Class / Patent application number | Description | Number of patent applications / Date published |
361777000 | By specific pattern on board | 42 |
20080266826 | ASSEMBLABLE SUBSTRATE FOR IN-LINE PACKAGE AND ASSEMBLY WITH SAME - An exemplary assemblable substrate for an SIP includes a substrate and a group of welding pads. The substrate defines a receiving portion therein for receiving a line of pins of the SIP. The group of welding pads is formed on the substrate for electrically coupling the line of pins to the substrate; the group of welding pads being distributed around the receiving portion, two welding pads corresponding to two adjacent pins in the same line being distributed on opposing sides of the receiving portion. | 10-30-2008 |
20080291651 | PASSIVE ALTERABLE ELECTRICAL COMPONENT - A passive electrical component is described including a substrate, at least a first, second and third electrically conductive pad, each disposed on the substrate and at least a first electrical device fixedly attached to the first pad and the second pad. The first electrical device is electrically connected to the first and second pads. The third pad is devoid of electrical connection to either the first or the second pads. The component is recognizable by both a Computer Aided Design program and an automated component assembly machine. | 11-27-2008 |
20080310133 | Printed wiring board - The present invention is to provide a printed wiring board which can certainly prevent damage of conductive pattern caused by the terminal. The printed wiring board has a board, a conductive pattern, a through-hole and a non-conductive area. A lead wire of resistance mounted on the printed wiring board is inserted into the through-hole | 12-18-2008 |
20090141465 | ELECTRONIC APPARATUS AND CIRCUIT BOARD - According to one embodiment, a circuit board carries thereon a connection pattern for the connection of a PC card receptacle selectively mounted in a mounting area, a connection pattern for the connection of an Express card receptacle, and a connection pattern for the connection of a smartcard receptacle. An end portion of the smartcard receptacle overlaps the connection pattern for the Express card receptacle. Therefore, the smartcard receptacle is connected to the connection pattern for the smartcard receptacle through a flexible printed wiring element and a connector with the connection pattern shifted to a position between the two connection patterns. | 06-04-2009 |
20090147489 | STRUCTURE FOR MOUNTING FEEDTHROUGH CAPACITORS - In a structure for mounting a first feedthrough capacitor and a second feedthrough capacitor on a mounting surface of a substrate, the first and second feedthrough capacitors are disposed so as to be substantially parallel and to face each other in their partial regions, and a current in the partial region of the first feedthrough capacitor flows in a direction opposite to that in the partial region of the second feedthrough capacitor. | 06-11-2009 |
20090231822 | DEVICE, IN PARTICULAR INTELLIGENT POWER MODULE WITH PLANAR CONNECTION - The invention relates to a device ( | 09-17-2009 |
20090237902 | MULTILAYER PRINTED WIRING BOARD AND ELECTRONIC DEVICE USING THE SAME - The invention provides a multilayer printed wiring board including: a power supply wiring layer and a ground wiring layer provided so as to oppose each other via an insulation layer; mounted integrated circuits; and decoupling capacitors mounted in proximity to the integrated circuits and connected between the power supply wiring layer and the ground wiring layer to absorb noise from the integrated circuits. The power supply wiring layer includes through holes for connecting the decoupling capacitors to the power supply wiring layer and has a polygonal form formed by straight lines which link some of the through holes. | 09-24-2009 |
20100027229 | PRINTED WIRING BOARD AND CONNECTION CONFIGURATION OF THE SAME - A printed wiring board having an insulating base material; a wiring formed on at least one surface of the insulating base material, the wiring forming a predetermined circuit pattern; a first connection terminal portion formed on the surface and electrically connected to the wiring, the first connection terminal portion having a first width; a second connection terminal portion formed on the surface and electrically connected to the wiring, the second connection terminal portion having a second width; and a cover layer configured to cover the wiring and expose the first and the second connection terminal portion. | 02-04-2010 |
20100039784 | PRINTED CIRCUIT BOARD - A power source terminal and a ground terminal for a semiconductor integrated circuit are connected to a conductor pattern through a capacitor. The conductor pattern is connected, through a filter, to a plane conductor connected to neither a ground plane nor a power source plane. Thus, a common mode noise arising from between the power source and the ground is caused to flow into the plane conductor. This reduces the common mode noise flowing in the ground and the power source of the printed wiring board, which relatively act as antennas. | 02-18-2010 |
20100046186 | CIRCUIT BOARD STRUCTURE COMPRISING AN ELECTRICAL COMPONENT AND A METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE COMPRISING AN ELECTRICAL COMPONENT - A circuit board structure and a method for manufacturing a circuit board structure comprising an electrical component. The method comprises the steps of fabricating a conductive pattern on the surface of an essentially plane-like layer on the back side of the plane-like layer, and forming an electrical contact between at least one electrical component and the conductive pattern. The method further comprises the steps of attaching at least one electrical component to the back side of the plane-like layer after the fabrication of the conductive pattern, molding encapsulation material on the back side of the plane-like layer so that the encapsulation material at least partly encloses the at least one electrical component attached to the back side of the plane-like layer, and forming holes through the conductive pattern at positions where terminals of the electrical components attached to the back side of the plane-like layer become positioned when the electrical component is attached to the circuit board structure. | 02-25-2010 |
20100103637 | Printed Circuit Board And Probe Therewith - Disclosed herein are a printed circuit board (PCB) and a probe including the same. The probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer. | 04-29-2010 |
20100110650 | Soldering Strategies for Printed Circuit Board Assemblies - Disclosed herein is a method for forming solder joints including providing a printed circuit board having a first outer surface, a second outer surface opposite the first outer surface, and a plurality of conductive interconnect traces. The printed circuit board supports on the first outer surface at least one electronic component having a plurality of leads, and further includes a plurality of through-hole clusters. Each through-hole cluster is associated with a single lead and includes a central hole portion surrounded by a plurality of other hole portions. A plurality of solder joints is formed by subsequently moving the printed circuit board over a wave soldering tank filled with solder. Each solder joint is formed between a respective lead inserted in the central hole portion of a respective through-hole cluster and a corresponding one of the plurality of conductive interconnect traces. Each solder joint is formed by solder which is wicked up by the through-hole cluster to extend from the second surface to the first surface. | 05-06-2010 |
20100128451 | MULTILAYERED PRINTED CIRCUIT BOARD - A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to the first surface layer, a main power supply wiring layer, and a ground layer between the first and second surface layers. In the multilayered printed circuit board, one terminal of the bypass capacitor is connected to a midpoint of a wiring path from the main power supply wiring layer to a power supply terminal of the semiconductor integrated circuit, and an impedance of a first wiring path from the main power supply wiring layer to the terminal of the bypass capacitor is higher than an impedance of a second wiring path from the terminal of the bypass capacitor to the power supply terminal of the semiconductor integrated circuit. | 05-27-2010 |
20100149771 | Methods and Apparatus for Flexible Mounting of Light Emitting Devices - LED mounting arrangements are described which provide flexibility for LED users to mount a first LED having different physical, electrical, thermal, or other characteristic footprints from those for a second LED on a mounting pad designed for the second LED. With such arrangements, migration from one LED to another can be facilitated without the need for redesigning the printed circuit board for a lighting application. Flexibility is thereby provided to LED customers. | 06-17-2010 |
20100157557 | CONDUCTIVE WIRE PATTERN AND METHOD OF MONITORING THE BONDING ERROR OF A FILM - A conductive line pattern of a pad area includes a plurality of terminals arranged side by side. Each terminal includes an opening portion with a side edge and a line portion connecting with the side edge of the corresponding opening portion. The relative position of each line portion and the corresponding opening portion varies according to the location of the terminal in the pad area. | 06-24-2010 |
20100157558 | Sensor device for occupant protection system - A sensor device includes a communication line having a high-level line and a low-level line, and printed wiring layers. The printed wiring layers are connected to the communication line so as to have a differential communication with an electronic control unit of an occupant protection system. First and second layers are ungrounded, and have a low-level conduction pattern connected to the low-level line and a circuit element having a standard corresponding to the low-level line. Third printed wiring layer is arranged between the first and second layers through insulations, and has a high-level conduction pattern connected to the high-level line. | 06-24-2010 |
20100177491 | ORIENTATION-TOLERANT LAND PATTERN AND METHOD OF MANUFACTURING THE SAME - A land pattern, a method of manufacturing a printed circuit board (PCB) and a PCB incorporating a land pattern. In one embodiment, the land pattern includes: (1) a quadrilateral component outline area having diagonally opposed first and second corners and diagonally opposed third and fourth corners, defined according to a body configuration of a particular component type and located on a surface of a substrate and (2) first and second exposed conductive pads located within said area respectively proximate said first and second corners, coupled to respective first and second circuit conductors of said substrate, configured according to a terminal configuration of said type and separated from said third and fourth corners such that a component of said particular component type may be placed on the land pattern in multiple orientations without causing a short circuit. | 07-15-2010 |
20100202124 | CIRCUIT BOARD MOUNTING STRUCTURE OF COMPOUND CIRCUIT - A structure for mounting a compound circuit on a circuit board is provided. The compound circuit includes a high voltage circuit and a low voltage circuit whose supply voltages are different from each other. The structure includes: a main circuit board on which constituents of the low voltage circuit are mounted; and a hybrid IC which includes a sub circuit board on which at least a part of constituents of the high voltage circuit is mounted and a moisture preventing agent coating the sub circuit board, and is arranged over the main circuit board. Both an insulation distance between terminals provided on the main circuit board for connecting to the hybrid IC and an insulation distance between terminals provided on the hybrid IC for connecting to the main circuit board are larger than a minimum insulation distance between terminals provided on the constituents mounted on the sub circuit board. | 08-12-2010 |
20110228502 | ACTIVE DEVICE ARRAY SUBSTRATE AND FABRICATING METHOD THEREOF - An active device array substrate has at least one patterned conductive layer. The patterned conductive layer includes a copper layer. A cross-section of the copper layer which is parallel to a normal line direction of the copper layer includes a first trapezoid and a second trapezoid stacked on the first trapezoid. A base angle of the first trapezoid and a base angle of the second trapezoid are acute angles, and a difference between the base angle of the first trapezoid and the base angle of the second trapezoid is from about 5° to about 30°. | 09-22-2011 |
20110279990 | PRINTED BOARD AND ELECTRONIC EQUIPMENT INCORPORATING THE PRINTED BOARD - A printed board includes footprints which are electrically solder-bonded to a surface-mounting substrate, on which electronic components are mounted, and which assists the heat release from the surface-mounting substrate. The footprint comprises a fillet-forming division which is placed on an outer-edge side of the surface-mounting substrate and where solder is supplied independently when solder-bonding is performed. The fillet-forming division is solder-bonded to the same electrode as the electrode of the surface-mounting substrate to which the footprint is solder-bonded. | 11-17-2011 |
20120127682 | PROTECTIVE CIRCUIT MODULE - A protection circuit board is disclosed. The protection circuit board includes a main printed circuit board and an auxiliary printed circuit board. In the auxiliary printed circuit board, a thermistor is electrically interposed between an external electrode terminal and auxiliary electrodes. | 05-24-2012 |
20120170239 | FIELD BARRIER STRUCTURES WITHIN A CONFORMAL SHIELD - In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures. | 07-05-2012 |
20120229998 | DIFFERENTIAL TRANSMISSION CIRCUIT, OPTICAL MODULE, AND INFORMATION PROCESSING SYSTEM - A differential transmission circuit includes a pair of transmission line conductors and a ground conductor layer, wherein the pair of transmission line conductors include a first straight line region where both the pair of transmission line conductors extend in parallel to each other in a first direction with a first width in a first layer, a first cross region where one of the pair of transmission line conductors is formed in the first layer, the other thereof is formed in a second layer, and the pair of transmission line conductors cross the each other in a three-dimensional manner, the first cross region being disposed on the front side of the first straight line region, and wherein each of the widths of the pair of transmission line conductors in the first cross region is smaller than the first width. | 09-13-2012 |
20120268908 | PRINTED CIRCUIT BOARD AND PROBE THEREWITH - Disclosed herein arc a printed circuit board (PCB) and a probe including the same. The probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer. | 10-25-2012 |
20120281378 | Split Electrical Contacts in an Electronic Assembly - An electronic device is disclosed for coupling to a target platform, which includes a multitude of pad contacts. The electronic device includes a substrate, a multitude of pad contacts on the substrate, and a multitude of contact regions in one of the of pad contacts on the substrate. Each of the multitude of pad contacts on the substrate electrically couples to a corresponding one of the multitude of pad contacts on the target platform when the substrate and the target platform are assembled. The multitude of contact regions corresponds to one of the multitude of pad contacts on the target platform when the substrate and the target platform are assembled. | 11-08-2012 |
20130003333 | ELECTRONIC DEVICE, WIRING BOARD, AND METHOD OF SHIELDING NOISE - A wiring board includes a metal cap pad that is arranged so as to surround a mounting position of an electronic component and is connected to an end portion of a metal cap, a power source plane that is connected to the electronic component through a connection member and has a gap, a ground plane that is connected to the electronic component through a connection member, and a plurality of conductive body elements that are repeatedly arranged so as to surround the connection members and the gap. The power source plane and the ground plane extend so as to include at least a part of an area that is surrounded by the plurality of conductive body elements and at least a part of an area facing the plurality of conductive body elements. | 01-03-2013 |
20130010445 | REDUCED WIRING REQUIREMENTS WITH SIGNAL SLOPE MANIPULATION - An information handling system device includes a plurality of electronic components; an electric circuit including at least one trace for connecting two or more of the plurality of electronic components and transmitting data between the plurality of electronic components via at least one electric signal; and a substrate including an insulating material for serving as a base for the electric circuit, wherein each of the at least one electric signal transmitted between the plurality of electronic components is transmitted utilizing slope manipulation by manipulating each of the at least one electric signal to provide a slope substantially proportional to a discrete integer data value of n discrete integer data values, n being a positive integer greater than or equal to 3, said discrete integer data value represented by using one of n distinct slopes transmitted utilizing a particular reference voltage of n predetermined reference voltages. | 01-10-2013 |
20130033838 | SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS - A substrate includes: a base; and a plurality of bonding terminals arranged on at least one surface of the base, wherein the plurality of bonding terminals include a first bonding terminal and a second bonding terminal, the first bonding terminal and the second bonding terminal include, in plan view of the base, a circle contacting portion extending along the circumference of a circle tangent to the first bonding terminal and the second bonding terminal, all of the plurality of bonding terminals are arranged so as not to protrude from an area including the circle and the inside thereof, and the circle contacting portion includes at least a first circle contacting portion disposed in the first bonding terminal and a second circle contacting portion disposed in the second bonding terminal. | 02-07-2013 |
20130170166 | SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD, IN PARTICULAR FOR MEMS DEVICES - A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described. | 07-04-2013 |
20130322041 | PRINTED CIRCUIT BOARD ASSEMBLY AND SOLDER VALIDATION METHOD - A solder validation method for a printed circuit board (PCB) having a pin hole extending through the PCB, an electrically conductive trace on a surface of the PCB, and an electrically conductive pin inserted through the pin hole includes the following. An electrically non-conductive portion is provided on the surface of the PCB between the pin hole and the trace such that the non-conductive portion electrically isolates the pin from the trace. After a soldering process intended to solder the pin and the trace together, a soldered connection between the pin and the trace is detected as being absent when no electrical continuity is between the pin and the trace as a soldered connection between the pin and the trace has to be present to provide the electrical continuity due to the pin and the trace otherwise being electrically isolated from one another by the non-conductive portion. | 12-05-2013 |
20140071646 | ROUTING DESIGN FOR HIGH SPEED INPUT/OUTPUT LINKS - Certain embodiments relate to routing structures and their formation. In one embodiment a routing structure includes a first region including a first layer comprising alternating signal traces and ground traces separated by a dielectric. The first region also includes a second layer including alternating signal traces and ground traces separated by a dielectric, wherein the second layer signal positioned over the first layer ground traces, and the second layer ground traces positioned over the first layer signal traces. The first region may also include additional layers of alternating signal and ground traces. The first region may also be formed with the ground traces having a width that is larger than that of the signal traces. The routing structure may also include a second region including pads to which the traces are coupled. Other embodiments are described and claimed. | 03-13-2014 |
20140126168 | WIRELESS MODULE - A wireless module includes a first board ( | 05-08-2014 |
20140168923 | DISPLAY PANEL INTEGRATING A DRIVING CIRCUIT - A display panel includes a periphery area, an active display area adjacent to the periphery area and having two opposite sides connecting with the periphery area, a driving chip disposed at the periphery area for driving electrical elements in the active display area, and a plurality of wires electrically connecting the driving chip and the electrical elements in the active display area. The distance from a first part of the wires to the center of the driving chip is farther than the distance from a second part of the wires to the center of the driving chip, and the width of the first part of the wires on a reference line perpendicular to the opposite sides of the active display area is greater than the width of the second part of the wires on the reference line. | 06-19-2014 |
20140185259 | PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING STRUCTURE HAVING SAME - A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts. | 07-03-2014 |
20140301056 | Method and System for Optimizing Routing Layers and Board Space Requirements for a Ball Grid Array Land Pattern - A method, system, and apparatus for optimizing routing layers and board space requirements for a ball grid land pattern is described. A number of required pads is determined. A land pattern to yield the required pads is selected. A number of required perimeter routing channels is determined. A size of the land pattern to yield the required perimeter routing channels is optimized. At least one perimeter edge of the land pattern is under populated. In a further aspect, a number of layers is determined when a substrate has multiple layers. | 10-09-2014 |
20150029690 | FUNCTIONAL DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT - A functional device includes a fixed electrode portion including a first fixed electrode portion and a second fixed electrode portion, a first wiring portion connected to the first fixed electrode portion, and a second wiring portion connected to the second fixed electrode portion. At least one of the first wiring portion and the second wiring portion is provided with a branch portion. One wiring line extending from the branch portion is connected to the fixed electrode portion, and another wiring line extending from the branch portion is provided along the first wiring portion or the second wiring portion. | 01-29-2015 |
20150138743 | WEAVED ELECTRICAL COMPONENTS IN A SUBSTRATE PACKAGE CORE - A substrate package includes a woven fabric having electrically non-conductive strands woven between electrically conductive strands including wire strands, co-axial strands, and/or an inductor pattern of strands. The package may be formed by an inexpensive and high throughput process that first weaves the non-conductive strands (e.g., glass) between the conductive strands to form a circuit board pattern of conductive strands in a woven fabric. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planarized. Planarizing segments and exposes ends of the wire, co-axial, and inductor pattern strands. Since the conductive strands were formed integrally within the planarized woven fabric, the substrate has a high mechanical stability and provides conductor strand based electrical components built in situ in the substrate package. | 05-21-2015 |
20150296611 | LOGIC GATE ARRAY - A logic gate array includes a substrate; an array of first conductive lines with plurality of first gaps disposed on each of the first conductive lines on the substrate wherein the array of first conductive lines is disposed in a first direction; an array of isolation lines over the first conductive lines wherein the isolation lines are not disposed on the first gaps; an array of second conductive lines with plurality of second gaps disposed on each of the second conductive lines on the substrate wherein the array of first conductive lines is disposed in a second direction and wherein orientation of the second direction is oriented is different than the orientation of the first direction; and conductive ink dots printed on at least some of the intersection of the first conductive lines and the second conductive lines by connecting the corresponding first gaps and corresponding second gaps. | 10-15-2015 |
361778000 | Cross-connected | 1 |
20090122498 | CIRCUIT BOARD AND CONDUCTIVE THROUGH HOLE STRUCTURE THEREOF - A circuit board having at least one through hole and including a first and a second wiring layer, an insulation layer, and a conductive through hole structure is provided. The insulation layer is disposed between the first and second wiring layers. The through hole located in the insulation layer extends from the first wiring layer to the second wiring layer. The conductive through hole structure includes at least one first pad, at least one second pad, and a conductive pattern. The first pad partially covers the edge of one opening of the through hole and connects the first wiring layer. The second pad partially covers the edge of the other opening of the through hole and connects the second wiring layer. The conductive pattern connects the first and second pads and partially covers the sidewall of the through hole. | 05-14-2009 |
361779000 | With specific connection material | 3 |
20080239684 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board including, on a resin insulating layer, an Ni—Cu alloy bonding seed layer constituted by 20 to 75 wt % of Ni and Cu to be a residual part and a wiring layer constituted by Cu formed thereon is provided. It is possible to manufacture the wiring board by (A) forming the Ni—Cu alloy bonding seed layer through a one-time treatment and removing an unnecessary portion through one-time etching after wiring patterning, or (B) forming the Ni—Cu alloy bonding seed layer and a Cu layer thereon and patterning thereof in a lump by etching. A wiring board in which a wiring layer is formed by an Ni—Cu alloy constituted by 20 to 75 wt % of Ni and Cu to be a residual part over a whole thickness of the wiring layer is also provided. | 10-02-2008 |
20080285246 | COMPONENT FIXING METHOD | 11-20-2008 |
20150049450 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - An electronic device includes: a first electronic component; first members that are provided on a first surface of the first electronic component and that include outside surfaces configured to face diagonally upward with respect to the first surface; a second electronic component provided above the first surface; second members that are provided corresponding to the first members on a second surface of the second electronic component which faces the first surface and that include inside surfaces configured to face diagonally downward with respect to the second surface and configured to face the outside surfaces; and solder that is provided between the first surface and the second surface and that electrically connects the first electronic component and the second electronic component. | 02-19-2015 |