| Patent application number | Description | Published |
|---|
| 20090075423 | METHOD OF BONDING CHIPS ON A STRAINED SUBSTRATE AND METHOD OF PLACING UNDER STRAIN A SEMICONDUCTOR READING CIRCUIT - The invention concerns a method of collective bonding of individual chips on a strained substrate ( | 03-19-2009 |
| 20090085045 | METHOD FOR PRODUCING A MATRIX OF INDIVIDUAL ELECTRONIC COMPONENTS AND MATRIX PRODUCED THEREBY - The invention relates to a method for producing a matrix of electronic components, comprising a step of producing an active layer on a substrate, and a step of individualizing the components by forming trenches in the active layer at least until the substrate emerges. The method comprises steps of depositing a layer of functional material on the active layer, depositing a photosensitive resin on the layer of material in such a way as to fill said trenches and to form a thin film on the upper face of the components, at least partially exposing the resin to radiation while underexposing the portion of resin in the trenches, developing the resin in such a way as to remove the properly exposed portion thereof, removing the functional material layer portion that shows through after the development step, and removing the remaining portion of resin. | 04-02-2009 |
| 20090145885 | METHOD FOR SOLDERING TWO ELEMENTS TOGETHER USING A SOLDER MATERIAL - This method for soldering or hybridizing two components ( | 06-11-2009 |
| 20090162657 | METHOD FOR MANUFACTURING METAL CHIPS BY PLASMA FROM A LAYER COMPRISING SEVERAL ELEMENTS - The invention relates to a method for manufacturing chips composed of at least one electrically conductive material. Such a method comprises the following steps:
| 06-25-2009 |
| 20100072631 | CONNECTION BY FITTING TOGETHER TWO SOLDERED INSERTS - A connection device between two components includes a hollow conductive insert, into which is fitted another conductive insert, the electrical connection between the two inserts being provided by means of a solder element. | 03-25-2010 |
| 20100123899 | DETECTOR SYSTEM WITH AN OPTICAL FUNCTION AND METHOD FOR MAKING SUCH A SYSTEM - The invention relates to a system and method for positioning and passively aligning at least one optical component as close as possible to an electromagnetic radiation detector. This system comprises supporting wedges ( | 05-20-2010 |
| 20100124604 | METHOD OF THINNING A BLOCK TRANSFERRED TO A SUBSTRATE - The invention relates to a method of thinning a block transferred to a substrate. According to the invention, the method includes depositing a stop layer at least onto the substrate and in a way adjacent to and contiguous with the transferred block. The stop layer is made out of material of greater resistance or hardness than the material of the transferred block and of smaller thickness than that of the transferred block. The method further includes actuating the thinning of the transferred block. The thinning time is pre-programmed as a function of a predetermined speed of thinning the transferred block, the thinning time being selected so that the thinning also attacks the stop layer. | 05-20-2010 |
| 20100243713 | METAL LIP SEAL AND MACHINE FITTED WITH SAID SEAL - This metal lip seal capable of ensuring tightness between two elements includes: two resilient members each intended to be accommodated in a cavity of one of the two elements, said cavities being located in line with a zone of engagement of the two elements one with the other in which tightness is desired; and a flexible body secured to the element receiving the resilient members, provided with two free ends, said free ends extending at least in line with said engagement zones and being in contact with the resilient members. Each of the resilient members is capable of exerting a contact force on the free ends in order to ensure tightness between the two elements. | 09-30-2010 |
| 20110041332 | CONNECTION COMPONENT PROVIDED WITH INSERTS COMPRISING COMPENSATING BLOCKS - The invention relates to a component comprising, on one face, a set of conductive inserts to be electrically connected to conductive buried regions of another component, said inserts resting on conductive blocks, advantageously produced from a deformable material and positioned at the surface of the component. The surface of the block, which is to come into contact with the insert, has at least one dimension larger than that of the buried region. | 02-24-2011 |
| 20110094789 | CONNECTION COMPONENT WITH HOLLOW INSERTS AND METHOD FOR MAKING SAME - The invention relates to a method for making a connection component that comprises a set of conducting inserts to be electrically connected with another component, said inserts being hollow. | 04-28-2011 |
| 20110300487 | METHOD FOR PRODUCING A MATRIX OF INDIVIDUAL ELECTRONIC COMPONENTS AND MATRIX PRODUCED THEREBY - The invention relates to a method for producing a matrix of electronic components, comprising a step of producing an active layer on a substrate, and a step of individualizing the components by forming trenches in the active layer at least until the substrate emerges. The method comprises steps of depositing a layer of functional material on the active layer, depositing a photosensitive resin on the layer of material in such a way as to fill said trenches and to form a thin film on the upper face of the components, at least partially exposing the resin to radiation while underexposing the portion of resin in the trenches, developing the resin in such a way as to remove the properly exposed portion thereof, removing the functional material layer portion that shows through after the development step, and removing the remaining portion of resin. | 12-08-2011 |
| 20130001807 | METHOD OF FLIP-CHIP HYBRIDIZATION FOR THE FORMING OF TIGHT CAVITIES AND SYSTEMS OBTAINED BY SUCH A METHOD - A method for manufacturing a microelectronic assembly including stacked first and second microelectronic components having a cavity therebetween including defining said cavity by means of a lateral wall forming a closed frame extending around a determined area of the first component except for an opening used as a vent; forming within the closed frame and opposite to the vent an obstacle capable of forming, in cooperation with the lateral wall, a bypass duct for the filling material; performing a flip-chip hybridization of the first and second components, a surface of the second component resting on the upper edge or end of the lateral wall formed on the first component to form said at least one cavity; injecting the filling material in liquid form between the two hybridized components to embed said at least one cavity and to make it tight by obstruction of the vent as said filling material solidifies. | 01-03-2013 |
| 20130267113 | CONNECTING ELEMENTS FOR PRODUCING HYBRID ELECTRONIC CIRCUITS - A connecting system having a female element including a hollow flared part for receiving and guiding a male element and a hollow mating part for mating with the male element. A part to be mated of the male element has an outside diameter that before the mating is larger than an inside diameter of the mating part of the female element, and the part to be mated of the male element is made of a material that can be strained and has a corrugated transverse cross section, so as to contract when it is plugged into the mating part of the female element, and/or the mating part of the female connection element is made of a material that can be strained and has a corrugated transverse cross section, so as to dilate when the part to be mated of the male element is plugged into it. | 10-10-2013 |
| 20140075747 | CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS - Electro-mechanical connection component provided on one connection surface with conductive inserts intended to be inserted at ambient temperature into respective ductile conductive pads formed on a surface of another connection component for a face-to-face type hybridization. Each insert of the component includes: a hollow metal core formed of a bottom arranged on the connection surface and of a lateral wall protruding from said bottom, defining an internal surface of the insert, at least a portion of said internal surface being non-oxidized; and a metal layer substantially only covering the internal surface of the metal core. | 03-20-2014 |
