Class / Patent application number | Description | Number of patent applications / Date published |
324750080 | By fluid | 26 |
20110109335 | Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same - An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material. | 05-12-2011 |
20120007623 | SPRAY COOLING THERMAL MANAGEMENT SYSTEM AND METHOD FOR SEMICONDUCTOR PROBING, DIAGNOSTICS, AND FAILURE ANALYSIS - A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be re-circulated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point. | 01-12-2012 |
20120112777 | ELECTRONIC DEVICE PUSHING APPARATUS, ELECTRONIC DEVICE TEST APPARATUS, AND INTERFACE DEVICE - An electronic device pushing apparatus includes a pushing unit which has: a plurality of pushers which contact DUTs; and base plate on which the plurality of pushers are provided. A rigidity of the base plate is set to a rigidity which is lower relative to the rigidity of a spacing frame of the HIFIX. | 05-10-2012 |
20120169363 | Production Integrated Circuit Test Handler Using Microcontroller Reading a Thermal Diode of a Device Under Test for Temperature Control - Production test of integrated circuit face thermal management challenges with higher power devices. Current production handlers do not have adequate thermal management characteristics. This invention employs thermal diodes on each device under test and a closed loop microprocessor controlled feedback system for thermal control during production test. | 07-05-2012 |
20120268149 | ELECTRICAL TEST APPARATUS FOR A PHOTOVOLTAIC COMPONENT - The present invention relates to electrical test apparatuses for photovoltaic modules and methods of testing photovoltaic modules. | 10-25-2012 |
20130021049 | Systems and Methods for Conforming Device Testers to Integrated Circuit Device Profiles - A device tester for an IC device under test (DUT), the DUT having a substrate and an attached die. The device tester includes a thermal control unit and a test socket assembly which conforms to the DUT's profile. The thermal control unit includes a pedestal assembly, a heater having a fuse coupled to a heating element, a substrate pusher, and a force distributor for distributing force between the pedestal assembly and the substrate pusher. The test socket assembly includes a socket insert that supports and also conforms to the DUT's profile. | 01-24-2013 |
20130093446 | SUPPORT BODY FOR CONTACT TERMINALS AND PROBE CARD - A support body for a plurality of contact terminals included in a probe card for inspecting semiconductor devices formed in a semiconductor substrate is provided. | 04-18-2013 |
20130127483 | Radiator Module System for Automatic Test Equipment - A radiator module system for automatic test equipment, wherein the automatic test equipment comprises at least one test arm, with the front end of the test arm being configured with a test head, and a closed-loop circulating cooling device is installed on the test arm. The closed-loop circulating cooling device includes a conduit which is in contact with the cooling device, internally contains an working fluid and is connected to the test head, a cooling device, a set of fans and a driving source for driving the working fluid. The closed-loop circulating cooling device can operate to circulate and exchange heat energy generated by a device under test (DUT) tightly stressed by downward pressure applied with the test arm, and brings up airflows by means of the fans to perform heat exchange on the cooling device thereby dissipating the generated heat energy. | 05-23-2013 |
20130147502 | VERTICAL PROBE ASSEMBLY WITH AIR CHANNEL - A vertical probe assembly includes an upper die; a lower die; a plurality of probes, the probes comprising an electrically conductive material, wherein the probes extend from the upper die through the lower die; and an air channel located between the upper die and the lower die, such that airflow through the air channel passes through the plurality of probes. | 06-13-2013 |
20130271170 | Systems and Methods for Conforming Device Testers to Integrated Circuit Device Profiles with Feedback Temperature Control - An integrated circuit (IC) device tester maintains a set point temperature on an IC device under test (DUT) having a die attached to a substrate. The tester includes a thermal control unit and a fluid management system configured to supply the thermal control unit with fluids for pneumatic actuation, cooling, and condensation abating. The tester can includes a box enclosing the thermal control unit thereby providing a substantially isolated dry environment during low humidity testing of the DUT. The heat exchange plate may include an inner structure for thermal conductivity enhancement. | 10-17-2013 |
20140077829 | TEST HANDLER THAT RAPIDLY TRANSFORMS TEMPERATURE AND METHOD OF TESTING SEMICONDUCTOR DEVICE USING THE SAME - A test handler and a test method of a semiconductor device using the same includes a plurality of chambers to provide a sealed inner space accommodating a first tray on which semiconductor devices are mounted, a test module electrically connected to the semiconductor devices in the chambers to perform a test process of the semiconductor devices, and a sort part to load and unload the first tray in the chambers and to sort semiconductor devices determined to be failed in the test process. The plurality of chambers have a fluid path circulating a coolant or a heat medium in the walls so that a temperature of the plurality of chambers is rapidly changed at the test process of the semiconductor devices between a first temperature that is less than room temperature and a second temperature that is greater than room temperature. | 03-20-2014 |
20140125367 | SEAL METHOD FOR DIRECT LIQUID COOLING OF PROBES USED AT FIRST LEVEL INTERCONNECT - Embodiments of an apparatus and method for providing cooling of probes for testing of integrated circuits are generally described herein. In some embodiments, an apparatus comprises a probe head assembly configured to hold one or more probes that are adapted to provide electrical contact with an integrated circuit device under test (DUT), a DUT chuck adapted to hold the DUT for contact with the probes, a seal arranged between the probe head assembly and the DUT chuck to form a chamber when the seal is in contact with the probe head assembly and the DUT chuck, and a first port and a second port arranged to provide fluid flow into and fluid flow out of the chamber. | 05-08-2014 |
20140203829 | TEST JIG AND SEMICONDUCTOR DEVICE TEST METHOD - The test jig includes: a package mounting plate on which a semiconductor device is placed; a plurality of penetrating holes provided in the package mounting plate; a socket portion in which a plurality of probe pins are disposed, the probe pins designed to come in contact with electrodes of the semiconductor device through the penetrating holes; and a gas injecting unit configured to inject gas to the package mounting plate through the socket portion. The test of the semiconductor device is performed with the gas injected from the gas injecting unit to the package mounting plate. | 07-24-2014 |
20140210499 | INCREASING CURRENT CARRYING CAPABILITY THROUGH DIRECT LIQUID COOLING OF TEST CONTACTS - Testing methods and systems are described. One method for testing an electronic device includes providing a probe in electrical contact with a device. The method also includes positioning an interface of the probe and the device in a liquid medium. The method also includes transmitting a current from the probe through the interface while the interface is in the liquid medium. Other embodiments are described and claimed. | 07-31-2014 |
20140232423 | APPARATUS AND METHOD FOR TESTING ELECTRONIC DEVICES - An apparatus for testing electronic devices, having a test head coupled to at least one immovably mounted test socket, a positioning device for positioning the electronic device in testing position and a lead-backer attached to the positioning device for supporting the electronic device and pressing it against the test socket. A supply port for supplying a temperature control medium to a temperature control system of the said lead-backer is immovably mounted beside the said test socket, the said temperature control system of the said lead-backer and the said supply port communicate with each other when the electronic device is in testing position, whereby the said temperature control medium flows from the said supply port to the said temperature control system of the said lead-backer. | 08-21-2014 |
20140239991 | METHOD FOR VERIFYING A TEST SUBSTRATE IN A PROBER UNDER DEFINED THERMAL CONDITIONS - A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate. | 08-28-2014 |
20140306728 | ELECTRONIC ASSEMBLY TEST SYSTEM - An example system for testing electronic assemblies (EAs) may include carriers for holding EAs and slots for testing at least some of the EAs in parallel. Each slot may be configured to receive a corresponding carrier containing an EA and to test the EA. An example carrier in the system may include a first part and a second part. At least one of the first part and the second part include a first structure, and the first structure is movable to enable electrical connection between an EA and an electrical connector. | 10-16-2014 |
20140312924 | HANDLER AND INSPECTION APPARATUS - A handler includes: a rotating section which is a holding unit mounting section which can take a mounted state in which a holding unit for holding an IC device is mounted; and a transportation mechanism which transports the IC device held by the holding unit. The rotating section includes a heat generation section which generates heat and a heating flow path through which fluid which is heated by the heat generation section and is used for heating of the IC device passes. | 10-23-2014 |
20150061712 | IMPLEMENTING LOW TEMPERATURE WAFER TEST - A method and structure are provided for implementing low temperature wafer testing of a completed wafer. A coolant gel is applied to the completed wafer, the gel coated wafer is cooled and one or more electrical test probes are applied through the gel to electrical contacts of the cooled wafer, and testing is performed. | 03-05-2015 |
20150309112 | THERMAL HEAD FOR DEVICE UNDER TEST AND METHOD FOR CONTROLLING THE TEMPERATURE OF DEVICE UNDER TEST - A thermal head for device under test having a gimbal fixture and a protective casing and an air chamber having an air inlet hole and a plurality of O-ring grooves to form a pneumatic control mechanism, comprising (a) a cooling chamber within the protective casing having at least one inlet and at least one outlet formed on each of the opposite edge of the chamber for the flow of a cooling fluid from the inlet to the outlet to provide a cooling temperature to a device under test which comes into contact with the thermal head; (b) a metal plate being formed below the cooling chamber, wherein the metal plate touches the surface of the device under test when the thermal head is in operation; (c) an air gap formed between the cooling chamber and the metal plate, wherein the size of the gap depends on distance between the cooling chamber and the metal plate, wherein the cooling chamber moves relative to the metal plate; and (d) a pair of coil spring mechanism disposed in between the base of the metal plate and a jacket covered the cooling chamber at the opposite edges thereof. The present invention also relates to a method of controlling the temperature of a device under test. | 10-29-2015 |
20150355268 | SUPPORTING AUTOMATED TESTING OF DEVICES IN A TEST FLOOR SYSTEM - In an embodiment, a test floor apparatus includes at least one conveyor, a vertical stack buffer, and an automated handling station. The vertical stack buffer is operable to hold a plurality of DUT (device under test) receptacles and operable to place a DUT receptacle on the at least one conveyor to enable a corresponding DUT to be inserted into the DUT receptacle. The automated handling station is operable to access the DUT receptacle from the at least one conveyor and is operable to open the DUT receptacle to position the corresponding DUT in a manner that couples the corresponding DUT to an electrical interface of the DUT receptacle and that encloses the corresponding DUT inside the DUT receptacle to facilitate testing of the corresponding DUT. | 12-10-2015 |
20150355270 | MULTI-CONFIGURABLE TESTING MODULE FOR AUTOMATED TESTING OF A DEVICE - In an embodiment, a testing apparatus includes an air mixing chamber, a docking unit, and a DUT (device under test) test execution unit. The air mixing chamber includes a first air inlet operable to receive a first air flow, a second air inlet operable to receive a second air flow, and an air outlet operable to output a mixed air flow. The docking unit is operable to receive and to securely hold a DUT (device under test) receptacle including an electrical interface, an air flow interface, and a DUT coupled to the electrical interface. The DUT receptacle is configured to enclose and hold inside the DUT. The docking unit is operable to couple to the electrical interface and to the air flow interface. The docking unit is operable to receive and to send the mixed air flow to the DUT receptacle. A DUT test execution unit is coupled to the docking unit. The DUT test execution unit is operable to perform a test on the DUT that is inside of the DUT receptacle. | 12-10-2015 |
20150355271 | CUSTOMIZABLE TESTER HAVING TESTING MODULES FOR AUTOMATED TESTING OF DEVICES - In an embodiment, a testing system includes a frame, a DUT (device under test) testing module. The frame has at least one aperture extending from a front side of the frame to a rear side of the frame. The DUT testing module is inserted into the at least one aperture. The DUT testing module is operable to receive and hold a DUT receptacle including an electrical interface, an air flow interface, and a DUT coupled to the electrical interface. The DUT receptacle is configured to enclose and hold inside the DUT. Further, the DUT testing module is operable to couple to and to use the electrical interface and the air flow interface to perform a test at a controlled temperature on the DUT that is inside of the DUT receptacle. | 12-10-2015 |
20160025817 | MEASUREMENT INSTRUMENT FOR TESTING CHARGE STORAGE DEVICES - A test instrument for use with a sample having a plurality of electrically conducting contact pads, the instrument including: a controllable, variable force linear actuator; a probe assembly operated by the linear actuator, the probe assembly having a probe head at one end with a surface for contacting the sample; a movable contactor assembly including a plurality of contacts for electrically contacting the plurality of contact pads on the sample; a housing on which the linear actuator and contactor assembly are mounted, the housing having an identified area for holding the sample during testing; a position sensor assembly for measuring changes in the position of the probe; and a sensor for measuring a force applied to the sample by the probe head. | 01-28-2016 |
20160187377 | SEMI-AUTOMATIC PROBER - A wafer probe station system for reliability testing of a semiconductor wafer. The wafer probe station is capable of interfacing with interchangeable modules for testing of semiconductor wafers. The wafer probe station can be used with different interchangeable modules for wafer testing. Modules, such as probe card positioners and air-cooled rail systems, for example, can be mounted or docked to the probe station. The wafer probe station is also provided with a front loading mechanism having a rotatable arm that rotates at least partially out of the probe station chamber for wafer loading. | 06-30-2016 |
20160377658 | FLUID FLOW IN A TEMPERATURE CONTROL ACTUATOR FOR SEMICONDUCTOR DEVICE TEST - Improved fluid flow is described for a temperature control actuator that is used in semiconductor device test. In one example, the apparatus includes a top plate configured to thermally connect to a semiconductor device under test, a channel plate thermally connected to the top plate and having a plurality of fluid channels to receive a thermally controlled fluid from an inlet to exchange heat with the thermally controlled fluid in the channel and to eliminate the thermally controlled fluid to an outlet, a manifold to provide the thermally controlled fluid to the inlet and to receive the thermally controlled fluid through the outlet, and a flow guide in the channel thermally connected to the top plate. | 12-29-2016 |