Class / Patent application number | Description | Number of patent applications / Date published |
257720000 | Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink) | 19 |
20080197483 | Lidless semiconductor cooling - A system for cooling a semiconductor includes a heat sink in thermal contact with the semiconductor, a thermal interface material (TIM) layer disposed between the heat sink and the semiconductor, and a picture frame support disposed between a substrate of the semiconductor and the heat sink, wherein the picture frame support encloses at least a portion of the semiconductor in a plane between the substrate and the heat sink, and wherein the picture frame support has a height that is greater than a height of the semiconductor. | 08-21-2008 |
20080258296 | Cut-Out Heat Slug for Integrated Circuit Device Packaging - In a package, a heat slug, encapsulated by molding compound, encases an integrated circuit device (IC). In an example embodiment, a semiconductor package structure comprises a substrate ( | 10-23-2008 |
20090008773 | Mounted Semiconductor Device And A Method For Making The Same - A method for mounting a semiconductor device onto a composite substrate, including a submount and a heat sink, is described. According to one aspect of the invention, the materials for the submount and the heat sink are chosen so that the value of coefficient of thermal expansion of the semiconductor device is in between the values of coefficients of thermal expansion of the materials of the submount and the heat sink, the thickness of the submount being chosen so as to equalize thermal expansion of the semiconductor device to that of the surface of the submount the device is mounted on. According to another aspect of the invention, the semiconductor device, the submount, and the heat sink are soldered into a stack at a single step of heating, which facilitates reduction of residual post-soldering stresses. | 01-08-2009 |
20090079063 | MICROELECTRONIC PACKAGE AND METHOD OF COOLING AN INTERCONNECT FEATURE IN SAME - A microelectronic package comprises a substrate ( | 03-26-2009 |
20090146295 | Ceramic substrate having thermal via - The present invention relates to a ceramic substrate having a thermal via passing through the substrate for purposes of radiating heat to the outside, wherein the ceramic substrate has a reinforcing structure that divides the opening of the thermal via into two or more parts, and the height of the reinforcing structure is less than the height of the thermal via. | 06-11-2009 |
20090309215 | SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING SEMICONDUCTOR MODULE - A semiconductor module ( | 12-17-2009 |
20100019380 | INTEGRATED CIRCUIT WITH MICRO-PORES CERAMIC HEAT SINK - An integrated circuit includes an integrated circuit device, a micro-pores ceramic heat sink and a heat conductive medium. The micro-pores ceramic heat sink is placed on a surface of the integrated circuit device. The heat conductive medium is placed in between the integrated circuit device and the micro-pores ceramic heat sink with one surface joined to the integrated circuit device and the other surface to the micro-pores ceramic heat sink. | 01-28-2010 |
20100102442 | Heat spreader having single layer of diamond particles and associated methods - A heat spreader is presented which can provide effective thermal management in a cost effective manner. The heat spreader includes a plurality of diamond particles arranged in a single layer surrounded by a metallic mass. The metallic mass cements the diamond particles together. The layer of diamond particles is a single particle thick. Besides the single layer of diamond particles, the metallic mass has substantially no other diamond particles therein. A thermal management system including a heat source and a heat spreader is also presented, along with methods for making and methods for use of such heat spreaders. | 04-29-2010 |
20100200984 | ADJUSTABLE THREADED CORES FOR LED THERMAL MANAGEMENT - Adjustable threaded cores for LED thermal management. The cores provide a direct thermal path between a LED and a heat sink while minimizing gaps and stresses between materials. The system includes a heat generating object, a first substrate housing containing a threaded hole beginning adjacent to the heat generating object, a second substrate having compatible threading with the threaded hole, and a third substrate including a heat sink. The second substrate has a higher thermal conductivity in comparison to the first substrate. The threaded hole and threaded core may terminate adjactent to the heat sink or may extent into the heat sink. | 08-12-2010 |
20110049702 | SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME - A method of producing a semiconductor package includes setting a radiator member on a semiconductor device that is mounted on a wiring board, said radiator member having a convex surface part on at least a part of a first surface thereof opposite to a second surface thereof to be bonded to the semiconductor device, and pressing the convex surface part of the radiator member towards the semiconductor device in order to align the radiator member and the semiconductor device automatically and to become substantially parallel to each other. | 03-03-2011 |
20120241943 | Diamond Particle Mololayer Heat Spreaders and Associated Methods - Thermally regulated semiconductor devices having reduced thermally induced defects are provided, including associated methods. Such a device can include a heat spreader having a monolayer of diamond particles within a thin metal matrix and a semiconductor material thermally coupled to the heat spreader. In one aspect, the coefficient of thermal expansion difference between the heat spreader and the semiconductor material is less than or equal to about 50%. | 09-27-2012 |
20130154085 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT CONDUCTION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; mounting a lid base over the substrate, the lid base having a base indentation and a hole with the integrated circuit within the hole; and mounting a heat slug over the lid base, the heat slug having a slug non-horizontal side partially within the base indentation. | 06-20-2013 |
20140217576 | SEMICONDUCTOR PACKAGE - A semiconductor package and a method of manufacturing the same are disclosed, wherein the semiconductor package includes a circuit board, a semiconductor chip mounted on the circuit board, an encapsulant positioned on the circuit board and encapsulating the semiconductor chip to the circuit board, and a thermal dissipating member positioned on the encapsulant and having a heat spreader that dissipates a driving heat from the semiconductor chip and a heat capacitor that absorbs excess driving heat that exceeds a heat transfer capability of the heat spreader, such that when a high power is applied to the package, the excess heat is absorbed into the heat capacitor as a latent heat and thus the semiconductor chip is protected from an excessive temperature increase caused by the excess heat, thereby increasing a critical time and performance duration time of the semiconductor package. | 08-07-2014 |
20150084182 | COOLING ASSEMBLY USING HEATSPREADER - Various embodiments relate to a microchip die cooling assembly comprising a circuit board; a microchip having an exposed die attached to the circuit board; a heatspreader having a top side and a bottom side; a heat sink having a bottom side and a top side comprising a cooling structure; a first thermal interface material in contact with the exposed die and the bottom side of the heatspreader; and a second thermal interface material in contact with the top side of the heat spreader and the bottom side of the heat sink. | 03-26-2015 |
20150108632 | THIN FILM WITH NEGATIVE TEMPERATURE COEFFICIENT BEHAVIOR AND METHOD OF MAKING THEREOF - A conductive thin film including a binder matrix and semiconductor nanowires dispersed therein is disclosed. The semiconductor nanowires are in the range of 30% to 50% by weight percentage of the thin film. The present invention also discloses a method of making such thin film. The method includes the steps of: mixing a plurality of semiconductor nanowires with a polymer binder to obtain a printing ink; thinning the printing ink with a solvent to achieve a predetermined viscosity; printing the printing ink on a substrate to form a conductive thin film thereon and evaporating the solvent at a rate slower than the evaporation rate of water. | 04-23-2015 |
20150318266 | Semiconductor Package Devices - Semiconductor package devices and methods of forming the semiconductor package devices are provided. The semiconductor package devices may include a lower package including a lower semiconductor chip on a lower substrate, an upper package including an upper semiconductor chip on an upper substrate. The upper substrate may include a protruding part corresponding to the lower semiconductor chip and a connection part that has a bottom surface lower than a bottom surface of the protruding part and is disposed around the protruding part. The semiconductor package devices may also include a heat dissipation part in a space between the lower semiconductor chip and the protruding part on the upper substrate and a package connection pattern electrically connecting the lower package to the upper package. | 11-05-2015 |
20160104657 | Thermally Conductive Sheet, Method for Producing Same, and Semiconductor Device - A thermally conductive sheet, which contains: a binder; carbon fibers; and an inorganic filler, wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device, wherein the carbon fibers have an average fiber length of 50 μm to 250 μm, wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm | 04-14-2016 |
20160133811 | High-Power led lamp cooling device and method for manufacturing the same - A high-power LED lamp cooling device and its manufacturing method, which includes: manufacturing a semiconductor crystal bar in advance into cone-shaped crystal bar with one end having large diameter and the other having small diameter, making color mark on each wafer as the large-diameter end surface of the tail end when the cone-shaped semiconductor crystal bar is cut into slices; cutting and pelletizing the conical surface to obtain polygonal cylindrical N-type or P-type semiconductor elements, arranging them in a matrix form between two beryllium-oxide ceramic chips provided with conductive circuits, connecting head end of N-type semiconductor elements to tail end of the P-type semiconductor elements in series to manufacture high-power LED lamp cooling device. The high-power LED lamp cooling device can achieve: good cooling effect, high working efficiency, low energy consumption and capable of reducing light failure of LED lamp, and prolonging service life of the high-power LED lamp. | 05-12-2016 |
20160254211 | Thermal Structure for Integrated Circuit Package | 09-01-2016 |