| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 324750050 | Burn-in | 39 |
| 20100308853 | Method and apparatus for the prevention of untested or improperly tested printed circuit boards from being used in a fire pump control system - The present invention relates to a method and apparatus for preventing untested or improperly tested printed circuit boards from being used in a fire pump control system by interrogating each printed circuit board to ensure post-assembly fitness. Exemplary embodiments of the present invention comprise retrieving test status information stored on non-volatile memory of a printed circuit board, verifying the test status information stored on the non-volatile memory of the PCB, determining if all tests performed on the PCB have passed, outputting a message regarding the status of the PCB, and continuing to interrogate each additional PCB in the fire pump controller. A pass flag is set and recorded on the non-volatile memory of a respective PCB if all tests on the respective PCB have passed. Whereas, an error flag is set and recorded on the non-volatile memory if at least one test on a respective PCB has failed. | 12-09-2010 |
| 20110043231 | SYSTEM FOR POST-PROCESSING OF ELECTRONIC COMPONENTS - A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier. | 02-24-2011 |
| 20110084718 | Burn-In Testing System - The present invention discloses a burn-in testing system including a burn-in board and a burn-in testing apparatus, the burn-in board including: a first interface component, adapted to connect with the burn-in testing apparatus for signal input and/or output between the burn-in board and the burn-in testing apparatus; and a second interface component, adapted to connect with a device under test for signal input and/or output between the burn-in board and the device, wherein the burn-in testing system further includes a pin matching unit flexibly connected with the burn-in board and adapted to adjust signal connection relationship between the first interface component and the second interface component according to a pin description of the device. By using the invention, burn-in tests of various devices having the same number of pins and different pin descriptions can be performed using the same burn-in board, which is compatible with existing burn-in boards, thereby improving production efficiency and reducing production costs. | 04-14-2011 |
| 20110169514 | EQUIPMENT BURN-IN METHOD AND SYSTEM - An equipment burn-in method, which includes the equipment undergoing treatment in an oven, the oven undergoing cycles including at least one temperature-rise and/or temperature-fall transition, for which ventilation of the equipment is cut off during at least part of a temperature transition of the oven. | 07-14-2011 |
| 20120013357 | Semiconductor Device - A semiconductor device comprises a burn-in test circuit configured to receive a flag signal for a burn-in test, generate a toggled output enable signal, and drive a first input/output line to toggle a signal on the first input/output line, and a switching device connected between a bit line and a second input/output line for transferring a signal on the bit line to the second input/output line in response to the output enable signal. | 01-19-2012 |
| 20120112776 | THREE-DIMENSIONAL (3D) STACKED INTEGRATED CIRCUIT TESTING - Testing of a three-dimensional (3D) integrated circuit includes defining a first group of parts by a region and/or layer on the 3D integrated circuit. The testing further includes applying a first intensity of stress test conditions to the first group of parts. The testing also includes defining a second group of parts by a region and/or layer on the 3D integrated circuit that is different from the first group of parts. The testing further includes and applying a second intensity of stress test conditions to the second group of parts. The second intensity of stress test conditions is greater than the first intensity and is determined by sensitivities identified for each of the first and second group of parts. A determination is made whether the 3D integrated circuit passed the testing based upon results of application of the first and second intensities of stress test conditions. | 05-10-2012 |
| 20120206157 | Structure of burn-in oven - An improved structure of a burn-in oven includes a housing, a loading support, a cooling-fan assembly, and a motor-fan assembly. A circuit-board-space and an exhaust channel are defined inside of the housing, wherein the exhaust channel is provided with a plurality of venting holes such that the circuit-board-space and the exhaust channel are communicated with each other through the venting holes. The loading support is disposed in the circuit-board-space for loading a plurality of circuit boards. The cooling-fan assembly is arranged at one side of the loading support and beside the exhaust channel. The motor-fan assembly is arranged at the exhaust channel. Thereby, a phenomenon of heat accumulation locally at a back panel side of the oven can be improved so as to enhance cooling effect of the oven, let alone the number of fans installed on the oven can be decreased. | 08-16-2012 |
| 20120223729 | Adhesively Attached Stand-Offs On A Portable Pack For An Electronics Tester - The invention relates to a tester apparatus of the kind including a portable supporting structure for removably holding and testing a substrate carrying a microelectronic circuit. An interface on the stationary structure is connected to the first interface when the portable structure is held by the stationary structure and is disconnected from the first interface when the portable supporting structure is removed from the stationary structure. An electrical tester is connected through the interfaces so that signals may be transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit. | 09-06-2012 |
| 20120268148 | AUTOMATED LOADING/UNLOADING OF DEVICES FOR BURN-IN TESTING - The automatic loading and unloading of devices for burn-in testing is facilitated by loading burn-in boards in a magazine with the stacked boards in the magazine moved into and out of a burn-in oven by means of a trolley. The trolley can include an elevator whereby a plurality of magazines can be stacked in the oven for the simultaneous burn-in testing of devices mounted on the burn-in boards. Each board has rollers on one end which are engagable by pneumatically actuated cam mechanisms for inserting the board into an electrical contact in the oven for burn-in tests. Preferably, the cam mechanisms allow for extraction of a single board for inspection. | 10-25-2012 |
| 20120326740 | BURN-IN TESTING APPARATUS - A testing apparatus includes a thermal control chamber including a test room, which temperature is controlled within a testing temperature range; a carrier frame including a direction guiding unit installed securely within the test room and formed with one guiding groove and a carrier rod extending through the guiding groove in the direction guiding unit; and a clamping unit mounted on the carrier rod for clamping a display-panel module securely, wherein, movement of the carrier rod transversely within the guiding groove relative to the direction guiding unit results in disposing the display-panel module to extend along one of several testing directions for undergoing a burn-in test. | 12-27-2012 |
| 20130127482 | BURN-IN TEST APPARATUS WITH FUNCTION OF ENERGY RECYCLING - A new electrical recycling apparatus for AC/DC power converter is provided to recycle the electricity in direct current to the input ends of the power converter to be tested to save a stage of power converter and avoid the complicated standard and requirement that feed the electricity to the mains supply. | 05-23-2013 |
| 20130135000 | SEMICONDUCTOR TEST BOARD AND SEMICONDUCTOR BOARD - Provided is a semiconductor test board which includes a power supply, a first temperature resistive element and a second temperature resistive element configured to commonly receive power from the power supply and having resistances that varies with temperature, a first chip embedding unit configured to receive the power through the first temperature resistive element and having a first semiconductor package embedded therein, and a second chip embedding unit configured to receive the power through the second temperature resistive element and having a second semiconductor package embedded therein. | 05-30-2013 |
| 20130193995 | METHODS AND DEVICES FOR STRESSING AN INTEGRATED CIRCUIT - Disclosed is in particular a device ( | 08-01-2013 |
| 20130285686 | Systems and Methods for Thermal Control - The present invention relates generally to a system and a method for thermal control. More particularly, the invention encompasses an apparatus for thermal control and management of at least one device under test (DUT). The inventive thermal control and management apparatus also allows for the management of a plurality of devices under test, and with each device under test having its own testing regimen. The thermal control and management of the device under test (DUT) is managed using at least one thermoelectric element or cooler (TEC), which can be used to either heat or cool the corresponding device under test (DUT). | 10-31-2013 |
| 20130300444 | BURN IN BOARD, SYSTEM, AND METHOD - Systems, methods, and apparatuses are provided for facilitating the use of a burn in board comprising integrated circuits. An apparatus may comprise a burn in board and a plurality of integrated circuits connected to the burn in board. Each integrated circuit may be configured to at least connect to a plurality of components to be subjected to a burn in process at room temperature; receive at least one signal for testing the plurality of components during the burn in process; and transmit the at least one signal to each of the plurality of components. Corresponding systems and methods are also provided. | 11-14-2013 |
| 20140062515 | Sequential Burn-In Test Mechanism - A method includes performing a burn-in test on an integrated circuit (IC) by removing power from a first component block within the IC and applying a maximum burn-in voltage and temperature to a second component block within the IC. | 03-06-2014 |
| 20140084953 | COMPLIANT THERMAL CONTACT DEVICE AND METHOD - Examples of thermal contact devices and methods are shown. Compliant thermal contact devices are shown that include interleaved conducting structures to provide a high thermal conduction contact area. Selected examples include a thermal interface material located at the interleaved interface between the conducting structures. Selected examples also include designs for alternate chip orientations. | 03-27-2014 |
| 20140103947 | THERMAL RELIABILITY TESTING SYSTEMS WITH THERMAL CYCLING AND MULTIDIMENSIONAL HEAT TRANSFER - Devices, methods, and systems for facilitating heat transfer around an electronic component during thermal-cycle testing are presented. A system may include a core, a plurality of solid state heating/cooling devices, and a plurality of heat sinks. The core defines one or more cavities for receiving an electronic component. The system may include an air mover and a duct. In operation, the system may cool an electronic component to sub-ambient temperatures and heat it to above the boiling point of water. A method of thermal-cycle testing may include a core defining a cavity for receiving an electronic component, selectively inducing said heating/cooling devices to operate in a heating mode or a cooling mode, and measuring and recording conditions during the test. | 04-17-2014 |
| 20140167798 | SYSTEM FOR POST-PROCESSSING OF ELECTRONIC COMPONENTS - A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier. | 06-19-2014 |
| 20140354313 | Method for Temporary Electrical Contacting of a Component Arrangement and Apparatus Therefor - A method for temporary electrical contacting of a component arrangement with a plurality of contact surfaces is described. A connection support includes a plurality of connection surfaces, on which contact protrusions are disposed. The connection support and component arrangement are brought together in such a way that the connection surfaces and the associated contact surfaces overlap in a top view and the contact protrusions form an electrical contact with respect to the contact surfaces in order to achieve electrical contacting of the component arrangement. Subsequently the connection support and the component arrangement are separated from each other. | 12-04-2014 |
| 20140375345 | BURN-IN SOCKET WITH A HEAT SINK - An burn-in socket electrically connecting an IC package to a PCB, comprises a base, a cover, a plurality of contacts and a block-shaped heat sink. The base defines a receiving space for the IC package. The cover is pin-jointed to one side by a pivot of the base and able to rotate around the pivot. A plurality of contacts are retained in the base and partially exposed in the receiving space. The heat sink is located above the IC package and against to the IC package so as to apply its gravity force to the IC package. Top face of the heat sink is below top face of the cover. | 12-25-2014 |
| 20150028908 | HIGH SPEED TESTER COMMUNICATION INTERFACE BETWEEN TEST SLICE AND TRAYS - A tester system is disclosed. The tester system comprises a tester module operable to generate test signals for testing a plurality of DUTs. It also comprises a plurality of cables operable to communicatively couple the tester module with a tray comprising the plurality of DUTs through a thermal chamber wall interface. Further, it comprises a plurality of connectors in contact with the tray, wherein the plurality of connectors is operable to provide an interface between the plurality of cables and conductive traces on the tray, and further wherein each of the plurality of connectors is operable to pass a respective subset of the test signals to each DUT on the tray via the conductive traces. | 01-29-2015 |
| 20150061711 | Overclocking as a Method for Determining Age in Microelectronics for Counterfeit Device Screening - An invention employing testing, e.g., overclocking, to determine undesirable conditions in a device under test (DUT) is provided. An exemplary apparatus and method includes artificially aging a known sample microelectronic device (SMD); overclocking the known SMD to specification and/or maximum performance; and collecting a plurality of device data associated with overclocking of each SMD at multiple ageing data points over a predicted aging progression. Another exemplary next step includes overclocking a DUT and collecting device data associated with the overclocked DUT. Another exemplary next step includes comparing the DUT device data with SMD device data to determine, for example, if the DUT has an anomaly or undesirable condition, if the DUT conforms to a manufacturer's specification, if the DUT was made by an original equipment manufacturer, if the DUT is used but represented as new, and/or the DUT has been subjected to damage or stress events exceeding acceptable limits. | 03-05-2015 |
| 20150369858 | APPARATUS FOR TESTING ELECTRONIC DEVICES - An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer. | 12-24-2015 |
| 20160069950 | DEVICES UNDER TEST - A system can include a plurality of device under test (DUT) cells. Each DUT cell can include a DUT and a plurality of switches configured to control a flow of current to the DUT. The system can further include a controller configured to execute a plurality of test to the plurality of DUTs in the plurality of DUT cells. Each of the plurality of tests comprises applying a measurement condition to a given DUT of the plurality of DUTs and concurrently applying a stress condition to the remaining DUTs of the plurality of DUTs, wherein the plurality of tests can provide measurements sufficient to determine a bias thermal instability and a time dependent dielectric breakdown of the given DUT. | 03-10-2016 |
| 20160091559 | Apparatus for Burn-In Test - The present invention relates to an apparatus for burn-in of a device under test ( | 03-31-2016 |
| 20160109509 | APPARATUS FOR THE THERMAL TESTING OF ELECTRONIC DEVICES AND CORRESPONDING METHOD - An apparatus for the thermal testing of electronic devices may include a universal base board for coupling to an electronic driver unit for receiving electrical signals therefrom, and a plurality of test boards arranged on the base board. Each test board may include a holder for receiving a device under test and routing thereto electrical signals from the electronic driver unit as well as an adaptation board to the base board. Each test board may include a respective electrically powered heating element for heating the electronic device received thereat. | 04-21-2016 |
| 20160154053 | ELECTRONICS TESTER WITH HOT FLUID THERMAL CONTROL | 06-02-2016 |
| 20160187418 | Drum-Type IC Burn-In And Test Equipment - Disclosed is drum-type IC burn-in and test equipment including burn-in equipment. The burn-in equipment includes therein a first working platform, a second working platform, a drum-type burn-in device, and a parts pickup device. The first working platform includes a first parts disposition section and a parts feeding device. The second working platform includes a parts transferring device. The drum-type burn-in device is rotatably mounted between the first and second working platforms and includes multiple planar sections circumferentially mounted thereto with each planar section having at least one burner mounted thereon. This arrangement allows a parts feeding device to sequentially dispose unburned ICs and a parts transferring device to sequentially pick up completely-burned ICs. As such, the drum-type burn-in device helps increase the number of ICs disposed and also helps improve the throughput and increase the manufacturing speed. | 06-30-2016 |
| 20190146041 | BURN-IN SYSTEM ENERGY MANAGEMENT | 05-16-2019 |
| 324750060 | With temperature sensing | 9 |
| 20100315109 | BURN-IN SYSTEM FOR ELECTRONIC DEVICES - A burn-in system ( | 12-16-2010 |
| 20120256649 | Dynamic Testing Based on Thermal and Stress Conditions - A plurality of sets of test conditions of a die in a stacked system is established, wherein the plurality of test conditions are functions of temperatures of the die, and wherein the stacked system comprises a plurality of stacked dies. A temperature of the die is measured. A respective set of test conditions of the die is found from the plurality of sets of test conditions, wherein the set of test conditions corresponds to the temperature. The die is at the temperature using the set of test conditions to generate test results. | 10-11-2012 |
| 20130285687 | METHOD AND APPARATUS FOR CHARACTERIZING THERMAL MARGINALITY IN AN INTEGRATED CIRCUIT - Apparatus and methods are described herein for emulating the hot spot distribution of a functional test by applying vectors for structural test to an integrated circuit (IC). The affects of the hot spots can then be tested and characterized. The vectors may be generated on the IC, or may be fed to the IC via an external source. | 10-31-2013 |
| 20140049277 | TEST APPARATUS AND MOVABLE TEST CHAMBER THEREOF - A test apparatus includes a plurality of rails, a plurality of test zones and a movable test chamber. The test zones are located between the rails. The movable test chamber includes a passageway, at least one heat source and at least one pair of rolling balls. The heat source is used to heat the passageway. The pair of rolling balls is movably contained in two rails, so as to facilitate movement of the passageway to different test zones. | 02-20-2014 |
| 20140139246 | Wafer Temperature Sensing Methods and Related Semiconductor Wafer - A method includes measuring a first voltage across a test diode on a semiconductor wafer while injecting a first current into the test diode, measuring a second voltage across the test diode while injecting a second current into the test diode, and determining temperature of a region proximate the test diode according to difference between the first voltage and the second voltage. | 05-22-2014 |
| 20160054374 | SEMICONDUCTOR DEVICE INCLUDING TEMPERATURE RANGES HAVING TEMPERATURE THRESHOLDS AND METHOD OF DETERMINING THEREFOR - A method of determining temperature ranges and setting performance parameters in a semiconductor device that may include at least one temperature sensing circuit is disclosed. The temperature sensing circuits may be used to control various operating parameters to improve the operation of the semiconductor device over a wide temperature range. The performance parameters may be set to improve speed parameters and/or decrease current consumption over a wide range of temperature ranges. | 02-25-2016 |
| 20160116529 | APPARATUS AND METHOD USING PROGRAMMABLE RELIABILITY AGING TIMER - An apparatus and a method which use a programmable reliability aging timer are provided. The apparatus includes a performance circuit configured to perform a function of an integrated circuit (IC), a memory unit configured to store a lifetime of the IC, a controller configured to set an aging target condition according to the lifetime stored in the memory unit, and a reliability aging timer (RAT) configured to apply stress to a test pattern according to the aging target condition and sense a result of the stress to determine the degradation of the IC. The RAT refreshes an operation of the performance circuit if it is determined that the IC degraded before the lifetime of the IC. | 04-28-2016 |
| 324750070 | With feedback control | 2 |
| 20140253156 | THIN HEATING DEVICE - A thin heating device is provided. The thin heating device includes a first circuit board, a second circuit board, an elastic connector and a heating element. The first and second circuit boards are face-to-face arranged. The elastic connector connects the first and second circuit boards to apply a return force to hold an under-tested device. The heating element is mounted on the first or the second circuit board to heat the under-tested device. | 09-11-2014 |
| 20160041223 | ELECTRONIC COMPONENT TESTING DEVICE - An electronic component testing device which is able to release heat (radiate heat) efficiently from a self-heating electronic component, and is able to carry out an intended test efficiently while keeping the temperature of the electronic component within a predetermined range higher than ordinary temperature. | 02-11-2016 |
