Patent application number | Description | Published |
20090034183 | Cooling device for memory chips - A cooling device for memory chip includes a first part and a second part which is pivotably connected to the first part at a top thereof. Each of the first and second parts includes an elongate plate and fins extend from each of the elongate plates. Ventilation holes are defined through each the elongate plates and located between the fins. The memory chip is sandwiched between the first and second elongate plates of the first and second parts, and the fins of the two parts are arranged alternatively. | 02-05-2009 |
20090277607 | Heat sink memory chip - A heat sink for chips includes two heat dispensing units and each heat dispensing unit includes multiple fins between which passages are defined. Each heat dispensing unit includes a flat surface defined in an inside thereof and a heat conducting member is connected to the flat surface. The chip is in contact between the two heat conducting members so that the heat generated from the chip is contacted to the heat conducting members and the fins and escapes to the air. | 11-12-2009 |
20090288802 | Heat sink for chips - A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and a second heat dispensing unit is fixed on a top of the base board. The base board is connected to the first heat dispensing unit by two clamping members. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member. | 11-26-2009 |
20090288803 | Heat sink for chips - A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and two engaging portions are connected to two ends of the base board. A second heat dispensing unit is fixed on a top of the base board. Two clamps connect the base board to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member. | 11-26-2009 |
20090288804 | Heat sink for chips - A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and a second heat dispensing unit is fixed on a top of the base board. The base board is connected to the first heat dispensing unit by two clamping members. The clamping members each have a first portion fixed to the base board and a second board which is removably connected to the first portion. The second portion is connected to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member. | 11-26-2009 |
20090290308 | Heat sink for chips - A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped therebetween. A base board has a first extension portion and a second extension portion extending from two ends thereof. A second heat dispensing unit is fixed on a top of the base board. A first clamping member is integrally connected to the first extension portion and a second clamping member is removably connected to the second extension portion. The first and second clamping members connect the base board to the first heat dispensing unit. | 11-26-2009 |
20090294099 | Heat dispensing unit for memory chip - A heat dispensing unit includes two heat dispensing plates between which the memory chip is clamped. Each heat dispensing plate has a plurality of bending plates which split from an inside of each of the heat dispensing plates and each bending plate has an insertion and a hole. When connecting the two heat dispensing plates, the first insertions on one of the two heat dispensing plates are engaged with the first holes of the other heat dispending plate. The heat dispensing plates have a flange on a top thereof so as to cover the gap between the two heat dispensing plates. | 12-03-2009 |
20100038054 | Heat dispensing unit for memory chip - A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes multiple ridges extending from an outside thereof and two clamps clamp two ends of the two heat dispensing plates. Each clamp includes two side plates and a flexible plate which is connected between the two side plates, two protrusions extend from two respective insides of the two side plates so as to be engaged with two holes in the two heat dispensing plates to securely connect the two heat dispensing plates. The clamps each have two hooks to hook the notches in two ends of the chip. | 02-18-2010 |
20100038055 | Heat dispensing unit for memory chip - A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes two connection plates bending from two ends thereof and the two connection plates have a connection piece or a connection port so that when the two heat dispensing plates are connected to each other, the connection pieces are connected to the connection ports. | 02-18-2010 |