Patent application title: HEAT SINK
Inventors:
Chao-Ke Wei (Tu-Cheng, TW)
Chao-Ke Wei (Tu-Cheng, TW)
Assignees:
HON HAI PRECISION INDUSTRY CO., LTD.
IPC8 Class: AF28F700FI
USPC Class:
165185
Class name: Heat exchange heat transmitter
Publication date: 2013-06-13
Patent application number: 20130146269
Abstract:
A heat sink includes a base and a number of fins perpendicularly
extending from the base. The base includes a main body. The fins include
a number of parallel first fins and two second fins sandwiching the first
fins. Each second fin includes a main piece extending from the main body
and a guiding piece extending from one end of the main piece.Claims:
1. A heat sink, comprising: a base comprising a main body; and a
plurality of fins comprising a plurality of parallel first fins extending
up from the main body and two second fins extending up from the main body
and sandwiching the first fins, wherein each of the second fins comprises
a main piece extending from the base and parallel to the first fins, and
a guiding piece slantingly extending out from one end of the main piece.
2. The heat sink of claim 1, wherein the base comprises four mounting portions formed from four corners of the main body.
3. The heat sink of claim 1, wherein a plurality of heat pole is set on the main body and extends through the first fins.
4. The heat sink of claim 3, wherein each of the heat pole is substantially U-shaped, and comprises a fixing portion fixed on the main body, a first heat pole extending perpendicularly from one end of the fixing portion, and a second heat pole extending from a top end of the first heat pole and parallel to the fixing portion, the second heat pole extends perpendicularly through the first fins.
5. The heat sink of claim 1, wherein an inclined guiding surface is formed on a side surface of the main body.
Description:
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to a heat sink.
[0003] 2. Description of Related Art
[0004] With the continuing development of electronic technology, components of electronic devices, such as servers, generate a great deal of heat. The heat needs to be dissipated immediately to ensure the continued proper function of the electronic devices. Often, a heat sink is arranged on the component to dissipate heat. A plurality of fans is arranged at a side of the electronic device to generate airflow to flow through the heat sink. However, one part of the airflow will flow through an outside the heat sink, which affects the efficiency of cooling the components.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Many aspects of the present embodiments can be better understood with reference to the following drawing. The components in the drawing are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawing, like reference numerals designate corresponding parts throughout the several views.
[0006] FIG. 1 is an assembled, isometric view of a heat sink, according to an exemplary embodiment, wherein the heat sink includes a base and a plurality of heat poles.
[0007] FIG. 2 is an enlarged, isometric view of the base and the heat poles of FIG. 1.
[0008] FIG. 3 is a cross-sectional view of FIG. 1, taken along the line of III-III.
DETAILED DESCRIPTION
[0009] The disclosure, including the accompanying drawing, is illustrated by way of examples and not by way of limitation. It should be noted that references to "an" or "one" embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
[0010] Referring to FIG. 1 to FIG. 3, an embodiment of a heat sink includes a base 10, a plurality of fins 20 extending up from the base 10, and a plurality of heat poles 30.
[0011] The base 10 includes a main body 12, and four mounting portions 14 respectively extending out from four corners of the main body 12. The main body 12 has a trapezium cross-section and includes two inclined guiding surfaces 122 formed at opposite sides of the main body 12. Each mounting portion 14 defines a mounting hole 142 for fixing the main body 12 to a motherboard (not shown).
[0012] The fins 20 include a plurality of parallel first fins 22 and two second fins 24 sandwiching the first fins 22. Each second fin 24 includes a main piece 242 extending up from the base 10 and parallel to the first fins 22, and two guiding pieces 244 slantingly extending out from opposites ends of the main piece 242.
[0013] Each heat pole 30 is substantially U-shaped, and includes a fixing portion 31 fixed on the main body 12, a first heat pole 32 extending perpendicularly up from one end of the fixing portion 31, and a second heat pole 33 perpendicularly extending from a top end of the first heat pole 32 opposite to the main body 12 and parallel to the fixing portion 31. The second heat poles 32 extend perpendicularly through the first fins 22.
[0014] When airflow flows to the heat sink, the guiding pieces 244 at one end of the heat sink are used to gather more airflow together to flow through the first fins 22. The guiding surface 122 is used to reduce air resistance.
[0015] Even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
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