| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 324755020 | Coaxial | 14 |
| 20110102007 | Calibrated wideband high frequency passive impedance probe - A calibrated passive impedance probe has a wide bandwidth operating range for impedance and performance measurements of RF and microwave components, devices, and circuits in 50Ω and 75Ω environments. The probe is calibrated at the probe tip, thus allowing accurate impedance and performance measurements of in-circuit functions and on-board components. The calibrated probe can be used to eliminate RF connectors and provide input and output connections to a circuit board for prototype design and quick performance verification thus realizing cost savings on RF connectors. The probe includes a semi-rigid coaxial cable assembly filled with dielectric material, a silver plated center conductor, and silver plated ground outer conductor having an SMA male connector on one end and exposed center conductor at the opposite end and having uniform characteristic impedance of 50Ω or 75Ω along the cable length; a hexagonal shaped body made of anodized aluminum having raised texture on the surface for sure handling; a probe tip of gold plated aluminum with two spring loaded ground pins; a four-finger threaded cable catch for locking semi-rigid coaxial cable assembly inside the tip and for ground continuity from cable to spring loaded pins; an interface RF connector-adapter including SMA female-SMA female, BNC-SMA female, or Type N-SMA female; a locking nut to hold and lock cable assembly and connector-adapter inside the probe body; and 50Ω and 75Ω precision loads for probe calibration. | 05-05-2011 |
| 20120274347 | INTEGRATED HIGH-SPEED PROBE SYSTEM - An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system. | 11-01-2012 |
| 20120306524 | High Temperature- Low Leakage Probe Apparatus and Method of Manufacturing Same - In one embodiment, the present invention includes an apparatus for contacting a plurality of contact locations of a semiconductor device. The apparatus includes a housing, a support member, a plurality of probe members, and an adhesive substance. The housing has a plurality of apertures that provides a low leakage pathway for high frequency signals to reach the semiconductor device through the plurality of probe members. The plurality of probe members are aligned on the support member and the adhesive substance secures the plurality of probe members to the supporting member. The housing, supporting member, and adhesive substance match in thermal expansion to reduce the error in alignment between the plurality of contact locations and the plurality of probe members over a temperature variance. | 12-06-2012 |
| 20130015873 | CABLE ASSEMBLY, CONNECTOR AND SEMICONDUCTOR TESTERAANM Suzuki; TeruhitoAACI YamatoAACO JPAAGP Suzuki; Teruhito Yamato JPAANM Sakiyama; ShinAACI TokyoAACO JPAAGP Sakiyama; Shin Tokyo JP - In a cable assembly, when auxiliary ground conductor is provided so as to face the lower surface of supporting insulating member, elastically-deformed piece in an elastically deformed status comes in contact with the tip of ground terminal protruding from the lower surface of supporting insulating member. | 01-17-2013 |
| 20140191775 | REDOX METHOD OF FORMING A COAXIAL PROBE STRUCTURE OF ELONGATED ELECTRICAL CONDUCTORS PROJECTING FROM A SUPPORT STRUCTURE - The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe. | 07-10-2014 |
| 20140203831 | COAXIAL PROBE - Disclosed is a coaxial probe comprising, an internal conductor comprising an upper contact configured to contact a semiconductor device; a lower contact configured to contact a tester for testing the semiconductor device; and an internal elastic member configured to elastically bias at least one of the upper and lower contacts to make the upper and lower contacts distant from each other; an external conductor configured to surround the internal conductor; a plurality of gap members which is respectively inserted into opposite ends between the internal conductor and the external conductor to create a predetermined air gap between the internal conductor and the external conductor; and at least one external elastic member that is inserted into an external circumferential surface of the external conductor to elastically bias at least one of the semiconductor device and the tester to a direction that makes either the semiconductor device or the test distant from the external conductor. | 07-24-2014 |
| 20150130491 | CABLE INTERFACE FOR COAXIAL CABLES - The invention relates to a cable interface ( | 05-14-2015 |
| 20160084878 | TRIAXIAL DC-AC CONNECTION SYSTEM - Embodiments of the present invention provide an improved two-cable connection system for connecting electrical test instrumentation to a device under test (DUT). In one embodiment, a single pair of equal-length triaxial cables each has a desired characteristic impedance. Each cable has a center connecter, intermediate conductor, and outer conductor. The proximal end of each cable is connected to the test instrumentation, and the distal ends are located at the DUT. At the distal end, the center conductors are connected to the DUT, the intermediate conductors are allowed to float, and the outer conductors are connected to each other. The proximal end of each cable is connected to the device using an appropriate connection for the test that will be performed. This allows the test instrumentation to perform different types of tests without changing connections to the DUT. | 03-24-2016 |
| 20160124016 | TESTING PROBE AND SEMICONDUCTOR TESTING FIXTURE, AND FABRICATION METHODS THEREOF - Testing probe and semiconductor testing fixture, and their fabrication methods are provided. A testing probe may configure a chamber through an insulating body. A first testing pin is disposed inside the chamber of the insulating body. The first testing pin includes: a first testing terminal on one end of the first testing pin and a first connection terminal on another end of the first testing pin. An elastic member is disposed inside the chamber and attached to the first testing pin to drive an upward or downward movement of the first testing pin along the chamber. A second testing pin is disposed around an outer sidewall surface of the insulating body enclosing the first testing pin. The second testing pin includes a second testing terminal on one end of the second testing pin and a second connection terminal on another end of the second testing pin. | 05-05-2016 |
| 20160124017 | TESTING PROBE AND SEMICONDUCTOR TESTING FIXTURE, AND FABRICATION METHODS THEREOF - Testing probe and semiconductor testing fixture, and their fabrication methods are provided. A plurality of first testing pins is formed on the substrate, each first testing pin including a first testing terminal on a top and a first connection terminal on a bottom. An insulating layer is formed on a sidewall surface of each first testing pin. A number of second testing pins are formed on the insulating layers, each second testing pin including a second testing terminal on a top thereof and a second connection terminal on a bottom thereof. A first concave surface is formed on a top of the second testing terminal, and surrounds a corresponding first testing pin. | 05-05-2016 |
| 20160124018 | TESTING PROBE, SEMICONDUCTOR TESTING FIXTURE AND FABRICATION METHOD THEREOF - A testing probe is provided. The testing probe includes a first testing tip; an insulation layer formed on a side surface of the first testing tip; and a second testing tip being coaxial with the first testing tip and surrounding the first testing tip formed on a side surface of the insulation layer. | 05-05-2016 |
| 20160124019 | SEMICONDUCTOR TESTING FIXTURE AND FABRICATION METHOD THEREOF - A semiconductor testing fixture is provided. The semiconductor testing fixture includes a substrate having a plurality of testing regions; and a plurality of testing probes with a predetermined distribution pattern formed on the substrate in each of the plurality of testing regions. Etch of the testing probes comprises a first testing tip; an insulation layer formed on a side surface of the first testing tip; and a second testing tip being coaxial with the first testing tip and surrounding the first testing tip formed on a side surface of the insulation layer. | 05-05-2016 |
| 20160124020 | SEMICONDUCTOR TESTING FIXTURE AND FABRICATION METHOD THEREOF - A semiconductor testing fixture is provided. The semiconductor testing fixture comprises a substrate having a surface; a plurality of testing probes formed on the surface of the substrate; and a dielectric layer filling space between adjacent testing probes and covering side surfaces of the plurality of testing probes formed on the surface of the substrate. | 05-05-2016 |
| 20160187413 | CABLE ASSEMBLY, CONNECTOR AND SEMICONDUCTOR TESTER - In a cable assembly, when auxiliary ground conductor is provided so as to face the lower surface of supporting insulating member, elastically-deformed piece in an elastically deformed status comes in contact with the tip of ground terminal protruding from the lower surface of supporting insulating member. | 06-30-2016 |
