FIXING MECHANISM FOR FIXING A HEAT-DISSIPATING DEVICE AND RELATED THERMAL MODULE

Abstract

A fixing mechanism for fixing a heat-dissipating device includes a plurality of thermal fins whereon a ditch is formed, and a positioning device disposed on the plurality of thermal fins. The positioning device includes a supporting portion, and a first side of the supporting portion is for supporting the heat-dissipating device. The positioning device further includes a first constraining portion connected to a second side of the supporting portion and engaged with the ditch for preventing the supporting portion from moving relative to the plurality of thermal fins in a first direction, and a second constraining portion connected to the second side of the supporting portion and contacting against the plurality of thermal fins for preventing the supporting portion from moving relative to the plurality of thermal fins in a second direction different from the first direction.

Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a fixing mechanism for fixing a heat-dissipating device, and more particularly, to a fixing mechanism for preventing a heat-dissipating device from detaching from an initial position due to its vibration and a related thermal module.

[0003] 2. Description of the Prior Art

[0004] Duo to an insufficient internal space and structural constrain of a computer device, electronic components disposed inside the computer device are fixed on a base in a simple manner for economizing manufacturing cost and increasing assembly efficiency. For example, a conventional method of fixing a fan utilizes a screw to fix the fan on a set of thermal fins, directly. Dimensions of the screw are greater than a distance between two adjacent thermal fins. When the screw is wedged between the two adjacent thermal fins, the fan is fixed on the set of thermal fins due to friction of the thermal fins. However, vibration generated by the fan decays the engagement between the screw and the set of thermal fins. For example, threads of the screws or threads on the set of thermal fins are damaged due to the vibration, so that the fan can not be fixed on the thermal fins stably and moves along a direction of the thermal fins relative to the set of thermal fins. Thus, design of a fixing mechanism with advantages of accurate positioning, easy assembly, and low manufacturing cost is an important issue of the mechanical design industry.

SUMMARY OF THE INVENTION

[0005] The present invention provides a fixing mechanism for preventing a heat-dissipating device from detaching from an initial position due to its vibration and a related thermal module for solving above drawbacks.

[0006] According to the claimed invention, a fixing mechanism includes a plurality of thermal fins whereon a ditch is formed, and a positioning device disposed on the plurality of thermal fins. The positioning device includes a supporting portion. A first side of the supporting portion is for supporting a heat-dissipating device. The positioning device further includes a first constraining portion connected to a second side of the supporting portion and engaged inside the ditch for preventing the supporting portion from moving relative to the plurality of thermal fins in a first direction, and a second constraining portion connected to the second side of the supporting portion and contacting against the plurality of thermal fins for preventing the supporting portion from moving relative to the plurality of thermal fins in a second direction different from the first direction.

[0007] According to the claimed invention, a positioning hole is formed on the first side of the supporting portion, and the fixing mechanism further comprises a positioning component passing through the heat-dissipating device and fixed inside the positioning hole so as to fix the heat-dissipating device on the supporting portion.

[0008] According to the claimed invention, a thickness of the first constraining portion is substantially equal to a width of the ditch so as to fix the positioning device on the plurality of thermal fins tightly.

[0009] According to the claimed invention, the first constraining portion includes a guiding structure for guiding the first constraining portion to engage inside the ditch.

[0010] According to the claimed invention, an inclined angle of the guiding structure is substantially between 3 degrees and 5 degrees.

[0011] According to the claimed invention, the positioning device is disposed between the heat-dissipating device and the plurality of thermal fins so that an interval is formed between the heat-dissipating device and the plurality of thermal fins.

[0012] According to the claimed invention, the second constraining portion comprises two lateral walls contacting against outer sides of two thermal fins of the plurality of thermal fins, respectively.

[0013] According to the claimed invention, the second constraining portion is a lateral wall clipped between two thermal fins of the plurality of thermal fins.

[0014] According to the claimed invention, a thermal module includes a heat-dissipating device, and a fixing mechanism for fixing the heat-dissipating device. The fixing mechanism includes a plurality of thermal fins whereon a ditch is formed, and a positioning device disposed on the plurality of thermal fins. The positioning device includes a supporting portion. A first side of the supporting portion is for supporting the heat-dissipating device. The positioning device further includes a first constraining portion connected to a second side of the supporting portion and engaged inside the ditch for preventing the supporting portion from moving relative to the plurality of thermal fins in a first direction, and a second constraining portion connected to the second side of the supporting portion and contacting against the plurality of thermal fins for preventing the supporting portion from moving relative to the plurality of thermal fins in a second direction different from the first direction.

[0015] These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] FIG. 1 is an exploded diagram of a thermal module according to a preferred embodiment of the present invention.

[0017] FIG. 2 is an assembly diagram of the thermal module according to the preferred embodiment of the present invention.

[0018] FIG. 3 and FIG. 4 are diagrams of a positioning device in different views according to the preferred embodiment of the present invention.

DETAILED DESCRIPTION

[0019] Please refer to FIG. 1 and FIG. 2. FIG. 1 is an exploded diagram of a thermal module 10 according to a preferred embodiment of the present invention. FIG. 2 is an assembly diagram of the thermal module 10 according to the preferred embodiment of the present invention. The thermal module 10 can be disposed inside a computer system for dissipating heat generated by electronic components. The thermal module 10 includes a heat-dissipating device 12. The heat-dissipating device 12 can be a fan, such as an axial flow fan, a centrifugal fan, and so on. The thermal module 10 further includes a fixing mechanism 14 for fixing the heat-dissipating device 12 on a predetermined position, so that the heat-dissipating device 12 can dissipate the heat stably and effectively. The fixing mechanism 14 includes a plurality of thermal fins 16 whereon at least one ditch 161 is formed, and at least one positioning device 18 disposed on the plurality of thermal fins 16. The fixing mechanism 14 can further include at least one positioning component 20 for fixing the heat-dissipating device 12 on the positioning device 18, so that the heat-dissipating device 12 can be fixed on the plurality of thermal fins 16. The positioning component 20 can be a locking component, such as a screw. As shown in FIG. 2, the ditch 161 can be formed on any positions of the plurality of thermal fins 16, so that the positioning device 18 can be installed on the corresponding ditch 161 and the heat-dissipating device 12 can be installed on the plurality of thermal fins 16 at the corresponding orientation. For example, as shown in FIG. 2, four lateral sides of the heat-dissipating device 12 do not align with four lateral sides of the plurality of thermal fins 16 in an embodiment. The disposition of the heat-dissipating device 12 and the plurality of thermal fins 16 is not limited to the above-mentioned embodiment, and it depends on design demand. In addition, the positioning device 18 can be installed between the heat-dissipating device 12 and the plurality of thermal fins 16, so as to form a gap between the heat-dissipating device 12 and the plurality of thermal fins 16 for preferred heat convection efficiency. The number of the positioning device 18, and the disposition of the positioning device 18, the heat-dissipating device 12, and the plurality of thermal fins 16 are not limited to the above-mentioned embodiment, and it depends on actual demand. For example, the positioning device 18 can be disposed on an outer side of the plurality of thermal fins 16.

[0020] Please refer to FIG. 1 to FIG. 4. FIG. 3 and FIG. 4 are diagrams of the positioning device 18 in different views according to the preferred embodiment of the present invention. The positioning device 18 includes a supporting portion 22. A first side 221 of the supporting portion 22 is for supporting the heat-dissipating device 12. A positioning hole 223 can be formed on the first side 221 of the supporting portion 22. The positioning component 20 can pass through the heat-dissipating device 12 and be fixed inside the positioning hole 223, so as to fix the heat-dissipating device 12 on the supporting portion 22. The positioning device 18 further includes a first constraining portion 24 connected to a second side 225 of the supporting portion 22 and engaged inside the ditch 161, so as to prevent the supporting portion 22 from moving along a first direction D1 relative to the plurality of thermal fins 16. The positioning device 18 further includes a second constraining portion 26 connected to the second side 225 of the supporting portion 22 and contacting against the plurality of thermal fins 16, so as to prevent the supporting portion 22 from moving along a second direction D2 substantially different from the first direction D1 relative to the plurality of thermal fins 16. The first direction D1 can be substantially perpendicular to the second direction D2. The positioning device 18 can be made of elastic material, which not only can fix the heat-dissipating device 12 on the plurality of thermal fins 16, but also can effectively absorb vibration generated by the heat-dissipating device 12 for preventing the heat-dissipating device 12 from detaching from the plurality of thermal fins 16.

[0021] As shown in FIG. 1 to FIG. 4, a thickness of the first constraining portion 24 is substantially equal to a width of the ditch 161, so that the positioning device 18 can be fixed on the plurality of thermal fins 16 tightly. A guiding structure 241 can be formed on the first constraining portion 24 for engaging the first constraining portion 24 inside the ditch 161 conveniently. The guiding structure 241 can be made of elastic material, and the guiding structure 241 can be elastically deformed as the first constraining portion 24 are wedged into the ditch 161 for guiding the first constraining portion 24 to engage inside the ditch 161 smoothly. Generally, an inclined angle of the guiding structure 241 can be substantially and preferably between 3 degrees and 5 degrees. In addition, the second constraining portion 26 of the preferred embodiment includes two lateral walls 261 respectively contacting against outer sides of two thermal fins of the plurality of thermal fins 16, so as to constrain a movement of the supporting portion 22 along the second direction D2 relative to the plurality of thermal fins 16. However, the structure of the second constraining portion 26 is not limited to the above-mentioned embodiment. For example, the second constraining portion 26 can be a lateral wall clipped between the two thermal fins of the plurality of thermal fins 16. Structures capable of constraining the movement of the supporting portion 22 along the second direction D2 relative to the plurality of thermal fins 16 belongs to the scope of the second constraining portion 26 of the present invention.

[0022] In conclusion, the fixing mechanism 14 includes the plurality of thermal fins 16 whereon the ditch 161 is formed. First, the first constraining portion 24 of the positioning device 18 is engaged inside the ditch 161 tightly, and the second constraining portion 26 of the positioning device 18 contacts against the plurality of thermal fins 16, so that the first constraining portion 24 and the second constraining portion 26 respectively constrain the movements of the supporting portion 22 along the first direction D1 and the second direction D2 relative to the plurality of thermal fins 16. The first direction D1 can be substantially perpendicular to the second direction D2, so as to position the heat-dissipating device 12 in biaxial directions. Therefore, the positioning device 18 can solve the problem that the heat-dissipating device easily moves relative to the thermal fins by its vibration in the prior art. In addition, the positioning component 20 passes through the heat-dissipating device 12 and is fixed inside the positioning hole 223 on the first side 221 of the supporting portion 22, so that the heat-dissipating device 12 is fixed on the positioning device 18 stably, and the heat-dissipating device 12 can be fixed on the plurality of thermal fins 16 via the positioning device 18 and the positioning component 20 in triaxial directions. Furthermore, the positioning device 18 can be made of elastic material, so that the positioning device 18 can be engaged inside the ditch 161 with the elastic deformation of the first constraining portion 22 so as to simultaneously absorb the vibration generated by the heat-dissipating device 12 for stabilizing the engagement. Thus, the heat-dissipating device 12 can be installed on the plurality of thermal fins 16 via the positioning device 18 rapidly and stably.

[0023] Comparing to the prior art, the fixing mechanism and the related thermal module of the present invention has advantages of low manufacturing cost and easy assembly. The fixing mechanism of the present invention can install the heat-dissipating device on the plurality of thermal fins stably for preventing the heat-dissipating device from detaching from the thermal fins due to its vibration.

[0024] Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention.

Claims

1. A fixing mechanism comprising: a plurality of thermal fins whereon a ditch is formed; and a positioning device disposed on the plurality of thermal fins, the positioning device comprising: a supporting portion, a first side of the supporting portion being for supporting a heat-dissipating device; a first constraining portion connected to a second side of the supporting portion and engaged inside the ditch for preventing the supporting portion from moving relative to the plurality of thermal fins in a first direction; and a second constraining portion connected to the second side of the supporting portion and contacting against the plurality of thermal fins for preventing the supporting portion from moving relative to the plurality of thermal fins in a second direction different from the first direction.

2. The fixing mechanism of claim 1, wherein a positioning hole is formed on the first side of the supporting portion, and the fixing mechanism further comprises a positioning component passing through the heat-dissipating device and fixed inside the positioning hole so as to fix the heat-dissipating device on the supporting portion.

3. The fixing mechanism of claim 1, wherein a thickness of the first constraining portion is substantially equal to a width of the ditch so as to fix the positioning device on the plurality of thermal fins tightly.

4. The fixing mechanism of claim 3, wherein the first constraining portion comprises a guiding structure for guiding the first constraining portion to engage inside the ditch.

5. The fixing mechanism of claim 4, wherein an inclined angle of the guiding structure is substantially between 3 degrees and 5 degrees.

6. The fixing mechanism of claim 1, wherein the positioning device is made of elastic material.

7. The fixing mechanism of claim 1, wherein the positioning device is disposed between the heat-dissipating device and the plurality of thermal fins so that an interval is formed between the heat-dissipating device and the plurality of thermal fins.

8. The fixing mechanism of claim 1, wherein the second constraining portion comprises two lateral walls contacting against outer sides of two thermal fins of the plurality of thermal fins, respectively.

9. The fixing mechanism of claim 1, wherein the second constraining portion is a lateral wall clipped between two thermal fins of the plurality of thermal fins.

10. A thermal module comprising: a heat-dissipating device; and a fixing mechanism for fixing the heat-dissipating device, the fixing mechanism comprising: a plurality of thermal fins whereon a ditch is formed; and a positioning device disposed on the plurality of thermal fins, the positioning device comprising: a supporting portion, a first side of the supporting portion being for supporting the heat-dissipating device; a first constraining portion connected to a second side of the supporting portion and engaged inside the ditch for preventing the supporting portion from moving relative to the plurality of thermal fins in a first direction; and a second constraining portion connected to the second side of the supporting portion and contacting against the plurality of thermal fins for preventing the supporting portion from moving relative to the plurality of thermal fins in a second direction different from the first direction.

11. The thermal module of claim 10, wherein a positioning hole is formed on the first side of the supporting portion, and the fixing mechanism further comprises a positioning component passing through the heat-dissipating device and fixed inside the positioning hole so as to fix the heat-dissipating device on the supporting portion.

12. The thermal module of claim 10, wherein a thickness of the first constraining portion is substantially equal to a width of the ditch so as to fix the positioning device on the plurality of thermal fins tightly.

13. The thermal module of claim 12, wherein the first constraining portion comprises a guiding structure for guiding the first constraining portion to engage inside the ditch.

14. The thermal module of claim 13, wherein an inclined angle of the guiding structure is substantially between 3 degrees and 5 degrees.

15. The thermal module of claim 10, wherein the positioning device is made of elastic material.

16. The thermal module of claim 10, wherein the positioning device is disposed between the heat-dissipating device and the plurality of thermal fins so that an interval is formed between the heat-dissipating device and the plurality of thermal fins.

17. The thermal module of claim 10, wherein the second constraining portion comprises two lateral walls contacting against outer sides of two thermal fins of the plurality of thermal fins, respectively.

18. The thermal module of claim 10, wherein the second constraining portion is a lateral wall clipped between two thermal fins of the plurality of thermal fins.

19. The thermal module of claim 10, wherein the heat-dissipating device is a fan.

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