| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 324763010 | Printed circuit board | 46 |
| 20100283498 | FULL GRID CASSETTE FOR A PARALLEL TESTER FOR TESTING A NON-COMPONENTED PRINTED CIRCUIT BOARD, SPRING CONTACT PIN FOR SUCH A FULL GRID CASSETTE AND ADAPTER FOR A PARALLEL TESTER FOR TESTING A NON-COMPONENTED PRINTED CIRCUIT BOARD - The invention relates to a full grid cassette for a parallel tester for testing a non-componented printed circuit board, to a spring contact pin for such a full grid cassette and to an adapter for a parallel tester for testing a non-componented printed circuit board. | 11-11-2010 |
| 20110095781 | METHOD OF INSPECTING PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND INSPECTION DEVICE OF PRINTED CIRCUIT BOARD - A plurality of assembly sheets are placed on an upper surface of a substrate adsorption platform, and a pressing plate is placed on the plurality of assembly sheets placed on the substrate adsorption platform such that the plurality of assembly sheets are pressed by the pressing plate. In this state, a DC power supply device is turned on and causes the upper surface of the substrate adsorption platform to be charged, thereby causing the plurality of assembly sheets to be adsorbed on the upper surface by an electrostatic force. Then, the pressing plate placed on the plurality of assembly sheets is removed while the upper surface of the substrate adsorption platform is charged, and automatic appearance inspection is performed on the plurality of assembly sheets adsorbed on the upper surface of the substrate adsorption platform. | 04-28-2011 |
| 20110128033 | Connection structure of electronic component and wired circuit board, wired circuit board assembly, and method for testing electronic component - In a connection structure of an electronic component and a wired circuit board, the electronic component includes a plurality of external terminals. The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, and a conductive pattern formed on the insulating base layer. The conductive pattern includes a plurality of terminal portions for connection with the plurality of external terminals. The electronic component and the wired circuit board are disposed such that the plurality of external terminals and the plurality of terminal portions face each other. The wired circuit board is bent such that the conductive pattern is warped, and by the reaction force of the warping, the terminal portions and the external terminals are abutted, and the electronic component and the wired circuit board are electrically connected. | 06-02-2011 |
| 20110140731 | ELECTRONIC DEVICE AND METHOD FOR TESTING A CIRCUIT BOARD - An electronic device, and associated method, provided with a circuit board ( | 06-16-2011 |
| 20110215828 | TEST METHOD FOR PASSIVE DEVICE EMBEDDED PRINTED CIRCUIT BOARD - A method of testing a passive device embedded printed circuit board is disclosed. The method in accordance with an embodiment of the present invention includes: applying an AC power to a printed circuit board in which a filter including at least two of a resistor, an inductor and a capacitor is embedded; measuring a property of the filter for the applied AC power; and determining whether or not the printed circuit board is defective by comparing the measured property of the filter with a design value. | 09-08-2011 |
| 20110234254 | TERMINAL DISCRIMINATING APPARATUS AND TERMINAL DISCRIMINATING METHOD USING THE SAME - A terminal discriminating apparatus and a terminal discriminating method using the same are provided. The terminal discriminating apparatus includes: a measurement unit for measuring a pull-up voltage and a pull-down voltage of each of candidate terminals to be discriminated; a discriminating unit for comparing the pull-up voltages, pull-down voltages, and the differences between the pull-up voltages and pull-down voltages for the candidate terminals to discriminate the types of the candidate terminals; and an output unit for outputting results of the discrimination of the candidate terminals transferred from the discriminating unit. The types of the candidate terminals can be discriminated by comparing the pull-up voltage, the pull-down voltage, and the differences between the pull-up voltages and the pull-down voltages for the candidate terminals. | 09-29-2011 |
| 20110241721 | SWITCHING APPARATUS FOR ELECTRICAL CONTACT TESTING - The invention relates to a switching apparatus ( | 10-06-2011 |
| 20110254581 | SHORT CIRCUIT DETECTION DEVICE - A short circuit detection device is provided to check a circuit layout. The circuit layout includes electronic components connected in parallel. Any of the electronic components includes two contacts on the circuit layout. The short circuit detection device includes a determination circuit configured to determine whether a short circuit has occurred in the circuit layout, and a detection circuit configured to determine the specific electronic component or components responsible for the short circuit. The determination circuit connects with one contact of any of the electronic components. The detection circuit connects with two contacts of any of the electronic components. | 10-20-2011 |
| 20110273202 | CIRCUT BOARD AND MEHTOD FOR TESTING COMPONENT BUILT IN THE CIRCUIT BOARD - Disclosed herein are a circuit board and a method for testing devices embedded inside the circuit board. The circuit board according to an embodiment of the present invention includes an active device that is embedded inside the circuit board and includes at least one connection terminal; a passive device of which one terminal is electrically connected to one of the connection terminals of the active device and the other terminal is electrically connected to a signal pad on a surface of the circuit board; and a test pad that is electrically connected to the one terminal of the passive device. According to the present invention, even when the active device and the passive device are embedded inside the board, it is possible to effectively test a connection state of each device, thereby making it possible to easily determine whether defects occur in the circuit board. | 11-10-2011 |
| 20110273203 | METHOD FOR THE TESTING OF CIRCUIT BOARDS - The invention relates to a method for the testing of circuit boards using a testing apparatus which has a test set-up for contacting the circuit board test points of a circuit board to be tested. The test set-up has test contact elements in a predetermined regular grid. The method involves the following steps:
| 11-10-2011 |
| 20110291694 | TELEVISION APPARATUS, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE - According to one embodiment, a television apparatus includes a circuit board, a conductive portion, and an easily broken portion. The circuit board is mounted with an electronic component. The conductive portion is located on a surface or the inside of the circuit board. A breakage detection mechanism detects breakage of the conductive portion by conduction. The easily broken portion is provided to at least part of the conductive portion. The easily broken portion is broken easier than other portions of the conductive portion when a stress is applied to the circuit board. | 12-01-2011 |
| 20120013360 | Method of repairing probe card and probe board using the same - There are provided a method of repairing a probe card and a repaired probe board. The method of repairing a probe card includes: in a board body composed of a sintered ceramic having first and second pillar surfaces disposed at a position opposed to each other, preparing the board body including a plurality of main channels for electrically connecting a first pad formed on the first pillar surface to a second pad formed on a second pillar surface and reserved channels disposed to be adjacent to the main channels to repair to damaged main channels; when the main channels are damaged; removing the first and second pads formed in the main channels and the reserved channels; forming cavities by partially removing the board between the damaged main channels and the reserved channels adjacent to the main channel; and forming repair connection parts in the cavities in order to electrically connect the damaged main channels to the reserved channels adjacent thereto. | 01-19-2012 |
| 20120025864 | CIRCUIT TESTING DEVICE AND METHOD FOR IMPLEMENTING SAME - The invention relates to a device for testing a circuit made up of a printed circuit board on which components, preferably dummy components, are assembled by means of solder connections. The testing device comprises an enclosure for subjecting the circuit under test to a schedule of thermo-mechanical and/or vibration constraints. The testing device comprises a hardware portion comprising bridges of electrical resistors, a software portion comprising means for setting a detection criterion representing damage to one or more solder connections and for displaying the results of the test, an input/output interface for converting each electrical resistor measurement of the tested chains of solder connections into data that can be used by the software portion, and adjustment means for modifying a criterion for detecting damage to the solder connections. | 02-02-2012 |
| 20120032700 | MULTILAYER WIRING BOARD AND METHOD FOR EVALUATING MULTILAYER WIRING BOARD - A method for evaluating a multilayer wiring board is provided. The multilayer wiring board includes an inner-layer on which a test pattern is disposed. The method includes arranging a plurality of first patterns and a second pattern of the test pattern such that the first patterns have a comb-like shape opposed to one another, and the second pattern has an unbranched shape extending between the opposed first patterns. A voltage is applied between the first patterns and the second pattern. An impedance of the second pattern is measured. | 02-09-2012 |
| 20120105096 | Assessing Connection Joint Coverage Between a Device and a Printed Circuit Board - The present disclosure relates to assessing coverage of a connection joint, such as a solder joint, between a device and a printed circuit board (PCB). In accordance with various embodiments, a PCB includes a conductive thermal pad adapted to be electrically and mechanically connected to an exposed pad of a component by an intervening connection joint to establish a thermal path to dissipate thermal energy from the component. An isolated test via that extends through the conductive thermal pad in non-contacting relation thereto, the test via adapted to mechanically and electrically contact said intervening connection joint. A coverage characteristic of the intervening connection joint can be determined in relation to application of an electrical signal to the test via. | 05-03-2012 |
| 20120119779 | SIGNAL SENSING DEVICE AND CIRCUIT BOARDS - Apparatus are provided for use in testing circuit boards. A signal sensing device includes one or more probes. Each probe includes a length of rigid coaxial conductor configured to define a sensing pin at one end. A circuit board defines a number of through vias lined in metal and configured to receive the sensing pin of a corresponding probe. The signal sensing device also includes a ground pin. Electrical pathways extending away from adjacent pairs of the through vias can be tested for electrical impedance and other signal propagating characteristics by way of the signal sensing device. | 05-17-2012 |
| 20120153985 | TESTING APPARATUS FOR TESTING PORTS OF PRINTED CIRCUIT BOARD - A test assembly includes a printed circuit board, a first subsidiary test chipset, a second subsidiary test chipset, and a main test chipset. The printed circuit board includes a first CPU socket and a second CPU socket. The first CPU socket includes a first socket pin. The second CPU socket includes a second socket pin. The first subsidiary test chipset connects to the first CPU socket. The second subsidiary test chipset connects to the second CPU socket. The main test chipset connects to the first subsidiary test chipset and the second subsidiary test chipset. The first subsidiary test chipset outputs a first signal to the first socket pin. The second subsidiary test chipset receives a second signal from the second socket pin. The main test chipset compares the first signal and the second signal to test a connection of the first socket pin and the second socket pin. | 06-21-2012 |
| 20120212252 | Printed Circuit Board Registration Testing - A structure for determining misregistration of layers of a printed circuit board. A first conductive pattern is on a first layer of the printed circuit board. A second conductive pattern on a second layer of the printed circuit board. There is a hole through the first layer and the second layer of the printed circuit board. There is electrically conductive material in the hole. If the first layer and the second layer of the printed circuit board are registered properly, the first conductive pattern and the second conductive pattern are not electrically continuous with the conductive material in the hole. If either or both of the first layer and the second layer are a misregistered layer, the conductive trace on the misregistered layer is electrically continuous with the conductive material in the hole. | 08-23-2012 |
| 20120229162 | Non-Contact Testing Devices for Printed Circuit Boards Transporting High-Speed Signals - Non-contact testing devices formed on a printed circuit board (PCB), to enable testing high-speed signals propagating along at least one signal track located on a signal layer of the PCB, and methods of testing high-speed signals using thereof are provided. A non-contact testing device includes a non-contact testing track formed on a layer of the PCB, and having at least one portion substantially parallel with the at least one signal track and a testing point located at an end of the non-contact testing track. | 09-13-2012 |
| 20120235703 | Circuit Board, Image Forming Apparatus, And Method Of Managing Reuse Information Of Circuit Board - A circuit board includes a main part on which a processor is mounted, a cut part to be cut off from the main part at a cut section before the board is reused, and a conductor pattern wired through the cut part via the cut section and to be cut off into a plurality of patterns at the cut section as the cut part is cut off. The processor detects a difference in signal level between a level of a signal output from the conductor pattern before the cut part is cut off, and a level of the signal output from the conductor pattern after the cut part is cut off, to determine a number of times the board is reused. | 09-20-2012 |
| 20120274349 | DEBUG CARD FOR MOTHERBOARD - A debug card includes a connector, a driving circuit, a switching circuit, and a testing circuit. The connector is connected to an expansion slot of a motherboard. The switching circuit is connected between the connector and the testing circuit to select data channels between the connector and the testing circuit through a low level signal or a high level signal received by a ground pin of the connector. The driving circuit is connected to the connector, the switching circuit, and the testing circuit, to provide voltages to the switching circuit and the testing circuit through the connector and the expansion slot. | 11-01-2012 |
| 20120299615 | CIRCUIT BOARD ASSEMBLY AND ASSISTANT TEST CIRCUIT BOARD - An assistant test circuit board for assisting a tester to test a number of signal welds and a number of ground welds on a printed circuit board includes a ground pin, a same number of ground pads as ground welds, test pads, and a same number of test pins as signal welds. Each test pad and each ground pad located on a fist side of the circuit board are soldered to the corresponding signal weld and ground weld, while the test pins and the ground pin are connected to the tester. | 11-29-2012 |
| 20120306529 | ELECTRONIC DEVICE AND ELECTRONIC SYSTEM - There is provided with an electronic device including: a main board, a plurality of electronic substrates, a first chain, a measuring unit and a controller, in which the plurality of electronic substrates each are mounted on the main board via solder joints, the first chain connects the solder joints in series throughout all of the electronic substrates, comprising a plurality of second chains each being a part of the first chain and connecting the solder joints in each corresponding one of the electronic substrates, the measuring unit measures an electrical resistance of the first chain and electrical resistances of the second chains, and the controller detects, if the electrical resistance of the first chain is equal to or higher than a first threshold value, the second chain having an electrical resistance equal to or higher than a corresponding second threshold value from among the second chains. | 12-06-2012 |
| 20130027076 | APPARATUS FOR DETECTING PATTERN ALIGNMENT ERROR - An apparatus for detecting pattern alignment error includes a first conductive pattern disposed over a first insulation member with a power source applied of the first conductive pattern; a second insulation member for covering the first conductive pattern; a second conductive pattern disposed on the second insulation member; a conductive via connected to the second conductive pattern and passing through the second insulation member; and an insulation pattern disposed in the first to conductive pattern for detecting an alignment error in response to a position of the conductive via. The apparatus for detecting pattern alignment error can detect the alignment of lower wiring in a device with multi-layer wiring | 01-31-2013 |
| 20130033286 | Non-Destructive Tilt Data Measurement to Detect Defective Bumps - The present disclosure includes techniques and apparatus for making non-contact differential measurements of various dimensions of electronic components surface mounted on circuit boards. Tilt data relating to the electronic components is derived from the differential measurements to provide an indication of the integrity of the electrical connection between the electronic components to the circuit board. The techniques and apparatus of the present disclosure make it possible to accomplish non-destructive inspection of the connection without individually inspecting each bump-terminal connection. | 02-07-2013 |
| 20130127489 | ELECTRONIC LOAD FOR TESTING DIMM SLOT - An exemplary electronic load includes a simulation load, a comparison circuit, a sample resistor, and a voltage control circuit. The comparison circuit includes a comparator. The sample resistor samples current flowing through the simulation load, and outputs the sampled current to a negative input of the comparator. An output of the comparator is connected to the simulation load. The voltage control circuit outputs an adjustable control voltage to a positive input of the comparator to control the simulation load to output an adjustable current. | 05-23-2013 |
| 20130181737 | TEST SYSTEM AND TEST METHOD FOR PCBA - A test system is provided. A printed circuit board (PCB) includes a plurality of traces and at least one test point. A central processing unit (CPU) socket including a plurality of first pins and a memory module slot including a plurality of second pins are disposed on the PCB. Each of the second pins is coupled to the corresponding first pin of the CPU socket via the corresponding trace. A CPU interposer board is inserted into the CPU socket, and a memory interposer board is inserted into the memory module slot. The traces form a test loop via the CPU interposer board and the memory interposer board. When an automatic test equipment (ATE) provides a test signal to the test loop via the test point, the ATE determines whether the test loop is normal according to a reflectometry result of the test signal. | 07-18-2013 |
| 20130234751 | DUAL POWER-SOURCE COMMUNICATION TESTING APPARATUS AND COMMUNICATION TESTING METHOD THEREOF - A dual power-source testing apparatus for testing a communication board and communication testing method thereof are disclosed. The communication testing apparatus comprises a main body, a first power supply module, and a second power supply module. The main body has a communication testing area with a first port and a second port for supplying power, wherein the hoard is to be placed in the communication testing area. The first power supply module is configured to provide first power to the communication board through the communication testing area while performing a charging operation to the second power supply module. The communication testing method is to be performed similarly in a communication testing apparatus using dual power sources. Using the present invention may keep good qualities of communication testing operations being performed to the communication board. | 09-12-2013 |
| 20130241592 | SERVER WITH CURRENT MONITORING SYSTEM - A current monitoring system for monitoring at least one current terminal of a motherboard includes at least one current monitoring unit and an indication device connected to the at least one current monitoring unit. Each current monitoring unit determines whether a current output from a corresponding current terminal is abnormal. The indication device encodes and displays a determination of the current monitoring unit and alarms according to the determination. | 09-19-2013 |
| 20130265079 | METHOD FOR PRINTED CIRCUIT BOARD TRACE CHARACTERIZATION - A method is provided which measures PCB trace characteristics from measurements of a PCB trace structure. | 10-10-2013 |
| 20130271177 | PRINTED CIRCUIT BOARD, METHOD OF PRODUCING A PRINTED CIRCUIT BOARD AND TESTING DEVICE FOR TESTING A PRINTED CIRCUIT BOARD - The invention relates to a printed circuit board ( | 10-17-2013 |
| 20130321023 | Test Device For Testing A Flat Module - A test device for testing a flat module includes a test station and a cover movable relative to the test station between a test position and a removal position. At least two holding devices are arranged and formed on the cover in such a way that, when the cover moves from its removal position into the test position, they releasably connect to the flat module arranged in the test station in such a way that, when the cover moves from its test position into the removal position, the flat module is held by the at least two holding devices. | 12-05-2013 |
| 20140015563 | TRACE STRUCTURE FOR THE TOUCH PANEL AND ELECTRICAL TESTING METHOD - A trace structure for a touch panel having a transparent substrate with a touch sensing region and a border region surrounding the touch sensing region, the trace structure including: a plurality of traces disposed on the transparent substrate and within the border region; a plurality of bonding pads disposed in the border region of the transparent substrate, wherein each bonding pad has a first side and a second side, and the first side of each bonding pad is connected to a corresponding trace of the plurality of traces; and at least two trace extending portions extended toward an outer edge of the border region from the second side of two of the plurality of bonding pads. | 01-16-2014 |
| 20140028343 | INSPECTION JIG AND CONTACT - A contact that can maintain the function of a spring portion even under relatively high current conditions, and an inspection jig equipped with the contact are provided. A contact of an inspection jig includes a columnar portion and a cylindrical portion disposed around the columnar portion. The columnar portion includes a front end portion protruding from the cylindrical portion, and a rear end portion. The cylindrical portion has a spring portion, and the spring portion is configured to expand and compress to change a dimension between the front end portion of the columnar portion and the rear end portion of the cylindrical portion. The cylindrical portion is formed of an alloy of nickel and phosphorus. | 01-30-2014 |
| 20140077834 | PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION METHOD - A printed wiring board includes: a laminated body that has a plurality of wiring layers laminated therein; a first through hole that electrically connects two or more wiring layers with each other; and a second through hole that has strength to expansion and contraction of the laminated body less than in the first through hole. | 03-20-2014 |
| 20140084957 | WIRING CHECK DEVICE AND WIRING CHECK SYSTEM - An objective of the present invention is to provide a wiring check device with which it is possible, with respect to finding a risk of deterioration of electromagnetic noise characteristics, to take into account the presence of a plane conductor other than a plane conductor located closest to the wiring. A wiring check device according to the present invention includes: a wiring information acquisition unit which acquires wiring information on a wiring which is included in a printed substrate having a multi-layered structure; a plane conductor detection unit which detects a plurality of plane conductors on multiple layers among the multi-layered structure which include a layer located closest to the wiring; a plane conductor overlap configuration detection unit which detects a plane conductor overlap configuration of a configuration in which the plurality of plane conductors overlap; and a bridge point detection unit which detects a point where the wiring steps over a plane conductor excluded region in the plane conductor overlap configuration on the basis of a wiring-plane conductor overlap configuration of a configuration in which the wiring and the plane conductor overlap configuration are overlapped. | 03-27-2014 |
| 20140125375 | BOARD INSPECTION APPARATUS SYSTEM AND BOARD INSPECTION METHOD - A board inspection apparatus system includes a first apparatus, a second apparatus, a third apparatus and an information transfer section. The first apparatus acquires first three-dimensional information of a solder paste on a board, and inspects whether the solder paste is formed good by a first tolerance based on the first three-dimensional information. The second apparatus mounts an electronic component on the board to join the electronic component and the solder paste. The third apparatus acquires second three-dimensional information of a solder joint, and inspects whether the electronic component is mounted good by a second tolerance based on the second three-dimensional information. The information transfer section transfers the first three-dimensional information to the third apparatus, or transfers the second three-dimensional information to the first apparatus. Thus, a more effective inspection condition may be established, and a rate of defect for each apparatus may be greatly reduced. | 05-08-2014 |
| 20140139259 | TEST METHOD FOR INTERPOSER - A test method for an interposer is provided. The interposer includes a plurality of conductive lines therein and a plurality of connecting contacts thereon, wherein the connecting contacts are electrically connected to the conductive lines. The test method for an interposer provides a passive transponder device. The passive transponder device includes a first circuit including an open/short test circuit and at least a pair of connecting contacts. The test method for an interposer includes contacting the connecting contacts of the first circuit in the passive transponder device with the selected contacts on the interposer to form a checking area and conducting an open-circuit or short-circuit test for the interposer through the checking area. | 05-22-2014 |
| 20140218065 | DETECTING EARLY FAILURES IN PRINTED WIRING BOARDS - A method includes characterizing the effects of an electric field on a first set of printed wiring boards (PWBs) by testing the first set of PWBs to generate test data, using the test data to determine a dielectric life curve of the first set of PWBs, and based on the dielectric life curve, defining a screening time and a screening voltage to screen for premature failures in a second set of PWBs due to electric fields. | 08-07-2014 |
| 20140347090 | SYSTEM AND METHOD FOR TESTING LAYOUT OF POWER PIN OF INTEGRATED CHIP ON PRINTED CIRCUIT BOARD - A testing system includes a layout information obtaining module, a first power pin sorting module, a transmission line sorting module, a power pin filtering module, a distance calculating module, a comparing module, and a report generating module. The layout information obtaining module obtains layout information. The first power pin sorting module sorts a power pin from a plurality of pins of a IC. The transmission line sorting module sorts transmission lines. The power pin filtering module filters power pins from a plurality of pins of capacities in same transmission line. The distance calculating module calculates distances between the power pin of the IC and each of the power pins of the capacities. The comparing module compares each of the distances with a threshold distance. The report generating module generates a testing report to depict whether or not the sorted power pins of the IC are qualified. | 11-27-2014 |
| 20140375351 | INSPECTION APPARATUS AND INSPECTION METHOD FOR INSPECTING A WIRING BOARD - An inspection apparatus for inspecting a wiring board having an opposing electrode facing an upper face of the wiring board, a capacitance meter electrically connected to the opposing electrode and the multi-layer wiring, and measuring capacitance between the opposing electrode and the multi-layer wiring, ground, a switch box that is connected to the ground wirings, the opposing electrode, and the ground, and switches to select between a first connection state, in which all the ground wirings are electrically connected to the opposing electrode, and a second connection state, in which one ground wiring is electrically connected to the ground. A control unit extracts a capacitance value by calculating difference between a first capacitance and a second capacitance, wherein capacitance in units of layers of the multi-layer wiring are measured based on the capacitance value extracted by the control unit. | 12-25-2014 |
| 20150028915 | TOUCH PANEL AND TEST METHOD THEREOF - A touch panel and a method thereof are provided. The touch panel includes a touch sensor, a shielding layer, and a plurality of conducting foils. The shielding layer is disposed on the touch sensor. The plurality of conducting foils is disposed via an Anisotropic Conductive Film (ACF) on a surface of the shielding layer, which is on an opposite side of a surface of the touch sensor. Any two of the plurality of conducting foils, the ACF, and the shielding layer are connected in series as a signal path. | 01-29-2015 |
| 20150130501 | ADJUSTABLE RESISTOR DEVICE - An adjustable resistor device includes a first pin, a second pin, a resistance-adjusting branch circuit, and a resistance display circuit. The first and second pins are configured to connect to an external circuit. The resistance-adjusting branch circuit is connected between the first pin and the second pin, and provides resistors for testing the external circuit. The resistance display circuit displays a resistance of the resistance display circuit. | 05-14-2015 |
| 20150145552 | PRINTED CIRCUIT ARRANGEMENT - The invention relates to a printed circuit arrangement comprising a printed circuit board having a corrosion test circuit comprising at least two conductive pads which are located proximate to each other in a measuring area, the arrangement further comprising a measuring device, characterized in that one pad is an excitation pad, being connected to an excitation signal source, and the other pad is a response pad, whereby the measuring device is connected at least to the response pad. This arrangement allows the measurement of the corrosion of a printed circuit board including short circuits and line cuts. | 05-28-2015 |
| 20150338457 | RESIDUAL MATERIAL DETECTION IN BACKDRILLED STUBS - A stub of a via formed in a printed circuit board is backdrilled to a predetermined depth. A capacitance probe is positioned within the via. Then the capacitance probe is used to obtain a test capacitance measurement. The test capacitance measurement is compared to a predetermined baseline capacitance measurement. Residual conductive plating material in the backdrilled stub causes the test capacitance measurement to exceed the predetermined baseline capacitance measurement. An indication is made that the predetermined baseline capacitance measurement has been exceeded. | 11-26-2015 |
| 20160047855 | PCB AUTHENTICATION AND COUNTERFEIT DETECTION - This disclosure relates generally to printed circuit board authentication, such as for protecting printed circuit boards against counterfeiting. The authentication can be implemented based on measurements from the PCB used to generate a unique signature for the PCB. The generated signature of the PCB can be evaluated to determine if the PCB is authentic or counterfeit. | 02-18-2016 |
