Patent application number | Description | Published |
20150035872 | LIQUID CRYSTAL DISPLAY DEVICE - A device according to an embodiment includes an array substrate including electrodes corresponding to pixels arranged in a matrix, a color filter substrate opposed to the array substrate and including color filters corresponding to the pixels, a liquid crystal layer provided between the substrates, a backlight, and a controller which controls the substrates and the backlight. The pixels are configured to each have a parallelogrammatic shape elongated in a lateral direction, such that identical colors are arranged in the lateral direction, and different colors are arranged in a vertical direction. Pixels neighboring in the lateral direction are in line-symmetry with respect to a center line of the neighboring pixels. Liquid crystal molecules have negative dielectric constant anisotropy, and rotate horizontally relative to a substrate plane in a direction of the line-symmetry with respect to the center line when the voltage is applied to the electrodes of the neighboring pixels. | 02-05-2015 |
20150035873 | LIQUID CRYSTAL DISPLAY DEVICE - A device according to an embodiment includes an array substrate, a color filter substrate including color filters corresponding to pixels, a liquid crystal layer provided between the substrates, a backlight unit, and a controller. The controller controls an application timing of a driving voltage to the pixel electrodes, and a light emission timing of the backlight unit. Each of the pixels has a shape elongated in a lateral direction. Identical colors of the pixels are arranged in the lateral direction, and different colors of the pixels are arranged in a vertical direction. Pixels neighboring in the lateral direction have shapes of line-symmetry with respect to a center line of the neighboring pixels, and liquid crystal molecules of them tilt in directions of the line-symmetry with respect to the center line when the driving voltage is applied to the pixel electrodes corresponding to the neighboring pixels. | 02-05-2015 |
20150070611 | LIQUID CRYSTAL DISPLAY DEVICE - Pixels of a liquid crystal display device have a polygonal shape long in the longitudinal direction. The pixel is divided into two by a center line, and is line-symmetric with respect to the center line. Pixel electrodes are divided line-symmetrically with respect to the center line. Streaks are formed on the surfaces of the pixel electrodes. Common electrodes are divided line-symmetrically with respect to the center line. Positions of the common electrodes in the lateral direction shift from the pixel electrodes in directions apart from the center line. A film gives a pretilt angle to liquid crystal molecules to tilt the lengthwise direction of the liquid crystal molecules from the vertical direction in the directions in which the common electrodes shift from the pixel electrodes. | 03-12-2015 |
Patent application number | Description | Published |
20090268595 | INFORMATION RECORDING MEDIUM AND RECORDING/REPRODUCING APPARATUS - On an information recording medium, a first region where first recording regions that are long in a radial direction are disposed at a predetermined pitch with first non-recording regions in between is provided in a preamble pattern region. A second recording region that connects first recording regions that are adjacent in a direction of rotation is provided in the first region. A second non-recording region that is longer in the direction of rotation than a length in the direction of rotation of the first non-recording regions at corresponding same-pattern-radius positions is provided at a position where a read of servo data is carried out following the first region. | 10-29-2009 |
20100108640 | DRAWING METHOD, STAMPER MANUFACTURING METHOD, INFORMATION RECORDING MEDIUM MANUFACTURING METHOD, AND DRAWING APPARATUS - A drawing method and a drawing apparatus use a drawing beam to draw a pattern, which will be used when forming a concave/convex pattern, on a resin layer formed on a substrate. When doing so, to prevent insufficient exposure to the drawing beam in certain parts of the pattern that tend to be insufficiently exposed, the number of irradiation of the drawing beam is changed. By doing so, the production of defects in the concave/convex pattern is avoided and the pattern can be made finer. | 05-06-2010 |
20130222092 | THIN-FILM MAGNETIC OSCILLATION ELEMENT - A thin-film magnetic oscillation element includes a pinned magnetic layer, a free magnetic layer, a nonmagnetic spacer layer provided between the pinned magnetic layer and the free magnetic layer, and a pair of electrodes, in which the easy axis of magnetization of the pinned magnetic layer lies in an in-plane direction of the plane of the pinned magnetic layer, and the easy axis of magnetization of the free magnetic layer lies in a direction normal to the plane of the free magnetic layer. Preferably, the relationship between the saturation magnetization Ms and the magnetic anisotropy field Ha of the free magnetic layer satisfies | 08-29-2013 |
20140340183 | THIN FILM MAGNETIC ELEMENT - A magnetoresistive effect element includes a pair of first soft magnetic layers that are arranged opposite to each other so as to sandwich a magnetoresistive effect film; a second soft magnetic layer; and a coil that is windingly formed about the second soft magnetic layer. When a rear end region cross-sectional area of the first soft magnetic layers is defined as S1r and a tip end region cross-sectional area of the second soft magnetic layer is defined as S2f, S2f>S1r is established, and when a tip end width of the first soft magnetic layers is defined as W1f and a rear end width of the first soft magnetic layers is defined as W1r, W1r>W1f is established. | 11-20-2014 |
20150061393 | VARIABLE VOLTAGE CIRCUIT - In a variable voltage circuit | 03-05-2015 |
20150228394 | MAGNETIC ELEMENT - A magnetic element including a magnetoresistive effect film (MEF). Magnetic element includes an MEF and nonmagnetic spacer layer, first and second ferromagnetic layers, wherein layers being disposed with nonmagnetic spacer layer interposed therebetween, pair of electrodes disposed with MEF interposed therebetween in stacking direction of MEF at least two first soft magnetic layers, coil, and second soft magnetic layer magnetically connected to coil, wherein second soft magnetic layer has ring-like shape, spacing distance between second soft magnetic layer and MEF is larger than first soft magnetic layer and MEF, film thickness of second soft magnetic layer is larger than first soft magnetic layer, part of the two first soft magnetic layers overlaps a part of second soft magnetic layer in stacking direction of MEF, first and second soft magnetic layers are magnetically coupled to each other, and MEF is disposed between respective fore ends of two first soft magnetic layers. | 08-13-2015 |
20150249205 | MAGNETIC ELEMENT, AND MAGNETIC HIGH FREQUENCY ELEMENT HAVING THE MAGNETIC ELEMENT - A higher oscillation output is realized in a magnetic element utilizing high frequency characteristics of a magnetoresistive effect element. A magnetic element | 09-03-2015 |
Patent application number | Description | Published |
20100118861 | Inter-Working Between a Packet-Switched Domain and a Circuit-Switched Domain - The present invention proposes a solution for providing packet-switched services to a user, even in case the user is accessibly only via a circuit-switched access. For this purpose it is proposed to force the user to report changes in the reachability status and to keep the user's registration alive in a packet-switched domain as long as the user is reachable. A packet-switched adapter located between the circuit-switched domain and a packet-switched domain aligns the registration status of the user in the packet-switched domain to the reachability status and performs a registration procedure depending on the outcome of the alignments. The registration procedure might be in detail either a registration or a re-registration or a de-registration procedure. | 05-13-2010 |
20100157985 | SYSTEM AND METHOD FOR INDICATING CIRCUIT SWITCHED ACCESS AT IMS REGISTRATION - In IP Multimedia Subsystem (IMS) IMS Control Channel Protocol (ICCP) is used between a user equipment (UE) and IMS Control Channel Function (ICCF) and Session Initiated Protocol (SIP) interface (between to ICCF, Call Session Control Function and Application Server) to support the indication of Circuit Switched (CS) access utilizing P-Access-Network-Information header. The indication can be used by an S-CSCF or AS for different purposes such as routing decision, charging, and presence info. | 06-24-2010 |
20100182998 | Access Domain Selection In A Communications Network - A method and apparatus for managing access domain selection for a user device accessing an IP Multimedia Subsystem (IMS) network. A Call Session Control Function (CSCF) in the IMS network stores an access domain indicator associated with a user s contact address. The access domain indicator is associated with the user s contact address when the user registers with the IMS network. The CSCF sends the access domain indicator to an Access Domain Selection (ADS) function in the IMS network, the access domain indicator to be used by the ADS function in selecting an access domain. This allows the ADS function to select the correct access domain to use when sending messages to the user device. | 07-22-2010 |
20100254372 | SYSTEM AND METHOD FOR ENHANCING IMS CENTRALIZED SERVICES - A system and method of providing an enhanced service in a telecommunications network. The system includes a telecommunications network utilizing a circuit switched and packet switched access capability. The system also includes a sending User Equipment (UE) originating a call to a receiving UE. The sending UE sends an indicator informing the network to wait for further call information before proceeding with a call request towards the receiving UE. The system also includes a control node for routing calls within the network. The control node combines the call information received from the sending UE with call routing information of the call for connecting the call with the receiving UE to form a call request to the receiving UE. Upon receiving the call request message by the receiving UE, the call is connected and a media path is established between the receiving UE and the sending UE. | 10-07-2010 |
20130077620 | SYSTEM AND METHOD FOR INDICATING CIRCUIT SWITCHED ACCESS AT IMS REGISTRATION - In IP Multimedia Subsystem (IMS) IMS Control Channel Protocol (ICCP) is used between a user equipment (UE) and IMS Control Channel Function (ICCF) and Session Initiated Protocol (SIP) interface (between to ICCF, Call Session Control Function and Application Server) to support the indication of Circuit Switched (CS) access in header information. The indication can be used by an S-CSCF or AS for different purposes such as routing decision, charging, and presence info. | 03-28-2013 |
Patent application number | Description | Published |
20080291880 | RANDOM ACCESS COMMUNICATION METHOD AND MOBILE COMMUNICATION SYSTEM IN MOBILE COMMUNICATION SYSTEM - The random access communication method according to the present invention includes a mobile station transmitting a transmission continuation request signal which requests a continuation of transmission of random access data to a base station during transmission of the random access data, the base station judging, upon receiving a transmission continuation request signal from the mobile station, whether or not to permit a continuation of transmission of the random access data depending on the current communication situation, the base station transmitting a transmission continuation permission signal or a transmission continuation rejection signal to the mobile station depending on whether or not to permit the continuation of transmission of the random access data, and the mobile station continuing, upon receiving the transmission continuation permission signal from the base station, transmission of the random access data. | 11-27-2008 |
20100232557 | TRANSMISSION TIMING CONTROL SYSTEM AND METHOD, AND MOBILE STATION FOR USE THEREIN - It is an object of the present invention to hold the detecting range of a timing correlator in a base station to the minimum required and to reduce the circuit scale and power requirement of the timing correlator. Before a mobile station transmits a data signal, it transmits a signal referred to as a preamble signal to measure the transmission timing to the base station. If the base station detects the preamble signal with a timing correlator having a limited circuit scale, then the base station transmits a transmission permission signal to the mobile station. If the mobile station fails to receive the transmission permission signal over a given period of time after it has transmitted the preamble signal, then the mobile station retransmits the preamble signal at a changed transmission timing based on the received electric power of a control signal transmitted continuously from the base station and information included in the control signal. The mobile station repeatedly retransmits the preamble signal until it receives the transmission permission signal. If the mobile station receives the transmission permission signal from the base station, then the mobile station transmits a data signal at the transmission timing of the preamble signal transmitted immediately prior to the reception of the transmission permission signal. | 09-16-2010 |
20110268160 | TRANSMISSION TIMING CONTROL SYSTEM AND METHOD, AND MOBILE STATION FOR USE THEREIN - It is an object of the present invention to hold the detecting range of a timing correlator in a base station to the minimum required and to reduce the circuit scale and power requirement of the timing correlator. Before a mobile station transmits a data signal, it transmits a signal referred to as a preamble signal to measure the transmission timing to the base station. If the base station detects the preamble signal with a timing correlator having a limited circuit scale, then the base station transmits a transmission permission signal to the mobile station. If the mobile station fails to receive the transmission permission signal over a given period of time after it has transmitted the preamble signal, then the mobile station retransmits the preamble signal at a changed transmission timing based on the received electric power of a control signal transmitted continuously from the base station and information included in the control signal. The mobile station repeatedly retransmits the preamble signal until it receives the transmission permission signal. If the mobile station receives the transmission permission signal from the base station, then the mobile station transmits a data signal at the transmission timing of the preamble signal transmitted immediately prior to the reception of the transmission permission signal. | 11-03-2011 |
20120257532 | RELAY DEVICE, RELAY SYSTEM, RELAY METHOD, RADIO COMMUNICATION SYSTEM, AND PROGRAM - A relay device according to the present invention includes an uplink signal relaying unit that performs an uplink signal relaying operation that amplifies an uplink signal transmitted through an uplink channel from a mobile station and re-transmits the amplified uplink signal to a base station; a frequency information acquisition unit that acquires frequency information that represents a frequency band that said mobile station uses for the uplink channel periodically or at predetermined timings; an uplink signal detection unit that determines whether or not the average reception power of the uplink signal in the frequency band represented by the frequency information acquired by said frequency information acquisition unit exceeds a predetermined threshold; and a control unit that controls the uplink signal relaying operation performed by said uplink signal relaying unit based on a determined result of said uplink signal detection unit. | 10-11-2012 |
Patent application number | Description | Published |
20080210562 | Plating method and plating apparatus - A plating method, despite employing a face-down manner of plating and using a resistor body between a substrate and an anode, can securely bring an entire surface to be plated of the substrate into contact with a plating solution without permitting intrusion of air bubbles to the surface to be plated, thereby enabling uniform plating, and can easily regulate the temperature of the plating solution. The plating method for carrying out plating of a downwardly-facing surface to be plated of a substrate by applying a voltage between the surface to be plated and an anode disposed below the substrate in the presence of a plating solution between the surface to be plated and the anode, comprises disposing a resistor body above the anode and immersing the resistor body in the plating solution, allowing the plating solution to flow along an upper surface of the resistor body from the periphery toward the center of the resistor body, thereby creating a raised portion of the plating solution in the center of the upper surface of the resistor body, and then lowering the substrate with the surface facing downwardly so as to fill the space between the surface to be plated of the substrate and the upper surface of the resistor body with the plating solution. | 09-04-2008 |
20080264798 | Copper Plating Bath and Plating Method - An acid copper plating solution and plating method are disclosed. The acid copper plating solution comprises copper ions, an organic acid or an inorganic acid, chloride ions, high molecular weight surfactant which controls the electrodeposition reaction, and a sulfur-containing saturated organic compound which promotes the electrocoating rate, wherein the high molecular weight surfactant comprises two or more types with different hydrophobicities. The plating method is a method for forming a plating film on a conductor layer, which is formed on at least a part of a structural object having a concave-convex pattern on a semiconductor substrate, and comprises providing a cathode potential to the conductor layer and supplying a plating solution which electrically connects an anode with the conductor layer, wherein the plating solution contains 25-75 g/l of copper ion and 0.4 mol/l of an organic acid or inorganic acid and an electric resistor is installed between the conductor layer and the anode. Also disclosed is a plating method for forming a wiring circuit on an electronic circuit substrate having fine holes and trenches, comprising forming a plating film on a conductor layer, which is formed on at least a part of the substrate, and filling the holes and trenches with copper, wherein the plating film is formed by using an acid copper plating solution containing copper ions, organic or inorganic acid, chloride ions, sulfur-containing saturated organic compound, and high molecular weight surfactant controlling electrocoating concentration of 500 ppm or more. | 10-30-2008 |
20090020434 | Substrate processing method and substrate processing apparatus - A substrate processing method makes it possible to fill interconnect recesses, such as trenches, with a defect-free interconnect material by carrying out electroplating directly on a surface of a ruthenium film as a barrier layer. The substrate processing method comprises: providing a substrate having interconnect recesses formed in a substrate surface and having a ruthenium film formed in the entire substrate surface including interior surfaces of the interconnect recesses; keeping the substrate surface in contact with a plating solution for a predetermined time to adsorb an additive in the plating solution onto the ruthenium film, and then carrying out electroplating to form a conductive film on a surface of the ruthenium film. | 01-22-2009 |
20100032315 | Electrolytic processing apparatus and electrolytic processing method - An electrolytic processing apparatus, prior to carrying out plating directly on, e.g., a ruthenium film of a substrate using the ruthenium film as a seed layer, can securely remove a passive layer formed on a surface of the ruthenium film even when the substrate is a large-sized high-resistance substrate, such as a 300-mm wafer, thereby reducing the terminal effect during the subsequent plating, improving the quality of a plated film and enabling filling of a void-free plated film into a fine interconnect pattern. The electrolytic processing apparatus includes: an anode disposed opposite a seed layer of a noble metal or a high-melting metal, formed on a substrate; a porous body impregnated with an electrolytic solution, disposed in a space, filled with the electrolytic solution, between the substrate and the anode; and a control section for controlling an electric field on a surface of the seed layer so that a reduction reaction takes place in the seed layer, thereby electrolytically and electrochemically removing a passive layer formed in the surface of the seed layer. | 02-11-2010 |
20100163408 | Plating apparatus and plating method - A plating apparatus can form a plated film having a more uniform thickness over an entire surface of a substrate and can securely fill interconnect recesses with the metal without forming voids in the embedded metal even when the substrate has a high sheet resistance in the surface. The plating apparatus includes a substrate holder for holding a substrate, a cathode portion including a cathode for contact with the substrate held by the substrate holder to feed electricity to the substrate, and an anode, partly or wholly having a high resistance, disposed opposite a surface of the substrate held by the substrate holder, wherein plating of the surface of the substrate is carried out while filling between the anode and the substrate held by the substrate holder with a plating solution. | 07-01-2010 |
20110155581 | METHOD FOR FORMING METAL FILM - A metal film-forming method is capable of forming a metal film on a surface of a base metal film, formed on a surface of a substrate, with sufficient adhesion to the base metal film even when a natural oxide film is formed on the surface of the base metal film. The metal film-forming method includes: preparing a substrate having a base metal film formed on a surface; and carrying out electroplating of the substrate using the base metal film as a cathode and another metal as an anode while immersing the substrate in a solution containing a metal complex and a reducing material, both dissolved in a solvent, to form a metal film, deriving from a metal contained in the metal complex, on the surface of the base metal film. | 06-30-2011 |
20130056361 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus can arbitrarily switch the flow direction of a processing liquid without causing a change in the overall flow rate of the processing liquid nor creating a non-uniform flow of the processing liquid. The substrate processing apparatus includes a plurality of inlet pipes and a plurality of outlet pipes, connected to a processing tank and to be switched therebetween to create a flow of a processing liquid in the processing tank in a direction different from that of the processing liquid before the switching. The inlet pipes and the outlet pipes are each provided with a flow control device which is controlled by a control section so that upon switching between the pipes, the flow rate of the processing liquid flowing therethrough changes with time. | 03-07-2013 |
20130122704 | ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATING METHOD - There is provided an electroless plating apparatus which, despite using a high-productivity batch processing method, can reduce the amount of a liquid chemical brought out of a processing tank, thereby reducing the cleaning time in a cleaning step, and can perform flushing easily and quickly. The electroless plating apparatus includes a pre-plating treatment module including a pre-plating treatment tank, a plating module, and an inter-module substrate transport device. The pre-plating treatment tank is provided with a pre-plating treatment solution circulation line having a temperature control function for a pre-plating treatment solution. The plating tank is provided with a plating solution circulation line having a filter and a temperature control function for a plating solution. The plating solution circulation line is connected to a flushing line for flushing the interior of the plating solution circulation line and the interior of the plating tank. | 05-16-2013 |
20150090584 | PLATING APPARATUS AND CLEANING DEVICE USED IN THE PLATING APPARATUS - A plating apparatus for plating a substrate is disclosed. The plating apparatus includes: a dip-type plating bath; a dry-type plating bath having a hole in a sidewall thereof; and a pressing mechanism configured to press a substrate holder, holding a substrate, against the sidewall of the dry-type plating bath to close the hole. The substrate holder includes a base member and a holding member configured to sandwich the substrate therebetween, a first seal portion configured to seal a gap between the substrate and the holding member, a second seal portion configured to seal a gap between the base member and the holding member, and a third seal portion configured to seal a gap between the holding member and the sidewall of the dry-type plating bath. | 04-02-2015 |
20150267302 | ELECTROLESS PLATING METHOD - An electroless plating method which can prevent stoppage of a plating reaction and a decrease in a plating rate is disclosed. This method includes: circulating a plating solution through a plating bath while heating the plating solution; immersing the substrate in the plating solution in the plating bath; forming a first electroless plating film on the substrate while circulating the plating solution at a first flow rate during a period from when the substrate is immersed in the plating solution until a predetermined time elapses; and forming a second electroless plating film on the first electroless plating film while circulating the plating solution at a second flow rate that is lower than the first flow rate after the predetermined time has elapsed. | 09-24-2015 |
20150275390 | ANODE UNIT AND PLATING APPARATUS HAVING SUCH ANODE UNIT - An anode unit capable of forming a metal film having a uniform thickness on a substrate is disclosed. The anode unit includes an anode, a first feeding portion connected to a central portion of the anode, a second feeding portion located on a central axis of the anode and located away from the anode, and arms extending radially from the second feeding portion. The arms are connected to a periphery of the anode. | 10-01-2015 |