Entries |
Document | Title | Date |
20080252774 | CAMERA MODULE WITH CIRCUIT BOARD - A camera module includes an image sensor, a lens module and a circuit board. The lens module is disposed at an object side of the image sensor and has a plurality of electrical connection points thereon. The circuit board includes a main body and a bent portion electrically connecting with the main body. The image sensor is mounted on the main body and received between the lens module and the main body. The bent portion extends from a side surface of the main body and a plurality of electrical connection points is formed on the bent portion corresponding to the electrical connection points of the lens module. The electrical connection points of the bent portion are configured for connecting with the electrical connection points of the lens module to supply power to the lens module. | 10-16-2008 |
20080252775 | Camera module and method of manufacturing the same - Provided is a camera module including a housing that is formed in a rectangular box shape and has a cylindrical barrel coupling portion extending upward from the central portion thereof; an image sensor module that is mounted in the housing; a lens barrel that has a lens insertion port provided in the central portion thereof and a housing coupling portion extending downward therefrom, the housing coupling portion being closely coupled to the barrel coupling portion of the housing; a wafer lens that is mounted in the lens insertion port of the lens barrel; and a lens fixing cap that is covered on the upper end portion of the lens barrel. | 10-16-2008 |
20080266447 | Camera module and electronic device including same - A camera module | 10-30-2008 |
20080278621 | Camera module - The present invention relates to a camera module capable of being surface mounted (SMT) on a main substrate. | 11-13-2008 |
20080291322 | Method for the Optical Adjustment of a Camerafield of the Invention - During the assembly of cameras, especially for cameras having imaging optical systems with reduced depth of field, an accurate adjustment of an optical sensor medium relative to the imaging optical system may be necessary. Therefore, a method is provided for optically adjusting a camera in which at least one plastically deformable adjustment element is employed that is plastically deformable by the action of at least one force and/or at least one torque. By deforming this adjustment element, it is possible to alter a placement and/or alignment of the optical sensor medium relative to the imaging optical system so that an optimal image quality is ensured. Because of the stability of the method and the low costs associated with it, the method proposed is also suitable for a serial application. | 11-27-2008 |
20080297651 | OPTICAL APPARATUS HAVING DEVICE FOR REMOVING FOREIGN SUBSTANCE - An optical apparatus includes a rectangular optical member provided on an optical axis, a supporting member configured to support the optical member, and a rectangular vibrating device stuck to the optical member close to and in parallel with one of four sides of the optical member and configured to vibrate the optical member in a wave fashion having a predetermined wavelength to have a plurality of nodes parallel with the one side. A support position at which the optical member is supported by the supporting member at a side opposite the one side of the optical member is located inward from the opposite side by ΒΌ the predetermined wavelength. | 12-04-2008 |
20080303939 | CAMERA MODULE WITH COMPACT PACKAGING OF IMAGE SENSOR CHIP - An exemplary camera module includes a base, an image sensor chip, a lens holder, a lens module, at least one electronic element, and a light transmittance element. The base defines a first cavity. The image sensor chip is disposed on the base and includes a photosensitive area. The image sensor chip covers the first cavity. The lens holder is disposed on the base. The lens holder includes a first chamber and a second chamber disposed on the base. The second chamber covers the image sensor chip. The lens module is partially received in the first chamber. The lens module is optically aligned with the image sensor chip. The at least one electronic element is disposed in the first cavity. The light transmittance element is fixed on the image sensor chip. The light transmittance element is received in the second chamber and contacts the second chamber. | 12-11-2008 |
20090002549 | ELECTRONIC CAMERA - An electronic camera includes an imaging device, a drive printed circuit board, a camera main body, an air inlet, an air outlet, and a cooling fan. The imaging device is located inside the camera main body on the optical axis of an imaging lens attached to the camera main body, and receives light passing through the imaging lens to form an image. The drive printed circuit board includes an imaging control device for controlling the imaging device. The camera main body includes a held portion that is located off the optical axis and configured to be held by an operator, and a monitor on its outer surface. The air inlet and the air outlet are located outside the held portion on the outer surface of the camera main body each on either side of the drive printed circuit board. The cooling fan generates an air flow inside the camera main body from the air inlet to the air outlet through the drive printed circuit board. | 01-01-2009 |
20090015709 | Camera and direction indicating switch - A camera includes a direction indicating switch to specify an arbitrary indicating direction which is attached to a case member. The direction indicating switch has a switch base having a contact point which is capable of abutting intermittently; an operating section held by the switch base to be capable of tilting for tilting for intermittently abutting of the contact point; and a tilt controlling section which controls a tilt of the operating section. The operating section is capable of tilting in a radial direction from a reference position where the contact point is in a nonconductive state. When the operating section is tilted over a predetermined angle from the reference position, the contact point is in a conductive state. The tilt controlling section allows the operating section to tilt over the predetermined angle in a predetermined indicating direction from the reference position and prevents the operating section from tilting over the predetermined angle in a direction different from the predetermined indicating direction from the reference position. | 01-15-2009 |
20090021635 | CAMERA MODULE - A camera module includes a circuit board ( | 01-22-2009 |
20090021636 | IMAGE PICKUP MODULE - An image pickup module is provided. The image pickup module includes a lens, a circuit board, an image sensor, a hollow base, and a lens seat. The image sensor is coupled to the circuit board and includes a housing package portion with a side periphery. The hollow base is disposed on the image sensor. The hollow lens seat is used for housing the lens and is disposed on the hollow base. The hollow lens seat is positioned according to the side periphery of the housing package portion. | 01-22-2009 |
20090033789 | CAMERA MODULE - A camera module includes a lens holder, a lens module, an image sensor chip, and a printed circuit board. The lens module is received in the lens holder. The lens module includes a lens barrel and at least one lens received in the lens barrel. The image sensor chip has a photosensitive area configured for receiving light transmitted through the lens module. The printed circuit board defines a top surface for receiving both the image sensor chip and the lens barrel thereon and an opposite bottom surface thereon. The bottom surface defines a plurality of recesses thereon for receiving the corresponding electronic elements therein by adhesives. | 02-05-2009 |
20090033790 | CAMERA MODULE - A camera module includes a lens holder, a lens module, an image sensor chip, and a PCB defining a step-shaped recess on the upper thereof. The step-shaped recess comprises a first recess formed on an upper portion thereof and a second recess, for receiving a plurality of electrical elements therein, coaxially formed on a lower portion thereof, and a intermediate step surface formed between the first recess and the second recess. A cover plate received in the first recess and attached on the intermediate step surface defines at least one electronic layer therein and an external point formed on the bottom thereof. At least one zero voltage point is formed on the intermediate step surface thereof. The electronic layer is electrically connected to the zero voltage points by the external points, thereby electromagnetic waves generated by the electronic elements are prevented from affecting the image sensor chip. | 02-05-2009 |
20090040368 | IMAGE SENSOR MODULE FOR CAMERA DEVICE - An image sensor module includes a circuit board ( | 02-12-2009 |
20090040369 | LENS BARREL AND IMAGE PICKUP DEVICE THEREFOR - A lens barrel capable of reliably housing a flexible printed circuit board without increasing the number of its component parts and its outer diameter. A guide member is inserted in a through hole of a fixing member and projects from a holding member in a direction opposite to the direction toward the subject when the lens barrel is in a collapsed position. | 02-12-2009 |
20090073309 | DIGITAL CAMERA HAVING PRINTHEAD AND INK SUPPLY - A digital camera is provided having a printhead for printing images digitally captured by the camera, an ink supply for supplying ink to the printhead, and a casing surrounding and encasing the printhead and ink supply so that the ink supply is unable to be accessed without destruction of the casing. | 03-19-2009 |
20090079863 | CAMERA MODULE, MANUFACTURING METHOD OF IMAGING APPARATUS AND HOT MELT MOLDING METHOD - The invention provides a camera module which can make a work for filling up a clearance between a pedestal mount and a circuit board in a post process unnecessary. The invention provides a camera module including a lens unit, an imaging element converting an incoming light formed by the lens unit into an electric signal and a pedestal mount attaching the lens unit thereto and storing the imaging element, in which a lower end portion of a side wall portion of the pedestal mount is provided with a bottom surface portion made of a thermoplastic resin melting at a reflow temperature. | 03-26-2009 |
20090086088 | CAMERA DOOR OPENING AND SHUTTING APPARATUS FOR PORTABLE COMMUNICATION DEVICE - The present invention discloses a camera door opening/shutting apparatus for a portable communication device. The apparatus includes a camera door disposed at a main body to expose or cover a camera lens included in the main body according to a sliding movement of the camera door, and a door sliding part disposed between the main body and the camera door to slidably couple the camera door with the main body. | 04-02-2009 |
20090109326 | CAMERA MODULES - A camera module may include a mount and a barrel coupled to the mount. One of the barrel and the mount may include a polycarbonate material and the other of the barrel and the mount may include a liquid crystal polymer (LCP) material. | 04-30-2009 |
20090109327 | CAMERA MODULE - A camera module includes a lens module, an image sensor, and a circuit board. The image sensor module is disposed in an image side of the lens module. The circuit board is electronically connected with the image sensor module. The circuit board includes a receiving chamber defined therein. The receiving chamber receives the image sensor module. The lens module is mounted on the circuit board and covers the receiving chamber. The image sensor module is fixed in the receiving chamber that is defined in the circuit board therein. Therefore, a thickness of the camera module along the axis of the camera module is decreased and a volume of the camera module becomes thinner compare with the conventional camera module. | 04-30-2009 |
20090109328 | Camera module package - There is provided a camera module package. A camera module package according to an aspect of the invention includes a bonding unit at an inner surface of a housing including an optical system and a filter adhered to the bonding unit by an adhesive. Here, the bonding unit corresponding to the filter has a longitudinal central region corresponding to a gate and an overflow unit of a runner hardening unit provided when the housing is injection molded, and left and right regions while the longitudinal central region has a smaller surface height than each of the left and right regions, and the adhesive provided between the bonding unit and the filter has a predetermined thickness so that maximum thermal stress generated in the housing has a relatively smaller value than adhesive strength of the adhesive. | 04-30-2009 |
20090109329 | Data connector for an electronics device - One embodiment of the invention sets forth a hand-held electronics device for recording digital video that includes a housing, a processor disposed within the housing, and a data connector coupled to the processor such that data can be transmitted to and from the processor through the data connector. The data connector includes an arm rotationally coupled to the housing, and an adapter portion matable with a corresponding adapter of a computer system. The data connector forms a portion of a top part or a bottom part of the housing when in a retracted position. Among other things, the disclosed hand-held electronics device advantageously enables a user to easily, with one hand, hold the hand-held electronics device and slide the trigger with a thumb or other finger to release the data connector into the extended position. | 04-30-2009 |
20090109330 | Case member, sensor module, and electronic information device - A case member has a predetermined surface and a sealable inside, where a first circular area for passing light is provided at the center portion of the predetermined surface, a double-sided light shielding sheet, which is provided with a second circular area for passing light at the center, is adhered to the predetermined surface such that the second circular area is positioned in a concentric circle manner to the first circular area, the second circular area having a diameter smaller than the diameter of the first circular area, a transparent dustproof film is adhered on the light shielding sheet. | 04-30-2009 |
20090115891 | CAMERA MODULE - Provided is a camera module providing EMS shielding, so that electromagnetic waves generated in the camera module are prevented from radiating to the outside and external electromagnetic waves or noise are prevented from flowing into the camera module. The camera module includes: a lens unit comprising at least one lens; an image sensor package including an image sensor chip having an image area where an image is formed in response to light passing through the lens unit; a housing surrounding the lens unit and the image sensor package, wherein the housing is electrically connected to the image sensor package and is formed of a conductive material; and a connection terminal disposed below the image sensor package and electrically connecting the image sensor package and a main board of an electronic device including the camera module. | 05-07-2009 |
20090135297 | CAMERA MODULE - An exemplary camera module includes a substrate, a printed circuit board, an imaging sensor chip, and a lens module. The substrate defines a top surface and a recessed portion in the top surface. The printed circuit board defines a bottom surface soldered to the top surface of the substrate. The imaging sensor chip is received in the recessed portion of the substrate. The lens module is positioned above the imaging sensor chip, with an optical center thereof aligned with that of the imaging sensor chip. | 05-28-2009 |
20090135298 | DIGITAL CAMERA - A digital camera of the present invention has: an optical housing having a bending optical system for reflecting photographic object light entering along a first optical axis to a second optical axis direction perpendicular to the first optical axis to form an image on an image pickup device; a camera main body having a containing portion for containing the optical housing slidably only in the second optical axis direction and having support portions for supporting the optical housing provided on each of both side surfaces of the containing portion across the second optical axis of the bending optical system; and shock absorbing means provided between an inner surface of the containing portion of the camera main body in which the support portions are not provided and an outer surface of the optical housing facing thereto. | 05-28-2009 |
20090141165 | Solid-state image pickup apparatus, method of manufacturing the same, and electronic device including the same - In a solid-state image pickup apparatus | 06-04-2009 |
20090147127 | LENS HOOD DEVICE, AND IMAGE PICKUP DEVICE USING THE SAME - A lens hood device includes a barrier case ( | 06-11-2009 |
20090147128 | Digital photographing apparatus - A digital photographing apparatus is provided that has a reduced number of elements as compared to conventional arrangements and can thus be manufactured through a simple process with low manufacturing costs. The digital photographing apparatus includes a main printed circuit board to which an imaging device converting energy of incident light into electrical signals is directly attached. The digital photographing apparatus also includes an optical tube unit connected to the main printed circuit board and forming an image in the imaging device by receiving an external image. A first contact formed at a surface of the optical tube unit is directly in contact with a second contact formed at a surface of the main printed circuit board. | 06-11-2009 |
20090161006 | Image sensor, method of manufacturing the same, and camera module having the same - Provided is an image sensor module including a lower substrate having a plurality of top pads formed on the top surface thereof; an upper substrate that is installed along the edge of the top surface of the lower substrate and has a plurality of connection grooves formed on the inner side surface thereof, each connection groove having a side pad corresponding to each of the top pads of the lower substrate; an image sensor installed on the top surface of the upper substrate; and a connection element that electrically connects the top pads and the side pads. | 06-25-2009 |
20090190025 | Image-capturing module and manufacturing method thereof - An image-capturing module and a manufacturing method thereof are provided. The image-capturing module includes a circuit board, an electric element, a lens set and a carrier. The circuit board has at least a locking hole. The electric element is disposed on the circuit board. The carrier is disposed on the circuit board for carrying the lens set. The carrier has at least a hook locking at the locking hole of the circuit board. | 07-30-2009 |
20090201414 | Solid Image capture device and electronic device incorporating same - A solid image capture device | 08-13-2009 |
20090213264 | MOBILE ENTERTAINMENT AND COMMUNICATION DEVICE - A mobile communication device in a palm-held size housing has a cellular or satellite telephone capable of wireless communication with the Internet and remotely located telephones. The device includes one or more replaceable memory card sockets for receiving a blank memory card for recording data directly from the Internet and, in particular, musical performances that then can be selectively reproduced by the device for the enjoyment of the user, including both audio and visual recordings and reproductions. The device also includes a camera and microphone for recording images and sound within the range of the device that can be wirelessly transmitted, either selectively or automatically to a remote telephone. Further, the device includes sensors for sensing unusual conditions that may also be transmitted to a remote telephone, together with the location of the device as determined by a GPS section of the device. Still further the device includes a connectable stethoscope for detecting and transmitting sounds from the chest of a user to a remote location. | 08-27-2009 |
20090244363 | Video Camera - In a video camera, air outlet holes and air inlet holes are disposed in a panel-facing surface of a camera body. A duct is disposed inside the camera body and guides the air taken in through the air inlet holes to the air outlet holes. A first heat sink is so arranged as to extend from an image sensor into the duct, and the first heat sink releases the heat generated by the image sensor into the duct. A liquid crystal panel unit is movably disposed between a first position in which a first face of the liquid crystal panel unit including a display screen of a liquid crystal panel faces the panel-facing surface of the camera body and a second position in which a second face faces the panel-facing surface. When the liquid crystal panel unit is in the first position, the first face is so formed as to cover the air outlet holes and the air inlet holes. The second surface of the liquid crystal panel unit is formed so that the air outlet holes and the air inlet holes are open to the exterior when the liquid crystal panel unit is in the second position. | 10-01-2009 |
20090295986 | CAMERA LENS ACTUATION APPARATUS - A camera lens actuation apparatus for driving motion of a camera lens supported on a support structure by a suspension system. The apparatus incorporates a subassembly comprising SMA wire connected to at least one mounting member which is mounted to the support structure. At least one pair of lengths of SMA wire are held in tension between the camera lens element and the support structure at respective acute angles to the optical axis applying a tensional force having a component along the optical axis. The lengths of SMA wire in the pair are held at angle as viewed along the optical axis. There may be plural pairs with a balanced arrangement in which the forces generated have no net component perpendicular to the optical axis and generate no net torque around any axis perpendicular to the optical axis. A control circuit controls heating of the SMA wire in response to a measure of its resistance. | 12-03-2009 |
20100002129 | ELECTRONIC DEVICE HAVING MULTIPLE CAMERA MODULES - An exemplary electronic device includes a lower housing having a mounting panel, a first camera module mounted to the mounting panel, a sliding member mounted to the lower housing, a second camera module mounted to the sliding member, and two hinge assemblies fixed to the sliding member. The first camera module is configured to be covered by the sliding member. The second camera module is configured to be covered by the mounting panel. The hinge assemblies are configured to make the sliding member slidable relative to the lower housing to expose the first camera module and the second camera module out from the sliding member and the mounting panel, respectively, and enable the sliding member rotatably relative to the lower housing. | 01-07-2010 |
20100013985 | CAMERA MODULE - An exemplary camera module includes a barrel, a holder engaged with the barrel, a first lens received in the barrel, an image sensor received in the holder and a second lens received in the holder. The holder includes an inner chamber. The second lens is mounted on the holder proximate to the image sensor. The second lens is configured for preventing dust accessing into the inner chamber. The second lens includes a main body and an infrared cut film formed on and in contact with an outside surface of the main body or embedded within the main body. | 01-21-2010 |
20100039553 | Camera module - The present invention relates to a camera module including a substrate; a housing which is coupled to the substrate and includes a support unit extended to an inside of a lower part and a shaft insertion groove at one side of the support unit; a guide shaft vertically coupled inside the housing by inserting a lower end portion into the shaft insertion groove; a conductive pattern extended from a lower end portion of the housing to a bottom surface of the support unit; an image sensor closely coupled to the bottom surface of the support unit by being electrically connected to the conductive pattern; a lens barrel fixed to an upper part of the housing by coupling a lens inside; and a movable lens barrel vertically moved along the guide shaft by mounting lens inside. | 02-18-2010 |
20100045855 | CAMERA APPARATUS AND ELECTRONIC DEVICE PROVIDED WITH THE SAME - A camera apparatus ( | 02-25-2010 |
20100053423 | Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly - A disclosed method of manufacturing a camera module includes providing a stack of optical elements, providing an integrated circuit image capture device (ICD) having a top surface with an array of sensors, rigidly attaching the stack of optical elements to top surface of the image capture device, providing a substrate having an opening therethrough and a recess around said opening, and attaching the image capture device to the substrate such that edges of the image capture device are disposed in the recess and the stack of optical elements extends through the opening. The method further includes providing a second substrate (e.g., host PCB) and mounting the substrate on the second substrate to attach the camera module to the host device. Optionally, the substrate is mounted to the second substrate via a reflow solder process. | 03-04-2010 |
20100085474 | CAMERA MODULE - A camera module has a sensor unit holding an image sensor and a lens unit holding a taking lens. The sensor unit and the lens unit are joined in such a manner that an imaging plane of the image sensor is orthogonal to an optical axis of the taking lens. Each of top and bottom surfaces of the lens unit has a pair of held members to be held by holding jigs. This held member is a depression of triangular cross section defined by a bottom face that inclines toward rear surface of the lens unit. Each held member contains a positioning member that receives a pin jig when the position and angle of the sensor unit is adjusted relative to the lens unit. | 04-08-2010 |
20100091179 | Module Connector - The module connector can accommodate a miniaturized module such as a camera module and reliably fix the module in an electrically connected state, and make the connector itself in lower profile. With this connector ( | 04-15-2010 |
20100110282 | CAMERA LENS MODULE AND MANUFACTURING METHOD THEREOF - The present invention discloses a camera lens module. The present invention places and fixes an image sensor chip in an opening in a substrate and then assembles a frame, a lens holder and a lens, thereby minimizing the superposition height of the camera lens module and ensuring that the assembly is simpler and more effective. | 05-06-2010 |
20100110283 | CAMERA LENS MODULE-INTEGRATED SPEAKER ASSEMBLY - A camera lens module-integrated speaker assembly is provided, which includes a speaker housing, a camera lens module mounted through a center of the speaker housing, and a speaker module surrounding the camera lens module along an outer circumference of the camera lens module. | 05-06-2010 |
20100110284 | COMPRESSIBLE ZOOM CAMERA - A device includes a housing capable of forming an internal space during operation of the device. The device also includes a camera having an optical zoom portion provided within the housing. The optical zoom portion is capable of expanding into the internal space when the camera is in use. | 05-06-2010 |
20100118182 | CAMERA MODULE MANUFACTURING METHOD AND CAMERA MODULE - It is possible to provide a camera module manufacturing method and a camera model which can improve performance of a camera module without complicating the manufacturing method. A light shield is formed on the side surface of each lens body ( | 05-13-2010 |
20100141830 | CAMERA MODULE AND PORTABLE ELECTRONIC DEVICE USING SAME - A camera module and a portable electronic device using same are provided. The camera module can be rotated to align with a first camera window and a first aperture in the front of the portable electronic device or a second camera window and second aperture in the rear of the portable electronic device. | 06-10-2010 |
20100149408 | ACCESSORY AND ACCESSORY FOR IMAGE PICKUP APPARATUS - An accessory and an accessory for an image pickup apparatus are provided and are advantageous in reducing cost by reducing the number of parts. A retaining ring is engaged in an annular groove formed in an outer circumference of a cylindrical part of a wide-angle converter lens. Each of retaining ridges has a bottom wall extending from the inner circumference of the annular part in the direction of the width of the annular part in a recess, and a protruded wall extending radially outward of the annular part from the end of the bottom wall, spaced from the annular part, and protruding radially outward from the first outer circumference. When the parts, provided with the retaining ridges, of the annular part are depressed radially inward of the annular part, the protruded wall sink radially inward from the first outer circumference. | 06-17-2010 |
20100149409 | IMAGE SENSOR HOLDER - An image sensor holder includes a frame, first and second slidable holders, first and second driving devices, first and second driving arms, and at least two elastic members. The first slidable holder is slidably mounted on the frame. The second slidable holder is slidably mounted on the first slidable holder. The first and second driving devices are separately mounted on the frame. The first driving arm is mounted on the frame and contacts to the first slidable holder and the first driving device by opposite ends thereof. The second driving arm is slidably mounted on the frame extending from the second slidable holder, and contacts the second driving device by an end thereof. The two elastic members are separately positioned between the first holder and the frame and between the first holder and the second holder. | 06-17-2010 |
20100149410 | ELECTRONIC COMPONENT APPARATUS - An electronic component apparatus includes a wiring board | 06-17-2010 |
20100157143 | Camera module package - A camera module package is disclosed. The camera module package is capable of preventing defects caused by foreign bodies and enhancing product reliability by reducing the time consumed in a packaging process for manufacturing a camera module, and of reducing the size of a package and manufacturing costs by excluding the use of gold wires. | 06-24-2010 |
20100165182 | COMBINATION DEVICE OF SPEAKER AND CAMERA OPTICAL SYSTEM - In the device according to this invention, a vibrating diaphragm and a magnetic conduction plate are improved, so that the vibrating diaphragm of the speaker, under the action of magnetic force excited by different electrical signals, can convert an acoustoelectric signal into voice, can resonate together with a coil, and can be as a movable lens to constitute an optical focusing/zooming system together with lens of the camera optical system, respectively, so that the space of the mobile terminal occupied by the combination device can be saved, and the sound quality of the speaker also can be improved. | 07-01-2010 |
20100165183 | CAMERA MODULE - An camera module includes a substrate, an image sensor chip, and a lens module. The image sensor chip is disposed on and electrically connected to the substrate. The lens module is mounted on the base via an adhesive layer. The lens module includes a bottom surface contacting with the substrate. The bottom surface defines at least one sloped surfaces thereon. At least one gap is defined between the substrate and the at least one sloped surface. The adhesive layer is disposed between the bottom surface and the substrate, the gap is capable of accepting adhesive when the lens module and substrate are pressed together. | 07-01-2010 |
20100165184 | Camera lens assembly - Disclosed is a camera lens assembly, including a fixed frame; a rotation frame disposed in the fixed frame and configured to rotate about a first axis; an image sensor frame provided in the rotation frame and configured to rotate about a second axis; a first driving part installed in the fixed frame and configured to rotate the rotation frame; and a second driving part installed in the rotation frame and configured to rotate the image sensor frame, wherein the second axis extends in a direction perpendicular to the first axis. | 07-01-2010 |
20100165185 | CIRCUIT BOARD ASSEMBLY - A circuit board assembly includes a circuit board and at least one electrical element. The circuit board includes a dielectric substrate including a supporting surface, and at least one connecting part formed on the supporting surface. The at least one electrical element is electrically connected to the at least one connecting part via a connecting media. At least one air-exhaust hole extends through the connecting part and the dielectric substrate. The at least one air-exhaust hole is configured for exhausting air from the connecting media. | 07-01-2010 |
20100177237 | CAMERA MODULE - Disclosed is a camera module. The camera module includes a lens assembly including a wafer level optics lens (WLO), and a sensor assembly on which the lens assembly is mounted through a surface mount technology (SMT). In the camera module, a lens is directly mounted on a sensor die through the SMT, so that the manufacturing process can be simplified and the manufacturing cost can be reduced. A height of the camera module is lowered, so that a slim camera module can be realized. | 07-15-2010 |
20100177238 | Imaging Device - Provided is an imaging device which simplifies an assembling adjustment so as to reduce the manufacturing time and cost, wherein second lens L | 07-15-2010 |
20100182497 | Camera Module - A camera module includes a circuit board; a lens electrically connected to the circuit board; a adjusting base disposed on the circuit board and having at least two through-hole disposed adjacent to opposite sides of the lens; at least two fixed posts; at least two adjusting screw respectively passing through the through-holes of the adjusting base so as to be secured in the fixed posts; and at least two springs respectively encircling the adjusting screws, wherein two ends of each spring are positioned against the adjusting base and one of the fixed post respectively. | 07-22-2010 |
20100182498 | SOLID-STATE IMAGE PICKUP APPARATUS - A solid-state image pickup apparatus includes a metal plate having at least one of surfaces which consists of a planar surface and an image sensor directly mounted on the surface of the metal plate through an adhesive layer, wherein the metal plate is provided with a hole-shaped or notch-shaped positioning portion for performing positioning in a direction parallel to the surface consisting of the planar surface of the metal plate. | 07-22-2010 |
20100188564 | IMAGING DEVICE HOLDING STRUCTURE AND IMAGING DEVICE - A holding structure | 07-29-2010 |
20100188565 | CIRCUIT-SUBSTRATE SUPPORT STRUCTURE AND IMAGE-ACQUISITION DEVICE - A circuit-substrate support structure includes a circuit substrate having electronic components mounted thereon, a first substrate-holding member provided at one side edge of the circuit substrate to hold the circuit substrate, a second substrate-holding member provided at the other side edge of the circuit substrate, opposite the one side edge, to hold the circuit substrate, and an elastic member provided together with the second substrate-holding member to hold the circuit substrate by applying elasticity in a surface direction of the circuit substrate. | 07-29-2010 |
20100208132 | CAMERA MODULE - A camera module includes: a case including a first surface formed with a first opening for entering incident light, and a second surface opposite to the first surface, the second surface being formed with a second opening; a lens unit mounted in the case; a first substrate including a front surface and a back surface, wherein the case is bonded to the front surface of the first substrate to seal the second opening; a filter supported by the first substrate to face the lens unit; a circuit component disposed on the front surface of the first substrate; a second substrate including a front face and a back face, wherein the front face of the second substrate is bonded to the back surface of the first substrate; and an image pickup device disposed on the front face of the second substrate to face the filer. | 08-19-2010 |
20100238346 | COMPACT IMAGING DEVICE - The subject matter disclosed herein relates to an imaging device having a small form factor. | 09-23-2010 |
20100245661 | STRUCTURE FOR FIXING CAMERA MODULE ON BIODRIVE - Provided is a structure for fixing a camera module on a biodrive. The structure includes a socket fixed on a top surface of a printed circuit board (PCB) of the biodrive. The camera module is combined with the socket. A holder member is disposed over the camera module and covers the camera module. A plurality of fixing units may fix the holder member to fix the camera module on the PCB. The structure can prevent distortion and deviation of the camera module due to external shock. | 09-30-2010 |
20100245662 | IMAGING APPARATUS - An imaging apparatus includes a photoelectric conversion element package, a chassis member arranged at a position opposite a rear surface of the photoelectric conversion element package, a wiring member electrically connected to the photoelectric conversion element package. The wiring member has an opening that exposes the rear surface of the photoelectric conversion element package. The wiring member is arranged between the rear surface of the photoelectric conversion element package and the chassis member. The imaging apparatus further includes a heat conduction member configured to contact the rear surface of the photoelectric conversion element package, exposed by the opening, and the chassis member. | 09-30-2010 |
20100253834 | CAMERA MODULE AND MOBILE TERMINAL UNIT - A camera module includes a wiring substrate on which an imaging device is mounted to an upper surface side thereof, and a lens holding frame which is arranged on the wiring substrate and in which a lens portion is housed, wherein a plurality of concave portions are provided side by side to a lower part of an inner wall of the lens holding frame in a height direction, and an end part of the wiring substrate is fitted in the concave portion of the lens holding frame and is fixed thereto. A holding member having elasticity in an upper and lower direction is provided to stand to an inside part of the lens holding frame, and a top end part of the holding member touches an upper surface of the wiring substrate, and thereby the wiring substrate is held. | 10-07-2010 |
20100259672 | CAMERA AND PRODUCTION METHOD FOR A CAMERA - An image capturing system includes an optical component, a sensor below and connected to the optical component for capturing radiation, and a chip below the sensor for processing and/or storing and/or transmitting information captured by the sensor. The sensor and the Chip are directly connected to each other. The disclosure further relates to a production method for an image capturing system. | 10-14-2010 |
20100265388 | LID OPENING AND CLOSING MECHANISM - A container unit ( | 10-21-2010 |
20100265389 | CAMERA SOCKET MODULE - A method of tracking and acting on events related to the delivery of a mail piece is provided. An integrated record associated with an addressee of a mail piece is created. The mail piece is given a unique identifier, is associated with the addressee, and is placed in a mail stream with the date and nature of associated delivery events being recorded. After a predetermined delivery event occurs, a follow-up communication is transmitted to the addressee, and the date of this follow-up communication is recorded. The date of any response by the addressee to the follow-up communication is also recorded. To the integrated record associated with the addressee is added the date and nature of the delivery events associated with the mail piece, the date of the follow-up communication, and the date of any response by the addressee to the follow-up communication. | 10-21-2010 |
20100271541 | CAMERA MODULE WITH PIEZOELECTRIC ACTUATOR - A camera module includes a positioning plate, a positioning frame, a spring member, a lens holder, and a piezoelectric actuator. The positioning frame is fixed to the positioning plate and defines a positioning through hole. The spring member is disposed on the positioning plate and in a compressed state. The lens holder is received in the positioning through hole and movably engaged with the positioning frame. The piezoelectric actuator is sandwiched between the compressed spring member and the lens holder. The piezoelectric actuator is operable to drive the lens holder to rotate about a central axis of the positioning frame, thereby move along the central axis relative to the positioning frame. | 10-28-2010 |
20100277640 | CAMERA APPARATUS FOR PORTABLE ELECTRONIC DEVICE - A camera apparatus is attached to a portable electronic device. The camera apparatus includes an imaging module, a socket and a holder. The imaging module is positioned in the socket. The holder includes a base portion, and two positioning cylinders. The base portion provides a receiving space accommodating the socket and the imaging module, and the positioning cylinders are fixed to the portable electronic device. | 11-04-2010 |
20100283890 | Module Socket - A module socket for use with camera modules has an insulative housing with a base and four walls extending upward. The base and walls have L-shaped terminal-receiving cavities that receive terminal therein. The terminals extend between the two legs of the L-shaped cavities so as to position a terminal contact portion in opposition to contacts on the bottom surface of a camera module. Two metal retainers are applied to two opposing walls of the housing and these retainers have locking arms that extend horizontally into the interior space of the housing. The locking arms each include separate angled guide members and engagement members, the first of which guide a module into the socket and the second of which retain the module in place within the socket. | 11-11-2010 |
20100283891 | METHOD OF SETTING POSITION OF IMAGING DEVICE - A method of setting a location of an imaging device includes (a) preparing a base unit, the base unit including a lens and a mounting boss; (b) mounting an imaging device, on which a reference point is formed, to a circuit board; (c) forming a mounting hole at a predetermined location of the circuit board based on the reference point of the imaging device; and (d) mounting the circuit board to the base unit by inserting the mounting boss into the mounting hole. | 11-11-2010 |
20100295989 | IMAGE CAPTURING DEVICE AND MANUFACTURING METHOD OF SEALING STRUCTURE - An image capturing device including a housing, a sealing element, a light-permeable cover and a lens module is provided. The housing has an opening portion, and the opening portion has an inner periphery and an outer periphery. The sealing element is integrated with the housing by injection molding, wherein the inner periphery and the outer periphery of the opening portion are surrounded by the sealing element. The light-permeable cover is integrated with the sealing element by injection molding and corresponding to the opening portion, wherein a periphery portion of the light-permeable cover is surrounded by the sealing element, and a containing space is defined by the housing, the sealing element and the light-permeable cover. The lens module is disposed in the containing space. In addition, a manufacturing method of a sealing structure is also provided. | 11-25-2010 |
20100302437 | SOLID-STATE IMAGING UNIT, IMAGING APPARATUS, AND METHOD OF FIXING SOLID-STATE IMAGING DEVICE - An embodiment of the invention relates to a solid-state imaging unit including a solid-state imaging device and a supporting member that is provided on the rear side of the solid-state imaging device. An object of the invention is to provide a solid-state imaging unit that is positioned without being affected by a part error of the solid-state imaging device or the supporting member. | 12-02-2010 |
20100315546 | Imaging Device and Manufacturing method therefor - There is provided an imaging device capable of easily shielding an imaging element. The imaging device comprises a conductive mirror frame, an element unit including an imaging element equipped with a photoelectric converter, and an imaging lens attached within the mirror frame and imaging a subject image on the photoelectric converter of the imaging element. The element unit has an exposed conductive member contactable to the mirror frame. | 12-16-2010 |
20100321562 | LENS HOLDER MODULE AND CAMERA MODULE UTILIZING THE SAME - A lens holder module includes a holder and an optical element. The holder has a peripheral sidewall. The peripheral sidewall has a first connection portion formed on an inner surface thereof. The optical element is received in the holder and spaced a distance from the first connection portion. The optical element has a top surface facing the first connection portion. At least one slot is recessed below on the inner surface and located between the first connection portion and the optical element. The at least one slot is proximate to the top surface of the optical element. The width of the at least one slot along an axis of the holder is from 0.01 to 0.2 mm. | 12-23-2010 |
20100321563 | SOLID-STATE IMAGING UNIT - A solid-state imaging unit includes: an imaging device receiving light at a light-receiving surface thereof; and a protective component having a light transmissive member covering the light-receiving surface of the imaging device and a frame securing the light transmissive member at the periphery thereof, the protective component being mounted on a peripheral region of the light-receiving surface of the imaging device, wherein at least the frame is formed using a molding process. | 12-23-2010 |
20100321564 | Camera system and associated methods - A camera system may include an optics stack including two substrates, the optics stack forming an imaging system, each substrate having two surfaces that are parallel to each other and perpendicular to an optical axis of the imaging system, the optics stack including a securing region on opposing surfaces of the two substrates, the two substrates being secured together on a wafer level at their respective securing regions, at least one of the surfaces of the two substrates including a refractive surface of the imaging system, a detector substrate having an active area and a cover structure protecting at least the active area of the detector substrate, the optics stack being secured to an upper surface of the cover structure. | 12-23-2010 |
20100321565 | IMAGE PICKUP MODULE - There is provided an image pickup module which can be formed by a simple process while securing the mechanical strength of an inner lead at the time of bending and when fixed, without increasing an outer dimension of the image pickup module. | 12-23-2010 |
20100328525 | CAMERA MODULE - A camera module and a method of manufacturing the camera module are provided. The camera module includes a substrate having an opening through which light passes, a circuit pattern for transmitting an electrical signal, and first and second terminals connected to the circuit pattern; an image sensor combined with the substrate so as to receive the light through the opening, and electrically connected to the first terminals; a lead frame disposed around the image sensor and electrically connected to the second terminals of the substrate; a housing combined on a surface of the substrate opposite to another surface on which the image sensor and the lead frame are combined; and a lens disposed in the housing. | 12-30-2010 |
20100328526 | MODULAR CAMERA SYSTEM AND A METHOD OF MANUFACTURING THE SAME - A camera module includes a substrate with a cavity therein. A processor is located in the cavity, and wire bonding is for connecting the processor to the substrate. An imaging module is adapted to overlay the processor in the cavity and rest on at least part of the edge of the cavity. Wire bonding is for connecting the imaging module to the substrate and the processor. The cavity includes a longitudinal cutout section adapted to accommodate at least some wire bonding for connecting the processor to the substrate or associated surface mount components. | 12-30-2010 |
20110019075 | CAMERA MODULE WITH ANTI-SHAKE MECHANISM - An exemplary camera module includes a fixture, a lens module, a movable frame, an image sensor, a position sensor, a first and a second magnet, and a first and a second magnetic field generator. The position sensor is used to detect displacements of the lens module caused by shake. The magnetic field generators are used to apply a magnetic field to the corresponding magnets, each of the magnetic field generators is electrifiable in response to detection by the position sensor of displacement of the lens module caused by shake. Accordingly, at least one of the magnets and the corresponding magnetic field generator cooperatively drive the lens module to move and compensate the displacement of the image sensor. | 01-27-2011 |
20110019076 | IMAGE CAPTURING DEVICE HAVING OBLIQUE IMAGE SENSOR - An image capturing device includes a lens module defining an optical axis, a holder defining an opening and a space communicating with the opening, an image processing unit received in the space, and an image sensor received in the space and fixed on the image processing unit. The holder is configured for receiving the lens module. The image processing unit is electrically connected to the image processing unit and inclined relative to the optical axis. The image sensor is configured for capturing images of objects. The optical axis passes through the center of the sensing surface of image sensor. | 01-27-2011 |
20110019077 | CAMERA MODULE FABRICATING METHOD AND CAMERA MODULE - There is disclosed a method for fabricating a camera module includes the steps of: disposing a camera module body inside of a die; filling the die with a resin blocking a light; curing the resin; and removing the camera module body and the resin from the die. Here, disposing the camera module body inside of the die is disposing the camera module body having a lens holder secured on a sensor board inside of the die in such a manner that the side surface of the camera module body is not brought into contact with the side surface of the die. Filling the die with the resin is covering the upper end of the die with a lid so as to closely enclose the inside of the die, followed by filling the die with the resin. Taking the camera module body and the resin from the die is taking, from the die, the camera module body and the resin formed around the camera module body in close contact. | 01-27-2011 |
20110019078 | LENS BARREL AND IMAGING DEVICE - The lens barrel includes a flexible wire, a first supporting frame, and a second supporting frame. The flexible wire has a first end, a second end, and a flexible mounting portion. The first end includes at least one terminal. The second end includes at least one terminal. The mounting portion is disposed between the first end and the second end. The first supporting frame is configured to support the first end. The second supporting frame includes a storage component configured to support the mounting portion and is movably disposed in a first direction. | 01-27-2011 |
20110025908 | PORTABLE ELECTRONIC DEVICE WITH SLIDABLE IMAGE CAPTURING ASSEMBLY - A portable electronic device includes a shell, an image capturing assembly, a signal processing circuit, and a connection plate. The shell defines a first annular shaped guiding slot. The image capturing assembly includes a camera module. The camera module includes a substrate and a flexible circuit board (FPC). The FPC has one end connected to the substrate and another end electrically coupled to the signal processing circuit. The connection plate includes a first plate positioned on the shell and a second plate perpendicular to the first plate. A second guiding slot is defined on the second plate and aligned with the first guiding slot on the shell. The connection plate, the shell, the first and second annular guiding slots cooperatively define a laid-down T-shaped receiving groove, the image capturing assembly is received in the T-shaped groove and is slidable along the T-shaped groove. | 02-03-2011 |
20110025909 | WAFER-LEVEL CAMERA MODULE AND METHOD FOR COATING THE SAME - A method for coating wafer level camera modules, comprising: providing a wafer level camera module comprising an outer surface, depositing an opaque layer onto the outer surface, applying a photoresist layer onto the opaque layer, exposing a selected area of the photoresist layer to light to remove the selected area, etching part of the opaque layer within the selected area to form an light incident hole, and removing the remaining photoresist layer. | 02-03-2011 |
20110032416 | CAMERA APPARATUS - Disclosed herein is a camera apparatus, including: a lens block having an image capturing lens provided therein; a substrate having an image pickup element mounted thereto; a housing for accommodating therein the lens block and the substrate; and a supporting block for supporting the substrate so that the image pickup element and the image capturing lens face each other by bonding thereto the substrate by using an adhesive agent, wherein the supporting block has a side surface making a right angle with an adhesion surface to which the substrate is bonded, and a bottom surface parallel with the adhesion surface on the adhesion surface, and a filling groove which is filled with the adhesive agent is formed in the supporting block. | 02-10-2011 |
20110037892 | WEBCAM WITH MOVEABLE ZOOM LENS - A webcam with an optical lens that can manually be moved into a position in front of the camera lens. The lens may slide or be rotated to a position in front of the camera lens. The optical lens may be a zoom lens, such that, in combination with the lens of the camera, a fixed zoom or magnification function is provided. Alternately, at least a second lens may also be provided, such as to provide two fixed zoom positions. The two lenses could be moved together with a single mechanical structure, or separately with two different manual controls. | 02-17-2011 |
20110037893 | Imaging Module - An imaging module includes an imaging substrate mounting an imaging device thereon, a resin holder including a substrate securing portion to which the imaging substrate is secured, a lens support barrel supporting a lens at an inside thereof, and a holding portion which protrudes toward a subject from the substrate securing portion and includes a through hole configured to permit retention of the holder in an external structure, a metal securing member disposed at a side of the substrate securing portion of the holder facing a subject, and a metal holding plate including a securing region which is secured to and electrically connected to the securing member, and a holding portion adjacent region which overlaps a part around the through hole of the holding portion and includes a through hole configured to communicate with the through hole. | 02-17-2011 |
20110043684 | Imaging device and method of producing the same - An imaging device comprises: a lens housing on which lens groups are mounted and which has a first opening opened along an optical axis direction of the lens groups; and a drive housing on which a drive source for moving the lens groups in the optical axis direction is mounted and which has a drive-use opening to be communicated with the first opening of the lens housing. The lens housing and the drive housing are combined together so as to be separable from each other in a state that the first opening and the drive-use opening are communicated with each other. | 02-24-2011 |
20110043685 | PORTABLE ELECTRONIC DEVICE WITH CAMERA MODULE - A portable electronic device includes a main body, a number of ball bearings, a spherical retaining member and a camera module. The main body includes a cavity formed therein, and a number of recesses formed in inner walls of the cavity and in communication with the cavity. The ball bearings are received in the respective recesses. The spherical retaining member is located in the cavity and is in contact with the ball bearings. The spherical retaining member defines a receiving space therein and an opening in communication with the receiving space. The camera module is received in the receiving space and facing the opening, the camera module is retained by the spherical retaining member in a manner such that the camera module is rotated by rotating the spherical retaining member relative to the ball bearings. | 02-24-2011 |
20110043686 | IMAGE SENSING MODULE AND CAMERA MODULE HAVING SAME - An exemplary image sensing module includes a base, a transparent plate, many first electrically conductive poles, an image sensor, and many passive components. The base includes a top surface and a recess defined in the top surface. The transparent plate is mounted on the top surface of the base, and covers the recess. The transparent plate includes a first surface facing away from the recess. The first electrically conductive poles extend through the transparent plate. The image sensor is received in the recess of the base. The passive components are attached on the first surface of the transparent plate, and surround the image sensor. The passive elements are connected electrically with the image sensor via the first electrically conductive poles. | 02-24-2011 |
20110043687 | CAMERA MODULE - An exemplary camera module includes an image sensor package, an enclosure, and a lens module. The image sensor package includes a circuit board and an image sensor mounted on the circuit board. The enclosure is attached on the circuit board and includes four elastic engaging portions protruding from an interior surface thereof. The lens module includes a barrel and at least one optical element received in the barrel. The barrel defines four recesses in an outer surface thereof. The barrel is detachably mounted in the enclosure. The engaging portions engage in the respective recesses. | 02-24-2011 |
20110050987 | LENS UNIT AND IMAGING DEVICE - A lens unit having a first lens ( | 03-03-2011 |
20110050988 | Optical element module and manufacturing method thereof, electronic element module and manufacturing method thereof, and electronic information device - An optical element module according to the present invention is provided, in which: one or a plurality of optical elements are housed within a light shielding holder; a slanting surface is provided on an outer circumference side of an optical surface of the optical element facing an aperture opening of the light shielding holder; a slanting surface is provided on an inner surface on a back side of the aperture opening of the light shielding holder in such a manner to face the slanting surface of the optical element; and the slanting surface of the optical element and the slanting surface of the light shielding holder are guided together, so that the aperture opening of the light shielding holder and the optical surface of the optical element are positioned. | 03-03-2011 |
20110050989 | MOBILE TERMINAL - A mobile terminal is disclosed, by which a user is facilitated to carry and use a terminal in a simple and easy way. According to the present invention, since a camera module is configured in a manner that a protective cover is provided not to a case but to a module body, it is advantageous in protecting a lens unit provided to the module body before installing the camera module at the case. While light passes through a protective cover, a protective cover physically isolates an inside of a camera module from an outside to prevent external particles from being introduced into the camera module. Therefore, it is advantageous in enhancing durability of the camera module. A loading portion is provided to a case to guide an installation position of a camera module. A separate cover is not added to the case. And, a protective cover of a camera module is directly exposed to outside. Therefore, accumulation of numerical value tolerance is barely generated and an assembly process is simplified. | 03-03-2011 |
20110069221 | ALIGNMENT OF LENS AND IMAGE SENSOR - Embodiments related to the alignment of a lens with an image sensor in an optical device are disclosed. For example, one disclosed embodiment comprises an optical device including a printed circuit board, and an image sensor package mounted on the printed circuit board, wherein the image sensor package includes an image sensor. The optical system further comprises a lens holder including a lens, and one or more alignment features arranged on the lens holder. The one or more alignment features are configured to contact the image sensor package to mechanically align the lens holder with the image sensor package. | 03-24-2011 |
20110075021 | IMAGING MODULE WITH FIXED-FOCUS LENS - An exemplary imaging module includes a substrate, an image sensor, a lens barrel, a lens, and a holder. The image sensor is fixed on the substrate, the lens barrel is connected to the substrate to enclose the image sensor, the lens is received in the lens barrel, and the holder is connected to the lens barrel and partially receives the lens barrel therein. The lens barrel includes an elastic protruding portion protruding from the inner surface thereof. The inner surface of the protruding portion elastically abuts a side surface of the lens. | 03-31-2011 |
20110075022 | IMAGING DEVICE, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF MANUFACTURING IMAGING DEVICE - An imaging device includes an imaging unit, and a panel facing the imaging unit. The panel includes a panel body that has an anti-reflection-coated surface treated with anti-reflection coating and has a portion thereof overlapping an angle of view of the imaging unit, a sheet that is provided on a portion of the anti-reflection-coated surface outside of the angle of view, and a resin layer that has a pattern and is provided on a side of the sheet near the imaging unit. | 03-31-2011 |
20110075023 | SUBSTRATE HOLDING APPARATUS - A substrate holding apparatus includes a case having a case body and a case cover, a plurality of substrates held in the case in a thickness direction of the substrates, and a plurality of support portions formed at the case body, the plurality of support portions constituting a plurality of support portion groups, the support portions including end surfaces whose heights in the thickness direction are the same in each of the support portion groups, the heights of the end surfaces of the support portions in one of the plurality of support portion groups being different from the heights of the end surfaces of the support portions in the other of the plurality of support portion groups, one of the substrates including a peripheral edge portion having guide grooves into which the support portions in one of the plurality of support portion groups are inserted. | 03-31-2011 |
20110075024 | Photographic Device and Holder Thereof - A holder is disclosed, wherein the holder is situated on a circuit board and is used for connecting with an electronic component. The holder comprises an upper surface, a lower surface, and an opening. The upper surface comprises a recess used for laying a flat component, wherein the recess comprises at least one rough area; the lower surface comprises a protruding edge, wherein the protruding edge is connected with the circuit board with glue, and the protruding side and the circuit board delimit a space; and the opening penetrates the upper surface and the lower surface, whereby the gas generated from heating the glue will accumulate in the enclosed space, and the gas will then escape through the opening and out through at least one of the rough areas. | 03-31-2011 |
20110080515 | Camera module - The present invention relates to a camera module assembled by using a connector. The present invention provides a camera module including: a main substrate having an image sensor mounted on an upper surface and a connector insertion groove formed at one side of the image sensor; a plurality of connectors mounted in a row in the connector insertion groove; a housing mounted on the main substrate and having a lens barrel vertically movably coupled therein; a flexible printed circuit board mounted to surround an outer peripheral surface of the housing while being electrically connected to a lens transfer device coupled to one side of the housing; and a shield case coupled to the outer peripheral surface of the housing. Since it is possible to minimize a distance between pads which are connectable through the connector, there is an advantage of miniaturizing the camera module as a whole by size reduction of the main substrate. | 04-07-2011 |
20110080516 | IMAGE SENSOR MODULE AND IMAGING DEVICE INCLUDING THE IMAGE SENSOR MODULE - An image sensor module and an imaging device. An image sensor package includes a plurality of image sensor chips for generating image signals and a lower transparent board over the image sensor chips. An upper transparent board is positioned over the lower transparent board and includes a lens for focusing an external light to the image sensor chips. An adhesion member is interposed between the upper transparent board and the lower transparent board, and thus the upper and lower transparent boards are adhered to each other by the adhesion member such that the lens and the image sensor chips are aligned with each other. A dehumidifying agent is arranged in the adhesion member to absorb moistures from an interior of the image sensor module. Accordingly, the moistures are prevented from being condensed onto the surface of the image sensor module. | 04-07-2011 |
20110085076 | IMAGE PICKUP UNIT AND METHOD OF MANUFACTURING THE SAME - An image pickup unit according to the present invention includes: a lens frame that internally holds an image pickup optical system; and a backside illuminated image pickup device which has a light-receiving section that receives light entering the lens frame via the image pickup optical system and which is held inside the lens frame, wherein a claw portion of the lens frame abuts an opposing surface that opposes a light-entering surface of the image pickup device so as to define a position of the image pickup optical system in an optical axis direction L with respect to the light-receiving section using the opposing surface as a reference. | 04-14-2011 |
20110096223 | CAMERA MODULE AND MANUFACTURING METHOD THEREOF - A camera module includes an image sensor, a first substrate, a lens, a second substrate, and a light shading cover. The first substrate includes a first surface and a second surface opposite to the first surface. The first substrate defines a first aperture. The image sensor is attached to the first surface. The lens is attached to the second surface. The second substrate is attached to a surface of the lens away from the first substrate. The second substrate defines a second aperture. The light shading cover defines a third aperture. The light shading cover is covered on the second substrate and defining a third aperture coaxial to the first aperture . The center of the first aperture, the second aperture, and the third aperture are located on the optical axis of the camera module. | 04-28-2011 |
20110096224 | Camera module package - There is provided a camera module package including: a lens barrel having a lens deposited therein; a housing having the lens barrel installed therein; a board bonded to the housing and having an image sensor provided on one surface thereof to coincide with an optical axis of the lens; and a shield can covering the outside of the housing and having a ground portion. The ground portion is protruded outwards from an outer side surface of the shield can and contacts an inner side surface of a socket when the shield can is inserted into the socket. | 04-28-2011 |
20110102667 | Camera module with fold over flexible circuit and cavity substrate - A disclosed method of manufacturing a camera module includes providing an image capture device, providing an electronic component, providing a flexible circuit substrate, mounting the image capture device on a first portion of the flexible circuit substrate, mounting the electronic component on the second portion of the flexible circuit substrate, and positioning the second portion above the first portion. The method further includes providing a chip carrier including a bottom surface defining a cavity and a top surface adapted to receive the image capture device and positioning the chip carrier between the image capture device and the flexible circuit substrate. The method further includes mounting a second electronic component within the cavity. | 05-05-2011 |
20110102668 | CAMERA BODY AND IMAGING UNIT ATTACHABLE TO AND DETACHABLE FROM CAMERA BODY, AND IMAGING APPARATUS - A camera body includes a camera body connector and a recess to which an imaging unit including an optical system, an image pickup device, and an imaging unit connector is detachably attached to be placed therein. The recess includes a back wall, an upper wall, and a side wall to be opened to a lower side, a front side, and a lateral side of the camera body. The camera body has a guide mechanism to control a position of the camera body connector in relation to a position of the imaging unit connector. The imaging unit has a rear surface on which at least two guiding grooves provided to be extended between opposite edges of the imaging unit and an engagement plate section are formed. The imaging unit has a biasing member to bias the imaging unit toward the back wall. The guide mechanism has at least two guide protrusions provided on the back wall and inserted into the at least two guiding grooves and an engagement claw formed on the back wall so as to face the engagement plate section and to engage with the biasing member when the imaging unit is attached to the camera body. | 05-05-2011 |
20110109791 | CERAMIC PACKAGE AND CAMERA MODULE - According to one embodiment, a ceramic package of which inner space is sealed by a ceramic base plate and a cover portion mounted on the ceramic base plate. The ceramic package has an image sensor, an element unit and a lead electrode. The image sensor and the element unit are mounted on the ceramic base plate. The lead electrode is formed on the ceramic base plate and electrically connected to the image sensor by a bonding wire. A surface on which the lead electrode is formed is the same as a surface on which the cover portion is mounted. | 05-12-2011 |
20110115974 | Integrated lens and chip assembly for a digital camera - A integrated camera module ( | 05-19-2011 |
20110115975 | IMAGING DEVICE - To produce a subject's image on an imager as accurately as possible, a technique that is effectively applicable to the process of assembling an optical system is provided. | 05-19-2011 |
20110134314 | IMAGE SENSOR MODULE FOR CAMERA DEVICE - An image sensor module includes a circuit board, an image sensor, and a supporting board. The image sensor is electrically connected to the circuit board. The circuit board defines a through opening therein. The supporting board is arranged on one side of the circuit board and includes a protrusion. The protrusion extends outwardly from the supporting board and includes a square-shaped block no larger than the image sensor. The square-shaped block passes through the through opening. The image sensor is mounted on the block and spaced from the circuit board. | 06-09-2011 |
20110141346 | Camera Module and Manufacturing Method Thereof - Disclosed herein are a camera module and a manufacturing method thereof, the camera module including a plurality of lenses, a substrate arranged at the lower part of the plurality of lenses, an infrared blocking agent formed on the upper surface of the substrate to block infrared light, and an image sensor positioned at the lower surface of the substrate to convert an optical image incident through the plurality of lenses into an electrical signal. | 06-16-2011 |
20110149143 | Image pickup lens, camera module using the same, image pickup lens manufacturing method and camera module manufacturing method - An image pickup lens is provided that includes a substrate; resin layers formed on both respective opposite surfaces of the substrate; a lens portion formed on at least any one of the surfaces of the substrate; and a spacer formed on at least any one of the surfaces of the substrate at an area surrounding the lens portion. | 06-23-2011 |
20110157462 | CAMERA MODULE - A camera module includes a lens module, a printed circuit board (PCB), and a connection material. The lens module includes two pins. The PCB defines two conductive grooves. The lens module is disposed on the PCB. The pins are received in the conductive grooves and connected to the PCB through the connection material received within the conductive grooves. | 06-30-2011 |
20110170000 | CAMERA DEVICE ADAPTING TO DIFFERENT LENS SENSORS - A camera device includes a lens cover defining a lens opening. Two positioning posts extend from the lens cover. The two positioning posts are arranged at two opposite sides of the lens opening, for selectively mounting a first circuit board having a first lens or a second circuit board having a second lens different from the first lens. The first and second circuit boards are operable to be installed on the lens cover at different positions through being mounted on different positions of the two positioning posts. | 07-14-2011 |
20110187921 | CAMERA MODULE AND ELECTRONIC DEVICE UTILIZING THE SAME - A camera module includes a substrate, a lens module, a driver circuit and a electromagnetic interference shield. The substrate includes a first surface and a second surface opposite to the first surface, and the lens module is positioned on the first surface of the substrate. The driver circuit is positioned on the first surface of the substrate, and is electrically connected to the lens module. The electromagnetic interference shield is positioned on the first surface of the substrate and covers the driver circuit. The electromagnetic interference shield includes a case and pins. The case covers the driver circuit. The pins extend from the case and pass through the substrate to secure the electromagnetic interference shield on the substrate. | 08-04-2011 |
20110187922 | DIGITAL SINGLE LENS REFLEX CAMERA - To simplify and miniaturize an interface structure for power supply and signal transmission and reception between a camera body and a lens unit and reduce operation restrictions of the interface structure, a digital single lens reflex (DSLR) camera includes a camera body and a lens unit which is attached to or detached from the camera body, in which the camera body includes interface pins formed contactable with the lens unit, the interface pins including power pins and signal pins, a pin housing that receives therein the interface pins, a flexible printed circuit board (FPCB) including a first pattern portion electrically connected with the power pins and a second pattern portion electrically connected with the signal pins, and a lead wire electrically connected with the first pattern portion. | 08-04-2011 |
20110194022 | IMAGE SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME - An image sensor module having a light gathering region and a light non-gathering region includes an image sensor, a lens barrel and a lens layer. The lens barrel is disposed on the image sensor and located in the light non-gathering region and has a through hole exposing a portion of the image sensor in the light gathering region. A material of the lens barrel includes a thermoplastic with a melting point higher than soldering temperature. The lens layer is disposed on an end portion of the lens barrel away from the image sensor and covers the through hole. The lens layer includes a glass substrate and a lens disposed on the glass substrate and located in the light gathering region. | 08-11-2011 |
20110194023 | Camera module with molded tape flip chip imager mount and method of manufacture - A novel design and method for manufacturing camera modules is disclosed. The camera module includes a flexible circuit substrate, an image capture device flip-chip mounted to the bottom surface of the flexible circuit substrate, a housing mounted over the top surface of the flexible circuit substrate, and a lens unit coupled to the housing. In an example embodiment, the camera module includes a stiffener formed directly over a plurality of electrical components mounted on the top surface of the flexible circuit substrate. In another example embodiment, the bottom surface of the flexible circuit substrate defines a recessed portion whereon the image capture device is flip-chip mounted. A disclosed method for manufacturing camera modules includes providing a flexible circuit tape having a plurality of discrete circuit regions, providing a plurality of image capture devices, flip-chip mounting each image capture device on an associate one of the discrete circuit regions, providing a plurality of housings, and mounting each housing on an associate one of the discrete circuit regions. | 08-11-2011 |
20110216238 | OPTICAL ELEMENT, OPTICAL ELEMENT MANUFACTURING METHOD, AND CAMERA MODULE - According to one embodiment, an optical element includes: a substrate in which a through-hole is formed; a transparent thin film formed on at least one of the rear surface and the front surface of the substrate to cover the through-hole; and a lens formed in contact with the surface of the thin film in an area where the thin film covers the through-hole. | 09-08-2011 |
20110221956 | SOLID-STATE IMAGE PICKUP DEVICE, A CAMERA MODULE AND A METHOD FOR MANUFACTURING THEREOF - A solid-state image pickup device includes a solid-state image sensor chip having a solid-state image sensor having a photosensitive element formed on a main surface of a semiconductor substrate and chip electrodes led to the back surface of the semiconductor substrate, a passive chip bonded on the back surface of the solid-state image sensor chips having passive parts mounted in its thickness and electrically connected to the chip electrodes of the solid-state image sensors. The device further includes a lens holder fixed to enclose the photosensitive element of the solid-state image pickup sensor chip and a lens barrel to fit into the lens holders, wherein the passive chip is formed having a size equal to or smaller than a size of the solid-state image sensors. | 09-15-2011 |
20110228164 | IMAGE PICKUP APPARATUS IN WHICH IMAGE PICKUP ELEMENT IS MOVABLE IN OPTICAL AXIS DIRECTION - An image pickup apparatus includes lens barrels | 09-22-2011 |
20110234892 | HEAT DISSIPATING STRUCTURE FOR AN IMAGING UNIT - A heat dissipating structure for an imaging unit includes an imaging element configured to convert light into an electrical signal, a first heat dissipating plate, a second heat dissipating plate, and a heat dissipating portion. The first heat dissipating plate has a first end and a second end disposed opposite to the first end, and is positioned on the rear face side of the imaging element. The second heat dissipating plate is positioned on the rear face side of the first heat dissipating plate. The heat dissipating portion is fixedly coupled to the first end of the second heat dissipating plate. | 09-29-2011 |
20110234893 | SOLID STATE IMAGING DEVICE, CAMERA MODULE, AND METHOD FOR MANUFACTURING SOLID STATE IMAGING DEVICE - A solid state imaging device according to one embodiment of the present invention includes a substrate with a solid state imaging element, a first impurity layer, a plurality of external electrodes, and a translucent substrate. The first impurity layer is formed on a back surface side of the substrate, and forms a pn junction with the substrate. The plurality of external electrodes is formed on the back surface of the substrate and is electrically connected to the solid state imaging element. The translucent substrate is fixed to the substrate. | 09-29-2011 |
20110242407 | CAMERA MODULE AND METHOD FOR MAKING SAME - A camera module includes a lens module, an infrared cut film covering the majority of the outer surface of the lens module, a printed circuit board, and a mass of reflowable solder paste attaching the lens module to the print circuit board. | 10-06-2011 |
20110242408 | DIGITAL CAMERA - A digital camera includes a bezel and an extending ring. The bezel includes a convex ring and at least one fixing portion. The convex ring is positioned on a center of the bezel. The fixing portion is defined on an outer sidewall of the convex ring. The extending ring includes a sleeve, a flange, and at least one fastening portion. The sleeve is placed around the outer sidewall of the convex ring. The flange extends from an end of the sleeve and abuts the convex ring. The fastening portion cooperates with the fixing portion. | 10-06-2011 |
20110242409 | DIGITAL CAMERA - A digital camera includes a bezel and an extending ring. The bezel defines a circular-shaped recess, and N pairs of support arms are positioned on the inner sidewall of the recess. The N is an integer equaling or exceeding 2. Each of the pairs of support arms has different height and the two support arms in each of the pairs of support arms are symmetrically placed with respect to a central axis of the recess. The extending ring defines Nβ1 pairs of bar-shaped slots. An end of the extending ring contacts an end surface of one of the N pairs of support arms, and the Nβ1 pairs of bar-shaped slots are positioned corresponding to the other Nβ1 of the N pairs of support arms. | 10-06-2011 |
20110249176 | WAFER LEVEL LENS MODULE AND RELATED METHOD FOR FORMING THE SAME - A wafer level lens module includes a first optical layer, a spacer layer and a second optical layer. The spacer layer is disposed upon the first optical layer, having a hole through the spacer layer for light passage, wherein a surface of the hole substantially avoids light reflection. And the second optical layer is disposed upon the spacer layer. | 10-13-2011 |
20110255000 | CAMERA ALIGNMENT AND MOUNTING STRUCTURES - An electronic device may be provided with a housing. A camera module may be mounted within the housing. The housing may have a camera window with which a lens in the camera module is aligned. To rotationally and laterally align the camera module with respect to the camera window and the electronic device housing, an alignment structure may be mounted to the housing in alignment with the camera window and housing. The alignment structure may be formed form a ring-shaped structure with an opening. The alignment structures may have sidewalls that form an alignment groove for the camera module. The camera window may be formed from a circular opening in a layer of opaque material deposited on a transparent housing member such as a planar layer of glass. During the process, a laser tool may be used to trim the opening in the opaque material. | 10-20-2011 |
20110261253 | CAMERA MODULE - A camera module includes a holder, a barrel, an image sensor module, and a printed circuit board. The barrel receives lenses. The barrel is received in the holder. The image sensor module includes a substrate and an image sensor. The substrate is positioned at one side of the holder. The image sensor is mounted on the substrate and aligned with the lenses. First solder pads are positioned in the substrate. The first solder pads are electrically coupled to the image sensor. The printed circuit board includes second solder pads. The second solder pads are electrically coupled to the first solder pads. The printed circuit board is positioned at an exterior surface of the holder. | 10-27-2011 |
20110267534 | IMAGE SENSOR PACKAGE AND CAMERA MODULE USING SAME - The image sensor package includes a transparent substrate, a number of conductive patterns, an image sensor, a flexible circuit board. The conductive patterns are distributed on a surface of the transparent substrate. The image sensor is adhered on the transparent substrate and electrically connected to the conductive patterns. The flexible circuit board is electrically connected to the conductive patterns, and defines an opening for receiving the image sensor therein. | 11-03-2011 |
20110267535 | IMAGE SENSOR MODULE HAVING IMAGE SENSOR PACKAGE - An image sensor module includes a circuit board, an image sensor package and an optical system. The circuit board has an upper surface and a lower surface, the substrate having a window. The image sensor package includes a mounting substrate and an image sensor chip mounted on the mounting substrate, the image sensor package being adhered to the lower surface of the circuit board such that the image sensor chip is exposed through the window. The optical system is provided on the upper surface of the circuit board to guide light from an object to the image sensor chip. | 11-03-2011 |
20110285900 | CASING OF WEBCAM - A casing of a webcam improves the hand feel of turning a lens ring. A base of the casing includes a sheath hole having a first connection portion, a first ring-shaped flange formed around an upper side of the lens ring, a second connection portion formed between upper and lower sides of the lens ring, and a second ring-shaped flange formed around the lens ring and abutted against an upper side of the sheath hole and a lower side of the first connection portion, and the first and second ring-shaped flanges of the lens ring are separated from the sheath hole by an interval. A flexible ring is clamped between the first and second connection portions and disposed between the first and second ring-shaped flanges, such that the casing can have a greater manufacturing tolerance to reduce manufacturing costs, and provide a better hand feel of turning the lens ring. | 11-24-2011 |
20110285901 | SOLID STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME AND CAMERA MODULE - A solid-state imaging device is provided. The solid-state imaging device includes an imaging area that includes arrayed pixels having photoelectric converting units and transistor elements; and a peripheral circuit, in which a wiring line in the imaging area that is shifted based on pupil correction amount and a wiring line in the peripheral circuit that is not shifted are connected through a connection expanded portion integrally formed with one or both of the wiring lines. | 11-24-2011 |
20110292279 | CAMERA MODULE - A camera module includes a lens of heat-resistant material, a barrel receiving the lens, a baseboard mounted on the barrel by surface mounted technology, an image sensor mounted on the baseboard receiving optical signals from the lens and converting the optical signals into electrical signals, and a transmitting member transmitting the electrical signals to the circuit board. | 12-01-2011 |
20110298971 | COMPACT IMAGING DEVICE - The subject matter disclosed herein relates to an imaging device including a laminated portion of an actuator or actuator support. | 12-08-2011 |
20120002102 | CAMERA MODULE - A camera module includes a lens drive device that moves an image pickup lens along an optical axis. The lens drive device has electromagnetic drive means that drives the image pickup lens by electromagnetic force with use of a coil and a magnet. The image pickup lens has a planimetrically rectangular shape. The magnet and the coil are disposed along each of at least one pair of opposite sides of the rectangular shape. By utilizing the characteristics of the image pickup lens having a rectangular shape, the magnet and coil of the lens drive device are disposed along each of the at least one pair of opposite sides. This makes it possible to provide a camera module having a lens drive device with a smaller footprint (amount of space that the camera module uses) than in the case of an arrangement of magnets at the corners of the image pickup lens. | 01-05-2012 |
20120008043 | IMAGING APPARATUS - The imaging apparatus includes a lens mount to which a lens unit is mountable, an imaging unit operable to generate an image signal, and a shutter unit that is arranged between the lens mount and the imaging unit, and is capable of limiting the light incident on the imaging unit, opening and closing at least at recording and being kept in an opened state during a recording preparation operation, and a main frame to which the lens mount, the shutter unit and the imaging unit are fixed. | 01-12-2012 |
20120044410 | CAMERA MODULE AND ELECTRONIC DEVICE USING SAME - A camera module includes a printed circuit board and a camera mounted to the printed circuit board. The printed circuit board further defines a at least one cut-out located near the camera. | 02-23-2012 |
20120044411 | CAMERA MODULE AND METHOD FOR ASSEMBLING THE SAME - A camera module includes a first circuit board, a holder, a lens module, an image sensor chip, a filter, and a second circuit board. The holder includes a sleeve and a base connected to an end of the sleeve. The lens module is received in the sleeve. The holder is mounted on the first circuit board. The base defines a first receiving portion. The image sensor chip is electrically fixed to the first circuit board and received in the first receiving portion. The filter is received in the first receiving portion corresponding to the image sensor chip. The second circuit board is electrically connected to the first circuit board. The second circuit board is received in the first receiving portion and fixed to the base. | 02-23-2012 |
20120044412 | CAMERA MODULE AND ASSEMBLY METHOD THE SAME - A camera module includes a first circuit board, a holder, a lens module, an image sensor chip, a filter, and a second circuit board. The holder includes a sleeve and a base connected to an end of the sleeve. The lens module is received in the sleeve. The holder is mounted on the first circuit board. The base defines a receiving portion. The image sensor chip is electrically fixed to the first circuit board and received in the receiving portion. The filter is received in the first receiving portion corresponding to the image sensor chip. The second circuit board is electrically connected to the first circuit board. The second circuit board is received in the first receiving portion and fixed to the first circuit board. Incident light passes through the lens module and the filter in that order, and finally projects on the image sensor chip. | 02-23-2012 |
20120044413 | IMAGING APPARATUS - The image sensor and the imaging substrate are arranged in a space formed between the connection portion and the plane formed by the holding portion. | 02-23-2012 |
20120044414 | Thin Image Capturing Apparatus - A thin image capturing apparatus includes a circuit substrate having at least one electronic component, a light sensing element packaged onto the circuit substrate, and a camera lens installed onto the light sensing element for capturing images. | 02-23-2012 |
20120044415 | IMAGE PICKUP MODULE AND CAMERA - An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area. | 02-23-2012 |
20120062790 | OPTICAL MEMBER AND OPTICAL MODULE - An optical member is disclosed which can prevent invasion of foreign articles into a space on a light path and can prevent deterioration of the yield in a manufacturing process. The optical member includes a first substrate, a second substrate opposed to the first substrate, a joining element for joining the first and second substrates together in a spaced relationship from each other so as to provide a space between the first substrate and the second substrate, and a porous member provided in the joining element. At least one of the first and second substrates is formed from an optical transmission member. The space between the substrates is closed by the joining element and the porous member. | 03-15-2012 |
20120075523 | IMAGING UNIT - An imaging unit includes a housing having an opening on one of opposite sides in a direction of thickness thereof; an imaging optical system provided in the housing and includes an incident surface and an exit-side prism, wherein object-emanated light being incident on said incident surface and traveling in a lengthwise direction of said housing is reflected by said exit-side prism toward said opening; an image sensor, installed in the housing, with an imaging surface facing the other of the opposite sides of the housing toward an exit surface of the exit-side prism; a spacer projecting from the housing or a fixed member, the spacer contacting the image sensor to create a clearance between the exit surface and the imaging surface; and a cover fixed to the housing to close the opening and press the image sensor so as to come in contact with the spacer. | 03-29-2012 |
20120081599 | DIGITAL CAMERA - A digital camera of the present invention has: an optical housing having a bending optical system for reflecting photographic object light entering along a first optical axis to a second optical axis direction perpendicular to the first optical axis to form an image on an image pickup device; a camera main body having a containing portion for containing the optical housing slidably only in the second optical axis direction and having support portions for supporting the optical housing provided on each of both sides surfaces of the containing portion across the second optical axis of the bending optical system; and a shock absorbing unit provided between an inner surface of the containing portion of the camera main body in which the support portions are not provided and an outer surface of the optical housing facing thereto. | 04-05-2012 |
20120081600 | DIGITAL CAMERA - A digital camera of the present invention has: an optical housing having a bending optical system for reflecting photographic object light entering along a first optical axis to a second optical axis direction perpendicular to the first optical axis to form an image on an image pickup device; a camera main body having a containing portion for containing the optical housing slidably only in the second optical axis direction and having support portions for supporting the optical housing provided on each of both sides surfaces of the containing portion across the second optical axis of the bending optical system; and a shock absorbing unit provided between an inner surface of the containing portion of the camera main body in which the support portions are not provided and an outer surface of the optical housing facing thereto. | 04-05-2012 |
20120092549 | PHOTOGRAPHIC DEVICE - A photographic device includes a body, and at least an optical assembly and multiple auxiliary light sources surrounding the optical assembly are disposed in the body. A front cover is disposed on a front end of the body, and a protecting mirror is disposed on the front cover. Light emitted by the auxiliary light sources passes through the protecting mirror and illuminates a photographic area. A light-blocking film is disposed on the protecting mirror corresponding to the optical assembly, so as to prevent the light emitted by the auxiliary light sources from entering the optical assembly after reflected by the protecting mirror. | 04-19-2012 |
20120092550 | CAMERA DEVICE AND MANUFACTURING METHOD FOR A CAMERA DEVICE - A camera device ( | 04-19-2012 |
20120092551 | LENS DRIVING DEVICE AND CAMERA MODULE - A lens driving device prevents its holder from tilting while driving the lens, and has a small number of components, low cost, and small size. The lens driving device includes a base, a holder, magnets, and magnetic plates. The base includes a projection having a hook-shaped cross section. The holder includes a rotation inhibitor which comes into contact with the projection of the base. The holder is supported to the base by one shaft. One magnetic plate is located further from the shaft than the center of the magnet is. The other magnetic plate is located closer to the shaft than the center of the magnet is. The magnetic forces generated between the magnetic plates and the magnets make the holder subjected to a torque on the shaft. The torque allows the rotation inhibitor to be slightly pressed against the projection. | 04-19-2012 |
20120092552 | IMAGE SENSOR MODULE - An image sensor module including: a lower substrate having a plurality of top pads formed on the top surface thereof; an upper substrate that is installed along the edge of the top surface of the lower substrate and has a plurality of connection grooves formed on the inner side surface thereof, each connection groove having a side pad corresponding to each of the top pads of the lower substrate; an image sensor installed on the top surface of the upper substrate; and a connection element that electrically connects the top pads and the side pads. | 04-19-2012 |
20120105713 | LOW PROFILE CHIP SCALE MODULE AND METHOD OF PRODUCING THE SAME - A low profile chip scale module and method of making of the same. The low profile chip scale module includes embedded SMD and integrated EM shielding. An adhesive layer is arranged on a substrate, e.g., chip carrier. Dies and SMDs are arranged on the adhesive layer. An etched frame and molding is attached to the substrate. Inputs/outputs (I/O) are formed and the substrate is coated with a dielectric material. Metal lines and connections among bond pads are formed and another layer of dielectric material is applied as a protective layer. The substrate is cut into various predetermined sizes and a lens is attached to form the chip scale module. | 05-03-2012 |
20120105714 | IMAGE CAPTURE MODULE OF HANDHELD ELECTRONIC DEVICE WITH POLYDIRECTIONAL ROTATION FUNCTION - An image capture module of a handheld electronic device is provided. In the image capture module, a spherical casing cooperates with a fixing cover and accommodates a camera module. The spherical casing is fixed in a casing of the electronic device by the fixing cover. Thus, the spherical casing can rotate transversely. In addition, the fixing cover has a slot to allow a connecting wire of the camera module to pass through, and thus, the spherical casing may rotate in the fixing cover. | 05-03-2012 |
20120113318 | Methods of Adjustment Free Manufacture Of Focus Free Camera Modules - Methods are provided for wafer scale manufacturing camera modules without adjustment components to compensate for assembly errors and optical errors incurred within manufacturing tolerances. Camera modules are assembled in wafer arrays from arrays of image sensors, arrays of lens structures and arrays of optical trim elements. At least one of the arrays is a wafer. Lens structures are configured to provide less optical power than necessary to focus an image at infinity on image sensors without trim elements. A test performed during the wafer scale assembly of camera modules, after at least the sensor array and the lens structure array assembled, determines optical errors by identifying optical distortions and aberrations quantified in terms of optical power, astigmatism, coma, optical axis shift and optical axis reorientation deficiencies. Corresponding trim elements are configured to counteract distortions and aberrations prior to singulating useful camera modules from the array. | 05-10-2012 |
20120120308 | CAPILLARY ACTUATOR DEPLOYMENT - A method for making an actuator includes forming a substantially planar actuator device of an electrically conductive material, the device incorporating an outer frame, a fixed frame attached to the outer frame, a moveable frame disposed parallel to the fixed frame, a motion control flexure coupling the moveable frame to the outer frame for coplanar, rectilinear movement relative to the outer frame and the fixed frame, an actuator incorporating a plurality of interdigitated teeth, a fixed portion of which is attached to the fixed frame and a moving portion of which is attached to the moveable frame, moving the moveable frame to a deployed position that is coplanar with, parallel to and spaced a selected distance apart from the fixed frame, and fixing the moveable frame at the deployed position for substantially rectilinear, perpendicular movement relative to the fixed frame. | 05-17-2012 |
20120133825 | IMAGING DEVICE - An imaging device includes a welded part on a lens barrel side that is hardened after a contact portion of a lens barrel or a contact part on the lens barrel side is softened, where the contact portion of the lens barrel and the contact part on the lens barrel side are fixed, and a welded part on a light-receiving circuit side that is hardened after a contact portion of the light-receiving circuit or a contact part on a light-receiving circuit side is softened, where the contact portion of the light-receiving circuit and the contact part on the light-receiving circuit side are fixed. | 05-31-2012 |
20120140115 | DRIVING DEVICE, LENS BARREL, AND OPTICAL APPARATUS INCLUDING THE LENS BARREL - In a driving device, a distance from a guide member to a vibrator is less than that from the guide member to a permanent magnet in a plane perpendicular to a guiding direction of a guide member. An attraction force between the permanent magnet and a magnetic body acts as a force to rotate (i.e., a rotating force) a holding member about an axis of the guide member, and the vibrator is pressed against a contact member by the rotating force. | 06-07-2012 |
20120147257 | ELECTRONIC APPARATUS INCORPORATING RECORDING MEDIUM FOR RECORDING DATA SUCH AS IMAGE AND/OR CHARACTER - An electronic apparatus having a mechanism configured to, when disposing of the electronic apparatus, reliably prevent data from being leaked out from a recording medium incorporated in the electronic apparatus with simple work not requiring taking the electronic apparatus apart. A recording board is provided inside an apparatus body. A recording medium is mounted on the recording board. A terminal board is provided inside the apparatus body. A connection terminal is mounted on the terminal board. A terminal hole of the connection terminal connects with an external apparatus and opens externally of the apparatus body. The terminal hole extends through the connection terminal, and a surface of the recording board is disposed so as to intersect with an extension of an axis of the terminal hole. | 06-14-2012 |
20120147258 | CAMERA MODULE - The present disclosure relates to a camera module including a fixture; a moving part centrally coupled with a lens and arranged to move relative to the fixture; three or more magnets arranged at a periphery of the moving part; and three or more coils arranged from an inner surface of the fixture to areas opposite to the three or more magnets, where each of the coils independently receives a control signal so that the moving part moves to a height direction and tilted relative to a central axis of the moving part, whereby a lens can be axially moved and tilted at the same time using arrangement of a single set of coils and magnets. | 06-14-2012 |
20120147259 | SMALL INDUSTRIAL ELECTRONIC IMAGING CAMERA - A lens mount, a board mount frame, a tri-face cover, and a connector metal bracket attached with an external interface connector which are constitutive elements forming a box-type camera housing are respectively a housing constitutive element common to a back-cable-lead assembly structure and a side-cable-lead assembly structure. The box-type camera housing having a four-piece structure in which a capable of providing an external interface connector in an arbitrary face among five faces as targets excepting a front face is achieved by the lens mount, the board mount frame, the tri-face cover, and the connector metal bracket attached with the external interface connector. | 06-14-2012 |
20120154673 | Camera module - There is provided a camera module, including: a housing having a reception space formed in a side thereof; an image sensor unit mounted in the housing; and a passive element package mounted in the reception space and connected to the image sensor unit. | 06-21-2012 |
20120154674 | IMAGE-PICKUP APPARATUS - An image-pickup apparatus | 06-21-2012 |
20120162501 | ELECTRONIC DEVICE AND IMAGING DEVICE - An electronic device comprises a housing, a sliding cover and an internal member. The housing includes a plate-like member that defines a slide opening. The sliding cover includes a cover component disposed on the plate-like member and slidably attached to the slide opening, a detected component fixed to the cover component and extending into the housing, and a first restrictor fixed to the cover component. The internal member is disposed inside the housing and includes a detector switch having a contact component configured to contact the detected component when the detected component is at a specific position and a second restrictor adjacent to the first restrictor when the detected component is at the specific position. The detector switch detects when the contact component contacts the detected component. The first and second restrictors are configured to restrict movement of the plate-like member when the detected component is at the specific position. | 06-28-2012 |
20120162502 | CAMERA MODULE SOCKET DEVICE - A camera module socket device for blocking a path through which foreign materials may ingress is provided. The camera module socket device having a camera module and a socket into which the camera module is inserted includes a cap for securing the camera module in the socket, and a buffer member for closure formed between a surface of the camera module and the cap to enclose the periphery of a lens portion of the camera module, thereby preventing malfunction of the camera module and image quality degradation due to ingress of foreign materials into the lens portion and absorbing shock forces exerted at the top of the camera module socket device. | 06-28-2012 |
20120169921 | IMAGE CAPTURE SYSTEM WITH ADJUSTMENT MECHANISM - An image capture system comprises a lens module, a ball joint, and a location element. The ball joint has a spherical joint seat and a hollow socket. The top of the spherical joint seat is coupled to the lens module, and the bottom of the spherical joint seat is coupled to the hollow socket. The location element comprises a bolt, a contact plate and a threaded retainer. The location element is set in the ball joint. Through the cooperation of the threaded retainer and the bolt, the contact plate presses the spherical joint seat and the hollow socket together, thus fixing the position of the lens module. The lens module can be adjusted and rotate about multiple axes with the ball joint. | 07-05-2012 |
20120169922 | CAMERA MODULE - A camera module includes a lens assembly and a base board assembly. The lens assembly includes a lens, an internally threaded seat, and a barrel receiving the lens. The base board assembly includes a printed circuit board and a light sensing chip for receiving light through the lens. The seat defines a receiving cavity at least partially receiving the printed circuit board and the light sensing chip. | 07-05-2012 |
20120176534 | CAMERA MODULE - A camera module includes a square substrate, an image sensor, and a lens module. The square substrate includes a mounting surface. The mounting surface includes two opposing first sides and two opposing second sides perpendicular to the two first sides. The square substrate includes two first protrusions respectively arranged on the center of the two first sides and two second protrusions respectively arranged on the center of the two second sides. The image sensor is fixed on the mounting surface. The lens module is mounted on the substrate, abutting against the two first protrusions and the two second protrusions and housing the image sensor. | 07-12-2012 |
20120182469 | CAMERA BODY - A camera body is provided that includes a base member, a body mount, a focal plane shutter and a fastening member. The body mount is configured to support an interchangeable lens. The fastening member is configured to fasten the focal plane shutter unit to the base member. The body mount, the base member, and the focal plane shutter unit are disposed between a subject side of the camera body and a user side of the camera body in that order. The focal plane shutter unit is fastened to the base member that faces toward the user side of the camera body. | 07-19-2012 |
20120182470 | COMMUNICATION APPARATUS - Disclosed is a communication apparatus including an image input unit that includes an image input member that inputs an image of an object and a retaining member that retains the image input member at its one edge; an enclosure to which a concave portion is formed at its one side surface; a uniaxial hinge device that includes a first hinge member and a second hinge member rotatably connected with each other and capable of rotating around a first axial line with respect to each other, the first hinge member being connected to the enclosure and the second hinge member being connected to the other edge of the retaining member. The image input unit is rotated via the uniaxial hinge device around the first axial line with respect to the enclosure between a housing position and a protruding position. | 07-19-2012 |
20120182471 | IMAGING DEVICE HAVING AN ANGLE ADJUSTING DEVICE FOR AN IMAGE SENSOR - The present invention relates to a digital camera which comprises a sensor holder on which an image sensor is mounted and at least one adjustment ring. The adjustment ring is configured to rotate around an optical axis (OA) of the camera. The sensor holder and the at least one adjustment ring are configured to interact via at least one cam surface such that when the at least one adjustment ring is rotated with respect to the sensor holder, a normal direction of the sensor is adjusted in relation to a direction of the optical axis. | 07-19-2012 |
20120182472 | CAMERA DRIVE DEVICE - A camera driving apparatus according to the present invention includes a camera section | 07-19-2012 |
20120188441 | CAMERA DRIVE DEVICE - A camera driving apparatus according to the present invention includes: a camera portion having an imaging plane; a movable unit incorporating the camera portion, including an attracting magnet, and having an outer shape formed as a convex partial spherical surface; a fixing unit which includes a magnetic body and a concave portion to which the movable unit is loosely fitted, and in which a magnetic attraction force of the attracting magnet with respect to the magnetic body causes the convex partial spherical surface of the movable unit and the concave portion to be held in point contact or linear contact with each other, thereby enabling the movable unit to freely rotate about a spherical center of the first convex partial spherical surface; a panning drive portion; a tilting drive portion; a rolling drive portion; and a detector for detecting a tilt angle of the camera portion in a panning direction with respect to the fixing unit, a tilt angle of the camera portion in a tilting direction with respect to the fixing unit, and a rotation angle of the camera unit to be rotated in a rolling direction with respect to the fixing unit. | 07-26-2012 |
20120200768 | LENS BARREL AND IMAGING DEVICE - An interchangeable lens unit is provided that includes a lens housing, a cam frame, a zoom motor mounted to the lens housing, and a transmission mechanism. The zoom motor has a zoom driveshaft that outputs a driving force. The transmission mechanism is configured to transmit the driving force from the zoom driveshaft to the cam frame. The lengthwise direction of the zoom motor is oriented differently than the direction of the optical axis. When viewed along the direction of the optical axis, the zoom motor is disposed on the inner peripheral side of the cam frame. | 08-09-2012 |
20120212664 | CAMERA MODULE FACILITATING HEAT DISSIPATION - A camera module includes a printed circuit board (PCB), an image sensor fixed to the PCB, a lens holder fixed to the PCB and covering the image sensor, a lens barrel coupled to the lens holder, and a lens received in the lens barrel. The lens holder includes an inner sensor cover and an outer sensor cover surrounding the inner sensor cover. The image sensor, the inner sensor cover, the lens barrel and the lens define an enclosed space. The inner sensor cover and the outer sensor cover define an intermediate space. The inner sensor cover defines an inner dissipation hole communicating the enclosed space with the intermediate space. The outer sensor cover defines an outer dissipation hole that communicates the intermediate space with the outside of the outer sensor cover. The inner dissipation hole and the outer dissipation hole are misaligned to prevent the ingress of light and dust. | 08-23-2012 |
20120218466 | CAMERA HEAD AND CAMERA DEVICE - Provided is a camera head capable of further size reduction. A camera head | 08-30-2012 |
20120218467 | CAMERA MODULE CAPABLE OF CALIBRATION - A camera module includes a circuit board; a lens electrically connected to the circuit board; a adjusting base disposed on the circuit board and having at least two through-hole disposed adjacent to opposite sides of the lens; at least two fixed posts; at least two adjusting screw respectively passing through the through-holes of the adjusting base so as to be secured in the fixed posts; and at least two springs respectively encircling the adjusting screws, wherein two ends of each spring are positioned against the adjusting base and one of the fixed post respectively. | 08-30-2012 |
20120229701 | CAMERA MODULE WITH PROTECTIVE AIR VENTILATION CHANNEL - A camera module with a vent in a housing thereof to allow for fluid communication between an interior of the camera module and an exterior of the camera module. A micro-porous membrane filter having a pore size smaller than 10 um is employed to cover the vent so as to reduce the flow of contaminants into the camera module. | 09-13-2012 |
20120249867 | IMAGING UNIT - An imaging unit includes a mount unit, an imaging element unit, a plurality of elastic members, a plurality of adjusting screws, and at least one restricting member. The mount unit is configured to support the interchangeable lens unit. The imaging element unit is disposed apart from the mount unit and is configured to produce image data for the subject by opto-electrical conversion. The plurality of elastic members is disposed in a compressed state between the mount unit and the imaging element unit. The plurality of adjusting screws is mounted to the mount unit and/or the imaging element unit to adjust the distance between the mount unit and the imaging element unit. The restricting member is mounted to the mount unit and/or the imaging element unit and configured to restrict the imaging element unit from moving close to the mount unit against the elastic force of the elastic members. | 10-04-2012 |
20120249868 | LENS MODULE, IMAGE CAPTURING DEVICE, AND ELECTRONIC APPARATUS - A lens module includes a lens body; a lens holding member that movably holds the lens body along an optical axis of the lens body without tilting the optical axis; a displacement element that has a flat-plate shape of which one end edge on a side of the lens body along the optical axis is disposed as a free end and the free end is displaced to freely approach the lens body by applying a voltage; and a push-up member that is disposed on the free end of the displacement element and is inserted on one end surface side of the lens body, which is perpendicular to the optical axis, by the approach towards the lens body of the displacement element so as to push up the lens body in the optical axis direction. | 10-04-2012 |
20120274843 | Image Capturing Device and Assembly Method Thereof - An image capturing device and its assembly method are disclosed. The image capturing device comprises a main board, a metal plate and a sensing unit. The main board comprises a first hollowed block. The metal plate comprises a second hollowed block corresponded to the first hollowed block and is disposed at one side of the main board. The sensing unit is disposed at the other side of the main board. The metal plate is parallel to the sensing element. The first hollowed block and the second hollowed block are filled by a fastening material. In addition, the image plane of the sensing unit is perpendicular to the optical axis of the lens set. Therefore, image quality is improved. | 11-01-2012 |
20120281135 | Handpiece Camera - A handpiece camera, comprising an illumination device optical elements, and an image converter. A housing is provided with an entrance window, through which an observation light returning from an examination area shines in, which is subsequently conducted to the image converter by the optical elements. The camera has a head part and a handle part, which are detachably connected to one another. The handle part can be adjusted to a wide variety of purposes when combined with different head parts. | 11-08-2012 |
20120300120 | IMAGE MODULE - An image module including a sensor, a filter, and a shading plate is provided. The filter is disposed on the sensor, and the shading plate is disposed between the sensor and the filter. The shading plate has two opposite surfaces and two adhesion layers disposed thereon separately, such that the sensor and the filter are connected to the opposite surfaces of the shading plate. | 11-29-2012 |
20120307139 | CAMERA MODULE AND FABRICATION METHOD THEREOF - A camera module and a fabrication method thereof are provided. The camera module includes a lens structure and an image sensor device chip disposed under the lens structure. The lens structure includes a transparent substrate and a lens disposed on the transparent substrate. A spacer is disposed on the transparent substrate to surround the lens, wherein the spacer contains a base pattern and a dry film photoresist. The method includes forming a base pattern on a carrier and attaching a dry film photoresist on the carrier. The dry film photoresist is planarized by a lamination process and then patterned to form a spacer. A transparent substrate having a plurality of lenses is provided. The spacer is stripped from the carrier, attaching on the transparent substrate to surround each of the lenses, and then bonded with image sensor device chips. | 12-06-2012 |
20120307140 | VOICE COIL MOTOR AND RELATED IMAGE CAPTURING MODULE - A voice coil motor includes a movable receiving cylinder having protrusions formed at an end; a wire coil surrounding the receiving cylinder; a hollow fixing frame receiving the receiving cylinder and the wire coil; magnetic members fixedly received in the fixing frame, top and bottom elastic members. The top elastic member includes a peripheral portion and a resilient central portion, the central portion having a central opening and cutouts. The protrusions of the receiving cylinder are engaged in the cutouts. The peripheral portion is fixed at a lower position than the central portion, thereby forming an elastic force applied to the receiving cylinder when no current is applied to the wire coil. The bottom elastic member is connected to the receiving cylinder and the fixing frame, and is in an undeformed state when no current is applied to the wire coil. | 12-06-2012 |
20120314126 | MINIATURIZATION IMAGE CAPTURING MODULE AND METHOD OF MANUFACTURING THE SAME - A miniaturization image capturing module includes a substrate unit, an image capturing unit, a fixing glue unit, and a lens unit. The substrate unit includes a hollow substrate body, a plurality of top conductive pads, a plurality of bottom conductive pads, a plurality of embedded conductive traces. The hollow substrate body has at least one receiving space, and each embedded conductive trace is electrically connected between at least one of the top conductive pads and at least one of the bottom conductive pads. The image capturing unit includes at least one image capturing chip received in the receiving space and electrically connected to the substrate unit. The fixing glue unit includes a fixing glue disposed in the receiving space and fixed between the hollow substrate body and the image capturing chip. The lens unit is disposed on the top side of the hollow substrate body. | 12-13-2012 |
20130016280 | IMAGE CAPTURE DEVICE WITH LINKED MULTI-CORE PROCESSOR AND ORIENTATION SENSOR - An image capture device that has an image sensor for capturing a scene, a multi-core processor with plurality of linked, identical processing units and an image sensor interface, all incorporated onto a single chip. The device also has an orientation sensor for sensing the device orientation. The processing units are configured for receiving data from the image sensor interface and an output from the orientation sensor, to simultaneously process the data. | 01-17-2013 |
20130027607 | CAMERA MODULE - Disclosed herein is a camera module including: an image sensor which converts an image entering through a lens into an electric signal; a rigid-flexible substrate which includes first and second rigid substrates distanced from each other and a flexible substrate to connect the first and the second rigid substrates to each other; a first connection part which is electrically connected to the rigid-flexible substrate; and a second connection part which has one end electrically connected to the first connection part and the other end connected to a cable, and which is disconnectable from the first connection part and the cable. | 01-31-2013 |
20130038787 | IMAGE PICK-UP APPARATUS - An image pick-up apparatus to reduce glare includes a lens module, a light shielding plate and an image sensor. The lens module includes a lens barrel and a base plate. The base plate defines a first through hole. The light shielding plate is arranged between the lens module and the base plate, and defines a second through hole. The image sensor has an exposed portion. The exposed portion has an optically effective region. The first through hole is arranged between the light shielding plate and the effective region. A projection of a border of the second through hole on the exposed surface surrounds a projection of a border of the effective region on the exposed surface, and a projection of a border of the first through hole on the exposed surface surrounds the projection of the border of the second through hole on the exposed surface. | 02-14-2013 |
20130038788 | FLEXIBLE LENS MOUNT SYSTEM FOR RAPID TILT PHOTOGRAPHY - The disclosure generally relates to photography, including both still photography and video photography. One aspect of the invention is directed toward a lens system that includes a lens, a fitting mountable to a camera, and a flexible body extending between the lens and the fitting. The fitting can be the sole support for the body relative to the camera. The body can be configured to position the lens among at least two operative positions relative to the camera when the fitting is mounted to the camera. | 02-14-2013 |
20130050571 | CAMERA MODULE HOUSING HAVING BUILT-IN CONDUCTIVE TRACES TO ACCOMMODATE STACKED DIES USING FLIP CHIP CONNECTIONS - A camera module including a housing with embedded conductive traces that allow for an increase in usable surface area of a corresponding printed circuit board (PCB) or multi-layer substrate, a reduced overall thickness of the module, a reduction in tilt management of a lens element of the module, and a facilitation in alignment of the lens element relative to the image sensor. An image sensor is electrically interconnected to first portions of the conductive traces by way of a flip chip process, and then the housing may be mounted over the PCB so that second portions of the conductive traces interconnect with corresponding conductive pads on the PCB to electrically interconnect the image sensor die to the PCB. In one arrangement, another die may be electrically interconnected to the PCB so that as assembled, the die is disposed between the image sensor and the PCB. | 02-28-2013 |
20130057755 | Camera Module - A camera module includes a lens module, an image sensor, at least one first spacer, and a bump element. The lens module includes a lens unit and a supporting unit connected to the lens unit. The image sensor is disposed corresponding in position to the lens unit for sensing light from the lens unit. The first spacer is disposed between the supporting unit of the lens module and the image sensor for separating the lens module and the image sensor. The bump element is disposed on the supporting unit. The bump element is located between the first spacer and the lens unit for preventing the first spacer from contacting the lens unit. | 03-07-2013 |
20130057756 | DRIVE UNIT, LENS MODULE, AND IMAGE PICKUP UNIT - A drive unit includes: a holding member holding an object to be driven; a polymer actuator device provided on one side of the object to be driven; one or more supporting members provided on the other side of the object to be driven; and a fixing member directly or indirectly fixing a first end of each of the polymer actuator device and the supporting members. A second end of each of the polymer actuator device and the supporting members is directly or indirectly connected to an end of the holding member. | 03-07-2013 |
20130057757 | CAMERA MODULE HAVING MEMS ACTUATOR, CONNECTING METHOD FOR SHUTTER COIL OF CAMERA MODULE AND CAMERA MODULE MANUFACTURED BY THE SAME METHOD - Disclosed is a camera module including a substrate which is provided with an electrode pad and an image sensor; a housing which is stacked on the substrate and of which an upper portion is opened so that light is incident to the image sensor; a MEMS actuator which is installed at the housing and has an electrode terminal at one side thereof, and a conductive pattern which is formed at the housing, wherein a lower end of the conductive pattern is connected with the electrode pad of the substrate, and an upper end thereof is connected with the electrode terminal of the MEMS actuator, whereby it is possible to improve electrical reliability between the electrode terminal of the MEMS actuator and the electrode pad of the substrate and facilely form the electrical connection therebetween, thereby reducing the number of processes. | 03-07-2013 |
20130063655 | CAMERA MODULE AND METHOD FOR ASSEMBLING SAME - In a method for assembling a camera module, a sensor module, a lens holder, and a lens assembly are first provided. The sensor module includes a substrate and a sensor positioned on the substrate. The lens holder is positioned on the substrate and accommodates the sensor. The lens assembly is held in the lens holder. At least one of the lens holder and the lens assembly has a chamfer at an end thereof opposite to the substrate and located between the lens holder and the lens assembly. Then, curable adhesive is applied to the chamfer. The tilt of the lens is adjusted until the lens assembly is optically aligned with the sensor. The curable adhesive is cured. | 03-14-2013 |
20130076976 | CAMERA MODULE - Disclosed herein is a camera module including: a lens barrel part in which a plurality of lenses are stacked; a housing enclosing an outer peripheral surface of the lens barrel part; an infrared (IR)-cut filter mounted at a lower portion of the housing to remove a near infrared wavelength; an image sensor mounted on a lower portion of the IR-cut filter to convert an external image into an electrical signal; a circuit board having an opening part formed at the center thereof, the opening part receiving the image sensor therein; and a plate mounted on the circuit board and made of a thermal conductive material so as to radiate heat generated from the circuit board. | 03-28-2013 |
20130076977 | IMAGE PICKUP APPARATUS HAVING IMAGING SENSOR PACKAGE - An image pickup apparatus in which an imaging sensor package reflow mounted in advance to a circuit board can be fixed to a fixture member of the image pickup apparatus. A sensor holder of a digital video camera as an image pickup apparatus has a holder body that is positioned to surround an imaging sensor package mounted to a sensor board as a circuit board. Flange portions of the sensor holder are formed to project from a rear end surface of the holder body toward a heat radiation plate having a flat plate shape. The heat radiation plate is fixed to a lens barrel in a state that the flange portions are held between the lens barrel and the heat radiation plate. | 03-28-2013 |
20130083239 | FOLDED TAPE PACKAGE FOR ELECTRONIC DEVICES - Described herein is a folded tape package for electronic devices. The folded tape package uses a flexible tape substrate having two end sections for passive components and a middle section for connecting and stacking multiple dies. The stacked dies are encapsulated or covered with a mold. One side may be left exposed for device functionality and operation with additional components or devices. The passive components may also be covered with a mold. The end sections are folded such that the end sections are in a parallel configuration with the middle section. The flexible tape substrate may be a high density interconnect flexible tape substrate with two layers. A silicon substrate may be used to interconnect a die stack to the flexible tape substrate. The folded tape package has a reduced device footprint, lower substrate warpage effects, and higher substrate yields. | 04-04-2013 |
20130093946 | DISPLAY APPARATUS - A display apparatus in which the angle of a display section can be varied freely. The display apparatus includes the display section and arms. The arms connect the display section with an attachment target to which the display section is to be attached in such a manner that inclination angles of the arms with respect to the display section or the attachment target can be changed independently of one another. The number of the arms is a multiple of four. | 04-18-2013 |
20130093947 | CAMERA MODULE - Disclosed herein is a camera module. The camera module according to preferred embodiments of the present invention includes: a lens barrel; a housing; an IR filter; an image sensor; a circuit substrate; a shield can; a heat transfer member mounted in the image sensor to transfer heat generated from the image sensor; and a protective cover mounted between the housing and the shield can while surrounding the bottom of the heat transfer member and connecting the housing and the shield can. | 04-18-2013 |
20130093948 | SOLID-STATE IMAGING APPARATUS AND METHOD OF PRODUCING A SOLID- STATE IMAGING APPARATUS - A solid-state imaging apparatus in which heat dissipation and electromagnetic shielding can be efficiently performed is provided. | 04-18-2013 |
20130100342 | IMAGE CAPTURING DEVICE - An image capturing device includes a base defining a receiving space and having two spaced-apart through holes, first and second lens units disposed within the receiving space, a circuit board connected to a bottom end of the base, and two sensor elements disposed on a top face of the circuit board below the first and second lens units. The first lens unit defines a first light communicating path corresponding in position with one of the through holes. The second lens unit defines a second light communicating path corresponding in position with the other through hole. The first and second lens units and the sensor elements are inclined inwardly, so that the first and second light communicating paths intersect each other in an extended direction and in the area external to the base. | 04-25-2013 |
20130100343 | CAMERA MODULE - The present invention relates to a camera module including: a lens unit mounted with at least one or more lenses; an image sensor mounted with an image pickup device for converting a light converged through the lenses to an electric signal; a PCB (Printed Circuit Board) mounted with the image sensor; and a holder accommodated inside the lens unit for supporting the lens unit, wherein the lens unit is bonded and fixed at an inner surface of the holder, whereby the lens unit mounted with a plurality of lenses is bonded to a lateral surface of a holder to prevent generation of vertical tilting phenomenon at the lens unit caused by a conventional improper coating of epoxy, and particularly, the coating of epoxy on the lateral surface of the holder advantageously enhances adhesive power to increase a bonded area. | 04-25-2013 |
20130107112 | CAMERA MODULE | 05-02-2013 |
20130107113 | OPTICAL COMPONENT, METHOD OF MANUFACTURING OPTICAL COMPONENT, AND CAMERA MODULE | 05-02-2013 |
20130107114 | IMAGING DEVICE | 05-02-2013 |
20130107115 | IMAGING DEVICE | 05-02-2013 |
20130120647 | IMAGING MODULE - An imaging module includes: a hollow lens holder open at both ends; a lens assembled in the lens holder and collecting light input from one end of the lens holder; a hollow imaging holder having an opening into which the light output from the lens is input; an optical member assembled in the imaging holder and transmitting or deflecting the light input from one end of the imaging holder; and an image sensor assembled in the imaging holder and having a light-receiving region configured to receive the light transmitted or deflected by the optical member and to perform photoelectric conversion of the received light, wherein an optical axis center of the lens and a center of the light received by the light-receiving region of the image sensor are aligned with each other by fitting a light-output-side end portion of the lens holder and the imaging holder to each other. | 05-16-2013 |
20130120648 | CAMERA MODULE - A camera module is disclosed, the camera module including a lens barrel including more than one sheet of lens receiving an optical image of an object, an actuator moving the lens barrel, a PCB (Printed Circuit Board) formed with an image sensor at a bottom surface of the lens barrel for converting the optical image to an electrical signal, and a holder for supporting the lens barrel and the actuator and formed with a terminal electrically connected to the actuator, wherein an electrical contact point between the actuator and the terminal is formed with two or more tiers of coated layers. | 05-16-2013 |
20130120649 | CAMERA MODULE AND MOBILE TERMINAL UNIT - A camera module of the present invention includes a wiring substrate having a connection pad, and on which an imaging device is mounted, on an upper surface side thereof, and a lens unit provided on the wiring substrate and equipped with a lens portion arranged over the imaging device, an actuator (voice coil motor) for driving the lens portion, and projected connection terminal protruding downward and connected to the actuator. The projected connection terminal of the lens unit is arranged on the connection pad of the wiring substrate, and the connection pad and the projected connection terminal are joined mutually by a conductive adhesive agent. | 05-16-2013 |
20130128105 | VISION SYSTEM CAMERA WITH MOUNT FOR MULTIPLE LENS TYPES - This invention provides a vision system housing having a front plate assembly that accommodates a plurality of lens mount types. The front plate includes a central aperture that is located at a predetermined axial (camera axis) distance from a plane of an image sensor. The aperture is stepped from a wider diameter adjacent to the front to a narrower diameter more adjacent to the sensor. This arrangement enables threaded mounting of a plurality of lens mount types, for example M12 and C-Mount. The exterior (front) surface of the front plate includes threaded holes and a removable spring clip arrangement constructed to accommodate a liquid lens positioned over the aperture with an associated lens assembly mounted within the aperture and in optical communication with the liquid lens. The lens is operated using an electrical connection provided by a cable that interconnects with a multi-pin socket positioned on the front plate. | 05-23-2013 |
20130128106 | CAMERA MODULE HOUSING HAVING MOLDED TAPE SUBSTRATE WITH FOLDED LEADS - A camera module including a flexible tape substrate (e.g., a flexible printed circuit tape portion) having a plurality of surface mount components and a first frame member mounted to a first side of the substrate and an image sensor and a frame member mounted to an opposing second side of the substrate. The substrate includes a body portion and one or more leads or wing members having conductive contacts thereon extending from the body portion. The wing members may be folded onto the second frame member so that the conductive contacts of the wing members generally face in a different direction than conductive contacts of the body portion to provide an electrical path to the surface mount components in a manner that is free of using vias extending through the substrate. A tubular housing and lens barrel may be mounted to the substrate over the first frame member. | 05-23-2013 |
20130128107 | VOICE COIL MOTOR AND CAMERA MODULE USING SAME - A voice coil motor includes a stationary magnetic field generator having a supporting frame, a moveable magnetic field generator, a case and a double sided adhesive layer. The supporting frame defines a first receiving space receiving the moveable magnetic field generator. The moveable magnetic field generator defines a second receiving space. The case encloses the stationary magnetic field generator, the moveable magnetic field generator and the double sided adhesive layer and includes a bottom plate and side plates. The bottom plate includes a first surface and a second surface facing away the first surface. The side plates extend from the second surface. The bottom plate defines a through hole. A diameter of the through hole is smaller than that of the second receiving space. The double sided adhesive layer is entirely covering the second face. | 05-23-2013 |
20130128108 | CAMERA MODULE - Exemplary embodiments of a camera module are proposed, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor, an IRCF (Infrared Cut Filter) installed at an upper surface of the base, and an adhesive member fixing the IRCF to the base. | 05-23-2013 |
20130128109 | WIRING SUBSTRATE, IMAGE PICKUP DEVICE, AND IMAGE PICKUP MODULE - A image pickup device includes a wiring substrate and an image pickup device. A wiring substrate includes an insulating substrate and a plurality of connection electrodes. The insulating substrate has a penetrating hole, and has an inclined area where its lower surface is inclined downward toward the opening. The plurality of connection electrodes are disposed in a surrounding region around the penetrating hole on the lower surface of the insulating substrate, and are to be electrically connected to an image sensor. The image pickup device is mounted on the lower surface of the insulating substrate of the wiring substrate, and is electrically connected to the plurality of connection electrodes. | 05-23-2013 |
20130141638 | CAMERA MODULE WITH REDUCED SIZE - A camera module includes a lens barrel and a lens holder. The lens barrel includes a first tubular section and a second tubular section. The first tubular section extends from an end of the second tubular section. The outer diameter of the first tubular section tapers in a direction from the image side to the object side of the lens barrel. The lens holder includes a third tubular section and a fourth tubular section. The third tubular section extends from an end of the fourth tubular section. The outer diameter of the third tubular section tapers in a direction from an image side to an object side of the third tubular section. The lens barrel threadedly inserts into the lens holder and is held by the lens holder. | 06-06-2013 |
20130141639 | CAMERA MODULE AND MOBILE COMMUNICATION TERMINAL INCLUDING THE SAME - A camera module including an optical tube including a lens, a photodetector disposed on a first portion of a substrate, and multiple capacitors disposed on a second portion of the substrate, in which the lens overlaps only the first portion of the substrate among the first portion and the second portion of the substrate. A mobile terminal including an optical tube including a lens, a photodetector disposed on a first portion of a substrate, and a plurality of capacitors disposed on a second portion of the substrate, a bezel unit to overlap a portion of the camera module, in which the lens overlaps only the first portion of the substrate among the first portion and the second portion of the substrate, and the first portion of the substrate is disposed towards an edge portion of the mobile terminal. | 06-06-2013 |
20130148016 | CAMERA MODULE - Disclosed herein is a camera module. The camera module according to preferred embodiments of the present invention includes: a housing; a printed circuit board disposed in the housing and having a heat dissipating hole formed at a first side thereof; an image sensor bonded to the printed circuit board and disposed on one surface of the heat dissipating hole; and a heat dissipating part having one side contacting the image sensor and the printed circuit board through the heat dissipating hole and the other side disposed at the outside of the housing to discharge heat generated from the image sensor and the printed circuit board to the outside of the housing. | 06-13-2013 |
20130155317 | IMAGING DEVICE - There is provided an imaging device including a lens mount on which a lens is mounted, an image sensor that has an imaging face on which a subject image is formed by the lens, an image sensor holder on which the image sensor is mounted, biasing members that bias the image sensor holder in a direction of the lens mount, and an adjustment mechanism that is provided between the image sensor holder and the lens mount to adjust a distance between the imaging face and the lens mount. | 06-20-2013 |
20130162896 | CAMERA MODULE - Disclosed herein is a camera module, including: a lens holder including a receiving unit receiving a lens module therein; a driving unit joined to the lens holder to be movable in a direction vertical to an optical-axis direction; a housing in which the driving unit is installed to be movable in the vertical direction to the optical-axis direction and having a protruding member that protrudes on one surface thereof; a shape memory alloy wire part connected to the driving unit to generate driving force in the vertical direction to the optical-axis direction; and an elastic member applying a preload to the shape memory alloy wire part to cause initial transformation. | 06-27-2013 |
20130162897 | CAMERA MODULE - Disclosed herein is a camera module including: a lens barrel including at least one lens L stacked and bonded therein and having a lower protrusion part formed on a bottom surface thereof; a housing having an internal space so as to receive the lens barrel therein and having a supporting surface supporting the lens barrel; and a substrate formed below the housing and having an image sensor mounted thereon. | 06-27-2013 |
20130162898 | IMAGE-PICKUP APPARATUS - An image-pickup apparatus includes a speaker, a movable barrel having a lens, a fixed barrel where a cam groove engaging with a cam pin provided on the movable barrel and configured to drive the movable barrel is formed on its inner periphery and an exterior part where the fixed barrel is attachable. A sound space is formed by concaving an outer periphery of the fixed barrel, the speaker is arranged so as to cover the sound space, an opening connected with the sound space is formed on the exterior part, and a bottom part of the sound space is located closer to an optical axis of the lens than to the bottom part of the cam groove in the fixed barrel. | 06-27-2013 |
20130182180 | High Density Composite Focal Plane Array - A composite focal plane assembly with an expandable architecture has a multi-layer, double-sided aluminum nitride (AlN) substrate and vertical architecture to achieve the dual function of focal plane and electronics backplane. Imaging dice and other electrical components are mounted and wire bonded to one surface and then direct backplane connectivity is provided on the opposing surface through a matrix of electrical contacts. In one embodiment, a flexible connector is sandwiched between the AlN focal plane and a FR-4 backplane is used to compensate for differences in coefficient of thermal expansion (CTE) between the AlN and commercially available high density circuit card connectors that are commonly manufactured from materials with CTE properties more closely approximating FR-4. In an alternate embodiment, the FR-4 and flexible connectors are eliminated by using high density circuit card connectors that are fabricated out of materials more closely matching the CTE of AlN. | 07-18-2013 |
20130194490 | LENS HOLDER DRIVING DEVICE CAPABLE OF EASILY MOUNTING UPPER ELASTIC MEMBER TO OUTER YOKE - A lens holder driving device includes a lens holder in which a lens assembly is mounted, a driving coil fixed to the lens holder at outside circumference thereof, a magnet opposite to the driving coil, a yoke including the magnet, an elastic member supporting the lens holder in a direction of an optical axis shiftably, and a base disposed at a lower side of the lens holder. The yoke includes an outer yoke including the magnet at an inner wall surface thereof. The elastic member includes an upper elastic member disposed at an upper side of the lens holder. The upper elastic member is mounted to the inner wall of the outer yoke in a state where the upper elastic member is positioned and fitted to a spacer. | 08-01-2013 |
20130201391 | CAMERA MODULE, IMAGE PROCESSING APPARATUS, AND IMAGE PROCESSING METHOD - According to one embodiment, an image processing apparatus includes a refocus filter generating unit and a refocus image generating unit. The refocus image generating unit executes a filtering process using a refocus filter generated by the refocus filter generating unit. A filtering level of the refocus filter is adjusted according to a subject distance of a subject to be focused and sighted among a plurality of subjects projected in a first image and a second image. | 08-08-2013 |
20130201392 | CAMERA MODULES WITH INERTIAL SENSORS - A camera module includes an actuator that is coupled to one or more lenses of an optical train configured to move relative to an image sensor to provide alignment, zoom and/or autofocus control. The actuator is configured to position one or more, e.g., three, lenses of the optical train by applying one or more bias voltages respectively between one or more pairs of actuator components. A processor uses measured capacitances of the pairs of actuator components and/or the bias voltages thereof to calculate an acceleration or force acting on the camera module and to provide information for the actuator to align the optical train along the optical path in accordance with the information. | 08-08-2013 |
20130215325 | ARCUATE MOTION CONTROL IN ELECTROSTATIC ACTUATORS - In one embodiment, an actuator includes a moving frame coupled to a fixed frame by a plurality of elongated parallel motion flexures for generally parallel motion relative to the fixed frame and between an as-fabricated position and a deployed position. The flexures are disposed at a first angle relative to a line extending perpendicularly to both the moving frame and the fixed frame when the moving frame is disposed in the as-fabricated position, and at a second angle relative to that same line when the moving frame is disposed in the deployed position, Arcuate movement of the first frame relative to the second frame is controlled by constraining the first angle to a value of less than about half of the sum of the first and second angles. | 08-22-2013 |
20130222686 | CAMERA MODULE, TERMINAL AND MANUFACTURING METHOD - A terminal includes a first board including an accommodation portion, the accommodation portion being disposed in a first groove of the first board, and a camera module mounted in the accommodation portion. A method for manufacturing a terminal includes obtaining a first board including an accommodation portion, the accommodation portion being disposed in a first groove of the first board, obtaining a camera module to be mounted in the accommodation portion, and mounting the camera module in the accommodation portion. | 08-29-2013 |
20130222687 | LENS BARREL AND IMAGING APPARATUS - A lens barrel includes a cam follower, a first cam ring with a cam slide protrusion in which a cam groove engages with the cam follower, a second cam ring so supported by the first cam ring that both are unrotatable around an axis parallel to an optical axis, a rectilinear guide ring so supported by the second cam ring that the second cam and rectilinear guide rings are rotatable around the axis and unmovable in the optical axis direction, a rectilinear guide guiding the rectilinear guide ring in the optical axis direction, a rectilinear cam ring in which a cam slide groove engages the cam slide protrusion and which guides the rectilinear guide in the optical axis direction, and a rotary ring so supported by the rectilinear cam ring that the rectilinear cam and rotary rings are rotatable around the axis and unmovable in the optical axis direction. | 08-29-2013 |
20130229570 | SHIFTED LENS CAMERA FOR MOBILE COMPUTING DEVICES - Techniques of shifting the lens stack from an image capture sensor within a smart device and/or mobile device are disclosed. The shifting of the center of the lens stack from the center of the sensor allows the Field of View (FOV) of such a camera assembly to have an angle from the normal and/or perpendicular direction from the surface of the device. Such an angle allows the FOV to be substantially horizontal and/or parallel to a surface when the device is held (e.g. by a kickstand) at a similar angle from the vertical direction. When the front of the lens stack is substantially at a front surface of the device and the sensor is attached to a back surface of the device, then the Total Track Length (TTL) is substantially the depth of the device. | 09-05-2013 |
20130229571 | OPTIMIZED DESIGNS FOR EMBEDDING WEBCAM MODULES WITH SUPERIOR IMAGE QUALITY IN ELECTRONICS DISPLAYS - The present invention is an apparatus and method of manufacture for providing image capturing modules which can be embedded into thin displays (e.g., in laptop computers) while providing for improved image quality. In accordance with several embodiments, a webcam module embedded in a display has multiple positions. A first position (or a βrestβ or βparkβ position) is the position of the webcam module when it is not in use. In this first position of the webcam module, it is in its most compact configuration, and lends itself to integration into a very thin display. In other positions, the webcam module has a more expanded configuration, thus leading to better image quality. Such an expanded configuration leads, amongst other things, to a larger depth of focus. In one embodiment, a stepped PCB is used to provide good image quality while maintaining a compact form factor as well as structural rigidity. | 09-05-2013 |
20130235261 | Plenoptic Imaging System with a Body and Detachable Plenoptic Imaging Components - A modular plenoptic imaging system, in which various components of the plenoptic imaging system can be detachably attached to each other. In this way, various primary lenses, filter modules, microlens arrays and/or sensor arrays can be interchanged. | 09-12-2013 |
20130235262 | METHOD FOR PACKAGING IMAGE SENSOR STRUCTURE AND IMAGE SENSOR STRUCTURE FORMED FROM THE SAME - A method for packaging an image sensor structure and an image sensor structure formed from the same are provided. The method comprises the steps of: providing an image sensor set on a substrate in that: a plurality of substrate conductive joints are installed on the supporting surface; adhering a transparent cover upon the image sensor set; taking a needle with adhesive therein; preferably, the adhesive is epoxy; injecting the adhesive from the needle into a periphery of the image sensor set and the transparent cover to completely seal the sensor conductive joints, the substrate conductive joints and conductive wires between the substrate conductive joints and the sensor conductive joints so as to package the image sensor set therein and form a packaging structure; and baking the packaging structure. An image sensor structure made from the same is provided. | 09-12-2013 |
20130235263 | Camera Module - Disclosed is a camera module, the module including an IR filter for filtering infrared rays, an image sensor located under the IR filter to convert an incident optic image into an electric signal, a first PCB having a window to permit passage of the optic image and a cavity extending downwards from the window to accommodate the image sensor, a predetermined portion of an upper portion of the cavity being electrically connected to a predetermined portion of an upper surface of the image sensor, and a first through hole taking a shape of a pipe that is connected at one end thereof to the window and connected at the other end to the cavity, the first through hole serving as a path for discharging air between the IR filter and the image sensor. | 09-12-2013 |
20130242181 | CAMERA MODULE WITH MAGNETIC SHIELDING AND METHOD OF MANUFACTURE - A method for manufacturing camera modules for use in portable electronic devices, such as mobile phones, is provided. More specifically, in camera modules utilizing lens motion type auto focus actuation, permanent magnets associated with voice coil motors utilized in the auto focus system, generate magnetic flux that can interfere with the process of bonding image sensors to camera modules if the permanent magnets of different voice coil motors are positioned too closely. Incorporating a magnetic shield into the manufacturing process to restrain or control the magnetic flux generated by the permanent magnets permits voice coil motors camera modules to be positioned closer together during the manufacturing process. This increases manufacturing throughput and reduces cost. | 09-19-2013 |
20130242182 | METHOD OF MANUFACTURING A PLURALITY OF OPTICAL DEVICES FOR CAMERAS - Manufacturing optical devices (e.g., for cameras) includes providing and allocating mount elements to lens modules wherein the mount elements are to be arranged within the optical devices to define a fixed separation distance between the lens modules and the image sensor plane. The mount elements have variable mount FFL sections by means of which the geometrical distance between the lens module and the image sensor plane is adjusted for each lens module, individually or in groups dependent on the optical properties of the lens modules, to compensate the variation of the lens module values among the lens modules, so that the focal planes of the lens modules falls into the image sensor plane. | 09-19-2013 |
20130242183 | Camera Module and Method for Manufacturing the Same - The present invention relates to a camera module, the camera module including: a PCB (Printed Circuit Board), an image sensor mounted on the PCB and formed with an imaging device for converting light to an electrical signal; a housing fixed a bottom end to an upper surface of the PCB, the housing being a case formed with a hole at an upper center and having a bottom-opened inner space: a lens assembly having at least one lens aligned to the lens hole by being positioned at and contacted to an upper surface of the image sensor and accommodated at an inner space of the housing; and an elastic stiffening material inserted between a lens hole periphery at an upper inner side of the housing and an upper edge of the lens assembly. | 09-19-2013 |
20130250169 | CAMERA MODULE - A camera module according to an exemplary embodiment of the present disclosure includes a housing forming an exterior appearance of the camera module, a PCB (Printed Circuit Board) mounted with an image sensor where one end of which is fixed to the housing and the other end is exposed to an outside to be connected to other parts, a lens holder including at least one or more pieces of lenses and so arranged as to be spaced apart from the image sensor at a predetermined distance, and at least two actuators mounted at areas other than an image sensor-mounted area of the PCB, wherein a position of the image sensor is controlled in response to strains of the actuators. | 09-26-2013 |
20130250170 | CAMERA MODULE - The present invention relates to a camera module, the module including: a PCB; an image sensor mounted on the PCB and formed with an image pickup device; a base mounted on the PCB and including a plated portion formed at a lower center with an opening mounted with an IR filter; a lower spring plate formed with a conductive material; a spacer arranged on an upper surface of the lower spring plate and forming a staircase structure by a rib wrapping a periphery of the lower spring plate to supportively apply a pressure to the lower spring plate; a lens actuator including a bobbin, and a yoke; an upper spring plate coupled to an upper surface of the lens actuator; and a cover arranged on an upper surface of the upper spring plate. | 09-26-2013 |
20130258181 | WAFER LEVEL CAMERA MODULE WITH SNAP-IN LATCH - An apparatus includes an image sensor module with a lens stack disposed on the image sensor module. A protective tube is disposed on the image sensor module and encloses the lens stack. The protective tube includes an outer wall having a snap-in latch element disposed thereon. A metal housing encloses the protective tube. The metal housing includes a housing foot and inner wall having an opposite snap-in latch element disposed thereon. The image sensor module is adapted to be secured between the housing foot of the metal housing and the protective tube when the opposite snap-in latch element of the metal housing is engaged with the snap-in latch element of the protective tube. | 10-03-2013 |
20130258182 | WAFER LEVEL CAMERA MODULE WITH PROTECTIVE TUBE - An apparatus includes an image sensor module with a lens stack disposed on the image sensor module. A protective tube is disposed on the image sensor module and encloses the lens stack. A metal housing encloses the protective tube. The metal housing includes a housing foot adapted to secure the image sensor module between the housing foot of the metal housing and the protective tube. | 10-03-2013 |
20130258183 | SUPPORT, IMAGING APPARATUS, AND CONNECTION METHOD FOR AN IMAGING APPARATUS - A support according to an embodiment is a support that supports a wiring board including a mounting area for an image sensor, a first lead area extending from the mounting area and having a first connection terminal formed therein, and a second lead area extending from the mounting area and having a second connection terminal formed therein. | 10-03-2013 |
20130258184 | Imaging Lens Having Five Lens Elements, and Electronic Apparatus Having the Same - An imaging lens includes: a first lens element having a positive refracting power, and having a convex object-side surface facing toward an object side; a second lens element having a negative refracting power, and having a concave image-side surface facing toward an image side; a third lens element having a negative refracting power; a fourth lens having a convex image-side surface facing toward the image side; and a fifth lens element having an image-side surface with concave and convex portions and facing toward the image side. Absolute value of a difference between Abbe numbers of the second and third lens elements is less than 10. A quotient of a thickness of the fourth lens element divided by a sum of widths of air gap among the lens elements ranges between 0.5 and 1. | 10-03-2013 |
20130258185 | Imaging Lens and Electronic Apparatus Having the Same - An imaging lens includes first, second, third, fourth, and fifth lens elements arranged from an object side to an image side in the given order. The first, second, and third lens elements have positive, negative, and negative refractive powers, respectively. The third lens element has an image-side surface having a convex portion in a vicinity of a periphery of the third lens element. The fourth lens element has a concave object-side surface. The fifth lens element has an object-side surface that has a convex portion in a vicinity of an optical axis of the imaging lens, and an image-side surface that has a concave portion in a vicinity of the optical axis and a convex portion in a vicinity of a periphery of the fifth lens element. | 10-03-2013 |
20130258186 | CAMERA BODY - This camera body includes an interchangeable lens detector, a lens information recognition component, a wireless communication component, and an output controller. The interchangeable lens detector detects whether or not the interchangeable lens is mounted to the camera body. The lens information recognition component recognizes lens information related to the interchangeable lens, according to the mounting state of the interchangeable lens. The wireless communication component performs wireless communication with the outside of the camera body. The output controller controls the output strength of the wireless communication component on the basis of the lens information in the information recognition component. | 10-03-2013 |
20130258187 | CAMERA MODULE - A camera module is disclosed. A camera module in accordance with an embodiment of the present invention includes: a housing; a lens barrel arranged inside the housing; an infrared filter fixed to one side of the lens barrel and having a window layer coated thereon so as to form a window area; an image sensor arranged beneath the infrared filter so as to correspond to the window area; and a printed circuit board having the image sensor mounted thereon. | 10-03-2013 |
20130258188 | BI-DIRECTIONAL CAMERA MODULE AND FLIP CHIP BONDER INCLUDING THE SAME - Bi-directional camera modules and flip chip bonders including the same are provided. The module includes a circuit board on which an upper sensor and a lower sensor are mounted, an upper lens and a lower lens disposed on the upper sensor and under the lower sensor, respectively, and a housing fixing the upper lens and the lower lens spaced apart from the upper sensor and the lower sensor, respectively. The housing surrounds the circuit board. The housing has a plurality of inlets and an outlet through which air flows, and the housing has an air passage connected from the inlets to the outlet via a space between lower lens and the lower sensor. | 10-03-2013 |
20130258189 | CAMERA MODULE - The present invention relates to a camera module, the module including: a PCB; an image sensor mounted on the PCB and formed with an image pickup device; a base mounted on the PCB and including a plated portion formed at a lower center with an opening mounted with an IR filter; a lower spring plate formed with a conductive material; a spacer arranged on an upper surface of the lower spring plate and forming a staircase structure by a rib wrapping a periphery of the lower spring plate to supportively apply a pressure to the lower spring plate; a lens actuator including a bobbin, and a yoke; an upper spring plate coupled to an upper surface of the lens actuator; and a cover attached to an upper surface of the upper spring plate. | 10-03-2013 |
20130265486 | MOLDED IMAGE SENSOR PACKAGE HAVING LENS HOLDER - An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support. | 10-10-2013 |
20130271648 | ALTERNATIVE LENS INSERTION METHODS AND ASSOCIATED FEATURES FOR CAMERA MODULES - A camera module has an image sensor and a lens assembly that includes a lens barrel having a first cylindrical portion that includes an externally threaded portion and a second cylindrical portion that has a larger diameter than the externally threaded portion. A lens moving mechanism includes a movable sleeve having internal threads that receive the externally threaded portion of the lens assembly. The lens moving mechanism is coupled to the image sensor such that the second cylindrical portion of the lens assembly is closest to the image sensor. The camera module is assembled by inserting the lens assembly into the lens moving mechanism from the side closest to the image sensor. An installation tool engages the second cylindrical portion to rotate the lens assembly and engage the externally threaded portion of the lens assembly with an internally threaded portion of a movable sleeve in the lens moving mechanism. | 10-17-2013 |
20130271649 | CAMERA MODULE, METHOD OF ASSEMBLY AND IMAGING DEVICE - A camera module has a lens module mounted on a substrate. The image sensor is located in a cavity in the substrate and is connected to the substrate by a bridge member, the infra-red filter. The image sensor is attached to the infra-red filter by a ring of adhesive surrounding the imaging area of the image sensor. The adhesive attaching the image sensor to the infra-red filter comprises spacers. The infra-red filter is attached to the substrate by adhesive. The cavity may extend through the substrate. The image sensor is further connected to the substrate by a sheet member, which may be made of metal. The sheet member is affixed to the bottom of the substrate and covers the hole in the substrate formed by the extension of the cavity through the substrate. A method of assembly of the camera module includes: providing a substrate with a cavity; locating the image sensor in the cavity; connecting the infra-red filter to the image sensor and the substrate; and mounting the lens module on the substrate. | 10-17-2013 |
20130278820 | MONITORING DEVICE WITH INDEPENDENT HEAT DISSIPATION FOR IMAGE CAPTURE COMPONENT - A monitoring device with independent heat dissipation for an image capture component is provided. A body module and an image capture module are designed separately. Thus, the image capture component in the image module and the processing circuit board in the body module can dissipate heat separately. The device achieves the goal of improving the image capture component and the processing circuit board in capturing high quality images. | 10-24-2013 |
20130278821 | SPRING PLATE AND CAMERA MODULE HAVING SAME - A spring plate includes a plate body having a through hole defined at the center, and a terminal perpendicularly extending from the plate body. The plate body includes an outer closed-loop frame, an inner closed-loop frame, and spring parts interconnected between the outer closed-loop frame and the inner closed-loop frame. The terminal has an end portion distal from the plate body with at least one through hole or a recess. | 10-24-2013 |
20130286282 | Camera Module and Manufacturing Method Thereof - In order to prevent a flare phenomenon of a camera module manufactured by a wafer process, there is provided a camera module including at least one lens sheet layered on a solid-state imaging device through a glass spacer, wherein an inner side wall and upper and lower surfaces or a side wall of at least the spacer is coated with a light shielding layer made of metal or black colored resin. Here, at least a peripheral portion of a lens of the lens sheet is coated with the light shielding layer. | 10-31-2013 |
20130286283 | VOICE COIL MOTOR AND CAMERA MODULE USING THE VOICE COIL MOTOR - A voice coil motor includes a fixing assembly and a moveable assembly. The fixing assembly includes a fixing frame and at least one magnet positioned on the fixing frame. The moveable assembly is movably received in the fixing assembly. The moveable assembly includes a moveable barrel. The moveable barrel includes a coil and resin filled in gaps of the coil. When the coil is powered on, the moveable barrel is capable of moving along an axis direction of the moveable barrel by a magnetic force generated by the at least one magnet. | 10-31-2013 |
20130286284 | CAMERA MODULE - The present invention relates to a camera module configured to prevent de-focusing during correction of hand-shake, and to prevent damages to devices during correction of hand-shake, the module including: a module part including a lens assembly formed with at least one or more lenses, an image sensor having an image pickup device for converting light concentrated through the lens to an electrical signal, and a PCB (Printed Circuit Board) mounted with the image sensor; a case supporting the module part by accommodating the module part; a driving part tilting the module part; and a rotation preventing part preventing the module part from rotating on a vertical axis. | 10-31-2013 |
20130293771 | IMAGING APPARATUS - A front case | 11-07-2013 |
20130293772 | CAMERA MODULE - An exemplary embodiment of the present disclosure includes a PCB mounted with an image sensor, a base installed at an upper surface of the PCB to centrally form an optical path, a lens holder coupled to an upper surface of the base to form an optical path by being mounted with at least one or more sheets of lenses, a variable lens arranged on the optical path centrally formed at the base to control a refractive index of passing light, and an infrared cut-off coating layer provided on a surface of the variable lens to filter an infrared component from the optical path-passing light. | 11-07-2013 |
20130308047 | CAMERA MODULE AND METHOD OF ASSEMBLING CAMERA MODULE - The present disclosure relates to a camera module, which includes a holder, a lens module and an image sensor module. The holder has a receiving space defined through the holder. The lens module is placed in an upper section of the receiving space. The image sensor module has an image sensor, which is placed at a bottom section of the receiving space. The lens module has at least one lens with an alignment structure facing the image sensor. The alignment structure is positioned in a non-optical area of the image sensor module. The alignment structure has an alignment center aligned with an optical axis of the lens module and the alignment center is further aligned with an image sensing center of the image sensor. The present disclosure further provides a method for assembling the camera module. | 11-21-2013 |
20130308048 | CAMERA MODULE - Disclosed herein is a camera module including: a lens barrel in which one or more lenses are installed; a housing accommodating the lens barrel; a printed circuit board coupled with a bottom of the housing and having an image sensor with a light receiving portion mounted thereon; a window film having a window formed therein to define an incident area of light incident on the image sensor; and an infrared ray blocking member blocking an infrared ray in the light incident on the image sensor. | 11-21-2013 |
20130335625 | LENS WITH SAPPHIRE SUBSTRATE AND LENS MODULE - A lens includes a substrate and an infrared-cut (IR-cut) filtering film. The substrate is made of sapphire, is configured for converging or diffusing light rays and includes an object-side surface and an image-side surface opposite to the object-side surface. The IR-cut filtering film increases the reflectivity of the substrate in relation to infrared light, and is coated on the image-side surface of the substrate. | 12-19-2013 |
20130335626 | Objective For An Image Recording Device - The invention relates to an objective for an image recording device for reproducing an image, which is created by a far-optical device. A housing, which is detachably connectable to an eyepiece of the far-optical device, has a greater inner diameter than the exterior diameter of an eyepiece housing. Both an exit pupil of the far-optical device and an entrance pupil of the objective are situated inside the housing. The objective has at least one lens, the optical axis of which is arranged to be parallel to the optical axis of the eyepiece of the far-optical device and to the middle axis of the eyepiece housing. | 12-19-2013 |
20140002726 | CAMERA, AND METHOD OF MANUFACTURING A PLURALITYOF CAMERAS | 01-02-2014 |
20140002727 | CAMERA MODULE | 01-02-2014 |
20140009674 | ADJUSTMENT DEVICE AND METHOD THEREOF - The present invention discloses an adjustment device and method thereof which are applied for adjusting a photosensitive element. The adjustment device comprises a first platform, a second platform, a third platform and a cover. The first platform comprises a curved surface body and a positioning elastic element. The second platform, having a recess corresponding to each curved surface body and having a loading support portion, is arranged on a side of the first platform. The third platform is arranged on the other side of the first platform, and when the third platform, moves in an axial direction, the first and second platform moves together with the third platform. The cover compresses the photosensitive element against the second platform. When the inclination of photosensitive element is adjusted by the adjustment device, each curve surface body and each recess keep in contact due to the expansion of each positioning elastic element. | 01-09-2014 |
20140009675 | ACTUATOR WITH POSITION SENSOR AND CAMERA MODULE USING SAME - An actuator includes a base, a stationary frame fixed on the base, a movable frame received in the stationary frame, a SMA line, a guide pole, a position sensor, and a controller. The movable frame includes a resisting surface adjacent to the base, and defines a hole. The SMA line resists on the resisting surface. Two ends of the SMA line are fixed on the stationary frame. The guide pole is fixed on the base and extends through the hole. The position sensor detects the position of the movable frame. The controller supplies current to heat the SMA line to change the length of the SMA line, the SMA line drives the movable frame to move along the guide pole accordingly. The controller adjusts the current according to the position of the movable frame detected by the position sensor. | 01-09-2014 |
20140022450 | CAMERAL MODULE WITH SEALING STRUCTURE FOR PORTABLE ELECTRONIC DEVICES - A sealing structure includes a housing and a camera module. The housing defines an annular groove. The cameral module is assembled in the housing. The camera module includes a closed, wave-shaped rib, which includes a plurality of waves. The rib is engaged with a wall of the annular groove to create a seal. | 01-23-2014 |
20140028904 | CAMERA MODULE - Disclosed herein is a camera module. The camera module includes: a lens barrel with a built-in lens collecting external images; a housing that has a receiving space in which the lens barrel is received; a driving part that is configured to include a magnet and a coil and provides a first driving force that drives the lens barrel upward and a second driving force that drives the lens barrel downward by an electromagnetic force that is generated from the magnet and the coil; a guide ball that is provided between the lens barrel and the housing and guides the motion of the lens barrel; and a position detection part that senses the position of the lens barrel, wherein the driving part drives the lens barrel upward and downward so that a preload part that provides preload returning the lens barrel to its initial position is not required. | 01-30-2014 |
20140028905 | CAMERA MODULE - A camera module is provided, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor; a holder member mounted on the PCB, a lens module screw-connected to the holder member, an actuator mounted at an upper surface of the lens module, and arranged at a position lower than an upper surface of the holder member, and an electronic circuit pattern formed on a surface of the holder member to conductibly connect the PCB and the actuator, where one end of the electronic circuit pattern is connected to the PCB, and the other end of the electronic circuit pattern is connected to the actuator. | 01-30-2014 |
20140036146 | CAMERA MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME - An exemplary embodiment of the present disclosure provides one or more pieces of lenses, a housing formed therein with the one or more pieces of lenses, and a PCB (Printed Circuit Board) fixed to the housing, mounted with an image sensor converting an optical image having passed the one or more pieces of lenses to an electrical signal and formed at a bottom surface with a solder ball. | 02-06-2014 |
20140049686 | IMAGE SENSOR MODULE AND CAMERA MODULE USING SAME - An image sensor module includes a rigid-flex board, an image sensor, and a supporting plate. The rigid-flex board defines a through hole, and includes a plurality of connecting pads adjacent to the through hole. The image sensor is positioned on one side of the rigid-flex board, and includes an image surface and a plurality of pins adjacent to the image surface. The image surface faces the through hole, and the pins are connected to the connecting pads. The supporting plate is positioned on the side of the rigid-flex board. The image sensor is positioned between the supporting plate and the rigid-flex board. | 02-20-2014 |
20140049687 | OPTICAL MODULE, WAFER SCALE PACKAGE, AND METHOD FOR MANUFACTURING THOSE - An optical module for an electro-optical device with a functional element, in particular for a camera device, and to an electro-optical device with such a module. The optical module includes a lens substrate portion with at least one lens element, and a spacer. The spacer serves to keep the lens substrate at a well defined axial distance from a base substrate portion of the fully assembled electro-optical device. In order to ensure improved performance of the functional element, an EMC shield is provided. The spacer is at least in parts electrically conductive and thus forms the EMC shield or a part thereof. A method of manufacturing a plurality of such modules on a wafer scale is also provided. | 02-20-2014 |
20140055668 | CAMERA MODULE HAVING IMAGE SENSOR AND COVER GLASS - A camera module includes an image sensor, a number of metal balls, and a cover glass. The image sensor includes an active surface and a number of pads. The active surface includes an imaging zone and a non-imaging zone surrounding the imaging zone. The imaging zone is configured to sense incident light and to convert the incident light into corresponding electric signals. The pads are formed on the non-imaging zone. The metal balls are stacked on three of the pads, which are not linear. The numbers of the metal balls on each of the three pads are equal to each other such that heights of the metal balls on each of the three pads are substantially equal to each other. The cover glass is positioned on the metal balls. | 02-27-2014 |
20140055669 | IMAGE SENSOR MODULE AND CAMERA MODULE USING SAME - An image sensor module includes a ceramic substrate, an image sensor, a conductive film, and a bottom plate. The ceramic substrate includes an upper surface, a lower surface opposite to the upper surface, a side surface connected between the upper surface and the lower surface. The ceramic substrate has a through hole through the upper and lower surfaces, a receiving recess on the lower surface, and an air hole on the side surface. The through hole communicates with the receiving recess, and the air hole communicates with the receiving recess. The image sensor is received in the receiving recess and is electrically connected to the ceramic substrate. The bottom plate is positioned on the lower surface and electrically connected to the ceramic substrate by the conductive film. | 02-27-2014 |
20140055670 | CAMERA MODULE AND ELECTRONIC DEVICE - There is provided a camera module including an image sensor unit that is configured to include an image sensor and a mounting board, a sheet-shaped heat radiation member that comes into contact with a part of the image sensor unit and a component other than the image sensor unit and is elastically deformed so that an imaging surface of the image sensor unit is moved, and an actuator that elastically deforms the sheet-shaped heat radiation member so that the imaging surface of the image sensor unit is moved. | 02-27-2014 |
20140055671 | IMAGE PICKUP APPARATUS WITH AIR COOLING UNIT - An image pickup apparatus is reduced in width and length dimensions. The image pickup apparatus has a heat sink-cum-duct disposed on a rear face side of an air cooling fan. Air sucked from an opening defined by an opening portion of the heat sink-cum-duct is guided to an air inlet port of the cooling fan through a ventilation path defined by plural fins of the heat sink-cum-duct and is discharged from an air outlet port of the cooling fan. A circuit board disposed on a rear face side of the heat sink-cum-duct is cooled and heat generated in the circuit board is radiated from a heat radiation plate. The image pickup unit, cooling fan, heat sink-cum-duct, circuit board, and heat radiation plate are each formed into a flat shape having a short dimension in optical axis direction and are substantially parallel to one another. | 02-27-2014 |
20140063335 | IMAGING APPARATUS - An imaging apparatus includes a pentaprism and outer covering members. Among the photographing light flux incident from a photographing optical system, light reflected by a rotary mirror is further reflected by the reflection surface of the pentaprism to thereby reach an ocular lens. A wireless substrate on which an antenna section is mounted is arranged between the pentaprism and a front outer cover. The substrate fixing member fixes the wireless substrate and is attached to a pentaprism fixing member so as to be electrically connected to the ground section of the imaging apparatus. The ground section of the wireless substrate is connected to the substrate fixing member at a position facing the antenna section with the optical axis of the eyepiece optical system therebetween. The electrical resistivity of a region facing the antenna section in the front outer cover is set relatively higher than the periphery of the region. | 03-06-2014 |
20140063336 | CAMERA HAVING INTERNAL ANTENNA - A camera having an internal antenna includes a metal body portion forming an external surface of the camera, excluding one side surface. A non-metallic injection grip portion comprises the one side surface and is fastened to the metal body portion. An antenna portion having at least one radiator is disposed within the injection grip portion. The configuration can allow for a more efficient arrangement of radiators and other components, reduce interference between the antenna and metal components of the camera, and can exhibit an aesthetic appearance. | 03-06-2014 |
20140071340 | MOBILE DEVICE AND OPTICAL IMAGING LENS THEREOF - The present invention provides a mobile device and an optical imaging lens thereof. The optical imaging lens comprises an aperture stop, first, second, third and fourth lens elements positioned sequentially from an object side to an image side. The first lens element with positive refracting power has a surface facing toward the object side. The second lens element with negative refracting power has a convex surface facing toward the object. The third lens element has a positive refracting power. The fourth lens element has a surface facing toward the object side with a concave portion in the vicinity of the optical axis and a surface facing toward the image side with a convex portion in the peripheral vicinity. The optical imaging lens of the present invention is capable of shortening the total length of the optical imaging lens efficiently and has good optical characteristics. | 03-13-2014 |
20140078386 | Lens Module - A lens module includes a lens set, an image sensor, a circuit board and a case. The lens set is configured to receive an optical image. The image sensor is configured to convert the optical image into an electrical signal. The circuit board includes a thermally conductive metal portion contacting the image sensor. The case is configured to accommodate the lens set, the image sensor and the circuit board and to contact the thermally conductive metal portion of the circuit board. | 03-20-2014 |
20140078387 | HOUSING FOR WAFER-LEVEL CAMERA MODULE - A housing for protecting a wafer-level camera module and fixing the wafer-level camera module to a printed circuit board (PCB) includes: four side plates, defining a quadrilateral frame; four supporting plates each fixed to a lower portion of an inner face of a corresponding one of the four side plates, each supporting plate having a top face supporting a portion of the camera module; and four bottom plates each fixed to a lower portion of an outer face of a corresponding one of the four side plates, each bottom plate having a bottom face fixed to the PCB. The housing is capable of addressing the issues of poor housing-PCB soldering, paint falling off and surface scratching and improving the efficiency in UV lamp-utilized UV adhesive curing. | 03-20-2014 |
20140078388 | CAMERA MODULE - An exemplary embodiment of the present disclosure includes an array sensor arrayed with a plurality of image sensors, and a plurality of lens units respectively mounted on the plurality of image sensors. | 03-20-2014 |
20140092297 | IMAGING DEVICE WITH ADHESIVE FILLING OPENINGS AND RELATED METHODS - An imaging device may include a housing, an image sensor IC in the housing, a lens adjacent the image sensor IC, and a cap over the lens and having an adhesive filling opening therein. The cap, the housing, and the lens may define an adhesive receiving cavity therein and in communication with the adhesive filling opening. The imaging device may also include adhesive material within the adhesive receiving cavity touching the cap, the housing, and the lens. | 04-03-2014 |
20140092298 | CAMERA MODULE - The present invention relates to a camera module, the module including a case embedded with a lens, a base supporting the case and formed with a window for passing an optical image emitted by the lens, the window being formed with a staircase unit, and a PCB (Printed Circuit Board) mounted with the base and an image sensor for converting the optical image to an electrical signal. | 04-03-2014 |
20140098287 | STRUCTURE AND MANUFACTURING METHOD FOR HIGH RESOLUTION CAMERA MODULE - The present invention discloses a structure and a manufacturing method for a high-resolution camera module, wherein the method includes the following steps: providing an image sensor wafer comprising multiple image sensor chips; performing inspection and defining if each image sensor chip is a good chip; disposing an optical cover on the image sensor chip defined as the good chip, wherein the optical cover faces a sensing area and does not cover conductive contacts; cutting the image sensor wafer to obtain the discrete image sensor chip covered with the optical cover; and disposing a first surface of the divided image sensor chip on a bottom surface of a ceramic substrate. The present invention can seal the high resolution camera module during early stage of the manufacturing process to improve the yield rate of the camera module, and downsize the camera module effectively. | 04-10-2014 |
20140098288 | SMALL FORM FACTOR MODULES USING WAFER LEVEL OPTICS WITH BOTTOM CAVITY AND FLIP-CHIP ASSEMBLY - A disclosed method of manufacturing a camera module includes providing a stack of optical elements, providing an integrated circuit image capture device (ICD) having a top surface with an array of sensors, rigidly attaching the stack of optical elements to top surface of the image capture device, providing a substrate having an opening therethrough and a recess around said opening, and attaching the image capture device to the substrate such that edges of the image capture device are disposed in the recess and the stack of optical elements extends through the opening. The method further includes providing a second substrate (e.g., host PCB) and mounting the substrate on the second substrate to attach the camera module to the host device. Optionally, the substrate is mounted to the second substrate via a reflow solder process. | 04-10-2014 |
20140104488 | HOUSING WITH TOUCH-THROUGH MEMBRANE - A camera system includes a camera and a housing that is structured to at least partially enclose the camera. The camera includes a touch-sensitive surface that can be used to receive user input. The camera housing includes a touch-through membrane in a position that allows the membrane to align with the touch-sensitive surface when the camera is placed in the housing. The membrane transfers a user's gestures so that any touch gestures that are performed on the exterior surface of the membrane are transferred to the touch-sensitive surface. | 04-17-2014 |
20140104489 | IMAGE PICKUP DEVICE - An image pickup device includes a placing section on which an image pickup element that receives light from an object is placed, a tilted surface section, which is provided on the placing section and is tilted with respect to the axis of light that enters the image pickup element, a direction specifying section, which specifies a moving direction so that the placing section moves parallel to the optical axis direction, a panel section having a surface perpendicular to the optical axis, and a rotating member, which is disposed between the tilted surface section and the panel section, and rotates and moves in the tilt direction of the tilted surface by being in contact with the tilted surface section. | 04-17-2014 |
20140111684 | Antenna Structures and Electrical Components with Grounding - An electronic device may have a conductive housing with an antenna window. Antenna structures may be mounted adjacent to the antenna window. The antenna structures may have a dielectric carrier. Patterned metal antenna traces may be formed on the surface of the dielectric carrier. A proximity sensor may be formed from a flexible printed circuit mounted on the dielectric carrier. The flexible printed circuit may have a tail that contains a transmission line for feeding the antenna structures. The transmission line may include a positive signal conductor that is maintained at a desired distance from the conductive housing using a polymer sheet. A portion of the antenna structures may protrude between a microphone and a camera module. Plastic camera module housing structures may have an inner surface coated with a shielding metal. A U-shaped conductive fabric layer may be used as a grounding structure. | 04-24-2014 |
20140111685 | CAMERA MODULE WITH LENS HOLDER AND CONNECTING PLATE BOTH POSITIONED ON SAME SUBSTRATE - A camera module includes a lens module and a connecting plate. The lens module includes a substrate and a lens holder. The substrate includes an upper surface. The upper surface includes a packaging area and a connecting area on the exterior of the packaging area. A number of first pads are positioned on the connecting area. The lens holder is positioned on the packaging area. A plurality of second pads is positioned on the connecting plate and corresponds to the first pads. The second pads of the connecting plate are electrically connected to the first pads of the substrate. | 04-24-2014 |
20140111686 | CAMERA BODY, LENS BARREL AND LENS-INTERCHANGEABLE CAMERA - A camera body includes a body-side bayonet lug, wherein a lens-side bayonet lug of a lens barrel is positioned immediately behind the body-side bayonet lug when the lens barrel is mounted to the camera body; an opposed surface formed on the rear surface of the body-side bayonet and positioned immediately in front of the lens-side bayonet lug; a body-side mount surface positioned in front of the opposed surface and with which the lens-side bayonet surface comes into contact; and a body-side contact portion, the front end of which contacts the rear end of the lens-side contact portion when the opposed surface faces the lens-side bayonet lug, the front end of the body-side contact portion being positioned in front of the opposed surface and behind the body-side mount surface. | 04-24-2014 |
20140118613 | MOBILE DEVICE AND OPTICAL IMAGING LENS - An optical imaging lens includes first, second, third, fourth and fifth lens elements positioned sequentially from an object side to an image side. The first lens element with positive refractive power has an object-side surface comprising a convex portion in the optical axis vicinity. The second lens element with negative refractive power has an object-side surface comprising a convex portion in the optical axis vicinity and an image-side surface comprising a concave portion in the optical axis vicinity. The third lens element has an image-side surface comprising a convex portion in the periphery. The fourth lens element has an image-side surface comprising a convex portion in the optical axis vicinity. The fifth lens element has an object-side surface comprising a convex portion in the optical axis vicinity and an image-side surface comprising a concave portion in the optical axis vicinity and a convex portion in the periphery. | 05-01-2014 |
20140146228 | VIDEO CAMERA DRIVING CIRCUIT AND METHOD THEREOF - A video camera driving circuit and a method thereof are provided, where the video camera driving circuit includes a connector, a determination unit and a control chip. The connector outputs an identification signal specifying either a first lens or a second lens which the connector connects to. The determination unit outputs a determination signal according to the identification signal and a reference voltage. The control chip outputs a control signal according to the determination signal. | 05-29-2014 |
20140168509 | CAMERA MODULE - There is provided a camera module including a housing having a lens part installed therein; a flexible circuit board having an extension part on which a lamp is installed, the extension part being coupled to the housing such that the lamp is disposed to be adjacent to the lens part; and a shield can having first and second through-holes formed therein such that the lens part and the lamp are exposed therethrough. | 06-19-2014 |
20140168510 | IMAGING ELEMENT MODULE AND METHOD FOR MANUFACTURING THE SAME - The front face of an opening in a first wiring substrate is covered by a transparent substrate, a light-receiving face is made to face the opening, and an imaging element chip is flip-chip bonded to the rear face side of the first substrate. A gap formed between connection terminals between the periphery of the light-receiving face of the imaging element chip and the peripheral edge section of the opening is buried in a first resin, and the entire rear face of the imaging element chip and the rear face side of the first substrate are covered by a second resin. At the front face on this rear face side, an exposed conductive portion substantially parallel with the front face of the transparent substrate is covered with the second resin. A second wiring substrate is electrically and mechanically connected to the first substrate. | 06-19-2014 |
20140184902 | IMAGE SENSOR MODULE WITH SUBSTRATE DEFINING GAS PRESSURE RELIEVING HOLE AND CAMERA MODULE USING SAME - An image sensor module includes a ceramic substrate, an image sensor, and a filter. The ceramic substrate defines a light transmitting hole and a receiving recess communicating with the light transmitting hole. The image sensor is received in the receiving recess. The filter is positioned on the ceramic substrate. | 07-03-2014 |
20140184903 | IMAGE-PICKUP APPARATUS - An image pickup apparatus capable of performing zooming and release operation easily whether the photographer operates with right-handed or left-handed without being lack of design. The image pickup apparatus includes a lens unit, a first ring operation unit that is ring shaped and arranged around the lens unit, a base unit configured to hold the first ring operation unit so that the first ring operation unit is capable of sliding in a first direction and a second direction perpendicular to an optical axis of the lens unit, and a first detector configured to detect a slide of the first ring operation unit in the first direction or the second direction. The first direction and the second direction are opposite to each other. | 07-03-2014 |
20140192260 | CAMERA MODULE - A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have first coils wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB; and buffer units provided at the connection units of the wire springs and the third PCB and configured to surround the connection units of the wire springs and the third PCB. | 07-10-2014 |
20140218606 | SYSTEMS OF AN ELECTRONIC DEVICE AND METHODS FOR MANUFACTURING THE SAME - Various systems of an electronic deice and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield and electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device. | 08-07-2014 |
20140240590 | IMAGE PICKUP UNIT AND METHOD OF MANUFACTURING THE SAME - An image pickup unit according to the present invention includes: a lens frame that internally holds an image pickup optical system; and a backside illuminated image pickup device which has a light-receiving section that receives light entering the lens frame via the image pickup optical system and which is held inside the lens frame, wherein a claw portion of the lens frame abuts an opposing surface that opposes a light-entering surface of the image pickup device so as to define a position of the image pickup optical system in an optical axis direction L with respect to the light-receiving section using the opposing surface as a reference. | 08-28-2014 |
20140253796 | Imaging Lens and Electronic Device Having the Same - An imaging lens includes first, second, third, fourth, and fifth lens elements arranged from an object side to an image side in the given order. Through surface designs of the lens elements, the imaging lens has a relatively short overall length while maintaining good optical performance. | 09-11-2014 |
20140253797 | MOBILE DEVICE AND OPTICAL IMAGING LENS THEREOF - Present embodiments provide for a mobile device and an optical imaging lens thereof. The optical imaging lens comprises five lens elements positioned sequentially from an object side to an image side. Through controlling the convex or concave shape of the surfaces and/or the refracting power of the lens elements, the optical imaging lens shows better optical characteristics and the total length of the optical imaging lens is shortened. | 09-11-2014 |
20140253798 | ADJUSTMENT ARRANGEMENT - The invention provides for an adjustment arrangement ( | 09-11-2014 |
20140267894 | Wireless Surface Illuminators - A camera system includes a wireless indicator that emits light to provide signals to a user. This wireless indicator is attached to a lens casing that covers the front face of the camera to protect components of the camera such as the lens. A wireless signal interface on the front face of the camera is configured to emit ultraviolet light in response to control circuitry within the camera. The ultraviolet light is transmitted through the lens casing to an excitable element. The excitable element produces visible light in response to the ultraviolet light. Any re-emitted visible light that travels back towards the camera lens and image sensor is reflected by a reflective layer, which is configured to transmit ultraviolet light while reflecting visible light. Therefore, the wireless indicator does not cause light artifacts or image flaws to appear in images captured by the image sensor. | 09-18-2014 |
20140267895 | IMAGE PICKUP DEVICE - An image pickup device includes a body case, a grip belt, and a Wi-Fi module stored in the body case. A communication module has a substrate, a processing circuit, and an antenna. The grip belt extends from a first attaching portion provided on a right side surface of the body case to a second attaching portion provided on a side opposite to an opening portion side of a lens barrel of the body case. The communication module is arranged closer to the opening portion of the lens barrel than a reference surface substantially orthogonal to an optical axis and passing through the first attaching portion or in the vicinity of the reference surface. | 09-18-2014 |
20140293126 | ALIGNMENT OF LENS AND IMAGE SENSOR - Embodiments related to the alignment of a lens with an image sensor in an optical device are disclosed. For example, one disclosed embodiment comprises an optical device including a printed circuit board, and an image sensor package mounted on the printed circuit board, wherein the image sensor package includes an image sensor. The optical system further comprises a lens holder including a lens, and one or more alignment features arranged on the lens holder. The one or more alignment features are configured to contact the image sensor package to mechanically align the lens holder with the image sensor package. | 10-02-2014 |
20140313406 | DISASTER DAMAGE CAMERA AND RECORDING SYSTEM - A disaster damage camera and recording system is disclosed. The system may be used to provide evidence for insurance claims, as well as other purposes. The system includes a camera for daylight, low light, dark, and night conditions. Video images from the camera is recorded on a digital video recording medium. The system contains sufficient storage for at least 24 hours of video and sufficient battery power for at least 24 hours of operation. | 10-23-2014 |
20140320738 | CAMERA MODULE AND MOBILE PHONE USING THE SAME - Disclosed herein is a camera module comprising: a circuit board; a frame coupled to the circuit board; an image sensor on the circuit board; a bobbin on the frame, a plurality of lenses being inside the bobbin; a coil wound on the bobbin, the bobbin moving to two directions based on a current applied to the coil; a magnet configured to interact the coil; and a yoke on the frame, the magnet being at an inner side of the yoke, wherein the bobbin moves to a first direction when a forward current is applied to the coil and to a second direction when a reverse current is applied to the coil. | 10-30-2014 |
20140327817 | FRAME AND INSERT FOR MOUNTING A MOBILE DEVICE TO A TRIPOD - An apparatus for mounting a mobile device on a tripod includes a frame with a rigid peripheral member defining an opening therethrough. The peripheral member includes a mount configured to releasably couple the frame to the tripod. An insert is sized and shaped to be placed into the opening of the frame and releasably engage at least a portion of the peripheral member in an assembled configuration. The insert has a membrane in the form of a cavity configured to releasably receive and support the mobile device. The membrane extends over at least a portion of the opening of the frame in the assembled configuration and includes at least one camera hole extending therethrough that is aligned with a camera lens of the mobile device when the mobile device is mounted in the cavity. | 11-06-2014 |
20140340574 | Camera Module - The present invention relates to a camera module, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a housing configured to protect the image sensor and mounted therein with camera constituent parts, and plural pieces of lenses mounted on the housing, wherein a surface of the housing is metalized. | 11-20-2014 |
20140340575 | Camera Module - An exemplary embodiment of the present invention includes a support unit, at least two or more connection units extended from the support unit, a lens coupling unit connected to each of the connection units, formed at an inner surface with a window and coupled to at least one or more sheets of lenses, and a piezoelectric driving unit formed at each of the connection units for ascending or descending the connection units and the lens coupling unit. | 11-20-2014 |
20140354878 | CAMERA MODULE FOR VEHICLE VISION SYSTEM - A camera module for use in a vision system for a vehicle includes a housing portion, a lens holding portion and a securing element. The housing portion at least partially houses circuitry of the camera module and includes a first mating surface and a first perimeter flange around the first mating surface. The lens holding portion at least partially houses a lens assembly of the camera module and includes a second mating surface and a second perimeter flange around the second mating surface. The securing element is disposed along the first and second perimeter flanges and overlaps opposite surfaces of the first and second perimeter flanges to secure the housing portion relative to the lens holding portion. | 12-04-2014 |
20140362285 | LENS MODULE AND METHOD FOR MANUFACTURING LENS MODULE - A lens module includes a housing; a lens barrel mounted in the housing; and an actuator unit including an actuator to move the lens barrel. The actuator unit has a coupling area on one end for coupling to the housing, and an adjustment portion on another end for adjusting a tilt of the lens barrel formed. | 12-11-2014 |
20140362286 | MINIATURE IMAGING AND DECODING MODULE - An imaging module for an image scanning and/or reading device, contains a camera module, a decoder module, and a chassis module for mounting the camera and decoder modules. The camera module includes a module body having a surface for receiving a circuit board, the surface including one or more recessed portions for preventing damage to the body when the one or more contacts of the circuit board are soldered. The decoder module includes a folded circuit board arrangement including parallel first and second circuit boards. The chassis module includes a main chassis having a portion that engages a processor of the decoder module to transfer heat from the processor into the main chassis. | 12-11-2014 |
20140368731 | Magnetic Optical Adapter for Electronic Devices - The invention presented generally refers to an optical adapter device which magnetically attaches one or more optical elements or assemblies to a magnetic portion of an electronic device having a camera. In particular, the optical adapter is shaped to align a first opening in housing of the optical adapter with the camera of the electronic device. The novel device and method utilizes the inherently magnetic properties of the electronic device itself, instead of requiring a predetermined magnetic mate to be built into the electronic device. | 12-18-2014 |
20150009401 | Camera Module - A camera module is disclosed, the camera module including a PCB (Printed Circuit Board), a base arranged at an upper surface of the PCB, a holder member arranged at an upper surface of the base and formed with a plurality of magnet reception portions, a surface of which facing the base is opened, and a plurality of magnets coupled to the magnet reception portions, wherein the base is formed with a protrusion configured to support a bottom surface of the magnet by being protrusively formed at a position corresponding to an opening of the magnet reception portions. | 01-08-2015 |
20150015779 | CAMERA MODULE - A camera module includes an image sensor, a circuit board, and a stiffener. The stiffener is located one side of the circuit board and includes a bottom plate grounded. The image sensor is located on another side of the circuit board. The stiffener includes a sidewall extending from the bottom plate. The sidewall and the bottom plate cooperatively hold the circuit board. An insulative coating is coated on the sidewall to avoid short circuiting. | 01-15-2015 |
20150036046 | OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES - Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material. | 02-05-2015 |
20150042874 | IN-VEHICLE CAMERA - An in-vehicle camera that is provided with a substrate, a camera body, a housing including the substrate and the camera body. The substrate is provided with the opening, and the camera body is arranged at the position of the opening of the substrate. Furthermore, the camera body is included in the housing, with a part thereof inserted into the opening. | 02-12-2015 |
20150042875 | IMAGING APPARATUS - An imaging apparatus includes a lens unit including a lens and an image sensor, a lens unit supporting unit for supporting the lens unit, a base unit for supporting the lens unit supporting unit in a manner that can tilt, a fixing base unit for supporting the base unit, a dome cover mounted to the fixing base unit, and an elastic member for elastically supporting the lens unit so that the lens unit can perform a retreat operation in an opposite direction from an object and along an optical axis direction of the lens unit when a force is applied thereto from the dome cover and even if the lens unit supporting unit leans in a tilt direction. | 02-12-2015 |
20150049242 | CAMERA DEVICE - A camera device includes: a camera including a lens; a first casing including a light-transmitting cover disposed to oppose the lens; a second casing which supports the camera within the first casing, and which surrounds the camera such that a side of the second casing opposing the light-transmitting cover is spaced from the camera with a gap; and an air flow path which allows air within the second casing to flow out toward the light-transmitting cover via the gap. The air flow path is formed between the second casing and a lens barrel of the lens. | 02-19-2015 |
20150049243 | Camera Heat Sink - A camera includes a camera body having a camera lens structured on a front surface of the camera body and electronics internal to the camera body for capturing images via the camera lens. A thermally conductive material is thermally coupled to the electronics and exposed on an external face of the camera body. The thermally conductive material transfers heat produced by the electronics to the external face of the camera, and a removable heat sink removably couples to the thermally conductive material. The camera further includes a housing structured to at least partially enclose the camera body. The housing is structured to enable at least a portion of the removable heat sink to protrude through the housing. | 02-19-2015 |
20150062421 | CAMERA MODULE - There is provided a camera module including: a lens barrel including at least one lens disposed on an optical axis; a housing having the lens barrel disposed therein; and first and second elastic members elastically supporting upper and lower portions of the lens barrel, respectively, wherein the first and second elastic members include a fixed side coupled to the housing and a driving side coupled to the lens barrel, respectively, the fixed side and the driving side being disposed to face each other based on the optical axis. | 03-05-2015 |
20150062422 | LENS ALIGNMENT IN CAMERA MODULES USING PHASE DETECTION PIXELS - Image sensors may include image pixels and phase detection pixels. Phase detection pixels may he used during active lens alignment operations to accurately align camera module optics to the image sensor during camera module assembly. During active alignment operations, phase detection pixels may gather phase information from a target that is viewed through the camera module optics. Control circuitry may process the phase information to determine a distance and direction of lens movement needed to bring the target into focus and thereby align the camera module optics to the image sensor. A computer-controlled positioner may be used to adjust a position of the camera module optics relative to the image sensor based on information from the phase detection pixels. Once the camera module optics are accurately aligned relative to the image sensor, structures in the camera module assembly may be permanently attached to lock the alignment in place. | 03-05-2015 |
20150062423 | LENS APPARATUS AND IMAGE PICKUP APPARATUS INCLUDING THE SAME - Provided is a lens apparatus, including: a lens barrel; a movable optical member arranged in the lens barrel; and an operation ring arranged on an outer peripheral surface of the lens barrel and configured to be rotated about an optical axis when the movable optical member is to be driven in an optical axis direction, the operation ring including a plurality of gears formed about the optical axis, the plurality of gears being mutually rotated at the same cycle when the operation ring is rotated, at least one of the plurality of gears being arranged apart from an electric operation member in the optical axis direction when the operation ring is rotated by the electric operation member. | 03-05-2015 |
20150062424 | CAMERA MODULE AND METHOD FOR ASSEMBLING SAME - A camera module includes a substrate, an image sensor electrically connected to a surface of the substrate, a lens holder connected to the substrate and covering the image sensor, a lens holder received into the lens holder, a connecting board, and an ACF positioned between the substrate and the connecting board. The image sensor includes a sensing surface and a number of side surfaces connecting to the sensing surface. The substrate is electrically and mechanically connected with each other by the ACF. An adhesive is distributed on each corner of the image sensor, and the adhesive connects the side surfaces of the image sensor to the substrate. | 03-05-2015 |
20150070576 | IMAGING SYSTEM INCLUDING A BODY UNIT TO WHICH A FIRST UNIT OR A SECOND UNIT IS MOUNTED - An imaging system includes: a body unit; at least one type of interchangeable lens unit; and at least one type of external unit, wherein in the case where the body unit and one of the at least one type of interchangeable lens unit are connected integrally, the imaging system becomes an imaging device capable of shooting a photographic subject, and in the case where the body unit and one of the at least one type of external unit are connected integrally, the imaging system becomes a device having a specific function of the external unit connected to the body unit, and wherein when the interchangeable lens unit or the external unit is connected to the body unit, the body unit obtains information on the type of unit connected to the body unit, and is capable of changing control of an entire device including the body unit and the unit connected to the body unit based on the type of unit connected to the body unit. | 03-12-2015 |
20150070577 | CAMERA MODULE - A camera module includes an imaging function section, a connector forming section, and a connecting section combined in a laminated body. The connecting section is thinner than the imaging function section and is bendable. The imaging function section includes a cavity and a through hole. An image sensor IC is disposed within the cavity. A lens unit is mounted in the imaging function section to be optically coupled to the image sensor IC via the through hole. A light shielding member covers a boundary between the connecting section and the imaging function section that define a height difference. | 03-12-2015 |
20150077628 | CAMERA MODULE - The camera module according to the present disclosure can improve reliability by mounting a posture sensor on a PCB and promoting a bending prevention of the PCB. | 03-19-2015 |
20150077629 | CAMERA MODULE - A camera module includes a rectangular image sensor including an effective image area, and a rectangular PCB mounted with the image sensor. The effective image area comprises a first side and a second side formed longer than the first side. The first side is parallel with a long side of the PCB, and the second side is parallel with a short side of the PCB. | 03-19-2015 |
20150085182 | MOVING CAMERA WITH OFF-AXIS SLIP RING ASSEMBLY - A camera unit includes a housing, a pan stage disposed inside the housing and rotatable relative to the housing about a pan axis, a camera lens assembly coupled to the pan stage, and a slip ring assembly having a slip ring stator fixedly coupled to the pan stage at a location offset from the pan axis. | 03-26-2015 |
20150085183 | PHOTOGRAPHING LENS ASSEMBLY AND IMAGE CAPTURING DEVICE - A photographing lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, and a sixth lens element. The first lens element has positive refractive power. The second lens element has refractive power. The third lens element has positive refractive power. The fourth lens element with refractive power has an object-side surface being concave in a paraxial region thereof. The fifth lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof. The sixth lens element with refractive power has an image-side surface being concave in a paraxial region thereof. The photographing lens assembly has a total of six lens elements with refractive power. | 03-26-2015 |
20150092105 | CAMERA MODULE AND METHOD FOR MANUFACTURING A CAMERA MODULE - A camera module, in particular, for a vehicle, the camera module including at least: an objective mount and an objective, which is held in the objective mount and has a lens holder and at least one lens secured in the lens holder, the objective being fixed in position in the objective mount by a frictional connection between an outer surface of the lens holder and an inner surface of the objective mount. A plurality of frictional connection devices spaced apart in the circumferential direction are formed on the outer surface of the lens holder and/or on the inner surface of the objective mount, in order to generate the frictional connection. To insert and to adjust the objective, the objective mount is preferably asymmetrically deformed in an elastic manner, and the objective is placed into the deformed objective mount, and the elastic deformation is subsequently removed. | 04-02-2015 |
20150098017 | IMAGING UNIT AND IMAGING APPARATUS - An imaging unit includes an attached portion which is detachably attached to an attaching portion disposed in a display apparatus including a display screen, an imaging main body portion which includes an imaging element, and a rotational mechanism which includes a rotational member formed as an arc-like portion, and connects the attached portion and the imaging main body portion such that the imaging main body portion is able to be rotated around a center of an arc of the arc-like portion as a rotational center in a direction in which an imaging direction is changed, in which when viewed from a direction in which a rotational axis of the imaging main body portion by the rotational mechanism is viewed as a point, the imaging main body portion is superposed on a circle which has the same center and the same radius as the arc of the arc-like portion. | 04-09-2015 |
20150103238 | Interface Geometry for Camera Mounting - In one or more implementations, a lens barrel assembly includes one or more lens elements and a lens barrel configured to retain the one or more lens elements. The lens barrel includes a connection portion configured to provide a physical coupling to a camera module and an interface geometry having a complementary shape of an aperture of an external enclosure of a mobile computing device sufficient to align the lens barrel and the one or more lens elements in relation to the external housing. | 04-16-2015 |
20150103239 | COMMUNICATION DEVICE - The present disclosure provides a communication device which ensures downsizing of a whole device and a communication performance of an antenna even in a case where an exterior member is mainly made of metal. The communication device of the present disclosure includes a first exterior member made of metal, a second exterior member provided at a position surrounded by the first exterior member, and an antenna provided on an inside surface of the second exterior member. The second exterior member has a resin frame having an opening, and a resin door provided in the opening. The resin door has a rotary shaft, and the first exterior member has a come-off stopper which prevents the rotary shaft from coming off. The antenna is disposed outside the come-off stopper. | 04-16-2015 |
20150103240 | CAMERA MODULE, METHOD FOR ALIGNING OPTICAL AXIS OF CAMERA MODULE AND PORTABLE ELECTRONIC DEVICE INCLUDING CAMERA MODULE - A camera module may include a lens barrel supporting a lens, a frame in which the lens barrel is provided, and a housing accommodating the frame. The frame may be pressed toward one surface of the housing to thereby be relatively aligned in the housing so that an optical axis of the lens is positioned perpendicularly with respect to an image formation surface of an image sensor. | 04-16-2015 |
20150109526 | CAMERA MODULE - Embodiments of the invention provide a camera module including a lens barrel part in which a plurality of lenses are stacked, a housing having the lens barrel part disposed therein, and an infrared (IR)-cut filter provided in the housing and disposed at a lower portion of the lens barrel part. According to at least one embodiment, the camera module further includes a circuit board having a window formed therein so as to penetrate through a central region thereof and supporting a bottom surface of the housing; an image sensor accommodated in the window of the circuit board and converting an external image into an electrical signal, and a plate coupled to a lower portion of the circuit board to radiate heat generated from the circuit board. | 04-23-2015 |
20150116591 | CAMERA MODULE - An exemplary embodiment of the present invention relates to a camera module configured to prevent a warp of an optical axis of a lens holder, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a base, a first lens holder arranged at an upper surface of the base and including at least one or more lens modules therein, a second lens holder forming an outer cover of the first lens holder, and an actuator concentrically arranged with an optical axis of the lens module for adjusting a focus of an image captured by the image sensor. | 04-30-2015 |
20150124162 | CAMERA MODULE - A camera module includes a PCB (Printed Circuit Board) installed with an image sensor, a base mounted on the PCB, and a bobbin reciprocatingly mounted above the base. A bottom elastic member is fixed to the base to support the bobbin, and a terminal is installed at the base, one end of which is conductively connected to the PCB and the other end of which is conductively connected to the bottom elastic member at a solder part. A solder cut-off part is formed at the base to cut off movement of overflowing solder from the solder part. | 05-07-2015 |
20150130999 | OPTICAL PHOTOGRAPHING LENS ASSEMBLY, IMAGE CAPTURING DEVICE AND MOBILE TERMINAL - An optical photographing lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has refractive power. The second lens element has positive refractive power. The third lens element with positive refractive power has an image-side surface being concave in a paraxial region thereof. The fourth lens element has refractive power. The fifth lens element with refractive power has an image-side surface being concave in a paraxial region thereof, wherein an object-side surface and the image-side surface of the fifth lens element are aspheric, and at least one of the surfaces of the fifth lens element has at least one inflection point. The optical photographing lens assembly has a total of five lens elements with refractive power. | 05-14-2015 |
20150131000 | CAMERA MODULE HAVING MEMS ACTUATOR, CONNECTING METHOD FOR SHUTTER COIL OF CAMERA MODULE AND CAMERA MODULE MANUFACTURED BY THE SAME METHOD - Disclosed is a camera module including a substrate which is provided with an electrode pad and an image sensor; a housing which is stacked on the substrate and of which an upper portion is opened so that light is incident to the image sensor; a MEMS actuator which is installed at the housing and has an electrode terminal at one side thereof, and a conductive pattern which is formed at the housing, wherein a lower end of the conductive pattern is connected with the electrode pad of the substrate, and an upper end thereof is connected with the electrode terminal of the MEMS actuator, whereby it is possible to improve electrical reliability between the electrode terminal of the MEMS actuator and the electrode pad of the substrate and facilely form the electrical connection therebetween, thereby reducing the number of processes. | 05-14-2015 |
20150138436 | CAMERA MODULE - One or more embodiments are directed to optical module assemblies, such as a camera module assembly, and methods of forming same. One embodiment is directed to an optical module assembly that includes a substrate having a first surface. An optical device is secured to the first surface of the substrate and electrically coupled to the substrate. A molded body is located on the first surface of the substrate outward of the optical device. The molded body includes a first recess. A lens assembly is secured to the molded body over the first recess by an adhesive material located in the first recess. In some embodiments, the molded body of the optical module assembly further includes a second recess spaced apart from the first recess. A transparent material is secured to the molded body over the second recess by an adhesive material located in the second recess. | 05-21-2015 |
20150138437 | DRIVE DEVICE WHICH CAN BE FREELY ATTACHED TO/DETACHED FROM LENS BARREL, AND PROCESS CONTROL METHOD AND ADJUSTMENT METHOD FOR SAME - There are provided a drive device that is detachably mounted on a lens barrel making time, which is required until the position of a zoom ring is detected, uniform, a method of controlling initial processing for storing a result of initial processing in a memory, and a method of adjusting an angular position. A series of pulses are output from an encoder | 05-21-2015 |
20150138438 | IMAGING SYSTEM AND CONTROL METHOD FOR IMAGING SYSTEM - An imaging system of the present invention comprises a lens unit having a barrel section that contains a photographing optical system, and an operating section provided on the barrel section, and a camera body having an imaging section for converting a subject image formed by the photographing optical system into electrical signals, and a display section for displaying the subject image based on the electrical signals, wherein the lens unit has a transmission section for transmitting information relating to the operation section, and the camera body has a receiving section for receiving information relating to the operating section that has been transmitted from the transmission section, and an association section for displaying the information relating to the operation section that has been received by the receiving section on the display section, and associating information relating to the operating section with functions of the camera body. | 05-21-2015 |
20150146092 | PHOTOGRAPHING LENS ASSEMBLY, IMAGE CAPTURING DEVICE AND MOBILE TERMINAL - A photographing lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, and a sixth lens element, which has a total of six non-cemented lens elements with refractive power. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The second lens element with refractive power has an object-side surface being concave in a paraxial region thereof. The third and the fourth lens elements have refractive power. The fifth lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The sixth lens element with refractive power has an image-side surface being concave in a paraxial region thereof. | 05-28-2015 |
20150146093 | IMAGING LENS ASSEMBLY AND MOBILE DEVICE - An imaging lens assembly includes a barrel and a lens assembly, wherein the lens assembly is disposed in the barrel. The barrel has an incident light surface and a barrel cylindrical axis, wherein the incident light surface includes a specular region including at least one specular protrusion region disposed thereon. An angle between a shortest line from an innermost edge to an outermost edge of the specular protrusion region and a normal line to the barrel cylindrical axis is ΞΈ. | 05-28-2015 |
20150146094 | Module device for a camers system, retaining spring device and corresponding camera system - A module device for a camera system having a housing device, which is provided with an inner opening and configured to allow an adjustment of an installation position of the module device in a motor vehicle; it also includes a sensor holder device which has an upper region and a base region, is coupled to the housing device via at least one support element and configured to accommodate an image sensor; a lens apparatus which is coupled to the sensor holder device in the upper region via at least one connection element and configured to generate an optical image on the image sensor; and a retaining spring device which is coupled to the housing device and the base region of the sensor holder device and is configured to press the image sensor against the sensor holder device. | 05-28-2015 |
20150304528 | DUST REMOVAL APPARATUS AND IMAGE PICKUP APPARATUS - A dust removal apparatus includes a vibrating plate, a piezoelectric element, a power supply that applies the piezoelectric element with an alternating voltage; and a control circuit that changes a frequency of the alternating voltage, in which the piezoelectric element includes first and second electrodes and a piezoelectric material, a phase transition temperature T from a first crystal phase to a second crystal phase of the piezoelectric material is β40Β° C.β¦Tβ¦85Β° C., the change of the frequency is for repeating a frequency sweep operation from a first frequency to a second frequency, and when a frequency at which an audible vibration is generated during the sweep operation is set as fns, a frequency at which the audible vibration is ended is set as fne, and a changing time from fns to fne during the sweep operation is set as Ξtn, Ξtnβ¦10 ms is satisfied. | 10-22-2015 |
20150304561 | SUSPENSION SYSTEM FOR A CAMERA LENS ELEMENT - A camera lens element is suspended on a support structure by balls that allow movement of the camera lens elementorthogonal to the optical axis and plural flexures connected between the support structure and the camera lens element to bias them against the balls whilst permitting said movement of the camera lens elementorthogonal to the optical axis. Lateral movement is driven by a lateral actuation arrangement comprising plural SMA actuator wires. The flexures provide a lateral biasing force that biases the camera lens element towards a central position. An electrical connection is made through the flexures from the support structure to the camera lens element. The flexures may be connected to laminated structures. | 10-22-2015 |
20150305160 | PACKAGE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND IMAGING MODULE - There are provided a package for mounting an electronic element which can be reduced in size and an electronic device. A package for mounting an electronic element includes an insulating base including a frame section; an electrode pad disposed on an upper surface of the frame section; a first wall conductor disposed in an upper end part of an inner wall of the frame section so as to be electrically connected to the electrode pad; and a wiring conductor embedded within the frame section so as to be electrically connected to the first wall conductor. Consequently, the package for mounting an electronic element can be reduced in size, and is capable of suppressing electrical short-circuiting between the wiring conductor and an electronic element and of suppressing occurrence of a crack in the insulating base. | 10-22-2015 |
20150312448 | SPRING-LOADED MOUNTING HOUSING FOR A CAMERA - A mounting housing for a camera includes a surface contacting member and a sliding member that is slidable within an interior conduit within the surface contacting member. The surface contacting member has a back end that is located behind a mounting surface when the mounting housing is mounted and a front end, connected to the back end, that is located in front of the mounting surface when the mounting housing is mounted. A spring is pivotably coupled to and extends outwardly from the back end, and the spring is pivotable to apply force on to a back side of the mounting surface when the mounting housing is mounted. The sliding member is slidable along the interior conduit between mounted and un-mounted positions. The sliding member is lockable in the mounted position to bias the spring against the mounting surface when the mounting housing is mounted. | 10-29-2015 |
20150312453 | Switchable Camera Mirror Apparatus - Techniques for switchable camera mirror apparatus are described. In one or more embodiments, a computing device (e.g., a tablet device, a smartphone, and so on) includes a camera functionality that is configured to capture images from a variety of different device perspectives. The camera functionality, for instance, can enable images to be captured from a front-facing device perspective, a rear-facing device perspective, and so on. Included as part of the camera functionality is a switchable mirror apparatus that is switchable to alternately reflect light from different device perspectives, such as to enable images to be captured from at least some of the different device perspectives using a single image sensor. | 10-29-2015 |
20150312456 | CAMERA SYTEM AND METHOD FOR ITS MANUFACTURE, - A camera system for a vehicle includes: a camera housing; an imager module accommodated in the camera housing, the imager module including a carrier device, a lens accommodated in the carrier device, and an image sensor accommodated at the carrier device, an optical axis of the camera system being set by the image sensor and the lens. The image sensor makes contact with a metallic housing part of the camera housing via a heat-conducting element. The imager module is fixed in one direction perpendicular to the optical axis in the camera housing, i.e., it is braced in the radial direction and cooled axially toward the rear. | 10-29-2015 |
20150326757 | HOUSING ASSEMBLY - A housing assembly for a monitoring system is provided. The housing assembly includes a main housing, a light transmission member, an adjustable arm and a shield. The main housing has a front face. The main housing has an opening located on the front face. The monitoring system is located in the main housing. The light transmission member is assembled with the opening, in which the monitoring system monitors via the light transmission member. | 11-12-2015 |
20150326759 | IMAGE CAPTURE DEVICE - Provided is an image capture device including a lens unit that includes a lens, a supporting member that supports the lens unit and rotates in a predetermined rotating direction with the lens unit, a rotation regulating member that regulates rotation of the supporting member by coming into contact with the supporting member while the supporting member is rotating, and a move permitting part that permits the rotation regulating member being in contact with the supporting member to move a predetermined amount in the rotating direction in a manner that the supporting member is rotatable 360 degrees or more in the rotating direction. | 11-12-2015 |
20150326768 | CAMERA MODULE - The camera module according to an embodiment of the present invention including: a printed circuit board on which | 11-12-2015 |
20150334277 | MEMS BASED DUST REMOVAL FOR IMAGE SENSORS - Systems and methods provide dust removal on an image sensor surface of a digital camera. Dust removal can be achieved by either imparting vibrational movement on a stage upon which the image sensor is mounted and/or by moving the stage towards one or more impact stops. The vibrational movement may shake loose any contaminants present on the image sensor. The impact of the stage at the one or more impact stops also may shake loose any contaminants present on the image sensor. | 11-19-2015 |
20150341530 | ELECTRONIC DEVICE - An electronic device includes an electronic member, a plate having a fastening part, the fastening part having a tubular shape and projecting outward with respect to the electronic member when the plate is arranged outside the electronic member, a case having a hole whose diameter is larger than the outer diameter of the fastening part, the fastening part being inserted into the hole, and a fastening member attached to the fastening part from outside of the case with the fastening part inserted into the hole. A part of the electronic member is located on the axis of the fastening part. | 11-26-2015 |
20150350500 | MOVING IMAGE SENSOR PACKAGE - A moving image sensor package is provided that may be used to provide optical image stabilization (OIS) in the same form factor as non-OIS enabled image sensors utilized in portable/mobile devices. The moving image sensor package includes an image sensor attached to a MEMS actuator mounted within a cutout in a circuit board, wherein the MEMS actuator has substantially the same thickness as the circuit board. | 12-03-2015 |
20150358513 | ELECTRONIC DEVICE - To provide a user-friendly electronic device, the electronic device includes: a first unit including a first operation unit; a second unit attachable to/detachable from the first unit; and a control unit configured to make presentation of the first operation unit in a state where the first unit and the second unit are attached to each other different from presentation of the first operation unit in a state where the first unit and the second unit are detached from each other. | 12-10-2015 |
20150365570 | DEVICE FOR PREVENTING CAMERA FROM BEING STOLEN - A device for preventing a camera from being stolen, which covers the lens module separation button of the camera body so as to prevent the lens module from being separated from the body without permission. If a thief attempts to steal the camera by separating the cover or a mounting unit, or cutting or separating a cable from an alarm, the theft-prevention device generates an alarm or a flickering light to deter thieves and to notify the owner of the camera. The device for preventing a camera from being stolen includes: a cover for covering a lens module separation button enabling a lens module to be separated from a camera body; a mounting unit for mounting the cover to the camera body; and a sensor provided in the mounting unit for sensing a separation of the mounting unit. | 12-17-2015 |
20150365571 | IMAGING MODULE, INSULATING-TUBE-ATTACHED IMAGING MODULE, LENS-ATTACHED IMAGING MODULE, AND ENDOSCOPE - An imaging module of the invention includes: an electrical cable; a solid-state image sensing device; and a three-dimensional wiring base in which a mount surface is provided on a molded product. The mount surface has two opposed apexes which sandwich a central portion therebetween and is molded so that the distance between the two apexes is the longest in distances between two points on sides of the mount surface, a cross section parallel to the mount surface of the three-dimensional wiring base is equal to the mount surface or smaller than the mount surface, and the distance between two points that is the longest in distances on sides of a shape in a plan view of the solid-state image sensing device is equal to or shorter than the distance between the two apexes. | 12-17-2015 |
20150370011 | IMAGE PICKUP APPARATUS - An image pickup apparatus includes an imaging optical system; an image pickup device; and an optical fiber bundle constituted by plural optical fibers configured to guide light from the imaging optical system to the image pickup device. A light incident surface of the optical fiber bundle is concave with respect to the imaging optical system. An optical fiber distant from an optical axis of the imaging optical system satisfies: | 12-24-2015 |
20150373237 | Method for manufacturing an imager module and a corresponding imager module - A method for manufacturing an imager module, includes: applying a flexible, in particular elastic, receiving area to a carrier device, for example, a metal plate, and applying an image sensor to the flexible receiving area, the image sensor being tiltable and/or pivotable with the flexible receiving area, attaching a lens, in particular including a guide device, on the image sensor so that the lens aligns the image sensor so that an axis, in particular an optical axis of the lens, extends essentially in parallel to a normal of the image sensor, and fixing the lens on the image sensor and/or the carrier device. The guide device may be formed by three guide pins here, whose lower pin ends define a support plane, which is placed on a sensor surface. In addition, an imager module manufactured in this way is created. | 12-24-2015 |
20150373238 | CAMERA MODULE AND ELECTRONIC DEVICE - A camera module includes a multilayer base body including a first mounting portion, a second mounting portion, and a connecting portion. The first mounting portion and the second mounting portion are connected to the connecting portion. A connector element is arranged in the second mounting portion. The first mounting portion includes a cavity, and a penetration hole penetrating from the cavity to one surface of the first mounting portion. An image sensor IC is arranged in the cavity, and the lens unit is arranged on the one surface of the first mounting portion at a location at or near the penetration hole. Peripheral circuit components and conductor patterns are mounted to or incorporated in the first mounting portion. | 12-24-2015 |
20150378133 | Imaging Device, Lens Unit, And Method For Manufacturing Imaging Device - Imaging device includes a compound eye optical system equipped with an array lens formed by arranging multiple lenses as an array in which the lenses have mutually different light axes; a lens frame having a top surface part that covers the portion of a first surface on the object side of the compound eye optical system which excludes the lenses, and a side surface part that supports the top surface part; and a solid-state imaging element that converts a photographic subject imaged by the compound eye optical system into electrical signals. The side surface part of the lens frame is adhered to the solid-state imaging element or to a member that is affixed to the solid-state imaging element, and the portion of the first surface of the compound eye optical system which excludes the lenses is adhered to the top surface part of the lens frame. | 12-31-2015 |
20150381859 | PORTABLE CAMERAS AND RELATED METHODS - A wireless camera system and related methods are disclosed in which the camera system has a camera body and a mounting base. The camera body has electronics to create a wireless connection hotspot that can be connected to wireless connection enabled device. The mounting base can be positioned on any surface and can include one or more magnetic inserts to mount the camera system on a magnetic surface, such as to a car chassis. | 12-31-2015 |
20150381861 | CAMERA MODULE - A camera module including a PCB mounted with an image sensor; a holder member disposed at the PCB; a lens module coupled to the holder member; an actuator disposed at an upper surface of the lens module; and an electronic circuit pattern extending along an outer surface of the holder member. Further, a first end of the electronic circuit pattern is electrically connected to the PCB, and a second end of the electronic circuit pattern is electrically connected to the actuator | 12-31-2015 |
20160004041 | Imaging Lens, and Electronic Apparatus Including the Same - An imaging lens includes first to sixth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant optical parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance. | 01-07-2016 |
20160004050 | OPTICAL IMAGE CAPTURING SYSTEM - The invention discloses a six-piece optical lens for capturing image and a six-piece optical system for capturing image. In order from an object side to an image side, the optical lens along the optical axis comprises a first lens with a positive refractive power having a convex object-side surface; a second lens with a refractive power; a third lens with a refractive power; a fourth lens with a refractive power; a fifth lens with a refractive power; and a sixth lens with a negative refractive power having a concave object-side surface; and at least one of the image-side surface and object-side surface of each of the sixth lens element has inflection points and both of the image-side surface and object-side surface of the sixth lens element are aspheric. The optical lens can increase aperture value and improve the imagining quality for use in compact cameras. | 01-07-2016 |
20160006912 | CAMERA MODULE - A camera module is disclosed. The camera module in accordance with an aspect of the present invention can include a housing having a receiving portion formed therein and a lens barrel being inserted into the receiving portion, and a rib can be formed on an inside surface of the receiving portion, and an insertion groove can be formed on an outside surface of the lens barrel in an latitudinal direction in such a way that the lens barrel is engaged with the housing by inserting the rib into the insertion groove. | 01-07-2016 |
20160006913 | OPTICAL IMAGING APPARATUS, IN PARTICULAR FOR COMPUTATIONAL IMAGING, HAVING FURTHER FUNCTIONALITY - The optical apparatus comprises a semiconductor substrate and at least one optics substrate. The semiconductor substrate comprises a first active region establishing a first image sensor, said semiconductor substrate further comprising an additional active region, different from said first active region. The additional active region establishes or is part of an additional sensor which is not an image sensor. And the at least one optics substrate comprises for said first image sensor at least one lens element for imaging light impinging on the optical apparatus from a front side onto the first image sensor. Preferably, at least two or rather at least three image sensors are provided, such that a computational camera can be realized. The additional sensor may comprise, e.g., an ambient light sensor and/or a proximity sensor. | 01-07-2016 |
20160021283 | METHOD FOR CLEANING OFF PARTICLES WITHIN CAMERA MODULE AND CAMERA MODULE - A camera module includes a sensing chip, a lens module and a gluing element. The gluing element is disposed on the sensing chip and located at a side of the sensing region. The lens module covers the sensing chip. A lens assembly of the lens module is aligned with the sensing region. When the camera module is subject to a vibration, the particles within the camera module are moved to and adsorbed on the gluing element. Consequently, the camera module o can reduce the possibility of falling down the particles on the sensing region. | 01-21-2016 |
20160021284 | PHOTOELECTRIC CONVERSION APPARATUS, AND IMAGING SYSTEM USING THE SAME - An apparatus having a first region including a photoelectric conversion element, and a second region, includes a member provided above the second region and only arranged in the second region in a planar view, and a color filter layer including color filters with a plurality of colors that is provided across the first and second regions and positioned above the member. The color filter layer includes a color filter with a first color provided across the first and second regions to cover a difference in level caused by the member. The color filter with the first color has a first thickness d | 01-21-2016 |
20160028927 | ELECTRONIC APPARATUS - An electronic apparatus includes: a main body including a housing section that houses a battery; a lid attached to the main body to cover the housing section, the lid being adapted to perform state shift between a closed state and an open state; and a locking member attached to the main body, the locking member locking the lid both in the closed state and in the open state. | 01-28-2016 |
20160031754 | PROCESS FOR PRODUCING PHASE SEPARATION GLASS FILM, PROCESS FOR PRODUCING POROUS GLASS FILM, GLASS MEMBER, AND IMAGING DEVICE - A process for producing a phase separation glass film including a film formation step of forming a film including glass powder on both faces of a substrate, and a baking step of baking the film to form a phase separation glass film on both faces of the substrate simultaneously. The baking step is performed in a state in which the substrate is disposed such that an in-plane direction of the substrate is perpendicular to a gravitational direction by supporting the substrate at a portion where the film is not formed. In the baking step, a member having a thermal conductivity higher than that of the substrate is disposed below the substrate so as not to be in contact with the film. | 02-04-2016 |
20160035921 | PHOTOELECTRIC CONVERSION APPARATUS AND IMAGE PICKUP SYSTEM - A photoelectric conversion apparatus includes a photoelectric conversion unit having a light incident surface and including: a first electrode; a second electrode disposed further toward the light incident surface; and a photoelectric conversion layer disposed between the first and second electrodes. The photoelectric conversion apparatus includes a member in contact with the photoelectric conversion layer and constituting a light guide together with the layer. An area of a first surface parallel to the light incident surface at a portion of the photoelectric conversion layer surrounded by the member is smaller than an area of a second surface disposed between the first surface and the second electrode at a portion of the photoelectric conversion layer surrounded by the member, and an area of orthogonal projection to the light incident surface of the first electrode is smaller than an area of orthogonal projection to the light incident surface of the second surface. | 02-04-2016 |
20160037031 | MULTI-SENSOR CAMERA WITH APERTURED CIRCUIT-CARRYING SUBSTRATE - A circuit-carrying assembly for use in an imaging system, the assembly comprising a first circuit carrier; a second circuit carrier spaced apart from the first circuit carrier; at least one attachment member to attach the circuit-carrying assembly to a rigid support member; and a compliant part between the first circuit carrier and the second circuit carrier, the compliant part allowing the second circuit carrier to move towards and away from the first circuit carrier. | 02-04-2016 |
20160037033 | SOLID STATE IMAGING DEVICE AND ELECTRONIC APPARATUS - A solid state imaging device including: a pixel region that is formed on a light incidence side of a substrate and to which a plurality of pixels that include photoelectric conversion units is arranged; a peripheral circuit unit that is formed in a lower portion in the substrate depth direction of the pixel region and that includes an active element; and a light shielding member that is formed between the pixel region and the peripheral circuit unit and that shields the incidence of light, emitted from an active element, to the photoelectric conversion unit. | 02-04-2016 |
20160037036 | CAMERA ASSEMBLY FOR AN ELECTRONIC DEVICE HAVING A SEAL MEMBER INTEGRALLY FORMED THEREWITH - A camera assembly for an electronic device. The camera assembly comprises an image sensor, a housing barrel, at least one lens and a seal member. The housing barrel is positioned above the image sensor and includes a proximal end and a distal end, as well as an inner surface which defines a barrel cavity. The image sensor is configured to receive light that extends through the barrel cavity. The at least one lens is positioned within the housing barrel. The upper lens cover is positioned over the distal end of the housing barrel. The upper lens cover has an inner surface and an outer surface. The seal member is integrally formed with one of the housing barrel, at a distal end thereof, and the inner surface of the upper lens cover, wherein the seal member effectively provides a seal between the housing barrel and the upper lens cover. | 02-04-2016 |
20160044213 | IMAGE CAPTURING MODULE FOR SAVING FOCUSING TIME AND INCREASING ASSEMBLY FLATNESS AND METHOD OF ASSEMBLING THE SAME - An image capturing module for saving focusing time and increasing assembly flatness and a method of assembling the same are disclosed. The image sensing chip has a first horizontal top surface, the optical filter has a second horizontal top surface, and the first horizontal top surface and second horizontal top surface are obtained by a horizontal correction system using a laser light source. The distance from the second horizontal top surface to the first horizontal top surface is defined as a predetermined fixed focusing distance. Whereby, the movable lens assembly is directly disposed on the second horizontal top surface to save the focusing time of the movable lens assembly relative to the image sensing chip, and the first horizontal top surface and the second horizontal top surface are horizontal to each other for increasing the assembly flatness of the movable lens assembly relative to the image sensing chip. | 02-11-2016 |
20160057323 | PCB-Mountable Lens Adapter For A PCB-Mountable Camera Module - A PCB-mountable lens adapter includes an adapter lens for being a component of an imaging system that has a second field of view different from the first field of view, the imaging system comprising the adapter lens and the camera lens; and an adapter housing for holding the adapter lens and for attaching to a PCB. A method for modifying the field of view of an camera module includes attaching a PCB-mountable lens adapter to a PCB, the PCB-mountable lens adapter including an adapter lens mounted in an adapter housing, the PCB being configured for surface-mounting of the camera module thereto. | 02-25-2016 |
20160062087 | ELECTRONIC DEVICE WITH INTERNALLY-HOUSED CAMERA - An internally-housed camera in an electronic device includes a lens assembly and an image convertor located above the lens assembly. The lens assembly includes a lens and a reflector arranged at an acute angle with the lens. When incident light is received by the lens and reflected to the reflector, the reflector upwardly reflects one part of the incident light through 90 degrees to image convertor, and refracts the other part of the incident light to a back side of the reflector. The image convertor generates a corresponding image of the incident light. | 03-03-2016 |
20160065802 | MECHANICALLY ISOLATED EXTERNAL CONNECTOR - An imaging system includes a housing, circuitry within the housing, and a connector coupled to the circuitry and extending from the housing for electrical and mechanical connection with a personal electronic device. The connector can be secured to the housing using a connector support that is resilient and flexible. The connector can be electrically coupled to a main printed circuit board assembly using a flexible circuit. The resilient connector support can be configured to allow movement of the connector relative to the housing. The flexible circuit is configured to maintain electrical connection to the main printed circuit board assembly when the connector moves relative to the housing. The imaging system can be a thermal imaging system and may include an infrared camera core. | 03-03-2016 |
20160065818 | Electronic Device Flash Shutter - An electronic device may have a camera module for acquiring still and video digital images of a subject. A light source such as a light-emitting diode may serve as a flash for the camera module. A shutter may be mounted above the light-emitting diode. When the light-emitting diode is not being used to produce a flash of light for illuminating the subject, the shutter may be closed to block the light-emitting diode from view by a user. During image acquisition operations in which it is desired to illuminate the subject, the shutter may be opened to allow light from the light-emitting diode to exit the electronic device. The electronic device may have a touch screen display with an active region and an inactive region. The camera module and light source may be mounted under a portion of the inactive region of the display. The shutter may include a filter structure. | 03-03-2016 |
20160072996 | DUAL SHOT STROBE LENS AND FLEX AND STIFFENER FEATURES OF A CAMERA - An electronic device having a lens and a lens retaining member is disclosed. The lens and the lens retaining member may both be molded in a single mold cavity. However, the lens includes a first material that is clear and translucent, while the lens retaining member includes a second material that is opaque. The lens retaining member may include an alignment such that the lens and lens retaining member, when secured to a flexible circuit, may self-align with a window. The window allows a light source to emit light while the lens retaining member blocks or reflects light. In another embodiment, a container having a first member and a second member may be positioned around a camera module. The container may act as an EMI shield for the camera module. | 03-10-2016 |
20160080616 | SOLID-STATE IMAGING DEVICE, DRIVE METHOD THEREOF AND CAMERA SYSTEM - A solid-state imaging device includes: pixel signal reading lines; a pixel unit in which pixels including photoelectric conversion elements are arranged; and a pixel signal reading unit performing reading of pixel signals from the pixel unit through the pixel signal reading lines, wherein the pixel signal reading unit includes current source circuits each of which includes a load element as a current source connected to the pixel signal reading line forming a source follower, and the current source circuit includes a circuit generating electric current according to a slew rate of the pixel signal reading line and replicating electric current corresponding to the above electric current to flow in the current source. | 03-17-2016 |
20160088198 | ACTUATOR UNIT AND CAMERA MODULE INCLUDING THE SAME - There is provided an actuator unit including: a support member supporting a first lens so that the first lens is maintained in a non-contact state with a second lens adjacent thereto; and a piezoelectric member connected to the support member, deforming the support member so that the lenses are movable in an optical axis direction, and including a plurality of piezoelectric elements and a plurality of internal electrodes. The actuator unit configured as described above may improve driving reliability of the lens. | 03-24-2016 |
20160088199 | IMAGING DEVICE - A imaging device includes: a case having bottom and top plate portions with an accommodation space interposed therebetween; a dome cover protruding outward from the case through an opening formed in the top plate portion; an annular support member allowing a circumferential edge portion of the dome cover to be interposed between the support member and the top plate portion; a lens unit; and an elastic member disposed between the bottom plate portion and the lens unit and allows the lens unit to be biased in a direction toward the dome cover. The lens unit includes an outer circumferential portion disposed on outside of a lens in a direction along the bottom plate portion and engaged with an inside opening of the support member, and a stepped portion provided in the outer circumferential portion and restricts movement in the direction approaching the dome cover by abutting the support member. | 03-24-2016 |
20160088201 | CAMERA MODULE - Disclosed herein is a camera module. The camera module includes: a lens barrel with a built-in lens collecting external images; a housing that has a receiving space in which the lens barrel is received; a driving part that is configured to include a magnet and a coil and provides a first driving force that drives the lens barrel upward and a second driving force that drives the lens barrel downward by an electromagnetic force that is generated from the magnet and the coil; a guide ball that is provided between the lens barrel and the housing and guides the motion of the lens barrel; and a position detection part that senses the position of the lens barrel, wherein the driving part drives the lens barrel upward and downward so that a preload part that provides preload returning the lens barrel to its initial position is not required. | 03-24-2016 |
20160099429 | OPTICAL DETECTOR AND METHOD FOR MANUFACTURING THE SAME - An optical detector ( | 04-07-2016 |
20160103299 | PHOTOGRAPHING OPTICAL LENS ASSEMBLY, IMAGE CAPTURING UNIT AND ELECTRONIC DEVICE - A photographing optical lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region. The second lens element has refractive power. The third lens element has positive refractive power. The fourth lens element has refractive power. The fifth lens element with positive refractive power has an object-side surface being convex in a paraxial region and an image-side surface being convex in a paraxial region. The sixth lens element with positive refractive power has an object-side surface being convex in a paraxial region and an image-side surface being concave in a paraxial region, and the image-side surface thereof has at least one inflection point. | 04-14-2016 |
20160109501 | BACK-PLANE CONNECTOR FOR CUBESAT - A back-plane connector connects component boards for a cubesat with a processing unit and a board connector electrically connected to the back-plane connector. The board connector mates with complimentary connectors on the component boards. The arrangement facilitates assembly, testing and operational reliability. An image capture system may be included and has an image capture device with a multiplexer for interactive collection and storage of image and video data. | 04-21-2016 |
20160112614 | SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS - The present disclosure relates to a solid-state imaging device, a method for manufacturing the same, and an electronic apparatus capable of improving sensitivity while suppressing degradation of color mixture. The solid-state imaging device includes an anti-reflection portion having a moth-eye structure provided on a boundary surface on a light-receiving surface side of a photoelectric conversion region of each pixel arranged two-dimensionally, and an inter-pixel light-blocking portion provided below the boundary surface of the anti-reflection portion to block incident light. In addition, the photoelectric conversion region is a semiconductor region, and the inter-pixel light-blocking portion has a trench structure obtained by digging the semiconductor region in a depth direction at a pixel boundary. The techniques according to the present disclosure can be applied to, for example, a solid-state imaging device of a rear surface irradiation type. | 04-21-2016 |
20160116701 | SUBSTRATE FOR MOUNTING IMAGING ELEMENT, AND IMAGING DEVICE - A substrate for mounting an imaging element is a substrate for mounting an imaging element that includes a base. The base has: a through-hole having an opening in a top surface of the base; a cover mounting region provided on the top surface, in a rim of the opening of the through-hole; a lens-housing mounting region | 04-28-2016 |
20160119517 | CAMERA ACTUATOR - Some embodiments include an actuator assembly for mounting a moving component. In some embodiments, the actuator assembly includes a base substrate including a first portion for mounting comb drive actuators and a second portion for mounting the moving component. In some embodiments, the actuator assembly includes a plurality of comb drive actuators rigidly affixed to the first portion of the base substrate. In some embodiments, the plurality of comb drive actuators is flexibly affixed to the second portion of the base substrate by a plurality of respective mechanical flexures. In some embodiments, the respective mechanical flexures provide a flexible mechanical connection between the second portion and the first portion, and the plurality of comb drive actuators is arranged to control the motion of the second portion to adjust the position of the moving component in multiple degrees of freedom relative to first portion. | 04-28-2016 |
20160126283 | SEMICONDUCTOR DEVICE, IMAGING DEVICE, AND ELECTRONIC DEVICE - Provided is a novel semiconductor device, a semiconductor device with reduced area, or a versatile semiconductor device. The semiconductor device includes a pixel portion including a first pixel, a second pixel, a third pixel, and a fourth pixel; a first switch and a second switch located outside the first to fourth pixels; a first wiring located outside the first to fourth pixels; a second wiring electrically connected to the first and second pixels; and a third wiring electrically connected to the third and fourth pixels. A first terminal of the first switch is electrically connected to the first wiring. A second terminal of the first switch is electrically connected to the second wiring. A first terminal of the second switch is electrically connected to the first wiring. A second terminal of the second switch is electrically connected to the third wiring. | 05-05-2016 |
20160134789 | IMAGING DEVICE AND ELECTRONIC DEVICE - To provide an imaging device capable of obtaining high-quality imaging data. The imaging device includes a first circuit and a second circuit. The first circuit includes a photoelectric conversion element, a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, a sixth transistor, a seventh transistor, a first capacitor, a second capacitor, and a third capacitor. The second circuit includes an eighth transistor. The imaging device can compensate variation in threshold voltage of an amplifier transistor included in the first circuit. | 05-12-2016 |
20160139357 | IMAGING MODULE AND ELECTRONIC DEVICE - The present invention provides an imaging module capable of performing positioning of an imaging element unit, and a lens unit at a low cost and with high precision and an electronic device including the imaging module. An imaging module | 05-19-2016 |
20160142599 | IMAGING MODULE AND ELECTRONIC APPARATUS - The invention provides an imaging module having second connecting portions capable of reliably performing probing and can maintain a small installation space, and an electronic apparatus including the imaging module. A lens unit includes at least one drive unit, a housing, a first connecting portion that is electrically connected to an imaging element unit, a first wiring portion that electrically connects the drive unit to the first connecting portion, a plurality of second connecting portions that are disposed outside the housing, and a second wiring portion that electrically connects the second connecting portions to the drive unit. The second wiring portion includes wires that are electrically connected to the drive unit to which the first wiring portion is connected, and at least a part of the second wiring portion extends to the outside of the housing in a direction in which an element wiring portion extends from the support portion. | 05-19-2016 |
20160150137 | Camera Module - The present disclosure relates to a camera module including a fixture; a moving part centrally coupled with a lens and arranged to move relative to the fixture; three or more magnets arranged at a periphery of the moving part; and three or more coils arranged from an inner surface of the fixture to areas opposite to the three or more magnets, where each of the coils independently receives a control signal so that the moving part moves to a height direction and tilted relative to a central axis of the moving part, whereby a lens can be axially moved and tilted at the same time using arrangement of a single set of coils and magnets. | 05-26-2016 |
20160154152 | LENS DEVICE AND IMAGE CAPTURING DEVICE | 06-02-2016 |
20160156817 | MANUFACTURING METHOD OF IMAGING APPARATUS, IMAGING APPARATUS, AND IMAGING SYSTEM | 06-02-2016 |
20160156819 | METHOD AND SYSTEM FOR CMOS IMAGE SENSING DEVICE | 06-02-2016 |
20160165106 | Lens Stack Arrays Including Adaptive Optical Elements - Systems and methods in accordance with embodiments of the invention incorporate adaptive optical elements into optical channels in a lens stack array. In one embodiment, an array camera module includes a lens stack array, that includes at least two lens stacks, where at least one lens stack includes an adaptive optical element that can adjust the characteristics of the transmission of light in the optical channel defined by the corresponding lens stack in response to at least one electrical signal, a sensor including a focal plane for each lens stack within the lens stack array, and circuitry configured to control at least one adaptive optical element, where the lens stack array and the sensor are configured so that each lens stack can form an image on a corresponding focal plane. | 06-09-2016 |
20160165108 | CAMERA MODULE - A camera module includes: a housing including an accommodating space configured to accommodate a lens part, the housing including an upper surface and a first opening in the upper surface configured to expose the lens part; a seating part recessed in a portion of a lower surface of the housing and including a second opening configured to allow light incident to the lens part to pass therethrough; a protrusion part protruding from the seating part in a downward direction of the housing; and an infrared cut-off filter including a through-hole in a position corresponding to a position of the protrusion part such that the protrusion part is inserted into the through-hole and the infrared cut-off filter is seated in the seating part. | 06-09-2016 |
20160165115 | IMAGE PICKUP ELEMENT UNIT AND IMAGE PICKUP APPARATUS - This image pickup element unit is provided with: an image pickup element substrate having mounted thereon an image pickup element that converts inputted light into electric signals; and a temperature adjusting member for adjusting the temperature of the image pickup element. The image pickup element unit is configured such that: the temperature adjusting member is configured to have a recessed section, and include a left-side member, a right-side member, an upper-side member, a lower-side member, and a rear-side member of the recessed section; the image pickup element is disposed to be surrounded by the left-side member, the right-side member, the upper-side member, the lower-side member, and the rear-side member; and the image pickup element unit is attached to the image pickup element substrate by having the rear-side member therebetween. | 06-09-2016 |
20160173747 | Camera Module | 06-16-2016 |
20160182777 | METHODS AND APPARATUS FOR IMPLEMENTING AND USING CAMERA DEVICES | 06-23-2016 |
20160182780 | MULTIPLE PHOTOSITES PIXEL ARCHITECTURE | 06-23-2016 |
20160182783 | IMAGE PICKUP APPARATUS | 06-23-2016 |
20160191758 | IC IMAGE SENSOR DEVICE WITH TWISTED PIXEL LINES AND RELATED METHODS - An IC image sensor device may include image sensing IC pixels arranged in an array, and pixel line pairs coupled to the image sensing IC pixels. The IC image sensor device may include circuitry coupled to the pixel line pairs and configured to operate the array in a global shutter mode. Each pair of the pixel line pairs may include a pair of spaced electrical conductors having a twist. | 06-30-2016 |
20160191763 | ELECTRONIC DEVICE INCLUDING A CAMERA ASSEMBLY HAVING AN ELECTRICALLY CONDUCTIVE MATERIAL WITHIN A GROUND PLANE ACCESS OPENING AND RELATED METHODS - A camera assembly may include a printed circuit board (PCB), an image sensor carried by the PCB, and an electrically conductive layer carried by the PCB defining a ground plane. The camera assembly may also include a lens assembly, and a camera body that includes a dielectric layer and an electrically conductive layer thereon. The camera body may have a lens assembly opening aligned between the image sensor and the lens assembly and may also have a ground plane access opening therein aligned with the ground plane. The camera assembly may also include an electrically conductive material within the ground plane access opening coupling the electrically conductive layer to the ground plane. | 06-30-2016 |
20160191770 | IMAGING UNIT AND IMAGING APPARATUS - The imaging unit of the present disclosure is an imaging unit rotatable about a first axis. The imaging unit includes a lens holder and an operating member. The lens holder holds a lens on its surface, has a first gear on its rear face, and is rotatable about a second axis in forward and backward directions. The operating member has a second gear engaged with the first gear, is rotatable about a third axis in forward and backward directions, and faces the rear face of the lens holder. A plane with the first axis as a normal, a plane with the second axis as a normal, and a plane with the third axis as a normal are orthogonal to each other. The lens holder rotates by rotating the operating member. | 06-30-2016 |
20160198070 | CAMERA MODULE AND ELECTRONIC APPARATUS | 07-07-2016 |
20160205300 | IMAGING UNIT OF A CAMERA FOR RECORDING THE SURROUNDINGS WITH OPTICS UNCOUPLED FROM A CIRCUIT BOARD | 07-14-2016 |
20160205304 | Camera Module | 07-14-2016 |
20160255254 | WASTEWATER MONITORING SYSTEM AND METHOD | 09-01-2016 |
20180027154 | CAMERA MODULE INCLUDING MULTILAYER BASE BODY, IMAGE SENSOR IC, LENS UNIT, PERIPHERAL CIRCUIT COMPONENTS, AND CONNECTOR ELEMENT AND ELECTRONIC DEVICE INCLUDING SAME | 01-25-2018 |
20180027155 | IMAGING DEVICE, OPTICAL DEVICE PROVIDED WITH SAME, ELECTRONIC DEVICE PROVIDED WITH SAME, AND METHOD FOR PRODUCING IMAGING DEVICE | 01-25-2018 |
20180027157 | SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS | 01-25-2018 |
20220141358 | LENS MOVING APPARATUS, AND CAMERA MODULE AND OPTICAL DEVICE COMPRISING SAME - An embodiment comprises: a housing; a bobbin disposed in the housing; a first coil disposed on the bobbin; a magnet disposed on the housing; a first sensing coil, disposed on the housing, for generating a first induced voltage by interacting with the first coil; a first circuit board connected to the first coil and the first sensing coil; and a first amplifier, disposed on the first circuit board, for amplifying the first induced voltage of the first sensing coil and outputting a first amplified signal. | 05-05-2022 |