Class / Patent application number | Description | Number of patent applications / Date published |
361679500 | Plurality of air streams | 33 |
20090147454 | Heat dissipation module - A heat dissipation module is used to cool a microprocessor. The heat dissipation module includes a base, a diversion pipeline, a plurality of heat conductive pieces and a fan. The base is assembled on the microprocessor. The diversion pipeline is connected to the base, provides a diversion direction, and has a heat insulated pipe-wall which partitions the diversion pipeline into an inside and an outside portions and reduces the heat conduction in the diversion direction of the diversion pipeline. The heat conductive pieces are fixed on the diversion pipeline, and have a heat dissipation direction from the inside portion to the outside portion of the diversion pipeline which crosses the diversion direction. Each two neighboring heat conductive pieces are separated with the heat insulated pipe-wall. The fan is assembled on the outside of the diversion pipeline and provides a cool air for the heat conductive pieces. | 06-11-2009 |
20100053868 | HEAT DISSIPATION DEVICE - A heat dissipation device is provided for being mounted on a computer enclosure to seal an inside of the enclosure from an outside of the enclosure. The heat dissipation device comprises a housing, a plurality of fins received in the housing, and two fans respectively fixed on a top and a bottom of the housing. The plurality of fins divides an inner space of the housing into two separate chambers, wherein a lower chamber communicates with the interior of the enclosure, and an upper chamber communicates with the exterior of the enclosure. A lower fan forces airflow through the lower chamber to take heat in the enclosure to the fins. An upper fan forces airflow through the upper chamber to carry the heat in the fins to the exterior of the enclosure. | 03-04-2010 |
20100172078 | Cooling structure for rackmount-type control device and rack-type storage control device - According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages. | 07-08-2010 |
20100321873 | SYSTEMS AND METHODS FOR PROVIDING AIRFLOW - An exemplary embodiment of the present invention provides a computer system. The system includes an enclosure configured to house a plurality of electronic devices. The system also includes a fan coupled to the enclosure and configured to provide a flow of cooling air through the enclosure to cool the electronic devices. The system also includes a first airflow path configured to allow the cooling air to exit the enclosure and attenuate noise generated in the enclosure. The system also includes an auxiliary outlet configured to provide a second airflow path if the first airflow path is obstructed. | 12-23-2010 |
20100321874 | COMPUTER SERVER CHASSIS - An expandable server housing having one or more server chassis stacked upon each other and one intake plenum and one exhaust plenum disposed on opposite sides of the stacked server chassis is disclosed. Each server chassis may have two or more fans predominately controlling airflow rate through a zone of the server chassis. Also, a method and system determining fan failure regardless of blockage of air path. | 12-23-2010 |
20110069438 | COMPUTER ENCLOSURE - A computer enclosure includes a chassis, a mounting frame, two air-guiding members, and a fan. The chassis includes a ventilation area defining a plurality of ventilation through holes. The mounting frame is fixed to the chassis and faces the ventilation through holes. The mounting frame configured for receiving electronic components. The two air-guiding members respectively connect two opposite sides of the mounting frame to the chassis. The two air-guiding members incline relative to the mounting frame and the chassis to form an air passage. The fan is configured for exhausting air passing through the ventilation through holes and the mounting frame. | 03-24-2011 |
20110080700 | Airflow Barriers for Efficient Cooling of Memory Modules - Method and apparatus providing airflow through a chassis including an upstream column of memory modules and a downstream column of memory modules. The airflow is divided into first and second separate airflow streams extending from an upstream end of the upstream column to a downstream end of the downstream column. The first airflow stream is guided into contact with a single memory module operably-installed in the upstream column and to avoid contact with any memory module in the downstream column. The second airflow stream is guided to avoid contact with any memory module in the upstream column and into contact with a single memory module operably-installed in the downstream column. The improved cooling enables the extended use of a single memory module per channel, even though the thermal load on such a memory module is greater. The result is an overall savings of power, since cooling requirements no longer dictate the installation of additional memory modules per channel in order to share and distribute the thermal load. | 04-07-2011 |
20110080701 | COOLING HIGH PERFORMANCE COMPUTER SYSTEMS - A computer system may include a chassis defining a front and a rear. The chassis may include a vertically oriented midplane disposed therein, the midplane including a plurality of front module slots for receiving front electronic modules from the front of the chassis, and a plurality of rear module slots for receiving rear electronic modules from the rear of the chassis. A cooling system may be provided within the chassis and may generate an upwardly-directed front air flow within the chassis directed at selected ones of the front electronic modules and an upwardly-directed rear air flow within the chassis directed at selected ones of the rear electronic modules. The front air flow is separate from and independent of the rear air flow. The selected front and rear electronic modules may be disposed in the chassis so as to separate the front air flow into a plurality of substantially equal front air streams and the rear air flow into a plurality of substantially equal rear air streams, respectively. | 04-07-2011 |
20110116221 | HEAT DISSIPATION SYSTEM AND ELECTRONIC DEVICE USING THE SYSTEM - An electronic device includes a server, a plurality of fans, a fan holder attached to one outer side of the server and a plurality of fan ducts received in the fan holder. The server defines an inner cavity therein. Each fan is centrifugal fan and has a fan intake and a fan outlet perpendicular to the fan intake. The fan holder accommodates the fans therein. Each fan duct has an inlet communicating with the fan outlet and an outlet communicating with the inner cavity of the server through the fan holder to allow airflow from the fans into the server. | 05-19-2011 |
20110134594 | COMPUTER SERVER SYSTEM AND FAN MODULE THEREOF - A fan module for dissipating heat from a computer server includes a mounting bracket and a fan mounted on the mounting bracket. The mounting bracket is mounted to an outside of the computer server. The mounting bracket is hollow and forms an air passage in an interior of the mounting bracket. The air passage is communicated with an interior of the computer server. An airflow generated by the fan flows into the interior of the computer server through the air passage to take heat away from the interior of the computer server. | 06-09-2011 |
20110249386 | HEAT-DISSIPATING ASSEMBLY FOR SERVER - A heat-dissipating assembly for a server includes a housing in which a partitioning plate and a power supply mounted on one side of the partitioning plate are provided. The power supply includes a casing and a power-supplying module received in the casing. The heat-dissipating assembly includes a fan received in the casing and located outside the power-supplying module. The partitioning plate and the casing are respectively provided with a plurality of first heat-dissipating holes and second heat-dissipating holes. The first heat-dissipating holes and the second heat-dissipating holes are positioned to correspond to the fan. The airflow caused by the fan drives the air inside the housing to flow out of the housing via the first heat-dissipating holes and the second heat-dissipating holes. In this way, the heat-dissipating efficiency can be improved without affecting the arrangement of other electronic devices in the housing. | 10-13-2011 |
20110292580 | AIRFLOW DUCT - An airflow duct for guiding air toward two heat sink apparatuses in computer includes a duct body fixed in a computer case, a first air guide channel and a second air guide channel defined in the duct body. The duct body has an air inlet and an air outlet. The first air guide channel forms a first air outlet, which opens towards a first heat sink apparatus in the computer case. The second air guide channel forms a second air outlet, which opens towards a second heat sink apparatus in the computer case. The first and second air guide channels guide air from the air inlet to the first and second heat sink apparatuses, through the first and second air outlet openings to dissipate heat respectively from the first and second heat sink apparatuses. A first air guide channel height is greater than that of the second air guide channel. | 12-01-2011 |
20120075787 | METHOD AND APPARATUS FOR ENHANCED COOLING OF MOBILE COMPUTING DEVICE SURFACES - An apparatus with some embodiments is described having ducts positioned above and below a main device housing to provide cooling air flow to at least a portion of the top and bottom surfaces of the associated computing device. In some embodiments, the device is a mobile computing device. In some embodiments, air may be drawn through inlets located on at least one side of the device. The inlet air may be supplied via upper and lower air ducts to an air mover positioned on an opposite side of the device. In some embodiments, air discharged from the air mover may be supplied to a main housing of the device in which heat producing components may be located. Other embodiments are described. | 03-29-2012 |
20120162886 | RACK SERVER CENTER - A rack server center includes servers, an air conditioning system for bringing cooling air to the rack server, and an air exhaust system located outside the rack server. The air exhaust system includes an exhaust fan, branch pipes, controlling valves, and a main pipe. Each branch pipe is connected with a corresponding server via a corresponding controlling valve. The branch pipes are connected with an inlet of the exhaust fan. The main pipe is connected with an outlet of the exhaust fan. The exhaust fan is configured for exhausting heated air generated by the servers out of the rack server via the branch pipes. Each server is configured for controlling the amount of the heated air entering a corresponding branch pipe by controlling the controlling valve connected with the corresponding branch pipe. | 06-28-2012 |
20120170196 | SERVER CENTER WITH HEAT DISSIPATION SYSTEM - An exemplary server center includes a server, a heat dissipating system, and temperature controlling device. The heat dissipating system includes an exhaust fan, and an airflow tunnel connecting the exhaust fan with the server. The temperature controlling device includes a temperature sensor electrically connected to the server, and an airflow valve mounted on the airflow tunnel The temperature sensor is configured for detecting a temperature of the server and controlling the airflow valve to permit the airflow enter the airflow tunnel or not, according to the temperature obtained from the server. | 07-05-2012 |
20120307440 | MIXED-FLOW DUCTED FAN - In accordance with at least some embodiments, a computer system includes an enclosure ( | 12-06-2012 |
20130088823 | SERVER ASSEMBLY - A server assembly includes a server, a number of first air ducts, and a number of second air ducts. A number of intakes and outlets are defined in a top of a chassis of the server. Each of the first and second ducts includes a hollow main body, and a connecting portion extending from a bottom of the main body. A first opening is defined in an end of the main body of each of the first and second ducts. A second opening is defined in each of the connecting portions of each of the first and second ducts. Outside air flows through the first air ducts, thereby flowing into the chassis to be heated, thereby cooling the server. The heated air is expelled out of the chassis through the second air ducts. | 04-11-2013 |
20130100600 | COMPUTER SYSTEM WITH AIRFLOW GUIDING DUCT - A computer system includes an enclosure, a printed circuit board, and an airflow guiding duct. The enclosure includes a bottom plate. The printed circuit board is mounted on the bottom plate. The printed circuit board includes a first heat generating element and a second heat generating element. The airflow guiding duct includes a top wall, a first sidewall, a second sidewall, a first mounting wall, and a second mounting wall. An input opening is surrounded by the top wall and the first and second sidewalls. A first output opening corresponds to the first heat generating element, and is surrounded by the top wall and the first and second mounting walls. A second output opening is defined in the second sidewall corresponding to the second heat generating element. An obtuse angle is defined between the second sidewall and the second mounting wall. | 04-25-2013 |
20130201618 | MODULAR SYSTEM FOR DATA CENTER - A modular computing system for a data center includes one or more data center modules including rack-mounted computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. One or more air handling modules are coupled to the data center modules. The data center module may include two pre-fabricated portions, each portion including a row of racks of computer systems. The two computing module portions of the data center module may combine to form a computing space when coupled to one another. | 08-08-2013 |
20140016255 | CONTAINER DATA CENTER - A container data center includes a container, a number of rack servers arranged in the container, and a cooling room. Each rack server includes a fan module attached to a first side of the rack server, and defines an opening in a second side of the rack server facing the cooling room. The fan module operates to draw air from the rack server, then the cool air in the cooling room flows into the rack server to cool the rack server. | 01-16-2014 |
20140016256 | CONTAINER DATA CENTER - A container data center includes a container, a number of rack servers arranged in the container, and an air-conditioning device arranged in the container. The air-conditioning device defines a vent. A fan module is mounted in the vent, for blowing cooling air generated by the air-conditioning device to the rack servers. | 01-16-2014 |
20140092541 | SERVER - Embodiments of the present invention disclose a server, and relate to the field of computer communications, so that maintainability of a server is improved, a heat dissipation function of the server is ensured, and heat dissipation reliability of the server is improved through online replacement of a heat dissipation fan and a server mainboard. A server includes: a chassis, a backplane with a ventilation opening, a rear board, a first air ducting apparatus, and at least one fan module, where the backplane is located in the middle of the chassis, and the rear board is connected to a rear side of the backplane in a pluggable manner; the fan module is disposed side by side with the rear board along a horizontal direction, and is connected to the rear side of the backplane in a pluggable manner. | 04-03-2014 |
20140204516 | DIRECTIONAL GRATE ACCESS FLOOR PANEL - A grate access floor panel comprising a support frame and a plurality of vanes supported by the frame, each of the plurality of vanes having an upstream end and a downstream end with respect to a direction of airflow across the plurality of vanes and faces that extend between the upstream and downstream ends, wherein at least some of the vanes have openings that extend through the faces thereof and have angled tips. | 07-24-2014 |
20140268530 | Data center facility design configuration - The methods and apparatuses described herein is a data center. In one embodiment is described a data center comprising: a building having a plurality of rooms and first and second exterior load walls disposed on opposite sides of the building; a plurality of air handler and fluid cooler devices disposed exterior to the building along the first exterior load wall; a plurality of condenser unit devices disposed exterior to the building along the second exterior load wall; a data sector disposed inside the building, adjacent to the first exterior load wall; three separate UPS and substation distribution equipment rooms, each containing UPS and substation distribution equipment therein, as well as air conditioning equipment that is connected to certain of the plurality of condenser unit devices; and a power spine room disposed between the three separate UPS and substation distribution equipment rooms and the data sector, the power spine room including a plurality of PDU devices. | 09-18-2014 |
20140301027 | Cold Row Encapsulation for Server Farm Cooling System - Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow one or more fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves fanless servers installed on the server racks and introduces fan units to draw cooling air from the cold row encapsulation structure through the fanless servers on the racks. | 10-09-2014 |
20140355185 | Arrangement of Computing Assets in a Data Center - A system of computing assets arranges a plurality of backplanes to form a perimeter of a central region of a backplane structure. A plurality of computing assets are coupled to the backplanes and extend away from the central region of the backplane structure. A plurality of air intake openings are located along the perimeter of the backplane structure. An exhaust duct is coupled to an exhaust opening of the backplane structure and configured to direct air away from the backplane structure and is coupled to an air moving device. When the air moving device is operational, air flows across the computing assets through the air intake openings towards the central region of the backplane structure and into the exhaust duct, which directs the air away from the backplane structure. | 12-04-2014 |
20150055283 | ELECTRICAL DEVICE - An electrical device includes a housing, a motherboard module and a holding assembly. The housing includes a top shell and a bottom shell which are assembled with each other. The top shell has a top wall and a hook fixed to the top wall. The bottom shell has a bottom wall which is opposite to the top wall. The hook is located on an area of the top wall which faces toward the bottom wall. The motherboard module is located on the bottom wall. The motherboard module includes a motherboard and a central processing unit located on the motherboard. The holding assembly is securely located on the motherboard module and hung on the hook for providing an upward pulling force for the motherboard module. | 02-26-2015 |
20150098173 | BLADE ENCLOSURE - Enclosures and systems that can control airflow and signal connectivity in a blade enclosure are provided. Some examples include a front section including a number of blade server modules, a rear section including a number of switch modules; and a middle section having a number of openings and a number of connectors, wherein the middle section controls airflow between the front section and the rear section in the blade enclosure with the number of openings and the middle section controls signal connectivity between a number of blades in the number of blade server modules and a number of switches in the number of switch modules with the number of connectors. | 04-09-2015 |
20150382513 | APPARATUS FOR COOLING SERVER CABINET AND SERVER CABINET APPARATUS - Disclosed are an apparatus for cooling a server cabinet and a server cabinet apparatus. The apparatus for cooling a server cabinet includes: a bracket a heat-exchange device, and an air-ducting device; where the bracket is positioned below one or a plurality of server cabinets, the heat-exchange device is installed on a side surface of the bracket, the air-ducting device is installed in the bracket, the heat-exchange device and the air-ducting device are parallelly arranged, the heat-exchange device cools hot air produced by the server cabinet to obtain cold air, and the air-ducting device blows the cold air to the server cabinet to cool the server cabinet. The server cabinet apparatus includes: an apparatus for cooling a server cabinet and at least one server cabinet. With the apparatus for cooling a server cabinet, each of the servers in a data center are effectively cooled, and resources are saved. | 12-31-2015 |
20160054768 | Air Channel in Storage Media for Chassis Thermal Design - A storage device includes a first portion including drive media, and a second portion. The second portion includes a first end wall that is in physical communication with first and second side walls, and a second end wall that is in physical communication with the first and second side walls. The second portion also includes a printed circuit board mounted within the cavity, a plurality of ribs within the cavity, and an air channel within the cavity. The air channel has a lower air flow impedance than other portions of the storage device including the first portion, the printed circuit board, and the ribs. The air channel extends along a direction between the first end wall and the second end wall of the storage device. | 02-25-2016 |
20160098068 | COMPUTER CASE PROVIDING MULTIPLE INDEPENDENT AIRFLOWS - A computer case providing multiple independent airflows includes a case body which has an installation space. The installation space includes a logic process zone, a magnetic disk zone and a spaced zone. The case body also has a flow guide passage in the spaced zone to allow external air to enter the installation space, at least one first air fan located in the installation space to be electrically activated to provide a first airflow to the logic process zone and a second air fan located in the installation space at one side of the magnetic disk zone to be electrically activated to provide a second airflow to the magnetic disk zone. The invention, through the flow guide passage, can directly get the external air to perform cooling of the logic process zone and provide multiple airflows to cool electronic elements installed in the installation space. | 04-07-2016 |
20160165760 | RACK AND METHOD OF COOLING ELECTRONIC DEVICE - A cooling device includes: a rack body that houses a plurality of pieces of electronic equipment; a plurality of temperature sensors that detect temperatures of air discharged from a plurality of exhaust ports of the rack body; and an opening and closing device that increases an opening ratio of an exhaust port in which a temperature of the air detected with a temperature sensor is equivalent to or higher than a threshold temperature, and that decreases an opening ratio of an exhaust port in which a temperature of the air is lower than the threshold temperature. | 06-09-2016 |
20160187941 | External Drive Chassis Storage Array - The invention in at least one embodiment includes a system that includes a chassis having a frame present within a housing where the frame includes at least two plates having a base and two grills running widthwise along and on opposite ends of the base, a plurality of walls between the at least two plates, and at least one baffle running between the plates at an angle to the plates; at least one power supply; and a plurality of fans electrically connected to the at least one power supply; wherein there are at least two air flow paths through the chassis that pass through at least one fan and pass at least one baffle through a duct defined by the housing and the frame. In at least one embodiment, the chassis receives at least one storage drive. | 06-30-2016 |