Entries |
Document | Title | Date |
20080212292 | ELECTRONIC DEVICE WITH WATERPROOF STRUCTURE AND FABRICATION METHOD THEREOF - An electronic device with a waterproof structure includes a housing structure, a printed circuit board and a protective layer. The housing structure includes a receptacle, a first opening and a second opening. The printed circuit board is disposed within the receptacle and includes plural electronic components and electrical trace patterns thereon. The protective layer is formed on at least a portion of the electronic components and the electrical trace patterns to protect the printed circuit board from moisture attack. | 09-04-2008 |
20080212293 | FIXING DEVICE FOR SECURING CIRCUIT BOARD TO PLATE MEMBER - A fixing device for securing a circuit board to a plate member includes a spacer, a nut member, and a fastener. A coupling hole is defined through the spacer. A female thread is formed on a part of an interior surface of the coupling hole at an end thereof. A nut member comprises a pressing portion and a coupling portion extending from the pressing portion. A male thread is formed on a part of an exterior surface of the coupling portion at a free end thereof, corresponding to the female thread of the coupling hole of the spacer such that the coupling portion is capable of being movably retained in the coupling hole. A threaded hole is defined in the nut member. A fastener includes a head and a threaded rod extending from the head for being screwed in the threaded hole of the nut member. | 09-04-2008 |
20080218983 | METHOD OF MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD - A method of manufacturing a circuit board is provided. The method includes forming a plurality of first holes in a semiconductor substrate, each of the first holes being opened toward a front surface of the semiconductor substrate, filling a bottom side of the plurality of first holes with an insulating layer, filling the first holes filled with the insulating layer on the bottom side thereof with a first electro-conductive layer, polishing the semiconductor substrate from the back surface thereof until the respective insulating layers filled in the plurality of first holes are exposed, and forming a second hole in each of the exposed insulating layers so as to reach the first electro-conductive layer, and forming a second electro-conductive layer by filling each second hole with the second electro-conductive layer to connect the first electro-conductive layer. | 09-11-2008 |
20080239680 | METHOD OF FORMING BURIED WIRING LINES, AND SUBSTRATE AND DISPLAY DEVICE USING THE SAME - An method of forming buried wiring lines makes it possible not to limit usable materials for an insulative plate to those having excellent heat resistance and to improve the corrosion resistance of the terminals provided for the buried wiring lines. The surface of an insulative plate is selectively etched using a mask formed on the surface, thereby forming grooves in the surface. A metallic nanoparticle ink is placed over the whole surface of the plate to fill the grooves with the ink, where the mask is being left. The ink is heated for preliminary curing to form a metallic nanoparticle ink film. The part of the film placed on the mask is selectively removed by detaching the mask, thereby leaving the remainder of the film in the grooves. The remaining film in the grooves is heated for main curing, thereby forming desired buried wiring lines. | 10-02-2008 |
20080266818 | Scanning module for a scanner system having a MEMS device or the like - Briefly, in accordance with one or more embodiments, a scanning module for a scanner system comprises a frame having a first section and a second section. The first section of the frame is capable of receiving a laser to secure the laser in the first section, and the second section of the frame is capable of receiving a MEMS device having a mirror, to secure the MEMS device in the first section. The laser is aligned with the mirror by the frame to cause light emitted from the laser to impinge upon the mirror during operation of the laser. Such an arrangement may facilitate the physical and/or electrical assembly of the components of the scanner system. | 10-30-2008 |
20080273311 | Enhanced Localized Distributive Capacitance for Circuit Boards - A multi-layered circuit board is provided having a buried capacitive layer and a device-specific embedded, localized, non-discrete, and distributive capacitive element. A printed circuit board is provided including (1) a first dielectric layer, (2) a first conductive layer coupled to a first surface of the first dielectric layer, (3) a second conductive layer coupled to a second surface of the first dielectric layer, and (4) a localized distributive non-discrete capacitive element adjacent the first conductive layer, wherein the capacitive element occupies a region that approximately coincides with a location over which a device to be coupled to the capacitive element is to be mounted. The embedded, localized, non-discrete, and distributive capacitive element may provide device-specific capacitance to suppress voltage/current noise for a particular device. | 11-06-2008 |
20080278920 | Hybrid Integrated Circuit Device and Method for Manufacturing Same - A hybrid integrated circuit device includes: an insulating substrate ( | 11-13-2008 |
20080291645 | INTERFACE RETENTION AND SUPPORT APPARATUS AND METHOD OF USE - An interface retention and support apparatus and method of use is disclosed. In one form, an extension apparatus can include a first coupling interface operable to be coupled to an first expansion terminal of a printed circuit board. The apparatus can also include a retention mechanism aligned to a surface of the first coupling interface. The retention mechanism can be used to engage a first exterior surface of the first expansion terminal upon coupling the first coupling interface to the first expansion terminal. The apparatus can further include an access terminal operably coupled to the first coupling interface and an expansion circuit coupled between the first coupling interface and the access terminal. The expansion circuit can electrically couple the first expansion terminal to access terminal. | 11-27-2008 |
20080298028 | AMC CARRIER FACEPLATES - A faceplate for AMC carriers is fabricated from extruded aluminum using a combination of extruded cross-sectional features and machined features to achieve the structural and functional characteristics of an AdvancedTCA faceplate. The extruded aluminum faceplate significantly improves on sheet-metal alternatives while substantially conforming to the AdvancedTCA specification. | 12-04-2008 |
20080310128 | Variable Height Plug-In Pads and Equalizers - The electronic component mounts the circuitry and connector pins at the bottom of a substrate. The upper portion of the substrate has one or more weakened horizontal lines allowing the user to break off part of the upper portion of the substrate. Doing so allows a technician to shorten the component so that it properly fits into a cable system amplifier. A cap with indicia or color-coding may fit over the top of the substrate to help handling the component and identifying its type and electrical values. | 12-18-2008 |
20080316715 | Coated Copper, Method for Inhibiting Generation of Whisker, Printed Wiring Board and Semiconductor Device - A coated copper is provided which inhibits the growth of whiskers and is composed of a copper substrate or a copper alloy substrate, a copper-diffused tin layer formed on the surface of the substrate, and a pure tin layer formed on the surface of the copper-diffused tin layer. The thickness of the copper-diffused tin layer is 55% or more with respect to the total thickness of the copper-diffused tin layer and the pure tin layer. Further, a printed wiring board is provided having a wiring pattern of the copper substrate or the copper alloy substrate, and a semiconductor device. Accordingly, the generation of long whiskers having a length exceeding 15 μm which cause short circuits can be inhibited. | 12-25-2008 |
20090002958 | Method of Forming a Substrate Core Structure Using Microvia Laser Drilling and Conductive Layer Pre-Patterning And Substrate Core Structure Formed According to the Method - A method of fabricating a substrate core structure comprises, providing first and second patterned conductive layers defining openings therein on each side of a starting insulating layer; providing a first and a second supplemental insulating layers onto respective ones of a first and a second patterned conductive layer; laser drilling a set of via openings extending through at least some of the conductive layer openings of the first and second patterned conductive layers; filling the set of via openings with a conductive material to provide a set of conductive vias; and providing a first and a second supplemental patterned conductive layer onto respective ones of the first and the second supplemental insulating layers, the set of conductive vias contacting the first supplemental patterned conductive layer at one side thereof and the second supplemental patterned conductive layer at another side thereof. | 01-01-2009 |
20090016030 | CIRCUIT BOARD, CONNECTION STRUCTURE, AND APPARATUS - A circuit board is connected to a connector including a connection port and contact portions located at upper and lower positions of the connection port. The contact portions face each other in the vertical direction, and each contact portion is connected electrically to the opposite contact portion. The circuit board includes a base substrate, a first wiring layer, and a second wiring layer. First terminals connected to the first wiring layer are provided on one principal surface of the base substrate, and second terminals connected to the second wiring layer are provided on the other principal surface. The first terminals and the second terminals come into contact with the contact portions and are arranged so as not to overlap each other in the vertical direction. | 01-15-2009 |
20090016031 | CIRCUIT CONNECTION STRUCTURE AND PRINTED CIRCUIT BOARD - While gradually increasing the widths of signal lines ( | 01-15-2009 |
20090034213 | Printed Circuit Board and Related Method Capable of Suppressing Electromagnetic Wave - A method for suppressing an electromagnetic wave of noise of a printed circuit board comprises forming a metal conducting circuit in a conducting layer of the printed circuit board; and duplicating a plurality of pattern circuits, every two neighboring patterns with substantially the same patterns and separated space for forming a metal conducting circuit that is an electromagnetic wave suppressing circuit having an electromagnetic wave stop frequency band corresponding to the electromagnetic wave of noise. | 02-05-2009 |
20090040735 | Tamper Respondent System - A tamper respondent system having: a physical volume containing an electronic device to be protected; an at least partially conductive surface proximate to the electronic device; and a tamper respondent sensor over the electronic device (the sensor comprising: a flexible, dielectric substrate; conductive traces on the substrate; a porous insulating layer having pores over the conductive traces; and adhesive within said pores of said porous insulating layer), wherein the adhesive is in contact with both the substrate and the at least partially conductive surface through the porous insulating layer. | 02-12-2009 |
20090046436 | MICRO-ELECTRO-MECHANICAL-SYSTEM PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A MEMS package includes a first board, a second board and a laminate material. The first board includes a lower metallic trace, a metallic diaphragm and a through opening. The lower metallic trace is located on the lower surface of the first board, and the metallic diaphragm is disposed on the lower metallic trace. The second board includes an upper metallic trace and a metallic electrode. The upper metallic trace is located on the upper surface of the second board, the metallic electrode is disposed on the upper metallic trace, and the metallic electrode is corresponding to the metallic diaphragm. The laminate material is disposed between the lower and upper metallic traces, and includes a hollow portion for accommodating the metallic electrode and metallic diaphragm, wherein a sensing unit is formed by the metallic electrode, the hollow portion and the metallic diaphragm, and is corresponding to the through opening. | 02-19-2009 |
20090052146 | Printed Board - The invention relates to a printed board which comprises an inlay and on whose one face electrical components are provided and on whose other face at least one single cooling element for cooling the components is mounted. A component to be cooled, the inlay and the cooling element are aligned with each other. The components are SMD components of, e.g., a high-power output stage circuit with heat emissions of up to 10 to 15 watt. In order to cool the structure, the heat produced in a heating zone between the pins of a component to be cooled is guided to the inlay which is dimensioned in such a manner that it extends farther than below the pins of the component to be cooled. In order to prevent short-circuits and allow power connections, an additional layer is arranged on the printed board above the inlay and simultaneously below the component to be cooled and comprises thermic provisions between a component to be cooled and the inlay for ensuring a good to excellent heat conduction from the heating zone of a component to be cooled to the inlay. | 02-26-2009 |
20090059541 | Electronic assembly having housing with embedded conductor connecting electrical component - An electronic assembly includes a printed circuit board and an electrical component arranged within a housing. The component is mounted in a lower region of the housing, and the printed circuit board is supported over the component. The housing is formed of a electrically insulating material and includes embedded conductors connecting the component to the printed circuit board. Potting material is disposed on the printed circuit board within the housing. A fill hole may be provided in the board over the component to allow the potting material to flow onto the electrical component for mechanical stabilization. | 03-05-2009 |
20090067139 | Large electronic component dampening fixation - An electronic assembly having a large or massive electronic component mounted to a circuit substrate is stabilized against movement due to shock and/or vibration by an elastic dampening member disposed between the large electronic component and a clamping member that compresses the dampening member between the clamping member and the electronic component and urges opposite end walls of the dampening member against opposite sidewalls of the electronic component to securely grip the electronic component between the opposite end walls of the dampening member. The arrangement is effective for reducing and/or eliminating damage and subsequent failure due to exposure of the electronic assembly to shock and/or vibration. | 03-12-2009 |
20090067140 | STIFFENING PLATE FOR CIRCUIT BOARD AND SWITCH ASSEMBLY - This invention is directed to a support plate for reinforcing a portion of a circuit board. The support plate may be coupled to a portion of the circuit board that is subject to forces (e.g., portions of the circuit board having switches) to prevent flexing of the board. The support plate may be coupled to the circuit board. This invention is also directed to a switch constructed from a button, a label plate, and a backer plate. The label plate and the backer plate may include apertures operative to receive a protrusion extending from the button, where the protrusion is welded to the backer plate. Labels may be printed or attached to the bottom surface of the label plate to protect the labels. In some embodiments, the protrusion may be welded to the backer plate. The protrusion may be operative to engage an electrical switch of an electronic device in which the switch is placed. | 03-12-2009 |
20090097212 | Optimization of connector density and identification carrier for high density front plates - A high connector density printed circuit board, and high connector density device containing the same, including one or more of the following: a face plate; a plurality of connector ports in the face plate; a tab integral with the face plate label and bent to extend away from the face plate; information printed on the tab; the tab forming a plane at an angle of ninety degrees with respect to the face plate; the tab fabricated from a material having a combination of a thickness and a stiffness minimally able to resist a deformation resulting from a force of gravity; a second tab that is integral with the face plate and bent to extend away from the face plate; and the tabs do not infringe on an adjacent space occupied by another high connector density printed circuit board. | 04-16-2009 |
20090103272 | DC-DC CONVERTER - A DC-DC converter comprising a soft-magnetic, multi-layer substrate provided with a laminated coil constituted by connecting pluralities of conductor lines, and a semiconductor integrated circuit device comprising a switching device and a control circuit, which are mounted on the soft-magnetic, multi-layer substrate; the semiconductor integrated circuit device comprising an input terminal, an output terminal, a first control terminal for controlling the ON/OFF of the switching device, a second control terminal for variably controlling output voltage, and pluralities of ground terminals; the soft-magnetic, multi-layer substrate comprising first external terminals formed on a first main surface, first connecting wires formed on the first main surface and/or on nearby layers, second connecting wires formed between the side surface of the multi-layer substrate and a periphery of the laminated coil, and second external terminals formed on a second main surface; and terminals of the semiconductor integrated circuit device being connected to the first external terminals on the multi-layer substrate, at least part of the first external terminals being electrically connected to the second external terminals through the first and second connecting wires, and the input or output terminal being connected to the second external terminals via the laminated coil. | 04-23-2009 |
20090109639 | PORTABLE ELECTRONIC DEVICE AND METHOD FOR IDENTIFYING ACCESSORY CONNECTED TO THE SAME - A portable electronic device ( | 04-30-2009 |
20090141460 | CERAMIC MULTILAYER COMPONENT, METHOD FOR THE PRODUCTION THEREOF AND RETAINING DEVICE - An electrical component includes a sintered ceramic and electrodes inside the sintered ceramic. The sintered ceramic and the electrodes together form a stack having a first surface and a second surface. The electrodes include a first electrode and a second electrode. The first electrode extends to the first surface but not to the second surface. The second electrode extends to the second surface but not to the first surface. At least one of the first electrode and the second electrode has a surface that contains metal. The surface is in contact with the sintered ceramic. | 06-04-2009 |
20090168372 | EXPANSION CARD RETENTION ASSEMBLY - An exemplary retention assembly ( | 07-02-2009 |
20090213556 | TRACKBALL SOCKET FOR A HANDHELD WIRELESS COMMUNICATION DEVICE - A socket is configured to receive a trackball device in a receiving space formed therein. The socket has an exterior configured to fit within an installation recess in a printed circuit board. A biased electrical interconnector extends from an interior surface of the receiving space into the receiving space, the electrical interconnector oriented within the receiving space at a position that establishes biased electrical contact with a target electrical contact of the trackball device and biased electrical contact with a corresponding electrical contact on the printed circuit board when the socket is installed in an installation recess. | 08-27-2009 |
20090213557 | ELECTRONIC DEVICE WITH INTERNAL MICROPHONES DISPOSED IN FLEXIBLE HOLDERS - An electronic device includes a housing, a circuit board, a plurality of flexible holders, and a plurality of microphones. The housing includes a plurality of wall portions, a plurality of storage spaces encircled by the wall portions, and a plurality of acoustic openings connected to the storage spaces. The flexible holders are disposed in the storage spaces. Each of the flexible holders comprises a plurality of surfaces and at least one rib provided on the surfaces. The microphones are mounted on the circuit board and disposed in the flexible holders. | 08-27-2009 |
20090213558 | SUPPORT METHOD AND APPARATUS FOR PRINTED CIRCUIT BOARD - An orthogonal array is formed by performing electromagnetic field analysis only once and determining a range by using the mount position and type of a capacitor and the number of capacitors as parameters to perform circuit analysis a small number of times. An estimation equation is formed by using as an index a result of the absolute value of the calculated power source impedance, and a capacitor is disposed to reduce noises by using the estimation equation. | 08-27-2009 |
20090237893 | FIXING STRUCTURE FOR FIXING A CIRCUIT BOARD - A fixing structure includes a first case whereon a first boss is disposed, a circuit board whereon a hole is disposed in a position corresponding to the first boss, a fixing component for screwing in the first boss of the first case so as to fix the circuit board above the first case, a first elastic component disposed on a first side of the circuit board for supporting the circuit board above the first case, and a second elastic component disposed on a second side opposite to the first side of the circuit board for clamping the circuit board with the first elastic component. | 09-24-2009 |
20090237894 | ELECTRONIC DEVICE - An electronic device includes a substrate, a coil that has a spiral shape and is provided on the substrate, and a conductive pattern that is provided inside of the coil, has optical reflectivity higher than that of a surface of the coil, and is divided into pieces. | 09-24-2009 |
20090244857 | CIRCUIT DEVICE - a circuit device includes a dielectric substrate including a first face and a second face opposite side of the first face; a coplanar line including a first line, a second line and ground electrodes, the first line and the second line being decupled mutually, the ground electrodes formed around the first line and the second line, the first line, the second line and the ground electrodes formed on the first face of the dielectric substrate; a capacitor for connecting the first line and the second line; a termination resistor connecting the second line; a microstrip line formed on the second face of the dielectric substrate; and a conducting portion formed in the dielectric substrate and electrically connecting the first line and the microstrip line. | 10-01-2009 |
20090244858 | IC CARD HAVING IMPROVED ELECTRICAL CONTACTS - An IC Card includes a microchip having memory portions storing programs and a plurality of electrical contacts including a first set of electrical contacts connected to the microchip for supporting respective and predetermined functions, according to a predetermined ISO 7816 standard that reserves a second set of the electrical contacts for future use. At least one electrical contact of the second set is further connected to the microchip and is configured by one or more of the programs for supporting respective additional functions. | 10-01-2009 |
20090251869 | Multilayer ceramic substrate, electronic component, and method of manufacturing multilayer ceramic substrate - A multilayer ceramic substrate in which an active element and a passive element are surface-equipped over the outermost surface on one side is provided. The multilayer ceramic substrate comprises a plurality of laminated ceramic substrate layers, a surface layer terminal electrode provided in a via hole of an outermost ceramic substrate layer on at least one side and having a surface layer via electrode and a metal plating layer deposited over an end surface of the surface layer via electrode, and a via conductor which connects the surface layer terminal electrode and circuit patterns over the ceramic substrate layer at the inside, wherein a via hole size of a surface layer terminal electrode for connection of the active element is smaller than a via hole size of a surface layer terminal electrode for connection of the passive element. | 10-08-2009 |
20090257206 | HOLDING APPARATUS - The invention specifies a holding apparatus comprising a support element and a circuit board. A trench for receiving the circuit board is embodied in the support element. At least one first clamping element is arranged on one or both longitudinal sides of the circuit board and/or at least one second clamping element is arranged in the trench. As a result, the circuit board received by the trench is fixed in the trench in a clearance-free fashion. | 10-15-2009 |
20090268415 | Battery Backup Unit (BBU) assembly - The present invention is a Battery Backup Unit (BBU) Assembly. The BBU Assembly may include a Printed Circuit Board (PCB). The BBU Assembly may further include a protection circuit connected to the PCB. The BBU Assembly may further include a battery pack connected to the PCB. The battery pack may include a plurality of Lithium-ion (Li-ion) cells. The battery pack may be configured as a 2-cell series stack, a 3-cell series stack, or a 4-cell series stack. The BBU Assembly is configured for electrically connecting the battery pack to the protection circuit. | 10-29-2009 |
20090273907 | CIRCUIT BOARD AND PROCESS THEREOF - A circuit board and process thereof are provided. The circuit board includes a dielectric layer, an active circuit, and two shielding circuits. The dielectric layer has an active surface. The active circuit is disposed on the active surface, and the shielding circuits are respectively disposed on two sides of the active circuit. The height of the shielding circuits is larger than the height of the active circuit. | 11-05-2009 |
20090273908 | NETWORK TRANSFORMER, NETWORK MODULE THEREOF, AND ELECTRONIC DEVICE THEREOF - The invention discloses a network transformer, a network module thereof, and an electronic device thereof The network transformer includes a plurality of coil sets, an insulating board, a casing and a plurality of pins. The pins are disposed on the casing. The network transformer is disposed on a PCB via the pins. The insulating board is disposed in the casing and connects with at least two side walls of the casing to form a plurality of isolation chambers, each of which is for containing one coil set. | 11-05-2009 |
20090284935 | STRUCTURE AND MANUFACTURING PROCESS FOR CIRCUIT BOARD - A circuit board structure comprising a composite layer, a fine circuit pattern and a patterned conductive layer is provided. The fine circuit pattern is inlaid in the composite layer, and the patterned conductive layer is disposed on a surface of the composite layer. After fine circuit grooves are formed on the surface of the composite layer, conductive material is filled into the grooves to form the fine circuit pattern inlaid in the composite layer. Since this fine circuit pattern has relatively fine line width and spacing, the circuit board structure has a higher wiring density. | 11-19-2009 |
20090284936 | Combination of a Main Carrier and a Printed Circuit Board with Components - A combination of a main carrier and a printed circuit board. Light and heavy electrical and/or electronic components are fixed on the printed circuit board, wherein at least one heavy component is mechanically fixedly connected to the main carrier and electrically conductively connected to conductor tracks of a first section of the printed circuit board. The first section of the printed circuit board is electrically conductively connected to a second section of the printed circuit board and decoupled from the second section of the printed circuit board with regard to mechanical vibrations by means of a decoupling device. The decoupling device may be, for example, a flexible section or a recess formed in said printed circuit board. | 11-19-2009 |
20090290314 | Environmental Protection Coating System and Method - A circuit board assembly includes a circuit board having an outer surface, the outer surface being configured with a plurality of discrete electrical components that are each manufactured independently of one another. The circuit board assembly further includes a domed lid enclosure disposed over one of the plurality of discrete electrical components and an additional dielectric coating overlying the outer surface and the domed lid enclosure. | 11-26-2009 |
20090316369 | TOOL-LESS VERTICAL PCBA INSULATOR AND SUPPORT/SHIPPING BRACE - A brace for a circuit board vertically mounted on a motherboard includes a first attachment member capable of attaching to an edge of the circuit board distal from the motherboard; a second attachment member capable of attaching to a side edge of the motherboard; and a rigid support connecting the first attachment member and the second attachment member. The rigid support is shaped such that the circuit board is held substantially perpendicular to the motherboard when the brace is attached. An interference minimization device for minimizing the interference of a circuit board vertically mounted on a motherboard includes an attachment member capable of attaching to the circuit board at an end distal from the motherboard; a mating wall that is substantially parallel to the circuit board and abuts the circuit board when the interference minimization device is attached to the circuit board; and a tapered wall that widens from the distal end of the circuit board towards the motherboard. | 12-24-2009 |
20090316370 | ELECTROMAGNETIC NOISE SUPPRESSOR, STRUCTURE WITH ELECTROMAGNETIC NOISE SUPPRESSING FUNCTION AND THEIR MANUFACTURING METHODS - An electromagnetic noise suppressor of the present invention has magnetic resonance frequency of 8 GHz or higher, and the imaginary part of complex magnetic permeability at 8 GHz is higher than the imaginary part of complex magnetic permeability at 5 GHz. Such an electromagnetic noise suppressor is capable of achieving sufficient electromagnetic noise suppressing effect over the entire sub-microwave band. The electromagnetic noise suppressor can be manufactured by forming a composite layer on the surface of a binding agent through physical deposition of a magnetic material on the binding agent. The structure with an electromagnetic noise suppressing function of the present invention is a printed wiring board, a semiconductor integrated circuit or the like that is covered with the electromagnetic noise suppressor on at least a part of the surface of the structure. | 12-24-2009 |
20090323295 | INJECTION MOLDED METAL STIFFENER AND INTEGRATED CARRIER FOR PACKAGING APPLICATIONS - In some embodiments, an injection molded metal stiffener and integrated carrier for packaging applications is presented. In this regard, an apparatus is introduced comprising a microelectronic device package substrate, a microelectronic device coupled with a top surface of the package substrate, and an injection-molded, metal stiffener coupled with the package substrate, wherein the stiffener includes a central opening and at least partially surrounds the microelectronic device, and wherein the stiffener includes an overhang that extends along a side of the package substrate and incorporates a coupling feature. Other embodiments are also disclosed and claimed. | 12-31-2009 |
20100002401 | ELECTRONIC COMPONENT PACKAGING STRUCTURE HAVING TWO-LAYER MOISTURE-PROOF COATING AND METHOD FOR MANUFACTURING THE SAME - The electronic component packaging structure having, as the moisture-proof coating layer, a polymer material that has sufficient moisture-proof performance and can be relatively easily peeled off from a circuit board and/or electronic components when repairing can be provided. | 01-07-2010 |
20100008052 | Integrated photovoltaic cell and antenna - RF device powered by photovoltaic cells. A device comprises a substrate having one or more photovoltaic cells mounted on one side of the substrate, and an RF antenna mounted on the other side of the substrate. Electronics powered by the photovoltaic cells and communicating via the RF antenna are preferably mounted on the same side of the substrate as the antenna, but may be mounted on the same side of the substrate as the photovoltaic cells. | 01-14-2010 |
20100014260 | ELECTRONIC DEVICE WITH CHIP CARD - A electronic device ( | 01-21-2010 |
20100020509 | Integrated Power Passives - A multi-layer film-stack and method for forming the multilayer film-stack is given where a series of alternating layers of conducting and dielectric materials are deposited such that the conducting layers can be selectively addressed. The use of the method to form integratable high capacitance density capacitors and complete the formation of an integrated power system-on-a-chip device including transistors, conductors, inductors, and capacitors is also given. | 01-28-2010 |
20100020510 | HIGH-VOLTAGE POWER SUPPLY - Provided is a high-voltage power supply including a board having at least one bent portion separating a first region of the board from a second region of the board, the first region not being coplanar with the second region of the board; a first circuit, on the first region of the board, generating a second voltage according to a first voltage; and a second circuit, on the second region of the board, amplifying the second voltage and then rectifying the amplified second voltage. | 01-28-2010 |
20100033938 | METHOD AND APPARATUS FOR REDUCING CAPACITOR GENERATED NOISE ON A PRINTED CIRCUIT BOARD - Embodiments of the present invention provide an arrangement structure capable of reducing noise caused by a laminated ceramic capacitor mounted on a printed circuit board. A unit arrangement structure includes ceramic capacitors. Among the laminated ceramic capacitors, capacitors are arranged so that capacitor axes thereof extend along a first axis, while the other ceramic capacitors are arranged so that capacitor axes thereof extend along a second axis crossing the first axis. In accordance with such an arrangement structure, it is possible to effectively suppress noise even in the case of single-side mounting. | 02-11-2010 |
20100046176 | PORTABLE ELECTRONIC DEVICE WITH MAINTENANCE CAPABILITY - A portable electronic device includes a circuit board and at least one treatment element mounted adjacent to the circuit board and storing volatile maintaining matters therein. The circuit board generates heat when the portable electronic device is working to heat the treatment element, and then the maintaining matters volatilize to maintain the portable electronic device. | 02-25-2010 |
20100067200 | DATA CARRIER FOR CONTACTLESS DATA TRANSMISSION AND A METHOD FOR PRODUCING SUCH A DATA CARRIER - Data carrier for contactless data transmission comprising a substrate, a chip having at least one connection pad, wherein the chip is arranged by its side remote from the connection pad on the substrate and a first copper-coated prepreg layer 40 is arranged on the chip and at least partly on the substrate and has a contact opening to the connection pad. A plated-through hole is situated within the contact opening for producing an electrically conductive connection between the connection pad of the chip 30 and the copper layer of the first copper-coated prepreg layer, wherein a first antenna structure 48 is formed in the copper layer of the first copper-coated prepreg layer. | 03-18-2010 |
20100067201 | FLIP ELECTRONIC DEVICE - A flip electronic device includes a cover, a display module, a casing, a circuit board, and an electrical connection element. The casing is pivotally connected with the cover. The cover has a light-transparent portion. The display module is disposed at the cover. The circuit board is disposed in the casing. The electrical connection element is electrically connected with the display module and the circuit board. At least one portion of the electrical connection element is viewable through the light-transparent portion. | 03-18-2010 |
20100073886 | Sensor board and producing method thereof - A method for producing a sensor board includes the steps of preparing an insulating layer; forming at least a pair of electrodes on the insulating layer; and forming a conductive layer by spraying a conductive component-containing liquid onto the insulating layer by an ultrasonic spray method so as to cover the electrodes. | 03-25-2010 |
20100085716 | CHIP CARD HOLDER - The chip card holder includes a body member, a card receiving space formed on the body member and a releasing piece. The card receiving space has an opening to insert a chip card along a direction perpendicular to the longitudinal direction of the card receiving space. The releasing piece is slidablely mounted on the body member along the longitudinal direction and is configured for either exposing the opening to insert the chip card or locking the chip card in the card receiving space. | 04-08-2010 |
20100097770 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - Disclosed are a printed circuit board and a manufacturing method thereof. The manufacturing method of a printed circuit board includes: mounting an electronic device on an upper surface of an adhesive layer; laminating an insulator on an upper side of the electronic device and a lower side of the adhesive layer, respectively, such that the electronic device is buried; and forming a circuit pattern and a via on the insulator. | 04-22-2010 |
20100097771 | CIRCUIT BOARD ASSEMBLY - A circuit board assembly used in a portable electronic device includes a circuit board, a duplexer mounted on the circuit board, and a shielding member defining a hole corresponding to the duplexer therein. The shielding member is mounted on the circuit board and surrounds portions of the duplexer, and the hole exposes portions of the duplexer from the shielding. | 04-22-2010 |
20100142160 | ELECTRONIC DEVICE - An electronic device is described that includes a body member and a cable. The cable is mounted to and received in the body member. | 06-10-2010 |
20100149761 | Apparatus and method for use in assembly of a portable apparatus - An apparatus including: a first interconnector portion configured to fasten to a side part of a first housing portion of a portable apparatus, and a second interconnector portion rigidly connected to the first interconnector portion and configured to fasten to a second housing portion of the portable apparatus. | 06-17-2010 |
20100149762 | FIXING STRUCTURE AND BACKLIGHT MODULE USING THE SAME - A fixing structure and a backlight module using the same are provided. The fixing structure is used for fixing a circuit board. The circuit board with several openings has an upper surface and a lower surface. The fixing structure includes a back plate and several hooks. The back plate has a contact surface. These hooks are disposed on the contact surface. The hooks go through the openings so that the contact surface contacts the lower surface. The hooks move toward the walls of the openings and press against the upper surface so as to fix the circuit board onto the back plate. | 06-17-2010 |
20100157547 | ELECTRONIC DEVICE MODULE - An electronic device module comprises a carrier and first and second device regions. The first device region comprises a plurality of serially-connected devices deposited on the carrier, and the second device region is adjacent to the first device region and comprises a plurality of serially-connected devices. The voltage potential of the plurality of the serially-connected devices in the first device region is substantially the same as that of the plurality of the serially-connected devices in the second device region whereby damage due to short circuit of the adjacent plurality of serially-connected devices is avoided. | 06-24-2010 |
20100165583 | Method for Manufacturing PCB, Display Module and Method for Fabricating Display Module - In the specification and drawing a display module is disclosed. The display module comprises a backboard, a display component and a printed circuit board with at least one locating pin formed thereon. The backboard has at least one locating hole. The display component is disposed on the backboard. The at least one the locating pin is inserted in the locating hole. Moreover, a method for manufacturing the printed circuit board and a method for fabricating the display module are also disclosed in the specification and drawing. | 07-01-2010 |
20100165584 | DETACHABLE NETWORK COMMUNICATION DEVICE, ELECTRONIC DEVICE AND COMMUNICATION DEVICE - A detachable network communication device comprising a first antenna is disclosed. The detachable network communication device is operable to be coupled to a second electronic device comprising a second antenna, wherein the first antenna is coupled to the second antenna to form a combined antenna structure. The combined antenna structure is operable to receive and/or transmit radio signals such as, for example, digital television signals. The detachable network communication device may also comprise an additional sub-antenna that may be operable as a diversity antenna. | 07-01-2010 |
20100165585 | CHIP PACKAGES WITH POWER MANAGEMENT INTEGRATED CIRCUITS AND RELATED TECHNIQUES - Chip packages having power management integrated circuits are described. Power management integrated circuits can be combined with on-chip passive devices, and can provide voltage regulation, voltage conversion, dynamic voltage scaling, and battery management or charging. The on-chip passive devices can include inductors, capacitors, or resistors. Power management using a built-in voltage regulator or converter can provide for immediate adjustment of the voltage range to that which is needed. This improvement allows for easier control of electrical devices of different working voltages and decreases response time of electrical devices. Related fabrication techniques are described. | 07-01-2010 |
20100172110 | ELECTRONIC APPARATUS - An electronic apparatus includes a printed board having a mounting surface and a ground layer, a peripheral circuit of a memory, which is mounted in the electronic apparatus, being mounted on the mounting surface, a metal plate disposed above the mounting surface, and a plurality of conductive portions that electrically connect the ground layer and the metal plate to each other, wherein the peripheral circuit is mounted between the conductive portions. | 07-08-2010 |
20100177488 | Vinyl Addition Polycyclic Olefin Polymers Prepared With Non-Olefinic Chain Transfer Agents And Uses Thereof - A method of polymerizing poly(cyclic)olefin monomers encompassing (a) combining a monomer composition containing the poly(cyclic)olefin monomers, a non-olefinic chain transfer agent and an activator compound to faun a mixture; (b) heating the mixture; and (c) adding a polymerization catalyst containing Ni and/or Pd. The non-olefinic chain transfer agent includes one or more compounds selected from H | 07-15-2010 |
20100182755 | SEMICONDUCTOR DEVICE - To provide a technique that can improve the reliability of coupling between a package with a PA module and a mounting board in mounting the package over the mounting board. The width of a back conductor pattern is made smaller than the width of each of back terminals. Specifically, for example, the back terminals are arranged in the X direction. The back terminals arranged in parallel to the X direction are coupled together by the back conductor pattern. At this time, the coupling direction (coupling line direction) of the back conductor pattern is the X direction. Taking into consideration the Y direction orthogonal to (intersecting) the X direction, the width of the back conductor pattern in the Y direction is made smaller than the width of each of the back terminals in the Y direction. | 07-22-2010 |
20100188825 | APPARATUS FOR ISOLATING MULTIPLE CIRCUIT BOARDS FROM VIBRATION - An apparatus for isolating an electronic device from vibration is provided. The apparatus includes a rigid frame and a circuit board assembly comprising a plurality of circuit boards. A first isolator is located on a first side of the circuit board assembly between the circuit board assembly and the rigid frame, wherein the first isolator is held in place by equal and opposite forces from the rigid frame and the circuit board. A second isolator is located on a second side of the circuit board assembly between the circuit board and the rigid frame. The second isolator is substantially opposite of the first isolator in relation to the circuit board assembly, wherein the second isolator is held in place by equal and opposite forces from the rigid frame and the circuit board. A third isolator is located on a third side of the circuit board assembly between the circuit board assembly and the rigid frame, wherein the third isolator is held in place by equal and opposite forces from the rigid frame and the circuit board. A fourth isolator is located on a fourth side of the circuit board assembly between the circuit board assembly and the rigid frame. The fourth isolator is substantially opposite of the third isolator in relation to the circuit board assembly, wherein the fourth isolator is held in place by equal and opposite forces from the rigid frame and the circuit board. | 07-29-2010 |
20100195291 | ELECTRONIC CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME - An electronic circuit module includes a plurality of electronic parts mounted on a substrate, the space separating the electronic parts being filled with thermosetting insulating resin, the insulating resin being covered by metal foil so as to expose the profiles and the heights of the electronic parts, the outer periphery of the metal foil being electrically connected to a grounding electrode arranged on the substrate by means of a conductive material. | 08-05-2010 |
20100195292 | ELECTRONIC MEMBER, ELECTRONIC PART AND MANUFACTURING METHOD THEREFOR - When silver oxide is reduced to silver, a large number of cores of metallic silver are formed inside the silver oxide. Then, the silver oxide is reduced in a manner of being hollowed out while its original outer configuration is being maintained. As a result, the curvature of the silver generated becomes larger. The utilization of this microscopic-particle implementation mechanism allows accomplishment of the bonding even if the silver oxide is supplied not in a particle-like configuration, but in a closely-packed layer-like configuration. In the present invention, there is provided an electronic member including an electrode for inputting/outputting an electrical signal, or a connection terminal for establishing a connection with the electrical signal, wherein the uppermost surface of the electrode or the connection terminal is a silver-oxide layer. | 08-05-2010 |
20100195293 | METHOD FOR PRODUCING CAPACITOR, CAPACITOR, WIRING BOARD, ELECTRONIC DEVICE, AND IC CARD - There is provided a method for producing a capacitor which is capable of producing a capacitor having a high withstand voltage and low leakage current,
| 08-05-2010 |
20100202117 | Backplane Wiring For An Input-Output Panel Used For Front Or Rear Access - According to one embodiment, an input-output (I-O) panel is transformed. The I-O panel is configured to couple to an array of first midplane connectors of a first shelf configured according to a first format, where the first shelf has rear access. The I-O panel comprises an array of I-O panel connectors and defines an xy-plane. An array of second midplane connectors of a second shelf is transformed to substantially align the second midplane connectors with the I-O panel connectors. The second shelf is configured according to a second format, where the second shelf has front access. The array of second midplane connectors is arranged in columns defining a midplane column axis and rows defining a midplane row axis. | 08-12-2010 |
20100202118 | SHIFTED SEGMENT LAYOUT FOR DIFFERENTIAL SIGNAL TRACES TO MITIGATE BUNDLE WEAVE EFFECT - An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis. | 08-12-2010 |
20100208436 | Multilayer Circuit Board and Use of a Multilayer Circuit Board - A multilayer circuit board having a security cell having security-related electronic components disposed thereon. The security cell is covered by a circuit path arrangement having circuit path segments disposed close to one another, and by an insulation layer. Penetration and thus manipulation of the security-related components is thus largely prevented. | 08-19-2010 |
20100220449 | CIRCUIT BOARD MODULE AND I/O PORT COLLECTION BOARD THEREOF - A circuit board module includes a circuit board and an I/O port collection board. The circuit board includes at least a first transmission interface. The I/O port collection board has a substrate, a plurality of I/O ports, a plurality of traces, and at least a second transmission interface. The I/O ports, the traces, and the second transmission interface are formed on the substrate. The I/O ports are electrically connected with the second transmission interface via the traces. The second transmission interface is connecting with the first transmission interface of the circuit board. | 09-02-2010 |
20100220450 | PACKAGING STRUCTURE OF SIP AND A MANUFACTURING METHOD THEREOF - A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module. | 09-02-2010 |
20100226101 | Multi-Part Substrate Assemblies for Low Profile Portable Electronic Devices - Multi-part substrate arrangements that yield low profile configurations are disclosed. One aspect pertains to portable electronic devices are able to have low profiles through use of multi-part substrate arrangements. Another aspect pertains to methods for assembling two or more separate substrates into a multi-part substrate. By use of multi-part substrate arrangements according to the invention, portable electronic devices are able to be thinner and more compact. | 09-09-2010 |
20100226102 | PRINTED CIRCUIT BOARD UNIT - A printed circuit board unit includes a printed wiring board, an electronic component package mounted on a front surface of the printed wiring board, a radiating plate that is placed on an upper surface of the electronic component package, a bolt that has a head and a tip protruding from a back surface of the printed wiring board, and penetrates through the radiating plate and the printed wiring board, a reinforcing plate separated from the back surface of the printed wiring board by a predetermined gap, a stud arranged on a front surface of the reinforcing plate and coupled with the tip of the bolt, and a shock absorbing plate that is arranged between the reinforcing plate and the back surface of the printed wiring board. | 09-09-2010 |
20100232120 | ELECTRICAL COMPONENT - An electrical component system and method is provided. In an embodiment, the electrical component system includes a circuit carrier onto which at least one electrical component has been mounted. The circuit carrier is injection molded around using a molding compound. An embedding length of a circuit-board conductor in the molding compound, situated between the contacting area on the circuit carrier and the exit location, is maximized. | 09-16-2010 |
20100238634 | CORRECTING FITTING FOR USE WITH PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD UNIT - A correcting fitting clamped by elasticity at least on one part of an edge portion of a printed circuit board for correcting warpage or flexure of the printed circuit board. The correcting fitting has a clamping portion for coming into band-shaped abutting contact with both faces of the printed circuit board along the edge portion of the printed circuit board. The clamping portion is bent in such a manner that at least a portion thereof is directed toward the edge portion of the printed circuit board. The bending strength of the correcting fitting against warpage and flexure of the printed circuit board can be enhanced by the clamping portion. Further, since fixing elements such as screws are not used to mount the correcting fitting, the number of parts of the printed circuit board and the number of steps for assembling the same can be reduced to thereby lower cost and achieve high-density packaging. | 09-23-2010 |
20100238635 | Printed circuit board, manufacturing method thereof and radio-frequency device - A printed circuit board (PCB) is provided. The PCB includes a first microwave board material, a second prepreg, and a third ordinary board material that are pressed together. The first microwave board material, the second prepreg, and the third ordinary board material are provided with an opening respectively. At least two openings have different sizes. In a region between boundaries of the at least two openings having different sizes, a borehole is provided to pass through the board material in the region. A back-drilled hole is selectively used. A radio-frequency device and a method for manufacturing a PCB are further provided. Thus, it is suitable for designing different power modules and other circuit modules on the same single board, and is compatible with the existing basic PCB manufacturing technologies, which further has a low cost, and can meet the requirements of large-power radio-frequency circuits with different frequencies. | 09-23-2010 |
20100246143 | Electromagnetic Interference Shielding for Compact Electronic Devices - Improved approaches for providing electromagnetic interference shielding to one or more electrical components within a housing of a portable electronic device are disclosed. According to one aspect of certain embodiments, an electromagnetic shield can be attached to one or more edges of a substrate (e.g., printed circuit board) provided within a housing of a portable electronic device. Advantageously, this allows the substrate space to be efficiently utilized such that relatively wide electrical components can be provided on the substrate without having to further increase the width of the substrate to provide space for an EMI shielding structure and its attachment to the substrate. The housing of the portable electronic device can be compact, such as a low profile housing. | 09-30-2010 |
20100254097 | OUTPUT ARCHITECTURE OF POWER SUPPLY - An output architecture of a power supply is disclosed, wherein the power supply includes an input portion to obtain input power and a conversion circuit board connecting to the input portion to convert the input power into output power of different voltage potential. The conversion circuit board includes plural power output areas with different preset output voltages, and after selecting the output standard, the power output areas connect to at least one power extension board via plural electrical conductive elements, so as to provide the power extension board the output power, and the power extension board has plural output wires connected to a load. Through the architecture described above, the corresponding output wires can be selected after the output standard is selected for connecting to the power extension board, and then, the power extension board is connected to the conversion circuit board. | 10-07-2010 |
20100254098 | Circuit Board, Mounting Structure, and Method for Manufacturing Circuit Board - Provided are a circuit board which meets requirement of suppressing peeling of a through hole conductor, a mounting structure and a method for manufacturing the circuit board. A circuit board ( | 10-07-2010 |
20100254099 | SILICON-CERAMIC COMPOSITE SUBSTRATE - The invention relates to a silicon-ceramic composite substrate ( | 10-07-2010 |
20100259904 | Signal Conversion Device - The present invention provides a signal conversion device comprising: a substrate having a first surface and a second surface, the first surface being provided with a first contact region comprising at least a first contact and a second contact while the second surface being provided with a second contact region comprising at least a third contact and a fourth contact; wherein there is an electrical connection between the first and third contacts, and the second and fourth contacts are electrically connected to an IC fabricated using Wafer Level Chip Scale Package (WLCSP) or Chip On Film (COF) technology, and wherein the IC is disposed at the first surface or the second surface. | 10-14-2010 |
20100265670 | FIXING STRUCTURE FOR ELECTRONIC CARD - A fixing structure for an electronic card is suitable for mounting a long electronic card or a short electronic card within a housing. The fixing structure includes a pressing plate, a locking slice, and a locking member. Two ends of the pressing plate have two buckling portions. The locking slice connects an end of the pressing plate and has a locking hole. Besides, the locking slice leans against the housing. The locking member passes through the locking hole and is fixed into a first fixing hole or a second fixing hole. When the locking hole corresponds to the first fixing hole, the two buckling portions are fixed onto a free end of the long electronic card. When the locking hole is corresponding to the second fixing hole, the two buckling portions are fixed onto a free end of the short electronic card. | 10-21-2010 |
20100271788 | CIRCUIT MODULE AND ELECTRONIC EQUIPMENT USING THE CIRCUIT MODULE - A circuit module of the present invention includes a circuit board, a plurality of electronic parts mounted on one face of the circuit board, a tubular body provided in an upstanding manner on the face in surrounding relation to the electronic parts, a turned-back portion turned back inwardly at a predetermined height position of the tubular body, and a resin portion formed by a sealing resin which is filled in the tubular body to a height reaching a distal end of the turned-back portion such that the resin covers at least part of the electronic parts. With this construction, the two surfaces of the sealing resin and the turned-back portion are joined together, so that the joining strength increases, and there can be provided the circuit module which is of the thin type and has a high strength. Further, through holes are provided at a region of the turned-back portion exposed from the sealing resin, and therefore a cavity within the turned-back portion (within a U-shaped portion), which is due to expansion of residual gas, can be eliminated, and besides the development of a convex portion formed on the upper surface of the resin by a cavity formed in the resin by gas moved from the interior of the turned-back portion into the resin and also the development of a crater-like irregularity portion formed on the upper surface of the resin portion when gas within the frame passes to the upper surface of the resin can be suppressed. | 10-28-2010 |
20100315790 | Circuit Substrate Structure And Circuit Apparatus - A first wiring layer in a circuit substrate structure is provided with a first inductor and a second inductor. A dielectric layer is provided with a first via and a second via electrically connected to the first inductor and the second inductor, respectively. A second wiring layer is provided with: a bridge electrically connecting the first via and the second via; and a conductive pattern provided around the bridge, the outer edge of the conductive pattern being located outside the outer edge of the first wiring pattern and the second wiring pattern in the first wiring layer. The bridge functions as a coplanar line and suppresses generation of electromagnetic field. | 12-16-2010 |
20100321901 | OPTICAL ELEMENT, ELECTRONIC MODULE AND METHOD OF PRODUCING ELECTRONIC MODULE - Disclosed are: an optical element which is reduced in the changes in transmittance which may be caused by a reflow processing; an electronic module; and a method of producing an electronic module. The optical element comprises an optical material which comprises a curable resin material comprising a curable resin and a curing agent and at least one additive, wherein the light transmittance of the optical material at a wavelength of 400 nm is lower by 1 to 10% than that of the curable resin material without the additive at a wavelength of 400 nm. | 12-23-2010 |
20100328902 | Coil Transducer Isolator Packages - In an embodiment, the invention provides a coil transducer isolator package comprising at least one lead frame, at least two integrated circuits (ICs) and a flex circuit comprising at least a first coil transducer. The first coil transducer comprises at least one metal coil. The coil transducer isolator package is fabricated such that no portion of the lead frame is physically located within a spatial volume extending substantially perpendicular to the at least one metal coil. The boundaries of the spatial volume are defined by a periphery of the at least one metal coil. At least one of the two ICs is at least partially located within the spatial volume extending substantially perpendicular to the at least one metal coil. | 12-30-2010 |
20100328903 | CIRCUIT BOARD MODULE AND ELECTRONIC APPARATUS - A circuit board module includes: a board having a mounting surface; an electronic component mounted on the mounting surface; a frame which is mounted on the mounting surface so as to surround the electronic component; a resin portion which is provided inside the frame and closely contacts the electronic component, the mounting surface, and the frame; and a lid portion which covers the electronic component, and which is connected to the frame. The lid portion includes a flat portion which is provided at a region containing an area corresponding to the electronic component not covered with the resin portion and which protrudes outward more than the other regions. | 12-30-2010 |
20110013369 | AUDIO CIRCUIT BOARD - An audio circuit board includes a main body, an audio connector, a digital ground loop, an analog ground portion and a moat. The main body includes an edge and a surface. The audio connector is disposed on one side of the main body and includes a fixing portion. The digital ground loop completely surrounds the edge of the main body. The audio connector is connected with the digital ground loop via the fixing portion. The analog ground portion is disposed on the surface of the main body and is disposed adjacent to the digital ground loop. The analog ground portion is separated from the main body via the moat. | 01-20-2011 |
20110019368 | Silicon Carrier Structure and Method of Forming Same - A silicon carrier structure for electronic packaging includes a base substrate, a silicon carrier substrate disposed on the base substrate, a memory chip disposed on the silicon carrier substrate, a microprocessor chip disposed on the silicon carrier substrate, an input/output chip disposed on the silicon carrier substrate, and a clocking chip disposed on the silicon carrier substrate. | 01-27-2011 |
20110019369 | ELECTRONIC CIRCUIT MODULE WITH GOOD HEAT DISSIPATION - An electronic circuit module includes a circuit board provided with the connector section, electronic parts provided on a mounting surface of the circuit board, a metallic board provided with a bonding section, which is superimposed on a part of the mounting surface of the circuit board, and an extension section which extends from the circuit board and is formed with the fixing through holes, a connection member that connects the circuit board to the metallic board, and a shim member superimposed at the same side as the circuit board with respect to the extension section of the metallic board, and having a thickness substantially identical to a thickness of the circuit board. | 01-27-2011 |
20110026228 | Retractable Circuit Board Guide And Bracket - A circuit board guide and bracket apparatus includes a first member collapsibly attached to a second member. The first member is attachable to a planar member in a chassis. The second member guides a circuit board being mounted into a connector on the planar member and supports the board subsequent to being mounted. | 02-03-2011 |
20110051377 | CIRCUIT BOARD HOLDING MEMBER AND IMAGE FORMING APPARATUS - A circuit board holding member includes a body portion, holding portions and first attachment portions. The body portion is made of resin, and is provided to hold a circuit board. The holding portions are made of resin. The holding portions are formed integrally with the body portion, and are provided to hold connection lines to be connected from electric modules of an apparatus to the circuit board. The first attachment portions are provided in the body portion and serve for removably attaching the circuit board to the apparatus. | 03-03-2011 |
20110051378 | Wafer-Level Molded Structure for Package Assembly - An integrated circuit structure includes a bottom die; a top die bonded to the bottom die with the top die having a size smaller than the bottom die; and a molding compound over the bottom die and the top die. The molding compound contacts edges of the top die. The edges of the bottom die are vertically aligned to respective edges of the molding compound. | 03-03-2011 |
20110063806 | HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD - A circuit wiring board including a wiring substrate, multiple electronic components provided on a surface of the wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a core substrate and a built-up wiring layer formed over the core substrate. The built-up wiring layer includes a conductive layer and an interlayer resin insulating layer, and the electronic components are electrically connected to the conductive layer of the built-up wiring layer. | 03-17-2011 |
20110069459 | SUBSTRATE LAYER ADAPTED TO CARRY SENSORS, ACTUATORS OR ELECTRICAL COMPONENTS - This invention relates to a substrate layer structure adapted to carry electronic device, or components, or electro-mechanical, or electro-chemical sensors, or a combination thereof, and adapted to be attached to a surface of a human or animal body or biological species. The surface of the flexible substrate layer structure is a patterned structure of pre-fixed geometry-formed by one or more slits, but this geometry being selected such that the stretchability of the substrate layer structure becomes adapted to the geometry of the body surface under it. | 03-24-2011 |
20110085305 | ELECTRONIC DEVICE, WASHER AND METHOD FOR MANUFACTURING WASHER - An electronic device includes, a circuit board including a through hole, a member including a screw hole, a screw including a screw body having an outer diameter smaller than an inner diameter of the through hole and a screw head having an outer diameter larger than the inner diameter of the through hole, wherein the screw body penetrates through the through hole to engage with the screw hole and the screw head is disposed on an opposite side of the circuit board to the member, and a first washer provided between the screw head and the circuit board, the first washer including a first washer body and a plurality of first washer legs extending from the first washer body toward the circuit board, the first washer legs being in contact with the circuit board and having a characteristic of reducing stress on the circuit board upon being heated. | 04-14-2011 |
20110085306 | MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING THE BOARD - A coreless multilayer printed wiring board including a coreless layer having an opening, a conductive film formed on an upper surface of the coreless layer and closing one end of the opening of the coreless layer, a via-hole formed in the opening of the coreless layer, a first resin layer formed on the coreless layer and the conductive film and having an opening reaching to the conductive film, a via-hole formed in the opening of the first resin layer, a second resin layer formed on the upper surface of the first resin layer and having an opening, a via-hole formed in the opening of the second resin layer. The via-holes formed in the first and second resin layers are open in the direction opposite to the direction in which the via-hole formed in the coreless layer is open. | 04-14-2011 |
20110090651 | PACKAGE STRUCTURE - Provided is a package structure. The package structure includes a first substrate, a first device, a second substrate, a first via contact, and at least one second device. The first device is formed on the first substrate. The second substrate has an air gap over the first substrate and covers the first device. The first via contact is connected to the first device through the second substrate. At least one second device is electrically connected to the first via contact, and is stacked on the second substrate. | 04-21-2011 |
20110096514 | SHIELD FOR A COMPONENT FOR AN ELECTRONIC DEVICE AND METHOD FOR ASSEMBLING COMPONENTS IN THE DEVICE - The disclosure provides a shield for a component in an electronic device. The shield comprises a cap for locating on the PCB about the first component, the cap having a first and a second arm extending outwardly from a body of the cap. For the shield, a platform is mountable on the cap to provide a top surface for mounting a second component thereon; and a connector is disposable on the PCB, located against the cap and the arm, the connector providing electrical connections between the PCB and the platform for the second component. The disclosure also provides a method of assembling components in an electronic device. The method comprises: assembling the cap on the PCB; and assembling the platform onto the cap without utilizing an external jig and utilizing alignment features provided on the cap and the platform, such that the platform is placed on top of the cap at a predetermined location about the cap defined by the alignment features. | 04-28-2011 |
20110096515 | ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF - Provided is an electronic device of high reliability having an exposed functional portion. An electronic device | 04-28-2011 |
20110103026 | MOUNTING APPARATUS FOR PERIPHERAL COMPONENT INTERCONNECT CARD - A mounting apparatus for a PCI card includes a mounting bracket, a mounting piece for attaching the PCI card to the mounting bracket, and a securing member. The mounting bracket has a blocking plate and a first engaging portion. The mounting piece includes an elongated body and a mounting end extending from the elongated body. The mounting end abuts the blocking plate. The securing member is pivotably attached to the mounting bracket and abuts the mounting end to sandwich the mounting end between the securing member and the blocking plate. The securing member includes a second engaging portion, a handling portion, and an elastic arm. The second engaging portion engages the first engaging portion. The handling portion is for driving the second engaging portion to disengage from the first engaging portion by biasing the handling portion. | 05-05-2011 |
20110110051 | MOUNTING APPARATUS FOR EXPANSION CARD - A mounting apparatus for an expansion card with a blocking piece is disclosed. The mounting apparatus includes a mounting bracket and a fixing piece. The mounting bracket includes a support plate with two bent portions. The fixing piece is pivotably mounted on the mounting bracket. The fixing piece includes a resisting piece, two resilient pressing pieces, and an engaging portion. The resisting piece secures the blocking piece to the support plate. The two resilient pressing pieces are connected to the resisting piece. The engaging portion retains the fixing piece to the mounting bracket. A pivot portion protrudes from each pressing piece and is received in each bent portion. The two pressing pieces are oppositely pressed to disengage the pivot portion from the bent portion. | 05-12-2011 |
20110110052 | MULTILAYER WIRING BOARD - A multilayer wiring board | 05-12-2011 |
20110110053 | SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR MEMORY CARD USING THE SAME - A semiconductor memory device is provided with a wiring board which includes an element mounting portion and connection pads. Plural semiconductor memory elements are stacked on the element mounting portion of the wiring board. The semiconductor memory element of a lower side has a thickness greater than that of the semiconductor memory element of an upper side. The semiconductor memory elements are electrically connected to the connection pads of the wiring board via metal wires. | 05-12-2011 |
20110116242 | TAMPER EVIDENT PCBA FILM - Method and apparatus for constructing and operating a printed circuit board assembly (PCBA). In some embodiments, a plurality of electronic components are attached to a first side of a substrate that has at least one electrical lead that connects the electrical components is present on an opposite second side of the substrate. A primary film is adhered to the second side of the substrate to create an air tight seal around each electrical lead. A secondary film is then adhered to the primary film and provides a cantilevered lift tab that extends outside the bounds of the primary film. The secondary film has a lower bond strength than the primary film. | 05-19-2011 |
20110122586 | Side key connection device of mobile terminal - A side key connection device of a mobile terminal simplifies a connection structure between a side key and a main circuit board. The mobile terminal includes a side key and a row and column terminal pad. The mobile terminal also includes a side key connection device installed between the side key and the row and column terminal pad. The side key connection device is electrically connected to the side key and the row and column terminal pad. Thereby, by simplifying a connection structure of a side key, a key cost, an assembly process, and a surface mounting cost can be reduced. | 05-26-2011 |
20110128709 | Display array substrate and method of manufacturing display substrate - A display array substrate according to an aspect of the invention may include: a substrate wafer having a plurality of substrates and cutting portions connecting the plurality of substrates to a dummy area, the substrate wafer being diced to provide individual substrates by cutting the cutting portions; and a transparent electrode part coated over one surface of the substrate wafer. | 06-02-2011 |
20110141704 | CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUACTURING THE SAME - A circuit board includes a substrate, a circuit pattern and a through electrode. The circuit pattern is disposed on one side of the substrate in a thickness direction thereof. The through electrode is filled in a through-hole formed in the substrate with one end connected to the circuit pattern. The circuit pattern and the through electrode each have an area containing a noble metal component (e.g., Au component) and are connected to each other therethrough. | 06-16-2011 |
20110149528 | METHODS AND COMPOSITIONS FOR DIELECTRIC MATERIALS - The present invention comprises methods and compositions of dielectric materials. The dielectric materials of the present invention comprise materials having a dielectric constant of more than 1.0 and less than 1.9 and/or a dissipation factor of less than 0.0009. Other characteristics include the ability to withstand a wide range of temperatures, from both high temperatures of approximately +260° C. to low temperatures of approximately −200° C., operate in wide range of atmospheric conditions and pressures (e.g., a high atmosphere, low vacuum condition such as that found in the outer-space as well as conditions similar to those found at sea level or below sea level). The dielectric materials of the present invention may be used in the manufacture of composite structures that can be used alone or in combination with other materials, and can be used in electronic components or devices such as RF interconnects. | 06-23-2011 |
20110149529 | PROCESSING OF ELECTRIC AND/OR ELECTRONIC ELEMENTS ON CELLULOSIC SUBSTRATES - The present invention consists of the direct deposition over paper of electric and electronic elements, single or integrated, including at nano-scale. The deposition, by virtue of the materials and scale utilized, is furthermore transparent, which allows the application of the present invention in the domain of graphic arts. The deposition is executed at close-to-ambient temperatures, an in a less controlled environment than that of traditional deposition processes. Furthermore, the low cost of printing obtained allows for the application of electronic paper to large surfaces. | 06-23-2011 |
20110149530 | PRINTED CIRCUIT BOARD ASSEMBLY - There is provided a printed circuit board assembly including a printed circuit board having a plurality of circuit elements mounted on an upper surface thereof, and a power line mounted on a lower surface of the printed circuit board and supplying power to the circuit elements. | 06-23-2011 |
20110149531 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing having electric insulation properties, a substrate installed in the housing, a trace provided on an inner surface of the housing, and a connector including a connector body formed of an elastic body and compressed between the inner surface of the housing and the substrate, and a conductor buried in the connector body so as to penetrate the connector body, the connector electrically connecting the trace and a terminal of the substrate by the conductor. The housing includes a holder integrally formed therewith, the holder defining an attachment position of the connector. The holder protrudes from the inner surface of the housing in such a manner as to support the substrate and controls a degree of compression of the connector body. | 06-23-2011 |
20110149532 | LAMINATE, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE - Disclosed is a laminate including an insulating resin layer and a metallic foil formed in contact with the insulating resin layer. The laminate is characterized in that the interface stress between the insulating resin layer and the metallic foil represented by the following formula (1) is not more than 7×10 | 06-23-2011 |
20110157839 | ELECTRONIC DEVICE, FILTERING MODULE THEREOF AND METHOD FOR REDUCING COMMON MODE NOISE - A filtering module includes a circuit board, a connector, a core and a plurality of coils. The connector and the core are disposed on the circuit board. The coils wind around the core and are electrically connected to the connector. | 06-30-2011 |
20110157840 | CHIP CARD HOLDER AND ELECTRONIC DEVICE USING THE SAME - A chip card holder is configured for receiving a chip card. The chip card holder includes a housing defining a groove, a latching part received in the groove, a fixing element made of rubber material. The chip card is received in the latching part. The fixing element includes a main plate, a positioning portion, a rib, and a free end. The positioning portion is positioned on a side of the main plate. The positioning portion latches the housing. The rib is positioned on the same side which positioning the positioning portion. The rib resists the chip card. The free end extends from a peripheral edge of the main plate. The present disclosure further discloses an electronic device using the chip card holder. | 06-30-2011 |
20110157841 | PORTABLE ELECTRONIC DEVICE WITH HOLLOW SUPPORT - A portable electronic device includes a main body, a circuit board in the main body, a rear cover, at least one first conductive member exposed through the rear cover and electrically connected to the circuit board, and a support assembly. The support assembly includes a hollow support detachably connected to the rear cover, at least one second conductive member connected to the hollow support and staying in contact with the at least one second conductive member, and at least one cable extending through the hollow support and comprising a first end electrically connected to the at least one second conductive member, and a second end extending out of the hollow support for connecting with a peripheral. | 06-30-2011 |
20110157842 | USE OF HYBRID PCB MATERIALS IN PRINTED CIRCUIT BOARDS - A apparatus comprising a printed circuit board (“PCB”). The PCB comprises a first insulating layer and a second insulating layer. The first insulating layer is made of a first material and the second insulating layer is made of a second material. The first material has a lower dissipation factor than the second material. The first material and second material have substantially similar dielectric constants. | 06-30-2011 |
20110170267 | STRUCTURE, ANTENNA, COMMUNICATION DEVICE AND ELECTRONIC COMPONENT - A structure | 07-14-2011 |
20110170268 | ELECTROMAGNETIC BAND GAP STRUCTURE, ELEMENT, SUBSTRATE, MODULE, AND SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC BAND GAP STRUCTURE, AND PRODUCTION METHODS THEREOF - To provide a small-sized and thin electromagnetic band gap structure which can be surface-mounted or built in a substrate. An electromagnetic band gap structure according to an aspect of the present invention includes: an insulating substrate; a plurality of conductor pieces regularly arranged on the insulating substrate; a dielectric layer formed so as to fill a space between adjacent ones of the conductor pieces; an interlayer insulating layer formed on the dielectric layer; and a conductor plane which is formed on the interlayer insulating layer and is connected to each of the conductor pieces with a conductor penetrating through the interlayer insulating layer. | 07-14-2011 |
20110188213 | THERMALLY CONDUCTIVE SILICONE COMPOSITION AND ELECTRONIC DEVICE - A thermally conductive silicone composition of the invention comprises: (A) an organopolysiloxane having a viscosity of at least 500 mPa·s at 25° C.; (B) a thermally conductive filler; (C) a fine silica powder; (D) an organopolysiloxane having a hydrolyzable group and having a viscosity of less than 500 mPa·s at 25° C.; and (E) a silane compound containing a hydrolyzable group. The composition possesses excellent handleability and workability at low viscosity and which, after application onto surfaces, is not subject to slipping-off when this surface assumes a vertically position, even under harsh temperature conditions. | 08-04-2011 |
20110194261 | PREPREG, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE - The present invention is to provide a prepreg capable of significantly decreasing generation of voids in a glass fiber base material and forming a printed wiring board and a semiconductor having high reliability, a laminate thereof, and a printed wiring board and a semiconductor device using the same. A prepreg comprising a glass fiber base material (A) impregnated with a thermosetting resin composition (B), wherein an inorganic particle having an average particle diameter of 500 nm or less is attached on a glass fiber surface of the glass fiber base material (A). | 08-11-2011 |
20110199738 | SUBSTRATE FOR DISPLAY DEVICE AND DISPLAY DEVICE - A substrate for a display device is disclosed which enables further reduction in area of a frame region and a display device comprising the substrate. In at least one embodiment, the present invention relates to a substrate for display device, comprising: a plurality of external connection terminals; and a plurality of lower wirings running below the plurality of external connection terminals; wherein the substrate further comprises an interlayer insulating film positioned between a layer of the plurality of external connection terminals and a layer of the plurality of lower wirings and provided with a plurality of connection holes, the plurality of lower wirings are running alongside each other in a direction across the plurality of external connection terminals and bent toward the same side with respect to the running direction in order from an endmost lower wiring, in a plan view of the substrate for display device, and each of the plurality of external connection terminals is connected through at least one of the plurality of through holes to a portion beyond the bent portion of any of the plurality of lower wirings. | 08-18-2011 |
20110205714 | ELECTRONIC APPARATUS AND DAUGHTERBOARD - A daughterboard to be attached to a motherboard on which a host controller is mounted includes a first connector electrically connected to the host controller, a bridge controller electrically connected to the first connector, a chip electrically connected to the bridge controller, and a second connector electrically connected to the bridge controller and configured to electrically connect to other daughterboards. | 08-25-2011 |
20110205715 | TRANSMISSION LINE CIRCUIT HAVING PAIRS OF CROSSING CONDUCTIVE LINES - A transmission line circuit includes a dielectric layer and a plurality of pairs of conductive lines extending generally along a first direction. The conductive lines in each pair are separated by the dielectric layer, and the conductive lines in each pair intermittently cross at crossing points that are separated by a first distance. The crossing points of adjacent pairs of the conductive lines are offset along the first direction. | 08-25-2011 |
20110205716 | CIRCUIT SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE - Provided is a circuit substrate that affords a narrower frame in display devices or the like, while suppressing connection faults between wirings and external connection terminals. The invention is a circuit substrate having a substrate, on top of which wiring, an insulating film and an external connection terminal are disposed in order. The circuit substrate is provided with an anisotropic conductive film, having conductive particles, on the external connection terminal; and the external connection terminal is connected to the wiring via at least one contact hole formed in the insulating film, with the length from one end to the other end, in a plan view, of a region formed with one or more contact holes that connect to a specific external connection terminal being greater than the diameter of each of the conductive particles. | 08-25-2011 |
20110222247 | Printed wiring board - A printed wiring board includes a bridge located in a surface layer, a noise absorber located on the bridge, a plurality of grounds directly connected or high-frequency-connected to the bridge, a first device using one of the plurality of grounds as a reference potential, a second device using one of the plurality of grounds other than the ground for the first device as a reference potential, and a high-speed signal line that connects the first device and the second device. The high-speed signal line is routed through a layer adjacent to the bridge in a layer direction of the printed wiring board to form a transmission line structure. | 09-15-2011 |
20110228489 | DEVICES WITH PNEUMATIC, HYDRAULIC AND ELECTRICAL COMPONENTS - Method and devices are provided that integrate various internal channels and inlet and outlet ports, configured to operate with air or fluidics, with electrical circuitry. The devices comprise internal channels and outlet/inlet ports that are integrated into multiple layers of printed circuit boards. A multi-layer printed circuit board assembly is produced by laminating the plurality of layers together. The multi-layer printed circuit board assembly can accommodate a variety of off-the-shelf components, as well as electrical circuits and electronic components. | 09-22-2011 |
20110235284 | CIRCUIT BOARD - A circuit board includes a printed substrate, a number couple of high signal transmission ports and a number of auxiliary testing ports. The couples high signal transmission ports are electrically connected to printed substrate, and each of the couples high signal transmission ports has an space smaller than 50 mil measured from the centers of the high signal transmission ports. The auxiliary testing ports respectively mounted on the high signal transmission ports, and every two testing ports mounted on a couple of high signal transmission ports are interspaced by an space larger than or equal to 70 mil. | 09-29-2011 |
20110235285 | INTERFACE PORT CONFIGURATION TO REDUCE CONNECTION INTERFERENCE - Methods and apparatuses for reducing connection interference within and across adjacent interfaces are provided. An interface includes ports arranged along at least a first axis and second axis. The ports on the first axis are offset from the ports on the second axis. When two interfaces are provided adjacent to each other, the ports on the last axis of the first circuit board are offset from the ports on the first axis of the second circuit board. | 09-29-2011 |
20110242772 | PRE-LAMINATION CORE AND METHOD FOR MAKING A PRE-LAMINATION CORE FOR ELECTRONIC CARDS AND TAGS - The disclosed pre-lamination core and the method of making such a pre-lamination core includes an electronic component or a non-electronic component, a bottom cover sheet, a top cover sheet, and a layer of thermosetting material between the bottom and top cover sheets. The pre-lamination core can be used in the manufacture of cards while using conventional equipment to apply top and bottom overlays to the pre-lamination core. | 10-06-2011 |
20110242773 | CONTROLLER, ELECTRIC POWER STEERING PROVIDED WITH THE SAME, METHOD OF MANUFACTURING BUS BAR, AND METHOD OF MANUFACTURING CONTROLLER - A controller includes: a circuit board; a retaining member; a bus bar that has an embedded portion embedded in and retained by the retaining member and an exposed portion that is exposed from the retaining member and that is electrically connected to the circuit board; and an electrical element that has a terminal connected to the exposed portion. The bus bar is formed in such a manner that a metal plate of which an outer surface is plated with a plating layer is cut along a predetermined cutting plane. The cutting plane at the exposed portion has a parallel portion that is arranged substantially parallel to a principal surface of the circuit board. The parallel portion and the terminal are joined to each other. | 10-06-2011 |
20110249409 | COMPUTER MOTHERBOARD - A computer motherboard includes a display controller, a digital visual interface integrated (DVI-I) connector, and a switching unit. The switching unit includes four first terminals, two second terminals, and a control terminal. Two of the first terminals are respectively connected to clock and data pins of a first display data channel (DDC) of the display controller, the other two first terminals are respectively connected to clock and data pins of a second DDC of the display controller, and the second terminals are respectively connected to DDC clock and DDC data pins of the DVI-I connector. The control terminal is connected to a hot plug detect pin of the DVI-I connector to detect a voltage and correspondingly control the second terminals to be respectively connected to the two first terminals connected to the clock and data pins of the first DDC or the second DDC. | 10-13-2011 |
20110249410 | CARD HOLDING APPARATUS CAPABLE OF HOLDING CARD-SHAPED ELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT PROVIDED WITH THE SAME - Due to the presence of a regulating part in the vicinity of a protrusion of a guide member, a card holding apparatus can prevent large deformation of the protrusion even when an excess pressure force in an insertion direction is applied to the expansion card mounted on the card holding apparatus. Thus, when the subsequent expansion cards are mounted, a guide member can be displaced normally in the insertion direction, and a heart-shaped cam mechanism can be operated normally. Therefore, the expansion card can be removed from the card holding apparatus, using the elastic restoring force of a spring. | 10-13-2011 |
20110267783 | Circuit board having holes to increase resonant frequency of via stubs - A circuit board includes layers, a pair of vias filled with a conductive material and extending through the layers, first and second pairs of conductive signal paths, and holes extending at least partially through the layers and located between the pair of vias. The first pair of conductive paths is connected to the pair of vias within a first layer; the second pair of conductive paths is connected to the pair of vias within a second layer. The pair of vias has a pair of via stubs defined between the second layer and a bottom layer. A differential signal is to be transmitted between the first and second pairs of conductive signal paths via the pair of vias. The holes have a lower dielectric constant than the layers to increase a resonant frequency of the pair of via stubs beyond the frequency of the differential signal. | 11-03-2011 |
20110273853 | COMPUTER SYSTEM WITH RISER CARD - A computer system includes a riser card. The riser card includes a board body and a first socket. The board body includes a first surface. The first socket is located on the first surface. A first socket height of the first socket relative to the first surface is in the range of about 15 mm to about 16 mm. | 11-10-2011 |
20110279985 | Electronic Circuit Breaker and a Method of Providing Protection Switching - A protection switching system in a power supply distribution system, comprises at least one protection switch ( | 11-17-2011 |
20110292619 | ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SUCH AN ELECTRONIC COMPONENT - An electronic component having electrically conductive contacts and a printed circuit board enclosed by a sheathing made from a first plastic, and a method for manufacturing the electronic component. Such electronic components are used in oil pans of a transmission. The electrically conductive contacts are enclosed by a frame made from a second plastic. The first plastic is a duroplastic, and the second one is a thermoplastic. The thermoplastic does not represent a barrier to transmission oil. It is used for shaping the duroplastic, prepositioning the electrically conductive contacts, and preventing mechanical reworking of the duroplastic. No projections such as tabs or flash layers are created. | 12-01-2011 |
20110292620 | CIRCUIT BOARD PACKAGING STRUCTURE - The circuit board packaging structure capable of inserting and extracting an interface part of a circuit board into and from a connector part of the processing equipment in a direction different from a direction of attaching and detaching the circuit board to and from the processing equipment includes: an operating part which turns on receiving force; a plate part which is fixed to the circuit board to be rotatable in a direction reverse to a turning direction of the operating part, and converts the force received by the operating part to force in a direction different from the attaching and detaching direction to move the circuit board in that direction; a link part which connects the operating part with the plate part to transmit the force received by the operating part to the plate part; and a fastener which fastens the circuit board and the operating part with play. | 12-01-2011 |
20110292621 | GROUNDED LID FOR MICRO-ELECTRONIC ASSEMBLIES - An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface. | 12-01-2011 |
20110292622 | METHOD FOR ELECTRIC CIRCUIT DEPOSITION - The invention is directed to a method for preparing a substrate with an electrically conductive pattern for an electric circuit, to the substrate with the electrically conductive pattern, and to a device comprising the substrate with the electrically conductive pattern. | 12-01-2011 |
20110299254 | SCREW-LESS FIXING ASSEMBLY FOR INTERFACE CARD - A screw-less fixing assembly for an interface card having a fixing support includes a frame, a movable cover module and an elastic member. The frame has an I/O opening. One side of the I/O opening is provided with an accommodating space. A long plate of the fixing support is positioned to correspond to the I/O opening, and a short plate of the fixing support is received in the accommodating space. The movable cover module is mounted in the accommodating space. The elastic member has an elastic protrusion positioned to correspond to the short plate of the fixing support. The movable cover module is moved to drive the elastic protrusion to tightly fix the short plate of the fixing support to the frame. With this arrangement, the interface card can be rapidly detached from the frame or attached thereto without using screws. | 12-08-2011 |
20110304994 | CONDUCTIVE VIA STRUCTURES FOR ROUTING POROSITY AND LOW VIA RESISTANCE, AND PROCESSES OF MAKING - An integrated circuit structure includes a first conductive layer (MET | 12-15-2011 |
20110310569 | Method and System For Innovative Substrate/Package Design For A High Performance Integrated Circuit Chipset - Provided is a method and system for designing an integrated circuit (IC) substrate, the substrate being formed to include at least one die. The method includes providing at least portions of IC power and a grounding function on a metal | 12-22-2011 |
20120002377 | GALVANIC ISOLATION TRANSFORMER - An integrated circuit die system comprises a first integrated circuit die, a second integrated circuit die and a transformer formed on a dielectric (e.g., quartz) substrate and electrically connected between the first integrated circuit die and the second integrated circuit die to provide galvanic isolation therebetween. | 01-05-2012 |
20120002378 | BACKPLANE AND BACKPLANE COMMUNICATION SYSTEM - The embodiments of the present invention disclose a backplane and backplane system. The backplane includes at least two service slots with the same function and an exchange slot. Among the pins of different service slots with the same function respectively connected to the exchange slot, at least two pins are arranged to resemble a stepped form. When arranged in this manner, the distribution and orientation of the connection lines connecting the pins of the service slots with the same function to the exchange slot may be adjusted, and wiring density within a single wiring layer may be increased, which therefore enables the connection lines between the service slots and the exchange slot to be staggered from each other in less wiring layers or even one wiring layer, and as a result, decreases the number of the wiring layers to be used, and reduces the costs of the backplane. | 01-05-2012 |
20120014073 | CONDUCTIVE NANOPARTICLE SUBSTRATE AND METHOD OF MANUFACTURE - A device comprising a substrate with first and second layers is prepared by applying a cellulosic base layer on the substrate followed by a silver nanoparticle coating. The nanoparticle coating is durable and highly electrically conductive. This conductive substrate maybe used for the application of integrated circuitry components, and does not outgas upon application of reflow solder. | 01-19-2012 |
20120020031 | ELECTRONIC DEVICE AND CONNECTION MECHANISM FOR TOUCH BUTTONS THEREOF - An electronic device includes a housing, a capacitive touch button, a PCB and a connection mechanism. The capacitive touch button is secured in the housing and includes a number of button bodies. The PCB is secured in the housing. The connection mechanism includes a circuit board and a connection element. The circuit board is secured in the housing and includes a number of sensor electrodes and a number of electrical protrusions, which are all arranged corresponding to the number of button bodies of the capacitive touch button. The sensor electrodes are connected to the capacitive touch button and the electrical protrusions. The connection element includes a first end and a second end. The first end is fixed on the PCB. The second end resists against the electrical protrusions for electrically connecting the capacitive touch button and the controller of the PCB. | 01-26-2012 |
20120020032 | ELECTRIC BUTTON AND LED BUTTON MODULE - An electric button is provided. The electric button comprises a substrate with a plurality of through holes thereon, at least an electric component fixedly disposed on the surface of the substrate and electrically connecting to the substrate, and a mask sealing the electric component on the surface of the substrate. The substrate is sewed onto the fabric by at least a conductive thread through the through holes and electrically connected to the conductive thread. Thereby, if a power supply is connected through the conductive thread to the substrate, the electrical power would be further connected to the electric component so that the electric component can perform its function. | 01-26-2012 |
20120020033 | Skin-Safe Conductive Ink and Method for Application on the Body - An ink comprising a particulate conductive material, a binder and a humectant, the conductive material being present in sufficient amount that the ink, once dry, is electrically conductive, may be applied, for example, to the human or animal body and enables such a body to function as part of an electrical circuit. | 01-26-2012 |
20120026698 | INTEGRATED CIRCUIT BOARD - An integrated circuit board includes a bridging filtering capacitor, a bypass capacitor, a thermistor, and a varistor. The integrated circuit board further includes an electrolytic capacitor set having a plurality of electrolytic capacitors, which are arranged in parallel and adjacent to each other, and a mounting frame for grouping the electrolytic capacitors. The present invention uses the above elements to reduce the vertical height, the horizontal width, and the occupied area. Therefore, the overall dimension of the circuit board can be reduced to make the electronic devices smaller, especially for thin electronic devices such as LCD TVs and screens. | 02-02-2012 |
20120039049 | CARD DEVICE AND POWER SUPPLY METHOD OF CARD DEVICE - One exemplary object of the present invention is to provide a card device which can be shared in main body devices employing different power supply systems, and a power supply method of the card device. The card device according to the present invention includes a flat rectangular card base body ( | 02-16-2012 |
20120044655 | GPS-Timing Module - A GPS-timing module for a wireless communication system comprises an “in line” power-over-Ethernet system and a modular surge protection means for protecting the device and a connected wireless access point/backhauls from power or Ethernet surges. The “in line” Power-over-Ethernet system allows the GPS-timing device to directly power the wireless access point/backhaul to which it is providing a GPS-timing signal. The modular surge protection means comprises a removable component that can be quickly replaced following a power surge. The GPS-timing module further comprises a plurality of DIP switches. The DIP switches allow a user to turn the GPS-timing module on and off, turn the communication module on or off, switch between the GPS-timing module's internal GPS-antenna and external GPS-antenna, and remotely revert the communication module to it “default” mode from its “normal” mode. | 02-23-2012 |
20120044656 | ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME - A method for making an electronic package structure is provided which comprises: providing a substrate; providing an inductor module; assembling the inductor module and the substrate so that they define a space; injecting package glue into the space defined by the inductor module and the substrate so as to form a package layer. | 02-23-2012 |
20120057310 | TELEVISION AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a module in the housing, and an electrical interconnection. The housing includes a first portion, a second portion including a step between the first portion and the second potion, and a slope between the first portion and the second portion. The electrical interconnection extends from the first portion to the second portion via the slope and is electrically connected to the module. | 03-08-2012 |
20120069531 | CONDUCTING PASTE FOR DEVICE LEVEL INTERCONNECTS - A conducting paste and method of forming the paste for device level interconnection. The conducting paste contains metal loading in the range 80-95% that is useful for making five micron device level interconnects. The conducting paste is made by mixing two different conducting pastes, each paste maintaining its micro level individual rich region in the mixed paste even after final curing. One paste contains at least one low melting point alloy and the other paste contains noble metal fillers such as gold or silver flakes. In general, average flake size below five micron is suitable for five micron interconnects. However, 1 micron or smaller silver flakes and an LMP mixture is preferred for five micron interconnects. The amount of LMP based paste in the final mixture is preferably 20-50% by weight. The nano micro paste embodiment shows good electrical yield (81%) and low contact resistance. | 03-22-2012 |
20120081862 | STRUCTURE FOR FIXING CIRCUIT BOARD - A structure for fixing circuit board, adapted for fixing a circuitboard at the rear of a cage, is disclosed, which comprises: a circuitboard; and a clamp, configured with a clipping part, a fixing part and an elastic part; wherein, the clipping part is coupled to the fixing part while the fixing part is coupled to the elastic part; the clipping part has a first hook formed at a surface facing toward the fixing part; the elastic part has a second hook formed extruding out form a surface facing away from the fixing part; the clipping part and the fixing part are arranged straddling across the top edge of the circuitboard while enabling the first hook to couple to a fastener of the circuitboard; and the elastic part is arranged facing toward the cage while enabling the second hook to secure to the bottom of the cage. | 04-05-2012 |
20120092836 | Suspension board with circuit and producing method thereof - A suspension board with circuit includes a metal supporting board, a first insulating layer laminated on a top surface of the metal supporting board, a second insulating layer laminated on a back surface of the metal supporting board, a first conductive pattern laminated on the surface of the first insulating layer and including a first terminal connected to the magnetic head, and a second conductive pattern laminated on the surface of the second insulating layer and including a second terminal. In a slider mounting region, the slider is mounted on the surface and an electronic element mounting space is formed. Respective end edges of the first and second insulating layers are spaced apart from and located at positions inwardly protruded in the electronic element mounting space from an end edge of the metal supporting board, and the second terminal is disposed to face the electronic element mounting space. | 04-19-2012 |
20120106096 | CONNECTOR ASSEMBLY FOR ELECTRICAL AND MECHANICAL INTERCONNECTION OF MODULES - A connector for electrical and mechanical interconnection of first and second mechanically adjacent modules with one another. The first module includes a first electrical connector and an alignment pin and the second module includes a printed circuit board floatingly and displacably mounted on the second module with at least one alignment hole aligned for alignment with the alignment pin of the first module and a second electrical connector aligned for engagement with a corresponding first electrical connector of the first module. During assembly, the alignment pin of the first module engages the alignment hole of the second module and displaces the printed circuit board to align the second electrical connector with the first electrical connector. | 05-03-2012 |
20120106097 | MOTHERBOARD - A motherboard includes a power circuit, a system power supply, and a central processor unit (CPU). The power circuit includes a direct current (DC) voltage input terminal. A first control circuit receives a direct current (DC) voltage through the DC voltage input terminal and outputs a first control signal. A second control circuit receives the first control signal and outputs a second control signal to the CPU and output a third control signal. A switching circuit includes a number of switches. The second control signal controls the corresponding switches to be on or off. A voltage converting circuit receives the third control signal and converts the DC voltage from the DC voltage input terminal, and outputs the converted DC voltage to the system power supply. The CPU receives the second control signal and controls the motherboard operation. | 05-03-2012 |
20120106098 | Flat Panel Display Apparatus and Method of Manufacturing the Same - In a flat panel display apparatus having improved sealing and a method of manufacturing the same, the flat panel display apparatus comprises: a substrate; a display unit disposed on the substrate; a sealing substrate facing the display unit; a sealing member interposed between the substrate and the sealing substrate and surrounding the display unit; and a plurality of wiring groups comprising areas overlapping the sealing member between the substrate and the sealing substrate; wherein the wiring groups are disposed so as to surround the display unit, are spaced apart from an area corresponding to an edge of the display unit, and receive voltage from an external power source. | 05-03-2012 |
20120106099 | PACKAGING BOARD - A packaging board is described having a structure that can positively prevent same kind electrical components having different specifications from being erroneously mounted on a printed board and that can quickly confirm a regular packaging position for each of the same kind of electrical components. The packing board includes at least two electrical components having a same kind and different specifications from each other can be provided with component side identifying marks that can discriminate between the electrical components. A printed board can be provided with mounting areas for the same kind of electrical components with board side identifying marks that correspond to the component side identifying marks. | 05-03-2012 |
20120106100 | Backplane Wiring for an Input-Output Panel Used for Front or Rear Access - According to one embodiment, an input-output (I-O) panel is transformed. The I-O panel is configured to couple to an array of first midplane connectors of a first shelf configured according to a first format, where the first shelf has rear access. The I-O panel comprises an array of I-O panel connectors and defines an xy-plane. An array of second midplane connectors of a second shelf is transformed to substantially align the second midplane connectors with the I-O panel connectors. The second shelf is configured according to a second format, where the second shelf has front access. The array of second midplane connectors is arranged in columns defining a midplane column axis and rows defining a midplane row axis. | 05-03-2012 |
20120113602 | ELECTRICAL CONNECTOR ASSEMBLY HAVING ELECTRICAL CONNECTOR AND FILTER MODULE - A electrical connector assembly includes a mother board ( | 05-10-2012 |
20120120614 | WIRING BOARD - There is provided a wiring board including a multilayer substrate and a reinforcing member. The multilayer substrate has a first main substrate surface formed with a chip mounting area to which an electronic chip is mounted and a second main substrate surface opposed to the first main substrate surface. The reinforcing member is fixed to either an area of the first main substrate surface other than the chip mounting area or the second main substrate surface and has a body predominantly formed of ceramic material and incorporating therein at least one capacitor. | 05-17-2012 |
20120120615 | CIRCUIT BOARD WITH VIA TRACE CONNECTION AND METHOD OF MAKING THE SAME - Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board. The first interconnect layer includes a first conductor trace with a first segment that does not include a via land. A first via is formed on the first segment. | 05-17-2012 |
20120120616 | WIRING BOARD, METHOD FOR MANUFACTURING SAME, DISPLAY PANEL, AND DISPLAY DEVICE - A wiring board is provided which can prevent a metal electrode from corroding due to a defect in a transparent conductive electrode covering an end face of an organic insulating film. An active-matrix substrate includes: a glass substrate; a metal wire provided on the glass substrate; a gate insulating film covering the metal wire; an interlayer insulating film covering the gate insulating film; and a transparent electrode formed on the interlayer insulating film. The scanning wire provided with a terminal area where the transparent electrode is laminated directly on the scanning wire. The transparent electrode extends over the terminal area in such a way as to cover an end face of the interlayer insulating film that faces the terminal area and an end face of the gate insulating film that faces the terminal area. | 05-17-2012 |
20120120617 | FEED LINE STRUCTURE, CIRCUIT BOARD USING SAME, AND EMI NOISE REDUCTION METHOD - Provided is a feed line structure that enables suppression of noise entering a primary power supply from an electronic circuit without using a circuit component such as a choke coil and a capacitor and also without increasing an occupied area on the circuit board, so that an EMI countermeasure is achieved. The feed line structure includes a feed line composed by pairing a power supply wire 41 and a reference potential wire 42 in an insulator 40, and is characterized in that a wire 43 in a floating state in potential is provided. | 05-17-2012 |
20120127675 | APPARATUS HAVING A WIRING BOARD AND MEMORY DEVICES - An address signal line having a stub structure connects between at least three memory elements and a data transferring element and transmits address signals for the memory elements. An address terminal of the data transferring element has an impedance lower than a characteristic impedance of the address signal line. A wiring length TL | 05-24-2012 |
20120127676 | ARRANGEMENT FOR CONNECTING ELECTRICAL CONDUCTORS TO TERMINAL CONNECTIONS OF INTERCONNECTED CELLS - In order that even the cell connectors ( | 05-24-2012 |
20120134118 | SINGLE SIDED FEED CIRCUIT PROVIDING DUAL POLARIZATION - A feed circuit for connecting adjacent components includes: a printed circuit board having a first portion and an axis of symmetry extending along a longitudinal direction of the first portion, second portions extending in substantially opposite directions from one end of the first portion, and third portions extending in substantially opposite directions from another end of the first portion; at least two circuits electrically connecting respective ones of the second portions with corresponding ones of the third portions; and connection areas at each of the second portions configured to be connected to one of the adjacent components, and at each of the third portions configured to be connected to another one of the adjacent components. | 05-31-2012 |
20120134119 | CHIP CARD HOLDING MECHANISM AND ELECTRONIC DEVICE USING THE SAME - A chip card holding mechanism includes a support bracket defining a receiving chamber and an opening communicating with the receiving chamber; a resilient member fixed to the support bracket at an end of the support bracket opposite to the opening, and partial received in the receiving chamber; a latching assembly rotatably fixed to the support bracket and further comprising a pair of latching portions; and a tray slidably assembled to the support bracket, in which the tray comprises an accommodating space defined thereon to receive a chip card, and a pair of opposite sidewalls adjacent to the accommodating space, each sidewall defining a latching groove according to the corresponding latching portion; and the tray is received in the receiving chamber by having the latching portions of the latching assembly engaged in the latching grooves and resisting against the resilient member. An electronic device using the same is also provided. | 05-31-2012 |
20120134120 | DRIVER ELEMENT AND DISPLAY DEVICE - To broaden a substantial area for wiring between a display portion and a driver element, and to increase the number of wirings between the driver element and the display portion. | 05-31-2012 |
20120134121 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - An electronic device includes: a vibrator disposed within a cavity on a substrate and electrically driven; an enclosure wall which has electric conductivity and sections the cavity from an insulation layer surrounding the circumference of the cavity; a first wiring and a second wiring which connect with the vibrator and penetrate the enclosure wall; and a liquid flow preventing portion disposed at the position where the first wiring and the second wiring penetrate the enclosure wall to prevent flow of etchant dissolving the insulation layer from the cavity toward the insulation layer and insulate the first wiring and the second wiring from the enclosure wall. | 05-31-2012 |
20120140423 | Printed Circuit Board With Integral Radio-Frequency Shields - Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces. | 06-07-2012 |
20120147568 | PRINTED CIRCUIT BOARD FOR USE IN GIGABIT-CAPABLE PASSIVE OPTICAL NETWORK AND METHOD FOR LAYING OUT THE PRINTED CIRCUIT BOARD - A method for laying out a printed circuit board for use in a gigabit-capable passive optical network includes the steps of providing a printed circuit board and laying out an analog circuit module, an analog-to-digital conversion module, a signal processing module, an optoelectronic transmitting and receiving module, and a power module on the printed circuit board. The printed circuit board has a first periphery and an opposing second periphery. The analog circuit module and the optoelectronic transmitting and receiving module are laid out at the first periphery of the printed circuit board. The power module is laid out at the second periphery of the printed circuit board. Electromagnetic wave generated by a power IC inserted in the power module does not interfere with data transmission taking place at the optoelectronic transmitting and receiving module. Furthermore, a printed circuit board for use with the method is proposed. | 06-14-2012 |
20120147569 | ELECTRONIC DEVICE AND PORT CONNECTOR THEREOF - An electronic device includes a main body and a port connector. The main body includes a printed circuit board, a bottom plate and a side plate cooperatively defining a opening. The printed circuit board is fixed parallelly to the bottom plate. The port connector includes an outer angled plate having a first wall, a second wall, and first pins and second pins. The first wall is attached to the bottom plate and defines first ports. The second wall is attached to the side plate and defines second ports. Each of the first pins is retained within one of the first ports and contacting the printed circuit board. Each of the second pins is retained within one of the second ports and contacting the printed circuit board. | 06-14-2012 |
20120147570 | SWITCH STRUCTURE, ELECTRONIC COMPONENT PART INSTALLING STRUCTURE, AND ELECTRONIC MUSICAL INSTRUMENT INCLUDING THE SAME - An intermediate member includes: a base section including a fixing portion provided on a circuit board along the outer periphery of a switch section, and a cylindrical held portion formed integrally with the upper end of the fixing portion; a operator portion operable to drive the switch section; and a resilient connection portion resiliently connecting the operator portion to the base section. A panel member and the circuit board are fixed in face-to-face pressed engagement with each other with the intermediate member sandwiched therebetween. The operator portion is partly exposed out of an opening portion formed in the panel member, the held portion is held fitted with a cylindrical holding portion provided on the lower surface of the panel member, and the fixing portion is sandwiched between the lower end of the holding portion and the upper surface of the circuit board. | 06-14-2012 |
20120155036 | HYBRID CIRCUIT - A hybrid circuit includes a high-voltage circuit and a low-voltage circuit having different power supply voltages, respectively, a board on which a connecting terminal for connecting an external element outside of the hybrid circuit is mounted; and a hybrid integrated circuit mounted on the board. The low-voltage circuit includes a control unit for controlling an operation of the high-voltage circuit. The control unit and the high-voltage circuit are integrated in the hybrid integrated circuit. | 06-21-2012 |
20120162932 | POWER AND GROUND PLANES HAVING MODIFIED RESONANCE FREQUENCIES - Adjusting the resonance of a power distribution network in a device to ensure a resonance frequency of the device is outside of a frequency band of wireless signals, other interference signals, or interference signals intrinsic to the device. The resonance frequency may be adjusted by cutting slices into the power and/or ground planes such that a serpentine pattern (or other desired pattern) is formed. The serpentine pattern increases the length that the current travels along the power/ground plane and thus, changes the resonance frequency of the device. | 06-28-2012 |
20120162933 | MOUNTING APPARATUS FOR EXPANSION CARD - A mounting apparatus for an expansion card includes a bracket, and a securing member. The bracket is capable of fixing a front end of the expansion card. The securing member is slidably mounted to the bracket back and forth, for fixing a rear end of the expansion card. | 06-28-2012 |
20120162934 | ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD - An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer. | 06-28-2012 |
20120170229 | FIXING DEVICE FOR CIRCUIT BOARD - A fixing device for circuit boards of different thicknesses includes a base board, a number of posts protruding from the base board, a number of resilient brackets respectively mounted to the posts, a number of blocks respectively received in the resilient brackets and stacked on top of the corresponding posts, and a number of fasteners inserted through the circuit board, and the resilient brackets, and the blocks, to engage in the posts. | 07-05-2012 |
20120176752 | Assembly Apparatus - An assembly apparatus is provided. The assembly apparatus includes a fixed apparatus that includes a body element, a first fixed element protruding from an outer curved surface of the body element in a radial direction of the body element, and a second fixed element extending in a first direction that is vertical to the radial direction of the body element, and a support apparatus that includes a first receiving element in which the first fixed element is inserted, rotated, and fixed, and a second receiving element in which the second fixed element is inserted, rotated, and fixed. An end of the second fixed element is connected to the body element. Another end of the second fixed element protrudes from a lower surface of the body element. | 07-12-2012 |
20120176753 | EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES - Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves. | 07-12-2012 |
20120188728 | COMPLIANT INSERT FOR ELECTRONICS ASSEMBLIES - A compliant insert is provided to support electronic assemblies to mitigate the effects of external loading. The insert comprises a polymer material having a durometer of between 10 and 90 on the Shore A scale and a 3-D negative relief on the surface of the polymer material. The 3-D negative relief is the negative of the 3-D positive relief of a specified geometric design of an electronics assembly. The compliant insert is mated with an instance of the electronics assembly such that the 3-D negative relief of the polymer material engages the 3-D positive relief of the assembly's PCB and electronic components. The polymer material is compliant enough to absorb the vertical and lateral spacing tolerances of the electronic components and stiff enough to mitigate deflections under loading. | 07-26-2012 |
20120188729 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board (PCB) according to an exemplary aspect of the present invention includes a plate-like member, a power supply circuit, a power supply line, and a ground line. The plate-like member has a surface on which a semiconductor device is mounted. The power supply circuit is embedded in the plate-like member in a region in which the semiconductor device is mounted, and outputs a power supply voltage and a ground voltage. The power supply line is formed in the plate-like member between the semiconductor device and the power supply circuit, and supplies the power supply voltage output from the power supply circuit to the semiconductor device. The ground line is formed in the plate-like member between the semiconductor device and the power supply circuit, and supplies the ground voltage output from the power supply circuit to the semiconductor device. | 07-26-2012 |
20120188730 | INSULATING SHEET, CIRCUIT BOARD, AND PROCESS FOR PRODUCTION OF INSULATING SHEET - An object of the present invention is to provide an insulating sheet superior in heat dissipation efficiency, heat resistance, insulation efficiency and moldability. Provided is a sheet-shaped insulating sheet of a resin composition containing an epoxy resin, a curing agent and an inorganic filler, wherein one or both of the epoxy resin and the curing agent have a naphthalene structure, the inorganic filler contains hexagonal boron nitride, and the inorganic filler is contained in an amount of 70 to 85 vol % in the entire resin composition. It is possible to increase the filling efficiency of an inorganic filler in the insulating sheet by using an epoxy resin and/or a curing agent having a naphthalene structure, which are favorably compatible with the hexagonal boron nitride contained in the inorganic filler. | 07-26-2012 |
20120201009 | LEAD FREE LTCC TAPE COMPOSITION - The invention relates to the use of and method of forming Low Temperature Cofired Ceramic (LTCC) circuits for high frequency applications. Furthermore, the invention relates to the novel LTCC thick film compositions and the structure itself. | 08-09-2012 |
20120206886 | HIGH-FREQUENCY MODULE - In a high-frequency module, a laminate including a plurality of dielectric layers each including an electrode pattern located thereon, and a switch element which includes a test terminal arranged to output a negative voltage applied to the switch element and which is mounted on the laminate, are integrally formed. A test external terminal for external connection which outputs a signal to the outside is provided on a back surface of the laminate. The laminate includes a voltage transmission path electrically connecting the test terminal to the test external terminal. | 08-16-2012 |
20120212911 | ELECTRONIC DEVICE HAVING ADJUSTABLE MOUNTING MODULE - An electronic device having an adjustable mounting module is disclosed. The adjustable mounting module comprises a shaft bracket, a base and an adjusting member. The shaft bracket has at least one fixing member and a bracket body. The bracket body is pivotally mounted on the fixing member. The base is pivotally mounted on the bracket body and is for an electronic assembly to be mounted thereon. The adjusting member is pivotally mounted on bracket body and correspondingly geared with the base. With the foregoing structure, a user can use the adjusting member to drive the base or the bracket body to rotate and thereby adjusts view angle of the electronic assembly. | 08-23-2012 |
20120218723 | MOBILE TERMINAL - Disclosed herein is a mobile terminal including a terminal body comprising a circuit board formed to process radio signals, a first and a second member configured to form an external appearance of the terminal and disposed to cover a lateral surface of the circuit board, a power feed connecting portion to allow the first member and the circuit board to be power feed connected, and a ground connecting portion to allow the first member and the circuit board to be ground connected. Accordingly, an electrical element and an antenna are disposed adjacent to each other, allowing the effective use of a space within the terminal. | 08-30-2012 |
20120224333 | MULTI-PLATE BOARD EMBEDDED CAPACITOR AND METHODS FOR FABRICATING THE SAME - A printed wiring board (PWB) including one or more embedded capacitors. The PWB defines a planar area and includes a plurality of first conductive plates that are substantially parallel to the planar area and extend from a first normal axis towards a second normal axis. The first normal axis and the second normal axis extend substantially perpendicularly through the planar area. The PWB also includes one or more second conductive plates that are substantially parallel to the planar area and extend from the second normal axis towards the first normal axis. The second conductive plates are positioned between the first conductive plates. A non-conductive material is positioned between the first and second conductive plates. At least one first conductive via extends substantially collinear with the first normal axis in contact with the first conductive plates. A plurality of second conductive vias extends substantially collinear with the second normal axis in contact with the second conductive plate. | 09-06-2012 |
20120224334 | MOUNTING APPARATUS FOR DATA STORAGE DEVICE - A mounting apparatus is provided to mount a data storage device includes a bracket and a number of fastening members. The bracket includes two opposite clamping arms to sandwich the data storage device. The fastening members extend through the clamping arms to be locked to the data storage device. Two resilient portions are respectively formed on a top and a bottom of each clamping arm. | 09-06-2012 |
20120229990 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A printed wiring board has a metal layer, a resin structure having a first resin layer portion formed on a first surface of the metal layer, a second resin layer portion formed on a second surface of the metal layer, and a filler resin portion filling an opening portion of the metal layer, a first circuit formed on the first resin portion, a second circuit formed on the second resin portion, and a through-hole conductor formed through the first resin, filler resin and second resin portions and connecting the first and second circuits. The through-hole conductor has a first portion narrowing from the first circuit toward the second resin portion and a second portion narrowing from the second circuit toward the first resin portion, and the first portion is connected to the second portion at a connected position shifted from the middle point of the thickness of the metal layer. | 09-13-2012 |
20120229991 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT - A method for manufacturing an electronic component includes a step of preparing a plurality of electrical elements, a step of preparing a base including a plurality of boards on which the plurality of electrical elements are to be mounted, respectively, a step of forming a resin on the base, a step of pressing the plurality of electrical elements against the resin to join portions of side surfaces of the plurality of electrical elements to the resin, a step of grinding the plurality of electrical elements to thin the plurality of electrical elements, and a step of dividing the base to form the plurality of board into individual pieces. | 09-13-2012 |
20120229992 | MULTILAYERED COMPOSITE SYSTEMS, PRODUCTION THEREOF AND USE THEREOF - Multilayered composite system comprising
| 09-13-2012 |
20120236510 | APPARATUS FOR MANAGING HEAT DISTRIBUTION IN AN OSCILLATOR SYSTEM - A system and method of making an apparatus for managing heat distribution in an oscillator system is disclosed. In an example embodiment, the apparatus includes a resonator configured to provide a periodic signal, a circuit coupled to the resonator configured to compensate for changes in the periodic signal due to variation in temperature, and further includes a heat source configured to generate heat that heats the resonator and the circuit. At least one of the resonator, circuit, and heat source is embedded in a substrate, and the resonator, circuit, and heat source are arranged to heat the resonator and circuit substantially the same amount. | 09-20-2012 |
20120236511 | MOUNTING APPARATUS FOR DATA STORAGE DEVICE - A mounting apparatus for mounting a data storage device includes a bracket and a locking member. The bracket includes a first clamping arm and a second clamping arm pivotable relative to the first clamping arm. A number of mounting pins extend from each of the first and second clamping arms. The second clamping arm includes a first hook. The locking member is pivotably mounted to the first clamping arm and includes a second hook. When the second clamping arm is pivoted towards the first clamping arm, the first hook of the second clamping arm drives the locking member to rotate, until the second hook engages with the first hook and the mounting pins engage in opposite sidewalls of the data storage device. | 09-20-2012 |
20120236512 | PRINTED CIRCUIT BOARD AND CARRIER - A printed circuit board (PCB) secured to a carrier, the carrier comprising at least one hook for securing the PCB, the PCB includes a first surface and a second surface opposite to the first surface. At least one recessed portion in the rim of the first surface receives at least one hook so there are no protrusions above the upper surface of the PCB. A carrier for securing the PCB is also provided. | 09-20-2012 |
20120236513 | Hermetically Sealed Radio-Frequency Front End - A hermetically sealed HF front end (e.g. a transmission/reception module) in a multilayer structure that includes electronic components is provided. The multilayer structure contains a plurality of substrates stacked one above the other and carrying the components. Grooves are formed in the substrates and sealing elements are provided between the substrates, which sealing elements engage in the grooves, and the substrates are soldered together. | 09-20-2012 |
20120243185 | MICRO AND MILLIMETER WAVES CIRCUIT - Embodiments of the present invention provide a micro and millimeter waves circuit, including: a multi-layer circuit board, a heat substrate, and a circuit module. The multi-layer circuit board is opened with a window. The heat substrate includes a base. The multi-layer circuit board is attached to the base. The heat substrate further includes a projecting part extending from the base into the window of the multi-layer circuit board. The circuit module is received in the window and placed on the projecting part. The circuit module is electrically connected with an outer conductor layer of the multi-layer circuit board. | 09-27-2012 |
20120250266 | ELECTRONIC DEVICE WITH CONDUCTIVE RESILIENT SHEET - An electronic device includes a supporting member, a circuit board fixed to the supporting member, a bottom cover assembled with the supporting member, and at least one conductive resilient sheet fixed on the circuit board. The conductive resilient sheet includes a fixing portion fixed on the circuit board and a conductive portion. The conductive portion defines a first elastic sheet and a second elastic sheet. The bottom cover is fixed between the first elastic sheet resisting the outer side of the bottom cover and the second elastic sheet resisting the inner side of the bottom cover. | 10-04-2012 |
20120250267 | RADIO FREQUENCY COMMUNICATION MODULE - Disclosed herein is a radio frequency (RF) communication module. The RF communication module includes: a main substrate having a plurality of electronic components mounted on an upper surface thereof and having at least one ground pad formed at corners thereof; an insulating material encapsulating the electronic components mounted on the upper surface of the main substrate and having a metal layer formed on an upper surface thereof; and a side shielding layer formed on a side of the insulating material. | 10-04-2012 |
20120250268 | PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM THEREOF, AND PRINTED WIRING BOARD USING THEM - An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant. By using the photosensitive resin composition or a dry film thereof, a printed wiring board having a flame-retardant cured film, such as a solder resist, formed from the halogen-free composition can be provided while imposing little burden on the environment, the cured film being flame-retardant and reduced in warpage and having various excellent properties including bending characteristics, resistance to soldering heat, and resistance to gold plating. | 10-04-2012 |
20120257359 | Circuit Layout of Image Capturing Device - A circuit layout of an image capturing device comprises a circuit board, an image capturing circuit, a flashlight circuit and a groove. The circuit board is a multilayered structure. The image capturing circuit is built on the circuit board. The flashlight circuit is built on the circuit board. The groove is formed on the multilayered structure of the circuit board and divides the circuit board into two areas where the image capturing circuit and the flashlight circuit are respectively disposed. The image capturing circuit is located at a first area, and the flash circuit is located at a second area. Therefore, the groove can prevent the interference between the image capturing circuit and the flashlight circuit. | 10-11-2012 |
20120257360 | FIXING APPARATUS FOR ELECTRONIC DEVICE - A fixing apparatus includes a circuit board and a support member. A connector is installed on the circuit board. The support member includes a first connection portion to be electrically connected to an electronic device, and a second connection portion formed below the first connection portion and electrically connected to the first connection portion. The second connection portion is plugged into the connector of the circuit board, to elevate the electronic device. | 10-11-2012 |
20120257361 | DISPLAY DEVICE AND ELECTRONIC APPARATUS - Disclosed herein is a display device including: a display substrate having wires on a particular one of the surfaces of the display substrate, and having penetration holes each provided at a position exposed to the wire and penetrating the display substrate from the particular surface to the other display-substrate surface; and a wiring substrate provided on the side of the other surface of the display substrate and electrically connected to the wires through the penetration holes. | 10-11-2012 |
20120262885 | SIGNAL TRANSFER CIRCUIT - Provided is a signal transfer circuit which uses a low cost circuit board with a high packing density but is capable of reducing a crosstalk noise between signal lines and also reducing a reflection noise due to a stub. A signal transfer circuit of the present invention is configured such that lead terminals of electronic components and through-hole vias are connected to each other by surface wirings, respectively, to allow no branching from the middle of the through-hole vias. Further, first wirings connecting a first electronic component are each arranged between a corresponding pair of second wirings connecting a second electronic component, and signals are transmitted through the first wirings and the second wirings by interleaved transmission. | 10-18-2012 |
20120268903 | COVER FOR A FRAME FOR A DEVICE MOUNTED ABOVE A PRINTED CIRCUIT BOARD IN AN ELECTRONIC DEVICE - The disclosure describes a cover for a frame for mounting a device above a printed circuit board (PCB) in an electronic device. The cover comprises: a surface to cover a bottom of the display device and to be located on top of a frame section of a frame that is mounted on the PCB and surrounds a surface device on the PCB; a raised region in the surface to allow a part of the surface device to jut above the frame section; and a depressed region in the surface to receive a feature on a bottom of the display device to allow the feature to extend into an interior cavity bounded by the frame section. | 10-25-2012 |
20120275121 | Power Module with Press-Fit Clamps - According to an exemplary embodiment, a bondwireless power module residing on a top surface of a substrate includes at least one input power pad providing power to the module and at least one output current pad providing output current from the module. At least one press-fit input power clamp engages a top side of the at least one input power pad, and engages a bottom surface of the substrate. Also, at least one press-fit output current clamp engages a top side of the at least one output current pad, and engages the bottom surface of the substrate. The at least one press-fit input power clamp can include at least one top prong and at least one bottom prong. Furthermore, the at least one bottom prong can press the input power pad into the at least one top prong. | 11-01-2012 |
20120275122 | USING A COUPLING ORTHOGONALIZATION APPROACH TO REDUCE CROSS-TALK - An apparatus is provided. The apparatus generally comprises a plurality of pairs of differential transmission lines. The plurality of pairs of differential transmission lines includes a set of pairs of differential transmission lines with each pair of differential transmission lines from the set of pairs of differential transmission lines including at least one twist to alternate current direction. Also, the plurality of differential transmission lines are arranged such that alternating current directions substantially eliminate cross-talk across the plurality of pairs of differential transmission lines. | 11-01-2012 |
20120275123 | CERAMIC ANTENNA MODULE AND METHODS OF MANUFACTURE THEREOF - Circuit modules and methods of construction thereof that contain composite meta-material dielectric bodies that have high effective values of real permittivity but which minimize reflective losses, through the use of host dielectric (organic or ceramic), materials having relative permittivities substantially less than ceramic dielectric inclusions embedded therein. The composite meta-material bodies permit reductions in physical lengths of electrically conducting elements such as antenna element(s) without adversely impacting radiation efficiency. The meta-material structure may additionally provide frequency band filtering functions that would normally be provided by other components typically found in an RF front-end. | 11-01-2012 |
20120281369 | LEAD LINE STRUCTURE AND DISPLAY PANEL HAVING THE SAME - A lead line structure and a display panel having the same are provided. The display panel includes a pixel array, at least one driving device, first and second lead lines, and first and second insulating layers. The first lead lines are electrically connected to the pixel array and the driving device. The first insulating layer covers the first lead lines and has trenches. The second lead lines are electrically connected to the pixel array and the driving device, and located in the trenches of the first insulating layer. The first and second lead lines are alternately arranged. The second insulating layer covers the first insulating layer and the second lead lines. The height of the second insulating layer above the second lead lines is smaller than the height of the second insulating layer above the first lead lines. | 11-08-2012 |
20120281370 | CIRCUIT MODULE AND MANUFACTURING METHOD FOR THE SAME - A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules. | 11-08-2012 |
20120287586 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other. | 11-15-2012 |
20120293968 | RETAINER FOR ADJACENT-ORIENTED CARDS - Fasteners and fastening systems for holding an electronic card on a bulkhead are disclosed. An example of a fastener includes a pin on a first side of the bulkhead. The fastener also includes a bracket to hold a portion of the electronic card on the pin of the bulkhead. The fastener also includes a connector to hold the bracket on a second side of the bulkhead, the first side of the bulkhead substantially perpendicular to the second side of the bulkhead. | 11-22-2012 |
20120293969 | METHOD AND APPARATUS FOR PROVIDING A MECHANICAL MEANS TO SUPPORT CARD SLOTS CAPABLE OF ACCEPTING CARDS OF MULTIPLE FORM FACTORS - An embodiment of the invention may comprise a reconfigurable chassis with one or more first card slots capable of being populated with a first mechanical form factor card, one or more second card slots capable of being populated with the first mechanical form factor card or with a second mechanical form factor card, and a mechanical slot adaptor configured to occupy at least one second card slot, where the mechanical slot adaptor is configured to provide mechanical support for the second mechanical form factor card in the second card slot. | 11-22-2012 |
20120293970 | ELECTRONIC CARD MODULE INCLUDING FUNCTION OF STORING INFORMATION REGARDING FABRICATION/MAINTENANCE/DRIVING OF A PRODUCT - An electronic card module which includes the function of storing information regarding the fabrication/maintenance/driving of a product. The electronic card module has a main function circuit unit configured by mounting various electronic components on a PCB substrate. The electronic card module is formed with the PCB module in one piece and includes an information provision unit which stores information including product fabrication information, maintenance information, and driving information, and which provides the information when a request is made from an external device. | 11-22-2012 |
20120300415 | RELEASING APPARATUS FOR SIM CARD - A releasing apparatus for a subscriber identity module (SIM) card includes a bracket, a rack received in the bracket for manipulating the SIM card, a pivot pole pivotably received in the bracket, and a movable member pivotably attached to the bracket. The movable member includes a biasing portion and an engaging portion formed from opposite ends of the movable member. A tab and a biasing protrusion are formed from opposite ends of the pivoting member. The engaging portion is operated to rotate the movable member. The biasing portion presses the tab of the pivot pole to rotate the pivot pole. The biasing protrusion biases the rack and SIM card away from the bracket. | 11-29-2012 |
20120300416 | MULTILAYER SUBSTRATE - A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line. | 11-29-2012 |
20120300417 | Power Distribution Mounting Component and Inverter Apparatus Using Same - The present invention is a power distribution mounting component operable at high voltages. More specifically, the power distribution mounting component includes: an insulating layer; current-carrying first conductor layers sandwiching the insulating layer; and a second conductor layer (thinner than the first conductor layers) interposed between the insulating layer and at least one of the first conductor layers. Each the second conductor layer between the insulating layer and the overlying current-carrying first conductor layer is sufficiently thinner than the first conductor layer and is therefore formed in close adhesion to the insulating layer, thereby increasing the partial discharge inception voltage of the power distribution mounting component and therefore its insulation reliability. | 11-29-2012 |
20120300418 | SEMICONDUCTOR DEVICE - A semiconductor device that can suppress variation of GND potential of a control board and prevent malfunction of IC without restricting a mounting direction of the IC of the control board is provided. In a power module | 11-29-2012 |
20120314379 | WIRING DEVICE AND DISPLAY DEVICE - A wiring device includes a main conductive line, a plurality of branch conductive lines, a passivation layer, a plurality of contact holes, a plurality of conductive patterns, and a plurality of outside device bonding regions. The branch conductive lines are electrically connected to the main conductive line. The passivation layer is disposed on the branch conductive lines. Each the contact hole partially exposes one of the branch conductive lines. The conductive patterns are disposed on the passivation layer, and each of the conductive patterns is disposed respectively corresponding to each of the branch conductive lines. Each of the conductive patterns is electrically connected to the corresponding branch conductive line via the contact holes. Each of the outside device bonding regions is disposed corresponding to each of the branch conductive lines. At least one of the outside device bonding regions does not overlap the contact hole in a vertical projective direction. | 12-13-2012 |
20120314380 | INJECTION MOLDED CONTROL PANEL WITH IN-MOLDED DECORATED PLASTIC FILM THAT INCLUDES AN INTERNAL CONNECTOR - Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector. | 12-13-2012 |
20120314381 | ANTENNA DESIGNING METHOD AND DATA CARD SINGLE BOARD OF WIRELESS TERMINAL - An antenna designing method and a data card single board of a wireless terminal are provided. The antenna designing method provided by an embodiment of the present invention includes: dividing a semi-closed area without other metal wirings on a data card single board of the wireless terminal; and arranging an antenna wiring in the semi-closed area, where a gap exists between the antenna wiring and the data card single board, and the antenna wiring is coupled with the data card single board via the gap. The embodiments of the present invention also disclose a data card single board of the wireless terminal. According to the embodiments of the present invention, a Specific Absorption Rate (SAR) value of the antenna is reduced, and meanwhile, a working bandwidth of a broadband is realized. | 12-13-2012 |
20120320538 | SERIAL ADVANCED TECHNOLOGY ATTACHMENT DIMM - A serial advanced technology attachment (SATA) DIMM includes a board body. A control chip and a power circuit are set on the board body. An edge connector is set on a side of the board body and inserted into a memory slot of a motherboard. The edge connector includes a number of power pins, a number of ground pins, and a number of signal pins. The power pins are connected to the power circuit. The signal pins are connected to the control chip. | 12-20-2012 |
20120320539 | PACKAGE STRUCTURE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR REPAIRING PACKAGE STRUCTURE - A package structure including an electronic component | 12-20-2012 |
20120320540 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR - A printed circuit board of a card edge connector type includes interconnections formed on a surface of a substrate to be electrically coupled to respective connecting terminals formed by electrolytic plating on an edge of the substrate, and connecting terminal-forming wirings being respectively in connection with the interconnections, when the connecting terminals are formed by the electrolytic plating. The interconnections are electrically isolated from the connecting terminal-forming wirings by process openings formed in the substrate. | 12-20-2012 |
20120327612 | CARD CONNECTOR WITH A SERVOMECHANICAL DEVICE FOR REPOSITIONING AN EXPANSION CARD - A card connector having a housing with a receiving slot and connector pins are provided. An expansion card having docking well regions, contact pads, and backup contact pads is inserted in the receiving slot. The connector pins are connected to the docking well regions on the expansion card. The expansion card is coupled to a servomechanical device that can slide the expansion card to connect the connector pins with the contact pads. Connector pins and contact pads are coated with an interface material that is subject to wearing. Worn interface material can cause weak electrical connections between connector pins and contact pads. Thus, a card connector with a servomechanical device is provided to slide an expansion card within a receiving slot of the card connector for an improved electrical connection between connector pins and contact pads. | 12-27-2012 |
20120327613 | CONDUCTIVE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - The present disclosure discloses a conductive substrate with a conductive pattern formed on a float glass and a method for manufacturing the same, which can prevent a yellowing phenomenon from occurring in the float glass during firing of the conductive substrate. The method for manufacturing the conductive substrate according to the present disclosure includes manufacturing a float glass by injecting molten glass onto a molten tin contained in a float bath, removing a top face of the float glass not contacting the molten tin, by a predetermined thickness, and forming a conductive pattern on the top face of the float glass, which was removed by a predetermined thickness. | 12-27-2012 |
20130003320 | DRIVE ENCLOSURES FOR TOOL-LESS REMOVABLE MOUNTING OF SOLID STATE DRIVES ONTO PRINTED CIRCUIT BOARD DEVICES - Methods and systems for removably mounting a Solid State Drive (SSD) to a Printed Circuit Board (PCB) device without use of a tool. An exemplary system comprises a top portion and at least two flexible legs. Each leg comprises a vertical member attached to the top portion, and a tab for insertion into the PCB, the tab restricting the motion of the drive enclosure with respect to the PCB when inserted into the PCB, thereby allowing for removable attachment of the enclosure to the PCB without use of a tool. The drive enclosure itself is adapted to receive the SSD and adapted to align the SSD for physical coupling with a connector for the PCB. | 01-03-2013 |
20130003321 | NOISE SUPPRESSION STRUCTURE - Provided is a noise suppression structure having a current control unit that controls current, and which is provided on a ground layer. The current control unit comprises: a first metal surface provided on the ground layer with an interval therebetween, and having a first end part and a second end part on the opposite side to the first end part; a second metal surface provided on the first metal surface with an interval therebetween, and having a first end part and a second end part on the opposite side to the first end part; a first short-circuit board disposed on the first end part of the first metal surface, and which connects the first metal surface and the ground layer; and a second short circuit board disposed on the second end part of the second metal surface, and which connects the second metal surface and the first metal surface. A first open end is formed on the second end part of the first metal surface. A second open end is formed on the first end part of the second metal surface. | 01-03-2013 |
20130010432 | PRINTED BOARD ASSEMBLY INTERFACE STRUCTURES - Example printed board assembly (PBA) interfaces are described. In some examples, the disclosure relates to a printed board (PB) including a conductive layer, where the PB defines a first surface and a recess in the first surface, where a surface defining the recess is at least one of electrically or thermally connected to the conductive layer, and an electrical component body mounted on the PB. The electrical component body may be mounted on the PB such that a surface of the electrical component body extends over at least a portion of the recess, where the recess extends beyond the electrical component body such that the recess defines an aperture for introducing an interface material between the surface of the electrical component body and the surface of the recess. | 01-10-2013 |
20130010433 | Integrated Appliance - An integrated appliance is disclosed in the present disclosure. The integrated appliance comprises a backplate and a circuit board. The circuit board comprises a baseplate and an electronic component disposed on the baseplate. The baseplate is fixed to an inner wall of the backplate, and the electronic component is located between the baseplate and the backplate. With the aforesaid arrangement, an uneven surface structure of the backplate itself is utilized in the integrated appliance of the present disclosure to dispose the circuit board on the inner wall of the backplate in such a way that the electronic component on the circuit board is disposed facing towards an inner wall surface of the backplate. As this eliminates the use of the back cover, the structure is simplified and both the mold cost and the material cost associated with the back cover are saved, thus resulting in a reduced manufacturing cost. | 01-10-2013 |
20130010434 | NETWORK DEVICE AND COMMUNICATION MODULE - On a circuit board configured to transmit a signal, a pulse transformer is provided on a path used for transmitting the signal of the circuit board. A shield member is provided on the circuit board to prevent noise, which is generated due to noise current flowing in a noise line pattern, from entering the pulse transformer. The shield member covers a part of a surface of at least one pulse transformer, the part intersecting concentric circles (which represent a magnetic field generated by the noise current) whose central axis extends along the direction in which the noise current flows. | 01-10-2013 |
20130010435 | FRAME UNIT, MOUNTING SUBSTRATE UNIT, AND MANUFACTURING METHOD FOR THE SAME - Provided is a frame unit, a mounting substrate unit, and a mounting substrate that can achieve both high shield performance and reduction in the height of a shield member. The frame unit according to the present invention is a frame unit ( | 01-10-2013 |
20130021761 | EXPANSION CARD - An expansion card has at least one connector electrically coupled with at least one expansion slot of a server, and includes a shell defining at least one through slot, a main body, and a transmission element received in the shell. The transmission element includes a locating element, a connecting pole, and a fixing shaft. The connecting pole includes a head portion and a tail portion. The head portion defines a notch sleeving on the locating element. The tail portion extends outwards from the shell and defines a first hole. The fixing shaft is fixed on the shell and extends through the first hole. When the tail portion is pushed, the connecting pole rotates around the fixing shaft, the head portion drives the at least one connector to extends outwards or inwards from the at least one through slot, to electrically connected or disconnected to the at least one expansion slot. | 01-24-2013 |
20130027891 | MOUNTING APPARATUS FOR EXPANSION CARD - A mounting apparatus for expansion cards includes a cage of a chassis, a bracket secured to the cage, a positioning member, and a circuit board. The cage includes an installation plate. The installation plate is adapted to secure a first end of a first expansion card. The positioning member is removably mounted to the cage and includes a top wall. The top wall is adapted to secure a third end of a second expansion card with a height smaller than the first expansion card. The circuit board is secured to the bracket and is adapted to secure a second end of the first expansion card and a forth end of the second expansion card. A distance between the installation plate and the top wall is substantially equal to an altitude difference between the first expansion card and the second expansion card. | 01-31-2013 |
20130027892 | MOBILE TERMINAL - A mobile terminal includes a terminal body, a case defining an appearance of the terminal body, the case formed of a non-metal, and a metal frame formed of a metal, at least part of the metal frame extending through the case from inside to outside of the terminal body so as to be externally exposed, wherein the case and the metal frame are integrally formed with each other. Accordingly, a specific pattern can be realized at the appearance of the terminal body to arouse distinctive attraction to the appearance, thereby providing a terminal with such attractive appearance. | 01-31-2013 |
20130027893 | Electromagnetic Interference (EMI) Shields - Disclosed herein are exemplary embodiments of an EMI shielding apparatus. A frame of the apparatus has a sidewall and an inwardly extending lip defining at least one opening along an upper portion of the frame. A reusable cover is attachable to the frame for at least substantially covering opening(s) of the frame. A first border portion of the cover includes one or more sliding members. A second border portion of the cover includes one or more stops. The sliding member(s) and stop(s) are configured to abut, in generally opposed directions, one or more lip edges generally facing the opening(s) when the cover is attached to the frame. The shielding apparatus is operable for shielding the component(s) on the substrate that are within an interior cooperatively defined by the frame and the cover. | 01-31-2013 |
20130033825 | Plasma-Polymerized Polymer Coating - An electrical or electro-optical assembly comprising a substrate comprising an insulating material, at least one conductive track present on at least one surface of the substrate, at least one electrical or electro-optical component connected to at least one of the at least one conductive track, and a continuous coating comprising one or more plasma-polymerized polymers completely covering the at least one surface of the substrate, the at least one conductive track and the at least one electrical or electro-optical component. | 02-07-2013 |
20130033826 | ELECTRICAL COMPONENT - An electronic component includes a circuit element, a circuit board that is connected to the circuit element, and a connection terminal that is connected to the circuit board. The connection terminal includes a main body, a spring member that is formed so as to be elastically deformable in two directions including a direction of moving closer to the circuit board disposed on the main body and a direction of moving away from the circuit board, and a pair of arm portions that is extended from the main body so as to position the spring member therebetween. The pair of arm portions passes through the circuit board, ends of the respective arm portions far from the main body are bent toward the spring member, and the circuit board is held between the ends and the spring member. | 02-07-2013 |
20130039021 | DISPLAY DEVICE AND CUSHIONING MEMBER USABLE IN THE SAME - An object of the present invention is to provide a display device including a cushioning member which is unlikely to be shifted from a predetermined position and has a function of effectively preventing EMI and/or ESD. In a display device according to the present invention, a cushioning member ( | 02-14-2013 |
20130044441 | Device for Electric Insulation of a Conducting Plane - A device for insulating an electrically conducting plane having a first electric potential relatively to a second electric potential is provided. The device comprises an insulating substrate including two parallel planar surfaces, and a first conducting outer layer and an electrostatic field reducer. The electrostatic field reducer reduces the value of the electrostatic field in a point of the peripheral edge, the reducer includes at least one conducting area distinct from the first outer layer, positioned on the first surface of the insulating substrate and/or in the insulating substrate. The reducer reduces the value of the electrostatic field in this point relative to the value of the electrostatic field in this point in the absence of the conducting area. The conducting area has a potential with a value strictly comprised between the values of the first and second potentials. | 02-21-2013 |
20130050960 | PORTABLE ELECTRONIC DEVICE - A portable electronic device includes an integration unit and a main circuit. The integration unit includes a carrier and at least one electronic element disposed on the carrier. The electronic element includes an antenna unit, a button input unit or a sound transmission unit. The main circuit is electrically connected to the electronic element through a conducting wire. | 02-28-2013 |
20130058053 | POWER CONVERSION CIRCUIT AND CIRCUIT BOARD - An exemplary power conversion circuit is to convert a voltage from one voltage level to another. The circuit includes an input port, an output port, a main body circuit, a first solder bridge, and a second solder bridge. The input port of the power conversion circuit is an output port of one power conversion circuit previous in sequence to the power conversion circuit, the output port of the power conversion circuit is an input port of one power conversion circuit next in sequence to the power conversion circuit. The first solder bridge is arranged between the input port of the power conversion circuit and the main body circuit of the power conversion circuit. The second solder bridge is arranged between the output port of the power conversion circuit and the main body circuit of the power conversion circuit. | 03-07-2013 |
20130058054 | FIXING APPARATUS FOR EXPANSION CARD - An apparatus for fixing an expansion card includes a circuit board, a fixing device, and a latching device. The expansion card includes a protrusion formed on a first end of the expansion card, and a positioning hole defined adjacent to a second end of the expansion card away from the first end. The fixing device is mounted to the circuit board for supporting the first end of the expansion card, and defines a through hole for allowing the protrusion of the expansion card to extend through the through hole. The latching device is mounted to the circuit board for supporting the second end of the expansion card, and includes a post for engaging in the positioning hole of the expansion card, and a resilient hook for engaging with a top of the expansion card. | 03-07-2013 |
20130058055 | SUBSTRATE WITH BUILT-IN COMPONENT - A substrate with a built-in component is constructed such that a resin reliably goes around a clearance provided in a lower portion of the component and is thus filled in without expansion of a clearance in a height direction when various components such as an LW reversal type chip component are to be built in. The substrate includes a component to be embedded in a resin layer, and a land electrode (a component mounting electrode) to which external electrodes of the component are to be bonded, the land electrode being provided with a concave groove extending in a transverse direction through which an uncured resin of the resin layer flows, and the uncured resin of the resin layer flows through the concave groove and sufficiently goes around a lower side of the component so that the resin is well filled in when the component in a mounting state is to be embedded in the resin layer. | 03-07-2013 |
20130063904 | HANDHELD DEVICE - A handheld device includes a body, a back cover and a latch mechanism. The body has a back portion. The back cover coves the back portion. The latch mechanism is disposed between the body and the back portion to lock the back portion to the body. Reliving the lock connection between the body and the back cover performed by the latch mechanism causes the back cover is able to depart from the body. | 03-14-2013 |
20130063905 | CIRCUIT BOARD SENSOR AND METHOD FOR PRODUCING THE SAME - The invention relates to a circuit board sensor ( | 03-14-2013 |
20130070429 | INTEGRATED VOLTAGE DIVIDER - A semiconductor structure including a high-voltage transistor; voltage dropping circuitry, at least part of which is overlapping the high-voltage transistor; at least one intermediate contact point to the voltage dropping circuitry, connected to at least one intermediate position between a first and a second end of the voltage dropping circuitry; and at least one external connection connecting the at least one intermediate contact point to outside of the semiconductor structure. | 03-21-2013 |
20130070430 | DISPLAY DEVICE - A display device includes: circuit board | 03-21-2013 |
20130077264 | Sealed Overmolded Circuit Board With Sensor Seal and Edge Connector Seal and Production Method Of The Same - An electronic apparatus partially overmolded with a overmold sealing material that seals the circuit board, protects the electrical components on the circuit board and provides seals between the circuit board and mating devices is disclosed. The electronic apparatus may be an engine controller. The electrical components may be an electrical edge connector, a sensor, and a heat sink. The sensor may be a pressure sensor. The controller may be connected to a throttle body such that the overmold sealing material provides a first seal between the controller and the throttle body allowing the pressure sensor to be in fluid communication with the interior of the throttle body. A wire harness may be connected to the controller such that the overmold sealing material provides a second seal between the wire harness and the controller protecting the electrical connection. The overmold sealing material may also be translucent. | 03-28-2013 |
20130094157 | POWER CONVERTERS WITH INTEGRATED CAPACITORS - An apparatus having a power converter circuit having a first active layer having a first set of active devices disposed on a face thereof, a first passive layer having first set of passive devices disposed on a face thereof, and interconnection to enable the active devices disposed on the face of the first active layer to be interconnected with the non-active devices disposed on the face of the first passive layer, wherein the face on which the first set of active devices on the first active layer is disposed faces the face on which the first set of passive devices on the first passive layer is disposed. | 04-18-2013 |
20130094158 | CARD STRUCTURE, SOCKET STRUCTURE, AND ASSEMBLY STRUCTURE THEREOF - A card structure includes a first substrate, a second substrate, an intermediate unit, and a connector. The first substrate includes a base surface. The second substrate is disposed on the base surface of the first substrate and coupled to the first substrate. The connector is disposed on the base surface of the first substrate to juxtapose the second substrate via the intermediate unit and coupled to the first substrate. | 04-18-2013 |
20130107473 | ELECTRONIC DEVICE CAPABLE OF ADJUSTING ORIENTATION OF DISPLAY CONTENT IN RESPONSE TO ROTATION OF A SUPPORT | 05-02-2013 |
20130107474 | ELECTRONIC CONTROL UNIT | 05-02-2013 |
20130114217 | PRINTED CIRCUIT BOARD LAMINATE - A printed circuit board laminate is provided of a novel structure that is not only capable of enhancing a degree of freedom in design and achieving a further size reduction, but also capable of enhancing heat releasing performance in a space sandwiched in between two printed circuit boards. A lattice-like portion formed of a plurality of connection walls crossed with one another is provided to an insulating plate interposed between two printed circuit boards, and the connection walls are positioned with clearances from the two printed circuit boards, respectively, by a plurality of supporting ribs protruding from the connection walls toward at least one of the two printed circuit boards. | 05-09-2013 |
20130114218 | ELECTRONIC CIRCUIT, METHOD OF MANUFACTURING ELECTRONIC CIRCUIT, AND MOUNTING MEMBER - An electronic circuit includes: a semiconductor chip provided with a single-ended I/F including a pad on which single-ended signals are exchanged; and a mounting unit on which a differential transmission path transmitting a differential signal is formed, and on which the semiconductor chip is mounted so that the pad of the single-ended I/F is directly electrically connected to a conductor configuring the differential transmission path. | 05-09-2013 |
20130128469 | PORTABLE ELECTRONIC DEVICE - A portable electronic device is provided. The portable electronic device includes a body, an operation interface, a supporting element and an image capturing unit. A receiving recess is formed on the body. The operation interface is disposed on the body. The supporting element is rotated between a first orientation and a second orientation relative to the body, wherein when the supporting element is in the first orientation, the supporting element is in the receiving recess, and when the supporting element is in a second orientation, a supporting included angle is formed between the supporting element and the body, wherein the supporting included angle is greater than 0 degree. The image capturing unit is disposed in the supporting element. | 05-23-2013 |
20130128470 | Backlight Module, Backplane and LCD Device - The present invention discloses a backlight module, a backplane and an LCD device. The backlight module comprises a backplane, a PCB and locking pieces for fixing the PCB on the backplane; the backplane surface is provided with multiple through holes, and the locking pieces are selectively arranged in the through holes. In the present invention, because the backplane surface is provided with through holes for arranging hillocks, the hillocks are arranged in the through holes in random positions. Thus, the hillocks are arranged in the through holes in the corresponding positions in accordance with the PCB size, so that the backplane can be adapted for PCBs of different size, and its generality can be increased. In addition, hillocks and through holes of corresponding number can be arranged in accordance with the number of different components. Thus, the backplane has higher generality, and then the production cost and the processing cost of the backplane can be reduced. | 05-23-2013 |
20130128471 | Display Device Back Panel with Adjustable PCB Mounting Seat - The present invention provides a display device back panel with adjustable PCB mounting seat, which includes a hollow body and paired mounting seats. The mounting seats are arranged in a hollow portion of the body and have opposite ends extended to connect to the body. Each of the mounting seats includes a first bracket and a second bracket that are symmetrically arranged and a connection board connected between the first bracket and the second bracket. The first bracket has an end adjustably connected to the body and an opposite end adjustably connected to the connection board. The second bracket has an end adjustably connected to the body and an opposite end adjustably connected to the connection board. The first bracket has a first bent section that is bent downward, and the second bracket has a second bent section that is bent down. The pair of mounting seats forms a receiving space between the two first bent sections and the two second bent sections that receive a PCB supported and mounted thereon. The assembling is simple and through the adjustable connection formed between the first bracket, the second bracket, the body, and the connection board, it is suitable for mounting and fixing PCBs of various sizes. | 05-23-2013 |
20130128472 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - The present invention discloses a printed circuit board and a manufacturing method thereof. The manufacturing method of the printed circuit board includes: forming a first circuit pattern on a metal layer formed on one surface of a base substrate; forming a second circuit pattern after laminating a first insulating layer in which the first circuit pattern is embedded; sequentially laminating a second insulating layer and a preliminary third circuit pattern on the second circuit pattern; separating the base substrate and forming a hole in the separated substrate; and forming a third circuit pattern, a landless first fill-plating layer, and a second fill-plating layer by performing fill-plating on the entire surface of the substrate in which the hole is formed, forming an insulating film layer on the other surface of the substrate, and performing an etching process on one surface and the other surface of the substrate. | 05-23-2013 |
20130128473 | METHOD FOR PRODUCING CAPACITOR, CAPACITOR, WIRING BOARD, ELECTRONIC DEVICE, AND IC CARD - There is provided a method for producing a capacitor which is capable of producing a capacitor having a high withstand voltage and low leakage current,
| 05-23-2013 |
20130135829 | DISPLAY MODULE - A display module is disclosed which includes a display panel, a printed circuit board, a flexible printed circuit board interconnecting the display panel and the printed circuit board, and a reinforcing piece interconnecting the display panel and the printed circuit board for supporting the printed circuit board. The reinforcing piece prevents drooping or shifting of the printed circuit board relative to the display panel during assembly or transport, thereby preventing severed wires of the flexible printed circuit board. | 05-30-2013 |
20130141877 | FAN-OUT CIRCUIT AND ELECTRONIC DEVICE HAVING THE SAME - A fan-out circuit electrically connected to a driver and a plurality of signal lines is provided. The fan-out circuit includes a first fan-out trace including a first and a second conductive line, and a second fan-out trace including a third and a fourth conductive line. The second conductive line is connected between the first conductive line and one of the signal lines. The length of the second and fourth conductive lines are L | 06-06-2013 |
20130141878 | TRANSFORMER CONDUCTIVE STRUCTURE AND TRANSFORMER - The present application discloses a transformer conductive structure, which comprises a primary coiling, a printed circuit board and a secondary coiling unit comprising a plurality of conductive sheets; wherein each conductive sheet comprises an annular body and an output terminal arranged at the edge of the annular body and protruded to the outside; the annular bodies of the conductive sheets and the primary coiling are staggered arrangement together; and the output terminal of the conductive sheet directly clamps on the printed circuit board. The present application further discloses a transformer, which can effectively reduces the output path of the transformer, the AC and DC loss and the volume of the transformer device, so as to increase the power density and efficiency of power supply. | 06-06-2013 |
20130141879 | PRESSURE-SENSITIVE ADHESIVE LAYER FOR TRANSPARENT CONDUCTIVE FILM, TRANSPARENT CONDUCTIVE FILM WITH PRESSURE-SENSITIVE ADHESIVE LAYER, TRANSPARENT CONDUCTIVE LAMINATE, AND TOUCH PANEL - Provided is a pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, which has transparent as the pressure-sensitive adhesive layer for transparent conductive film and can prevent the patterned transparent conductive thin film from degrading the appearance of the conductive film. A pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, wherein the pressure-sensitive adhesive layer is made from an acrylic pressure-sensitive adhesive composition containing: 100 parts by weight of an acryl-based polymer obtained by polymerization of a monomer component including an alkyl(meth)acrylate; and 30 to 150 parts by weight of a styrene-based oligomer, the pressure-sensitive adhesive layer has a refractive index of 1.50 or more, the pressure-sensitive adhesive layer has a haze of 2% or less as measured at a thickness of 30 μm. | 06-06-2013 |
20130148314 | CIRCUIT BOARD FOR PERIPHERAL CIRCUITS OF HIGH-CAPACITY MODULES, AND A HIGH-CAPACITY MODULE INCLUDING A PERIPHERAL CIRCUIT USING THE CIRCUIT BOARD - A drive circuit is laminated via a high exothermic element disposed on a power circuit, and it is configured so that the average thermal expansion coefficient of the side of the power circuit of the drive circuit board may be larger than the average thermal expansion coefficient of the side opposite to the power circuit. Thereby, the drive circuit board will be curved in the same direction as the power circuit board when the power circuit board is curved due to heat generation from the high exothermic element accompanying the operation of the module. Thereby, in a high-capacity module, while attaining reduction in size and weight, reduction in serge, and reduction in a loss, poor junction between the high exothermic element of the power circuit and the drive circuit board can be suppressed and heat generating from the high exothermic element can be more effectively released. | 06-13-2013 |
20130155630 | Touch Sensor with Passive Electrical Components - In one embodiment, an apparatus includes a substrate, a touch sensor, and a passive electrical component. The touch sensor is disposed on the substrate. The passive electrical component is disposed on a surface of the substrate. The passive electrical component is formed at least in part of conductive material. | 06-20-2013 |
20130155631 | POWER GENERATING DEVICE AND POWER GENERATING MODULE USING SAME - The power generating device has a power generating section including a piezoelectric body; and a plurality of electrode pairs each constituted by a pair of electrodes placed on opposite sides of the piezoelectric body with regard to a thickness direction thereof to define a functional section therebetween, each of the functional sections is cooperated with the related electrode pair to define a power generating element. A plurality of the power generating elements includes a first and second power generating elements that give a polarization orientation opposite to each other in the thickness direction. The first and second power generating elements have the corresponding electrodes that are connected to each other by means of a wiring member on the same surface of the piezoelectric body with regard to the thickness direction thereof, such that all of the plurality of the power generating elements are connected in series. | 06-20-2013 |
20130163212 | CIRCUIT SUBSTRATE - A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and an active component that is provided on a surface of the laminate substrate and is connected with the filter chip, at least a part of the active component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate. | 06-27-2013 |
20130170151 | DISPLAY SUBSTRATE, MOTHER SUBSTRATE FOR MANUFACTURING THE SAME AND METHOD OF MANUFACTURING THE DISPLAY SUBSTRATE - A display substrate includes a circuit mounted part that has a driving IC mounted thereon. The circuit mounted part includes an input pad part connected to an input terminal of the driving IC and an output pad part connected to an output terminal of the driving IC. A flexible pad part connected to a terminal of a FPCB includes a driving pad part to receive a drive signal of the driving IC. A driving line part is connected to the driving pad part to be extended along a length direction of the circuit mounted part within the circuit mounted part. Connection lines are extended from the driving line part disposed within the circuit mounted part toward the output pad part. The connection lines are partially removed in a trimming area defined between the driving line and the output pad part. | 07-04-2013 |
20130170152 | PRINTED CIRCUIT AND PRINTED CIRCUIT OF TOUCH PANEL - A printed circuit includes a number of conductive wires. Each of the conductive wires includes a first conductive wire section, a second conductive wire section, and a first connection section. The first connection section includes a first end and a second end opposite to the first end, the first end of the first connection section is connected to the first conductive wire section, and the second end of the first connection section is connected to the second conductive wire section. An angle between the first conductive wire section and the first connection section can be in a range from about 90 degrees to about 180 degrees. | 07-04-2013 |
20130170153 | PRINTED CIRCUIT AND PRINTED CIRCUIT OF TOUCH PANEL - A printed circuit includes a number of conductive wires. The conductive wires include at least one first conductive wire section, at least one second conductive wire section, and at least one first connection section. An angle between the at least one first conductive wire section and the at least one first connection section is defined as angle α | 07-04-2013 |
20130170154 | PRINTED CIRCUIT BOARD HAVING EMBEDDED CAPACITOR AND METHOD OF MANUFACTURING THE SAME - Provided is a printed circuit board having an embedded capacitor including at least one sheet-shaped capacitor, an insulating material configured to cover the sheet-shaped capacitor, and a capacitor device mounted in the insulating material to be parallelly disposed at one side of the sheet-shaped capacitor, improving reliability of the substrate. | 07-04-2013 |
20130170155 | PRINTED WIRING BOARD, AND METHOD OF SUPPLYING POWER AND FORMING WIRING FOR PRINTED WIRING BOARD - Provided is a printed wiring board including a power source, a plurality of LSIs, and a planar power supply wiring for supplying power from the power source to the LSIs. A plurality of partial wiring patterns each forming a current path from the power source to the LSIs are provided by forming gaps in the power supply wiring. | 07-04-2013 |
20130176691 | MASKS FOR USE IN APPLYING PROTECTIVE COATINGS TO ELECTRONIC ASSEMBLIES, MASKED ELECTRONIC ASSEMBLIES AND ASSOCIATED METHODS - One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed. | 07-11-2013 |
20130176692 | METHOD FOR PRODUCING A CIRCUIT BOARD CONSISTING OF A PLURALITY OF CIRCUIT BOARD AREAS AND CIRCUIT BOARD - For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled. | 07-11-2013 |
20130182397 | Circuit Board Structure Used for Vehicle-Mounted Electronic Device - Provided is a highly reliable ceramic circuit board which can be manufactured at a low cost and is friendly to environment as a material from which lead is eliminated in forming the multilayered structure. | 07-18-2013 |
20130194759 | TOUCH SENSOR WITH INTEGRATED SIGNAL BUS EXTENSIONS - A touch sensor may be formed from a flexible substrate such as a sheet of polymer. The flexible substrate may have a main rectangular portion and a protruding portion. Capacitive touch sensor electrodes may be formed on the upper and lower surfaces of the flexible substrate. Signal lines may be coupled to the touch sensor electrodes. The ends of the signal lines may extend onto the protruding portion. Signal lines may be formed on upper and lower surfaces of the flexible substrate. The signal lines may be coupled to circuitry on a printed circuit using a connector that receives the end of the protruding portion. Ground structures on the protruding portion may be configured to overlap the signal lines or may be laterally interposed between upper surface signal lines and lower surface signal lines. | 08-01-2013 |
20130201633 | STRUCTURE OF SURVEILLANCE DEVICE - The present invention relates to a surveillance device, which includes a device body, a display module mounted to at least one side surface of the device body, and at least one light-emitting diode mounted to at least one side of the device body. The display module can be a liquid crystal display (LCD) or an LED display screen. With the above arrangement, the operation of light-emitting diode helps identifying the location where the device body is mounted and also helps identifying if the device body is in normal operation and further, the arrangement of the display module provides practical advantages of criminal deterrence, advertisement effect, status notification, and information transmission. | 08-08-2013 |
20130201634 | SINGLE-SCAN LINE-SCAN CRYSTALLIZATION USING SUPERIMPOSED SCANNING ELEMENTS - The disclosure relates to methods and systems for single-scan line-scan crystallization using superimposed scanning elements. In one aspect, the method includes generating a plurality of laser beam pulses from a pulsed laser source, wherein each laser beam pulse has a fluence selected to melt the thin film and, upon cooling, induce crystallization in the thin film; directing a first laser beam pulse onto a thin film using a first beam path; advancing the thin film at a constant first scan velocity in a first direction; and deflecting a second laser beam pulse from the first beam path to a second beam path using an optical scanning element such that the deflection results in the film experiencing a second scan velocity of the laser beam pulses relative to the thin film, wherein the second scan velocity is less than the first scan velocity. | 08-08-2013 |
20130201635 | FLUORINATED SILANE COATING COMPOSITIONS FOR THIN WAFER BONDING AND HANDLING - This invention is related to compositions that prepare substrate surfaces to enable temporary wafer bonding during microelectronics manufacturing, especially using a zonal bonding process. This invention, which comprises compositions made from fluorinated silanes blended in a polar solvent, can be used to form surface coatings or treatments having a high contact angle with water (>85°). The resulting silane solutions are stable at room temperature for longer than one month. | 08-08-2013 |
20130223021 | Method For Locating A Printed Circuit Board Within An Enclosure - An apparatus is provided comprising an enclosure for enclosing a printed circuit board (PCB). The PCB has a tab extending therefrom. The enclosure comprises first and second portions, one of which includes a recess arranged to receive the tab of the PCB. | 08-29-2013 |
20130235536 | ELECTRONIC CARD - An electronic card including a substrate and a display panel is provided. The substrate has a first surface, a second surface opposite to the first surface, a first side, a second side opposite to the first side, a third side and a fourth side opposite to the third side, wherein the first surface and the second surface are surrounded by the first side, the second side, the third side and the fourth side. The display panel is disposed on the first surface and is roughly near the first side, the third side and the fourth side. Therefore, a disposition area of the display panel is wider. | 09-12-2013 |
20130242510 | Photoimaging Method and Apparatus - There is herein described a method and apparatus for photoimaging. In particular, there is described a method and apparatus for photoimaging a substrate covered with a wet curable photopolymer, wherein the photoimaged substrate is used to form images such as electrical circuits. | 09-19-2013 |
20130242511 | WIRING BOARD, DISPLAY PANEL, AND ELECTRONIC APPARATUS - A wiring substrate of the present invention has, on a first dummy wiring disposing section ( | 09-19-2013 |
20130242512 | DISPLAY DEVICE PACKAGE AND PACKAGING PROCESS THEREOF - An display device package including a first substrate, an display device, a second substrate, a welding glue, and a first adhesive layer is provided. The display device is disposed on the first substrate. The second substrate is disposed above the first substrate and the display device. The welding glue is welded with the first substrate and the second substrate and surrounds the display device, wherein the welding glue has a continuous pattern. The first adhesive layer is adhered to the first substrate and the second substrate, wherein the first adhesive layer is disposed between the display device and the welding glue and surrounds the display device, and the material of the first adhesive layer and the material of the welding glue are different. | 09-19-2013 |
20130250526 | ELECTRONIC DEVICE WITH CABLE SECURING MECHANISM - An electronic device includes a front cover, a rear cover coupled to the front cover, a circuit board fixed to the front cover, a connector mounted on the circuit board, and a cable including a first end connected to the connector and an opposite, second end. The front cover defines a receiving groove. A bottom of the receiving groove defines a through opening and a restriction element protruding from the bottom of the receiving groove. A smallest distance between a sidewall of the receiving groove and the restriction element is smaller than a diameter of the cable. The second end of the cable passes through the through opening from an inner side of the front cover, and the cable is retainably received in a space between the sidewall and the restriction element. | 09-26-2013 |
20130250527 | ELECTRONIC DEVICE - An electronic device is provided wherein the characteristics thereof are prevented from deteriorating. The electronic device ( | 09-26-2013 |
20130250528 | CIRCUIT MODULE - A circuit module provided with an auxiliary substrate includes a structure in which electronic components are mounted on a circuit substrate arranged at a bottom, an insulating resin covering the electronic components is defined so as to be higher than the electronic components, and the auxiliary substrate is arranged on the insulating resin. As a result, there has been a problem in that the height of the circuit module is increased. The circuit module is defined such that at least one of the electronic components is in contact with the auxiliary substrate. | 09-26-2013 |
20130258610 | SEMICONDUCTOR CHIP DEVICE WITH VENTED LID - Various circuit board lids and methods and using the same are disclosed. In one aspect, an apparatus is provided that includes a lid adapted to cover a semiconductor chip mounted on a circuit board. The lid has a top plate, a first support leg and a second support leg opposite the first support leg adapted to support the lid. The first and second support legs and the top plate define a recess to accommodate the semiconductor chip. The recess has a first opening and a second opening. At least one of the first and second openings extends from the first support leg to the second support leg. | 10-03-2013 |
20130258611 | ELECTRONIC APPARATUS AND FIXING DEVICE THEREOF - The fixing device includes a main body, at least two sliding location elements and at least one location element. The main body includes a bolting structure for bolting with a component element. The sliding location elements are disposed on one side of the main body opposite the bolting structure. Each sliding location element includes a connecting portion connected to the main body and an extending portion connected to the connecting portion. The extending portion is substantially parallel to the main body. A spacing is kept between the main body and the extending portion for clamping and fixing a printed circuit board. The at least one location element is extended from the main body and is substantially parallel to the extending portion. The at least one location element is disposed between the sliding location elements and the bolting structure for fixing the printed circuit board. | 10-03-2013 |
20130258612 | DAUGHTER CIRCUIT BOARD FOR INTERFACE SIGNAL CONVERSION - A daughter circuit board of a brushless DC motor for interface signal conversion, having circuit units integrated on the daughter circuit and eight ports for communicating with a control system of a user terminal. The daughter circuit board is plugged into a motor controller for signal conversion so that the motor controller communicates with the control system of the user terminal. The eight ports include a signal input port of analog control, a signal port for activating a fan mode, signal ports of speed feedback, a reserved signal port, a port of COM, a port of DC power supply, and a R/T port. | 10-03-2013 |
20130258613 | TOUCH PANEL AND TOUCH DISPLAY PANEL - A touch panel includes a substrate, a transparent sensor electrode pattern, a patterned compensation electrode, a passivation layer, a transparent shielding electrode and at least one connection structure. The substrate has a surface and includes a sensor region and a peripheral region. The transparent sensor electrode pattern is disposed on the surface of the substrate and in the sensor region. The patterned compensation electrode is disposed on the surface of the substrate and in the peripheral region, and the patterned compensation electrode and the transparent sensor electrode pattern are electrically isolated. The passivation layer is disposed on the surface of the substrate, covers the transparent sensor electrode pattern, and at least partially exposes the patterned compensation electrode. The transparent shielding electrode is disposed on the passivation layer. The connection structure is electrically connected to the transparent shielding electrode and the patterned compensation electrode exposed by the passivation layer. | 10-03-2013 |
20130258614 | TOUCH PANEL, DISPLAY DEVICE INCLUDING THE TOUCH PANEL, AND METHOD OF MANUFACTURING THE TOUCH PANEL - A external connecting terminal ( | 10-03-2013 |
20130258615 | METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY HAVING A SHAPED BODY - The invention relates to a method for producing an electronic assembly ( | 10-03-2013 |
20130265726 | PRINTED CIRCUIT BOARD - Provided is a printed circuit board capable of increasing an inductance value of a power pattern and a ground pattern while keeping a low electric resistance value of the power pattern and the ground pattern. The printed circuit board includes a printed wiring board including: a power layer having a power pattern formed therein; and a ground layer having a ground pattern formed therein. On the printed wiring board, an LSI as a semiconductor device and an LSI as a power supply member are mounted. The ground pattern has a first ground region that overlaps the power pattern as viewed from the direction perpendicular to the surface of the printed wiring board. In the first ground region, at least one defect portion is formed. In the first ground region, the defect portion forms a region that is narrower than the power pattern. | 10-10-2013 |
20130265727 | MANY-UP WIRING SUBSTRATE, WIRING BOARD, AND ELECTRONIC DEVICE - A many-up wiring substrate includes an insulating base substrate in which a plurality of wiring board regions are arranged in at least one of a vertical direction and a horizontal direction; a hole disposed in one main surface of the insulating base substrate, and straddling adjacent wiring board regions of the plurality of wiring board regions or straddling the wiring board regions and a dummy region; a conductor disposed on an inner surface of the hole; and a through hole disposed so as to extend from the inner surface of the hole of the wiring board regions to the other main surface of the insulating base substrate. | 10-10-2013 |
20130271927 | Mainboard having a reverse current blocking arrangement - A mainboard is provided with a plurality of USB connectors; a switching circuit; a current limiting circuit electrically connected to the switching circuit; a power loop for supplying electrical power to the switching circuit, the current limiting circuit, and the USB connectors; and a control chip. The control chip is programmed to enable the switching circuit so that current is blocked flowing from at least one of the USB connectors to the switching circuit via the current limiting circuit when the mainboard is powering on. | 10-17-2013 |
20130271928 | CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME - A circuit module pertaining to an embodiment of the present invention has a board, multiple electronic components, a shield member, sealing layer, and cover layer. The board has a mounting surface that includes a first area and second area in which the multiple electronic components are mounted. The shield member is constituted by conductive material and placed between the first area and second area on the mounting surface. The sealing layer has on its top surface a groove having its bottom face including an upper end face of the shield member, is formed on the mounting surface, and is constituted by an insulator that covers the multiple electronic components. The cover layer is constituted by conductive material and has a first cover part that fills the groove as well as a second cover part that covers the first cover part and sealing layer. | 10-17-2013 |
20130271929 | THERMAL EXPANSION COMPENSATORS FOR CONTROLLING MICROELECTRONIC PACKAGE WARPAGE - The present description relates to the field of fabricating microelectronic packages, wherein a microelectronic device may be attached to a microelectronic substrate with a compensator to control package warpage. The warpage compensator may be a low coefficient of thermal expansion material, including but not limited to silicon or a ceramic material, which is positioned on a land-side of the microelectronic device to counteract the thermal expansion effects of the microelectronic device. | 10-17-2013 |
20130279125 | INJECTION MOLDED CONTROL PANEL WITH IN-MOLDED DECORATED PLASTIC FILM THAT INCLUDES AN INTERNAL CONNECTOR - Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector. | 10-24-2013 |
20130286604 | PHOTO CURABLE RESIN COMPOSITION, IMAGING DISPLAY DEVICE AND PRODUCTION METHOD THEREOF - A photocurable resin composition which hardly causes leakage and is easily formed into a desired shape and an image display device using this photocurable resin composition are provided. | 10-31-2013 |
20130294037 | CONDUCTIVE FILM AND DISPLAY APPARATUS PROVIDED WITH SAME - The present invention discloses a conductive film and a display apparatus provided with the conductive film. A conductive film is disposed on a display panel of a display apparatus, and has a base body, and a conductive section formed on one of the main surfaces of the base body. The conductive section has a mesh pattern composed of fine metal lines, and the fine metal lines have a tilt of 30-44° with respect to the alignment direction of pixels of the display apparatus. | 11-07-2013 |
20130294038 | ELECTRONIC DEVICE FOR RADIOFREQUENCY OR POWER APPLICATIONS AND PROCESS FOR MANUFACTURING SUCH A DEVICE - The invention relates to an electronic device for radio frequency or power applications, comprising a semiconductor layer supporting electronic components on a support substrate, wherein the support substrate comprises a base layer having a thermal conductivity of at least 30 W/m K and a superficial layer having a thickness of at least 5 μm, the superficial layer having an electrical resistivity of at least 3000 Ohm·cm and a thermal conductivity of at least 30 W/m K. The invention also relates to two processes for manufacturing such a device. | 11-07-2013 |
20130301227 | CIRCUIT MODULE AND METHOD OF MANUFACTURING SAME - A circuit module having satisfactory isolation characteristics and a method of manufacturing the same are such that electronic components are mounted on a principal surface of a circuit substrate. An insulating layer covers the principal surface of the circuit substrate and the electronic components. A groove is disposed in a principal surface of the insulating layer. A shielding layer covers the principal surface of the insulating layer and the inner surface of the groove. | 11-14-2013 |
20130301228 | PACKAGING STRUCTURE - The present invention relates a packaging structure including: a carrier board and a cementing layer on the surface of the carrier board; chips and passive devices having functional side thereof attached to the cementing layer; and a sealing material layer for packaging and curing, the sealing material being formed on the carrier board on the side attached to the chips and the passive devices. The present invention integrates chips and passive devices and then packages the chips and the passive devices together, and is therefore a packaged product having not single-chip functionality but integrated-system functionality. The present invention is highly integrated, reduces interfering factors such as system-internal electric resistance and inductance, and accommodates growing demand for lighter, thinner, shorter, and smaller semiconductor packaging. | 11-14-2013 |
20130322029 | MULTILAYER ELECTRONIC STRUCTURE WITH INTEGRAL FARADAY SHIELDING - A multilayer electronic support structure including at least one metallic component encapsulated in a dielectric material, and comprising at least one faraday barrier to shield the at least one metallic component from interference from external electromagnetic fields and to prevent electromagnetic emission from the metallic component. | 12-05-2013 |
20130322030 | PRINTED CIRCUIT BOARD - A printed circuit board includes a power supply, a plurality of loads, a copper sheet, and a plurality of metal sheets mounted onto the copper sheet. The copper sheet is electronically connected between the power supply and the loads. The power supply outputs a plurality of currents to the loads via a plurality of current traces passing through the copper sheet, the plurality of metal sheets are located along the plurality of current traces. | 12-05-2013 |
20130329380 | Method and System for Reducing Self-Interference in a Handheld Communication Device - A method and a system for a handheld communication device is provided. The method includes: a testing a printed circuit board PCB assembly; identifying an emission point in the PCB; allocating a frequency radio (RF) absorber over or close to the emission point where the emission point is a potential source of electromagnetic interference (EMI) other than electronic components mounted on the PCB. The system includes a PCB assembly; and an RF absorber planar plate secured over or close to the emission point, for reducing the EMI from the emission point. A handheld communication device includes an antenna system and the PCB assembly with the RF absorber for isolating the antenna system from self-interference in the device. | 12-12-2013 |
20130329381 | ELECTROMAGNETIC SHIELDING CASE AND ELECTRONIC DEVICE HAVING THE SAME - An electromagnetic shielding case and an electronic device having the same are introduced. The electronic device includes a PCB, which has at least one electronic component mounted thereon and is provided around the electronic component with multiple positioning holes. The electromagnetic shielding case includes a casing body internally defining a shielding space and multiple fixing pins formed on lower edges of the casing body corresponding to the positioning holes on the PCB. Each fixing pin includes a neck portion and an end portion with an angle included therebetween. After the fixing pins are correspondingly extended through the positioning holes, the end portions can be deflected by an angle to thereby hold the casing body to the PCB with the electronic component located in the shielding space and shielded against EMI. With these arrangements, the electromagnetic shielding case can be quickly mounted to and dismounted from the PCB. | 12-12-2013 |
20130335927 | PLANAR TRANSFORMER ASSEMBLIES FOR IMPLANTABLE CARDIOVERTER DEFIBRILLATORS - A planar transformer assembly, for use in charging capacitors of an ICD, includes windings arranged to minimize voltage across intervening dielectric layers. Each secondary winding of a preferred plurality of secondary windings is arranged relative to a primary winding, in a hierarchical fashion, such that the DC voltage, with respect to ground, of a first secondary winding, of the plurality of secondary windings, is lower than that of a second secondary winding, with respect to ground, wherein the first secondary winding is in closest proximity to the primary winding. The primary winding and each secondary winding are preferably formed on a corresponding plurality of dielectric layers. | 12-19-2013 |
20130335928 | CARRIER AND METHOD FOR FABRICATING CORELESS PACKAGING SUBSTRATE - A fabrication method of a coreless packaging substrate is provided, including the steps of: forming an inner built-up circuit board on a carrier; removing the carrier; and symmetrically forming a first outer built-up structure and a second outer built-up structure on top and bottom surfaces of the inner built-up circuit board, respectively. The present invention effectively increases the product yield, saves the fabrication cost, and reduces wastes. | 12-19-2013 |
20130343008 | CIRCUIT BOARD SYSTEM WITH MECHANICAL PROTECTION - A circuit board system including mechanical protection of electrical components includes a circuit board ( | 12-26-2013 |
20130343009 | DEFLECTING DEVICE FOR ELECTROMAGNETIC RADIATION - An apparatus includes active layers, and a first high resistive layer disposed between the active layers. The apparatus further includes second and third high resistive layers disposed on respective surfaces of the active layers, the second and third high resistive layers including first and second strip conductors, respectively, the first strip conductors being connected at an end by a first connecting conductor, the second strip conductors being connected at an end by a second connecting conductor, and the first connecting conductor being disposed perpendicularly to the second connecting conductor. The apparatus further includes first contact pads disposed on respective ends of the first connecting conductor, and second contact pads disposed on respective ends of the second connecting conductor. The apparatus further includes matching layers disposed on respective surfaces of the second and third high resistive layers. | 12-26-2013 |
20130343010 | CONDUCTIVE SUBSTRATE AND ELECTRONIC DEVICE COMPRISING SAME - Disclosed are an electric conducting substrate, comprising a transparent substrate and an electric conducting pattern comprising an electric conducting line provided on the transparent substrate, and an electronic device comprising the same. | 12-26-2013 |
20140003004 | METHOD FOR PRODUCING BASE SUBSTRATE, METHOD FOR PRODUCING ELECTRONIC DEVICE, BASE SUBSTRATE, AND ELECTRONIC APPARATUS | 01-02-2014 |
20140003005 | ELECTRONIC DISPLAYS AND METAL MICROPATTERNED SUBSTRATES HAVING A GRAPHIC | 01-02-2014 |
20140016279 | TOUCH PANEL AND FABRICATION METHOD THEREOF - The present invention relates to touch panel and a fabrication method thereof. The method for forming touch panel disclosed in the present invention includes: forming a first pattern on a surface of a first substrate having a conductive material; forming a second pattern on a surface of a second substrate; aligning and laminating the first substrate having the first pattern and the second substrate; and cutting the laminated first substrate and second substrate into a plurality of touch panels. The present invention may resolve problems such as the high probability of substrate cracking and the high complexity of alignment of existing method for fabricating touch panel. A simple fabrication procedure may be used to perform alignment, to lamination and cutting, and the yield may be further improved. | 01-16-2014 |
20140016280 | SERIALLY ARRANGED PRINTED CIRCUIT BOARD - The present general inventive concept provides a serially arranged printed circuit board including a printed circuit board body and a connector connected to the printed circuit board body configured to exchange a signal with an external device. The printed circuit board body includes a plurality of semiconductor device areas, on which a plurality of semiconductor devices is formed, and a dummy area including a plurality of conductive patterns electrically connecting the connector with the plurality of semiconductor device areas, respectively. Each of the plurality of conductive patterns is formed in two or more multiple layers. | 01-16-2014 |
20140016281 | PROCESS TUNABLE RESISTOR WITH USER SELECTABLE VALUES - A process tunable resistor is fabricated by adjusting elements of the resistor during a fabrication process. The elements include legs, turns, and elements such as a parallel sub-legs, that are adjusted in the fabrication process to provide a specific user defined resistance value. The process tunable resistor provides for fixed contact points in order to support pre-existing or define circuit designs. | 01-16-2014 |
20140016282 | DECOUPLING METHOD, APPRATUS FOR DESIGNING POWER FEEDING LINE, AND CIRCUIT BOARD - A method includes: with a setting frequency set as an operating frequency of an LSI, selecting a capacitor having a lowest resonant impedance and a resonant frequency close to the setting frequency with reference to a capacitor characteristic database and installing one or more capacitors, each being the selected capacitor, as high frequency decoupling capacitors, the number thereof corresponding to a value obtained by dividing the upper limit of the power feeding line impedance by a resonant impedance of the capacitor. | 01-16-2014 |
20140016283 | GROUNDED LID FOR MICRO-ELECTRONIC ASSEMBLIES - An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface. | 01-16-2014 |
20140022742 | COMPACT LOW LOSS TRANSITION WITH AN INTEGRATED COUPLER - A compact transition structure includes a printed circuit board, wherein there is a rectangular region on one side of the printed circuit board and the rectangular region has a pair of long edges and a pair of short edges; a transition probe on the one side of the printed circuit board, wherein the transition probe extends into the rectangular region through a long edge of the rectangular region and has a terminal near a center of the rectangular region; and a coupler probe on the one side the printed circuit board, wherein the coupler probe extends into the rectangular region through a short edge of the rectangular region and has a terminal before the center of the rectangular region such that the coupler probe is electrically insulated from the transition probe. | 01-23-2014 |
20140022743 | TOUCH-SENSING SUBSTRATE, DISPLAY PANEL, AND PATTERNED LIGHT-SHIELDING LAYER - A touch-sensing substrate including a substrate, a patterned conductive layer and a patterned insulating layer is provided. The substrate has a plurality of first striped regions and a plurality of second striped regions. The first striped regions are intersected with the second striped regions to define a plurality of sensing-pad disposition regions. The patterned conductive layer includes a plurality of sensing pads disposed in the sensing-pad disposition regions. The patterned insulating layer is disposed on the first striped regions and the second striped regions. The patterned insulating layer and the patterned conductive layer are spliced to form a patterned light-shielding layer. The patterned light-shielding layer has a plurality of enclosed notches arranged in array, wherein parts of the enclosed notches are surrounded by the patterned conductive layer, and other parts of the enclosed notches are surrounded by the patterned conductive layer and the patterned insulating layer. | 01-23-2014 |
20140036455 | SYSTEM AND METHOD FOR ADDITIVE MANUFACTURING OF AN OBJECT - A method of additive manufacturing of a three-dimensional object is disclosed. The method comprises sequentially forming a plurality of layers each patterned according to the shape of a cross section of the object. In some embodiments, the formation of at least one of the layers comprises performing a raster scan to dispense at least a first building material composition, and a vector scan to dispense at least a second building material composition. The vector scan is optionally along a path selected to form at least one structure selected from the group consisting of (i) an elongated structure, (ii) a boundary structure at least partially surrounding an area filled with the first building material, and (iii) an inter-layer connecting structure. | 02-06-2014 |
20140043775 | Compliable Units and Compliable Network Having the Same - A compliable unit in an compliable network comprises a first layer including at least one device component at a first region of the first layer, and a second layer including at least one compliable element at a first region of the second layer to transfer the at least one device component to a desired location. The first layer and the second layer are arranged in a stack. | 02-13-2014 |
20140049923 | THIN FILM DISPOSITION - A method of preparing a surface for deposition of a thin film thereon, wherein the surface including a plurality of protrusions extending therefrom and having shadowed regions, includes locally treating at least one of the protrusions. | 02-20-2014 |
20140055961 | Printed Circuit Boards with Recesses - Printed circuit boards are provided with recess-mounted components. The components may be mounted within recesses in the surface of a printed circuit board substrate that are larger than the component. A solder stencil may be used to mount the components in a recess. The solder stencil may have curved portions between a planar portion and a depressed portion. The difference in the lateral width of the recess and the lateral width of the component may be configured to allow the planar portion and the depressed portion to be placed against the surface of the printed circuit board without damaging edges of the recess during solder application processes. The recess may be formed by placing a dummy component having a size and shape that is larger than the size and shape of the recess-mounted component against a portion of the printed circuit board during board formation operations. | 02-27-2014 |
20140055962 | MOBILE TERMINAL AND METHOD OF FABRICATING CASE THEREOF - A mobile terminal having a case defining an external appearance thereof, and a method of manufacturing such a case, are provided. The case may include a base formed of a resin material and having a recessed portion, a sheet disposed within the recessed portion and formed of a material that is different from that of the base, the material of the sheet having greater rigidity than that of the base, and a reinforcing member filled between the base and the sheet to integrally couple the base and the sheet. The rigidity of the material of the reinforcing member may have an intermediate value between the rigidity of the base and the rigidity of the sheet. | 02-27-2014 |
20140063755 | TERMINAL INCLUDING TOUCH UNIT AND METHOD FOR MANUFACTURING TOUCH UNIT - A terminal includes: a touch unit that includes first electrodes connected in a first diagonal direction, the first diagonal direction being oblique to each side of the touch unit, and a second electrodes disposed in the second diagonal direction which intersects the first diagonal direction, the second diagonal direction being oblique to each side of the touch unit, and a Printed Circuit Board (PCB) configured to receive information generated in response to electric signals from one or more of the first electrodes and the second electrodes. Accordingly, a width of the terminal may be reduced as signal wirings need not be formed at the side surface thereof. | 03-06-2014 |
20140071634 | Electronic Device Subassemblies - An electronic device may include subassemblies such as battery structures, electromagnetic shielding structures, and button structures. The electromagnetic shielding structures may include a conductive fence and a flexible shielding layer that covers electronic components. The electromagnetic shielding structure may be formed with a recess that receives a protruding portion of a battery. The recess may be formed from a multi-level shielding structure that includes rigid and flexible portions. The button structures may be mounted to a ledge that is formed as an integral part of a device housing. An electronic device battery may be enclosed in a protective battery sleeve. The battery sleeve may include a center portion that encloses the battery and peripheral portions that are folded and coupled to the center portion by adhesive material interposed between opposing surfaces of the folded peripheral portions and the center portion of the battery sleeve. | 03-13-2014 |
20140071635 | SYSTEMS AND METHODS FOR SHIELDING CIRCUITRY FROM INTERFERENCE WITH A SHIELD ASSEMBLY HAVING A REMOVABLE TAB - This is directed to systems and methods for shielding circuitry from interference with a shield assembly. In some embodiments, a shield assembly may include a shield fence having a fence body, at least one fence finger extending from the bottom of the fence body for coupling to a circuit board, and a tab extending from the fence body. The tab is configured to be removed from the shield fence after the shield fence is coupled to the circuit board. | 03-13-2014 |
20140071636 | Magnetic Core Inductor Integrated with Multilevel Wiring Network - An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive winding. The conductive winding turns around in generally spiral manner on the outside of the planar magnetic core. The conductive winding is piecewise constructed of wire segments and of VIAs. The wire segments pertain to at least two wiring planes and the VIAs are interconnecting the at least two wiring planes. Methods for such integration, and for fabricating laminated planar magnetic cores are also presented. | 03-13-2014 |
20140071637 | TOUCH PANEL AND TOUCH DISPLAY DEVICE - A touch panel includes a first substrate and a first composite material conductive layer. The first composite material conductive layer has a first multilayer structure. The first multilayer structure includes a first refraction index compensating layer, a second refraction index compensating layer, and a first metal conductive layer. The first refraction index compensating layer, the first metal conductive layer, and the second compensation layer are stacked on the first substrate, and an equivalent refraction index of the first composite material conductive layer is substantially between a refraction index of the first substrate and 1.1 times the refraction index of the first substrate. | 03-13-2014 |
20140078688 | SWITCH CIRCUIT FOR SERIAL ADVANCED TECHNOLOGY ATTACHMENT CONNECTOR - A switch circuit is connected to a serial advanced technology attachment (SATA) connector on a motherboard. The switch circuit includes a switch unit. The switch unit connects a last pin of the SATA connector to either a power supply on the motherboard or a ground pin of the motherboard. | 03-20-2014 |
20140078689 | CARD KEY FOR VEHICLE AND MAKING METHOD OF THE SAME - Provided are a vehicle card key and a method of manufacturing the same. The vehicle card key is used to lock/unlock a vehicle door or start an engine in wireless communication with a vehicle. The vehicle card key includes a lower cover, a circuit board stacked on and coupled to a top of the lower cover, and an upper cover coupled to the lower cover as one body to cover an upper side of the circuit board. The lower cover and the upper cover are formed of a thermo-hardening resin. | 03-20-2014 |
20140085835 | DC Link Capacitor Bank - A capacitor bank comprising at least two series chains each comprising a plurality of capacitors, wherein the series chains are coupled in parallel at corresponding points; and a fusible link arranged to form at least part of each coupling; wherein the corresponding points of each chain that are coupled to one another are at the same voltage when the capacitor bank is operational. | 03-27-2014 |
20140092565 | OPTICAL MODULE WITH AN ELECTRONIC CONNECTOR ALIGNED WITH A SUBSTRATE AND A METHOD TO ASSEMBLE THE SAME - An optical module having a substrate and an electrical connector whose terminals are precisely aligned with pads on the substrate is disclosed. The electrical connector provides upper and lower terminals, while, the substrate provides upper and lower pads each having a V-shaped cut opened for a direction along which the upper and lower terminals are slide. As the electrical connector is assembled with the substrate, the terminals slide along the edge of the V-shaped cut and slide onto the pads at the bottom of the V-shaped cut, which automatically and precisely aligns the terminals with the pads. | 04-03-2014 |
20140098500 | SHIELD FRAME, SHIELD FRAME MOUNTING STRUCTURE, AND ELECTRONIC PORTABLE DEVICE - A shield frame includes a side plate part that extends so as to be arranged vertically from a circuit board, on which electronic components are mounted, and to surround lateral sides of the electronic components. The side plate part has a base end part that faces the circuit board, and the base end part has a flangeless structure and functions as an end part fixed to the circuit board by soldering. Preferably, the shield frame is made of metal and is formed by a drawing process. | 04-10-2014 |
20140111951 | HIGH PERFORMANCE VERTICAL INTERCONNECTION - Representative implementations of devices and techniques provide improved electrical performance of components, such as chip dice, for example, disposed on different layers of a multi-layer printed circuit board (PCB). In an example, the components may be embedded within layers of the PCB. An insulating layer located between two component layers or sets of layers includes a conductive portion that may be strategically located to provide electrical connectivity between the components. The conductive portion may also be arranged to improve thermal conductivity between points of the PCB. | 04-24-2014 |
20140111952 | MOSFET STACK PACKAGE - Embodiments of the invention provide methods and configuration for packaging multiple semiconductor ships in a semiconductor package. In one embodiment, an integrated circuit system includes a printed circuit board, a first MOSFET device disposed on a first surface of the printed circuit board, and a second MOSFET device disposed on a second surface of the printed circuit board, wherein the first MOSFET device overlaps an edge of the second MOSFET device in a direction extending through the printed circuit board. | 04-24-2014 |
20140118962 | Current Redistribution in a Printed Circuit Board - In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer. The power plane layer does not distribute current evenly. Instead, the power plane layer includes multiple patterns with different resistances. The patterns may include a hatching pattern, a grid pattern, a directional pattern, a slot, a void, or a continuous pattern. The pattern is a predetermined spatial variation such that current flows in a first area differently than current flows in a second area. | 05-01-2014 |
20140118963 | Shielded System - A shielded system for reducing energy dissipation from an RF component into a semiconductor substrate, the shielded system comprising: a semiconductor substrate; an RF component in connection with the semiconductor substrate; an electrically connected shielding structure having a galvanic connection to ground or the semiconductor substrate, the electrically connected shielding structure being electrically connected to the RF component; and an electrically isolated shielding structure having no galvanic connection to ground, the semiconductor substrate or the RF component. | 05-01-2014 |
20140118964 | METHOD FOR PRODUCING PRINTED WIRING BOARD - A method for producing a printed wiring board which is capable of forming an insulating layer having a surface with low roughness and high adhesion strength to a conductive layer and of achieving an excellent performance in removal of smear, involves the following steps (A) to (F) in this order: (A) laminating, onto an internal layer circuit substrate, a resin sheet with a support which includes a support and a resin composition layer in contact with the support so that the resin composition layer is in contact with the internal layer circuit substrate; (B) thermally curing the resin composition layer of the resin sheet with a support to form an insulating layer; (C) perforating the insulating layer to form a via hole; (D) performing a desmear treatment; (E) peeling the support; and (F) forming a conductive layer on a surface of the insulating layer. | 05-01-2014 |
20140118965 | LOW PROFILE INDUCTORS FOR HIGH DENSITY CIRCUIT BOARDS - An inductor includes a core formed of a magnetic material and a foil winding wound at least partially around or through at least a portion of the core. A first end of the winding extends away from the core to form an extended output tongue configured and arranged to supplement or serve as a substitute for a printed circuit board foil trace. A second end of the winding forms a solder tab. At least a portion of the extended output tongue and the solder tab are formed at a same height relative to a bottom surface of the core. Another inductor includes a core formed of a magnetic material, a winding wound at least partially around or through at least a portion of the core, and a ground return conductor attached to the core. The core does not form a magnetic path loop around the ground return conductor. | 05-01-2014 |
20140126161 | ELECTRONIC PACAKGE MODULE AND METHOD OF MANUFACTURING THE SAME - An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic component, and at least one molding compound. The first and second electronic components are mounted on the supporting surface. The molding compound is disposed on the supporting surface and covers the supporting surface partially. The molding compound encapsulates the first electronic component yet not the second electronic component. | 05-08-2014 |
20140126162 | SUBSTRATE INDUCTIVE DEVICE METHODS AND APPARATUS - An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures by incorporating surface mountable chip chokes in the underlying circuit design, These conditions that result in undesirable CAF include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed. | 05-08-2014 |
20140133107 | THIN FILM TYPE CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a thin film type chip device, including: a plurality of unit circuit structures laminated on a substrate; and an adhesive layer adhering the unit circuit structures to each other. | 05-15-2014 |
20140133108 | DIFFERENTIAL TRANSMISSION CIRCUIT, OPTICAL MODULE, AND INFORMATION PROCESSING SYSTEM - A differential transmission circuit includes a pair of transmission line conductors and a ground conductor layer, wherein the pair of transmission line conductors include a first straight line region where both the pair of transmission line conductors extend in parallel to each other in a first direction with a first width in a first layer, a first cross region where one of the pair of transmission line conductors is formed in the first layer, the other thereof is formed in a second layer, and the pair of transmission line conductors cross the each other in a three-dimensional manner, the first cross region being disposed on the front side of the first straight line region, and wherein each of the widths of the pair of transmission line conductors in the first cross region is smaller than the first width. | 05-15-2014 |
20140140015 | SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME - In an aspect, a substrate for a display device that includes a plastic substrate and a planarization layer is provided. | 05-22-2014 |
20140140016 | POWER METAL MESH AND SEMICONDUCTOR MEMORY DEVICE AND METHOD INCLUDING THE SAME - A power metal mesh and a semiconductor memory device including the same are provided. As the power metal mesh configured to reduce noise coupling generated between adjacent chips disposed on an interposer, a band stop filter unit including an inductor and a capacitor coupled in parallel is disposed between the adjacent chips to effectively reduce the noise coupling of a specific frequency band generated between the adjacent chips. | 05-22-2014 |
20140140017 | ELECTRONIC DEVICE WITH CARD BRACKET - An electronic device includes a circuit board and a card bracket. The card bracket includes a base panel and a pair of latching pieces extending from opposite sides of the base panel. Each of the pair of latching pieces includes a resilient arm extending perpendicularly from the base panel and a latching flange extending from the resilient arm at an angle that is slightly less than 90 degrees. The latching piece includes a curling edge. A circuit board includes a pair of mounting holes corresponding to the pair of latching flanges. The resilient arm is deformable and movable between a first position and a second position. In the first position, the latching flange is removable from a corresponding one pair of mounting holes. In the second position, the curling edge abuts against the circuit board for preventing the card bracket from detaching from the circuit board. | 05-22-2014 |
20140146489 | SURFACE FINISH FOR CONDUCTIVE FEATURES ON SUBSTRATES - An electronic substrate includes a non-conductive body and one or more conductive features coupled to the non-conductive body. Each of the conductive features includes a base layer. To preserve the performance and conductivity of the one or more conductive features, each of the conductive features includes a protective layer formed over the base layer. The protective layer may include a first layer of silver formed over the base layer and a second layer of palladium formed over the first layer. By depositing the protective layer over the base layer of each of the conductive features, oxidation and exposure of the conductive features is prevented, or at least substantially reduced, since the first layer and the second layer provide a migration barrier for the metal in the base layer. However, the performance and conductivity of the conductive features are maintained due to the low resistivity of silver and palladium. | 05-29-2014 |
20140146490 | LAMINATED STRUCTURE, METHOD OF MANUFACTURING LAMINATED STRUCTURE, AND ELECTRONIC APPARATUS - A laminated structure includes a first substrate, an adhesive, a graphene, and a second substrate. The adhesive is provided on a principal surface of the first substrate, and the adhesive has a storage elastic modulus of 7.2*104 Pa or more and 6.1*105 Pa or less at 23° C. The graphene is bonded to the adhesive, and the graphene has one or a plurality of layers. The second substrate is bonded to the graphene. | 05-29-2014 |
20140153199 | MOUNTING APPARATUS FOR CONVERSION CARD - A mounting apparatus for fixing a conversion card to a motherboard of a chassis includes a main body and an assistant member. The assistant member includes a top board, and a side board to which the conversion card is fixed. The assistant member includes a handle mounted to the top board and adjacent to the conversion card. The handle is operated to move the mounting apparatus together with the conversion card away from the motherboard. | 06-05-2014 |
20140153200 | PRINTED CIRCUIT BOARD - A printed circuit board includes a ground layer, a metal board, a via, and a power layer. The metal board is arranged between the ground layer and the power layer. The via is electrically connected between the metal board and the power layer. The power layer is made of a number of wires. | 06-05-2014 |
20140153201 | LOW PROFILE MEMORY MODULE - An electronic component module according to an embodiment of the present invention includes a printed circuit board including a low-profile plug and at least one memory component thereon, and a connector for connecting the printed circuit board to a motherboard, the connector being mateable with the plug on the printed circuit board and having a z-height of no more than about 1.5 mm. The low-profile plug includes one hundred seventy pins and the number of pins allocated for VSS is no more than twenty-two and the number of pins allocated for VDD is no more than sixteen. Further, the low-profile plug includes an insulative portion protruding from a surface of the printed circuit board and having a “ | 06-05-2014 |
20140160693 | SEMICONDUCTOR MODULE - A semiconductor module includes a circuit substrate, a first semiconductor device substrate that is mounted on the circuit substrate and that processes an input signal of a first frequency band, a second semiconductor device substrate that is mounted on the circuit substrate and that processes an input signal of a second frequency band, and a control device substrate that is arranged between the first and second semiconductor device substrates and that controls the first and second semiconductor device substrates. | 06-12-2014 |
20140168912 | ELECTRONIC DEVICE AND CONDUCTIVE GROUND ELEMENT - An electronic device includes a metallic housing having a front wall with a mounting hole communicating with an interior thereof, and a front cover spaced apart from the front wall and having an access slot corresponding in position to the mounting hole. A circuit module includes a circuit board disposed within the metallic housing and having an extension protruding out of the front wall via the mounting hole, and an electrical connector disposed on the extension. A conductive ground element is disposed pivotally within the metallic housing in proximity to the mounting hole, and abuts against the electrical connector to conduct static electricity of the electrical connector to the metallic housing. | 06-19-2014 |
20140168913 | METHOD AND APPARATUS FOR REDUCING STRESS ON MOUNTED ELECTRONIC DEVICES - A continuous substrate including a first portion with a plurality of electronic components, and at least one strain relief area located proximate a fastening location, wherein the at least one strain relief area is located between the first portion and the fastening location. | 06-19-2014 |
20140177175 | Gold Pad Mini PCB Module - A printed circuit board (PCB) assembly includes a first printed circuit board that includes first circuit traces formed of copper. A second printed circuit board includes second circuit traces that are formed of nickel/gold plated copper and terminations that are soldered to the first circuit traces. An electrical component contacts the second circuit traces. | 06-26-2014 |
20140177176 | PANEL UNIT THAT REDUCES INFLUENCE OF STATIC ELECTRICITY, AND ELECTRONIC APPARATUS - A panel unit that reduces the influence of static electricity applied to a panel member forming a display surface without increasing the size of an electronic apparatus. The panel unit has a touch panel and an FPC including connection sections which are electrically connected to interconnection sections of the touch panel, and is provided with signal lines and a ground interconnection. The FPC includes conductor-exposed portions each provided between the connection sections connected to the interconnection sections and an outer part of the touch panel. The conductor-exposed portions are configured to be prevented from being electrically conducted to the signal lines, and be electrically conducted to the ground interconnection. | 06-26-2014 |
20140177177 | ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF - An electronic device is disclosed. The electronic device includes at least an electronic element; and a circuit board having a base with at least a block, wherein the at least a block is used as a replaceable carrying portion for carrying the electronic element, and the electronic element is electrically connected to the circuit board. As such, when a defect occurs to the replaceable carrying portion, the replaceable carrying portion as well as the defective electronic element can be removed and replaced with good ones. | 06-26-2014 |
20140177178 | PRINTED ELECTRONICS - Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed. | 06-26-2014 |
20140177179 | WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE - A wiring substrate comprises an insulating substrate and an external electrode on the insulating substrate. The insulating substrate comprises a lateral surface comprising a cutout. The cutout extends to a lower surface of the insulating substrate. The external electrode extends from an inner surface of the cutout to the lower surface of the insulating substrate. The insulating substrate comprises a protrusion at a lower end portion of the inner surface of the cutout. The protrusion protrudes from the inner surface of the cutout toward the lateral surface of the insulating substrate. | 06-26-2014 |
20140185250 | MOTHERBOARD WITH COMPATIBLE INTERFACE - A motherboard includes an interface and a switch module. The interface includes first to eighth pins used to connect a component object model (COM) connector or a registered jack 45 (RJ45) connector. The switch module is connected to the interface. The switch module is also connected to a serial communication bus and an Ethernet bus on the motherboard. The switch module is used to determine the type of a connector connected to the interface, and connect the connector to the serial communication bus or the Ethernet bus according to the determination. | 07-03-2014 |
20140192487 | CIRCUITRY ARRANGEMENT FOR REDUCING A TENDENCY TOWARDS OSCILLATIONS - A circuitry arrangement includes several electronic parts mounted to a circuit board, at least one conductor section extending between the electronic parts within a first conductor layer, and a closed conductor loop comprising at least one loop section running in parallel to the at least one conductor section within a second conductor layer neighboring the first conductor layer. The closed conductor loop is configured to reduce a tendency towards oscillations of a current flowing through the conductor section in operation of the circuitry arrangement. The conductor loop is closed via at least one electronic component mounted to an outer surface of the circuit board. | 07-10-2014 |
20140198461 | LOW PROFILE INDUCTORS FOR HIGH DENSITY CIRCUIT BOARDS - An inductor includes a core formed of a magnetic material and a foil winding wound at least partially around or through at least a portion of the core. A first end of the winding extends away from the core to form an extended output tongue configured and arranged to supplement or serve as a substitute for a printed circuit board foil trace. A second end of the winding forms a solder tab. At least a portion of the extended output tongue and the solder tab are formed at a same height relative to a bottom surface of the core. Another inductor includes a core formed of a magnetic material, a winding wound at least partially around or through at least a portion of the core, and a ground return conductor attached to the core. The core does not form a magnetic path loop around the ground return conductor. | 07-17-2014 |
20140198462 | DISPLAY PANEL INTEGRATING A DRIVING CIRCUIT - A display panel includes a periphery area, an active display area adjacent to the periphery, a driving chip disposed out of the active display area for driving the active display area, and a plurality of wires electrically connecting the driving chip and the active display area. The width of at least one wire at a portion adjacent to the driving chip is smaller than the width of the at least one wire at the other portion adjacent to the active display area. | 07-17-2014 |
20140198463 | PRINTED CIRCUIT BOARD AND MAGNETIC FIELD OR CURRENT SENSOR - A printed circuit has a creep suppressor and a stack of metallization layers separated by electrically insulating layers. A metallization layer arranged above the insulating layer at least partially covers a cavity formed in the latter's top face. Prepreg arranged directly on the insulating layer below the metallization layer bonds the layers together. A magnetic core is housed in the cavity leaves at least a five micrometer gap between the cavity's vertical walls and roof and the core's facing vertical and top faces. During stack assembly, the creep suppressor prevents prepreg from flowing, by creep, into the cavity until it contacts more than 20% of the core's top face. | 07-17-2014 |
20140204541 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE - An electronic device includes a glass substrate, an electronic element mounted on one surface of the glass substrate, a cover body covering the electronic element and bonded to the glass substrate and a through electrode penetrating from one surface to the other surface of the glass substrate. The through electrode is composed of an iron-nickel based alloy and; and a nickel film is formed on an end face of the through electrode exposing on the other surface of the glass substrate and on the other surface of the glass substrate located in the vicinity of the end face. | 07-24-2014 |
20140204542 | DISPLAY PANEL INTEGRATING A DRIVING CIRCUIT - A display panel includes a periphery area, an active display area adjacent to the periphery, a driving chip disposed out of the active display area for driving the active display area, and a plurality of wires electrically connecting the driving chip and the active display area. The width of at least one wire at a portion adjacent to the driving chip is smaller than the width of the at least one wire at the other portion adjacent to the active display area. | 07-24-2014 |
20140211425 | ELECTRIC DEVICE - The present invention discloses an electric device, which comprises at least one transparent/semi-transparent substrate; a plurality of electric conduction elements arranged on at least one of two opposite surfaces and a lateral surface of the transparent/semi-transparent substrate; and at least one module arranged on the transparent/semi-transparent substrate and electrically connected with the electric connection units. The present invention also discloses an electric device, which comprises a plurality of transparent/semi-transparent substrates; a plurality of electric conduction elements selectively arranged on the transparent/semi-transparent substrates; and a plurality of modules arranged on outer surfaces of the transparent/semi-transparent substrates or interposed between the transparent/semi-transparent substrates, and electrically connected with the electric conduction elements. The electric device has electric functions and features transparency esthetics. | 07-31-2014 |
20140211426 | MOTHERBOARD HAVING TWO DISPLAY CONNECTORS - A motherboard includes a resistor, a display card controller, first and second display connectors, and a signal switch chip. A display device is connected to either the first or second display connector. A detecting pin of the first display connector is connected to a power source through the resistor. The signal switch chip is connected between the display card controller and each of the first display connector and the second display connector. | 07-31-2014 |
20140211427 | INDUCTIVE DEVICE ASSEMBLIES AND METHODS - Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed. | 07-31-2014 |
20140218871 | SUBSTRATE AND TERMINALS FOR POWER MODULE AND POWER MODULE INCLUDING THE SAME - According to example embodiments, a substrate for a power module includes first to third parts spaced apart from each other, where the third part surrounds the first and second parts, and a conductive layer on the first to third parts. A terminal of a first polarity is connected to the first part, and a terminal of a second polarity is connected to the second part. The first and second terminals may be spaced apart from each other and each have a coupling part, a body, and a contact part. The bodies of the first and second terminals may overlap each other. A power module may include the substrate. | 08-07-2014 |
20140268589 | CIRCUIT BOARD AND ELECTRONIC DEVICE PROVIDED WITH SAME - A circuit board and an electronic device having the circuit board that includes a ceramic sintered body, a through conductor and a metal wiring layer. The ceramic sintered body includes a through hole penetrating from a first main surface to a second main surface thereof. The through conductor is in the through hole and has first and second ends. The metal wiring layer covering the first end and electrically connected to the through conductor. The through conductor includes: a first portion having a hollow cylinder shape, in contact with an inner wall of the through hole and extending from the first end to the second end; and a second portion having a columnar shape and disposed inside the first portion. The second portion has an average grain size of the metal larger than that in the first portion. | 09-18-2014 |
20140268590 | WINDOW MEMBER AND METHOD OF MANUFACTURING THE SAME - A window member includes: a glass member; a display member wherein the glass member has a bottom surface which faces and overlays the display member and a pattern layer provided on a first surface of the glass member and having a fine pattern. The pattern layer is silk-screen printed on the first surface of the glass member to directly contact the surface of the glass member. A method of manufacturing a window member, includes: forming a pattern layer such that the pattern layer contacts a surface of the glass member along a periphery of the glass member. The pattern layer is formed at a location which is offset inward from a periphery of the glass member. | 09-18-2014 |
20140268591 | PRINTING COMPLEX ELECTRONIC CIRCUITS - A programmable circuit includes an array of printed groups of microscopic transistors or diodes. The devices are pre-formed and printed as an ink and cured. The devices in each group are connected in parallel so that each group acts as a single device. In one embodiment, about 10 devices are contained in each group so the redundancy makes each group very reliable. Each group has at least one electrical lead that terminates in a patch area on the substrate. An interconnection conductor pattern interconnects at least some of the leads of the groups in the patch area to create logic circuits for a customized application of the generic circuit. The groups may also be interconnected to be logic gates, and the gate leads terminate in the patch area. The interconnection conductor pattern then interconnects the gates for form complex logic circuits. | 09-18-2014 |
20140268592 | Assembling and Handling Edge Interconnect Packaging System - Apparatuses and methods related to the field of microchip assembly and handling, in particular to devices and methods for assembling and handling microchips manufactured with solid edge-to-edge interconnects, such as Quilt Packaging® interconnect technology. Specialized assembly tools are configured to pick up one or more microchips, place the microchips in a specified location aligned to a substrate, package, or another microchip, and facilitate electrical contact through one of a variety of approaches, including solder reflow. This specialized assembly tooling performs heating functions to reflow solder to establish electrical and mechanical interconnections between multiple microchips. Additionally, the interconnected microchips may be arranged in an arbitrarily large array. | 09-18-2014 |
20140285979 | MINIMIZING PRINTED CIRCUIT BOARD WARPAGE - A printed circuit board and method of manufacturing same, the printed circuit board comprising a stack of layers. The stack of layers being comprised of alternating circuit layers and insulating layers that are laminated together. The stack of layers includes an area with resin cured to a degree. The area has a coefficient of thermal expansion that is dependent, at least in part, on the degree of curing of the resin. | 09-25-2014 |
20140285980 | CONVERSION OF STRAIN-INDUCING BUFFER TO ELECTRICAL INSULATOR - Techniques are disclosed for converting a strain-inducing semiconductor buffer layer into an electrical insulator at one or more locations of the buffer layer, thereby allowing an above device layer to have a number of benefits, which in some embodiments include those that arise from being grown on a strain-inducing buffer and having a buried electrical insulator layer. For instance, having a buried electrical insulator layer (initially used as a strain-inducing buffer during fabrication of the above active device layer) between the Fin and substrate of a non-planar integrated transistor circuit may simultaneously enable a low-doped Fin with high mobility, desirable device electrostatics and elimination or otherwise reduction of substrate junction leakage. Also, the presence of such an electrical insulator under the source and drain regions may further significantly reduce junction leakage. In some embodiments, substantially the entire buffer layer is converted to an electrical insulator. | 09-25-2014 |
20140293554 | INSULATED METAL SUBSTRATE - An insulated metal substrate (IMS) for supporting a device comprises a metallic substrate having a ceramic coating formed at least in part by oxidation of a portion of the surface of the metallic substrate. The ceramic coating has a dielectric strength of greater than 50 KV mm | 10-02-2014 |
20140313677 | RADIO FREQUENCY SHIELD - A radio frequency shield is disclosed. | 10-23-2014 |
20140313678 | MOUNTING DEVICE FOR EXPANSION CARD - A mounting device for mounting one end of an expansion card plugged in a circuit board includes a bracket to be mounted on the circuit board, and a mounting member slidably mounted to the bracket. The bracket includes a top plate forming a number of parallel dentate members. The mounting member includes a supporting portion for clamping the end of the expansion card, and a positioning portion adjustable to lock to one of the dentate members for positioning the mounting member relative to the bracket. | 10-23-2014 |
20140313679 | HEAVY-CURRENT TRANSFORMER HAVING A MULTI-POINT CONTACTING, TRANSFORMER ELEMENT, CONTACT PLATE AND SECONDARY WINDING, AND METHOD FOR PRODUCING SUCH A HEAVY-CURRENT TRANSFORMER - The invention relates to a heavy-current transformer ( | 10-23-2014 |
20140321070 | Portable Electronic Device Assembly - A portable electronic device assembly includes a portable electronic device and a peripheral device. The portable electronic device includes a first electronic connection element and a first magnetic element. The peripheral device includes a second electronic connection element and a second magnetic element. When the portable electronic device is placed on the peripheral device, the magnetic force between the second magnetic element and the first magnetic element moves the second electronic connection element such that the first electronic connection element and the second electronic connection element are electrically connected. | 10-30-2014 |
20140321071 | PRINTED CIRCUIT BOARD, DISPLAY DEVICE AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A printed circuit board includes an insulation layer adjacent to a high-speed signal wire layer. A low-loss material layer is provided between the high-speed signal wire layer and the insulation layer. As a result, it is possible to reduce frequency loss of a high-speed signal wire layer and improve reliability of the printed circuit board. | 10-30-2014 |
20140328029 | CONTROL UNIT HAVING A SACRIFICIAL STRUCTURE - A control unit has a substrate with an electrically conductive structure, an integrated circuit device, which is installed on the substrate in an electrically conductive manner, and a sacrificial structure on the substrate. The sacrificial structure is configured to be irreversibly destroyed if the integrated circuit device is removed from the substrate. The electrically conductive structure has at least one conducting track applied to the substrate. The sacrificial structure is formed by a segment of the conducting track. An electrically insulating connecting layer that connects the integrated circuit device, the substrate, and the segment of the conducting track is formed. The sacrificial structure can be destroyed by the connecting layer when the integrated circuit device is removed. | 11-06-2014 |
20140340853 | Safety Device - Safety devices are provided having a power generating part and a safety-critical part. A conducting ring is provided at least around the power generating part. The ring may be connected to a reference potential such as ground. | 11-20-2014 |
20140340854 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE - An electronic device includes a substrate; and a plurality of thin-film elements formed on the substrate. Further, the thin-film element includes a thin-film section having a function selected from a group including piezoelectric effect, inverse piezoelectric effect, charge storage, semiconductivity, and conductivity, and the plurality of thin-film elements includes the thin-film sections having two or more different functions. | 11-20-2014 |
20140340855 | DISPLAY DEVICE - In one embodiment, the display device includes a display panel and a support frame. The display panel includes a flexible upper substrate, at least one light emitting diode, and a flexible lower substrate ( | 11-20-2014 |
20140347823 | SENSOR UNIT, METHOD OF MANUFACTURING THE SAME, ELECTRONIC APPARATUS, AND MOVING OBJECT - A sensor unit is provided with a sensor device. The sensor device has a first electrode disposed on an outer surface. A board is provided with a first surface and a second surface in an obverse-reverse relationship with each other, and a side surface. A first conductive terminal is disposed along a contour of the first surface. The sensor device has the outer surface disposed along the side surface of the board, and has the first electrode connected to the first conductive terminal with a first conductive body, and a first projection length of the outer surface projecting on the first surface side is smaller than a second projection length of the outer surface projecting on the second surface side. | 11-27-2014 |
20140347824 | PORTABLE ELECTRONIC DEVICE DISPLAY ASSEMBLIES AND METHODS AND APPARATUS FOR MANUFACTURING THE SAME - A display includes an upper surface adapted to present visual information to a device user and an outer perimeter proximate the upper surface. An optically transparent lens is carried by a housing and overlies the display. The optically transparent lens and the upper portion of the housing together define an upper surface of the portable electronic device. An optically transparent resin is carried between the display and the optically transparent lens. The optically transparent resin includes a perimeter portion disposed between the outer perimeter of the display and the side portion of the housing. The resin can be cured using light. | 11-27-2014 |
20140347825 | CIRCUIT BOARD AND POWER CONVERSION APPARATUS HAVING CIRCUIT BOARD - The present invention discloses a circuit board, including a substrate and a magnetic core, where the magnetic core is embedded into the substrate, at least one turn of a winding conductor wound around the magnetic core is arranged on the substrate, each turn of the winding conductor includes a first end-surface conductor and a second end-surface conductor that are separately arranged on two ends of the magnetic core, and each turn of the winding conductor further includes a first side-surface conductor that penetrates through the magnetic core from an inner side of the magnetic core and a second side-surface conductor that penetrates through the magnetic core from an outer side of the magnetic core. The circuit board and the power conversion apparatus having the circuit board provided by the present invention, achieve larger inductance, save materials, and reduce cost for fabricating a power conversion apparatus. | 11-27-2014 |
20140347826 | INJECTION MOLDED CONTROL PANEL WITH IN-MOLDED DECORATED PLASTIC FILM THAT INCLUDES AN INTERNAL CONNECTOR - Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector. | 11-27-2014 |
20140355225 | FORMULATED RESIN COMPOSITIONS FOR FLOOD COATING ELECTRONIC CIRCUIT ASSEMBLIES - Formulated resin systems containing polymeric flood coat compositions are provided herein and characterized by having an initial mix thixotropic index from 1 to 5, and a gel time from 5 to 15 minutes such that when cured the compositions provide a Shore hardness from 15 A to 90 A, a thickness on horizontal surfaces from 20 mils to 75 mils, and a thickness on vertical surfaces from 4 mils to 20 mils. Electronic circuit assemblies flood coated with such formulated resin systems, and methods for protecting and supporting said assemblies, are also provided. | 12-04-2014 |
20140362541 | IMAGE DISPLAY DEVICE - An image display device includes a display to output an image, a first support plate disposed at a rear surface of the display for support, a second support plate spaced apart from a rear surface of the first support plate, and having electronic devices mounted thereon, and at least one hinge unit to connect the first support plate and the second support plate to each other by a hinge such that the second support plate resists transformation during transformation of the first support plate. | 12-11-2014 |
20140362542 | ARRAY SUBSTRATE ASSEMBLY AND DISPLAY DEVICE - The present invention relates to an array substrate assembly and a display device. The array substrate assembly comprises a substrate; a first metal line formed at one side of the substrate; an insulating layer formed on the first metal line; a second metal line formed on the insulating layer, wherein one end of the second metal line connected with a driving circuit is formed with a second terminal, wherein in a thickness direction of the substrate, a distance between a surface of the second terminal away from the one side of the substrate and the substrate is less than a distance between a surface of the second metal line away from the one side of the substrate and the substrate. The display device includes the array substrate assembly. With the solution of the present invention, when the array substrate assembly is connected to IC or COF, deformation difference between a conducting gold ball at a gate line terminal and a conducting gold ball at a date line is small, thus impedances at the two terminals are close to each other, and therefore image quality of the display device is improved. | 12-11-2014 |
20140362543 | SHIELD CAN ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME - An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device. | 12-11-2014 |
20140376194 | SIGNAL REFERENCING FOR MEMORY - Apparatus, systems, and methods for signal referencing for memory are described. In one embodiment, connector for a memory device comprises a housing having a first panel and a second panel opposite the first panel to be positioned adjacent a circuit board, the first panel and second panel defining a slot to receive a portion of the memory device, a first plurality of electrically conductive pins disposed in the slot and proximate the first panel to establish electrical connections with a plurality of electrical connectors on the memory device, wherein at least one of the first plurality of pins is a ground pin and a layer of conductive material disposed proximate the second surface. The ground pin is electrically coupled to the layer of conductive material. Other embodiments are also disclosed and claimed. | 12-25-2014 |
20140376195 | Methods of forming dual sided coreless package structures with land side capacitor - Methods of forming coreless package structures comprising backside land side capacitors (LSC) and dual sided solder resist are described. Those methods and structures may include forming a nickel coating on a first and second side of a core, forming a conductive plating on the nickel coating, forming building up layers on the conductive plating to form two panels on the core, de-paneling the panels from the core to form two coreless substrates, forming a laminate on the first and second sides of the coreless substrates, and forming an LSC on a backside of the coreless substrates. | 12-25-2014 |
20140376196 | METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST TWO PRINTED CIRCUIT BOARD REGIONS, AND PRINTED CIRCUIT BOARD - The invention relates to a method for producing a printed circuit board consisting of at least two printed circuit board regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one conductive component, wherein printed circuit board regions to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a mechanical coupling. According to the invention, at least one sub-region or connection port of the conductive layer, and/or a conductive element of the component are electrically conductively coupled to each other at the lateral surface, whereby a simple and reliable lateral electrical coupling between printed circuit board regions to be connected to each other is rendered possible. The invention further relates to such a printed circuit board. | 12-25-2014 |
20150009634 | ELECTRONIC DEVICE HAVING SELF-EMITTING DISPLAY PANEL - An electronic device includes a self-emitting display panel, a first transparent substrate, a second transparent substrate and two combining elements. The first transparent substrate includes two first edge portions and a first cover portion. The second transparent substrate includes two second edge portions and a second cover portion. The self-emitting display panel is disposed between the first cover portion and the second cover portion. The self-emitting display panel has a first surface facing to and covered entirely by the first cover portion and a second surface facing to and covered entirely by the second cover portion. One of the two combining elements is connected between one of the two first edge portions and one of the two second edge portions, and the other of the two combining elements is connected between the other of the two first edge portions and the other of the two second edge portions. | 01-08-2015 |
20150016068 | 3DIC Package Integration for High-Frequency RF System - A three-Dimensional Integrated Circuit (3DIC) Chip on Wafer on Substrate (CoWoS) packaging structure or system includes a silicon oxide interposer with no metal ingredients, and with electrically conductive TVs and RDLs. The silicon oxide interposer has a first surface and a second surface opposite to the first surface. The electrically conductive TVs penetrate through the silicon oxide interposer. The electrically interconnected RDLs are disposed over the first surface of the silicon oxide interposer, and are electrically coupled or connected to a number of the conductive TVs. | 01-15-2015 |
20150016069 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) is disclosed. The PCB includes a main body. A first surface of the main body is a connecting surface for electrical components. A second surface of the main body is a conductive cooper foil layer operating as ground wires. A plurality of grooves is arranged on the conductive cooper foil layer. The grooves pass through the conductive cooper foil layer to connect to the main body of the PCB. The thermal stress generated in the PCB welding process can be effectively released via the grooves. The inflation of the conductive cooper coil is relieved such that the PCB is prevented from being wrapped or cooper bubbling. In this way, the operation efficiency is enhanced and the manufacturing cost is reduced. | 01-15-2015 |
20150016070 | CONDUCTIVE STRUCTURE AND DEVICE WITH THE CONDUCTIVE STRUCTURE AS ELECTRODE - Provided is a conductive structure and a device with the conductive structure as an electrode. The conductive structure includes a reduced metal layer and an overlapping structure formed by nano metal wires. The overlapping structure has at least one connecting portion, and the reduced metal layer covers the nano metal wires at the connecting portions. | 01-15-2015 |
20150016071 | ELECTRONIC COMPONENT THICKNESS MEASUREMENT METHOD, METHOD FOR MANUFACTURING A SERIES OF ELECTRONIC COMPONENTS USING THE MEASUREMENT METHOD, A SERIES OF ELECTRONIC COMPONENTS MANUFACTURED BY THE MANUFACTURING METHOD, AND ELECTRONIC COMPONENT INSPECTION APPARATUS - An electronic component thickness measurement method includes extracting, from a plurality of second reference lines in first image data and a plurality of second reference lines in second image data, only a second reference line at which a difference in intensity peak between respective second reference lines at a same position in the first image data and the second image data is smallest, and forming third image data including a first reference line and the extracted second reference line, and calculating a thickness of the electronic component from a distance between the first reference line and the second reference line in the third image data. | 01-15-2015 |
20150016072 | DRY FILM, PRINTED WIRING BOARD USING SAME, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND FLIP CHIP MOUNTING SUBSTRATE - The present invention provides a dry film capable of forming a cured coating film having an excellent laser processability and a desmear resistance, and a printed writing board using the same. Further, the present invention provides a method of producing a printed writing board for a flip-chip mounting substrate capable of simply and inexpensively forming a dam preventing from spreading an underfill, a printed writing board obtained by the method of producing, and a flip-chip mounting substrate in which a chip is subjected to flip chip mounting on the printed writing board. | 01-15-2015 |
20150016073 | Circuit Carrier Having a Conducting Path and an Electric Shield, and Method for Producing Said Circuit Carrier - The invention relates to a circuit carrier ( | 01-15-2015 |
20150022977 | POWER MODULE SUBSTRATE, POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE - A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is in the range of 0.05 to 5 wt %. | 01-22-2015 |
20150029678 | SUBSTRATELESS DEVICE AND THE METHOD TO FABRICATE THEREOF - A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate. | 01-29-2015 |
20150029679 | CIRCUIT BOARD, PRODUCTION METHOD OF CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT - A method for producing circuit board, including: adhering plastic deformable insulating material onto surface of laminate, which contains second-metal-layer of second metal, and first-metal-layer in pattern on second-metal-layer, and the surface of the laminate is surface of second-metal-layer where first-metal-layer is formed, and surface of first-metal-layer, followed by curing the material, and removing second-metal-layer to form plate structure to which first-metal-layer in pattern is formed; opening hole in cured material from surface of the plate structure opposite to surface thereof where first-metal-layer is formed, until the hole reaches first-metal-layer; filling the hole with electroconductive paste, to form the plate structure filled therewith; and laminating one plate structure filled therewith with the other plate structure filled therewith in manner that first-metal-layer of one plate structure filled therewith faces opening of the hole of other plate structure filled therewith, wherein first-metal-layer contains metal different from second metal. | 01-29-2015 |
20150029680 | MOUNTING STRUCTURE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC APPARATUS - A mounting structure in which a plurality of substrates are electrically connected to each other includes a first substrate having a first alignment mark formed by partially cutting away a first terminal, and a second substrate having a second alignment mark formed by partially cutting away a second terminal. The first terminal and the second terminal are electrically connected to each other by being relatively positioned with respect to each other. | 01-29-2015 |
20150029681 | FLEXIBLE COMPOSITE, PRODUCTION THEREOF AND USE THEREOF - A flexible composite comprising a plastic foil, having an upper and a lower surface, and at least one dielectric barrier layer against gases and liquids which is applied directly to at least one of the surfaces by plasma-enhanced thermal vapor deposition and comprises an inorganic vapor-depositable material, is provided. The flexible composite can be used for constructing flexible circuits or displays and has a high barrier effect with regard to oxygen and/or water vapor. | 01-29-2015 |
20150029682 | ELECTRONIC CONTROL UNIT - Proposed is a C/U that is designed to accomplish the above object. The CU includes a multilayer circuit substrate, a resin cover, and a metal base. Electronic parts are mounted on both surfaces of the multilayer circuit substrate which is covered with the resin cover and the metal base. The multilayer circuit substrate | 01-29-2015 |
20150036297 | ELECTRONIC MODULE AND METHOD OF MAKING THE SAME - A method of manufacturing electronic module is provided. The method can perform selective partial molding by forming the tapes in a predetermined area on the circuit substrate, setting electronic components out the predetermined area on the circuit substrate, forming the molding member encapsulating the whole circuit substrate and removing the tapes along of the molding member thereon. Following, forming an EMI shielding layer on the molding member and setting optoelectronics in the predetermined area on the circuit substrate could protect the electronic components from electromagnetic disturbance and avoid the optoelectronics being encapsulated. | 02-05-2015 |
20150036298 | TRANSPARENT CONDUCTOR AND OPTICAL DISPLAY APPARATUS COMPRISING THE SAME - A transparent conductor includes a base layer, and a transparent conductive film on one or both sides of the base layer, the transparent conductive film including a metal nanowire, where the base layer includes a retardation film. An optical display apparatus includes the transparent conductor. The transparent conductor may compensate for a viewing angle of the optical display apparatus. | 02-05-2015 |
20150049441 | CIRCUIT BOARD WITH CORNER HOLLOWS - A method of manufacturing is provided that includes singulating a circuit board from a substrate of plural of the circuit boards, wherein the circuit board is shaped to have four corner hollows. The corner hollows may be various shapes. | 02-19-2015 |
20150049442 | CERAMIC CIRCUIT BOARD AND ELECTRONIC DEVICE - A ceramic circuit board includes a ceramic substrate, and a first metal plate bonded to a front surface of the ceramic substrate. A size of the front surface of the ceramic substrate is smaller than a size of a surface, i.e., a first facing surface, on a side of the first metal plate that faces the ceramic substrate. | 02-19-2015 |
20150055307 | Windowed Reference Planes for Embedded Conductors - A rigid multi-layer printed circuit board (PCB) has an embedded elongated conductor between opposing first and second reference planes. The first and second reference planes are formed of conductive material and are electrically isolated from the conductor by intervening insulative material. Each of the first and second reference planes have a plurality of spaced apart windows extending therethrough, the windows aligned with the elongated conductor. | 02-26-2015 |
20150062835 | CIRCUIT MODULE - A circuit module includes a wiring substrate having a mount surface that has first, second, and third areas; a plurality of electronic components mounted on the areas; an insulating sealing layer that has a main surface and a side surface and covers the plurality of electronic components, the main surface having a trench that is sequentially formed along a boundary between the areas to be diverged en route and has a tapered shape toward the mount surface, the side surface being formed around the main surface; and a conductive shield that has first and second shield portions and includes conductive resin, the first shield portion covering the side surface of the sealing layer and having a first thickness, the second shield portion being provided in the trench and having a second thickness larger than the first thickness at a height of half the total height of the second shield portion. | 03-05-2015 |
20150062836 | STACKED PACKAGE OF VOLTAGE REGULATOR AND METHOD FOR FABRICATING THE SAME - The present disclosure relates to a stacked package of a voltage regulator and a method for fabricating the same. The method comprises: providing a first chip and a second chip which are integrated with each other, the first chip and the second chip each having a front surface provided with a plurality of bumps; forming a non-conductive layer and a conductive layer side by side on the back surface of the second chip; providing a first leadframe and a second leadframe each having at least a group of leads, the plurality of bumps on the first chip being electrically coupled to the first leadframe, the plurality of bumps on the second chip being electrically coupled to the second leadframe, and the back surface of the second chip being electrically coupled to a back surface of the first leadframe; the first leadframe being electrically coupled to the second leadframe; the first chip, the second chip, the conductive layer, the non-conductive layer, the bumps, the first leadframe, and the second leadframe forms a stacked package to reduce the footprint of a chip and reducing manufacture cost. | 03-05-2015 |
20150062837 | Lead frame for a premold sensor housing - A lead frame for a premold sensor housing, in which the lead frame includes at least one angled section having essentially no rounding in an area of contact with the premold sensor housing, the area of contact being provided as a positioning area for a sensor element. | 03-05-2015 |
20150070853 | DISPLAY DEVICE AND FIXING ELEMENT FOR USE IN THE DISPLAY DEVICE - A display device, comprising a base cover with a base plate, a sidewall portion extended from the base plate and a first coupling hole; a display panel with a first display portion configured to display an image and a second display portion outside and along the first display portion, a top cover with a bezel portion sized to be laid over the second display portion, and a sidewall portion extended from the bezel portion, the top cover including a second coupling hole; and a fixing element with a first coupling portion having a third coupling hole, a contact portion extended from the first coupling portion and configured to maintain contact with a portion of the top cover. A coupling element can be inserted through the first through third coupling holes so as to press the contact portion against a portion of the top cover. | 03-12-2015 |
20150070854 | DISPLACEABLE INSULATION BARRIER - The invention relates to an arrangement for increasing the insulation coordination between at least two electric potentials on a printed circuit board ( | 03-12-2015 |
20150070855 | CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT - A circuit board includes a ceramics substrate composed of ceramics and a conductor portion provided on the ceramics substrate. The conductor portion is composed of a stacked body including, in order from the ceramics substrate side, an under layer that contains a Group 6 element and a glass material, and a metal layer that contains a low-melting-point metal. A portion of the low-melting-point metal constituting the metal layer migrates to the under layer. | 03-12-2015 |
20150077946 | TOUCH SCREEN PANEL AND METHOD FOR MANUFACTURING SAME - A one glass solution touch screen panel includes a substrate, a shielding layer, an indium tin oxide film layer, a soft circuit board, an infiltrate layer, and a plurality of conducting connectors. The shielding layer is formed on a first portion of the substrate. The indium tin oxide film layer is formed on a second portion of the substrate and has a plurality of indium tin oxide film connecting portions. The soft circuit board is formed on the shielding layer. The infiltrate layer is formed on the connecting portions and defines a plurality of infiltrate gaps within the infiltrate layer. The conducting connectors are formed on the infiltrate layer. The conducting connectors are electrically connected to the soft circuit board. The conducting connectors extend into the infiltrate layer substantially filling a substantial portion of the plurality of infiltrate gaps and electrically connecting to the connecting portions. | 03-19-2015 |
20150077947 | FORMULATED RESIN COMPOSITIONS FOR FLOOD COATING ELECTRONIC CIRCUIT ASSEMBLIES - Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations. | 03-19-2015 |
20150092358 | PACKAGE CARRIER - A package carrier including a removable supporting plate and a circuit board is provided. The removable supporting plate includes a dielectric layer, a copper foil layer and a releasing layer. The dielectric layer is disposed between the copper foil layer and the releasing layer. The circuit board is disposed on the removable supporting plate and directly contacts the releasing layer. A thickness of the circuit board is between 30 μm and 100 μm. | 04-02-2015 |
20150092359 | TOUCH WINDOW AND TOUCH DEVICE WITH THE SAME - Disclosed are a touch window with an improved visibility and a touch device with the same. The touch window includes a substrate; a first sensing electrode aligned on the substrate as a first conductive pattern; and a second sensing electrode aligned on the substrate as a second conductive pattern, wherein the first conductive pattern and the second conductive pattern have mutually different directionalities. | 04-02-2015 |
20150098195 | FOLDABLE ASSEMBLY AND PIVOT ASSEMBLY THEREOF - A foldable assembly includes a first plate component, a second plate component and a pivot assembly. The pivot assembly comprises a first pivot member, a second pivot member and a third pivot member. The first pivot member and the second pivot member are connected with the first plate component and the second plate component, respectively. Each of the first pivot member and the second pivot member has an axial hole and a plurality of recesses. Each of the two opposite sides of the third pivot member has a shaft and a protrusion located on an outer wall surface of the shaft. The two shafts are adapted for being rotatable on the two axial holes, respectively. The two protrusions are located on one of the plurality of recesses of the first pivot member and on the one of the plurality of recesses of the second pivot member, respectively. | 04-09-2015 |
20150109740 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF - An electronic device includes a substrate, a first device, a second device, and a shielding wall. The first device and the second device are disposed on the substrate respectively. The shielding wall is disposed independently between the first device and the second device. The shielding wall is configured for suppressing the electromagnetic interference from the second device to the first device. | 04-23-2015 |
20150109741 | CARD AND CARD PRODUCTION METHOD - To provide a card capable of improving external appearance, and a card production method. A card ( | 04-23-2015 |
20150109742 | DISPLAY DEVICE - A display device is provided, including a display panel, a back frame, a circuit board and a cover film. The display panel includes a first substrate and a second substrate, wherein the first substrate includes an upper surface. The back frame supports the display panel and includes an outer surface. The cover film includes a film base, a first adhesive and a second adhesive. The film base includes a first portion, a second portion and an intermediate portion located therebetween, wherein the film base covers an edge of the upper surface and a portion of the outer surface. The first adhesive is disposed on the first portion and is attached to the edge of the upper surface. The second adhesive is disposed on the second portion and is attached to the outer surface, wherein the intermediate portion and the outer surface define a receiving space receiving the circuit board. | 04-23-2015 |
20150116957 | ELECTRONIC ASSEMBLY AND ELECTRONIC APPARATUS - An electronic apparatus includes a rear casing, a front cover, and an electronic assembly that includes a display module, a host module, a battery module, and an expansion module. The rear casing has a front opening. The front cover is located on the front opening; the front cover and the rear casing together constitute an accommodation space. The display module is installed inside the accommodation space and stacked over the front cover. The host module is installed inside the accommodation space and stacked over the display module. The battery module is installed inside the accommodation space, stacked over the display module, and arranged side by side with the host module. The expansion module is installed inside the accommodation space and stacked over the battery module. The expansion module includes an expansion circuit board stacked over the battery module and a plurality of card connectors mounted on the expansion circuit board. | 04-30-2015 |
20150116958 | CIRCUIT BOARD MODULES HAVING MECHANICAL FEATURES - A modularized printed circuit board including mechanical features. The modularized printed circuit board may include a printed circuit board, at least one electronic component affixed to the printed circuit board, and an overmold material adjacent at least a portion of the printed circuit board and defining a region of overmold material. The modularized printed circuit board may also include a feature formed from the overmold material. | 04-30-2015 |
20150124413 | DISPLAY UNIT AND ELECTRONIC APPARATUS - A display unit includes: a display section displaying an image; a base film having a first surface provided with a drive circuit, the drive circuit controlling the display section; and a sheet antistatic-finished and bonded to a second surface opposite to the first surface of the base film, in which the sheet is larger in size than the base film. | 05-07-2015 |
20150124414 | Integrated Controller for Electronic Apparatuses - An integrated controller for electronic apparatuses includes a host and an AC/DC converting module. The host includes at least one power terminal set to connect to an electronic apparatus. The power terminal set includes a power input terminal, a power output terminal and a power neutral terminal. The power input terminal is connected to a fire wire to receive AC power. The power output terminal is connected to a wire-input end of the electronic apparatus, and the power neutral terminal is connected to a wire-output end of the electronic apparatus. Therefore, the AC/DC converting module receives the AC power via the power input terminal and the power neutral terminal and converts the AC power to DC power which is required by the integrated controller. The integrated controller is mounted in an original position for a wall-embedded switch is positioned to replace the wall-embedded switch. | 05-07-2015 |
20150313021 | DISPLAY PANEL MOTHERBOARD AND MANUFACTURING METHOD THEREOF - A display panel motherboard and a manufacturing method thereof are provided. The display panel motherboard comprises display panel regions (Q | 10-29-2015 |
20150313045 | Electronic Device and Shielding Member Production Method - An electronic device includes a metal member, a circuit board, and a shielding member. A through hole or slot is disposed on the metal member. The shielding member is fastened on the metal member. The shielding member includes a blocking portion and an enclosing portion. The blocking portion is made of an electrically conductive plastic material. The enclosing portion is made of a metal material or an electrically conductive plastic material. The blocking portion is configured to block the through hole or slot. The enclosing portion is disposed around the electronic component. One end of the enclosing portion is electrically connected to the metal member, and the other end of the enclosing portion is electrically connected to the circuit board. The metal member, the blocking portion, the enclosing portion, and the circuit board form a shielding space, and the electronic component is located in the shielding space. | 10-29-2015 |
20150319869 | WINDOW MEMBER AND METHOD OF MANUFACTURING THE SAME - A window member includes: a glass member; a display member wherein the glass member has a bottom surface which faces and overlays the display member and a pattern layer provided on a first surface of the glass member and having a fine pattern. The pattern layer is silk-screen printed on the first surface of the glass member to directly contact the surface of the glass member. A method of manufacturing a window member, includes: forming a pattern layer such that the pattern layer contacts a surface of the glass member along a periphery of the glass member. The pattern layer is formed at a location which is offset inward from a periphery of the glass member. | 11-05-2015 |
20150327389 | CONNECTION INCLUDING FLANGE IN COOPERATION WITH RESILIENT MEMBER TO ENGAGE AND DISENGAGE REMOVABLE PRINTED CIRCUIT ASSEMBLY - A connection apparatus to receive a removable printed circuit assembly includes a connector body and a first locking unit coupled to the connector body. The first locking unit may include a first outer locking member having a first channel, a first inner locking member movably disposed in the first channel, and a first resilient member. The first inner locking member may include a first flange to engage with the removable printed circuit assembly in an engaged position and disengage from the removable printed circuit assembly in a disengaged position. The first resilient member may be disposed in the first channel and in contact with the first outer locking member and the first inner locking member to enable movement of the first inner locking member between the engaged position and the disengaged position. | 11-12-2015 |
20150340312 | MICROELECTRONIC PACKAGE AND STACKED MICROELECTRONIC ASSEMBLY AND COMPUTING SYSTEM CONTAINING SAME - A microelectronic package comprises a die ( | 11-26-2015 |
20150351243 | LC COMPOSITE COMPONENT - An LC composite component includes one or more inductors, one or more capacitors, a magnetic layer, and a substrate. The substrate has a first surface, and a second surface opposite to the first surface. The magnetic layer is disposed to face the first surface of the substrate. The one or more inductors are disposed between the first surface of the substrate and the magnetic layer. The substrate has a thickness greater than that of the magnetic layer in a direction perpendicular to the first surface of the substrate. The substrate has a complex permeability having a real part and an imaginary part that are respectively smaller than the real part and the imaginary part of the complex permeability of the magnetic layer. | 12-03-2015 |
20150357275 | Printed Circuit Boards and Semiconductor Packages - A printed circuit board includes an in-line PCB region comprising an input/output control region including a first conductive line, and a main PCB region coupled to the in-line PCB region and comprising a semiconductor chip and an input/output signal generation region including a second conductive line. The input/output signal generation region is configured to detect whether or not the first and second conductive lines are electrically connected and to provide an input/output control signal to the semiconductor chip in response to determining whether or not the first and second conductive lines are electrically connected. | 12-10-2015 |
20150366074 | Conductive Formulations For Use In Electrical, Electronic And RF Applications - Metal flakes, an organic metal precursor, an organic solvent and either no binder, or a volatile or a thermally decomposable binder are combined to form a paste. The paste is deposited in a circuit pattern on a substrate and the circuit pattern is cured. While curing, the organic metal precursor decomposes to leave an electrically conductive path, and the printed circuit is thus formed. A precursor to an electrically conductive circuit material includes an organic metal precursor, metal microparticles, and an organic solvent. The method can be employed to form printed circuits, for a variety of electrical, electronic and sensing application, such as crack detection in ceramic, plastics, concrete, wood, fabric, leather, rubber or paper and composite materials. | 12-17-2015 |
20150371959 | POWER GRID CONDUCTOR PLACEMENT WITHIN AN INTEGRATED CIRCUIT - An integrated circuit | 12-24-2015 |
20150380178 | AUTOMOBILE PUSH-BUTTON TYPE CONTROL DEVICE - An automobile push-button type control device is disclosed. The device comprises a casing, a circuit module, a button set and a USB plug, wherein the circuit module is connected to an electronic device, thereby the vehicle with the device can connect to various related automobile electronic products without changing the original design of the vehicle. Thus, the device can provide a more convenient and easy-to-operate interface for users to expand the functions of the vehicles than before. | 12-31-2015 |
20160021729 | SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES, AND POWER MODULE - The present invention provides a power module substrate including an insulating substrate, a circuit layer which is formed on one surface of the insulating substrate, and a metal layer which is formed on the other surface of the insulating substrate, in which the circuit layer has a first aluminum layer made of aluminum or an aluminum alloy which is bonded to the insulating substrate and a first copper layer made of copper or a copper alloy which is bonded to the first aluminum layer by solid-phase diffusion, the metal layer has a second aluminum layer made of aluminum or an aluminum alloy, and a relationship between a thickness t | 01-21-2016 |
20160021751 | CIRCUIT FIXING MEMBER, CIRCUIT MODULE, AND JOINING METHOD FOR CIRCUIT MODULE - A circuit fixing member is provided which achieves a connection with a controlled object after a circuit module is produced, thereby avoiding disconnection of a wire member in the course of the production, easy to transfer between production processes, and is designed to avoid the entry of water into the circuit module. The terminal-embedded portion | 01-21-2016 |
20160029502 | DISPLAY MODULE, DISPLAY DEVICE, AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a display device includes forming on a first substrate a display element and a metal layer surrounding the display element, the metal layer including a first portion having a first width and a second portion having a second width less than the first width, forming on a second substrate a sealing member surrounding the display element, the sealing member including a first sealing portion having a first forming width and a second sealing portion having a second forming width greater than the first forming width, arranging the first substrate and the second substrate such that the sealing member on the second substrate faces the first substrate, the first sealing portion overlaps the first portion of the metal layer, and the second sealing portion overlaps the second portion of the metal layer, and sealing the first and second substrates by melting and curing the sealing member. | 01-28-2016 |
20160035689 | CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATION METHOD - The present invention provides a chip integration module, including a die, a passive device, and a connecting piece, where the die is provided with a die bonding portion, the passive device is provided with a passive device bonding portion, the die bonding portion of the die and the passive device bonding portion of the passive device are disposed opposite to each other, and the connecting piece is disposed between the die bonding portion and the passive device bonding portion and is connected to the die bonding portion and the passive device bonding portion. The chip integration module of the present invention achieves easy integration and has low costs. Moreover, a path connecting the die to the passive device becomes shorter, which can improve performance of the passive device. The present invention further discloses a chip package structure and a chip integration method. | 02-04-2016 |
20160049240 | FLEXIBLE CABLE AND ELECTRONIC DEVICE - A flexible cable includes an elongated flexible substrate including first and second surfaces on opposite sides thereof, a first capacitor electrode provided on the first surface side of the flexible substrate, the first capacitor electrode extending from a first end of the flexible substrate toward a second end of the flexible substrate, a second capacitor electrode provided on the second surface side of the flexible substrate, the second capacitor electrode extending from the second end of the flexible substrate toward the first end of the flexible substrate, a first connection portion provided at an end of the first capacitor electrode located at the first end of the flexible substrate, and a second connection portion provided at an end of the second capacitor electrode located at the second end of the flexible substrate. | 02-18-2016 |
20160050757 | ALL-ORGANIC INDUCTOR-CAPACITOR TANK CIRCUIT FOR RADIO FREQUENCY SENSOR APPLICATIONS - The present invention provides novel tank circuits that are totally passive, and they are made of conductive-grade carbon nanotubes (CNTs) on substrates, and preferably flexible substrates. These components and structures contain no traditional electronic materials such as silicon, metal oxides, or ceramics, and they are totally organic. They may be used in applications where the resonant frequency and amplitude of the sensor can be modulated by a thermal, mechanical, or chemical signal, such as temperature, strain, pressure, vibration, or humidity. All-organic, and consequently combustible, passive RF sensors have unique applications for defense and consumer industries. | 02-18-2016 |
20160050773 | OUTPUT MODULE FOR VEHICLE GAUGES - Presently disclosed output modules may be removably and directly connected to a vehicle gauge. For example, the output module may be directly mounted on or plugged into the back of the gauge, such as by using the existing mounting bosses of the gauge. Disclosed output modules may be used with existing micro-processor-controlled gauges to send a desired switch signal to an external device, such as a warning light or a kill switch, when measured data hits a trigger point. Prior to attachment of the output module, the end-user may program the gauge via connection to a computer or other device, in order to set the desired trigger point or threshold value. Once the gauge is programmed with the desired trigger point, the output module may be attached to the back side of the gauge and may be wired to the external device to be controlled. | 02-18-2016 |
20160057852 | ELECTRICAL CHANNEL INCLUDING PATTERN VOIDS - A channel to be coupled to an input of a receiver, the channel including: a first transmission line including: a first trace; and a first reference plane including a plurality of first pattern voids overlapping the first trace. | 02-25-2016 |
20160057856 | Anti-tamper Device - A multi-layered electronic system has: a support substrate which supports at least a primary conductive track and a conductive shorting element, which are electrical isolated from one another. A security layer has at least a conductive security connection and a flexible switch element providing an electrical interruption to the conductive security track. The conductive security connection electrically engages the primary conductive track. The flexible switch element is coplanar with the conductive security connection. A dielectric substrate, to which the security layer is affixed, is secured to the support substrate. The electrical interruption of the conductive security connection is bridged by the switch element contacting the conductive shorting element under an actuation force provided from the direction of the dielectric substrate, the switch element being biased away from the conductive shorting element in the absence of the actuation force. | 02-25-2016 |
20160073493 | STIFFENER RING FOR CIRCUIT BOARD - Various stiffener rings and circuit boards are disclosed. In one aspect, an apparatus is provided that includes a stiffener ring that has a first flange to engage a first principal side of a circuit board and a peripheral wall to engage an external peripheral wall of the circuit board. | 03-10-2016 |
20160073498 | Driving Printed Circuit Board for Display Device and Display Device Having the Same - An electronic device connection unit includes a substrate and a plurality of signal pads on the substrate configured to send signals from an electronic device to a driving printed circuit board (PCB). One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device. One or more dummy ground pads on the substrate are configured to connect to the reference voltage of the electronic device without extending onto the driving PCB. One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads. | 03-10-2016 |
20160073509 | POWER SUPPLY MODULE AND ITS MANUFACTURING METHOD - A power supply module and its manufacturing method are disclosed. The manufacturing method for the power supply module includes: configuring a coil such that coil terminals are configured by way of electrical connection in the preset circuit connection configuration of the connector; preparing a mold cavity, and placing the connector housed with the coil and the electronic components into the mold cavity; making a magnetic mixture, and filling the mold cavity where the connector is placed with the magnetic mixture to form a magnetic body under pressure, wherein the magnetic body encapsulates at least the coil, the electronic components and a portion of the connector adapted to house the coil and the electronic components, and the terminal is exposed outside the magnetic body; demoulding the magnetic body from the mold cavity; and increasing the temperature of the demoulded magnetic body by heating. In this way, the molding pressure for forming the power supply module is lower and the manufactured power supply module has good performance of heat transfer. | 03-10-2016 |
20160088736 | INTEGRATION OF EMBEDDED THIN FILM CAPACITORS IN PACKAGE SUBSTRATES - An embedded thin film capacitor and methods of its fabrication are disclosed. The embedded thin film capacitor includes two conductive plates separated by a dielectric layer. In embodiments, the capacitor is enclosed within a package substrate. A method of forming the embedded thin film capacitor includes forming a first insulating layer on a bottom plate and a first trace. A first opening is then formed in a first insulating layer to expose a first region of a bottom plate. An adhesive layer is then formed on the first insulating layer and on top of the exposed first region of the bottom plate. A second opening is formed through the insulating layer and the first insulating layer to expose a second region of the bottom plate. A top plate is formed within the first opening and a via is formed within the second opening. | 03-24-2016 |
20160088737 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - An electronic device includes a resin layer, a conductive layer buried in the resin layer, an electronic part buried in the resin layer, and a wiring layer arranged on the resin layer, the wiring layer including wiring and an opening, the wiring being connected electrically to the conductive layer and the electronic part, the opening communicating with the conductive layer. | 03-24-2016 |
20160091746 | DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME - A display panel includes a display panel having a curved shape and a printed circuit hoard (PCB). At least one carrier connects the display panel and the PCB. At least one driving integrated circuit (driving IC) is disposed on each carrier. Each carrier includes a body and at least one connector extending from the body. Each connector is spaced apart from each other connector. | 03-31-2016 |
20160100494 | THERMAL STABILIZATION OF TEMPERATURE SENSITIVE COMPONENTS - An enclosure for thermally stabilizing a temperature sensitive component on a circuit board is provided. The enclosure comprises a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted. The first cover section includes a first lid, and at least one sidewall that extends from a perimeter of the first lid. The enclosure also comprises a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section. The second cover section includes a second lid, and at least one sidewall that extends from a perimeter of the second lid. The first and second cover sections are configured to releasably connect with the circuit board. | 04-07-2016 |
20160120032 | PACKAGE FRAME AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME - A package frame includes a plurality of unit regions disposed on one surface of the package frame, a peripheral region surrounding the unit regions on the one surface, and a wrinkled structure disposed on the one surface in the peripheral region. A first surface of the wrinkled structure extends from the one surface and is disposed at a different level than the one surface. Each of the unit regions includes a plurality of conductive pads. | 04-28-2016 |
20160126487 | DISPLAY DEVICE - A display device includes a first substrate, a second substrate that covers the first substrate, a sealing member between the first and second substrates, the sealing member bonding the first and second substrates to each other, and one or more heating parts between the first substrate and the sealing member to apply heat to the sealing member during a sealing process of bonding the first and second substrates to each other. | 05-05-2016 |
20160128199 | BUILT-IN-ELECTRONIC-COMPONENT SUBSTRATE AND MANUFACTURING METHOD THEREFOR - A built-in-electronic-component substrate includes a core substrate, an electronic component mounted on one main surface of the core substrate via a joining member, and a resin layer including the electronic component embedded therein. The electronic component is a multilayer ceramic capacitor including a ceramic multilayer body, and a first outer electrode including an end surface portion and a second outer electrode including an end surface portion provided on end surfaces of the ceramic multilayer body. A first gap is provided between the resin layer and the end surface portion of the first outer electrode and the joining member and a second gap is provided between the resin layer and the end surface portion of the second outer electrode and the joining member. | 05-05-2016 |
20160128218 | Printed Circuit Board - A main printed circuit board, called a motherboard, of a payment terminal is provided on which a plurality of components is assembled. The components are assembled on the motherboard according to the height of the components so that the components of greater height are situated at a first end of the board and the components of smaller height are situated at a second end of the board. | 05-05-2016 |
20160128219 | APPARATUS AND METHOD FOR UTILIZING COMMERCIAL OFF THE SHELF CIRCUIT BOARDS IN A HIGHLY KINEMATIC ENVIRONMENT - A system is disclosed which utilizes a stabilization disk | 05-05-2016 |
20160150637 | DEVICE KIT AND METHOD FOR ABSORBING LEAKAGE CURRENT - The present invention relates to a kit devise, and method for absorbing leakage current in an electronic circuit including at least one switch and at least one load by using an absorbing device, an absorbing material or an absorbent marking device, wherein the absorbent marking device is configured to mark or attach an absorbing material on the circuit or on the load. | 05-26-2016 |
20160157338 | PRINTED WIRING BOARD AND METHOD OF PRODUCING THE SAME | 06-02-2016 |
20160157372 | ELECTRONIC DEVICE | 06-02-2016 |
20160165730 | INPUT OUTPUT FOR AN INTEGRATED CIRCUIT - A three-dimensional integrated circuit including a first layer and a second layer electrically coupled to the first layer and disposed in a stacked relationship relative to the first layer. Logic circuitry is embodied in the first layer and input output circuitry of an input output circuit is embodied in the second layer. | 06-09-2016 |
20160174362 | APPARATUS, SYSTEM AND METHOD TO PROTECT SIGNAL COMMUNICATION INTEGRITY | 06-16-2016 |
20160174367 | CONTROLLED TRANSFORMATION OF NON-TRANSIENT ELECTRONICS | 06-16-2016 |
20160174373 | CABLE FOR ALTERNATIVE INTERCONNECT ATTACHEMENT | 06-16-2016 |
20160174383 | CONDUCTIVE SUBSTRATE AND MANUFACTURING METHOD THEREOF | 06-16-2016 |
20160177182 | FIRE-RESISTANT PRINTED CIRCUIT BOARD ASSEMBLIES | 06-23-2016 |
20160183381 | Electronic Component and Overmolding Process | 06-23-2016 |
20160205767 | NOVEL HIGH SPEED SIGNAL ROUTING TOPOLOGY FOR BETTER SIGNAL QUALITY | 07-14-2016 |
20160205770 | CROSSTALK REDUCTION IN ELECTRICAL INTERCONNECTS | 07-14-2016 |
20160255724 | ELECTRICAL CONNECTION MATERIAL | 09-01-2016 |
20160381798 | PEDESTAL MOUNTING OF SENSOR SYSTEM - Examples related to the incorporation of a sensor into an electronic device are disclosed. One example provides a system including a circuit board comprising a first side and a second side opposite the first side, a sensor housed in a package bonded to the first side of the circuit board, and a mounting pedestal coupled to the circuit board on the second side at a location opposite the package, the mounting pedestal configured to be mounted to a surface in an electronic device. | 12-29-2016 |
20160381842 | MODULAR RADIO FREQUENCY SHIELDING - In an embodiment, a modular RF shielding is disclosed. According to an embodiment, a device is disclosed comprising: at least one radio frequency shielding block including: an electrically conductive wall configured to radio frequency shielding; an electrically conductive portion of a ceiling, wherein the portion of the ceiling is connected to the wall; at least one support element, or the shape of the modular block itself, is extending transversely from the wall and configured to uphold the wall, wherein the support element is configured to rest against a portion of a printed circuit board and a length of the support element is shorter than a length of the block; wherein the wall is configured next to an electrical component of the printed circuit board and wherein the electrical component is configured at least partly beneath the portion of the ceiling. Other embodiments relate to a mobile device and a manufacturing method for the modular RF shielding. | 12-29-2016 |
20170238415 | THREE-DIMENSIONAL CIRCUIT SUBSTRATE AND SENSOR MODULE USING THREE-DIMENSIONAL CIRCUIT SUBSTRATE | 08-17-2017 |
20180024281 | HEAT-INSULATION MATERIAL AND PRODUCTION METHOD THEREOF | 01-25-2018 |
20190148078 | Devices Comprising A Capacitor And Support Material That Laterally Supports The Capacitor | 05-16-2019 |
20190150288 | Circuit Board Structure | 05-16-2019 |
20220137764 | FORCE SENSING DOME SWITCH - The force sensing dome switch is configured to simultaneously, or nearly simultaneously, close or open two separate circuits. For one of these circuits, the force sensing dome switch acts as a variable resistor whose value is controlled by applied force. Each force sensing dome switch is disposed upon a printed circuit board (PCB) comprising two separate circuits. An example force sensing dome switch comprises: a conductive dome in conductive contact with a first trace of a first circuit, the conductive dome is configured to make conductive contact with a second trace of the first circuit when pressed down; and a force-sensing resistor element positioned between the PCB and the conductive dome, the force-sensing resistor element overlays a pair of interdigitated traces of a second circuit and is configured to conductively connect the pair of interdigitated traces when pressed against the PCB by the conductive dome. The force-sensing resistor element is a layer of material whose resistance changes when force is applied. | 05-05-2022 |