| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 324750090 | By heat sink | 7 |
| 20110095773 | COOLING STRUCTURE FOR A TEST DEVICE, AND A METHOD FOR TESTING A DEVICE - An exemplary embodiment of the present invention aims at providing a cooling structure for a test device which has sufficient cooling performance and can reduce the size of the heat sink. The cooling structure for a test device has first and second plates, a cover with a hole on the first plate, and a heat sink attached to the cover. When the vacuum suction is applied in a test space which is formed between the first and the second plates, air is drawn through the hole of the cover and applied onto the heat sink. | 04-28-2011 |
| 20110267084 | THERMAL INTERFACE MATERIAL, TEST STRUCTURE AND METHOD OF USE - Non-corrosive thermal interface materials for use in a test structure and method of use. The test structure includes a heat sink for dissipating heat away from a device under test. The test structure further includes a non-corrosive thermal interface material disposed between the heat sink and the device under test. The non-corrosive thermal interface material is capable of withstanding test conditions for at least 60 minutes for at least 115° C. without staining or leaving residue on the device under test after baking. | 11-03-2011 |
| 20120313657 | TEMPERATURE CONTROL UNIT FOR ELECTRONIC COMPONENT AND HANDLER APPARATUS - A temperature control unit for an electronic component and a handler apparatus, which are excellent in responsibility during cooling and heating, is obtained. The temperature control unit for an electronic component includes a cooling cycle device having a refrigerant passage circulating through a compressor, a condenser, an expander, and an evaporator; a thermally conductive block having an outer surface capable of coming in contact with the electronic component that is an object to be temperature-controlled, where an inner surface corresponding to the outer surface is placed opposite to the outer surface so as to be brought in contact with or apart from the evaporator; at least one first heater for heating the thermally conductive block; and a compressed air feeding circuit for feeding compressed air between facing surfaces of the evaporator and the thermally conductive block to part them. | 12-13-2012 |
| 20140077830 | High Speed, High Current, Closed Loop Load Transient Tester - The present document relates to voltage regulators ( | 03-20-2014 |
| 20140132296 | HEAT SINK BLADE PACK FOR DEVICE UNDER TEST TESTING - Embodiments of the present disclosure provide an apparatus configured to engage a device for testing the device via automatic test equipment. The apparatus includes a heat sink, wherein the heat sink comprises a plurality of fins extending from the heat sink, and wherein the heat sink is configured to engage the device. The apparatus further includes a heat conduction layer coupled to the heat sink, a first leg coupled to the heat conduction layer, and a second leg coupled to the heat conduction layer. The second leg is spaced apart from the first leg. A vacuum path is defined through (i) the heat conduction layer and (ii) the heat sink. The vacuum path permits the apparatus to engage the device to be tested by the automatic test equipment. | 05-15-2014 |
| 20140253157 | TEST SYSTEM WITH LOCALIZED HEATING AND METHOD OF MANUFACTURE THEREOF - A test system, and a method of manufacture thereof, including: a thermal management head including a heat spreader; an electronic device in direct contact with the heat spreader; and an electrical current for transferring energy between the heat spreader and the electronic device. | 09-11-2014 |
| 20140354314 | THERMAL INTERFACE TECHNIQUES AND CONFIGURATIONS - Embodiments of the present disclosure describe thermal interface techniques and configurations. In some embodiments, a thermal interface apparatus may include a flexible container, a plurality of thermally conductive objects disposed within the flexible container, and an attachment member coupled to the flexible container for attaching the thermal interface apparatus to a heat sink. The thermally conductive objects may be movable to rearrange their packing within the flexible container in response to deformation of the flexible container. Other embodiments may be described and/or claimed. | 12-04-2014 |
