Class / Patent application number | Description | Number of patent applications / Date published |
156714000 | Gripping and pulling work apart during delaminating | 31 |
20120211173 | LABEL EJECTION DEVICE - The invention relates to a label ejection device ( | 08-23-2012 |
20120234498 | Carpet Removal Device and Method of Using the Same - An apparatus for removing carpet including: a base; a hoist engaged with the base; a resilient line with first and second ends, wherein the first end is engaged with the hoist; a carpet gripping means removably engaged with the second end of the resilient line; and at least one friction surface engaged with a bottom of the base for holding the base in position. Further, a method for removing carpet comprising: the apparatus for removing carpet; moving the apparatus into position; engaging carpet to be removed with the carpet gripping means; and utilizing the hoist and resilient line to pull the carpet gripping means in order to remove the carpet. | 09-20-2012 |
20130174987 | APPARATUS AND METHOD FOR REMOVING A CMP PAD FROM A PLATEN - A method and apparatus for removing a pad adhesively secured to a platen. The apparatus includes a barrel assembly having a clamp assembly fixedly attached to a perimeter of the barrel assembly; a rotatable handle assembly nested within the barrel assembly; and a ratchet assembly nested between the handle assemble and the barrel assembly the ratchet assembly configured to engage the rotatable handle assembly. | 07-11-2013 |
20130255889 | Method For Detaching A Semiconductor Chip From A Foil - A method for detaching a semiconductor chip from a foil uses a die ejector comprising plates having a straight supporting edge and an L-shaped supporting edge comprises:
| 10-03-2013 |
20130319620 | BOARD SEPARATION APPARATUS AND OPERATING METHOD THEREOF - A board separation apparatus and an operating method thereof are provided. The board separation apparatus includes a board separation machine and a composite board constituted of a plurality of circuit boards and carrier panels. The board separation machine includes a frame, first and second suction devices, and a linkage. The second suction device is positioned above the first suction device, and the composite board is placed in between the suction devices. The linkage connects the driving mechanism and second suction device. A separable interface layer is located in the composite board. When the suction devices are powered up to stick to the top and the bottom surfaces of the composite board, the linkage is pushed by the driving mechanism, so that the second suction device can move in relation to the first suction device, and one of the circuit board is separated from another one of the carrier panels. | 12-05-2013 |
20140020847 | BENDABLE CARRIER MOUNT, DEVICE AND METHOD FOR RELEASING A CARRIER SUBSTRATE - A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the product substrate. | 01-23-2014 |
20140150980 | PEELING APPARATUS, PEELING SYSTEM AND PEELING METHOD - Provided is a peeling apparatus including a first holding unit, a second holding unit, and a peeling inducing unit. The first holding unit holds a first substrate of a superimposed substrate in which the first substrate and a second substrate are bonded. The second holding unit holds the second substrate of the superimposed substrate and moves the second substrate in a direction of separating the second substrate from a surface of the first substrate. The peeling inducing unit forms an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate. The peeling inducing unit includes a sharp member, and a moving mechanism that moves the sharp member toward a side surface portion of the second substrate adjacent to a bonding portion of the first substrate and the second substrate in the side surface of the superimposed substrate. | 06-05-2014 |
20140150981 | PEELING APPARATUS, PEELING SYSTEM AND PEELING METHOD - Provided is a peeling apparatus includes a first holding unit, a second holding unit, and a peeling inducing unit. The first holding unit holds a first substrate of a superimposed substrate in which the first substrate and a second substrate are bonded. The second holding unit holds the second substrate of the superimposed substrate and moves the second substrate in a direction of separating the second substrate from a surface of the first substrate. The peeling inducing unit forms an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate. The second holding unit includes a first suction and moving unit and a second suction and moving unit. The first suction moving unit sucks and moves a circumferential edge portion of the second corresponding to the area formed by the peeling inducing unit, in a direction of separating the circumferential edge portion from the surface of the first substrate. The a second suction and moving unit sucks and moves a region which is closer to a central portion of the second substrate than to the circumferential edge portion of the second substrate, in a direction of separating the region from the surface of the first substrate. | 06-05-2014 |
20140251548 | METHOD FOR IMPROVING SURFACE QUALITY OF SPALLED SUBSTRATES - A compliant material is formed between a base substrate and a support structure prior to performing a controlled spalling process. By positioning the compliant material between the base substrate and the support structure, the localized effects of surface perturbations (particles, wafer artifacts, etc.) on spalling mode fracture can be reduced. The method of the present disclosure thus leads to improved surface quality of the spalled material layer and the remaining base substrate. Moreover, the method of the present disclosure can reduce the density of cleaving artifacts. | 09-11-2014 |
20140352892 | SUBSTRATE SEPARATION APPARATUS AND METHODKASN03436 US - Provided are a substrate separation apparatus and method. The substrate separation apparatus includes: an upper transfer part which fixes the upper substrate and transfers the upper substrate in a positive X-axis direction in an XY coordinate system composed of an X axis and a Y axis intersecting each other; and a lower transfer part which is installed under the upper transfer part with a gap therebetween and fixes and transfers the lower substrate, wherein the lower transfer part includes: a lower holding unit on which the lower substrate is placed; and a lower guide unit which includes path guides for guiding movement of the lower holding unit, wherein the path guides include a first path guide which is parallel to the X axis and a second path guide which is continuous with the first path guide and contacts a straight line having a negative slope in the XY coordinate system. | 12-04-2014 |
20150059987 | PROCESSING APPARATUS AND PROCESSING METHOD OF STACK - A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack. | 03-05-2015 |
20150101758 | PEEL-OFF APPARATUS, PEEL-OFF SYSTEM, PEEL-OFF METHOD AND COMPUTER STORAGE MEDIUM - Disclosed is a peel-off apparatus comprising: a first holding unit configured to hold a first substrate of a superimposed substrate; a second holding unit configured to hold a second substrate of the superimposed substrate; and a moving unit configured to move a part of outer periphery of the first holding unit to be separated from the second holding unit. The first holding unit includes: a plate type elastic member connected to the moving unit; and a plurality of adsorbing units provided in the elastic member to adsorb the first substrate. An outer periphery adsorbing unit which becomes a peel-off beginning point includes: a pad member whose adsorbing surface of the first substrate is open to form a hollow portion; and a support member fitted into the hollow portion of the pad member having a hardness higher than that of the pad member. | 04-16-2015 |
20150343755 | PEELING DEVICE, PEELING SYSTEM AND PEELING METHOD - A peeling device which peels a superposed substrate obtained by bonding a first substrate and a second substrate together, from one end portion of the superposed substrate toward the other end portion thereof, includes a first holding unit configured to hold the first substrate of the superposed substrate, a second holding unit configured to hold the second substrate of the superposed substrate, and a moving unit configured to move the first holding unit away from the second holding unit. The moving unit is configured to move in at least a peeling direction of the superposed substrate. | 12-03-2015 |
20150351294 | TAPE FEEDER AND TAPE FEEDING METHOD FOR CHIP MOUNTER - A tape feeder for a chip mounter, the tape feeder including: a tape support unit extending along a moving direction of a carrier tape to which a cover tape is separably attached, and contacting a top surface of the carrier tape; a separation unit separating a first side portion of the cover tape in a lengthwise direction; a bending guide unit guiding the first side portion of the cover tape separated from the carrier tape such that the first side portion of the cover tape separated from the carrier tape is bent and away from the separated portion of the carrier tape; and a folding guide unit folding the first side portion over a second side portion of the cover tape to drop the first side portion downward. | 12-03-2015 |
20150375495 | CLAMPING APPARATUS FOR CLEAVING A BONDED WAFER STRUCTURE AND METHODS FOR CLEAVING - Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed. The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave. | 12-31-2015 |
20160378230 | PROTECTIVE MEMBRANE STRUCTURE AND METHOD OF REMOVING MEMBRANE - A protective membrane structure is configured to protect a pan& module. The protective membrane structure includes a main body, an adhesive member, and a pulling member. The main body is attached to the panel module. The adhesive member is disposed on the main body. The pulling member is located over the main body and has an adhesive portion and a warping portion connected to each other. The adhesive member is adhered between the main body and the adhesive portion. The warping portion warps away from the main body. | 12-29-2016 |
156715000 | Using roller for delamination (e.g., roller pairs operating at differing speeds or directions, etc.) | 8 |
20120312481 | METHOD AND APPARATUS FOR PEELING PROTECTION FILM FOR FLAT DISPLAY PANEL - An apparatus for removing a protective film for a flat display panel includes a laser oscillating member configured to be disposed over the protective film, the protective film attached to a surface of the flat display panel, the laser oscillating member configured to cut the protective film into a plurality of division regions by irradiating a laser beam; a separation member configured to peel at least one of the plurality of division regions from the flat display panel; a spacer member configured for insertion between the protective film and the at least one division region to be peeled from the flat display panel; and an adhesive member configured for attachment to a surface of the division region opposite the spacer member on the division region, the spacer member and the adhesive member being configured to move in a same direction. | 12-13-2012 |
20130062020 | Systems and Methods for Cleaving A Bonded Wafer Pair - Systems and methods are provided for mechanically cleaving a bonded wafer pair by controlling the rate of cleaving. This controlled rate of cleaving results in a reduction or elimination of non-uniform thickness variations in the cleaved surface of the resulting SOI wafer. One embodiment uses flexible chucks attached to the faces of the wafers and actuators attached to the flexible chucks to cleave the bonded wafer pair. Other embodiments also use rollers in contact with the surfaces to control the rate of cleaving. | 03-14-2013 |
20130133839 | APPARATUS AND METHOD FOR PEELING PROTECTIVE FILM AND METHOD FOR FABRICATING STEREOSCOPIC IMAGE DISPLAY DEVICE - An apparatus for peeling a protective film is provided to remove air bubbles in a film member with the protective film peeled, by moving a peeling unit so that the peeling unit performs peeling at a different position for each peeling process. The apparatus includes: a cylindrical plate for rotating a film member attached to the outer peripheral surface thereof, the film member having a protective film attached to the front surface thereof; a peeling unit comprising a peeling roller disposed at a side portion of the cylindrical plate to peel the protective film from the film member and a clamp for holding the peeled portion of the protective film; and a first moving unit for moving the peeling unit backward from the cylindrical plate to peel the protective film, wherein the peeling unit is moved along an axial direction of the cylindrical plate so that the peeling unit is contacted to the a different position of the protection film for each peeling process. | 05-30-2013 |
20150306864 | FILM PEELING APPARATUS AND FILM PEELING METHOD - A film peeling apparatus is provided. The film peeling apparatus comprises: a film peeling roller which is sticky; at least one peeling belt which is non-sticky; at least one first rotation shaft which is configured to drive the peeling belt to rotate, wherein when the film peeling roller rotates, the film peeling roller sticks to the film peeling belt and a release film such that the release film is peeled from an original film. | 10-29-2015 |
20150343754 | SHEET MATERIAL DETACHING DEVICE AND DETACHING METHOD - A device body comprises: a winding roller that is provided so as to contact with a flooring material sheet bonded to a floor and on which is wound the sheet that is stripped from the floor starting from a contact portion with the sheet; a driving means that, by rotationally driving the winding roller, winds the sheet onto the winding roller and strips the same from the floor, and that advances the device body by the winding roller being pushed toward the floor by the reactive force of the removal and rolling on the sheet; and a guiding means that discharges the sheet being stripped from the floor in front of or to the side of the direction of advancement of the device body. | 12-03-2015 |
20160031203 | METHOD AND APPARATUS FOR SEPARATING FLEXIBLE DISPLAY FILM FROM SUBSTRATE - The present disclosure relates to a method and an apparatus for separating a flexible display film from a substrate. The method of separating a flexible display film from a substrate according to the present disclosure comprises the steps of dividing the substrate attached with the flexible display film on a side thereof into a plurality of pieces, and separating part or all of the plurality of pieces from the flexible display film. The apparatus for separating a flexible display film from a substrate according to the present disclosure comprises a division component configured to divide the substrate attached with the flexible display film on a side thereof into the plurality of pieces, and a substrate-film separation component configured to separate part or all of the pieces from the flexible display film. | 02-04-2016 |
20160082622 | DEVICE FOR REMOVING A THREAD FROM A TIRE - The present invention relates to a device for removing a tread from a tire or part of a tire allowing the subsequent use thereof as an independent product in other industries. Another object of the invention is the method which allows establishing suitable pre-cuts and the subsequent removal thereof. The configuration of the machine allows automated tread removal in a very short time. The particular configuration of the cutting means allows removing helical cut portions for obtaining longer bands. | 03-24-2016 |
20160193822 | CORNER PEELING DEVICE, FILM PEELING APPARATUS AND FILM PEELING METHOD | 07-07-2016 |
156716000 | With poking during delaminating (e.g., jabbing, etc.) | 2 |
156717000 | Piercing layer during delaminating (e.g., cutting, etc.) | 2 |
20140202642 | CONTAINER LABEL AND RELATED METHODS - A label for a container may include a planar body comprising a first edge and a second edge, the first and second edges disposed at opposite sides of the body from each other; a cut-out portion of the planar body disposed between the first and second edges; and first and second tear lines extending from the cutout portion to respective first and second termination locations at or proximate to the first and second edges, respectively. The first and second tear lines may diverge at an angle away from each other in a direction from the cut-out portion to the respective first and second termination locations. | 07-24-2014 |
20150096691 | PEELING MECHANISM AND PEELING METHOD USING THE SAME - A peeling mechanism configured to cooperate with a mechanical arm to remove a protecting film from a workpiece can include a driver, two clamping members coupled to the driver and spaced from each other, and two cutting members respectively coupled to the clamping members oppositely to each other. Each cutting member can include a protruding end extending towards the other cutting member. The protruding end protrudes out of the clamping member. The driver can be configured to move the two clamping members towards each other. | 04-09-2015 |
156718000 | With shearing during delaminating | 5 |
20110253315 | DEBONDING EQUIPMENT AND METHODS FOR DEBONDING TEMPORARY BONDED WAFERS - A debonder apparatus for debonding a temporary bonded wafer pair includes a clam-shell type reactor, an upper chuck and a lower chuck. The reactor includes first and second isolated chambers. The upper chuck is contained within the first chamber and has a lower surface protruding into the second chamber and an edge configured to be held in fixed position via clamping means. The lower chuck is contained within the second chamber and has an upper surface oriented parallel and opposite to the lower surface of the upper chuck. The debonder apparatus also includes means for holding an unbonded surface of the first wafer of the temporary bonded wafer pair onto the lower surface of the upper chuck, and means for pressurizing the first chamber. The first chamber pressurizing means applies pressure onto an upper surface of the upper chuck while the upper chuck edge is held in fixed position via the clamping means, and thereby causes the lower surface of the upper chuck and the attached wafer pair to bow downward. The debonder apparatus also includes means for initiating a separation front at a point of the bonding interface of the temporary bonded wafer pair. The debonder apparatus also includes means for pressurizing the second chamber while the first chamber pressure is reduced thereby causing removal of the downward bowing of the upper chuck and the attached wafer pair and propagation of the separation front through the entire bond interface. The debonder apparatus also includes means for attaching the unbonded surface of the separated second wafer onto the upper surface of the lower chuck. | 10-20-2011 |
20120152466 | METHOD FOR THE PRODUCTION OF AN ELASTIC COMPOSITE MATERIAL WITH A TEXTILE SURFACE - A method for the production of an elastic composite material with a textile surface. First, a laminate is produced, which has elastic cover layers and a core composed of a nonwoven fabric. Subsequently, the laminate is separated into two strips, each of which has a cover layer and an adhering layer of nonwoven fabric, by tearing open the core. | 06-21-2012 |
20130008614 | ADHESIVE FASTENING ELEMENTS FOR HOLDING A WORKPIECE AND METHODS OF DE-BONDING A WORKPIECE FROM AN ADHESIVE FASTENING ELEMENT - An adhesive fastening element includes a first member and a second member adjacent to the first member and movable relative to the first member along a longitudinal axis of the adhesive fastening element, wherein a bond is formed by an adhesive between the workpiece and the first and second members of the adhesive fastening element. A method for debonding a workpiece from an adhesive fastening element includes moving the second member away from the workpiece and breaks the bond between the second member and the workpiece and moving the first and second members such that the second member moves towards the workpiece and applies a force to the workpiece so as to break the bond between the first member and the workpiece, and to de-bond the workpiece from the adhesive fastening element. | 01-10-2013 |
20130186575 | METHOD OF SEPARATING TWO ADHERED PLATES - A method of separating two plates adhered to each other via an adhesive sheet or a curable resin layer, comprising
| 07-25-2013 |
20160185097 | AUTOMATIC FILM PEELING MACHINE AND FILM PEELING METHOD - An automatic film peeling machine for peeling a film adhered on a board, includes a workbench, a frame mounted on the workbench including a movable pushing block, a supporting plate mounted on the frame, a suction plate for locating the board on the supporting plate, and a peeling module. The peeling module includes a sliding member, a resisting member and a movable clamping member mounted on the sliding member. The clamping member includes a clamping portion with a plurality of vents. Air is blown out from the vents for rotating a movable un-adhered portion of the film into a space between the clamping portion and the resisting member. The clamping member is moved toward the resisting member for clamping the movable un-adhered portion. The pushing block is moved to push the sliding member away from the frame, for peeling the first film from the board. | 06-30-2016 |