global word lines into a first group and a second group in response to an input row address and generate control signals, a first selection unit configured to output at least two different voltages that are to be applied to global word lines of the first group, a second selection unit configured to output a voltage that is to be applied to global word lines of the second group, and a third selection unit configured to apply output voltages of the first selection unit to the global word lines of the first group, and apply an output voltage of the second selection unit to the global word lines of the second group. | 10-25-2012 |
20120268998 | Flash Memory Device and Method for Handling Power Failure Thereof - A flash memory device. In one embodiment, the flash memory device comprises a flash memory, a diode, a controller, and a capacitor. The flash memory has a voltage source pin. The diode is coupled between a voltage source and the voltage source pin of the flash memory. The controller is coupled to the flash memory via a data bus. The capacitor is coupled between the voltage source pin of the flash memory and a ground, and supplies power to the flash memory to enable the flash memory to complete writing of at least one data page when the level of the voltage source is lowered. | 10-25-2012 |
20120275228 | INTERNAL WORDLINE CURRENT LEAKAGE SELF-DETECTION METHOD, DETECTION SYSTEM AND COMPUTER-READABLE STORAGE MEDIUM FOR NOR-TYPE FLASH MEMORY DEVICE - A wordline internal current leakage self-detection method, system and a computer-readable storage medium thereof employ the originally existed high voltage supply unit and the voltage detector connected to the wordline in the flash memory device, in which the high voltage supply unit applies the test signal to the selected wordline, and the voltage detector detects the voltage signal of the wordline. By comparing the test signal with the voltage signal, the wordline will be indicated as current leakage when the voltage signal is lower than the test signal. | 11-01-2012 |
20120275229 | APPARATUS AND METHOD FOR EXTERNAL CHARGE PUMP ON FLASH MEMORY MODULE - A memory module is provided. The memory module includes die packages and a charge pump that is external the die packages. Each die package includes a flash memory device, and each of the flash memory devices includes bit lines and memory cells coupled to the bit lines. The charge pump provides a charge pump voltage that is selectively provided to the bit lines in each flash memory device in each of the die packages. | 11-01-2012 |
20120275230 | METHOD OF STORING DATA ON A FLASH MEMORY DEVICE - Methods and apparatus are disclosed, such as those involving a flash memory device. One such method includes storing data on memory cells on a memory block including a plurality of word lines and a plurality of memory cells on the word lines. The word lines comprising one or more bottom edge word lines, one or more top edge word lines, and intermediate word lines between the bottom and top edge word lines. The data is stored first on memory cells on the intermediate word lines. Then, a remaining portion, if any, of the data is stored on memory cells on the bottom edge word lines and/or the top edge word lines. This method enhances the life of the flash memory by preventing a premature failure of memory cells on the bottom or top edge word lines, which can be more prone to failure. | 11-01-2012 |
20120281476 | MEMORY APPARATUS AND METHODS - Embodiments of apparatus and methods having a memory device can include a line to exchange information with a string of memory cells and a transistor coupled between the string of memory cells and the line. Such a memory device can also include a module configured to couple a gate of the transistor to a node during a first time interval of a memory operation and decouple the gate from the node during a second time interval of the memory operation. Additional apparatus and methods are described. | 11-08-2012 |
20120281477 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes a memory cell array includes a plurality of cell units each composed of a plurality of memory cells which are arranged at intersections of a plurality of bit lines and a plurality of word lines and whose current paths are connected in series and select transistors each connected to either end of the series connection, a voltage generator circuit which generates a voltage applied to the memory cell array, and a control circuit which controls the memory cell array and the voltage generator circuit. | 11-08-2012 |
20120281478 | THERMALLY ASSISTED FLASH MEMORY WITH DIODE STRAPPING - A memory includes an array of memory cells including rows and columns. The memory includes circuitry coupled to the word lines applying a first bias voltage to a first set of spaced-apart locations on a word line or word lines in the array, while applying a second bias voltage different than the first bias voltage, to a second set of spaced-apart locations on the word line or word lines, locations in the first set of spaced-apart locations being interleaved among locations in the second set of spaced-apart locations, whereby current flow is induced between locations in the first and second sets of locations that cause heating of the word line or word lines. | 11-08-2012 |
20120287717 | FLASH MEMORY DEVICE AND ASSOCIATED CHARGE PUMP CIRCUIT - A charge pump circuit comprises a first booster set, a second booster group, and a detecting circuit. The first booster set receives a supply voltage and generates a first output voltage. The detecting circuit generates a detecting signal depending on the voltage level of the first output voltage. The second booster group receives the supply voltage and generates the first output voltage or a second output voltage according to the detecting signal. The second booster group is composed of a plurality of booster sets connected in parallel, wherein each booster set comprises a plurality of charge pump stages and a plurality of switch units. The number of serially-connected charge pump stages of each booster set in the second booster group is controlled by the plurality of switch units according to the stable voltage levels of the first and second output voltages. | 11-15-2012 |
20120287718 | PROGRAMMING MEMORY CELLS - Methods for programming, memory devices, and methods for reading are disclosed. One such method for programming a memory device (e.g., an SLC memory device) includes encoding a two level data stream to a three level stream prior to programming the memory. | 11-15-2012 |
20120287719 | FLASH MEMORY DEVICE HAVING SEED SELECTOR CIRCUIT - A flash memory device includes a memory cell array, a seed selector circuit, and a randomizing and de-randomizing circuit. The memory cell array includes memory cells forming multiple pages. The seed selector circuit stores seeds corresponding to the multiple pages, respectively. The randomizing and de-randomizing circuit randomizes data to be stored in a selected page. Each page has a corresponding seed and includes multiple sectors having corresponding sector offset values and seed values generated from the seed corresponding to the page. The seed selector circuit selects a seed value from the seed values of the selected page based on a sector offset value indicating a sector of the selected page to which a column offset value, input with an access request, belongs. The randomizing and de-randomizing circuit randomizes data to be stored in the selected page based on the seed value selected by the seed selector circuit. | 11-15-2012 |
20120294087 | PROGRAM METHOD OF NONVOLATILE MEMORY DEVICE - A program method of a nonvolatile memory device includes applying a program voltage to a selected word line, applying a first pass voltage to at least one word line adjacent to the selected word line, applying at least one first middle voltage lower than the first pass voltage but higher than an isolation voltage to at least one word line adjacent to the word line receiving the first pass voltage, applying the isolation voltage to a word line adjacent to the word line receiving the first middle voltage, applying at least one second middle voltage higher than the isolation voltage but lower than a second pass voltage to at least one word line adjacent to the word line receiving the isolation voltage, and applying a second pass voltage to at least one word line adjacent to the word line receiving the second middle voltage. | 11-22-2012 |
20120294088 | MEMORY SEGMENT ACCESSING IN A MEMORY DEVICE - Bit lines of a memory segment are read at substantially the same time by coupling a selected memory segment and, at some of the data lines of any intervening segments, to respective data caches. The bit lines of the unselected memory segments that are not used to couple the selected segment to the data caches can be coupled to their respective source lines. | 11-22-2012 |
20120294089 | SEMICONDUCTOR MEMORY DEVICE CAPABLE OF MEMORIZING MULTIVALUED DATA - In a memory cell array, a plurality of memory cells connected to word lines and bit lines are arranged in a matrix. A data storage circuit is connected to the bit lines and stores write data. The data storage circuit includes at least one static latch circuit and a plurality of dynamic latch circuits when setting 2 | 11-22-2012 |
20120300552 | CHARGE PUMP CIRCUIT WITH FAST START-UP - A charge pump circuit ( | 11-29-2012 |
20120307562 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to an embodiment includes: a semiconductor substrate; a memory cell array including a plurality of memory cells, the memory cells being stacked on the semiconductor substrate; and a power supply circuit provided on the semiconductor substrate. The power supply circuit includes: a pump circuit configured to generate a voltage and supply the voltage to the memory cell array; a limiter circuit configured to output control signal for activating the pump circuit according to a comparison result between a voltage value of the output terminal and a first value; a capacitor configured to adjust a voltage of the output terminal; a boost circuit configured to charge the capacitor using a constant current based on the control signal; and a switch configured to stop a charge operation of the boost circuit. The capacitor is provided directly below the memory cell array. | 12-06-2012 |
20120307563 | NONVOLATILE MEMORY WITH BITLINE CAPACITIVE COUPLING COMPENSATION - A method of programming memory cells in a nonvolatile memory, includes applying a programming voltage to a first bitline and setting a second bitline in a floating state. The method further includes applying a compensation voltage to a shield conductive line coupled to the bitline set in the floating state, and setting in the floating state a shield conductive line coupled to the bitline receiving the programming voltage. The method is applicable to the reduction of the parasitic programming phenomena of memory cells by capacitive coupling between bitlines. | 12-06-2012 |
20120314502 | PROGRAMMING NON-VOLATILE STORAGE WITH SYNCHONIZED COUPLING - A process for programming non-volatile storage is able to achieve faster programming speeds and/or more accurate programming through synchronized coupling of neighboring word lines. The process for programming includes raising voltages for a set of word lines connected a group of connected non-volatile storage elements. The set of word lines include a selected word line, unselected word lines that are adjacent to the selected word line and other unselected word lines. After raising voltages for the set of word lines, the process includes raising the selected word line to a program voltage and raising the unselected word lines that are adjacent to the selected word line to one or more voltage levels concurrently with the raising the selected word line to the program voltage. The program voltage causes at least one of the non-volatile storage elements to experience programming. | 12-13-2012 |
20120314503 | COARSE AND FINE PROGRAMMING IN A SOLID STATE MEMORY - Memory devices adapted to receive and transmit analog data signals representative of bit patterns of two or more bits facilitate increases in data transfer rates relative to devices communicating data signals indicative of individual bits. Programming of such memory devices includes initially programming a cell with a coarse programming pulse to move its threshold voltage in a large step close to the programmed state. The neighboring cells are then programmed using coarse programming. The algorithm then returns to the initially programmed cells that are then programmed with one or more fine pulses that slowly move the threshold voltage in smaller steps to the final programmed state threshold voltage. | 12-13-2012 |
20120320680 | METHOD, APPARATUS, AND MANUFACTURE FOR STAGGERED START FOR MEMORY MODULE - A method, apparatus, and manufacture for memory device startup is provided. Flash memory devices are configured such that, upon the power supply voltage reaching a pre-determined level, each flash memory is arranged to load the random access memory with instructions for the flash memory, and then execute a first portion of the instructions for the flash memory. After executing the first portion of the instructions for the flash memory, each separate subset of the flash memories waits for a separate, distinct delay period. For each flash memory, after the delay period expires for that flash memory, the flash memory executes a second portion of the instructions for the flash memory. | 12-20-2012 |
20120320681 | REDUCING THE PROGRAMMING CURRENT FOR MEMORY MATRICES - A sector of an electrically programmable non-volatile memory includes memory cells connected to word lines and to bit lines, each cell including at least one transistor having a gate connected to a word line, a drain connected to a bit line and a source connected to a source line. The sector includes at least two distinct wells insulated from one another, each including a number of cells of the sector, being able to take different potentials, and in that the sector has at least one bit line electrically linked to the drain of at least two cells mounted on two distinct wells. | 12-20-2012 |
20130016563 | MEMORY CIRCUITAANM OSANAI; JunAACI Chiba-shiAACO JPAAGP OSANAI; Jun Chiba-shi JPAANM Hirose; YoshitsuguAACI Chiba-shiAACO JPAAGP Hirose; Yoshitsugu Chiba-shi JPAANM Tsumura; KazuhiroAACI Chiba-shiAACO JPAAGP Tsumura; Kazuhiro Chiba-shi JPAANM Inoue; AyakeAACI Chiba-shiAACO JPAAGP Inoue; Ayake Chiba-shi JP - Provided is a memory circuit in which erroneous writing is less likely to occur at the time of power-on. A memory circuit ( | 01-17-2013 |
20130028022 | DYNAMIC PROGRAM WINDOW DETERMINATION IN A MEMORY DEVICE - Methods for determining a program window and memory devices are disclosed. One such method for determining the program window measures an amount of program disturb experienced by a particular state and determines the program window responsive to the amount of program disturb. | 01-31-2013 |
20130028023 | APPARATUSES AND METHODS INCLUDING MEMORY ARRAY AND DATA LINE ARCHITECTURE - Some embodiments include apparatus and methods having memory cells located in different device levels of a device, at least a portion of a transistor located in a substrate of the device, and a data line coupled to the transistor and the memory cells. The data line can be located between the transistor and the memory cells. Other embodiments including additional apparatus and methods are described. | 01-31-2013 |
20130028024 | APPARATUSES AND METHODS INCLUDING MEMORY ARRAY DATA LINE SELECTION - Some embodiments include an apparatus having data lines coupled to memory cell strings and a selector configured to selectively couple one of the data lines to a node. The memory cell strings and the selector can be formed in the same memory array of the apparatus. Other embodiments including additional apparatus and methods are described. | 01-31-2013 |
20130028025 | NONVOLATILE MEMORY DEVICE AND RELATED METHOD OF OPERATION - A flash memory device comprises alternately arranged odd and even memory cells. The odd and even memory cells are connected to corresponding odd and even bitlines, which are connected to corresponding odd and even page buffers. In a read operation of the flash memory device, data is sensed at two different times via the odd and even bitlines. In certain embodiments, data is read from the odd page buffers while data is being sensed via the even bit lines, or vice versa. | 01-31-2013 |
20130033935 | MEMORY DIE SELF-DISABLE IF PROGRAMMABLE ELEMENT IS NOT TRUSTED - Techniques are disclosed herein for automatically self-disabling a memory die in the event that a programmable element on the memory die for indicating whether the memory die is defective cannot be trusted. Memory die are provided with chip enable circuitry to allow particular memory die to be disabled. If the programmable element can be trusted, the state of the programmable element is provided to the chip enable circuitry to enable/disable the memory die based on the state. However, if the programmable element cannot be trusted, then the chip enable circuitry may automatically disable the memory die. This provides a greater yield for multi-chip memory packages because packages having memory die with a programmable element that cannot be trusted can still be used. | 02-07-2013 |
20130044546 | DETERMINING SYSTEM LIFETIME CHARACTERISTICS - The present disclosure includes methods and systems for determining system lifetime characteristics. A number of embodiments include a number of memory devices and a controller coupled to the number of memory devices. The controller can be configured to perform a number of operations on the number of memory devices using a number of trim parameters at a testing level, and determine a system lifetime characteristic based, at least partially, on the number of operations performed on the number of memory devices using the number of trim parameters at the testing level. | 02-21-2013 |
20130044547 | DEVICE, METHOD AND COMPUTER READABLE PROGRAM FOR ACCESSING MEMORY CELLS USING SHORTENED READ ATTEMPTS - A device, a computer readable medium and a method that may include performing a shortened read attempt of multiple data memory cells that store data to provide an estimate of the data; wherein the shortened read attempt has a duration that is shorter than a duration of a full read attempt; performing a shortened read attempt of redundant memory cells that store redundant information to provide an estimate of the redundant information; wherein the estimate of the redundant information is indicative of an expected number of data memory cells that store a certain logic value; determining, based on the estimate of the data, an estimated number of data memory cells that store the certain logic value; comparing the expected number to the estimated number; and providing the estimate of the data as a read result if the expected number and the estimated number equal each other. | 02-21-2013 |
20130051149 | APPARATUSES AND METHODS OF REPROGRAMMING MEMORY CELLS - Apparatuses and methods for reprogramming memory cells are described. One or more methods for memory cell operation includes programming a number of memory cells such that each of the number of memory cells are at either a first program state or a second program state, the second program state having a first program verify voltage associated therewith; and reprogramming the number of memory cells such that at least one of the number of memory cells is reprogrammed to a third program state having a second program verify voltage associated therewith, wherein those of the number of memory cells having a threshold voltage less than the second program verify voltage represent a same data value. | 02-28-2013 |
20130051150 | Three-Dimensional NAND Memory With Stacked Mono-Crystalline Channels - A three-dimensional (3D) non-volatile memory (NVM) array including spaced-apart horizontally-disposed bitline structures arranged in vertical stacks, each bitline structures including a mono-crystalline silicon beam and a charge storage layer entirely surrounding the beam. Vertically-oriented wordline structures are disposed next to the stacks such that each wordline structure contacts corresponding portions of the charge storage layers. NVM memory cells are formed at each bitline/wordline intersection, with corresponding portions of each bitline structure forming each cell's channel region. The bitline structures are separated by air gaps, and each charge storage layer includes a high-quality thermal oxide layer that entirely covers (i.e., is formed on the upper, lower and opposing side surfaces of) each of the mono-crystalline silicon beams. The 3D NVM array effectively includes multiple NVM NAND string structures, where each NAND string structure is formed by multiple series-connected NVM memory cells disposed along an associated bitline structure. | 02-28-2013 |
20130051153 | FLOATING ADDRESSING OF AN EEPROM MEMORY PAGE - A method for electrically programming a non-volatile memory in which a programming cycle includes prior addressing of memory cells from an initial address corresponding to a first row and a column of a memory plane. The method may include addressing the memory cells in a second consecutive row when the end of the first row i is reached to store data on bits with consecutive and increasing addresses in two consecutive rows. | 02-28-2013 |
20130058166 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes memory cells, word lines, a driver circuit, and a control circuit. The memory cells are stacked above a semiconductor substrate, and each includes a charge accumulation layer and control gate. The word lines are coupled to the control gates. The driver circuit repeats a programming operation to write data in a memory cell coupled to a selected word line. In the programming operation, a first voltage is applied to the selected word line, a second voltage to a first unselected word line, and a third voltage to a second unselected word line. The control circuit steps up the first voltage and steps down the second voltage in repeating the programming. | 03-07-2013 |
20130058167 | SEMICONDUCTOR DEVICE USING CHARGE PUMP CIRCUIT - A semiconductor device including a plurality of capacitance units connected in parallel between a first voltage and a second voltage. Each of the plurality of capacitance units includes: a capacitance element connected with the first voltage; and a capacitance disconnecting circuit connected between the second voltage and the capacitance element. The capacitance disconnecting circuit includes a non-volatile memory cell with a threshold voltage changed based on a change of a leakage current which flows from the capacitance element, and blocks off the leakage current based on a rise of the threshold voltage of the non-volatile memory cell when the leakage current exceeds a predetermined value. | 03-07-2013 |
20130058168 | METHODS, DEVICES, AND SYSTEMS FOR DEALING WITH THRESHOLD VOLTAGE CHANGE IN MEMORY DEVICES - The present disclosure includes methods, devices, and systems for dealing with threshold voltage change in memory devices. A number of embodiments include an array of memory cells and control circuitry having sense circuitry coupled to the array. The control circuitry is configured to determine changes in threshold voltages (Vts) associated with the memory cells without using a reference cell, and adjust the sense circuitry based on the determined changes and without using a reference cell. | 03-07-2013 |
20130064014 | EEPROM MEMORY PROTECTED AGAINST BREAKDOWN OF CONTROL GATE TRANSISTORS - The disclosure relates to an electrically erasable and programmable memory comprising at least one word of memory cells with first and second control gate transistors in parallel to apply a control gate voltage to the memory cells of the word. The memory also comprises s first control circuit to supply a first control voltage to a control terminal of the first control gate transistor through a first current limiter, and a second control circuit to supply a second control voltage to a control terminal of the second control gate transistor through second current limiter. | 03-14-2013 |
20130064015 | METHOD OF BURN-IN TEST OF EEPROM OR FLASH MEMORIES - The disclosure relates to a method for testing an integrated circuit, comprising in a burn-in test mode, two steps during which gate oxides of conductive high voltage MOS transistors of the integrated circuit are subjected to a first test voltage, and blocked high voltage MOS transistors of the integrated circuit are subjected to a second test voltage, the first test voltage being set to a value higher than a high supply voltage supplied to the high voltage MOS transistors in a normal operating mode, to make the gate oxides of transistors considered as insufficiently robust break down, the second test voltage being set to a value lower than the first test voltage and which can be supported by the blocked transistors, the states of the transistors being changed between the two steps. | 03-14-2013 |
20130077405 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device in an embodiment includes a semiconductor layer, a memory cell array, word lines, bit lines, a source line, and a control circuit. The memory cell array has memory strings, each of the memory strings having memory cells. The word lines are connected to the control gates of the memory cells. The control circuit controls a voltage applied to the semiconductor layer, the control gates, the bit lines, and the source line. When executing a read operation, the control circuit begins application of a first voltage to the source line at a first time, the first voltage having a positive value. The control circuit begins application of a second voltage to unselected word lines at the first time or thereafter, the second voltage setting the memory cells to a conductive state regardless of retained data of the memory cells. | 03-28-2013 |
20130077406 | Flash Memory Device - A flash memory device is provided. The flash memory device includes a memory cell array and a pre-charge unit. The pre-charge unit, coupled to a plurality of bit lines corresponding with the memory cell array, pre-charges the bit lines to a predetermined voltage during a pre-charge stage. The pre-charge unit includes a voltage stabilizing unit to provide a constant current to the bit lines. Due to the voltage stabilizing unit, in a programming process, the voltage applied to the bit lines which are not related with programming may not drop as a result of current leakage. Therefore, the memory cells except the memory cell to be programmed are kept in cut off state, without a current passing. As a result, interference with the memory cells which are not to be programmed may be effectively avoided and the accuracy of programming may be improved. | 03-28-2013 |
20130083604 | APPARATUS AND METHOD FOR SMART VCC TRIP POINT DESIGN FOR TESTABILITY - An apparatus and method for testing is provided. An integrated circuit includes a comparison circuit that is arranged to trip based on a power supply signal reaching a trip point. The integrated circuit also includes an analog-to-digital converter that is arranged to convert the power supply signal into a digital signal. The integrated circuit also includes a storage component that stores a digital value associated with the digital signal, and provides the power supply value at an output pin of the integrated circuit. The integrated circuit includes a latch that is coupled between the analog-to-digital converter and the storage component. The latch is arranged to open when the comparison circuit trips, such that, when the comparison circuit trips, the storage component continues to store a digital value such that the digital value corresponds to the voltage associated with the power supply signal when the comparison circuit tripped. | 04-04-2013 |
20130083605 | MEMORY WITH WEIGHTED MULTI-PAGE READ - A memory device is described that provides increased output data to help evaluate data errors from bit line coupling and floating gate coupling during a read operation. Multiple rows, or pages, of data are read to allow an internal or external decoder to evaluate memory cell data. | 04-04-2013 |
20130088922 | SEMICONDUCTOR MEMORY DEVICE HAVING A PLURALITY OF CHIPS AND CAPABILITY OF OUTPUTTING A BUSY SIGNAL - One package contains a plurality of memory chips. Each memory chip has an I/O terminal which generates a busy signal. The busy signal enables a busy state when a power supply voltage value reaches a specified and guaranteed range after a power-on sequence. The busy signal maintains the busy state until completion of initialization operations for the plurality of memory chips. The busy signal releases the busy state after completion of all initialization operations for the plurality of memory chips. | 04-11-2013 |
20130094298 | STORAGE DEVICES WITH SOFT PROCESSING - A storage device includes a storage array having a group of storage elements. Each storage element can written to a discrete set of physical states. A read circuit selects one or more storage elements and generates, for each selected storage element, an analog signal representative of the physical state of the selected storage element. A signal processing circuit processes the analog signal to generate a plurality of outputs, with each output representing a degree of an association of the selected storage element with a different subset of one or more of the discrete set of physical states. | 04-18-2013 |
20130100740 | Compact Sense Amplifier for Non-Volatile Memory Suitable for Quick Pass Write - A compact and versatile sense amp is presented. Among its other features this sense amp arrangement provides a way to pre-charge bit lines while doing data scanning. Another feature is that the sense amp circuit can provide a way to set three different bit line levels used in the quick pass write (QPW) technique using dynamic latch, where quick pass write is a technique where cells along a given word line selected for programming can be enabled, inhibited, or partially inhibited for programming. Also, it can provide a convenient way to measure the cell current. | 04-25-2013 |
20130100741 | 3-D NONVOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME, AND MEMORY SYSTEM INCLUDING THE 3-D NONVOLATILE MEMORY DEVICE - A three-dimensional (3-D) nonvolatile memory device includes vertical channel layers protruded from a substrate, interlayer insulating layers and memory cells, which are alternately stacked along the vertical channel layers, and select transistors including planar channel layers, each contacted with at least one of the vertical channel layers and being parallel to the substrate, and gate insulating layers formed over the planar channel layers. | 04-25-2013 |
20130100742 | NONVOLATILE MEMORY DEVICE - A nonvolatile memory device is provided. The device may include a plurality of cell strings that are configured to share a bit line, word lines, and selection lines. Each of the cell strings may include a plurality of memory cells connected in series to each other and a string selection device controlling connections between the memory cells and the bit line, and the string selection device may include a first string selection element with a first threshold voltage and a second string selection element connected in series to the first string selection element and having a second threshold voltage different from the first threshold voltage. At least one of the first and second string selection elements may include a plurality of switching elements connected in series to each other. | 04-25-2013 |
20130100743 | METHOD FOR OPERATING A SEMICONDUCTOR STRUCTURE - A method for operating a semiconductor structure is provided. The semiconductor structure includes a first conductor extending in a first direction, a second conductor extending in a second direction different from the first direction, and a dielectric layer between the first conductor and the second conductor. The method for operating the semiconductor structure comprises following steps. A current is provided to flow in the first direction in the first conductor. | 04-25-2013 |
20130107630 | NON-VOLATILE MEMORY DEVICES HAVING VERTICAL DRAIN TO GATE CAPACITIVE COUPLING | 05-02-2013 |
20130107631 | Method Of Programming A Split Gate Non-volatile Floating Gate Memory Cell Having A Separate Erase Gate | 05-02-2013 |
20130107632 | Mixed Voltage Non-volatile Memory Integrated Circuit With Power Saving | 05-02-2013 |
20130107633 | NONVOLATILE MEMORY DEVICE AND READING METHOD THEREOF | 05-02-2013 |
20130114343 | SEMICONDUCTOR DEVICE WITH ONE-TIME PROGRAMMABLE MEMORY CELL INCLUDING ANTI-FUSE WITH METAL/POLYCIDE GATE - A one-time programmable (OTP) memory cell includes two transistors including a dual gate transistor. The dual gate transistor is formed using the same processing operations used to form floating gate transistors in other areas of the semiconductor device. The dual gate transistor includes an upper gate isolated from a floating gate by a floating gate oxide, the combination of which produces an anti-fuse. The nonvolatile memory device may include a plurality of such OTP memory cells and one or more OTP memory cells are selected and programmed by applying a voltage sufficient to blow the anti-fuse by causing the floating gate oxide layer to break down and the upper gate to become shorted to the floating gate. | 05-09-2013 |
20130114344 | ERRATIC PROGRAM DETECTION FOR NON-VOLATILE STORAGE - Methods and non-volatile storage systems are provided for determining erratically programmed storage elements, including under-programmed and over-programmed storage elements. Techniques do not require any additional data latches. A set of data latches may be used to store program data for a given memory element. This program data may be maintained after the programming is over for use in erratic program detection. In one embodiment, lockout status is kept in a data latch that is used to serially receive program data to be programmed into the storage element. Therefore, no extra data latches are required to program the storage elements and to maintain the program data afterwards. | 05-09-2013 |
20130121080 | Adaptive Estimation of Memory Cell Read Thresholds - A method for operating a memory ( | 05-16-2013 |
20130121081 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes a memory unit and a control unit. The memory unit includes a multilayer structure including electrode films and inter-electrode insulating films alternately stacked in a first direction; a semiconductor pillar piercing the multilayer structure in the first direction; a memory layer provided between the semiconductor pillar and the electrode films; an inner insulating film provided between the memory layer and the semiconductor pillar; an outer insulating film provided between the memory layer and the electrode films; and a wiring electrically connected to the first semiconductor pillar. In an erasing operation, the control unit sets the first wiring at a first potential and sets the electrode film at a second potential lower than the first potential, and then sets the first wiring at a third potential and sets the electrode film at a fourth potential higher than the third potential. | 05-16-2013 |
20130128670 | MEMORY ACCESS METHOD AND FLASH MEMORY USING THE SAME - A memory access method is applied in a memory controller for accessing an NAND memory array, including a number of respective select switches globally controlled with a string select signal. The memory access method includes the following steps. A stream bias signal and a selected word line signal are respectively provided on a selected stream and on a selected cell of the selected stream, and the rest of memory cells are turned on as pass transistors, in the setup phase. A discharge path is provided to eliminate coupling charge presented on unselected streams, in the setup phase. Then, the string select signal is enabled to have the selected stream connected to a sense unit via a metal bit line and according read the selected cell in a voltage sensing scheme, in a read phase, which does not overlap with the setup phase. | 05-23-2013 |
20130128671 | FLASH MEMORY DEVICE AND PROGRAM METHOD - Disclosed is a flash memory device and programming method that includes; receiving buffer data and determining between a high-speed mode and a reliability mode for buffer data, and upon determining the reliability mode storing the buffer data in a first buffer region, and upon determining the high-speed mode storing the buffer data in a second buffer region. The memory cell array of the flash memory including a main region and a separately designated buffer region divided into the first buffer region and second buffer region. | 05-23-2013 |
20130135934 | NONVOLATILE MEMORY DEVICE AND OPERATING METHOD THEREOF - Disclosed is a method of operating a nonvolatile memory device which includes a first memory area and a second memory area, the number of pages being stored in each word line of the first memory area being smaller than the number of pages being stored in each word line of the second memory area, and the first memory area being configured to buffer data to be written in the second memory area. The method includes sensing pages stored in the first memory area to store the sensed pages in a page buffer; receiving an address for storing pages stored in the page buffer in the second memory area; and randomizing the pages stored in the page buffer based on the address. | 05-30-2013 |
20130135935 | ACCESS LINE DEPENDENT BIASING SCHEMES - The present disclosure includes methods, devices, and systems for access line biasing. One embodiment includes selecting, using a controller external to the memory device, a particular access line dependent biasing scheme and corresponding bias conditions for use in performing an access operation on an array of memory cells of the memory device, and performing the access operation using the selected particular access line dependent biasing scheme and corresponding bias conditions. In one or more embodiments, the selected particular access line dependent biasing scheme and corresponding bias conditions is selected by the controller external to the memory device based, at least partially, on a target access line of the array. | 05-30-2013 |
20130135936 | MEMORY CONTROLLER SELF-CALIBRATION FOR REMOVING SYSTEMIC INFLUENCE - Self-calibration for a memory controller is performed by writing a voltage to a selected cell. Adjacent cells around the selected cell are programmed. After each of the adjacent programming operations, the voltage on the selected cell is read to determine any change in voltage caused by systemic offsets such as, for example, floating gate-to-floating gate coupling. These changes are averaged and stored in a table as an offset for use in adjusting a programming voltage or a read voltage in a particular area of memory represented by the offset. Self calibration method for temperature is determined by writing cells at different temperatures and reading at different temperatures to generate temperature offset tables for the write path and read path. These offset tables are used to adjust for systematic temperature related offsets during programming and during read. | 05-30-2013 |
20130141978 | FLASH MEMORY DEVICES AND SYSTEMS - Flash memory devices and systems are provided. One flash memory device includes an n-channel metal oxide semiconductor field-effect transistor (nMOSFET), a silicon-oxide-nitride-oxide silicon (SONOS) transistor coupled to the nMOSFET, and an isolated p-well coupled to the nMOSFET and the SONOS transistor. A flash memory system includes an array of memory devices divided into a plurality of paired sectors, a global bit line (GBL) configured to provide high voltage to each respective sector during erase and program operations coupled to each of the plurality of sectors, and a plurality of sense amplifiers coupled between a respective pair of sectors. Methods for operating a flash memory are also provided. One method includes providing high voltage, via the GBL, to the paired sectors during erase and program operations and providing low voltage, via a local bit line, to each memory device during read operations. | 06-06-2013 |
20130141979 | SEMICONDUCTOR MEMORY APPARATUS - A semiconductor memory apparatus including a latch unit configured to be driven in response to activation of a reset selection signal and resetting a first node and a second node; and an auxiliary driving unit configured to support a driving force of the latch unit in response to the reset selection signal and a voltage logic level of the first node or the second node, wherein the first node and the second node have substantially opposite voltage logic levels. | 06-06-2013 |
20130141980 | REDUCED SIGNAL INTERFACE MEMORY DEVICE, SYSTEM, AND METHOD - A memory has a serial interface. The serial interface is programmable to either use separate dedicated input and output pads, or to use one bidirectional pad. When one bidirectional pad is used, the interface signal count is reduced by one. | 06-06-2013 |
20130141981 | MEMORY DEVICE AND METHOD HAVING CHARGE LEVEL ASSIGNMENTS SELECTED TO MINIMIZE SIGNAL COUPLING - A non-volatile memory device programs memory cells in each row in a manner that minimizes the coupling of spurious signals. A control logic unit programs the cells in a row using a set of bit state assignments chosen by evaluating data that are to be written to the cells in the row. The control logic unit performs this evaluation by determining the number of cells in the row that will be programmed to each of a plurality of bit states corresponding to the write data. The control logic unit then selects a set of bit state assignments that will cause the programming level assigned to each bit state to be inversely proportional to the number of memory cells in the row that are programmed with the bit state. The selected set of bit states is then used to program the memory cells in the row. | 06-06-2013 |
20130148428 | Non-volatile Memory Device And A Method Of Programming Such Device - A non-volatile memory device has a charge pump for providing a programming current and an array of non-volatile memory cells. Each memory cell of the array is programmed by the programming current from the charge pump. The array of non-volatile memory cells is partitioned into a plurality of units, with each unit comprising a plurality of memory cells. An indicator memory cell is associated with each unit of non-volatile memory cells. A programming circuit programs the memory cells of each unit using the programming current, when fifty percent or less of the memory cells of each unit is to be programmed, and programs the inverse of the memory cells of each unit and the indicator memory cell associated with each unit, using the programming current, when more than fifty percent of the memory cells of each unit is to be programmed. | 06-13-2013 |
20130148429 | MEMORY DEVICE, METHOD OF PERFORMING READ OR WRITE OPERATION AND MEMORY SYSTEM INCLUDING THE SAME - Provided is a memory device having a first switch configured to receive a first CSL signal to input or output data. A second switch is configured to receive a second CSL signal. A sensing and latch circuit (SLC) is coupled between the first and second switches. And at least one memory cell is coupled to the second switch. The second switch is configured to control timing of read or write operations of the at least one memory cell in response to the second CSL signal, e.g., where a read operation can be performed in not more than about 5 ns. The SLC operates as a latch in a write mode and as an amplifier in a read mode. The memory device may comprise part of a memory system or other apparatus including such memory device or system. Methods of performing read and write operations using such memory device are also provided. | 06-13-2013 |
20130148430 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A non-volatile semiconductor memory device according to one embodiment includes: a cell array; and a data writing unit that repeatedly executes a write loop including a programming operation of applying a program voltage to a selected word line and a passage voltage to non-selected word lines during writing of data, in which, when a difference between the passage voltage used in an n-th write loop and the passage voltage used in an n+1-th write loop is expressed as ΔVn and when a condition of L06-13-2013 | |
20130148431 | ON-CHIP MEMORY TESTING - An integrated circuit is described that has a substrate with a memory array with dedicated support hardware formed on the substrate. An access wrapper circuit is coupled to address and data lines of the memory array and to control lines of the dedicated support hardware. The wrapper circuit is configured to provide an access port to the memory array. A test controller is formed on the substrate and coupled in parallel with the access wrapper circuit to the address and data lines of the memory array and to the control lines of the dedicated support hardware, wherein the test controller is operable to perform a test of the memory array by manipulating control signals to the support hardware in addition to those required to write data patterns into the memory array and to read the contents of the memory array. | 06-13-2013 |
20130163339 | READING METHOD OF NON-VOLATILE MEMORY DEVICE - A non-volatile memory device includes a first selection transistor, a second selection transistor, and a plurality of memory cells serially coupled between the first selection transistor and the second selection transistor. A reading method of the non-volatile memory device includes applying a read voltage to a gate of a selected memory cell; applying a first pass voltage to a gate of a memory cell adjacent to the selected memory cell, and applying a second pass voltage to gates of the other memory cells, wherein the selected memory cell is in one program state among first to T | 06-27-2013 |
20130163340 | NON-VOLATILE STORAGE SYSTEM WITH THREE LAYER FLOATING GATE - A non-volatile storage system includes memory cells with floating gates that comprises three layers separated by two dielectric layers (an upper dielectric layer and lower dielectric layer). The dielectric layers may be an oxide layers, nitride layers, combinations of oxide and nitride, or some other suitable dielectric material. The lower dielectric layer is close to the bottom of the floating gate (near interface between floating gate and tunnel dielectric), while the upper dielectric layer is close to top of the floating gate (near interface between floating gate and inter-gate dielectric). | 06-27-2013 |
20130170301 | Wordline-to-Wordline Stress Configuration - A method and system for performing wordline-to-wordline stress routines on a storage device is disclosed. Stress routines may be performed to reduce state widening in multi-level memory cells in the storage device. However, data retention problems may result if the stress routines are performed too often. In order to perform the stress routines at the proper times, a stress control variable is used. The stress control variable may be indicative of age of the storage device (such as the number of erase cycles performed on a memory block in the storage device). The stress control variable is input to a look-up table (or other logical construct), with the output of the look-up table indicating whether to perform the wordline-to-wordline stress routine. In this way, the stress routines may be performed to reduce state widening while reducing the ill effects of data retention. | 07-04-2013 |
20130170302 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATION AND OPERATION - A non-volatile semiconductor memory device comprises a semiconductor substrate and a plurality of gate structures formed on a cell region of the semiconductor substrate. The plurality of gate structures include: a first select-gate structure and a second select-gate structure disposed on the cell region, the first select-gate structure and the second select-gate structure spaced apart from each other, and a plurality of cell gate structures disposed between the first select-gate structure and the second select-gate structure. At least one of the select-gate structures comprises plural select gates. | 07-04-2013 |
20130176787 | Method and Apparatus for Training a DLL in a Memory Subsystem - A method and apparatus for training a DLL in a memory subsystem is disclosed. In one embodiment, a memory subsystem includes a memory coupled to convey data read therefrom on one or more channels. Each memory channel may include a delay locked loop (DLL) configured to apply a desired amount of delay to a data strobe signal received from the memory during a read operation. Upon detecting a read request, a controller may initiate a training procedure in which the DLL is trained to the desired delay. During the training procedure, an input clock signal may be provided to the DLL. The delay within the DLL may be adjusted until an output clock signal has a desired phase relationship with the input clock signal. Once the desired phase relationship is attained, the training procedure may be terminated and the DLL input may be switched to receive the data strobe signal. | 07-11-2013 |
20130176788 | DEVICE SELECTION SCHEMES IN MULTI CHIP PACKAGE NAND FLASH MEMORY SYSTEM - Systems and methods are provided for perform device selection in multi-chip package NAND flash memory systems. In some embodiments, the memory controller performs device selection by command. In other embodiments, the memory controller performs device selection by input address. | 07-11-2013 |
20130182506 | PROGRAMMING ALGORITHM FOR IMPROVED FLASH MEMORY ENDURANCE AND RETENTION - A method for programming a flash cell using a series of programming pulses, the method comprising providing a plurality of first successive programming pulses, wherein each of the first successive programming pulse is incremented by a first incremental amount and providing a plurality of second successive programming pulses, wherein each of the second successive programming pulses is incremented by a second incremental amount and wherein the second increment amount is smaller than the first incremental amount. A system and machine-readable media are also provided. | 07-18-2013 |
20130188424 | SYSTEM AND METHOD FOR STORING AT LEAST A PORTION OF INFORMATION RECEIVED IN ASSOCIATION WITH A FIRST OPERATION FOR USE IN PERFORMING A SECOND OPERATION - A method includes: receiving first information in association with a first operation to be performed on at least one of multiple flash memory circuits; storing at least a portion of the first information; receiving second information in association with a second operation to be performed on at least one of the multiple flash memory circuits, in which the second operation is a read operation or a write operation; receiving data from the flash memory circuits based on at least the first information and storing the data in a buffer; and performing the second operation utilizing the stored portion of the first information in addition to the second information on the data in the buffer. | 07-25-2013 |
20130188425 | READOUT CIRCUIT FOR NON-VOLATILE MEMORY DEVICE - Provided is a readout circuit for a non-volatile memory device, which has a large readout margin for distinguishing between 0 and 1 of data and has a small circuit area. A voltage output from a single bias circuit is applied to a gate of a memory element and a gate of an NMOS transistor serving as a reference current source to be compared with a current flowing through the memory element. Thus, the gates are controlled by the same voltage, and hence characteristics fluctuations in the operating temperature range and the operating power supply voltage range are reduced. Therefore, a large readout margin for distinguishing 0 and 1 of data can be obtained, resulting in a simplified circuit configuration. | 07-25-2013 |
20130194873 | SYSTEMS AND METHODS FOR AUTO-CALIBRATION OF A STORAGE MEMORY CONTROLLER - Systems and methods for auto-calibrating a storage memory controller are disclosed. In some embodiments, the systems and methods may be realized as a method for auto-calibrating a storage memory controller including instructing a controllable delay circuit to delay a read strobe signal at one of a plurality of delay settings, receiving data captured at a data latch using the delayed read strobe signal, selecting an adjustment factor from the plurality of delay settings using a multi-scale approach, based on an accuracy of the data captured at the data latch, and instructing the controllable delay circuit to delay the read strobe signal by the adjustment factor. | 08-01-2013 |
20130194874 | Dynamic Healing Of Non-Volatile Memory Cells - Methods and systems are disclosed for dynamic healing of non-volatile memory (NVM) cells within NVM systems. The dynamic healing embodiments described herein relax damage within tunnel dielectric layers for NVM cells that occurs over time from charges (e.g., holes and/or electrons) becoming trapped within these tunnel dielectric layers. NVM operations with respect to which dynamic healing processes can be applied include, for example, erase operations, program operations, and read operations. For example, dynamic healing can be applied where performance for the NVM system degrades beyond a selected performance level for an NVM operation, such as elevated erase/program pulse counts for erase/program operations and bit errors for read operations. A variety of healing techniques can be applied, such as drain stress processes, gate stress processes, and/or other desired healing techniques. | 08-01-2013 |
20130201763 | METHOD AND APPARATUS FOR READING DATA STORED IN FLASH MEMORY BY REFERRING TO BINARY DIGIT DISTRIBUTION CHARACTERISTICS OF BIT SEQUENCES READ FROM FLASH MEMORY - A method for reading data stored in a flash memory includes at least the following steps: controlling the flash memory to perform a plurality of read operations upon a plurality of memory cells included in the flash memory; obtaining a plurality of bit sequences read from the memory cells, respectively, wherein the read operations read bits of a predetermined bit order from the memory cells by utilizing different control gate voltage settings; and determining readout information of the memory cells according to binary digit distribution characteristics of the bit sequences. | 08-08-2013 |
20130223151 | SYSTEM AND METHOD OF DETERMINING A PROGRAMMING STEP SIZE FOR A WORD LINE OF A MEMORY - A method includes determining a programming step size for a word line of a memory in a data storage device. The programming step size is determined at least partially based on a count of memory elements of the word line to be programmed to a particular state. | 08-29-2013 |
20130223152 | CLOCK GENERATOR - A clock generator or oscillating circuit is provided to generate a clock signal with high Power Supply Rejection Ratio (PSSR), or a stable clock signal that is resistant to variations in the power supply. The clock generator or oscillating circuit may also adjust the clock period (T) of the clock signal, either or both upwards and downwards, around its central value to compensate fabrication process variations. | 08-29-2013 |
20130223153 | NON-VOLATILE MEMORY APPARATUS AND METHODS - Some embodiments include apparatus and methods having memory cells coupled in series and a module to cause an application of voltages with at least three different values to gates of the memory cells during an operation to retrieve information stored in at least one of the memory cells. Additional apparatus and methods are described. | 08-29-2013 |
20130229874 | MEMORY WITH OUTPUT CONTROL - An apparatus, system, and method for controlling data transfer to an output port of a serial data link interface in a semiconductor memory is disclosed. In one example, a flash memory device may have multiple serial data links, multiple memory banks and control input ports that enable the memory device to transfer the serial data to a serial data output port of the memory device. In another example, a flash memory device may have a single serial data link, a single memory bank, a serial data input port, a control input port for receiving output enable signals. The flash memory devices may be cascaded in a daisy-chain configuration using echo signal lines to serially communicate between memory devices. | 09-05-2013 |
20130235669 | HIGH VOLTAGE SWITCH CIRCUIT - Disclosed herein is a device that includes a first transistor coupled between an input terminal and an output terminal and including a control gate, a voltage-generating circuit configured to produce a voltage at the control gate of the first transistor, and a discharge circuit coupled between the input terminal of the first transistor and the control gate of the first transistor, the discharge circuit responding to a discharge signal to perform a discharge operation such that an electrical charge is discharged from the output terminal to the input terminal of the first transistor. | 09-12-2013 |
20130235670 | FLASH MEMORY - A flash memory is disclosed. The flash memory includes a flash memory chip; a serial-to-parallel converter for receiving and converting a serial data to a parallel data; and a data mode decision circuit connected to an output terminal of the serial-to-parallel converter for generating an inversion control signal through the parallel data and for applying an inversion processing to the parallel data and then outputting an inverted parallel data to the flash memory chip under the control of the inversion control signal. By converting the serial data to a parallel data and then writing the parallel data into the flash memory chip, a lower proportion of the inversion control signal to the total amount of data is achieved, and therefore less area is consumed while the same programming efficiency and average programming power is maintained compared with a flash memory adopting the bit inversion technique of the prior art. | 09-12-2013 |
20130235671 | SEMICONDUCTOR MEMORY DEVICE AND OPERATING METHOD THEREOF - A semiconductor memory device and a method of operating a semiconductor memory device includes connecting selected even bit lines to selected even cell strings, programming memory cells in the selected even cell strings by using a second program permission voltage higher than a first program permission voltage, connecting selected odd bit lines to selected odd cell strings when programming of the memory cells is finished, and programming memory cells in the selected odd cell strings by using the first program permission voltage. | 09-12-2013 |
20130235672 | FLASH MEMORY WITH INTEGRATED ROM MEMORY CELLS - Memory array for storing a plurality of data bits. The memory array has flash memory cells, ROM memory cells addressing circuitry. The addressing circuitry is operatively coupled to both the plurality of flash memory cells and the plurality of ROM memory cells, the addressing circuitry being configured to address both the plurality of flash memory cells and the plurality of ROM memory cells. | 09-12-2013 |
20130235673 | NONVOLATILE MEMORY DEVICE HAVING 3D MEMORY CELL ARRAY AND READ METHOD - Disclosed is a method reading memory device information from a nonvolatile memory device having a three-dimensional (3D) memory cell array including an original plane storing data associated with the information in a first group of memory cells and a replica plane storing the data in replica in a second group of memory cells. The method applies a selection read voltage to a selected word line connected to first and second groups of memory cells while applying a non-selection read voltage to other word lines, and simultaneously reading first data from the first group of memory cells and second data from the second group of memory cells. | 09-12-2013 |
20130242663 | PROGRAMMING INHIBIT METHOD OF NONVOLATILE MEMORY APPARATUS FOR REDUCING LEAKAGE CURRENT - The invention provides a nonvolatile memory apparatus. The nonvolatile memory apparatus comprises a plurality of memory cells and a signal generator. The memory cells are arranged in an array, and each of the memory cells has a control gate terminal, a floating gate, a source line terminal, a bit-line terminal, a selected gate terminal and a word-line terminal. The signal generator is coupled to the memory cells. When the nonvolatile memory apparatus executes a programming operation, the signal generator provides a programming signal to the control gate terminals of a plurality of inhibited memory cells among the memory cells. Wherein, the programming signal is a pulse signal with a direct-current (DC) offset voltage. | 09-19-2013 |
20130242664 | INTERFACE CIRCUIT - According to an embodiment, an interface circuit is provided with an output buffer which generates an output waveform on the basis of the ON/OFF operation of a transistor and a driver circuit which drives the transistor and is capable of independently changing a turn-ON speed and a turn-OFF speed of the transistor. | 09-19-2013 |
20130250692 | Adaptive Programming For Non-Volatile Memory Devices - Systems and techniques for performing write operations on non-volatile memory are described. A described system includes a memory structure including non-volatile memory cells that are arranged on word lines and bit lines and a microcontroller that is communicatively coupled with the memory structure. The memory structure can include non-volatile memory cells that are arranged on word lines and bit lines. The microcontroller can be configured to receive data to write to the memory structure, write the data to the memory structure using a selected word line of the word lines, detect a failure to write the data, apply, based on the failure, a negative bias voltage to one or more unselected word lines of the word lines during a negative bias period, and write the data to the portion of the memory cells using the selected word line during the negative bias period. | 09-26-2013 |
20130250693 | MEMORY SYSTEM - According to one embodiment, a memory system includes a first semiconductor memory and a controller. The first semiconductor memory receives a first clock, and outputs, in accordance with the first clock, a second clock and a data signal in synchronization with the second clock. The controller includes a detection circuit which detects a shift of a duty ratio of the second clock which is output from the first semiconductor memory. The controller also includes an adjustment circuit which adjusts a duty ratio of the first clock based on the shift detected by the detection circuit. | 09-26-2013 |
20130250694 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device of an embodiment includes a p-type semiconductor substrate, a first P-well formed in the semiconductor substrate, and on which a plurality of memory cells is formed, an first N-well surrounding the first P-well and electrically separating the first P-well from the semiconductor substrate, a first negative voltage generation unit configured to generate a first negative voltage, a boost unit configured to boost a voltage and generate a boosted voltage, and a well voltage transmission unit connected to the first negative voltage generation unit, the boost unit, and the first P-well, and configured to switch a voltage between the first negative voltage and the boosted voltage, the voltage being applied to the first P-well. | 09-26-2013 |
20130250695 | METHOD FOR ERASING MEMORY CELLS IN A FLASH MEMORY DEVICE USING A POSITIVE WELL BIAS VOLTAGE AND A NEGATIVE WORD LINE VOLTAGE - A memory device of the non-volatile type including a memory array having a plurality of memory cells organized as sectors, each sector having a main word line associated with a plurality of local word lines, each local word line coupled to the main word line by a respective local word line driver circuit, each of the local word line driver circuits consisting of a first MOS transistor coupled between the respective main word line and a respective local word line and a second MOS transistor coupled between the respective local word line and a first biasing terminal. | 09-26-2013 |
20130258783 | Method and Apparatus for Logic Read in Flash Memory - The timing of logic read operations in a Flash memory device may be improved by a pad serial output circuit which receives a pre-decoded instruction signal and pre-fetched logic data prior to the last command clock, and which performs a fast resolution of the command in the pad serial output circuit on the last clock of the command input sequence. In one illustratively implementation, instruction pre-decode and data pre-fetch may be done on the seventh clock during command input. In another illustrative implementation, a first instruction pre-decode and data pre-fetch may be done on the fourth clock during command input, and a second instruction pre-decode may be done on the seventh clock during command input. Both serial protocol interface, including dual and quad I/O SPI, and quad peripheral interface are supported. | 10-03-2013 |
20130258784 | SILICON ON INSULATOR AND THIN FILM TRANSISTOR BANDGAP ENGINEERED SPLIT GATE MEMORY - Memory cells comprising thin film transistor, stacked arrays, employing bandgap engineered tunneling layers in a junction free, NAND configuration. The cells comprise a channel region in a semiconductor strip formed on an insulating layer; a tunnel dielectric structure disposed above the channel region, the tunnel dielectric structure comprising a multilayer structure including at least one layer having a hole-tunneling barrier height lower than that at the interface with the channel region; a charge storage layer disposed above the tunnel dielectric structure; an insulating layer disposed above the charge storage layer; and a gate electrode disposed above the insulating layer Arrays and methods of operation are described. | 10-03-2013 |
20130265827 | LEVEL COMPENSATION IN MULTILEVEL MEMORY - Some embodiments include apparatuses and methods having a compensation unit to provide a compensation value based at least in part on a threshold voltage value of a memory cell. At least one of such embodiments includes a controller to select a code during an operation of retrieving information from the memory cell to represent a value of information stored in the memory cell. Such a code can be associated with an address having an address value based at least in part on the compensation value. Additional apparatuses and methods are described. | 10-10-2013 |
20130279259 | HAFNIUM TANTALUM OXYNITRIDE DIELECTRIC - Electronic apparatus and methods may include a hafnium tantalum oxynitride film on a substrate for use in a variety of electronic systems. The hafnium tantalum oxynitride film may be structured as one or more monolayers. The hafnium tantalum oxynitride film may be formed using atomic layer deposition. Metal electrodes may be disposed on a dielectric containing a hafnium tantalum oxynitride film. | 10-24-2013 |
20130279260 | NON-VOLATILE MEMORY DEVICE AND METHOD FOR PROGRAMMING THE DEVICE, AND MEMORY SYSTEM - A non-volatile memory device comprises a memory cell array comprising memory cells arranged in rows connected to corresponding word lines and columns connected to corresponding bit lines, a page buffer that stores a program data, a read-write circuit that programs and re-programs the program data into selected memory cells of the memory cell array and reads stored data from the programmed memory cells, and a control circuit that controls the page buffer and the read-write circuit to program the selected memory cells by loaded the program data from in page buffer and to re-program the selected memory cells by re-loaded the program data in the page buffer. | 10-24-2013 |
20130279261 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE INCLUDING PLURAL MEMORY CELLS AND A DUMMY CELL COUPLED TO AN END OF A MEMORY CELL - A nonvolatile semiconductor memory device having a plurality of electrically rewritable nonvolatile memory cells connected in series together includes a select gate transistor connected in series to the serial combination of memory cells. A certain one of the memory cells which is located adjacent to the select gets transistor is for use as a dummy cell. This dummy cell is not used for data storage. During data erasing, the dummy cell is applied with the same bias voltage as that for the other memory cells. | 10-24-2013 |
20130279262 | NONVOLATILE MEMORY DEVICES, CHANNEL BOOSTING METHODS THEREOF, PROGRAMMING METHODS THEREOF, AND MEMORY SYSTEMS INCLUDING THE SAME - Non-volatile memory device channel boosting methods in which at least two strings are connected to one bit line, the channel boosting methods including applying an initial channel voltage to channels of strings in a selected memory block, floating inhibit strings each having an un-programmed cell among the strings, and boosting channels of the floated inhibit strings. | 10-24-2013 |
20130286740 | EEPROM CELL WITH TRANSFER GATE - An EEPROM cell including a transfer gate that can suppress a data disturbance phenomenon of the EEPROM cell is provided. The EEPROM cell includes: an inverter; a control plate; a tunneling plate; a data output metal oxide semiconductor field effect transistor (MOSFET) that is connected to the inverter; a floating plate that is connected to the inverter; a tunneling capacitor area that is formed between the floating plate and the tunneling plate; and a transfer gate that is connected to the tunneling plate. As the transfer gate is added between a bit line and the tunneling plate of the EEPROM cell, in a standby (or unselected) operation of the EEPROM cell, the tunneling plate is floated. | 10-31-2013 |
20130286741 | OVER-SAMPLING READ OPERATION FOR A FLASH MEMORY DEVICE - A flash memory device and a reading method are provided where memory cells are divided into at least two groups. Memory cells are selected according to a threshold voltage distribution. Data stored in the selected memory cells are detected and the data is latched corresponding to one of the at least two groups according to a first read operation. A second read operation detects and latches data of the memory cells corresponding to another one of the at least two groups. The data is processed through a soft decision algorithm during the second read operation. | 10-31-2013 |
20130294170 | SWITCH AND SEMICONDUCTOR DEVICE INCLUDING THE SWITCH - A device includes a first transistor coupled between first and second nodes, and including a control gate supplied with a first control signal, a second transistor coupled between the first node and a third node, and including a control gate supplied with the first control signal, a third transistor coupled between the third node and a fourth node, and including a control gate supplied with a second control signal, a fourth transistor coupled between the fourth node and a fifth node, and including a control gate supplied with the second control signal, and a fifth transistor coupled between the fifth node and the second nodes, and including a control gate supplied with the first control signal. Each of the second and fifth transistors is smaller in threshold voltage than the first transistor. | 11-07-2013 |
20130294171 | SEMICONDUCTOR INTEGRATED CIRCUIT AND SEMICONDUCTOR PHYSICAL QUANTITY SENSOR DEVICE - In aspects of the invention, an auxiliary memory circuit includes a shift register wherein a plurality of flip-flops are cascade-connected and a plurality of inversion circuits that invert and output outputs of each D flip-flop. A main memory circuit includes a switch, which acts in accordance with a signal from the auxiliary memory circuit, and an EPROM connected in series to the switch and driven by a writing voltage. A variable resistance circuit includes a switch, which acts in accordance with a signal from the auxiliary memory circuit, and a resistor connected in series to the switch. With aspects of the invention, it is possible for terminals of the writing voltage and a writing voltage to be commonized. Also, it is possible to provide a low-cost semiconductor physical quantity sensor device that can carry out electrical trimming with the voltage when writing into the EPROM kept constant. | 11-07-2013 |
20130301355 | EEPROM MEMORY UNIT AND EEPROM MEMORY DEVICE - An EEPROM memory unit is disclosed. The EEPROM memory unit includes a first memory cell, a second memory cell, and a word line controller. The first memory cell includes a source that is connected to a first bit line of the EEPROM memory unit and a drain that is connected to a source of the word line controller. The word line controller includes a drain that is connected to a source of the second memory cell. The second memory cell includes a drain that is connected to a second bit line of the EEPROM memory unit. An EEPROM memory device is also disclosed. | 11-14-2013 |
20130301356 | SEMICONDUCTOR DEVICE WITH ONE-TIME PROGRAMMABLE MEMORY CELL INCLUDING ANTI-FUSE WITH MAETAL/POLYCIDE GATE - A one-time programmable (OTP) memory cell includes two transistors including a dual gate transistor. The dual gate transistor is formed using the same processing operations used to form floating gate transistors in other areas of the semiconductor device. The dual gate transistor includes an upper gate isolated from a floating gate by a floating gate oxide, the combination of which produces an anti-fuse. The nonvolatile memory device may include a plurality of such OTP memory cells and one or more OTP memory cells are selected and programmed by applying a voltage sufficient to blow the anti-fuse by causing the floating gate oxide layer to break down and the upper gate to become shorted to the floating gate. | 11-14-2013 |
20130301357 | REDUCING NOISE IN SEMICONDUCTOR DEVICES - The present disclosure includes methods, devices, modules, and systems for reducing noise in semiconductor devices. One method embodiment includes applying a reset voltage to a control gate of a semiconductor device for a period of time. The method further includes sensing the state of the semiconductor device after applying the reset voltage. | 11-14-2013 |
20130308387 | MEMORY READ APPARATUS AND METHODS - Apparatus and methods are disclosed, including a method that raises an electrical potential of a plurality of access lines to a raised electrical potential, where each access line is associated with a respective charge storage device of a string of charge storage devices. The electrical potential of a selected one of the access lines is lowered, and a data state of the charge storage device associated with the selected access line is sensed while the electrical potential of the selected access line is being lowered. Additional apparatus and methods are described. | 11-21-2013 |
20130308388 | APPARATUS AND METHOD FOR REDUCED PEAK POWER CONSUMPTION DURING COMMON OPERATION OF MULTI-NAND FLASH MEMORY DEVICES - System and method for executing a global memory command in a multi-chip non-volatile memory device having a plurality of non-volatile memories. The global memory command is received at each non-volatile memory concurrently. The memory command is initiated at different times relative to receiving the global memory command for at least two of the plurality of non-volatile memory to mitigate peak power consumption. | 11-21-2013 |
20130314998 | Enhanced Glitch Filter - A glitch circuit includes an SR flip-flop where a received input clock is operatively coupled to set and reset inputs of the flip-flop, respectively. A configurable delay circuit receives an input signal, and an output of the delay circuit provides a delayed signal. The configurable delay circuit includes a plurality of switchable taps, each providing an increment of delay to the input signal. The delay circuit input is operatively coupled to an output of the flip flop, and an output of the delay circuit is operatively coupled to the inputs of the flip-flop. The glitch circuit captures a first signal transition of the input clock and blocks all other transitions from propagating through the flip-flop during a selected delay period so as to provide on an output of the flip-flop, the glitch-free output clock. | 11-28-2013 |
20130314999 | FLASH MEMORY DEVICE AND READING METHOD THEREOF - A flash memory device and reading method of the flash memory device. The reading method includes determining a read voltage set of memory cells corresponding to a first word line from at least one of flag cell data of the first word line and flag cell data of a second word line adjacent to the first word line, and reading the memory cells corresponding to the first word line according to the determined read voltage set. | 11-28-2013 |
20130315000 | Techniques For Providing A Direct Injection Semiconductor Memory Device - Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a first region connected to a bit line extending in a first orientation and a second region connected to a source line extending in a second orientation. The direct injection semiconductor memory device may also include a body region spaced apart from and capacitively coupled to a word line extending in the second orientation, wherein the body region is electrically floating and disposed between the first region and the second region. The direct injection semiconductor memory device may further include a third region connected to a carrier injection line extending in the second orientation, wherein the first region, the second region, the body region, and the third region are disposed in sequential contiguous relationship. | 11-28-2013 |
20130315001 | SEMICONDUCTOR MEMORY COLUMN DECODER DEVICE AND METHOD - Semiconductor memory devices and methods include a flash memory cell array fabricated in a well, with memory cells in the same column connected to each other in series and connected to a respective bit line. The memory devices also include a column decoder, a data register buffer unit, a row decoder, an erase control unit, and an input/output buffer unit. In one or more embodiments, the erase control unit applies voltages to the well to erase the memory cells in a manner that avoids breaking down p-n junctions formed by transistors fabricated in the well. In another embodiment, high voltage transistors are used to selectively isolate the bit lines from and couple the bit lines to a peripheral circuit in pairs so that each high voltage transistor is shared by two bit lines. | 11-28-2013 |
20130315002 | METHODS AND DEVICES FOR DETERMINING SENSING VOLTAGES - The present disclosure includes methods and devices for determining sensing voltages. One such method includes comparing data associated with a number of template distributions to data associated with a first threshold voltage distribution and a second threshold voltage distribution associated with a number of memory cells programmed to particular adjacent program states, determining an intersection of the first and second threshold voltage distributions based on a template distribution of the number template distributions which most closely compares to the first and second threshold voltage distributions, and using the determined intersection to determine a sensing voltage used to sense the number of memory cells programmed to the particular adjacent program states. | 11-28-2013 |
20130322180 | VOLTAGE GENERATING CIRCUIT AND SEMICONDUCTOR DEVICE INCLUDING THE VOLTAGE GENERATING CIRCUIT - A voltage generating circuit includes first and second step-up circuits, each having first and second input terminals and an output terminal and configured to increase a voltage level of an input signal supplied through the first input terminal and output the signal with the increased voltage level through the output terminal. The second input terminal of the first step-up circuit is connected to the output terminal of the second step-up circuit and the second input terminal of the second step-up circuit is connected to the output terminal of the first step-up circuit. The voltage generating circuit may also include third and fourth step-up circuits and fifth and sixth step-up circuits having similar configurations. | 12-05-2013 |
20130329501 | SEMICONDUCTOR DEVICE WITH FLOATING GATE AND ELECTRICALLY FLOATING BODY - Techniques for providing floating body memory devices are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor device comprising a floating gate, a control gate disposed over the floating gate, a body region that is electrically floating, wherein the body region is configured so that material forming the body region is contained under at least one lateral boundary of the floating gate, and a source region and a drain region adjacent the body region. | 12-12-2013 |
20130336066 | SENSE AMPLIFIER CIRCUIT - A sense amplifier ( | 12-19-2013 |
20130336067 | NONVOLATILE STORAGE SYSTEM, POWER SUPPLY CIRCUIT FOR MEMORY SYSTEM, FLASH MEMORY, FLASH MEMORY CONTROLLER, AND NONVOLATILE SEMICONDUCTOR STORAGE DEVICE - Disclosed is a nonvolatile storage system including: a memory block having a plurality of flash memories; a flash memory power supply circuit outside of the memory block; and a flash memory controller. The flash memory power supply circuit has a plurality of types of power supply circuits for process execution, the power supply circuits for process execution generating and supplying power at a plurality of voltage levels needed to execute processes in the flash memories. The flash memory controller monitors changes of the internal states of the flash memories by communicating with the flash memories, thereby controlling the power supply circuits for process execution and the flash memories. | 12-19-2013 |
20130336068 | RANDOM TELEGRAPH SIGNAL NOISE REDUCTION SCHEME FOR SEMICONDUCTOR MEMORIES - Embodiments are provided that include a method including providing a first pulsed gate signal to a selected memory cell, wherein the pulsed gate signal alternates between a first voltage level and a second voltage level during a time period and sensing a data line response to determine data stored on the selected memory of cells. Further embodiments provide a system including a memory device, having a regulator circuit coupled to a plurality of access lines of a NAND memory cell, and a switching circuit configured to sequentially bias at least one of the plurality of the access lines between a first voltage level and a second voltage level based on an input signal. | 12-19-2013 |
20140003152 | METHODS FOR EXTENDING THE EFFECTIVE VOLTAGE WINDOW OF A MEMORY CELL | 01-02-2014 |
20140010018 | NANODOT CHARGE STORAGE STRUCTURES AND METHODS - Methods, devices, and systems associated with charge storage structures in semiconductor devices are described herein. In one or more embodiments, a method of forming nanodots includes forming at least a portion of a charge storage structure over a material by reacting a single-source precursor and a reactant, where the single-source precursor includes a metal and a semiconductor. | 01-09-2014 |
20140010019 | NON-VOLATILE MEMORY WITH DYNAMIC MULTI-MODE OPERATION - A method and system for extending the life span of a flash memory device. The flash memory device is dynamically configurable to store data in the single bit per cell (SBC) storage mode or the multiple bit per cell (MBC) mode. In the MBC storage mode, the cell can have one of multiple possible states, where each state is defined by respective threshold voltage ranges. In the SBC mode, the cell can have states with threshold voltages corresponding to states of the MBC storage mode which are non-adjacent to each other to improve reliability characteristics of the cell. | 01-09-2014 |
20140016414 | FLASH MEMORY - The present invention provides a flash memory including a memory cell, a current limiter and a program voltage generator. The memory cell is programmed in response to a program current and a program voltage. The current limiter reflects amount of the program current by a data-line signal, e.g., a data-line voltage. The program voltage generator generates and controls the program voltage in response to the data-line voltage, such that the program current can track to a constant reference current. | 01-16-2014 |
20140016415 | PROGRAMMING METHOD TO TIGHTEN THRESHOLD VOLTAGE WIDTH WITH AVOIDING PROGRAM DISTURB - A non-volatile storage system that performs a multi-stage programming process to program non-volatile storage to a set of data threshold voltage distributions. The multi-stage programming process includes performing a first stage of the multi-stage programming process to change threshold voltages of at least a subset of the non-volatile storage elements from an erased distribution to one or more intermediate distributions, performing an intermediate stage of the multi-stage programming process to change threshold voltages of at least some of the non-volatile storage elements to appropriate distributions of the data threshold voltage distributions, and performing a later stage of the multi-stage programming process, after performing the intermediate stage of the multi-stage programming process, to tighten only a subset of the data threshold voltage distributions. | 01-16-2014 |
20140022848 | NON-VOLATILE MEMORY HAVING 3D ARRAY OF READ/WRITE ELEMENTS AND READ/WRITE CIRCUITS AND METHOD THEREOF - A three-dimensional array is especially adapted for memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. Memory elements are formed across a plurality of planes positioned different distances above a semiconductor substrate. A two-dimensional array of bit lines to which the memory elements of all planes are connected is oriented vertically from the substrate and through the plurality of planes. During sensing, to compensate for word line resistance, a sense amplifier references a stored reference value during sensing of a memory element at a given location of the word line. A layout with a row of sense amplifiers between two memory arrays is provided to facilitate the referencing. A selected memory element is reset without resetting neighboring ones when it is subject to a bias voltage under predetermined conditions. | 01-23-2014 |
20140029345 | MEMORY DEVICES AND PROGRAMMING MEMORY ARRAYS THEREOF - An embodiment of a method includes decreasing a difference of a voltage applied to a first select gate minus a voltage applied to a source while the first select gate is off, decreasing a difference of a voltage applied to a second select gate minus a voltage applied to a data line while the second select gate is off, and increasing a voltage of a signal applied to a selected access line that is coupled to an untargeted memory cell in a string of memory cells coupled to the first and second select gates to a program voltage after or substantially concurrently with decreasing the difference of the voltage applied to the first select gate minus the voltage applied to the source and with decreasing the difference of the voltage applied to the second select gate minus the voltage applied to the data line. | 01-30-2014 |
20140029346 | CHARGE PUMP REDUNDANCY IN A MEMORY - An integrated circuit includes a circuit block to utilize a load current at a load voltage from a power input and two or more charge pump arrays. The outputs of the charge pump arrays are coupled to the power input of the circuit block. The integrated circuit includes one or more modifiable elements to disable one or more of the two or more charge pump arrays. | 01-30-2014 |
20140029347 | MEMORY SYSTEM HAVING A PLURALITY OF SERIALLY CONNECTED DEVICES - A semiconductor memory device and system are disclosed. The memory device includes a memory, a plurality of inputs, and a device identification register for storing register bits that distinguish the memory device from other possible memory devices. Circuitry for comparing identification bits in the information signal with the register bits provides positive or negative indication as to whether the identification bits match the register bits. If the indication is positive, then the memory device is configured to respond as having been selected by a controller. If the indication is negative, then the memory device is configured to respond as having not been selected by the controller. A plurality of outputs release a set of output signals towards a next device. | 01-30-2014 |
20140036593 | NONVOLATILE MEMORY DEVICES, MEMORY SYSTEMS AND METHODS OF PERFORMING READ OPERATIONS - Within a non-volatile memory device, a read operation directed to a nonvolatile memory cell having a positive threshold voltage applies a positive read voltage to a selected word line and a first control signal to a page buffer connected to a selected bit line, but if the memory cell has a negative threshold voltage the read operation applies a negative read voltage to the selected word line and a second control signal to the page buffer different from the first control signal. | 02-06-2014 |
20140036594 | NONVOLATILE MEMORY DEVICE AND RELATED METHOD OF OPERATION - A flash memory device comprises alternately arranged odd and even memory cells. The odd and even memory cells are connected to corresponding odd and even bitlines, which are connected to corresponding odd and even page buffers. In a read operation of the flash memory device, data is sensed at two different times via the odd and even bitlines. In certain embodiments, data is read from the odd page buffers while data is being sensed via the even bit lines, or vice versa. | 02-06-2014 |
20140043910 | SEMICONDUCTOR MEMORY DEVICE AND OPERATING METHOD THEREOF - A semiconductor memory device and a method of operating same includes reading a number of program/erase operations stored in a program/erase number storage unit, setting a pulse width of a program voltage based on the read number of program/erase operations, and performing a program operation on memory cells using the program voltage having the set pulse width. Setting of the pulse width of the program voltage includes decreasing the pulse width of the program voltage as the number of program/erase operations increases. | 02-13-2014 |
20140043911 | Method For Non-Volatile Memory Having 3D Array of Read/Write Elements with Efficient Decoding of Vertical Bit Lines and Word Lines - A three-dimensional array of memory elements is formed across multiple layers of planes positioned at different distances above a semiconductor substrate. The memory elements reversibly change a level of electrical conductance in response to a voltage difference being applied across them. The three-dimensional array includes a two-dimensional array of pillar lines from the substrate through the multiple layers of planes. A first set of pillar lines acts as local bit lines for accessing the memory elements together with an array of word lines on each plane. A second set of pillar lines is connected to the word lines. An array of metal lines on the substrate is switchable connected to the pillar lines to provide access to the first and second sets of pillar lines, thereby to provide access respectively to the bit lines and word lines of the three-dimensional array. | 02-13-2014 |
20140063966 | PROGRAMMING METHOD OF NONVOLATILE MEMORY DEVICE - Provided is a programming method of a nonvolatile memory device which includes a plurality of strings each including a source select transistor, a plurality of memory cells, and a drain select transistor which are connected in series between a common source line and a bit line. The programming method includes: applying a first voltage to the common source line during a first period in which a channel of a plurality of memory cells of an unselected string is floated; and applying a second voltage increased more than the first in voltage to the common source line during a second period in which a selected memory cell is programmed, when a selected word line belongs to a word line group adjacent to the common source line. | 03-06-2014 |
20140063967 | SEMICONDUCTOR MEMORY DEVICE AND OPERATING METHOD OF THE SAME - An operating method of a semiconductor memory device includes performing a first read operation on main cells of a first page with an initial read voltage, performing a second read operation on the main cells of the first page with a read voltage corresponding to a read retry number when the number of error bits generated as results of performing the first read operation exceeds the number of error-correctable bits, and storing the read retry number in spare cells of the first page while the second read operation is performed, and repeatedly performing the second read operation and repeatedly storing the read retry number until the number of error bits generated as results of performing the second read operation becomes the number of error-correctable bits or less. | 03-06-2014 |
20140071761 | NON-VOLATILE STORAGE WITH JOINT HARD BIT AND SOFT BIT READING - A system is disclosed for reading hard bit information and soft bit information from non-volatile storage. Some of the hard bit information and/or soft bit information is read concurrently by using different bit line voltages, different integration times, different sense levels within the sense amplifiers, or other techniques. A method is disclosed for determining the hard bits and soft bits in real time based on sensed hard bit information and soft bit information. | 03-13-2014 |
20140071762 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell and a select gate transistor formed on a semiconductor substrate. The memory cell includes a first gate insulating film, a first charge storage layer, a first intergate insulating film, and a first control gate. The first gate insulating film, the first charge storage layer, the first intergate insulating film, and the first control gate are formed on the semiconductor substrate in order. The select gate transistor includes a second gate insulating film, a first gate electrode, a second intergate insulating film, and a second control gate. The second gate insulating film, the first gate electrode, the second intergate insulating film, and the second control gate are formed on the semiconductor substrate in order. The second intergate insulating film different first and second thicknesses. | 03-13-2014 |
20140071763 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes the following structure. A memory cell array includes memory cells arranged at positions where bit lines and word lines cross are arranged on a semiconductor substrate. A sense amplifier reads data stored in the memory cell. The hookup region includes a transfer transistor arranged between the memory cell array and the sense amplifier. One end of a current path of the transfer transistor is connected to a first interconnect formed between the semiconductor substrate and the bit line. The other end of the current path is connected to the sense amplifier. A guard ring region is arranged between the memory cell array and the hookup region. A contact plug is arranged to overlap the guard ring region. | 03-13-2014 |
20140071764 | TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a direct injection semiconductor memory device are disclosed. In one embodiment, the techniques may be realized as a method for biasing a direct injection semiconductor memory device including the steps of applying a first non-negative voltage potential to a first region via a bit line and applying a second non-negative voltage potential to a second region via a source line. The method may also include applying a third voltage potential to a word line, wherein the word line may be spaced apart from and capacitively to a body region that may be electrically floating and disposed between the first region and the second region. The method may further include applying a fourth positive voltage potential to a third region via a carrier injection line, wherein the third region may be disposed below at least one of the first region, the body region, and the second region. | 03-13-2014 |
20140078828 | NVM WITH CHARGE PUMP AND METHOD THEREFOR - A non-volatile memory device comprises an array of memory cells and a charge pump coupled to the memory cells. The charge pump is dynamically reconfigurable to operate in a bypass mode to provide a first voltage to the memory cells, a program mode to provide the first voltage to the memory cells, and an erase mode to provide a second voltage that has inverse polarity of the first voltage. | 03-20-2014 |
20140085984 | Two-Transistor Non-Volatile Memory Cell and Related Program and Read Methods - A memory device includes an N-channel transistor and a P-channel transistor. A word line is electrically connected to a drain terminal of the N-channel transistor, and a source terminal of the P-channel transistor. A first bit line is electrically connected to a source terminal of the N-channel transistor. A second bit line is electrically connected to a drain terminal of the P-channel transistor. Gate terminals of the N-channel transistor and the P-channel transistor are electrically connected and floating. | 03-27-2014 |
20140085985 | Sigma Delta Over-Sampling Charge Pump Analog-To-Digital Converter - Techniques are presented for determining current levels based on the behavior of a charge pump system while driving a load under regulation. While driving the load under regulation, the number of pump clocks during a set interval is counted. This can be compared to a reference that can be obtained, for example, from the numbers of cycles needed to drive a known load current over an interval of the duration. By comparing the counts, the amount of current being drawn by the load can be determined. This technique can be applied to determining leakage from circuit elements, such as word lines in a non-volatile memory. The accuracy and level of resolution can be further increased through use of sigma delta noise shaping. | 03-27-2014 |
20140085986 | MEMORY ARRAY DEVICE AND METHOD FOR REDUCING READ CURRENT OF THE SAME - A memory array device is disclosed, which includes a plurality of memory array rows, each memory array row including a plurality of subsidiary memory arrays and a switch arranged between every adjacent two subsidiary memory arrays; wherein each subsidiary memory array includes: a memory unit for storing a data; a programming indication bit arranged prior to the memory unit for indicating whether the subsidiary memory array has been programmed; and an inversion indication bit arranged subsequent to the memory unit for indicating whether a data had been inverted before being written in the memory unit of the subsidiary memory array. A method for reducing a read current of a memory array device is also disclosed. | 03-27-2014 |
20140085987 | SEMICONDUCTOR MEMORY CIRCUIT - Provided is a semiconductor memory circuit excellent in long-term reliability and reading characteristics and having low current consumption. The semiconductor memory circuit includes: a first inverter; a first non-volatile memory, which is electrically writable; a second inverter; and a second non-volatile memory, the first inverter having an output connected to a source of the first non-volatile memory, the first non-volatile memory having a drain connected to an input of the second inverter, the second inverter having an output connected to a source of the second non-volatile memory, the second non-volatile memory having a drain connected to an input of the first inverter, the drain of the second non-volatile memory serving as an output of the semiconductor memory circuit. | 03-27-2014 |
20140085988 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to one embodiment of the present invention includes: a memory cell array and a control circuit. The control circuit executes a first reading operation and a second reading operation. The first reading operation is an operation of reading a threshold voltage set in the selected memory cell by setting a voltage between a control gate electrode and source of the selected memory cell to a first value. The second reading operation is an operation of reading a threshold voltage set in the selected memory cell by setting a voltage between the control gate electrode and source of the selected memory cell to a second value lower than the first value. When executing the second reading operation, the control circuit keeps a voltage of the control gate electrode of the selected memory cell to 0 or a positive value. | 03-27-2014 |
20140092687 | METHOD, APPARATUS, AND MANUFACTURE FOR STAGGERED START FOR MEMORY MODULE - A method, apparatus, and manufacture for memory device startup is provided. Flash memory devices are configured such that, upon the power supply voltage reaching a pre-determined level, each flash memory is arranged to load the random access memory with instructions for the flash memory, and then execute a first portion of the instructions for the flash memory. After executing the first portion of the instructions for the flash memory, each separate subset of the flash memories waits for a separate, distinct delay period. For each flash memory, after the delay period expires for that flash memory, the flash memory executes a second portion of the instructions for the flash memory. | 04-03-2014 |
20140098613 | MULTI-PORT SEMICONDUCTOR MEMORY DEVICE WITH MULTI-INTERFACE - A semiconductor memory device is provided which includes a first port configured to connect to a first processor and including a first interface circuit; a second port configured to connect to a second processor and including a second interface circuit; and a memory cell array including a first memory area connected to the first and second ports in common. The first memory area includes a plurality of magneto-resistive random access memory cells. The first interface circuit is configured to receive a DRAM interface signals, and the second interface circuit is configured to receive a flash memory interface signals. | 04-10-2014 |
20140104953 | SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR PRODUCING THE SAME - A semiconductor storage device | 04-17-2014 |
20140104954 | NON-VOLATILE SEMICONDUCTOR MEMORY HAVING MULTIPLE EXTERNAL POWER SUPPLIES - A memory device includes core memory such as flash memory for storing data. The memory device includes a first power input to receive a first voltage used to power the flash memory. Additionally, the memory device includes a second power input to receive a second voltage. The memory device includes power management circuitry configured to receive the second voltage and derive one or more internal voltages. The power management circuitry supplies or conveys the internal voltages to the flash memory. The different internal voltages generated by the power management circuitry (e.g., voltage converter circuit) and supplied to the core memory enable operations such as read/program/erase with respect to cells in the core memory. | 04-17-2014 |
20140112076 | SOFT READOUT FROM ANALOG MEMORY CELLS IN THE PRESENCE OF READ THRESHOLD ERRORS - A method includes storing data in a group of analog memory cells by writing respective analog values into the memory cells in the group. After storing the data, the analog values are read from the memory cells in the group one or more times using one or more respective read thresholds so as to produce readout results. Reliability measures are computed for the read analog values based on the readout results. An offset of the one or more read thresholds from an optimal read threshold position is estimated based on the reliability measures. The reliability measures are modified to compensate for the estimated offset, and the data stored in the analog memory cells in the group is decoded using the corrected reliability measures. | 04-24-2014 |
20140112077 | SNR ESTIMATION IN ANALOG MEMORY CELLS - A method includes programming a group of analog memory cells by writing respective analog values into the memory cells in the group. After programming the group, the analog values are read from the memory cells in the group using a set of read thresholds so as to produce readout results. Respective optimal positions for the read thresholds in the set are identified based on the readout results. A noise level in the readout results is estimated based on the identified optimal positions of the read thresholds. | 04-24-2014 |
20140112078 | APPARATUSES AND METHODS INCLUDING MEMORY ARRAY DATA LINE SELECTION - Some embodiments include an apparatus having data lines coupled to memory cell strings and a selector configured to selectively couple one of the data lines to a node. The memory cell strings and the selector can be formed in the same memory array of the apparatus. Other embodiments including additional apparatus and methods are described. | 04-24-2014 |
20140112079 | CONTROLLING AND STAGGERING OPERATIONS TO LIMIT CURRENT SPIKES - Systems and methods are disclosed for managing the peak power consumption of a system, such as a non-volatile memory system (e.g., flash memory system). The system can include multiple subsystems and a controller for controlling the subsystems. Each subsystem may have a current profile that is peaky. Thus, the controller may control the peak power of the system by, for example, limiting the number of subsystems that can perform power-intensive operations at the same time or by aiding a subsystem in determining the peak power that the subsystem may consume at any given time. | 04-24-2014 |
20140119123 | FAULT TOLERANT CONTROL LINE CONFIGURATION - A fault tolerant control line configuration useful in a variety of solid state memories such as but not limited to a flash memory. In accordance with some embodiments, an apparatus includes a plurality of memory cells, and a fault tolerant control line. The control line has an elongated first conductive path connected to each of the plurality of memory cells. An elongated second conductive path is disposed in a parallel, spaced apart relation to the first conductive path. A plurality of conductive support members are interposed between the first and second conductive paths to support the second conductive path above the first conductive path. | 05-01-2014 |
20140119124 | SEMICONDUCTOR MEMORY SYSTEMS USING REGRESSION ANALYSIS AND READ METHODS THEREOF - A memory system includes: a bit counter and a regression analyzer. The bit counter is configured to generate a plurality of count values based on data read from selected memory cells using a plurality of different read voltages, each of the plurality of count values being indicative of a number of memory cells of a memory device having threshold voltages between pairs of the plurality of different read voltages. The regression analyzer is configured to determine read voltage for the selected memory cells based on the plurality of count values using regression analysis. | 05-01-2014 |
20140119125 | FLASH MEMORY - The present invention provides a flash memory including a memory cell, a current limiter and a program voltage generator. The memory cell is programmed in response to a program current and a program voltage. The current limiter reflects amount of the program current by a data-line signal, e.g., a data-line voltage. The program voltage generator generates and controls the program voltage in response to the data-line voltage, such that the program current can track to a constant reference current. | 05-01-2014 |
20140126292 | Flash Memory with Data Retention Bias - Charge leakage from a floating gate in a NAND flash memory die is reduced by applying a data retention bias to a word line extending over the floating gates. The data retention bias is applied to one or more selected word lines when the memory die is in idle mode, when no read, write, erase, or other commands are being executed in the memory die. | 05-08-2014 |
20140126293 | Centralized Variable Rate Serializer and Deserializer for Bad Column Management - A memory circuit includes an array subdivided into multiple divisions, each connectable to a corresponding set of access circuitry. A serializer/deserializer circuit is connected to a data bus and the access circuitry to convert data between a (word-wise) serial format on the bus and (multi-word) parallel format for the access circuitry. Column redundancy circuitry is connect to the serializer/deserializer circuit to provide defective column information about the array. In converting data from a serial to a parallel format, the serializer/deserializer circuit skips words of the data in the parallel format based on the defective column information indicating that the location corresponds to a defective column. In converting data from a parallel to a serial format the serializer/deserializer circuit skips words of the data in the parallel format based on the defective column information indicating that the location corresponds to a defective column. | 05-08-2014 |
20140133240 | SOLID STATE STORAGE DEVICE WITH SLEEP CONTROL CIRCUIT - A solid state storage device receives a device sleep signal and a power signal from a host. The solid state storage device includes a control chip, a sleep control circuit, and a regulator. If the device sleep signal is activated, the control chip temporarily stores a system parameter into a flash memory module and then generates an acknowledge signal. The sleep control circuit receives the power signal, the device sleep signal and the acknowledge signal. If both of the device sleep signal and the acknowledge signal are activated, the sleep control circuit generates a disable state and a wake-up state. Moreover, if the power signal is received by the regulator and the sleep control circuit generates the disable state, the regulator stops providing a supply voltage to the control chip, so that the solid state storage device enters a sleep mode. | 05-15-2014 |
20140133241 | Memory Controllers and User Systems Including the Same - A user system is provided including a plurality of flash memory devices and a memory controller connected to the flash memory devices through a plurality of channels. The memory controller includes a voltage regulator configured to supply a power of the flash memory devices and a compensation unit configured to supply an additional power to the flash memory devices when a power required by the flash memory devices exceeds a predetermined level. The compensation unit includes a resistor unit connected to an output terminal of the voltage regulator and input terminals of the flash memory devices and a charging unit connected to input terminals of the flash memory devices. The charging unit is configured to supply an additional power to the flash memory devices according to voltages of input terminals of the flash memory devices. | 05-15-2014 |
20140133242 | MEMORY WITH OUTPUT CONTROL - An apparatus, system, and method for controlling data transfer to an output port of a serial data link interface in a semiconductor memory is disclosed. In one example, a flash memory device may have multiple serial data links, multiple memory banks and control input ports that enable the memory device to transfer the serial data to a serial data output port of the memory device. In another example, a flash memory device may have a single serial data link, a single memory bank, a serial data input port, a control input port for receiving output enable signals. The flash memory devices may be cascaded in a daisy-chain configuration using echo signal lines to serially communicate between memory devices. | 05-15-2014 |
20140133243 | CLOCK MODE DETERMINATION IN A MEMORY SYSTEM - A clock mode configuration circuit for a memory device is described. A memory system includes any number of memory devices serially connected to each other, where each memory device receives a clock signal. The clock signal can be provided either in parallel to all the memory devices or serially from memory device to memory device through a common clock input. The clock mode configuration circuit in each memory device is set to a parallel mode for receiving the parallel clock signal, and to a serial mode for receiving a source synchronous clock signal from a prior memory device. Depending on the set operating mode, the data input circuits will be configured for the corresponding data signal format, and the corresponding clock input circuits will be either enabled or disabled. The parallel mode and the serial mode is set by sensing a voltage level of a reference voltage provided to each memory device. | 05-15-2014 |
20140133244 | Twin MONOS Array for High Speed Application - A stitch area configuration for word gates and control gates of a twin MONOS metal bit array comprises control gates on sidewalls of the word gates wherein the word gates and control gates run in parallel. Control gate poly contacts contact each of the control gates aligned in a row at the stitch area perpendicular to the control gates. Two word gate poly contacts at the stitch area contact alternating word gates. Also provided are bit lines, word line and control gate decoders and drivers, a bit line decoder, a bit line control circuit, and a chip controller to control the memory array. The invention also provides twin MONOS metal bit array operations comprising several control gates driven by one control gate driver circuit and one word gate driven by one word gate driver circuit, as well as erase inhibit and block erase. | 05-15-2014 |
20140140138 | Three-Dimensional Flash Memory System - A three-dimensional flash memory system is disclosed. | 05-22-2014 |
20140140139 | INTERCONNECTION MATRIX USING SEMICONDUCTOR NON-VOLATILE MEMORY - An interconnection matrix consists of a plurality of semiconductor Non-Volatile Memory (NVM) forming an M×N array. Semiconductor NVM devices in the array are either programmed to a high threshold voltage state or erased to a low threshold voltage state according to a specific interconnection configuration. Applied with a gate voltage bias higher than the low threshold voltage and lower than the high threshold voltage to the control gates of the entire semiconductor NVM devices in the array, the configured interconnection network is formed. The disclosed interconnection matrix can be applied to configuring circuit routing in Integrated Circuit (IC). | 05-22-2014 |
20140146610 | MEMORY AND OPERATION METHOD THEREOF - An operation method of a memory includes the following steps: determining the number of memory units required to update the content stored therein when the memory is performing a program operation based on the N-bit input data and accordingly generate a first determination result; and providing (N−M) number of loads to a source line decoder of the memory if the first determination result indicates that there are M number of memory units required to update the content stored therein, and thereby coupling the (N−M) number of the provided loads to a transmission path of a power supply voltage in parallel, wherein N and M are natural numbers. A memory is also provided. | 05-29-2014 |
20140146611 | MEMORY DEVICE AND METHOD FOR PROGRAMMING MEMORY CELL OF MEMORY DEVICE - A method for programming a memory cell of a memory device includes the following steps. A plurality of cycle number ranges are set up. A specific one of the plurality of cycle number ranges, in which the memory cell having a drain terminal passes a program-verification, is determined. A bias voltage is applied to the drain terminal for programming the memory cell, wherein the bias voltage varies with the specific cycle number range. | 05-29-2014 |
20140146612 | THREE DIMENSIONAL MEMORY CONTROL CIRCUITRY - An integrated circuit includes a memory array, a wordline circuit, divided into at least two subcircuits, to control the memory array, and a bitline circuit, divided into at least two subcircuits, to control the memory array. The wordline subcircuits and the bitline subcircuits at least partially overlap separate respective regions of the memory array. | 05-29-2014 |
20140146613 | OPERATING METHOD OF MEMORY HAVING REDUNDANCY CIRCUITRY - In a method of operating a memory circuit, which includes a plurality of memory arrays each coupled with a corresponding input/output (IO) interface and a redundancy memory page a failing address of a failing bit cell is determined. The failing address is located in a memory page of one of the memory arrays. The method further includes repairing the failing bit cell by replacing the memory page with the redundancy memory page. | 05-29-2014 |
20140146614 | MEMORY DEVICE HAVING THREE-DIMENSIONAL GATE STRUCTURE - Subject matter disclosed herein relates to a memory device, and more particularly to a nonvolatile memory device having a recess structure and methods of fabricating same. | 05-29-2014 |
20140146615 | Method for Reading Data Stored in a Flash Memory According to a Threshold Voltage Distribution and Memory Controller and System Thereof - A method for reading data stored in a flash memory. The flash memory comprises a plurality of memory cells and each memory cell has a particular threshold voltage. The method includes: obtaining a first threshold voltage distribution representing threshold voltages of a first group of the memory cells; obtaining a second threshold voltage distribution representing threshold voltages of a second group of the memory cells, wherein the second threshold voltage distribution is different from the first threshold voltage distribution, and the first group of the memory cells comprises at least a part of the second group of the memory cells; and controlling the flash memory to perform at least one read operation upon the first group of the memory cells according to the second threshold voltage distribution. | 05-29-2014 |
20140153335 | ASYNCHRONOUS/SYNCHRONOUS INTERFACE - The present disclosure includes methods, and circuits, for operating a memory device. One method embodiment for operating a memory device includes controlling data transfer through a memory interface in an asynchronous mode by writing data to the memory device at least partially in response to a write enable signal on a first interface contact, and reading data from the memory device at least partially in response to a read enable signal on a second interface contact. The method further includes controlling data transfer in a synchronous mode by transferring data at least partially in response to a clock signal on the first interface contact, and providing a bidirectional data strobe signal on an interface contact not utilized in the asynchronous mode. | 06-05-2014 |
20140153336 | SEMICONDUCTOR MEMORY DEVICE HAVING A PLURALITY OF CHIPS AND CAPABILITY OF OUTPUTTING A BUSY SIGNAL - One package contains a plurality of memory chips. Each memory chip has an I/O terminal which generates a busy signal. The busy signal enables a busy state when a power supply voltage value reaches a specified and guaranteed range after a power-on sequence. The busy signal maintains the busy state until completion of initialization operations for the plurality of memory chips. The busy signal releases the busy state after completion of all initialization operations for the plurality of memory chips. | 06-05-2014 |
20140153337 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes memory cells, word lines, a driver circuit, and a control circuit. The memory cells are stacked above a semiconductor substrate, and each includes a charge accumulation layer and control gate. The word lines are coupled to the control gates. The driver circuit repeats a programming operation to write data in a memory cell coupled to a selected word line. In the programming operation, a first voltage is applied to the selected word line, a second voltage to a first unselected word line, and a third voltage to a second unselected word line. The control circuit steps up the first voltage and steps down the second voltage in repeating the programming. | 06-05-2014 |
20140160851 | APPARATUSES AND METHODS TO CONTROL BODY POTENTIAL IN MEMORY OPERATIONS - Some embodiments include apparatuses and methods having a memory cell string including memory cells located in different levels of the apparatus and a data line coupled to the memory cell string. The memory cell string includes a pillar body associated with the memory cells. At least one of such apparatus can include a module configured to store information in a memory cell among memory cells and/or to determine a value of information stored in a memory cell among memory cells. The module can also be configured to apply a voltage having a positive value to the data line and/or a source to control a potential of the body. Other embodiments are described. | 06-12-2014 |
20140160852 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD AND OPERATING METHOD FOR THE SAME - A semiconductor device and a manufacturing method and an operating method for the same are provided. The semiconductor device comprises a substrate, a doped region and a stack structure. The doped region is in the substrate. The stack structure is on the substrate. The stack structure comprises a dielectric layer, an electrode layer, a solid electrolyte layer and an ion supplying layer. | 06-12-2014 |
20140160853 | MEMORY ARRAY - A memory array used in the field of semiconductor technology includes a plurality of memory cells, bit lines, word lines perpendicular to the bit lines, and first/second control lines. The memory array uses split-gate memory cells, wherein two memory bit cells of a memory cell share one word line, thereby the read, program and erase of the memory cell can be realized by applying different voltages to the word line, two control gates and source/drain regions; the word line sharing structure enables a split-gate flash memory to effectively reduce the chip area and avoid over-erase problems while maintaining electrical isolation performance of the chip unchanged and not increasing the complexity of the process. | 06-12-2014 |
20140169098 | APPARATUSES AND METHODS INVOLVING ACCESSING MEMORY CELLS - Apparatuses and methods involving accessing memory cells are described. In one such method, chunks of memory cells in a memory array are enabled to be accessed and then one or more of the chunks are disabled from being accessed. In one such apparatus, an array includes chunks of memory cells and a chunk selector circuit coupled to each chunk to enable the memory cells in the respective chunk to be accessed. Additional embodiments are described. | 06-19-2014 |
20140169099 | MEMORY ARRAY - A memory array used in the field of semiconductor technology includes a plurality of memory cells, bit lines, word lines perpendicular to the bit lines, and first/second control lines. The memory array uses split-gate memory cells, wherein two memory bit cells of a memory cell share one word line, thereby the read, program and erase of the memory cell can be realized by applying different voltages to the word line, two control gates and source/drain regions; the word line sharing structure enables a split-gate flash memory to effectively reduce the chip area and avoid over-erase problems while maintaining electrical isolation performance of the chip unchanged and not increasing the complexity of the process. | 06-19-2014 |
20140169100 | SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device functioning as a multivalued memory device including: memory cells connected in series; a driver circuit selecting a memory cell and driving a second signal line and a word line; a driver circuit selecting any of writing potentials and outputting it to a first signal line; a reading circuit comparing a potential of a bit line and a reference potential; and a potential generating circuit generating the writing potential and the reference potential. One of the memory cells includes: a first transistor connected to the bit line and a source line; a second transistor connected to the first and second signal line; and a third transistor connected to the word line, bit line, and source line. The second transistor includes an oxide semiconductor layer. A gate electrode of the first transistor is connected to one of source and drain electrodes of the second transistor. | 06-19-2014 |
20140169101 | METHOD COMPENSATION OPERATING VOLTAGE, FLASH MEMORY DEVICE, AND DATA STORAGE DEVICE - Disclosed is a method generating a compensated operating voltage, such as a read voltage, in a non-volatile memory device, and a related non-volatile memory device. The operating voltage is compensated in response to one or more memory cell conditions such as temperature variation, programmed data state or physical location of a selected memory cell, page information for selected memory cell, or the location of a selected word line. | 06-19-2014 |
20140177340 | DETERMINING MEMORY PAGE STATUS - The present disclosure includes methods, devices, modules, and systems for operating semiconductor memory. One method embodiment includes determining a status of a page of memory cells without using input/output (I/O) circuitry, and outputting the status through the I/O circuitry. | 06-26-2014 |
20140192599 | TEST PARTITIONING FOR A NON-VOLATILE MEMORY - Systems and methods are provided for testing a non-volatile memory, such as a flash memory. The non-volatile memory may be virtually partitioned into a test region and a general purpose region. A test application may be stored in the general purpose region, and the test application can be executed to run a test of the memory locations in the test region. The results of the test may be stored in the general purpose region. At the completion of the test, the test results may be provided from the general purpose region and displayed to a user. The virtual partitions may be removed prior to shipping the electronic device for distribution. | 07-10-2014 |
20140198576 | PROGRAMMING TECHNIQUE FOR REDUCING PROGRAM DISTURB IN STACKED MEMORY STRUCTURES - A programming bias technique is described for programming a stacked memory structure with a plurality of layers of memory cells. The technique includes the controller circuitry responsive to a program instruction to program data in target cells in a stack of cells at a particular multibit address. The circuitry is configured to use an assignment of cells in the stack of cells to a plurality of sets of cells, and to iteratively execute a set program operation selecting each of the plurality of sets in sequence. Each iteration includes applying inhibit voltages to all of the cells in others of the plurality of sets. Also, each set of layers includes subsets of one or two, and there are at least two layers from other sets separating each of the subsets in one set. | 07-17-2014 |
20140198577 | SEMICONDUCTOR DEVICE - A semiconductor device includes a plurality of nonvolatile memory cells ( | 07-17-2014 |
20140198578 | Method Of Operating A Split Gate Flash Memory Cell With Coupling Gate - A method of operating a memory cell that comprises first and second regions spaced apart in a substrate with a channel region therebetween, a floating gate disposed over the channel region and the first region, a control gate disposed over the channel region and laterally adjacent to the floating gate with a portion disposed over the floating gate, and a coupling gate disposed over the first region and laterally adjacent to the floating gate. A method of erasing the memory cell includes applying a positive voltage to the control gate and a negative voltage to the coupling gate. A method of reading the memory cell includes applying positive voltages to the control gate, to the coupling gate, and to one of the first and second regions. | 07-17-2014 |
20140204676 | HIGH VOLTAGE SWITCH AND A NONVOLATILE MEMORY DEVICE INCLUDING THE SAME - A high voltage switch of a nonvolatile memory device includes a depletion type NMOS transistor configured to switch a second driving voltage in response to an output signal of the high voltage switch; at least one inverter configured to convert a voltage of an input signal of the high voltage switch into a first driving voltage or a ground voltage, wherein the first and second driving voltages are received from an external device; and a PMOS transistor configured to transfer the second driving voltage provided to a first terminal of the PMOS transistor from the depletion type NMOS transistor to a second terminal of the PMOS transistor as the output signal in response to an output of the at least one inverter, wherein the output of the at least one inverter is transferred to a gate terminal of the PMOS transistor. | 07-24-2014 |
20140204677 | APPARATUSES AND METHODS INCLUDING MEMORY WRITE OPERATION - Some embodiments include apparatuses and methods having memory cells and access lines coupled to the memory cells. In one such apparatus, the access lines include a first access line and a second access line. The first access line can be adjacent to the second access line. The memory cells include a memory cell associated with the second access line. A module can be configured to apply a voltage to the first access line during an operation of accessing the memory cell associated with the second access line, and to place the second access line in a floating state during at least a portion of a time interval within the operation. Other embodiments including additional apparatus and methods are described. | 07-24-2014 |
20140211567 | Low-Pin-Count Non-Volatile Memory Embedded in a Integrated Circuit without any Additional Pins for Access - A low-pin-count non-volatile memory (NVM) embedded an integrated circuit can be accessed without any additional pins. The NVM has one or more memory cells and at least one of the NVM cells can have at least one NVM element coupled to at least one selector and to a first supply voltage line. The selector can be coupled to a second supply voltage line and has a selecting signal. The integrated circuit can include at least one test mode detection circuit to activate a test mode upon detecting an abnormal (or out of normal) operation condition(s). Once a test mode is activated, at least one I/O or supply voltage of the integrated circuit can be used as the I/O or supply voltage of the NVM to select at least one NVM cell for read, program into nonvolatile, or volatile state. At least one NVM cell can be read during ramping of at least one supply voltage line. | 07-31-2014 |
20140219028 | Compensation Loop for Read Voltage Adaptation - The disclosure is directed to a system and method for nominal read voltage variations of a flash device. N reads are performed, each at a selected voltage offset from an initial read voltage. An N bit digital pattern associated with the selected voltage offsets is generated for the N reads. The N bit digital pattern generated by the N reads is mapped to a signed representation. A voltage adjustment based upon the signed representation is applied to at least partially compensate for a variation of the nominal read voltage to reduce bit error rate of the flash device. | 08-07-2014 |
20140219029 | PROGRAMMING METHOD FOR NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A method for programming a plurality of memory cells of a nonvolatile semiconductor memory device comprises the steps of: dividing the plurality of memory cells into M number of groups (M is an integer); successively selecting each of the M number of groups; generating M number of successive overlapping pulse signals; and programming the memory cells of the M number of groups in response to the respective M number of successive overlapping pulse signals. | 08-07-2014 |
20140219030 | High Density Vertical Structure Nitride Flash Memory - A charge trap type of memory having a memory channel with vertical and possibly horizontal components is described. The invention includes a new operation method of simultaneous hole and electron injection operation for high speed and high reliability non-volatile memories, as well as high-density non-volatile memories. Array implementations for high-density memory arrays and high-speed memory arrays and their fabrication methods are also described. | 08-07-2014 |
20140219031 | SMART BRIDGE FOR MEMORY CORE - An apparatus includes a first semiconductor device including a three-dimensional (3D) memory. The 3D memory includes multiple memory cells arranged in multiple physical levels above a substrate. The 3D memory further includes circuitry associated with operation of the multiple memory cells. The apparatus includes a second semiconductor device coupled to the first semiconductor device. The second semiconductor device includes a charge pump, and the 3D memory does not include a charge pump. | 08-07-2014 |
20140233317 | GENERATION OF A COMPOSITE READ BASED ON NEIGHBORING DATA - A victim group of one or more cells is read using a first read threshold to obtain a first raw read which includes one or more values. The victim group of cells is read using a second read threshold to obtain a second raw read which includes one or more values. A neighboring read, corresponding to a neighboring group of one or more cells associated with the victim group of cells, is obtained. A composite read is generated, including by selecting from at least the first raw read and the second raw read based at least in part on the neighboring read. | 08-21-2014 |
20140233318 | DYNAMIC DATA CACHES, DECODERS AND DECODING METHODS - Examples described include dynamic data caches (DDCs), decoders and decoding methods that may fit into a smaller width area. The DDCs, decoders and decoding method may be used in flash memory devices. A single column select line may be provided to select a plurality of cached bytes, while a second select line selects a byte of the selected plurality. The column select line may be routed parallel to bit lines carrying data, while the second select line may be routed perpendicular to the bit lines. | 08-21-2014 |
20140233319 | SEMICONDUCTOR DEVICE WITH ONE-TIME PROGRAMMABLE MEMORY CELL INCLUDING ANTI-FUSE WITH METAL/POLYCIDE GATE - A one-time programmable (OTP) memory cell includes a dual date transistor and, in some embodiments, two transistors. The dual gate transistor is formed using the same processing operations used to form floating gate transistors in other areas of the semiconductor device. The dual gate transistor includes an upper gate isolated from a floating gate by a floating gate oxide, the combination of which produces an anti-fuse. The nonvolatile memory device may include a plurality of such OTP memory cells and one or more OTP memory cells are selected and programmed by applying a voltage sufficient to blow the anti-fuse by causing the floating gate oxide layer to break down and the upper gate to become shorted to the floating gate. | 08-21-2014 |
20140241066 | Dual-Function Read/Write Cache for Programmable Non-Volatile Memory - A non-volatile memory, such as a one-time programmable memory, with a dual purpose read/write cache. The read/write cache is used as a write cache during programming, and stores the data to be written for a full row of the memory array. The programming operation simultaneously programs all cells in the selected row based on the contents of the write cache. In subsequent read operations, the read/write cache is used as a read cache. A full row of the array is simultaneously read in a read access, and the contents of that row are stored in the read cache. Subsequent access to that same row causes the data to be read from the read cache rather than requiring access of the array. | 08-28-2014 |
20140241067 | METHOD AND APPARATUS FOR READING DATA STORED IN FLASH MEMORY BY REFERRING TO BINARY DIGIT DISTRIBUTION CHARACTERISTICS OF BIT SEQUENCES READ FROM FLASH MEMORY - A method for reading data stored in a flash memory includes at least the following steps: controlling the flash memory to perform a plurality of read operations upon a plurality of memory cells included in the flash memory; obtaining a plurality of bit sequences read from the memory cells, respectively, wherein the read operations read bits of a predetermined bit order from the memory cells by utilizing different control gate voltage settings; and determining readout information of the memory cells according to binary digit distribution characteristics of the bit sequences. | 08-28-2014 |
20140254278 | Writing Data To A Thermally Sensitive Memory Device - Writing data to a thermally sensitive memory device, including: receiving a physical layout of the thermally sensitive memory device; receiving the direction of airflow across the thermally sensitive memory device; selecting an address for writing data to the thermally sensitive memory device in dependence upon the physical layout of the thermally sensitive memory device and the direction of airflow across the thermally sensitive memory device; and writing data to the selected address of the thermally sensitive memory device. | 09-11-2014 |
20140254279 | Writing Data To A Thermally Sensitive Memory Device - Writing data to a thermally sensitive memory device, including: receiving a physical layout of the thermally sensitive memory device; receiving the direction of airflow across the thermally sensitive memory device; selecting an address for writing data to the thermally sensitive memory device in dependence upon the physical layout of the thermally sensitive memory device and the direction of airflow across the thermally sensitive memory device; and writing data to the selected address of the thermally sensitive memory device. | 09-11-2014 |
20140269085 | DETERMINING READ VOLTAGES FOR READING MEMORY - A method of reading data at a data storage device that includes a non-volatile memory includes identifying a first set of storage elements of a first word line of the non-volatile memory that satisfy a condition. The condition is based on one or more states of one or more storage elements. The method includes determining a first read voltage corresponding to the first set of storage elements of the first word line and determining a second read voltage corresponding to a second set of storage elements of the first word line that do not satisfy the condition. The method includes reading data from the first word line by applying the first read voltage to the first set of storage elements of the first word line and applying the second read voltage to the second set of storage elements of the first word line. | 09-18-2014 |
20140269086 | SYSTEM AND METHOD OF ACCESSING MEMORY OF A DATA STORAGE DEVICE - Flash memory devices and methods of reading data from flash memory devices reduce an overall number of sensing operations when data is to be read from one word line in accordance with one or more flags set according to data read from another word line. | 09-18-2014 |
20140269087 | Lithography-friendly Local Read Circuit for NAND Flash Memory Devices and Manufacturing Method Thereof - A flash memory device comprising a local sensing circuitry is provided in a hierarchical structure with local and global bit lines. The local sensing circuitry comprise read and pass circuits configured to sense and amplify read currents during read operations, wherein the amplified read signals may be passed to a global circuit via the local and global bit lines. | 09-18-2014 |
20140269088 | SYSTEM AND METHOD OF READING DATA FROM MEMORY CONCURRENTLY WITH SENDING WRITE DATA TO THE MEMORY - A data storage device includes a memory, a controller, and a communication bus coupled to the memory and to the controller. The controller is configured to send a read-write command and write data to the memory via the communication bus. The read-write command indicates an address of requested data to be read from the memory. The controller is further configured to receive the requested data read from the memory. Communicating the requested data over the communication bus overlaps the write data being stored into the memory. | 09-18-2014 |
20140269089 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF TESTING THE SAME - A semiconductor memory device comprises a first-supplied-voltage-supplying pad, a second-supplied-voltage-supplying pad, a data input/output pad, a memory body, a buffer circuit and an impedance-controlling circuit. A first supplied voltage is supplied to the memory body. A second supplied voltage is supplied to the buffer circuit. The impedance-controlling circuit controls an impedance of the buffer circuit on a side connected to the data input/output pad. The semiconductor memory device comprises a voltage-generating circuit generating a first inner voltage. The impedance-controlling circuit comprises a first P-channel transistor. A source terminal of the first P-channel transistor is connected to the first-supplied-voltage-supplying pad, and the first inner voltage generated from the voltage-generating circuit is selectively supplied to a gate terminal of the first P-channel transistor. | 09-18-2014 |
20140293704 | Auto-Suspend and Auto-Resume Operations for a Multi-Die NAND Memory Device - A method and apparatus that controls a peak-current condition in a multi-die memory, such as a solid-state drive, by determining by at least one die of the multi-die memory whether a subsequent memory operation is a high-current memory operation, such as an operation to enable a charge pump of the die, an operation to charge a bit line of the die, or a program/erase loop operation, or a combination thereof. The die enters a suspended-operation mode if the subsequent memory operation is determined to be a high current memory operation. Operation is resumed by the die in response to a resume operation event, such as, but not limited to, a command specifically address to the die, an indication from another die that a high-current memory operation is complete. Once operation is resumed, the die performs the high-current memory operation. | 10-02-2014 |
20140293705 | ASYNCHRONOUS BRIDGE CHIP - A memory device multi-chip package containing conventional parallel bus flash memory dies interfacing to an external parallel bus having the same format and protocol. A bridge chip within the memory device interfaces internally over one or more internal parallel bus interfaces to the flash dies within the package. The bridge chip presents a single load on the external bus interface so that several memory device multi-chip packages (MCPs) can be connected to a controller, thereby increasing the number of flash dies supported by a single controller channel operating at full performance. | 10-02-2014 |
20140293706 | SEMICONDUCTOR MEMORY DEVICE, MEMORY MANAGEMENT METHOD, AND ELECTRONIC APPARATUS - There is provided a semiconductor memory device including a bit line configured to write data, and a time measurement unit configured to measure a write time of the bit line. | 10-02-2014 |
20140307509 | Method for and Flash Memory Device Having Improved Read Performance - A Flash memory device operable under a single-bit or multiple-bit serial protocol is provided with a capability to determine the address boundary condition of an application from the address field of an address boundary configurable (“ABC”) read command. Based on the identified address boundary condition, the Flash memory device may perform multiple sensing of the memory array as required by the ABC read command using optimal internal sense times for each sensing. The number of dummy bytes may be specified for the read command in advance by the user, based on the address boundary of the application and the desired frequency of operation of the Flash memory device. Therefore, Flash memory device read performance is improved both by minimizing the number of dummy bytes in the read command and by optimizing the internal sense times for the read operation. | 10-16-2014 |
20140307510 | INTEGRATED CIRCUIT INCLUDING A VOLTAGE DIVIDER AND METHODS OF OPERATING THE SAME - An integrated circuit includes at least one memory array and at least one capacitor array over a substrate. The at least one capacitor array includes a plurality of capacitor cell structures. The capacitor cell structures of the plurality of cell structures comprise a first capacitor electrode over the substrate. A second capacitor electrode is over the first capacitor electrode. A third capacitor electrode is adjacent to first sidewalls of the first and second capacitor electrodes. A fourth capacitor electrode is adjacent to second sidewalls of the first and second capacitor electrodes. A fifth capacitor electrode is over the substrate and adjacent to the fourth capacitor electrode. | 10-16-2014 |
20140313834 | RETENTION OPTIMIZED MEMORY DEVICE USING PREDICTIVE DATA INVERSION - A method for storing data. The method includes providing an addressable memory including a memory space, wherein the memory space includes a plurality of memory cells. The method includes configuring the addressable memory such that a majority of the plurality of memory cells in the memory space stores internal data values in a preferred bias condition when a first external data state of one or more external data states is written to the memory space, wherein the first external data state is opposite the preferred bias condition. | 10-23-2014 |
20140313835 | Semiconductor Memory Device and Data Programming Method Thereof - A data programming method of a semiconductor memory device is provided which includes randomizing write data using a randomization method selected from among a plurality of randomization methods according to whether the write data is programmed in one of a plurality of nonvolatile memories; and programming the randomized write data in at least one of the plurality of nonvolatile memories, wherein the plurality of nonvolatile memories has different types from one another. | 10-23-2014 |
20140321210 | METHOD FOR PROCESSING DATA, FLASH MEMORY, AND TERMINAL - Embodiments of the present invention provide a flash memory which has high operating efficiency and a longer service life, and relate to the field of electronic technologies. The flash memory includes a control circuit and a plurality of memory cells, where the memory cell is a floating-gate MOS transistor which includes a source, a gate, a drain, and a substrate; the control circuit is separately connected to the source, the gate, the drain, and the substrate and configured to output a control signal to them, so as to implement a bitwise overwrite operation on the memory cell; and the control circuit is further configured to generate a control signal when data stored by any one of the memory cells is 0, so that the memory cell overwrites the data stored by the memory cell from 0 to 1 according to the control signal. | 10-30-2014 |
20140347936 | RECOVERY OF INTERFACIAL DEFECTS IN MEMORY CELLS - A group of non-volatile, solid state memory cells are transferred from an active list that includes memory cells accessible to a host to a temporary list that includes memory cells temporarily inaccessible to the host. The memory cells included in the temporary list are maintained at a temperature that is substantially the same as or lower than that of memory cells included in the active list. The memory cells are transferred from the temporary list to the active list in response to satisfaction of a trigger condition. | 11-27-2014 |
20140362647 | DETERMINING SYSTEM LIFETIME CHARACTERISTICS - The present disclosure includes methods and systems for determining system lifetime characteristics. A number of embodiments include a number of memory devices and a controller coupled to the number of memory devices. The controller can be configured to perform a number of operations on the number of memory devices using a number of trim parameters at a testing level, and determine a system lifetime characteristic based, at least partially, on the number of operations performed on the number of memory devices using the number of trim parameters at the testing level. | 12-11-2014 |
20140362648 | NON-VOLATILE MEMORY SYSTEM AND METHOD OF PROGRAMMING THE SAME - A non-volatile memory system includes a first non-volatile memory device, a second non-volatile memory device that performs a write operation more slowly than the first non-volatile memory device, where the first and second non-volatile memory devices are different types of non-volatile memory devices, and a controller that controls the first and second non-volatile memory devices to concurrently perform the write operation for data input from a host based on a write command signal and that outputs a write completion signal to the host when one of the first and second non-volatile memory devices completes the write operation. | 12-11-2014 |
20140369130 | LOCAL SELF-BOOST USING A PLURALITY OF CUT-OFF CELLS ON A SINGLE SIDE OF A STRING OF MEMORY CELLS - Methods for local self-boost of a selected memory cell channel, memory devices, and systems are disclosed. One such method generates a cut-off channel under each of a plurality of memory cells on one of either a source side or a drain side of a selected memory cell. | 12-18-2014 |
20150009760 | THREE-DIMENSIONAL NONVOLATILE MEMORY AND RELATED READ METHOD DESIGNED TO REDUCE READ DISTURBANCE - A nonvolatile memory device performs a read operation comprising first and second intervals. In the first interval the device applies a turn-on voltage to string selection lines and ground selection lines connected to the string selection transistors and the ground selection transistors, respectively. In the second interval, the device applies a turn-off voltage to unselected string selection lines and unselected ground selection lines while continuing to apply the turn-on voltage to a selected string selection line and a selected ground selection line. In both the first and second intervals, the device applies a first read voltage to a selected wordline connected to memory cells to be read by the read operation and applying a second read voltage to unselected wordlines among connected to memory cells not to be read by the read operation. | 01-08-2015 |
20150009761 | CLOCK MODE DETERMINATION IN A MEMORY SYSTEM - A clock mode configuration circuit for a memory device is described. A memory system includes any number of memory devices serially connected to each other, where each memory device receives a clock signal. The clock signal can be provided either in parallel to all the memory devices or serially from memory device to memory device through a common clock input. The clock mode configuration circuit in each memory device is set to a parallel mode for receiving the parallel clock signal, and to a serial mode for receiving a source synchronous clock signal from a prior memory device. Depending on the set operating mode, the data input circuits will be configured for the corresponding data signal format, and the corresponding clock input circuits will be either enabled or disabled. The parallel mode and the serial mode is set by sensing a voltage level of a reference voltage provided to each memory device. | 01-08-2015 |
20150009762 | SWITCH AND SEMICONDUCTOR DEVICE INCLUDING THE SWITCH - A device for use with non-volatile memory, includes a first transistor of a first channel type coupled between first and second nodes, including a control gate supplied with a first control signal having a first phase, a second transistor of a second channel type different from the first channel type including a first terminal coupled to the first node, a second terminal coupled to a third node, a back gate coupled to the first terminal thereof, and a control gate supplied with a second control signal having a second phase substantially opposite to the first phase, a third transistor of the second channel type including a first terminal coupled to the second node, a second terminal coupled to the third node, a back gate coupled to the first terminal thereof, and a control gate supplied with the second control signal, and a protection circuit coupled between the first and second node. | 01-08-2015 |
20150016191 | DATA STORAGE DEVICE AND FLASH MEMORY CONTROL METHOD - An overclocking process for a data storage device using a flash memory. A controller for the flash memory tests the flash memory using test clocks with various frequencies to determine at least one clock signal suitable to the flash memory. The clock candidates suitable to the flash memory are selected from the test clocks. The flash memory is operated in a variable-frequency manner by which the flash memory is switched between the clock candidates, such that electromagnetic interference is spread over different bands. | 01-15-2015 |
20150016192 | METHOD OF USING NON-VOLATILE MEMORIES FOR ON-DIMM MEMORY ADDRESS LIST STORAGE - An integrated circuit device. The device includes an address input(s) configured to receive address information from an address stream from an address command bus coupled to a host controller and an address output(s) configured to drive address information, and is coupled to a plurality of memory (DRAM) devices provided on a DIMM. The device has an address match table comprising a non-volatile memory device configured to store at least a revised address corresponding to a spare memory location and a bad address of at least one of the plurality of memory (DRAM) devices. The device has a control module configured to process and determine whether each address matches with a stored address in the address match table to identify the bad address and configured to replace the bad address with the revised address of the spare memory location. | 01-15-2015 |
20150023104 | APPARATUSES AND METHODS FOR MEASURING AN ELECTRICAL CHARACTERISTIC OF A MODEL SIGNAL LINE AND PROVIDING MEASUREMENT INFORMATION - Apparatuses and methods for measuring an electrical characteristic of a model signal line and providing measurement information based at least in part on the measurement of the electrical characteristic. An example apparatus includes a signal line model including a model signal line configured to model electrical characteristics of a signal line. The apparatus further includes a measurement circuit coupled to the signal line model and configured to measure the electrical characteristic of the model signal line responsive to an input signal provided to the model signal line. The measurement circuit is further configured to provide measurement information based at least in part on the measurement to set a signal applied to the signal line. | 01-22-2015 |
20150023105 | Memory Cell Comprising First and Second Transistors and Methods of Operating - Semiconductor memory cells, array and methods of operating are disclosed. In one instance, a memory cell includes a bi-stable floating body transistor and an access device; wherein the bi-stable floating body transistor and the access device are electrically connected in series. | 01-22-2015 |
20150036435 | NONVOLATILE MEMORY DEVICE, MEMORY SYSTEM INCLUDING THE SAME, AND METHOD OF OPERATING NONVOLATILE MEMORY DEVICE - A non-volatile memory device includes a non-volatile memory cell array including a plurality of word lines, a voltage generator configured to generate a first high-voltage using a supply voltage and a second high-voltage using an external voltage which is higher than the supply voltage, and a word line selection circuit configured. The word line selection circuit is configured apply, during a program operation of the memory cell array, the first high-voltage to a selected word line among the plurality of word lines, and the second high-voltage to unselected word lines among the plurality of word lines | 02-05-2015 |
20150043279 | SEMICONDUCTOR MEMORY DEVICE - Provided is a semiconductor memory device including an oxide semiconductor insulated gate FET and having a capability to implement advanced performance without being affected by a variation in threshold voltage. A memory cell MC includes a memory node Nm formed at a connection point of a gate of a first transistor element T | 02-12-2015 |
20150043280 | Data Storage Device and Voltage Protection Method Thereof - A data storage device includes a flash memory, a voltage detection device, and a controller. The flash memory is arranged to store data. The voltage detection device is arranged to detect a supply voltage received by the data storage device. The controller is configured to receive write commands from a host, and perform a prohibition mode when the supply voltage is outside a predetermined range, wherein the write command is arranged to enable the controller to write the flash memory, and the controller is further configured to disable all of the write commands received from the host in the prohibition mode. | 02-12-2015 |
20150043281 | NON-VOLATILE STORAGE WITH TEMPERATURE COMPENSATION BASED ON NEIGHBOR STATE INFORMATION - Data is programmed into and read from a set of target memory cells. When reading the data, temperature compensation is provided. The temperature compensation is based on temperature information and the state of one or more neighbor memory cells. In one embodiment, when data is read from set of target memory cells, the system senses the current temperature and determines the differences in temperature between the current temperature and the temperature at the time the data was programmed. If the difference in temperature is greater than a threshold, then the process of reading the data includes providing temperature compensation based on temperature information and neighbor state information. In one alternative, the decision to provide the temperature compensation can be triggered by conditions other than a temperature differential. | 02-12-2015 |
20150049552 | DATA STORAGE DEVICE - A data storage device includes a nonvolatile memory device; and a controller electrically coupled with the nonvolatile memory device, and configured to control an operation of the nonvolatile memory device, wherein the controller is configured to change a frequency of an internal clock and a level of an internal voltage, according to whether data is being transmitted through a channel. | 02-19-2015 |
20150049553 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a memory cell, a sense amplifier electrically connected to the memory cell, the sense amplifier including a node for sensing a voltage during a sense operation and a data latch electrically connected to the node and configured to hold a first voltage corresponding to a voltage of the node when a strobe signal is issued during a strobe operation, and a controller configured to raise the voltage of the node during the strobe operation before the strobe signal is issued. | 02-19-2015 |
20150049554 | MEMORY SYSTEM INCLUDING A MEMORY DEVICE, AND METHODS OF OPERATING THE MEMORY SYSTEM AND THE MEMORY DEVICE - A method is provided for operating a memory device. The method includes counting, from among memory cells, a number of first off-cells with respect to a first reading voltage and a number of second off-cells with respect to a second reading voltage, comparing the number of first off-cells and the number of second off-cells, and determining, based on a result of the comparing, whether a programming error exists in a storage region in which the memory cells are included. | 02-19-2015 |
20150055415 | CONTROLLER - According to one embodiment, CONTROLLER includes a phase comparator that receives a data strobe signal outputted from a memory in response to a read enable signal, and a delayed data strobe signal formed by applying a delay to the data strobe signal, and outputs a result of comparison between phases of two signals. The controller also includes a Duty control unit that corrects a Duty of the read enable signal outputted to the memory based upon the comparison result of the phase comparator. | 02-26-2015 |
20150055416 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND DATA PROGRAMMING METHOD - According to one embodiment, a nonvolatile semiconductor memory device includes memory cell units, bit lines, word lines, and a controller. Each of the memory cell units includes a plurality of memory cells connected in series. Bit lines are connected respectively to the corresponding memory cell units. Each of the word lines is commonly connected to control gates of the corresponding memory cells of the memory cell units. The controller is configured to control a programming operation of data to the memory cells. The controller is configured to execute a first procedure including programming the data to the memory cell connected to the (4n−3)th (n being a natural number) bit line and the memory cell connected to the (4n−2)th bit line, and a second procedure including programming the data to the memory cell connected to the (4n−1)th bit line and the memory cell connected to the 4nth bit line. | 02-26-2015 |
20150063034 | MEMORY SYSTEM INCLUDING NONVOLATILE MEMORY - According to one embodiment, a memory system includes a nonvolatile memory and a control circuit. The nonvolatile memory includes a storage area having a plurality of memory cells configured to store data. The control circuit determines whether data write to the storage area is possible or impossible. | 03-05-2015 |
20150063035 | MEMORY DEVICE BIASING METHOD AND APPARATUS - Memory devices and methods are disclosed, such as those facilitating data line shielding by way of capacitive coupling with data lines coupled to a memory string source line. For example, alternating data lines are sensed while adjacent data lines are coupled to a common source line of the data lines being sensed. Data line shielding methods and apparatus disclosed can reduce effects of source line bounce occurring during a sense operation of a memory device. | 03-05-2015 |
20150071002 | DYNAMIC REFERENCE CURRENT SENSING - A circuit comprises a first path, a second path, a current generating circuit, and a sense amplifier. The first path has a first current having a first current value. The second path has a second current having a second current value. The current generating circuit is configured to generate a reference current having a reference current value based on the first current value and the second current value. The sense amplifier is configured to receive a third current having a third current value and to generate a logical value based on the reference current value and the third current value. | 03-12-2015 |
20150071003 | DATA WRITE CONTROL DEVICE AND DATA STORAGE DEVICE - According to one embodiment, a data transfer control device complying with a communication protocol which executes an update of information from an attachment device in a predetermined area of a system memory, the device includes a receiving part receiving the information from the attachment device, a transferring part transferring the information in the predetermined area, the information from the transferring part overwritten in the predetermined area sequentially, and a determining part inhibiting a transfer of the information in the transferring part to omit the update of the information in the predetermined area. | 03-12-2015 |
20150071004 | SEMICONDUCTOR MEMORY SYSTEM INCLUDING A PLURALITY OF SEMICONDUCTOR MEMORY DEVICES - A communication line is connected to first and second chips, and held at a first signal level. A monitor circuit changes a signal level of the communication line from the first signal to a second signal level while one of the first and second chips uses a current larger than a reference current. When the signal level of the communication line is the second signal level, the other of the first and second chips is controlled to a wait state that does not transfer to an operating state of using a current larger than the reference current. | 03-12-2015 |
20150078091 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes: a memory cell array; a first data latch; a second data latch; a first data bus; a second data bus; a first temporary latch; a second temporary latch; and a control unit. The first and the second data latches are electrically connected to the memory cell array. The first data bus is electrically connected to the first data latch. The second data bus is electrically connected to the second data latch. The first temporary latch is electrically connected to the first data bus. The second temporary latch is electrically connected to the second data bus. The control unit is configured to write data on the first temporary latch and transfer data retained in the first temporary latch to the first data latch while writing data on the second temporary latch. | 03-19-2015 |
20150078092 | Non-Volatile Semiconductor Memory Adapted to Store a Multi-Valued Data in a Single Memory Cell - A non-volatile semiconductor memory device includes an electrically data rewritable non-volatile semiconductor memory cell and a write circuit for writing data in the memory cell, the write circuit writing a data in the memory cells by supplying a write voltage Vpgm and a write control voltage VBL to the memory cell, continuing the writing of the data in the memory cell by changing the value of the write control voltage VBL in response to an advent of a first write state of the memory cell and inhibiting any operation of writing a data to the memory cell by further changing the value of the write control voltage VBL to Vdd in response to an advent of a second write state of the memory cell. | 03-19-2015 |
20150085580 | MEMORY DEVICE WITH MULTIPLE CELL WRITE FOR A SINGLE INPUT-OUTPUT IN A SINGLE WRITE CYCLE - A non-volatile memory device incorporates a write buffer within a multi-level column decoder to enable multiple memory cells associated with a single write driver to be written in parallel. In this manner, in a non-volatile memory such as a flash memory that performs batch write operation, a group of data bits for a single I/O can be written to the memory cells at a time, thereby reducing the number of write cycles required for writing a block of program data and increasing the speed of write operation. | 03-26-2015 |
20150085581 | NON-VOLATILE MEMORY PROGRAMMING - Some embodiments include a memory device and a method of programming memory cells of the memory device. One such method can include applying a signal to a line associated with a memory cell, the signal being generated based on digital information. The method can also include, while the signal is applied to the line, determining whether a state of the memory cell is near a target state when the digital information has a first value, and determining whether the state of the memory cell has reached the target state when the digital information has a second value. Other embodiments including additional memory devices and methods are described. | 03-26-2015 |
20150085582 | PROGRAMMING METHOD OF NONVOLATILE MEMORY DEVICE - Provided is a programming method of a nonvolatile memory device which includes a plurality of strings each including a source select transistor, a plurality of memory cells, and a drain select transistor which are connected in series between a common source line and a bit line, The programming method includes: applying a first voltage to the common source line during a first period in which a channel of a plurality of memory cells of an unselected string is floated; and applying a second voltage increased more than the first in voltage to the common source line during a second period in which a selected memory cell is programmed, when a selected word line belongs to a word line group adjacent to the common source line. | 03-26-2015 |
20150085583 | NONVOLATILE MEMORY APPARATUS, PROGRAM METHOD THEREOF, AND DATA PROCESSING SYSTEM USING THE SAME - A nonvolatile memory apparatus includes: a memory cell area including a plurality of memory cells connected to a word line and a bit line; a program time controller configured to determine a program voltage application time for a selected word line, as the selected word line is selected in response to a program command and an address signal; and a controller configured to apply a program voltage to the selected word line according to the program voltage application time determined by the program time controller. | 03-26-2015 |
20150098275 | FLASH MEMORY BASED ON STORAGE DEVICES AND METHODS OF OPERATION - A method transfers read data from a flash memory to a controller synchronously with respect to a data strobe signal during a read data transfer period. During an initial control period of the read data transfer period, the cycle of the data strobe signal is expanded such that a pulse width of the resulting cycle-controlled data strobe signal is greater than a pulse width of the data strobe signal. | 04-09-2015 |
20150117108 | SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING AND OPERATING THE SAME - A semiconductor device includes a memory cell array including a vertical channel layer, two or more selection transistors, and a plurality of memory cells formed along the vertical channel; a peripheral circuit suitable for programming the two or more selection transistors and the memory cells; and a control circuit suitable for controlling the peripheral circuit to decrease a pass voltage applied to one word line adjacent to two or more selection lines coupled to the respective selection transistors, during a program operation in which the peripheral circuit applies a program voltage to the two or more selection lines and applies the pass voltage to a plurality of word lines connected to the memory cells. | 04-30-2015 |
20150117109 | HOT-CARRIER INJECTION PROGRAMMABLE MEMORY AND METHOD OF PROGRAMMING SUCH A MEMORY - The present disclosure relates to a memory comprising at least one word line comprising a row of split gate memory cells each comprising a selection transistor section comprising a selection gate and a floating-gate transistor section comprising a floating gate and a control gate. According to the present disclosure, the memory comprises a source plane common to the memory cells of the word line, to collect programming currents passing through memory cells during their programming, and the selection transistor sections of the memory cells are connected to the source plane. A programming current control circuit is configured to control the programming current passing through the memory cells by acting on a selection voltage applied to a selection line. | 04-30-2015 |
20150117110 | CONNECTING STORAGE GATE MEMORY - Technologies are generally related to a connecting storage gate memory device, system, and method of manufacture. | 04-30-2015 |
20150131382 | SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor storage device including a memory cell array including a memory cell and a circuit element including first wirings and a selection element, the first wirings having a wiring width smaller than a resolution limit of an exposure apparatus. The first wirings extend in a first direction and are aligned in a second direction crossing with the first direction. A second wiring, being one of the first wirings, is cut by at least one cut region. The first wiring adjacent to the second wiring in the second direction extends continuously in the first direction in a portion adjacent to the cut region in the second direction. | 05-14-2015 |
20150131383 | NON-VOLATILE IN-MEMORY COMPUTING DEVICE - Disclosed is an in-memory computing device including a memory array with non-volatile memory cells arranged in rows and columns; a multiple row decoder to activate at least two cells in a column of the memory array at the same time to generate a parametric change in a bit line connected to at least one cell in the column; and circuitry to write data associated with the parametric change into the memory array. Additionally disclosed is a method of computing inside a memory array including non-volatile memory cells arranged in rows and columns, the method includes activating at least two cells in a column of the memory array at the same time to generate a parametric change in a bit line connected to at least one cell in the column; and writing data associated with the parametric change into the memory array. | 05-14-2015 |
20150138891 | EMBEDDED CHARGE TRAP MULTI-TIME-PROGRAMMABLE-READ-ONLY-MEMORY FOR HIGH PERFORMANCE LOGIC TECHNOLOGY - An embedded Multi-Time-Read-Only-Memory having a (MOSFET) cells' array having an initial threshold voltage (VT | 05-21-2015 |
20150294730 | METHOD OF SHAPING A STROBE SIGNAL, A DATA STORAGE SYSTEM AND STROBE SIGNAL SHAPING DEVICE - A strobe signal shaping method for a data storage system includes receiving a strobe signal; boosting a first clock edge portion of the strobe signal when the strobe signal is received after having been idle or paused over a predetermined time period; and returning to an operating mode in which boosting is turned off with respect to a second clock edge portion of the strobe signal. | 10-15-2015 |
20150302930 | FLASH STORAGE DEVICE WITH DATA INTEGRITY PROTECTION - A flash storage device includes a power hold circuit including a double layer capacitor. A power source supplies power to the flash storage device and charges the double layer capacitor. The double layer capacitor supplies power for maintaining integrity of data during a data transfer occurring in the flash storage device when the power supplied by the power source is disrupted. Additionally, the flash storage device can inhibit subsequent data transfers until the power supplied by the power source is restored. | 10-22-2015 |
20150303210 | Lithography-friendly Local Read Circuit for NAND Flash Memory Devices and Manufacturing Method Thereof - A flash memory device comprising a local sensing circuitry is provided in a hierarchical structure with local and global bit lines. The local sensing circuitry comprise read and pass circuits configured to sense and amplify read currents during read operations, wherein the amplified read signals may be passed to a global circuit via the local and global bit lines. | 10-22-2015 |
20150310918 | EPROM CELL ARRAY, METHOD OF OPERATING THE SAME, AND MEMORY DEVICE INCLUDING THE SAME - An EPROM cell array includes a cell array including multiple unit cells, each of which includes a MOSFET having a floating gate, and which are disposed in an array with a plurality of rows and a plurality of columns; multiple first selection lines each coupled with drains of unit cells, which are disposed on the same row among the multiple unit cells; and multiple second selection lines each coupled with sources of unit cells, which are disposed on the same column among the unit cells, wherein a selected unit cell to be programmed or read is selected by one of the multiple first selection lines, and one of the multiple second selection lines | 10-29-2015 |
20150318048 | Non-Volatile Semiconductor Storage Device - To propose a non-volatile semiconductor memory device capable of suppressing occurrence of disturbance more greatly than in a conventional technique while achieving miniaturization. A plurality of word lines are formed in a matrix in the non-volatile semiconductor memory device, power supply units are respectively provided for word line columns (memory wells), a different unit voltage is applied for each of power supply units depending on whether or not a selected memory cell exists in the word line column, a switching mechanism in each of the power supply units is switched by the word line depending on a value of a voltage on a control line, a charge storage gate voltage or a charge storage inhibition gate voltage is individually applied for each of the word lines so that the charge storage inhibition gate voltage value and a bit line voltage value can be freely set for each of the word line columns to values at which occurrence of disturbance can be suppressed. A plurality of power supply units are connected to the control line in a common row direction, and a row-direction address decoder, which is independent for each of the word line columns is not required so that the non-volatile semiconductor memory device can be miniaturized. | 11-05-2015 |
20150332768 | MEMORY MODULES WITH MULTI-CHIP PACKAGED INTEGRATED CIRCUITS HAVING FLASH MEMORY - In one embodiment of the invention, a memory module is disclosed including a printed circuit board with an edge connector; an address controller coupled to the printed circuit board; and a plurality of memory slices. Each of the plurality of memory slices of the memory module includes one or more memory integrated circuits coupled to the printed circuit board, and a slave memory controller coupled to the printed circuit board and the one or more memory integrated circuits. The slave memory controller receives memory access requests for the memory module from the address controller. The slave memory controller selectively activates one or more of the one or more memory integrated circuits in the respective memory slice in response to the address received from the address controller to read data from or write data into selected memory locations in the memory integrated circuits. | 11-19-2015 |
20150332778 | SEMICONDUCTOR MEMORY SYSTEMS USING REGRESSION ANALYSIS AND READ METHODS THEREOF - A memory system includes: a bit counter and a regression analyzer. The bit counter is configured to generate a plurality of count values based on data read from selected memory cells using a plurality of different read voltages, each of the plurality of count values being indicative of a number of memory cells of a memory device having threshold voltages between pairs of the plurality of different read voltages. The regression analyzer is configured to determine read voltage for the selected memory cells based on the plurality of count values using regression analysis. | 11-19-2015 |
20150332779 | Method for Reading Data Stored in a Flash Memory According to a Threshold Voltage Distribution and Memory Controller and System Thereof - A method for reading data stored in a flash memory. The flash memory comprises a plurality of memory cells and each memory cell has a particular threshold voltage. The method includes: obtaining a first threshold voltage distribution representing threshold voltages of a first group of the memory cells; obtaining a second threshold voltage distribution representing threshold voltages of a second group of the memory cells, wherein the second threshold voltage distribution is different from the first threshold voltage distribution, and the first group of the memory cells comprises at least a part of the second group of the memory cells; and controlling the flash memory to perform at least one read operation upon the first group of the memory cells according to the second threshold voltage distribution. | 11-19-2015 |
20150332780 | STORAGE DEVICE, OPERATING METHOD OF STORAGE DEVICE AND METHOD OF ACCESSING STORAGE DEVICE - An operating method of a storage device is provided. The storage device includes a nonvolatile memory and a memory controller to control the nonvolatile memory. Temperature is detected. A current weighted time is calculated using the temperature. Data is read from the nonvolatile memory using a read voltage level which is adjusted based on the current weighted time. The current weighted time is determined according to an amount of charges leaked from memory cells storing the data at the temperature. | 11-19-2015 |
20150332781 | NONVOLATILE MEMORY SYSTEM WITH IMPROVED SIGNAL TRANSMISSION AND RECEPTION CHARACTERISTICS AND METHOD OF OPERATING THE SAME - A non-volatile memory system and a method of operating a non-volatile memory system are provided. The method includes receiving a command from a host, generating a strobe signal using a clock signal, generating a command response synchronized with the strobe signal and corresponding to the received command and outputting the strobe signal and the command response. | 11-19-2015 |
20150333085 | THREE DIMENSIONAL MEMORY STRUCTURE - A method to fabricate a three dimensional memory structure includes forming an array stack, creating a layer of sacrificial material above the array stack, etching a hole through the layer of sacrificial material and the array stack, creating a pillar of semiconductor material in the hole to form at least two vertically stacked flash memory cells that use the pillar as a common body, removing at least some of the layer of sacrificial material around the pillar to expose a portion of the pillar, and forming a field effect transistor (FET) using the portion of the pillar as the body of the FET. | 11-19-2015 |
20150340097 | VOLTAGE GENERATOR AND SEMICONDUCTOR MEMORY DEVICE - A voltage generator includes a first trim unit and a second trim unit. The first trim unit generates a first voltage variable depending on temperature variation and a second voltage invariable irrespective of the temperature variation based on a power supply voltage, and performs a first trim operation by changing a level of the second voltage. The level of the second voltage at a first temperature becomes substantially the same as a level of the first voltage at the first temperature based on the first trim operation. The second trim unit generates an output voltage based on the power supply voltage, the first and second voltages, a reference voltage and a feedback voltage, and performs a second trim operation by adjusting variation of the output voltage depending on the temperature variation based on a result of the first trim operation. | 11-26-2015 |
20150340370 | THREE-DIMENSIONAL NONVOLATILE MEMORY DEVICE, SEMICONDUCTOR SYSTEM INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SAME - A three-dimensional nonvolatile memory device includes a first vertical channel layer and a second vertical channel layer extending from a substrate, a plurality of memory cells, first selection transistors and second selection transistors spaced apart from each other along the first vertical channel layer and the second vertical channel layer, a pad, a contact plug and a bit line in a stacked configuration over the first vertical channel layer, and a common source line formed over the second vertical channel layer. | 11-26-2015 |
20150348630 | NON-VOLATILE MEMORY DEVICE AND METHOD OF PROGRAMMING THE SAME - A non-volatile memory device includes a first word line, a second word line, first memory cells, second memory cells, and an address decoder. The second word line is adjacent to the first word line. The first memory cells are connected to the first word line. The second memory cells are connected to the second word line. The second memory cells are connected to the first memory cells, respectively. The address decoder applies a first voltage to the first word line and applies a second voltage to the second word line in an over program period of the first memory cells. The first voltage is higher than a program voltage of the first and second memory cells. The second voltage is lower than a pass voltage of the first and second memory cells. | 12-03-2015 |
20150348643 | DYNAMIC PROGRAM WINDOW DETERMINATION IN A MEMORY DEVICE - A memory device has an array of memory cells and a controller coupled to the array of memory cells. The controller is configured to determine a program window after a portion of a particular programing operation performed on the memory device is performed and before a subsequent portion of the particular programing operation performed on the memory device is performed. The controller is configured to determine the program window responsive to an amount of program disturb experienced by a particular state of a memory cell. The controller is configured to perform the subsequent portion of the particular programing operation performed on the memory device using the determined program window. | 12-03-2015 |
20150364203 | HIGH-VOLTAGE SWITCHING CIRCUIT FOR FLASH MEMORY DEVICE - A high-voltage switching device for a flash memory includes at least one pumping transistor which includes one junction terminal and another junction terminal which are commonly connected to a control signal, and a gate terminal connected to a select signal. The high-voltage switching device also includes at least one switching transistor that includes one junction terminal connected to an input signal, another junction terminal connected to an output signal, and a gate terminal connected to the select signal. A layout of the high-voltage switching device includes a pumping active area in which the one junction terminal and the another junction terminal of the pumping transistor are disposed; a control interconnection area in which an interconnection of the control signal is wired; and a select interconnection area in which an interconnection of the select signal is wired. | 12-17-2015 |
20150371712 | DYNAMIC ADJUSTMENT OF READ VOLTAGE LEVELS BASED ON MEMORY CELL THRESHOLD VOLTAGE DISTRIBUTION - A system and methods to find the threshold voltage distribution across a set of nonvolatile memory cells, such that embodiments may incorporate this distribution information into calculations that may change the read compare voltages used to read the memory cells, while ensuring adequate separation in read voltage between different data states at which the memory cells may be read. | 12-24-2015 |
20150380099 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a sense amplifier, and the sense amplifier includes a bus, first and second latch circuits, and a third transistor. The first latch circuit includes a first transistor connected to the bus, and the second latch circuit includes a second transistor connected to the bus. When data is transmitted from the first latch circuit to the second latch circuit, a third transistor is switched on to precharge the bus by applying a first voltage that is lower than a power source voltage of the first and second latch circuits to a gate of the third transistor. Thereafter, second and third voltages that are lower than the power source voltage are applied to gates of first and second transistors, respectively. | 12-31-2015 |
20160005467 | COMMAND SIGNAL MANAGEMENT IN INTEGRATED CIRCUIT DEVICES - Methods of operating integrated circuit devices include logically combining an output signal indicating whether an operation is being performed with the logic level of a command signal line to generate a command signal to control circuitry of the integrated circuit device having the logic level of the command signal line when the output signal indicates that the operation is not being performed, and having a particular logic level when the output signal indicates that the operation is being performed. Integrated circuit devices include a command signal management circuit to provide a logic level of a particular command signal to control circuitry of the integrated circuit device when control signals indicate a desire to allow the particular command signal, and to provide a particular logic level to the control circuitry when the control signals indicate a desire to block the particular command signal. | 01-07-2016 |
20160005485 | Semiconductor Device Having Features to Prevent Reverse Engineering - A ROM circuit includes a first N channel transistor having an output and having device geometry and device characteristics adapted to bias the output at a predetermined level when a P channel circuit is connected to the first N channel transistor; a pass transistor connected between the output and a data bus, the pass transistor connected to a word line, the word line adapted to turn ON the pass transistor when the word line is asserted; and the P channel circuit connected to the data bus and adapted to provide leakage current to charge a gate in the first N channel transistor when pass transistor is turned ON. | 01-07-2016 |
20160005488 | EXTERNAL STORAGE DEVICE AND METHOD OF SETTING REFERENCE FREQUENCY FOR THE SAME - An external storage device and method of setting a reference frequency for the same are provided. The external storage device includes: a device manager configured to set a reference frequency using information about the reference frequency for a high-speed mode received in a low-speed mode after the external storage device starts initialization, and control the external storage device to operate at the reference frequency in the high-speed mode, wherein the external storage device is a removable device which is attachable to and detachable from a host and is configured to operate according to a reference clock signal with the reference frequency in the high-speed mode. | 01-07-2016 |
20160005489 | Controlling a Flash Device Having Time-Multiplexed, On-Die-Terminated Signaling Interface - An IC die transmits command signals, address signals and data signals to a flash memory device at respective times via a time-multiplexed external signaling line, the data signals representing data to be stored within an array of non-volatile storage elements of the flash memory device. The IC die additionally transmits a control signal to the flash memory device via one or more external control signal lines, the control signal directing the flash memory device to switchably couple an on-die termination element to the time-multiplexed signaling line. | 01-07-2016 |
20160005746 | MEMORY ARCHITECTURE OF 3D ARRAY WITH INTERLEAVED CONTROL STRUCTURES - A 3D memory device includes a first plurality and a second plurality of stacks of semiconductor material strips on a substrate. The second plurality of stacks of gate material strips on the substrate is interleaved with, and coplanar with, the first plurality of stacks. The second plurality of stacks is configured as gates for the first plurality of stacks. A first plurality of word lines is arranged orthogonally over, and having surfaces conformal with, the first plurality of stacks, such that a 3D array of memory elements is established at cross-points between surfaces of the first plurality of stacks and the plurality of word lines. | 01-07-2016 |
20160012894 | NON-VOLATILE MEMORY AND COLUMN DECODER THEREOF | 01-14-2016 |
20160012896 | NON-VOLATILE MULTIPLE TIME PROGRAMMABLE MEMORY DEVICE | 01-14-2016 |
20160019983 | System and method of a novel redundancy scheme for OTP - A novel redundancy scheme to repair no more than one defect per I/O in a One-Time-Programmable (OTP) memory is disclosed. An OTP memory has a plurality of OTP cells in a plurality of I/Os and at least one auxiliary OTP cell associated with each I/O. At least one volatile cell in each I/O corresponds to the auxiliary OTP cells. At least one Boolean gate to invert the data into and/or out of the main OTP memory in each I/O independently based on the data in the volatile cells. The data in each I/O of the OTP memory can be inverted if no more than one defect per I/O is found. Furthermore, the inversion scheme can be achieved by reading the auxiliary OTP cells and storing into the volatile cells by automatically generating at least one read cycle upon initialization. | 01-21-2016 |
20160020220 | NON-VOLATILE ONE-TIME PROGRAMMABLE MEMORY DEVICE - An apparatus includes a metal gate, a substrate material, and an oxide layer between the metal gate and the substrate material. The oxide layer includes a hafnium oxide layer contacting the metal gate and a silicon dioxide layer contacting the substrate material and contacting the hafnium oxide layer. The metal gate, the substrate material, and the oxide layer are included in a one-time programmable (OTP) memory device. The OTP memory device includes a transistor. A non-volatile state of the OTP memory device is based on a threshold voltage shift of the OTP memory device. | 01-21-2016 |
20160027522 | RETENTION LOGIC FOR NON-VOLATILE MEMORY - An integrated circuit memory device includes an array of non-volatile, charge trapping memory cells, configured to store data values in memory cells in the array using threshold states, including a higher threshold state. Retention check logic executes to identify memory cells in the higher threshold state which fail a threshold retention check. Also, logic is provided to reprogram the identified memory cells. | 01-28-2016 |
20160027524 | DATA STORAGE DEVICE AND OPERATING METHOD THEREOF - An operating method of a data storage device includes performing a first static read fail solving operation in which the memory cell is read by applying read fail solving voltages included in a first group to the memory cell; and performing a second static read fail solving operation in which the memory cell is read by applying read fail solving voltages included in a second group to the memory cell after the first static read fail solving operation fails, wherein read success numbers of the respective read fail solving voltages included in the first group are larger than read success numbers of the respective read fail solving voltages included in the second group. | 01-28-2016 |
20160027793 | SEMICONDUCTOR DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATED METHODS - Semiconductor devices, such as three-dimensional memory devices, include a memory array including a stack of conductive tiers and a stair step structure. The stair step structure is positioned between first and second portions of the memory array and includes contact regions for respective conductive tiers of the stack of conductive tiers. The first portion of the memory array includes a first plurality of select gates extending in a particular direction over the stack. The second portion of the memory array includes a second plurality of select gates also extending in the particular direction over the stack of conductive tiers. Methods of forming and methods of operating such semiconductor devices, including vertical memory devices, are also disclosed. | 01-28-2016 |
20160035425 | MEMORY DEVICE AND PROGRAMMING METHOD THEREOF - A programming method for a memory device is provided. The memory device includes a first transistor, a memory cell string, and a second transistor which are electrically connected in series. The memory cell string includes a target memory cell, first and second peripheral memory cells adjacent to the target memory cell, and a plurality of non-target memory cells which are not adjacent to the target memory cell. The programming method includes following steps. The first transistor is turned on, and the second transistor is turned off. A pass voltage is applied to turn on the non-target memory cells, and an assistant voltage is applied to turn on the first and second peripheral memory cells. A programming voltage is applied to program the target memory cell. The assistant voltage is greater than the pass voltage and is less than the programming voltage. | 02-04-2016 |
20160035426 | Bias To Detect And Prevent Short Circuits In Three-Dimensional Memory Device - In a three-dimensional stacked non-volatile memory device, a short circuit in a select gate layer is detected and prevented. A short circuit may occur when charges which are accumulated in select gate lines due to plasma etching, discharge through a remaining portion of the select gate layer in a short circuit path when the select gate lines are driven. To detect a short circuit, during a testing phase, an increasing bias is applied is applied to the remaining portion while a current is measured. An increase in the current above a threshold indicates that the bias has exceed a breakdown voltage of a short circuit path. A value of the bias at this time is recorded as an optimal bias. During subsequent operations involving select gate transistors or memory cells, such as programming, erasing or reading, the optimal bias is applied when the select gate lines are driven to prevent a current flow through the short circuit. | 02-04-2016 |
20160035430 | Compact High Speed Sense Amplifier for Non-Volatile Memory with Reduced Layout Area and Power Consumption - A compact and versatile high speed sense amplifier suitable for use in non-volatile memory circuits is presented. The sense amp circuit is connected to first and second supply levels, a first level used for setting a program inhibit level on bit lines and a second level used for pre-charging bit lines for sensing operation. Outside of a data latch, the sense amp can employ only NMOS transistors. The arrangement of the circuit also allows for the discharging the bit line at the same time as transfers the sensing result out to other latches. | 02-04-2016 |
20160042793 | LOW-POWER NONVOLATILE MEMORY CELLS WITH SELECT GATES - Technologies are generally described for low-power nonvolatile memory cells configured with select gates. A nonvolatile memory cell may have a transistor body, a select gate and a floating gate both coupled to the body, and a control gate coupled to the floating gate. Charge stored on the floating gate may indicate the data stored on the memory cell, and the control gate may be configured to adjust the charge stored on the floating gate. The select gate may be used to adjust the state of the transistor body to facilitate the adjustment of charge on the floating gate, and may also be used to render the memory cell unresponsive to the control gate. | 02-11-2016 |
20160042798 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND READING METHOD - A non-volatile semiconductor memory device includes a memory cell, and a sense amplifier that includes a latch unit, a first transistor having a first end electrically connected to the latch unit and a second end electrically connected to a first node, a second transistor having a first end electrically connected to the first node and a second end electrically connected to the memory cell, and a third transistor having a first end electrically connected to a second node between the first end of the first transistor and the latch unit. A control unit of the device controls the sense amplifier during a read operation, to charge the second node to a first voltage, and then charge the first node to a second voltage, turn on the second transistor after charging the first node to the second voltage, and turn on the third transistor after turning on the second transistor. | 02-11-2016 |
20160049413 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device is disclosed. The semiconductor device includes: a substrate; a floating gate on the substrate; a first silicon oxide layer between the floating gate and the substrate; a first tunnel oxide layer and a second tunnel oxide layer adjacent to two sides of the first silicon oxide layer; and a control gate on the floating gate. Preferably, the thickness of the first tunnel oxide layer and the second tunnel oxide layer is less than the thickness of the first silicon oxide layer. | 02-18-2016 |
20160049507 | DUAL CHANNEL MEMORY - Technologies are generally described related to a dual channel memory device, system and method of manufacture. Various described devices include utilization of both a front channel and a back channel through a substrate formed underneath a dual gate structure of a semiconductor device. Using two pairs of contacts on opposing sides of the gate structure, where the contact pairs are formed on differently doped layers of the semiconductor device, multiple bits may be stored in the semiconductor device acting as a single memory cell. Memorization may be realized by storing different amount or types of charges on the floating gate, where the charges may impact a conduction status of the channels of the device. By detecting the conduction status of the channels, such as open circuit, close circuit, or high resistance, low resistance, data stored on the device (“0” or “1”) may be detected. | 02-18-2016 |
20160049742 | MEMORY CARD - A memory card is provided to include a substrate having two pairs of edges facing each other, a plurality of first row terminals that are arranged adjacent to an edge at an insertion side of the substrate and include a first voltage power terminal for applying a first voltage and a first ground terminal, a plurality of second row terminals that are spaced farther apart from the edge at the insertion side than the plurality of first row terminals and include a second voltage power terminal for applying a second voltage and first data terminals, and a plurality of third row terminals that are spaced farther apart from the edge at the insertion side than the plurality of second row terminals and include second data terminals. | 02-18-2016 |
20160055909 | Integrated Circuit Comprising an Input Transistor Including a Charge Storage Structure - An electronic circuit comprises an input insulated gate field effect transistor. The input insulated gate field effect transistor comprises first and second load terminals and a control terminal. The control terminal is electrically coupled to an input signal terminal of the electronic circuit. The electronic circuit further comprises a control circuit. An input terminal of the control circuit is electrically coupled to the second load terminal. The control terminal is electrically connected to a control structure comprising a control electrode and charge storage structure. | 02-25-2016 |
20160056168 | 3D NAND NONVOLATILE MEMORY WITH STAGGERED VERTICAL GATES - A memory device includes a plurality of stacks of conductive strips, a plurality of word lines over and orthogonal to the plurality of stacks of conductive strips, a plurality of vertical gate columns, and control circuitry. The plurality of word lines is electrically coupled to the plurality of vertical gate columns acting as gates controlling current flow in the plurality of stacks of conductive strips. The plurality of word lines including a first word line and a second word line adjacent to each other. The plurality of vertical gate columns is between the plurality of stacks of conductive strips. The plurality of vertical gate columns includes a first set of vertical gate columns electrically coupled to the first word line and a second set of vertical gate columns electrically coupled to the second word line. The first set of vertical gate columns is staggered relative to the second set of vertical gate columns. The control circuitry controls the plurality of word lines as gates to control current flow in the plurality of stacks of conductive strips, and controls nonvolatile memory operations. | 02-25-2016 |
20160064085 | MEMORY DEVICE HAVING A DIFFERENT SOURCE LINE COUPLED TO EACH OF A PLURALITY OF LAYERS OF MEMORY CELL ARRAYS - A sensing voltage may be applied to a particular memory cell that is in a particular layer of a plurality of layers of memory cells. While the sensing voltage is applied to the particular memory cell, a source voltage may be applied to an end of a string of memory cells that includes the particular memory cell. The source line voltage may be based on a programming rate of the particular layer. | 03-03-2016 |
20160065240 | DATA STORAGE DEVICE AND OPERATING METHOD THEREOF - A data encoding method may include receiving N bits of first data, and converting the first data into M bits of second data, wherein the proportion of a first value in the second data is higher than the proportion of a second value. | 03-03-2016 |
20160071608 | DYNAMIC MEMORY RANK CONFIGURATION - Control logic within a memory control component outputs first and second memory read commands to a memory module at respective times, the memory module having memory components disposed thereon. Interface circuitry within the memory control component receives first read data concurrently from a first plurality of the memory components via a first plurality of data paths, respectively, in response to the first memory read command, and receives second read data concurrently from a second plurality of the memory components via a second plurality of data paths, respectively, in response to the second memory read command, the first plurality of the memory components including at least one memory component not included in the second plurality of the memory components and vice-versa. | 03-10-2016 |
20160071609 | Holdup Capacitor Energy Harvesting - The various embodiments described herein include circuits, methods and/or devices used to protect data in a storage device. In one aspect, a method includes performing a power fail operation on a first section of the storage device. The power fail operation includes supplying power, via an energy storage device, to the first section of the storage device, where the energy storage device is distinct from a power source used during normal operation of the storage device, and where supplying power via the energy storage device includes switching the output of the energy storage device from an output of a boost regulator to an input of the boost regulator. The power fail operation also includes performing data hardening on the first section of the storage device. | 03-10-2016 |
20160071610 | FLASH MEMORY, MEMORY MODULE, COMPUTER-READABLE RECORDING MEDIUM AND OPERATING METHOD - A flash memory, a memory module, a computer-readable recording medium and an operating method are provided, which can perform a flexible setup by a flexible clock scheme. A NAND-type flash memory | 03-10-2016 |
20160071854 | FLASH MEMORY STRUCTURE AND METHOD OF MAKING THE SAME - A method of making a flash memory includes providing a substrate. Then, a first insulating layer, a first conductive layer and a second insulating layer are formed to cover the substrate. Later, a first trench is formed in the first conductive layer and the second insulating layer. After that, a second conductive layer and a mask layer are formed to cover the second insulating layer, and the second conductive layer fills up the first trench. Then, the mask layer are patterned to form patterned mask layers. Subsequently, a spacer is formed on the sidewall of the patterned mask layer. Then, an etching process is carried out by using the patterned mask layers and the spacer as a mask so as to form a first gate structure and a second gate structure. | 03-10-2016 |
20160078944 | WORD LINE REPAIR FOR 3D VERTICAL CHANNEL MEMORY - A memory device includes a plurality of stacks of conductive strips alternating with insulating strips, including at least a bottom plane of conductive strips, a plurality of intermediate planes of conductive strips, a top plane of conductive strips, and an additional intermediate plane. A plurality of vertical structures is arranged orthogonally to the plurality of stacks. Memory elements are disposed in interface regions at cross-points between side surfaces of the plurality of stacks and the plurality of vertical structures. A stack of linking elements is connected to conductive strips in respective intermediate planes and to the additional intermediate plane. Decoding circuitry is coupled to the plurality of intermediate planes and the additional intermediate plane, and is configured to replace an intermediate plane indicated to be defective with the additional intermediate plane. | 03-17-2016 |
20160078947 | MEMORY SYSTEM AND CONTROLLER - A memory system includes a semiconductor memory device and a controller. The semiconductor memory device performs a writing operation with either a first writing method or a second writing method. The controller selects one of the first writing method and the second writing method upon receipt of a write instruction and output a write command indicating the selected writing method to the semiconductor memory device. The controller selects the writing method in accordance with a storage location in the semiconductor memory device targeted by the write instruction. | 03-17-2016 |
20160078967 | Power Loss Test Device And Method For Nonvolatile Memory Device - A power loss test apparatus for a non-volatile memory device includes a test-board including at least one socket into which at least one test target non-volatile memory device is inserted, a micro controller that determines whether to supply power to the test target non-volatile memory device based on current consumption information or operating state information of the test target non-volatile memory device, and a tester that performs a power loss test for the test target non-volatile memory device based on whether the power is supplied to the test target non-volatile memory device. | 03-17-2016 |
20160085249 | VOLTAGE CONVERSION CIRCUIT, SEMICONDUCTOR MEMORY APPARATUS HAVING THE SAME, AND OPERATING METHOD - A voltage conversion circuit may include a first reference voltage generation block configured to be provided with an external voltage, and generate a first reference voltage; a second reference voltage generation block configured to be provided with the external voltage and generate a second reference voltage according to a standby trim code; a trim code generation block configured to generate the standby trim code according to levels of the first reference voltage and the second reference voltage; and an internal voltage generation block configured to select the first reference voltage or the second reference voltage as a determined reference voltage according to an operation mode of a semiconductor memory apparatus, and to generate an internal voltage from the external voltage. | 03-24-2016 |
20160086967 | NONVOLATILE MEMORY DEVICE - A nonvolatile memory device includes a memory cell array including a plurality of memory cells, a first metal layer, a peripheral circuit configured to control the memory cell array, a second metal layer, and a pad. The first metal layer is disposed on the memory cell array and includes a plurality of cell region interconnections connected to the memory cell array. The second metal layer is disposed on the peripheral circuit and includes a plurality of peripheral region interconnections connecting the peripheral circuit and the plurality of cell region interconnections. The pad is disposed on the second metal layer and exchanges data, an address, or a command with the peripheral circuit during operation of the device. The second metal layer is lower than the first metal layer relative to a substrate of the device. | 03-24-2016 |
20160086973 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, the stacked body includes a plurality of stacked units and a first intermediate layer. Each of the stacked units includes a plurality of electrode layers and a plurality of insulating layers. Each of the insulating layers is provided between the electrode layers. The first intermediate layer is provided between the stacked units. The first intermediate layer is made of a material different from the electrode layers and the insulating layers. The plurality of columnar portions includes a channel body extending in a stacking direction of the stacked body to pierce the stacked body, and a charge storage film provided between the channel body and the electrode layers. | 03-24-2016 |
20160093381 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a method of manufacturing a semiconductor device. The method includes forming memory cells which share a data storage layer; performing a first strong program operation on first memory cells, arranged in a checker board pattern among the memory cells; performing a first annealing process after the first strong program operation; performing a second strong program operation on second memory cells arranged in a reverse checker board pattern among the memory cells, and performing a slight program operation on the first memory cells; and performing a second annealing process after the second strong program operation and the slight program operation. | 03-31-2016 |
20160093389 | NONVOLATILE SEMICONDUCTOR MEMORY - A nonvolatile semiconductor memory can reduce variations in an amount of current during data writing operation. This allows for the writing of data to memory cells with high precision. The nonvolatile semiconductor memory includes a plurality of memory cells, word lines connected to the memory cells, and bit lines connected to each of the memory cells. At least two of the bit lines are selected, and a current is simultaneously supplied from a power supply line to those memory cells which are connected to the selected bit lines in order to write data thereto. The nonvolatile semiconductor memory also includes charge amount measurement units for measuring respective amounts of charge stored in the memory cells. The nonvolatile semiconductor memory also includes current path switching circuits connected to the respective bit lines. Those current path switching circuits which are connected to the selected bit lines supply a current from the power supply line to the memory cells or a predetermined terminal depending on a measured value of the amount of charge measured by the charge amount measurement section. | 03-31-2016 |
20160093392 | MEMORY DEVICE AND METHOD FOR OPERATING THE SAME - According to an embodiment, an operation method for a memory device which has a first memory element and a second memory element respectively provided on both sides of a semiconductor member includes applying a first voltage to a second word line, the first voltage being negative for a voltage of a cell source line, and applying a second voltage to a first word line, the second voltage being positive for the voltage of the cell source line when reading out a data from the first memory element. | 03-31-2016 |
20160099348 | HIGH VOLTAGE DOUBLE-DIFFUSED MOS (DMOS) DEVICE AND METHOD OF MANUFACTURE - A method of forming an integrated DMOS transistor/EEPROM cell includes forming a first mask over a substrate, forming a drift implant in the substrate using the first mask to align the drift implant, simultaneously forming a first floating gate over the drift implant, and a second floating gate spaced apart from the drift implant, forming a second mask covering the second floating gate and covering a portion of the first floating gate, forming a base implant in the substrate using an edge of the first floating gate to self-align the base implant region, and simultaneously forming a first control gate over the first floating gate and a second control gate over the second floating gate. The first floating gate, first control gate, drift implant, and base implant form components of the DMOS transistor, and the second floating gate and second control gate form components of the EEPROM cell. | 04-07-2016 |
20160111163 | PARALLEL PROGRAMMING OF NONVOLATILE MEMORY CELLS - Adaptive write operations for non-volatile memories select programming parameters according to monitored programming performance of individual memory cells. In one embodiment of the invention, programming voltage for a memory cell increases by an amount that depends on the time required to reach a predetermined voltage and then a jump in the programming voltage is added to the programming voltage required to reach the next predetermined voltage. The adaptive programming method is applied to the gate voltage of memory cells; alternatively, it can be applied to the drain voltage of memory cells along a common word line. A circuit combines the function of a program switch and drain voltage regulator, allowing independent control of drain voltage of selected memory cells for parallel and adaptive programming. Verify and adaptive read operations use variable word line voltages to provide optimal biasing of memory and reference cells during sensing. | 04-21-2016 |
20160118399 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE - A three-dimensional (3D) semiconductor memory device that includes a peripheral logic structure including peripheral logic circuits disposed on a semiconductor substrate and a first insulation layer overlapping the peripheral logic circuits, and a plurality of memory blocks spaced apart from each other on the peripheral logic structure. | 04-28-2016 |
20160125943 | METHODS AND APPARATUS FOR PROGRAMING MEMORY OF A PRINTING CARTRIDGE - Methods to program a floating gate memory array include, in response to a request to program a second bit of the floating gate memory array, at a first time, outputting a programming voltage to cause a first node voltage at a first source of a first transistor corresponding to a first bit, wherein the first node voltage is greater than a second node voltage at a second source of a second transistor corresponding to the second bit. The method further includes at a second time, increasing the programming voltage of the floating gate memory array to program the second bit of the floating gate memory array. | 05-05-2016 |
20160125950 | DATA STORAGE DEVICE - According to one embodiment, a data storage device includes a controller driven by a first power supply voltage, a nonvolatile memory controlled by the controller and driven by a second power supply voltage, and a switch element determining whether the second power supply voltage is applied to the nonvolatile memory. The controller is configured to turn off the switch element in a first mode and turn on the switch element in a second mode. | 05-05-2016 |
20160133310 | APPARATUSES AND METHODS TO PERFORM POST PACKAGE TRIM - Memory die can be stacked to form a three-dimensional integrated circuit. For example, through-silicon vias (TSVs) can permit signals to pass vertically through the three-dimensional integrated circuit. Disclosed herein are apparatuses and methods to perform post package trimming of memory die, which advantageously permits the memory die to be trimmed after the memory die is stacked, such that test and trimming characteristics are relatively close to that which will be actually be encountered. | 05-12-2016 |
20160134292 | SAMPLING CIRCUIT MODULE, MEMORY CONTROL CIRCUIT UNIT, AND DATA SAMPLING METHOD - A sampling circuit module, a memory control circuit unit, and a data sampling method are provided. The sampling circuit module includes a delay lock loop (DLL) and a sampling circuit. The DLL includes a clock control circuit, a clock delay circuit and a voltage control circuit. The clock control circuit performs a delay lock for a reference clock signal, so as to output a selecting signal. The clock delay circuit delays the reference clock signal according to the selecting signal, so as to output a delay clock signal. The voltage control circuit adjusts a driving voltage outputted to the clock control circuit and the clock delay circuit according to the selecting signal. The sampling circuit samples a data signal according to the delay clock signal. Accordingly, a delay ability of the DLL may be improved by adjusting the driving voltage. | 05-12-2016 |
20160141050 | Processor Having a Programmable Function Unit - A processor comprising an ALU a programmable function unit wherein the functional unit may be programmed to comprise multistage logic. | 05-19-2016 |
20160148701 | READ LEVEL GROUPING ALGORITHMS FOR INCREASED FLASH PERFORMANCE - A plurality of flash memory wordlines of a flash storage device are divided into a plurality of wordline groups based on read error counts associated with the wordlines and a plurality of read level offsets. Each wordline group is associated with one of a plurality of read level offsets determined while dividing the plurality of flash memory wordlines, and associations between the plurality of read level offsets and the plurality of wordline groups are stored for use in connection with read levels to read the flash memory wordlines of the respective wordline groups. | 05-26-2016 |
20160163396 | PEAK CURRENT CONTRL - A low-dropout regulator includes an error amplifier to provide a control signal, a first transistor, and a second transistor. The first transistor receives the control signal and has a source-drain path electrically coupled between a supply voltage node and a load, the first transistor to power the load in response to a voltage on the supply voltage node rising above an absolute value of a threshold voltage of the first transistor. The second transistor has a source-drain path electrically coupled between the supply voltage node and the load, the second transistor to receive the control signal in response to the voltage on the supply voltage node rising above a particular voltage. | 06-09-2016 |
20160180949 | MEMORY DEVICE AND METHOD FOR OPERATING THE SAME | 06-23-2016 |
20160180950 | LOW VOLTAGE DETECTION CIRCUIT, NONVOLATILE MEMORY APPARATUS INCLUDING THE SAME, AND OPERATING METHOD THEREOF | 06-23-2016 |
20160254056 | SYSTEM, APPARATUS, AND METHOD OF PROGRAMMING A ONE-TIME PROGRAMMABLE MEMORY CIRCUIT | 09-01-2016 |
20160254058 | Electronic Device | 09-01-2016 |
20160380532 | CLOCK FREEZING TECHNIQUE FOR CHARGE PUMPS - Methods and systems for generating voltages greater than a supply voltage are described. A charge pump system may generate a boosted output voltage greater than the supply voltage using one or more charge pump stages that are arranged in series between the supply voltage and the boosted output voltage. The charge pump system may include clock freezing circuitry that eliminates glitches in clock signals used for driving the one or more charge pump stages. In one example, the clock freezing circuitry may freeze a clock signal that drives a charge pump stage (i.e., prevent the clock signal from switching) when a feedback flag of the charge pump system is in a disable state (e.g., is low). When the feedback flag is in an enable state (e.g., is high), then the clock signal may toggle between a high state and a low state. | 12-29-2016 |