| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 324757010 | Transporting or conveying the device under test to the testing station | 30 |
| 20100315113 | HANDLER FOR ELECTRONIC COMPONENTS, IN PARTICULAR IC'S, COMPRISING CIRCULATING UNITS, THE TEMPERATURE OF WHICH CAN BE CONTROLLED - A handler for electronic components, in particular IC's, for controlling the temperature of the components and supplying and removing said components to and from a test device has circulating units that can be moved along a circulating track. Each unit has at least one retaining unit for retaining a component. In addition, the circulating units have temperature-control chambers containing components that are retained by the retaining units, so that the temperature of the components can be controlled during transport from the charging station to the test station. | 12-16-2010 |
| 20110050268 | Parking Structure Memory-Module Tester that Moves Test Motherboards Along a Highway for Remote Loading/Unloading - A parking-structure test system has motherboards that test memory modules. The motherboards are not stationary but are placed inside movable trays that move along conveyors. An unloader removes tested memory modules from test sockets on the motherboards, and a loader inserts untested memory modules into the motherboards using a robotic arm. A conveyor carries the motherboards from the loader to a parking and testing structure. An elevator raises or lowers the motherboards to different parking levels in the parking and testing structure. The motherboards move from the elevator to test stations on the parking level. A retractable connector from the test station makes contact with a motherboard connector to power up the motherboard, which then tests the memory modules. Test results are communicated from the test station to a host controller, which instructs the loader-unloader to sort the tested memory modules once the motherboard returns via the elevator and conveyors. | 03-03-2011 |
| 20110074458 | Transport Apparatus for Moving Carriers of Test Parts - One embodiment is a transport apparatus for moving carriers of microelectronic devices along a track, the transport apparatus including: (a) a track with two rails adapted to support the carriers; (b) a trolley adapted to be transported in a direction along the track by a linear actuator; and (c) a first and a second engagement feature attached to the trolley wherein the first engagement feature is adapted to engage temporarily with a first of the carriers, and the second engagement feature is adapted to engage temporarily with a second of the carriers; wherein a predetermined movement of the trolley slidably moves the first carrier onto a test position and slidably moves the second carrier off the test position simultaneously. | 03-31-2011 |
| 20110121853 | TEST ARRANGEMENT FOR AC VOLTAGE TESTING OF ELECTRICAL HIGH VOLTAGE COMPONENTS - A test arrangement is provided for AC voltage testing of high voltage components including at least one inverter, at least one test transformer, at least one high-voltage inductor and at least one further high voltage component arranged as test components in a common cuboid container. The at least one high-voltage inductor is movable at least partially out of the container through at least one opening on a boundary surface of the container, by means of a movement apparatus. The at least one further high voltage component is movable within the cuboid container from a transport position to a working position. | 05-26-2011 |
| 20130057310 | HANDLER AND PART INSPECTION APPARATUS - A handler includes a base having an opening portion, a first hand which transports a transport target, a first transport section which transports the first hand to above the opening portion and moves the first hand down, a second hand which transports the transport target, a second transport section which transports the second hand to above the opening portion and moves the second hand down, and a control section which controls an operation of the first transport section and an operation of the second transport section. The handler has a state where the first hand and the second hand are disposed in parallel to the opening portion while being close to each other toward above the opening portion. | 03-07-2013 |
| 20130200915 | Test System with Test Trays and Automated Test Tray Handling - A test system may be provided in which devices under test (DUTs) are loaded into test trays. Test trays may be tested at test stations. Test trays may be moved between test stations using a conveyor belt system. Each test station may include test equipment for testing DUTs and automated loading equipment for latching incoming test trays moving along the conveyor belt. The automated loading equipment may include a first movable arm configured to pick up a test tray from the conveyor belt and a second movable arm. The first arm may hand off (transfer) the test tray to the second arm. The second arm may move the test tray towards associated test equipment for testing. Upon completion of testing, the second arm may drop off the test tray onto the conveyor belt. Multiple layers of test stations may be stacked on top of each other for improved test throughput. | 08-08-2013 |
| 20130200916 | Testing System with Mobile Storage Carts and Computer-Controlled Loading Equipment - A test system may be provided in which devices under test undergo various types of testing. A first test location may have test equipment for testing input/output devices in the devices under test. A second test location may have test equipment for testing wireless communications circuitry in the devices under test. A mobile storage cart having shelves may be used to store the devices under test and to convey the devices under test between test locations. The storage cart may be configured to engage with a stationary frame structure at a test location. Actuators underneath the storage cart may be used to position the storage cart in a desired location. Distance sensors may be used to obtain status information about each shelf in the storage cart. A computer-controlled loading structure may be used to load the devices under test from the storage cart into test enclosures. | 08-08-2013 |
| 20130200917 | Test System with Hopper Equipment - A test system may be provided in which devices under test (DUTs) are loaded into test trays. Test trays may be moved between test stations using a test conveyor belt. The test system may include loading equipment for placing test trays on the test conveyor belt at desired intervals. The loading equipment may include a feed conveyor belt, tray support structure, and at least one computer-controlled grabber. Test trays may be placed on the feed conveyor belt by test personnel or automated loader. The grabber may be used to transport an incoming test tray from the feed conveyor belt to the support structure. The test tray may be temporarily docked at the support structure. The grabber may then transport the test tray from the support structure to the test conveyor belt so that the DUT on the test tray can be passed to the various test stations for testing. | 08-08-2013 |
| 20140103954 | TEST SYSTEM WITH ROTATIONAL TEST ARMS FOR TESTING SEMICONDUCTOR COMPONENTS - A test system with rotational test arms for testing semiconductor components includes a transport device, a first test socket, a second test socket, a first test arm, and a second test arm. The first test socket and the second test socket are electrically connected to different test signals respectively and correspond to the first test arm and the second test arm. The first test arm and the second test arm test arms operate rotationally to carry and place the semiconductor components to the transport device, the first test socket and the second test socket, so the test time is improved. | 04-17-2014 |
| 20140139253 | METHOD FOR INSPECTING ELECTRONIC DEVICE AND ELECTRONIC DEVICE INSPECTION APPARATUS - A method for inspecting an electronic device, in which inspection of electrical characteristics is carried out, uses conduction to pass a current to an electronic device while the electronic device is being continuously conveyed. | 05-22-2014 |
| 20140145743 | MODULAR PROBER AND METHOD FOR OPERATING SAME - The invention relates to a prober for checking and testing electronic semiconductor components and methods of using the same. The prober comprises at least two checking units, each of which is equipped with a chuck, probes, and a positioning unit, and each of which is assigned to a machine control system and a process control system. The prober further comprises a loading unit for automatically loading both testing units and an additional loader for manually loading at least one of the testing units, a user interface, and a module control system for controlling the process control systems and/or the machine control systems and the loading unit. The user interface can optionally be connected to at least one of the process control systems or the module control system by means of a switching device of the prober. | 05-29-2014 |
| 20140239998 | Turret Handlers and Methods of Operations Thereof - In one embodiment, a method of testing a semiconductor component includes loading a plurality of semiconductor components into a main turret of a turret handler, transporting the plurality of semiconductor components using the main turret to a test area, and splitting the plurality of semiconductor components into a first set and a second set. The method further includes testing a first semiconductor component in the first set at a first test pad using a tester while transporting a second semiconductor component in the second set to a second test pad and testing the second semiconductor component using the tester while transporting the first semiconductor component out of the first test pad. The first set and the second set are merged into the plurality of semiconductor components and the plurality of semiconductor components are transported away from the test area using the main turret. | 08-28-2014 |
| 20150022231 | Test Apparatus with Sector Conveyance Device - A test apparatus includes a sector conveyance device provided with a plurality of soaking buffers, the soaking buffers being used to carry electronic components, the sector conveyance device being mounted pivotably by a pivot and moved between a test location and a transferring location; a transferring device arranged in correspondence to the transferring location, used to transfer a plurality of electronic components into or out of the sector conveyance device; and a test device arranged in correspondence to the test location for testing electronic components, the electronic components being transferred into the sector conveyance device after test. | 01-22-2015 |
| 20150077153 | AUTOMATIC MODULE APPARATUS FOR MANUFACTURING SOLID STATE DRIVES (SSD) - An automatic module apparatus for manufacturing a solid state drive (SSD) includes a labeling apparatus, one or more test handler apparatuses and a sorting apparatus. The labeling apparatus is for printing a label on a SSD mounted on a carrier tray. The one or more test handler apparatuses are for transporting the carrier tray on which the labeled SSD is mounted and for testing the labeled SSDs to determine whether the labeled SSDs have any defects. The SSD sorting apparatus is for transporting the carrier tray on which the tested SSDs are mounted and sorting non-defective defective SSDs tested by the test handler apparatuses. The SSD labeling apparatus, the test handler apparatuses, and the SSD sorting apparatus are in-line and automated. | 03-19-2015 |
| 20150102832 | CARRIER DISASSEMBLING APPARATUS, ELECTRONIC DEVICE HOUSING APPARATUS, ELECTRONIC DEVICE RETRIEVING APPARATUS, AND ELECTRONIC DEVICE TESTING APPARATUS - A carrier disassembling apparatus which disassembles a test carrier including a base member and a cover member coming into close contact with each other, includes: a first reversing arm which sucks and holds the cover member; and a disassembly table which sucks and holds the base member. The first reversing arm can approach and separate from the disassembly table. The first reversing arm includes a first contract surface which comes into contact with the cover member. The first contract surface includes a protrusion which protrudes toward the cover member. | 04-16-2015 |
| 20160003898 | SYSTEMS AND METHODS FOR TESTING RFID STRAPS - Systems and methods provided for testing remote frequency identification (RFID) straps on a web. Testing system includes a test head having a pair of contact pins configured to be moved toward the web (or configured to make contact with web moved towards them) and into contact with the web or RFID strap. Conveyor continuously moves the web to move individual RFID straps into and out of alignment with the test head. Controller causes the contact pins to move toward the web at a frequency that's greater than the frequency at which the conveyor moves consecutive RFID straps into alignment with the test head. Alternatively or additionally, the test head may have a mount formed of a compliant material that allows at least a portion of the test head to deflect while the contact pins are in contact with a continuously moving RFID strap, thereby maintaining contact between contact pins and strap. | 01-07-2016 |
| 20160091562 | TRANSFER METHOD AND INSPECTION SYSTEM - In a transfer method for transferring a substrate in an inspection system configured to perform a test on electrical characteristics of the substrate, the inspection system including an inspection unit including a plurality of test devices configured to perform the test on the electrical characteristics of a substrate, a loader unit configured to mount a cassette which accommodates a plurality of substrates, and a transfer device configured to transfer a substrate between the inspection unit and the loader unit, an inspected substrate is received by the transfer device from the inspection unit. The inspected substrate received from the inspection unit is transferred toward the loader unit in a state where an opening portion of a transfer arm container of the transfer device. Then, the inspected substrate is delivered to the loader unit. | 03-31-2016 |
| 324757020 | Printed circuit board | 3 |
| 20120092036 | UPRIGHT TEST APPARATUS FOR ELECTRONIC ASSEMBLIES - An upright test apparatus for electronic assemblies includes a case assembly, first motherboard assemblies and a handler. The first motherboard assemblies are disposed in the case assembly. Each first motherboard assembly includes a motherboard, a first main connector, an adapter, a first sub-connector and a central processing unit (CPU). The motherboard is vertically disposed in the case assembly. The first main connector is disposed on the motherboard and electrically connected to the motherboard. The adapter is electrically connected to the first main connector and is substantially perpendicular to the motherboard. The first sub-connector is disposed on the adapter. The CPU is disposed on the motherboard and electrically connected to the motherboard. The handler inserts the electronic assemblies into the first sub-connectors in a vertical direction, respectively, tests the electronic assemblies and removes the electronic assemblies after the electronic assemblies are tested. | 04-19-2012 |
| 20130257471 | APPARATUS AND METHOD FOR MANUFACTURING SUBSTRATES - A substrate manufacturing apparatus includes a test apparatus including a test handler module for performing a test process on a substrate. The test handler module may include a conveyor unit to transfer a substrate, a handler unit for performing a test process on the substrate, and a transfer unit for transferring the substrate between the conveyor unit and the handler unit. The conveyor unit may include a feed conveyor and a discharge conveyor spaced apart from the feed conveyor. | 10-03-2013 |
| 20140197861 | Test Equipment for Testing Semiconductor Device and Methods of Testing Semiconductor Device Using the Same - A method of testing a semiconductor device using the test equipment includes loading an undivided printed circuit board (PCB) including unit PCBs in a test equipment. A semiconductor device is mounted in each of the unit PCBs. Product information of the undivided PCB loaded in the test equipment is confirmed. The undivided PCB whose product information has been confirmed is electrically connected to one of a plurality of main testers of the test equipment. Each of the main testers includes a main test interface directly connected to a cloud server in which firmwares for various kinds of tests are stored. The product information of the undivided PCB is transmitted to the main tester electrically connected to the undivided PCB. The main tester to which the product information has been transmitted performs a main test of the undivided PCB using the product information. The undivided PCB on which the main test has been performed by the main tester is unloaded from the test equipment. | 07-17-2014 |
| 324757030 | Wafer | 2 |
| 20110012635 | WET HIGH POTENTIAL QUALIFICATION TOOL FOR SOLAR CELL FABRICATION - Embodiments of the invention generally provide methods and an apparatus for processing and qualifying a formed photovoltaic device to assure that the formed photovoltaic device meets desired quality and industry electrical standards. Embodiments of the present invention may also provide a photovoltaic device, or solar cell device, production line that is adapted to form a thin film solar cell device by accepting an unprocessed substrate and performing multiple deposition, material removal, cleaning, bonding, and testing steps to form a complete functional and tested solar cell device. The solar cell device production line, or system, is generally an arrangement of processing modules and automation equipment used to form solar cell devices that are interconnected by automated material handling system. In one embodiment, the system is a fully automated solar cell production line that is designed to reduce and/or remove the need for human interaction and/or labor intensive processing steps to improve the device reliability, process repeatability, and the solar cell formation process cost of ownership (CoO). | 01-20-2011 |
| 20110248738 | TESTING APPARATUS FOR ELECTRONIC DEVICES - A wafer processing apparatus used for the testing of electronic devices comprises first and second clampers movably mounted on a shaft, each clamper being configured for holding a wafer carrier on which a wafer is mounted. Clamping fingers on each of the first and second clampers are operative to clamp onto the wafer carrier to hold the wafer carriers, and the clampers are operative to move the wafer carriers reciprocally between a loading position and a wafer processing location for processing the wafers. | 10-13-2011 |
| 324757040 | Packaged IC or unpackaged die or dice | 7 |
| 20110089968 | ELECTRONIC DEVICE MOUNTING APPARATUS AND METHOD OF MOUNTING ELECTRONIC DEVICE - The electronic device mounting apparatus 1 comprises: a first camera 123 for imaging a flexible board 74 of a base member 70 of a test carrier 60 to generate a first image information; an image processing apparatus 40 for detecting a position of an alignment mark 79 of the flexible board 74 from the first image information and calculating a print start position 782 of the first interconnect patterns 78 on the flexible board 74 on the basis of the position of the alignment mark 79; a printing head 122 for forming a first interconnect pattern 78 on the flexible board 74 from the print start position 782; and a second conveyor arm 21 for mounting a die 90 on the flexible board 74 on which the first interconnect pattern 78 is formed. | 04-21-2011 |
| 20110199113 | INSERT CONTAINING APPARATUS FOR SEMICONDUCTOR PACKAGE - An insert containing apparatus for a semiconductor package. The insert containing apparatus for a semiconductor package includes: a tray; an insert that is disposed in the tray, wherein at least one semiconductor package is seated on the insert and a through hole is formed around the semiconductor package; and an adapter including at least one finger of which an end portion passes through the through hole of the insert and guides the semiconductor package to a predetermined position so as to arrange the semiconductor package seated on the insert. The insert containing apparatus for a semiconductor package can be applied to semiconductor packages having any of various sizes by using a size-free insert. Thus, an investment cost of an instrument infrastructure can be greatly reduced, and an exchanging time of an insert can be reduced, and thus human power and time can be reduced. | 08-18-2011 |
| 20120062262 | Test Handlers For Semiconductor Packages and Test Methods Using the Same - A test handler for a semiconductor package includes a loader unit that is configured to transfer the semiconductor package to a test tray. A test chamber is configured to test the semiconductor package loaded in the test tray. An unloader unit is configured to remove the tested semiconductor package from the test tray. A loader stage is configured to convey the test tray from the unloader unit to the loader unit. A test tray cleaning unit proximate the loader stage is configured to clean the test tray while it is being conveyed from the unloader unit to the loader unit. | 03-15-2012 |
| 20130249588 | DEVICE AND METHOD FOR TESTING A SOLAR MODULE - A test device for testing a solar module includes a transfer unit for transporting the solar module through the test device, an irradiation unit for irradiating the solar module, an imaging unit for optically capturing an image of the solar module and a tapping device for sensing parameters of the solar module and/or for supplying voltage to the solar module. The tapping device includes a contact bar on which a contact surface positioned on the solar module can glide or slide along during the transport process in order to generate an electrical connection. The contact surface is provided by a contact device that can be temporarily attached to the solar module. | 09-26-2013 |
| 20140009184 | SEMICONDUCTOR CHIP TEST APPARATUS AND METHOD - A semiconductor chip test method used in a semiconductor chip test apparatus including an electric energy measurement unit defining multiple conducting pin holes in a recess of an electric energy test table for holding contact pins of a semiconductor chip for testing electric properties, a functional tester disposed adjacent to the electric energy measurement unit for testing predetermined functions of the semiconductor chip in a functional test table thereof and transmitting tested data to an external display screen through a display card, and a conveyer unit controllable to deliver the test semiconductor chip to the electric energy test table for electric energy measurement and to the functional test table of the functional tester for functional test. | 01-09-2014 |
| 20140253168 | APPARATUS FOR TESTING A SEMICONDUCTOR PACKAGE - An apparatus for testing a semiconductor package including a shuttle, a socket and a pressing unit may be provided. The shuttle may include a pocket, which is configured to receive the semiconductor package and a printed circuit board (PCB). The PCB may be configured to make electrical contact with the semiconductor package. The socket may be arranged under the shuttle and include socket pins configured to make electrical contact with the PCB. The pressing unit may be arranged on the shuttle and may be movable in a vertical direction. The pressing unit may press on the shuttle toward the socket such that the semiconductor package may be electrically connected to the socket pins. Because the semiconductor package received in the shuttle may make contact with the socket at the testing region to test the semiconductor package, the semiconductor package may not fall off or may not be slanted. | 09-11-2014 |
| 20140312926 | TESTING STACKED DEVICES - Testing stacked devices. In accordance with a first method embodiment, a primary circuit assembly is accessed from a first circuit assembly carrier. The primary circuit assembly is placed into a test fixture. A secondary circuit assembly is accessed from a second circuit assembly carrier. The secondary circuit assembly is placed into the test fixture on top of the primary circuit assembly. The primary circuit assembly is tested in conjunction with said secondary circuit assembly while coupled together. | 10-23-2014 |
| 324757050 | Multiple chip module | 1 |
| 20160057875 | Semiconductor Module with Gripping Sockets, Methods for Gripping, for Moving and for Electrically Testing a Semiconductor Module - One aspect of the invention relates to a semiconductor module with an outer housing having four side walls, and a circuit carrier, which is mounted on the outer housing and has an upper side and a lower side opposite the upper side. A semiconductor chip is arranged on the upper side and in the outer housing. A first gripping socket, which is formed as an indentation, extends from the outer side of the outer housing into a first of the side walls. | 02-25-2016 |
