| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 324750260 | Shielding or casing of device under test or of test structure | 17 |
| 20120139571 | System for Field Testing Wireless Devices With Reduced Multipath Interference - A portable test chamber with an open top may serve as a field testing apparatus for wireless testing of electronic devices. A wireless device under test may be mounted within a cavity in the test chamber. The cavity may be surrounded by a dielectric lining of anechoic material. A layer of electromagnetic shielding such as metal foil may cover the outer surfaces of the dielectric lining. The chamber may have a box shape with a rectangular opening at its top. Satellite navigation system signals or other wireless signals may be received through the opening at the top of the test chamber during testing. The electromagnetic shielding may reduce the effects of multipath interference during field tests. | 06-07-2012 |
| 20120182034 | CONTACT ASSEMBLY - A contact assembly for receiving a spring probe unit includes an elongate contact element adapted to electrically contact the spring probe unit. The contact element includes a stop for restraining movement of the spring probe unit towards the stop in the direction of an axis along the length of the contact element, and urging means, adapted to urge the spring probe unit against the contact element for removable engagement of the spring probe unit with the contact element. | 07-19-2012 |
| 20120262198 | SEMICONDUCTOR DEVICE - A method of testing a semiconductor device includes providing a first wafer that includes a first surface, a second surface that is allocated at an opposite side of the first surface, a first electrode penetrating the first wafer from the first surface to the second surface, and a pad formed on the first surface and coupled electrically with the first electrode, providing a second wafer that includes a second electrode penetrating the second wafer, stacking the first wafer onto the second wafer to connect the first electrode with the second electrode such that the second surface of the first wafer faces the second wafer, probing a needle to the pad, and supplying, in such a state that the first wafer is stacked on the second wafer, a test signal to the first electrode to input the test signal into the second wafer via the first electrode and the second electrode. | 10-18-2012 |
| 20120274345 | RADIO FREQUENCY TESTING APPARATUS - A radio frequency (RF) testing apparatus, for testing device under test (DUT) comprising a receiving antenna, includes a pair of transmitting antennas transmitting wireless communication signals to the receiving antenna, a shielding box, a first filter and a second filter. The shielding box includes a transmitting box, a receiving box for receiving the DUT, a connecting box connecting between the transmitting box and the receiving box and a pair of transmitting antennas fixed on the transmitting box and suspending towards the connecting box. The connecting box includes a microwave absorption medium on the connecting box and communicates with the receiving box. The first filter is mounted on the connecting box and the transmitting box to electrically connect with the transmitting antenna. The second filter is mounted on the receiving box to electrically connect with the DUT. | 11-01-2012 |
| 20130176047 | TEST DEVICE FOR WIRELESS ELECTRONIC DEVICES - A test device for wireless electronic devices includes a metal casing, a RF-absorbing material, a measurement antenna, and an impedance adjustment module. The impedance adjustment module includes a dielectric layer, a microstrip line, and a slot line, wherein the slot line is electrically connected to the measurement antenna. The microstrip line and the slot line are disposed on two opposite sides of the dielectric layer and respectively include a first body and a second body, which are parallel to each other. | 07-11-2013 |
| 20140028338 | SHIELD PIN ARRANGEMENT - Among other things, one or more techniques and/or systems are provided for shielding a signal pin. A signal pin, such as a signal pin within a probe card used to test electronic devices, such as integrated circuits, is shielded from interference signals, which are emitted from other signal pins within the probe card. Shielding the signal pin mitigates cross-talk issues and/or impendence control issues associated with signals that are carried by the signal pin. In one example, one or more shield pins are arranged with respect to the signal pin according to a shield configuration. For example, the shield configuration comprises a plane of signal pins, a substantially regular layout of signal pins, or a polygonal layout of signal pins, etc. In this way, one or more shield pins inhibit unintended interactions or effects that otherwise occur among two or more signal pins. | 01-30-2014 |
| 20150028909 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a first circuit; a first power switch provided either between a power supply potential terminal and a power supply potential node of the first circuit or between a reference potential terminal and a reference potential node of the first circuit; a power switch control circuit configured to control a voltage of a control terminal of the first power switch; a test terminal; and a first test control circuit configured to control connection of the test terminal and the control terminal of the first power switch. | 01-29-2015 |
| 20150130486 | ELECTRICAL CONNECTOR PIN COVER - One embodiment includes a method for protecting from the accidental application of an electrical potential to an incorrect pin of a multipin electrical connector during testing. A sleeve is fitted around a pin that is not to have potential applied to it such that the pin is protected from accidental application of potential during testing. | 05-14-2015 |
| 20160018442 | COAXIAL STRUCTURE FOR TRANSMISSION OF SIGNALS IN TEST EQUIPMENT - An example system includes a circuit board having electrical elements; a wafer having contacts; and an interconnect to route signals between the electrical elements and the contacts. The interconnect includes multiple layers, each of which includes a flexible circuit. The flexible circuit includes a conductive trace disposed thereon. The interconnect also includes shielding between adjacent layers of the multiple layers. The shielding is electrically connected to ground. | 01-21-2016 |
| 20160103151 | ELECTRICAL TERMINAL TEST POINT AND METHODS OF USE - Described herein are embodiments of an electrical terminal test point that can be temporarily attached to an electrical terminal (e.g., terminal block) in order to provide an interface between the test leads/jumpers of a test device and the electrical contact points of the electrical terminal. In one aspect, embodiments of the electrical terminal test point provide a shield for the electrical contact points of the electrical terminal (whether or not being used for testing) from inadvertent contact and prevents test leads/jumpers of test device from accidentally falling of or being knocked off of their contact points. Electrical terminal test point can be installed and removed without affecting the electrical connections made by electrical terminal (e.g., without removing terminal screws of electrical terminal). | 04-14-2016 |
| 20160131681 | TESTING DEVICE - A testing device includes a base body, a holder, an electrically conductive plate, plural testing probes and plural insulation structures. The testing device of the present invention uses the electrically conductive plate to replace the plastic plate of the conventional testing device. Consequently, the electrostatic discharge effect is avoided. Moreover, the insulation structure is arranged between the testing probe and the electrically conductive plate to separate the testing probe from the electrically conductive plate so as to avoid the electric leakage problem. Consequently, the testing device of the present invention is capable of avoiding the electrostatic discharge effect without causing damage of the under-test object and reducing the measurement accuracy. | 05-12-2016 |
| 20160187379 | APPARATUS AND METHOD FOR TERMINATING PROBE APPARATUS OF SEMICONDUCTOR WAFER - A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester side by side at a proximal end of the probe and a distal end of the signal cable. In one embodiment, the probe apparatus includes: a chassis; a dielectric block mounted in the chassis for retaining the probe, the probe extending on the chassis from a proximal end of the probe to the dielectric block, extending through the dielectric block, and projecting from the dielectric block towards the semiconductor device at a distal end of the probe; and a terminating apparatus, mounted in the chassis, for terminating the proximal end of the probe with a distal end of the signal cable side by side. | 06-30-2016 |
| 324750270 | EMI interference | 5 |
| 20130033279 | Electromagnetic Test Enclosure - The present disclosure is directed to systems and methods for operating, designing, testing and verifying the performance of wireless communication devices. Specifically, the present systems and methods can reliably determine the operating behavior of wireless communication modules within electronic products and devices in a relatively inexpensive and compact testing cabinet, with useful electromagnetically isolating structure, that allows for scalable, multi-application and production line operation and testing and verification of electromagnetic equipment therein. | 02-07-2013 |
| 20130257468 | Stackable Electromagnetically Isolated Test Enclosures - The present disclosure is directed to systems and methods for operating, designing, testing and verifying the performance of wireless communication devices. Specifically, the present systems and methods can reliably emulate a mobile environment with channel impairment in an ad-hoc network and determine the operating behavior (routing, auto-healing, etc.) of wireless communication modules. Utilizing a relatively inexpensive, compact testing chamber arrays with useful electromagnetically isolating structure, the present invention allows for scalable, multi-application and production line operation and testing and verification of electromagnetic equipment therein. | 10-03-2013 |
| 20140347082 | SEMICONDUCTOR DEVICE TEST SOCKET - A test socket for connecting a device under test (DUT) electrically to a high-frequency power source comprises a plurality of pogo pins each having an electrode, an electron-to-heat conversion plate supporting bottoms of the pogo pins, the electron-to-heat conversion plate configured to convert kinetic energy of free electrons emitted from the pogo pins to thermal energy, and a heat sink wall formed on the electron-to-heat conversion plate, the heat sink wall having a predetermined height and isolating the plurality of pogo pins from one another. | 11-27-2014 |
| 20150054538 | ELECTROMAGNETIC SHIELD FOR TESTING INTEGRATED CIRCUITS - A probe card includes a number probes. Each probe is adapted to contact a corresponding terminal of a circuit integrated in at least one die of a semiconductor material wafer during a test phase of the wafer. The probes include at least one probe adapted to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase. The probe card further includes at least one electromagnetic shield structure corresponding to the at least one probe adapted to provide and/or receive the radio frequency test signal for the at least partial shielding of an electromagnetic field irradiated by such at least one probe adapted to provide and/or receive the radio frequency test signal. | 02-26-2015 |
| 20150130487 | INTEGRATED CIRCUIT (IC) TEST SOCKET WITH FARADAY CAGE - An integrated circuit test socket includes a highly conductive compliant material that is cut and installed into the test socket. The conductive material draws electrical charge away from the test socket, leading to more accurate testing. The test socket base is grounded, and a ground current runs through the base and into conductive strips. The configuration forms an electromagnetic impulse shield, protecting the chip from electromagnetic interference. The compliance of the shield material allows the shield to be sealed when activated, ensuring that the electromagnetic impulse shield is complete around the semi-conductor chip. | 05-14-2015 |
