HEAT-DISSIPATING BASE FOR ELECTRONIC PRODUCT

Abstract

A heat-dissipating base for an electronic product includes a pair of supporting bodies and a concealed linkage assembly. The supporting bodies have a first accommodating trough provided with a first rail and a second accommodating trough provided with a second rail. The concealed linkage assembly is received in the first accommodating trough and the second accommodating trough. The concealed linkage assembly comprises a first connecting rod and a second connecting rod pivotally connected to each other. Both ends of the first connecting rod are pivotally connected to the pair of supporting bodies in the first accommodating trough and the second accommodating trough respectively. Both ends of the second connecting rod are slidingly connected to the first rail and the second rail respectively. By this structure, the present invention can be applied to various electronic products of different sizes, and it can be folded for easy storage and carry.

Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a heat-dissipating structure, and in particular to a heat-dissipating base for an electronic product.

[0003] 2. Description of Prior Art

[0004] Currently, many kinds of electronic products are proposed and widely used in our daily life, such as notebook computers, laptop computers, personal digital assistants, digital video disks (DVD) and tablet computers (XPAD). In order to make these electronic products more and more compact, a heat-dissipating device installed inside the respective electronic products is required to have a much simpler structure to thereby reduce the volume of the whole electronic product. However, the heat-dissipating efficiency of such a compact heat-dissipating device may be insufficient, so that the heat generated by electronic elements of the electronic product cannot be dissipated quickly and efficiently. As a result, the electronic elements may be overheated or suffer damage due to the accumulated heat.

[0005] Usually, the electronic elements are located in the bottom of the electronic product. Accordingly, heat pipes, vapor chambers and fans may be provided in the bottom of the electronic product for better heat dissipation. Since the heat generated by the electronic elements may be accumulated in the bottom of the electronic product to negatively affect the performance and lifetime of the electronic elements, various auxiliary heat-dissipating devices are proposed to improve the heat-dissipating efficiency, such as a cooling pad or a cooling stand available in the market. The cooling pad or the cooling stand is configured to provide an airflow space under the bottom of the electronic product to thereby improve the heat-dissipating efficiency of the electronic product.

[0006] With the advancement of science and technology, many kinds of electronic products are developed, each having different size and profile. Further, each kind of the electronic products is required to be made more and more compact for easy carry and storage. However, the conventional cooling pad or cooling stand is usually made by a metal plate with a fixed volume. Thus, when a customer buys an electronic product, the user also has to buy a cooling pad or cooling stand exclusively designed for the electronic product. On the other hand, the conventional cooling pad or cooling stand cannot be folded for easy carry and storage.

[0007] In view of the above-mentioned problems, the present Inventor proposes a novel and reasonable structure based on his expert knowledge and deliberate researches.

SUMMARY OF THE INVENTION

[0008] The present invention is to provide a heat-dissipating base for an electronic product, in which a concealed linkage assembly is provided. By this structure, the present invention can be applied to various electronic products of different dimensions. Further, the present invention can be folded for easy carry and storage.

[0009] The present invention provides a heat-dissipating base for an electronic product, including: a pair of supporting bodies respectively having a first accommodating trough and a second accommodating trough corresponding to each other, the first accommodating trough being provided with a first rail, the second accommodating rail being provided with a second rail; and a concealed linkage assembly received in the first accommodating trough and the second accommodating trough, the concealed linkage assembly comprising a first connecting rod and a second connecting rod pivotally connected to each other, both ends of the first connecting rod being pivotally connected to the pair of supporting bodies in the first accommodating trough and the second accommodating trough respectively, both ends of the second connecting rod being slidingly connected to the first rail and the second rail respectively.

[0010] The present invention provides a heat-dissipating base for an electronic product, including: a pair of supporting bodies respectively having a first accommodating trough and a second accommodating trough corresponding to each other, the first accommodating trough being provided with a first rail, the second accommodating rail being provided with a second rail; and a concealed linkage assembly received in the first accommodating trough and the second accommodating trough, the concealed linkage assembly comprising a first connecting rod and a second connecting rod pivotally connected to each other, one end of the first connecting rod being slidingly connected to the second rail, the other end of the first connecting rod being pivotally connected to one of the pair of supporting bodies in the first accommodating trough, one end of the second connecting rod being slidingly connected to the first rail, the other end of the second connecting rod being pivotally connected to the other of the pair of supporting bodies in the second accommodating trough.

[0011] The present invention has advantageous features as follows. The concealed linkage assembly can be folded and received in the first accommodating trough and the second accommodating trough, so that the heat-dissipating base of the present invention can be folded to have a reduced volume for easy carry and storage. Further, since the concealed linkage assembly has a number of bars and the rails are provided with a plurality of positioning portions, the heat-dissipating base of the present invention can be applied to various electronic products of different sizes. Each of the supporting bodies is formed into a trapezoid prism, so that the electronic product can be disposed on the two supporting bodies with an inclination angle for better operation. Further, the electronic product is supported by the two supporting bodies in such a manner that an airflow space is formed under the electronic product to thereby improve the heat-dissipating efficiency thereof. Each of the supporting bodies has a protrusion and a slide-proof piece, so that the electronic product can be disposed on the heat-dissipating base of the present invention more stably. Furthermore, the heat-dissipating base of the present invention has a supporting piece to increase the inclination angle of the heat-dissipating base, so that the user can adjust the inclination angle of the electronic product based on demand. Further, the supporting element is configured to generate multi-stage adjustment, whereby the user can adjust the angle of the heat-dissipating base of the present invention based on demand.

BRIEF DESCRIPTION OF DRAWING

[0012] FIG. 1 is an exploded perspective view showing the foldable heat-dissipating base of the present invention;

[0013] FIG. 2 is another exploded perspective view showing the foldable heat-dissipating base of the present invention;

[0014] FIG. 3 is an assembled perspective view showing the foldable heat-dissipating base of the present invention;

[0015] FIG. 4 is a cross-sectional view showing the foldable heat-dissipating base of the present invention;

[0016] FIG. 5 is another cross-sectional view showing the foldable heat-dissipating base of the present invention;

[0017] FIG. 6 is a cross-sectional view showing the foldable heat-dissipating base according to another embodiment of the present invention;

[0018] FIG. 7 is a cross-sectional view showing the foldable heat-dissipating base according to a further embodiment of the present invention;

[0019] FIG. 8 is a schematic view showing an operating state of the foldable heat-dissipating base of the present invention;

[0020] FIG. 9 is a schematic view showing another operating state of the foldable heat-dissipating base of the present invention;

[0021] FIG. 10 is an assembled view showing the foldable heat-dissipating base according to a further embodiment of the present invention;

[0022] FIG. 11 is another assembled view showing the foldable heat-dissipating base according to a further embodiment of the present invention;

[0023] FIG. 12 is a further cross-sectional view showing the foldable heat-dissipating base according to a further embodiment of the present invention; and

[0024] FIG. 13 is a schematic view showing an operating state of the foldable heat-dissipating base according to a further embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0025] The detailed description and technical contents of the present invention will become apparent with the following detailed description accompanied with related drawings. It is noteworthy to point out that the drawings is provided for the illustration purpose only, but not intended for limiting the scope of the present invention.

[0026] Please refer to FIGS. 1 to 3. The present invention provides a foldable heat-dissipating base for an electronic product 100. The foldable heat-dissipating base includes a pair of supporting bodies 1a, 1b and a concealed linkage assembly 2.

[0027] Each of the supporting bodies 1a, 1b is formed into a trapezoid prism 3, but it is not limited thereto. The supporting body 1a is provided with a first accommodating trough 11a, and the other supporting body 1b is provided with a second accommodating trough 11a. The first accommodating trough 11a and the second accommodating trough 11b are configured to correspond to each other. The first accommodating trough 11a is provided with a first rail 111a. The second accommodating trough 11b is provided with a second rail 111b. Each of the supporting bodies 1a, 1b has a top surface 12 and a bottom surface 13. The top surface 12 is provided with a trough 121.

[0028] The concealed linkage assembly 2 comprises a first connecting rod 21 and a second connecting rod 22 pivotally connected to each other. Both ends of the first connecting rod 21 are respectively located in the first accommodating trough 11a and the second accommodating trough 11b and pivotally connected to the pair of supporting bodies 1a, 1b. Both ends of the second connecting rod 22 are slidingly connected to the first rail 111a and the second rail 111b respectively. The first connecting rod 21 has a plurality of first bars 211. The second connecting rod 22 has a plurality of second bars 221. Each of the first bars 221 and each of the second bars 221 are pivotally connected to form an X-shape structure.

[0029] The present invention further includes a plurality of slide-proof pieces 4, two protrusions 5 and two supporting pieces 6. The top surface 12 and the bottom surface 13 of each of the supporting bodies 1a, 1b are fixedly provided with at least one slide-proof piece 4. Each of the protrusions 5 is pivotally connected to the respective supporting bodies 1a, 1b in the trough 121. Each of the supporting pieces 6 is pivotally connected to the bottom surface 13 of the respective supporting bodies 1a, 1b.

[0030] According to the present invention, the concealed linkage assembly 2 can be expanded or received in the pair of supporting bodies 1a, 1b. The concealed linkage assembly 2 comprises the first connecting rod 21 and the second connecting rod 22 pivotally connected to each other. Both ends of the first connecting rod 21 are pivotally connected to the pair of supporting bodies 1a, 1b in the first accommodating trough 11a and the second accommodating trough 11b respectively. Both ends of the second rod 22 are slidingly connected to the first rail 111a and the second rail 111b. The concealed linkage assembly 2 can be folded and received in the first accommodating trough 11a and the second accommodating trough 11b. By this structure, the heat-dissipating base of the present invention can be folded for easy carry and storage.

[0031] Please refer to FIGS. 4 and 5, which are schematic views showing the foldable heat-dissipating base of the present invention. When not in use, the concealed linkage assembly 2 is received in the first accommodating trough 11a and the second accommodating trough 11b. Both ends of the second connecting rod 22 are located in the bottom of the first rail 111a and the second rail 111b. When in use, the two supporting bodies 1a, 1b are expanded, so that both ends of the second connecting rod 22 slide in the first rail 111a and the second rail 111b to reach the top of the first rail 111a and the second rail 111b. Further, as shown in FIG. 5, the first connecting rod 21 has even number of first bars 211. The second connecting rod 22 has even number of second bars 221. Each of the first bars 211 and each of the second bars 221 are pivotally connected to each other to form an X-shape structure. The more the number of the first bars 211 and the second bars 221 is, the larger the extending width of the foldable heat-dissipating base of the present invention will be.

[0032] Please refer to FIG. 6, which is a schematic view showing the foldable heat-dissipating base according to another embodiment of the present invention. The concealed linkage assembly 2 comprises a first connecting rod 21 and a second connecting rod 22 pivotally connected to each other. One end of the first connecting rod 21 is slidingly connected to the second rail 111b, and the other end of the first connecting rod 21 is pivotally connected to the supporting body 1a in the first accommodating trough 11a. One end of the second connecting rod 22 is slidingly connected to the first rail 111a, and the other end of the second connecting rod 22 is pivotally connected to the other supporting body 1b in the second accommodating trough 11b. Further, the first connecting rod 21 has one or odd number of the first bars 211. The second connecting rod 22 has one or odd number of second bars 221. Each of the first bars 211 and each of the second bars 221 are pivotally connected to each other to form an X-shape structure. The more the number of the first bars 211 and the second bars 221 is, the larger the extending width of the foldable heat-dissipating base of the present invention will be.

[0033] Please refer to FIG. 7. In addition to the above-mentioned embodiment, the first rail 111a and the second rail 111b may be embodied in another way. The first rail 111a and the second rail 111b are provided with a plurality of positioning portions 112 respectively. The concealed linkage assembly 2 cooperates with the positioning portions 112 to generate multi-stage adjustment. In case of the concealed linkage assembly 2 shown in FIG. 5, both ends of the second connecting rod 22 cooperate with the positioning portions 112 to generate multi-stage adjustment. In case of the concealed linkage assembly 2 shown in FIG. 6, one end of the first connecting rod 21 and one end of the second connecting rod 22 cooperate with the positioning portions 112 to generate multi-stage adjustment of the extending width of the foldable heat-dissipating base. In this way, the foldable heat-dissipating base of the present invention can be applied to various electronic products of different sizes.

[0034] Please refer to FIG. 8. Each of the supporting bodies 1a, 1b is formed into a trapezoid prism 3, so that the electronic product 100 can be disposed on the supporting bodies 1a, 1b with an inclination angle for better operation. Further, the electronic product 100 is supported by the supporting bodies 1a, 1b in such a manner that an airflow space is formed under the electronic product 100 to improve the heat-dissipating efficiency thereof. Each of the supporting bodies 1a, 1b has a top surface 12 and a bottom surface 13. The top surface 12 is provided with a trough 121. Each of the protrusions 5 is pivotally connected to the supporting bodies 1a, 1b in the trough 121. The protrusion 5 can be received in the trough 121. The protrusion 5 can be pulled up in the trough 121 to protrude from the top surface 12. When being pulled up, the two protrusions 5 can stop the electronic product 100, so that the electronic product 100 can be disposed on the two top surfaces 12. The top surface 12 has at least one slide-proof piece 4 for allowing the electronic product 100 to be stably disposed on the two top surfaces 12. Further, the bottom surface 13 has at least one slide-proof piece 4. By this structure, even though the weight of the electronic product 100 exerts a force on the protrusions 5, the foldable heat-dissipating base of the present invention can still support the electronic product 100 stably.

[0035] Please refer to FIG. 9. Each of the supporting pieces 6 is pivotally connected to the bottom surface 13. The supporting piece 6 can be folded on the bottom surface 13. The supporting piece 6 can be pulled up to protrude from the bottom surface 13. In other words, the supporting piece 6 is used to increase the inclination angle of the foldable heat-dissipating base of the present invention. In this way, the user can adjust the inclination angle of the electronic product 100 based on demand. When being pulled up, the two protrusions 5 can stop the electronic product 100, so that the electronic product 100 can be disposed on the two top surfaces 12. The slide-proof piece 4 of the top surface 12 is configured to allow the electronic product 100 to be stably disposed on the two top surfaces 12. The slide-proof piece 4 located on the bottom surface 13 and on the same end as the protrusion 5 cooperates with the supporting piece 6 to support the electronic product 100 and the foldable heat-dissipating base of the present invention stably.

[0036] Please refer to FIGS. 10 to 13, which show a further embodiment of the present invention. The supporting piece 6 is configured to generate multi-stage adjustment. Each of the bottom surfaces 13 is provided with a groove 131. Each of the supporting pieces 6 is pivotally connected to the supporting bodies 1a, 1b in each groove 131. The present invention further includes two adjustment pieces 7. The periphery of each groove 131 is formed with a plurality of recesses 132. One end of each adjustment piece 7 is pivotally connected to the supporting piece 6, and the other end thereof protrudes to form a tenon 71. The tenon 71 cooperates with the recesses 132 to allow the supporting piece 6 to generate multi-stage adjustment. By this structure, the user can adjust the inclination angle of the foldable heat-dissipating base of the present invention.

[0037] Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims

1. A heat-dissipating base for an electronic product, including: a pair of supporting bodies respectively having a first accommodating trough and a second accommodating trough corresponding to each other, the first accommodating trough being provided with a first rail, the second accommodating rail being provided with a second rail; and a concealed linkage assembly received in the first accommodating trough and the second accommodating trough, the concealed linkage assembly comprising a first connecting rod and a second connecting rod pivotally connected to each other, both ends of the first connecting rod being pivotally connected to the pair of supporting bodies in the first accommodating trough and the second accommodating trough respectively, both ends of the second connecting rod being slidingly connected to the first rail and the second rail respectively.

2. The heat-dissipating base for an electronic product according to claim 1, wherein the first connecting rod has a plurality of first bars, the second connecting rod has a plurality of second bars, each of the first bars and each of the second bars are pivotally connected to each other to form an X-shaped structure.

3. The heat-dissipating base for an electronic product according to claim 1, wherein each of the supporting bodies is formed into a trapezoid prism.

4. The heat-dissipating base for an electronic product according to claim 1, further including two slide-proof pieces, each of the supporting bodies having a bottom surface, the slide-proof pieces being provided on the bottom surfaces respectively.

5. The heat-dissipating base for an electronic product according to claim 1, further including two slide-proof pieces, each of the supporting bodies having a top surface, the slide-proof pieces being provided on the top surfaces respectively.

6. The heat-dissipating base for an electronic product according to claim 1, wherein the first rail and the second rail are provided with a plurality of positioning portions respectively, both ends of the second connecting rod cooperate with the positioning portions to generate multi-stage adjustment.

7. The heat-dissipating base for an electronic product according to claim 1, further including two protrusions, each of the supporting bodies having a top surface, the top surface being provided with a trough, each of the protrusions being pivotally connected to the supporting body in the trough, the two protrusions stopping the electronic product to be disposed on the two top surfaces.

8. The heat-dissipating base for an electronic product according to claim 1, further including two supporting pieces, each of the supporting bodies having a bottom surface, the supporting pieces being pivotally connected to the bottom surfaces respectively.

9. The heat-dissipating base for an electronic product according to claim 8, wherein each of the bottom surfaces is provided with a groove, each of the supporting pieces is pivotally connected to the supporting body in the groove.

10. The heat-dissipating base for an electronic product according to claim 9, further including two adjustment pieces, a periphery of each groove being formed with a plurality of recesses, one end of each adjustment piece being pivotally connected to the supporting piece, the other end of each adjustment piece protruding to form a tenon, the tenon cooperating with the recesses to generate multi-stage adjustment.

11. A heat-dissipating base for an electronic product, including: a pair of supporting bodies respectively having a first accommodating trough and a second accommodating trough corresponding to each other, the first accommodating trough being provided with a first rail, the second accommodating rail being provided with a second rail; and a concealed linkage assembly received in the first accommodating trough and the second accommodating trough, the concealed linkage assembly comprising a first connecting rod and a second connecting rod pivotally connected to each other, one end of the first connecting rod being slidingly connected to the second rail, the other end of the first connecting rod being pivotally connected to one of the pair of supporting bodies in the first accommodating trough, one end of the second connecting rod being slidingly connected to the first rail, the other end of the second connecting rod being pivotally connected to the other of the pair of supporting bodies in the second accommodating trough.

12. The heat-dissipating base for an electronic product according to claim 11, wherein the first connecting rod has a plurality of first bars, the second connecting rod has a plurality of second bars, each of the first bars and each of the second bars are pivotally connected to each other to form an X-shaped structure.

13. The heat-dissipating base for an electronic product according to claim 11, wherein each of the supporting bodies is formed into a trapezoid prism.

14. The heat-dissipating base for an electronic product according to claim 11, further including two slide-proof pieces, each of the supporting bodies having a bottom surface, the slide-proof pieces being provided on the bottom surfaces respectively.

15. The heat-dissipating base for an electronic product according to claim 11, further including two slide-proof pieces, each of the supporting bodies having a top surface, the slide-proof pieces being provided on the top surfaces respectively.

16. The heat-dissipating base for an electronic product according to claim 11, wherein the first rail and the second rail are provided with a plurality of positioning portions respectively, one end of the first connecting rod and one end of the second connecting rod cooperate with the positioning portions to generate multi-stage adjustment.

17. The heat-dissipating base for an electronic product according to claim 11, further including two protrusions, each of the supporting bodies having a top surface, the top surface being provided with a trough, each of the protrusions being pivotally connected to the supporting body in the trough, the two protrusions stopping the electronic product to be disposed on the two top surfaces.

18. The heat-dissipating base for an electronic product according to claim 11, further including two supporting pieces, each of the supporting bodies having a bottom surface, the supporting pieces being pivotally connected to the bottom surfaces respectively.

19. The heat-dissipating base for an electronic product according to claim 18, wherein each of the bottom surfaces is provided with a groove, each of the supporting pieces is pivotally connected to the supporting body in the groove.

20. The heat-dissipating base for an electronic product according to claim 19, further including two adjustment pieces, a periphery of each groove being formed with a plurality of recesses, one end of each adjustment piece being pivotally connected to the supporting piece, the other end of each adjustment piece protruding to form a tenon, the tenon cooperating with the recesses to generate multi-stage adjustment.