51st week of 2010 patent applcation highlights part 16 |
Patent application number | Title | Published |
20100320597 | Wafer level stack structure for system-in-package and method thereof - A system-in-package, comprising a wafer level stack structure, including at least one first device chip including a first device region having a plurality of input/output(I/O) pads, and at least one second device chip including a second device region having a plurality of input/output(I/O) pads and a second peripheral region surrounding the second device region, wherein the size of the second device region is different from the size of the first device region, wherein the at least one first device chip and the at least one second device chip have approximately equal size; and a common circuit board to which the wafer level stack structure is connected. | 2010-12-23 |
20100320598 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF - A semiconductor device includes a stacked chip structure provided on a board and made up of semiconductor chips that are stacked via insulators. Each semiconductor chip has an integrated circuit surface, pads provided on the integrated circuit surface, and conductive connecting members having a wave shape with first ends electrically connected to the pads, and second ends extending outwardly from the at least one edge part and electrically connected to the connection terminals on the board. | 2010-12-23 |
20100320599 | DIE STACKING APPARATUS AND METHOD - Various stacked semiconductor devices and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a first semiconductor die that has a first bulk semiconductor side and a first opposite side. A second semiconductor die is provided that has a second bulk semiconductor side and a second opposite side. The second opposite side of the second semiconductor die is coupled to the first opposite side of the first semiconductor die. Electrical connections are formed between the first semiconductor die and the second semiconductor die. | 2010-12-23 |
20100320600 | SURFACE DEPRESSIONS FOR DIE-TO-DIE INTERCONNECTS AND ASSOCIATED SYSTEMS AND METHODS - Stacked microelectronic dies employing die-to-die interconnects and associated systems and methods are disclosed herein. In one embodiment, a stacked system of microelectronic dies includes a first microelectronic die, a second microelectronic die attached to the first die, and a die-to-die interconnect electrically coupling the first die with the second die. The first die includes a back-side surface, a surface depression in the back-side surface, and a first metal contact located within the surface depression. The second die includes a front-side surface and a second metal contact located at the front-side surface and aligned with the first metal contact of the first die. The die-to-die interconnect electrically couples the first metal contact of the first die with the second metal contact of the second die and includes a flowable metal layer that at least partially fills the surface depression of the first die. | 2010-12-23 |
20100320601 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THROUGH VIA DIE HAVING PEDESTAL AND RECESS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a pedestal portion bordering the recess; mounting a semiconductor device inside the recess in the structure; and encapsulating the structure and the semiconductor device in an encapsulation. | 2010-12-23 |
20100320602 | High-Speed Memory Package - The semiconductor package includes a dielectric layer, a trace layer, a conductive layer, a die and an underfill layer. The dielectric layer has first side and an opposing dielectric layer second side. Multiple vias extend through the dielectric layer from the dielectric layer first side to the dielectric layer second side. Multiple solder balls are disposed at the dielectric layer second side. Each of the solder balls is electrically coupled to a different one of the vias. The die is electrically coupled to the solder balls. The conductive layer is disposed between the dielectric layer second side and the die. The conductive layer defines a window there through for allowing the solder balls to electrically couple to the vias without contacting the conductive layer, i.e., no physical or electrical contact. The underfill layer is formed between the die and the conductive layer, while the trace layer is formed at the dielectric layer first side. Traces of the trace layer electrically couple the vias to other solder balls. | 2010-12-23 |
20100320603 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION LAYER AND METHOD FOR MANUFACTURING THEREOF - A method for manufacturing an integrated circuit package system includes: providing a base device; attaching a base interconnect to the base device; applying an encapsulant over the base device and the base interconnect; and forming a re-routing film over the encapsulant, the base device, and the base interconnect for connectivity without a substrate. | 2010-12-23 |
20100320604 | APPLICATION OF MN FOR DAMAGE RESTORATION AFTER ETCHBACK - Back end of line interconnect structures and methods of making a back end of line interconnect structure are provided. The back end of line interconnect structure contains a first interconnect layer containing a first conductive feature and a first dielectric layer; a first cap layer over the first interconnect layer, and a second interconnect layer over the first cap layer. The second interconnect layer contains a second conductive feature, a second dielectric layer, and two or more barrier layers therebetween. The two or more barrier layers contain a first barrier layer over the second dielectric layer and a MnO | 2010-12-23 |
20100320605 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - Provided are a semiconductor device and a method of fabricating the semiconductor memory device. A contact plug is formed by wet etching. An aspect ratio of SAC is decreased and SAC fail is reduced so that a process margin is secured. The semiconductor device includes a semiconductor substrate comprising an active region and a device isolation layer defining the active region, a conductive pattern formed on the semiconductor substrate, and a nitride layer formed on the semiconductor substrate perpendicularly to the conductive pattern. | 2010-12-23 |
20100320606 | Method for Forming MEMS Devices Having Low Contact Resistance and Devices Obtained Thereof - The present disclosure proposes a method for manufacturing in a MEMS device a low-resistance contact between a silicon-germanium layer and a layer contacted by this silicon-germanium layer, such as a CMOS metal layer or another silicon-germanium layer, through an opening in a dielectric layer stack separating both layers. An interlayer is formed in this opening, thereby covering at least the sidewalls of the opening on the exposed surface of the another layer at the bottom of this opening. This interlayer may comprise a TiN layer in contact with the silicon-germanium layer. This interlayer can further comprise a Ti layer in between the TiN layer and the layer to be contacted. In another embodiment this interlayer comprises a TaN layer in contact with the silicon-germanium layer. This interlayer can then further comprise a Ta layer in between the TaN layer and the layer to be contacted. | 2010-12-23 |
20100320607 | INTERCONNECT STRUCTURES WITH A METAL NITRIDE DIFFUSION BARRIER CONTAINING RUTHENIUM - A method for forming an interconnect structure for copper metallization and an interconnect structure containing a metal nitride diffusion barrier are described. The method includes providing a substrate having a micro-feature opening formed within a dielectric material and forming a metal nitride diffusion barrier containing ruthenium, nitrogen, and a nitride-forming metal over the surfaces of the micro-feature. The nitride-forming metal is selected from Groups IVB, VB, VIB, and VIIB of the Periodic Table, and the metal nitride diffusion barrier is formed by exposing the substrate to a precursor of the nitride-forming metal, a nitrogen precursor, and a ruthenium precursor. | 2010-12-23 |
20100320608 | Semiconductor Substrate Contact VIA - Edges of a first conductive layer ( | 2010-12-23 |
20100320609 | WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FILLING - Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer. | 2010-12-23 |
20100320610 | SEMICONDUCTOR PACKAGE WITH SUBSTRATE HAVING SINGLE METAL LAYER AND MANUFACTURING METHODS THEREOF - A semiconductor package includes a substrate, a die, and a package body. The substrate includes: (a) a core including a resin reinforced with fibers; (b) a plurality of openings extending through the core; (c) a dielectric layer; and (d) a single conductive layer disposed between the dielectric layer and the core. Portions of a lower surface of the single conductive layer cover the plurality of openings to form a plurality of first contact pads for electrical connection external to the semiconductor package. Exposed portions of an upper surface of the single conductive layer form a plurality of second contact pads. The die is electrically connected to the plurality of second contact pads, and the package body encapsulates the die. | 2010-12-23 |
20100320611 | Method for manufacturing a semiconductor device, semiconductor chip and semiconductor wafer - A method for manufacturing a semiconductor device includes forming a semiconductor wafer including a plurality of interconnect layers, the semiconductor wafer including: a plurality of chip-composing portions; a dicing region separating the chip-composing portions from each other; and a plurality of inter-chip interconnects electrically connecting adjacent ones of the chip-composing portions and formed in one of the interconnect layers and in the dicing region; a dummy metal pattern comprising a plurality of dummy metals, the dummy metal pattern being formed in at least one of the interconnect layers over or below the inter-chip interconnects only in an area corresponded to a region where the inter-chip interconnects are arranged and corresponded to a region therearound; and forming semiconductor chips by dicing the dicing region so as to divide the chip-composing portions. | 2010-12-23 |
20100320612 | Method for manufacturing semiconductor device, semiconductor chip, and semiconductor wafer - A method for manufacturing a semiconductor device includes forming a semiconductor wafer including a plurality of interconnect layers, the semiconductor wafer including: a plurality of chip-composing portions; a dicing region separating the chip-composing portions from each other; and a plurality of inter-chip interconnects formed in the dicing region and electrically connecting adjacent ones of the chip-composing portions; and forming semiconductor chips by dicing the dicing region so as to divide the chip-composing portions, wherein each of the inter-chip interconnects has a width of an intermediate portion narrower than widths of connection end portions connected to the adjacent ones of the chip-composing portions. | 2010-12-23 |
20100320613 | INTEGRATED CIRCUIT ARRANGEMENT WITH AN AUXILIARY INDENTATION, PARTICULARLY WITH ALIGNING MARKS - An integrated circuit arrangement is disclosed having a wiring indentation and an auxiliary indentation in a dielectric layer. The wiring indentation contains a metal through which current flows during operation of the circuit arrangement. The auxiliary indentation contains a metal through which an electric current does not flow during operation of the circuit arrangement. The auxiliary indentation serves as an alignment mark during the production of the integrated circuit arrangement. | 2010-12-23 |
20100320614 | SEMICONDUCTOR PACKAGE AND PRODUCTION METHOD THEREOF, AND SEMICONDUCTOR DEVICE - A semiconductor package production method includes the step of die-cutting part of a lead side portion of a seal formed by molding and dam bars using a pedestal and punch. The pedestal has an outer surface at a position retreating from a side surface of an upper seal portion as far as possible and an inner surface generally near a side surface of a lower seal portion. Width Wa of the upper surface of the pedestal is smaller than the overhang size of the upper seal portion. Tip region Ra of the lead side portion which is present right under the overhang portion of the upper seal portion has a slanted surface Fa | 2010-12-23 |
20100320615 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a semiconductor device, includes: mounting a semiconductor chip having an electrode on a wiring substrate having a base substrate and a wiring formed on the base substrate; forming a eutectic alloy by contacting the wiring with the electrode and by heating and pressurizing, and; forming the eutectic alloy so as a part of the eutectic alloy enters between the wiring and the base substrate. | 2010-12-23 |
20100320616 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor device comprises forming an insulating layer on a semiconductor substrate, etching the insulating layer to form contact regions, forming a conductive layer on an entire surface including the contact regions, and spiking the conductive layer in the semiconductor substrate. | 2010-12-23 |
20100320617 | METHODS TO MITIGATE PLASMA DAMAGE IN ORGANOSILICATE DIELECTRICS USING A PROTECTIVE SIDEWALL SPACER - Plasma damage in ultra low k dielectric materials during formation of a dual damascene metal interconnect structure is reduced by providing a protective spacer on sidewalls of a line trench. A densified trench bottom region may be additionally formed directly beneath an exposed horizontal surface of the line trench. The protective spacer and/or the densified trench bottom region protects an ultra low k intermetal dielectric layer from plasma damage during a plasma strip process that is used to remove a disposable via fill plug employed in the dual damascene metal interconnect structure. | 2010-12-23 |
20100320618 | INTERCONNECTION SUBSTRATE, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE - An interconnection substrate including: a first insulating film made of a silicon compound, an adhesion enhancing layer formed on the first insulating film, and a second insulting film made of a silicon compound and formed on the adhesion enhancing layer, wherein the first insulating film and the second insulating film are combined together with a component having a structure represented by General Formula (1) described below: | 2010-12-23 |
20100320619 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: attaching a lower integrated circuit, having a first through via, over a substrate with the first through via coupled to the substrate; mounting a pre-formed interposer, having an interposer through via and an integrated passive device, over the lower integrated circuit with the interposer through via coupled to the first through via; attaching an upper integrated circuit, having a second through via, over the pre-formed interposer; and forming an encapsulation over the upper integrated circuit and the pre-formed interposer. | 2010-12-23 |
20100320620 | ADHESIVE FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE ADHESIVE FILM - An adhesive film for a semiconductor containing an (A) ester (meth)acrylate copolymer and a (B) thermoplastic resin other than the ester (meth)acrylate copolymer, and composed so as to satisfy the following formula (1) for two hours from 10 minutes after starting measurement, in which γ represents an amount of shearing strain produced upon undergoing a shearing stress of 3000 Pa at a frequency of 1 Hz and a temperature of 175° C. on parallel plates of 20 mm in diameter, exhibits superior filling performance in surface unevenness of a substrate through an encapsulating material sealing process, despite that semiconductor chips are stacked in multiple layers in the semiconductor device and hence a wire bonding process imposes a longer thermal history. | 2010-12-23 |
20100320621 | INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH SIDE-BY-SIDE AND OFFSET STACKING AND METHOD FOR MANUFACTURING THEREOF - A method for manufacturing of an integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device. | 2010-12-23 |
20100320622 | ELECTRONIC COMPONENT BUILT-IN WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - In an electronic component built-in wiring substrate, an electronic component is mounted on a first wiring substrate. A second wiring substrate is stacked on the first wiring substrate and is connected electrically to the first wiring substrate by connection terminals. The second wiring substrate has an opening portion of a size larger than a planar area of the electronic component. An underfill resin is filled in a first space between the first wiring substrate and the electronic component, and has a raised portion which is raised along an outer peripheral side surface of the electronic component, seals a clearance between an inner peripheral edge of the opening portion and an outer peripheral edge of the electronic component and supports the second wiring substrate. A sealing resin is filled in a second space between the first and second wiring substrates. | 2010-12-23 |
20100320623 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A multi-pin semiconductor device with improved reliability. In a multi-pin BGA, a plurality of wires for electrically coupling a semiconductor chip and a wiring substrate include a plurality of short and thin first wires located in an inner position and a plurality of second wires longer and thicker than the first wires. Since resin flows in from between thin first wires during resin molding, the resin pushes out air, thereby suppressing formation of voids. The reliability of the multi-pin BGA is thus improved. | 2010-12-23 |
20100320624 | DIE PACKAGE INCLUDING ENCAPSULATED DIE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a die package including an encapsulated die, including: a die including pads on one side thereof; an encapsulation layer covering lateral sides of the die; a support layer covering the encapsulation layer and one side of the die; a passivation layer formed on the other side of the die such that the pads are exposed therethrough; and a redistribution layer formed on the passivation layer such that one part thereof is connected with the pad. Here, since one side of the die is supported by the support layer and the encapsulation layer is formed on only the lateral side of the die, the warpage of the die package due to the difference in thermal expansion coefficient can be minimized. | 2010-12-23 |
20100320625 | Carburetor with starting fuel supply mechanism - A carburetor | 2010-12-23 |
20100320626 | ENERGY-SAVING AND WIND-POWERED AERATOR - An energy-saving and wind-powered aerator includes a floating carrier ( | 2010-12-23 |
20100320627 | Optical film, method for producing the same and polarizing plate using the same - A method for producing an optical film comprising the steps of: (i) melt casting a cellulose ester resin or a cycloolefin resin by extruding melt of the cellulose ester resin or the cycloolefin resin from a die onto a roll-shaped cooling drum; (ii) cooling and solidifying the extruded melt to form a film; (iii) stretching the film in a lateral direction of the film; and (iv) winding the film in a roll, wherein the cooling drum has plural regions divided predeterminedly in an axis direction of the cooling drum, a temperature of each region being independently controlled. | 2010-12-23 |
20100320628 | Magnetic Clamp for Underwater Pelletizer - An underwater pelletizer is presented having an electromagnetic clamp that includes an electromagnetic ring body having a series of electromagnets disposed along a contact surface of the electromagnetic ring body. A clamping ring body has a series of mild steel inserts disposed along a contact surface of the clamping ring body, where each mild steel insert is disposed in a position complementary to at least one of the series of electromagnets. The electromagnetic clamp ring has a contact face with a series of electromagnets disposed therein and providing a clamping ring having a contact face with a series of mild steel inserts disposed therein, where the contact face of the clamping ring is configured to engage the contact face of the electromagnetic ring to form a seal and the mild steel inserts are positioned such that each one of the series of electromagnets is adjacent to one of the mild steel inserts when the contact faces of the electromagnetic and clamping rings are engaged. The method involves disposing the electromagnetic ring and the clamping ring between the water chamber and a die face, activating the series of electromagnets to clamp the electromagnetic ring to the clamping ring, and deactivating the series of electromagnets to gain access to the water chamber. | 2010-12-23 |
20100320629 | CERAMIC MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF - A method of manufacturing a ceramic molded product includes adding a binder mainly comprising a saccharide and water to a powder of ceramics such as silicon carbide and stirring the same to form an aqueous sludge having a fluidity, casting the sludge into an elastic die, molding the sludge while applying vibrations in a negative pressure state, solidifying the sludge by putting the die in which the sludge is cast to a temperature below freezing point for freeze-drying, and to a temperature where the binder is not frozen completely, then thawing the sludge in the negative pressure state and subliming and evaporating the water content in the binder, taking the molded product solidified in the die out of the die, further dewatering the demolded product by elevating the temperature to a temperature where the saccharide in the binder is dissolved, and then sintering the molded product. | 2010-12-23 |
20100320630 | Method For Producing A Sintered Body - This invention relates to a method for forming a three dimensional sintered body comprising the steps of a) providing a basic mould having a configuration adapted to the sintered body that is to be produced, b) treating the surface of the basic mould to facilitate application of a first surface layer of the sintered body, c) applying powder particles onto the basic mould, to form said first surface layer, d) applying at least one more layer on top of said first surface layer, e) heat treating the basic mould and the particles to form a sintered body, wherein step b) is performed by providing an adhering layer to the basic mould arranged to adhere the particles of at least a portion of the surface layer. | 2010-12-23 |
20100320631 | METHOD OF PROCESSING SUBSTRATE AND IMPRINT DEVICE - A method of processing a substrate according to an embodiment includes carrying out an imprint processing that transfer a pattern formed in a template onto a flowable material disposed on a semiconductor substrate so as to obtain a transfer pattern, and at least one processing selected from the group consisting of an inspection processing of an semiconductor substrate, an applying processing of a separating material and an inspection-cleaning processing in parallel in the same processing chamber. | 2010-12-23 |
20100320632 | ELECTRONIC CYCLE COUNTER - A monitor for maintaining a mold cycle count with an actuator sending a count signal to a processor following a mold operation. The monitor further includes a timer having an active mode and a sleep mode. The processor generates an average cycle time and an activity percentage of the mold taking into account active and sleep periods of the mold. | 2010-12-23 |
20100320633 | METHOD OF OPERATING INJECTION MOLDING MACHINE AND INJECTION MOLDING MACHINE - In an injection molding machine, dies are connected to a die temperature regulating machine by means of thermal medium supplying pipes and thermal medium returning pipes. A heat exchanger is interposed between the thermal medium returning pipes. The air which has been heated by the heat exchanger is supplied to a hopper through a hot air supplying pipe so as to preheat and dry injection material in the hopper. | 2010-12-23 |
20100320634 | Process for Producing a Hyper-Elastic, High Strength Dilatation Balloon Made From Multi-Block Copolymers - A process for producing a dilatation balloon by extruding a multiblock copolymer composition to form an extrudate comprising phase-separated glassy, rubber, and semicrystalline microdomains that are macroscopically ordered in a perpendicular alignment. The balloon formed by the process demonstrates, during inflation, a true stress vs. nominal strain response curve comprising a first zone representative of a low modulus balloon, a second zone representative of a high strength balloon, and a sharp transition from the first zone to the second zone. | 2010-12-23 |
20100320635 | METHOD FOR PRODUCING POLYMER MEMBER HAVING PLATED FILM - To provide a method for producing a polymer member having a plated film with excellent adhesion by subjecting a polymer member in which a catalyst component is dispersed by using pressurized carbon dioxide to electroless plating under ordinary pressure. A polymer member in which a catalyst component is dispersed is formed by using a pressurized fluid in which a catalyst component containing a metal which serves as a plating catalyst is dissolved in pressurized carbon dioxide; the polymer member in which the catalyst component is dispersed is immersed in an alcohol treatment liquid under ordinary pressure; and the polymer member, which has been subjected to the pretreatment with the alcohol treatment liquid, is immersed in an electroless plating solution containing an alcohol under ordinary pressure to form a plated film. | 2010-12-23 |
20100320636 | FIBER-CONTAINING THERMOPLASTIC RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME - A thermoplastic resin composition comprising (i) 55 to 95 parts by weight of a thermoplastic resin, and (ii) 5 to 45 parts by weight of a fiber containing 10 to 100% by weight of a diameter-varying fiber which has an enlarged diameter at its one or both ends; and a production process thereof comprising the steps of (1) cutting a continuous fiber under the condition that its cutting spot is heated to its melting temperature or higher, thereby preparing a diameter-varying fiber, and (2) melt-kneading a mixture containing the diameter-varying fiber and a thermoplastic resin. | 2010-12-23 |
20100320637 | METHOD OF MAKING POLYMER/NATURAL FIBER COMPOSITE PELLET AND/OR A COUPLING AGENT/NATURAL FIBER PELLET AND THE PELLET MADE BY THE METHOD - A method of making a polymer/natural fiber composite pellet and/or a coupling agent/natural fiber pellet and the pellet made by the method. The pellet is intended to be used in molded structural composites comprising thermoplastic polymers and fibers. It is produced by carding or combing the natural fibers and to form a sliver or roving therefrom, which is combined with the polymer and/or coupling agent in a melted or dissolved state. The fibers may either be dispersed in the polymer through an extrusion process or be present as an inner core surrounded by an outer sheath of polymer and/or coupling agent. | 2010-12-23 |
20100320638 | DEVICE AND METHOD FOR PRODUCING CRYSTALLINE BODIES BY DIRECTIONAL SOLIDIFICATION - The invention relates to a device and a method for producing crystalline bodies by directional solidification. The device comprises a melting furnace ( | 2010-12-23 |
20100320639 | Medical Implants with Pre-Settled Cores and Related Methods - A treatment process by which medical implants may be pre-settled before surgical implantation. Although explained herein within the context of a spinal implant, it will be appreciated that the same techniques and features of the present invention may be applied to any medical implant, particularly those having a core or other structure subject to material creep over time after implantation. This pre-settling process of the present invention may be done at any stage in the manufacturing of the implantable device after the spinal implant has been formed but before the device is surgically implanted. The pre-settling of the invention may be used for any type of core material that may have creep characteristics including, but not limited to, elastomers and textiles. | 2010-12-23 |
20100320640 | Method of Fabricating Slag Fiber Friction Material - Slag fiber is used to fabricate a friction material. Friction factor and abrasion loss of the friction material are controlled. The friction material can be used to make linings. Thus, slag fiber can be used as a replace of natural material to make a friction material, and waste is thus recycled. | 2010-12-23 |
20100320641 | PROCESS TO OBTAIN BASIC CONSTRUCTION ELEMENTS FORMED BY CEMENT AND RESIDUAL MATERIAL - A process for obtaining basic construction elements formed by cement and residual material for building basic artifacts for civil construction, involving, cement aggregated to mineral residues, the process includes the following steps: accumulation of raw material: formed by cement material found in nature or derived from mining and industrial processes and in this case, there is no single field; homogenization or mixture: is performed manually or by machinery, such as front-end loaders, according to percentage of each raw material used, obtaining an unique and homogenous plaster; disintegration of raw material such as cement, lamination, homogenization, involving specific machinery with a new purge of residual rejects and finally, a temporary bulk storage. | 2010-12-23 |
20100320642 | APPARATUS AND METHOD FOR TAKING UP, POSITIONING AND DRAPING DRY TEXTILE FIBER SEMI-FINISHED PRODUCTS - The invention relates to an apparatus ( | 2010-12-23 |
20100320643 | REEL - A reel comprising: a hub on which a recording tape is wound; and a pair of flanges provided at both end portions of the hub respectively, and holding transverse direction end portions of the recording tape, wherein the hub is reinforced by a reinforcing ring, and at a time of release from a mold which molds the hub, an entire region of an end surface of the reinforcing ring is pushed, is provided. | 2010-12-23 |
20100320644 | Device for Injection a Strand of a Paste-Like Mass into the Intermediate Space between Glass Panes of an Insulated Glass Pane - A device for injecting a strand of a paste-like mass, which is formed from a plurality of constituents, into the intermediate space between two glass plates of an insulated glass pane. The device includes a nozzle having a storage unit for each of the constituents of the paste-like mass, which is connected to the nozzle by means of a supply path, in which provision is made for a dynamic mixer. | 2010-12-23 |
20100320645 | DUAL ZONE TEMPLATE CHUCK - A template chuck includes multiple zones to provide 1) an imprint bend optimized to provide high curvature and provide contact at middle radius of substrate and/or, 2) separation bend zone with an increased free span zone and high crack angle. | 2010-12-23 |
20100320646 | MOLDING SYSTEM AND MOLDED-IN-COLOR PANEL - In one embodiment, a molding system for creating a molded-in-color panel has a first mold member with a first forming surface for forming a portion of a panel with an exposed surface. The molding system has a second mold member having a second forming surface for forming a concealed portion of the panel. One of the first and second mold members is translatable relative to the other to collectively receive a heated molded-in-color resin to form the panel. The molding system has an injector for injecting molded-in-color resin into the mold. The second forming surface is sufficiently smooth so that the exposed surface of the panel is free of visible flow lines. | 2010-12-23 |
20100320647 | SYNTHETIC LOADBEARING COLLAGEN-MINERAL COMPOSITES USEFUL FOR SPINAL IMPLANTS, AND METHODS OF MANUFACTURE - Described are intervertebral spinal implants that include a biocompatible load bearing composite comprised of a particulate mineral material and collagen and having a wet compressive strength of at least about 200 N/cm | 2010-12-23 |
20100320648 | LAYERWISE PRODUCTION METHOD AND ILLUMINATION SYSTEM FOR USE THEREIN - An illumination system for use in a system ( | 2010-12-23 |
20100320649 | METHOD AND DEVICE FOR THE PRODUCTION OF A THREE-DIMENSIONAL OBJECT MADE OF A MATERIAL WHICH CAN BE COMPACTED - The invention relates to a method and a device according to rapid technology for the production of a three-dimensional object made of a powdery material, which can be compacted, wherein additional temperature control is carried out in the available space by passing a temperature-controlled fluid through the powder. | 2010-12-23 |
20100320650 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, MOLDED OBJECTS, AND PROCESS FOR PRODUCING HEAT-SHRINKABLE TUBE - An adhesive composition comprising 100 parts by weight of a fluorine-containing polymer and 2 to 30 parts by weight of an unsaturated compound containing at least one polar group selected from the group consisting of an epoxy group and a carboxyl group, wherein the fluorine-containing polymer has been graft-modified with the polar group-containing unsaturated compound by irradiation of ionizing radiation, a production process thereof, and formed products such as a heat-shrinkable tube equipped with a layer composed of the adhesive composition. | 2010-12-23 |
20100320651 | MANIFOLD-TYPE DIE FOR THE PRODCUTION OF A MUTILAYER BLOWN FILM - The invention describes a blow head ( | 2010-12-23 |
20100320652 | Methods of Making Particulates for Use in Subterranean Applications - Among the methods described herein are methods of making a low-specific gravity particulate including the steps of: (a) providing combustion products of carbonaceous materials comprising silica and an aluminum oxide, (b) mixing the combustion products with a binder to create a pelletizable mixture; (c) pelletizing the combustion products of carbonaceous materials to create a pellet, and (d) sintering the combustion products of carbonaceous materials to create a particulate comprising silica and an aluminum oxide in an amount of about 0.1% to about 25% by weight and having at least one void, a specific gravity of less than about 2.2, a particle size of 8 U.S. Mesh or smaller, and a substantially spherical shape. | 2010-12-23 |
20100320653 | TUYERE STRUCTURE OF MELTING FURNACE - A tuyere structure of a melting furnace includes: a tuyere main body which is covered on an outer periphery thereof with a ring member baked in advance, and is disposed in a hole portion provided in a tuyere brick; and a ramming material which fills a periphery of the ring member so as to fix the ring member. | 2010-12-23 |
20100320654 | TAP HOLE PLUG GUN - The embodiments of the invention relate to a tap hole plug gun for metallurgical furnaces, having a pressure cylinder for receiving the plugging compound, which has a closable filling opening for the plugging compound, and having a plugging piston for pressing the plugging compound out from a mouthpiece of the pressure cylinder pressed against the tap hole of a furnace. The pivotable safety flap for closing the filling opening of the pressure cylinder for the plugging compound is equipped with a stop, which is pivoted into the cylinder chamber of the pressure cylinder upon opening of the flap to decelerate an unintentional forward stroke of the plugging piston for pre-compression and expulsion of the plugging compound, and is pivoted out of the cylinder chamber upon closing of the safety flap. | 2010-12-23 |
20100320655 | Shock absorber - A shock absorber that absorbs a vibration using a working fluid charged into a first chamber and a second chamber comprises a tube body, an inserted body, a tip end of which is inserted into the tube body from an end portion of the tube body, and a partition wall portion that is provided on the tip end of the inserted body to be capable of sliding within the tube body and partitions an interior of the tube body into the first chamber and the second chamber. The shock absorber comprises a connecting portion that is provided within a partition wall portion sliding region of the tube body and connects the first chamber and the second chamber when the partition wall portion passes thereby. | 2010-12-23 |
20100320656 | SPRING SYSTEM, IN PARTICULAR FOR BICYCLES - A spring system in particular for bicycles includes a gas suspension spring with adjustable progression and a housing element for movably receiving the suspension piston of the gas suspension spring. The gas suspension spring has a spring volume including a first spring chamber and at least a second spring chamber separated from one another by a partitioning member. The first spring chamber is arranged within the housing element and the second spring chamber extends internal of the housing portion consecutive to the housing element. | 2010-12-23 |
20100320657 | GAS SPRING AND DAMPER ASSEMBLY - A gas spring and damper assembly includes a damper and a gas spring. The damper includes a damper housing and a damper rod. The gas spring includes a first end member, a second end member and a flexible wall operatively connected therebetween. A friction-reducing element is operatively connected between the damper housing and the second end member. A sealing element is operatively disposed between the damper housing and the second end member such that a substantially fluid-tight seal is formed therebetween. | 2010-12-23 |
20100320658 | Apparatus for changing a leaf spring characteristic - The invention relates to an apparatus for changing a spring characteristic, which includes at least one tension and/or compression spring for changing the spring rate of a leaf spring to which the apparatus can be connected, wherein a mounting device for mounting the tension and/or compression spring on the leaf spring is connected to a first end of the tension and/or compression spring. | 2010-12-23 |
20100320659 | PLATE SPRING FOR A VOICE COIL MOTOR - A plate spring includes an internal surrounding portion, an external surrounding portion, and a plurality of suspending arms. The external surrounding portion surrounds the internal surrounding portion and is spaced apart from the internal surrounding portion. The suspending arms interconnect the internal surrounding portion and the external surrounding portion. Each of the suspending arms includes a first connecting segment, a second connecting segment, and a working segment. The first connecting segment is connected to the external surrounding portion and extends inwardly. The second connecting segment is connected to the internal surrounding portion and extends outwardly. The working segment interconnects the first and second connecting segments and is formed with a plurality of hole portions which are spaced apart from each other. | 2010-12-23 |
20100320660 | Spring assembly and manufacturing method therefor - According to one embodiment, a spring assembly includes: a substrate; a coil spring having an end turn portion fixed to the substrate; an inner wall provided at an inner peripheral side of the coil spring; and an outer wall provided at an outer peripheral side of the coil spring, wherein one of the inner wall and the outer wall forms a spring fixing wall configured to prevent the end turn portion of the coil spring from coming off in an axial direction of the coil spring, and wherein the other of the inner wall and the outer wall forms a support wall configured to prevent the end turn portion of the coil spring from moving in a radial direction of the coil spring. | 2010-12-23 |
20100320661 | THERMOCOMPENSATED SPRING AND METHOD FOR MANUFACTURING THE SAME - The invention relates to a method ( | 2010-12-23 |
20100320662 | COIL SPRING FOR VEHICLE SUSPENSION AND METHOD FOR MANUFACTURING THE SAME - A spring wire with hardness of 50 to 56 HRC is subjected to first and second shot peening processes within a warm working temperature range of 150 to 350° C. In the first shot peening process, the first shot of a shot size of 1.0 mm or more is used. In the second shot peening process, the second shot smaller in shot size than the first shot is used. Through these shot peening processes, compressive residual stress is imparted to the spring wire. The spring wire includes a residual stress increase part, residual stress peak part, and residual stress decrease part. In the residual stress decrease part, a part including the compressive residual stress magnitude of which is equivalent to the magnitude of the compressive residual stress at the surface of the spring wire exists at a position at a depth exceeding the permissible pit depth. | 2010-12-23 |
20100320663 | Clamping Apparatus - A clamping apparatus is disclosed including a first handle defining a hole, a magnet affixed to the first handle, and a movable jaw coupled to the first handle and a second handle, the jaw comprising two clamp segments. The apparatus further includes a magnet contacting element disposed on a release lever on the second handle, wherein pressure is applied to release the release lever from contacting the magnet in an open position. | 2010-12-23 |
20100320664 | CLAMP DEVICE - A clamp device includes a grip member, a clamp rod, and a hydraulic cylinder, and, by the grip member being inserted into an hole in a workpiece, it can grip the inner circumferential surface of the hole. The clamp device is provided with: a main body member; seating surfaces formed upon the main body member, upon which the workpiece is seated; a seating sensor that includes a pressurized air ejection hole opening to the seating surfaces; and a workpiece mounting surface that can receive and stop a workpiece at a position that is more advanced than the seating surfaces when the grip member is at an advanced position (its unclamped state), and that shifts together with the grip member during clamp operation when the grip member and the clamp rod shift towards retraction. | 2010-12-23 |
20100320665 | ARROW FLETCHING DEVICE WITH PLATE CLAMP - An arrow fletching device with plate clamp, as well as features and aspects thereof, provides an arrow builder the means to accurately and repeatedly position fletching against the shaft of an arrow, without a spring loaded butterfly clamp component, and securely hold the fletching thereto until a bond is attained between the fletching and arrow shaft via an adhesive. Exemplary embodiments of an arrow fletching device with a plate clamp are, generally, jig apparatuses operable to precisely position an arrow shaft relative to an arrow fletching. More particularly, exemplary embodiments of an arrow fletching device comprise a plate component, in lieu of a spring-loaded butterfly clamp, useful for receiving, positioning and retaining fletching against the shaft of an arrow. Advantageously, the use of a plate component with a specifically profiled slot operable to receive and position a fletching reduces the steps required to adhere a fletching to an arrow shaft as well as mitigates the probability of improper installation of the fletching. | 2010-12-23 |
20100320666 | HIGH-DENSITY FIXTURE VISE - A multi-station machine vise that is disclosed herein that utilizes soft jaws, which are symmetrical and machineable on all four sides. The jaws being identical in size and configuration makes them interchangeable/usable on any vise station, which results in reduced operating costs. The movable jaws are precisely located and fastened to the vise utilizing a jaw carrier, which incorporates a pull-down action to eliminate jaw lift. The jaw carrier includes a downwardly positioned wedge design that engages a corresponding wedge on a slide that moves the jaw carrier and the jaw. Incorporating the pull-down mechanism into the jaw carrier disposed between and slide and the jaw allows for simplifying the design and manufacture of the jaws. | 2010-12-23 |
20100320667 | DEVICE FOR POSITIONING COMPONENTS - A device for positioning components, in particular for use in bodymaking of the motor vehicle industry, is provided with a rotatable receiving plate ( | 2010-12-23 |
20100320668 | Machine Tool - A machine tool ( | 2010-12-23 |
20100320669 | CLAMP LOCKING MECHANISM IN DEVICE FOR WELDING PLASTIC TUBES - A device for welding plastic tubes includes a laterally movable tube holder having tube holding areas and a laterally fixed tube holder having tube holding areas. Each tube holder includes clamping structure for clamping each tube placed in the respective tube holder areas and for creating a fluid free area. A spring mechanism urges the laterally movable tube holder toward the laterally fixed tube holder to maintain the clamp faces flush against each other. A clamp locking mechanism is provided to supplement the action of the spring mechanism by maintaining the clamp faces flush against each other during the loading of the tubes. | 2010-12-23 |
20100320670 | MATERIAL-SAVING AND ENERGY-SAVING MULTIFUNCTIONAL BENCH CLAMP - A material-saving and energy-saving multifunctional bench clamp includes a movable clamp body, a fixed clamp body and a transmission pair of a screw and a nut. The fixed clamp body is provided with a holding accessory and a retractable locating-guiding device. The movable clamp body is made up of a left part and a right part. The left part is provided with two work heads, each head includes holding members, which form a holding assembly together with the accessories installed on the fixed clamp body. At least two axially locating-guiding key grooves are shaped on the cylinder guide rail of the right part and positioned the corresponding work heads of the left part. The bench clamp not only reduces processing surfaces and costs, but also saves about 30% material of clamper body under the same standard size and rated clamp force by comparison to the old multifunctional bench clamp. | 2010-12-23 |
20100320671 | SHEET PROCESSING APPARATUS AND IMAGE FORMING APPARATUS - Provided is a sheet processing apparatus including a gripper unit which is moved to a retreat region along long grooves in advance when moving a stapler unit to any one of first and second binding positions. The stapler unit is moved to the binding position by being guided by a guide rail portion while passing above the long grooves. Therefore, moving operations of both of the gripper unit and the stapler unit can be smoothly performed under a state in which movement of both thereof is not prohibited by the long grooves and the guide rail portion. Further, an image forming apparatus including the sheet processing apparatus is provided. | 2010-12-23 |
20100320672 | Sheet folding device and post-processing apparatus and image forming system comprising the same - A sheet folding device includes a sheet guide for holding a sheet bunch, a folding roll device having a first folding roll and a second folding roll, a folding blade inserting the sheet bunch supported on the sheet guide to a nip position between the first and second folding rolls, and a blade driving device for moving the folding blade from a standby position to the nip position on the folding rolls. The sheet guide has a curved guide section supporting the sheet bunch and an outlet guide section connected to the curved guide section to guide the sheet bunch to the folding rolls. The curved guide section has a curved guide plate supporting the sheet bunch so that the sheet bunch rolls back toward the folding roll device. The outlet guide section includes a pair of opposite guide plates in folding the sheet bunch by the folding blade. | 2010-12-23 |
20100320673 | SHEET POST-PROCESSING DEVICE - A sheet post-processing device includes a stacker for stacking and storing sheets therein, a feeder for receiving sheets and feeding the sheets toward the stacker, a folder for folding a set of sheets stored in the stacker, a preparatory processor, which is located upstream from the folder, for processing sheets preparatory to folding of a set of sheets, a presser for pressing the set of sheets stored in the stacker at a portion processed by the preparatory processor so as to push the set of sheets into the folder, and a controller for controlling the stacker, the feeder, the folder, the preparatory processor and the presser. The controller controls the preparatory processor not to process a sheet that will be an outermost sheet of a folded set of sheets. | 2010-12-23 |
20100320674 | SHEETS COUNTING DEVICE - A paper sheet counting apparatus includes a hopper; a transport mechanism that feeds the paper sheets to a transport path one by one, and transports the paper sheets along the transport path; a sensing unit including a counting sensor for counting the paper sheets; and a stacker. The transport mechanism includes a drive roller constituting an inside of a turn portion for changing a direction of the transport path; pinch rollers that biases the paper sheet against the drive roller; and a turn guide plate arranged between the pinch rollers to guide the paper sheet along an outer periphery of the drive roller. The turn guide plate is formed such that a front edge of the paper sheet transported to the turn portion is guided to a contact portion between a pinch roller arranged on a downstream side and the drive roller. | 2010-12-23 |
20100320675 | AUTOMATIC PAPER SUPPLY APPARATUS FOR PAPER SHREDDER - Disclosed is an automatic paper supply apparatus for a paper shredder, which can shred stapled paper sheets regardless of the volume or thickness of the paper sheets to be shredded. The automatic paper supply apparatus includes a paper loading stand for loading paper sheets to be shredded, the paper sheets being loaded while facing the shredding part; a supporting jaw installed at a front end of the paper loading stand so as to keep and support the paper sheets to be shredded; a lifting board included in the paper loading stand in such a manner that the lifting board can be rotated toward an upper direction; a feed sensor which is positioned at a lower part of the lifting board so as to sense if paper sheets to be shredded are supplied; a feed roller positioned at an upper part of the lifting board, the feed roller being driven when the feed sensor senses paper sheets so as to carry the paper sheets to be shredded to the shredding part; a pressing spring which elastically supports the lifting board and allows the paper sheets to be shredded, which has been put on the paper loading stand, to face the feed roller of an upper part of the paper shredder; and a catching board which is positioned above an upper part of the paper loading stand while being spaced from the paper loading stand, and allows a sheet of paper at an upper layer of stapled paper sheets to be released from the stapled part of the paper sheets. The present invention can shred stapled paper sheets without need to previously remove the staple thereof, increases the user's safety, and prevents damage to the apparatus. | 2010-12-23 |
20100320676 | System and Method for Monitoring Image Forming Machine Media Stack Height and Method of Calibrating Stack Height Sensing in the Monitoring System - A system and method for monitoring media stack height utilizes a pick mechanism and stack height sensing mechanism. The pick mechanism has a pick arm and a pick roller, the arm rotatably mounted at one end to pivot about an axis and change its angular position relative thereto. The roller rotatably mounted to an opposite end of the arm contacts a media stack top and is rotatably driven to feed sheets one at a time from the stack top changing the stack height. The angular position of the arm relative to the stack changes as the stack height changes. The stack height sensing mechanism arranged on and adjacent to the arm senses arm angular displacement as the stack height changes to provide an indication of the sheet quantity remaining in the stack. A method for calibrating stack height sensing of the monitoring system provides one or more calibration points such as at “full stack” and “stack out” conditions. | 2010-12-23 |
20100320677 | SEGMENTED RIGID PLATE BELT TRANSPORT WITH A HIGH MOTION QUALITY DRIVE MECHANISM - A vacuum transport includes a segmented, rigid or solid articulated belt combined with a vacuum plenum in each segment of the belt. Using a rigid segmented belt with a vacuum plenum connected to each segmented belt section eliminates ordinarily encountered drag friction in conventional vacuum transports by reducing the force necessary to move the belt with media thereon while simultaneously improving the motion quality of the move by driving the articulated rigid belt from the top side of the belt in a flat section. | 2010-12-23 |
20100320678 | PAPER SHEET IDENTIFYING/COUNTING APPARATUS AND PAPER SHEET IDENTIFYING/COUNTING METHOD - A bank note identifying/counting apparatus | 2010-12-23 |
20100320679 | SHEET STACKING APPARATUS - A sheet stacking apparatus includes a stack unit which includes a first stack tray and a second stack tray which can be individually elevated and is configured to stack a sheet on at least one of the first stack tray and the second tray, and a control unit configured to control the stack unit to stack the sheet in a first stack mode in which the sheet is stacked on at least one of the first stack tray and the second stack tray without being extended over the first stack tray and the second stack tray and a second stack mode in which the sheet is stacked on across the first stack tray and the second stack tray, the control unit capable of selecting the first stack mode and the second stack mode with respect to a same size sheet. | 2010-12-23 |
20100320680 | METHOD AND APPARATUS FOR PRINTED MEDIA STACK MANAGEMENT IN AN IMAGE PRODUCTION DEVICE - A method and apparatus for printed media stack management in an image production device is disclosed. The method may include determining if a media stacker device has been removed from a finishing module during a print job, wherein if it is determined that the media stacker device has been removed from the finishing module during a print job, moving one or more media path selection devices to enable the printed media to be stacked onto a media stacking tray, determining if the media stacker device has been returned to the finishing module, wherein if it is determined that the media stacker device has been returned to the finishing module, moving the one or more media path selection devices to enable the printed media to be stacked onto the media stacker device. | 2010-12-23 |
20100320681 | SHEET POST-PROCESSING APPARATUS - A sheet post-processing apparatus of the present invention comprises: a sheet discharge section that feeds a sheet supplied from an image forming apparatus to a post-processing section and leads the sheet that has passed through the post-processing section to a sheet discharge port; a sheet discharge tray that receives a sheet discharged from the sheet discharge port and can move to a first standby position and a second standby position higher than the first standby position and nearer to the sheet discharge port; and a controller that controls the height position of the sheet discharge tray by identifying the type of the sheet. The controller changes the height position of the sheet discharge tray to allow the sheet discharge tray to receive the discharged sheet at the first standby position in the case where the sheet is a first type while to receive the discharged sheet at the second standby position in the case where the sheet is a second type. | 2010-12-23 |
20100320682 | Flick and Jump Magnetic Games - A toy action game where magnetic sticks work by maneuvering magnetic vehicles and riders from underneath a theme park constructed with minimal thickness, making the vehicles and riders look like they are moving under their own power. The vehicles and riders can be dragged around slowly and smoothly or can be flicked off a jump or towards a target with tremendous speed and are capable of launching over a hundred scale feet of air then landing and rolling it out. The magnetic sticks and jump plates are the key to the vehicle and rider's speed and accuracy. | 2010-12-23 |
20100320683 | MAGNETIC SPINNER - A spinner anchors to a variety of magnetic and non-magnetic surfaces. The spinner includes a base, a spinner arm rotatably coupled to the base, and an indicator coupled to the spinner arm. The base of the spinner is shaped to receive a coupling member, such as a cylindrical magnet, configured to anchor the spinner to a plurality of surfaces regardless of their orientation and maintain its location relative to the support surface while the spinner arm and indicator rotate. | 2010-12-23 |
20100320684 | PLAYING CARDS SHUFFLING AND DEALING MACHINE - The invention presents a methodology and device for distribution of playing cards. Automatic operation without manual intervention is its main theme. This eliminates the likely manipulations, monotony, errors associated with manual handling of playing cards. The device has provision of conventional automatic shuffling prior to distributing. Playing cards shuffled in more elaborate manner by other suitable devices also can be used on the invented device. There are many user friendly features of the invented device. These include compact size, portability, ease of operation and maintenance, adaptability to any card games. Optional operation of this device by a remote control enhances its utility Standard playing cards of Bridge or Poker size can be used with this device. The invented device is said to be useful to group of players in homes, club houses, casinos and at out-doors. | 2010-12-23 |
20100320685 | DEVICE AND METHOD FOR CONTINUOUSLY SHUFFLING AND MONITORING CARDS - The present invention provides an apparatus and method for moving playing cards from a first group of cards into a second group of cards, wherein the second group of cards is randomly arranged or shuffled. The apparatus comprises a card receiver for receiving the first group of cards, a single stack of card-receiving compartments generally adjacent to the card receiver, the stack generally vertically movable, an elevator for moving the stack, a card-moving mechanism between the card receiver and the stack for moving cards one at a time into a selected one of the compartments, another card moving mechanism for moving cards from one of the compartments to a second card receiver and a microprocessor that controls the card-moving mechanisms and the elevator. A count of cards within specified areas of the card handling system is maintained and card handling is halted and all cards counted by adding a count of all cards not within the specified areas to the total of cards counted within the specified areas. | 2010-12-23 |
20100320686 | PUZZLE WITH THREE DIMENSIONAL REPRESENTATION OF GEOGRAPHIC AREA - A puzzle kit for assembly into a three dimensional representation of a geographic region includes first pieces that form a first layer, second pieces that form a second layer on top of the first layer, and structure pieces mounted on the first and/or second layers. The first and second layers can include retaining elements for retaining the structure pieces. The retaining elements can take the form of voids. The first layer can include image elements visible through the voids of the second layer, and the image elements can include indicia to match the voids with the structure pieces. The first pieces can include anchoring pieces that are elevated and interlock with the second layer. The structure pieces can be sequentially assembled on the first and/or second layers according to an index. The assembled puzzle can represent a city, and the structure pieces can represent buildings within the city. | 2010-12-23 |
20100320687 | Board Game Apparatus and method - A game having a board and playing positions occupied by playing pieces of individual players. Upon accomplishing a designated criteria for covering different playing positions a player may win the game by crowning another player. | 2010-12-23 |
20100320688 | GAME KIT - There is provided a game kit comprising (i) a plurality of game pieces, the pieces comprising at least two faces and the faces comprising at least one symbol thereon; and (ii) a holder comprising at least one holding section for holding the game pieces in such a manner that when at least one of the game pieces is inserted in the holding section, the holding section is effective for hiding at least one symbol of the at least one of the game pieces. | 2010-12-23 |
20100320690 | Backgammon-based table game or electronic game - A wagering table game based on backgammon is played in which a player wagers on outcomes against a dealer. A backgammon-type board is provided to at least one player that has fewer than 24 position points on the board. Each of the player and dealer are provided with fewer than 15 game pieces. Randomly generated numbers are used to allow players to move player pieces and cause the dealer to move pieces according to fixed rules. A player places a wager against a paytable, odds are paid out on player winning events, and player winning events are determined by removal of all player game pieces from the game board by movement of player game pieces on the game board. | 2010-12-23 |
20100320691 | APPARATUS, SYSTEM, METHOD, AND COMPUTER PROGRAM PRODUCT FOR DETECTING PROJECTILES - An exemplary embodiment of the present invention sets forth an apparatus for registering a scoring event. The apparatus includes a target having a surface; a sensor, positioned in proximity to the target, adapted to detect the occurrence of a scoring event caused by the presence of a projectile in the scoring area and to determine a trajectory of the projectile; a time tracking device adapted to keep track of time of the scoring event; a location sensing device adapted to identify a location of the apparatus; a true north detection device adapted to detect the direction of true north with respect to the surface of the target; and a controller, coupled to the sensor and the true north detection device. | 2010-12-23 |
20100320692 | BAG TOSS GAME - The present invention to a novel bag toss game comprises the elements of darts and bag toss with new elements not found in either game. A number of toss compartments form the target board and one throws bags into compartments of different size and distance while gathering points based on these parameters. | 2010-12-23 |
20100320693 | Projectile Trap Material With Improved Trapping Behavior For Projectiles - A projectile trap composition comprising 10% to 100% by weight of metallocene polyolefin wax and/or its derivatives. The projectile trap composition of the present invention has high permeability for projectiles with self-healing behavior and it effects the complete deceleration of impacting projectiles in a system of different plates and in some instances additionally a section of projectile trap composition granules. | 2010-12-23 |
20100320694 | APPARATUS, METHOD, AND SYSTEM FOR SEALING AN OBJECT OR A PLURALITY OF OBJECTS IN AN ASSEMBLY AND SEALING SAID ASSEMBLY AROUND AN APERTURE - An apparatus, method, and system for sealing around an aperture in an enclosure; the aperture through which a plurality of wires, wire harness, or other objects, must pass. Injection of sealant into an assembly secured to the enclosure and about the wires, wire harness, or other objects ensures the components housed in the enclosure may be sealed against adverse effects while not limiting useful connection of the wires contained within the assembly to the enclosed components. | 2010-12-23 |
20100320695 | ANNULAR SEAL - A seal assembly capable of low temperature service is disclosed. It features upper and lower metallic backup rings that are specially shaped to act as a spring to keep the sidewalls of such rings in contact with the inside and outside surfaces to be sealed to prevent extrusion of the seal material even in low temperature situations. Inner and outer grooves are provided. O-ring seals, used for the ID of the seal, are manufactured to have a slightly greater diameter than the groove into which they will be installed. The greater length provides stored energy to promote sealing functionality in cold temperature situations. The O-rings used for the OD of the seal are manufactured to have a slightly smaller diameter than the groove into which they will be installed. The shorter length provides stored energy to promote sealing functionality in cold temperature situations. | 2010-12-23 |
20100320696 | SEAL ARRANGEMENT - The invention relates to a sealing arrangement for a non-hermetic seal of a gap ( | 2010-12-23 |
20100320697 | LEAF SEAL DEVICE - The present invention provides a leaf seal device which is available to assemble easily and to control and to set an inclination angle and a space of a sealing section. In the leaf seal device of the present invention, a connection holding section | 2010-12-23 |