| Entries |
| Document | Title | Date |
|---|
| 20110108203 | Apparatus for Stripping Metal From a Cathode Plate - An apparatus for stripping metal from a cathode plate in which part of the metal has been separated from the cathode plate to form a gap between the part of the metal and the cathode plate, the apparatus comprising at least one roller for positioning in the gap between the metal and the cathode plate and drive means for driving the roller along the cathode plate or the metal to cause stripping of the metal from the cathode plate. | 05-12-2011 |
| 20110126989 | Method for Reworking Adhesively Bonded Liquid Crystal Displays - A method is disclosed for reworking a bonded LCD having a substrate (e.g., plate or film) adhesively bonded to a face (e.g., front face) of the LCD. The method provides for efficient and clean removal of the substrate from the LCD when necessary (e.g., when defect(s) are present) without damage to the LCD such that the LCD can subsequently be re-bonded. | 06-02-2011 |
| 20110220293 | METHOD OF REMOVING BACKING ADHESIVE OF CARPET AND THE DEVICE THEREOF - A method and a device for removing backing adhesive, typically a mixture of CaCO | 09-15-2011 |
| 20110220294 | METHOD OF PROCESSING TERMINUS OF OPTICAL FIBER AND TERMINUS PROCESSING TOOL - Provides a method and a terminus processing tool whereby terminus processing for the purpose of connection to another optical fiber may be carried out simply. The terminus processing method entails cutting an optical fiber | 09-15-2011 |
| 20120037319 | Apparatus for Stripping Metal from a Cathode Plate - An apparatus for stripping metal from a cathode plate, the apparatus comprising stripping means adapted for positioning between the metal and the cathode plate in order to separate the metal from the cathode plate, and wherein movement of the stripping means is achieved through movement of a robotic arm. | 02-16-2012 |
| 20120043026 | FILM PEELING METHOD - The method provides that, in an initial peeling phase (AP), the material block is started to be peeled in a spiral shape. This is followed by a transition phase (UP) of a fraction of a turn so as to change to the set layer thickness. In the subsequent peeling phase (SP), the work is done with the same spiral pitch as in the initial peeling phase. During each turn of the material block, the knife is sunk further into the material block within a limited angular range and thereafter the turn is completed with the pitch of the initial peeling phase. Advantages are achieved by the fact that the set layer thickness is reached within fractions of a turn. The method can be executed with little expenditure of time and little waste of material. | 02-23-2012 |
| 20120085500 | Methods Of Applying Protective Films - Methods for applying protective polymeric films on metal substrates are described. The methods involve depositing a liquid curable resin on a substrate in a particular manner and then curing the resin to form the protective film. The films can be readily peeled off from the substrates and are environmentally friendly. | 04-12-2012 |
| 20120103534 | METHOD OF MINIMIZING BEAM BENDING OF MEMS DEVICE BY REDUCING THE INTERFACIAL BONDING STRENGTH BETWEEN SACRIFICIAL LAYER AND MEMS STRUCTURE - The beam bending of a MEMS device is minimized by reducing interfacial strength between a sacrificial layer and a MEMS structure. | 05-03-2012 |
| 20120138237 | APPARATUS AND METHOD FOR DELAMINATING ADHESIVE FILM - A delaminating apparatus ( | 06-07-2012 |
| 20120152465 | DEVICE AND METHOD FOR DETACHING A SEMICONDUCTOR WAFER FROM A SUBSTRATE - Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate. | 06-21-2012 |
| 20120234497 | DEBONDER TO MANUFACTURE SEMICONDUCTOR AND DEBONDING METHOD THEREOF - A debonder to manufacture a semiconductor that includes: a stage to support a carrier wafer that is attached to a chip stack assembly by a temporary adhesive layer coated on the surface of the carrier wafer; a chuck arranged above the stage to selectively secure the chip stack assembly; a lifting unit to lift the chuck from the stage; a lateral driving unit to move the chuck laterally with respect to the stage; and a controller to control the lifting unit and the lateral driving unit. | 09-20-2012 |
| 20120261076 | DEVICE FOR SEPARATION OF A STACKED STRUCTURE AND ASSOCIATED METHOD - A device for separation of a stack in two distinct parts, including a first part, a second part and a zone of weakness between the first and second parts, and an insertion zone located at the periphery of the stack at or close to the zone of weakness, extending over all or part of the periphery of the stack. The device includes at least one separator capable of penetrating into the insertion zone along a penetration distance until coming into contact with the first part of the stack at at least one first contact point located at the periphery of the stack, and coming into contact with the second part of the stack at at least one second contact point located at the periphery of the stack. The device also includes drive means for making the separator penetrate into the insertion zone as far as the penetration distance and for applying a relative movement between the separator and the stack. The separator is configured such that the distance between the first contact point and the second contact point increases during the relative movement, the first and second contact points remaining at the periphery of the stack during the relative movement. | 10-18-2012 |
| 20120261077 | METHOD FOR SEPARATING AN OPTICAL FILM BONDED TO AN ADHEREND WITH A PRESSURE-SENSITIVE ADHESIVE OPTICAL FILM - There is provided a method for separating an optical film bonded to an adherend with a pressure-sensitive adhesive layer interposed therebetween from the adherend. The pressure-sensitive adhesive layer is formed using an optical pressure-sensitive adhesive. The optical pressure-sensitive adhesive of the invention comprises a base polymer having a functional group (F); and a coupling agent that has a benzyl ester group and is represented by Formula (1): | 10-18-2012 |
| 20120325410 | METHODS AND APPARATUS FOR ELECTRICALLY MODIFYING GEL ADHESION - The invention concerns a method for controlling the adhesive bond between an electric-field responsive material and a substrate, which method comprises using an electric field to control the strength and integrity of the adhesive bond. The method may be used, for example, for removing or delaminating a material, which material is responsive to an electric field, from a substrate. The invention further comprises elimination of the application of the electric field and application of the previously removed electric-field-responsive material to the substrate, thereby resuming the strength and integrity of the adhesive bond. The invention includes apparatus for use in the bond controlling process. | 12-27-2012 |
| 20130105089 | METHOD FOR SEPARATING SUBSTRATE ASSEMBLY | 05-02-2013 |
| 20130146228 | SEPARATION APPARATUS, SEPARATION SYSTEM, AND SEPARATION METHOD - A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate, includes: a first holding unit which holds the processing target substrate; a second holding unit which holds the supporting substrate; a moving mechanism which relatively moves the first holding unit or the second holding unit in a horizontal direction; a load measurement unit which measures a load acting on the processing target substrate and the supporting substrate when the processing target substrate and the supporting substrate are separated; and a control unit which controls the moving mechanism based on the load measured by the load measurement unit. | 06-13-2013 |
| 20130146229 | SEPARATION SYSTEM, SEPARATION METHOD, PROGRAM AND COMPUTER STORAGE MEDIUM - The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit. | 06-13-2013 |
| 20130186572 | METHOD OF SEPARATING TWO ADHERED PLATES - A method of reusably separating two plates adhered to each other via an adhesive sheet or a curable resin layer, including
| 07-25-2013 |
| 20130186573 | Post Consumer Scrap Film Recycling Process - A method for processing a supply of post consumer scrap linear low density or low density polyethylene film into near-virgin quality blown film product. The method includes tearing the supply of film in a shredder, wherein the surface area of the film is exposed, including delaminating the film. The torn supply of film is washed in a water bath including a surfactant. The film is agitated in the bath containing the surfactant wherein contaminants on the film are removed from the film. The washed film is ground into smaller pieces and additional washing of the ground film in a rotating friction washer occurs wherein additional contaminants are removed from the film. The ground film is then dried and compacted without addition of water into granulated objects of near-virgin quality blown film product. | 07-25-2013 |
| 20130248118 | ADHESIVE LAYER FOR OPTICAL FILM, OPTICAL FILM HAVING ADHESIVE LAYER, IMAGE DISPLAY DEVICE, AND DETACHMENT METHOD FOR OPTICAL FILM - A pressure-sensitive adhesive layer for an optical film made from an aqueous dispersion-type pressure-sensitive adhesive composition, wherein the aqueous dispersion-type pressure-sensitive adhesive composition is an aqueous dispersion comprising a water-dispersible (meth)acryl-based copolymer (A) having a glass transition temperature from −55° C. to less than 0° C.; and a water-soluble or water-dispersible component (B) having a glass transition temperature of 0° C. or more, a mixture ratio (A)/(B) is in the range of 50-97/3-50, the component (B) forms domains with maximum lengths between 1 nm and 200 nm in a resin component made of the (meth)acryl-based copolymer (A), and the pressure-sensitive adhesive layer has a haze value (H20) of 1% or less when having a thickness of 20 μm. The pressure-sensitive adhesive layer for an optical film, which is made from an aqueous dispersion-type pressure-sensitive adhesive composition has good reworkability or recyclability, and has a sufficient level of durability. | 09-26-2013 |
| 20140020845 | Method For Debonding Items With Reactive Multilayer Foil - An apparatus comprising a first substrate, a second substrate, a bonding layer positioned between the first substrate and the second substrate, the bonding layer holding the first substrate and the second substrate together, and a reactive layer embedded in the bonding layer. The reactive layer can generate sufficient thermal energy to cause the first substrate to separate from the second substrate without damaging at least one of the first substrate or the second substrate when the reactive layer is activated, and is preferably comprised of a reactive multilayer foil. | 01-23-2014 |
| 20140060747 | Method and Device for Recycling Labeled Plastic Articles - A method and a device for recycling labeled plastic articles are described. Accordingly, the labels are detached from the plastic articles and the plastic articles treated in this way are sorted in particular automatically. During sorting, plastic articles from which the labels have not been properly detached are sorted out and again subjected to the treatment for detaching the labels. | 03-06-2014 |
| 20140076497 | SEPARATION APPARATUS, SEPARATION SYSTEM AND SEPARATION METHOD - A separation apparatus according to the present disclosure includes a first holding unit, a cutting unit, a measuring unit and a position adjusting unit. The first holding unit holds a first substrate of a superposed substrate formed by joining the first substrate and a second substrate. The cutting unit cuts a joining portion of the first substrate and the second substrate. The measuring unit measures a distance from a predetermined measurement reference position to a holding surface of the first holding unit or to an object interposed between the measurement reference position and the holding surface. The position adjusting unit adjusts a cutting position of the cutting unit based on a result of the measuring unit and information acquired in advance with respect to a thickness of the superposed substrate. | 03-20-2014 |
| 20140076498 | FILM PEELING METHOD AND FILM PEELING DEVICE FOR FILM-COATED FLAT WIRE - A film peeling method for a film-coated flat wire that is performed by a film peeling device including: a rotational holder that can rotationally convey in a perpendicular direction to a rotational axis; a positioning mechanism that positions a film-coated flat wire in a longitudinal direction; and a working section that is provided in plural, aligned at specified intervals, and works an end portion of the film-coated flat wire, the method includes: holding the film-coated flat wire that is cut in a specified length in advance by the rotational holder; rotationally conveying the film-coated flat wire that is held by the rotational holder in the perpendicular direction to the rotational axis; positioning the conveyed film-coated flat wire by the positioning mechanism; and working the end portion of the film-coated flat wire by the working section. | 03-20-2014 |
| 20140083624 | SOLUTION OF AROMATIC POLYAMIDE FOR PRODUCING DISPLAY ELEMENT, OPTICAL ELEMENT, OR ILLUMINATION ELEMENT - The present disclosure is directed toward solutions, transparent films prepared from aromatic copolyamides, and a display element, an optical element or an illumination element using the solutions and/or the films. The copolyamides, which contain pendant carboxylic groups are solution cast into films using cresol, xylene, N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), dimethylsulfoxide (DMSO), or butyl cellosolve or other solvents or mixed solvent which has more than two solvents. When the films are thermally cured at temperatures near the copolymer glass transition temperature, after curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. | 03-27-2014 |
| 20140144590 | ADHESIVE STRUCTURE, SURFACE TREATING AGENT, AND METHOD OF SEPARATING THE SAME - An adhering structure is disclosed. The adhering structure includes an adhering member, an adhesive layer, and a surface treatment layer sandwiched between the adhering member and the adhesive. The surface treatment layer includes a plurality of magnetic disabling particles. Each of the plurality of magnetic disabling particles has a core-shell structure, and includes a magnetic shell and a core capsulated in the magnetic shell. The core decreases an adhesive strength of the adhesive layer. | 05-29-2014 |
| 20140196852 | SYSTEM AND METHOD OF REMOVING BEADS FROM TIRES - A system and method for removing steel beads from large diameter tires by lifting a tire into a position adjacent an extraction hook and a pair of stripping dyes. The hook is positioned adjacent the tire bead and is then withdrawn through a narrow opening in the stripping dyes, which removes the bead from the tire. The machine is capable of removing both rubber-encased inner beads from the tire without repositioning the tire within the system. A plurality of lifting platforms position the tire and the stripping mechanisms with respect to one another throughout the extraction process. | 07-17-2014 |
| 20140209250 | DETACHING APPARATUS AND DETACHING METHOD - In a detaching apparatus, a detachment starter bends one end part of a first plate-like body into a cylindrical or prismatic surface in a direction opposite to a second plate-like body, thereby forming a single and straight boundary line between an adhering region and a detached region. A separator increases a distance between a first holder holding the first plate-like body and a second holder holding the second plate-like body to separate the first and second plate-like bodies. | 07-31-2014 |
| 20140251545 | Process and Method for Recycling Carpet or Other Fibrous Plastic Materials - A process and method for recycling carpet is disclosed. The process and method involves the liberation and separation of desirable carpet face fibers from the carpet backing materials. The present invention eliminates face fiber shearing. In the present process, the secondary layer of the carpet backing is removed either manually or mechanically. Then, the bottom of the primary backing layer of the carpet with the bottom of the face fiber “U's” exposed, is mechanically grip-abraded by a rubber material. The grip-abrasion of the rubber or rubber-like material across the bottom of the primary carpet backing layer loosens the glue and grips and pulls the face fiber from the primary backing without destructing primary or secondary backing. The liberation and separation of face fibers from the backing materials using this method produces the highest yield of usable materials compared to any other method. It not only separates the entire face fiber for recycling, but it also allows the backing material to be recycled since it is not contaminated with face fibers. | 09-11-2014 |
| 20140262051 | PASSIVE FEEDER CARTRIDGE DRIVEN BY PICKUP HEAD - A pick-and-place machine and method includes use of a passive component feeder cartridge including a feeder gear. Rotation of the feeder gear causes a component-bearing tape to be fed through the feeder cartridge. A pickup head includes a vacuum nozzle to pick up the components from the tape and a rack gear to engage and drive the feeder gear of the feeder cartridge via translational motion of the pickup head when operatively disposed with respect to a selected feeder cartridge. | 09-18-2014 |
| 20140305597 | SOLUTION OF AROMATIC POLYAMIDE FOR PRODUCING DISPLAY ELEMENT, OPTICAL ELEMENT, OR ILLUMINATION ELEMENT - This disclosure, viewed from one aspect, relates to a solution of polyamide comprising: an aromatic polyamide; and a solvent; wherein elastic modulus at 30.0° C. of a cast film formed by applying the solution onto a glass plate is 5.0 GPa or less, and coefficient of thermal expansion (CTE) of the cast film is more than 30 ppm/K, and wherein the aromatic copolyamide comprises at least two repeat units, and at least one of the repeat units has one or more free carboxyl groups. | 10-16-2014 |
| 20140318713 | INTERCHANGEABLE CUT TAPE / LEADERLESS FEEDER FINGER ADAPTABLE TO VARIOUS SURFACE MOUNT ASSEMBLY MACHINE FEEDERS FOR CHIP MOUNTERS - Provided is a cut tape/leaderless feeder finger for use in tape feeders for component mounters. The cut tape/leaderless feeder finger can be attached to existing component tape feeders to allow feeding of component tape without a leader. The cut tape/leaderless feeder finger includes a stripping mechanism that folds and creases the top cover of component carrier tape to expose the component in the tape. The cover tape stays attached to the carrier tape and is folder and creased out of the way of the feeder mechanism and the chip mounter. The component tape passes between guides that retain the component in the tape until it is picked by the component mounter. | 10-30-2014 |
| 20140374031 | WAFER DEBONDING AND CLEANING APPARATUS AND METHOD - A wafer debonding and cleaning apparatus comprises a wafer debonding module configured to separate a semiconductor wafer from a carrier wafer. The wafer debonding and cleaning apparatus also comprises a first wafer cleaning module configured perform a first cleaning process to clean a surface of the semiconductor wafer. The wafer debonding and cleaning apparatus further comprises an automatic wafer handling module configured to transfer the semiconductor wafer from one of the wafer debonding module or the first wafer cleaning module to the other of the wafer debonding module or the first wafer cleaning module. The semiconductor wafer has a thickness ranging from about 0.20 μm to about 3 mm. | 12-25-2014 |
| 20150083340 | DISPLAY MODULE REWORKABILITY - Techniques are disclosed for a cutting apparatus that can be used to cut a target layer within a display module, e.g., a liquid crystal display that includes a protective cover glass. The cutting apparatus includes a platform that supports a track. The cutting apparatus also includes a linear slide that is configured to both hold the display module in place and travel along the track, where the movement of the linear slide along the track is driven by a mass that is in free fall. The cutting apparatus further includes a cutting wire, where the cutting wire is positioned relative to the target layer and oscillates to cut the target layer as the linear slide moves along the track. Additional techniques are disclosed and directed toward a method for operating the cutting apparatus described above. | 03-26-2015 |
| 20150096689 | FLEXIBLE SUBSTRATE HOLDER, DEVICE AND METHOD FOR DETACHING A FIRST SUBSTRATE - A flexible substrate mount for holding a first substrate when the first substrate is being detached from a second substrate, and detachment means for debonding of the second substrate by bending the first substrate. Furthermore, this invention relates to a device for detaching a first substrate from a second substrate in one detachment direction (L) with the following features: a substrate mount for holding the first substrate, said first substrate mount being flexible in the detachment direction (L), a substrate mount for holding the second substrate and detachment means for the debonding of the first substrate from the second substrate as the first substrate bends, and a method of using the same. | 04-09-2015 |
| 20150144271 | METHOD OF SEPARATING PLATES - It is an object of the present invention to provide a method that can separate two plates laminated via a pressure-sensitive adhesive sheet, smoothly, efficiently, and accurately without such force (load) that large strain (deformation) leading to breakage or cracking occurs being substantially applied to the plates. The method of separating plates according to the present invention is a method of separating two plates laminated via a double-sided pressure-sensitive adhesive sheet, comprising placing a cutting tool having a cutting edge angle of not more than 25° and a thickness of not more than 20 mm, on a side of a structure composed of a double-sided pressure-sensitive adhesive sheet and two plates, between the double-sided pressure-sensitive adhesive sheet and the plate, and applying force in a normal direction of the plate. | 05-28-2015 |
| 20150290687 | MACHINE AND METHOD FOR CONTINUOUS REMOVAL OF LABELS FROM CONTAINERS MADE OF PLASTIC MATERIALS - A machine and a method for the continuous removal of labels from plastic containers made of recyclable material are described. The machine comprises a fixed treatment chamber in which an agitator provided with a plurality of vanes is rotated. Toothed plates are mounted in a removable way on at least one of the flat surfaces of each of the vanes. | 10-15-2015 |
| 20150290921 | METHOD OF MANUFACTURING DEVICE SUBSTRATE - A method of separating a device substrate from a carrier substrate on which said device substrate is disposed. A static electricity removal member is provided between the device substrate and the carrier substrate. The device substrate is separated from the carrier substrate. According to the above, since static electricity accumulating between the device substrate and the carrier substrate is removed by the static electricity removal member, the carrier substrate and the device substrate may be easily separated from each other. Thus, damage to the device due to static electricity when the carrier substrate and the device substrate are separated from each other may be prevented. | 10-15-2015 |
| 20150314584 | SYSTEM AND METHOD FOR AUTOMATED INITIAL SEPARATION OF COMPOSITE PLY BACKING - A method for initial separation of an adhered backing film from an uncured pre-impregnated composite lamina having an edge includes exposing and supporting the edge of the composite lamina, and applying an impact force to the exposed edge with an automated tool. The impact force is sufficient to cause delamination of the backing film from the composite lamina without damaging the lamina. | 11-05-2015 |
| 20160023449 | STRIPPING DEVICE AND METHOD - A stripping device and method for stripping a plastic film from a glass substrate are provided. The stripping device at includes a roller and a support member. The support member is disposed at a position where the plastic film is separated from the glass substrate. The support member supports and/or stretches the stripped plastic film. The roller is used to roll up the plastic film supported and/or stretched by the support member. Because the support member stretches and/or supports the plastic film as it is removed from the glass substrate, the plastic film is bent at a rounded angle. This reduces the stress generated in the plastic film during bending, thereby decreasing cracks in the plastic film and improving the overall useable yield of the plastic film. | 01-28-2016 |
| 20160101613 | DE-BONDING AND CLEANING PROCESS AND SYSTEM - Methods and tools for de-bonding and cleaning substrates are disclosed. A method includes de-bonding a surface of a first substrate from a second substrate, and after de-bonding, cleaning the surface of the first substrate. The cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate. A tool includes a de-bonding module and a cleaning module. The de-bonding module comprises a first chuck, a radiation source configured to emit radiation toward the first chuck, and a first robot arm having a vacuum system. The vacuum system is configured to secure and remove a substrate from the first chuck. The cleaning module comprises a second chuck, a spray nozzle configured to spray a fluid toward the second chuck, and a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck. | 04-14-2016 |
| 20160104633 | CASSETTE FIXTURE FOR HOLDING FILM FRAMES WITH AFFIXED THIN SUBSTRATES DURING LIQUID CHEMICAL BATCH REMOVAL OF CARRIERS - The invention describes the ability to conduct multiple carrier substrate removal practices simultaneously. The fixture design is slotted in a manner to hold film frame rings and has the bottom region open without interference to the passage of the released carrier substrate. Slots in the fixture are arranged on two sides at top and bottom to support the film frame, however, the distance between the slots and the area of the open region is sufficient to allow the carrier substrate to travel downwards under gravity force, once it has been released from the device wafer. The method describes a batch process whereby a fixture design supports multiple film frames with taped adhered device wafers enable exposure to a chemical medium that either acts upon the interface between the device wafer and carrier substrate or digests the carrier substrate in a manner that results in removal. | 04-14-2016 |
| 20160111316 | Debonding Schemes - A method includes receiving a wafer stack having at least two wafers bonded together. At least one blade is inserted between a first wafer of the at least two wafers and a second wafer of the at least two wafers. The blade has a channel configured to inject air or fluid. The first wafer is debonded from the second wafer using the at least one blade. In another embodiment, a detacher having a convex bottom surface is attached to the wafer stack. The first wafer is debonded from the second wafer using the detacher. | 04-21-2016 |
| 20160176181 | METHOD OF DETACHING SUB-SUBSTRATE FROM SUBSTRATE | 06-23-2016 |
| 20220134634 | FILM PEELING DEVICE AND METHOD OF PEELING FILM - A film peeling device includes a chamber, a lower stage disposed on a first wall of the chamber, first to fourth grippers capable of peeling first to fourth sides of a film by gripping the first to fourth sides of the film attached to an object disposed on the lower stage and an upper stage disposed on a second wall of the chamber facing the first wall of the chamber and capable of extending in a first direction in which the object is disposed. | 05-05-2022 |
