Patents - stay tuned to the technology

Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees

Patent application title: STRUCTURE OF WALL, FLOOR AND CEILING OF BUILDING

Inventors:  Yoshiaki Nakada (Tokyo, JP)
Assignees:  Nippon Digital Soft Kabushiki Kaisha
IPC8 Class: AE04B548FI
USPC Class: 521731
Class name: Static structures (e.g., buildings) combined
Publication date: 2015-10-15
Patent application number: 20150292204



Abstract:

The present invention provides a structure of a wall, a floor and a ceiling of a building using a peltier element so that cooling/heating friendly to human body can be achieved. The wall, the floor and the ceiling of the building has a first board; a second board that is arranged on an indoor side of the first board while facing the first board and has an opening; a third board that is arranged on the indoor side of the second board while facing the second board; a peltier element that is arranged on the opening of the second board so that heat is transferred in a thickness direction of the second board by being connected to a power source; and a heat storage member arranged between the second board and the third board.

Claims:

1. A wall, a floor and a ceiling of a building, comprising: a first board; a second board that is arranged on an indoor side of the first board while facing the first board and has an opening; a third board that is arranged on the indoor side of the second board while facing the second board; a peltier element that is arranged on the opening of the second board so that heat is transferred in a thickness direction of the second board by being connected to a power source; and a heat storage member arranged between the second board and the third board.

2. A wall, a floor and a ceiling of a building, comprising: a first board; a second board that is arranged on an indoor side of the first board while facing the first board and has an opening; a third board that is arranged on the indoor side of the second board while facing the second board; a fourth board that is arranged on the indoor side of the third board while facing the third board; a pettier element that is arranged on the opening of the second board so that heat is transferred in a thickness direction of the second board by being connected to a power source; and a heat storage member arranged between the third board and the fourth board.

3. The wall, the floor and the ceiling of the building according to claim 1, further comprising: a first air flow generating device that generates an air flow between the first board and the second board; and a second air flow generating device that generates an air flow between the second board and the third board.

4. The wall, the floor and the ceiling of the building according to claim 3, wherein the first air flow generating device and the second air flow generating device are arranged facing each other sandwiching the peltier element so that the air flow is generated in the thickness direction of the second board toward the peltier element.

5. The wall, the floor and the ceiling of the building according to claim 1, wherein a heat reflecting sheet containing a layer of metal is arranged along the second board.

6. The wall, the floor and the ceiling of the building according to claim 1, wherein the heat storage member contains a ceramic structure having many holes penetrating in the thickness direction of the second board.

7. The wall, the floor and the ceiling of the building according to claim 1, further comprising: a first vent pipe that is connected to a first opening formed on the first board so as to ventilate a space between the first board and the second board; a second vent pipe that is at least connected to a second opening formed on the first board and a third opening formed on the second board; and a porous heat storage member that is arranged an inside the second vent pipe and has a plurality of holes penetrating in the thickness direction of the second board.

8. The wall, the floor and the ceiling of the building according to claim 1, wherein the heat storage member has a phase transition temperature of around a preset temperature.

9. The wall, the floor and the ceiling of the building according to claim 8, wherein the heat storage member includes a plurality of heat storage members having different phase transition temperatures which almost corresponding to a plurality of different preset temperatures.

10. The wall, the floor and the ceiling of the building according to claim 8, wherein the heat storage member includes a first heat storage member having a phase transition temperature, which is a recommended preset temperature during a cooling operation in a summer season, and a second heat storage member having a phase transition temperature, which is a recommended preset temperature during a heating operation in a winter season.

11. The wall, the floor and the ceiling of the building according to claim 8, further comprising: a heat storage member having a phase transition temperature, which is specified between a recommended preset temperature during a cooling operation and a recommended preset temperature during a heating operation so as to be used both for the summer season and the winter season.

12. A wall, a floor and a ceiling of a building, wherein a heat storage member is held in contact with a third board having high thermal conductivity, a peltier element is supported by a second board, which is arranged facing the third board and has high heat insulating performance, and heat is transferred from the peltier element to the third board through a space.

13. The wall, the floor and the ceiling of the building according to claim 12, wherein the third board is arranged on an indoor side, and the second board is arranged on an outdoor side than the third board.

Description:

CROSS-REFERENCES TO RELATED APPLICATIONS

[0001] This patent specification is based on Japanese patent application, No. 2014-082478 filed on Apr. 14, 2014 in the Japan Patent Office, the entire contents of which are incorporated by reference herein.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to a structure of a wall, a floor and a ceiling of a building.

[0004] 2. Description of the Related Art

[0005] A cooling/heating device using a peltier element is proposed. It is efficiently available for both cooling and heating with a simple structure. As an example, in Patent Document 1, it is described that a cooling/heating device comprised of a peltier element and a heat absorbing/discharging interior plate, which is thermally coupled to one of heat absorbing/discharging surfaces of the peltier element and is arranged on an interior side of a wall, a floor and a ceiling of a building.

[0006] However, since thermal conductivity of the interior plate is limited, in the configuration of Patent document 1, only a specific part of the interior side of the wall and the floor neighboring the peltier element may be extremely heated or cooled by the peltier element. If only the specific part of the interior side of the wall and the floor is extremely heated or cooled, users may feel uncomfortable. In addition, there is a problem in terms of cooling and heating efficiency when compared to energy consumption.

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2003-240255

BRIEF SUMMARY OF THE INVENTION

[0008] The present invention provides a structure of a wall, a floor and a ceiling of a building using a peltier element so that cooling/heating, which is friendly to human body and excellent in energy efficiency, can be achieved.

[0009] In one aspect of the present invention, as shown in FIGS. 3 to 5 for example, a structure of a wall, a floor and a ceiling of a building has a first board; a second board that is arranged on an indoor side of the first board while facing the first board and has an opening; a third board that is arranged on the indoor side of the second board while facing the second board; a peltier element that is arranged on the opening of the second board so that heat is transferred in a thickness direction of the second board by being connected to a power source; and a heat storage member arranged between the second board and the third board.

[0010] In another aspect of the present invention, as shown in FIGS. 1 and 2 for example, a structure of a wall, a floor of a ceiling of a building has a first board; a second board that is arranged on an indoor side of the first board while facing the first board and has an opening; a third board that is arranged on the indoor side of the second board while facing the second board; a fourth board that is arranged on the indoor side of the third board while facing the third board; a peltier element that is arranged on the opening of the second board so that heat is transferred in a thickness direction of the second board by being connected to a power source; and a heat storage member arranged between the third board and the fourth board.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] FIGS. 1A and 1B are cross sectional views showing a structure of a floor of a building concerning the first embodiment of the present invention.

[0012] FIG. 2 is a plan view showing the structure of the floor shown in FIG. 1.

[0013] FIGS. 3A and 3B show a structure of a wall concerning the second embodiment of the present invention. FIG. 3A is a cross-sectional view and FIG. 3B is a front view.

[0014] FIGS. 4A and 4B show a structure of a wall concerning the third embodiment of the present invention. FIG. 4A is a cross-sectional view and FIG. 4B is a front view.

[0015] FIG. 5 is a cross-sectional view showing a structure of a wall concerning the fourth embodiment of the present invention.

[0016] FIG. 6 is a cross-sectional view showing a variation example of FIG. 5.

DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereafter, the embodiments of the present invention will be explained in detail. The embodiments explained below are merely an example of the present invention, and do not unreasonably restrict the present invention described in the claims. All the structures and operations explained in the embodiments are not always necessary for the structure and the operation of the present invention. The same reference characters are applied to the same parts so as to omit the overlapping description.

1. First Embodiment

[0018] FIGS. 1A and 1B are cross sectional views showing a structure of a floor of a building concerning the first embodiment of the present invention. FIG. 1A shows a heating mode operated in a winter season. FIG. 1B shows a cooling mode operated in a summer season. FIG. 2 is a plan view showing the structure of the floor shown in FIG. 1.

[0019] As shown in FIGS. 1A and 1B, the structure of the floor of the building concerning the first embodiment is composed of a first board 11, a second board 12, a third board 13, a fourth board 14, heat storage members 20, and a peltier unit 30. The peltier unit 30 includes peltier elements 15, a blowing fan 31, a blowing fan 32, a motor 33, and a motor 34.

[0020] The first board 11 is a board arranged between a foundation (not illustrated) and a joist 16. Below the first board 11 is an under-floor space. The present specification is described assuming that the under-floor space is classified as outdoor.

[0021] The second board 12 is arranged above (indoor side of) the first board 11 while facing the first board 11. The second board 12 has openings so as to engage the peltier elements 15. The peltier elements 15 are arranged so that heat is transferred in a thickness direction (vertical direction) of the second board 12 by being connected to a DC power source.

[0022] The third board 13 is arranged above (indoor side of) the second board 12 while facing the second board 12.

[0023] The fourth board 14 is arranged above (indoor side of) the third board 13 while facing the third board 13. The fourth board 14 can be, for example, a board forming a floor.

[0024] The heat storage members 20 are arranged between the third board 13 and the fourth board 14. The heat storage members 20 can be a latent heat storage member. The latent heat storage member is, for example, a member of absorbing and releasing a large amount of heat while maintaining a constant temperature using a phase change between a solid phase and a liquid phase. For example, when the latent heat storage member having a phase change temperature of about 20° C. is used, even if an outside temperature is changed from 25° C. to 15° C., it takes a long time before the latent heat storage member is cooled to below 20° C. Therefore, the room temperature can be maintained at 20° C. for a long time. Alternately, the heat storage members 20 can be a sensible heat storage member. As the sensible heat storage member, ceramics can be used. The ceramics preferably include at least either one of mullite, cordierite, zirconia, SiC, zeolite, and Shirasu. Alternately, the heat storage members 20 can be a chemical heat storage member.

[0025] The peltier element 15 transfers heat from one surface to the other surface by being connected to a DC power source (not illustrated). The one surface is a heat absorbing surface (low temperature), while the other side is a heat radiating surface (high temperature). If the polarity of the voltage applied to the peltier element 15 by the DC power source is inverted, the heat absorbing surface and the heat radiating surface are exchanged. FIG. 1A shows a case where heating is performed in the winter season by arranging the heat radiating surface on the upper side. FIG. 1B shows a case where cooling is performed in the summer season by arranging the heat absorbing surface on the upper side. The peltier element 15 can have a plurality of pleats (not illustrated) on the heat radiating surface and the heat absorbing surface.

[0026] The blowing fan 31, as a first air flow generating device, is arranged between the first board 11 and the second board 12 and closely to the peltier element 15. The blowing fan 32, as a first air flow generating device, is arranged between the second board 12 and the third board 13 and closely to the peltier element 15. The blowing fan 31 is connected to the motor 33, and the blowing fan 32 is connected to the motor 34. Since the motors 33 and 34 respectively rotate the blowing fans 31 and 32, the blowing fans 31 and 32 generate an air flow near the heat absorbing surface and the heat radiating surface of the peltier element 15. By the air flow, heat absorption of the heat absorbing surface of the peltier element 15 is enhanced and heat radiation of the heat radiating surface is enhanced.

[0027] In the first embodiment, as shown in FIG. 2, the blowing fans 31 and 32 are arranged overlapping the peltier element 15 when viewed the second board 12 in a plane view while sandwiching the peltier element 15. In addition, the blowing fans 31 and 32 are arranged so as to generate an air flow in a direction parallel to the thickness direction of the second board 12. Thus, the blowing fans 31 and 32 can apply the air flow strongly to the peltier element 15. It is preferred that the blowing fan 31 is larger and has higher blowing capability than the blowing fan 32.

[0028] When the upper side is specified to be the heat radiating surface as shown in FIG. 1A, a space between the second board 12 and the third board 13 is heated by the peltier element 15. Then, the heat is transferred to the heat storage members 20 by heat conduction through the third board 13 and the heat is stored in the heat storage members 20. The heat stored in the heat storage members 20 is released to an above-floor space while taking a long time, thus achieving heating of the above-floor space. The heating of the first embodiment is achieved mainly by heating effect of radiation from the heat storage members 20 to the above-floor space, rather than heating effect of the air blow of the heated air. By using the heating effect of the radiation, the heating, which is less harmful to human body and friendly to human body, can be achieved. In addition, the heating using the peltier element 15 can obtain good heating effect with small energy because the heat absorbed by the heat absorbing surface is used in addition to Joule heat generated by a current.

[0029] In FIG. 1A, a space between the first board 11 and the second board 12 is cooled by the peltier element 15. A temperature sensor (not illustrated) can be provided in the space between the first board 11 and the second board 12. In addition, another temperature sensor (not illustrated) can be provided in the under-floor space. When a temperature of the space between the first board 11 and the second board 12 becomes lower than a temperature of the under-floor space, a ventilating opening (not illustrated) provided on the first board 11 can be opened so as to ventilate the space between the first board 11 and the second board 12. A blowing fan 35 can be provided so as to forcibly exhaust air from the space between the first board 11 and the second board 12. The blowing fan 35 can be a fan for helping to circulate air in the space between the first board 11 and the second board 12.

[0030] The space between the first board 11 and the second board 12 is larger than the space between the second board 12 and the third board 13. Thus, the heat can be efficiently transferred from the space between the first board 11 and the second board 12 to the peltier element 15 and vice versa.

[0031] A temperature sensor (not illustrated) can be provided in the space between the second board 12 and the third board 13. In addition, another temperature sensor (not illustrated) can be provided in the above-floor space. When a temperature of the space between the second board 12 and the third board 13 becomes high enough compared to a temperature of the above-floor space, an air supply opening (not illustrated) can be opened so as to supply hot air from the space between the second board 12 and the third board 13 to the above-floor space.

[0032] When the upper side is specified to be the heat absorbing surface as shown in FIG. 1B, the space between the second board 12 and the third board 13 is cooled by the peltier element 15. Then, the heat stored in the heat storage members 20 is released to the space between the second board 12 and the third board 13 by heat conduction through the third board 13. The heat storage members 20 are cooled, thus achieving cooling of the above-floor space. The cooling of the first embodiment is achieved mainly by cooling effect caused by small radiation from the heat storage members 20 to the above-floor space, rather than cooling effect of the air blow of the cooled air. The cooling effect caused by small radiation has the following meanings. Although all objects emit radiation heat according to a temperature and an emissivity of the object, when the radiation heat emitted from the object to human body is small, cooling effect can be obtained for the human body. For example, even when the temperature is same between the inside and the outside of a tunnel, the inside of the tunnel is felt cooler than the outside. The cooling effect caused by small radiation is based on the same principle as this example. By using the cooling effect caused by small radiation, the cooling, which is less harmful to human body and friendly to human body, can be achieved. In addition, the cooling using the peltier element 15 can obtain good cooling effect with small energy because a room is felt cooler even when the temperature is not changed.

[0033] In FIG. 1B, the space between the first board 11 and the second board 12 is heated by the peltier element 15. When a temperature of the space between the first board 11 and the second board 12 becomes higher than a temperature of the under-floor space, a ventilating opening (not illustrated) provided on the first board 11 can be opened and the blowing fan 35 is operated if needed so as to ventilate the space between the first board 11 and the second board 12.

[0034] As described above, the space between the first board 11 and the second board 12 is larger than the space between the second board 12 and the third board 13. Thus, the heat can be efficiently transferred from the space between the first board 11 and the second board 12 to the peltier element 15 and vice versa.

[0035] In the peltier element 15, an amount of the heat released from the heat radiating surface is approximately 1.5 times more than an amount of the heat absorbed by the heat absorbing surface. Therefore, during a cooling operation in the summer season, it is necessary to release the heat efficiently from the heat radiating surface. In the present embodiment, the space between the first board 11 and the second board 12 is 1.2 times to 2.5 times more than the space between the second board 12 and the third board 13, and is preferably 1.5 times. Furthermore, the blowing fan 31 is larger and has higher blowing capability than the blowing fan 32. Thus, the heat can be efficiently released from the heat radiating surface during the cooling operation in the summer season. The first board 11 can be removed so that a space below the second board 12 is the under-floor space.

[0036] When a temperature of the space between the second board 12 and the third board 13 becomes low enough compared to a temperature of the above-floor space, an air supply opening (not illustrated) can be opened so as to supply cool air from the space between the second board 12 and the third board 13 to the above-floor space.

[0037] In the first embodiment, the second board 12 is preferred to be a board having high heat insulating performance. In addition, the third board 13 is preferred to be a board having high thermal conductivity. For example, metal material is suitable. Thus, the amount of heat absorbed in the peltier element 15 and released from the peltier element 15 can be efficiently transferred to the heat storage members 20. Although the fourth board 14 is preferred to be a board having high thermal conductivity, a thermal conductivity performance of the board can be adjusted while considering the feeling of users when cooling or heating. The first board 11 is also preferred to be a board having high thermal conductivity. Thus, an unnecessary heat generated when cooling is easily released to the under-floor or a cool heat generated when heating is easily released to the under-floor. On the other hand, since the heat insulating performance is also required so that inside the room is not affected by a fluctuation of outside temperature, a thermal conductivity performance of the board can be adjusted.

[0038] In addition, the heat storage members 20 are held in contact with the third board 13, which is arranged on the indoor side and has high thermal conductivity, and the peltier element 15 is held by the second board 12, which is arranged on an outdoor side of the third board 13 facing the third board 13 and has high heat insulating performance. Consequently, the heat is transferred from the peltier element 15 to the third board 13 through the space.

[0039] Since the space is interposed, heating and cooling by the peltier element 15 is not locally concentrated. Furthermore, since heating or cooling is performed while the heat storage members 20 store the heat, heating and cooling is felt to be gentle.

2. Second Embodiment

[0040] FIGS. 3A and 3B show a structure of a wall concerning the second embodiment of the present invention. FIG. 3A is a cross-sectional view and FIG. 3B is a front view. In the second embodiment, heat storage members 22 are provided on the space between the second board 12 and the third board 13, and the heat storage members 22 are attached to the third board 13. The fourth board 14 (shown in FIG. 1) can be omitted. The heat storage members 20 (shown in FIG. 1) provided on the space between the third board 13 and the fourth board 14 can be omitted. An interior finish material 13a is applied to a surface of the indoor side of the third board 13. In addition, an exterior finishing material 11a is provided on a surface of an outdoor side of the first board 11 so as to face the first board 11 while being separated in a certain distance from the first board 11. An insulating material (not illustrated) can be provided on a space between the first board 11 and the exterior finishing material 11a. A pillar 19 can be provided on a space between the first board 11 and the third board 13.

[0041] The heat storage members 22 can be formed by kneading a chemical heat storage member, which is enclosed in capsules having an approximately same size as pebbles, with a mixture of diatomite, plaster and Shirasu. Note that the mixture of diatomite, plaster and Shirasu is the sensible heat storage member. Shirasu is a powdery substance created from magma before the magma becomes rock. Shirasu can be taken from a stratum in throughout the southern part of Kyushu region. The mixture of diatomite, plaster and Shirasu is also excellent in a function of adjusting humidity and a function of absorbing harmful gas and odor. For example, the heat storage members 22 can be constructed by attaching forms 22a on the third board 13, daubing the mixture of diatomite, plaster and Shirasu inside the forms 22a, and drying the daubed mixture. In addition, the mixture of diatomite, plaster and Shirasu can be used for the interior finish material 13a so that the interior finish material 13a has a function of storing heat, a function of adjusting humidity, and a function of absorbing harmful gas and odor.

[0042] Although the heat storage members 22 are attached to the third board 13 in FIG. 3A and FIG. 3B, the heat storage members 22 can be provided on the space between the second board 12 and the third board 13 and the heat storage members 22 can be attached to the second board 12. Furthermore, the heat storage members 22 can be in contact with both the second board 12 and the third board 13.

[0043] In other respects, the second embodiment is same as the floor structure indicated in the first embodiment.

[0044] In the second embodiment, the second board 12 is preferred to be a board having high heat insulating performance. In addition, the third board 13 is preferred to be a board having high thermal conductivity. For example, metal material is suitable. Thus, the amount of heat absorbed in the peltier element 15 and released from the peltier element 15 can be efficiently transferred to the heat storage members 22. In addition, the amount of heat can be suitably transferred between the heat storage members 22 and the third board 13 when the heat storage member 22 heats and cools the indoor. The first board 11 is also preferred to be a board having high thermal conductivity. Thus, an unnecessary heat generated when cooling is easily released to the outside or a cool heat generated when heating is easily released to the outside. In the present embodiment, since the exterior finishing material 11a is further provided on the outdoor side of the first board 11, the necessity for preventing the fluctuation of outside temperature from affecting inside the room is low.

3. Third Embodiment

[0045] FIGS. 4A and 4B show a structure of a wall concerning the third embodiment of the present invention. FIG. 4A is a cross-sectional view and FIG. 4B is a front view. In the third embodiment, an interior finish material 13b is provided on a surface of the indoor side of the third board 13 so as to face the third board 13 while being separated in a certain distance from the third board 13. In addition, an exterior finishing material 11b is provided on a surface of the outdoor side of the first board 11 so as to face the first board 11 while being separated in a certain distance from the first board 11.

[0046] An opening 13x is formed on the third board 13. By the opening 13x, hot air can be supplied to a space between the third board 13 and the interior finish material 13b during the heating operation, and cool air can be supplied thereto during the cooling operation. The hot air or the cool air supplied to the space between the third board 13 and the interior finish material 13b can be supplied to an indoor space through another opening (not illustrated) provided on the interior finish material 13b. Even if the hot air or the cool air is supplied to the indoor space, an air flow is reduced by the interior finish material 13b and therefore bad influences on the human body caused by the air flow is suppressed.

[0047] Heat storage members 23, 24 and 25 can be arranged on the space between the second board 12 and the third board 13. The heat storage members 23, 24 and 25 have phase transition temperatures different from each other. For example, the heat storage member 23 can have a phase transition temperature of approximately 28° C., which is a recommended preset temperature during the cooling operation in the summer season. In addition, the heat storage member 24 can have a phase transition temperature of approximately 20° C., which is a recommended preset temperature during the heating operation in the winter season. In addition, the heat storage member 25 can have a phase transition temperature of approximately 24° C. so as to be used both in the summer season and the winter season. For example, if the latent heat storage member containing paraffin is used, a desired phase transition temperature can be obtained by selecting the number of carbons.

[0048] In other words, the heat storage members 23, 24 and 25 have the phase transition temperature of around the preset temperature, and have the phase transition temperatures around a plurality of the preset temperatures. More specifically, a first heat storage member (heat storage member 23) having the phase transition temperature, which is a recommended preset temperature during the cooling operation in the summer season, and a second heat storage member (heat storage member 24) having the phase transition temperature, which is a recommended preset temperature during the heating operation in the winter season, are provided. In addition, a third heat storage member (heat storage member 25) having the phase transition temperature of approximately 24° C., for example, so as to be used both in the summer season and the winter season can be provided.

[0049] Furthermore, the heat storage member 23 for the summer season is preferred to be arranged on an upper side, and the heat storage member 24 is preferred to be arranged on a lower side. The heat storage member 25 for both use can be arranged between the heat storage member 23 and the heat storage member 24, or arranged both between a plurality of the heat storage members 23 and between a plurality of the heat storage members 24.

[0050] Openings are provided both on the first board 11 and the exterior finishing material 11b. A vent pipe 11c is provided between the first board 11 and the exterior finishing material 11b so as to connect the opening of the first board 11 with the opening of the exterior finishing material 11b. By the vent pipe 11c, the space between the first board 11 and the second board 12 can be ventilated.

[0051] Insulating materials 12a and 12b can be arranged on both surfaces of the second board 12. Thus, a temperature difference between both surfaces of the second board 12 generated by the function of the peltier element 15 can be prevented from being lost caused by heat transfer in the second board 12.

[0052] Alternately, the materials indicated by the symbols 12a and 12b can be dehumidification sheets. Thus, even if dew condensation occurs because of the temperature difference between both surfaces of the second board 12, the bad influences of the dew condensation can be suppressed. The dehumidification sheets can be attached to the first board 11 and the third board 13.

[0053] Alternately, the materials indicated by the symbols 12a and 12b can be heat reflecting sheets. Thus, during the heating operation in the winter season, for example, radiation heat emitted from the heat storage member 24 and the heat storage member 25 can be reflected to the indoor side. The heat reflecting sheets are preferably arranged on the second board 12 on a surface of the side of the third board 13, as indicated by the symbol 12b. The heat reflecting sheets are preferably a sheet containing thin film layer of metal such as aluminum.

[0054] In other respects, the third embodiment can be same as the second embodiment.

[0055] In the third embodiment, since the insulating materials 12a and 12b are provided on both surfaces of the second board 12, the preferable heat insulating performance of the second board 12 does not have to be considered. In addition, the third board 13 is preferred to be a board having high thermal conductivity. Thus, the amount of heat absorbed in the peltier element 15 and released from the peltier element 15 can be efficiently transferred to the heat storage members 22. In addition, the amount of heat can be suitably transferred between the heat storage members 22 and the third board 13 when the heat storage member 22 heats and cools the indoor. Furthermore, the hot air and the cool air can be supplied toward the interior finish material 13b through the opening 13x.

[0056] Although the first board 11 is preferred to be a board having high thermal conductivity, an unnecessary heat generated when cooling can be released to the outside or a cool heat generated when heating can be released to the outside. In the present embodiment, since the exterior finishing material 11b is further provided on the outdoor side of the first board 11, the necessity for preventing the fluctuation of outside temperature from affecting inside the room is low.

4. Fourth Embodiment

[0057] FIG. 5 is a cross-sectional view showing a structure of a wall concerning the fourth embodiment of the present invention. In the fourth embodiment, a ventilator 40 is provided. Openings are formed on each of the exterior finishing material 11b, the first board 11, the second board 12, the third board 13, and the interior finish material 13b. The ventilator 40 includes a sleeve tube 42. The sleeve tube 42 connects the openings from the opening of the exterior finishing material 11b to the opening of the interior finish material 13b. The sleeve tube 42 can be a tube connecting the openings from the opening of the first board 11 to the opening of the second board 12 or to the opening of the third board 13.

[0058] A blowing fan 37 and a porous heat storage member 38 are provided inside the sleeve tube 42. The porous heat storage member 38 has many holes penetrating between the indoor side and the outdoor side. The porous heat storage member 38 is, for example, a structure of having many hexagonal holes (i.e. honeycomb-shaped). The porous heat storage member 38 explained above is formed by ceramics, for example.

[0059] The blowing fan 37 is connected to a motor 39. The motor 39 can rotate the blowing fan 37 while switching a rotation direction by a predetermined time interval between a first rotation direction and a second rotation direction which is opposite to the first rotation direction. The predetermined time is approximately one minute to three minutes, for example.

[0060] In the ventilator 40, if the motor 39 rotates the blowing fan 37 in the first rotation direction for one minute to three minutes, the air is exhausted from the indoor to the outdoor through the sleeve tube 42. At that time, in the heating operation, a part of the heat of the air passing through the porous heat storage member 38 is stored in the porous heat storage member 38. Then, when the motor 39 rotates the blowing fan 37 in the second direction for one minute to three minutes, the air is supplied from the outdoor to the indoor through the sleeve tube 42. At that time, the air passing through the porous heat storage member 38 is heated by the heat stored in the porous heat storage member 38. By repeating such operations, the indoor air can be ventilated while heat exchange is performed. In the cooling operation, although a direction of transferring the heat is opposite, the indoor air can be ventilated while heat exchange is performed in the same way.

[0061] Baffle plates 36 are provided both on inside the sleeve tube 42 and inside the vent pipe 11c. The baffle plates 36 have a function of preventing the structure inside the wall from being damaged by a gust of wind blew on the outside.

[0062] Openings are provided both on the third board 13 and the interior finish material 13b. A vent pipe 13c is provided between the third board 13 and the interior finish material 13b so as to connect the opening of the third board 13 with the opening of the interior finish material 13b. By the vent pipe 13c, hot air can be supplied to the indoor during the heating operation, and cool air can be supplied to the indoor during the cooling operation.

[0063] In the fourth embodiment, although the explanation is based on a case where the air is ventilated from the indoor air or the air between the second board 12 and the third board 13 to the outdoor air and vice versa while the heat exchange is performed, the air can be ventilated between indoors having different temperatures. For example, by attaching the ventilator 40 to a wall or a door partitioning between a living room and a passage, the air can be ventilated between the indoor air or the air between the living room and the passage while the heat exchange is performed.

[0064] In other respects, the fourth embodiment can be same as the third embodiment. Although only the heat storage member 23 is shown between the second board 12 and the third board 13 in FIG. 5, the heat storage members 24 and 25 can be further provided between the second board 12 and the third board 13 as explained in the third embodiment.

[0065] Furthermore, as the heat storage members 23, 24 and 25, a ceramic structure having many holes can be used same as the porous heat storage member 38. In this case, the holes are preferably penetrating in a thickness direction of the second board 12. If the heat storages members 23, 24 and 25 have many holes, the heat can be efficiently exchanged between the peltier element 15 and the heat storages members 23, 24 and 25. In addition, by using the ceramic structure having many holes, a weight of the wall containing the heat storage member can be reduced.

[0066] FIG. 6 is a cross-sectional view showing a variation example of FIG. 5. In the variation example shown in FIG. 6, in the sleeve tube 42, the ventilator 40 can have a blowing fan 37a and a motor 39a arranged on the outdoor side of the porous heat storage member 38, in addition to the blowing fan 37 and the motor 39 arranged on the indoor side of the porous heat storage member 38. If the blowing fan 37a and the motor 39a are provided in addition to the blowing fan 37 and the motor 39, the air can be smoothly supplied and exhausted even when strong wind is blew on the outside. Furthermore, the blowing fan 37a and the motor can be provided inside the vent pipe 11c. If the blowing fan 37a and the motor are provided, the air can be smoothly supplied and exhausted even when strong wind is blew on the outside.

[0067] The fourth embodiment shown in FIG. 5 can be used as a structure of the wall of a building of about four floors or less. The variation example shown in FIG. 6 can be used as a structure of the wall of a building of about five floors or more.

[0068] In the fourth embodiment, materials of the first board 11, the second board 12 and the third board 13 can be selected from almost the same point of view as the third embodiment. Since the interior space is directory connected to the third board 13 through the vent pipe 13c, hot air and cool air can be easily supplied to the indoor space.

5. Others

[0069] In the above described explanation, the structure of the floor is taken as an example in the first embodiment, and the structure of the wall is taken as an example in the second to fourth embodiments. However, the present invention is not limited to these examples. The structure of the first embodiment can be applied to the structure of the wall. The structures of the second to fourth embodiments can be applied to the structure of the floor. Furthermore, the structures of the first to fourth embodiments can be applied to the structure of the ceiling. When the structures of the first to fourth embodiments are applied to the structure of the ceiling, the "under-floor" in the first embodiment is corresponding to under the roof, and the "above-floor" in the first embodiment is corresponding to the indoor space. Furthermore, although the embodiments of the first to fourth embodiments are explained as a fixed structure of the building as the floor or the wall, they can be applied to a movable structure such as a sliding door, an overhang door and a hinged door. The first to fourth embodiments can be applied to office buildings and clean rooms in factories, in addition to conventional homes.


Patent applications in class COMBINED

Patent applications in all subclasses COMBINED


User Contributions:

Comment about this patent or add new information about this topic:

CAPTCHA
Images included with this patent application:
STRUCTURE OF WALL, FLOOR AND CEILING OF BUILDING diagram and imageSTRUCTURE OF WALL, FLOOR AND CEILING OF BUILDING diagram and image
STRUCTURE OF WALL, FLOOR AND CEILING OF BUILDING diagram and imageSTRUCTURE OF WALL, FLOOR AND CEILING OF BUILDING diagram and image
STRUCTURE OF WALL, FLOOR AND CEILING OF BUILDING diagram and imageSTRUCTURE OF WALL, FLOOR AND CEILING OF BUILDING diagram and image
Similar patent applications:
DateTitle
2016-01-07Bar for a support structure for a false ceiling and production process for producing the bar
2015-12-31Set of profile sections for the construction of walls, panels and angle sections in thermoplastic
2016-01-07Self-locking block and complementary pieces for the raising of pillars and free-standing walls
2015-11-26Support metal structure of a false ceiling
2015-12-03Panel system for covering a building wall
New patent applications in this class:
DateTitle
2019-05-16Adjustable concealed heating and cooling system
2019-05-16Hybrid operating room for combined surgical and fixed imaging services in an ambulatory surgical center
2016-12-29Method and apparatus for positioning heating elements
2016-07-07Expandable, modular information technology facility providing efficient expansion of distributed power supply system
2016-06-16Heat panel and fastener system
Top Inventors for class "Static structures (e.g., buildings)"
RankInventor's name
1Darko Pervan
2Gregory F. Jacobs
3Husnu M. Kalkanoglu
4Ronald P. Hohmann, Jr.
5Mark Cappelle
Website © 2025 Advameg, Inc.