| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 324756070 | Board or plate | 41 |
| 20100301889 | CIRCUIT BOARD UNIT AND TESTING APPARATUS - Provided is a circuit board unit for connecting a connecting terminal of a testing apparatus to a connected terminal of a device under test, including: a circuit board having, on one surface, a contact corresponding to the connected terminal; and a connector guide provided on the one surface of the circuit board, the connector guide guiding a connector having the connecting terminal to the circuit board, and pulling the connector towards the circuit board. In this circuit board unit, the connector guide may bias the connector on a side of the connecting terminal, towards the circuit board. Moreover in the circuit board unit, the circuit board may further have a substrate frame that is coupled to the connector guide and biases the connector guide towards the circuit board. | 12-02-2010 |
| 20110006799 | METHOD FOR MANUFACTURING PROBE SUPPORTING PLATE, COMPUTER STORAGE MEDIUM AND PROBE SUPPORTING PLATE - A prescribed pattern is formed on a thin metal plate by photolithography. The thin metal plate is etched by using the pattern as a mask to form a plurality of through-holes having diameters greater than diameters of probes, in the thin metal plate. The etching is performed on a plurality of the thin metal plates. After the pattern is removed, the plurality of thin metal plates are laminated by conforming the through-holes of each of the thin metal plates to guide pins of a guide. The laminated plurality of thin metal plates are bonded by diffusion bonding. An insulating film is formed on surfaces of the thin metal plates and an inner surface of each of the through-holes. A film thickness of the insulating film is adjusted so that inner diameters of the through-holes whereupon the insulating film is formed match with the diameters of the probes. | 01-13-2011 |
| 20110006800 | SYSTEM FOR TESTING AN INTEGRATED CIRCUIT OF A DEVICE AND ITS METHOD OF USE - A cartridge, including a cartridge frame, formations on the cartridge frame for mounting the cartridge frame in a fixed position to an apparatus frame, a contactor support structure, a contactor interface on the contactor support structure, a plurality of terminals, held by the contactor support structure, for contacting contacts on a device, and a plurality of conductors, held by the contactor support structure, connecting the interface to the terminals. | 01-13-2011 |
| 20110025362 | APPARATUS AND METHOD FOR MEASURING PHASE NOISE/JITTER IN DEVICES UNDER TEST - A system for testing integrated circuit products and other devices under test (DUT) includes a DUT tester, which stimulates the devices under test and analyzes signals from the devices under test. A device interface board transports signals between the DUT tester and the devices under test. A test board is coupled to the device interface board and used to generate measurements associated with the devices under test, such as phase noise or phase jitter measurements. The test board could, for example, include a phase detector for detecting a phase difference between two signals and a control loop for adjusting at least one of the two signals to maintain an average of zero DC volts at an output of the phase detector. A customization module could also be used to customize the test board. The customization module could include a phase shifter, a phase-locked loop synthesizer, and/or an oscillator. | 02-03-2011 |
| 20110037493 | PROBE-ABLE VOLTAGE CONTRAST TEST STRUCTURES - Test structures and method for detecting defects using the same. A probe-able voltage contrast (VC) comb test structure that includes first, second and third probe pads, a comb-like structure including grounded tines, floating tines between the grounded tines, switching devices coupled with an end portion of each floating tine, and connecting the floating tines to the second probe pad, and the third probe pad being a control pad which controls the switching devices. A probe-able VC serpentine test structure that includes first, second, third and fourth probe pads, a comb-like structure including grounded tines, floating tines between the grounded tines and each floating tine connected together between the second and third probe pads, switching devices connected to an end portion of each floating tine and connecting the floating tines to the second and third probe pads, and the fourth probe pad being a control pad which controls the switching devices. | 02-17-2011 |
| 20110156741 | TEST OF ELECTRONIC DEVICES WITH BOARDS WITHOUT SOCKETS BASED ON MAGNETIC LOCKING - An embodiment is proposed for testing electronic devices; each electronic device has a plurality of terminals for electrically contacting the electronic device. A corresponding test system includes a set of test boards; each test board is equipped with a plurality of banks of electrically conductive receptacles each one for resting a corresponding electronic device (with each receptacle that is adapted to receive a terminal of the corresponding electronic device). Locking means are provided for mechanically locking the electronic devices on the test boards. The locking means include free means—such as ferromagnetic discs—being adapted to be freely rested on the electronic devices for pressing the electronic devices against the test boards—for example, because of the attractive force exerted by corresponding magnetic discs being fastened under the test board. | 06-30-2011 |
| 20110204915 | DIE TESTING USING TOP SURFACE TEST PADS - Timely testing of die on wafer reduces the cost to manufacture ICs. This disclosure describes a die test structure and process to reduce test time by adding test pads on the top surface of the die. The added test pads allow a tester to probe and test more circuits within the die simultaneously. Also, the added test pads contribute to a reduction in the amount of test wiring overhead traditionally required to access and test circuits within a die, thus reducing die size. | 08-25-2011 |
| 20110227597 | Test Adapter Configuration - The invention provides a base plate for a test adapter for use in testing devices in a production line. The base plate comprises a first interface configured to connect to a product-specific part configured to receive and test a specific type of device under test, and a second interface configured to connect to a common part comprising testing elements common to various devices under test. The base plate is a printed wiring board arranged to couple signals from the common part to the device under test. | 09-22-2011 |
| 20110234252 | WAFER UNIT FOR TESTING AND TEST SYSTEM - Provided is a test wafer unit for testing a plurality of semiconductor chips formed on a semiconductor wafer, the test wafer unit including: a test wafer having a shape corresponding to a shape of the semiconductor wafer; and a plurality of test circuits formed on the test wafer, each test circuit provided to correspond to two or more of the plurality of semiconductor chips and testing the two or more semiconductor chips. The test wafer unit may include a plurality of connection terminals formed on the test wafer in one to one relation with test terminals of the plurality of semiconductor chips, where each of the plurality of connection terminals is connected to a corresponding one of the test terminals. | 09-29-2011 |
| 20110241718 | Test Plate for Electronic Component Handler - Test plates with improved test pockets are described herein. One embodiment is a circular test plate comprising a plurality of test pockets, each test pocket being a quadrilateral hole in the test plate, and each quadrilateral hole having four sides and four corners located at the intersections of the sides. Each of the four corners comprises at least one corner having a corner relief that extends from and intersects each of the at least one corner's two intersecting sides, and any remaining corners not having a corner relief. The test plate can be incorporated into a component handler. | 10-06-2011 |
| 20110267089 | TESTING BOARD - The testing board is used to carry electrical device for electric testing. The testing board is constructed by a main testing board and a supporting board assembled on the lower surface of the main testing board. The main testing board and the supporting board respectively have a first thickness and a second thickness. The sum of the first thickness and the second thickness is matching the required distance of a testing apparatus. | 11-03-2011 |
| 20110298487 | SEMICONDUCTOR TESTING APPARATUS AND TESTING METHOD - An apparatus for testing electric characteristics of a semiconductor device having a plurality of hemispherical electrode terminals on one surface thereof, including: a support plate vertically movably supported by an elastic member, supporting a side of the one surface of the semiconductor device, and having through holes for accommodating the hemispherical electrode terminals; a probe pin securing block placed under the support plate; a plurality of probe pins secured to the probe pin securing block and having concave-shaped tips facing the hemispherical electrode terminals of the semiconductor device supported by the support plate; and a vertically movable pressing head placed over the support plate for applying a downward pressure on the support plate, wherein after the support plate is lowered by a predetermined amount by the downward pressure from the pressing head, the pressing head contacts the semiconductor device and applies a downward pressure thereon. | 12-08-2011 |
| 20120056636 | TEST HANDLER AND METHOD FOR OPERATING THE SAME FOR TESTING SEMICONDUCTOR DEVICES - A test handler is provided, which comprises a test tray, at least one opening unit, and a position changing apparatus. The test tray aligns a plurality of inserts on its side. Each insert loads at least one semiconductor device thereon. The opening unit opens inserts at one part of the one side of the test tray. The position changing apparatus moves at least one opening unit in such a way that the at least one opening units can be located at another part of the one side of the test tray, such that the at least one opening units can open inserts at said another part of the one side of the test tray. The present invention can reduce the number of replaced parts according to change in the semiconductor device size, production cost, and part replacement time. | 03-08-2012 |
| 20120092035 | ADAPTED TEST APPARATUS FOR ELECTRONIC COMPONENTS - An adapted test apparatus for electronic components includes a case assembly, a plurality of first motherboard assemblies and a handler. The first motherboard assemblies are disposed in the case assembly. Each first motherboard assembly includes a motherboard, a first main connector, an adapter, a plurality of test connectors and a central processing unit (CPU). The motherboard is vertically disposed in the case assembly. The first main connector is disposed on the motherboard and electrically connected to the motherboard. The adapter is electrically connected to the first main connector and substantially perpendicular to the motherboard. The test connector is disposed on the adapter. The CPU is disposed on the motherboard and electrically connected to the motherboard. The handler inserts a plurality of electronic components into the test connectors in a vertical direction, tests the electronic components and removes the electronic components after the electronic components are tested. | 04-19-2012 |
| 20120105091 | STACKED FPGA BOARD FOR SEMICONDUCTOR VERIFICATION - Disclosed herein is an FPGA board assembly for inspecting a semiconductor, the FPGA board assembly being a programmable logic device (PLD) board for inspecting a semiconductor product design, comprising: one or more FPGA boards, each including an FPGA chip provided with a logic circuit for inspecting a semiconductor and a plurality of connectors for inputting/outputting signals; and a switching board including connectors corresponding to the connectors and selectively connecting signals between the FPGA boards, wherein the one or more FPGA boards and the switching board are connected with each other in the form of a laminate by their respective connectors to inspect a semiconductor product design. The FPGA board assembly is advantageous in that boards can be easily connected with each other and in that various problems, such as difficulties of wiring design, the spatial restriction and the like, can be solved. | 05-03-2012 |
| 20120126844 | CHIP STACK DEVICE TESTING METHOD, CHIP STACK DEVICE REARRANGING UNIT, AND CHIP STACK DEVICE TESTING APPARATUS - A plurality of chip stack devices having different external sizes can be tested accurately and efficiently with low cost. The present invention provides a chip stack device testing method testing a chip stack device configured by stacking a plurality of chips separated by dicing a substrate under test tested in a testing unit. A tray for chip stack devices having equal shape and external dimension to those of the undiced substrate under test is used, one or a plurality of the chip stack devices are attached and supported to an adhesive layer of the tray for chip stack devices to align the chip stack devices with positions of the respective chips of the undiced substrate under test, the tray for chip stack devices is installed in the testing unit in a similar manner to that in a test of the substrate under test, and the respective chip stack devices are tested. | 05-24-2012 |
| 20120139573 | TEST BRACKET FOR CIRCUIT BOARD - A test bracket for testing a circuit board includes a base, two connection pieces, and a supporting member for supporting the circuit board. The base includes a board and two posts extending up from the board. The supporting member is pivotably installed between the posts. First ends of the connection pieces are respectively slidably connected to the posts, and second ends of the connection pieces opposite to the first ends are respectively pivotably connected to opposite sides of the supporting member. | 06-07-2012 |
| 20120146681 | CONNECTOR TEST SYSTEM - A connector test system includes a number of adapters, a number of testers, and a motherboard. Each tester is connected to a corresponding one of the adapters. The motherboard is configured for connecting to the connector. The motherboard includes a number of pins arrayed in a 9 by 10 matrix. The pins includes a number of signal input pins and a number of grounding pins, each signal input pin is connected to a corresponding adapter. | 06-14-2012 |
| 20120187973 | TEST APPARATUS - An existing test head is made best use of and a capital investment is reduced. A test apparatus for testing a plurality of devices under test includes: a plurality of test heads for retaining therein at least one test board to test devices under test; a connecting section mounted on upper surfaces of the plurality of test heads and is independently fixed to each of the plurality of test heads; and a DUT board on which the plurality of devices under test are mounted, the DUT board being mounted to the connecting section, where the at least one test board is mountable and removable through a side surface of each of the plurality of test heads while the connecting section is mounted to the test head. | 07-26-2012 |
| 20120206160 | TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS - Test structures for performing electrical tests of devices under one or more microbumps are provided. Each test structure includes at least one microbump pad and a test pad. The microbump pad is a part of a metal pad connected to an interconnect for a device. A width of the microbump pad is equal to or less than about 50 μm. The test pad is connected to the at least one microbump pad. The test pad has a size large enough to allow circuit probing of the device. The test pad is another part of the metal pad. A width of the test pad is greater than the at least one microbump pad. | 08-16-2012 |
| 20120229159 | TEST INTERFACE BOARD AND TEST SYSTEM INCLUDING THE SAME - A test interface board includes a wiring group, a plurality of contact portions, and a control device. The wiring group includes a main wire operatively coupled to a channel of a tester, and a plurality of sub-wires operatively coupled to the main wire. The plurality of contact portions are operatively coupled to the plurality of sub-wires, and contact first electrodes of a plurality of semiconductor devices. The control device includes a plurality of switching devices operatively coupled to the plurality of sub-wires, a memory configured to store an identification number, and a controller configured to open and close the plurality of switching devices in response to a control signal corresponding to the identification number from among a plurality of control signals. | 09-13-2012 |
| 20120229160 | WIRING BOARD FOR ELECTRONIC PARTS INSPECTING DEVICE AND ITS MANUFACTURING METHOD - A wiring board for an electronic parts inspecting device that can be designed and produced relatively quickly, inexpensively, and with few jigs is provided. In certain embodiments the wiring board includes a base board made of an insulating material having a front surface and a back surface, the base board including a plurality of first via conductors as well as first terminals on the front surface and outer terminals on the back surface that are connected to the ends of the first via conductors, and a mounting board on the front surface of the base board having a front side that includes, a plurality of probe pads, a plurality of second terminals that are electrically connected to the first terminals of the base board, and front surface wirings that connect the probe pads to the second terminals. Lastly, a method of manufacturing the same is provided. | 09-13-2012 |
| 20120268157 | TEST CARRIER AND BOARD ASSEMBLY - A test carrier | 10-25-2012 |
| 20120280707 | BOARD MOUNTING APPARATUS, TEST HEAD, AND ELECTRONIC DEVICE TEST APPARATUS - A board mounting apparatus includes: a guide mechanism which guides a pin electronic card along a horizontal direction to an inside of a test head; and an insert mechanism which moves a pin electronic card guided into the test head along a vertical direction so that the pin electronic card is electrically connected through connectors to a back board. | 11-08-2012 |
| 20130147507 | APPARATUS FOR PROBING DIE ELECTRICITY AND METHOD FOR FORMING THE SAME - A method of forming an apparatus for probing die electricity, which determines a reinforcement structure according to features of a converting plate, and combines the converting plate, reinforcement structure and a substrate for forming the apparatus for probing die electricity. In an embodiment, the apparatus for probing die electricity further comprises a substrate, a converting plate, a needle module and a reinforcement structure. The converting plate comprises two opposite surfaces respectively having a plurality of first and second conductive elements. The needle module comprises a plurality of needles respectively and electrically connected to the plurality second conductive elements. The reinforcement structure is disposed between the converting plate and the substrate. | 06-13-2013 |
| 20130265076 | ADAPTER BOARD AND DC POWER SUPPLY TEST SYSTEM USING SAME - An adapter board includes a PCB, a first gold finger mounted on the PCB, and a plurality of first connectors mounted on the PCB. The first gold finger includes a first ground pin and a plurality of power pin groups. Each first connector includes a load connection pin and a second ground pin electronically connected to the first ground pin, the load connecting pin of each first connector is electronically connected to a load, a oscilloscope, and a corresponding power pin group. | 10-10-2013 |
| 20130300447 | MANUFACTURING METHOD FOR ELECTRONIC COMPONENT, INSPECTION METHOD FOR ELECTRONIC COMPONENT, SHEET SUBSTRATE, ELECTRONIC COMPONENT, AND ELECTRONIC APPARATUS - A manufacturing method for an electronic component includes arranging, across boundaries of a first substrate region, wires for electrically connecting a piezoelectric resonator element arranged in the first substrate region and a lid arranged in a second substrate regions to a sheet substrate, performing, after arranging the piezoelectric resonator element and the lid in the substrate regions, input and output of a signal to and from the piezoelectric resonator element via the lid connected to the wires, and dividing the sheet substrate in each of the boundaries. | 11-14-2013 |
| 20130342236 | TEST INTERFACE BOARDS AND TEST SYSTEMS - A test interface board comprises at least one switch matrix including a plurality of switching elements that connect a plurality of connection nodes to each other. The at least one switch matrix is configured to connect a plurality of channels of an automatic test equipment (ATE) to respective pin positions corresponding to a device under test (DUT) in response to switching control signals. The plurality of channels provide test operation signals for testing the DUT. A control logic is configured to generate the switching control signals based on pin configuration information of the DUT. | 12-26-2013 |
| 20140002124 | Wire Probe Assembly and Forming Process for Die Testing | 01-02-2014 |
| 20140055159 | Interposer with Edge Probe Points - An interposer is shown with contact points on a lateral edge. When assembled between a board under test and an integrated circuit, traces of the interposer carry signals between the board under test and the integrated circuit and also between signal lines of the integrated circuit and the lateral edge contact points. The signals can then be accessed by test equipment at the lateral edge contact points. The interposer may include additional components connected to the traces. | 02-27-2014 |
| 20140139252 | ELONGATION TESTER - An elongation tester includes a fixed holder configured to hold an end of a tested material, a variable holder configured to hold a side of the tested material, the variable holder being formed of an elastic material and having a holding region that deforms in a longitudinal direction of the side of the tested material in accordance with deformation of the tested material, and a driver configured to reciprocate the fixed holder. | 05-22-2014 |
| 20140184261 | TESTING APPARATUS AND TESTING METHOD - A testing method is provided, including providing a testing apparatus including a carrier member and a testing element, the carrier member comprising a first surface, a second surface opposing the first surface, and an elastic conductive area defined on the first surface; disposing an object-to-be-tested on the elastic conductive area; electrically connecting the testing element to the object-to-be-tested and the carrier member, to form an electric loop among the carrier member, the object-to-be-tested and the testing element. Through the design of the elastic conductive area, the object-to-be-tested can be secured with a small pressure applied thereto, and is prevented from being cracked. | 07-03-2014 |
| 20140197860 | CURRENT-DIVERTING GUIDE PLATE FOR PROBE MODULE AND PROBE MODULE USING THE SAME - A current-diverting guide plate for use in a probe module is disclosed to include a plate body having a first surface, a second surface opposite to the first surface, and a plurality of through holes penetrating through the first and second surfaces. A conducting layer is provided at a periphery wall of each through hole of the plate body and electrically coupled to a probe slidably inserted through the through holes. A current-diverting circuit trace is disposed on the first surface of the plate body and electrically connected with the conducting layers for diverting the electric current flowing through probes. Thus, the current-diverting guide plate can be used to prevent the probes from possible damage due to an excessive instantaneous current. | 07-17-2014 |
| 20140292366 | LIGHTING JIG FOR INSPECTION OF A LIQUID CRYSTAL PANEL - A lighting jig for inspection of a liquid crystal panel, which includes: a base plate; a first supporting plate and a second supporting plate, which are respectively located on and orthogonal to the base plate; and an adsorption platform disposed between the first supporting plate and the second supporting plate and being able to move up and down along a direction orthogonal to the base plate. The adsorption platform has an adsorption surface for adsorbing probes, and the adsorption positions of the probes on the adsorption surface can be adjusted according to distributed locations of circuit test points of various liquid crystal panels to be inspected. The lighting jig provided by embodiments of the present invention can be used for lighting various types of liquid crystal panels, thereby improving the universality and use efficiency of the lighting jig. | 10-02-2014 |
| 20140327464 | TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS - A test structure including an array of microbumps electrically connecting a chip and a substrate, wherein a width of each microbump of the array of microbumps is equal to or less than about 50 microns (μm). The test structure further includes an interconnect structure connected to the array of microbumps. The test structure further includes an array of test pads around a periphery of the array of microbumps, wherein a test pad of the array of test pads is connected to a corresponding microbump of the array of microbumps through the interconnect structure. A width of the test pad is greater than a width of the corresponding microbump, and the test pad is adapted to be covered after circuit probing by a passivation material to prevent particle and corrosion issues. | 11-06-2014 |
| 20150028912 | BOARD FOR PROBE CARD, METHOD OF MANUFACTURING THE SAME, AND PROBE CARD - A board for a probe card includes a ceramic board including a first insulating layer, and second insulating layers disposed on one surface of the first insulating layer and including cavities for receiving electronic components, conductive patterns disposed on the first and second insulating layers, conductive vias electrically connecting the conductive patterns, and a capacitor disposed in the cavities. The cavities have a depth greater than a thickness of the capacitor to secure a space in a lower portion of the cavity after receiving the capacitor. | 01-29-2015 |
| 20150084662 | APPARATUS AND METHOD FOR TERMINATING PROBE APPARATUS OF SEMICONDUCTOR WAFER - A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester site by site at a proximal end of the probe and a distal end of the signal cable. in one embodiment, the probe apparatus includes: a chassis; a dielectric block mounted in the chassis for retaining the probe, the probe extending on the chassis from a proximal end of the probe to the dielectric block, extending through the dielectric block, and projecting from the dielectric block towards the semiconductor device at a distal end of the probe; and a terminating apparatus, mounted in the chassis, for terminating the proximal end of the probe with a distal end of the signal cable side by side. | 03-26-2015 |
| 20150377957 | APPARATUS FOR PROBING DIE ELECTRICITY AND METHOD FOR FORMING THE SAME - An apparatus for probing die electricity includes a substrate, a converting plate, a needle module and a reinforcement structure. The converting plate includes two opposite surfaces respectively having a plurality of first and second conductive elements. The needle module has a plurality of needles respectively and electrically connected to the plurality second conductive elements. The reinforcement structure is made from a polymer gel and disposed between the converting plate and the substrate. | 12-31-2015 |
| 20160091531 | TEST BOARD, TEST SYSTEM INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF - Provided is a test board including a main board which is configured to be connected to a plurality of devices-under-test (DUTs) and includes a plurality of test signal paths for transmitting a plurality of test signals input from an external tester to pins of at least one of the DUTs or transmitting a test result from the DUT to the tester, and a farm board which is connected to the main board and configured to mount therein a plurality of passive elements which are configured to be connected to at least one of the pins of the DUT through at least one of the test signal paths of the main board, when a test operation is performed, thereby improving a power integrity property or a signal integrity property in the test operation. | 03-31-2016 |
| 20160109479 | Continuous Breadboard - A continuous breadboard provides a continuous surface having no gaps or barriers. The continuous surface enables electrical components to position anywhere on the surface of the breadboard. The electrical components orient along any row or column on the surface of the breadboard. The capacity to position anywhere on the breadboard enables variously sized and dimensioned electrical components and their lead ends to integrate with the breadboard in myriad configurations. Additionally, multiple electrical components may be staked side-by-side for lateral electrical connectivity. The breadboard comprises a plate that forms a continuous surface with no gaps or barriers. The plate comprises banks disposed to abut an adjacent bank, such that no gaps are formed between banks. Apertures that extend twelve columns and one row across the banks provide electrical connections. The banks are grouped into a sets that share a common electrical continuity and can include an alternating AABBAABBCCDD arrangement. | 04-21-2016 |
| 20160178662 | TESTING APPARATUS HAVING TEST BASE WITH DETACHABLE SUPPORT PLATE | 06-23-2016 |
