Class / Patent application number | Description | Number of patent applications / Date published |
361792000 | Plural contiguous boards | 26 |
20080205016 | Module Board - A module board has a configuration in which a first circuit board, a first composite sheet, a second circuit board, a second composite sheet, and a third circuit board are laminated in this order. Inspection terminals are arranged in a matrix shape in a predetermined region on an upper surface of the third circuit board. Electronic components are mounted on the first and second circuit boards. The inspection terminals are electrically connected to the electronic components mounted on the first and second circuit boards through vias and wiring patterns. | 08-28-2008 |
20090073670 | Multilayered printed circuit board and fabricating method thereof - A multilayered printed circuit board and a fabricating method thereof are disclosed. A method that includes repeating processes of forming at least one circuit pattern, and at least one insulation layer that covers the circuit pattern, over a carrier and interconnecting circuit patterns on different layers with vias; stacking a metal stiffener over the insulation layer; repeating processes of forming at least one insulation layer and at least one circuit pattern over the stiffener and interconnecting circuit patterns on different layers with vias; and removing the carrier, can be used to reduce warpage in the board and improve workability. | 03-19-2009 |
20090103276 | CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided is a circuit device that allows a plurality of circuit boards, which are stacked each other and arranged in a case member, to be sealed with a resin effectively, and a method of manufacturing the same. In a hybrid integrated circuit device, a first circuit board is overlaid with the second circuit board and both of the boards are fitted into the case member. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, an opening is provided in a side wall part of the case member, and an internal space of the case member communicates with the outside through this opening. Accordingly, in the resin sealing step, a sealing resin can be injected into the internal space of the case member from the outside through this opening. | 04-23-2009 |
20090175017 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured. | 07-09-2009 |
20090290318 | Printed wiring board and method for manufacturing the same - A printed wiring board includes a first substrate having a recess portion and multiple conductors, a second substrate having multiple conductors and inserted in the recess portion of the first substrate such that the first substrate has a surface exposing at least a portion of a surface of the second substrate. The multiple conductors in the first substrate is electrically connected to the multiple conductors in the second substrate, and the second substrate has density of the conductors which is higher than density of the conductors of the first substrate. | 11-26-2009 |
20090296362 | Multilayer Printed Circuit Board, and Design Method of Multilayer Printed Circuit Board - According to one embodiment, a multilayer printed circuit board having a plurality of wiring layers and an electronic component mounted thereon, includes a spiral wire including a path in a substantial spiral shape configured with a printed wire section of a substantial loop shape provided on each of at least two wiring layers of the plurality of wiring layers, and a plug provided on each wiring layer arranged between a top wiring layer which is a wiring layer on a top on which the printed wire section of a substantial loop shape is provided and a bottom wiring layer which is a wiring layer on a bottom on which the printed wire section of a substantial loop shape is provided. | 12-03-2009 |
20100085720 | JOINED STRUCTURE, METHOD FOR PRODUCING THE SAME, AND ANISOTROPIC CONDUCTIVE FILM USED FOR THE SAME - A joined structure of the present invention including a first substrate having a wiring thereon, any one of a second substrate and an electronic part, and an anisotropic conductive film containing conductive particles, wherein the first substrate and any one of the second substrate and the electronic part are electrically joined via the anisotropic conductive film, and wherein the conductive particles pressure-bonded to the wiring of the first substrate protrude from both edges of the wiring in a width direction, and an interval of the wiring is 3.5 times or more larger than an average particle diameter of the conductive particles which are not pressure-bonded to the wiring. | 04-08-2010 |
20100097776 | Assembling Stacked Substrates That Can Form 3-D Structures - A system is described that can assemble substrates over one another to form a stacked substrate. The various layers of the stacked substrate can be separated from each other by using Coulomb forces. In addition, a beam substrate can be used to increase the separation. In addition, a first substrate can be flipped around and connected to the edge of a second substrate. The instructions for assembly and a FSM (Finite State Machine) can be included in the stacked substrate to pave the way for a self-constructing 3-D automaton. The beam substrate can be used to carry heat, fluids, electrical power or signals between the various layers of the stacked cells besides providing a mechanical support. A stacked substrate can be assembled into 3-D structures. These structures can have applications in antennas and RF circuits, for example. | 04-22-2010 |
20100134995 | Electrical Interconnection System - According to one embodiment, an electrical interconnection system includes a pair of printed wiring boards formed of a printed wiring board material. Each printed wiring board has multiple surface pads formed on a surface of the printed wiring board adjacent its outer edge. The surface of each printed wiring board is operable to be placed adjacent to one another such that an electrical circuit coupled to one printed wiring board is electrically coupled to another electrical circuit of the other printed wiring board by contact of the surface pads of each printed wiring board with one another. | 06-03-2010 |
20100134996 | INTEGRATED CIRCUIT PACKAGE - An integrated circuit package comprising at least two printed circuit boards each comprising a substrate coated with metallic layers on both sides and having plated through-holes for electrical and thermal connection to the metallic layers, at least two of the printed circuit boards being diffusion-bonded at an interface between their respective metallic layers, the bonded metallic layers forming an hermetic seal between the opposed external surfaces of the integrated circuit package. | 06-03-2010 |
20100302750 | DISPLAY SUBSTRATE HAVING ARCHED SIGNAL TRANSMISSION LINE AND MANUFACTURE METHOD THEREOF - This invention discloses a display device mother substrate, a display device substrate and a manufacture method of display device substrate thereof. The display device mother substrate includes a first substrate, a second substrate, a first active area circuit and a first transmission line, wherein a first cutting line is defined between the first substrate and the second substrate. The first active area circuit is disposed on the first substrate and is electrically connected to the first transmission line. The first transmission line includes a display line portion, an end line portion and a middle line portion, wherein the display line portion is electrically connected to the first active area circuit. The middle line portion is disposed on the second substrate, wherein two ends of the middle line portion are electrically connected to the display line portion and the end line portion respectively at the first cutting line. The display device mother substrate is cut along the first cutting line to be separated into the first substrate and the second substrate, wherein the middle line portion is also separated from the display line portion and the end line portion. | 12-02-2010 |
20110019383 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a first rigid wiring board having an accommodation section, a second rigid wiring board to be accommodated in the accommodation section, and an insulation layer formed on the first rigid wiring board and the second rigid wiring board. Here, a conductor of the first rigid wiring board and a conductor of the second rigid wiring board are electrically connected to each other, and at least either a side surface of the second rigid wiring board or a wall surface of the accommodation section has a concave-convex portion. | 01-27-2011 |
20110063813 | CIRCULAR ELECTRONIC APPARATUS - The present invention provides a circular electronic apparatus. The circular electronic apparatus includes a circular crust and a plurality of isosceles trapezoid circuit boards. The isosceles trapezoid circuit boards are put together to form an equilateral polygon. Each isosceles trapezoid circuit board is connected with an adjacent isosceles trapezoid circuit board by a plurality of electrical lines and all the isosceles trapezoid circuit boards are connected together. The circular crust covers the equilateral polygon circuit board. | 03-17-2011 |
20120008296 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a first rigid wiring board having an accommodation portion and a conductor, a second rigid wiring board accommodated in the accommodation portion of the first rigid wiring board and having a conductor electrically connected to the conductor of the first rigid wiring board, and an insulation layer formed on the first rigid wiring board and the second rigid wiring board. The accommodation portion of the first rigid wiring board has wall surfaces tapering from a first surface of the first rigid wiring board to a second surface on the opposite side of the first surface, and the second rigid wiring board has side surfaces tapering such that the side surfaces of the second rigid wiring board substantially fit into the wall surfaces of the accommodation portion of the first rigid wiring board. | 01-12-2012 |
20120008297 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a first rigid wiring board including a conductor and having an accommodation portion, the accommodation portion having wall surfaces, a second rigid wiring board accommodated in the accommodation portion and including a conductor electrically connected to the conductor of the first rigid wiring board, the second rigid wiring board having side surfaces, an insulation layer formed on the first rigid wiring board and the second rigid wiring board, and a metal film having a solid pattern formed directly on a boundary portion formed between the wall surfaces of the accommodation portion and the side surfaces of the second rigid wiring board. | 01-12-2012 |
20130100628 | Printed Circuit Board and Electronic Device Using Printed Circuit Board - An electronic device having a press-fit connection for connecting a connector and an electronic part mounted on a printed circuit board which is possible to enable high density mounting. Viewing the printed circuit board from an upper surface, between adjacent through holes on which a compressive force acts upon insertion of the press-fit terminal, among the large number of through holes, a land or a conductor film connected to the conductor film formed on the inner wall surface of the through hole or the conductor film not connected to the conductor film formed on the inner wall surface of the through hole, formed in the circuit board held between the top layer circuit board and the bottom layer circuit board, exists in a width equal to or wider than the diameter of the through hole. | 04-25-2013 |
20140016290 | TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a touch panel including: a first transparent substrate partitioned into an active area and a bezel area provided in edges of the active area; a mark formed so as to protrude on the bezel area; and a second transparent substrate coupled to the first transparent substrate so that at least one corner thereof corresponds to the mark. | 01-16-2014 |
20140022752 | CIRCUIT BOARD SYSTEM - Disclosed herein is a circuit board system comprising a carrier circuit board which is essentially planar at least in sections, wherein the carrier circuit board has at least one rigid layer copper clad on one or both sides or provided with conductor tracks, wherein at least one essentially planar circuit board module aligned in parallel with the carrier circuit board is arranged with at least one rigid layer copper clad on one or both sides or provided with conductor tracks, in an associated recess in the carrier circuit board. In particular, the circuit board module is pressed into the recess in the carrier circuit board and the edge of the circuit board module is engaged in a friction-locked manner with the edge of the associated recess to form a press fit. | 01-23-2014 |
20140063770 | METHOD FOR PLUG-IN BOARD REPLACEMENT, METHOD FOR MANUFACTURING MULTI-PIECE BOARD AND MULTI-PIECE BOARD - A plug-in board replacement method includes preparing a board having a piece board, forming first conductive pattern on first surface of the board, forming second conductive pattern on second surface on the opposite side such that the second pattern is on the opposite side of the first pattern, irradiating laser upon the first and second surfaces along the first and second patterns such that the piece is cut out from the board, and fitting the piece into another board. The irradiating includes irradiating laser upon the first surface along the first pattern such that laser is irradiated along the border between edge portion of the first pattern and the first surface and laser upon the second surface along the second pattern such that laser is irradiated along the border between edge portion of the second pattern and the second surface such that the piece is cut out through the board. | 03-06-2014 |
20140362553 | THREE-DIMENSIONAL FORM FACTOR SUPPORTING HIGH-SPEED SIGNAL PROCESSING SYSTEMS - A reconfigurable advanced rapid-prototyping environment (RARE) solution provides a three-dimensional (x, y, z) interconnection fabric that is a modular, reconfigurable, fully scalable high performance computing architecture. RARE allows processing nodes (modules) to communicate with other processing nodes (modules) in a three-dimensional mesh architecture where every processing node (module) has access to all other nodes (modules) in the system. The RARE architecture is a modular form-factor design which is fully stand-alone. It does not require the use of a backplane or chassis infrastructure for connectivity. RARE is widely scalable and provides full cross-channel communication in all three dimensions (x, y, z). RARE yields a scalable and morphable hardware architecture for a processing system where the system can scale by one module at a time without limit and it can take on any shape and those shapes can be easily changed. | 12-11-2014 |
20150022990 | VERTICAL BLINDMATE SCALING OF IDENTICAL SYSTEM BOARDS - Two system boards may be connected by a blind plug connector assembly. The top system board supports a first connector and has a hole adjacent the first connector that secures a guide bracket. The blind plug connector assembly is selectively received in the guide bracket to position a proximal connector on the assembly for connecting to the first connector on the top system board and position a distal connector on the assembly for connecting to a second connector on the lower system board. A flexible wired connection extends within the assembly between the proximal connector and the distal connector, and may form a scalability cable. The interaction between the assembly and the guide bracket provide alignment of the connectors. | 01-22-2015 |
20150062855 | HYBRID CIRCUIT ASSEMBLY - A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon. The multi-layer PWB is connected to the IMS and has an upper surface that is co-planar with an upper surface of the IMS. The PWB is mounted on the metal base plate via the insulating adhesive. | 03-05-2015 |
20160192479 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT - A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection. | 06-30-2016 |
361793000 | Thick film component or material | 1 |
20080316727 | 3D Electronic Module - The invention relates to a 3D electronic module comprising a stack ( | 12-25-2008 |
361794000 | Power, voltage, or current layer | 2 |
20090040741 | METHOD FOR TRANSMITTING MOVING IMAGE DATA AND COMMUNICATION APPARATUS - A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to the first surface layer, a main power supply wiring layer, and a ground layer between the first and second surface layers. In the multilayered printed circuit board, one terminal of the bypass capacitor is connected to a midpoint of a wiring path from the main power supply wiring layer to a power supply terminal of the semiconductor integrated circuit, and an impedance of a first wiring path from the main power supply wiring layer to the terminal of the bypass capacitor is higher than an impedance of a second wiring path from the terminal of the bypass capacitor to the power supply terminal of the semiconductor integrated circuit. | 02-12-2009 |
20090279273 | MULTI-LAYER PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND FABRICATION METHOD OF ELECTRONIC DEVICE - There is provided a multi-layer printed wiring board that can perform impedance control, concurrently maintaining the flexibility of a flexible portion with one or more signal lines. Such a multi-layer printed wiring board includes a plurality of rigid board units; and a flexible board unit, connecting outer layers or inner layers of the plurality of rigid board units and extending over the outer layers or the inner layers of the plurality of rigid board units. The flexible board unit includes a signal layer sending signals between the plurality of rigid board units; ground layers sandwiching the signal layer; and intermediate layers each interposed between the signal layer and one of the ground layers. | 11-12-2009 |