| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 324755090 | Membrane | 8 |
| 20110043234 | SOCKET CONNECTOR FOR CONNECTION LEAD OF SEMICONDUCTOR DEVICE UNDER TEST WITH TESTER - A socket connector for electrically connecting a lead of a semiconductor device under test (DUT) with a tester includes a container having a chamber, a conductive end or plug that seals the chamber at one end, and a conductive membrane that seals the chamber at another end. A liquid conductive material fills the chamber. The conductive plug is arranged to be in electrical contact with the tester. The lead of the semiconductor DUT is in electrical contact with the conductive membrane and thus with the tester via the conductive membrane, the liquid conductive material and the conductive plug. | 02-24-2011 |
| 20110133766 | TRANSFORMER WITHIN WAFER TEST PROBE - A wafer test probe for testing integrated circuitry on a die is disclosed. The wafer test probe includes a membrane core. The wafer test probe also includes circuitry within the membrane core. The circuitry within the membrane core includes at least one portion of an inductor. The wafer test probe further includes a probe tip. | 06-09-2011 |
| 20120062261 | Electrically Conductive Pins For Microcircuit Tester - The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. | 03-15-2012 |
| 20130002285 | Electrically Conductive Pins For Microcircuit Tester - The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted. | 01-03-2013 |
| 20130321018 | MEMBRANE PROBING METHOD USING IMPROVED CONTACT - A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process. | 12-05-2013 |
| 20140266279 | Electrically Conductive Pins For Microcircuit Tester - The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted. | 09-18-2014 |
| 20150123689 | Electrically Conductive Pins For Microcircuit Tester - The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. | 05-07-2015 |
| 20160103153 | PROBE HEAD ASSEMBLIES, COMPONENTS THEREOF, TEST SYSTEMS INCLUDING THE SAME, AND METHODS OF OPERATING THE SAME - Probe head assemblies, components of probe head assemblies, test systems including the probe head assemblies and/or components thereof, and methods of operating the same. The probe head assemblies are configured to convey a plurality of test signals to and/or from a device under test and include a space transformer, a contacting assembly, and a riser that spatially separates the space transformer from the contacting assembly and conveys the plurality of test signals between the space transformer and the contacting assembly. The contacting assembly may include a frame that defines an aperture and has a coefficient of thermal expansion that is within a threshold difference of that of the device under test, a flexible dielectric body that is attached to the frame, maintained in tension by the frame, and extends across the aperture, and a plurality of conductive probes. The plurality of conductive probes may include a dual-faceted probe tip. | 04-14-2016 |
