Hsieh, Kaohsiung City
Cheng-Kang Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20120297218 | CLOUD-BASED ENERGY-SAVING SERVICE SYSTEM AND METHOD - A cloud-based energy-saving service system and method are disclosed. The service system and method of this invention use the strong computation capabilities of the cloud computing technology and systems to determine the power consumption policies of the mobile devices and provide the policies to the mobile devices, whereby the mobile devices implement the power consumption policies to save its power consumptions. In one aspect, the invented system and method calculate and determine the backlight level polices for a particular video stream, then provide the policies information to the mobile devices for implementation. The policies information may be provided to the mobile devices independently or along with the video stream. The calculation of the backlight illumination levels may be done in advance or on remand. | 11-22-2012 |
Chia-Chun Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20140192215 | METHOD OF DETECTING SUBJECT OF IMAGE AND IMAGING DEVICE THEREOF - A method of detecting the subject of an image and imaging device thereof are disclosed. The method comprises the following steps of providing an image capturing module to capture the temporal image, providing the image processing module to receive the temporal image and to determine a plurality of objects from the temporal image, using the image processing module to define a plurality of regions on the temporal image based on the center of temporal image, using the image processing module to assign an initial setup value to each of the objects according to the region corresponding to each of the objects, using the imaging processing module to execute an operation to increase or decrease each of the initial setup values, using the image processing module to execute a sorting, and selecting at least one of the objects as a subject of the temporal image. | 07-10-2014 |
Chi-Chen Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20110009588 | COUPLED POLYMERS AND MANUFACTURING METHOD THEREOF - A coupled copolymer is provided. The coupled copolymer is coupled by reacting a silane coupling agent with a copolymer, where the copolymer is polymerized by a conjugated diene monomer and a vinyl aromatics monomer, and the silane coupling agent has an alkenyl group and a alkoxy group, and has a chemical Formula (I) as follows: | 01-13-2011 |
20110105694 | HYDROGENATION CATALYST COMPOSITION AND HYDROGENATION METHOD THEREOF - A hydrogenation catalyst composition for hydrogenating a polymer of conjugated diene is provided. The polymer of conjugated diene is a homopolymer of conjugated diene or a copolymer of conjugated diene and vinyl aromatics. The hydrogenation catalyst composition includes: (a) a titanium compound, (b) a compound of formula (II), | 05-05-2011 |
20130053472 | PROCESS FOR PRODUCING CONJUGATED DIENE RUBBER AND COMPOSITE OF THE SAME RUBBER - A process for producing conjugated diene rubber and its composite includes polymerizing a conjugated diene or a conjugated diene and a vinyl aromatic hydrocarbon in a hydrocarbon solution by anionic polymerization to obtain conjugated diene rubber containing alkali metal in the polymer chain end reacting a with at least one organic silane compound to become a modified conjugated diene rubber. After or during the modified conjugated diene rubber contacting with large amount of water, solvent and water content are removed from the modified conjugated diene by applicable hot sources, wherein coupling ratio of modified conjugated diene rubber is less than 40%, coupling ratio of modified conjugated diene rubber after contact with water is at least 50% The conjugated diene rubber and composite exhibit storage stability. | 02-28-2013 |
20130150522 | CONJUGATED DIENE RUBBER MODIFIED WITH POLAR ALKOXYSILANE, METHOD AND COMPOSITION THEREOF - A modified conjugated diene rubber is disclosed. A method for producing the modified conjugated diene rubber includes providing an alkali metal ion-containing conjugated diene rubber; and reacting the alkali metal ion-containing conjugated diene rubber with an alkoxysilane to generate the modified conjugated diene rubber, the alkoxysilane being of the structural formula: | 06-13-2013 |
20130158192 | MODIFIED CONJUGATED DIENE RUBBER, METHOD AND COMPOSITION THEREOF - A method of forming modified conjugated diene rubber includes (a) reacting an alkali metal ion-containing conjugated diene rubber with a first modifier having a structural formula (I), | 06-20-2013 |
Chi Hau Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20100139757 | PHOTOVOLTAIC CELL STRUCTURE - A photovoltaic cell structure includes a substrate, a metal layer, a high resistivity layer, a p-type semiconductor layer, an n-type semiconductor layer and a transparent conductive layer. The metal layer may include molybdenum and be formed on the substrate to be a back contact metal layer of the cell. The high resistivity layer (e.g., V | 06-10-2010 |
20100139758 | PHOTOVOLTAIC CELL STRUCTURE AND MANUFACTURING METHOD THEREOF - A photovoltaic cell structure includes a substrate, a metal layer, a p-type semiconductor layer, an n-type semiconductor layer and a transparent conductive layer. The substrate has a rough surface. The metal layer may include molybdenum and be formed on the rough surface. The p-type semiconductor layer is formed on the metal layer and may include CIGSS, CIGS, CIS, or compound of two or more of copper, selenium, sulfur. The n-type semiconductor layer is formed on the p-type semiconductor layer thereby forming a rough p-n junction surface. The n-type semiconductor layer may include CdS. The transparent conductive layer is formed on the n-type semiconductor layer. In an embodiment, the roughness Ra of the rough surface is between 0.01 to 100 μm. | 06-10-2010 |
20100243044 | PHOTOVOLTAIC CELL STRUCTURE - A photovoltaic cell structure includes a substrate, a metal layer, a p-type semiconductor layer, an n-type semiconductor layer, a transparent conductive layer and a high resistivity layer. The metal layer is formed on the substrate. The p-type semiconductor layer is formed on the metal layer and may include a compound of copper indium gallium selenium sulfur (CIGSS), copper indium gallium selenium (CIGS), copper indium sulfur (CIS), copper indium selenium (CIS) or a compound of at least two of copper, selenium or sulfur. The n-type semiconductor layer exhibits photo catalyst behavior that can increase carrier mobility by receiving light, and is formed on the p-type semiconductor layer, thereby forming a p-n junction. The transparent conductive layer is formed on the n-type semiconductor layer. The high resistivity layer is formed between the metal layer and the transparent conductive layer. | 09-30-2010 |
20100258167 | PHOTOVOLTAIC CELL STRUCTURE AND MANUFACTURING METHOD - A photovoltaic cell structure includes a substrate, a metal layer, a p-type semiconductor layer, an n-type semiconductor layer, a high resistivity layer, an assistant electrode layer, and a transparent conductive layer. The metal layer is formed on the substrate, and comprises a plurality of p-type electrode units separated from each other. The p-type semiconductor layer is formed on the metal layer. The n-type semiconductor is formed on the p-type semiconductor layer, thereby forming a p-n junction. The high resistivity layer is formed on the n-type semiconductor layer. The assistant electrode layer is formed on the high resistivity layer and the p-type electrode units. The transparent conductive layer is formed on the assistant electrode layer, the high resistivity layer and the p-type electrode units. Accordingly, at least one cell is formed on each of the p-type electrode units. The assistant electrode layer and the transparent conductive layer are connected to the cells in series. | 10-14-2010 |
Chi Hua Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20110297225 | PHOTOVOLTAIC CELL STRUCTURE - A photovoltaic cell structure includes a substrate, a metal layer, a p-type semiconductor layer, an n-type semiconductor layer, a transparent conductive layer and a high resistivity layer. The metal layer is formed on the substrate. The p-type semiconductor layer is formed on the metal layer and may include a compound of copper indium gallium selenium sulfur (CIGSS), copper indium gallium selenium (CIGS), copper indium sulfur (CIS), copper indium selenium (CIS) or a compound of at least two of copper, selenium or sulfur. The n-type semiconductor layer exhibits photo catalyst behavior that can increase carrier mobility by receiving light, and is formed on the p-type semiconductor layer, thereby forming a p-n junction. The transparent conductive layer is formed on the n-type semiconductor layer. The high resistivity layer is formed between the metal layer and the transparent conductive layer. | 12-08-2011 |
Ching-Hua Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20140144581 | METHOD FOR MANUFACTURING A MAGNET-CONDUCTIVE DEVICE AND APPARATUS THEREOF - A method for manufacturing magnet-conductive device includes a filling step and an adhering step. The filling step includes providing a glue by a glue dispenser and contacting the glue with a first magnet-conductive plate to make the glue adhered to a lower surface of the first magnet-conductive plate. The adhering step includes making the lower surface of the first magnet-conductive plate face toward a second magnet-conductive plate, making the first magnet-conductive plate and the second magnet-conductive plate stackable from each other and adhering the first magnet-conductive plate and the second magnet-conductive plate via the glue. Eventually, by repeatedly performing the filling step and the adhering step, the desirable stacking quantity is achieved to form a magnet-conductive device. | 05-29-2014 |
Ching-Pei Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20140252295 | ONE TRANSISTOR AND ONE RESISTIVE (1T1R) RANDOM ACCESS MEMORY (RRAM) STRUCTURE WITH DUAL SPACERS - The present disclosure provides a resistive random access memory (RRAM) cells and methods of making the same. The RRAM cell includes a transistor and an RRAM structure. The RRAM structure includes a bottom electrode having a via portion and a top portion, a resistive material layer on the bottom electrode having a width that is same as a width of the top portion of the bottom electrode; a capping layer over the bottom electrode, a first spacer surrounding the capping layer and a top electrode, a second spacer surround the top portion of the bottom electrode and the first spacer, and the top electrode. The RRAM cell further includes a conductive material connecting the top electrode of the RRAM structure to a metal layer. | 09-11-2014 |
20140264229 | LOW FORM VOLTAGE RESISTIVE RANDOM ACCESS MEMORY (RRAM) - The present disclosure provides a resistive random access memory (RRAM) cells and methods of making the same. The RRAM cell includes a transistor and an RRAM structure. The RRAM structure includes a bottom electrode having a via portion and a non-planar portion, a resistive material layer conformally covering the non-planar portion of the bottom electrode; and, a top electrode on the resistive material layer. The via portion of the bottom electrode is embedded in a first RRAM stop layer. The non-planar portion of the bottom electrode has an apex and is centered above the via portion. | 09-18-2014 |
Chin-Tang Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20120074545 | THIN FLIP CHIP PACKAGE STRUCTURE - A thin flip chip package structure comprises a substrate, a chip and a heat dissipation paste, wherein the substrate comprises an insulating layer and a trace layer. The insulating layer comprises a first insulating portion and a second insulating portion, the first insulating portion comprises a first upward surface, a first downward surface, a first thickness and a recess formed on the first downward surface, wherein the recess comprises a bottom surface. The second insulating portion comprises a second upward surface, a second downward surface and a second thickness larger than the first thickness. The trace layer is at least formed on the second insulating portion, the chip disposed on top of the substrate is electrically connected with the trace layer and comprises a plurality of bumps, and the heat dissipation paste is disposed at the recess. | 03-29-2012 |
20120080783 | THIN FLIP CHIP PACKAGE STRUCTURE - A thin flip chip package structure comprises a substrate, a chip and a heat dissipation paste, the substrate comprises an insulating layer and a trace layer. The insulating layer comprises a top surface, a bottom surface and a plurality of apertures formed at the bottom surface, wherein the bottom surface of the insulating layer comprises a disposing area and a non-disposing area. Each of the apertures is located at the disposing area and comprises a lateral wall and a base surface. A first thickness is formed between the base surface and the insulating layer, a second thickness is formed between the top surface and the bottom surface, and the second thickness is larger than the first thickness. The chip disposed on the top surface comprises a chip surface and a plurality of bumps. The heat dissipation paste at least fills the apertures and contacts the base surface. | 04-05-2012 |
20130022830 | BUMPING PROCESS AND STRUCTURE THEREOF - A bumping process comprises steps of forming a metal layer with copper on a substrate, and the metal layer with copper comprises a plurality of first zones and second zones; forming a photoresist layer on the metal layer with copper; patterning the photoresist layer to form a plurality of openings; forming a plurality of copper bumps within the openings, each of the copper bumps covers the first zones and comprises a first top surface; forming a connection layer on the first top surface; removing the photoresist layer; removing the second zones and enabling each of the first zones to form an under bump metallurgy layer, wherein the under bump metallurgy layer, the copper bump, and the connection layer possess their corresponded peripheral walls, and covering sections of a first protective layer formed on the connection layer may cover those peripheral walls to prevent ionization phenomenon. | 01-24-2013 |
20130062756 | SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD THEREOF - A substrate structure with compliant bump comprises a substrate, a plurality of bumps, and a metallic layer, wherein the substrate comprises a surface, a trace layer, and a protective layer. The trace layer comprises a plurality of conductive pads, and each of the conductive pads comprises an upper surface. The protective layer comprises a plurality of openings. The bumps are formed on the surface, and each of the bumps comprises a top surface, an inner surface and an outer surface and defines a first body and a second body. The first body is located on the surface. The second body is located on top of the first body. The metallic layer is formed on the top surface, the inner surface, and the upper surface. | 03-14-2013 |
20130065388 | SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD THEREOF - A substrate structure with compliant bump comprises a substrate, a plurality of bumps, and a metallic layer, wherein the substrate comprises a surface, a trace layer, and a protective layer. The trace layer comprises a plurality of conductive pads, and each of the conductive pads comprises an upper surface. The protective layer comprises a plurality of openings. The bumps are formed on the surface, and each of the bumps comprises a top surface, an inner surface and an outer surface and defines a first body and a second body. The first body is located on the surface. The second body is located on top of the first body. The metallic layer is formed on the top surface, the inner surface, and the upper surface. | 03-14-2013 |
20130213702 | BUMPING PROCESS AND STRUCTURE THEREOF - A bumping process comprises steps of forming a metal layer with copper on a substrate, and the metal layer with copper comprises a plurality of first zones and second zones; forming a photoresist layer on the metal layer with copper; patterning the photoresist layer to form a plurality of openings; forming a plurality of copper bumps within the openings, each of the copper bumps covers the first zones and comprises a first top surface; forming a connection layer on the first top surface; removing the photoresist layer; removing the second zones and enabling each of the first zones to form an under bump metallurgy layer, wherein the under bump metallurgy layer, the copper bump, and the connection layer possess their corresponded peripheral walls, and covering sections of a first protective layer formed on the connection layer may cover those peripheral walls to prevent ionization phenomenon. | 08-22-2013 |
20130249070 | SEMICONDUCTOR PACKAGE STRUCTURE - A semiconductor package structure comprises a lead frame, at least one chip, a molding compound and an anti-conduction film. The lead frame comprises a plurality of leads, each of the leads comprises a first end portion and a second end portion, wherein the first end portion comprises a first upper surface and a first lower surface, and the second end portion comprises a second upper surface and a second lower surface. The chip comprises a plurality of bumps electrically connected with the lead frame. The chip and the leads are covered with the molding compound. The first lower surface of each of the first end portions and the second lower surface of each of the second end portions are exposed by the molding compound. The first lower surface of the first end portion of each of the leads is covered with the anti-conduction film. | 09-26-2013 |
20130334671 | SEMICONDUCTOR PACKAGE AND LEAD FRAME THEREOF - A semiconductor package includes a lead frame, at least one chip and a molding compound. The lead frame comprises a plurality of leads, each lead comprises a first end portion and at least one coupling protrusion, wherein the first end portion comprises a first upper surface, the coupling protrusion comprises a ring surface and is integrally formed as one piece with the first upper surface. The chip disposed on top of the leads comprises a plurality of bumps and a plurality of solders, the coupling protrusions embed into the solders to make the ring surfaces of the coupling protrusions cladded with the solders. The solders cover the first upper surfaces. The chip and the leads are cladded with the molding compound. | 12-19-2013 |
20130334681 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME - A semiconductor package structure includes a first substrate, a second substrate and an encapsulant. The first substrate comprises a plurality of first bumps and a plurality of first solder layers. Each of the first solder layers is formed on each of the first bumps and comprises a cone-shaped slot having an inner surface. The second substrate comprises a plurality of second bumps and a plurality of second solder layers. Each of the second solder layers is formed on each of the second bumps and comprises an outer surface. Each of the second solder layers is a cone-shaped body. The second solder layer couples to the first solder layer and is accommodated within the first solder layer. The inner surface of the cone-shaped slot contacts with the outer surface of the second solder layer. The encapsulant is formed between the first substrate and the second substrate. | 12-19-2013 |
20140021601 | SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF - A semiconductor manufacturing method includes providing a carrier; forming a first photoresist layer; forming plural core portions; removing the first photoresist layer; forming a second photoresist layer; forming a plurality of connection portions, each of the plurality of connection portions includes a first connection layer and a second connection layer and connects to each of the core portions to form a hybrid bump, wherein each of the first connection layers comprises a base portion, a projecting portion and an accommodating space, each base portion comprises an upper surface, each projecting portion is protruded to the upper surface and located on top of each core portion, each accommodating space is located outside each projecting portion, the second connection layers cover the projecting portions and the upper surfaces, and the accommodating spaces are filled by the second connection layers; removing the second photoresist layer to reveal the hybrid bumps. | 01-23-2014 |
20140027905 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME - A semiconductor package structure includes a first substrate, a second substrate and an encapsulant. The first substrate comprises a plurality of first bumps and a plurality of first solder layers. Each of the first solder layers is formed on each of the first bumps and comprises a cone-shaped slot having an inner surface. The second substrate comprises a plurality of second bumps and a plurality of second solder layers. Each of the second solder layers is formed on each of the second bumps and comprises an outer surface. Each of the second solder layers is a cone-shaped body. The second solder layer couples to the first solder layer and is accommodated within the first solder layer. The inner surface of the cone-shaped slot contacts with the outer surface of the second solder layer. The encapsulant is formed between the first substrate and the second substrate. | 01-30-2014 |
20140141606 | SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF - A semiconductor manufacturing method includes providing a carrier; forming a first photoresist layer; forming plural core portions; removing the first photoresist layer; forming a second photoresist layer; forming a plurality of connection portions, each of the plurality of connection portions includes a first connection layer and a second connection layer and connects to each of the core portions to form a hybrid bump, wherein each of the first connection layers comprises a base portion, a projecting portion and an accommodating space, each base portion comprises an upper surface, each projecting portion is protruded to the upper surface and located on top of each core portion, each accommodating space is located outside each projecting portion, the second connection layers cover the projecting portions and the upper surfaces, and the accommodating spaces are filled by the second connection layers; removing the second photoresist layer to reveal the hybrid bumps. | 05-22-2014 |
20150069584 | SEMICONDUCTOR STRUCTURE - A semiconductor structure includes a carrier, a first protective layer, a second protective layer, and a third protective layer. A first surface of the first protective layer comprises a first anti-stress zone. A first extension line from a first bottom edge intersects with a second extension line from a second bottom edge to form a first base point. A first projection line is formed on the first surface, an extension line of the first projection line intersects with the second bottom edge to form a first intersection point, a second projection line is formed on the first surface, and an extension line of the second projection line intersects with the first bottom edge to form a second intersection point. A zone by connecting the first base point, the first intersection point and the second intersection point is the first anti-stress zone. | 03-12-2015 |
Chiung-Chang Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20130262023 | METHOD FOR ESTIMATING AN OPERATIONAL PARAMETER OF A MOTOR - A method for estimating an operational parameter of a motor is to be implemented by an estimating device. In the method, the estimating device is configured to: receive an acoustic signal attributed to operation of the motor; process the acoustic signal to obtain a plurality of sample points in the frequency domain, each of which has a frequency and a corresponding amplitude; compute an estimated peak frequency using a centroid method based upon the frequencies and the amplitudes; from a plurality of peak frequencies and a plurality of known values of the operational parameter corresponding respectively to the peak frequencies, select a part of the peak frequencies approximate to the estimated peak frequency and a corresponding part of the known values of the operational parameter; and compute an estimated value of the operational parameter based upon the peak frequencies and the known values of the operational parameter. | 10-03-2013 |
Chuang-Han Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20120217641 | Preventing the Cracking of Passivation Layers on Ultra-Thick Metals - A device includes a top metal layer; a UTM line over the top metal layer and having a first thickness; and a passivation layer over the UTM line and having a second thickness. A ratio of the second thickness to the first thickness is less than about 0.33. | 08-30-2012 |
Chuehan Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20110018118 | Semiconductor Device Packages, Redistribution Structures, and Manufacturing Methods Thereof - Described herein are semiconductor device packages and redistribution structures including alignment marks and manufacturing methods thereof. | 01-27-2011 |
20110018124 | Semiconductor Device Packages, Redistribution Structures, and Manufacturing Methods Thereof - Described herein are semiconductor device packages and redistribution structures including alignment marks and manufacturing methods thereof. | 01-27-2011 |
Chueh-An Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20100314746 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A semiconductor package and a manufacturing method thereof are provided. A carrier having an adhesion layer is provided. A plurality of chips are disposed on the adhesion layer, wherein an active surface of each chip faces the adhesion layer. A molding compound is formed for encapsulating the chips to form a chip-redistribution encapsulant having a first surface and a second surface, wherein the first surface has a chip area and a peripheral area. The carrier and the adhesion layer are removed, so that the chip-redistribution encapsulant exposes the active surface of each chip. A plurality of solder balls are uniformly formed in the chip area and the peripheral area. The second surface of the chip-redistribution encapsulant is grinded to reduce the thickness of the chip-redistribution encapsulant, wherein the solder balls provide the chip-redistribution encapsulant with a uniform support. The chip-redistribution encapsulant is sawn to form a plurality of packages. | 12-16-2010 |
Chun-Shu Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20120031277 | DRINK CAN - A drink can includes a can body with a resilient portion, a cap located on a bottle mouth of the can body and a separated holding portion coupled with the cap. The resilient portion is coupled with one set of pressure guards. The separated holding portion connected to the cap holds concentrate of a brewing stuff with a taste different from that held in the can body. The resilient portion formed on the belly of the can body can be squeezed to make a conical portion at the bottom of the can body to dislocate and open a sealing plate at the distal end of the separated holding portion, so that the concentrate of the brewing stuff can quickly drop into the can body to be diluted by the brewing liquid held in the can body to quickly mix the brewing liquid and brewing stuff. | 02-09-2012 |
Der-Fong Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20100058798 | COOLANT-CIRCULATION COOLING DEVICE FOR COMPUTER SERVO - A coolant-circulation cooling device is provided for cooling a plurality of computer servos, including a compressor, a condenser, a coolant reservoir, an evaporation coil, a cooling head, and a pump. The coolant reservoir is provided with the evaporation coil in a wound condition and connected to the compressor and the condenser to form a closed refrigeration circulation system. The cooling head is connected via piping to the coolant reservoir and can be directly attached to a heat generation element to remove heat therefrom by a circulation of a coolant from the coolant reservoir to the cooling head by being driven by the pump. The coolant circulating back to the coolant reservoir | 03-11-2010 |
Goldie Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20130032450 | HIGH EFFICIENCY BUFFER STOCKER - A high-efficiency buffer stocker is disclosed. The buffer stocker includes an overhead transport track for supporting overhead transport vehicles carrying wafer containers and at least one conveyor system or conveyor belt provided beneath the overhead transport track for receiving the wafer containers from the overhead transport vehicles on the overhead transport track. The buffer stocker is capable of absorbing the excessive flow of wafer containers between a processing tool and a stocker, for example, to facilitate the orderly and efficient flow of wafers between sequential process tools in a semiconductor fabrication facility, for example. | 02-07-2013 |
Hong-Ming Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20080294922 | MATCHING SYSTEM OF ELECTRONIC DEVICE AND PERIPHERAL DEVICE AND MATCHING METHOD THEREOF - A matching system of an electronic device and a peripheral device and a matching method thereof are described. The system includes an electronic device, having an identification mechanism for identifying a specific identification code and generating a control signal or a control instruction according to an identification result; and a peripheral device, electrically coupled to the electronic device selectively. The peripheral device includes an identification code unit for storing a group identification code; and a power control unit, for controlling an operation state of the peripheral device according to the control signal or the control instruction, when the peripheral device is electrically coupled to the electronic device. If the identification result is that the specific identification code is consistent with the group identification code, the power control unit controls the entire peripheral device to work normally according to the control signal or the control instruction. | 11-27-2008 |
Hong Yean Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20080252373 | Low Flicker Noise Operational Amplifier - A low flicker noise operational amplifier comprises two circuit branches of the same topology and a plurality of current source pairs. For each current source pair, the two current sources are commutatively steered into the two circuit branches via two sets of differential pair in a manner controlled by a pair of complementary logical signal. | 10-16-2008 |
20080268805 | High Linearity Passive Mixer and Method Thereof - A high linearity mixer circuit includes a commutation network comprising four switches to provide an electrical coupling between a first pair of circuit nodes and a second pair of circuit nodes, whereas the coupling has two states and is controlled by a pair of complementary logical signals. The mixer circuit further comprises a first pair of current-sourcing devices coupled to the first pair of circuit nodes and a second pair of current-sourcing devices coupled to the second pair of circuit nodes. The mixer circuit further includes a pair of capacitors to provide AC coupling, either between the first pair of circuit nodes and a first external circuit, or between the second pair of circuit nodes and a second external circuit. | 10-30-2008 |
20090029668 | LOW FLICKER NOISE ACTIVE MIXER AND METHOD THEREOF - A low flicker noise active mixer comprises a trans-conductance section, a switching quad, and a load section. The trans-conductance section converts a voltage signal pair into a first current signal pair. The switching quad converts the first current signal pair into a second signal pair in a manner controlled by a LO (local oscillator) signal pair. The load section provides a loading to the second current signal pair using a pair of commutative active loads to convert the second current signal pair into an output voltage signal pair. | 01-29-2009 |
Hsi-Yi Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20100237158 | PRECAST CONCRETE COMPONENT MATERIAL MIXTURE AND METHOD OF PRECASTING - A precast concrete component material mixture and method of precasting, which is used to manufacture sleepers for transportation tracks, and related precast concrete components, are provided. The precast concrete component material mixture include: 891 to 963 kg/m | 09-23-2010 |
I-Chung Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20120252867 | METHOD OF THERAPY AND DIAGNOSIS OF ATHEROSCLEROSIS - There is provided a method of therapy of atherosclerosis, by providing microRNA let-7g, an analogue thereof or modified let-7g to organisms to inhibit the expression of lectin-like oxidized low density lipoprotein receptor-1 (LOX-1), and the binding of LOX-1 and oxidized low-density lipoprotein (oxLDL), so as to block the pathogenesis of atherosclerosis. Also, a method of diagnosis of atherosclerosis comprises determining the levels of microRNA let-7g in serum or plasma samples of organisms, in which the levels of microRNA let-7g is estimated in individuals with atherosclerosis as compared to individuals without atherosclerosis. | 10-04-2012 |
Jung-Hung Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20100232170 | HEADLIGHT OF MOTORCYCLE - A headlight of motorcycle includes a dashboard, a connection member, a headlight, a bracket, and front support racks. The dashboard is coupled to the headlight by the connection member in a modularized manner. The headlight forms coupling holes for mounting to the front support racks. The bracket carries signal lights thereon. By coupling the headlight and the dashboard together in a modularized manner and mounting the bracket that carries the signal lights to the opposite sides of the headlight, and further fixing the front support racks to the opposite sides of the headlight, a headlight module is formed. The headlight module can be easily attached between upper and lower beams of a steering handlebar by using the front support racks so as to simplify the assembling operation and to conceal the front support racks between the bracket and the steering handlebar for improving the outside appearance of the headlight. | 09-16-2010 |
Jung-Lin Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20110176900 | SUCTION HEAD AND TRANSPORTING MACHINE APPLYING THE SAME - A suction head including a first transmission part, a second transmission part and a suction nozzle is provided. The second transmission part is magnetically attracted by the first transmission part to permit a displacement of the second transmission part relative to the first transmission part. The suction nozzle is disposed on the second transmission part and transmitted by the first transmission part via the second transmission part. Additionally, a transporting machine including a shuttle, a transporting mechanism and the aforementioned suction nozzle is provided. The shuttle is capable of carrying an object being transported, and the suction head is driven by the transporting mechanism to take the object being transported. The suction head and the transporting machine applying the same provide high transporting efficiency and ensuring a normal operation in transporting process. | 07-21-2011 |
Kun-Hung Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20120092593 | FRAME, BACKLIGHT MODULE AND LIQUID CRYSTAL DISPLAY MODULE - A frame formed by cutting and bending a plate base is provided. The maximum thickness of the frame is T, the thickness of the plate base is t, and 1.5t≦T≦2.5t. The frame includes a first plate element, a second plate element, and a bending portion. The second plate element is directly contacted to the first plate element, and the first plate element is substantially parallel to the second plate element. The bending portion is connected between the first plate element and the second plate element. A backlight module using the above-mentioned frame and a liquid crystal display (LCD) module using the backlight module are also provided. | 04-19-2012 |
20130293810 | LIGHTING DEVICE, LIGHT UNIT AND LIQUID CRYSTAL DISPLAY - A lighting device includes a support member provided with a wiring portion. The lighting device further includes an LED light source placed on the wiring portion, and an insulating layer. The insulating layer is provided on the wiring portion except a region at which the LED light source is placed. The LED light source is covered by a light-transmitting resin portion. A fluorescent substance is dispersed in the light-transmitting resin portion. The fluorescent substance is a sulfide-based fluorescent material. | 11-07-2013 |
Kun-Lung Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20130295494 | METHOD FOR REPAIRING PHOTOMASK - A method for repairing a defect, such as a pinhole, on a photomask is described. In an example, a laser beam is used to form a matrix of laser burn spots in a substrate of the photomask proximate a defect, such as a pinhole, of the photomask. Each laser burn spot is formed at a focal point of the laser beam inside the substrate by melting a material of the substrate proximate to the defect. In an example, the defect is surrounded and covered by the matrix of laser burn spots. The matrix of laser burn spots can attenuate or block light from passing through the defect, such as the pinhole. The matrix of laser burn spots may repair the defect of the photomask without removing a pellicle and pellicle frame mounted on the photomask. | 11-07-2013 |
20140246045 | Lithography Mask Repair Methods - Lithography mask repair methods are disclosed. In one embodiment, a method of repairing a lithography mask includes providing a lithography mask, exposing a back side of the lithography mask to vacuum ultraviolet (VUV) energy, and cleaning the lithography mask. | 09-04-2014 |
20140291416 | JET SPRAY NOZZLE AND METHOD FOR CLEANING PHOTO MASKS AND SEMICONDUCTOR WAFERS - A jet spray nozzle for cleaning a photolithographic mask or semiconductor wafer and method for cleaning the same. The jet spray nozzle in one embodiment includes a water supply inlet, a gas supply inlet, a first row of gas injection nozzles communicating with the gas supply inlet, a mixing cavity defining a jet spray nozzle outlet, and a flow mixing baffle disposed in the cavity. The mixing baffle preferably is configured and arranged to combine gas and water in the jet spray nozzle for delivering a concentrated stream of gas with a cluster of micro water droplets entrained in the gas for removing contaminant particles from the mask. The jet spray nozzle is capable of cleaning photo masks or wafers without the use of chemicals. In one embodiment, the water may be deionized water and the gas may be nitrogen. In another embodiment, the jet spray nozzle further includes a second row of gas injection nozzles spaced above or below the first row of gas injection nozzles that communicate with the gas supply inlet. | 10-02-2014 |
Lan-Chin Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20100182114 | METHOD FOR ADJUSTING INDUCTANCE OF CHOKE AND METHOD FOR DESIGNING CHOKE - A method for adjusting the inductance of a choke is provided by the present invention. The method includes with an unchanged structure and unchanged dimensions of the core of the choke, changing the kind of the magnetic materials composing the cores so as to adjust the magnetic permeability of the magnetic material. In addition, the present invention also provides a method for designing a choke, the method includes determining the structure of a first choke and a second choke, determining the dimensions of the cores of the chokes, and selecting magnetic materials composing the cores. | 07-22-2010 |
20100182115 | WIRE WOUND TYPE CHOKE COIL - A choke coil including a drum-core and at least one wire is provided. The drum-core includes a pillar, a first board and a second board. Two ends of the pillar are respectively connected to the first board and the second board. A material of the drum-core includes ferrous alloy. The wire has a winding portion wrapped around the pillar. | 07-22-2010 |
20100219924 | CHOKE - An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. An area of the top board is smaller than an area of the bottom board. A winding space is fanned among the top board, the bottom board and the pillar. The wire is winded around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a metallic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 μm. | 09-02-2010 |
20100308950 | CHOKE - A choke including a core and a hollow coil is provided. The core includes a first core body and a second core body. The first core body includes a pillar. The second core body is a flat plate and has an opening. An end of the pillar is suitable to be disposed in the opening and joined to the same. The hollow coil is fitted on the pillar. | 12-09-2010 |
20120086534 | CHOKE HAVING A CORE WITH A PILLAR HAVING A NON-CIRCULAR AND NON-RECTANGULAR CROSS SECTION - A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis. | 04-12-2012 |
20130328653 | CHOKE - A choke includes a single-piece core made of a same material, the single-piece core having a first board, a second board, and a pillar located between the first and second boards, a winding space located among the first board, the second board and the pillar, wherein the pillar has a non-circular and non-rectangular cross section having a first axis and a second axis substantially perpendicularly intersecting with each other at a center of the cross section of the pillar, and wherein a circumference of the cross section of the pillar includes two arc edges, four first substantially straight edges substantially parallel to the first axis, and two second substantially straight edges substantially parallel to the second axis, each of the first substantially straight edges being a joint of and in direct contact with one of the arc edges and one of the second substantially straight edges. | 12-12-2013 |
Lisa Li-Chen Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20130035615 | INSTANT-SUCTION PRESSURE-ADJUSTABLE CUPPING DEVICE AND CUPPING THERAPY METHOD USING THE SAME - The present invention discloses an instant-suction pressure-adjustable cupping device and a cupping therapy method using the same. The method of the present invention comprises steps: respectively measuring cupping pressure-drop values of various regions of healthy persons and patients as normal pressure-drop values and reference pressure-drop values, and storing the data in a database; retrieving from the database one reference pressure-drop value corresponding to a cupped region of a patient; performing a weighted calculation on the reference pressure-drop value to obtain a pressure-drop value for the patient according to regulation factors, including the personal elementary conditions, symptom and cupped region; placing a cupping vessel of the instant-suction pressure-adjustable cupping device on the region to be cupped, exhausting air inside the cupping vessel with an air pump until the pressure-drop value is attained, and keeping the cupping vessel staying on the body of the patient to perform a cupping therapy. | 02-07-2013 |
Meng-Feng Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20130311892 | DIGITAL BUSINESS CARD MANAGEMENT SYSTEM FOR MOBILE DEVICES - A digital business card management system for mobile devices includes several mobile devices and a cloud server. A user can edit a digital business card in a mobile device and upload it to the cloud server. The cloud server allows users who know each other to download each other's digital business card. When the content of a digital business card is changed, the cloud server sends a notification to people with the privilege to view the business card. The invention makes it easier for the user to manage digital business cards and obtain the most up-to-date card information. | 11-21-2013 |
Meng-Ting Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20140166993 | ORGANIC LIGHT EMITTING DIODE - Disclosed is an organic light emitting diode (OLED), including a flexible substrate having a surface with a bulge and groove structure. The OLED also includes a first electrode on the flexible substrate, an organic light emitting layer on the first electrode, and a second electrode on the organic light emitting layer. The flexible substrate includes polyimide. | 06-19-2014 |
Ming-Da Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20100105205 | CLEANING SOLUTION AND SEMICONDCUTOR PROCESS USING THE SAME - A semiconductor process is provided. First, a metal layer, a dielectric layer and a patterned hard mask layer are sequentially formed on a substrate. Thereafter, a portion of the dielectric layer is removed to form an opening exposing the metal layer. Afterwards, a cleaning solution is used to clean the opening. The cleaning solution includes a triazole compound with a content of 0.00275 to 3 wt %, sulfuric acid with a content of 1 to 10 wt %, hydrofluoric acid with a content of 1 to 200 ppm and water. | 04-29-2010 |
20110130008 | METHOD TO CONTROL CRITICAL DIMENSION - A method to control a critical dimension is disclosed. First, a material layer and a composite patterned layer covering the material layer are provided. The composite patterned layer has a pattern defining a first critical dimension. Later, an etching gas is used to perform an etching step to etch the composite patterned layer and a pattern-transferring step is carried out so that thereby the underlying material layer has a transferred pattern with a second critical dimension which is substantially smaller than the first critical dimension. | 06-02-2011 |
20110244678 | SEMICONDUCTOR PROCESS - A semiconductor process is provided. First, a metal layer, a dielectric layer and a patterned hard mask layer are sequentially formed on a substrate. Thereafter, a portion of the dielectric layer is removed to form an opening exposing the metal layer. Afterwards, a cleaning solution is used to clean the opening. The cleaning solution includes a triazole compound with a content of 0.00275 to 3 wt %, sulfuric acid with a content of 1 to 10 wt %, hydrofluoric acid with a content of 1 to 200 ppm and water. The semiconductor process can reduce the possibility of having an incomplete turning on, a leakage or a short, so that the yield of the product is increased. | 10-06-2011 |
20120122035 | PATTERNING METHOD AND METHOD FOR FABRICATING DUAL DAMASCENE OPENING - A patterning method and a method for fabricating a dual damascene opening are described, wherein the patterning method includes following steps. An organic layer, a silicon-containing mask layer and a patterned photoresist layer are formed on a material layer in sequence. The silicon-containing mask layer is removed using the patterned photoresist layer as a mask. A reactive gas is used for conducting an etching step so as to remove the organic layer with the silicon-containing mask layer as a mask, wherein the reactive gas contains no oxygen species. The material layer is removed using the organic layer as a mask, so that an opening is formed in the material layer. The organic layer is then removed. | 05-17-2012 |
20120289043 | METHOD FOR FORMING DAMASCENE TRENCH STRUCTURE AND APPLICATIONS THEREOF - A method for fabricating a damascene trench structure, wherein the method comprises steps as follows: A semiconductor structure having an inner layer dielectric (ILD) and a patterned hard mask stacked in sequence is firstly provided, in which a trench extends from the patterned hard mask downwards into the ILD. Subsequently, the patterned hard mask is etched in an atmosphere essentially consisting of nitrogen (N | 11-15-2012 |
Ming-Deng Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20090164877 | MEMO VOICE RECORDING/PLAYBACK METHOD AND DIGITAL PHOTO FRAME USING THE SAME - A memo voice recording/playback method and a digital photo frame using the method are provided. The method is suitable for a digital image playback apparatus. The digital image playback apparatus has memo voice recording function and memo voice playback function and includes a display unit for image displaying. The method includes: displaying an image; judging whether memo voice recording function of the digital image playback apparatus is enabled or not; and executing a memo voice recording procedure to edit the recorded memo voice into a memo voice file associated with the image if it is judged that the memo voice recording function is enabled. | 06-25-2009 |
Ming-Fang Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20140097394 | Handrail Assembly - A handrail assembly includes at least one connecting unit, and at least two extension units each connected with the connecting unit. The connecting unit includes a middle tube and two connecting tubes extended from two opposite ends of the middle tube respectively. Each of the connecting tubes has a surface formed with a plurality of elongate slits. Each of the connecting tubes has a periphery formed with an annular reinforcing rib to enhance resilience and fixedness of each of the connecting tubes. Each of the extension units includes a mounting pipe mounted on a respective one of the connecting tubes. Thus, the connecting units and the extension units are detached before assembly to facilitate and reduce the cost of storage, packaging and transportation of the handrail assembly. | 04-10-2014 |
Ming-Tao Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20140097394 | Handrail Assembly - A handrail assembly includes at least one connecting unit, and at least two extension units each connected with the connecting unit. The connecting unit includes a middle tube and two connecting tubes extended from two opposite ends of the middle tube respectively. Each of the connecting tubes has a surface formed with a plurality of elongate slits. Each of the connecting tubes has a periphery formed with an annular reinforcing rib to enhance resilience and fixedness of each of the connecting tubes. Each of the extension units includes a mounting pipe mounted on a respective one of the connecting tubes. Thus, the connecting units and the extension units are detached before assembly to facilitate and reduce the cost of storage, packaging and transportation of the handrail assembly. | 04-10-2014 |
Min-Ju Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20090167285 | RESONANCE CIRCUIT FOR USE IN H-BRIDGE DC-DC CONVERTER - The present invention discloses a resonance circuit for use in an H-bridge DC-DC converter, the resonance circuit comprising: an H-bridge converter, capable of converting unstable DC power into stable DC power; a first resonance circuit, disposed on a buck side of the H-bridge converter for reducing the turn-off loss of a first active switching element; and a second resonance circuit, disposed on a boost side of the H-bridge converter for reducing the turn-on loss of a second active switching element. The H-bridge converter comprises: a first active switching element and a second active switching element; a coupled inductor with dual windings capable of storing energy; and a first passive switching element and a second passive switching element. The first resonance circuit comprises: a first inductor, a second inductor, a first auxiliary inductor, a first passive switching element, a second passive switching element and a first auxiliary capacitor, wherein the second inductor comprises a primary winding and an auxiliary winding. The second resonance circuit comprises: a second auxiliary inductor, a third active switching element, a first auxiliary inductor, a first passive switching element, a fourth passive switching element, a third capacitor, a fourth capacitor and a second auxiliary capacitor. | 07-02-2009 |
20090168460 | APPARATUS FOR CONTROLLING H-BRIDGE DC-AC INVERTER - The present invention discloses an apparatus for controlling an H-bridge DC-AC inverter, comprising an H-bridge DC-DC converting circuit capable of converting unstable DC power into stable DC power and a full-bridge DC-AC inverting circuit capable of inverting DC power output from the H-bridge DC-DC converting circuit into AC power. The H-bridge DC-DC converting circuit comprises: a first active switching element and a second active switching element; an inductor capable of storing energy; a first passive switching element and a second passive switching element; and a first capacitor and a second capacitor. The full-bridge DC-AC inverting circuit comprises: a third active switching element, a fourth active switching element, a fifth active switching element and a sixth active switching element; an output inductor; and an output capacitor. | 07-02-2009 |
20110103107 | RESONANCE CIRCUIT FOR DC-LINK VOLTAGE CONTROL IN DC-TO-AC INVERTER - The present disclosure relates to a resonance circuit for DC-link voltage control in a DC-to-AC inverter. The resonance circuit comprises two active switches. Before the active switches of the DC-to-AC inverter are turned on, a DC-link voltage is isolated by the active switches and the active switches of the DC-to-AC inverter are discharged by the resonance circuit to zero voltage at both ends. Then, the active switches of the DC-to-AC inverter are turned on again after the DC-link voltage is charged by the resonance circuit until the DC-link voltage restores to a normal voltage value. Hence, the active switches of the DC-to-AC inverter achieve zero-voltage switching. Not only the switching loss can be reduced to enhance the conversion efficiency, but also the electro-magnetic interference as well as the RF interference due to dynamic transient changes of the voltage (dv/dt) and of the current (di/dt) can be lowered. | 05-05-2011 |
20130141949 | DC-TO-DC VOLTAGE REGULATOR AND ITS OPERATING METHOD THEREOF - A method for operating the DC-to-DC voltage regulator including plural active switches and plural inductors is disclosed. The method including the steps of: turning on the first active switch, and then turning off the first active switch when the current flowing in the first inductor is equal to zero; turning on the third active switch, and then turning off the third active switch when the current flowing in the second inductor is equal to zero; turning on the second active switch, and then turning off the second active switch when the current flowing in the first inductor is equal to zero; and turning on the fourth active switch, and then turning off the fourth active switch when the current flowing in the second inductor is equal to zero. | 06-06-2013 |
Pei-Shan Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20120031277 | DRINK CAN - A drink can includes a can body with a resilient portion, a cap located on a bottle mouth of the can body and a separated holding portion coupled with the cap. The resilient portion is coupled with one set of pressure guards. The separated holding portion connected to the cap holds concentrate of a brewing stuff with a taste different from that held in the can body. The resilient portion formed on the belly of the can body can be squeezed to make a conical portion at the bottom of the can body to dislocate and open a sealing plate at the distal end of the separated holding portion, so that the concentrate of the brewing stuff can quickly drop into the can body to be diluted by the brewing liquid held in the can body to quickly mix the brewing liquid and brewing stuff. | 02-09-2012 |
Ping-Cheng Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20120002343 | Multi-function electroshock gun - A multi-function electroshock gun includes a gun body that includes a barrel and a grip extending from the barrel, and a firing mechanism mounted in the gun body and operable to propel a projectile that is fired through the barrel. The multi-function electroshock gun further includes an electroshock unit that includes a battery mounted in the gun body, a set of exposed electrodes fixedly mounted to the gun body, and a discharge module. The discharge module is coupled electrically to the battery and the exposed electrodes and is capable of being activated to generate an electrical output signal at the exposed electrodes for administering electric shock by contact. The multi-function electroshock gun also includes a trigger mechanism mounted on the gun body and operable to activate the discharge module. | 01-05-2012 |
Po-Chun Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20120154960 | ESD PROTECTION CIRCUIT WITH EOS IMMUNITY - ESD protection circuit with EOS immunity is provided, which includes a first connection circuit, a first EOS control circuit formed by at least a diode, and an ESD clamp respectively coupled between a pad, a first clamp node, an I/O clamp node and a second source node. When the ESD clamp detects ESD through the I/O clamp node, it is triggered to conduct from the I/O clamp node to the second source node. When the pad receives EOS, the first EOS control circuit provides a cross voltage between the first clamp node and the I/O clamp node, such that a voltage of the I/O clamp node becomes less than a characteristic voltage of the ESD clamp to prevent the ESD clamp from reverse conducting. | 06-21-2012 |
Po-Kuang Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20130106448 | TEST KEY STRUCTURE AND METHOD FOR MEASURING STEP HEIGHT BY SUCH TEST KEY STRUCTURE | 05-02-2013 |
20130168816 | RESISTOR AND FABRICATION METHOD THEREOF - The present invention provides a structure of a resistor comprising: a substrate having an interfacial layer thereon; a resistor trench formed in the interfacial layer; at least a work function metal layer covering the surface of the resistor trench; at least two metal bulks located at two ends of the resistor trench and adjacent to the work function metal layer; and a filler formed between the two metal bulks inside the resistor trench, wherein the metal bulks are direct in contact with the filler. | 07-04-2013 |
Sheng-Chi Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20140139382 | HIGH-FREQUENCY CHIP ANTENNA MEASUREMENT SYSTEM - A high-frequency chip antenna measurement system includes a platform; two piers; an arching; a stepper motor; an indication and fastening assembly having a source antenna holder and an illuminant indicator; a carrier stage; a chip antenna carrier having a support member and two sloping posts extending upward and outward from a top end of the support member, two chip antenna carrier benches being mounted to top ends of the two sloping posts respectively; a probe carrier having a support plate directionally variably fixed to the carrier substrate, two props fixed to the support member and parallel to each other and extending outward and upward slantingways, and a probe carrier bench mounted to top ends of the two props for bearing a probe; and a bridging member having two ends mounted to the chip antenna carrier benches. | 05-22-2014 |
Shih-Chia Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20130055992 | ENGINE IGNITION CONTROL DEVICE - An engine ignition control device includes: a pulser; and a control unit, which includes a micro control unit (MCU) and a printed circuit board (PCB). The PCB is electrically connected to the micro control unit, wherein the PCB includes a back porch signal generating circuit. The back porch signal generating circuit is electrically connected to the micro control unit, and includes a bipolar junction transistor (BJT). Emitter (E) of the bipolar junction transistor is electrically connected to the pulser, collector (C) of the bipolar junction transistor is electrically connected to the micro control unit, and base (B) of the bipolar junction transistor is increased to a predetermined voltage level that is larger than 0V. | 03-07-2013 |
Shu-Chen Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20100227079 | METHOD FOR PATTERNING POLYMER SURFACE - The invention provides a method for patterning a polymer surface. A polymer layer is formed on a substrate. A conductive grid with a mesh pattern is placed on the polymer layer. The mesh pattern is transferred to the polymer layer by a plasma treatment. The conductive grid is then removed. | 09-09-2010 |
Sung-Liang Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20130270014 | INTELLIGENT WEIGHT MONITORING SYSTEM AND METHOD THEREOF - The present invention relates to an intelligent weight monitoring system and the method thereof. The system comprises a weight monitoring module, a signal processing module, and a comparison module. The weight measuring module measures at least a weight of a sickbed having a patient, and produces and transmits at least a signal according to the measured weight. The signal processing module processes the signal for producing and transmitting physiological data to the comparison module. The comparison module judges if the patient is abnormal according to the physiological data for producing an abnormal signal. The patient's family members or nurses can get the abnormal signal produced by the comparison module real-timely. Thereby, appropriate medical measures can be applied according to the abnormal signal. | 10-17-2013 |
Sung-Wei Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20120265157 | EYE DROP CONTAINER WITH ALIGNMENT COMPONENT - The present invention provides an eye drop container with an alignment component, including a body, a spout, and a reflective surface. The body has a top surface. The spout has a bottom integrated with the top surface and an opening opposite to the bottom. The reflective surface is disposed on the top surface of the body and has a central hole, wherein the bottom of the spout is disposed in the central hole. | 10-18-2012 |
Ta-Nung Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20120267573 | METHOD FOR MAKING FLUORESCENT GOLD NANO-MATERIAL - A method for making a fluorescent gold nano-material having a gold nanocluster and thiol ligands on a surface of the gold nanocluster includes reacting a mixture of a gold-containing compound, an alkyl alcohol, and a thiol compound. | 10-25-2012 |
Tar-Hwa Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20130149436 | PROCESS FOR PREPARING A SOLID STATE ELECTROLYTE USED IN AN ELECTROCHEMICAL CAPACITOR - A process for preparing a solid state electrolyte used in an electrochemical capacitor includes the steps of: (a) preparing a prepolymer composition which includes a water-retaining polymer component and a film-forming hydroxyl-containing polymer component; (b) subjecting the prepolymer composition to a crosslinking reaction so as to form a polymer matrix membrane including a polymer matrix and an ion-permeable film; and (c) treating the polymer matrix membrane with an aqueous solution which includes a plurality of positive and negative ions so as to permit the positive and negative ions to permeate the ion-permeable film to be retained in the polymer matrix, thereby forming the solid state electrolyte. | 06-13-2013 |
20130344233 | PROCESS FOR PREPARING A SOLID STATE ELECTROLYTE USED IN AN ELECTROCHEMICAL CAPACITOR - A process for preparing a solid state electrolyte used in an electrochemical capacitor includes the steps of: (a) preparing a mixture of a water-retaining clay-based mineral component and a film-forming hydroxyl-containing polymer component; (b) subjecting the mixture to a crosslinking reaction so as to form a polymer matrix membrane including a polymer matrix and an ion-permeable film; and (c) treating the polymer matrix membrane with an aqueous solution which includes a plurality of positive and negative ions so as to permit the positive and negative ions to permeate the ion-permeable film to be retained in the polymer matrix, thereby forming the solid state electrolyte. | 12-26-2013 |
Te-Chuan Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20090172382 | Multi-function computer system - A multi-function computer system includes a host apparatus, a display and a boot mode switching unit. The display is electrically connected to the host apparatus. The boot mode switching unit electrically connected to the host apparatus may be switched between a first mode and a second mode. In the first mode, the boot mode switching unit controls the host apparatus to boot into a first operation environment. In the second mode, the boot mode switching unit controls the host apparatus to boot into a second operation environment different from the first operation environment. | 07-02-2009 |
Te-Hsien Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20120295186 | DOUBLE PATTERNING MASK SET AND METHOD OF FORMING THEREOF - A double patterning mask set includes a first mask having a first set of via patterns, and a second mask having a second set of via patterns. The first set of via patterns includes at least two via patterns arranged along a diagonal direction, each of the at least two via patterns has at least a truncated corner. The first set of via patterns and the second set of via patterns are interlacedly arranged along a horizontal direction and a vertical direction. | 11-22-2012 |
20130163850 | MASK PATTERN AND CORRECTING METHOD THEREOF - A mask pattern and a correcting method thereof are provided. The correcting method includes the following steps. An original pattern having a first original contour and a second original contour is provided. The first original contour has a first original corner. The second original contour has a second original corner, which is near the first original corner. The first and second original corners are cut to form a cut pattern. An optical proximity correction (OPC) process is applied to the cut pattern to form the mask pattern. | 06-27-2013 |
20140040837 | METHOD OF OPTICAL PROXIMITY CORRECTION ACCORDING TO COMPLEXITY OF MASK PATTERN - A method of optical proximity correction (OPC) includes the following steps. At first, a layout pattern is provided to a computer system. Subsequently, the layout pattern is classified into at least a first region and at least a second region. Then, several iterations of OPC calculations are performed to the layout pattern, and a total number of OPC calculations performed in the first region is substantially larger than a total number of OPC calculations performed in the second region. Afterwards, a corrected layout pattern is outputted through the computer system onto a mask. | 02-06-2014 |
20150036116 | APERTURE FOR PHOTOLITHOGRAPHY - An aperture is configured to be disposed between an illumination source and a semiconductor substrate in a photolithography system. The aperture includes a light-transmission portion with a non-planar thickness profile to compensate the discrepancy of wave-fronts of the light beams of different orders. | 02-05-2015 |
Tusty-Jiuan Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20110159127 | EXTRACT OF TOONA SINENSIS FROM SUPERCRITICAL FLUID EXTRACTION FOR TREATING DIABETES AND METABOLIC DISEASES, THE PREPARATION METHOD AND THE USE THEREOF | 06-30-2011 |
20130040996 | COMPOSITION FOR TREATING ATHEROSCLEROSIS AND A PREPARATION METHOD THEREOF - Disclosed are a composition for preventing and treating atherosclerosis which includes chalcone compound. In particular, the chalcone compound bound with 2-hydroxyl in ring A and 4′-methyoxy in ring B has versatile therapeutic potentials on anti-atherosclerosis by acting as PPARγ inducer, p44/42 MAPK inhibitor and cell cycle blocker and does not show toxicity to human aortic smooth muscle cells (HASMCs). In addition, the chalcone compound exhibits synergistic effect with the PPARγ ligand (rosiglitazone) to inhibit cell proliferation and the upregulation of cyclin D1, cyclin D3, interleukin-1β (IL-1β) and interleukin-6 (IL-6) induced by oxidized low density lipoprotein (Ox-LDL). | 02-14-2013 |
20140194474 | COMPOSITION FOR TREATING ATHEROSCLEROSIS AND A PREPARATION METHOD THEREOF - Disclosed are a composition for preventing and treating atherosclerosis which includes chalcone compound. In particular, the chalcone compound bound with 2-hydroxyl in ring A and 4′-methyoxy in ring B has versatile therapeutic potentials on anti-atherosclerosis by acting as PPARγ inducer, p44/42 MAPK inhibitor and cell cycle blocker and does not show toxicity to human aortic smooth muscle cells (HASMCs). In addition, the chalcone compound exhibits synergistic effect with the PPARγ ligand (rosiglitazone) to inhibit cell proliferation and the upregulation of cyclin D1, cyclin D3, interleukin-1β (IL-1β) and interleukin-6 (IL-6) induced by oxidized low density lipoprotein (Ox-LDL). | 07-10-2014 |
20140350304 | COMPOSITION FOR TREATING DIABETES AND METABOLIC DISEASES AND A PREPARATION METHOD THEREOF - Disclosed is a chalcone composition for treating diabetes and metabolic syndromes. In particular, the chalcone compound bound with 2-halogen in ring A significantly decreases the blood glucose level in the in vitro anti-diabetic effect experiment. In the in vivo animal model, the leading chalcone compound can prevent the progression of diabetes and control the blood glucose level, and there is no significant difference in the gains in body weight. Throughout the seven-week administration, there are no hepatic or renal toxicity observed. | 11-27-2014 |
Wei-Lun Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20100321099 | EFFICIENCY AND THERMAL IMPROVEMENT OF A CHARGE PUMP BY MIXING DIFFERENT INPUT VOLTAGES - For a charge pump, a control circuit switches two or more input voltages to apply to one or more pumping capacitors under auto-sensing control to modulate a maximum pumping voltage as close as to a demanded output voltage to thereby reduce the difference between the maximum pumping voltage and the output voltage for efficiency and thermal improvement of the charge pump. The maximum pumping voltage is produced by mixing the different input voltages and the charge pump may provide more operation modes. | 12-23-2010 |
20130128395 | Short-circuit Detection Circuit and Short-circuit Detection Method - The present invention discloses a short-circuit detection circuit and a short-circuit detection method. The short-circuit detection circuit detects whether an output node is short-circuited to a first predetermined level. A first switch circuit which is controlled by a control signal is coupled between the output node and a second predetermined level. The short-circuit detection circuit includes: a determination circuit, which is coupled between the output node and the second predetermined level, wherein when the determination circuit is enabled, it generates a determination signal according to whether the output node is short-circuited to the first predetermined level; and a second switch circuit, which generates a short-circuit detection signal according to the determination signal. | 05-23-2013 |
Wen-Hung Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20110175763 | DIGITAL-TO-ANALOG CONVERTER - The present invention relates to a digital-to-analog converter comprising a differentiation circuit, a conversion circuit, and an integration circuit. The differentiation circuit receives and differentiates a digital signal for producing a differentiation signal. The conversion circuit is coupled to the differentiation circuit. It receives the differentiation signal and produces a conversion signal according to a clock signal and the differentiation signal. The integration circuit is coupled to the conversion circuit. It receives and integrates the conversion signal for producing an analog signal. Thereby, the purpose of reducing distortion noises can be achieved. | 07-21-2011 |
Wen-Tsan Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20120144216 | TRANSACTION LEVEL SYSTEM POWER ESTIMATION METHOD AND SYSTEM - A transaction level (TL) system power estimation method and system are provided. The method includes inserting at least a characteristic extractor into an electronic device of a target system. The characteristic extractor extracts at least a power characteristic of the electronic device when a TL simulation is proceeding. The power characteristic provided from the characteristic extractor is converted to at least a power consumption value by using a power model. The power consumption value is recorded into a power database, for analyzing power consumption of the whole target system. In some embodiments, the TL system power estimation method and system can be applied in the target system with dynamic power management. The TL system power estimation method and system also can be used with a high-level synthesizer to develop the power-aware electronic device in a short time. | 06-07-2012 |
20130212546 | METHOD FOR INSERTING CHARACTERISTIC EXTRACTOR - A method for inserting characteristic extractor is provided. The method includes parsing a transaction level model (TLM) of an electronic device of a target system to find out at least one target point of an operation status of the electronic device; and inserting at least one characteristic extractor into the at least one target point. | 08-15-2013 |
Ya-Hsueh Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20130011938 | METHOD FOR MANUFACTURING THROUGH-SILICON VIA - A method for manufacturing TSVs, wherein the method comprises several steps as follows: A stack structure having a substrate and an ILD layer (inter layer dielectric layer) is provided, in which an opening penetrating through the ILD layer and further extending into the substrate is formed. After an insulator layer and a metal barrier layer are formed on the stack structure and the sidewalls of the opening, a top metal layer is then formed on the stack structure to fulfill the opening. A first planarization process stopping on the barrier layer is conducted to remove a portion of the top metal layer. A second planarization process stopping on the ILD layer is subsequently conducted to remove a portion of the metal barrier layer, a portion of the insulator layer and a portion of the top metal layer, wherein the second planarization process has a polishing endpoint determined by a light interferometry or a motor current. | 01-10-2013 |
20130078792 | SEMICONDUCTOR PROCESS - A semiconductor process includes the following steps. An interdielectric layer is formed on a substrate and the interdielectric layer has a first recess and a second recess. A metal layer is formed to cover the surface of the interdielectric layer, the first recess and the second recess. Partially fills a sacrificed material into the first recess and the second recess so that a portion of the metal layer in each of the recesses is respectively covered. The uncovered metal layer in each of the recesses is removed. The sacrificed material is removed. An etching process is performed to remove the remaining metal layer in the first recess and reserve the remaining metal layer in the second recess. | 03-28-2013 |
20130334690 | SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF - A semiconductor structure includes a work function metal layer, a (work function) metal oxide layer and a main electrode. The work function metal layer is located on a substrate. The (work function) metal oxide layer is located on the work function metal layer. The main electrode is located on the (work function) metal oxide layer. Moreover a semiconductor process forming said semiconductor structure is also provided. | 12-19-2013 |
20140054654 | MOS TRANSISTOR AND PROCESS THEREOF - A MOS transistor includes a gate structure on a substrate, and the gate structure includes a wetting layer, a transitional layer and a low resistivity material from bottom to top, wherein the transitional layer has the properties of a work function layer, and the gate structure does not have any work function layers. Moreover, the present invention provides a MOS transistor process forming said MOS transistor. | 02-27-2014 |
20140346616 | TRANSISTOR AND SEMICONDUCTOR STRUCTURE - A semiconductor structure includes a work function metal layer, a (work function) metal oxide layer and a main electrode. The work function metal layer is located on a substrate. The (work function) metal oxide layer is located on the work function metal layer. The main electrode is located on the (work function) metal oxide layer. A semiconductor process forming said semiconductor structure is also provided. | 11-27-2014 |
Ya-Hui Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20140255385 | TREATMENT OF GLIOBLASTOMA WITH PRODUCTS OBTAINED FROM CULTIVATION OF CORDYCEPS MILITARIS - Disclosed herein is that an active ingredient obtained from cultivation of | 09-11-2014 |
Yao Dung Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20120301508 | Compositions for Induction of Osteogenesis around an Implant - The invention relates to a composition for induction of osteogenesis around an implant comprises a chitosan having a degree of deacetylation at the range of 70%˜90% and a collagen, wherein the implant is a titanium implant. The composition of the present invention is able to effectively induce osteogenesis in organisms and can be used to promote bone formation and osseointegration of an implant. | 11-29-2012 |
Yao-Sheng Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20140025315 | BASELINE PREDICTIVE MAINTENANCE METHOD FOR TARGET DEVICE AND COMPUTER PROGRAM PRODUCT THEREOF - A baseline predictive maintenance method for a target device (TD) and a computer program product thereof are provided. Fresh samples which are generated when the target device produces workpieces just after maintenance are collected, and a new workpiece sample which is generated when the target device produces a new workpiece is collected. A plurality of modeling samples are used to build a TD baseline model in accordance with a conjecturing algorithm, wherein the modeling samples include the new workpiece sample and the fresh samples. A TD healthy baseline value for the new workpiece is computed by the TD baseline model, and a device health index (DHI), a baseline error index (BEI) and baseline individual similarity indices (ISI | 01-23-2014 |
Yi-Hsien Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20080311090 | Methods for inhibition of proliferative disease, including hepatocellular carcinoma - The present invention is related to a method for modulating expression of protein kinase C-alpha associated with proliferative diseases. The invention further relates to a screening method utilizing the association between transcription factors (MZF-1 and Elk-1) and their DNA binding element (PKC-.alpha. promoter) to identify novel anticancer agents. | 12-18-2008 |
Yi-Hung Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20090177852 | DATA BLOCK RECEIVER AND METHOD FOR DECODING DATA BLOCK - A data block receiver for decoding a data block. The data block has a block sequence number (BSN). The data block receiver includes two de-interleavers, a memory circuitry, a combiner, a decoder, and an error detector. A first de-interleaver interleaves the data block to obtain a first de-interleaved data block. A stored data block with a BSN same with the data block is retrieved from the memory circuitry when the data block is not the newest data block. The second de-interleaver interleaves the retrieved data block to obtain a second de-interleaved data block. The second and the first de-interleaved data blocks are combined to form a combined data block. The decoder decodes the combined data block. The data block is stored when an error in the decoded data block is detected. | 07-09-2009 |
Yi-Ting Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20130241784 | COMMUNICATION DEVICE AND TUNABLE ANTENNA ELEMENT THEREIN - A communication device includes a ground element, an antenna element, a circuit element group, and a communication module. The antenna element is a loop antenna. One end of the antenna element is a grounding end coupled to the ground element, and the other end of the antenna element is a feeding end close to the grounding end. The circuit element group includes at least two separate circuit element sub-groups. The communication module is coupled to the circuit element group. One of the circuit element sub-groups of the circuit element group is selectively coupled to the feeding end so as to make the antenna element operate in different communication bands. | 09-19-2013 |
20140145900 | COMMUNICATION DEVICE AND RECONFIGURABLE ANTENNA ELEMENT THEREIN - A communication device including a ground element, an antenna element and a switching unit is provided. The antenna element is substantially a loop antenna and includes a first part, a second part and a third part. The second part includes (N−1) bends for forming N connection sections. The third part includes (P−1) bends for forming P ground sections. The N connection sections are connected in series between a first end of a first ground section and the first part. A second end of an i | 05-29-2014 |
Yi-Zeng Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20110063073 | TACTILE REMOTE CONTROL SYSTEM - The present invention discloses a tactile remote control system, which uses a processor to integrate the operation selection items of controlled devices and arrange the selection items into a graphic user interface, and which uses a microswitch to output instructions. The processor arranges the graphic user interfaces of a controlled device hierarchically. Therefore, the graphic user interfaces have organizationality, logicality and continuity. The user watches the display and operates the microswitches to remotely control the controlled devices. The present invention integrates the control functions to assist the user to control the daily-life electronic devices and household appliances. The present invention enables any one, who has been briefly instructed, to remotely control the linked devices by his will. | 03-17-2011 |
Yu-An Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20100056313 | LIMITED SLIP DIFFERENTIAL - A limited slip differential includes a driving plate, backing plates, differential gear assemblies, and a transmission assembly engaged together inside a sealed casing where fluid is pumped. The driving plate has pairs of communicated openings for interlocking two gears of each gear assembly, which extend by opposite directions from the driving plate for separately engaging with the transmission assembly. While synchronously rotating the plates, the gear assemblies are alternatively soaked into the fluid and each permits the fluid passing among the gears for adjusting the rotational speed. In the event that the rotational speed difference of axle shafts of the vehicle exceeds a threshold value, the LSD applies at least one gear assembly to generate a back pressure and efficiently block the fluid passing through the gears for limiting mutual rotational speed difference, hence achieving a limited-slip effect. | 03-04-2010 |
20140102252 | AUTO-LOCKING TORQUE DISTRIBUTING MECHANISM - An auto-locking torque distributing mechanism comprises a main plate receiving two gear sets. On two sides of the main plate, slots and apertures are respectively formed near two side peripheries thereof and partially communicated with each other. A sleeve assembly includes a covering unit with an opening enclosed by a first wall whereby each aperture is communicated with the opening and arranged near the first wall while connecting the main plate to the sleeve assembly. When one wheel slips and spins much faster than the other wheel, the sleeve assembly keeps fluid to avoid leaking. By the aforementioned partial communication, the fluid is easily sucked into the aperture to enter the slot and go among the gear sets, thereby limiting the amount of torque sent to the slipping wheel and distributing as much as torque to the non-slipping wheel to keep the traction of the vehicle. | 04-17-2014 |
Yu-Chen Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20100251971 | Pet Leash and Rope Used Therein - A pet leash includes a connector, a handle, and a rope. The connector is for connecting with a collar; the handle is for being held; and the rope connecting with the connector and the handle by two ends respectively. The pet leash is characterized in that the rope includes a plurality of strands forming a core of the rope and a sheath wrapping and binding up the said core, with the strands being of an elastic material. Therefore, the present invention can avoid a widen crack or sudden snap derived from an initially formed crack while providing a high elasticity. | 10-07-2010 |
Yu-Hsin Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20140234804 | Assisted Guidance and Navigation Method in Intraoral Surgery - An assisted guidance and navigation method in intraoral surgeries is a method using computerized tomography (CT) photography and an optical positioning system to track medical appliances, the method including: first providing an optical positioning treatment instrument and an optical positioning device; then obtaining image data of the intraoral tissue receiving treatment through CT photography, precisely displaying actions of the treatment instrument in the image data, and real-time checking an image and guidance and navigation. Therefore, during the surgery, the existing use habits of the physicians are not affected and accurate and convenient auxiliary information is provided, and attention is paid to using the treatment instrument in physical environments such as a patient's tooth or dental model. | 08-21-2014 |
Yu-Ying Hsieh, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20120264984 | LIQUID CRYSTAL COMPOUND - A liquid crystal compound with high optical anisotropy is provided. The liquid crystal compound is represented by formula (I), | 10-18-2012 |