HEAT DISSIPATING APPARATUS

Abstract

A heat dissipating apparatus includes a heat-generating electronic component, a heat pipe, a heat sink. The heat sink includes a bottom panel, a top panel, and a plurality of fins. An air intake is defined between the bottom panel and the top panel. The plurality of fins defines a first air outlet and a second air outlet. An air guiding wall extends through the plurality of fins. The air intake, the air guiding wall, and the first air outlet together define a first air passage for air extending through the heat sink, and the air intake, the air guiding wall, and the second air outlet together define a second air passage for air extending through the heat sink. The invention further provides an assembly with the heat dissipating apparatus.

Description

BACKGROUND

[0001] 1. Technical Field

[0002] The present disclosure relates to heat dissipating apparatuses, more particularly to a heat dissipating apparatus for CPU.

[0003] 2. Description of Related Art

[0004] Heat dissipating apparatus performs the critical function of removing heat from a computer system. For example, a fan is provided to dissipate heat from an electronic component, such as a CPU. Air is directed out of the computer system by the fan, for dissipating heat generated by the CPU. Usually, the air outlet on the computer is the element which will decrease heat dissipating efficiency of the computer system, when the air flows out of the computer. Therefore, there is room for improvement within the art.

BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

[0006] FIG. 1 is an isometric, exploded view of a heat dissipating apparatus in accordance with an embodiment.

[0007] FIG. 2 is an isometric view of a heat sink of the heat dissipating apparatus of FIG. 1.

[0008] FIG. 3 is a cross-sectional view of the heat dissipating apparatus of FIG. 2, taken along a line III-III.

[0009] FIG. 4 is an assembled view of the heat dissipating apparatus of FIG. 1.

DETAILED DESCRIPTION

[0010] The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to "an" or "one" embodiment in this disclosure are not necessarily to the same embodiment, and such references mean "at least one."

[0011] FIGS. 1 and 2 illustrate a heat dissipating apparatus in accordance with an embodiment for dissipating heat generated by an electronic component 10, such as a CPU. The heat dissipating apparatus comprises a heat sink 20, a heat pipe 30, and a fan 40. The heat pipe 30 is connected to the heat sink 20 and the electronic component 10, and the fan 40 is attached to the heat sink 20.

[0012] The heat sink 20 comprises a bottom panel 21, a top panel 22 substantially parallel to the bottom panel 21, and a plurality of fins 23 located between the bottom panel 21 an the top panel 22. In one embodiment, each of the plurality of fins 23 is substantially perpendicular to the bottom panel 21. An air intake 24 is defined between the bottom panel 21 and the top panel 22. An opening 231 is defined in each of the plurality of fins 23 and slanted relative to the bottom panel 21. An air guiding piece 232, substantially perpendicular to each of the plurality of fins 23, extends from a top edge of the opening 231. The plurality of air guiding pieces 232 on the plurality of fins 23 together define an air guiding wall 233. The air guiding wall 233 is slanted towards the bottom panel 21. A first air outlet 25, opposite to the air intake 24, is defined in a first side of the plurality of fins 23. A second air outlet 26 is defined in the bottom panel 21, and located in a second side of the plurality of fins 23, that is substantially perpendicular to the first side the plurality of fins 23. In one embodiment, the opening 231 is substantially rectangular. A distal end of each of the plurality of fins 23, located on the first air outlet 25, is substantially arcuate. A width of the air guiding piece 232 is substantially equal to a distance between every two adjacent fins of the plurality of fins 23, so that the air guiding piece 232 can cover the gap between every two adjacent fins.

[0013] The fan 40 comprises an enclosure 41 and a impeller 42 located in the enclosure 41. The impeller 42 spins about an axis on the center of the enclosure 41. The enclosure 41 defines a fan air intake 43 and a fan air outlet 44. An air intake passage way defined by the fan air intake 43 is substantially perpendicular to an air outlet passage way defined by the fan air outlet 44.

[0014] FIG. 4 shows that, in assembly, a first end of the heat pipe 30 is secured to the bottom portion of the electronic component 10, and a second end of the heat pipe 30 is secured to the bottom panel 21 by means such as by soldering.

[0015] In use, the heat generated by the electronic component 10 is transferred to the heat sink 20. Air from the outside of the fan 40 flows into the enclosure 41 via the fan air intake 43, and out of the enclosure 41 via the fan air outlet 44. Then, the air flows into the heat sink 20 via the air intake 24. A first part of the air flows out of the heat sink 20 via the first air outlet 25. The air guiding wall 233 guides a second part of the air to flow out of the heat sink 20 via the second air outlet 26. Thus, the heat generated from the electronic component 10 can be effectively removed.

[0016] It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat dissipating apparatus comprising: a heat pipe; a first end of the heat pipe connected to an electronic component; and a heat sink connected to a second end of the heat pipe; the heat sink comprises a bottom panel, a top panel, and a plurality of fins located between the bottom panel and the top panel; an air intake defined between the bottom panel and the top panel; the plurality of fins defining a first air outlet and a second air outlet that is substantially perpendicular to the first air outlet; the first air outlet is opposite to the air intake; and an air guiding wall extending through the plurality of fins; wherein the air intake, the air guiding wall, and the first air outlet together defines a first air passage for air flowing through the heat sink; and the air intake, the air guiding wall, and the second air outlet together defines a second air passage for air flowing through the heat sink.

2. The heat dissipating apparatus of claim 1, wherein an air guiding piece perpendicularly extends from each of the plurality of fins, and the air guiding wall is defined by the air guiding piece of each of the plurality of fins.

3. The heat dissipating apparatus of claim 2, wherein the air guiding piece is slanted relative to the bottom panel.

4. The heat dissipating apparatus of claim 2, wherein each of the plurality of fins defines an opening, and the air guiding piece extends from an edge of the opening.

5. The heat dissipating apparatus of claim 2, wherein a width of the air guiding piece is substantially equal to a distance between every two adjacent fins of the plurality of fins.

6. The heat dissipating apparatus of claim 1, wherein a distal end of each of the plurality of fins is substantially arcuate.

7. An assembly comprising: an electronic component; a heat sink comprising a bottom panel, a top panel, and a plurality of fins located between the bottom panel and the top panel; an air intake defined between the bottom panel and the top panel; the plurality of fins defining a first air outlet and a second air outlet substantially perpendicular to the first air outlet; the first air outlet opposite to the air intake; an air guiding wall extending through the plurality of fins; a heat pipe connected to the electronic component and the heat sink; and a fan, attached to the heat sink, comprising a fan air intake and a fan air outlet; wherein air outside of the fan flows into the fan via the fan air intake, through the fan air outlet and into the heat sink via the air intake, a first part of the air flows out of the heat sink via the first air outlet, and a second part of the air flows out of the heat sink via the second air outlet by the air guiding wall.

8. The assembly of claim 7, wherein an air guiding piece perpendicularly extends from each of the plurality of fins, and the air guiding wall is defined by the air guiding piece of each of the plurality of fins.

9. The assembly of claim 8, wherein the air guiding piece is slanted relative to the bottom panel.

10. The assembly of claim 8, wherein each of the plurality of fins defines an opening, and the air guiding piece extends from an edge of the opening.

11. The assembly of claim 8, wherein a width of the air guiding piece is substantially equal to a distance between every adjacent two of the plurality of fins.

12. The assembly of claim 7, wherein a distal end of each of the plurality of fins is substantially arcuate.

13. The assembly of claim 7, wherein the electronic component is a CPU.